JP2014123674A - Heat radiation structure of printed circuit board - Google Patents

Heat radiation structure of printed circuit board Download PDF

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JP2014123674A
JP2014123674A JP2012279915A JP2012279915A JP2014123674A JP 2014123674 A JP2014123674 A JP 2014123674A JP 2012279915 A JP2012279915 A JP 2012279915A JP 2012279915 A JP2012279915 A JP 2012279915A JP 2014123674 A JP2014123674 A JP 2014123674A
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circuit board
printed circuit
pattern
heat
heat sink
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Mitsuhiro Tanaka
三博 田中
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Daikin Industries Ltd
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Daikin Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure for radiating heat of a pattern of a printed circuit board.SOLUTION: In a heat radiation structure 10 of a printed circuit board 12 of the invention, a conductive plate body 16 is attached onto a pattern 14 of the printed circuit board 12. The heat sink 16 has multiple recessed parts 22a facing the printed circuit board 12. Connecting the heat sink 16 onto the pattern 14 increases a heat radiation area. Since the recessed parts 22 are provided on the heat sink 16, a surface area of the heat sink 16 is widen and the heat radiation performance is improved compared to a heat sink 16 having a planar shape.

Description

本発明は、プリント基板の放熱構造に関するものである。   The present invention relates to a heat dissipation structure for a printed circuit board.

従来、プリント基板のパターンが発熱する場合に、そのパターンの放熱が必要である。放熱性能を向上させるために、パターンの面積を広くすることが考えられる。また、図６の放熱構造５０のように、パターン１４にフィン、放熱端子、バスバーまたはジャンパー線などの放熱部品５２を取り付けることが考えられる。下記の特許文献１〜６には、放熱端子、バスバーまたはジャンパー線などの放熱部品５２を取り付けた構造が開示されている。   Conventionally, when a pattern on a printed circuit board generates heat, it is necessary to dissipate the pattern. In order to improve the heat dissipation performance, it is conceivable to increase the area of the pattern. Further, as in the heat dissipation structure 50 of FIG. 6, it is conceivable to attach a heat dissipation component 52 such as a fin, a heat dissipation terminal, a bus bar, or a jumper wire to the pattern 14. The following Patent Documents 1 to 6 disclose a structure in which a heat radiating component 52 such as a heat radiating terminal, a bus bar, or a jumper wire is attached.

パターン１４の面積を広くすると、放熱面積が広くなり、電気抵抗も低下することから放熱性能が向上する。パターン１４に放熱部品５２を取り付けることも、放熱面積の拡大や電気抵抗の低下に寄与する。   When the area of the pattern 14 is increased, the heat dissipation area is increased and the electrical resistance is reduced, so that the heat dissipation performance is improved. Attaching the heat dissipation component 52 to the pattern 14 also contributes to an increase in the heat dissipation area and a decrease in electrical resistance.

しかし、プリント基板１２の製造上、パターン面積を広くできない場合がある。また、下記の各特許文献は、放熱部品５２を取り付けるために、プリント基板１２に穴開けをおこなったり、放熱部品５２を支えるために、他の部品をプリント基板１２に取り付けたりしており、構造が複雑化し、好ましくない。   However, there are cases where the pattern area cannot be increased in manufacturing the printed circuit board 12. In addition, each of the following patent documents has a structure in which holes are formed in the printed circuit board 12 in order to attach the heat radiating component 52, and other components are attached to the printed circuit board 12 in order to support the heat radiating component 52. Is complicated and undesirable.

実開平５−０７３９７８号公報Japanese Utility Model Publication No. 5-073978 特開２００３−３０４０７０号公報JP 2003-304070 A 特開２００７−２１４４１４号公報JP 2007-214414 A 特開２００７−２５８５３９号公報JP 2007-258539 A 特開２００８−４８５１６号公報JP 2008-48516 A 特開２０１０−９２９４８号公報JP 2010-92948 A

本発明は、プリント基板のパターンを放熱するための放熱構造を提供することを目的とする。   An object of this invention is to provide the thermal radiation structure for radiating the pattern of a printed circuit board.

プリント基板は、基板の表面に導体のパターンを有する。プリント基板の放熱構造は、前記プリント基板へ向かう凹部を有する導電性の放熱板と、前記パターンと凹部の底部とを接続する導電性の接続部材とを備える。   The printed board has a conductor pattern on the surface of the board. The heat dissipation structure of the printed circuit board includes a conductive heat dissipation plate having a recess toward the printed circuit board, and a conductive connection member that connects the pattern and the bottom of the recess.

前記凹部が曲面または平面を含む。凹部の曲面または平面がプリント基板のパターンに接続される。前記放熱板の凹部以外の部分に開口部を形成する。開口部が通気孔になる。   The concave portion includes a curved surface or a flat surface. The curved surface or plane of the recess is connected to the pattern of the printed circuit board. An opening is formed in a portion other than the concave portion of the heat sink. The opening becomes a vent.

本発明は凹部を有する導電性の放熱板を取り付けたことによって、放熱面積が拡大し、放熱しやすくなっている。放熱板によって電気抵抗が低くなり、発熱しにくくなっている。パターンと金属板との間に隙間があるため、パターンに風を通すことができ、パターンを空冷することもできる。   In the present invention, by attaching a conductive heat radiating plate having a concave portion, the heat radiating area is expanded and heat is easily radiated. The heat sink reduces the electrical resistance and makes it difficult to generate heat. Since there is a gap between the pattern and the metal plate, air can be passed through the pattern, and the pattern can be air-cooled.

本発明のプリント基板の放熱構造を示す図であり、（ａ）は斜視図であり、（ｂ）はＡ−Ａ線の断面図である。It is a figure which shows the thermal radiation structure of the printed circuit board of this invention, (a) is a perspective view, (b) is sectional drawing of an AA line. 直線状の凹部を有する放熱板を示す図であり、（ａ）は上面図であり、（ｂ）は側面図である。It is a figure which shows the heat sink which has a linear recessed part, (a) is a top view, (b) is a side view. 曲面以外の凹部を示す図であり、（ａ）は方形の凹部を示す断面図であり、（ｂ）は三角形の凹部を示す断面図である。It is a figure which shows recessed parts other than a curved surface, (a) is sectional drawing which shows a rectangular recessed part, (b) is sectional drawing which shows a triangular recessed part. 開口部を備えた放熱板を示す図であり、（ａ）は斜視図であり、（ｂ）はＢ−Ｂ線の断面図である。It is a figure which shows the heat sink provided with the opening part, (a) is a perspective view, (b) is sectional drawing of a BB line. 開口部を備えた放熱板を示す図であり、（ａ）は凹部の途中に開口部を形成した断面図であり、（ｂ）は図３（ａ）の凹部に開口部を形成した断面図である。It is a figure which shows the heat sink provided with the opening part, (a) is sectional drawing which formed the opening part in the middle of a recessed part, (b) is sectional drawing which formed the opening part in the recessed part of Fig.3 (a) It is. 従来のプリント基板の放熱構造を示す図であり、（ａ）は斜視図であり、（ｂ）はＣ−Ｃ線の断面図である。It is a figure which shows the heat dissipation structure of the conventional printed circuit board, (a) is a perspective view, (b) is sectional drawing of CC line.

本発明のプリント基板の放熱構造について図面を用いて説明する。図１に示す本発明のプリント基板１２の放熱構造１０は、プリント基板１２のパターン１４の上に放熱板１６を取り付けている。   A heat dissipation structure for a printed circuit board according to the present invention will be described with reference to the drawings. In the heat dissipation structure 10 of the printed circuit board 12 of the present invention shown in FIG. 1, a heat dissipation plate 16 is attached on the pattern 14 of the printed circuit board 12.

プリント基板１２は、樹脂などの基板１８の表面に銅箔などの導体でパターン１４を形成されている。樹脂の基板１８の代わりに表面に絶縁体を積層した金属基板であっても良い。パターン１４は、パワーデバイスや端子などの電子部品２０が接続され、電流が流れることによって発熱する。たとえばパターン１４の厚みは３５μｍ、大きさは１０ｃｍ×５ｃｍ以下である。パターン１４の形状は長方形以外に他の形状であっても良い。   The printed circuit board 12 has a pattern 14 formed of a conductor such as copper foil on the surface of a substrate 18 such as a resin. Instead of the resin substrate 18, a metal substrate having an insulator laminated on the surface thereof may be used. The pattern 14 generates heat when an electronic component 20 such as a power device or a terminal is connected and a current flows. For example, the pattern 14 has a thickness of 35 μm and a size of 10 cm × 5 cm or less. The shape of the pattern 14 may be other than the rectangle.

放熱板１６は、プリント基板１２に向かう複数の凹部２２ａを有する。凹部２２ａは、半球面または半楕円面などの曲面になっている。凹部２２ａは、プレス加工などによって形成する。放熱板１６は銅やアルミなどの熱伝導の良い導電性の金属材料で形成する。図１に示す放熱板１６の形状は長方形であるが、電子部品２０の位置や放熱性能に合わせて任意に形状を決定する。   The heat sink 16 has a plurality of recesses 22 a that face the printed circuit board 12. The recess 22a is a curved surface such as a hemispherical surface or a semi-elliptical surface. The recess 22a is formed by press working or the like. The heat radiating plate 16 is formed of a conductive metal material having good thermal conductivity such as copper or aluminum. The shape of the heat sink 16 shown in FIG. 1 is a rectangle, but the shape is arbitrarily determined according to the position of the electronic component 20 and the heat dissipation performance.

凹部２２ａは縦横に整列配置されることに限定されず、千鳥状や任意の位置に凹部２２ａが配置されても良い。また、図２に示すように、放熱板１６を波状にして、凹部２２ｂが直線状に形成されても良い。さらに、凹部２２ａは曲面に限定されない。たとえば、図３に示すように、方形などの平面を有する凹部２２ｃ，２２ｄであっても良い。凹部２２ｃ、２２ｄは、図１のように配列されても良いし、図２のように直線状になっても良い。各凹部２２ａ，２２ｂ，２２ｃ，２２ｄは、適宜組み合わされた態様で実施されても良い。   The recesses 22a are not limited to being arranged in rows and columns, and the recesses 22a may be arranged in a zigzag shape or in an arbitrary position. Moreover, as shown in FIG. 2, the heat sink 16 may be made into a wave shape, and the recessed part 22b may be formed in linear form. Furthermore, the recess 22a is not limited to a curved surface. For example, as shown in FIG. 3, it may be recesses 22c and 22d having a flat surface such as a square. The recesses 22c and 22d may be arranged as shown in FIG. 1 or may be linear as shown in FIG. Each recessed part 22a, 22b, 22c, 22d may be implemented in an appropriately combined manner.

パターン１４と放熱板１６はハンダ２４で接続される。ハンダ２４を利用するため、パターン１４と放熱板１６が電気的に接続される。放熱板１６の凹部２２ａの底２６がハンダ２４を介してパターン１４に接続される。凹部２２ａ同士の相対的な位置とハンダ２４同士の相対的な位置が一致する。ハンダ２４以外に、導電性の接着剤など、他の導電性の接続部材であっても良い。   The pattern 14 and the heat sink 16 are connected by solder 24. Since the solder 24 is used, the pattern 14 and the heat sink 16 are electrically connected. The bottom 26 of the recess 22 a of the heat radiating plate 16 is connected to the pattern 14 via the solder 24. The relative positions of the recesses 22a coincide with the relative positions of the solders 24. In addition to the solder 24, other conductive connection members such as a conductive adhesive may be used.

上記ハンダ２４での接続は、リフロー方式などが利用できる。パターン１４の上において、ハンダ２４を配置する部分以外にソルダーレジスト膜（図示せず）を形成する。ソルダーレジスト膜の上にはハンダ２４は形成されない。ソルダーレジスト膜の無い部分にハンダペーストを塗布する。放熱板１６をハンダペーストの上に配置し、リフロー炉の中でハンダペーストを溶かす。溶融したハンダペーストの表面張力によって、凹部２２ａの底２６が溶融したハンダペーストの中央に移動する。正確な位置合わせをおこなわなくても、自動的に放熱板１６が所望位置で固定される。   For the connection with the solder 24, a reflow method or the like can be used. On the pattern 14, a solder resist film (not shown) is formed in addition to the portion where the solder 24 is disposed. The solder 24 is not formed on the solder resist film. Solder paste is applied to the part without the solder resist film. The heat sink 16 is placed on the solder paste, and the solder paste is melted in a reflow furnace. Due to the surface tension of the molten solder paste, the bottom 26 of the recess 22a moves to the center of the molten solder paste. Even if accurate positioning is not performed, the heat sink 16 is automatically fixed at a desired position.

放熱板１６の凹部２２ａによって、パターン１４と放熱板１６の間には隙間２８が形成される。この隙間に風を通すことによってパターン１４を空冷できる。プリント基板１２を風の通過する位置に配置したり、ファンによってプリント基板１２に風を当てても良い。   A gap 28 is formed between the pattern 14 and the heat sink 16 by the recess 22 a of the heat sink 16. The pattern 14 can be air-cooled by passing air through the gap. You may arrange | position the printed circuit board 12 in the position which a wind passes, or may apply wind to the printed circuit board 12 with a fan.

以上のように、パターン１４の上に放熱板１６を接続したことによって、放熱面積が増加する。放熱板１６に凹部２２ａを設けているため、放熱板１６の表面積が広くなっており、平板状の放熱板１６に比べて放熱性能を高くすることができる。パターン１４に放熱板１６を接続したため、電気抵抗が下がり、発熱量を下げることができる。従来のフィンやジャンパーなどを接続することに比べて、製造が簡単であり、構造も単純である。放熱板１６の凹部２２ａによってパターン１４と放熱板１６との間に隙間２８があり、隙間２８に風を通すことができる。パターン１４を空冷することが可能である。   As described above, by connecting the heat radiating plate 16 on the pattern 14, the heat radiating area is increased. Since the heat sink 16 is provided with the recess 22a, the surface area of the heat sink 16 is increased, and the heat dissipation performance can be improved as compared with the flat plate heat sink 16. Since the heat radiating plate 16 is connected to the pattern 14, the electrical resistance is lowered and the heat generation amount can be reduced. Compared to connecting conventional fins, jumpers, etc., the manufacturing is simple and the structure is simple. There is a gap 28 between the pattern 14 and the heat radiating plate 16 by the recess 22 a of the heat radiating plate 16, and air can be passed through the gap 28. The pattern 14 can be air cooled.

以上、本発明について実施形態を説明したが、本発明は上記の実施形態に限定されない。たとえば、図４に示すように、放熱板１６において、凹部２２ａの底２６以外の部分に開口部３０を設けても良い。開口部３０が、パターン１４と金属板１４との間の隙間２８を通る風の排出口になる。   As mentioned above, although embodiment was described about this invention, this invention is not limited to said embodiment. For example, as shown in FIG. 4, an opening 30 may be provided in a portion other than the bottom 26 of the recess 22 a in the heat radiating plate 16. The opening 30 serves as a wind outlet through the gap 28 between the pattern 14 and the metal plate 14.

開口部３０の位置は、凹部２２ａ同士の中間に設けられることに限定されない。凹部２２ａの底２６はハンダ２４に接続されるため、それ以外の部分に開口部３０が形成されても良い。たとえば図５（ａ）のように、凹部２２ａの途中の傾斜している部分に形成しても良い。また、図５（ｂ）のように、曲面の凹部２２ａ以外に、平面を有する凹部２２ｂを有する導電性の板体１６に開口部３０を形成しても良い。開口部３０はドリルなどで貫通穴を設ける以外に、切り欠きなどを形成して開口部３０としても良い。   The position of the opening 30 is not limited to being provided in the middle between the recesses 22a. Since the bottom 26 of the recess 22a is connected to the solder 24, the opening 30 may be formed in other portions. For example, you may form in the part which incline in the middle of the recessed part 22a like Fig.5 (a). Further, as shown in FIG. 5B, the opening 30 may be formed in the conductive plate 16 having a flat recess 22 b in addition to the curved recess 22 a. The opening 30 may be formed by forming a notch or the like in addition to providing a through hole with a drill or the like.

その他、本発明は、その主旨を逸脱しない範囲で当業者の知識に基づき種々の改良、修正、変更を加えた態様で実施できるものである。   In addition, the present invention can be carried out in a mode in which various improvements, modifications, and changes are added based on the knowledge of those skilled in the art without departing from the spirit of the present invention.

１０：プリント基板の放熱構造
１２：プリント基板
１４：パターン
１６：放熱板
１８：基板
２０：電子部品
２２ａ，２２ｂ，２２ｃ，２２ｄ：凹部
２４：ハンダ（接続部材）
２６：凹部の底
２８：隙間
３０：開口部 10: heat dissipation structure of printed circuit board 12: printed circuit board 14: pattern 16: heat dissipation plate 18: substrate 20: electronic components 22a, 22b, 22c, 22d: recess 24: solder (connection member)
26: bottom of recess 28: gap 30: opening

Claims (3)

基板の表面に導体のパターンを有するプリント基板の放熱構造であって、
前記プリント基板へ向かう凹部を有する導電性の放熱板と、
前記パターンと凹部の底とを接続する導電性の接続部材と、
を備えたプリント基板の放熱構造。 A heat dissipation structure for a printed circuit board having a conductor pattern on the surface of the circuit board,
A conductive heat sink having a recess toward the printed circuit board;
A conductive connecting member connecting the pattern and the bottom of the recess;
PCB heat dissipation structure. 前記凹部が曲面または平面を含む請求項１のプリント基板の放熱構造。 The heat dissipation structure for a printed circuit board according to claim 1, wherein the recess includes a curved surface or a flat surface. 前記導電性の放熱板の凹部の底以外の部分に開口部を形成した請求項１または２のプリント基板の放熱構造。 The heat dissipation structure for a printed circuit board according to claim 1 or 2, wherein an opening is formed in a portion other than the bottom of the concave portion of the conductive heat dissipation plate.
JP2012279915A 2012-12-21 2012-12-21 Heat radiation structure of printed circuit board Pending JP2014123674A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016098379A (en) * 2014-11-18 2016-05-30 東洋鋼鈑株式会社 Soldering material
US10628008B2 (en) 2016-09-01 2020-04-21 Honda Motor Co., Ltd. Information terminal controlling an operation of an application according to a user's operation received via a touch panel mounted on a display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016098379A (en) * 2014-11-18 2016-05-30 東洋鋼鈑株式会社 Soldering material
US10628008B2 (en) 2016-09-01 2020-04-21 Honda Motor Co., Ltd. Information terminal controlling an operation of an application according to a user's operation received via a touch panel mounted on a display device

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