JP2014074223A - Copper alloy sheet excellent in conductivity and stress relaxation property - Google Patents
Copper alloy sheet excellent in conductivity and stress relaxation property Download PDFInfo
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Abstract
Description
本発明は、銅合金板及び通電用又は放熱用電子部品に関し、特に、電機・電子機器、自動車等に搭載される端子、コネクタ、リレー、スイッチ、ソケット、バスバー、リードフレーム、放熱板等の電子部品の素材として使用される銅合金板、及び該銅合金板を用いた電子部品に関する。中でも、電気自動車、ハイブリッド自動車等で用いられる大電流用コネクタや端子等の大電流用電子部品の用途、又はスマートフォンやタブレットＰＣで用いられる液晶フレーム等の放熱用電子部品の用途に好適な銅合金板及び該銅合金板を用いた電子部品に関するものである。 The present invention relates to a copper alloy plate and electronic parts for energization or heat dissipation, and in particular, electronic devices such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. mounted on electric machines / electronic devices, automobiles, etc. The present invention relates to a copper alloy plate used as a component material and an electronic component using the copper alloy plate. Among them, copper alloys suitable for use in high current electronic parts such as connectors and terminals for large currents used in electric cars, hybrid cars, etc., or for use in electronic parts for heat dissipation such as liquid crystal frames used in smartphones and tablet PCs The present invention relates to a plate and an electronic component using the copper alloy plate.
自動車や電機・電子機器等には、端子、コネクタ、スイッチ、ソケット、リレー、バスバー、リードフレーム、放熱板等の電気又は熱を伝えるための部品が組み込まれており、これら部品には銅合金が用いられている。ここで、電気伝導性と熱伝導性は比例関係にある。
近年、電子部品の小型化に伴い、通電部における銅合金の断面積が小さくなる傾向にある。断面積が小さくなると、通電した際の銅合金からの発熱が増大する。また、伸長著しい電気自動車やハイブリッド電気自動車で用いられる電子部品には、バッテリー部のコネクタ等、著しく高い電流が流されるものがあり、通電時の銅合金の発熱が問題になっている。
Parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc., that transmit electricity or heat are built into automobiles, electrical equipment, electronic devices, etc., and these parts are made of copper alloy. It is used. Here, electrical conductivity and thermal conductivity are in a proportional relationship.
In recent years, with the miniaturization of electronic components, the cross-sectional area of the copper alloy in the current-carrying part tends to be small. When the cross-sectional area becomes small, heat generation from the copper alloy when energized increases. In addition, some electronic parts used in an electric vehicle and a hybrid electric vehicle that are remarkably growing, such as a connector of a battery part, allow a very high current to flow, and heat generation of a copper alloy during energization is a problem.
コネクタ等の電子部品の電気接点では、銅合金板にたわみが与えられ、このたわみで発生する応力により、接点での接触力を得ている。たわみを与えた銅合金を高温下で長時間保持すると、応力緩和現象により、応力すなわち接触力が低下し、接触電気抵抗の増大を招く。
そこで、前記発熱の問題に対処するため、銅合金には、発熱量が減ずるよう導電性により優れることが求められ、さらに発熱しても接触力が低下しないよう応力緩和特性により優れることも求められている。
一方、例えばスマートフォンやタブレットＰＣの液晶には液晶フレームと呼ばれる放熱部品が用いられている。このような放熱用途の銅合金板においても、応力緩和特性を高めると、外力による放熱板のクリープ変形が抑制され、放熱板周りに配置される液晶部品、ＩＣチップ等に対する保護性が改善される、等の効果を期待できる。このため、放熱用途の銅合金板においても、応力緩和特性に優れることが望まれている。
In an electrical contact of an electronic component such as a connector, a deflection is given to the copper alloy plate, and a contact force at the contact is obtained by a stress generated by the deflection. When a bent copper alloy is held at a high temperature for a long time, the stress, that is, the contact force is reduced due to the stress relaxation phenomenon, and the contact electric resistance is increased.
Therefore, in order to cope with the problem of heat generation, the copper alloy is required to be superior in conductivity so that the amount of heat generation is reduced, and further to be excellent in stress relaxation characteristics so that the contact force does not decrease even if heat is generated. ing.
On the other hand, for example, a heat radiating component called a liquid crystal frame is used for a liquid crystal of a smartphone or a tablet PC. Even in such a copper alloy plate for heat dissipation, when stress relaxation characteristics are enhanced, creep deformation of the heat sink due to external force is suppressed, and the protection against liquid crystal components, IC chips, etc. disposed around the heat sink is improved. , Etc. can be expected. For this reason, it is desired that the copper alloy plate for heat dissipation also has excellent stress relaxation characteristics.
比較的高い導電率と強度を有し、安価に製造できる銅合金としてＣｕ−Ｆｅ−Ｐ系合金が知られており、例えばＪＩＳ合金番号Ｃ１９２１（Ｃｕ−０．１質量％Ｆｅ−０．０３質量％Ｐ）、Ｃ１９４０（Ｃｕ−２．４質量％Ｆｅ−０．１質量％Ｐ−０．１質量％Ｚｎ）等が実用に供されている。また、Ｃｕ−Ｆｅ−Ｐ系合金の改良技術が、例えば特許文献１〜５に開示されている。 A Cu-Fe-P-based alloy is known as a copper alloy that has relatively high electrical conductivity and strength and can be manufactured at low cost. For example, JIS alloy number C1921 (Cu-0.1 mass% Fe-0.03 mass) % P), C1940 (Cu-2.4 mass% Fe-0.1 mass% P-0.1 mass% Zn), and the like are practically used. Moreover, the improvement technique of a Cu-Fe-P type-alloy is disclosed by patent documents 1-5, for example.
銅合金の応力緩和特性は、特定の合金元素を添加することにより改善できる。応力緩和改善効果が顕著な元素として、例えばＺｒ、Ｔｉ等があげられる。ところが、これら元素は極めて活性であるため、インゴット溶製時にその一部が酸化する。この酸化物がインゴットに巻き込まれると、製品表面に傷が発生したり、圧延中の材料が切れたりする。このように、合金元素添加による応力緩和特性の改善は、一般的に、銅合金の製造コストの著しい上昇を招く。 The stress relaxation characteristics of the copper alloy can be improved by adding a specific alloy element. Examples of the element having a remarkable stress relaxation improving effect include Zr and Ti. However, since these elements are extremely active, some of them are oxidized during ingot melting. When this oxide is caught in an ingot, the surface of the product is damaged or the material being rolled is cut. As described above, the improvement of the stress relaxation characteristic by adding the alloy element generally causes a significant increase in the manufacturing cost of the copper alloy.
したがって、合金元素の添加に頼らず、製造プロセスの調整により、銅合金の応力緩和特性を改善できれば、工業的に極めて意義深いといえる。 Therefore, if the stress relaxation characteristics of the copper alloy can be improved by adjusting the manufacturing process without depending on the addition of alloy elements, it can be said that it is extremely significant industrially.
そこで、本発明は、高強度、高導電性および優れた応力緩和特性を兼ね備えた銅合金を提供することを目的とし、具体的には、安価で導電性と強度に優れるＣｕ−Ｆｅ−Ｐ系合金の応力緩和特性を改善することを課題とする。さらには、本発明は、該銅合金板の製造方法、及び大電流用途又は放熱用途に好適な電子部品を提供することをも目的とする。 Then, this invention aims at providing the copper alloy which has high intensity | strength, high electroconductivity, and the outstanding stress relaxation characteristic, Specifically, Cu-Fe-P type | system | group which is cheap and excellent in electroconductivity and intensity | strength. An object is to improve the stress relaxation characteristics of the alloy. Furthermore, another object of the present invention is to provide a method for producing the copper alloy plate and an electronic component suitable for high current use or heat dissipation use.
本発明者らは、Ｃｕ−Ｆｅ−Ｐ系合金において、ばね限界値を指標に金属組織を調整すること、圧延面に配向する結晶粒の方位を制御することにより、応力緩和特性が向上することを見出した。
以上の知見を背景に、以下の発明を完成させた。
（１）０．０１〜０．５質量％のＦｅを含有し、さらにＦｅの質量％濃度に対し１／６倍〜１倍の質量％のＰを含有し、残部が銅およびその不可避的不純物から成り、６５％ＩＡＣＳ以上の導電率、および３３０ＭＰａ以上の０．２％耐力を有し、かつ、０．２％耐力の８０％の応力を付加し１５０℃で１０００時間保持後の応力緩和率が５０％以下であることを特徴とする、銅合金板。
（２）ばね限界値Ｋｂ（ＭＰａ）と、０．２％耐力σ（ＭＰａ）との関係が、Ｋｂ≧（σ−１００）で与えられることを特徴とする、（１）に記載の銅合金板。
（３）Ｘ線回折法を用い圧延面において厚み方向に求めた（１１１）面および（３１１）面の回折積分強度をそれぞれＩ(111)およびＩ(311)としたときに、Ｉ(111)／Ｉ(311)が５．０以下であることを特徴とする（１）または（２）に記載の銅合金板。
（４）０．５質量％以下のＳｎを含有することを特徴とする、（１）〜（３）の何れかに記載の銅合金板。
（５）１．０質量％以下のＺｎを含有することを特徴とする、（１）〜（４）の何れかに記載の銅合金板。
（６） Ａｇ、Ｃｏ、Ｎｉ、Ｃｒ、Ｍｎ、Ｍｇ、ＳｉおよびＢのなかの一種以上を２質量％以下含有することを特徴とする（１）〜（５）の何れかに記載の銅合金板。
（７）（１）〜（６）の何れかに記載の銅合金板を用いた高電流用電子部品。
（８）（１）〜（６）の何れかに記載の銅合金板を用いた放熱用電子部品。
（９）インゴットを、８００〜１０００℃で厚み３〜３０ｍｍまで熱間圧延した後、冷間圧延と再結晶焼鈍とを繰り返し、最終の冷間圧延の後、歪取焼鈍を施す銅合金板の製造方法であって、
（Ａ）該最終冷間圧延前の再結晶焼鈍において、炉内温度を３５０〜８００℃として、銅合金板の平均結晶粒径を５０μｍ以下に調整し、
（Ｂ）該最終冷間圧延において、総加工度を２５〜９９％、１パスあたりの圧延加工度を２０％以下とし、
（Ｃ）該歪取焼鈍において、連続焼鈍炉を用い、炉内温度を３００〜７００℃、炉内で銅合金板に付加される張力を１〜５ＭＰａとして、銅合金板を通板し、０．２％耐力を１０〜５０ＭＰａ低下させる、
ことを特徴とする、（１）〜（６）の何れかに記載の銅合金板の製造方法。
In the Cu-Fe-P-based alloy, the present inventors improve the stress relaxation characteristics by adjusting the metal structure using the spring limit value as an index, and controlling the orientation of crystal grains oriented on the rolling surface. I found.
Based on the above findings, the following invention has been completed.
(1) It contains 0.01 to 0.5% by mass of Fe, and further contains 1% to 1% by mass of P with respect to the mass% concentration of Fe, with the balance being copper and its inevitable impurities. Stress relaxation rate after holding at 150 ° C. for 1000 hours with a conductivity of 65% IACS or higher, 0.2% proof stress of 330 MPa or higher, and 80% stress of 0.2% proof stress applied A copper alloy sheet characterized in that is 50% or less.
(2) The copper alloy according to (1), wherein the relationship between the spring limit value Kb (MPa) and the 0.2% yield strength σ (MPa) is given by Kb ≧ (σ−100) Board.
(3) When the integrated diffraction intensities of the (111) plane and (311) plane obtained in the thickness direction on the rolled surface using the X-ray diffraction method are I (111) and I (311) , respectively, I (111) The copper alloy sheet according to (1) or (2), wherein / I (311) is 5.0 or less.
(4) The copper alloy sheet according to any one of (1) to (3), characterized by containing 0.5 mass% or less of Sn.
(5) The copper alloy plate according to any one of (1) to (4), which contains 1.0% by mass or less of Zn.
(6) The copper alloy as set forth in any one of (1) to (5), wherein one or more of Ag, Co, Ni, Cr, Mn, Mg, Si and B is contained in an amount of 2% by mass or less. Board.
(7) An electronic component for high current using the copper alloy plate according to any one of (1) to (6).
(8) A heat dissipating electronic component using the copper alloy plate according to any one of (1) to (6).
(9) After hot rolling the ingot at a temperature of 800 to 1000 ° C. to a thickness of 3 to 30 mm, the cold rolling and the recrystallization annealing are repeated, and after the final cold rolling, A manufacturing method comprising:
(A) In the recrystallization annealing before the final cold rolling, the furnace temperature is set to 350 to 800 ° C., the average crystal grain size of the copper alloy plate is adjusted to 50 μm or less,
(B) In the final cold rolling, the total working degree is 25 to 99%, the rolling work degree per pass is 20% or less,
(C) In the strain relief annealing, using a continuous annealing furnace, the furnace temperature is 300 to 700 ° C., the tension applied to the copper alloy sheet in the furnace is 1 to 5 MPa, and the copper alloy sheet is passed through, 0 .2% yield strength is reduced by 10-50 MPa,
The method for producing a copper alloy plate according to any one of (1) to (6).
本発明によれば、高強度、高導電性および優れた応力緩和特性を兼ね備えた銅合金板及びその製造方法、並びに大電流用途又は放熱用途に好適な電子部品を提供することが可能である。この銅合金は、端子、コネクタ、スイッチ、ソケット、リレー、バスバー、リードフレーム、放熱板等の電子部品の素材として好適に使用することができ、特に大電流を通電する電子部品の素材又は大熱量を放散する電子部品の素材として有用である。 ADVANTAGE OF THE INVENTION According to this invention, it is possible to provide the copper alloy board which has high intensity | strength, high electroconductivity, and the outstanding stress relaxation characteristic, its manufacturing method, and an electronic component suitable for a large current use or a heat dissipation use. This copper alloy can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc., especially for electronic parts that carry a large current or a large amount of heat. It is useful as a material for electronic parts that dissipate the energy.
以下、本発明について説明する。
（特性）
本発明では、銅合金板の導電率および０．２％耐力を、それぞれ６５％ＩＡＣＳ以上および３３０ＭＰａ以上に調整することを目標とする。導電率が６５％ＩＡＣＳ以上であれば、通電時の発熱が減少し、応力緩和による接触力低下が軽減される。また、０．２％耐力が３３０ＭＰａ以上であれば、大電流を通電する部品の素材又は大熱量を放散する部品の素材として必要な強度を有しているといえる。
応力緩和特性については、０．２％耐力の８０％の応力を付加し１５０℃で１０００時間保持した時の応力緩和率を５０％以下、より好ましくは４０％以下、さらに好ましくは３０％に低減することを目標とする。通常のＣｕ−Ｆｅ−Ｐ系合金の該応力緩和率は７０〜８０％程度であり、これを５０％以下にすることで、コネクタに加工した後に大電流を通電しても接触力低下に伴う接触電気抵抗の増加が生じ難くなり、また、放熱板に加工した後に熱と外力が同時に加わってもクリープ変形が生じ難くなる。
上記特性を兼ね備える本発明の銅合金板は、高電流用電子部品の用途に好適である。
The present invention will be described below.
(Characteristic)
In this invention, it aims at adjusting the electrical conductivity and 0.2% yield strength of a copper alloy board to 65% IACS or more and 330MPa or more, respectively. If the electrical conductivity is 65% IACS or more, heat generation during energization is reduced, and a reduction in contact force due to stress relaxation is reduced. In addition, if the 0.2% proof stress is 330 MPa or more, it can be said that the material has a strength necessary for a material for a component that conducts a large current or a material for a component that dissipates a large amount of heat.
Regarding stress relaxation characteristics, the stress relaxation rate when 80% stress of 0.2% proof stress is applied and held at 150 ° C. for 1000 hours is reduced to 50% or less, more preferably 40% or less, and even more preferably 30%. The goal is to do. The stress relaxation rate of a normal Cu-Fe-P alloy is about 70 to 80%. By making this 50% or less, even if a large current is applied after processing into a connector, the contact force decreases. Increase in contact electrical resistance is unlikely to occur, and creep deformation is unlikely to occur even if heat and external force are applied simultaneously after processing into a heat sink.
The copper alloy plate of the present invention having the above characteristics is suitable for use in high-current electronic components.
（合金成分濃度）
Ｆｅ濃度は０．０１〜０．５質量％、Ｐ濃度は０．０１〜０．３質量％とする。
Ｆｅが０．５質量％を超えると、６５％ＩＡＣＳ以上の導電率を得ることが難しくなる。Ｆｅが０．０１質量％未満になると、３３０ＭＰａ以上の０．２％耐力を得ることが難しくなる。
本発明の銅合金には、Ｆｅに加えＰを添加する。Ｐには合金の製造プロセスにおいて、溶湯を脱酸する効果がある。また、Ｆｅと化合物を形成することにより、合金の導電率や強度を高める効果がある。
Ｆｅの質量％濃度（％Ｆｅ）とＰの質量％濃度（％Ｐ）との比（％Ｆｅ／％Ｐ）は１〜６、好ましくは２〜５に調整する。％Ｆｅ／％Ｐをこのように調整することで、より高い導電率が得られる。
(Alloy component concentration)
The Fe concentration is 0.01 to 0.5 mass%, and the P concentration is 0.01 to 0.3 mass%.
When Fe exceeds 0.5 mass%, it becomes difficult to obtain a conductivity of 65% IACS or more. When Fe is less than 0.01% by mass, it becomes difficult to obtain a 0.2% proof stress of 330 MPa or more.
In addition to Fe, P is added to the copper alloy of the present invention. P has the effect of deoxidizing the molten metal in the alloy manufacturing process. Further, by forming a compound with Fe, there is an effect of increasing the conductivity and strength of the alloy.
The ratio (% Fe /% P) between the mass% concentration of Fe (% Fe) and the mass% concentration of P (% P) is adjusted to 1 to 6, preferably 2 to 5. By adjusting% Fe /% P in this way, higher conductivity can be obtained.
本発明のＣｕ−Ｆｅ−Ｐ系合金には、０．５質量％以下のＳｎを添加することができる。Ｓｎには圧延の際の合金の加工硬化を促進し、合金の強度を改善する効果がある。また、前述したＺｒやＴｉほどではないが、Ｓｎには応力緩和特性を改善する効果もある。
Ｓｎが０．５質量％を超えると、導電率の低下が大きくなる。Ｓｎ添加の効果を得るためには、Ｓｎの添加量を０．００１質量％以上にすることが好ましい。より好ましいＳｎ濃度の範囲は０．００５〜０．３質量％、さらに好ましいＳｎ濃度の範囲は０．０１〜０．１質量％である。
なお、Ｓｎは溶銅中で酸化物を形成しにくいため、０．５質量％以下の濃度で添加する限り、Ｓｎ添加が合金の製造性や品質を悪化させることはない。
また、本発明のＣｕ−Ｆｅ−Ｐ系合金には、Ｓｎめっきの耐熱剥離性を改善するために、１質量％以下のＺｎを添加することができる。Ｚｎが１質量％を超えると、導電率の低下が大きくなる。Ｚｎ添加の効果を得るためには、Ｚｎの添加量を０．００１質量％以上にすることが好ましい。より好ましいＺｎ濃度の範囲は０．０１〜０．５質量％である。Ｚｎについても溶銅中で酸化物を形成しにくいため、１質量％以下の濃度で添加する限り、合金の製造性や品質を悪化させることはない。
0.5 mass% or less of Sn can be added to the Cu-Fe-P alloy of the present invention. Sn has the effect of promoting work hardening of the alloy during rolling and improving the strength of the alloy. Further, although not as much as Zr and Ti described above, Sn also has an effect of improving stress relaxation characteristics.
When Sn exceeds 0.5% by mass, the decrease in conductivity is increased. In order to acquire the effect of Sn addition, it is preferable to make the addition amount of Sn 0.001 mass% or more. A more preferable Sn concentration range is 0.005 to 0.3% by mass, and a further preferable Sn concentration range is 0.01 to 0.1% by mass.
In addition, since Sn does not easily form an oxide in molten copper, as long as it is added at a concentration of 0.5% by mass or less, Sn addition does not deteriorate the productivity and quality of the alloy.
In addition, 1% by mass or less of Zn can be added to the Cu—Fe—P-based alloy of the present invention in order to improve the heat peelability of Sn plating. When Zn exceeds 1 mass%, the fall of electrical conductivity will become large. In order to obtain the effect of adding Zn, the amount of Zn added is preferably 0.001% by mass or more. A more preferable range of Zn concentration is 0.01 to 0.5% by mass. Since it is difficult to form an oxide in molten copper, Zn does not deteriorate the manufacturability and quality of the alloy as long as it is added at a concentration of 1% by mass or less.
さらに、本発明のＣｕ−Ｆｅ−Ｐ系合金には、強度や耐熱性を改善するために、Ａｇ、Ｃｏ、Ｎｉ、Ｃｒ、Ｍｎ、Ｍｇ、ＳｉおよびＢのなかの一種以上を含有させることができる。ただし、添加量が多すぎると、導電率が低下したり、製造性が悪化したりするので、添加量は総量で２質量％以下、より好ましくは０．５質量％以下、さらに好ましくは０．１質量％以下に制限される。また、添加による効果を得るためには、添加量を総量で０．００１質量％以上にすることが好ましい。 Furthermore, the Cu—Fe—P alloy of the present invention may contain one or more of Ag, Co, Ni, Cr, Mn, Mg, Si and B in order to improve strength and heat resistance. it can. However, if the amount added is too large, the electrical conductivity decreases or the manufacturability deteriorates. Therefore, the amount added is 2% by mass or less, more preferably 0.5% by mass or less, still more preferably 0.8% by mass. It is limited to 1% by mass or less. Moreover, in order to acquire the effect by addition, it is preferable to make addition amount 0.001 mass% or more in total amount.
（ばね限界値）
製品のばね限界値をＫｂ（ＭＰａ）、０．２％耐力をσ（ＭＰａ）としたときに、Ｋｂ≧（σ−１００）の関係に、より好ましくは、Ｋｂ≧（σ−５０）の関係に調整することで、応力緩和特性が向上する。Ｋｂ＜（σ−１００）の場合は、応力緩和率が５０％を超える。Ｋｂの上限値は特に規制されないが、通常はσを超える値になることは少ない。
(Spring limit value)
When the spring limit value of the product is Kb (MPa) and the 0.2% proof stress is σ (MPa), the relationship is Kb ≧ (σ−100), more preferably the relationship Kb ≧ (σ−50). The stress relaxation property is improved by adjusting to. In the case of Kb <(σ-100), the stress relaxation rate exceeds 50%. The upper limit value of Kb is not particularly restricted, but normally it is rare that it exceeds σ.
（圧延面の結晶方位）
製品の圧延面において、Ｉ(111)／Ｉ(311)を５．０以下、好ましくは２．０以下に調整することにより、応力緩和特性が向上する。ここで、Ｉ(111)およびＩ(311)はそれぞれＸ線回折法を用い厚み方向に求めた（１１１）面および（３１１）面の回折積分強度である。Ｉ(111)／Ｉ(311)が５．０を超えると、応力緩和率が５０％を超える。Ｉ(111)／Ｉ(311)の下限値は応力緩和特性改善の点からは制限されないものの、Ｉ(111)／Ｉ(311)は典型的には０．０１以上の値をとる。
(Crystal orientation of rolling surface)
By adjusting I (111) / I (311) to 5.0 or less, preferably 2.0 or less on the rolled surface of the product, the stress relaxation characteristics are improved. Here, I (111) and I (311) are diffraction integrated intensities of the (111) plane and the (311) plane obtained in the thickness direction using the X-ray diffraction method, respectively. When I (111) / I (311) exceeds 5.0, the stress relaxation rate exceeds 50%. Although the lower limit of I (111) / I (311 ) is not limited in terms of the stress relaxation characteristics improved, I (111) / I ( 311) typically takes a value of more than 0.01.
（厚み）
製品の厚みは０．１〜２．０ｍｍであることが好ましい。厚みが薄すぎると、通電部断面積が小さくなり通電時の発熱が増加するため、大電流を流すコネクタ等の素材として不適であり、また、わずかな外力で変形するようになるため放熱板等の素材としても不適である。一方で、厚みが厚すぎると、曲げ加工が困難になる。このような観点から、より好ましい厚みは０．２〜１．５ｍｍである。厚みが上記範囲となることにより、通電時の発熱を抑えつつ、曲げ加工性を良好なものとすることができる。
(Thickness)
The thickness of the product is preferably 0.1 to 2.0 mm. If the thickness is too thin, the cross-sectional area of the current-carrying part will decrease and heat generation will increase during energization, making it unsuitable as a connector or other material that carries a large current. It is also unsuitable as a material. On the other hand, if the thickness is too thick, bending becomes difficult. From such a viewpoint, a more preferable thickness is 0.2 to 1.5 mm. When the thickness is in the above range, the bending workability can be improved while suppressing heat generation during energization.
（用途）
本発明の実施の形態に係る銅合金板は、電機・電子機器、自動車等で用いられる端子、コネクタ、リレー、スイッチ、ソケット、バスバー、リードフレーム、放熱板等の電子部品の用途に好適に使用することができ、特に、電気自動車、ハイブリッド自動車等で用いられる大電流用コネクタや端子等の大電流用電子部品の用途、又はスマートフォンやタブレットＰＣで用いられる液晶フレーム等の放熱用電子部品の用途に有用である。
(Use)
The copper alloy plate according to the embodiment of the present invention is suitably used for applications of electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. used in electric / electronic devices, automobiles, etc. In particular, applications of high-current electronic components such as connectors and terminals for large currents used in electric vehicles, hybrid vehicles, etc., or uses of electronic components for heat dissipation such as liquid crystal frames used in smartphones and tablet PCs Useful for.
（製造方法）
純銅原料として電気銅等を溶解し、Ｆｅ、Ｐおよび必要に応じ他の合金元素を添加し、厚み３０〜３００ｍｍ程度のインゴットに鋳造する。このインゴットを例えば８００〜１０００℃の熱間圧延により厚み３〜３０ｍｍ程度の板とした後、冷間圧延と再結晶焼鈍とを繰り返し、最終の冷間圧延で所定の製品厚みに仕上げ、最後に歪取り焼鈍を施す。最終冷間圧延後のばね限界値は、１００ＭＰａに満たないほど低いが、その後の歪取焼鈍により上昇する。
(Production method)
Electro copper or the like is melted as a pure copper raw material, Fe, P and other alloy elements are added as required, and cast into an ingot having a thickness of about 30 to 300 mm. After this ingot is made into a plate having a thickness of about 3 to 30 mm by hot rolling at 800 to 1000 ° C., for example, cold rolling and recrystallization annealing are repeated, and finally finished to a predetermined product thickness by cold rolling. Apply strain relief annealing. The spring limit value after the final cold rolling is so low that it does not reach 100 MPa, but rises by subsequent strain relief annealing.
再結晶焼鈍では、圧延組織の一部または全てを再結晶化させる。また、適当な条件で焼鈍することにより、ＦｅまたはＦｅとＰとの化合物が析出し、合金の導電率が上昇する。
最終冷間圧延前の再結晶焼鈍では、銅合金板の平均結晶粒径を５０μｍ以下に調整する。平均結晶粒径が大きすぎると、０．２％耐力を３３０ＭＰａ以上に調整することが難しくなる。
In recrystallization annealing, part or all of the rolling structure is recrystallized. Further, by annealing under appropriate conditions, Fe or a compound of Fe and P is precipitated, and the electrical conductivity of the alloy is increased.
In the recrystallization annealing before the final cold rolling, the average crystal grain size of the copper alloy sheet is adjusted to 50 μm or less. If the average crystal grain size is too large, it will be difficult to adjust the 0.2% yield strength to 330 MPa or more.
最終冷間圧延前の再結晶焼鈍の条件は、目標とする焼鈍後の結晶粒径および目標とする製品の導電率に基づき決定する。具体的には、バッチ炉または連続焼鈍炉を用い、炉内温度を３５０〜８００℃として焼鈍を行えばよい。バッチ炉では３５０〜６００℃の炉内温度において３０分から３０時間の範囲で加熱時間を適宜調整すればよい。連続焼鈍炉では４５０〜８００℃の炉内温度において５秒から１０分の範囲で加熱時間を適宜調整すればよい。一般的にはより低温でより長時間の条件で焼鈍を行うと、同じ結晶粒径でより高い導電率が得られる。 The conditions for recrystallization annealing before the final cold rolling are determined based on the target crystal grain size after annealing and the target product conductivity. Specifically, annealing may be performed by using a batch furnace or a continuous annealing furnace and setting the furnace temperature to 350 to 800 ° C. In a batch furnace, the heating time may be appropriately adjusted at a temperature in the furnace of 350 to 600 ° C. in the range of 30 minutes to 30 hours. In a continuous annealing furnace, the heating time may be appropriately adjusted within a range of 5 seconds to 10 minutes at a furnace temperature of 450 to 800 ° C. Generally, when annealing is performed at a lower temperature for a longer time, higher conductivity can be obtained with the same crystal grain size.
最終冷間圧延では、一対の圧延ロール間に材料を繰り返し通過させ、目標の板厚に仕上げてゆく。最終冷間圧延の総加工度と１パスあたりの加工度を制御する。
総加工度Ｒ（％）は、Ｒ＝（ｔ0−ｔ）／ｔ0×１００（ｔ0：最終冷間圧延前の板厚、ｔ：最終冷間圧延後の板厚）で与えられる。また、１パスあたりの加工度ｒ（％）とは、圧延ロールを１回通過したときの板厚減少率であり、ｒ＝（Ｔ0−Ｔ）／Ｔ0×１００（Ｔ0：圧延ロール通過前の厚み、Ｔ：圧延ロール通過後の厚み）で与えられる。
総加工度Ｒは２５〜９９％とする。Ｒが小さすぎると、０．２％耐力を３３０ＭＰａ以上に調整することが難しくなる。Ｒが大きすぎると、圧延材のエッジが割れることがある。
In the final cold rolling, the material is repeatedly passed between a pair of rolling rolls to finish the target plate thickness. The total workability of final cold rolling and the workability per pass are controlled.
The total workability R (%) is given by R = (t 0 −t) / t 0 × 100 (t 0 : plate thickness before final cold rolling, t: plate thickness after final cold rolling). Further, the processing degree r (%) per pass is a sheet thickness reduction rate when the rolling roll passes once, and r = (T 0 −T) / T 0 × 100 (T 0 : rolling roll) Thickness before passing, T: Thickness after passing the rolling roll).
The total processing degree R is 25 to 99%. If R is too small, it becomes difficult to adjust the 0.2% proof stress to 330 MPa or more. When R is too large, the edge of the rolled material may be broken.
１パスあたりの加工度ｒは２０％以下とする。ｒが大きすぎるとＩ(111)／Ｉ(311)が増加し、全パスの中にｒが２０％を超えるパスが一つでも含まれるとＩ(111)／Ｉ(311)を５．０以下に調整することが難しくなる。 The degree of processing r per pass is 20% or less. If r is too large increases I (111) / I (311 ), the path that r is more than 20% among all paths include even one I a (111) / I (311) 5.0 It becomes difficult to adjust to the following.
本発明の歪取焼鈍は連続焼鈍炉を用いて行う。バッチ炉の場合、コイル状に巻き取った状態で材料を加熱するため、加熱中に材料が塑性変形を起こし材料に反りが生じる。したがって、バッチ炉は本発明の歪取焼鈍に不適である。 The strain relief annealing of the present invention is performed using a continuous annealing furnace. In the case of a batch furnace, the material is heated in a coiled state, so that the material undergoes plastic deformation during the heating, and the material is warped. Therefore, the batch furnace is not suitable for the strain relief annealing of the present invention.
連続焼鈍炉において、炉内温度を３００〜７００℃とし、５秒から１０分の範囲で加熱時間を適宜調整し、歪取焼鈍後の０．２％耐力（σ）を歪取焼鈍前の０．２％耐力（σ0）に対し１０〜５０ＭＰａ低い値、好ましくは１５〜４５ＭＰａ低い値に調整する。これにより、最終冷間圧延上がりにおいて低かったＫｂが充分に上昇する。（σ0−σ）が小さすぎても大きすぎても、Ｋｂが充分に上昇せず、前記Ｋｂ≧（σ−１００）の関係を得ることが難しくなる。 In the continuous annealing furnace, the furnace temperature is set to 300 to 700 ° C., the heating time is appropriately adjusted in the range of 5 seconds to 10 minutes, and the 0.2% proof stress (σ) after the stress relief annealing is 0 before the stress relief annealing. Adjust to a value 10 to 50 MPa lower, preferably 15 to 45 MPa lower than 2% proof stress (σ 0 ). Thereby, Kb which was low in the final cold rolling is sufficiently increased. If (σ 0 −σ) is too small or too large, Kb does not rise sufficiently, and it becomes difficult to obtain the relationship of Kb ≧ (σ−100).
さらに、連続焼鈍炉内において材料に付加される張力を１〜５ＭＰａ、より好ましくは１〜４ＭＰａに調整する。張力が大きすぎると、Ｉ(111)／Ｉ(311)を５．０以下に調整することが難しくなる。また、Ｋｂの上昇が充分ではなくなる傾向にある。一方、張力が小さすぎると、焼鈍炉を通板中の材料が炉壁と接触し、材料の表面やエッジに傷が付くことがある。 Further, the tension applied to the material in the continuous annealing furnace is adjusted to 1 to 5 MPa, more preferably 1 to 4 MPa. If the tension is too large, it becomes difficult to adjust I (111) / I (311) to 5.0 or less. Further, the increase in Kb tends to be insufficient. On the other hand, if the tension is too small, the material in the passing plate of the annealing furnace may come into contact with the furnace wall, and the surface or edge of the material may be damaged.
本発明は、Ｋｂ≧（σ−１００）なる特徴およびＩ(111)／Ｉ(311)≦５．０なる特徴をＣｕ−Ｆｅ−Ｐ系合金に付与することにより、応力緩和特性を改善することを一つの特徴としているが、そのための製造条件を整理して示すと、
（１）Ｋｂ≧σ−１００のためには、
ａ．歪取焼鈍において、（σ0−σ）＝１０〜５０ＭＰａに調整する。
ｂ．歪取焼鈍における炉内張力を５ＭＰａ以下に調整する。
（２）Ｉ(111)／Ｉ(311)≦５．０のためには、
ａ．最終冷間圧延において、１パスあたりの加工度を２０％以下に調整する。
ｂ．歪取焼鈍における炉内張力を５ＭＰａ以下に調整する。
The present invention improves stress relaxation characteristics by imparting a feature of Kb ≧ (σ-100) and a feature of I (111) / I (311) ≦ 5.0 to a Cu—Fe—P alloy. Is one of the features, but the manufacturing conditions for that are organized and shown,
(1) For Kb ≧ σ−100,
a. In the strain relief annealing, (σ 0 −σ) = 10 to 50 MPa is adjusted.
b. The furnace tension in the strain relief annealing is adjusted to 5 MPa or less.
(2) For I (111) / I (311) ≦ 5.0,
a. In the final cold rolling, the degree of processing per pass is adjusted to 20% or less.
b. The furnace tension in the strain relief annealing is adjusted to 5 MPa or less.
以下に本発明の実施例を比較例と共に示すが、これらの実施例は本発明及びその利点をよりよく理解するために提供するものであり、発明が限定されることを意図するものではない。
溶銅に合金元素を添加した後、厚みが２００ｍｍのインゴットに鋳造した。インゴットを９５０℃で３時間加熱し、熱間圧延により厚み１５ｍｍの板にした。熱間圧延板表面の酸化スケールをグラインダーで研削、除去した後、焼鈍と冷間圧延を繰り返し、最終の冷間圧延で所定の製品厚みに仕上げた。最後に連続焼鈍炉を用い歪取焼鈍を行った。
Examples of the present invention will be described below together with comparative examples, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.
After adding the alloy element to the molten copper, it was cast into an ingot having a thickness of 200 mm. The ingot was heated at 950 ° C. for 3 hours and formed into a plate having a thickness of 15 mm by hot rolling. After grinding and removing the oxide scale on the surface of the hot rolled plate with a grinder, annealing and cold rolling were repeated, and the product was finished to a predetermined product thickness by final cold rolling. Finally, strain relief annealing was performed using a continuous annealing furnace.
最終冷間圧延前の焼鈍（最終再結晶焼鈍）は、バッチ炉を用い、加熱時間を５時間とし炉内温度を３５０〜７００℃の範囲で調整し、焼鈍後の結晶粒径と導電率を変化させた。焼鈍後の結晶粒径の測定においては、圧延方向に直角な断面を鏡面研磨後に化学腐食し、切断法（ＪＩＳ Ｈ０５０１（１９９９年））により平均結晶粒径を求めた。 For annealing before final cold rolling (final recrystallization annealing), a batch furnace is used, the heating time is 5 hours, the furnace temperature is adjusted in the range of 350 to 700 ° C, and the crystal grain size and conductivity after annealing are adjusted. Changed. In the measurement of the crystal grain size after annealing, a cross section perpendicular to the rolling direction was subjected to chemical corrosion after mirror polishing, and the average crystal grain size was determined by a cutting method (JIS H0501 (1999)).
最終冷間圧延では、総加工度および１パスあたりの加工度を制御した。また、最終冷間圧延後の材料の０．２％耐力を求めた。
連続焼鈍炉を用いた歪取り焼鈍では、炉内温度を５００℃とし加熱時間を１秒から１５分の間で調整し、焼鈍後の０．２％耐力を種々変化させた。また、炉内において材料に付加する張力を種々変化させた。なお、一部の例では歪取り焼鈍を行わなかった。
製造途中の材料および歪取焼鈍後の材料につき、次の測定を行った。
In the final cold rolling, the total workability and the workability per pass were controlled. Moreover, the 0.2% yield strength of the material after final cold rolling was calculated | required.
In strain relief annealing using a continuous annealing furnace, the furnace temperature was 500 ° C., the heating time was adjusted between 1 second and 15 minutes, and the 0.2% proof stress after annealing was variously changed. In addition, various tensions were added to the material in the furnace. In some cases, strain relief annealing was not performed.
The following measurement was performed on the material in the process of manufacturing and the material after strain relief annealing.
（成分）
歪取焼鈍後の材料の合金元素濃度をＩＣＰ−質量分析法で分析した。
(component)
The alloy element concentration of the material after strain relief annealing was analyzed by ICP-mass spectrometry.
（０．２％耐力）
最終冷間圧延後および歪取焼鈍後の材料につき、ＪＩＳ Ｚ２２４１に規定する１３Ｂ号試験片を引張方向が圧延方向と平行になるように採取し、ＪＩＳ Ｚ２２４１に準拠して圧延方向と平行に引張試験を行い、０．２％耐力を求めた。
(0.2% yield strength)
For the material after the final cold rolling and strain relief annealing, sample No. 13B specified in JIS Z2241 was taken so that the tensile direction was parallel to the rolling direction, and pulled in parallel with the rolling direction in accordance with JIS Z2241. Tests were performed to determine 0.2% yield strength.
（ばね限界値）
歪取焼鈍後の材料から、幅１０ｍｍ、長さ１００ｍｍの短冊形状の試験片を、試験片の長手方向が圧延方向と平行になるように採取し、ＪＩＳ Ｈ３１３０に規定されているモーメント式試験により圧延方向と平行な方向のばね限界値を測定した。
(Spring limit value)
A strip-shaped test piece having a width of 10 mm and a length of 100 mm was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and was subjected to a moment type test specified in JIS H3130. The spring limit value in the direction parallel to the rolling direction was measured.
（導電率）
歪取焼鈍後の材料から、試験片の長手方向が圧延方向と平行になるように試験片を採取し、ＪＩＳ Ｈ０５０５に準拠し四端子法により２０℃での導電率を測定した。
(conductivity)
A test piece was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and the conductivity at 20 ° C. was measured by a four-terminal method in accordance with JIS H0505.
（結晶方位）
歪取焼鈍後の材料の表面に対し、厚み方向に（１１１）面および（３１１）面のＸ線回折積分強度を測定した。Ｘ線回折装置には（株）リガク製ＲＩＮＴ２５００を使用し、Ｃｕ管球にて、管電圧２５ｋＶ、管電流２０ｍＡで測定を行った。
(Crystal orientation)
The X-ray diffraction integrated intensity of the (111) plane and (311) plane was measured in the thickness direction with respect to the surface of the material after strain relief annealing. RINT 2500 manufactured by Rigaku Corporation was used as the X-ray diffractometer, and measurement was performed with a Cu tube bulb at a tube voltage of 25 kV and a tube current of 20 mA.
（応力緩和率）
歪取焼鈍後の材料から、幅１０ｍｍ、長さ１００ｍｍの短冊形状の試験片を、試験片の長手方向が圧延方向と平行になるように採取した。図１のように、ｌ＝５０ｍｍの位置を作用点として、試験片にｙ0のたわみを与え、圧延方向の０．２％耐力の８０％に相当する応力（ｓ）を負荷した。ｙ0は次式により求めた。
ｙ0＝（２／３）・ｌ2・ｓ ／ （Ｅ・ｔ）
ここで、Ｅは圧延方向のヤング率であり、ｔは試料の厚みである。１５０℃にて１０００時間加熱後に除荷し、図２のように永久変形量（高さ）ｙを測定し、応力緩和率｛［ｙ（ｍｍ）／ｙ0（ｍｍ）］×１００（％）｝を算出した。
(Stress relaxation rate)
A strip-shaped test piece having a width of 10 mm and a length of 100 mm was collected from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction. As shown in FIG. 1, with the position of l = 50 mm as the working point, a deflection of y 0 was given to the test piece, and a stress (s) corresponding to 80% of the 0.2% proof stress in the rolling direction was applied. y 0 was determined by the following equation.
y 0 = (2/3) · l 2 · s / (E · t)
Here, E is the Young's modulus in the rolling direction, and t is the thickness of the sample. Unloading after heating at 150 ° C. for 1000 hours, and measuring the amount of permanent deformation (height) y as shown in FIG. 2, stress relaxation rate {[y (mm) / y 0 (mm)] × 100 (%) } Was calculated.
表１に評価結果を示す。ここで、最終冷間圧延では複数のパスを実施したが、これら各パスの加工度の中での最大値を示してある。また、最終再結晶焼鈍後の結晶粒径における「＜１０μｍ」の表記は、圧延組織の全てが再結晶化しその平均結晶粒径が１０μｍ未満であった場合、および圧延組織の一部のみが再結晶化した場合の双方を含んでいる。
Ｆｅ濃度を０．０１〜０．５質量％、Ｐ濃度をＦｅ濃度の１／６倍〜１倍に調整し、最終冷間圧延前の再結晶焼鈍において、結晶粒径を５０μｍ以下に調整し、最終冷間圧延において、総加工度を２５〜９９％に、１パスあたりの加工度を２０％以下に調整し、歪取焼鈍において、材料を連続焼鈍炉に張力１〜５ＭＰａで通板して０．２％耐力を１０〜５０ＭＰａ低下させた、本発明の銅合金板では、Ｋｂ≧（σ−１００）なる関係およびＩ(111)／Ｉ(311)≦５．０なる関係が得られ、６５％ＩＡＣＳ以上の導電率、３３０ＭＰａ以上の０．２％耐力、５０％以下の応力緩和率を達成できた。
Table 1 shows the evaluation results. Here, in the final cold rolling, a plurality of passes were performed, and the maximum value of the degree of processing of each pass is shown. In addition, the expression “<10 μm” in the crystal grain size after the final recrystallization annealing indicates that all of the rolling structure is recrystallized and the average crystal grain size is less than 10 μm, and that only a part of the rolling structure is recrystallized. Both cases of crystallization are included.
The Fe concentration is adjusted to 0.01 to 0.5 mass%, the P concentration is adjusted to 1/6 times to 1 time of the Fe concentration, and the crystal grain size is adjusted to 50 μm or less in the recrystallization annealing before the final cold rolling. In the final cold rolling, the total workability is adjusted to 25 to 99%, the workability per pass is adjusted to 20% or less, and the material is passed through the continuous annealing furnace at a tension of 1 to 5 MPa in strain relief annealing. In the copper alloy sheet of the present invention with a 0.2% proof stress reduced by 10 to 50 MPa, a relationship of Kb ≧ (σ−100) and a relationship of I (111) / I (311) ≦ 5.0 are obtained. A conductivity of 65% IACS or higher, a 0.2% proof stress of 330 MPa or higher, and a stress relaxation rate of 50% or lower were achieved.
比較例１、２は歪取焼鈍を行わなかったものであり、応力緩和率が極めて大きい。
比較例３〜５では、歪取焼鈍を行ったものの、炉内での材料張力が５ＭＰａを超えたため、Ｉ(111)／Ｉ(311)が５．０を超え、特に張力が高かった比較例５では（σ−Ｋｂ）も１００を超えた。比較例３〜５の応力緩和率は５０％を超えた。
比較例６、７では、最終冷間圧延における１パス当たりの加工度が２０％を超えたため、Ｉ(111)／Ｉ(311)が５．０を超え、応力緩和率が５０％を超えた。
比較例８、９では、歪取焼鈍における０．２％耐力の低下量がそれぞれ過小および過大であり、（σ0−σ）が１０〜５０ＭＰａの範囲から外れた。このため（σ−Ｋｂ）が１００を超え、応力緩和率が５０％を超えた。
Comparative Examples 1 and 2 were not subjected to strain relief annealing, and the stress relaxation rate was extremely large.
In Comparative Examples 3 to 5, although strain relief annealing was performed, since the material tension in the furnace exceeded 5 MPa, I (111) / I (311) exceeded 5.0, and the comparatively high tension 5 (σ-Kb) also exceeded 100. The stress relaxation rate of Comparative Examples 3 to 5 exceeded 50%.
In Comparative Examples 6 and 7, since the degree of processing per pass in the final cold rolling exceeded 20%, I (111) / I (311) exceeded 5.0 and the stress relaxation rate exceeded 50%. .
In Comparative Examples 8 and 9, the 0.2% yield strength reduction amount in strain relief annealing was excessively small and excessive, respectively, and (σ 0 −σ) was out of the range of 10 to 50 MPa. For this reason, (σ−Kb) exceeded 100 and the stress relaxation rate exceeded 50%.
比較例１０では最終冷間圧延における総加工度が２５％に満たなかったため、また比較例１１では最終冷間圧延前の再結晶焼鈍上がりの結晶粒径が５０μｍを超えたため、歪取焼鈍後の０．２％耐力が３３０ＭＰａに満たなかった。 In Comparative Example 10, the total degree of work in the final cold rolling was less than 25%, and in Comparative Example 11, the crystal grain size after recrystallization annealing before the final cold rolling exceeded 50 μm. The 0.2% proof stress was less than 330 MPa.
比較例１２では、Ｆｅ濃度０．０１質量％未満だったため、歪取焼鈍後の０．２％耐力が３３０ＭＰａに満たなかった。
比較例１３ではＦｅ濃度が０．５質量％を超えたため、比較例１４、１５ではＰ濃度がＦｅ濃度の１／６倍〜１倍の範囲から外れたため、導電率が６５％ＩＡＣＳに満たなかった。
In Comparative Example 12, since the Fe concentration was less than 0.01% by mass, the 0.2% proof stress after strain relief annealing was less than 330 MPa.
In Comparative Example 13, the Fe concentration exceeded 0.5 mass%, and in Comparative Examples 14 and 15, the P concentration was out of the range of 1/6 to 1 times the Fe concentration, so the conductivity was less than 65% IACS. It was.
Claims (9)
（Ａ）該最終冷間圧延前の再結晶焼鈍において、炉内温度を３５０〜８００℃として、銅合金板の平均結晶粒径を５０μｍ以下に調整し、
（Ｂ）該最終冷間圧延において、総加工度を２５〜９９％、１パスあたりの圧延加工度を２０％以下とし、
（Ｃ）該歪取焼鈍において、連続焼鈍炉を用い、炉内温度を３００〜７００℃、炉内で銅合金板に付加される張力を１〜５ＭＰａとして、銅合金板を通板し、０．２％耐力を１０〜５０ＭＰａ低下させる、
ことを特徴とする、請求項１〜６の何れか１項に記載の銅合金板の製造方法。 In the method of manufacturing a copper alloy plate, after ingot is hot rolled at 800 to 1000 ° C. to a thickness of 3 to 30 mm, cold rolling and recrystallization annealing are repeated, and after final cold rolling, strain relief annealing is performed. There,
(A) In the recrystallization annealing before the final cold rolling, the furnace temperature is set to 350 to 800 ° C., the average crystal grain size of the copper alloy plate is adjusted to 50 μm or less,
(B) In the final cold rolling, the total working degree is 25 to 99%, the rolling work degree per pass is 20% or less,
(C) In the strain relief annealing, using a continuous annealing furnace, the furnace temperature is 300 to 700 ° C., the tension applied to the copper alloy sheet in the furnace is 1 to 5 MPa, and the copper alloy sheet is passed through, 0 .2% yield strength is reduced by 10-50 MPa,
The method for producing a copper alloy sheet according to any one of claims 1 to 6, wherein
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| JP2016003373A (en) * | 2014-06-18 | 2016-01-12 | 株式会社Uacj | Copper alloy tube |
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| JP3962751B2 (en) * | 2004-08-17 | 2007-08-22 | 株式会社神戸製鋼所 | Copper alloy sheet for electric and electronic parts with bending workability |
| JP4441467B2 (en) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | Copper alloy with bending workability and stress relaxation resistance |
| JP4168077B2 (en) * | 2006-07-21 | 2008-10-22 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent oxide film adhesion |
| KR101503208B1 (en) * | 2010-08-27 | 2015-03-17 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy sheet and manufacturing method for same |
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