JP2014063875A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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JP2014063875A
JP2014063875A JP2012208018A JP2012208018A JP2014063875A JP 2014063875 A JP2014063875 A JP 2014063875A JP 2012208018 A JP2012208018 A JP 2012208018A JP 2012208018 A JP2012208018 A JP 2012208018A JP 2014063875 A JP2014063875 A JP 2014063875A
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electronic component
hole
main surface
circuit board
printed circuit
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JP5885630B2 (en
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Jun Tawara
潤 田原
Mitsunori Ishizaki
光範 石崎
Takaya Muto
貴哉 武藤
Hideyuki Saotome
秀之 早乙女
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board which achieves high heat radiation performance for an electronic component and high connection strength between the electronic component and a circuit base material.SOLUTION: A printed circuit board includes: a circuit base material 11; an electronic component 30 which is placed on a main surface of the circuit base material 11; a heat radiation member 50 disposed on the side of a rear surface of the circuit base material 11 which faces the main surface in a thickness direction of the circuit base material 11; and a heat conduction member 13 which connects the electronic component 30 with the heat radiation member 50. A through hole 12 which penetrates from the main surface of the circuit base material 11 to the rear surface is formed in a region of the circuit base material 11 where the electronic component 30 is placed. An outflow prevention member 14 which is formed so as to enclose an opening end part of the through hole 12 is provided on the main surface of the circuit base material 11.

Description

本発明はプリント基板に関し、特に、回路基材の主表面とはんだ接合された電子部品を備えるプリント基板に関する。   The present invention relates to a printed circuit board, and more particularly to a printed circuit board including an electronic component solder-bonded to a main surface of a circuit substrate.

電子部品を備えるプリント基板において、電子部品通電時の温度上昇に対し、プリント基板上の自然対流によって電子部品の温度低減を図る方法がある。これでも不十分な場合には、プリント基板の裏面側に放熱部材を接続して放熱する方法がある。   There is a method of reducing the temperature of an electronic component by natural convection on the printed circuit board with respect to a temperature rise when the electronic component is energized in a printed circuit board including the electronic component. If this is insufficient, there is a method of dissipating heat by connecting a heat dissipating member to the back side of the printed circuit board.

例えば、特開２０１０−１０９０３６号公報には、回路基材に形成したスルーホールに熱伝導性部材を設け、回路基材の両面に熱伝導性部材と接続された端子パターンを有して、発熱素子を該端子パターンにはんだ付けしている。   For example, in Japanese Patent Application Laid-Open No. 2010-109036, a heat conductive member is provided in a through hole formed in a circuit substrate, and terminal patterns connected to the heat conductive member are provided on both sides of the circuit substrate to generate heat. The element is soldered to the terminal pattern.

はんだ付けは、リフローはんだ法等により複数箇所を同時にはんだ付けする方法の方が、個別にはんだ付けする方法と比較して、製造コストの観点から有利である。この場合、熱伝導性部材の周囲に位置する部材も同時に加熱される。   As for soldering, the method of simultaneously soldering a plurality of locations by the reflow soldering method or the like is more advantageous from the viewpoint of manufacturing cost as compared with the method of soldering individually. In this case, members located around the heat conductive member are also heated at the same time.

特開２０１０−１０９０３６号公報JP 2010-109036 A

しかしながら、熱伝導性部材は熱伝導率が高くかつ熱容量が大きいため、電子部品のはんだ付けをリフローはんだ法等により行う場合には、熱伝導性部材と比べて熱伝導性部材の周囲の設けられた回路パターンの方が早く温度上昇する。そのため、熱伝導性部材上に塗布されたはんだが周囲の回路パターンに流れ、はんだ付け後の電子部品と熱伝導性部材との接合部において、空隙部が広がってしまう場合があった。   However, since the heat conductive member has a high heat conductivity and a large heat capacity, when soldering an electronic component by the reflow soldering method, the heat conductive member is provided around the heat conductive member. The circuit pattern rises faster. Therefore, the solder applied on the heat conductive member flows to the surrounding circuit pattern, and the gap portion may spread at the joint between the electronic component and the heat conductive member after soldering.

その結果、電子部品に対する熱伝導性部材による放熱性が低下して、電子部品の温度は上昇してしまう。さらに、接続強度が低下することにより、耐久性が低下するという問題がある。   As a result, the heat dissipation by the heat conductive member with respect to the electronic component is lowered, and the temperature of the electronic component is increased. Furthermore, there exists a problem that durability falls by connecting strength falling.

本発明は、上記のような課題を解決するためになされたものである。本発明の主たる目的は、電子部品に対する放熱性および電子部品と回路基材との接続強度の高い、プリント基板を提供することにある。   The present invention has been made to solve the above-described problems. A main object of the present invention is to provide a printed circuit board having high heat dissipation properties for an electronic component and high connection strength between the electronic component and a circuit substrate.

回路基材と、回路基材の主表面上に載置される電子部品と、回路基材の主表面と回路基材の厚さ方向において対向する裏面側に配置される放熱部材と、電子部品と放熱部材とを接続する熱伝導性部材とを備える。上記回路基材には、電子部品が載置される領域に、回路基材の主表面から裏面に貫通するスルーホールが形成されている。上記熱伝導性部材はスルーホール内に設けられて、主表面側に位置する熱伝導性部材の端部は電子部品とはんだを介して接続されており、裏面側に位置する熱伝導性部材の端部は放熱部材と接続されている。さらに、上記回路基材の主表面上において、スルーホールの開口端部を囲うように形成された流出防止部材を備える。   A circuit substrate, an electronic component placed on the main surface of the circuit substrate, a heat dissipating member disposed on the back side facing the main surface of the circuit substrate in the thickness direction of the circuit substrate, and an electronic component And a heat conductive member for connecting the heat dissipating member. In the circuit base material, a through hole penetrating from the main surface to the back surface of the circuit base material is formed in a region where the electronic component is placed. The heat conductive member is provided in the through hole, and the end of the heat conductive member located on the main surface side is connected to the electronic component via solder, and the heat conductive member located on the back surface side The end is connected to the heat dissipation member. Furthermore, an outflow prevention member is provided on the main surface of the circuit substrate so as to surround the opening end of the through hole.

これにより、熱伝導性部材上に塗布されたはんだが周囲のパターンに流出することを防止して、電子部品と熱伝導性部材との間において空隙が発生することを抑制することができるため、電子部品に対する放熱性および電子部品と回路基材との接続強度を高めることができる。   Thereby, it is possible to prevent the solder applied on the heat conductive member from flowing out to the surrounding pattern, and to suppress the generation of voids between the electronic component and the heat conductive member. The heat dissipation with respect to an electronic component and the connection strength of an electronic component and a circuit base material can be improved.

本発明のプリント基板によれば、熱伝導性部材上に塗布されたはんだが周囲のパターンに流出することを防止して、電子部品と熱伝導性部材との間において空隙を低減することができるため、電子部品に対する放熱性および電子部品と回路基材との接続強度を高めることができる。   According to the printed circuit board of the present invention, it is possible to prevent the solder applied on the heat conductive member from flowing out to the surrounding pattern, and to reduce the gap between the electronic component and the heat conductive member. Therefore, it is possible to improve the heat dissipation performance for the electronic component and the connection strength between the electronic component and the circuit substrate.

本実施の形態１に係るプリント基板の断面概略図である。1 is a schematic cross-sectional view of a printed circuit board according to a first embodiment. 本実施の形態２に係るプリント基板の断面概略図である。It is a cross-sectional schematic diagram of the printed circuit board according to the second embodiment. 図２の変形例を示す図である。It is a figure which shows the modification of FIG. 本実施の形態３に係るプリント基板の断面概略図である。It is a cross-sectional schematic diagram of the printed circuit board according to the third embodiment. 図４の上面図である。FIG. 5 is a top view of FIG. 4.

以下、図面を参照して、本発明の実施の形態について説明する。なお、以下の図面において、同一または相当する部分には同一の参照番号を付し、その説明は繰り返さない。   Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

（実施の形態１）
以下、本発明の実施の形態１について説明する。まず、図１を参照して実施の形態１に係るプリント基板１０の構成を説明する。本実施の形態に係るプリント基板１０は、厚さ方向（図１中での縦方向）に互いに対向する主表面および裏面を有する回路基材１１を備える。回路基材１１には主表面側と裏面側とを貫通するスルーホール１２が形成されている。さらに、本実施の形態に係るプリント基板１０は、回路基材１１の主表面側のスルーホール１２上に設けられた電子部品３０と、回路基材１１の裏面側に設けられた放熱部材５０と、スルーホール１２内に設けられて、電子部品３０から放熱部材５０に至る熱経路を形成している熱伝導性部材１３をさらに備える。 (Embodiment 1)
Embodiment 1 of the present invention will be described below. First, the configuration of the printed circuit board 10 according to the first embodiment will be described with reference to FIG. A printed circuit board 10 according to the present embodiment includes a circuit substrate 11 having a main surface and a back surface that face each other in the thickness direction (vertical direction in FIG. 1). The circuit substrate 11 is formed with a through hole 12 penetrating the main surface side and the back surface side. Furthermore, the printed circuit board 10 according to the present embodiment includes an electronic component 30 provided on the through hole 12 on the main surface side of the circuit base material 11, and a heat dissipation member 50 provided on the back side of the circuit base material 11. The heat conductive member 13 provided in the through hole 12 and forming a heat path from the electronic component 30 to the heat radiating member 50 is further provided.

電子部品３０は、例えばＭＯＳＦＥＴ等のパワー半導体素子を含み、通電時に発熱する。この場合、電子部品３０の内部（図示しない）は、例えばパワー半導体素子が電子部品３０の銅ベースにはんだ付けされている。   The electronic component 30 includes a power semiconductor element such as a MOSFET, and generates heat when energized. In this case, for example, a power semiconductor element is soldered to the copper base of the electronic component 30 inside the electronic component 30 (not shown).

回路基材１１は、図１を参照して、平板状であって電気的絶縁性を示す。回路基材１１の材料としては、電気的絶縁性を有する任意の材料とすることができるが、例えば、ガラスエポキシ樹脂としてもよい。回路基材１１は、厚さ方向（図１中での縦方向）に互いに対向する主表面および裏面を有している。回路基材１１には、回路基材１１の主表面から裏面に、回路基材１１を貫通するスルーホール１２が形成されている。スルーホール１２は、主表面および裏面と平行方向において、丸孔状として形成されている。スルーホール１２の孔径は、電子部品３０の外形よりも小さくすることにより、既存の回路パターン１５等の変更を必要とせずに採用することができる。   With reference to FIG. 1, the circuit base material 11 is flat form and shows electrical insulation. The material of the circuit substrate 11 can be any material having electrical insulation, but may be a glass epoxy resin, for example. The circuit substrate 11 has a main surface and a back surface that face each other in the thickness direction (vertical direction in FIG. 1). In the circuit substrate 11, a through hole 12 penetrating the circuit substrate 11 is formed from the main surface to the back surface of the circuit substrate 11. Through hole 12 is formed as a round hole in a direction parallel to the main surface and the back surface. By making the hole diameter of the through hole 12 smaller than the outer shape of the electronic component 30, it is possible to adopt the existing circuit pattern 15 or the like without requiring any change.

回路基材１１の主表面側のスルーホール１２の上には、電子部品３０が設けられている。また、回路基材１１の主表面上には回路パターン１５が形成されている。電子部品３０と回路パターン１５とは端子３１を介して電気的に接続されており、これによって、本実施の形態に係るプリント基板１０は、電気的に動作する。例えば、電子部品３０内のパワー半導体素子と端子３１とはワイヤボンディングにより接続され、端子３１と回路パターン１５とははんだ２１により接続されている。回路パターン１５は、絶縁性部材１８（外周側流出防止部材）によって縁取りされていてもよい。これにより、回路パターン１５が他の回路パターンと隣り合う場合において、はんだ２１が流出して回路パターン間を導通させることを防止することができる。絶縁性部材１８は、例えば、レジストとすればよい。   An electronic component 30 is provided on the through hole 12 on the main surface side of the circuit substrate 11. A circuit pattern 15 is formed on the main surface of the circuit substrate 11. The electronic component 30 and the circuit pattern 15 are electrically connected via the terminal 31, whereby the printed circuit board 10 according to the present embodiment operates electrically. For example, the power semiconductor element in the electronic component 30 and the terminal 31 are connected by wire bonding, and the terminal 31 and the circuit pattern 15 are connected by the solder 21. The circuit pattern 15 may be bordered by an insulating member 18 (outer peripheral side outflow prevention member). Thereby, when the circuit pattern 15 is adjacent to another circuit pattern, it is possible to prevent the solder 21 from flowing out and conducting between the circuit patterns. The insulating member 18 may be a resist, for example.

熱伝導性部材１３は、スルーホール１２の内部に配置される。熱伝導性部材１３の材料としては、数１０Ｗ／ｍ・Ｋ以上の高い熱伝導率を示す任意の材料とする。好ましくは、熱伝導性部材１３は、１００Ｗ／ｍ・Ｋ以上の熱伝導率を有する銅やアルミニウムからなる。熱伝導性部材１３の形状は、スルーホール１２と嵌合可能な任意の形状とすることができるが、好ましくは、スルーホール１２を丸孔状として熱伝導性部材１３を円柱状とする。これにより、はんだ付け工程時にはんだを均一に拡散することができる。さらにこの場合、スルーホール１２はドリルによって容易に形成でき、熱伝導性部材１３はプレスによって容易に作製することができる。   The thermally conductive member 13 is disposed inside the through hole 12. The material of the heat conductive member 13 is an arbitrary material that exhibits a high thermal conductivity of several tens W / m · K or more. Preferably, the heat conductive member 13 is made of copper or aluminum having a heat conductivity of 100 W / m · K or more. The shape of the heat conductive member 13 can be any shape that can be fitted to the through hole 12, but preferably the through hole 12 is round and the heat conductive member 13 is cylindrical. Thereby, a solder can be spread | diffused uniformly at the time of a soldering process. Further, in this case, the through hole 12 can be easily formed by a drill, and the heat conductive member 13 can be easily manufactured by pressing.

熱伝導性部材１３において、回路基材１１の主表面側に位置する端部は電子部品３０とはんだ２０を介して接続されている。また、熱伝導性部材１３において、回路基材１１の裏面側に位置する端部は放熱部材５０と伝熱材４０を介して接続されている。このとき、熱伝導性部材１３の上面および下面は、湾曲していてもよい。つまり、熱伝導性部材１３は、例えば、熱伝導性の板部材をプレスすることによって容易に作製することができる。プレスにより作製された熱伝導性部材１３には、加圧された方向に垂直な２面に湾曲が生じ、一方の面には凹部が、他方の面には凸部が形成される。この場合、図１を参照して、凹部が形成された端部を回路基材１１の主表面側に、凸部が形成された端部を回路基材１１の裏面側に配置するのが好ましい。このようにすれば、電子部品３０と熱伝導性部材１３とを接合するためのはんだは、凹部に配置されることになるため、はんだ付け工程時にはんだの流出を抑制することができる。   In the heat conductive member 13, the end portion located on the main surface side of the circuit substrate 11 is connected to the electronic component 30 via the solder 20. Further, in the heat conductive member 13, an end portion located on the back surface side of the circuit substrate 11 is connected via the heat radiating member 50 and the heat transfer material 40. At this time, the upper surface and the lower surface of the heat conductive member 13 may be curved. That is, the heat conductive member 13 can be easily manufactured by, for example, pressing a heat conductive plate member. The heat conductive member 13 produced by pressing is curved on two surfaces perpendicular to the pressurized direction, and a concave portion is formed on one surface and a convex portion is formed on the other surface. In this case, referring to FIG. 1, it is preferable to arrange the end portion on which the concave portion is formed on the main surface side of the circuit base material 11 and the end portion on which the convex portion is formed on the back surface side of the circuit base material 11. . If it does in this way, since the solder for joining the electronic component 30 and the heat conductive member 13 will be arrange | positioned at a recessed part, the outflow of solder can be suppressed at the time of a soldering process.

なお、熱伝導性部材１３の凸部が形成された下面と、回路基材１１の裏面とが同一平面上に形成されているのが好ましい。これにより、放熱部材５０に対して、回路基材１１の裏面と熱伝導性部材１３の裏面とを等間隔に設けることができるため、熱伝導性部材１３の裏面が回路基材１１の裏面より放熱部材５０から離れている場合より、伝熱材４０の使用量を少なくすることができる。   In addition, it is preferable that the lower surface in which the convex part of the heat conductive member 13 was formed, and the back surface of the circuit base material 11 are formed on the same plane. Thereby, since the back surface of the circuit base material 11 and the back surface of the heat conductive member 13 can be provided at equal intervals with respect to the heat radiating member 50, the back surface of the heat conductive member 13 is more than the back surface of the circuit base material 11. The amount of heat transfer material 40 used can be reduced as compared with the case where the heat dissipating member 50 is separated.

回路基材１１の裏面側には、伝熱材４０を介して放熱部材５０が形成されている。
伝熱材４０には、回路基材１１の裏面と放熱部材５０とを空隙なく接続することができる任意の材料を採用することができる。例えば、伝熱材４０は、グリースや接着剤等としてもよい。この場合には、伝熱材４０の粘度は、好ましくは数十Ｐａ・ｓ以下であり、より好ましくは１０Ｐａ・ｓ以下である。また、伝熱材４０は、シートやテープとしてもよく、この場合には、伝熱材４０の硬度は、好ましくはアスカーＣ硬度で３０以下であり、より好ましくは１０以下である。このようにすることで、回路基材１１の裏面側におけるスルーホール１２、熱伝導性部材１３、および放熱部材５０との間の空隙を低減して、放熱性を高めることができる。 A heat radiating member 50 is formed on the back surface side of the circuit substrate 11 via a heat transfer material 40.
As the heat transfer material 40, any material that can connect the back surface of the circuit substrate 11 and the heat radiating member 50 without a gap can be employed. For example, the heat transfer material 40 may be grease or an adhesive. In this case, the viscosity of the heat transfer material 40 is preferably several tens Pa · s or less, and more preferably 10 Pa · s or less. Further, the heat transfer material 40 may be a sheet or a tape. In this case, the heat transfer material 40 preferably has an Asker C hardness of 30 or less, more preferably 10 or less. By doing in this way, the space | gap between the through hole 12, the heat conductive member 13, and the heat radiating member 50 in the back surface side of the circuit base material 11 can be reduced, and heat dissipation can be improved.

放熱部材５０は、熱伝導率の高い材料からなり、例えば、銅やアルミニウムからなる。これにより、電子部品３０に生じた熱を、熱伝導性部材１３および伝熱材４０を経て、回路基材１１の裏面側に設けられた放熱部材５０へと伝播し、放熱することができる。このとき、放熱部材５０が導電性を有する場合には、伝熱材４０の材料は電気的絶縁性を有し、かつ放熱性の高い、シリコン樹脂系やエポキシ樹脂系の材料としてもよい。また、放熱部材５０は、フィン等を有するヒートシンクを構成してもよく、冷却方法としては空冷または水冷としてもよい。放熱部材５０をヒートシンクとして構成できない場合には、例えば、ヒートパイプや炭素材料からなる熱輸送機構を設けて、所定の場所に熱を輸送し、放熱してもよい。   The heat radiating member 50 is made of a material having high thermal conductivity, and is made of, for example, copper or aluminum. Thereby, the heat generated in the electronic component 30 can be propagated to the heat radiating member 50 provided on the back surface side of the circuit substrate 11 through the heat conductive member 13 and the heat transfer material 40, and can be radiated. At this time, when the heat radiating member 50 has conductivity, the material of the heat transfer material 40 may be a silicon resin or epoxy resin material having electrical insulation and high heat dissipation. Moreover, the heat radiating member 50 may constitute a heat sink having fins or the like, and the cooling method may be air cooling or water cooling. When the heat radiating member 50 cannot be configured as a heat sink, for example, a heat transport mechanism made of a heat pipe or a carbon material may be provided to transport heat to a predetermined place and dissipate heat.

回路基材１１の主表面上であって、電子部品３０の直下には、スルーホール１２を囲うように流出防止部材１４が形成されている。流出防止部材１４は、はんだ付け工程時に熱伝導性部材１３の周囲の部材が加熱されることによって、熱伝導性部材１３上に塗布されたはんだ２０が周囲の部材に流出するのを抑制する。よって、流出防止部材１４は、はんだ２０の流出を抑制可能な任意の材料とすることができ、例えば、レジストであってもよい。レジストとしては、一般的なフォトレジストや、スクリーン印刷レジストを用いることができる。流出防止部材１４の形状は、はんだ２０の流出を抑制可能な任意の形状とすることができるが、スルーホール１２の開口端部の外周形状に沿った平面形状としてもよく、好ましくは、平面形状を円形状とする。これにより、上述のように、スルーホール１２を丸孔状、熱伝導性部材１３を円柱状として、はんだ付け工程時にはんだを均一に拡散可能とするように設けられた場合に、拡散したはんだ２０が部分的に集中することを抑制できる。その結果、電子部品３０と熱伝導性部材１３との間に空隙が拡がることを抑制することができ、電子部品３０に対する放熱性や、電子部品３０の接着強度を高めることができる。   An outflow prevention member 14 is formed on the main surface of the circuit substrate 11 and immediately below the electronic component 30 so as to surround the through hole 12. The outflow prevention member 14 suppresses the solder 20 applied on the heat conductive member 13 from flowing out to the surrounding members by heating the members around the heat conductive member 13 during the soldering process. Therefore, the outflow prevention member 14 can be made of any material capable of suppressing the outflow of the solder 20, and may be a resist, for example. As the resist, a general photoresist or a screen printing resist can be used. The shape of the outflow prevention member 14 can be any shape that can suppress the outflow of the solder 20, but may be a planar shape along the outer peripheral shape of the opening end portion of the through hole 12, and preferably a planar shape Is a circular shape. Thus, as described above, when the through hole 12 has a round hole shape and the heat conductive member 13 has a cylindrical shape so that the solder can be uniformly diffused during the soldering process, the diffused solder 20 Can be prevented from being partially concentrated. As a result, it is possible to suppress an increase in the gap between the electronic component 30 and the heat conductive member 13, and it is possible to increase heat dissipation with respect to the electronic component 30 and adhesion strength of the electronic component 30.

次に、本実施の形態に係るプリント基板１０の製造方法を説明する。まず、回路基材１１を準備する（Ｓ０１）。回路基材１１は、例えば、主表面に銅箔等が圧着され、任意のパターンに加工されることにより、回路パターン１５を有する回路基材１１が準備される。このとき、回路パターン１５に２００Ａ以上の大電流が流れる場合には、回路パターン１５の厚みが１００μｍ以上となるように形成されるのが好ましい。なお、めっき等によって回路基材１１に回路パターン１５を形成してもよいが、回路パターン１５を厚さ１００μｍ以上として形成する場合には、シート状の回路パターン１５を回路基材１１に圧着する方法が簡便である。   Next, a method for manufacturing the printed circuit board 10 according to the present embodiment will be described. First, the circuit substrate 11 is prepared (S01). The circuit substrate 11 is prepared by, for example, bonding a copper foil or the like to the main surface and processing it into an arbitrary pattern, thereby preparing the circuit substrate 11 having the circuit pattern 15. At this time, when a large current of 200 A or more flows through the circuit pattern 15, it is preferable that the thickness of the circuit pattern 15 is 100 μm or more. The circuit pattern 15 may be formed on the circuit substrate 11 by plating or the like. However, when the circuit pattern 15 is formed with a thickness of 100 μm or more, the sheet-like circuit pattern 15 is pressure-bonded to the circuit substrate 11. The method is simple.

次に、スルーホール１２を形成する（Ｓ０２）。スルーホール１２は、電子部品３０が配置される回路基材１１に、回路基材１１の主表面と裏面とを貫通するように形成される。例えば、スルーホール１２は、ドリルを用いて回路基材１１に対して穴開け加工をすることによって形成される。   Next, the through hole 12 is formed (S02). The through hole 12 is formed in the circuit substrate 11 on which the electronic component 30 is disposed so as to penetrate the main surface and the back surface of the circuit substrate 11. For example, the through hole 12 is formed by drilling the circuit substrate 11 using a drill.

次に、熱伝導性部材１３をスルーホール１２に圧入する（Ｓ０３）。熱伝導性部材１３は、予め熱伝導性の板状部材からプレス成型等により作製しておく。このとき、上述のように、熱伝導性部材１３において、作製時に加圧された方向に垂直な２面に湾曲が生じ、一方の面には凹部が、他方の面には凸部が形成される。この場合、図１を参照して、凹部が形成された端部を回路基材１１の主表面側に、凸部が形成された端部を回路基材１１の裏面側に配置するのが好ましい。   Next, the heat conductive member 13 is press-fitted into the through hole 12 (S03). The heat conductive member 13 is previously produced from a heat conductive plate member by press molding or the like. At this time, as described above, the thermal conductive member 13 is curved on two surfaces perpendicular to the direction of pressure applied at the time of production, and a concave portion is formed on one surface and a convex portion is formed on the other surface. The In this case, referring to FIG. 1, it is preferable to arrange the end portion on which the concave portion is formed on the main surface side of the circuit base material 11 and the end portion on which the convex portion is formed on the back surface side of the circuit base material 11. .

次に、流出防止部材１４を形成する（Ｓ０４）。流出防止部材１４を、レジストとして形成する場合には、回路基材１１の主表面上および熱伝導性部材１３の凹部が形成された端部上にレジストを塗布して、露光および現像を行い、スルーホール１２を囲うようにレジストパターンを形成する。このとき、レジストの厚さは、例えば、２０μｍ〜４０μｍ程度とすればよい。   Next, the outflow prevention member 14 is formed (S04). When the outflow prevention member 14 is formed as a resist, a resist is applied on the main surface of the circuit substrate 11 and the end portion where the recesses of the heat conductive member 13 are formed, and exposure and development are performed. A resist pattern is formed so as to surround the through hole 12. At this time, the thickness of the resist may be about 20 μm to 40 μm, for example.

次に、回路基材１１の主表面上にはんだ２０，２１を塗布する（Ｓ０５）。はんだ２０は、電子部品３０と熱伝導性部材１３とを接合する領域に、はんだ２１は端子３１と回路パターン１５とを接合する領域に、それぞれ塗布される。このとき、はんだ２０，２１は、回路基材１１の主表面に均一な厚さで形成されたマスクを用いて塗布されてもよい。   Next, solders 20 and 21 are applied on the main surface of the circuit substrate 11 (S05). The solder 20 is applied to a region where the electronic component 30 and the heat conductive member 13 are bonded, and the solder 21 is applied to a region where the terminal 31 and the circuit pattern 15 are bonded. At this time, the solders 20 and 21 may be applied using a mask formed with a uniform thickness on the main surface of the circuit substrate 11.

次に、電子部品３０、端子３１をはんだ接合する（Ｓ０６）。電子部品３０は、はんだ２０によって熱伝導性部材１３と接合され、端子３１は、はんだ２１によって回路パターン１５と接合される。このとき、リフローはんだ法等を採用して、プリント基板１０全体を加熱して複数のはんだ接合箇所を同時に接合することができる。リフローはんだ法を採用した場合にも、流出防止部材１４によって、はんだ２０が熱伝導性部材１３の周囲に流出することを抑制でき、電子部品３０直下に生じる空隙を低減することができる。   Next, the electronic component 30 and the terminal 31 are soldered (S06). The electronic component 30 is joined to the heat conductive member 13 by the solder 20, and the terminal 31 is joined to the circuit pattern 15 by the solder 21. At this time, the reflow soldering method etc. are employ | adopted and the printed circuit board 10 whole can be heated, and a some solder joint location can be joined simultaneously. Even when the reflow soldering method is employed, the outflow prevention member 14 can suppress the solder 20 from flowing out to the periphery of the heat conductive member 13, and can reduce the gap generated immediately below the electronic component 30.

次に、回路基材１１の裏面側に伝熱材４０および放熱部材５０を形成する（Ｓ０７）。
以上のように、本実施の形態に係るプリント基板１０は、回路基材１１の主表面上であって、電子部品３０の直下には、スルーホール１２を囲うように流出防止部材１４が形成されている。そのため、電子部品３０等の接合にリフローはんだ法等のように、プリント基板１０全体を加熱してはんだ接合する方法を採用した場合においても、はんだ２０が熱伝導性部材１３の周囲に流出することを抑制できる。リフローはんだ法を採用した従来のプリント基板において、電子部品３０と熱伝導性部材１３との接合部に生じていた空隙を低減できる。その結果、当該従来のプリント基板と比較して、電子部品３０に対する放熱性を高めることができ、かつ電子部品３０の接合強度を高めることができる。 Next, the heat transfer material 40 and the heat dissipation member 50 are formed on the back surface side of the circuit substrate 11 (S07).
As described above, the printed circuit board 10 according to the present embodiment is on the main surface of the circuit base material 11, and immediately below the electronic component 30, the outflow prevention member 14 is formed so as to surround the through hole 12. ing. For this reason, the solder 20 flows out to the periphery of the heat conductive member 13 even when a method of heating and soldering the entire printed circuit board 10 such as a reflow soldering method is used for joining the electronic component 30 or the like. Can be suppressed. In the conventional printed circuit board that employs the reflow soldering method, it is possible to reduce voids that have occurred at the joint between the electronic component 30 and the heat conductive member 13. As a result, compared with the conventional printed circuit board, the heat dissipation with respect to the electronic component 30 can be increased, and the bonding strength of the electronic component 30 can be increased.

（実施の形態２）
次に、図２および図３を参照して、本発明の実施の形態２について説明する。本実施の形態に係るプリント基板およびその製造方法は、基本的には、実施の形態１に係るプリント基板およびその製造方法と同様の構成を有するが、回路基材１１の主表面側に電子部品３０の銅ベースと熱的および電気的に接続される回路パターン１６が形成されている点で異なる。 (Embodiment 2)
Next, a second embodiment of the present invention will be described with reference to FIG. 2 and FIG. The printed circuit board and the manufacturing method thereof according to the present embodiment basically have the same configuration as the printed circuit board and the manufacturing method thereof according to the first embodiment, but an electronic component is provided on the main surface side of the circuit substrate 11. The difference is that a circuit pattern 16 is formed which is thermally and electrically connected to 30 copper bases.

電子部品３０に対して熱伝導性部材１３が小さく、はんだ２０による接合面積が小さい場合、例えば、電子部品３０の外形が１０ｍｍ角以上である場合に、熱伝導性部材１３の径が５ｍｍ程度である場合には、熱伝導性部材１３の外周を囲うように回路パターン１６を形成し、回路パターン１６と電子部品３０とをはんだ２２によって接続してもよい。さらにこのとき、回路パターン１６と熱伝導性部材１３とを熱的および電気的に接続してもよい。   When the heat conductive member 13 is small with respect to the electronic component 30 and the bonding area by the solder 20 is small, for example, when the outer shape of the electronic component 30 is 10 mm square or more, the diameter of the heat conductive member 13 is about 5 mm. In some cases, the circuit pattern 16 may be formed so as to surround the outer periphery of the heat conductive member 13, and the circuit pattern 16 and the electronic component 30 may be connected by the solder 22. Further, at this time, the circuit pattern 16 and the heat conductive member 13 may be connected thermally and electrically.

本実施の形態における電子部品３０は、電子部品３０の銅ベースからはんだ２０経て熱伝導性部材１３へと至る熱経路に加えて、電子部品３０の銅ベースからはんだ２２および回路パターン１６を経て熱伝導性部材１３に至る熱経路を有する。この場合、新たに設けられた熱経路によって、熱抵抗を低減することができる。   The electronic component 30 in the present embodiment heats from the copper base of the electronic component 30 through the solder 22 and the circuit pattern 16 in addition to the heat path from the copper base of the electronic component 30 through the solder 20 to the heat conductive member 13. It has a heat path to the conductive member 13. In this case, the thermal resistance can be reduced by the newly provided heat path.

また、本実施の形態における電子部品３０は、パワー半導体素子から端子３１を経て回路パターン１５へと至る電流経路に加えて、電子部品３０の銅ベースからはんだ２０，２２を経て回路パターン１６および熱伝導性部材１３に至る電流経路を有する。回路パターン１６に加えて熱伝導性部材１３も電流経路として用いることができるため、電気抵抗を低減することができる。なお、回路パターン１５と回路パターン１６とは、絶縁性部材１８によって電気的に絶縁されている。例えば、絶縁性部材１８の一部は、回路パターン１６の外周を囲むように形成されている。また、絶縁性部材１８の一部は、回路パターン１５の外周を囲むように形成されている。   In addition to the current path from the power semiconductor element to the circuit pattern 15 through the terminal 31, the electronic component 30 in the present embodiment has the circuit pattern 16 and the heat from the copper base of the electronic component 30 through the solders 20 and 22. It has a current path to the conductive member 13. Since the heat conductive member 13 can be used as a current path in addition to the circuit pattern 16, the electric resistance can be reduced. The circuit pattern 15 and the circuit pattern 16 are electrically insulated by the insulating member 18. For example, a part of the insulating member 18 is formed so as to surround the outer periphery of the circuit pattern 16. A part of the insulating member 18 is formed so as to surround the outer periphery of the circuit pattern 15.

図２を参照して、スルーホール１２の側壁には導電性膜１７が形成されていてもよい。導電性膜１７は、回路パターン１６と熱伝導性部材１３およびはんだ２０とを電気的に接続する役割を担う。この結果、回路パターン１６と熱伝導性部材１３およびはんだ２０とを良好に接続することができ、電気抵抗を低減することができる。導電性膜１７は、例えば、銅などの金属からなる膜を、例えばめっき法などを用いて形成してもよい。この場合、スルーホール１２を形成する工程（Ｓ０２）後であって、熱伝導性部材１３をスルーホール１２に圧入する工程（Ｓ０３）の前に、スルーホール１２の側壁に導電性膜を形成すればよい。なお、本実施の形態において、導電性膜１７は、スルーホール１２の側壁の一部に設けられていてもよい。このようにしても、回路パターン１６と熱伝導性部材１３およびはんだ２０とを良好に接続することができ、電気抵抗を低減することができる。   Referring to FIG. 2, conductive film 17 may be formed on the side wall of through hole 12. The conductive film 17 plays a role of electrically connecting the circuit pattern 16 to the heat conductive member 13 and the solder 20. As a result, the circuit pattern 16 and the heat conductive member 13 and the solder 20 can be connected well, and the electrical resistance can be reduced. As the conductive film 17, for example, a film made of a metal such as copper may be formed using, for example, a plating method. In this case, a conductive film is formed on the side wall of the through hole 12 after the step (S02) of forming the through hole 12 and before the step of pressing the heat conductive member 13 into the through hole 12 (S03). That's fine. In the present embodiment, the conductive film 17 may be provided on a part of the side wall of the through hole 12. Even if it does in this way, the circuit pattern 16, the heat conductive member 13, and the solder 20 can be connected favorably, and electrical resistance can be reduced.

本実施の形態においても、流出防止部材１４を、回路基材１１の主表面上であってスルーホール１２を囲うように設けることによって、はんだ２０が熱伝導性部材１３の周囲に流出することを抑制することができる。このとき、流出防止部材１４は、導電性膜１７および回路パターン１６上に形成してもよい。その結果、実施の形態１と同様の効果を得ることができる。   Also in the present embodiment, by providing the outflow prevention member 14 on the main surface of the circuit substrate 11 so as to surround the through hole 12, the solder 20 flows out around the heat conductive member 13. Can be suppressed. At this time, the outflow prevention member 14 may be formed on the conductive film 17 and the circuit pattern 16. As a result, the same effect as in the first embodiment can be obtained.

また、図３を参照して、流出防止部材１４を、スルーホール１２の外周端部よりも外側においてスルーホール１２を囲うように形成してもよい。このようにすることで、はんだ２０が回路パターン１６および熱伝導性部材１３の両方に接合するため、回路パターン１６と、熱伝導性部材１３と、はんだ２０とを良好に接続することができ、電気抵抗を低減することができる。この場合にも、流出防止部材１４によって、はんだ２０が回路パターン１６上の流出防止部材１４より外周側の領域に流出することを抑制することができる。その結果、実施の形態１と同様の効果を得ることができる。なお、図３の例では、スルーホール１２の側壁に導電性膜が形成されていないが、当該側壁に導電性膜が形成されていてもよい。   Further, referring to FIG. 3, the outflow prevention member 14 may be formed so as to surround the through hole 12 outside the outer peripheral end portion of the through hole 12. By doing in this way, since the solder 20 is bonded to both the circuit pattern 16 and the heat conductive member 13, the circuit pattern 16, the heat conductive member 13, and the solder 20 can be satisfactorily connected. Electric resistance can be reduced. Also in this case, the outflow prevention member 14 can suppress the solder 20 from flowing out to the region on the outer peripheral side of the outflow prevention member 14 on the circuit pattern 16. As a result, the same effect as in the first embodiment can be obtained. In the example of FIG. 3, the conductive film is not formed on the side wall of the through hole 12, but a conductive film may be formed on the side wall.

（実施の形態３）
以下、図４および図５を参照して、本発明の実施の形態３について説明する。本実施の形態に係るプリント基板およびその製造方法は、基本的には、実施の形態２に係るプリント基板およびその製造方法と同様の構成を備えるが、流出防止部材１４の外周側であって、電子部品３０の下にビア７０が形成されている点で異なる。 (Embodiment 3)
Hereinafter, Embodiment 3 of the present invention will be described with reference to FIG. 4 and FIG. The printed circuit board and the manufacturing method thereof according to the present embodiment are basically provided with the same configuration as the printed circuit board and the manufacturing method thereof according to the second embodiment, but on the outer peripheral side of the outflow prevention member 14, The difference is that a via 70 is formed under the electronic component 30.

図５は、本実施の形態に係るプリント基板の製造方法において、流出防止部材１４を形成する工程（Ｓ０４）の後であって、回路基材１１の主表面にはんだを塗布する工程（Ｓ０５）前のプリント基板１０を、回路基材１１の主表面側から見たときの上面図である。ビア７０は、電子部品下であって、スルーホール１２を囲む領域に複数個形成されている。ビア７０は、回路パターン１６を貫通するように形成されている。また、回路パターン１５は絶縁性部材１８に囲まれて複数形成されている。   FIG. 5 is a step (S05) of applying solder to the main surface of the circuit substrate 11 after the step (S04) of forming the outflow prevention member 14 in the method for manufacturing a printed circuit board according to the present embodiment. FIG. 3 is a top view when the previous printed circuit board 10 is viewed from the main surface side of the circuit substrate 11. A plurality of vias 70 are formed in a region surrounding the through hole 12 below the electronic component. The via 70 is formed so as to penetrate the circuit pattern 16. A plurality of circuit patterns 15 are formed surrounded by the insulating member 18.

ビア７０は、スルーホール１２を形成する工程（Ｓ０２）において、スルーホール１２と同様に形成することができる。例えばドリルを用いて回路基材１１に対して穴開け加工することによって形成することができる。ビア７０には、はんだ２２を流入させることによって、電子部品３０からはんだ２２および伝熱材４０を経て放熱部材５０に至る新たな熱経路を設けることができ、熱抵抗をさらに低減することができる。   The via 70 can be formed in the same manner as the through hole 12 in the step of forming the through hole 12 (S02). For example, it can be formed by drilling the circuit substrate 11 using a drill. By introducing the solder 22 into the via 70, a new heat path from the electronic component 30 to the heat radiating member 50 through the solder 22 and the heat transfer material 40 can be provided, and the thermal resistance can be further reduced. .

このとき、回路基材１１の裏面側に、回路パターン１６と電気的に接続される裏面回路パターン１９を設けてもよい。この場合には、ビア７０に流入させたはんだ２２は、回路パターン１６と裏面回路パターン１９とを電気的に接続することができる。   At this time, a back surface circuit pattern 19 that is electrically connected to the circuit pattern 16 may be provided on the back surface side of the circuit substrate 11. In this case, the solder 22 flowing into the via 70 can electrically connect the circuit pattern 16 and the back surface circuit pattern 19.

なお、ビア７０の側壁には、導電性膜７１が形成されていてもよい。導電性膜７１は、回路パターン１６と熱伝導性部材１３およびはんだ２０とを電気的に接続する役割を担う。導電性膜７１を構成する材料は、例えば、銅メッキとすることができる。この結果、回路パターン１６と、裏面回路パターン１９と、はんだ２２とを良好に接続することができ、電気抵抗を低減することができる。   A conductive film 71 may be formed on the sidewall of the via 70. The conductive film 71 plays a role of electrically connecting the circuit pattern 16 to the heat conductive member 13 and the solder 20. The material constituting the conductive film 71 can be, for example, copper plating. As a result, the circuit pattern 16, the back surface circuit pattern 19, and the solder 22 can be satisfactorily connected, and the electrical resistance can be reduced.

本実施の形態においても、流出防止部材１４を、回路基材１１の主表面上であってスルーホール１２を囲うように設けることによって、はんだ２０が熱伝導性部材１３の周囲に流出することを抑制することができる。その結果、実施の形態１および２と同様の効果を得ることができる。   Also in the present embodiment, by providing the outflow prevention member 14 on the main surface of the circuit substrate 11 so as to surround the through hole 12, the solder 20 flows out around the heat conductive member 13. Can be suppressed. As a result, the same effect as in the first and second embodiments can be obtained.

今回開示された実施の形態および実施例はすべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味、および範囲内でのすべての変更が含まれることが意図される。   The embodiments and examples disclosed herein are illustrative in all respects and should not be construed as being restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

１０ プリント基板、１１ 回路基材、１２ スルーホール、１３ 熱伝導性部材、１４ 流出防止部材、１５，１６ 回路パターン、１７，７１ 導電性膜、１８ 絶縁性部材（外周側流出防止部材）、１９ 裏面回路パターン、２０，２１，２２ はんだ、３０ 電子部品、３１ 端子、４０ 伝熱材、５０ 放熱部材、７０ ビア。   DESCRIPTION OF SYMBOLS 10 Printed circuit board, 11 Circuit base material, 12 Through hole, 13 Thermal conductive member, 14 Outflow prevention member, 15, 16 Circuit pattern, 17, 71 Conductive film, 18 Insulating member (outer peripheral side outflow prevention member), 19 Back circuit pattern, 20, 21, 22 Solder, 30 Electronic component, 31 Terminal, 40 Heat transfer material, 50 Heat dissipation member, 70 Via.

Claims (10)

回路基材と、
前記回路基材の主表面上に載置される電子部品と、
前記回路基材の前記主表面と前記回路基材の厚さ方向において対向する裏面側に配置される放熱部材と、
前記電子部品と前記放熱部材とを接続する熱伝導性部材とを備え、
前記回路基材には、前記電子部品が載置される領域に、前記回路基材の前記主表面から前記裏面に貫通するスルーホールが形成されており、
前記熱伝導性部材は前記スルーホール内に設けられて、
前記主表面側に位置する前記熱伝導性部材の端部は前記電子部品とはんだを介して接続されており、前記裏面側に位置する前記熱伝導性部材の端部は前記放熱部材と接続されており、
さらに、前記回路基材の前記主表面上において、前記スルーホールの開口端部を囲うように形成された流出防止部材を備える、プリント基板。 A circuit substrate;
An electronic component placed on the main surface of the circuit substrate;
A heat dissipating member disposed on the back side facing the main surface of the circuit substrate and the thickness direction of the circuit substrate;
A heat conductive member that connects the electronic component and the heat dissipation member;
In the circuit base material, a through hole penetrating from the main surface of the circuit base material to the back surface is formed in a region where the electronic component is placed,
The thermally conductive member is provided in the through hole,
The end of the thermally conductive member located on the main surface side is connected to the electronic component via solder, and the end of the thermally conductive member located on the back side is connected to the heat dissipation member. And
Furthermore, on the said main surface of the said circuit base material, a printed circuit board provided with the outflow prevention member formed so that the opening edge part of the said through hole might be enclosed. 前記流出防止部材は、前記回路基材の前記主表面上において、前記スルーホールの前記開口端部に沿って形成されている、請求項１に記載のプリント基板。   The printed circuit board according to claim 1, wherein the outflow prevention member is formed along the opening end of the through hole on the main surface of the circuit base material. 前記回路基材の前記主表面上において、前記流出防止部材の外周側に位置し、前記スルーホールの前記開口端部に沿って形成されている、外周側流出防止部材をさらに備える、請求項１または２に記載のプリント基板。   The outer periphery side outflow prevention member which is located in the outer peripheral side of the said outflow prevention member on the said main surface of the said circuit base material, and is formed along the said opening edge part of the said through hole is further provided. Or the printed circuit board of 2. 前記スルーホールの平面形状は円形状であり、
前記熱伝導性部材は円柱状に形成されて、前記スルーホールと嵌合する、請求項１〜３のいずれか１項に記載のプリント基板。 The planar shape of the through hole is circular,
The printed circuit board according to any one of claims 1 to 3, wherein the thermal conductive member is formed in a columnar shape and fits into the through hole. 前記流出防止部材は前記電子部品の下に配置され、
前記流出防止部材の外周側であって前記電子部品の下に位置する領域において、前記回路基材の前記主表面から前記裏面に貫通するビアが形成されており、
前記ビアにははんだが充填され、
前記電子部品と前記放熱部材とは、前記はんだを介して接続されている、請求項１〜４のいずれか１項に記載のプリント基板。 The outflow prevention member is disposed under the electronic component,
In a region located on the outer peripheral side of the outflow prevention member and below the electronic component, a via penetrating from the main surface of the circuit base material to the back surface is formed,
The via is filled with solder,
The printed circuit board according to claim 1, wherein the electronic component and the heat dissipation member are connected via the solder. 前記流出防止部材を構成する部材は、レジストである、請求項１〜５のいずれか１項に記載のプリント基板。   The printed circuit board according to claim 1, wherein the member constituting the outflow prevention member is a resist. 前記熱伝導性部材は、前記電子部品と対向する面に凹部を有する、請求項１〜６のいずれか１項に記載のプリント基板。   The printed circuit board according to claim 1, wherein the thermally conductive member has a recess on a surface facing the electronic component. 前記スルーホールの側壁に導電性膜が形成されている、請求項１〜７のいずれか１項に記載のプリント基板。   The printed circuit board according to claim 1, wherein a conductive film is formed on a side wall of the through hole. 前記回路基材の前記主表面上において、前記スルーホールの前記開口端部を囲うように回路パターンが形成されており、
前記流出防止部材は、前記回路パターン上に形成されている、請求項１〜８のいずれか１項に記載のプリント基板。 On the main surface of the circuit substrate, a circuit pattern is formed so as to surround the opening end of the through hole,
The printed circuit board according to claim 1, wherein the outflow prevention member is formed on the circuit pattern. 前記回路基材の前記裏面上において、前記スルーホールを囲うように裏面回路パターンが形成されており、
前記放熱部材は、前記裏面回路パターンと接続されている、請求項１〜請求項９のいずれか１項に記載のプリント基板。 On the back surface of the circuit substrate, a back circuit pattern is formed so as to surround the through hole,
The printed circuit board according to claim 1, wherein the heat dissipation member is connected to the back surface circuit pattern.
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016209903A1 (en) 2015-06-11 2016-12-15 Aikokiki Manufacturing Co., Ltd. Printed circuit board and electronic device
JP2017108044A (en) * 2015-12-11 2017-06-15 株式会社Ｄａｉｗａ Wiring board laminate and method of manufacturing the same
CN108513433A (en) * 2018-04-24 2018-09-07 苏州维信电子有限公司 A kind of flexible circuit board PAD and its manufacturing method every tin
JP2018147996A (en) * 2017-03-03 2018-09-20 株式会社ジェイテクト Control board and manufacturing method for the same
DE102018206431A1 (en) 2017-04-25 2018-10-25 Omron Automotive Electronics Co., Ltd. PCB PLATE MODULE AND ELECTRONIC DEVICE
JP2019009153A (en) * 2017-06-20 2019-01-17 大陽工業株式会社 Wiring board, electronic device, and method of manufacturing electronic device
CN110622627A (en) * 2017-05-26 2019-12-27 三菱电机株式会社 Semiconductor device with a plurality of semiconductor chips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2008078271A (en) * 2006-09-20 2008-04-03 Sumitomo Wiring Syst Ltd Printed-circuit board equipped with heat dissipating structure, and its manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2008078271A (en) * 2006-09-20 2008-04-03 Sumitomo Wiring Syst Ltd Printed-circuit board equipped with heat dissipating structure, and its manufacturing method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016209903A1 (en) 2015-06-11 2016-12-15 Aikokiki Manufacturing Co., Ltd. Printed circuit board and electronic device
US9769916B2 (en) 2015-06-11 2017-09-19 Omron Automotive Electronics Co., Ltd. Printed circuit board and electronic device
JP2017108044A (en) * 2015-12-11 2017-06-15 株式会社Ｄａｉｗａ Wiring board laminate and method of manufacturing the same
JP2018147996A (en) * 2017-03-03 2018-09-20 株式会社ジェイテクト Control board and manufacturing method for the same
DE102018206431A1 (en) 2017-04-25 2018-10-25 Omron Automotive Electronics Co., Ltd. PCB PLATE MODULE AND ELECTRONIC DEVICE
CN108738225A (en) * 2017-04-25 2018-11-02 欧姆龙汽车电子株式会社 Circuit board module and electronic device
US10178754B2 (en) 2017-04-25 2019-01-08 Omron Automotive Electronics Co., Ltd. Circuit board module and electronic device
CN110622627A (en) * 2017-05-26 2019-12-27 三菱电机株式会社 Semiconductor device with a plurality of semiconductor chips
JPWO2018216646A1 (en) * 2017-05-26 2020-01-23 三菱電機株式会社 Semiconductor device
CN110622627B (en) * 2017-05-26 2022-08-16 三菱电机株式会社 Semiconductor device with a plurality of semiconductor chips
JP2019009153A (en) * 2017-06-20 2019-01-17 大陽工業株式会社 Wiring board, electronic device, and method of manufacturing electronic device
CN108513433A (en) * 2018-04-24 2018-09-07 苏州维信电子有限公司 A kind of flexible circuit board PAD and its manufacturing method every tin

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