JP2014007362A - Power element heat dissipation structure and manufacturing method therefor - Google Patents

Power element heat dissipation structure and manufacturing method therefor Download PDF

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JP2014007362A
JP2014007362A JP2012144059A JP2012144059A JP2014007362A JP 2014007362 A JP2014007362 A JP 2014007362A JP 2012144059 A JP2012144059 A JP 2012144059A JP 2012144059 A JP2012144059 A JP 2012144059A JP 2014007362 A JP2014007362 A JP 2014007362A
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power element
heat dissipation
dissipation structure
thin plate
plate material
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Yoshito Imai
義人 今井
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

PROBLEM TO BE SOLVED: To obtain a power element heat dissipation structure which excels in workability during assembly and disassembly and a manufacturing method therefor.SOLUTION: In a power element heat dissipation structure, heat generated by a power element 5 is conveyed from a product fitting heat sink 8 to a product casing body 7 having an opening 7a formed in the top surface thereof, whereby heat is dissipated. The power element heat dissipation structure comprises: the product fitting heat sink 8 disposed on the inner surface of the product casing body 7 in an inclined state, with the tip side down; a sheet member 2 disposed on the product fitting heat sink 8; a power element 5 having a rein encapsulated body section and a lead terminal extending from the body section, the body section being fixed in place on the sheet member 2, with the lead terminal directed diagonally downward; a printed circuit board 1 housed in the product casing body 7 so as not to overlap the power element, with the lead terminals thereof soldered; and a power element mounting board lockscrew 9 for fixing the sheet member 2 disposed on the product fitting heat sink 8 to the product fitting heat sink 8 by fastening together from the sheet member 2 side.

Description

本発明は、複数の回路ユニット、パワー素子やリアクトル、コイルを含む電機機器部品、放熱構造体から構成され、パワー素子が発する熱を放熱構造体に伝熱する構成の電機機器において、基板上のパワー素子から放熱構造体への伝熱を、製造及びサービス作業が容易かつ安価に実現したパワー素子放熱構造及びその製造方法に関する。   The present invention comprises an electrical equipment component including a plurality of circuit units, power elements, reactors, and coils, and a heat dissipation structure, and an electrical equipment configured to transfer heat generated by the power element to the heat dissipation structure. The present invention relates to a power element heat dissipation structure that realizes heat transfer from a power element to a heat dissipation structure easily and inexpensively and a manufacturing method thereof.

複数のパワー素子や、リアクトル等の電気発熱体から構成される電機機器においては、発熱部品を外気等で直接冷却すると、塵埃や湿度の影響を受けることになるため、筐体を構成する放熱構造体に伝熱し、間接的に放熱する構造が用いられている。   In electrical equipment composed of multiple power elements and electric heating elements such as reactors, the heat-radiating structure that constitutes the housing is affected by dust and humidity when the heat-generating components are directly cooled by the outside air. A structure that transfers heat to the body and indirectly releases heat is used.

これらの構成において、インバータ等を構成するパワー素子は発熱量が大きく、また端子の使用電圧が高電圧であることから、外気冷却が可能な筐体ヒートシンクに取り付ける際には、伝熱性とともに絶縁性を考慮した伝熱構造を得る必要があった。   In these configurations, the power elements that make up inverters, etc. generate a large amount of heat, and the operating voltage of the terminals is high. It was necessary to obtain a heat transfer structure that considered

しかし、パワー素子はスイッチング利用されることから、パワーラインの配線長の最短化やゲート駆動回路の集積化が要求され、基板上に個別半導体パワー素子を安価に実装する方法が要望されてきた。また、パワー素子と筐体との間の伝熱材料として、伝熱性絶縁シートを用いる場合においては、市場でのパワー素子交換は、伝熱性絶縁シートの交換も必要であり、交換作業での容易性が必要とされてきた。   However, since power elements are used for switching, minimization of power line length and integration of gate drive circuits are required, and a method for mounting individual semiconductor power elements on a substrate at low cost has been demanded. In addition, when using a heat transfer insulating sheet as a heat transfer material between the power element and the housing, it is necessary to replace the heat transfer insulating sheet on the market. Sex has been needed.

このような複数のパワー素子の製品筐体放熱部材への取付構造としては、例えばトランジスタ等の電子部品を搭載した基板を底面と平行に設置する構造において、パワー素子を筐体放熱面に固定取付後、基板の接続該当穴に貫通挿入し、基板とパワー素子端子とをはんだ付けすることなどが提案されている。   As a structure for mounting a plurality of power elements to a product casing heat dissipation member, for example, in a structure in which a substrate on which electronic components such as transistors are mounted is installed in parallel to the bottom surface, the power element is fixedly mounted on the casing heat dissipation surface. After that, it has been proposed that the board and the power element terminal are soldered by being inserted into a corresponding connection hole of the board.

特許文献１には、複数のパワー素子を底面ヒートシンクに伝熱させる構成が示されている。特許文献１において、パワー素子は筐体放熱体の傾斜面にワッシャ付きネジにて固定され、リード端子は上方を向いて取り付けられる。そして、プリント基板をこれらの上方から、基板の貫通穴にリード端子が挿通するように組み付けた後、リード端子と基板とをはんだ付けする。特許文献１では、パワー素子を基板下面側に放熱する方法と、パワー素子を傾けて取り付けることでリード端子長を短くすることを開示している。   Patent Document 1 discloses a configuration in which a plurality of power elements are transferred to a bottom heat sink. In Patent Document 1, the power element is fixed to the inclined surface of the case radiator with a screw with a washer, and the lead terminal is attached facing upward. Then, after assembling the printed board from above so that the lead terminal is inserted into the through hole of the board, the lead terminal and the board are soldered. Patent Document 1 discloses a method of dissipating heat from the power element to the lower surface side of the substrate and shortening the lead terminal length by attaching the power element at an angle.

特開２００３−３０９３８４号公報JP 2003-309384 A

しかしながら、上記特許文献１に開示される構成では、組み付け作業は困難とはならないが、パワー素子や基板を交換するとなると、パワー素子のリード端子とプリント基板とのはんだ付けを解除しなければならないため、パワー素子や基板の交換は困難である。   However, in the configuration disclosed in Patent Document 1, assembly work is not difficult. However, when the power element or the board is replaced, it is necessary to release the soldering between the lead terminal of the power element and the printed board. It is difficult to replace the power element and the substrate.

本体筐体底面にパワー素子を取り付けることで放熱を行う構造では、製品組み付け工程におけるパワー素子取付時には、パワー素子のねじ止めに使用するドライバーを上方から操作することが可能であり、プリント基板へのパワー素子の端子はんだ付け時においても、基板上方からはんだ付け作業を行える利点があった。   In a structure that dissipates heat by attaching a power element to the bottom of the main unit housing, when installing the power element in the product assembly process, it is possible to operate the screwdriver used to screw the power element from above, There is an advantage that soldering work can be performed from above the board even when soldering the terminals of the power element.

しかしながら、複数のパワー素子を放熱する必要がある場合においては、基板と平行な製品底面を利用する方法では、基板を２枚重ねて筐体内に収容するような形態の製品においては上側の基板は製品底面から放熱させることができず放熱量不足となるため、プリント基板取付面と垂直な製品側面にも放熱面を設けることが要望されてきた。   However, when it is necessary to dissipate heat from a plurality of power elements, the method using the bottom of the product parallel to the substrate is such that the upper substrate is used in a product having a configuration in which two substrates are stacked and accommodated in a housing. Since heat cannot be radiated from the bottom of the product and the amount of heat radiated is insufficient, it has been desired to provide a heat radiating surface also on the side of the product perpendicular to the printed board mounting surface.

従来の製品組み付け方法では、プリント基板面と製品筐体放熱面とが略垂直となるように取り付ける場合には、基板を地面に平行にした状態で製品側面への放熱面にパワー素子を取り付けるためには、パワー素子のねじ止めに使用するドライバーを水平に保持して操作する必要があることから、上方からの作業が困難であった。   In the conventional product assembly method, when the printed circuit board surface and the product housing heat dissipation surface are mounted so as to be substantially vertical, the power element is attached to the heat dissipation surface on the side of the product with the substrate parallel to the ground. Since it is necessary to hold and operate a screwdriver used for screwing the power element horizontally, it is difficult to work from above.

このため、パワー素子搭載基板を分離させ、コネクタやリード線で他基板と接続する方法が用いられてきた。しかし、基板組み付け工程の最中にパワー素子搭載基板の組み付け行わねばならず、作業工程が煩雑である。また、スイッチング素子であるパワー素子のリード長が延長されることから、妨害波が増加するなど、作業性・性能面で課題があった。   For this reason, a method of separating the power element mounting substrate and connecting it to another substrate with a connector or a lead wire has been used. However, it is necessary to assemble the power element mounting substrate during the substrate assembling process, and the work process is complicated. In addition, since the lead length of the power element, which is a switching element, is extended, there are problems in terms of workability and performance, such as an increase in disturbing waves.

本発明は、上記に鑑みてなされたものであって、組付・分解時の作業性に優れたパワー素子放熱構造及びその製造方法を得ることを目的とする。   This invention is made | formed in view of the above, Comprising: It aims at obtaining the power element thermal radiation structure excellent in the workability | operativity at the time of an assembly | attachment and decomposition | disassembly, and its manufacturing method.

上述した課題を解決し、目的を達成するために、本発明は、パワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造であって、先端側が下がるように傾斜した状態で製品筐体の内側面に設置された放熱構造体と、放熱構造体の上に配置された薄板材と、樹脂封止された本体部分と、本体部分から伸びるリード端子とを有し、リード端子を斜め下に向けた状態で本体部分が薄板材の上に固定されたパワー素子と、リード端子がはんだ付けされて、パワー素子に被さらないように製品筐体に収容されたプリント基板と、放熱構造体の上に配置された薄板材を、薄板材側から放熱構造体に共締め固定する固定ねじと、を備えることを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention provides a power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening formed on the top surface to dissipate the heat. A heat dissipating structure installed on the inner surface of the product housing in a state where the tip side is inclined, a thin plate disposed on the heat dissipating structure, a resin-sealed main body part, and a main body A power element with a lead terminal extending from the part, with the main body part fixed on a thin plate with the lead terminal facing diagonally downward, and the lead terminal being soldered so as not to cover the power element A printed circuit board housed in the product housing, and a fixing screw that fastens and fixes the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side.

本発明によれば、組付時だけでなく分解時の作業性に優れたパワー素子放熱構造及びその製造方法を実現できるという効果を奏する。   According to the present invention, there is an effect that it is possible to realize a power element heat dissipation structure excellent in workability not only at the time of assembly but also at the time of disassembly and a manufacturing method thereof.

図１は、本発明にかかるパワー素子放熱構造の実施の形態の構成を示す断面図である。FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a power element heat dissipation structure according to the present invention. 図２は、パワー素子を搭載するプリント基板の構造を示す図である。FIG. 2 is a diagram showing a structure of a printed circuit board on which the power element is mounted. 図３は、パワー素子搭載基板の構成を示す図である。FIG. 3 is a diagram showing the configuration of the power element mounting substrate. 図４は、製品ヒートシンクへ組み付ける際のパワー素子搭載基板の状態を示す図である。FIG. 4 is a diagram illustrating a state of the power element mounting substrate when assembled to the product heat sink. 図５は、本発明にかかるパワー素子放熱構造の実施の形態２のプリント基板の構造を示す図である。FIG. 5 is a diagram showing the structure of the printed circuit board according to the second embodiment of the power element heat dissipation structure according to the present invention. 図６は、パワー素子搭載基板の構成を示す図である。FIG. 6 is a diagram showing the configuration of the power element mounting substrate. 図７は、本発明にかかるパワー素子放熱構造の実施の形態３におけるパワー素子搭載基板の構成を示す図である。FIG. 7 is a diagram showing a configuration of a power element mounting substrate in a third embodiment of the power element heat dissipation structure according to the present invention. 図８は、本発明にかかるパワー素子放熱構造の実施の形態４におけるパワー素子搭載基板の構成を示す図である。FIG. 8 is a diagram showing a configuration of a power element mounting substrate in a fourth embodiment of the power element heat dissipation structure according to the present invention.

以下に、本発明にかかるパワー素子放熱構造及びその製造方法の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Embodiments of a power element heat dissipation structure and a manufacturing method thereof according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

実施の形態１．
図１は、本発明にかかるパワー素子放熱構造の実施の形態の構成を示す断面図である。パワー素子放熱構造は、天面に開口７ａが形成された製品筐体７の側面に設置された製品取付ヒートシンク８に、パワー素子搭載基板２０をパワー素子搭載基板固定ねじ９により熱的に接続して放熱する構造となっており、図１では製品筐体７を切断して内部を可視化して示している。製品取付ヒートシンク８は、先端側が下がるように傾斜した片持ち状態で製品筐体７の側面に設置されている。プリント基板１は、パワー素子５に被さらない状態で製品筐体７に収容されている。放熱部品としてのパワー素子５から放熱構造体としての製品取付ヒートシンク８への伝熱構造において、パワー素子５と製品取付ヒートシンク８との間に、薄板材２を介在させている。薄板材２の材料としては、鉄やアルミニウムなどの金属材料の他、伝熱性樹脂を適用することも可能である。薄板材２は、パワー素子５を搭載するプリント基板１上に配置され、絶縁シート４を介してパワー素子５がパワー素子固定ねじ３で薄板材２にねじ止めされることにより、製品組付に先立ってパワー素子搭載基板２０として基板製造工程において予め組み立てられる。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a power element heat dissipation structure according to the present invention. In the power element heat dissipation structure, the power element mounting board 20 is thermally connected to the product mounting heat sink 8 installed on the side surface of the product casing 7 having the opening 7a formed on the top surface by the power element mounting board fixing screw 9. In FIG. 1, the product casing 7 is cut and the inside is visualized. The product mounting heat sink 8 is installed on the side surface of the product housing 7 in a cantilever state inclined so that the front end side is lowered. The printed circuit board 1 is accommodated in the product housing 7 so as not to cover the power element 5. In the heat transfer structure from the power element 5 as the heat dissipating part to the product mounting heat sink 8 as the heat dissipating structure, the thin plate 2 is interposed between the power element 5 and the product mounting heat sink 8. As a material of the thin plate material 2, in addition to a metal material such as iron or aluminum, a heat transfer resin can be applied. The thin plate material 2 is arranged on the printed circuit board 1 on which the power element 5 is mounted, and the power element 5 is screwed to the thin plate material 2 with the power element fixing screw 3 through the insulating sheet 4, thereby assembling the product. Prior to assembly, the power element mounting substrate 20 is assembled in advance in the substrate manufacturing process.

図２は、パワー素子を搭載するプリント基板の構造を示す図である。プリント基板１は、プリント基板１を概ね横断するように設けられたスリット１ａによりパワー素子実装部１ｂと組付時除去部１ｃとに分けられており、パワー素子実装部１ｂと組付時除去部１ｃとは、切断部１ｄにおいて部分的に繋がっている。   FIG. 2 is a diagram showing a structure of a printed circuit board on which the power element is mounted. The printed circuit board 1 is divided into a power element mounting part 1b and an assembling removal part 1c by a slit 1a provided so as to substantially cross the printed circuit board 1, and the power element mounting part 1b and the assembling removal part are assembled. 1c is partially connected in the cutting part 1d.

図３は、パワー素子搭載基板の構成を示す図であり、図３（ａ）は上面図、図３（ｂ）は側面図である。薄板材２はプリント基板１上に配置されている。プリント基板１上に配置された薄板材２には、絶縁シート４を介してパワー素子５がパワー素子固定ねじ３でねじ止めされている。複数のパワー素子５を基板穴に挿通させ、はんだ槽にて一括はんだ付けを実施する。ここではパワー素子５を二つ配置する構成を例としているが、これよりも多くのパワー素子５を配置する構成であっても良いことは言うまでもない。構造材としての薄板材２、絶縁シート４及びパワー素子５を一体化したパワー素子ユニット１５を予め作成しプリント基板１に取り付けることで、パワー素子搭載基板２０の組付作業を簡略化できる。   3A and 3B are diagrams showing the configuration of the power element mounting substrate, in which FIG. 3A is a top view and FIG. 3B is a side view. The thin plate material 2 is disposed on the printed circuit board 1. A power element 5 is screwed to a thin plate material 2 disposed on the printed board 1 with a power element fixing screw 3 via an insulating sheet 4. A plurality of power elements 5 are inserted into the board holes, and batch soldering is performed in a solder bath. Here, a configuration in which two power elements 5 are arranged is taken as an example, but it goes without saying that a configuration in which more power elements 5 are arranged may be used. By assembling in advance the power element unit 15 in which the thin plate material 2 as the structural material, the insulating sheet 4 and the power element 5 are integrated and attaching the power element unit 15 to the printed circuit board 1, the assembly work of the power element mounting board 20 can be simplified.

なお、パワー素子５を構成する封止樹脂及び足部の耐トラッキング性改善を目的に、パワー素子５の端子沿面と絶縁シート４との間に耐トラッキング改善剤を塗布し固定することも可能である。パワー素子５の端子沿面と絶縁シート４との間に耐トラッキング改善剤を塗布してからパワー素子ユニット１５をプリント基板１上に組み付けることで、耐トラッキング性が低い樹脂材料で封止されたパワー素子５の耐トラッキング性を改善し、かつパワー素子搭載基板２０の交換が容易な構造を実現することが可能である。なお、薄板材２下の組付時除去部１ｃを除去せずに、製品組み付け性の改善のみを図っても良いことは言うまでもない。   In addition, for the purpose of improving the tracking resistance of the sealing resin and the foot part constituting the power element 5, it is also possible to apply and fix a tracking resistance improving agent between the terminal creepage of the power element 5 and the insulating sheet 4. is there. A power which is sealed with a resin material having low tracking resistance by applying a tracking resistance improving agent between the creeping surface of the power element 5 and the insulating sheet 4 and then assembling the power element unit 15 on the printed circuit board 1. It is possible to improve the tracking resistance of the element 5 and realize a structure in which the power element mounting substrate 20 can be easily replaced. Needless to say, the product assembling property may be improved without removing the assembling removal portion 1c under the thin plate material 2.

パワー素子５に予め端子整形を行い、薄板材２上に絶縁シート４を介してパワー素子固定ねじ３でねじ締めすることで、パワー素子ユニット１５を別工程にて組付することが容易であり、パワー素子５のリード端面側に必要に応じ耐トラッキング改善剤を塗布し、乾燥させることが可能となる。   It is easy to assemble the power element unit 15 in a separate process by performing terminal shaping on the power element 5 in advance and tightening the power element 5 on the thin plate material 2 via the insulating sheet 4 with the power element fixing screw 3. If necessary, a tracking resistance improving agent can be applied to the lead end face side of the power element 5 and dried.

図４は、製品ヒートシンクへ組み付ける際のパワー素子搭載基板の状態を示す図であり、図４（ａ）は上面図、図４（ｂ）は側面図である。組付が完了したパワー素子搭載基板２０を、製品取付ヒートシンク８に組み付ける際には、切断部１ｄで切り離すことによってパワー素子実装部１ｂと組付時除去部１ｃとを分離し、薄板材２下の組付時除去部１ｃを除去する。そして、薄板材２を製品取付ヒートシンク８と同じ傾斜角度となるように折り曲げ、製品筐体７に傾いた状態で設置された製品取付ヒートシンク８の放熱面にパワー素子搭載基板２０を組み付ける。これにより、基板運搬や製品組み付けが容易で、省投影面積での実装が可能となる。   4A and 4B are views showing the state of the power element mounting substrate when assembled to the product heat sink, FIG. 4A is a top view, and FIG. 4B is a side view. When the assembled power element mounting substrate 20 is assembled to the product mounting heat sink 8, the power element mounting portion 1 b and the assembling removal portion 1 c are separated by being cut off by the cutting portion 1 d, and the thin plate member 2 below The assembling removal section 1c is removed. Then, the thin plate material 2 is bent so as to have the same inclination angle as that of the product mounting heat sink 8, and the power element mounting substrate 20 is assembled to the heat radiating surface of the product mounting heat sink 8 installed in a tilted state on the product housing 7. This facilitates board transportation and product assembly, and enables mounting with a reduced projection area.

薄板材２下の組付時除去部１ｃは、パワー素子搭載基板２０の組付時に熱抵抗の低減を目的として廃棄する。製品にパワー素子搭載基板２０を組み付ける際は、組付時除去部１ｃを除去し、斜めに設置してある製品取付ヒートシンク８にパワー素子搭載基板２０の薄板材２をパワー素子搭載基板固定ねじ９で取り付けることで、伝熱構造を得る（図１参照）。この製品組付工程において、ねじ締め面となる製品取付ヒートシンク８を傾斜させることにより、製品筐体７の上方からの開口７ａを通じてドライバーを操作する際の操作性を阻害することなく筐体７の側面へのパワー素子搭載基板２０の組み付けが可能となる。これにより、組付が容易であるとともに、保守交換においても特殊な工具を用いることなくパワー素子搭載基板２０の交換が可能な構造を実現できる。   The assembling removal section 1c under the thin plate 2 is discarded for the purpose of reducing thermal resistance when the power element mounting substrate 20 is assembled. When assembling the power element mounting substrate 20 to the product, the removal portion 1c at the time of assembly is removed, and the thin plate material 2 of the power element mounting substrate 20 is attached to the product mounting heat sink 8 installed obliquely. To obtain a heat transfer structure (see FIG. 1). In this product assembly process, by tilting the product mounting heat sink 8 serving as a screw fastening surface, the operability when operating the driver through the opening 7a from above the product housing 7 is not hindered. The power element mounting substrate 20 can be assembled to the side surface. As a result, it is possible to realize a structure that can be easily assembled and can replace the power element mounting substrate 20 without using a special tool in maintenance and replacement.

また、高温使用可能なＳｉＣパワー素子をパワー素子５として用いることで、パワー素子５と製品取付ヒートシンク８との間に、パワー素子５の耐熱温度以上の温度での連続耐熱性を有する樹脂、例えばポリフェニレンスルファイド（PolyPhenyleneSulfide：ＰＰＳ）樹脂を配置して、絶縁シート４を省略することができる。ＰＰＳ樹脂のような熱抵抗は大きいが絶縁性の高い樹脂は、絶縁シート４の材料となる熱抵抗が小さく絶縁性の高い樹脂よりも安価であるため、パワー素子放熱構造の製造コストを低減できる。   Further, by using a SiC power element that can be used at a high temperature as the power element 5, a resin having continuous heat resistance at a temperature equal to or higher than the heat resistance temperature of the power element 5 between the power element 5 and the product mounting heat sink 8, for example, A polyphenylene sulfide (PPS) resin can be disposed and the insulating sheet 4 can be omitted. A resin having a large thermal resistance such as PPS resin but having a high insulating property is less expensive than a resin having a small thermal resistance and a high insulating property as the material of the insulating sheet 4, so that the manufacturing cost of the power element heat dissipation structure can be reduced. .

本実施の形態によれば、基板実装工程でパワー素子５のリード接続工程が完了し、製品組付工程においては、ドライバーの操作性を阻害することが無く組付が可能となり、容易な組付性とともに保守交換においても特殊な工具を用いること無く修理が可能となる。   According to the present embodiment, the lead connection process of the power element 5 is completed in the board mounting process, and the assembly process can be performed without hindering the operability of the driver in the product assembly process. In addition to performance, repairs can be made without using special tools in maintenance replacement.

また、パワー素子５を薄板材２にねじ止めする際に、パワー素子５の位置ずれが発生せず、パワー素子搭載基板２０の製造後には外力等によるパワー素子５の足曲がりなども発生しにくいため、パワー素子搭載基板２０の管理が容易となる。また、パワー素子搭載基板２０の組付・交換の工程が簡素化されるため、組付及びサービスにおいて安定した品質が確保される。   Further, when the power element 5 is screwed to the thin plate member 2, the power element 5 is not displaced, and the power element mounting substrate 20 is less likely to be bent due to an external force or the like after the power element mounting substrate 20 is manufactured. Therefore, management of the power element mounting substrate 20 is facilitated. In addition, since the process of assembling and replacing the power element mounting substrate 20 is simplified, stable quality is ensured in assembling and service.

実施の形態２．
図５は、本発明にかかるパワー素子放熱構造の実施の形態２のプリント基板の構造を示す図である。本実施の形態ではプリント基板１の組付時除去部１ｃには、薄板材位置決め穴１ｅが形成されている。 Embodiment 2. FIG.
FIG. 5 is a diagram showing the structure of the printed circuit board according to the second embodiment of the power element heat dissipation structure according to the present invention. In the present embodiment, a thin plate material positioning hole 1e is formed in the assembling removal portion 1c of the printed circuit board 1.

図６は、パワー素子搭載基板の構成を示す図であり、図６（ａ）は上面図、図６（ｂ）は側面図である。薄板材２は周縁部に取付脚２ａが設けられており、取付脚２ａを薄板材位置決め穴１ｅに挿入することによって、プリント基板１の基板面に対して傾いた状態で組付時除去部１ｃ上に配置されている。薄板材２の傾斜角度は、製品取付ヒートシンク８の傾斜角度と同じである。プリント基板１上に配置された薄板材２には、絶縁シート４を介してパワー素子５がパワー素子固定ねじ３でねじ止めされている。   6A and 6B are diagrams showing the configuration of the power element mounting substrate, in which FIG. 6A is a top view and FIG. 6B is a side view. The thin plate member 2 is provided with mounting legs 2a at the peripheral portion. By inserting the mounting legs 2a into the thin plate member positioning holes 1e, the assembling removal portion 1c is tilted with respect to the substrate surface of the printed circuit board 1. Is placed on top. The inclination angle of the thin plate material 2 is the same as the inclination angle of the product mounting heat sink 8. A power element 5 is screwed to a thin plate material 2 disposed on the printed board 1 with a power element fixing screw 3 via an insulating sheet 4.

製品取付ヒートシンク８にパワー素子搭載基板２０を取り付ける際には、切断部１ｄで切り離すことによってパワー素子実装部１ｂと組付時除去部１ｃとを分離し、薄板材２下の組付時除去部１ｃを除去する。そして、製品筐体７に傾いた状態で設置された製品取付ヒートシンク８の放熱面にパワー素子搭載基板２０を組み付ける。これにより、基板運搬や製品組み付けが容易で、省投影面積での実装が可能となる。   When the power element mounting substrate 20 is attached to the product mounting heat sink 8, the power element mounting part 1b and the assembling removal part 1c are separated by being separated by the cutting part 1d, and the assembling removal part under the thin plate material 2 is separated. 1c is removed. Then, the power element mounting substrate 20 is assembled to the heat radiating surface of the product mounting heat sink 8 installed in a tilted state on the product housing 7. This facilitates board transportation and product assembly, and enables mounting with a reduced projection area.

薄板材２下の組付時除去部１ｃは、パワー素子搭載基板２０の組付時に廃棄するが、通常の電子部品を配置するスペースとして利用しても良いことは言うまでもない。   The assembling removal portion 1c under the thin plate member 2 is discarded when the power element mounting substrate 20 is assembled, but it goes without saying that it may be used as a space for arranging normal electronic components.

本実施の形態によれば、製品組付工程において薄板材２をプリント基板１に対して傾斜させる作業が不要であるため、工数を省いて生産コストを低減できる。この他については実施の形態１と同様である。   According to the present embodiment, it is not necessary to incline the thin plate material 2 with respect to the printed circuit board 1 in the product assembling step, so that the number of steps can be saved and the production cost can be reduced. Others are the same as in the first embodiment.

実施の形態３．
図７は、本発明にかかるパワー素子放熱構造の実施の形態３におけるパワー素子搭載基板の構成を示す図であり、図７（ａ）は上面図、図７（ｂ）は側面図である。本実施の形態では、プリント基板１上に薄板材２を傾斜して設置できる治具１８を用い、薄板材２を平板状に（取付脚２ａを備えない形状に）形成し、製品組み付け時の薄板材２下の組付時除去部１ｃを削除する際に、治具１８が外れる構造としている。 Embodiment 3 FIG.
7A and 7B are diagrams showing the configuration of a power element mounting substrate in Embodiment 3 of the power element heat dissipation structure according to the present invention. FIG. 7A is a top view and FIG. 7B is a side view. In the present embodiment, the jig 18 that can be installed on the printed circuit board 1 at an inclination is used to form the thin plate material 2 in a flat plate shape (in a shape that does not include the mounting legs 2a), and at the time of product assembly. When the assembly removal portion 1c under the thin plate 2 is deleted, the jig 18 is removed.

製品取付ヒートシンク８への組み付け後のパワー素子搭載基板２０は、実施の形態１と同様である。   The power element mounting substrate 20 after assembly to the product mounting heat sink 8 is the same as that of the first embodiment.

本実施の形態では、薄板材２に取付脚を形成する必要がないため、加工コストを低減できる。この他については実施の形態２と同様である。   In the present embodiment, since it is not necessary to form mounting legs on the thin plate material 2, the processing cost can be reduced. Others are the same as in the second embodiment.

実施の形態４．
図８は、本発明にかかるパワー素子放熱構造の実施の形態４におけるパワー素子搭載基板の構成を示す図であり、図８（ａ）は上面図、図８（ｂ）は側面図である。本実施の形態においては、治具１９上にパワー素子位置決め突起１９ｂを設け、薄板材を用いずに、パワー素子５のみを治具１９上に設置する。治具１９は、実施の形態２における薄板材２と同様の形状であり、取付脚１９ａを備えている。製品組み付けにおいては、製品取付ヒートシンク８に絶縁シート４等を設置し、パワー素子５を直接取り付ける。 Embodiment 4 FIG.
8A and 8B are diagrams showing the configuration of the power element mounting substrate in the power element heat dissipation structure according to the fourth embodiment of the present invention. FIG. 8A is a top view and FIG. 8B is a side view. In the present embodiment, the power element positioning protrusion 19b is provided on the jig 19, and only the power element 5 is installed on the jig 19 without using a thin plate material. The jig 19 has the same shape as that of the thin plate 2 in the second embodiment, and includes a mounting leg 19a. In product assembly, the insulating sheet 4 or the like is installed on the product mounting heat sink 8 and the power element 5 is directly mounted.

実施の形態１〜３用いた薄板材２は、パワー素子５の位置決め材として用いるものであるため、本実施の形態の治具１９にて代用できる。治具１９は、製品組み付け時に取り外すことで、容易に再利用できる構成とし、パワー素子５を薄板材２ではなく製品取付ヒートシンク８に直接ねじ止めすることもできる。   Since the thin plate material 2 used in the first to third embodiments is used as a positioning material for the power element 5, the jig 19 of the present embodiment can be used instead. The jig 19 can be easily reused by removing it when the product is assembled, and the power element 5 can be directly screwed to the product mounting heat sink 8 instead of the thin plate material 2.

本実施の形態においては、薄板材が不要であるため、部品点数を削減し、製造コストを低減することができる。   In the present embodiment, since a thin plate material is unnecessary, the number of parts can be reduced and the manufacturing cost can be reduced.

以上のように、本発明にかかるパワー素子放熱構造及びその製造方法は、パワーコンディショナーなどの電機機器を構成するパワー素子が発する熱を放熱構造体に伝熱する構造を、安価かつ組付・分解が容易に実現できる点で有用である。   As described above, the power element heat dissipation structure and the method of manufacturing the power element according to the present invention are inexpensive and can be assembled and disassembled with a structure that transfers heat generated by the power element that constitutes an electrical device such as a power conditioner to the heat dissipation structure. Is useful in that it can be easily realized.

１ プリント基板
１ａ スリット
１ｂ パワー素子実装部
１ｃ 組付時除去部
１ｄ 切断部
１ｅ 薄板材位置決め穴
２ 薄板材
２ａ、１９ａ 取付脚
３ パワー素子固定ねじ
４ 絶縁シート
５ パワー素子
７ 製品筐体
７ａ 開口
８ 製品取付ヒートシンク
９ パワー素子搭載基板固定ねじ
１５ パワー素子ユニット
１８、１９ 治具
２０ パワー素子搭載基板 DESCRIPTION OF SYMBOLS 1 Printed circuit board 1a Slit 1b Power element mounting part 1c Removal part at the time of assembly 1d Cutting part 1e Thin plate material positioning hole 2 Thin plate material 2a, 19a Mounting leg 3 Power element fixing screw 4 Insulation sheet 5 Power element 7 Product housing 7a Opening 8 Product mounting heat sink 9 Power element mounting board fixing screw 15 Power element unit 18, 19 Jig 20 Power element mounting board

Claims (7)

パワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造であって、
先端側が下がるように傾斜した状態で前記製品筐体の内側面に設置された前記放熱構造体と、
前記放熱構造体の上に配置された薄板材と、
樹脂封止された本体部分と、該本体部分から伸びるリード端子とを有し、該リード端子を斜め下に向けた状態で前記本体部分が前記薄板材の上に固定された前記パワー素子と、
前記リード端子がはんだ付けされて、前記パワー素子に被さらないように前記製品筐体に収容されたプリント基板と、
前記放熱構造体の上に配置された前記薄板材を、該薄板材側から前記放熱構造体に共締め固定する固定ねじと、
を備えることを特徴とするパワー素子放熱構造。 A power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening on the top surface to dissipate the heat,
The heat dissipating structure installed on the inner surface of the product housing in an inclined state so that the tip side is lowered;
A thin plate disposed on the heat dissipation structure;
The power element having a resin-sealed main body portion and a lead terminal extending from the main body portion, the main body portion being fixed on the thin plate material in a state where the lead terminal is directed obliquely downward,
The printed circuit board accommodated in the product housing so that the lead terminal is soldered and does not cover the power element;
A fixing screw for fastening the thin plate material disposed on the heat dissipation structure together with the heat dissipation structure from the thin plate material side;
A power element heat dissipation structure comprising: 前記パワー素子は、ＳｉＣパワー素子であり、
前記パワー素子と前記薄板材との間に、前記パワー素子の耐熱温度以上の温度での連続耐熱性を有する樹脂が配置されたことを特徴とする請求項１に記載のパワー素子放熱構造。 The power element is a SiC power element;
The power element heat dissipation structure according to claim 1, wherein a resin having continuous heat resistance at a temperature equal to or higher than the heat resistance temperature of the power element is disposed between the power element and the thin plate material. パワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造であって、
先端側が下がるように傾斜した状態で前記製品筐体の内側面に設置された前記放熱構造体と、
樹脂封止された本体部分と、該本体部分から伸びるリード端子とを有し、該リード端子を斜め下に向けた状態で前記本体部分が前記放熱構造体の上に配置された前記パワー素子と、
前記リード端子がはんだ付けされて、前記パワー素子に被さらないように前記製品筐体に収容されたプリント基板と、
前記放熱構造体の上に配置された前記パワー素子の本体部分を、該パワー素子側から前記放熱構造体に共締め固定する固定ねじと、
を備えることを特徴とするパワー素子放熱構造。 A power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening on the top surface to dissipate the heat,
The heat dissipating structure installed on the inner surface of the product housing in an inclined state so that the tip side is lowered;
A power element having a resin-sealed main body portion and a lead terminal extending from the main body portion, the main body portion being disposed on the heat dissipation structure with the lead terminal facing obliquely downward; ,
The printed circuit board accommodated in the product housing so that the lead terminal is soldered and does not cover the power element;
A fixing screw for fixing the main body portion of the power element disposed on the heat dissipation structure together with the heat dissipation structure from the power element side;
A power element heat dissipation structure comprising: 樹脂封止された本体部分及び該本体部分から伸びるリード端子を有するパワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造の製造方法であって、
前記製品筐体の内側面に、先端側が下がるように傾斜した状態で前記放熱構造体を設置する工程と、
プリント基板の上に薄板材を配置する工程と、
前記プリント基板の上に配置した前記薄板材に前記パワー素子の前記本体部分を固定する工程と、
前記本体部分を前記薄板材に固定した前記パワー素子の前記リード端子を、前記プリント基板にはんだ付けする工程と、
前記プリント基板に前記リード端子をはんだ付けした前記パワー素子とともに、前記薄板材を、前記放熱構造体と略同じ角度傾斜するように傾ける工程と、
前記放熱構造体と略同じ角度傾斜するように傾けた前記薄板材が前記放熱構造体の上に配置されるように、前記プリント基板を前記製品筐体に収容する工程と、
前記放熱構造体の上に配置された前記薄板材を、前記開口を通じてのねじ止め操作により前記薄板材側から前記放熱構造体に共締め固定する工程と、
を備えることを特徴とするパワー素子放熱構造の製造方法。 Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Arranging a thin plate material on a printed circuit board;
Fixing the body portion of the power element to the thin plate disposed on the printed circuit board;
Soldering the lead terminal of the power element with the body portion fixed to the thin plate material to the printed circuit board;
Inclining the thin plate material together with the power element with the lead terminal soldered to the printed circuit board so as to be inclined at substantially the same angle as the heat dissipation structure,
Accommodating the printed circuit board in the product housing such that the thin plate material inclined so as to be inclined at substantially the same angle as the heat dissipation structure is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. 樹脂封止された本体部分及び該本体部分から伸びるリード端子を有するパワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造の製造方法であって、
前記製品筐体の内側面に、先端側が下がるように傾斜した状態で前記放熱構造体を設置する工程と、
プリント基板の上に前記放熱構造体と略同じ角度傾斜させて薄板材を配置する工程と、
前記プリント基板の上に配置した前記薄板材に前記パワー素子の前記本体部分を、前記リード端子を斜め下に向けた状態で固定する工程と、
前記薄板材に前記本体部分を固定した前記パワー素子のリード端子を、前記プリント基板にはんだ付けする工程と、
前記プリント基板の前記薄板材が配置された部分を取り除く工程と、
前記薄板材が前記放熱構造体の上に配置されるように前記プリント基板を前記製品筐体に収容する工程と、
前記放熱構造体の上に配置された前記薄板材を、前記開口を通じてのねじ止め操作により前記薄板材側から前記放熱構造体に共締め固定する工程と、
を備えることを特徴とするパワー素子放熱構造の製造方法。 Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
A step of placing a thin plate material on the printed circuit board by inclining at substantially the same angle as the heat dissipation structure;
Fixing the main body portion of the power element to the thin plate material disposed on the printed circuit board in a state where the lead terminal is directed obliquely downward;
Soldering the lead terminal of the power element with the main body portion fixed to the thin plate material to the printed circuit board;
Removing the portion of the printed board where the thin plate material is disposed;
Accommodating the printed circuit board in the product housing such that the thin plate material is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. 樹脂封止された本体部分及び該本体部分から伸びるリード端子を有するパワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造の製造方法であって、
前記製品筐体の内側面に、先端側が下がるように傾斜した状態で前記放熱構造体を設置する工程と、
プリント基板の上に前記放熱構造体と略同じ角度傾斜した上面を有する治具を配置する工程と、
前記治具の上面に薄板材を配置する工程と、
前記治具の上に配置した前記薄板材に前記パワー素子の前記本体部分を、前記リード端子を斜め下に向けた状態で固定する工程と、
前記薄板材に前記本体部分を固定した前記パワー素子の前記リード端子を、前記プリント基板にはんだ付けする工程と、
前記プリント基板の前記治具が配置された部分を、該治具とともに取り除く工程と、
前記薄板材が、前記放熱構造体の上に配置されるように前記プリント基板を前記製品筐体に収容する工程と、
前記放熱構造体の上に配置された前記薄板材を、前記開口を通じてのねじ止め操作により前記薄板材側から前記放熱構造体に共締め固定する工程と、
を備えることを特徴とするパワー素子放熱構造の製造方法。 Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Placing a jig having an upper surface inclined at substantially the same angle as the heat dissipation structure on the printed circuit board;
Placing a thin plate on the upper surface of the jig;
Fixing the main body portion of the power element to the thin plate material disposed on the jig in a state where the lead terminal is directed obliquely downward;
Soldering the lead terminal of the power element with the body portion fixed to the thin plate material to the printed circuit board;
Removing the portion of the printed circuit board where the jig is disposed together with the jig;
Accommodating the printed circuit board in the product housing such that the thin plate material is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. 樹脂封止された本体部分及び該本体部分から伸びるリード端子を有するパワー素子が発する熱を放熱構造体から天面に開口が形成された製品筐体に伝熱して放熱するパワー素子放熱構造の製造方法であって、
前記製品筐体の内側面に、先端側が下がるように傾斜した状態で前記放熱構造体を設置する工程と、
プリント基板上に、前記放熱構造体と略同じ角度傾斜した上面を有する治具を配置する工程と、
前記治具の上面に前記パワー素子の前記本体部分が当接するように、前記リード端子を斜め下に向けた状態で前記パワー素子を前記治具上に載置する工程と、
前記治具の上面に載置された前記パワー素子の前記リード端子を、前記プリント基板にはんだ付けする工程と、
前記プリント基板の前記治具が載置された部分を、該治具とともに取り除く工程と、
前記パワー素子の前記本体部分が、前記放熱構造体の上に配置されるように前記プリント基板を前記製品筐体に収容する工程と、
前記放熱構造体の上に配置された前記パワー素子の前記本体部分を、前記開口を通じてのねじ止め操作により前記パワー素子側から前記放熱構造体に共締め固定する工程と、
を備えることを特徴とするパワー素子放熱構造の製造方法。 Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Placing a jig having an upper surface inclined at substantially the same angle as the heat dissipation structure on the printed circuit board;
Placing the power element on the jig in a state in which the lead terminal is inclined downward so that the main body portion of the power element contacts the upper surface of the jig;
Soldering the lead terminal of the power element placed on the upper surface of the jig to the printed circuit board;
Removing the portion of the printed circuit board on which the jig is placed together with the jig;
Accommodating the printed circuit board in the product housing such that the main body portion of the power element is disposed on the heat dissipation structure;
Fixing the body portion of the power element disposed on the heat dissipation structure together with the heat dissipation structure from the power element side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure.
JP2012144059A 2012-06-27 2012-06-27 Power element heat dissipation structure and manufacturing method therefor Pending JP2014007362A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016077063A (en) * 2014-10-03 2016-05-12 三菱重工オートモーティブサーマルシステムズ株式会社 Installation structure for power transistor, inverter, and inverter integrated motor compressor
CN107461905A (en) * 2017-07-25 2017-12-12 青岛海尔空调电子有限公司 Box cover mounting structure for air conditioner
WO2018078687A1 (en) * 2016-10-24 2018-05-03 新電元工業株式会社 Electronic device disposition structure and electronic circuit device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016077063A (en) * 2014-10-03 2016-05-12 三菱重工オートモーティブサーマルシステムズ株式会社 Installation structure for power transistor, inverter, and inverter integrated motor compressor
WO2018078687A1 (en) * 2016-10-24 2018-05-03 新電元工業株式会社 Electronic device disposition structure and electronic circuit device
JPWO2018078687A1 (en) * 2016-10-24 2018-10-25 新電元工業株式会社 Electronic device arrangement structure and electronic circuit device
CN109644578A (en) * 2016-10-24 2019-04-16 新电元工业株式会社 The configuration structure and electronic-circuit device of electronic device
CN109644578B (en) * 2016-10-24 2020-09-29 新电元工业株式会社 Arrangement structure of electronic device and electronic circuit device
CN107461905A (en) * 2017-07-25 2017-12-12 青岛海尔空调电子有限公司 Box cover mounting structure for air conditioner
CN107461905B (en) * 2017-07-25 2021-01-05 青岛海尔空调电子有限公司 Box cover mounting structure for air conditioner

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