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- JP2013243481A5 JP2013243481A5 JP2012114769A JP2012114769A JP2013243481A5 JP 2013243481 A5 JP2013243481 A5 JP 2013243481A5 JP 2012114769 A JP2012114769 A JP 2012114769A JP 2012114769 A JP2012114769 A JP 2012114769A JP 2013243481 A5 JP2013243481 A5 JP 2013243481A5
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Description
［態様１］
本態様に係る温度補償情報作成方法は、発振素子の周波数温度特性及び発振素子定数を測定する第１の工程と、前記発振素子と、前記発振素子の発振を制御する発振制御部と、を有する電子部品を組み立てる第２の工程と、前記周波数温度特性及び前記発振素子定数の情報を用いて前記周波数温度特性を補償するための温度補償情報を作成する第３の工程と、を含む。
発振素子定数は、発振素子の特性を記述するパラメーターであり、例えば、発振素子の直列共振周波数、等価回路パラメーター、負荷容量、Ｑ値等であり、発振素子定数を用いて発振素子の周波数感度（素子感度）［ｐｐｍ／ｐＦ］を算出することができる。
本態様に係る温度補償情報作成方法によれば、発振素子の検査工程で得られた周波数温度特性だけでなく、発振素子の周波数感度（素子感度）［ｐｐｍ／ｐＦ］を算出可能な発振素子定数も用いることで、周波数調整感度のばらつきを考慮した温度補償情報を作成することができる。
また、本態様に係る温度補償情報作成方法によれば、発振素子の周波数温度特性と発振素子定数を用いることで、電子部品の検査工程において複数の温度を振ることなく高精度の温度補償情報を作成することができる。
従って、本態様に係る温度補償情報作成方法によれば、電子部品の検査コストの増加を抑えながら、周波数調整感度のばらつきを考慮して発振素子の周波数温度特性を高い精度で温度補償する温度補償情報を作成することができる。
［態様２］
上記態様に係る温度補償情報作成方法は、前記第１の工程と前記第３の工程との間に前記周波数温度特性及び前記発振素子定数に対応する情報を前記発振素子又は前記発振制御
部の少なくとも一方に記録する工程を含み、前記第３の工程は、前記発振素子又は前記発振制御部の少なくとも一方に記録されている情報に基づいて取得した前記周波数温度特性及び前記発振素子定数を用いて、前記温度補償情報を作成するようにしてもよい。
周波数温度特性及び発振素子定数を特定可能な情報とは、周波数温度特性及び発振素子定数の情報そのものであってもよいし、周波数温度特性及び発振素子定数の情報と１対１に対応づけられた他の情報であってもよい。
本態様に係る温度補償情報作成方法によれば、発振素子毎に検査工程で測定済みの周波数温度特性及び発振素子定数の情報を利用して、高精度の温度補償情報を作成することができる。
［態様３］
上記態様に係る温度補償情報作成方法において、前記第３の工程は、前記発振素子の発振周波数を制御する制御信号の値を変更して前記発振周波数を測定する工程と、前記発振周波数の測定結果と前記発振素子定数の情報とを用いて前記電子部品の周波数調整感度を計算する工程と、前記周波数調整感度と前記周波数温度特性の情報とを用いて前記温度補償情報を計算する工程と、を含むようにしてもよい。
［態様４］
上記態様に係る温度補償情報作成方法において、前記周波数調整感度を計算する工程は、前記発振周波数の測定結果と前記発振素子定数の情報とを用いて前記発振制御部の等価容量を計算する工程と、前記発振制御部の等価容量と前記制御信号とに基づいて前記発振制御部の容量調整感度を計算する工程と、前記発振素子定数の情報を用いて前記発振素子の周波数感度を計算する工程と、前記容量調整感度と前記周波数感度とを用いて、前記周波数調整感度を計算する工程と、を含むようにしてもよい。
［態様５］
本態様に係る電子部品の製造方法は、発振素子の周波数温度特性及び発振素子定数を測定する第１の工程と、前記発振素子と、前記発振素子の発振を制御する発振制御部と、を有する電子部品を組み立てる第２の工程と、前記周波数温度特性及び前記発振素子定数の情報を用いて前記周波数温度特性を補償するための温度補償情報を作成する第３の工程と、前記温度補償情報を、前記電子部品の記憶部に記録する第４の工程と、を含む。
本態様に係る電子部品の製造方法によれば、発振素子の検査工程で得られた周波数温度特性だけでなく発振素子定数も用いることで、周波数調整感度のばらつきを考慮した温度補償情報を作成し、電子部品に記録することができる。
また、本態様に係る電子部品の製造方法によれば、発振素子の周波数温度特性と発振素子定数を用いることで、電子部品の検査工程において複数の温度を振ることなく高精度の温度補償情報を作成し、記録することができる。
従って、本態様に係る電子部品の製造方法によれば、検査コストの増加を抑えながら、周波数調整感度のばらつきを考慮して発振素子の周波数温度特性を高い精度で温度補償することが可能な電子部品を提供することができる。
［態様６］
本態様に係る発振素子は、周波数温度特性及び発振素子定数に対応する情報が記録されている記録部を含む。
記録部は、例えば、発振素子のパッケージに付されたマーキング部であってもよい。例えば、各発振素子に識別子（文字、記号、図形等）を割り当て、当該識別子に対応づけて発振素子の周波数温度特性及び発振素子定数の情報を記憶装置に記憶させておき、マーキング部に識別子の情報をマーキングしてもよい。あるいは、マーキング部に、周波数温度特性及び発振素子定数の情報が埋め込められたデータコード（２次元バーコード等）を付してもよい。また、記録部は、例えば、不揮発性メモリーであってもよい。
本態様に係る発振素子によれば、記録部に記録されている情報に基づいて、検査工程で測定済みの周波数温度特性及び発振素子定数の情報を取得し、温度補償情報の作成に利用することができる。
［態様７］
本態様に係る発振器は、発振素子と、前記発振素子の発振を制御する発振制御部と、前記発振素子の周波数温度特性及び発振素子定数に対応する情報が記録されている記録部と、を含む。
記録部は、発振素子又は発振制御部と一体となっていてもよいし、発振素子及び発振制御部と分離して設けられていてもよい。前者の場合、例えば、記録部は、発振素子又は発振制御部のパッケージに付されたマーキング部であってもよいし、発振素子又は発振制御部に内蔵された不揮発性メモリーであってもよい。
本態様に係る発振器によれば、記録部に記録されている情報に基づいて、発振素子の検査工程で測定済みの周波数温度特性及び発振素子定数の情報を取得し、温度補償情報の作成に利用することができる。
［態様８］
本態様に係る電子機器は、上記態様に係る発振素子又は上記態様に係る発振器を含む。
［適用例１］
本適用例に係る温度補償情報作成方法は、発振素子の周波数温度特性を補償するための温度補償情報を作成する温度補償情報作成方法であって、前記発振素子の周波数温度特性及び発振素子定数を測定する工程と、前記発振素子と、前記発振素子の発振を制御する発振制御部とを用いて電子部品を組み立てる工程と、前記周波数温度特性及び前記発振素子定数の情報を用いて前記温度補償情報を作成する工程と、を含む。
[Aspect 1]
The temperature compensation information creating method according to this aspect includes a first step of measuring frequency temperature characteristics and an oscillation element constant of an oscillation element, the oscillation element, and an oscillation control unit that controls oscillation of the oscillation element. A second step of assembling an electronic component; and a third step of creating temperature compensation information for compensating the frequency temperature characteristic using information on the frequency temperature characteristic and the oscillation element constant.
The oscillation element constant is a parameter describing characteristics of the oscillation element. For example, the oscillation element constant is a series resonance frequency of the oscillation element, an equivalent circuit parameter, a load capacity, a Q value, and the like. Element sensitivity) [ppm / pF] can be calculated.
According to the temperature compensation information creating method according to this aspect, not only the frequency temperature characteristic obtained in the inspection process of the oscillation element but also the oscillation element constant capable of calculating the frequency sensitivity (element sensitivity) [ppm / pF] of the oscillation element. Can also be used to create temperature compensation information in consideration of variations in frequency adjustment sensitivity.
Further, according to the temperature compensation information creation method according to this aspect, by using the frequency temperature characteristics of the oscillation element and the oscillation element constant, highly accurate temperature compensation information can be obtained without changing a plurality of temperatures in the inspection process of the electronic component. Can be created.
Therefore, according to the temperature compensation information generation method according to the present aspect, temperature compensation that compensates for the frequency temperature characteristics of the oscillation element with high accuracy in consideration of variations in frequency adjustment sensitivity while suppressing an increase in the inspection cost of electronic components. Information can be created.
[Aspect 2]
In the temperature compensation information creating method according to the above aspect, information corresponding to the frequency temperature characteristic and the oscillation element constant is transmitted between the first step and the third step as the oscillation element or the oscillation control.
And recording the frequency temperature characteristic and the oscillation element constant acquired based on information recorded in at least one of the oscillation element or the oscillation control unit. The temperature compensation information may be created by using it.
The information that can specify the frequency temperature characteristic and the oscillation element constant may be the information of the frequency temperature characteristic and the oscillation element constant itself, or is associated with the information of the frequency temperature characteristic and the oscillation element constant in one-to-one correspondence. Other information may be used.
According to the temperature compensation information creation method according to this aspect, it is possible to create highly accurate temperature compensation information by using the frequency temperature characteristics and the oscillation element constant information measured in the inspection process for each oscillation element.
[Aspect 3]
In the temperature compensation information creating method according to the above aspect, the third step includes a step of measuring the oscillation frequency by changing a value of a control signal for controlling the oscillation frequency of the oscillation element, and a measurement result of the oscillation frequency. Calculating the frequency adjustment sensitivity of the electronic component using the information on the oscillation element constant and calculating the temperature compensation information using the frequency adjustment sensitivity and the information on the frequency temperature characteristic. It may be included.
[Aspect 4]
In the temperature compensation information creating method according to the above aspect, the step of calculating the frequency adjustment sensitivity includes a step of calculating an equivalent capacitance of the oscillation control unit using the measurement result of the oscillation frequency and the information of the oscillation element constant. Calculating the capacitance adjustment sensitivity of the oscillation control unit based on the equivalent capacitance of the oscillation control unit and the control signal; calculating the frequency sensitivity of the oscillation element using information on the oscillation element constant; The step of calculating the frequency adjustment sensitivity using the capacity adjustment sensitivity and the frequency sensitivity may be included.
[Aspect 5]
An electronic component manufacturing method according to the present aspect includes a first step of measuring a frequency temperature characteristic and an oscillation element constant of an oscillation element, the oscillation element, and an oscillation control unit that controls oscillation of the oscillation element. A second step of assembling an electronic component, a third step of creating temperature compensation information for compensating the frequency temperature characteristic using information on the frequency temperature characteristic and the oscillation element constant, and the temperature compensation information. And a fourth step of recording in the storage part of the electronic component.
According to the method of manufacturing an electronic component according to this aspect, temperature compensation information is generated in consideration of variations in frequency adjustment sensitivity by using not only the frequency temperature characteristic obtained in the inspection process of the oscillation element but also the oscillation element constant. Can be recorded on electronic components.
Further, according to the method for manufacturing an electronic component according to this aspect, by using the frequency temperature characteristic of the oscillation element and the oscillation element constant, highly accurate temperature compensation information can be obtained without changing a plurality of temperatures in the inspection process of the electronic component. Can be created and recorded.
Therefore, according to the method for manufacturing an electronic component according to this aspect, an electronic device capable of temperature compensation of the frequency temperature characteristics of the oscillation element with high accuracy in consideration of variations in frequency adjustment sensitivity while suppressing an increase in inspection cost. Parts can be provided.
[Aspect 6]
The oscillation element according to this aspect includes a recording unit in which information corresponding to the frequency temperature characteristic and the oscillation element constant is recorded.
The recording unit may be a marking unit attached to the package of the oscillation element, for example. For example, an identifier (character, symbol, figure, etc.) is assigned to each oscillating element, the frequency temperature characteristics of the oscillating element and the oscillating element constant information are stored in the storage device in association with the identifier, and the identifier is stored in the marking unit. Information may be marked. Alternatively, a data code (such as a two-dimensional bar code) in which information on the frequency temperature characteristic and the oscillation element constant is embedded may be attached to the marking portion. The recording unit may be a non-volatile memory, for example.
According to the oscillation element according to this aspect, information on the frequency temperature characteristics and the oscillation element constant measured in the inspection process is acquired based on the information recorded in the recording unit, and used to create temperature compensation information. Can do.
[Aspect 7]
An oscillator according to this aspect includes an oscillation element, an oscillation control unit that controls oscillation of the oscillation element, and a recording unit in which information corresponding to a frequency temperature characteristic and an oscillation element constant of the oscillation element is recorded. .
The recording unit may be integrated with the oscillation element or the oscillation control unit, or may be provided separately from the oscillation element and the oscillation control unit. In the former case, for example, the recording unit may be a marking unit attached to the package of the oscillation element or the oscillation control unit, or may be a nonvolatile memory built in the oscillation element or the oscillation control unit.
According to the oscillator according to this aspect, based on the information recorded in the recording unit, information on the frequency temperature characteristic and the oscillation element constant measured in the inspection process of the oscillation element is acquired and used for the creation of temperature compensation information. can do.
[Aspect 8]
The electronic device according to this aspect includes the oscillation element according to the above aspect or the oscillator according to the above aspect.
[Application Example 1]
The temperature compensation information creating method according to this application example is a temperature compensation information creating method for creating temperature compensation information for compensating the frequency temperature characteristic of the oscillation element, and the frequency temperature characteristic and the oscillation element constant of the oscillation element are calculated. A step of measuring, a step of assembling an electronic component using the oscillation element and an oscillation control unit for controlling oscillation of the oscillation element, and the temperature compensation information using information on the frequency temperature characteristic and the oscillation element constant. Creating a process.
Claims (8)
前記発振素子と、前記発振素子の発振を制御する発振制御部と、を有する電子部品を組み立てる第２の工程と、
前記周波数温度特性及び前記発振素子定数の情報を用いて前記周波数温度特性を補償するための温度補償情報を作成する第３の工程と、を含む、温度補償情報作成方法。 A first step of measuring the frequency temperature characteristics and oscillation element constants of the oscillation element,
A second step of assembling an electronic component having the oscillation element and an oscillation control unit that controls oscillation of the oscillation element;
And a third step of creating temperature compensation information for compensating the frequency temperature characteristic using the frequency temperature characteristic and the information of the oscillation element constant.
前記第１の工程と前記第３の工程との間に前記周波数温度特性及び前記発振素子定数に対応する情報を前記発振素子又は前記発振制御部の少なくとも一方に記録する工程を含み、
前記第３の工程は、
前記発振素子又は前記発振制御部の少なくとも一方に記録されている情報に基づいて取得した前記周波数温度特性及び前記発振素子定数を用いて、前記温度補償情報を作成する、温度補償情報作成方法。 In claim 1,
Including a step of recording information corresponding to the frequency temperature characteristic and the oscillation element constant in at least one of the oscillation element or the oscillation control unit between the first step and the third step ,
The third step includes
A temperature compensation information creation method for creating the temperature compensation information by using the frequency temperature characteristic and the oscillation element constant acquired based on information recorded in at least one of the oscillation element or the oscillation control unit .
前記第３の工程は、
前記発振素子の発振周波数を制御する制御信号の値を変更して前記発振周波数を測定する工程と、
前記発振周波数の測定結果と前記発振素子定数の情報とを用いて前記電子部品の周波数調整感度を計算する工程と、
前記周波数調整感度と前記周波数温度特性の情報とを用いて前記温度補償情報を計算する工程と、を含む、温度補償情報作成方法。 In claim 1 or 2,
The third step includes
And measuring the oscillation frequency by changing the value of the control signal for controlling the oscillation frequency of the oscillator,
Calculating the frequency adjustment sensitivity of the electronic component using the measurement result of the oscillation frequency and the information of the oscillation element constant;
Calculating the temperature compensation information using the frequency adjustment sensitivity and the frequency temperature characteristic information.
前記周波数調整感度を計算する工程は、
前記発振周波数の測定結果と前記発振素子定数の情報とを用いて前記発振制御部の等価容量を計算する工程と、
前記発振制御部の等価容量と前記制御信号とに基づいて前記発振制御部の容量調整感度
を計算する工程と、
前記発振素子定数の情報を用いて前記発振素子の周波数感度を計算する工程と、
前記容量調整感度と前記周波数感度とを用いて、前記周波数調整感度を計算する工程と、を含む、温度補償情報作成方法。 In claim 3,
The step of calculating the frequency adjustment sensitivity includes:
Calculating an equivalent capacitance of the oscillation control unit using the measurement result of the oscillation frequency and the information of the oscillation element constant;
Calculating capacity adjustment sensitivity of the oscillation control unit based on the equivalent capacity of the oscillation control unit and the control signal;
Calculating the frequency sensitivity of the oscillation element using information on the oscillation element constant;
Before using the Kiyo amount adjusting sensitivity and before distichum wavenumber sensitivity, comprising the steps of: calculating a pre-Symbol frequency adjustment sensitivity, the temperature compensation data creation method.
前記発振素子と、前記発振素子の発振を制御する発振制御部と、を有する電子部品を組み立てる第２の工程と、
前記周波数温度特性及び前記発振素子定数の情報を用いて前記周波数温度特性を補償するための温度補償情報を作成する第３の工程と、
前記温度補償情報を、前記電子部品の記憶部に記録する第４の工程と、を含む、電子部品の製造方法。 A first step of measuring a frequency temperature characteristic and an oscillation element constant of the oscillation element;
A second step of assembling an electronic component having the oscillation element and an oscillation control unit that controls oscillation of the oscillation element;
A third step of creating a temperature compensation data for compensating the frequency-temperature characteristic by using the information of the frequency temperature characteristic and the oscillator constant,
And a fourth step of recording the temperature compensation information in a storage unit of the electronic component.
前記発振素子の発振を制御する発振制御部と、
前記発振素子の周波数温度特性及び発振素子定数に対応する情報が記録されている記録部と、を含む、発振器。 An oscillation element;
An oscillation control unit for controlling oscillation of the oscillation element;
And a recording unit in which information corresponding to the frequency-temperature characteristic and the oscillation element constant of the oscillation element is recorded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012114769A JP5971467B2 (en) | 2012-05-18 | 2012-05-18 | Temperature compensation information creation method and electronic component manufacturing method |
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| JP2012114769A JP5971467B2 (en) | 2012-05-18 | 2012-05-18 | Temperature compensation information creation method and electronic component manufacturing method |
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| JP2013243481A JP2013243481A (en) | 2013-12-05 |
| JP2013243481A5 true JP2013243481A5 (en) | 2015-07-02 |
| JP5971467B2 JP5971467B2 (en) | 2016-08-17 |
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| JP6350201B2 (en) * | 2014-10-20 | 2018-07-04 | 富士通株式会社 | Measuring method |
| JP2016187153A (en) | 2015-03-27 | 2016-10-27 | セイコーエプソン株式会社 | Oscillator, electronic apparatus, and mobile body |
| JP2019087981A (en) * | 2017-11-10 | 2019-06-06 | セイコーエプソン株式会社 | Method for manufacturing vibrator group and method for manufacturing oscillator |
| CN110186446B (en) * | 2019-06-27 | 2022-12-02 | 重庆芯力源科技有限公司 | North seeking instrument north seeking method based on MEMS gyroscope |
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| JP2713214B2 (en) * | 1995-02-28 | 1998-02-16 | 日本電気株式会社 | Temperature compensation device for crystal oscillation circuit |
| JP3262739B2 (en) * | 1997-04-25 | 2002-03-04 | 松下電器産業株式会社 | Adjustment device and adjustment method for crystal oscillator |
| JP2000013142A (en) * | 1998-06-25 | 2000-01-14 | Citizen Watch Co Ltd | Voltage control piezoelectric oscillator |
| JP2002204127A (en) * | 2000-12-28 | 2002-07-19 | Kyocera Corp | Method and device for adjusting temperature compensating crystal oscillator |
| JP2002299957A (en) * | 2001-03-29 | 2002-10-11 | Kyocera Corp | Method for correcting temperature characteristics of crystal oscillator |
| JP3898472B2 (en) * | 2001-08-10 | 2007-03-28 | 日本電波工業株式会社 | Temperature information printing system on quartz crystal |
| JP4251070B2 (en) * | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | Piezoelectric oscillator, electronic component, and method for manufacturing piezoelectric oscillator |
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