JP2014069104A - Plasma treatment apparatus - Google Patents
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Abstract
Description
本発明は、プラズマ処理装置に係り、特に真空シールにＯリングを用いたプラズマ処理装置に関する。
The present invention relates to a plasma processing apparatus, and more particularly to a plasma processing apparatus using an O-ring as a vacuum seal.
ＣＰＵ、フラッシュメモリ、太陽電池、ＬＥＤなどのデバイスは、真空容器内部で基板状の試料に所望の処理を施す真空処理装置を用いて製造されている。一般的に真空処理装置は、大気が真空容器内部の処理室内に進入しないように、処理室の外壁を構成する部材はＯリング等のシール手段を用いて取り付けられている。
Devices such as CPUs, flash memories, solar cells, and LEDs are manufactured using a vacuum processing apparatus that performs a desired process on a substrate-like sample inside a vacuum vessel. Generally, in the vacuum processing apparatus, members constituting the outer wall of the processing chamber are attached using a sealing means such as an O-ring so that the atmosphere does not enter the processing chamber inside the vacuum vessel.
真空処理装置の種類は、ウェハにイオンを注入するイオン注入装置、ウェハを加熱するアニール装置、ウェハを加工するエッチング装置、アッシング装置など多岐にわたる。このうち、半導体デバイスを製造する工程において用いられる真空処理装置では、半導体デバイスを製造するために処理される半導体ウエハ等の基板は大口径化が進んでおり、これに伴って処理室の内側壁面を構成する部材、例えば、複数のガス導入孔を備えてガスを分散させて処理室内に導入するシャワープレートや、処理室を囲んで真空容器を構成し外部からの電界または磁界が透過する誘電体製のベルジャ等の部品が大型化している。
There are various types of vacuum processing apparatuses such as an ion implantation apparatus that implants ions into a wafer, an annealing apparatus that heats the wafer, an etching apparatus that processes the wafer, and an ashing apparatus. Among these, in a vacuum processing apparatus used in a process for manufacturing a semiconductor device, a substrate such as a semiconductor wafer to be processed to manufacture a semiconductor device has been increased in diameter, and accordingly, the inner wall surface of the processing chamber For example, a shower plate that has a plurality of gas introduction holes and disperses gas and introduces it into the processing chamber, or a dielectric that surrounds the processing chamber and constitutes a vacuum container to transmit an external electric field or magnetic field Parts such as made bell jars are getting larger.
このような大型化に伴って部品はその重量が増大している。真空容器のメンテナンス時、真空容器を構成して内外をシールするＯリングを取り付けて組み立てられた部材はＯリングがこれが接触する他の部品のシール面と強く密着してしまい取外しが困難な場合が生じている。特に、部品のシールされる部分が加熱されて高温にされる場合Ｏリングとシール面との密着が強固になってしまい、取り外しに時間を要して作業の効率が低下してしまうという問題が生じている。
With such an increase in size, the weight of parts has increased. During maintenance of the vacuum vessel, the O-ring that constitutes the vacuum vessel and seals the inside and outside of the assembled member may be difficult to remove because the O-ring is in close contact with the sealing surfaces of other parts that come into contact Has occurred. In particular, when the part to be sealed is heated to a high temperature, the adhesion between the O-ring and the sealing surface becomes strong, and it takes time to remove and the work efficiency is reduced. Has occurred.
このような密着したＯリングを取り外す手段として、文献１に示されているように、ケトン類を主成分とした剥離溶剤を用いて、Ｏリングを取り外すことが従来より知られている。
As a means for removing such a close O-ring, as shown in Document 1, it has been conventionally known to remove an O-ring using a peeling solvent mainly composed of ketones.
しかしながら、上記の従来技術では次の点で考慮が不十分であった。すなわち、上記ケトン類を主成分とした溶剤を用いた場合には、廃液の後処理が煩雑であり近年問題が大きくなっている環境への負荷が大きいという問題が有る。さらに、清浄な環境での運転が要求されるため真空処理装置が設置されるクリーンルーム等の建屋内に発塵を生じる原因となってしまう。
However, the above prior art has not been sufficiently considered in the following points. That is, when the above-described solvent containing ketones as a main component is used, there is a problem that the post-treatment of the waste liquid is complicated and the load on the environment is increasing, which has become a problem in recent years. Furthermore, since operation in a clean environment is required, it may cause dust generation in a building such as a clean room where a vacuum processing apparatus is installed.
また、ウエハの大口径化とともに真空容器が大型化することにより、よりＯリングの密着度が大きくなり、真空容器の大気開放が困難になってしまうという問題について、上記従来技術では十分に考慮されていなかった。
In addition, the above-mentioned prior art sufficiently considers the problem that, as the diameter of the wafer increases and the size of the vacuum container increases, the degree of adhesion of the O-ring increases and it becomes difficult to open the vacuum container to the atmosphere. It wasn't.
本発明の目的は、真空容器の部品の取外しを容易にして保守の時間を短縮できるプラズマ処理装置を提供することにある。
An object of the present invention is to provide a plasma processing apparatus capable of easily removing parts of a vacuum vessel and shortening maintenance time.
本発明の目的は、上部が開口された容器と、該容器の上部がＯリングを介して覆う天板と、容器内に処理ガスを供給するガス供給手段と、容器に接続され該容器内を減圧排気する真空排気装置と、天板を介して容器内に電磁波を供給する手段とを具備するプラズマ処理装置において、容器と天板とに係合し容器に対して天板の距離を相対的に引き離す引離し手段を有し、容器の開口が形成される上部面に前記Ｏリングが配置されるリング状の溝を形成し、該溝に対し容器の外周部から複数の溶剤供給路を設け、溶剤供給路に溶剤容器を着脱可能に設けることにより、達成される。
An object of the present invention is to provide a container having an upper opening, a top plate covered by an upper part of the container via an O-ring, a gas supply means for supplying a processing gas into the container, and a container connected to the container. In a plasma processing apparatus comprising an evacuation apparatus for evacuating under reduced pressure and means for supplying electromagnetic waves into a container through a top plate, the distance between the top plate and the container is relative to the container and the top plate. A ring-like groove in which the O-ring is arranged is formed on the upper surface where the opening of the container is formed, and a plurality of solvent supply paths are provided from the outer periphery of the container to the groove. This is achieved by detachably providing a solvent container in the solvent supply path.
さらに、溶剤供給路はリング状の法線方向に２つ以上の溝が形成されて成り、溶剤容器内の溶剤はアルコールであって、前記貯蔵容器と法線方向の溝とをチューブにより接続する。
Furthermore, the solvent supply path is formed by forming two or more grooves in the ring-shaped normal direction, the solvent in the solvent container is alcohol, and the storage container and the normal direction groove are connected by a tube. .
また、本発明の目的は、溶剤容器には、圧縮空気が接続され、圧縮空気の供給によってアルコールが押し出される。
Moreover, the objective of this invention is connected to a solvent container with compressed air, and alcohol is extruded by supply of compressed air.
また、上述のプラズマ処理装置における容器から天板を取り外す大気開放方法において、溶剤供給路に溶剤容器取り付け溶剤供給路を介して溶剤容器内の溶剤をＯリングが配置された溝に供給し、引離し手段により天板と容器との間に引張り力を付与することにより、達成される。
Further, in the above-described method for releasing the top plate from the container in the plasma processing apparatus, the solvent in the solvent container is supplied to the groove in which the O-ring is arranged via the solvent supply path and attached to the solvent supply path. This is achieved by applying a tensile force between the top plate and the container by the releasing means.
本発明によれば、真空容器の天板を容易に取外し大気開放することができる。
According to the present invention, the top plate of the vacuum vessel can be easily removed and opened to the atmosphere.
以下、本発明の実施の形態を図面を用いて説明する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
本発明の実施の形態では、内部に処理室を有する真空容器の上部の部材、例えば、真空容器の天蓋を構成する板状の部材（以下、天板）を取外し大気開放する際に、天板の外周縁部の内側の表面と強く密着してしまい取り外しが困難となったＯリングを短時間で取り外す構成として、上記密着した部分にＩＰＡなどのアルコールを供給して密着力を弱めて天板の外周縁部表面またはこれと対向して接触してシール面を構成する真空容器本体側の当接部品の表面から容易に取り外し可能とする。φ300mm以下のウエハ口径に対応した装置では、アルコールを用いてＯリングと当接部品のフランジ面との間にＩＰＡを浸みこませることで密着力を緩和させたのちフランジ面と天板とをより短時間で、あるいはより小さな外力で取り外すことが可能となる。
In an embodiment of the present invention, when a member at the top of a vacuum vessel having a processing chamber inside, for example, a plate-like member (hereinafter referred to as a top plate) constituting the canopy of the vacuum vessel is removed and opened to the atmosphere, the top plate As a structure to remove the O-ring, which is in close contact with the inner peripheral surface of the outer peripheral edge and difficult to remove, in a short time, alcohol such as IPA is supplied to the adhered part to weaken the adhesion and the top plate It can be easily removed from the surface of the abutting part of the vacuum vessel main body side that forms the seal surface by contacting the surface of the outer peripheral edge of the container. In an apparatus compatible with a wafer diameter of φ300 mm or less, the alcohol is used to immerse IPA between the O-ring and the flange surface of the contact part to reduce the adhesion, and then the flange surface and the top plate are connected. It can be removed in a short time or with a smaller external force.
しかし、φ300mm以上に対応した装置では、使用する部材の大型化により、より密着度が強くなり天板の取り外しが困難になるとともにＯリングの密着部分に一様にＩＰＡ等アルコールを供給することも困難となる。そこで、本実施の形態は、これら真空容器の大きさに関係なく、上部が開口された容器と、容器の上部がＯリングを介して覆う天板と、容器内に処理ガスを供給するガス供給手段と、容器に接続され容器内を減圧排気する真空排気装置と、天板を介して容器内に電磁波を供給する手段とを具備するプラズマ処理装置において、容器と天板とに係合し容器に対して天板の距離を相対的に引き離す引離し手段を有し、容器の開口が形成される上部面に前記Ｏリングが配置されるリング状の溝を形成し、該溝に対し容器の外周部から複数の溶剤供給路を設け、溶剤供給路に溶剤容器を着脱可能に設けることにより、容易に天板を取外し真空容器を大気開放することができるようにしたものである。
However, in equipment that supports φ300mm or more, the larger the members used, the stronger the adhesion, making it difficult to remove the top plate, and supplying alcohol such as IPA uniformly to the O-ring contact part. It becomes difficult. Therefore, in this embodiment, regardless of the size of these vacuum containers, a container having an upper opening, a top plate that covers the upper part of the container via an O-ring, and a gas supply for supplying a processing gas into the container In a plasma processing apparatus comprising means, an evacuation apparatus connected to the container for evacuating the inside of the container, and means for supplying electromagnetic waves into the container through the top plate, the container is engaged with the container and the top plate. A separating means for relatively separating the distance of the top plate from the top plate, and forming a ring-shaped groove in which the O-ring is disposed on the upper surface where the opening of the container is formed, A plurality of solvent supply paths are provided from the outer periphery, and a solvent container is detachably provided in the solvent supply path, whereby the top plate can be easily removed and the vacuum container can be opened to the atmosphere.
以下に、本発明の実施例を示す。
Examples of the present invention are shown below.
本発明のプラズマ処理装置の一実施例を図１乃至３を用いて説明する。
An embodiment of the plasma processing apparatus of the present invention will be described with reference to FIGS.
図１は、本発明の実施例に係る真空処理装置の真空容器の構成の概略を模式的に示す縦断面図である。本図において、真空容器１は、内部に円筒形状を有する処理室を備えた実質的に円筒形の容器であって、その上部に開口部と真空容器の上部を構成して開口部を上方から覆って開口部に蓋をする天板７を有している。
FIG. 1 is a longitudinal sectional view schematically showing an outline of a configuration of a vacuum vessel of a vacuum processing apparatus according to an embodiment of the present invention. In this figure, a vacuum vessel 1 is a substantially cylindrical vessel provided with a processing chamber having a cylindrical shape therein, and an opening and an upper portion of the vacuum vessel are formed on the upper portion thereof, and the opening is opened from above. It has a top plate 7 that covers and covers the opening.
円板形状を備えた天板７はその外周縁部の内側表面が天板７が開口を閉じた状態で、真空容器１の円筒形の側壁を構成する部材の上端縁部に配置されたフランジ２の上面と接触する。天板７は石英、あるいはアルミナ等のセラミクス等誘電体を含んで構成され、外周縁部のフランジ２と接続されるリング状の内壁面がＯリング３を挟んでフランジ２上面と当接することで、天板７または真空容器１内部の処理室と外部の大気（雰囲気）との間が気密に封止（シール）されている。
The top plate 7 having a disk shape has a flange disposed on the upper edge of the member constituting the cylindrical side wall of the vacuum vessel 1 with the inner surface of the outer peripheral edge of the top plate 7 closed in the opening. 2 is in contact with the top surface. The top plate 7 includes a dielectric such as ceramics such as quartz or alumina, and a ring-shaped inner wall connected to the flange 2 at the outer peripheral edge abuts the upper surface of the flange 2 with the O-ring 3 interposed therebetween. The space between the top plate 7 or the processing chamber inside the vacuum vessel 1 and the outside air (atmosphere) is hermetically sealed.
天板７の大気側の面（上面）の上方には高周波電源に接続された誘導コイル４が配置されており、高周波電力が印加された誘導コイル４は真空容器内に高周波の誘導電界を供給する。供給された高周波の電界はガス供給装置（図示省略）から供給される処理室内に供給された処理ガスを励起してプラズマを形成する。
An induction coil 4 connected to a high frequency power source is disposed above the atmosphere side surface (upper surface) of the top plate 7, and the induction coil 4 to which high frequency power is applied supplies a high frequency induction electric field in the vacuum vessel. To do. The supplied high-frequency electric field excites the processing gas supplied into the processing chamber supplied from a gas supply device (not shown) to form plasma.
真空容器１の下方には、ターボ分子ポンプの高排気ポンプやロータリーポンプ等の粗引きポンプからなる真空は息要の排気装置５が連結され、真空容器１内の処理室を所定の真空度まで排気する。
Below the vacuum vessel 1 is connected a evacuation device 5 that is a breather consisting of a turbo pump such as a high exhaust pump of a turbo molecular pump or a rotary pump, and the processing chamber in the vacuum vessel 1 is brought to a predetermined degree of vacuum. Exhaust.
この実施例の場合、真空容器１のフランジ２と天板７とには、その一端が取り付けられ天板７をフランジ２の上面に対して離間させて昇降させる昇降装置６が配置されている。さらに、フランジ２上面と天板７の下面との間には溶剤供給装置１０が着脱自在に接続され配置されている。
In the case of this embodiment, the flange 2 and the top plate 7 of the vacuum vessel 1 are provided with an elevating device 6 that is attached at one end and moves the top plate 7 away from the upper surface of the flange 2. Further, a solvent supply device 10 is detachably connected between the upper surface of the flange 2 and the lower surface of the top plate 7.
フランジ２は図２（ａ）の平面図に示すように上面に真空容器側のＯリング用の溝８が形成されている。また、図２（ａ）（ｂ）に示すようにフランジ２の上面にはＯリング用の溝８につながり、円筒形状を有した真空容器の上部の中心軸から放射状に（半径方向に）延在して外周側の端部がフランジ２の外周側面に開口して連通された溝９が、複数（本例では４本）形成されている。
As shown in the plan view of FIG. 2A, the flange 2 has an O-ring groove 8 on the vacuum vessel side formed on the upper surface. 2 (a) and 2 (b), the upper surface of the flange 2 is connected to an O-ring groove 8 and extends radially (in the radial direction) from the central axis of the upper part of the cylindrical vacuum vessel. A plurality of (in this example, four) grooves 9 are formed so that the outer peripheral end portion is open and communicated with the outer peripheral side surface of the flange 2.
図３に、溶剤供給装置１０の一例を示す。図３は、図１に示す実施例に係る溶剤供給装置の構成の概略を模式的に示す縦断面図である。
FIG. 3 shows an example of the solvent supply device 10. FIG. 3 is a longitudinal sectional view schematically showing the outline of the configuration of the solvent supply apparatus according to the embodiment shown in FIG.
本図に示す実施例では、溶剤として天板７を真空容器１本体上方に取り外して内部を大気解放した後に、フランジ２上面から蒸発して残留しにくいアルコールまたはこれを含むものを用いている。溶剤供給装置１０はその密閉容器１１内にアルコール容器１２が収納して配置されている。
In the embodiment shown in this figure, after removing the top plate 7 above the main body of the vacuum vessel 1 and releasing the atmosphere to the atmosphere as the solvent, alcohol that does not easily evaporate from the upper surface of the flange 2 or contains this is used. The solvent supply device 10 has an alcohol container 12 accommodated in a sealed container 11.
密閉容器１１には圧縮空気を導入する加圧器１４が取り付けられ、アルコール容器１２内のアルコール１３に一端が侵漬し多端が密閉容器１１外に伸びる配管１５が設けられている。加圧器１４の上部スイッチが押されることにより密閉容器１１に圧縮空気が供給され、その圧力によって、配管１５からアルコールを排出可能となっている。
A pressurizer 14 for introducing compressed air is attached to the sealed container 11, and a pipe 15 is provided, one end of which is immersed in the alcohol 13 in the alcohol container 12 and the other end extends outside the sealed container 11. By pressing the upper switch of the pressurizer 14, compressed air is supplied to the sealed container 11, and alcohol can be discharged from the pipe 15 by the pressure.
このような構成により、処理室内での通常のプラズマを用いた処理の際は、溶剤供給装置１０は配管１５の先端をフランジ２から取り外して別置きされる。真空処理装置をメンテナンス等のために真空容器１内を大気開放する際には、溶剤供給装置１０をフランジ２の溝９に接続し、アルコール１３を溝９内に供給する。この場合、溝９が４箇所あるので順次供給する。なお、溝９の供給口を１箇所にして分岐させるようにしても良い。
With such a configuration, during processing using normal plasma in the processing chamber, the solvent supply device 10 is placed separately by removing the tip of the pipe 15 from the flange 2. When the vacuum vessel 1 is opened to the atmosphere for maintenance or the like, the solvent supply device 10 is connected to the groove 9 of the flange 2 and the alcohol 13 is supplied into the groove 9. In this case, since there are four grooves 9, they are sequentially supplied. The supply port of the groove 9 may be branched at one place.
この供給により、アルコール１３の流路となる各溝９内部を流れてアルコール１３はＯリング３の溝８内に流れ込み、Ｏリング３とフランジ２との密着部に浸透し始める。アルコール１３はＯリングとフランジ２との密着力を徐々に弱めていくので、アルコール１３を供給して所定の時間経過後に昇降装置６により天板７を持ち上げる力を加える。この際、天板７を引き剥がしにくい場合には、円周方向の複数箇所に設けた昇降装置６を局部的に、例えば、１箇所のみ力を加え、部分的に剥がす。
By this supply, the alcohol 13 flows through the grooves 9 serving as a flow path of the alcohol 13 and flows into the groove 8 of the O-ring 3, and begins to penetrate into the contact portion between the O-ring 3 and the flange 2. Since the alcohol 13 gradually weakens the adhesion force between the O-ring and the flange 2, the alcohol 13 is supplied and a force for lifting the top plate 7 is applied by the lifting device 6 after a predetermined time has elapsed. At this time, if it is difficult to peel off the top plate 7, the lifting devices 6 provided at a plurality of locations in the circumferential direction are locally peeled off, for example, by applying a force only at one location.
部分的な（１箇所の）剥がれが生じるとリング状に連なっているＯリングの接着面は、剥がれた部分の端部に集中的に加わる相互に引き剥そうとする外力にによりその剥がれた部分の長さや領域の大きさを大きくするように徐々に剥がれていく。この際にアルコール１３の浸透が進んでいる場合にはより短時間で剥がれを進行させることができる。
When partial (single) peeling occurs, the adhesive surface of the O-ring connected in a ring shape is the part peeled off by the external force that is applied to the ends of the peeled portion in an intensive manner. It gradually peels off to increase the length and area size. At this time, when the permeation of the alcohol 13 is advanced, the peeling can be advanced in a shorter time.
このようにしてＯリングの密着を剥がし天板７を取り外すようにすれば、基板の大口径化に伴い大型化する真空容器においても容易に大気開放することができる。このため、メンテナンス等の目的のための大気開放の作業の時間が短縮され、真空処理装置が処理をしていない非処理時間を短縮して装置の稼働の効率、処理の効率を向上させることができる。
In this way, if the O-ring is peeled off and the top plate 7 is removed, the atmosphere can be easily released to the atmosphere even in a vacuum vessel that increases in size as the substrate diameter increases. For this reason, it is possible to shorten the time for the work to open the atmosphere for the purpose of maintenance and the like, shorten the non-processing time when the vacuum processing apparatus is not processing, and improve the operation efficiency and processing efficiency of the apparatus. it can.
１…真空容器
２…フランジ
３…Ｏリング
４…誘導コイル
５…排気装置
６…昇降装置
７…天板
８，９…溝
１０…溶剤供給装置
１１…密閉容器
１２…アルコール容器
１３…アルコール
１４…加圧器
１５…配管。
DESCRIPTION OF SYMBOLS 1 ... Vacuum container 2 ... Flange 3 ... O-ring 4 ... Induction coil 5 ... Exhaust device 6 ... Elevating device 7 ... Top plate 8, 9 ... Groove 10 ... Solvent supply device 11 ... Sealed container 12 ... Alcohol container 13 ... Alcohol 14 ... Pressurizer 15 ... piping.
Claims (4)
前記真空容器と前記天板とに係合し前記真空容器に対して前記天板を離間させる剥し手段と、前記真空容器の上部にの前記天板と当接する面に配置され内部に前記Ｏリングが配置されるリング状の溝と、この溝内部と連通しその外周部から溶剤が供給される複数の溶剤供給路と、この溶剤供給路に着脱可能に配置される溶剤容器とを備えた真空処理装置。
A vacuum vessel having an upper opening, a top plate that abuts the upper portion of the vacuum vessel with an O-ring interposed therebetween and hermetically seals the inside of the vacuum vessel and the outside, and is used for processing in the vacuum vessel. Gas supply means for supplying the gas, evacuation means for evacuating and depressurizing the inside of the vacuum vessel, and electric field supply means for supplying an electric field for forming plasma in the vacuum vessel through the top plate In a vacuum processing apparatus for processing a sample placed inside a vacuum vessel using the plasma,
A peeling means that engages with the vacuum vessel and the top plate and separates the top plate from the vacuum vessel, and is disposed on the surface of the upper portion of the vacuum vessel that contacts the top plate, and has the O-ring inside. A vacuum provided with a ring-shaped groove in which the solvent is disposed, a plurality of solvent supply passages that communicate with the inside of the groove and through which the solvent is supplied, and a solvent container that is detachably disposed in the solvent supply passage Processing equipment.
2. The plasma processing apparatus according to claim 1, wherein the solvent supply path includes a plurality of supply grooves that extend outward on an outer peripheral side of the ring-shaped groove, and the solvent container is connected to the groove to form the solvent. Is a vacuum processing apparatus in which the ring-shaped groove is supplied.
3. The plasma processing apparatus according to claim 1, wherein alcohol is pushed out into the solvent supply path by supplying compressed air into the solvent container.
前記真空処理装置は、前記真空容器と前記天板とに係合し前記真空容器に対して前記天板を離間させる剥し手段と、前記真空容器の上部にの前記天板と当接する面に配置され内部に前記Ｏリングが配置されるリング状の溝と、この溝内部と連通しその外周部から溶剤が供給される複数の溶剤供給路と、この溶剤供給路に着脱可能に配置される溶剤容器とを備え、
前記真空容器から前記天板を取り外す際に、前記溶剤供給路に取り付けられ前記溶剤容器内の溶剤を前記溶剤供給路を介して前記リング状の溝に供給した後、前記剥し手段により前記天板と前記容器との間を離間させる力を付与して前記天板を前記真空容器から剥す真空処理装置の天板の取り外し方法。 A vacuum vessel having an upper opening, a top plate that abuts the upper portion of the vacuum vessel with an O-ring interposed therebetween and hermetically seals the inside of the vacuum vessel and the outside, and is used for processing in the vacuum vessel. Gas supply means for supplying the gas, evacuation means for evacuating and depressurizing the inside of the vacuum vessel, and electric field supply means for supplying an electric field for forming plasma in the vacuum vessel through the top plate A method of removing a top plate of a vacuum processing apparatus for processing a sample placed inside a vacuum vessel using the plasma,
The vacuum processing apparatus is disposed on a surface that comes into contact with the top plate on the top of the vacuum vessel, and a peeling means that engages the vacuum vessel and the top plate and separates the top plate from the vacuum vessel. A ring-shaped groove in which the O-ring is disposed, a plurality of solvent supply paths communicating with the inside of the groove and supplied with a solvent from the outer periphery thereof, and a solvent detachably disposed in the solvent supply path A container,
When removing the top plate from the vacuum container, the top plate is attached to the solvent supply path and the solvent in the solvent container is supplied to the ring-shaped groove through the solvent supply path, and then the peeling means is used to remove the top board. A method for removing the top plate of the vacuum processing apparatus, which applies a force for separating the container and the container and peels the top plate from the vacuum container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012215449A JP2014069104A (en) | 2012-09-28 | 2012-09-28 | Plasma treatment apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012215449A JP2014069104A (en) | 2012-09-28 | 2012-09-28 | Plasma treatment apparatus |
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| JP2014069104A true JP2014069104A (en) | 2014-04-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016176497A (en) * | 2015-03-19 | 2016-10-06 | 東京エレクトロン株式会社 | Connection structure, exhaust system using connection structure, substrate treatment device and method for removing flange |
| JP2021534071A (en) * | 2018-10-16 | 2021-12-09 | 北京北方華創微電子装備有限公司Beijing Naura Microelectronics Equipment Co., Ltd. | Chamber seal assembly and growth furnace |
-
2012
- 2012-09-28 JP JP2012215449A patent/JP2014069104A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016176497A (en) * | 2015-03-19 | 2016-10-06 | 東京エレクトロン株式会社 | Connection structure, exhaust system using connection structure, substrate treatment device and method for removing flange |
| JP2021534071A (en) * | 2018-10-16 | 2021-12-09 | 北京北方華創微電子装備有限公司Beijing Naura Microelectronics Equipment Co., Ltd. | Chamber seal assembly and growth furnace |
| JP7126027B2 (en) | 2018-10-16 | 2022-08-25 | 北京北方華創微電子装備有限公司 | Chamber seal assembly and growth furnace |
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