JP2013517488A - 緩衝部を備えたセンサ - Google Patents
緩衝部を備えたセンサ Download PDFInfo
- Publication number
- JP2013517488A JP2013517488A JP2012549309A JP2012549309A JP2013517488A JP 2013517488 A JP2013517488 A JP 2013517488A JP 2012549309 A JP2012549309 A JP 2012549309A JP 2012549309 A JP2012549309 A JP 2012549309A JP 2013517488 A JP2013517488 A JP 2013517488A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- sensor device
- chip
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011156 evaluation Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 description 22
- 230000003139 buffering effect Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Abstract
Description
例えば、自動車の安全システム内に組み込まれているセンサ装置は通常、チップ構造体を有している。このチップ構造体は、センサチップと、このセンサチップと電気的に接続されている評価チップとを備えている。このセンサチップは、マイクロメカニカルデバイス(MEMS、Micro Electro Mechanical System)の形状で形成されており、これによって物理的な測定量、例えば加速度またはヨーレートを検出する。評価チップは、センサチップを制御するため、およびセンサチップの測定信号を評価ないしは処理するために用いられる。
本発明の課題は、改善されたセンサ装置を提供することでる。これは殊に、衝撃の影響を受けない構造および小さい横方向の面積の需要を特徴としている。さらに、本発明の課題は、この種のセンサ装置を製造する方法を提供することである。
Claims (10)
- ・チップ構造体(140、141、145)用の固定部分(120、121)を備えた柔軟なプリント回路基板(111)と、
・当該柔軟なプリント回路基板(111)の固定部分(120、121)上に配置されているチップ構造体(140、141、145)と、
・当該チップ構造体(140、141、145)に対する機械的な影響を緩和する緩衝部材(160)とを有しているセンサ装置において、
前記柔軟なプリント回路基板(111)の固定部分(120、121)と、前記チップ構造体(140、141、145)と、前記緩衝部材(16)とが重なり合って配置されている、
ことを特徴とするセンサ装置。 - 前記柔軟なプリント回路基板(111)は、第1の側と、当該第1の側に対向している第2の側とを有しており、
前記チップ構造体(140、141、145)は前記柔軟なプリント回路基板(111)の第1の側に配置されており、前記緩衝部材(160)は前記第2の側に配置されている、請求項1記載のセンサ装置。 - 前記緩衝部材(160)は、前記チップ構造体(140、141、145)に接している、請求項1記載のセンサ装置。
- 前記緩衝部材は前記チップ構造体(140、141)を付加的に包囲している、請求項3記載のセンサ装置。
- 前記柔軟なプリント回路基板(111)は、第1の脚と第2の脚(118、119)を備えたU字型をしており、当該2つの脚は中間領域を囲んでいる、請求項1から4までのいずれか1項記載のセンサ装置。
- 前記緩衝部材(160)は前記中間領域内に配置されている、請求項5記載のセンサ装置。
- 前記緩衝部材(160)と前記チップ構造体(140、141、145)は前記中間領域内に配置されている、請求項5記載のセンサ装置。
- 前記固定部分は、前記柔軟なプリント回路基板の剛性部分(120)である、請求項1から7までのいずれか1項記載のセンサ装置。
- 前記チップ構造体は、
・センサチップ(140)と評価チップ(141)、または
・チップモジュール(145)
を含んでいる、請求項1から8までのいずれか1項記載のセンサ装置。 - センサ装置の製造方法であって、当該方法は、
・チップ構造体(140、141、145)用の固定部分(120、121)を有している柔軟なプリント回路基板(111)を準備するステップと、
・チップ構造体(140、141、145)を、当該柔軟なプリント回路基板(111)の固定部分(120、121)上に配置するステップと、
・前記柔軟なプリント回路基板(111)の固定部分(120、121)と前記チップ構造体(140、141、145)と緩衝部材(160)とが重なり合って配置されるように前記緩衝部材(160)を形成するステップとを有している、
ことを特徴する、センサ装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010001023A DE102010001023A1 (de) | 2010-01-19 | 2010-01-19 | Sensorvorrichtung |
DE102010001023.5 | 2010-01-19 | ||
PCT/EP2011/050437 WO2011089066A1 (de) | 2010-01-19 | 2011-01-14 | Sensor mit dämpfung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013517488A true JP2013517488A (ja) | 2013-05-16 |
JP5611369B2 JP5611369B2 (ja) | 2014-10-22 |
Family
ID=43919951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012549309A Expired - Fee Related JP5611369B2 (ja) | 2010-01-19 | 2011-01-14 | 緩衝部を備えたセンサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US9263395B2 (ja) |
EP (1) | EP2526545B1 (ja) |
JP (1) | JP5611369B2 (ja) |
CN (1) | CN102714031B (ja) |
DE (1) | DE102010001023A1 (ja) |
WO (1) | WO2011089066A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012193971A (ja) * | 2011-03-15 | 2012-10-11 | Seiko Epson Corp | センサーモジュール、センサーデバイス、センサーデバイスの製造方法及び電子機器 |
DE102011017692A1 (de) * | 2011-04-28 | 2012-10-31 | Robert Bosch Gmbh | Leiterplattenanordnung mit einem schwingfähigen System |
DE102011080971A1 (de) * | 2011-08-16 | 2013-02-21 | Robert Bosch Gmbh | Sensor, Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit |
CN103021985B (zh) * | 2011-09-21 | 2015-07-22 | 中国科学院上海微***与信息技术研究所 | 待测传感器芯片的电学引出结构及其应用 |
DE102012223886A1 (de) | 2012-12-20 | 2014-06-26 | Robert Bosch Gmbh | Schwingungsdämpfer für eine Sensoreinheit und Sensoranordnung für ein Kraftfahrzeug |
DE102013212053A1 (de) * | 2013-06-25 | 2015-01-08 | Robert Bosch Gmbh | Leiterplatte mit einem schwingungsentkoppelten elektronischen Bauelement |
US10431382B2 (en) | 2015-08-31 | 2019-10-01 | Apple Inc. | Printed circuit board assembly having a damping layer |
EP3375262B1 (de) | 2015-11-12 | 2019-12-04 | Possehl Electronics Deutschland GmbH | Leiterbahnenstruktur mit einem schwingungsgedämpft aufgenommenen bauteil |
CN112912695A (zh) * | 2018-09-25 | 2021-06-04 | 弗瑞柏私人有限公司 | 传感器装置 |
CN109102791A (zh) * | 2018-09-27 | 2018-12-28 | 武汉天马微电子有限公司 | 柔性电路板及其制作方法 |
CN216316017U (zh) * | 2021-05-31 | 2022-04-19 | 北京歌尔泰克科技有限公司 | 表带以及智能手表 |
DE102022128942A1 (de) | 2022-11-02 | 2023-08-31 | Audi Aktiengesellschaft | Kraftfahrzeug und Anbindungselement für ein Kraftfahrzeug |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63250541A (ja) * | 1987-04-07 | 1988-10-18 | Mitsubishi Electric Corp | 半導体圧力センサ |
JPH07260822A (ja) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | 加速度センサ |
JPH08213774A (ja) * | 1994-10-21 | 1996-08-20 | Robert Bosch Gmbh | 電気機器とその製造方法 |
JPH11211749A (ja) * | 1998-01-27 | 1999-08-06 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2001324333A (ja) * | 2000-05-17 | 2001-11-22 | Denso Corp | 角速度センサ及びその製造方法 |
JP2004200596A (ja) * | 2002-12-20 | 2004-07-15 | Matsushita Electric Ind Co Ltd | フレキシブル配線基板を用いた半導体装置、その実装方法および実装装置 |
JP2005202175A (ja) * | 2004-01-16 | 2005-07-28 | Canon Inc | 振れ検知手段を有する撮影装置 |
JP2005257637A (ja) * | 2004-03-15 | 2005-09-22 | Ngk Insulators Ltd | 振動子の実装構造 |
JP2007047023A (ja) * | 2005-08-10 | 2007-02-22 | Seiko Instruments Inc | 半導体装置及び半導体パッケージ並びに半導体装置の製造方法 |
JP2009002964A (ja) * | 2008-09-01 | 2009-01-08 | Panasonic Corp | 回転率センサ |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH057835Y2 (ja) * | 1986-06-10 | 1993-02-26 | ||
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
EP0660081B1 (en) | 1993-12-21 | 1999-02-24 | Murata Manufacturing Co., Ltd. | Vibrating gyroscope |
US5646446A (en) * | 1995-12-22 | 1997-07-08 | Fairchild Space And Defense Corporation | Three-dimensional flexible assembly of integrated circuits |
GB2312972B (en) | 1996-05-11 | 2000-02-09 | Marconi Gec Ltd | Vibration control |
US6121676A (en) * | 1996-12-13 | 2000-09-19 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
US6225688B1 (en) * | 1997-12-11 | 2001-05-01 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
US6208521B1 (en) * | 1997-05-19 | 2001-03-27 | Nitto Denko Corporation | Film carrier and laminate type mounting structure using same |
DE19914418A1 (de) * | 1999-03-30 | 2000-10-05 | Bosch Gmbh Robert | Leiterplatte mit starren und elastisch verformbaren Abschnitten und Gerät mit einer solchen Leiterplatte |
JP2001203319A (ja) * | 2000-01-18 | 2001-07-27 | Sony Corp | 積層型半導体装置 |
JP2001308260A (ja) * | 2000-04-25 | 2001-11-02 | Seiko Epson Corp | 半導体装置 |
US7656678B2 (en) * | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US6956284B2 (en) * | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
US7071547B2 (en) * | 2002-09-11 | 2006-07-04 | Tessera, Inc. | Assemblies having stacked semiconductor chips and methods of making same |
US7116557B1 (en) * | 2003-05-23 | 2006-10-03 | Sti Electronics, Inc. | Imbedded component integrated circuit assembly and method of making same |
US7368695B2 (en) * | 2004-05-03 | 2008-05-06 | Tessera, Inc. | Image sensor package and fabrication method |
US7767543B2 (en) * | 2005-09-06 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a micro-electro-mechanical device with a folded substrate |
JP4893322B2 (ja) | 2006-03-23 | 2012-03-07 | 株式会社デンソー | 超音波センサ |
DE102009000571B4 (de) | 2009-02-03 | 2023-05-17 | Robert Bosch Gmbh | Sensorvorrichtung und Gehäuse für solch eine Sensorvorrichtung |
US8556611B2 (en) * | 2011-06-21 | 2013-10-15 | Xerox Corporation | Method for interstitial polymer planarization using a flexible flat plate |
DE102012201486B4 (de) * | 2012-02-02 | 2020-08-06 | Robert Bosch Gmbh | Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung |
US9029759B2 (en) * | 2012-04-12 | 2015-05-12 | Nan Chang O-Film Optoelectronics Technology Ltd | Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same |
US9668352B2 (en) * | 2013-03-15 | 2017-05-30 | Sumitomo Electric Printed Circuits, Inc. | Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly |
-
2010
- 2010-01-19 DE DE102010001023A patent/DE102010001023A1/de not_active Withdrawn
-
2011
- 2011-01-14 WO PCT/EP2011/050437 patent/WO2011089066A1/de active Application Filing
- 2011-01-14 US US13/521,573 patent/US9263395B2/en not_active Expired - Fee Related
- 2011-01-14 CN CN201180006502.XA patent/CN102714031B/zh active Active
- 2011-01-14 EP EP11700919.1A patent/EP2526545B1/de not_active Not-in-force
- 2011-01-14 JP JP2012549309A patent/JP5611369B2/ja not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63250541A (ja) * | 1987-04-07 | 1988-10-18 | Mitsubishi Electric Corp | 半導体圧力センサ |
JPH07260822A (ja) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | 加速度センサ |
JPH08213774A (ja) * | 1994-10-21 | 1996-08-20 | Robert Bosch Gmbh | 電気機器とその製造方法 |
JPH11211749A (ja) * | 1998-01-27 | 1999-08-06 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2001324333A (ja) * | 2000-05-17 | 2001-11-22 | Denso Corp | 角速度センサ及びその製造方法 |
JP2004200596A (ja) * | 2002-12-20 | 2004-07-15 | Matsushita Electric Ind Co Ltd | フレキシブル配線基板を用いた半導体装置、その実装方法および実装装置 |
JP2005202175A (ja) * | 2004-01-16 | 2005-07-28 | Canon Inc | 振れ検知手段を有する撮影装置 |
JP2005257637A (ja) * | 2004-03-15 | 2005-09-22 | Ngk Insulators Ltd | 振動子の実装構造 |
JP2007047023A (ja) * | 2005-08-10 | 2007-02-22 | Seiko Instruments Inc | 半導体装置及び半導体パッケージ並びに半導体装置の製造方法 |
JP2009002964A (ja) * | 2008-09-01 | 2009-01-08 | Panasonic Corp | 回転率センサ |
Also Published As
Publication number | Publication date |
---|---|
EP2526545B1 (de) | 2016-07-20 |
US9263395B2 (en) | 2016-02-16 |
CN102714031B (zh) | 2015-08-05 |
JP5611369B2 (ja) | 2014-10-22 |
CN102714031A (zh) | 2012-10-03 |
DE102010001023A1 (de) | 2011-07-21 |
EP2526545A1 (de) | 2012-11-28 |
WO2011089066A1 (de) | 2011-07-28 |
US20130044442A1 (en) | 2013-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5611369B2 (ja) | 緩衝部を備えたセンサ | |
US8276446B2 (en) | Sensor device | |
US9656856B2 (en) | Method of lower profile MEMS package with stress isolations | |
US9613877B2 (en) | Semiconductor packages and methods for forming semiconductor package | |
JP4701505B2 (ja) | 慣性トランスデューサ | |
CN105705950B (zh) | 惯性传感器 | |
US9841341B2 (en) | Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors | |
US9331010B2 (en) | System support for electronic components and method for production thereof | |
EP2434297A1 (en) | Structure having chip mounted thereon and module provided with the structure | |
US10800651B2 (en) | Low stress integrated device packages | |
US20140022745A1 (en) | Component and method for producing a component | |
CN111422819A (zh) | 传感器封装结构及其封装方法、以及电子设备 | |
US8664758B2 (en) | Semiconductor package having reliable electrical connection and assembling method | |
KR101166654B1 (ko) | 반도체 장치 | |
KR20100031775A (ko) | 전자 부품 | |
JP5115269B2 (ja) | 半導体デバイスの実装構造体及び実装構造体を用いた電子機器 | |
US20200170105A1 (en) | Conductor path structure having a component received in a vibration-damped manner | |
US10060944B2 (en) | Micromechanical sensor device and corresponding manufacturing method | |
JP5154275B2 (ja) | 磁気センサパッケージ | |
KR101688077B1 (ko) | 반도체 패키지 구조물 및 그 제작 방법 | |
KR20110076539A (ko) | 압력 센서 및 그 제조 방법 | |
KR101507200B1 (ko) | Mems 패키지 및 그 제조 방법 | |
EP1918988A2 (en) | A semiconductor package manufacturing method and semiconductor apparatus | |
KR20110124093A (ko) | 수직형 칩을 갖는 반도체 패키지 제조방법 | |
KR20140078119A (ko) | 멤스 패키지 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131016 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131028 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140121 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140804 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140902 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5611369 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |