JP2014135332A - Suction turnover device - Google Patents

Suction turnover device Download PDF

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JP2014135332A
JP2014135332A JP2013001466A JP2013001466A JP2014135332A JP 2014135332 A JP2014135332 A JP 2014135332A JP 2013001466 A JP2013001466 A JP 2013001466A JP 2013001466 A JP2013001466 A JP 2013001466A JP 2014135332 A JP2014135332 A JP 2014135332A
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suction
substrate
suction plate
push
adsorption
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Shintaro Kamei
慎太郎 亀井
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2013001466A priority Critical patent/JP2014135332A/en
Priority to TW102129107A priority patent/TW201427805A/en
Priority to CN201310522744.5A priority patent/CN103910196A/en
Priority to KR1020130151220A priority patent/KR20140090934A/en
Publication of JP2014135332A publication Critical patent/JP2014135332A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a suction turnover device in which a suction plate can be moved up and down with an extremely simple structure.SOLUTION: A suction turnover device for sucking and turning over a substrate W includes a rotating shaft 15 supported by right and left side frames 14, a support member 16 attached horizontally to the rotating shaft 15 and rotating together therewith, a horizontal suction plate 18 held by the support member 16 movably up and down via a push-down member 17, and a reset spring 19 for always urging the suction plate 18 upward. The suction turnover device is configured so that the suction plate 18 moves downward by operating the push-down member 17, and when the push-down force of the push-down member 17 is released, the suction plate 18 is raised by the urging force of the reset spring 19, and reset to the original position.

Description

本発明は、ガラス、シリコン、セラミック、化合物半導体等の脆性材料からなる基板に分断用のスクライブラインを加工したり、このスクライブラインに沿って基板を分断したりする基板加工装置等で用いられる吸着反転装置に関する。   The present invention is an adsorption used in a substrate processing apparatus or the like that processes a scribe line for cutting a substrate made of a brittle material such as glass, silicon, ceramic, or a compound semiconductor, or divides the substrate along the scribe line. The present invention relates to a reversing device.

従来より、テーブル上に載置した基板に対し、カッターホイール（スクライビングホイールともいう）を所定のスクライブ圧を加えた状態で転動させたり、レーザービームの照射による熱歪を利用したりして、互いに直交する複数条の平行なスクライブラインを形成し、その後に、基板を表裏反転させて、当該スクライブラインを設けた面とは反対側の面からブレイクバーを押し当てて基板を撓ませることにより基板を分断し、単位製品を取り出す方法が、例えば特許文献１等で開示されている。   Conventionally, with respect to the substrate placed on the table, the cutter wheel (also referred to as the scribing wheel) is rolled in a state where a predetermined scribe pressure is applied, or the thermal strain caused by the laser beam irradiation is utilized, By forming a plurality of parallel scribe lines orthogonal to each other, then turning the board upside down and bending the board by pressing the break bar from the surface opposite to the surface on which the scribe lines are provided A method of dividing a substrate and taking out a unit product is disclosed in, for example, Patent Document 1.

また、２枚のガラス基板を貼り合わせた基板の分断方法についても、例えば特許文献２（図４５等）には、以下に示す手順で分断する方法が開示されている。すなわち、スクライブ装置のテーブル上に載置された基板に対して、カッターホイールを転動させることにより、基板の一方の面であるａ面にスクライブラインを形成する。次いで、吸着反転装置で基板を吸着し反転させた後、ブレイク装置のテーブル上に載置し、基板ａ面の裏面となる基板ｂ面をブレイクバー等で押圧して基板ａ面をブレイクする。次いで、上記と同様に、基板ｂ面にスクライブラインを形成し、基板を反転させた後、基板ａ面をブレイクバー等で押圧して基板ｂ面を分断する。この後、分断された基板をブレイク装置から除材して次の工程へ移行するようにしている。   As for a method for dividing a substrate in which two glass substrates are bonded together, for example, Patent Document 2 (FIG. 45, etc.) discloses a method for dividing the substrate in the following procedure. That is, a scribe line is formed on the surface a which is one surface of the substrate by rolling the cutter wheel with respect to the substrate placed on the table of the scribe device. Next, after the substrate is sucked and reversed by the suction reversing device, it is placed on the table of the breaking device, and the substrate b surface which is the back surface of the substrate a surface is pressed with a break bar or the like to break the substrate a surface. Next, in the same manner as described above, a scribe line is formed on the surface of the substrate b, the substrate is inverted, and then the surface of the substrate a is pressed with a break bar or the like to divide the surface of the substrate b. Thereafter, the divided substrate is removed from the breaking device and the process proceeds to the next step.

国際公開ＷＯ２００５／０５３９２５号公報International Publication WO2005 / 053925 国際公開ＷＯ２００２／０５７１９２号公報International Publication No. WO2002 / 057192

上記のような基板の加工方法において、基板を反転させるのに用いられる吸着反転装置は、テーブル等の載置台上に置かれた基板を吸着して持ち上げるための吸着板を備えており、吸着板で吸着して持ち上げた基板を反転するようにしている。この吸着板を基板面に対して上下に昇降させる機構としては、例えばテーブルの上方に位置するフレーム等の支持部材から垂直な支柱を延設させ、この垂直な支柱に、前記吸着板を反転可能に保持した昇降部材を昇降可能に取り付けたりしている。
この昇降部材は、反転に必要な距離を昇降させるために移動ストロークの長い流体シリンダやラックとピニオン等による複雑な構造の昇降機構によって昇降するように形成されている。 In the substrate processing method as described above, the suction reversing device used for reversing the substrate includes a suction plate for sucking and lifting the substrate placed on a mounting table such as a table. The substrate picked up and lifted is reversed. As a mechanism for moving the suction plate up and down with respect to the substrate surface, for example, a vertical column is extended from a support member such as a frame located above the table, and the suction plate can be reversed to the vertical column The elevating member held in the upper part is attached so as to be movable up and down.
This elevating member is formed so as to elevate by a complicated structure elevating mechanism such as a fluid cylinder having a long moving stroke, a rack and a pinion, etc., in order to elevate the distance necessary for reversal.

上記のような吸着反転装置では、垂直な支柱や、これに沿って昇降する昇降部材、並びに、内部に組み込まれる複雑な昇降機構によって昇降装置が大掛かりなものとなり、かつ、機構が複雑となってコスト高になるといった問題点があった。   In the adsorption reversal device as described above, the vertical lifting column, the lifting member that moves up and down along this, and the complicated lifting mechanism incorporated inside, make the lifting device large, and the mechanism becomes complicated. There was a problem of high costs.

そこで本発明は、上記した従来課題に鑑み、吸着板の上下動を、新規な機構でしかも極めて簡単な構造で行うことができる吸着反転装置を提供することを目的とする。   In view of the above-described conventional problems, an object of the present invention is to provide a suction reversing device capable of moving the suction plate up and down with a novel mechanism and an extremely simple structure.

上記目的を達成するために本発明では次のような技術的手段を講じた。すなわち、本発明は、基板を吸着し反転させる吸着反転装置であって、左右の側枠に支持された回転軸と、前記回転軸に水平に取り付けられて回転軸と共に回動する支持部材と、前記支持部材に押下げ部材を介して上下動可能に保持された水平な吸着板と、前記吸着板を常時上方に向かって付勢する復帰スプリングとを備え、前記押下げ部材を動作させることにより前記吸着板が下動し、前記押下げ部材が押下げる力を解除することにより、前記復帰スプリングの付勢力によって前記吸着板が上昇して元位置に復帰するように形成されている構成とした。   In order to achieve the above object, the present invention takes the following technical means. That is, the present invention is an adsorption reversal device that adsorbs and reverses a substrate, a rotation shaft supported by the left and right side frames, a support member that is horizontally attached to the rotation shaft and rotates together with the rotation shaft, A horizontal suction plate that is supported by the support member via a push-down member so as to be movable up and down, and a return spring that constantly urges the suction plate upward, by operating the push-down member When the suction plate is moved downward and the pressing member releases the pressing force, the suction plate is lifted and returned to the original position by the biasing force of the return spring. .

本発明の吸着反転装置では、押下げ部材の押下げ力を解除すると復帰スプリングの付勢力（復元力）によって吸着板が元位置に自然復帰するように形成したので、吸着板を上昇させるための機械的な機構を省略することができ、これにより吸着板の昇降機構を簡単な構成で、かつ、低コストで形成することができるといった効果がある。   In the suction reversing device of the present invention, when the pressing force of the pressing member is released, the suction plate is naturally returned to the original position by the urging force (restoring force) of the return spring. The mechanical mechanism can be omitted, and this has the effect that the lifting mechanism of the suction plate can be formed with a simple configuration and at a low cost.

上記発明において、押下げ部材は、ピストンを備えたエアシリンダからなり、前記ピストンはＯＮ動作で下動し、ＯＦＦ動作で押下げ力を解除するとともに、ＯＮ動作時の押下げ量が調整できるように形成されているのが好ましい。
これにより、基板の厚み等の作業条件に応じて、吸着板の降下量を適切に調整することができる。 In the above invention, the push-down member is an air cylinder provided with a piston, and the piston is moved down by the ON operation, the push-down force is released by the OFF operation, and the push-down amount at the ON operation can be adjusted. It is preferable that it is formed.
Thereby, the amount of lowering of the suction plate can be appropriately adjusted according to work conditions such as the thickness of the substrate.

また、上記発明において、エアシリンダにエアを供給するためのエア流路が回転軸内部に設けられ、エア流路からエアシリンダに至るエア流通用の配管が接続されているのが好ましい。   Moreover, in the said invention, it is preferable that the air flow path for supplying air to an air cylinder is provided in the inside of a rotating shaft, and the piping for air distribution | circulation from an air flow path to an air cylinder is connected.

これにより、前記吸着板が反転回動したときにエアシリンダにつながる配管がねじれることがなくなるとともに、エアシリンダに接続される配管設備を簡素化することができる。   As a result, the pipe connected to the air cylinder is not twisted when the suction plate rotates in the reverse direction, and the piping equipment connected to the air cylinder can be simplified.

本発明の吸着反転装置を組み込んだ基板加工装置の全体構成を示す斜視図。The perspective view which shows the whole structure of the board | substrate processing apparatus incorporating the adsorption | suction inversion apparatus of this invention. 図１の基板加工装置におけるスクライブ装置の概略的な正面図。The schematic front view of the scribe apparatus in the board | substrate processing apparatus of FIG. 図１の基板加工装置における吸着反転装置の全体構成を示す斜視図。The perspective view which shows the whole structure of the adsorption | suction inversion apparatus in the board | substrate processing apparatus of FIG. 図３の吸着反転装置の一部拡大断面図。FIG. 4 is a partially enlarged cross-sectional view of the adsorption reversing device of FIG. 図３の吸着反転装置における吸着板の下動状態を示す図４同様の断面図。FIG. 5 is a cross-sectional view similar to FIG. 図３の吸着反転装置の反転回動機構部分を示す側面図。The side view which shows the inversion rotation mechanism part of the adsorption | suction inversion apparatus of FIG. 図１の基板加工装置における吸着昇降装置を示す斜視図。The perspective view which shows the adsorption raising / lowering apparatus in the board | substrate processing apparatus of FIG. 基板加工装置による基板加工工程の第１段階を示す説明図。Explanatory drawing which shows the 1st step of the substrate processing process by a substrate processing apparatus. 基板加工工程の第２段階を示す説明図。Explanatory drawing which shows the 2nd step of a board | substrate processing process. 基板加工工程の第３段階を示す説明図。Explanatory drawing which shows the 3rd step of a board | substrate processing process. 基板加工工程の第４段階を示す説明図。Explanatory drawing which shows the 4th step of a board | substrate processing process. 基板加工工程の第５段階を示す説明図。Explanatory drawing which shows the 5th step of a board | substrate processing process. 基板加工工程の第６段階を示す説明図。Explanatory drawing which shows the 6th step of a board | substrate processing process. 基板加工工程の第７段階を示す説明図。Explanatory drawing which shows the 7th step of a board | substrate processing process. 基板加工工程の第８段階を示す説明図。Explanatory drawing which shows the 8th step of a board | substrate processing process. 基板加工工程の第９段階を示す説明図。Explanatory drawing which shows the 9th step of a board | substrate processing process. 基板加工工程の第１０段階を示す説明図。Explanatory drawing which shows the 10th step of a board | substrate processing process. 基板加工工程の第１１段階を示す説明図。Explanatory drawing which shows the 11th step of a board | substrate processing process. 基板加工装置に取り付けられた操作パネルを示す図。The figure which shows the operation panel attached to the board | substrate processing apparatus. 基板加工装置に組み込まれるブレイク装置を示す正面図。The front view which shows the breaking apparatus integrated in a board | substrate processing apparatus. 吸着反転装置並びに吸着昇降装置の各吸着板とエア吸引装置とをつなぐエア回路を示す図。The figure which shows the air circuit which connects each adsorption | suction board of an adsorption | suction inversion apparatus and adsorption raising / lowering apparatus, and an air suction apparatus.

以下、本発明に係る吸着反転装置の詳細を図面に基づいて説明する。なお、ここでは、基板にスクライブラインを加工し、その後に基板を反転させるようにした基板加工装置に組み込まれた吸着反転装置での実施例に基づいて説明する。   Hereinafter, the details of the adsorption reversal device according to the present invention will be described with reference to the drawings. Here, a description will be given based on an example of an adsorption reversing apparatus incorporated in a substrate processing apparatus that processes a scribe line on a substrate and then reverses the substrate.

本発明の吸着反転装置を組み込んだ基板加工装置Ａは、図１に示すように、基板Ｗの表面にスクライブラインを加工するスクライブ装置Ｂと、基板Ｗを反転させる吸着反転装置Ｃと、スクライブ装置Ｂのテーブルの上方に配置され基板Ｗを吸着して昇降させる吸着昇降装置Ｄとを備えている。
これらスクライブ装置Ｂ、吸着反転装置Ｃ並びに吸着昇降装置Ｄは、基板加工装置Ａのフレーム１に組み込まれている。フレーム１は、金属製の枠材によって長方体の形態で組み付けられており、図１の平面視において長手方向に沿ったラインをＸ方向とし、Ｘ方向に直交する方向をＹ方向として以下に説明する。 As shown in FIG. 1, a substrate processing apparatus A incorporating the suction reversal device of the present invention includes a scribe device B for processing a scribe line on the surface of the substrate W, a suction reversal device C for reversing the substrate W, and a scribe device. And a suction lifting / lowering device D that is disposed above the B table and lifts and lowers the substrate W by suction.
The scribing device B, the suction reversing device C, and the suction lifting device D are incorporated in the frame 1 of the substrate processing apparatus A. The frame 1 is assembled in the form of a rectangular parallelepiped with a metal frame member. In the plan view of FIG. 1, the line along the longitudinal direction is defined as the X direction, and the direction orthogonal to the X direction is defined as the Y direction. explain.

スクライブ装置Ｂは、図１、２に示すように、フレーム１内のＸ方向に沿った一端側（本実施例では図１の右側）に組み込まれており、台板２上でＹ方向に延びるレール３に沿って移動するテーブル４を備えている。台板２は、平面視でＹ方向に延びる長方形に形成され、その一端部分がフレーム１から延出されている。
テーブル４は、その上面に多数の吸着孔を有する吸着面４ａを備え、モータを内蔵する回転駆動部５により水平面内で回動できるようになっている。また、テーブル４並びに回転駆動部５は、レール３に沿って移動する移動ステージ６上に取り付けられており、モータ８によって回転するネジ軸９によりＹ方向に移動するように形成されている。また、フレーム１には、ガイド１０を有するビーム（横桟）１１がＸ方向に沿って設けられ、ガイド１０にはカッターホイール１２を有する昇降可能なスクライブヘッド１３がＸ方向に移動できるように取り付けられている。 As shown in FIGS. 1 and 2, the scribing device B is incorporated on one end side (the right side of FIG. 1 in this embodiment) along the X direction in the frame 1 and extends in the Y direction on the base plate 2. A table 4 that moves along the rail 3 is provided. The base plate 2 is formed in a rectangular shape extending in the Y direction in plan view, and one end portion thereof extends from the frame 1.
The table 4 includes an adsorption surface 4a having a large number of adsorption holes on the upper surface thereof, and can be rotated in a horizontal plane by a rotation drive unit 5 incorporating a motor. The table 4 and the rotation drive unit 5 are mounted on a moving stage 6 that moves along the rail 3, and are formed to move in the Y direction by a screw shaft 9 that is rotated by a motor 8. Further, the frame 1 is provided with a beam (horizontal beam) 11 having a guide 10 along the X direction, and a scribe head 13 having a cutter wheel 12 that can be moved up and down is attached to the guide 10 so as to be movable in the X direction. It has been.

吸着反転装置Ｃは、図１、図３〜５に示すように、左右の側枠１４、１４によって支持されたＹ方向に延びる水平な回転軸１５と、該回転軸１５に水平に取り付けられ、回転軸１５と共に回転する支持部材１６と、この支持部材１６に複数の、本実施例では４つの押下げ部材１７を介して上下動可能に支持された水平な吸着板１８とを備えている。吸着板１８は下面に多数の吸着孔を有する吸着面１８ａを備え、復帰スプリング１９によって常時上方に向かって付勢されている。本実施例では上記した押下げ部材１７として、ＯＮ動作で下動し、ＯＦＦ動作で押下げ力を解除するピストンを備えたエアシリンダで形成されている。このエアシリンダ１７をＯＮ動作させることにより、図５に示すように、吸着板１８を復帰スプリング１９に抗して下動させ、エアシリンダ１７をＯＦＦ動作させることにより、復帰スプリング１９の復元力によって吸着板１８を図４の元位置に復帰できるように形成されている。
また、押下げ部材１７であるエアシリンダのピストン１７ａは、その突出ストロークが調整できるように形成されている。これにより、基板Ｗの厚み等の作業条件に応じて吸着板１８の降下量を適切に調整することができる。さらに、回転軸１５は内部を中空としたパイプ材で形成されており、その内部はエア供給源（図示外）から前記エアシリンダ１７にエアを供給するためのエア流路１５ａとして形成されている。このエア流路１５ａから配管４７を介して各エアシリンダ１７に接続されている。これにより、吸着板１８が反転回動したときにエアシリンダ１７につながる配管４７がねじれないようにしている。 As shown in FIGS. 1 and 3 to 5, the suction reversing device C is horizontally attached to the rotary shaft 15 extending in the Y direction supported by the left and right side frames 14 and 14, and horizontally attached to the rotary shaft 15. A support member 16 that rotates together with the rotary shaft 15 and a plurality of horizontal suction plates 18 that are supported by the support member 16 so as to be movable up and down via four push-down members 17 in this embodiment. The suction plate 18 includes a suction surface 18 a having a large number of suction holes on the lower surface, and is always urged upward by a return spring 19. In the present embodiment, the above-described pressing member 17 is formed of an air cylinder having a piston that moves downward by an ON operation and releases a pressing force by an OFF operation. When the air cylinder 17 is turned on, the suction plate 18 is moved down against the return spring 19 and the air cylinder 17 is turned off by the restoring force of the return spring 19 as shown in FIG. The suction plate 18 is formed so as to be able to return to the original position in FIG.
Moreover, the piston 17a of the air cylinder which is the pressing member 17 is formed so that the protrusion stroke can be adjusted. As a result, the amount of lowering of the suction plate 18 can be appropriately adjusted according to work conditions such as the thickness of the substrate W. Further, the rotary shaft 15 is formed of a pipe material having a hollow inside, and the inside is formed as an air flow path 15a for supplying air from an air supply source (not shown) to the air cylinder 17. . The air flow path 15 a is connected to each air cylinder 17 via a pipe 47. This prevents the pipe 47 connected to the air cylinder 17 from being twisted when the suction plate 18 is rotated in the reverse direction.

吸着反転装置Ｃの回転軸１５は、反転回動機構４２によって１８０度回転できるように形成されている。この反転回動機構４２は、図６に示すように、その一端部にピニオン２０を備え、このピニオン２０にかみ合うラック２１をシリンダ２２で駆動させることにより、１８０度回転できるように形成されている。これにより、吸着板１８の吸着面１８ａが下向きの姿勢から上向きの姿勢に、また逆に、上向きの姿勢から下向きの姿勢に反転できるようになっている。
また、図１に示すように、フレーム１のＸ方向に延びる上部枠材１ａ、１ａの上面にはレール２３、２３が設けられ、吸着反転装置Ｃの側枠１４、１４の上端部には、該レール２３、２３に沿ってスライドするガイド部２４、２４が設けられている。さらに、吸着反転装置Ｃを手動で移動させるための把手２５が、一方のガイド部２４に連なってフレーム１の外側に延出して設けられている。これにより、吸着板１８を、反転可能なスペースを確保したフレーム１内の図１における左側、すなわち基板反転位置から、スクライブ装置Ｂのテーブル４の上方、すなわち基板受け渡し位置まで手動で移動できるように形成されている。 The rotation shaft 15 of the adsorption reversing device C is formed so as to be rotated 180 degrees by the reversing rotation mechanism 42. As shown in FIG. 6, the reverse rotation mechanism 42 includes a pinion 20 at one end thereof, and is configured to be rotated 180 degrees by driving a rack 21 meshing with the pinion 20 with a cylinder 22. . Thereby, the suction surface 18a of the suction plate 18 can be reversed from a downward posture to an upward posture, and conversely, from an upward posture to a downward posture.
Further, as shown in FIG. 1, rails 23 are provided on the upper surfaces of the upper frame members 1a and 1a extending in the X direction of the frame 1, and the upper ends of the side frames 14 and 14 of the suction reversing device C are Guide portions 24, 24 that slide along the rails 23, 23 are provided. Further, a handle 25 for manually moving the suction reversing device C is provided to extend to the outside of the frame 1 so as to continue to one guide portion 24. As a result, the suction plate 18 can be manually moved from the left side in FIG. 1 in the frame 1 in which a reversible space is secured, that is, from the substrate reversal position to above the table 4 of the scribe device B, that is, from the substrate delivery position. Is formed.

さらに、左右の側枠１４、１４の上端を橋架する連結板２６には、フレーム１に取り付けられた出没可能な位置決めピン２８、２８が係入する係合穴２７が設けられている。
位置決めピン２８は、上記した基板反転位置と基板受け渡し位置とにそれぞれ配置されており、吸着反転装置Ｃが基板反転位置並びに基板受け渡し位置にきたときに、位置感知部材２９が感知して自動的に係合穴２７へ係入するように形成されている。位置決めピン２８としては、例えば電磁石のＯＮ／ＯＦＦによって出没するソレノイドで形成することができる。また、位置感知部材２９としては光センサやリミットスイッチなどを利用することができる。 Furthermore, the connection plate 26 that bridges the upper ends of the left and right side frames 14 and 14 is provided with an engagement hole 27 into which the retractable positioning pins 28 and 28 attached to the frame 1 are engaged.
The positioning pins 28 are arranged at the substrate reversing position and the substrate delivery position, respectively, and when the suction reversing device C comes to the substrate reversing position and the substrate delivery position, the position sensing member 29 senses and automatically. It is formed so as to engage with the engagement hole 27. The positioning pin 28 can be formed of, for example, a solenoid that appears and disappears when an electromagnet is turned ON / OFF. As the position sensing member 29, an optical sensor, a limit switch, or the like can be used.

吸着昇降装置Ｄは、図７に示すように、フレーム１に固定された水平な固定板３０と、固定板３０に取り付けられ、かつ、鉛直下方に向かって往復運動をするピストン３１ａを有する流体シリンダ３１と、該流体シリンダ３１のピストン３１ａの下端に固定された吸着板３２とを備えている。吸着板３２は、上記したスクライブ装置Ｂのテーブル４の上方に配置され、下面には多数の吸着孔を有する吸着面３２ａが設けられている。
また、吸着板３２は、その上面から鉛直上方に延びて固定板３０を摺動可能に貫通する複数のガイド３３を備えている。本実施例では、ガイド３３は丸棒材で形成され、流体シリンダ３１を中心とした対称位置に２本ずつ、合計４本が配置されている。これにより、吸着板３２が昇降する際に自由回転するのを阻止するとともに、吸着板３２の水平姿勢を安定よく保持することができる。また、ガイド３３の上端は連結部材３３ａによって互いに連結保持されており、これによりガイド３３が補強されて垂直な立設姿勢を保持することができ、吸着板３２をスムーズに昇降させることができる。 As shown in FIG. 7, the suction lifting device D is a fluid cylinder having a horizontal fixed plate 30 fixed to the frame 1 and a piston 31a attached to the fixed plate 30 and reciprocating vertically downward. 31 and a suction plate 32 fixed to the lower end of the piston 31a of the fluid cylinder 31. The suction plate 32 is disposed above the table 4 of the scribing apparatus B, and a suction surface 32a having a number of suction holes is provided on the lower surface.
Further, the suction plate 32 includes a plurality of guides 33 extending vertically upward from the upper surface thereof and slidably penetrating the fixed plate 30. In this embodiment, the guide 33 is formed of a round bar, and a total of four guides are arranged at two symmetrical positions around the fluid cylinder 31. As a result, it is possible to prevent the suction plate 32 from freely rotating when moving up and down, and to stably hold the horizontal posture of the suction plate 32. Further, the upper ends of the guides 33 are connected and held together by a connecting member 33a, whereby the guides 33 are reinforced and the vertical standing posture can be maintained, and the suction plate 32 can be raised and lowered smoothly.

本実施例において、吸着反転装置Ｃ並びに吸着昇降装置Ｄにおける吸着板１８、３２の昇降動作並びにバキューム動作、及び、吸着反転装置Ｃの吸着板１８を反転させる反転回動機構４２の駆動は、ボタンスイッチによるスイッチ操作によって手動で行うことができるようにしてある。
具体的には、図１９に示すように、吸着反転装置Ｃの位置決めピン２８、２８のロックを解除するための右側ロック解除ボタン３４並びに左側ロック解除ボタン３５、基板受け渡し位置で吸着板１８を下動させるために押下げ部材（エアシリンダ）１７をＯＮ／ＯＦＦ操作する昇降ボタン３６、吸着昇降装置Ｄの流体シリンダ３１を作動させるための操作ボタン３７、吸着反転装置Ｃの反転回動機構４２を駆動する反転操作ボタン４３が、基板加工装置Ａの正面に取り付けられた操作パネル３８（図１では省略）に設けられている。さらに、吸着反転装置Ｃの吸着板１８のバキュームボタン３９、吸着昇降装置Ｄの吸着板３２のバキュームボタン４０が上記操作パネル３８に設けられている。 In this embodiment, the lifting and lowering operation and vacuum operation of the suction plates 18 and 32 in the suction reversing device C and the suction lifting device D, and the driving of the reversing rotation mechanism 42 for reversing the suction plate 18 of the suction reversing device C are performed by a button. It can be manually performed by a switch operation with a switch.
Specifically, as shown in FIG. 19, the right lock release button 34 and the left lock release button 35 for unlocking the positioning pins 28 and 28 of the suction reversing device C, the suction plate 18 is lowered at the substrate delivery position. An elevating button 36 for operating the push-down member (air cylinder) 17 to be turned on and off, an operation button 37 for operating the fluid cylinder 31 of the adsorption elevating device D, and a reverse rotation mechanism 42 of the adsorption reversing device C. A reverse operation button 43 to be driven is provided on an operation panel 38 (not shown in FIG. 1) attached to the front surface of the substrate processing apparatus A. Further, a vacuum button 39 of the suction plate 18 of the suction reversing device C and a vacuum button 40 of the suction plate 32 of the suction lifting device D are provided on the operation panel 38.

上記したスクライブ装置Ｂのテーブル４、吸着反転装置Ｃの吸着板１８並びに吸着昇降装置Ｄの吸着板３２の各吸着面、４ａ、１８ａ、３２ａの吸着孔は、吸気用の配管を介して真空ポンプを用いたエア吸引装置（図示外）に接続されており、吸引エアによって基板Ｗを吸着保持できるように形成されている。図１〜７では、各吸着板に連なる吸気用の配管並びにその付帯設備は、図面の複雑化を避けるために省略してある。
吸着反転装置Ｃの吸着板１８と吸着昇降装置Ｄの吸着板３２とは、図２１に示すように、同一のエア吸引装置４８から配管４９を介して吸引エアが供給されるように形成されており、吸着板３２のバキュームボタン４０を押すと切換バルブ５０によって切り換わるようになっている。これにより、エア吸引装置の省力化と、各吸着板への配管を簡略化して基板加工装置のコスト低減化を図ることができるとともに、吸引エアの切り換えが、バキュームボタン４０を押すだけのワンタッチ操作で行うことができる。 The suction surface of the table 4 of the scribing device B, the suction plate 18 of the suction reversing device C, and the suction plate 32 of the suction lifting device D are provided as vacuum pumps via suction pipes. The substrate W is connected to an air suction device (not shown) using the above and is formed so that the substrate W can be sucked and held by suction air. In FIGS. 1 to 7, the intake pipes connected to the respective suction plates and the accompanying equipment are omitted in order to avoid complication of the drawings.
The suction plate 18 of the suction reversing device C and the suction plate 32 of the suction lifting device D are formed so that suction air is supplied from the same air suction device 48 through a pipe 49 as shown in FIG. When the vacuum button 40 on the suction plate 32 is pressed, the switching valve 50 switches the vacuum button 40. As a result, labor saving of the air suction device and simplification of piping to each suction plate can reduce the cost of the substrate processing device, and the suction air can be switched by one-touch operation only by pressing the vacuum button 40. Can be done.

次に、上記した基板加工装置Ａによって、単板の基板Ｗの上面にスクライブラインを加工した後、この基板Ｗを反転させる工程を、図１、図８〜１９を用いて順を追って説明する。
図１において、スクライブ装置Ｂのテーブル４上に載置されている基板Ｗは、その上面がカッターホイール１２によって既にスクライブラインが加工された状態にある。カッターホイール１２によるスクライブ加工は、テーブル４を台板２の延出端部まで移動させて加工すべき基板Ｗを載置した後、テーブル４をスクライブヘッド１３の位置まで移行させ、カッターホイール１２を降下させてカッターホイール１２またはテーブル４を相対的に移動させることにより行われる。また、テーブル４を回転駆動部５により９０度回転させることにより、Ｘ−Ｙ方向のスクライブラインを加工することができる。 Next, a process of reversing the substrate W after processing a scribe line on the upper surface of the single substrate W by the substrate processing apparatus A will be described in order with reference to FIGS. 1 and 8 to 19. .
In FIG. 1, the substrate W placed on the table 4 of the scribing apparatus B is in a state where the top surface has already been processed by the cutter wheel 12. The scribing process by the cutter wheel 12 is performed by moving the table 4 to the extending end of the base plate 2 and placing the substrate W to be processed, and then moving the table 4 to the position of the scribe head 13. This is done by lowering and moving the cutter wheel 12 or the table 4 relatively. In addition, the scribe line in the XY direction can be processed by rotating the table 4 by 90 degrees by the rotation driving unit 5.

上面にスクライブラインが加工されてテーブル４上に載置されている基板Ｗは、以下の工程を経て表裏反転される。
まず、吸着反転装置Ｃの左側の位置決めピン２８のロックを、左側ロック解除ボタン３５を操作して解除する。そして、把手２５を持って手動で図８、９に示すように吸着板１８をスクライブ装置Ｂのテーブル４の上方、すなわち、基板受け渡し位置まで移動させる。この基板受け渡し位置で位置感知部材２９が感知して自動的に右側の位置決めピン２８が係合穴２７に係入され、吸着反転装置Ｃの位置がロックされる。 The substrate W on which the scribe line is processed on the upper surface and placed on the table 4 is turned upside down through the following steps.
First, the left positioning pin 28 of the suction reversing device C is unlocked by operating the left lock release button 35. Then, as shown in FIGS. 8 and 9, the suction plate 18 is manually moved to the substrate delivery position above the table 4 of the scribing device B as shown in FIGS. The position sensing member 29 senses at this substrate delivery position, and the right positioning pin 28 is automatically engaged in the engagement hole 27, and the position of the suction reversing device C is locked.

次いで、昇降ボタン３６を押して押下げ部材１７（図５参照）を作動させ、吸着板１８を図１０に示すようにテーブル４の基板Ｗに接する位置まで下動させる。この位置でバキュームボタン３９を押して基板Ｗを吸着板１８に吸着させる。この際、テーブル４の吸引エアによる吸着力は、別途設けたテーブル用の吸着解除ボタン（図示外）によって、バキュームボタン３９を押す前に解除しておくか、或いは前記したバキュームボタン３９を押す操作と連動して解除されるようにする。
次いで、再度昇降ボタン３６を押して押下げ部材１７の押下げ力を解除する。この解除により、吸着板１８は復帰スプリング１９の復元力によって図１１に示すように元位置に復帰する。 Next, the elevating button 36 is pressed to operate the push-down member 17 (see FIG. 5), and the suction plate 18 is moved down to a position in contact with the substrate W of the table 4 as shown in FIG. At this position, the vacuum button 39 is pressed to attract the substrate W to the suction plate 18. At this time, the suction force by the suction air of the table 4 is released before pressing the vacuum button 39 by using a separately provided suction release button (not shown) for the table, or an operation of pressing the vacuum button 39 described above. It is released in conjunction with.
Next, the lifting button 36 is pressed again to release the pressing force of the pressing member 17. With this release, the suction plate 18 returns to the original position as shown in FIG. 11 by the restoring force of the return spring 19.

次いで、右側ロック解除ボタン３４を押して右側の位置決めピン２８のロックを解除した後、図１２に示すように、吸着反転装置Ｃを手動で基板反転位置まで移動させる。この基板反転位置で位置感知部材２９が感知して左側の位置決めピン２８が係合穴２７に係入され、吸着反転装置Ｃの位置がロックされる。この位置で、図１３に示すように、反転操作ボタン４３を押して吸着板１８を反転させる。   Next, after the right lock release button 34 is pressed to unlock the right positioning pin 28, the suction reversing device C is manually moved to the substrate reversing position as shown in FIG. The position sensing member 29 senses at this substrate reversal position, the left positioning pin 28 is engaged with the engagement hole 27, and the position of the suction reversing device C is locked. At this position, as shown in FIG. 13, the reverse operation button 43 is pressed to reverse the suction plate 18.

吸着板１８を反転させた後、左側ロック解除ボタン３５を押してロックを解除し、吸着反転装置Ｃを手動で図１４の基板受け渡し位置まで移動させる。その後、吸着昇降装置Ｄの操作ボタン３７を押して、図１５に示すように、吸着板３２を吸着反転装置Ｃの吸着板１８に吸着されている基板Ｗ上に降下させる。この状態でバキュームボタン４０を押して吸着エアを吸着反転装置Ｃの吸着板１８から吸着昇降装置Ｄの吸着板３２に切り換え、基板Ｗを吸着板３２に吸着させた後、操作ボタン３７を押して、図１６に示すように、吸着昇降装置Ｄの吸着板３２を上昇させるとともに、前記した操作によって吸着反転装置Ｃのロックを解除して吸着反転装置Ｃ（吸着板１８）を基板反転位置に戻す。   After the suction plate 18 is reversed, the left lock release button 35 is pressed to release the lock, and the suction reversing device C is manually moved to the substrate delivery position in FIG. Thereafter, the operation button 37 of the suction lifting device D is pressed, and the suction plate 32 is lowered onto the substrate W sucked by the suction plate 18 of the suction reversing device C as shown in FIG. In this state, the vacuum button 40 is pressed to switch the suction air from the suction plate 18 of the suction reversing device C to the suction plate 32 of the suction lifting device D. After the substrate W is sucked to the suction plate 32, the operation button 37 is pressed, As shown in FIG. 16, the suction plate 32 of the suction elevating device D is raised, and the suction reversing device C is unlocked by the above-described operation to return the suction reversing device C (suction plate 18) to the substrate reversing position.

次いで、操作ボタン３７を押して、図１７に示すように、吸着昇降装置Ｄの吸着板３２をスクライブ装置Ｂのテーブル４上まで降下させ、バキュームボタン４０を押して吸着板３２の吸着エアをＯＦＦにする。これにより、基板Ｗをテーブル４に受け渡す。この後、操作ボタン３７を押して、図１８に示すように、吸着昇降装置Ｄの吸着板３２を元の位置まで上昇させる。また、反転位置に戻された吸着反転装置Ｃの吸着板１８は、反転操作ボタン４３を押すことにより吸着面１８ａが下向きになるように反転させて次の基板反転作業のために待機させておく。
このようにして反転された基板Ｗは、次のブレイク工程のためにテーブル４から除材される。 Next, the operation button 37 is pressed to lower the suction plate 32 of the suction lifting device D onto the table 4 of the scribing device B as shown in FIG. 17, and the vacuum button 40 is pressed to turn off the suction air of the suction plate 32. . As a result, the substrate W is transferred to the table 4. Thereafter, the operation button 37 is pressed to raise the suction plate 32 of the suction elevating device D to the original position as shown in FIG. The suction plate 18 of the suction reversing device C returned to the reversal position is reversed so that the suction surface 18a faces downward by pressing the reversing operation button 43, and is kept waiting for the next substrate reversing operation. .
The substrate W reversed in this way is removed from the table 4 for the next breaking step.

上記した工程において、吸着反転装置Ｃの吸着板１８は、基板反転位置並びに基板受け渡し位置にきたときに位置決めピン２８によりロックされるので、定められた位置に吸着板１８を確実に保持することができる。また、基板Ｗの受け渡し動作や反転動作の際に、吸着板１８が左右に振れることなく、安定した姿勢でスムーズに行うことができる。
また、吸着反転装置Ｃの吸着板１８は、スクライブ装置Ｂのテーブル４から基板Ｗを受け取った後、基板反転位置に移動させて反転させるものであるから、テーブル４から基板Ｗを受け取る際には、テーブル４に接触しない程度に持ち上げるだけでよい。したがって、図３〜５に示すように、吸着板１８を昇降させる機構として上下移動ストロークの小さな押下げ部材１７と、押下げ部材１７の押下げ力を解除したときに吸着板１８を元位置に復帰させる復帰スプリング１９とによる簡単な機構でコンパクトに形成することができる。 In the above-described process, the suction plate 18 of the suction reversing device C is locked by the positioning pin 28 when it comes to the substrate reversal position and the substrate delivery position, so that the suction plate 18 can be reliably held at a predetermined position. it can. Further, when the substrate W is transferred or reversed, the suction plate 18 can be smoothly moved in a stable posture without swinging left and right.
Further, since the suction plate 18 of the suction reversing device C receives the substrate W from the table 4 of the scribing device B and then moves it to the substrate reversal position and reverses it, when receiving the substrate W from the table 4 It only needs to be lifted to the extent that it does not touch the table 4. Therefore, as shown in FIGS. 3 to 5, as a mechanism for raising and lowering the suction plate 18, the pressing member 17 having a small vertical movement stroke, and when the pressing force of the pressing member 17 is released, the suction plate 18 is returned to the original position. It can be compactly formed by a simple mechanism including the return spring 19 for returning.

上記実施例において、スクライブ装置Ｂのテーブル４上の基板Ｗを反転するために、まず吸着反転装置Ｃでテーブル４上の基板Ｗを取り上げて反転させた後、吸着昇降装置Ｄに基板Ｗを受け渡してテーブル４に載置するようにしたが、この手順を代えて、まず吸着昇降装置Ｄで基板Ｗをテーブル４から取り上げて吸着反転装置Ｃに受け渡し、基板Ｗを反転させた後、吸着反転装置Ｃでテーブル４に基板Ｗを載置するようしてもよい。   In the above embodiment, in order to invert the substrate W on the table 4 of the scribing apparatus B, the substrate W on the table 4 is first picked up and inverted by the suction inversion apparatus C, and then transferred to the adsorption lifting apparatus D. However, instead of this procedure, the substrate W is first picked up from the table 4 by the suction elevating device D and transferred to the suction reversing device C, and the substrate W is reversed. The substrate W may be placed on the table 4 by C.

また、基板加工装置Ａに組み込んだスクライブ装置Ｂに代えて、図２０に示すように、シリンダ４４によって昇降する板状のブレイクバー４５を備えたブレイク装置Ｅを組み込むことも可能である。この場合は、あらかじめ上面にスクライブラインが加工された基板Ｗを、上記したスクライブ装置Ｂのテーブル４と同じ移動機構を備えたテーブル４に載置し、吸着反転装置Ｃ並びに吸着昇降装置Ｄによって上記した工程と同じ手順を経て、スクライブラインが裏面側となるように基板Ｗを反転させてテーブル４に戻す。そして、テーブル４をブレイクバー４５の下方まで移動させてブレイクバー４５を基板Ｗに押し当てて基板Ｗを撓ませ、スクライブラインに沿って分断する。この後、分断された基板Ｗはテーブル４から除材されることになる。   Further, in place of the scribing apparatus B incorporated in the substrate processing apparatus A, as shown in FIG. 20, it is also possible to incorporate a breaking apparatus E including a plate-like break bar 45 that is moved up and down by a cylinder 44. In this case, the substrate W whose scribe line has been processed in advance on the upper surface is placed on the table 4 having the same moving mechanism as the table 4 of the scribe device B described above, and the above-mentioned by the suction reversing device C and the suction lifting device D. Through the same procedure as described above, the substrate W is reversed and returned to the table 4 so that the scribe line is on the back side. Then, the table 4 is moved to below the break bar 45 and the break bar 45 is pressed against the substrate W to bend the substrate W and cut along the scribe line. Thereafter, the divided substrate W is removed from the table 4.

以上本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものではない。例えば、上記実施例では、吸着反転装置Ｃ並びに吸着昇降装置Ｄにおける吸着板１８、３２の昇降動作並びにバキューム動作、及び、吸着反転装置Ｃの吸着板１８を反転させる反転回動機構４２の駆動は、ボタン操作によって手動で行うようにしたが、コンピュータ制御によって自動で行うように構成することも可能である。その他本発明では、その目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することが可能である。   While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the above-described embodiment, the lifting and lowering operations and the vacuum operation of the suction plates 18 and 32 in the suction reversing device C and the suction lifting device D, and the driving of the reversing rotation mechanism 42 that reverses the suction plate 18 of the suction reversing device C are as follows. The manual operation is performed by operating a button, but it is also possible to perform the operation automatically by computer control. Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

本発明は、ガラス等の脆性材料基板にスクライブ加工やブレイク加工を行う基板加工装置において、基板を反転させる吸着反転装置に利用される。   INDUSTRIAL APPLICABILITY The present invention is used in a suction reversal device that reverses a substrate in a substrate processing apparatus that performs scribing or breaking on a brittle material substrate such as glass.

Ａ 基板加工装置
Ｂ スクライブ装置
Ｃ 吸着反転装置
Ｄ 吸着昇降装置
Ｗ 基板（脆性材料基板）
１４ 側枠
１５ 回転軸
１５ａ エア流路
１６ 支持部材
１７ 押下げ部材
１８ 吸着板
１９ 復帰スプリング A Substrate processing device B Scribing device C Adsorption reversing device D Adsorption lifting device W Substrate (brittle material substrate)
14 Side frame 15 Rotating shaft 15 a Air flow path 16 Support member 17 Depressing member 18 Suction plate 19 Return spring

Claims (3)

基板を吸着し反転させる吸着反転装置であって、
左右の側枠に支持された回転軸と、
前記回転軸に水平に取り付けられて回転軸と共に回動する支持部材と、
前記支持部材に押下げ部材を介して上下動可能に保持された水平な吸着板と、
前記吸着板を常時上方に向かって付勢する復帰スプリングとを備え、
前記押下げ部材を動作させることにより前記吸着板が下動し、前記押下げ部材が押下げる力を解除することにより、前記復帰スプリングの付勢力によって前記吸着板が上昇して元位置に復帰するように形成されている吸着反転装置。 An adsorption reversing device that adsorbs and reverses a substrate,
A rotating shaft supported by the left and right side frames;
A support member attached horizontally to the rotating shaft and rotating together with the rotating shaft;
A horizontal suction plate held by the support member via a push-down member so as to be movable up and down;
A return spring that constantly biases the suction plate upward.
By operating the push-down member, the suction plate moves downward, and when the push-down member releases the push-down force, the suction plate is raised by the urging force of the return spring to return to the original position. The adsorption reversing device is formed as follows. 前記押下げ部材は、ピストンを備えたエアシリンダからなり、前記ピストンはＯＮ動作で下動し、ＯＦＦ動作で押下げ力を解除するとともに、ＯＮ動作時の押下げ量が調整できるように形成されている請求項１に記載の吸着反転装置。   The push-down member is formed of an air cylinder provided with a piston, and the piston is moved down by an ON operation, is formed so as to release the push-down force by an OFF operation and to adjust the push-down amount at the ON operation. The adsorption inversion apparatus according to claim 1. 前記エアシリンダにエアを供給するためのエア流路が前記回転軸内部に設けられ、前記エア流路から前記エアシリンダに至るエア流通用の配管が接続されている請求項２に記載の吸着反転装置。   The adsorption inversion according to claim 2, wherein an air flow path for supplying air to the air cylinder is provided inside the rotating shaft, and a pipe for air flow from the air flow path to the air cylinder is connected. apparatus.
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CN201310522744.5A CN103910196A (en) 2013-01-09 2013-10-29 Adsorption reversing device
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