JP2013256588A - Highly heat conductive thermoplastic resin composition - Google Patents
Highly heat conductive thermoplastic resin composition Download PDFInfo
- Publication number
- JP2013256588A JP2013256588A JP2012133194A JP2012133194A JP2013256588A JP 2013256588 A JP2013256588 A JP 2013256588A JP 2012133194 A JP2012133194 A JP 2012133194A JP 2012133194 A JP2012133194 A JP 2012133194A JP 2013256588 A JP2013256588 A JP 2013256588A
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- Japan
- Prior art keywords
- thermoplastic resin
- group
- resin composition
- thermal conductivity
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 88
- 239000011342 resin composition Substances 0.000 title claims abstract description 66
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 37
- 125000001424 substituent group Chemical group 0.000 claims abstract description 35
- 230000000694 effects Effects 0.000 claims abstract description 16
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- 125000006267 biphenyl group Chemical group 0.000 claims abstract description 9
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 60
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 14
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- 125000006848 alicyclic heterocyclic group Chemical group 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 8
- 230000001747 exhibiting effect Effects 0.000 abstract description 3
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 description 23
- 229910003475 inorganic filler Inorganic materials 0.000 description 23
- 239000000843 powder Substances 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 20
- 239000002245 particle Substances 0.000 description 16
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 13
- -1 fatty acid ester Chemical class 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000001746 injection moulding Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229910052582 BN Inorganic materials 0.000 description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 238000010292 electrical insulation Methods 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 125000003277 amino group Chemical group 0.000 description 7
- 150000004665 fatty acids Chemical class 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 125000004185 ester group Chemical group 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 230000007704 transition Effects 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002484 inorganic compounds Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000001632 sodium acetate Substances 0.000 description 3
- 235000017281 sodium acetate Nutrition 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000012756 surface treatment agent Substances 0.000 description 3
- MEFKFJOEVLUFAY-UHFFFAOYSA-N (2,2,2-trichloroacetyl) 2,2,2-trichloroacetate Chemical compound ClC(Cl)(Cl)C(=O)OC(=O)C(Cl)(Cl)Cl MEFKFJOEVLUFAY-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229930014626 natural product Natural products 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- JFKMVXDFCXFYNM-UHFFFAOYSA-N (2,2,2-tribromoacetyl) 2,2,2-tribromoacetate Chemical compound BrC(Br)(Br)C(=O)OC(=O)C(Br)(Br)Br JFKMVXDFCXFYNM-UHFFFAOYSA-N 0.000 description 1
- VGCSPGQZLMQTHC-UHFFFAOYSA-N (2,2-dibromoacetyl) 2,2-dibromoacetate Chemical compound BrC(Br)C(=O)OC(=O)C(Br)Br VGCSPGQZLMQTHC-UHFFFAOYSA-N 0.000 description 1
- RQHMQURGSQBBJY-UHFFFAOYSA-N (2,2-dichloroacetyl) 2,2-dichloroacetate Chemical compound ClC(Cl)C(=O)OC(=O)C(Cl)Cl RQHMQURGSQBBJY-UHFFFAOYSA-N 0.000 description 1
- IYXUFOCLMOXQSL-UHFFFAOYSA-N (2,2-difluoroacetyl) 2,2-difluoroacetate Chemical compound FC(F)C(=O)OC(=O)C(F)F IYXUFOCLMOXQSL-UHFFFAOYSA-N 0.000 description 1
- FUKOTTQGWQVMQB-UHFFFAOYSA-N (2-bromoacetyl) 2-bromoacetate Chemical compound BrCC(=O)OC(=O)CBr FUKOTTQGWQVMQB-UHFFFAOYSA-N 0.000 description 1
- PNVPNXKRAUBJGW-UHFFFAOYSA-N (2-chloroacetyl) 2-chloroacetate Chemical compound ClCC(=O)OC(=O)CCl PNVPNXKRAUBJGW-UHFFFAOYSA-N 0.000 description 1
- KLLYGDXCCNXESW-UHFFFAOYSA-N (2-fluoroacetyl) 2-fluoroacetate Chemical compound FCC(=O)OC(=O)CF KLLYGDXCCNXESW-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- PGZVFRAEAAXREB-UHFFFAOYSA-N 2,2-dimethylpropanoyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC(=O)C(C)(C)C PGZVFRAEAAXREB-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- DGVMNQYBHPSIJS-UHFFFAOYSA-N dimagnesium;2,2,6,6-tetraoxido-1,3,5,7-tetraoxa-2,4,6-trisilaspiro[3.3]heptane;hydrate Chemical compound O.[Mg+2].[Mg+2].O1[Si]([O-])([O-])O[Si]21O[Si]([O-])([O-])O2 DGVMNQYBHPSIJS-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- LSACYLWPPQLVSM-UHFFFAOYSA-N isobutyric acid anhydride Chemical compound CC(C)C(=O)OC(=O)C(C)C LSACYLWPPQLVSM-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- BKRIRZXWWALTPU-UHFFFAOYSA-N methyl 4-(4-methoxycarbonylphenyl)benzoate Chemical compound C1=CC(C(=O)OC)=CC=C1C1=CC=C(C(=O)OC)C=C1 BKRIRZXWWALTPU-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000003541 multi-stage reaction Methods 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、熱伝導性に優れた放熱材料であって、射出成形可能な熱可塑性樹脂組成物に関する。 The present invention relates to a heat radiation material excellent in thermal conductivity, and relates to a thermoplastic resin composition that can be injection-molded.
熱可塑性樹脂組成物をパソコンやディスプレーの筐体、電子デバイス材料、自動車の内外装など種々の用途に使用する際、プラスチックは金属材料など無機物と比較して熱伝導性が低いため、発生する熱を逃がしづらいことが問題になることがある。このような課題を解決するため、高熱伝導性無機物を大量に熱可塑性樹脂中に配合することで、高熱伝導性樹脂組成物を得ようとする試みが広くなされている。そのためには、グラファイト、炭素繊維、アルミナ、窒化ホウ素等の高熱伝導性無機物を、通常は３０Ｖｏｌ％以上、さらには５０Ｖｏｌ％以上もの高含有量で樹脂中に配合する必要がある。しかしながら、無機物を大量に配合しても樹脂単体の熱伝導性が低いために、樹脂組成物の熱伝導率には限界があった。そこで樹脂単体の熱伝導性の向上が求められていた。 When a thermoplastic resin composition is used in various applications such as PC and display housings, electronic device materials, and interior and exterior of automobiles, the heat generated due to the low thermal conductivity of plastics compared to inorganic materials such as metal materials. Difficult to escape may be a problem. In order to solve such problems, attempts have been widely made to obtain a high thermal conductive resin composition by blending a large amount of a high thermal conductive inorganic substance in a thermoplastic resin. For that purpose, it is necessary to mix highly heat-conductive inorganic substances such as graphite, carbon fiber, alumina, boron nitride and the like in the resin with a high content of usually 30 Vol% or more, and further 50 Vol% or more. However, even if a large amount of the inorganic substance is blended, the thermal conductivity of the resin alone is low, so that the thermal conductivity of the resin composition has a limit. Therefore, improvement in the thermal conductivity of the resin alone has been demanded.
樹脂単体の熱伝導性が優れた熱可塑性樹脂としては、延伸、磁場配向など特殊な成形加工なしに、射出成形により成形された樹脂単体が高熱伝導性を有する熱可塑性樹脂についての研究報告はほとんどなく、数少ない例として特許文献１が挙げられる。特許文献１に記載されているように、本発明の発明者らは樹脂単体で高熱伝導性を示す熱可塑性樹脂を見出してきた。
特許文献１には、特許文献１に記載の熱可塑性樹脂に窒化ホウ素などの無機充填剤を配合した場合、汎用樹脂に配合した場合よりも優れた熱伝導性を得られることが示されているが、その熱伝導性は未だ十分とはいえず、さらに、高い熱伝導性のために成形時の金型内での冷却固化が速く、成形体表面に模様が浮かび上がるなどという外観上の問題があった。また、特許文献２、３には、窒化アルミニウムを種々の熱可塑性樹脂に配合した例が記載されているが、いずれも窒化アルミニウムを１００〜１５０重量部配合しても熱伝導率は２Ｗ／（ｍ・Ｋ）と非常に低い。
As for the thermoplastic resin with excellent thermal conductivity of the resin itself, there are almost no research reports on thermoplastic resins in which the resin itself molded by injection molding has high thermal conductivity without special molding processes such as stretching and magnetic field orientation. There is no patent document 1 as a few examples. As described in Patent Document 1, the inventors of the present invention have found a thermoplastic resin exhibiting high thermal conductivity with a single resin.
Patent Document 1 shows that when the thermoplastic resin described in Patent Document 1 is blended with an inorganic filler such as boron nitride, thermal conductivity superior to that when blended with a general-purpose resin can be obtained. However, its thermal conductivity is still not sufficient, and furthermore, due to its high thermal conductivity, cooling and solidification in the mold during molding is fast, and the appearance problem such as patterns appearing on the surface of the molded product was there. Patent Documents 2 and 3 describe examples in which aluminum nitride is blended with various thermoplastic resins. However, even when 100 to 150 parts by weight of aluminum nitride is blended, the thermal conductivity is 2 W / ( m · K) and very low.
本発明は、優れた熱伝導性を示し、かつ良好な成形体外観を備えた熱可塑性樹脂組成物を提供することが目的である。 An object of the present invention is to provide a thermoplastic resin composition that exhibits excellent thermal conductivity and has a good molded body appearance.
本発明者らは、鋭意検討を重ねた結果、高熱伝導性を有する特定の分子構造の重縮合体に特定量の窒化アルミニウムを配合することによって、得られた樹脂組成物が非常に高い熱伝導率を示しながら、良好な成形体外観を備えることを見出し、本発明に至った。一般に、高い熱伝導性の樹脂組成物は冷却固化が速いために、成形体表面に模様が浮かび上がるなどという外観上の問題が起こる傾向にあり、窒化アルミニウムを用いて優れた熱伝導性と良好な成形体外観を両立できたことは思いがけない発見であった。即ち、本発明は、下記１）〜８）である。
１）
主鎖の構造が一般式（１）
As a result of intensive studies, the present inventors have obtained a resin composition obtained by blending a specific amount of aluminum nitride with a polycondensate having a specific molecular structure having high thermal conductivity. The present invention was found to have a good molded body appearance while showing the rate. In general, a resin composition with high thermal conductivity tends to cause appearance problems such as patterns appearing on the surface of the molded product because of rapid cooling and solidification. Excellent thermal conductivity and good performance using aluminum nitride It was an unexpected discovery that it was possible to achieve a good appearance of the compact. That is, the present invention includes the following 1) to 8).
1)
The structure of the main chain is general formula (1)
（式中、ＸはＯ、ＣＯの群から選ばれる２価の置換基を示す）
で表されるビフェニル基を有するユニット（Ａ）２５〜６０モル％、
一般式（２）
−Ｙ−Ｒ−Ｙ− （２）
（式中、Ｒは主鎖原子数２〜２０の分岐を含んでもよい２価の直鎖状置換基を示す。ＹはＯ、ＣＯの群から選ばれる２価の置換基を示す）
で表されるユニット（Ｂ）２５〜６０モル％、
一般式（３）
−Ｚ1−Ｍ−Ｚ2− （３）
（式中、Ｚ1、Ｚ2はＯ、ＮＨ、ＣＯ、Ｓ、ＮＨＣＯの群から選ばれる２価の置換基を示す。Ｍは主鎖の折り畳み効果を有する非縮合芳香族基、縮合芳香族基、複素環基、脂環基、脂環式複素環基から選ばれる置換基を示す。）
で表されるユニット（Ｃ）０〜２５モル％（ただしユニット（Ａ）、（Ｂ）、（Ｃ）の合計を１００モル％とする）からなり、樹脂単体の熱伝導率が０．４Ｗ／（ｍ・Ｋ）以上である熱可塑性樹脂（ｉ）１００重量部に対して、窒化アルミニウム（ｉｉ）を５０〜２５０重量部を含有してなる、熱可塑性樹脂組成物。
２）
前記一般式（１）のＸがＯ、一般式（２）のＹがＣＯである１）に記載の熱可塑性樹脂組成物。
３）
前記熱可塑性樹脂（ｉ）のＲに相当する部分が直鎖の脂肪族炭化水素鎖である、１）または２）に記載の熱可塑性樹脂組成物。
４）
前記熱可塑性樹脂（ｉ）のＲに相当する部分の主鎖原子数が偶数である、１）〜３）のいずれか一項に記載の熱可塑性樹脂組成物。
５）
前記熱可塑性樹脂（ｉ）のＲが−（ＣＨ2）8−、−（ＣＨ2）10−、−（ＣＨ2）12−から選ばれる少なくとも１種である、１）〜４）のいずれか一項に記載の熱可塑性樹脂組成物。
６）
前記熱可塑性樹脂（ｉ）のＭが以下に示す構造のうちいずれか１種である、１）〜５）のいずれか一項に記載の熱可塑性樹脂組成物。
(Wherein X represents a divalent substituent selected from the group of O and CO)
Unit (A) having a biphenyl group represented by 25 to 60 mol%,
General formula (2)
-YR-Y- (2)
(In the formula, R represents a divalent linear substituent which may contain a branch having 2 to 20 main chain atoms. Y represents a divalent substituent selected from the group of O and CO.)
Unit (B) represented by 25 to 60 mol%,
General formula (3)
-Z 1 -MZ 2- (3)
(In the formula, Z 1 and Z 2 represent a divalent substituent selected from the group of O, NH, CO, S, and NHCO. M represents a non-condensed aromatic group and a condensed aromatic group having a main chain folding effect. A substituent selected from a group, a heterocyclic group, an alicyclic group, and an alicyclic heterocyclic group.
Unit (C) represented by 0 to 25 mol% (however, the total of units (A), (B), and (C) is 100 mol%), and the thermal conductivity of the resin alone is 0.4 W / A thermoplastic resin composition comprising 50 to 250 parts by weight of aluminum nitride (ii) with respect to 100 parts by weight of the thermoplastic resin (i) that is (m · K) or more.
2)
The thermoplastic resin composition according to 1), wherein X in the general formula (1) is O and Y in the general formula (2) is CO.
3)
The thermoplastic resin composition according to 1) or 2), wherein a portion corresponding to R of the thermoplastic resin (i) is a linear aliphatic hydrocarbon chain.
4)
The thermoplastic resin composition according to any one of 1) to 3), wherein the number of main chain atoms in the portion corresponding to R of the thermoplastic resin (i) is an even number.
5)
Any one of 1) to 4), wherein R of the thermoplastic resin (i) is at least one selected from — (CH 2 ) 8 —, — (CH 2 ) 10 —, and — (CH 2 ) 12 —. The thermoplastic resin composition according to one item.
6)
The thermoplastic resin composition according to any one of 1) to 5), wherein M of the thermoplastic resin (i) is any one of the structures shown below.
７）
前記熱可塑性樹脂（ｉ）の数平均分子量が３０００〜４００００である、１）〜６）のいずれか一項に記載の熱可塑性樹脂組成物。
８）
１）〜７）のいずれか一項に記載の熱可塑性樹脂組成物を含有する成形体。
7)
The thermoplastic resin composition according to any one of 1) to 6), wherein the number average molecular weight of the thermoplastic resin (i) is 3000 to 40000.
8)
The molded object containing the thermoplastic resin composition as described in any one of 1) -7).
本発明の熱可塑性樹脂組成物は、優れた熱伝導性を示し、かつ良好な成形体外観を備える。 The thermoplastic resin composition of the present invention exhibits excellent thermal conductivity and has a good molded body appearance.
本発明における熱可塑性樹脂は、主鎖の構造が一般式（１） The thermoplastic resin in the present invention has a main chain structure of the general formula (1)
（式中、ＸはＯ、ＣＯの群から選ばれる２価の置換基を示す）
で表されるビフェニル基を有するユニット（Ａ）２５〜６０モル％、
一般式（２）
−Ｙ−Ｒ−Ｙ− （２）
（式中、Ｒは主鎖原子数２〜２０の分岐を含んでもよい２価の直鎖状置換基を示す。ＹはＯ、ＣＯの群から選ばれる２価の置換基を示す）
で表されるユニット（Ｂ）２５〜６０モル％、
一般式（３）
−Ｚ1−Ｍ−Ｚ2− （３）
（式中、Ｚ1、Ｚ2はＯ、ＮＨ、ＣＯ、Ｓ、ＮＨＣＯの群から選ばれる２価の置換基を示す。Ｍは主鎖の折り畳み効果を有する非縮合芳香族基、縮合芳香族基、複素環基、脂環基、脂環式複素環基から選ばれる置換基を示す。）
で表されるユニット（Ｃ）０〜２５モル％（ただしユニット（Ａ）、（Ｂ）、（Ｃ）の合計を１００モル％とする）からなることを特徴とし、樹脂単体の熱伝導率が０．４Ｗ／（ｍ・Ｋ）以上である。
(Wherein X represents a divalent substituent selected from the group of O and CO)
Unit (A) having a biphenyl group represented by 25 to 60 mol%,
General formula (2)
-YR-Y- (2)
(In the formula, R represents a divalent linear substituent which may contain a branch having 2 to 20 main chain atoms. Y represents a divalent substituent selected from the group of O and CO.)
Unit (B) represented by 25 to 60 mol%,
General formula (3)
-Z 1 -MZ 2- (3)
(In the formula, Z 1 and Z 2 represent a divalent substituent selected from the group of O, NH, CO, S, and NHCO. M represents a non-condensed aromatic group and a condensed aromatic group having a main chain folding effect. A substituent selected from a group, a heterocyclic group, an alicyclic group, and an alicyclic heterocyclic group.
The unit (C) is represented by 0 to 25 mol% (however, the sum of the units (A), (B), and (C) is 100 mol%), and the thermal conductivity of the resin alone is 0.4 W / (m · K) or more.
本発明で言う熱可塑性とは、加熱により可塑化する性質のことであり、本発明の熱可塑性樹脂は、好ましくは、ユニット（Ａ）が３０〜５５モル％であり、ユニット（Ｂ）が３０〜５５モル％であり、ユニット（Ｃ）が０〜２０モル％である熱可塑性樹脂である。より好ましくは、ユニット（Ａ）が３０〜４８％であり、ユニット（Ｂ）が４５〜５５モル％であり、ユニット（Ｃ）が０〜１５モル％である熱可塑性樹脂である。ユニット（Ｃ）が２６モル％以上であると熱伝導率が低下する場合がある。 The thermoplasticity referred to in the present invention is a property of being plasticized by heating, and the thermoplastic resin of the present invention is preferably such that the unit (A) is 30 to 55 mol% and the unit (B) is 30. It is -55 mol%, and is a thermoplastic resin whose unit (C) is 0-20 mol%. More preferably, it is a thermoplastic resin in which the unit (A) is 30 to 48%, the unit (B) is 45 to 55 mol%, and the unit (C) is 0 to 15 mol%. When the unit (C) is 26 mol% or more, the thermal conductivity may decrease.
本発明の熱可塑性樹脂の熱伝導率は０．４Ｗ／（ｍ・Ｋ）以上であり、好ましくは０．８Ｗ／（ｍ・Ｋ）以上であり、さらに好ましくは１．０Ｗ／（ｍ・Ｋ）以上である。熱伝導率の上限は特に制限されず、高ければ高いほど好ましいが、成形時に磁場、電圧印加、ラビング、延伸等の物理的処理を施さなければ、一般的には３０Ｗ／（ｍ・Ｋ）以下、さらには１０Ｗ／（ｍ・Ｋ）以下となる。 The thermal conductivity of the thermoplastic resin of the present invention is 0.4 W / (m · K) or more, preferably 0.8 W / (m · K) or more, and more preferably 1.0 W / (m · K). ) That's it. The upper limit of the thermal conductivity is not particularly limited and is preferably as high as possible, but generally 30 W / (m · K) or less unless physical treatment such as magnetic field, voltage application, rubbing, and stretching is performed during molding. Further, it becomes 10 W / (m · K) or less.
一般式（１） General formula (1)
（式中、ＸはＯ、ＣＯの群から選ばれる２価の置換基を示す）
中のＸとしては、熱伝導性の優れる樹脂が得られるという観点から、Ｏであることが好ましい。
(Wherein X represents a divalent substituent selected from the group of O and CO)
X in the inside is preferably O from the viewpoint of obtaining a resin having excellent thermal conductivity.
一般式（２）
−Ｙ−Ｒ−Ｙ− （２）
（式中、Ｒは主鎖原子数２〜２０の分岐を含んでもよい２価の直鎖状置換基を示す。ＹはＯ、ＣＯの群から選ばれる２価の置換基を示す）
中のＹとしては、熱伝導性の優れる樹脂が得られるという観点から、ＣＯであることが好ましい。
General formula (2)
-YR-Y- (2)
(In the formula, R represents a divalent linear substituent which may contain a branch having 2 to 20 main chain atoms. Y represents a divalent substituent selected from the group of O and CO.)
Y in the inside is preferably CO from the viewpoint that a resin having excellent thermal conductivity can be obtained.
一般式（２）中のＲは、主鎖原子数２〜２０の分岐を含んでもよい２価の直鎖状置換基を表し、分岐を含まない直鎖の脂肪族炭化水素鎖であることが好ましい。分岐を含む場合、結晶化度が低下し、熱伝導率が低下する場合がある。また、Ｒは飽和でも不飽和でもよいが、飽和脂肪族炭化水素鎖であることが好ましい。不飽和結合を含む場合、十分な屈曲性が得られず、熱伝導率の低下を招く場合がある。Ｒは炭素数２〜２０の直鎖の飽和脂肪族炭化水素鎖であることが好ましく、炭素数４〜１８の直鎖の飽和脂肪族炭化水素鎖であることがより好ましく、特に炭素数８〜１４の直鎖の飽和脂肪族炭化水素鎖であることが好ましい。Ｒの主鎖原子数は偶数であることが好ましい。奇数の場合、結晶化度が低下し、熱伝導率が低下する場合がある。特に熱伝導性の優れる樹脂が得られるという観点から、Ｒは−（ＣＨ2）8−、−（ＣＨ2）10−、−（ＣＨ2）12−から選ばれる少なくとも１種であることが好ましい。 R in the general formula (2) represents a divalent linear substituent which may include a branch having 2 to 20 main chain atoms, and is a linear aliphatic hydrocarbon chain not including a branch. preferable. When branching is included, the crystallinity may be reduced, and the thermal conductivity may be reduced. R may be saturated or unsaturated, but is preferably a saturated aliphatic hydrocarbon chain. When the unsaturated bond is included, sufficient flexibility cannot be obtained, and the thermal conductivity may be lowered. R is preferably a straight chain saturated aliphatic hydrocarbon chain having 2 to 20 carbon atoms, more preferably a straight chain saturated aliphatic hydrocarbon chain having 4 to 18 carbon atoms, particularly 8 to 8 carbon atoms. Preferably, it is a 14 straight chain saturated aliphatic hydrocarbon chain. The number of main chain atoms of R is preferably an even number. In the case of an odd number, the crystallinity may decrease and the thermal conductivity may decrease. In particular, R is preferably at least one selected from — (CH 2 ) 8 —, — (CH 2 ) 10 —, and — (CH 2 ) 12 — from the viewpoint that a resin having excellent thermal conductivity can be obtained. .
一般式（３）
−Ｚ1−Ｍ−Ｚ2− （３）
（式中、Ｚ1、Ｚ2はＯ、ＮＨ、ＣＯ、Ｓ、ＮＨＣＯの群から選ばれる２価の置換基を示す。Ｍは主鎖の折り畳み効果を有する非縮合芳香族基、縮合芳香族基、複素環基、脂環基、脂環式複素環基から選ばれる置換基を示す。）
について、ここで言う主鎖の折り畳み効果とは、高分子主鎖を折り畳むように屈曲させる効果を意味し、主鎖をなす結合どうしの角度が１５０度以下、好ましくは１２０度以下、より好ましくは６０度以下である。一般式（３）中のＭの具体例としては、以下で表される基が挙げられる。
General formula (3)
-Z 1 -MZ 2- (3)
(In the formula, Z 1 and Z 2 represent a divalent substituent selected from the group of O, NH, CO, S, and NHCO. M represents a non-condensed aromatic group and a condensed aromatic group having a main chain folding effect. A substituent selected from a group, a heterocyclic group, an alicyclic group, and an alicyclic heterocyclic group.
The main chain folding effect referred to here means the effect of bending the polymer main chain so as to fold, and the angle between the bonds forming the main chain is 150 degrees or less, preferably 120 degrees or less, more preferably It is 60 degrees or less. Specific examples of M in the general formula (3) include groups represented by the following.
熱伝導性の優れる樹脂が得られるという観点から、好ましい一般式（３）中のＭの具体例としては、以下で表される基が挙げられる。 From the viewpoint of obtaining a resin having excellent thermal conductivity, specific examples of M in the general formula (3) include groups represented by the following.
さらに熱伝導性の優れる樹脂が得られるという観点から、以下で表される基であることがより好ましい。 Further, from the viewpoint of obtaining a resin having excellent thermal conductivity, a group represented by the following is more preferable.
一般式（３）中のＺ1、Ｚ2はＯ、ＮＨ、ＣＯ、Ｓ、ＮＨＣＯの群から選ばれる２価の置換基を表し、熱伝導性の優れる樹脂が得られるという観点から、Ｚ1、Ｚ2はＯ、ＮＨ、ＣＯのいずれかであることが好ましく、Ｚ1、Ｚ2共にＯであることがより好ましい。
本発明における熱可塑性樹脂はサーモトロピック液晶性を示し、液晶相転移温度と等方相転移温度を有する。本発明の熱可塑性樹脂を射出成形する際、樹脂を液晶相転移温度と等方相転移温度の間の温度に加熱して液晶状態で射出すると、高熱伝導性を発現する。ここで言う液晶相転移温度と等方相転移温度とは、示差走査熱量測定（ＤＳＣ）において昇温過程で見られる２つのピークのうち、それぞれ低温側のものと高温側のものである。
Z 1, Z 2 in formula (3) is O, NH, CO, S, from the viewpoint represents a divalent substituent selected from the group consisting of NHCO, thermal conductivity and excellent resin is obtained, Z 1 , Z 2 is preferably any of O, NH, and CO, and more preferably both Z 1 and Z 2 are O.
The thermoplastic resin in the present invention exhibits thermotropic liquid crystallinity and has a liquid crystal phase transition temperature and an isotropic phase transition temperature. When the thermoplastic resin of the present invention is injection molded, when the resin is heated to a temperature between the liquid crystal phase transition temperature and the isotropic phase transition temperature and injected in a liquid crystal state, high thermal conductivity is exhibited. The liquid crystal phase transition temperature and the isotropic phase transition temperature referred to here are the low-temperature side and the high-temperature side, respectively, of two peaks observed in the temperature rising process in differential scanning calorimetry (DSC).
本発明における熱可塑性樹脂の数平均分子量とはポリスチレンを標準とし、本発明における熱可塑性樹脂をｐ−クロロフェノールとトルエンの体積比３：８混合溶媒に０．２５重量％濃度となるように溶解して調製した溶液を用いて、ＧＰＣにて８０℃で測定した値である。本発明における熱可塑性樹脂の数平均分子量は好ましくは３０００〜４００００であり、より好ましくは５０００〜３００００であり、さらに好ましくは７０００〜２００００である。数平均分子量が３０００未満または４００００より大きい場合、同一の一次構造を有する樹脂であっても熱伝導率が０．４Ｗ／（ｍ・Ｋ）未満になる場合がある。 The number average molecular weight of the thermoplastic resin in the present invention is based on polystyrene, and the thermoplastic resin in the present invention is dissolved in a mixed solvent of p-chlorophenol and toluene in a volume ratio of 3: 8 so as to have a concentration of 0.25% by weight. It is the value measured at 80 ° C. by GPC using the prepared solution. The number average molecular weight of the thermoplastic resin in the present invention is preferably 3000 to 40000, more preferably 5000 to 30000, and still more preferably 7000 to 20000. When the number average molecular weight is less than 3000 or greater than 40000, the thermal conductivity may be less than 0.4 W / (m · K) even if the resin has the same primary structure.
本発明に関わる熱可塑性樹脂は、公知のいかなる方法で製造されても構わない。構造の制御が簡便であるという観点から、ビフェニル基の両末端に反応性官能基を有する化合物と、直鎖状置換基Ｒの両末端に反応性官能基を有する化合物と、主鎖の折り畳み効果を有する置換基Ｍに２つの反応性官能基を有する化合物とを反応させて製造する方法が好ましい。このような反応性官能基としては水酸基、カルボキシル基、エステル基、アミノ基、チオール基、イソシアネート基など公知のものを使用でき、これらを反応させる条件も特に限定されない。 The thermoplastic resin according to the present invention may be produced by any known method. From the viewpoint that the control of the structure is simple, a compound having a reactive functional group at both ends of the biphenyl group, a compound having a reactive functional group at both ends of the linear substituent R, and the main chain folding effect A method in which a substituent M having a hydrogen atom is reacted with a compound having two reactive functional groups is preferred. As such a reactive functional group, known ones such as a hydroxyl group, a carboxyl group, an ester group, an amino group, a thiol group, and an isocyanate group can be used, and the conditions for reacting them are not particularly limited.
合成が簡便であるという観点から、ビフェニル基の両末端に反応性官能基を有する化合物と、直鎖状置換基Ｒの両末端に反応性官能基を有する化合物の組合せについては、ビフェニル基の両末端に水酸基を有する化合物と、直鎖状置換基Ｒの両末端にカルボキシル基を有する化合物、または、ビフェニル基の両末端にカルボキシル基またはエステル基を有する化合物と、直鎖状置換基Ｒの両末端に水酸基を有する化合物の組合せが好ましい。また、主鎖の折り畳み効果を有する置換基Ｍに２つの反応性官能基を有する化合物については、主鎖の折り畳み効果を有する置換基Ｍに水酸基、カルボキシル基、エステル基、アミノ基のいずれか少なくとも１種を有することが好ましい。 From the viewpoint of easy synthesis, a combination of a compound having a reactive functional group at both ends of the biphenyl group and a compound having a reactive functional group at both ends of the linear substituent R is Both a compound having a hydroxyl group at the end, a compound having a carboxyl group at both ends of the linear substituent R, or a compound having a carboxyl group or an ester group at both ends of the biphenyl group, and both of the linear substituent R A combination of compounds having a hydroxyl group at the terminal is preferred. In addition, for a compound having two reactive functional groups in the substituent M having a main chain folding effect, the substituent M having a main chain folding effect has at least one of a hydroxyl group, a carboxyl group, an ester group, and an amino group. It is preferable to have one.
ビフェニル基の両末端に水酸基を有する化合物と、直鎖状置換基Ｒの両末端にカルボキシル基を有する化合物と、主鎖の折り畳み効果を有する置換基Ｍに水酸基を有する化合物からなる熱可塑性樹脂の製造方法の一例としては、化合物の水酸基を無水酢酸等の低級脂肪酸を用いてそれぞれ個別に、または一括して低級脂肪酸エステルとした後、別の反応槽または同一の反応槽で、直鎖状置換基Ｒの両末端にカルボキシル基を有する化合物と脱低級脂肪酸重縮合反応させる方法が挙げられる。重縮合反応は、実質的に溶媒の存在しない状態で、通常２２０〜３３０℃、好ましくは２４０〜３１０℃の温度で、窒素等の不活性ガスの存在下、常圧または減圧下に、０．５〜５時間行われる。反応温度が２２０℃より低いと反応の進行は遅く、３３０℃より高い場合は分解等の副反応が起こりやすい。減圧下で反応させる場合は段階的に減圧度を高くすることが好ましい。急激に高真空度まで減圧した場合、直鎖状置換基Ｒを有するモノマー、主鎖の折り畳み効果を有するモノマーが揮発し、望む組成、または分子量の樹脂が得られない場合がある。到達真空度は４０Ｔｏｒｒ以下が好ましく、３０Ｔｏｒｒ以下がより好ましく、２０Ｔｏｒｒ以下がさらに好ましく、１０Ｔｏｒｒ以下が特に好ましい。真空度が４０Ｔｏｒｒより高い場合、十分に脱酸が進まず、低分子量の樹脂が得られることがある。多段階の反応温度を採用してもかまわないし、場合により昇温中あるいは最高温度に達したらすぐに反応生成物を溶融状態で抜き出し、回収することもできる。得られた熱可塑性樹脂はそのままで使用してもよいし、未反応原料を除去する、または、物性を上げる意味から固相重合を行なうこともできる。固相重合を行なう場合には、得られた熱可塑性樹脂を３ｍｍ以下、好ましくは１ｍｍ以下の粒径の粒子に機械的に粉砕し、固相状態のまま１００〜３５０℃で窒素等の不活性ガス雰囲気下、または減圧下に１〜３０時間処理することが好ましい。ポリマー粒子の粒径が３ｍｍより大きくなると、処理が十分でなく、物性上の問題を生じるため好ましくない。固相重合時の処理温度や昇温速度は、熱可塑性樹脂粒子どうしが融着を起こさないように選ぶことが好ましい。 A thermoplastic resin comprising a compound having a hydroxyl group at both ends of a biphenyl group, a compound having a carboxyl group at both ends of a linear substituent R, and a compound having a hydroxyl group at a substituent M having a main chain folding effect As an example of the production method, the hydroxyl group of the compound is individually or collectively converted into a lower fatty acid ester using a lower fatty acid such as acetic anhydride, and then substituted with a straight chain in another reaction vessel or the same reaction vessel. Examples include a method in which a compound having a carboxyl group at both ends of the group R is subjected to a delowering fatty acid polycondensation reaction. The polycondensation reaction is carried out at a temperature of usually 220 to 330 ° C., preferably 240 to 310 ° C. in the presence of substantially no solvent, in the presence of an inert gas such as nitrogen, at normal pressure or reduced pressure, and at a pressure of 0. 5 to 5 hours. When the reaction temperature is lower than 220 ° C, the reaction proceeds slowly, and when it is higher than 330 ° C, side reactions such as decomposition tend to occur. When making it react under reduced pressure, it is preferable to raise a pressure reduction degree in steps. When the pressure is rapidly reduced to a high degree of vacuum, the monomer having the linear substituent R and the monomer having the main chain folding effect volatilize, and a resin having a desired composition or molecular weight may not be obtained. The ultimate vacuum is preferably 40 Torr or less, more preferably 30 Torr or less, further preferably 20 Torr or less, and particularly preferably 10 Torr or less. When the degree of vacuum is higher than 40 Torr, deoxidation does not proceed sufficiently and a low molecular weight resin may be obtained. A multi-stage reaction temperature may be employed. In some cases, the reaction product can be withdrawn in a molten state and recovered as soon as the temperature rises or when the maximum temperature is reached. The obtained thermoplastic resin may be used as it is, or it may be subjected to solid phase polymerization in order to remove unreacted raw materials or to improve physical properties. In the case of performing solid phase polymerization, the obtained thermoplastic resin is mechanically pulverized into particles having a particle size of 3 mm or less, preferably 1 mm or less, and inert such as nitrogen at 100 to 350 ° C. in the solid state. The treatment is preferably performed in a gas atmosphere or under reduced pressure for 1 to 30 hours. If the particle size of the polymer particles is larger than 3 mm, the treatment is not sufficient, and problems with physical properties are caused, which is not preferable. It is preferable to select the treatment temperature and the rate of temperature increase during solid phase polymerization so that the thermoplastic resin particles do not cause fusion.
本発明における熱可塑性樹脂の製造に用いられる低級脂肪酸の酸無水物としては、炭素数２〜５個の低級脂肪酸の酸無水物、例えば無水酢酸、無水プロピオン酸、無水モノクロル酢酸、無水ジクロル酢酸、無水トリクロル酢酸、無水モノブロム酢酸、無水ジブロム酢酸、無水トリブロム酢酸、無水モノフルオロ酢酸、無水ジフルオロ酢酸、無水トリフルオロ酢酸、無水酪酸、無水イソ酪酸、無水吉草酸、無水ピバル酸等が挙げられるが、無水酢酸、無水プロピオン酸、無水トリクロル酢酸が特に好適に用いられる。低級脂肪酸の酸無水物の使用量は、用いるモノマーが有する水酸基とアミノ基の合計に対し１．０１〜１．５倍当量、好ましくは１．０２〜１．２倍当量である。１．０１倍当量未満である場合、低級脂肪酸の酸無水物が揮発することによって、水酸基とアミノ基が低級脂肪酸の無水物と反応しきらないことがあり、低分子量の樹脂が得られることがある。その他、ビフェニル基の両末端にカルボキシル基またはエステル基を有する化合物と、置換基Ｒの両末端に水酸基を有する化合物と、主鎖の折り畳み効果を有する置換基Ｍにカルボキシル基またはエステル基を有する化合物からなる熱可塑性樹脂の製造方法については例えば、特開平２−２５８８６４号公報に記載のように４，４’−ビフェニルジカルボン酸ジメチルと脂肪族ジオールを溶融重合する方法が挙げられる。 Examples of the acid anhydride of the lower fatty acid used in the production of the thermoplastic resin in the present invention include acid anhydrides of lower fatty acids having 2 to 5 carbon atoms, such as acetic anhydride, propionic anhydride, monochloroacetic anhydride, dichloroacetic anhydride, Trichloroacetic anhydride, monobromoacetic anhydride, dibromoacetic anhydride, tribromoacetic anhydride, monofluoroacetic anhydride, difluoroacetic anhydride, trifluoroacetic anhydride, butyric anhydride, isobutyric anhydride, valeric anhydride, pivalic anhydride, etc. Acetic anhydride, propionic anhydride, and trichloroacetic anhydride are particularly preferably used. The amount of the lower fatty acid anhydride used is 1.01 to 1.5 times equivalent, preferably 1.02 to 1.2 times equivalent to the total of hydroxyl groups and amino groups of the monomers used. When the amount is less than 1.01 equivalent, the lower fatty acid anhydride may volatilize, whereby the hydroxyl group and amino group may not completely react with the lower fatty acid anhydride, and a low molecular weight resin may be obtained. is there. In addition, a compound having a carboxyl group or an ester group at both ends of the biphenyl group, a compound having a hydroxyl group at both ends of the substituent R, and a compound having a carboxyl group or an ester group at the substituent M having a main chain folding effect As a method for producing a thermoplastic resin comprising, for example, a method of melt polymerization of dimethyl 4,4′-biphenyldicarboxylate and an aliphatic diol as described in JP-A-2-258864 is mentioned.
本発明の熱可塑性樹脂の製造には触媒を使用してもよい。触媒としては、従来からポリエステルの重合用触媒として公知のものを使用することができ、例えば、酢酸マグネシウム、酢酸第一錫、テトラブチルチタネート、酢酸鉛、酢酸ナトリウム、酢酸カリウム、三酸化アンチモン等の金属塩触媒、Ｎ,Ｎ−ジメチルアミノピリジン、Ｎ−メチルイミダゾール等の有機化合物触媒を挙げることができる。 You may use a catalyst for manufacture of the thermoplastic resin of this invention. As the catalyst, conventionally known polyester polymerization catalysts can be used, such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, antimony trioxide and the like. Mention may be made of organic compound catalysts such as metal salt catalysts, N, N-dimethylaminopyridine, N-methylimidazole and the like.
前記触媒の添加量としては、熱可塑性樹脂の総重量に対し、通常、０．１×１０-2〜１００×１０-2重量％、好ましくは０．５×１０-2〜５０×１０-2重量％、さらに好ましくは１×１０-2〜１０×１０-2重量％用いられる。 The amount of the catalyst added is usually 0.1 × 10 −2 to 100 × 10 −2 wt%, preferably 0.5 × 10 −2 to 50 × 10 −2, based on the total weight of the thermoplastic resin. % By weight, more preferably 1 × 10 −2 to 10 × 10 −2 % by weight is used.
本発明の熱可塑性樹脂の末端構造は特に限定されないが、射出成形に適した樹脂が得られるという観点から、水酸基、カルボキシル基、エステル基、アシル基、アルコキシ基、アミノ基、アミド基、チオール基、イソシアネート基、アルキル基などによって末端が封止されていることが好ましい。末端にエポキシ基、マレイミド基などの反応性が高い官能基を有する場合、樹脂が熱硬化性となり、射出成形性が損なわれることがある。高い熱伝導性を示すという観点から、末端構造はカルボキシル基、またはアルキル基であることが特に好ましい。末端構造がカルボキシル基である場合、分子鎖の全末端に対するカルボキシル基の割合は６０モル％以上であり、好ましくは７０モル％以上であり、より好ましくは８０モル％以上である。６０モル％未満の場合は、無機充填剤を配合した際に、末端のカルボキシル基が６０モル％以上の樹脂と比較して樹脂組成物の熱伝導率が低くなることがある。末端構造がアルキル基である場合、炭素数１〜２０の１〜３級アルコール、または脂肪族モノカルボン酸で末端封止したものが好ましく、炭素数１〜２０の脂肪族モノカルボン酸がより好ましく、炭素数１０〜２０の脂肪族モノカルボン酸がさらに好ましい。
本発明に用いられる窒化アルミニウム（ｉｉ）は、粉末であっても、粉末を酸化イットリウムなどの焼結助剤とともに高温焼結した焼結体であってもよい。また、本発明において用いられる窒化アルミニウム（ｉｉ）は、その製造方法を問わず、アルミニウム粉末と窒素ガスとの反応によって合成する直接窒化法で製造したものでも、アルミナ粉末と炭素粉末、窒素ガスによって合成する還元窒化法で製造したものでもよい。
The terminal structure of the thermoplastic resin of the present invention is not particularly limited, but from the viewpoint of obtaining a resin suitable for injection molding, a hydroxyl group, a carboxyl group, an ester group, an acyl group, an alkoxy group, an amino group, an amide group, a thiol group It is preferable that the terminal is sealed with an isocyanate group, an alkyl group or the like. When the terminal has a highly reactive functional group such as an epoxy group or a maleimide group, the resin becomes thermosetting and the injection moldability may be impaired. From the viewpoint of exhibiting high thermal conductivity, the terminal structure is particularly preferably a carboxyl group or an alkyl group. When the terminal structure is a carboxyl group, the ratio of the carboxyl group with respect to all the ends of the molecular chain is 60 mol% or more, preferably 70 mol% or more, more preferably 80 mol% or more. When it is less than 60 mol%, when an inorganic filler is blended, the thermal conductivity of the resin composition may be lower than that of a resin having a terminal carboxyl group of 60 mol% or more. When the terminal structure is an alkyl group, a C1-C20 primary to tertiary alcohol or an aliphatic monocarboxylic acid end-capped is preferable, and a C1-C20 aliphatic monocarboxylic acid is more preferable. Further, an aliphatic monocarboxylic acid having 10 to 20 carbon atoms is more preferable.
The aluminum nitride (ii) used in the present invention may be a powder or a sintered body obtained by sintering the powder at a high temperature together with a sintering aid such as yttrium oxide. In addition, the aluminum nitride (ii) used in the present invention is manufactured by a direct nitriding method synthesized by a reaction between aluminum powder and nitrogen gas, regardless of the manufacturing method. What was manufactured by the reductive nitriding method to synthesize | combine may be used.
本発明に用いられる窒化アルミニウム（ｉｉ）の粒子形状は、球状、破砕状、ウィスカー状、繊維状、テトラポット状など、特に規定しない。 The particle shape of aluminum nitride (ii) used in the present invention is not particularly defined as spherical, crushed, whiskered, fibrous, tetrapotted, or the like.
本発明に用いられる窒化アルミニウム（ｉｉ）は、高い熱伝導性を有する樹脂組成物が得られるという観点から、その粒子径は大きいものほど好ましい。しかし、あまりに粒子径が大きすぎると、粒子表面の凹凸により、伝熱抵抗となる空気層が形成されやすくなる、成形加工の過程で押出混練機や射出成形機などの金属部を磨耗する、などの問題が起こりうるので、平均粒子径は１〜８０μｍであることが望ましく、１〜６０μｍであることがより好ましい。 From the viewpoint of obtaining a resin composition having high thermal conductivity, aluminum nitride (ii) used in the present invention is preferably as large as possible. However, if the particle diameter is too large, an air layer that becomes a heat transfer resistance is likely to be formed due to irregularities on the particle surface, and metal parts such as extrusion kneaders and injection molding machines are worn during the molding process, etc. Therefore, the average particle size is preferably 1 to 80 μm, and more preferably 1 to 60 μm.
本発明に用いられる窒化アルミニウム（ｉｉ）の含有量は、本発明の熱可塑性樹脂１００重量部に対して、５０〜２５０重量部であり、より好ましくは８０〜２００重量部である。５０重量部未満の場合、十分な熱伝導性が得られにくく、２５０重量部より多い場合、樹脂組成物の流動性を低下させたり、成形加工の過程で押出混練機や射出成形機などの金属部を磨耗させたりする場合がある。 Content of aluminum nitride (ii) used for this invention is 50-250 weight part with respect to 100 weight part of thermoplastic resins of this invention, More preferably, it is 80-200 weight part. When it is less than 50 parts by weight, it is difficult to obtain sufficient thermal conductivity, and when it is more than 250 parts by weight, the fluidity of the resin composition is lowered, or a metal such as an extrusion kneader or an injection molding machine is formed during the molding process. The part may be worn out.
本発明における窒化アルミニウム（ｉｉ）は、樹脂との界面の接着性を高めたり、分散性を高めたり、作業性を容易にしたりするため、シラン処理剤等の各種表面処理剤で表面処理がなされたものであってもよい。表面処理剤としては特に限定されず、例えばシランカップリング剤、チタネートカップリング剤等従来公知のものを使用することができる。中でも、エポキシシラン等のエポキシ基含有シランカップリング剤、及び、アミノシラン等のアミノ基含有シランカップリング剤、ポリオキシエチレンシラン等が樹脂の物性を低下させることが少ないため好ましい。無機化合物の表面処理方法としては特に限定されず、通常の処理方法を利用できる。表面処理によって、窒化アルミニウム表面に薄い被膜が形成され、樹脂との界面の接着性が向上するとともに、耐水性を著しく向上することができる。 The aluminum nitride (ii) in the present invention is surface-treated with various surface treatment agents such as a silane treatment agent in order to enhance the adhesiveness at the interface with the resin, enhance the dispersibility, and facilitate the workability. It may be. It does not specifically limit as a surface treating agent, For example, conventionally well-known things, such as a silane coupling agent and a titanate coupling agent, can be used. Among them, an epoxy group-containing silane coupling agent such as epoxy silane, an amino group-containing silane coupling agent such as aminosilane, polyoxyethylene silane, and the like are preferable because they hardly reduce the physical properties of the resin. The surface treatment method of the inorganic compound is not particularly limited, and a normal treatment method can be used. By the surface treatment, a thin film is formed on the surface of the aluminum nitride, the adhesiveness at the interface with the resin is improved, and the water resistance can be remarkably improved.
本発明の熱可塑性樹脂組成物の熱伝導率は、好ましくは０．４Ｗ／（ｍ・Ｋ）以上であり、より好ましくは１．０Ｗ／（ｍ・Ｋ）以上、さらに好ましくは５．０Ｗ／（ｍ・Ｋ）以上、特に好ましくは１０Ｗ／（ｍ・Ｋ）以上である。この熱伝導率が０．４Ｗ／（ｍ・Ｋ）未満であると、電子部品から発生する熱を効率的に外部に伝えることが困難である。熱伝導率の上限は特に制限されず、高ければ高いほど好ましいが、一般的には１００Ｗ／（ｍ・Ｋ）以下、さらには８０Ｗ／（ｍ・Ｋ）以下のものが用いられる。本発明に用いられる熱可塑性樹脂は、優れた熱伝導性を有するため、上記の範囲の熱伝導率を有する高熱伝導性熱可塑性樹脂組成物を容易に得ることが可能となる。 The thermal conductivity of the thermoplastic resin composition of the present invention is preferably 0.4 W / (m · K) or more, more preferably 1.0 W / (m · K) or more, and even more preferably 5.0 W / (M · K) or more, particularly preferably 10 W / (m · K) or more. When the thermal conductivity is less than 0.4 W / (m · K), it is difficult to efficiently transmit the heat generated from the electronic component to the outside. The upper limit of the thermal conductivity is not particularly limited, and is preferably as high as possible. Generally, a thermal conductivity of 100 W / (m · K) or less, further 80 W / (m · K) or less is used. Since the thermoplastic resin used in the present invention has excellent thermal conductivity, it is possible to easily obtain a highly thermally conductive thermoplastic resin composition having a thermal conductivity in the above range.
本発明における樹脂組成物には、本発明の効果を損なわない範囲でさらに無機充填剤を加えてもよい。無機充填剤としては、公知の充填剤を広く使用できる。無機充填剤単体での熱伝導率は好ましくは１Ｗ／（ｍ・Ｋ）以上、より好ましくは１０Ｗ／（ｍ・Ｋ）以上、さらに好ましくは２０Ｗ／（ｍ・Ｋ）以上、特に好ましくは３０Ｗ／（ｍ・Ｋ）以上のものが用いられる。無機充填剤単体での熱伝導率の上限は特に制限されず、高ければ高いほど好ましいが、一般的には３０００Ｗ／（ｍ・Ｋ）以下、さらには２５００Ｗ／（ｍ・Ｋ）以下のものが好ましく用いられる。 An inorganic filler may be further added to the resin composition in the present invention as long as the effects of the present invention are not impaired. A wide variety of known fillers can be used as the inorganic filler. The thermal conductivity of the inorganic filler alone is preferably 1 W / (m · K) or more, more preferably 10 W / (m · K) or more, further preferably 20 W / (m · K) or more, particularly preferably 30 W / The thing more than (m * K) is used. The upper limit of the thermal conductivity of the inorganic filler alone is not particularly limited, and it is preferably as high as possible. Generally, it is 3000 W / (m · K) or less, more preferably 2500 W / (m · K) or less. Preferably used.
無機充填剤の使用量は、好ましくは熱可塑性樹脂と、無機充填剤と窒化アルミニウムの混合物の体積比で９０：１０〜３０：７０であり、より好ましくは８０：２０〜４０：６０であり、特に好ましくは７０：３０〜５０：５０である。熱可塑性樹脂と、無機充填剤と窒化アルミニウムの混合物の体積比が１００：０〜９０：１０では満足な熱伝導率が得られないことがある。熱可塑性樹脂と、無機充填剤と窒化アルミニウムの混合物の体積比が３０：７０〜０：１００では機械物性が低下することがある。本発明の熱可塑性樹脂が優れた熱伝導性を有するため、熱可塑性樹脂と、無機充填剤と窒化アルミニウムの混合物の体積比で９０：１０〜７０：３０と少量の場合でも、樹脂組成物は優れた熱伝導性を有し、さらに同時に無機充填剤の使用量が少量のために密度を下げることができる。熱伝導性に優れ、かつ密度が小さいことは電気・電子工業分野、自動車分野等さまざまな状況で放熱・伝熱用樹脂材料として用いる際に有利である。 The amount of the inorganic filler used is preferably 90:10 to 30:70, more preferably 80:20 to 40:60, by volume ratio of the thermoplastic resin and the mixture of the inorganic filler and aluminum nitride, Most preferably, it is 70: 30-50: 50. If the volume ratio of the mixture of the thermoplastic resin, the inorganic filler and the aluminum nitride is 100: 0 to 90:10, satisfactory thermal conductivity may not be obtained. When the volume ratio of the mixture of the thermoplastic resin, the inorganic filler and the aluminum nitride is 30:70 to 0: 100, the mechanical properties may be lowered. Since the thermoplastic resin of the present invention has excellent thermal conductivity, even when the volume ratio of the thermoplastic resin and the mixture of the inorganic filler and aluminum nitride is as small as 90:10 to 70:30, the resin composition is It has excellent thermal conductivity, and at the same time, the density can be lowered due to the small amount of inorganic filler used. The excellent thermal conductivity and low density are advantageous when used as a heat-dissipating / heat-transfer resin material in various situations such as in the electric / electronic industry and automobile fields.
樹脂組成物として特に電気絶縁性が要求されない用途に用いる場合には、無機充填剤としては金属系化合物や導電性炭素化合物等が好適に用いられる。これらの中でも、熱伝導性に優れることから、グラファイト、炭素繊維等の導電性炭素材料、各種金属を微粒子化した導電性金属粉、各種金属を繊維状に加工した導電性金属繊維、軟磁性フェライト等の各種フェライト類、酸化亜鉛等の金属酸化物、等の無機充填剤を好適に用いることができる。 When the resin composition is used for applications that do not require electrical insulation, a metal compound, a conductive carbon compound, or the like is preferably used as the inorganic filler. Among these, since it is excellent in thermal conductivity, conductive carbon materials such as graphite and carbon fibers, conductive metal powders obtained by atomizing various metals, conductive metal fibers obtained by processing various metals into fibers, soft magnetic ferrite Inorganic fillers such as various ferrites such as zinc oxide and metal oxides such as zinc oxide can be suitably used.
樹脂組成物として電気絶縁性が要求される用途に用いる場合には、無機充填剤としては電気絶縁性を示す化合物が好適に用いられる。電気絶縁性とは具体的には、電気抵抗率１Ω・ｃｍ以上のものを示すこととするが、好ましくは１０Ω・ｃｍ以上、より好ましくは１０5Ω・ｃｍ以上、さらに好ましくは１０10Ω・ｃｍ以上、最も好ましくは１０13Ω・ｃｍ以上のものを用いるのが好ましい。電気抵抗率の上限には特に制限は無いが、一般的には１０18Ω・ｃｍ以下である。本発明の高熱伝導性熱可塑性樹脂組成物から得られる成形体の電気絶縁性も上記範囲にあることが好ましい。 When the resin composition is used for applications requiring electrical insulation, a compound showing electrical insulation is suitably used as the inorganic filler. Specifically, the electrical insulating property indicates an electrical resistivity of 1 Ω · cm or more, preferably 10 Ω · cm or more, more preferably 10 5 Ω · cm or more, and further preferably 10 10 Ω · cm or more. It is preferable to use a material having a thickness of cm or more, most preferably 10 13 Ω · cm or more. The upper limit of the electrical resistivity is not particularly limited, but is generally 10 18 Ω · cm or less. It is preferable that the electrical insulation of the molded product obtained from the high thermal conductivity thermoplastic resin composition of the present invention is also in the above range.
無機充填剤のうち、電気絶縁性を示す化合物としては具体的には、酸化アルミニウム、酸化マグネシウム、酸化ケイ素、酸化ベリリウム、酸化銅、亜酸化銅等の金属酸化物、窒化ホウ素、窒化ケイ素等の金属窒化物、炭化ケイ素等の金属炭化物、炭酸マグネシウムなどの金属炭酸塩、ダイヤモンド等の絶縁性炭素材料、水酸化アルミニウム、水酸化マグネシウム等の金属水酸化物が挙げられる。これらは単独あるいは複数種類を組み合わせて用いることができる。 Among the inorganic fillers, specific examples of the compound that exhibits electrical insulation include metal oxides such as aluminum oxide, magnesium oxide, silicon oxide, beryllium oxide, copper oxide, and cuprous oxide, boron nitride, and silicon nitride. Examples thereof include metal nitrides, metal carbides such as silicon carbide, metal carbonates such as magnesium carbonate, insulating carbon materials such as diamond, and metal hydroxides such as aluminum hydroxide and magnesium hydroxide. These can be used alone or in combination.
無機充填剤の形状については、種々の形状のものを適応可能である。例えば粒子状、微粒子状、ナノ粒子、凝集粒子状、チューブ状、ナノチューブ状、ワイヤ状、ロッド状、針状、板状、不定形、ラグビーボール状、六面体状、大粒子と微小粒子とが複合化した複合粒子状、液体等種々の形状が挙げられる。またこれら無機充填剤は天然物であってもよいし、合成されたものであってもよい。天然物の場合、産地等には特に限定はなく、適宜選択することができる。これら無機充填剤は、１種類のみを単独で用いてもよいし、形状、平均粒子径、種類、表面処理剤等が異なる２種類以上を併用してもよい。 Various shapes of the inorganic filler can be applied. For example, particles, fine particles, nanoparticles, aggregated particles, tubes, nanotubes, wires, rods, needles, plates, irregular shapes, rugby balls, hexahedrons, large particles and fine particles are combined Various shapes such as converted composite particles and liquids can be mentioned. These inorganic fillers may be natural products or synthesized ones. In the case of a natural product, there are no particular limitations on the production area and the like, which can be selected as appropriate. These inorganic fillers may be used alone or in combination of two or more different shapes, average particle diameters, types, surface treatment agents and the like.
これら無機充填剤は、樹脂と無機化合物との界面の接着性を高めたり、作業性を容易にしたりするため、シラン処理剤等の各種表面処理剤で表面処理がなされたものであってもよい。表面処理剤としては特に限定されず、例えばシランカップリング剤、チタネートカップリング剤等従来公知のものを使用することができる。中でも、エポキシシラン等のエポキシ基含有シランカップリング剤、及び、アミノシラン等のアミノ基含有シランカップリング剤、ポリオキシエチレンシラン等が樹脂の物性を低下させることが少ないため好ましい。無機化合物の表面処理方法としては特に限定されず、通常の処理方法を利用できる。 These inorganic fillers may have been subjected to surface treatment with various surface treatment agents such as a silane treatment agent in order to enhance the adhesion at the interface between the resin and the inorganic compound or to facilitate workability. . It does not specifically limit as a surface treating agent, For example, conventionally well-known things, such as a silane coupling agent and a titanate coupling agent, can be used. Among them, an epoxy group-containing silane coupling agent such as epoxy silane, an amino group-containing silane coupling agent such as aminosilane, polyoxyethylene silane, and the like are preferable because they hardly reduce the physical properties of the resin. The surface treatment method of the inorganic compound is not particularly limited, and a normal treatment method can be used.
本発明の熱可塑性樹脂組成物には、前記の窒化アルミニウム（ｉｉ）、および無機充填剤以外にも、その目的に応じて公知の充填剤を広く使用することができる。樹脂単体の熱伝導率が高いために、公知の充填剤の熱伝導率が１０Ｗ／（ｍ・Ｋ）未満と比較的低くても、樹脂組成物として高い熱伝導率を有する。無機充填剤以外の充填剤としては、例えばケイソウ土粉、塩基性ケイ酸マグネシウム、焼成クレイ、微粉末シリカ、石英粉末、結晶シリカ、カオリン、タルク、三酸化アンチモン、微粉末マイカ、二硫化モリブデン、ロックウール、セラミック繊維、アスベスト等の無機質繊維、及び、ガラス繊維、ガラスパウダー、ガラスクロス、溶融シリカ等のガラス製充填剤が挙げられる。これら充填剤を用いることで、例えば熱伝導性、機械強度、または耐摩耗性など樹脂組成物を応用する上で好ましい特性を向上させることが可能となる。さらに必要に応じて紙、パルプ、木材、ポリアミド繊維、アラミド繊維、ボロン繊維等の合成繊維、ポリオレフィン粉末等の樹脂粉末、等の有機充填剤を併用して配合することができる。 In addition to the aluminum nitride (ii) and the inorganic filler, known fillers can be widely used in the thermoplastic resin composition of the present invention depending on the purpose. Since the thermal conductivity of the single resin is high, the resin composition has a high thermal conductivity even if the thermal conductivity of the known filler is relatively low as less than 10 W / (m · K). Examples of fillers other than inorganic fillers include diatomaceous earth powder, basic magnesium silicate, calcined clay, fine powder silica, quartz powder, crystalline silica, kaolin, talc, antimony trioxide, fine powder mica, molybdenum disulfide, Examples thereof include inorganic fibers such as rock wool, ceramic fibers, and asbestos, and glass fillers such as glass fibers, glass powder, glass cloth, and fused silica. By using these fillers, for example, it is possible to improve favorable characteristics in applying a resin composition such as thermal conductivity, mechanical strength, or abrasion resistance. Furthermore, if necessary, organic fillers such as paper, pulp, wood, polyamide fiber, aramid fiber, boron fiber and other synthetic fibers, polyolefin powder and the like can be used in combination.
本発明の熱可塑性樹脂組成物には、本発明の効果の発揮を失わない範囲で、エポキシ樹脂、ポリオレフィン樹脂、ビスマレイミド樹脂、ポリイミド樹脂、ポリエーテル樹脂、フェノール樹脂、シリコーン樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリエステル樹脂、フッ素樹脂、アクリル樹脂、メラミン樹脂、ユリア樹脂、ウレタン樹脂等いかなる公知の樹脂も含有させて構わない。好ましい樹脂の具体例として、ポリカーボネート、ポリエチレンテレフタレート、ポリブチレンテレフタレート、液晶ポリマー、ナイロン６、ナイロン６，６等が挙げられる。これら樹脂の使用量は、通常樹脂組成物に含まれる本発明の熱可塑性樹脂１００重量部に対し、０〜１００００重量部の範囲である。 The thermoplastic resin composition of the present invention includes an epoxy resin, a polyolefin resin, a bismaleimide resin, a polyimide resin, a polyether resin, a phenol resin, a silicone resin, a polycarbonate resin, and a polyamide as long as the effects of the present invention are not lost. Any known resin such as resin, polyester resin, fluorine resin, acrylic resin, melamine resin, urea resin, urethane resin may be contained. Specific examples of preferred resins include polycarbonate, polyethylene terephthalate, polybutylene terephthalate, liquid crystal polymer, nylon 6, nylon 6,6 and the like. The amount of these resins used is in the range of 0 to 10,000 parts by weight with respect to 100 parts by weight of the thermoplastic resin of the present invention usually contained in the resin composition.
本発明の熱可塑性樹脂組成物には、前記樹脂や窒化アルミニウム、無機充填剤以外の添加剤として、さらに目的に応じて他のいかなる成分、例えば、補強剤、増粘剤、離型剤、カップリング剤、難燃剤、耐炎剤、顔料、着色剤、その他の助剤等を本発明の効果を失わない範囲で、添加することができる。これらの添加剤の使用量は、熱可塑性樹脂１００重量部に対し、合計で０〜２０重量部の範囲であることが好ましい。 In the thermoplastic resin composition of the present invention, as an additive other than the resin, aluminum nitride, and inorganic filler, any other component depending on the purpose, for example, a reinforcing agent, a thickener, a release agent, a cup A ring agent, a flame retardant, a flame retardant, a pigment, a colorant, other auxiliary agents, and the like can be added as long as the effects of the present invention are not lost. The amount of these additives used is preferably in the range of 0 to 20 parts by weight in total with respect to 100 parts by weight of the thermoplastic resin.
本発明の熱可塑性樹脂組成物の製造方法としては特に限定されるものではない。例えば、上述した成分や添加剤等を乾燥させた後、単軸、２軸等の押出機のような溶融混練機にて溶融混練することにより製造することができる。また、配合成分が液体である場合は、液体供給ポンプ等を用いて溶融混練機に途中添加して製造することもできる。 It does not specifically limit as a manufacturing method of the thermoplastic resin composition of this invention. For example, it can be produced by drying the above-described components, additives and the like and then melt-kneading them in a melt-kneader such as a single-screw or twin-screw extruder. Moreover, when a compounding component is a liquid, it can also manufacture by adding to a melt-kneader on the way using a liquid supply pump etc.
本発明の熱可塑性樹脂組成物は、電子材料、磁性材料、触媒材料、構造体材料、光学材料、医療材料、自動車材料、建築材料等の各種の用途に幅広く用いることが可能である。特に優れた成形加工性、高熱伝導性という優れた特性を併せ持つことから、放熱・伝熱用樹脂材料として非常に有用である。 The thermoplastic resin composition of the present invention can be widely used in various applications such as electronic materials, magnetic materials, catalyst materials, structural materials, optical materials, medical materials, automobile materials, and building materials. In particular, it has excellent properties such as excellent moldability and high thermal conductivity, so it is very useful as a resin material for heat dissipation and heat transfer.
本発明の熱可塑性樹脂組成物は、家電、ＯＡ機器部品、ＡＶ機器部品、自動車内外装部品等の射出成形品等に好適に使用することができる。特に多くの熱を発する家電製品やＯＡ機器において、外装材料として好適に用いることができる。さらには発熱源を内部に有するがファン等による強制冷却が困難な電子機器において、内部で発生する熱を外部へ放熱するために、これらの機器の外装材として好適に用いられる。これらの中でも好ましい装置として、ノートパソコンなどの携帯型コンピューター、ＰＤＡ、携帯電話、携帯ゲーム機、携帯型音楽プレーヤー、携帯型ＴＶ／ビデオ機器、携帯型ビデオカメラ等の小型あるいは携帯型電子機器類の筐体、ハウジング、外装材用樹脂として非常に有用である。また自動車や電車等におけるバッテリー周辺用樹脂、家電機器の携帯バッテリー用樹脂、ブレーカー等の配電部品用樹脂、モーター等の封止用材料としても非常に有用に用いることができる。 The thermoplastic resin composition of the present invention can be suitably used for injection molded products such as home appliances, OA equipment parts, AV equipment parts, automobile interior and exterior parts, and the like. In particular, it can be suitably used as an exterior material in home appliances and office automation equipment that generate a lot of heat. Furthermore, in an electronic device having a heat source inside but difficult to be forcibly cooled by a fan or the like, it is suitably used as an exterior material for these devices in order to dissipate the heat generated inside to the outside. Among these, preferable devices include portable computers such as notebook computers, PDAs, cellular phones, portable game machines, portable music players, portable TV / video devices, portable video cameras, and other small or portable electronic devices. It is very useful as a resin for casings, housings, and exterior materials. It can also be used very effectively as a resin for battery peripherals in automobiles, trains, etc., a resin for portable batteries in home appliances, a resin for power distribution parts such as breakers, and a sealing material for motors and the like.
本発明の熱可塑性樹脂組成物は、従来良く知られている樹脂および樹脂組成物に比べて、一層高熱伝導化することができ、また成形加工性が良好であるため、上記の用途における部品あるいは筐体用として有用な特性を有するものである。
The thermoplastic resin composition of the present invention can be made higher in thermal conductivity than resin and resin compositions well known in the art, and has good molding processability. It has characteristics useful for a housing.
次に、本発明の熱可塑性樹脂組成物について、製造例、実施例及び比較例を挙げさらに詳細に説明するが、本発明はかかる実施例のみに制限されるものではない。なお、以下に挙げる各試薬は特記しない限り、和光純薬工業製の試薬を精製せずに用いた。 Next, although the manufacture example, an Example, and a comparative example are given and demonstrated further in detail about the thermoplastic resin composition of this invention, this invention is not restrict | limited only to this Example. Unless otherwise specified, the reagents listed below were used without purification from Wako Pure Chemical Industries.
［評価方法］
数平均分子量：本発明に用いる熱可塑性樹脂をｐ−クロロフェノール（東京化成工業製）とトルエンの体積比３：８混合溶媒に０．２５重量％濃度となるように溶解して試料を調製した。標準物質はポリスチレンとし、同様の試料溶液を調製した。高温ＧＰＣ（Ｖｉｓｃｏｔｅｋ社製 ３５０ ＨＴ−ＧＰＣ Ｓｙｓｔｅｍ）にてカラム温度：８０℃、流速１．００ｍＬ／ｍｉｎの条件で測定した。検出器としては、示差屈折計（ＲＩ）を使用した。
[Evaluation method]
Number average molecular weight: A sample was prepared by dissolving the thermoplastic resin used in the present invention in a mixed solvent of p-chlorophenol (manufactured by Tokyo Chemical Industry Co., Ltd.) and toluene in a volume ratio of 3: 8 to a concentration of 0.25% by weight. . The standard material was polystyrene, and a similar sample solution was prepared. The measurement was performed using a high temperature GPC (350 HT-GPC System manufactured by Viscotek) under conditions of a column temperature of 80 ° C. and a flow rate of 1.00 mL / min. A differential refractometer (RI) was used as a detector.
試験片成形：得られたペレット状の樹脂組成物を、熱風乾燥機を用いて１２０℃で４時間乾燥した後、射出成形機にて厚み１ｍｍ×２５ｍｍφの円板状サンプルの試験片を成形した。このとき、シリンダー温度は２２０〜２４０℃、金型温度１２０〜１５０℃に設定し、液晶状態で射出した。 Test piece molding: The pellet-shaped resin composition obtained was dried at 120 ° C. for 4 hours using a hot air dryer, and then a test piece of a disk-shaped sample having a thickness of 1 mm × 25 mmφ was molded using an injection molding machine. . At this time, the cylinder temperature was set to 220 to 240 ° C. and the mold temperature was set to 120 to 150 ° C., and injection was performed in a liquid crystal state.
熱伝導率：厚み１ｍｍ×２５ｍｍφの円板状サンプルにて、レーザーフラッシュ法熱伝導率測定装置（ＮＥＴＺＳＣＨ社製 ＬＦＡ４４７）で、室温大気中におけるサンプルの厚み方向の熱伝導率を測定した。 Thermal conductivity: The thermal conductivity in the thickness direction of the sample in the air at room temperature was measured with a laser flash method thermal conductivity measurement device (LFA447 manufactured by NETZSCH) using a disk-shaped sample having a thickness of 1 mm × 25 mmφ.
成形体外観：得られた成形体表面における着色や模様などの外観不良を目視にて観察し、以下の基準で評価した。○：ごくわずかに着色や模様などが見られるものの実使用上問題ない範囲で、外観良好、△：一部着色や模様などの外観不良が見られる、×：着色や模様などがあり外観不良。 Appearance of molded article: Visual appearance defects such as coloring and patterns on the surface of the obtained molded article were visually observed and evaluated according to the following criteria. A: Appearance is good within a range where there is no problem in practical use although a slight coloration or pattern can be seen. Δ: Appearance defect such as partial coloration or pattern is seen. X: Appearance defect due to coloration or pattern.
［製造例１］
還流冷却器、温度計、窒素導入管及び攪拌棒を備え付けた密閉型反応器に、４，４’−ジヒドロキシビフェニル、ドデカン二酸、無水酢酸をモル比でそれぞれ１．０：１．１：２．１の割合で仕込み、酢酸ナトリウムを触媒とし、常圧、窒素雰囲気下で１４５℃にて反応させ均一な溶液を得た後、酢酸を留去しながら２℃／ｍｉｎで２５０℃まで昇温し、２５０℃で１時間撹拌した。引き続きその温度を保ったまま、約４０分かけて１０Ｔｏｒｒまで減圧した後、減圧状態を維持した。減圧開始から３時間後、窒素ガスで常圧に戻し、生成したポリマーを取り出した。得られた樹脂の数平均分子量は９１００、樹脂単体の熱伝導率は０．９Ｗ／（ｍ・Ｋ）であった。得られた樹脂を（Ａ−１）とする。
[Production Example 1]
In a closed reactor equipped with a reflux condenser, a thermometer, a nitrogen introduction tube, and a stirring rod, 4,4′-dihydroxybiphenyl, dodecanedioic acid, and acetic anhydride were each in a molar ratio of 1.0: 1.1: 2. .1 was charged, and sodium acetate was used as a catalyst to react at 145 ° C. under atmospheric pressure and nitrogen atmosphere to obtain a uniform solution, and then heated to 250 ° C. at 2 ° C./min while acetic acid was distilled off. And stirred at 250 ° C. for 1 hour. Subsequently, while maintaining the temperature, the pressure was reduced to 10 Torr over about 40 minutes, and then the reduced pressure state was maintained. Three hours after the start of pressure reduction, the pressure was returned to normal pressure with nitrogen gas, and the produced polymer was taken out. The number average molecular weight of the obtained resin was 9100, and the thermal conductivity of the resin alone was 0.9 W / (m · K). Let the obtained resin be (A-1).
［製造例２］
還流冷却器、温度計、窒素導入管及び攪拌棒を備え付けた密閉型反応器に、４，４’−ジヒドロキシビフェニル、セバシン酸、カテコール、無水酢酸をモル比でそれぞれ０．９：１．１：０．１：２．１の割合で仕込み、酢酸ナトリウムを触媒とし、常圧、窒素雰囲気下で１４５℃にて反応させ均一な溶液を得た後、酢酸を留去しながら２℃／ｍｉｎで２４０℃まで昇温し、２４０℃で３０分撹拌した。さらに１℃／ｍｉｎで２６０℃まで昇温し、２６０℃で１時間撹拌した。引き続きその温度を保ったまま、約４０分かけて１０Ｔｏｒｒまで減圧した後、減圧状態を維持した。減圧開始から３時間後、窒素ガスで常圧に戻し、生成したポリマーを取り出した。得られた樹脂の数平均分子量は７７００、樹脂単体の熱伝導率は０．９Ｗ／（ｍ・Ｋ）であった。得られた樹脂を（Ａ−２）とする。
[Production Example 2]
In a closed reactor equipped with a reflux condenser, a thermometer, a nitrogen introduction tube and a stir bar, 4,4′-dihydroxybiphenyl, sebacic acid, catechol, and acetic anhydride were each in a molar ratio of 0.9: 1.1: The mixture was charged at a ratio of 0.1: 2.1, and sodium acetate was used as a catalyst to react at 145 ° C. under normal pressure and nitrogen atmosphere to obtain a uniform solution. The temperature was raised to 240 ° C., and the mixture was stirred at 240 ° C. for 30 minutes. Furthermore, it heated up to 260 degreeC at 1 degreeC / min, and stirred at 260 degreeC for 1 hour. Subsequently, while maintaining the temperature, the pressure was reduced to 10 Torr over about 40 minutes, and then the reduced pressure state was maintained. Three hours after the start of pressure reduction, the pressure was returned to normal pressure with nitrogen gas, and the produced polymer was taken out. The number average molecular weight of the obtained resin was 7700, and the thermal conductivity of the resin alone was 0.9 W / (m · K). Let the obtained resin be (A-2).
［実施例１]
製造例１で得られた樹脂（Ａ−１）を、熱風乾燥機を用いて１２０℃で４時間乾燥し、これと表面がシリカコートされた窒化アルミニウム粉末（東洋アルミ社製トーヤルナイトＦＬＡ、比重：３．３、単体での熱伝導率２００Ｗ／（ｍ・Ｋ）、平均粒子径１２μｍ、電気絶縁性、体積固有抵抗１０14Ω・ｃｍ）の体積比率が７０：３０（重量比率で、１００：１１６）となるように混合したものを準備した。これに、フェノール系安定剤（株式会社ＡＤＥＫＡ製ＡＯ−６０）およびリン系酸化防止剤（株式会社ＡＤＥＫＡ製アデカスタブＰＥＰ−３６）を樹脂１００重量部に対してそれぞれ０．２重量部加えた。
この混合物を、株式会社テクノベル製１５ｍｍ同方向回転完全噛合型二軸押出機ＫＺＷ１５−４５ＭＧを用いて、バレル温度を表１のように設定して溶融混練し、熱可塑性樹脂組成物を得た。吐出量は２０ｇ／ｍｉｎ、スクリュー回転数は１００ｒｐｍに設定した。二軸押出機内における熱可塑性樹脂は、Ｃ１からＣ６へと順次流動し、ダイスヘッド部から吐出される。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は３．４Ｗ／（ｍ・Ｋ）、成形体外観は○であった。
[Example 1]
The resin (A-1) obtained in Production Example 1 was dried at 120 ° C. for 4 hours using a hot air dryer, and this was coated with silica-coated aluminum nitride powder (Toyorunite FLA manufactured by Toyo Aluminum Co., Ltd., specific gravity) : 3.3, single body thermal conductivity 200 W / (m · K), average particle size 12 μm, electrical insulation, volume resistivity 10 14 Ω · cm) volume ratio is 70:30 (weight ratio, 100 : 116) to prepare a mixture. To this, 0.2 parts by weight of a phenol-based stabilizer (AO-60 manufactured by ADEKA Co., Ltd.) and a phosphorus-based antioxidant (ADEKA STAB PEP-36 manufactured by ADEKA Co., Ltd.) were respectively added.
This mixture was melt kneaded using a 15 mm co-rotating fully meshed twin screw extruder KZW15-45MG manufactured by Technobell Co., Ltd. as shown in Table 1 to obtain a thermoplastic resin composition. The discharge amount was set to 20 g / min, and the screw rotation speed was set to 100 rpm. The thermoplastic resin in the twin screw extruder sequentially flows from C1 to C6 and is discharged from the die head portion. The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 3.4 W / (m · K), and the appearance of the molded product was ○.
［実施例２］
樹脂と窒化アルミニウム粉末の体積比率が６０：４０（重量比率で、１００：１８１）とした以外は実施例１と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は６．１Ｗ／（ｍ・Ｋ）、成形体外観は○であった。
[Example 2]
A resin composition was obtained in the same manner as in Example 1 except that the volume ratio of the resin to the aluminum nitride powder was 60:40 (weight ratio: 100: 181). The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 6.1 W / (m · K), and the appearance of the molded product was ○.
［比較例１］
樹脂と窒化アルミニウム粉末の体積比率が９０：１０（重量比率で、１００：３０）とした以外は実施例１と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は１．３Ｗ／（ｍ・Ｋ）、成形体外観は○であった。熱伝導率は樹脂のそれに対してわずかしか向上せず、十分に高い熱伝導率は得られていない。
[Comparative Example 1]
A resin composition was obtained in the same manner as in Example 1 except that the volume ratio of the resin to the aluminum nitride powder was 90:10 (weight ratio: 100: 30). The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 1.3 W / (m · K), and the appearance of the molded product was ○. The thermal conductivity is only slightly improved compared to that of the resin, and a sufficiently high thermal conductivity is not obtained.
［比較例２］
窒化アルミニウム粉末に代えて、窒化ホウ素粉末（モメンティブパフォーマンスマテリアルズ社製ＰＴ１１０、比重：２．３、単体での熱伝導率６０Ｗ／（ｍ・Ｋ）、平均粒子径４５μｍ、電気絶縁性、体積固有抵抗１０14Ω・ｃｍ）を用い、樹脂と窒化ホウ素粉末の体積比率が６０：４０とした以外は実施例１と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は３．３Ｗ／（ｍ・Ｋ）、成形体外観は△であった。同じ体積比率の実施例２と比較して、熱伝導率が著しく低く、成形体にも外観不良が一部見られる。
[Comparative Example 2]
Instead of aluminum nitride powder, boron nitride powder (Momentive Performance Materials PT110, specific gravity: 2.3, thermal conductivity of single unit 60W / (m · K), average particle diameter 45μm, electrical insulation, volume specific Resin composition was obtained in the same manner as in Example 1 except that the resistance was 10 14 Ω · cm) and the volume ratio of the resin and boron nitride powder was 60:40. The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 3.3 W / (m · K), and the appearance of the molded product was Δ. Compared with Example 2 of the same volume ratio, the thermal conductivity is remarkably low, and some appearance defects are also seen in the molded body.
［比較例３］
熱可塑性樹脂をナイロン６、窒化アルミニウム粉末をトクヤマ製Ｈグレード（平均粒子径１μｍ、表面無処理）とした以外は、実施例２と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は２．２Ｗ／（ｍ・Ｋ）、成形体外観は○であった。同じ体積比率の実施例２と比較して、熱伝導率が著しく低い。
[Comparative Example 3]
A resin composition was obtained in the same manner as in Example 2 except that the thermoplastic resin was nylon 6 and the aluminum nitride powder was Tokuyama H grade (average particle size 1 μm, surface untreated). The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 2.2 W / (m · K), and the appearance of the molded product was ○. Compared with Example 2 having the same volume ratio, the thermal conductivity is remarkably low.
［実施例３]
樹脂を（Ａ−２）とし、その他にポリブチレンテレフタレート樹脂、窒化アルミニウム粉末（東洋アルミ社製トーヤルナイトＦＬＡ）、窒化ホウ素粉末、ガラス繊維（日本電気硝子株式会社製Ｔ１８７Ｈ／ＰＬ、単体での熱伝導率１．０Ｗ／（ｍ・Ｋ）、繊維直径１３μｍ、数平均繊維長３．０ｍｍ、電気絶縁性、体積固有抵抗１０15Ω・ｃｍ）を用いて、これらの体積比率を４５：５：１５：２０：１５（樹脂（Ａ−２）と窒化アルミニウム粉末の重量比率は１００：９１）として、実施例１と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は２．７Ｗ／（ｍ・Ｋ）、成形体外観は○であった。
[Example 3]
In addition to resin (A-2), polybutylene terephthalate resin, aluminum nitride powder (Toyalnite FLA manufactured by Toyo Aluminum Co., Ltd.), boron nitride powder, glass fiber (T187H / PL manufactured by Nippon Electric Glass Co., Ltd., single heat Using a conductivity of 1.0 W / (m · K), fiber diameter of 13 μm, number average fiber length of 3.0 mm, electrical insulation, volume resistivity of 10 15 Ω · cm), these volume ratios were 45: 5: A resin composition was obtained in the same manner as in Example 1 at 15:20:15 (the weight ratio of the resin (A-2) to the aluminum nitride powder was 100: 91). The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 2.7 W / (m · K), and the appearance of the molded product was ○.
［比較例４］
実施例２の、窒化アルミニウム粉末を窒化ホウ素粉末で置き換え、窒化ホウ素の体積比率を３５とした以外は、実施例３と同様にして、樹脂組成物を得た。得られた樹脂組成物を、射出成形機を用いて成形し、厚み方向の熱伝導率を測定した。熱伝導率は２．１Ｗ／（ｍ・Ｋ）、成形体外観は△であった。実施例３と比較して、熱伝導率は低く、成形体外観も悪い。
本実施例および比較例において、溶融混練の際に設定したバレル温度を表１に示す。
[Comparative Example 4]
A resin composition was obtained in the same manner as in Example 3 except that the aluminum nitride powder in Example 2 was replaced with boron nitride powder and the volume ratio of boron nitride was set to 35. The obtained resin composition was molded using an injection molding machine, and the thermal conductivity in the thickness direction was measured. The thermal conductivity was 2.1 W / (m · K), and the appearance of the molded product was Δ. Compared to Example 3, the thermal conductivity is low and the appearance of the molded article is also poor.
Table 1 shows barrel temperatures set during melt-kneading in the examples and comparative examples.
本発明の熱可塑性樹脂組成物は優れた熱伝導性を示し、かつ良好な成形体外観を有する。このような熱可塑性樹脂組成物は電気・電子工業分野、自動車分野等さまざまな状況で放熱・伝熱用樹脂材料として用いることが可能で、工業的に有用である。 The thermoplastic resin composition of the present invention exhibits excellent thermal conductivity and has a good molded body appearance. Such a thermoplastic resin composition can be used as a resin material for heat dissipation and heat transfer in various situations such as in the electric / electronic industry and automobile fields, and is industrially useful.
Claims (8)
で表されるビフェニル基を有するユニット（Ａ）２５〜６０モル％、
一般式（２）
−Ｙ−Ｒ−Ｙ− （２）
（式中、Ｒは主鎖原子数２〜２０の分岐を含んでもよい２価の直鎖状置換基を示す。ＹはＯ、ＣＯの群から選ばれる２価の置換基を示す）
で表されるユニット（Ｂ）２５〜６０モル％、
一般式（３）
−Ｚ1−Ｍ−Ｚ2− （３）
（式中、Ｚ1、Ｚ2はＯ、ＮＨ、ＣＯ、Ｓ、ＮＨＣＯの群から選ばれる２価の置換基を示す。Ｍは主鎖の折り畳み効果を有する非縮合芳香族基、縮合芳香族基、複素環基、脂環基、脂環式複素環基から選ばれる置換基を示す。）
で表されるユニット（Ｃ）０〜２５モル％（ただしユニット（Ａ）、（Ｂ）、（Ｃ）の合計を１００モル％とする）からなり、樹脂単体の熱伝導率が０．４Ｗ／（ｍ・Ｋ）以上である熱可塑性樹脂（ｉ）１００重量部に対して、窒化アルミニウム（ｉｉ）を５０〜２５０重量部を含有してなる、熱可塑性樹脂組成物。 The structure of the main chain is general formula (1)
Unit (A) having a biphenyl group represented by 25 to 60 mol%,
General formula (2)
-YR-Y- (2)
(In the formula, R represents a divalent linear substituent which may contain a branch having 2 to 20 main chain atoms. Y represents a divalent substituent selected from the group of O and CO.)
Unit (B) represented by 25 to 60 mol%,
General formula (3)
-Z 1 -MZ 2- (3)
(In the formula, Z 1 and Z 2 represent a divalent substituent selected from the group of O, NH, CO, S, and NHCO. M represents a non-condensed aromatic group and a condensed aromatic group having a main chain folding effect. A substituent selected from a group, a heterocyclic group, an alicyclic group, and an alicyclic heterocyclic group.
Unit (C) represented by 0 to 25 mol% (however, the total of units (A), (B), and (C) is 100 mol%), and the thermal conductivity of the resin alone is 0.4 W / A thermoplastic resin composition comprising 50 to 250 parts by weight of aluminum nitride (ii) with respect to 100 parts by weight of the thermoplastic resin (i) that is (m · K) or more.
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