JP2014162913A - Wavelength conversion member and light emitting device - Google Patents

Wavelength conversion member and light emitting device Download PDF

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JP2014162913A
JP2014162913A JP2013038062A JP2013038062A JP2014162913A JP 2014162913 A JP2014162913 A JP 2014162913A JP 2013038062 A JP2013038062 A JP 2013038062A JP 2013038062 A JP2013038062 A JP 2013038062A JP 2014162913 A JP2014162913 A JP 2014162913A
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phosphor
wavelength conversion
conversion member
getter
phosphate
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Koji Kajikawa
幸治 梶川
Atsushi Yamamoto
敦司 山本
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

PROBLEM TO BE SOLVED: To suppress the occurrence of decomposition gas caused by halogen included in a phosphor.SOLUTION: A wavelength conversion member according to the present invention comprises a wavelength conversion member comprising a phosphor, the phosphor comprising halogen, and getter comprising alkaline earth metal phosphate. A light emitting device according to the present invention comprises the wavelength conversion member, and a semiconductor light emitting element that emits light of a wavelength to excite a phosphor.

Description

本発明は、蛍光体を用いた波長変換部材及び発光装置に関する。   The present invention relates to a wavelength conversion member and a light emitting device using a phosphor.

近年、電子・電子機器においては、特定有害物質の使用禁止（ＲｏＨＳ）指令（カドミウム・鉛・水銀・六価クロム・臭素系難燃剤）など、環境や人体への影響に悪影響を与える物質の使用を制限する規定が定められている。さらに、ハロゲンを含まない材料（ハロゲンフリー）への代替も進められており、例えば日本電子回路工業界（ＪＰＣＡ）などでは、塩素含有９００ｐｐｍ以下、臭素含有９００ｐｐｍ以下など、ハロゲン含有量が定義されている。   In recent years, the use of substances that adversely affect the environment and the human body, such as the ban on the use of specified hazardous substances (RoHS) directives (cadmium, lead, mercury, hexavalent chromium, bromine flame retardants) in electronic and electronic devices There are provisions to restrict Furthermore, alternatives to halogen-free materials (halogen-free) are also being promoted. For example, in the Japan Electronic Circuit Industry (JPCA), halogen content is defined such as 900 ppm or less containing chlorine and 900 ppm or less containing bromine. Yes.

半導体発光素子（以下、「発光素子」とも称する）を用いたＬＥＤなどの発光装置も、上記の規制に沿った原材料への代替が進められている。   For light-emitting devices such as LEDs that use semiconductor light-emitting elements (hereinafter also referred to as “light-emitting elements”), replacement with raw materials in accordance with the above-mentioned regulations is being promoted.

照明やバックライト等の光源として用いる白色ＬＥＤは、発光素子と、その発光素子からの光を吸収して異なる波長の光を放出する蛍光体などの波長変換部材とを組み合わせて用いられることが多く、その蛍光体にハロゲンが用いられることがある。   White LEDs used as light sources for lighting and backlights are often used in combination with a light emitting element and a wavelength conversion member such as a phosphor that absorbs light from the light emitting element and emits light of different wavelengths. In some cases, halogen is used for the phosphor.

ハロゲンを含まない蛍光体で代替することも可能であるが、目的や用途によってはハロゲン含有蛍光体の方が適している場合もある。   Although it is possible to substitute a phosphor not containing halogen, the halogen-containing phosphor may be more suitable depending on the purpose and application.

特開２００３−１０１０７５号公報JP 2003-101075 A

特許文献１に記載のゲッタリング化合物は、該文献に開示されている特定の組成を有する蛍光体に対しては有効であるが、組成が異なる蛍光体に対しては有効とは言えない。   The gettering compound described in Patent Document 1 is effective for phosphors having a specific composition disclosed in the document, but is not effective for phosphors having different compositions.

前記課題を解決するために、本発明に係る波長変換部材は、蛍光体を含有する波長変換部材であって、蛍光体は、ハロゲンを含み、ゲッターは、アルカリ土類金属リン酸塩を含む。また、本発明に係る発光装置は、前記波長変換部材と、波長変換部材に含まれる蛍光体を励起する波長の光を発光する半導体発光素子と、を備える。   In order to solve the above problems, the wavelength conversion member according to the present invention is a wavelength conversion member containing a phosphor, the phosphor contains a halogen, and the getter contains an alkaline earth metal phosphate. Moreover, the light-emitting device which concerns on this invention is equipped with the said wavelength conversion member and the semiconductor light-emitting element which light-emits the light of the wavelength which excites the fluorescent substance contained in a wavelength conversion member.

このような構成によれば、ハロゲンに起因する分解ガスの発生を低減することができる。   According to such a structure, generation | occurrence | production of the decomposition gas resulting from a halogen can be reduced.

図１は、本発明の実施形態に係る波長変換部材を示す断面図である。FIG. 1 is a cross-sectional view showing a wavelength conversion member according to an embodiment of the present invention. 図２は、本発明の実施形態に係る波長変換部材を示す断面図である。FIG. 2 is a cross-sectional view showing a wavelength conversion member according to an embodiment of the present invention. 図３は、本発明の実施形態に係る波長変換部材を示す断面図である。FIG. 3 is a cross-sectional view showing a wavelength conversion member according to an embodiment of the present invention. 図４は、本発明の実施形態に係る波長変換部材を示す断面図である。FIG. 4 is a cross-sectional view showing a wavelength conversion member according to an embodiment of the present invention. 図５は、本発明の実施形態に係る波長変換部材を示す断面図である。FIG. 5 is a cross-sectional view showing a wavelength conversion member according to an embodiment of the present invention. 図６は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 6 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図７は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 7 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図８は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 8 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図９は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 9 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図１０は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 10 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図１１は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 11 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図１２は、本発明の実施形態に係る発光装置を示す断面図である。FIG. 12 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention. 図１３は、本発明の実施形態に係る発光装置を示す斜視図及び断面図である。FIG. 13 is a perspective view and a sectional view showing a light emitting device according to an embodiment of the present invention.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具現化するための波長変換部材及び発光装置を例示するものであって、以下に限定するものではない。また、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる例示に過ぎない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。   A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the wavelength conversion member and light-emitting device for embodying the technical idea of the present invention, and is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation.

＜波長変換部材＞
波長変換部材は、蛍光体と、ゲッターとを含む。ゲッターは、ハロゲンを含有する蛍光体と一体的に保持されているものであり、蛍光体粉末の表面に設けられるコート中に含有させてもよく、蛍光体を含有する樹脂やガラスなどの透光性部材中に含有させてもよい。 <Wavelength conversion member>
The wavelength conversion member includes a phosphor and a getter. A getter is integrally held with a phosphor containing halogen, and may be contained in a coat provided on the surface of the phosphor powder, or a translucent material such as a resin or glass containing the phosphor. You may make it contain in a sex member.

（蛍光体）
波長変換部材は、蛍光体を含む。蛍光体はハロゲンを含んでおり、ハロシリケート蛍光体、ハロボレート蛍光体、ハロゲンアパタイト蛍光体が挙げられる。これらの蛍光体は、紫外〜青色の光を吸収して、それよりも波長の長い緑色系、黄色系、赤色系の光を発光する蛍光体であり、一種又は二種以上を用いることができる。尚、蛍光体としては、これらとは異なる組成や発光波長のものと併用して用いることもできる。蛍光体の粒径としては１〜５０μｍ程度のものを用いることができる。 (Phosphor)
The wavelength conversion member includes a phosphor. The phosphor contains a halogen, and examples thereof include halosilicate phosphors, haloborate phosphors, and halogenapatite phosphors. These phosphors are phosphors that absorb ultraviolet to blue light and emit green, yellow, or red light having longer wavelengths, and one or more of them can be used. . In addition, as a fluorescent substance, it can also be used together with the thing of a composition and light emission wavelength different from these. As the particle size of the phosphor, those having a particle size of about 1 to 50 μm can be used.

ハロシリケート蛍光体としては、（Ｍ１−ｙＥｕｙ）xＳｉ２Ｏ１６Ｘｂ（ＭはＣａ、Ｓｒ、Ｂａ、Ｍｇの群から選ばれる少なくとも１種以上であり、ＸはＣｌ、Ｂｒ、Ｉの群から選ばれる少なくとも１種以上）が挙げられ、Ｃａ８ＭｇＳｉ４Ｏ１６Ｃｌ２：Ｅｕ、Ｍ８ＭｇＳｉ４０１６Ｃｌ２：Ｅｕ等が挙げられる。 As the halosilicate phosphor, (M 1-y Eu y ) x Si 2 O 16 X b (M is at least one selected from the group of Ca, Sr, Ba, Mg, and X is Cl, Br, At least one selected from the group of I), and Ca 8 MgSi 4 O 16 Cl 2 : Eu, M 8 MgSi 4 0 16 Cl 2 : Eu, and the like.

ハロボレート蛍光体としては、Ｃａ２Ｂ５Ｏ９Ｂｒ：Ｅｕ、Ｃａ２Ｂ５Ｏ９Ｃｌ：Ｅｕ等が挙げられる。 Examples of the haloborate phosphor include Ca 2 B 5 O 9 Br: Eu, Ca 2 B 5 O 9 Cl: Eu, and the like.

ハロゲンアパタイト蛍光体としては、Ｍ５（ＰＯ４）３Ｘ：Ｒ（Ｍは、Ｓｒ、Ｃａ、Ｂａ、Ｍｇ、Ｚｎから選ばれる少なくとも１種以上であり、Ｘは、Ｆ、Ｃｌ、Ｂｒ、Ｉから選ばれる少なくとも１種以上、Ｒは、Ｅｕ、Ｍｎ、ＥｕとＭｎ、のいずれか１種以上）があげられ、具体的には、Ｃａ５（ＰＯ４）３Ｃｌ：Ｅｕ、Ｃａ５（ＰＯ４）３Ｃｌ：Ｅｕ、Ｍｎ、Ｋ２（Ｓｉ、Ｇｅ）Ｆ６：Ｍｎ４＋等が挙げられる。 As the halogen apatite phosphor, M 5 (PO 4 ) 3 X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn, and X is F, Cl, Br, I And at least one selected from the group consisting of Eu, Mn, Eu and Mn, and specifically, Ca 5 (PO 4 ) 3 Cl: Eu, Ca 5 (PO 4 ) 3 Cl: Eu, Mn, K 2 (Si, Ge) F 6 : Mn 4+ and the like.

また、上記の蛍光体に加え、他の発光色の蛍光体を併用して用いてもよく、目的や用途に応じて、混合比率などを適宜選択することができる。赤色発光可能な蛍光体としては、例えば、カルシウムシリコンナイトライド（ＣＥＳＮ）、ストロンチウムシリコンナイトライド（ＳＥＳＮ）、カルシウムストロンチウムシリコンナイトライド（ＳＣＥＳＮ）、Ｅｕ賦活カルシウムアルミニウムシリコンナイトライド等、具体的には、Ｃａ２Ｓｉ５Ｎ８：Ｅｕ、Ｓｒ２Ｓｉ５Ｎ８：Ｅｕ、（Ｃａ，Ｓｒ）２Ｓｉ５Ｎ８：Ｅｕ、ＣａＡｌＳｉＮ３：Ｅｕ等が挙げられる。 Further, in addition to the above-described phosphors, other phosphors having emission colors may be used in combination, and the mixing ratio and the like can be appropriately selected according to the purpose and application. Examples of phosphors capable of emitting red light include calcium silicon nitride (CESN), strontium silicon nitride (SESN), calcium strontium silicon nitride (SCESN), Eu-activated calcium aluminum silicon nitride, and the like. Ca 2 Si 5 N 8: Eu , Sr 2 Si 5 N 8: Eu, (Ca, Sr) 2 Si 5 N 8: Eu, CaAlSiN 3: Eu and the like.

（ゲッター）
ゲッターは、蛍光体に含まれるハロゲンと反応して分解ガスの放出を低減させるものである。そのため、燃焼−イオンクロマトグラフ法（ＥＮ１４５８２／ＥＰＡ５０５０）による測定によってハロゲンの検出量(放散量)を低減することができる。燃焼−イオンクロマトグラフ法は、まず、酸素気流中において、１０００℃〜１１００℃で試料（ハロゲン含有蛍光体を含有する波長変換部材）を燃焼させ、発生した分解ガスを捕集した吸収液を、イオンクロマトグラフィで定量分析する分析方法である。 (Getter)
A getter reacts with the halogen contained in the phosphor to reduce the emission of decomposition gas. Therefore, the detection amount (dissipation amount) of halogen can be reduced by measurement by combustion-ion chromatography (EN14582 / EPA5050). In the combustion-ion chromatographic method, first, in an oxygen stream, a sample (a wavelength conversion member containing a halogen-containing phosphor) is burned at 1000 ° C. to 1100 ° C., and an absorption liquid that collects the generated decomposition gas is collected. This is an analysis method for quantitative analysis by ion chromatography.

このようなゲッターは、蛍光体中に含まれるハロゲンの含有量や、波長変換部材中に含まれる蛍光体の含有量、さらにはハロゲンの組成に応じて用いる量や組成を適宜選択するのが好ましい。ゲッターの粒径は、蛍光体よりも小さいものが好ましく、０．０１〜１μｍ程度のものが好ましい。   For such a getter, it is preferable that the content of the halogen contained in the phosphor, the content of the phosphor contained in the wavelength conversion member, and the amount and composition used according to the halogen composition are appropriately selected. . The particle diameter of the getter is preferably smaller than that of the phosphor, and preferably about 0.01 to 1 μm.

ゲッターは、アルカリ土類金属リン酸塩を含み、具体的には、第一リン酸カルシウム（Ｃａ（Ｈ２ＰＯ４）２）、第二リン酸カルシウム（ＣａＨＰＯ４）、リン酸三カルシウム（Ｃａ（ＰＯ４）２）、第三リン酸三カルシウム（３Ｃａ３（ＰＯ４）６（ＯＨ）２）、カルシウムヒドロキシアパタイト（Ｃａ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素カルシウム（ＣａＨ２Ｐ２Ｏ７）、ピロリン酸カルシウム（Ｃａ２Ｐ２Ｏ７）、ポリリン酸にカルシウムイオンを加えた塩（Ｃａ・（ＰＯ３）ｎ）、第一リン酸ストロンチウム（Ｓｒ（Ｈ２ＰＯ４）２）、第二リン酸ストロンチウム（ＳｒＨＰＯ４）、リン酸三ストロンチウム（Ｓｒ（ＰＯ４）２）、第三リン酸三ストロンチウム（３Ｓｒ３（ＰＯ４）６（ＯＨ）２）、ストロンチウムヒドロキシアパタイト（Ｓｒ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素ストロンチウム（ＳｒＨ２Ｐ２Ｏ７）、ピロリン酸ストロンチウム（Ｓｒ２Ｐ２Ｏ７）、ポリリン酸にストロンチウムイオンを加えた塩（Ｓｒ・（ＰＯ３）ｎ）、第一リン酸バリウム（Ｂａ（Ｈ２ＰＯ４）２）、第二リン酸バリウム（ＢａＨＰＯ４）、リン酸三バリウム（Ｂａ（ＰＯ４）２）、第三リン酸三バリウム（３Ｂａ３（ＰＯ４）６（ＯＨ２））、バリウムヒドロキシアパタイト（Ｂａ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素バリウム（ＢａＨ２Ｐ２Ｏ７）、ピロリン酸バリウム（Ｂａ２Ｐ２Ｏ７）、ポリリン酸にバリウムイオンを加えた塩（Ｂａ・（ＰＯ３）ｎ）から選択される少なくとも１つを有する。
以下、上記蛍光体及びゲッターを備えた波長変換部材について詳述する。 The getter contains an alkaline earth metal phosphate, specifically, primary calcium phosphate (Ca (H 2 PO 4 ) 2 ), dicalcium phosphate (CaHPO 4 ), tricalcium phosphate (Ca (PO 4 )). 2 ), tricalcium phosphate (3Ca 3 (PO 4 ) 6 (OH) 2 ), calcium hydroxyapatite (Ca 10 (PO 4 ) 6 (OH) 2 ), calcium dihydrogen pyrophosphate (CaH 2 P 2) O 7 ), calcium pyrophosphate (Ca 2 P 2 O 7 ), a salt obtained by adding calcium ions to polyphosphoric acid (Ca · (PO 3 ) n ), strontium phosphate (Sr (H 2 PO 4 ) 2 ), Dibasic strontium phosphate (SrHPO 4 ), tristrontium phosphate (Sr (PO 4 ) 2 ), tristrontium phosphate (3Sr 3 ( PO 4 ) 6 (OH) 2 ), strontium hydroxyapatite (Sr 10 (PO 4 ) 6 (OH) 2 ), strontium dihydrogen pyrophosphate (SrH 2 P 2 O 7 ), strontium pyrophosphate (Sr 2 P 2 O) 7 ), salt obtained by adding strontium ions to polyphosphoric acid (Sr · (PO 3 ) n ), primary barium phosphate (Ba (H 2 PO 4 ) 2 ), dibasic barium phosphate (BaHPO 4 ), phosphoric acid Tribarium (Ba (PO 4 ) 2 ), tribarium triphosphate (3Ba 3 (PO 4 ) 6 (OH 2 )), barium hydroxyapatite (Ba 10 (PO 4 ) 6 (OH) 2 ), pyrophosphoric acid Barium dihydrogen (BaH 2 P 2 O 7 ), barium pyrophosphate (Ba 2 P 2 O 7 ), a salt of polyphosphoric acid with barium ions added (Ba - having at least one selected from (PO 3) n).
Hereinafter, the wavelength conversion member provided with the said fluorescent substance and a getter is explained in full detail.

（実施形態１）
実施形態１において、波長変換部材は粉体であり、図１に示すように、蛍光体１１と、蛍光体１１の表面に設けられるコート部材と、を備えた粉体である。ゲッターは、このコート部材に含有されている。更に、コート部材には、ゲッター１２を蛍光体に付着（固着）させるため無機物又は有機物の結着剤（接着剤）１３を有している。 (Embodiment 1)
In the first embodiment, the wavelength conversion member is a powder, and as shown in FIG. 1, the wavelength conversion member is a powder including a phosphor 11 and a coating member provided on the surface of the phosphor 11. A getter is contained in the coating member. Further, the coating member has an inorganic or organic binder (adhesive) 13 for attaching (fixing) the getter 12 to the phosphor.

結着剤は、ゲッターの量や蛍光体の粒径等に応じて、用いる量を適宜調整することができる。そのため、図１に示すような、蛍光体１１の表面のほぼ全面を覆うように設けてもよく、あるいは、部分的に蛍光体が露出するように設けてもよい。結着剤に用いられる材料として、無機物としてはＡｌ２Ｏ３、ＳｉＯ２、ＺｒＯ２、ＨｆＯ２、ＴｉＯ２、ＺｎＯ、Ｔａ２Ｏ５、Ｎｂ２Ｏ５、Ｉｎ２Ｏ３、ＳｎＯ２、ＴｉＮ、ＡｌＮなどから構成される群から選ばれる少なくとも１種の化合物を好適に用いることができる。有機物としては、シリコーン樹脂組成物、変性シリコーン樹脂組成物、変性エポキシ樹脂組成物、フッ素樹脂組成物等を挙げることができる。尚、これら結着剤は複数混合させて用いてもよく、また、更に添加剤等を含んでいてもよい。 The amount of the binder used can be appropriately adjusted according to the amount of getter, the particle size of the phosphor, and the like. Therefore, as shown in FIG. 1, it may be provided so as to cover almost the entire surface of the phosphor 11, or may be provided so that the phosphor is partially exposed. As a material used for the binder, as the inorganic substance, Al 2 O 3 , SiO 2 , ZrO 2 , HfO 2 , TiO 2 , ZnO, Ta 2 O 5 , Nb 2 O 5 , In 2 O 3 , SnO 2 , TiN At least one compound selected from the group consisting of AlN and the like can be suitably used. Examples of the organic material include a silicone resin composition, a modified silicone resin composition, a modified epoxy resin composition, and a fluororesin composition. Note that a plurality of these binders may be mixed and used, and may further contain additives and the like.

（実施形態２）
実施形態２において、波長変換部材は成形体であり、図２〜図５に示すように、蛍光体と、蛍光体を保持する透光性部材（樹脂又はガラス）と、を備えた成形体である。更に詳細には、透光性部材の内部に蛍光体が保持（内包）されている。 (Embodiment 2)
In Embodiment 2, the wavelength conversion member is a molded body, and as illustrated in FIGS. 2 to 5, a molded body including a phosphor and a translucent member (resin or glass) that holds the phosphor. is there. More specifically, the phosphor is held (encapsulated) inside the translucent member.

透光性部材の材料としては、シリコーン樹脂組成物、変性シリコーン樹脂組成物、変性エポキシ樹脂組成物、フッ素樹脂組成物、ガラス等を挙げることができる。これらは、成形する前は、液体状又はペースト状であり、この状態の段階で蛍光体を含有させ、その後成形することで波長変換部材の成形体とすることができる。透光性部材中には、蛍光体のほか、拡散材、分散材、顔料などが保持されていてもよい。   Examples of the material for the translucent member include a silicone resin composition, a modified silicone resin composition, a modified epoxy resin composition, a fluororesin composition, and glass. These are in the form of a liquid or a paste before molding, and can be made into a molded article of a wavelength conversion member by containing a phosphor at this stage and then molding. In the translucent member, in addition to the phosphor, a diffusing material, a dispersing material, a pigment, and the like may be held.

図２に示すように、実施形態１（図１）のようにゲッターを含有するコート部材を備えた蛍光体が透光性部材１４中に保持（内包）されている波長変換部材２０とすることができる。また、図３に示すように、コート部材を備えていない蛍光体１１を用い、この蛍光体１１とゲッター１２とが透光性部材１４中に保持（内包）されている波長変換部材３０とすることができる。また、これらを組み合わせたもの、詳細には、実施形態１（図１）のようにゲッターを含有するコート部材を備えた蛍光体が、ゲッターを含有する透光性部材中に保持（内包）されている波長変換部材としてもよい。   As shown in FIG. 2, the wavelength conversion member 20 in which a phosphor including a coating member containing a getter is held (encapsulated) in a translucent member 14 as in Embodiment 1 (FIG. 1). Can do. Further, as shown in FIG. 3, a phosphor 11 having no coating member is used, and a wavelength conversion member 30 in which the phosphor 11 and the getter 12 are held (encapsulated) in a translucent member 14 is used. be able to. Further, a combination of these, specifically, a phosphor including a coat member containing a getter as in Embodiment 1 (FIG. 1) is held (encapsulated) in a light-transmitting member containing a getter. It is good also as a wavelength conversion member.

実施形態２において、波長変換部材２０、３０は、透光性部材が、蛍光体を保持（内包）できればよく、その形状や厚みなどは所望に応じて選択できる。例えば、図７に示すような板状（発光素子の上に載置）、図１１に示すようなシート状（フィルム状）（導光板の発光面に配置）、図１２に示すようなカバー状（ドーム状等）（電球型ＬＥＤランプのカバー）、図１３に示すような筒状（円筒、角筒等）（直管型ＬＥＤランプの直管）、あるいはこれらを組み合わせた複合形状等とすることができる。特に樹脂を用いる場合は、射出成形やトランスファ成形、圧縮成形、ポッティング、印刷等、種々の方法を用いて任意の形状に成形することが可能である。   In the second embodiment, the wavelength conversion members 20 and 30 only need to allow the light-transmitting member to hold (enclose) the phosphor, and the shape and thickness thereof can be selected as desired. For example, a plate shape as shown in FIG. 7 (mounted on the light emitting element), a sheet shape as shown in FIG. 11 (film shape) (arranged on the light emitting surface of the light guide plate), and a cover shape as shown in FIG. (Dome shape, etc.) (bulb-type LED lamp cover), cylindrical shape (cylindrical, square tube, etc.) as shown in FIG. 13 (straight-tube LED lamp straight tube), or a combination of these, etc. be able to. In particular, when a resin is used, it can be formed into an arbitrary shape using various methods such as injection molding, transfer molding, compression molding, potting, and printing.

（実施形態３）
実施形態３において、波長変換部材は成形体であり、図４示すように、蛍光体と、蛍光体を保持する透光性部材（樹脂又はガラス）と、を備えた成形体である。更に詳細には、透光性部材の表面（外部）に蛍光体が保持（付着）されている。 (Embodiment 3)
In Embodiment 3, the wavelength conversion member is a molded body, and as illustrated in FIG. 4, the wavelength conversion member is a molded body including a phosphor and a translucent member (resin or glass) that holds the phosphor. More specifically, the phosphor is held (attached) on the surface (outside) of the translucent member.

実施形態３では、実施形態１（図１）のようにゲッターを含有するコート部材を備えた蛍光体が透光性部材の表面に、結着剤を用いて保持（付着）されている波長変換部材とすることができる。また、図４に示すように、コート部材を備えていない蛍光体１１を用いい、ゲッター１２を含む結着剤１３を用いて、透光性部材１４の表面に保持（付着）されている波長変換部材４０としてもよい。   In the third embodiment, as in the first embodiment (FIG. 1), the phosphor having the coating member containing the getter is held (attached) to the surface of the translucent member using a binder. It can be a member. Further, as shown in FIG. 4, the wavelength that is held (attached) on the surface of the translucent member 14 using the phosphor 11 that does not include the coating member, and the binder 13 that includes the getter 12. The conversion member 40 may be used.

実施形態３において、透光性部材は、蛍光体を保持（表面に付着）できればよく、その形状や厚みなどは所望に応じて選択できる。形状としては、実施形態２と同様に、図７に示すような板状（発光素子の上に載置）、図１１に示すようなシート状（フィルム状）（導光板の発光面に配置）、図１２に示すようなカバー状（ドーム状等）（電球型ＬＥＤランプのカバー）、図１３に示すような筒状（円筒、角筒等）（直管型ＬＥＤランプの直管）、あるいはこれらを組み合わせた複合形状等とすることができる。特に樹脂を用いる場合は、射出成形やトランスファ成形、圧縮成形、ポッティング、印刷等、種々の方法を用いて任意の形状に成形することが可能である。   In the third embodiment, the translucent member only needs to hold the phosphor (attach to the surface), and the shape, thickness, and the like can be selected as desired. As in the second embodiment, the shape is a plate shape (mounted on the light emitting element) as shown in FIG. 7 and a sheet shape (film shape) as shown in FIG. 11 (located on the light emitting surface of the light guide plate). 12, a cover shape (dome shape, etc.) as shown in FIG. 12 (bulb-type LED lamp cover), a cylindrical shape (cylinder, square tube, etc.) as shown in FIG. 13 (straight tube of LED tube), or It can be set as the composite shape etc. which combined these. In particular, when a resin is used, it can be formed into an arbitrary shape using various methods such as injection molding, transfer molding, compression molding, potting, and printing.

実施形態３では、実施形態２と違い、透光性部材の表面に蛍光体を保持（付着）させるための接着剤が必要となる。このような接着剤としては、透光性部材として用いることができる樹脂やガラスを挙げることができる。例えば、蛍光体を含有した樹脂を、印刷、ポッティング、インクジェット、スプレー塗布などの方法で透光性部材表面に設け、樹脂を硬化させることで、透光性部材の表面にゲッターを有する波長変換部材を得ることができる。   In the third embodiment, unlike in the second embodiment, an adhesive for holding (attaching) the phosphor on the surface of the translucent member is required. Examples of such an adhesive include resin and glass that can be used as a translucent member. For example, a wavelength conversion member having a getter on the surface of a translucent member by providing a resin containing a phosphor on the surface of the translucent member by a method such as printing, potting, ink jetting, or spray coating, and curing the resin. Can be obtained.

また、透光性部材の表面に、ＩＴＯやＡｌなどの導電膜を形成し、電着によって蛍光体を設けることもできる。この場合、蛍光体として、ゲッターが含有されたコート部材を備えた蛍光体を用いて電着してもよく、あるいは、ゲッターを先に電着して、その後、蛍光体を電着したり、それとは逆に、先に蛍光体を電着したりして、その後、ゲッターを電着するなど蛍光体とゲッターとを別々に電着してもよい。何れの場合も、電着後に、その電着層の内部に接着剤を含浸させるなどにより、透光性部材の表面に蛍光体を保持（付着）した波長変換部材とすることができる。尚、ＩＴＯは、電着前も電着後も透光性であるため、特に処理は必要ではないが、Ａｌは電着前は透光性は低く（金属膜であるため）、そのような場合は、電着後に酸化処理を行うことで、酸化アルミニウムとなるように反応させることで、透光性に改質する工程が必要となる。   Further, a conductive film such as ITO or Al can be formed on the surface of the translucent member, and the phosphor can be provided by electrodeposition. In this case, the phosphor may be electrodeposited using a phosphor provided with a coating member containing a getter, or the electrode may be electrodeposited first and then the phosphor is electrodeposited, On the contrary, the phosphor and the getter may be electrodeposited separately, such as by electrodepositing the phosphor first and then electrodepositing the getter. In any case, after electrodeposition, a wavelength conversion member in which the phosphor is held (attached) on the surface of the translucent member can be obtained by impregnating the inside of the electrodeposition layer with an adhesive. Since ITO is translucent before and after electrodeposition, no particular treatment is required, but Al has low translucency before electrodeposition (since it is a metal film). In this case, an oxidation treatment is performed after the electrodeposition, so that a process of changing to translucency is required by reacting to become aluminum oxide.

（実施形態４）
実施形態４において、波長変換部材は成形体であり、図５に示すように、蛍光体と、蛍光体を保持する透光性部材（樹脂又はガラス）と、を備えた成形体である。更に詳細には、透光性部材の内部に波長変換部材が保持（内包）されているのに加え、透光性部材の表面（外部）にも蛍光体が保持（付着）されている。つまり、実施形態２と実施形態３とを組み合わせた構成となる。蛍光体及びゲッターは、透光性部材に内包されるものと、表面に付着されるものとで、同じであってもよく、異なっていてもよい。 (Embodiment 4)
In Embodiment 4, the wavelength conversion member is a molded body, and as illustrated in FIG. 5, is a molded body including a phosphor and a translucent member (resin or glass) that holds the phosphor. More specifically, the wavelength conversion member is held (encapsulated) inside the translucent member, and the phosphor is also held (attached) on the surface (outside) of the translucent member. That is, the second embodiment and the third embodiment are combined. The phosphor and the getter may be the same or different depending on what is contained in the translucent member and what is attached to the surface.

実施形態４において、透光性部材は、蛍光体を保持（内部に保持、及び、表面に付着）できればよく、その形状や厚みなどは所望に応じて選択できる。形状としては、実施形態２、３と同様に、図７に示すような板状（発光素子の上に載置）、図１１に示すようなシート状（フィルム状）（導光板の発光面に配置）、図１２に示すようなカバー状（ドーム状等）（電球型ＬＥＤランプのカバー）、図１３に示すような筒状（円筒、角筒等）（直管型ＬＥＤランプの直管）、あるいはこれらを組み合わせた複合形状等とすることができる。特に樹脂を用いる場合は、射出成形やトランスファ成形、圧縮成形、ポッティング、印刷等、種々の方法を用いて任意の形状に成形することが可能である。   In the fourth embodiment, the translucent member only needs to hold the phosphor (held inside and attached to the surface), and the shape and thickness thereof can be selected as desired. As in the second and third embodiments, the shape is a plate shape (mounted on the light emitting element) as shown in FIG. 7, and a sheet shape (film shape) as shown in FIG. 11 (on the light emitting surface of the light guide plate). 12) Cover shape (dome shape, etc.) as shown in FIG. 12 (bulb type LED lamp cover), cylindrical shape (cylinder, square tube, etc.) as shown in FIG. 13 (straight tube type LED lamp straight tube) Or it can be set as the composite shape etc. which combined these. In particular, when a resin is used, it can be formed into an arbitrary shape using various methods such as injection molding, transfer molding, compression molding, potting, and printing.

＜発光装置＞
次に、上述の波長変換部材を備えた発光装置について説明する。発光装置は、波長変換部材中に含まれる蛍光体を励起する波長の光を発光する半導体発光素子（発光素子）を備えた発光ダイオード（ＬＥＤ）、半導体レーザ（ＬＤ）を指し、更に、ＬＥＤランプやバックライトなど、ＬＥＤやＬＤを組み込んだ（搭載した）形態のものも指す。発光素子と波長変換部材とは、接していてもよく、離間していてもよい。 <Light emitting device>
Next, a light emitting device provided with the above-described wavelength conversion member will be described. The light-emitting device refers to a light-emitting diode (LED) and a semiconductor laser (LD) each including a semiconductor light-emitting element (light-emitting element) that emits light having a wavelength that excites a phosphor contained in the wavelength conversion member. It also refers to a form in which an LED or LD is incorporated (mounted), such as a backlight. The light emitting element and the wavelength conversion member may be in contact with each other or may be separated from each other.

蛍光体は、発光素子からの光を吸収して、その光とは異なる波長の光（好ましくは、長波長）に変換する部材として波長変換部材中に含まれる。波長変換部材としては、実施形態１の粉体や、実施形態２〜実施形態４の成形体を用いることができ、これらと発光素子とを組み合わせる。さらに、実施形態２〜実施形態４のように予め成形体として形成した波長変換部材ではなく、発光素子を埋設するようにして波長変換部材を成形（硬化）することで、発光装置の一部として波長変換部材を組み込むこともできる。   The phosphor is included in the wavelength conversion member as a member that absorbs light from the light emitting element and converts it into light having a wavelength different from that light (preferably, a long wavelength). As the wavelength conversion member, the powder of Embodiment 1 or the molded body of Embodiments 2 to 4 can be used, and these are combined with a light emitting element. Furthermore, as a part of the light emitting device, the wavelength converting member is molded (cured) so as to embed the light emitting element instead of the wavelength converting member previously formed as a molded body as in Embodiments 2 to 4. A wavelength conversion member can also be incorporated.

（実施形態５）
図６は、実施形態５にかかる発光装置であり、発光素子上に電着によって蛍光体が設けられる。基板１１０上に発光素子１４０が載置され、発光素子１４０の表面に蛍光体及びゲッターを含む波長変換部材１０が設けられている。そして、それらを覆うように透光性樹脂１３０が設けられる。 (Embodiment 5)
FIG. 6 shows a light emitting device according to Embodiment 5, in which a phosphor is provided on a light emitting element by electrodeposition. The light emitting element 140 is placed on the substrate 110, and the wavelength conversion member 10 including a phosphor and a getter is provided on the surface of the light emitting element 140. And translucent resin 130 is provided so that they may be covered.

蛍光体は電着によって発光素子の表面設けることができる。例えば、基板１１０上の配線に発光素子１４０の電極を対向させてフェイスダウン接合し、その後、全体にアルミニウム（Ａｌ）をスパッタする。電着槽に蛍光体とゲッターとを分散させ、その中で電着を行うことで、蛍光体とゲッターとをＡｌ表面に付着させる。その後、Ａｌを酸化させて酸化アルミニウムとして透明化する。その後に圧縮成形等で透光性樹脂１３０を成形する。尚、電着後は、少量の樹脂を電着層内に含浸させて硬化させておき、その後に透光性樹脂を設けてもよい。   The phosphor can be provided on the surface of the light emitting element by electrodeposition. For example, the electrode of the light emitting element 140 is opposed to the wiring on the substrate 110 and face-down bonded, and then aluminum (Al) is sputtered over the entire surface. The phosphor and the getter are dispersed in the electrodeposition tank, and electrodeposition is performed in the electrodeposition tank, thereby attaching the phosphor and the getter to the Al surface. Thereafter, Al is oxidized to be transparent as aluminum oxide. Thereafter, the translucent resin 130 is molded by compression molding or the like. In addition, after electrodeposition, a small amount of resin may be impregnated in the electrodeposition layer and cured, and then a translucent resin may be provided.

このように電着を用いる場合、実施形態１で説明したような、蛍光体にゲッター含有コート部材を、先に所望の位置に設け、その後に透光性樹脂を設けることで波長変換部材とすることができる。また、蛍光体とゲッターとを同時に電着するのではなく、蛍光体を電着した後にゲッターを電着する、あるいはその逆に、ゲッターを電着した後に蛍光体を電着するなど、２層または３層以上に積層して設けてもよい。さらに、蛍光体を電着した後、ゲッター含有の透光性樹脂を成形するなど、蛍光体とゲッターとを別方法で形成してもよい。   When electrodeposition is used in this way, as described in Embodiment 1, a getter-containing coat member is first provided at a desired position on the phosphor, and then a translucent resin is provided to obtain a wavelength conversion member. be able to. In addition, two layers, such as electrodepositing the phosphor after electrodepositing the phosphor, or electrodepositing the getter after electrodepositing the getter, instead of electrodepositing the phosphor and the getter simultaneously Alternatively, three or more layers may be provided. Furthermore, after electrodepositing the phosphor, the phosphor and the getter may be formed by different methods, such as molding a getter-containing translucent resin.

このように、実施形態５では、蛍光体とゲッターとを、あるいは蛍光体を、まず目的の位置に設けておき、その後、それらを固定するように透光性樹脂を設けることで、最終的に波長変換部材となるようにしている。   As described above, in the fifth embodiment, the phosphor and the getter or the phosphor is first provided at a target position, and then a translucent resin is provided so as to fix the phosphor, and finally, It becomes a wavelength conversion member.

（実施形態６）
図７は、実施形態６にかかる発光装置２００であり、実施形態２〜実施形態４で説明したような、発光素子とゲッターとを含有する波長変換部材の成形体をあらかじめ準備し、それを発光素子からの光が照射される位置に設けた発光装置である。基板上に発光素子を載置し、その上に波長変換部材の成形体を載置する。発光素子１４０は、ｐ電極、ｎ電極とも基板側に設けられており、これら電極と、基板１１０上の配線１２０とが導電性接着剤で接合されている。発光素子と波長変換部材の間は、透光性の接着剤（不図示）が設けられる。そして、これらの周りに枠体２６０を設け、発光素子と波長変換部材の側面を覆うように、枠体内に白色樹脂が充填される。発光素子の下部にはアンダーフィルを設けてもよい。尚、波長変換部材を予め成形した成型品を組み込んだ発光装置として、図１１〜１３のような形態も挙げられるがこれについては後述する。 (Embodiment 6)
FIG. 7 shows a light emitting device 200 according to the sixth embodiment. As described in the second to fourth embodiments, a wavelength conversion member molded body containing a light emitting element and a getter is prepared in advance, and light is emitted therefrom. The light emitting device is provided at a position where light from the element is irradiated. A light emitting element is mounted on a substrate, and a molded body of a wavelength conversion member is mounted thereon. In the light emitting element 140, both the p-electrode and the n-electrode are provided on the substrate side, and these electrodes and the wiring 120 on the substrate 110 are joined by a conductive adhesive. A light-transmitting adhesive (not shown) is provided between the light emitting element and the wavelength conversion member. Then, a frame body 260 is provided around them, and the frame body is filled with white resin so as to cover the side surfaces of the light emitting element and the wavelength conversion member. An underfill may be provided below the light emitting element. In addition, as a light-emitting device incorporating the molded product which shape | molded the wavelength conversion member previously, a form like FIGS. 11-13 is also mentioned, but this is mentioned later.

（実施形態７）
図８〜図１０は、実施形態７にかかる発光装置であり、発光素子を封止する封止部材として、蛍光体とゲッターとを含有する波長変換部材を用いる。図８に示すように、発光装置３００は、正負一対の電極として機能する一対のリード３１０を有しており、リード３１０上に発光素子１４０が接合部材（図示せず）を介して接合されている。リード３１０と発光素子１４０とは導電性ワイヤを３２０介して電気的に接続される。発光素子１４０及び導電性ワイヤ３２０を覆うように封止部材が設けられる。 (Embodiment 7)
8 to 10 show a light-emitting device according to Embodiment 7, in which a wavelength conversion member containing a phosphor and a getter is used as a sealing member for sealing a light-emitting element. As shown in FIG. 8, the light-emitting device 300 has a pair of leads 310 that function as a pair of positive and negative electrodes, and the light-emitting element 140 is bonded onto the leads 310 via a bonding member (not shown). Yes. The lead 310 and the light emitting element 140 are electrically connected via a conductive wire 320. A sealing member is provided to cover the light emitting element 140 and the conductive wire 320.

この封止部材は、実施形態２〜実施形態４で説明したような、蛍光体とゲッターとを含有する波長変換部材として機能するものである。実施形態７では、予め成形した波長変換部材と、発光素子とを組み合わせるのではなく、成形前の溶融様態の波長変換部材と発光素子とを組み合わせ、その後に成形（硬化）させるものである。   This sealing member functions as a wavelength conversion member containing a phosphor and a getter as described in the second to fourth embodiments. In Embodiment 7, the preliminarily molded wavelength conversion member and the light emitting element are not combined, but the wavelength conversion member and the light emitting element in a melted state before molding are combined and then molded (cured).

このように、発光素子を封止する封止部材を波長変換部材として用いる場合、図８に示すように、印刷や圧縮成形、トランスファ成形などの方法により、封止部材でリードを固定するような発光装置のほか、図９に示すようにパッケージ樹脂４２０の凹部に発光素子を載置し、その凹部内に封止部材（波長変換部材）２０を充填した発光装置としてもよい。あるいは図１０に示すように、リード３１０の一方にカップを有し、そのカップに発光素子を載置して波長変換部材を充填し、それらを透光性樹脂で覆った砲弾型の発光装置としてもよい。このように、封止部材として用いる波長変換部材は、硬化させる際の型によって種々の形状とすることができる。尚、封止部材は波長変換部材のみからなるもののほか、蛍光体を含まない樹脂と積層させてもよい。例えば、発光素子を直接封止する透光性樹脂の上に、蛍光体とゲッターとを含む波長変換部材を設けてもよく、あるいはその逆の順番で設けてもよい。さらにこのような２層でなく３層以上とすることもできる。また、２層以上の多層とする場合は、そのいずれかに蛍光体を含有し、それと異なる層にゲッターを含有するなどでもよく、封止部材全体をまとめてみたときに、蛍光体とゲッターとが含まれていればよい。   Thus, when using the sealing member which seals a light emitting element as a wavelength conversion member, as shown in FIG. 8, a lead is fixed with a sealing member by methods, such as printing, compression molding, and transfer molding. In addition to the light-emitting device, a light-emitting device in which a light-emitting element is placed in a concave portion of the package resin 420 and a sealing member (wavelength conversion member) 20 is filled in the concave portion as shown in FIG. Alternatively, as shown in FIG. 10, a bullet-type light emitting device having a cup on one of the leads 310, a light emitting element placed on the cup, filled with a wavelength conversion member, and covered with a translucent resin. Also good. Thus, the wavelength conversion member used as the sealing member can have various shapes depending on the mold used for curing. In addition, the sealing member may be laminated with a resin that does not contain a phosphor, in addition to the wavelength conversion member alone. For example, a wavelength conversion member including a phosphor and a getter may be provided on a translucent resin that directly seals the light emitting element, or may be provided in the reverse order. Further, the number of layers may be three or more instead of the two layers. In addition, in the case of a multilayer of two or more layers, it may contain a phosphor in one of them, and a getter may be contained in a different layer. When the entire sealing member is collected, the phosphor and getter As long as it is included.

（実施形態８）
図１１〜図１３は、実施形態８にかかる発光装置であり、実施形態６（図７）で示したように、予め成形品とした波長変換部材を用いる点は同じであるが、発光素子と組み合わせて（接着して）一体的な構成とするのではなく、発光素子を、波長変換部材を有しない透光性部材と組み合わせて（封止して）一体的な構成としたＬＥＤと組み合わせた（取り付けた）、ＬＥＤランプやバックライト用光源などの形態のものである。 (Embodiment 8)
FIGS. 11 to 13 show a light emitting device according to the eighth embodiment. As shown in the sixth embodiment (FIG. 7), the wavelength conversion member formed in advance is the same as the light emitting device. Rather than combining (adhering) to form an integrated structure, the light emitting element is combined with a light-transmitting member not having a wavelength conversion member (sealed) and combined with an LED having an integrated structure. (Attached), in the form of an LED lamp or a light source for backlight.

図１１に示す発光装置は、光源として青色ＬＥＤ６１０を用い、それを導光板６３０の端面に配置し、導光板の主面にシート状の波長変換部材６２０を取り付けたバックライト光源としての発光装置を示す。青色ＬＥＤは、導光板内に光を照射できる位置に配置されていればよく、例えば、導光板の端面のほかに、導光板の下面（主面と対向する面）に設けてもよく、また、導光板の角を切り欠いて斜面を設け、その斜面に設けてもよい。また、波長変換部材は、青色ＬＥＤからの光を照射される位置であればよく、図１１に示すような導光板の主面のほか、導光板の端面、下面などに設けてもよい。更に、シート状の波長変換部材を二枚以上用いて、重ねる、又は別の位置に設けるなどの構成としてもよい。   The light-emitting device shown in FIG. 11 uses a blue LED 610 as a light source, arranges it on the end surface of the light guide plate 630, and a light-emitting device as a backlight light source in which a sheet-like wavelength conversion member 620 is attached to the main surface of the light guide plate. Show. The blue LED only needs to be disposed at a position where light can be irradiated in the light guide plate. For example, in addition to the end surface of the light guide plate, the blue LED may be provided on the lower surface of the light guide plate (the surface facing the main surface). Alternatively, a slope may be provided by cutting off a corner of the light guide plate, and the light guide plate may be provided on the slope. Moreover, the wavelength conversion member should just be a position where the light from blue LED is irradiated, and may be provided in the end surface of a light guide plate, a lower surface other than the main surface of a light guide plate as shown in FIG. Furthermore, it is good also as a structure of using two or more sheet-like wavelength conversion members, and overlapping or providing in another position.

図１２に示す発光装置は、光源として青色ＬＥＤ７１０を用い、それらを配線基板に実装したＬＥＤモジュールを組み込んでおり、曲面状のカバーに成形した波長変換部材７２０で覆った電球型ＬＥＤランプとした発光装置を示す。カバーの形状や、口金サイズ、青色ＬＥＤの数や配置などは目的や用途に応じて適宜選択することができる。   The light emitting device shown in FIG. 12 uses a blue LED 710 as a light source, incorporates an LED module mounted on a wiring board, and emits light as a light bulb type LED lamp covered with a wavelength conversion member 720 formed on a curved cover. Indicates the device. The shape of the cover, the base size, the number and arrangement of the blue LEDs can be appropriately selected according to the purpose and application.

図１３に示す発光装置は、光源として青色ＬＥＤ８１０を用い、それを配線基板に実装した長尺のＬＥＤモジュールを、筒状に成形した波長変換部材８２０内に挿入して直管型ＬＥＤランプとした発光装置を示す。直管の形状や、口金サイズ、青色ＬＥＤの数や配置などは目的や用途に応じて適宜選択することができる。   The light-emitting device shown in FIG. 13 uses a blue LED 810 as a light source, and a long LED module mounted on a wiring board is inserted into a cylindrical wavelength conversion member 820 to obtain a straight tube LED lamp. 1 shows a light emitting device. The shape of the straight tube, the base size, the number and arrangement of the blue LEDs can be appropriately selected according to the purpose and application.

本発明に係る発光装置は、各種表示装置、照明器具、ディスプレイ、液晶ディスプレイのバックライト光源、さらには、デジタルビデオカメラ、ファクシミリ、コピー機、スキャナ等における画像読取装置、プロジェクタ装置、などにも利用することができる。   The light emitting device according to the present invention is used for various display devices, lighting fixtures, displays, backlight light sources for liquid crystal displays, and also for image reading devices, projector devices, etc. in digital video cameras, facsimiles, copiers, scanners, etc. can do.

１０…波長変換部材
１１…蛍光体
１２…ゲッター
１３…結着剤
２０、３０、４０、５０…波長変換部材
１００、２００、３００、４００、５００…発光装置
１１０…基板
１２０…配線
１３０…透光性樹脂
１４０…導電性接着剤
２６０…枠体
２７０…白色樹脂
３１０…リード
３２０…導電性ワイヤ
４２０…パッケージ樹脂
５５０…透明樹脂
６００、７００、８００…発光装置
６１０、７１０、８１０…青色ＬＥＤ
６２０…波長変換部材（シート）
６３０…導光板
７２０…波長変換部材（カバー）
８２０…波長変換部材（筒） DESCRIPTION OF SYMBOLS 10 ... Wavelength conversion member 11 ... Phosphor 12 ... Getter 13 ... Binder 20, 30, 40, 50 ... Wavelength conversion member 100, 200, 300, 400, 500 ... Light-emitting device 110 ... Substrate 120 ... Wiring 130 ... Light transmission Conductive resin 140 ... Conductive adhesive 260 ... Frame body 270 ... White resin 310 ... Lead 320 ... Conductive wire 420 ... Package resin 550 ... Transparent resin 600, 700, 800 ... Light emitting device 610, 710, 810 ... Blue LED
620 ... Wavelength conversion member (sheet)
630 ... Light guide plate 720 ... Wavelength conversion member (cover)
820 ... Wavelength conversion member (cylinder)

Claims (8)

蛍光体とゲッターを含有する波長変換部材であって、
前記蛍光体は、ハロゲンを含み、
前記ゲッターは、アルカリ土類金属リン酸塩を含むことを特徴とする波長変換部材。
A wavelength conversion member containing a phosphor and a getter,
The phosphor includes halogen,
The wavelength conversion member, wherein the getter contains an alkaline earth metal phosphate.
前記ゲッターは、第一リン酸カルシウム（Ｃａ（Ｈ２ＰＯ４）２）、第二リン酸カルシウム（ＣａＨＰＯ４）、リン酸三カルシウム（Ｃａ（ＰＯ４）２）、第三リン酸三カルシウム（３Ｃａ３（ＰＯ４）６（ＯＨ）２）、カルシウムヒドロキシアパタイト（Ｃａ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素カルシウム（ＣａＨ２Ｐ２Ｏ７）、ピロリン酸カルシウム（Ｃａ２Ｐ２Ｏ７）、ポリリン酸にカルシウムイオンを加えた塩（Ｃａ・（ＰＯ３）ｎ）から選択される少なくとも１つを有する請求項１記載の波長変換部材。
The getter is composed of monocalcium phosphate (Ca (H 2 PO 4 ) 2 ), dicalcium phosphate (CaHPO 4 ), tricalcium phosphate (Ca (PO 4 ) 2 ), tricalcium phosphate (3Ca 3 (PO 4 ) 6 (OH) 2 ), calcium hydroxyapatite (Ca 10 (PO 4 ) 6 (OH) 2 ), calcium dihydrogen pyrophosphate (CaH 2 P 2 O 7 ), calcium pyrophosphate (Ca 2 P 2 O 7 ) 2. The wavelength conversion member according to claim 1, comprising at least one selected from a salt (Ca · (PO 3 ) n ) obtained by adding calcium ions to polyphosphoric acid.
前記ゲッターは、第一リン酸ストロンチウム（Ｓｒ（Ｈ２ＰＯ４）２）、第二リン酸ストロンチウム（ＳｒＨＰＯ４）、リン酸三ストロンチウム（Ｓｒ（ＰＯ４）２）、第三リン酸三ストロンチウム（３Ｓｒ３（ＰＯ４）６（ＯＨ）２）、ストロンチウムヒドロキシアパタイト（Ｓｒ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素ストロンチウム（ＳｒＨ２Ｐ２Ｏ７）、ピロリン酸ストロンチウム（Ｓｒ２Ｐ２Ｏ７）、ポリリン酸にストロンチウムイオンを加えた塩（Ｓｒ・（ＰＯ３）ｎ）から選択される少なくとも１つを有する請求項１記載の波長変換部材。
The getter is composed of primary strontium phosphate (Sr (H 2 PO 4 ) 2 ), second strontium phosphate (SrHPO 4 ), tristrontium phosphate (Sr (PO 4 ) 2 ), tristrontium phosphate ( 3Sr 3 (PO 4 ) 6 (OH) 2 ), strontium hydroxyapatite (Sr 10 (PO 4 ) 6 (OH) 2 ), strontium dihydrogen pyrophosphate (SrH 2 P 2 O 7 ), strontium pyrophosphate (Sr 2) 2. The wavelength conversion member according to claim 1, comprising at least one selected from P 2 O 7 ) and a salt obtained by adding strontium ions to polyphosphoric acid (Sr · (PO 3 ) n ).
前記ゲッターは、第一リン酸バリウム（Ｂａ（Ｈ２ＰＯ４）２）、第二リン酸バリウム（ＢａＨＰＯ４）、リン酸三バリウム（Ｂａ（ＰＯ４）２）、第三リン酸三バリウム（３Ｂａ３（ＰＯ４）６（ＯＨ２））、バリウムヒドロキシアパタイト（Ｂａ１０（ＰＯ４）６（ＯＨ）２）、ピロリン酸二水素バリウム（ＢａＨ２Ｐ２Ｏ７）、ピロリン酸バリウム（Ｂａ２Ｐ２Ｏ７）、ポリリン酸にバリウムイオンを加えた塩（Ｂａ・（ＰＯ３）ｎ）から選択される少なくとも１つを有する請求項１記載の波長変換部材。
The getter is composed of primary barium phosphate (Ba (H 2 PO 4 ) 2 ), secondary barium phosphate (BaHPO 4 ), tribarium phosphate (Ba (PO 4 ) 2 ), tribarium triphosphate ( 3Ba 3 (PO 4 ) 6 (OH 2 )), barium hydroxyapatite (Ba 10 (PO 4 ) 6 (OH) 2 ), barium dihydrogen pyrophosphate (BaH 2 P 2 O 7 ), barium pyrophosphate (Ba 2) The wavelength conversion member according to claim 1, comprising at least one selected from P 2 O 7 ) and a salt obtained by adding barium ions to polyphosphoric acid (Ba · (PO 3 ) n ).
前記蛍光体は、ハロシリケート蛍光体、ハロボレート蛍光体、ハロゲンアパタイト蛍光体から選択される少なくとも１つを有する請求項１乃至請求項４のいずれか一項に記載の波長変換部材。
The wavelength conversion member according to any one of claims 1 to 4, wherein the phosphor has at least one selected from a halosilicate phosphor, a haloborate phosphor, and a halogenapatite phosphor.
前記蛍光体は、表面にコート部材を有し、
前記ゲッターは、前記コート部材に含有される請求項１乃至請求項５のいずれか一項に記載の波長変換部材。
The phosphor has a coating member on the surface,
The wavelength conversion member according to any one of claims 1 to 5, wherein the getter is contained in the coating member.
前記蛍光体は、透光性部材中に含有されており、
前記ゲッターは、前記透光性部材中に含有されている請求項１乃至請求項６のいずれか一項に記載の波長変換部材。
The phosphor is contained in a translucent member,
The wavelength conversion member according to any one of claims 1 to 6, wherein the getter is contained in the translucent member.
請求項１乃至請求項７のいずれか一項に記載の波長変換部材と、
該波長変換部材に含まれる蛍光体を励起する波長の光を発光する半導体発光素子と、
を備えた発光装置。 The wavelength conversion member according to any one of claims 1 to 7,
A semiconductor light emitting device that emits light having a wavelength that excites the phosphor contained in the wavelength conversion member;
A light emitting device comprising:
JP2013038062A 2013-02-28 2013-02-28 Wavelength conversion member and light emitting device Pending JP2014162913A (en)

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US10407615B2 (en) 2016-11-24 2019-09-10 Nichia Corporation Fluorescent material, method of producing same, and light emitting device
CN110832361A (en) * 2017-08-21 2020-02-21 东丽株式会社 Color conversion composition, color conversion sheet, and light source module, display, and lighting device each comprising color conversion sheet

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JP2009030042A (en) * 2007-06-29 2009-02-12 Mitsubishi Chemicals Corp Phosphor, method for producing phosphor, phosphor-containing composition, and light-emitting device
US20110279011A1 (en) * 2010-04-29 2011-11-17 General Electric Company Color stable phosphors

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JP2009030042A (en) * 2007-06-29 2009-02-12 Mitsubishi Chemicals Corp Phosphor, method for producing phosphor, phosphor-containing composition, and light-emitting device
US20110279011A1 (en) * 2010-04-29 2011-11-17 General Electric Company Color stable phosphors

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US10407615B2 (en) 2016-11-24 2019-09-10 Nichia Corporation Fluorescent material, method of producing same, and light emitting device
CN110832361A (en) * 2017-08-21 2020-02-21 东丽株式会社 Color conversion composition, color conversion sheet, and light source module, display, and lighting device each comprising color conversion sheet
CN110832361B (en) * 2017-08-21 2021-12-17 东丽株式会社 Color conversion composition, color conversion sheet, and light source module, display, and lighting device each comprising color conversion sheet

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