JP2013220451A - Laser beam cutting method and device for setting laser beam cutting order - Google Patents

Laser beam cutting method and device for setting laser beam cutting order Download PDF

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JP2013220451A
JP2013220451A JP2012094421A JP2012094421A JP2013220451A JP 2013220451 A JP2013220451 A JP 2013220451A JP 2012094421 A JP2012094421 A JP 2012094421A JP 2012094421 A JP2012094421 A JP 2012094421A JP 2013220451 A JP2013220451 A JP 2013220451A
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JP6025376B2 (en
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Kenji Masuda
健司 増田
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Amada Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a laser beam cutting method capable of reducing the number of times of piercing and suppressing influence of thermal expansion of a product.SOLUTION: A laser beam cutting method includes the respective steps of the step of continuously performing laser beam cutting on one ends in an X-axis direction of a plurality of products 5A-5D of a first row 7A in a Y-axis direction, the step of continuously performing laser beam cutting on a boundary line between the other ends in the X-axis direction of the plurality of products 5A-5D and one ends in the X-axis direction of a plurality of products 11A-11C of a second row 7B in the Y-axis direction, the step of leaving a micro coupling part 15 when performing laser beam cutting from one end to the other end in the X-axis direction of each product, the step of continuously performing laser beam cutting on the other ends in the X-axis direction of the plurality of products 11A-11C of the second row 7B in the Y-axis direction, and the step of leaving the micro coupling part 15 when performing laser beam cutting from one end to the other end in the X-axis direction of each product.

Description

本発明は、板状のワークに複数の製品をＸ軸方向に複数列、Ｙ軸方向に複数行配置し、レーザ切断加工によって各製品をワークから切断分離するレーザ切断加工方法及びレーザ切断加工順を設定するレーザ切断加工順設定装置に係り、さらに詳細には、複数列、複数行に配置した複数の製品をワークから切断分離するとき、レーザ切断加工を開始するためのピアス加工の回数をより少なくでき、かつ各製品の熱膨張の影響を抑制することのできるレーザ切断加工方法及びレーザ切断加工順設定装置に関する。   The present invention relates to a laser cutting method and a laser cutting processing sequence in which a plurality of products are arranged in a plate-like workpiece in a plurality of rows in the X-axis direction and a plurality of rows in the Y-axis direction, and each product is cut and separated from the workpiece by laser cutting processing. In more detail, when cutting and separating a plurality of products arranged in multiple columns and multiple rows from a workpiece, the number of times of piercing to start laser cutting is more The present invention relates to a laser cutting processing method and a laser cutting processing order setting device that can reduce the influence of thermal expansion of each product.

従来、板状のワークから複数の製品をレーザ切断加工によって切断分離することが行われている。この場合、複数の製品をＸ軸方向に複数列、Ｙ軸方向に複数行配置し、各製品の境界線の部分のレーザ切断加工を行うこと、すなわち棧幅共有の加工が行われている（例えば特許文献１参照）。   Conventionally, a plurality of products are cut and separated from a plate-like workpiece by laser cutting. In this case, a plurality of products are arranged in a plurality of columns in the X-axis direction and in a plurality of rows in the Y-axis direction, and laser cutting processing is performed on the boundary line portion of each product, that is, processing for sharing the heel width is performed ( For example, see Patent Document 1).

特開２００１−３３４３７９号公報JP 2001-334379 A

ところで、板状のワークに複数の製品をＸ軸方向に複数列、Ｙ軸方向に複数行配置してレーザ切断加工を行うとき、製品を個々に切断分離すると、ワークを支持する剣山、スキッドの摩耗や損耗によって高さが不揃いの場合には、製品が傾斜して浮上りという現象を生じることがある。この現象を生じると、傾斜した製品とレーザ加工ヘッドとが干渉し、近辺のレーザ切断加工を行うことができなくなることがある。   By the way, when a plurality of products are arranged on a plate-shaped workpiece in a plurality of rows in the X-axis direction and in a plurality of rows in the Y-axis direction and laser cutting is performed, when the products are cut and separated individually, If the height is uneven due to wear or wear, the product may tilt and rise. When this phenomenon occurs, the tilted product and the laser processing head interfere with each other, and it may become impossible to perform laser cutting processing in the vicinity.

上記問題に対し、前記特許文献１に記載のレーザ切断加工方法は、製品の境界線（棧幅共有線）の途中に微小連結部（ミクロジョイント）を残すものであるから、前述したごとき浮上り現象を防止することができる。しかし、前記境界線の途中にミクロジョイントを残すものであるから、加工能率向上を図る上において問題がある。   In response to the above problem, the laser cutting method described in Patent Document 1 leaves a minute connecting portion (micro joint) in the middle of a product boundary line (width sharing line). The phenomenon can be prevented. However, since the micro joint is left in the middle of the boundary line, there is a problem in improving the working efficiency.

そこで、前記浮上り現象やミクロジョイントの問題点を考慮して、図４に示すごときレーザ切断加工方法が提案されている。すなわち、中央部に穴Ｈを備えた十字形状の複数の製品ＷＰを、板状のワークＷにＸ軸方向に複数列、Ｙ軸方向に複数行配置し、レーザ切断加工によってワークＷから各製品ＷＰを切断分離するとき、先ず、各製品ＷＰの各穴Ｈ及び各製品ＷＰ間のスペースＳのレーザ切断加工が行われる。その後、各製品ＷＰの境界線（棧幅共有線）の切断を行うべく、ラインＬ１，Ｌ２，Ｌ３，Ｌ４及びＬ５のレーザ切断加工を順次行い、最後にラインＬ６により外周のレーザ切断加工を行うものである。   Therefore, a laser cutting method as shown in FIG. 4 has been proposed in consideration of the floating phenomenon and the problem of the micro joint. That is, a plurality of cross-shaped products WP having a hole H in the center are arranged on a plate-like workpiece W in a plurality of rows in the X-axis direction and in a plurality of rows in the Y-axis direction. When the WP is cut and separated, first, laser cutting of each hole H of each product WP and the space S between each product WP is performed. After that, in order to cut the boundary line (width sharing line) of each product WP, laser cutting processing of lines L1, L2, L3, L4 and L5 is sequentially performed, and finally laser cutting processing of the outer periphery is performed by line L6. Is.

上記レーザ切断加工方法によれば、各ラインＬ１〜Ｌ６のレーザ切断加工を開始するために、その都度ピアス加工が必要であり、ピアス加工の回数が６回と多い。しかし、各製品ＷＰを個々に切断分離するレーザ切断加工、すなわちラインＬ５，Ｌ６のレーザ切断加工は、切断分離された製品ＷＰから遠ざかる方向へ進行するものであるから、前述した浮上り現象を生じた場合であっても干渉の問題はない。また、既に理解されるように、ミクロジョイントを必要としないものである。   According to the above laser cutting method, in order to start laser cutting processing of each of the lines L1 to L6, piercing processing is necessary each time, and the number of times of piercing processing is as many as six. However, the laser cutting process that individually cuts and separates each product WP, that is, the laser cutting process of the lines L5 and L6, proceeds in a direction away from the cut and separated product WP. Even if it is, there is no problem of interference. Moreover, as already understood, a micro joint is not required.

上記レーザ切断加工方法においては、前述したようにピアス加工回数が多く、加工能率向上を図る上において問題がある。また、各製品ＷＰの穴Ｈ及び各製品ＷＰ間のスペースＳを全てレーザ切断加工を行った後に各製品ＷＰの切断分離を行うものであるから、各製品ＷＰに対する熱影響が大きく、寸法精度の向上を図る上において、さらなる改善が望まれている。   In the laser cutting method, as described above, the number of times of piercing is large, and there is a problem in improving the processing efficiency. In addition, since each product WP is cut and separated after all the holes H of each product WP and the space S between each product WP have been subjected to laser cutting, the thermal effect on each product WP is large, and dimensional accuracy is improved. Further improvement is desired for improvement.

本発明は、前述のごとき従来の問題に鑑みてなされたもので、Ｘ軸方向の辺とＹ軸方向の辺とを備えた製品を、板状のワークにＸ軸方向に複数列、Ｙ軸方向に複数行配置し、レーザ切断加工によって各製品をワークから切断分離するレーザ切断加工方法であって、第１列における複数の製品のＸ軸方向の一端部を、連続してＹ軸方向にレーザ切断加工を行う（ａ）工程と、前記第１列における複数の製品のＸ軸方向の他端部と第２列における複数の製品のＸ軸方向の一端部との境界線を、連続してＹ軸方向にレーザ切断加工を行う（ｂ）工程と、前記第１列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行うとき、前記他端部の境界線との間に微小連結部を残す（ｃ）工程と、前記第２列における複数の製品におけるＸ軸方向の他端部を、連続してＹ軸方向にレーザ切断加工を行う（ｄ）工程と、前記第２列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行うとき、Ｘ軸方向の他端部のＹ軸方向の切断線との間に微小連結部を残す（ｅ）工程、の各工程を備えていることを特徴とするものである。   The present invention has been made in view of the conventional problems as described above, and a product having a side in the X-axis direction and a side in the Y-axis direction is arranged on a plate-like workpiece in a plurality of rows in the X-axis direction, A laser cutting method in which a plurality of rows are arranged in a direction and each product is cut and separated from a workpiece by laser cutting, and one end portion of the plurality of products in the first column in the X axis direction is continuously arranged in the Y axis direction. (A) performing laser cutting, and the boundary line between the other end portion in the X-axis direction of the plurality of products in the first row and the one end portion in the X-axis direction of the plurality of products in the second row is continuous. (B) performing laser cutting in the Y-axis direction, and laser cutting from one end to the other end in the X-axis direction of each product in order to cut and separate the plurality of products in the first row from the workpiece (C) A process of leaving a minute connecting part between the boundary line of the other end when processing (D) a step of continuously cutting the other end portion in the X-axis direction of the plurality of products in the second row in the Y-axis direction, and the plurality of products in the second row from the workpiece. When laser cutting is performed from one end portion in the X-axis direction to the other end portion of each product in order to cut and separate, a minute coupling portion remains between the cutting line in the Y-axis direction at the other end portion in the X-axis direction. (E) The process is provided with each process.

また、前記レーザ切断加工方法において、前記各製品において穴加工を含む製品においては、当該製品の切断分離のためのレーザ切断加工の直前に穴加工を行うことを特徴とするものである。   Further, in the laser cutting method, in each of the products including the hole processing, the hole processing is performed immediately before the laser cutting processing for cutting and separating the product.

また、Ｘ軸方向の辺とＹ軸方向の辺を備えた製品を、板状のワークにＸ軸方向に１列、Ｙ軸方向に複数行配置し、レーザ切断加工によって各製品をワークから切断分離するレーザ切断加工方法であって、第１列における複数の製品のＸ軸方向の一端部を、連続してＹ軸方向にレーザ切断加工を行う（ａ）工程と、前記第１列における複数の製品のＸ軸方向の他端部を、連続してＹ軸方向にレーザ切断加工を行う（ｂ）工程と、前記第１列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行う（ｃ）工程との各工程を備えていることを特徴とするものである。   In addition, products with X-axis and Y-axis sides are placed on a plate-shaped workpiece in one row in the X-axis direction and multiple rows in the Y-axis direction, and each product is cut from the workpiece by laser cutting. A laser cutting method for separating, wherein (a) a step of continuously performing laser cutting processing in the Y-axis direction on one end portion in the X-axis direction of a plurality of products in the first row, and a plurality of the first row in the first row In order to cut and separate the plurality of products in the first row from the workpiece, the step (b) of continuously cutting the other end of the product in the X-axis direction in the Y-axis direction is performed. And (c) a step of performing laser cutting from one end portion to the other end portion in the X-axis direction.

また、前記レーザ切断加工方法において、前記各製品において穴加工を含む製品においては、当該製品の切断分離のためのレーザ切断加工の直前に穴加工を行うことを特徴とするものである。   Further, in the laser cutting method, in each of the products including the hole processing, the hole processing is performed immediately before the laser cutting processing for cutting and separating the product.

また、前記レーザ切断加工方法のレーザ切断加工順を設定するためのレーザ切断加工順設定装置であって、製品の形状寸法及びＸ軸方向の列数並びにＹ軸方向の行数を入力する入力手段と、前記入力された列数及び行数を参照してＹ軸方向の切断回数及び切断順を演算すると共にＸ軸方向の切断回数及び切断順を演算する演算手段と、当該演算手段の演算結果をレーザ切断加工機側へ出力する出力手段と、を備えていることを特徴とするものである。   A laser cutting processing order setting device for setting the laser cutting processing order of the laser cutting processing method, wherein the input means inputs the product shape dimensions, the number of columns in the X-axis direction, and the number of rows in the Y-axis direction. A calculation means for calculating the number of cuts and cutting order in the Y-axis direction with reference to the input number of columns and rows, and calculating the number of cuts and cutting order in the X-axis direction, and a calculation result of the calculation means Output means for outputting to the laser cutting machine side.

本発明によれば、ピアス加工の回数を少なくして加工能率向上を図ることができる。また、各製品に対する熱影響を抑制して寸法精度の向上を図ることができるものである。   According to the present invention, it is possible to improve the machining efficiency by reducing the number of times of piercing. Moreover, the thermal influence with respect to each product can be suppressed and the dimensional accuracy can be improved.

本発明の実施形態に係るレーザ切断加工方法の説明図である。It is explanatory drawing of the laser cutting processing method which concerns on embodiment of this invention. 本発明の実施形態に係るレーザ切断加工方法と従来のレーザ切断加工方法の比較説明図である。It is comparison explanatory drawing of the laser cutting processing method which concerns on embodiment of this invention, and the conventional laser cutting processing method. 機能ブロック図の説明図である。It is explanatory drawing of a functional block diagram. 従来のレーザ切断加工方法の説明図である。It is explanatory drawing of the conventional laser cutting processing method.

以下、図面を用いて説明するに、図１に示すように、Ｘ軸方向の辺１Ａ，１ＢよりもＹ軸方向の辺３Ａ，３Ｂが短く、かつ各角部に面取りＣを行った形態の長尺の製品５を、板状のワークＷにＸ軸方向に複数列７Ａ，７Ｂ，７Ｃ、Ｙ軸方向に複数行９Ａ〜９Ｄに配置し、レーザ切断加工によって各製品５をワークＷから切断分離する場合について説明する。   Hereinafter, as described with reference to the drawings, as shown in FIG. 1, the sides 3A and 3B in the Y-axis direction are shorter than the sides 1A and 1B in the X-axis direction, and each corner is chamfered C. A long product 5 is arranged on a plate-like workpiece W in a plurality of rows 7A, 7B, 7C in the X-axis direction and in a plurality of rows 9A to 9D in the Y-axis direction, and each product 5 is cut from the workpiece W by laser cutting. A case of separation will be described.

図１に示すように、Ｘ軸方向に長い長尺の複数の製品５をＸ軸方向及びＹ軸方向に互いに接触して、Ｘ軸方向に複数列、Ｙ軸方向に複数行配置した形態において、各製品５をレーザ切断加工によって切断分離するには、先ず、第１列７Ａにおける複数の製品５のＸ軸方向の一端部（図１においての左端部）を連続してＹ軸方向にレーザ切断加工を行う。すなわち、第１列７ＡのＸ軸方向の一端部に近接した位置に第１のピアス加工Ｐ１を行い、第１列７Ａにおける全ての製品５Ａ〜５ＤのＸ軸方向の一端部を連続して切断するために第１回目のＹ軸方向のレーザ切断加工を行うものである。   As shown in FIG. 1, in a form in which a plurality of long products 5 that are long in the X-axis direction are in contact with each other in the X-axis direction and the Y-axis direction and arranged in a plurality of columns in the X-axis direction and a plurality of rows in the Y-axis direction. In order to cut and separate each product 5 by laser cutting, first, one end portion (left end portion in FIG. 1) of the plurality of products 5 in the first row 7A is continuously lasered in the Y axis direction. Perform cutting. That is, the first piercing process P1 is performed at a position close to one end portion in the X-axis direction of the first row 7A, and one end portion in the X-axis direction of all the products 5A to 5D in the first row 7A is continuously cut. Therefore, the first laser cutting process in the Y-axis direction is performed.

次に、第１列７Ａの各製品５Ａ〜５Ｄと第２列７Ｂにおける各製品１１Ａ〜１１Ｃとの境界線（棧幅共有線）のレーザ切断加工を行う。従って、第１列７Ａと第２列７Ｂとの境界線、すなわち、第１列７Ａにおける各製品５Ａ〜５Ｄの他端部（図１においての右端部）と第２列７Ｂにおける各製品１１Ａ〜１１Ｃの一端部との境界線に近接した位置に第２のピアス加工Ｐ２を行い、第１列７Ａにおける全ての製品５Ａ〜５Ｄにおける他端部を連続してＹ軸方向にレーザ切断加工を行う。すなわち、第２回目のＹ軸方向のレーザ切断加工を行う。   Next, a laser cutting process is performed on the boundary lines (breadth shared lines) between the products 5A to 5D in the first row 7A and the products 11A to 11C in the second row 7B. Therefore, the boundary line between the first row 7A and the second row 7B, that is, the other end portion (the right end portion in FIG. 1) of each product 5A to 5D in the first row 7A and each product 11A in the second row 7B. The second piercing process P2 is performed at a position close to the boundary line with the one end portion of 11C, and the other end portions of all the products 5A to 5D in the first row 7A are continuously laser cut in the Y-axis direction. . That is, the second laser cutting process in the Y-axis direction is performed.

前述のように、第１列７Ａにおける複数行９Ａ〜９Ｄの全ての製品５Ａ〜５ＤのＸ軸方向の一端部及び他端部を連続してＹ軸方向にレーザ切断加工を行った後、第１列７Ａにおける各製品５Ａ〜５Ｄを、第１行目９Ａから順に切断分離するものである。この際、各製品５Ａ〜５Ｄに穴１３が含まれる場合には、各製品５Ａ〜５Ｄを個別に切断分離のためのレーザ切断加工を行う直前に前記穴１３のレーザ切断加工を行うものである。   As described above, after performing laser cutting in the Y-axis direction continuously on one end and the other end in the X-axis direction of all the products 5A to 5D in the plurality of rows 9A to 9D in the first column 7A, The products 5A to 5D in one column 7A are cut and separated in order from the first row 9A. At this time, when the holes 13 are included in the respective products 5A to 5D, laser cutting of the holes 13 is performed immediately before performing laser cutting for individually separating the products 5A to 5D. .

すなわち、例えば第１列７Ａにおける１行目９Ａの製品５Ａの切断分離を行う場合には、製品５Ａに含まれる穴１３のレーザ切断加工を行った後に、１行目の製品５ＡにおけるＸ軸方向に長い辺１Ａ，１Ｂを製品５Ａの一端部から他端部方向へレーザ切断加工を行う。そして、第１列７Ａと第２列７Ｂとの前記境界線のレーザ切断加工を行った前記切断線との間に微小連結部（ミクロジョイント）１５を残すものである。第２行目９Ｂ〜第４行目９Ｄの各製品５Ｂ〜５Ｄの切断分離を行う場合にも、第１行目９Ａの製品５Ａの場合と同様に、穴１３が含まれる場合には、穴１３のレーザ切断加工を行った直後に、当該穴１３を含む製品のＸ軸方向の辺のレーザ切断加工を一端部から他端部方向へ行い、ミクロジョイント１５を残すものである。   That is, for example, when cutting and separating the product 5A in the first row 9A in the first column 7A, the laser cutting processing of the holes 13 included in the product 5A is performed, and then the X-axis direction in the product 5A in the first row The long sides 1A and 1B are laser cut from one end of the product 5A to the other end. And the minute connection part (micro joint) 15 remains between the said cutting line which performed the laser cutting process of the said boundary line of the 1st row | line 7A and the 2nd row | line 7B. In the case of cutting and separating each of the products 5B to 5D in the second row 9B to the fourth row 9D, as in the case of the product 5A in the first row 9A, Immediately after performing the laser cutting process 13, the laser cutting process on the side in the X-axis direction of the product including the hole 13 is performed from one end to the other end, and the micro joint 15 is left.

前述したように、第１列７Ａにおける各製品５Ａ〜５Ｄの切断分離が終了した後は、隣接した第２列７Ｂにおける各製品１１Ａ〜１１Ｃの切断分離を行うことになる。この際、前記第２回目のＹ軸方向のレーザ切断加工時に残した製品１１Ａ〜１１Ｃの面取加工１７を行った後、第２列７ＢのＸ軸方向の他端部に隣接した第３列７Ｃとの境界線に近接した位置に第３のピアス加工Ｐ３を行う。そして、第２列７Ｂにおける各製品１１Ａ〜１１ＣのＸ軸方向の他端部と第３列７Ｃにおける各製品１９Ａ〜１９ＣのＸ軸方向の一端部との境界線のレーザ切断を行う。すなわち、第３回目のＹ軸方向のレーザ切断加工を行う。   As described above, after the cutting and separation of the products 5A to 5D in the first row 7A is completed, the products 11A to 11C in the adjacent second row 7B are cut and separated. At this time, after performing the chamfering 17 of the products 11A to 11C left during the second laser cutting in the Y-axis direction, the third row adjacent to the other end portion in the X-axis direction of the second row 7B. A third piercing process P3 is performed at a position close to the boundary line with 7C. Then, laser cutting is performed on a boundary line between the other end portion in the X-axis direction of each product 11A to 11C in the second row 7B and one end portion in the X-axis direction of each product 19A to 19C in the third row 7C. That is, the third laser cutting process in the Y-axis direction is performed.

上述のように、第２列７Ｂにおける各製品１１Ａ〜１１ＣにおけるＸ軸方向の一端部をＹ軸方向に連続してレーザ切断加工を行い、かつＸ軸方向の他端部をＹ軸方向に連続してレーザ切断加工を行った状態において、次に、第２列７Ｂにおける各製品１１Ａ〜１１Ｃを切断分離するためのレーザ切断加工を行うことになる。この場合、製品１１Ａ〜１１Ｃの切断分離は、第１列７Ａにおける前記製品５Ａ〜５Ｄの切断分離と同様に行うものである。   As described above, one end in the X-axis direction of each of the products 11A to 11C in the second row 7B is continuously subjected to laser cutting processing in the Y-axis direction, and the other end in the X-axis direction is continued in the Y-axis direction. Then, in the state where the laser cutting process is performed, the laser cutting process for cutting and separating the products 11A to 11C in the second row 7B is performed. In this case, the products 11A to 11C are cut and separated in the same manner as the products 5A to 5D in the first row 7A.

第２列７Ｂにおける各製品１１Ａ〜１１Ｃの切断分離後に、第３列７Ｃにおける各製品１９Ａ〜１９Ｃの切断分離を行うことになる。この場合、第２列７Ｂにおける各製品１１Ａ〜１１Ｃの切断分離と同様に、１９Ａ〜１９Ｃの面取加工を行った後に、第３列７Ｃにおける製品１９Ａの他端部に近接した位置に第４のピアス加工Ｐ４を行い、第３列７Ｃにおける各製品１９Ａ〜１９ＣのＸ軸方向の他端部を連続してＹ軸方向にレーザ切断加工を行う。すなわち、第４回目のＹ軸方向のレーザ切断加工を行う。   After the products 11A to 11C in the second row 7B are cut and separated, the products 19A to 19C in the third row 7C are cut and separated. In this case, similarly to the cutting and separation of the products 11A to 11C in the second row 7B, after the chamfering of 19A to 19C is performed, the fourth row is positioned near the other end of the product 19A in the third row 7C. The piercing process P4 is performed, and the other end portions in the X-axis direction of the products 19A to 19C in the third row 7C are continuously laser-cut in the Y-axis direction. That is, the fourth laser cutting process in the Y-axis direction is performed.

上述のように、第３列７Ｃにおける各製品１９Ａ〜１９ＣのＸ軸方向の一端部及び他端部をＹ軸方向にレーザ切断加工を行った後は、第３列７Ｃにおける各製品１９Ａ〜１９Ｃを切断分離するためのレーザ切断加工を行う。この場合、各製品１９Ａ〜１９Ｃのレーザ切断加工は、前記製品５Ａ〜５Ｄ、１１Ａ〜１１Ｃのレーザ切断加工と同様に行うものである。   As described above, after laser cutting of the one end and the other end in the X-axis direction of each product 19A to 19C in the third row 7C in the Y-axis direction, each product 19A to 19C in the third row 7C is performed. Laser cutting processing is performed for cutting and separating. In this case, laser cutting of each product 19A to 19C is performed in the same manner as the laser cutting of the products 5A to 5D and 11A to 11C.

前記説明より理解されるように、各製品は、短辺側のレーザ切断加工を行った後に長辺側のレーザ切断加工を行うものであるから、長辺の長さは、予め切断されている短辺間の長さに規定されることとなり、製品の熱膨張によって長辺の寸法精度が悪くなることを抑制することができるものである。換言すれば、長辺の寸法精度の向上を図ることができるものである。   As will be understood from the above description, each product is obtained by performing laser cutting on the long side after performing laser cutting on the short side, so the length of the long side is cut in advance. It will be prescribed | regulated by the length between short sides, and it can suppress that the dimensional accuracy of a long side deteriorates by the thermal expansion of a product. In other words, the dimensional accuracy of the long side can be improved.

また、製品に穴１３が含まれる場合には、穴１３のレーザ切断加工を行った後に、製品の長辺のレーザ切断加工を行うものてあるから、全製品に含まれる穴１３の加工を行った後に製品の長辺のレーザ切断加工を行う場合に比較して熱影響が少なくなり、寸法精度の向上を図ることができるものである。   In addition, when the hole 13 is included in the product, since the laser cutting process of the long side of the product is performed after the laser cutting process of the hole 13, the hole 13 included in all the products is processed. In comparison with the case where laser cutting of the long side of the product is performed after that, the thermal influence is reduced, and the dimensional accuracy can be improved.

また、前記レーザ切断加工方法によれば、製品における長辺のレーザ切断加工の終点にミクロジョイントを形成するものであるから、製品の浮上り現象を防止することができるものである。さらに、各列の境界線をレーザ切断加工するものであるから、ピアス加工回数は（列数＋１）となり、ピアス加工を少なくすることができるものである。   Further, according to the laser cutting method, since the micro joint is formed at the end point of the long-side laser cutting processing in the product, the floating phenomenon of the product can be prevented. Further, since the boundary line of each column is cut by laser, the number of times of piercing is (number of columns + 1), and the piercing can be reduced.

ここで、複数列、複数行に配置した複数の製品をレーザ切断加工によって切断分離する場合において、前述した本実施形態によるレーザ切断加工方法と、図４に示した従来のレーザ切断加工方法とを対比すると、図２（Ａ），（Ｂ）に示すようになる。すなわち、本実施形態によるレーザ切断加工方法においては、図２（Ａ）に示すように、ピアス加工はＰ１〜Ｐ６であって、（列数＋１）の回数である。従来のレーザ切断加工方法においてのピアス加工回数は、Ｐ１〜Ｐ９となり、列数に比較して４回も多くなっている。したがって、ピアス加工回数を少なくしてレーザ切断加工能率向上を図る上において、本実施形態に係るレーザ切断加工方法は効果が大きいものである。   Here, in the case of cutting and separating a plurality of products arranged in a plurality of columns and a plurality of rows by laser cutting processing, the laser cutting processing method according to this embodiment described above and the conventional laser cutting processing method shown in FIG. In contrast, the results are as shown in FIGS. That is, in the laser cutting processing method according to the present embodiment, as shown in FIG. 2A, the piercing processing is P1 to P6 and is the number of times (number of columns + 1). The number of times of piercing in the conventional laser cutting method is P1 to P9, which is four times larger than the number of columns. Therefore, the laser cutting processing method according to the present embodiment is very effective in reducing the number of times of piercing and improving the laser cutting processing efficiency.

前述したように、複数の製品をＸ軸方向に複数列、Ｙ軸方向に複数行に配置して、ワークＷから各製品の切断分離を行うためのレーザ切断加工経路は、レーザ切断加工順設定装置２１（図３参照）によって設定される。このレーザ切断加工順設定装置２１はコンピュータから構成してあって、ＣＰＵ２３、ＲＡＭ２５、ＲＯＭ２７及び入力手段２９を備えている。また、前記レーザ切断加工順設定装置２１は、前記入力手段２９から入力された製品の形状寸法から製品に穴が含まれるか否かを判別する形状判別手段３０を備えている。さらに、ワークの材質、板厚、製品の形状寸法に対応して予め設定されたミクロジョイントの大きさをパラメータとして格納したミクロジョイントパラメータメモリ３１を備えている。   As described above, a plurality of products are arranged in a plurality of columns in the X-axis direction and in a plurality of rows in the Y-axis direction, and the laser cutting processing path for cutting and separating each product from the workpiece W is set as the laser cutting processing order. Set by the device 21 (see FIG. 3). The laser cutting processing order setting device 21 is constituted by a computer and includes a CPU 23, a RAM 25, a ROM 27, and an input means 29. Further, the laser cutting processing order setting device 21 includes a shape discriminating unit 30 that discriminates whether or not the product includes a hole from the shape dimension of the product input from the input unit 29. Further, a micro joint parameter memory 31 is provided which stores a micro joint size set in advance as a parameter corresponding to the workpiece material, plate thickness, and product shape.

さらに、前記レーザ切断加工順設定装置２１は、前記入力手段２９から入力された条件によってレーザ切断加工順を設定する演算手段３３を備えていると共に、前記演算手段３３の演算手段を、レーザ切断加工機（図示省略）側へ出力する出力手段３５を備えている。すなわち、前記出力手段３５は、レーザ切断加工機の動作プログラムを生成する自動プログラミング装置３７へ前記演算結果を出力するものである。   Further, the laser cutting processing order setting device 21 is provided with calculating means 33 for setting the laser cutting processing order according to the conditions input from the input means 29, and the calculating means of the calculating means 33 is used as the laser cutting processing. An output means 35 for outputting to a machine (not shown) side is provided. That is, the output means 35 outputs the calculation result to an automatic programming device 37 that generates an operation program for the laser cutting machine.

上記構成において、入力手段２９からワークＷの材質、板厚及び各製品の形状寸法を入力すると、材質、板厚、製品の形状寸法に対応したミクロジョイントがミクロジョイントパラメータメモリ３１から検索されると共に、形状判別手段３０において各製品に穴が含まれるか否かの判別が行われる。また、入力手段２９から製品数に対応して列数及び各列における行数を入力すると、例えば図１に示すごとき製品の配置が得られることになる。前述のように、列数及び各列の行数が入力されると、演算手段３５において、Ｙ軸方向への連続したレーザ切断加工は（列数＋１）であると演算され、各列７Ａ〜７Ｃに対応してピアス加工位置Ｐ１〜Ｐ４が設定される。   In the above configuration, when the material of the workpiece W, the plate thickness, and the shape dimensions of each product are input from the input means 29, the micro joint corresponding to the material, the plate thickness, and the shape dimension of the product is retrieved from the micro joint parameter memory 31. Then, the shape determining means 30 determines whether each product includes a hole. Further, when the number of columns and the number of rows in each column are input from the input means 29 in correspondence with the number of products, for example, an arrangement of products as shown in FIG. 1 is obtained. As described above, when the number of columns and the number of rows in each column are input, the calculation means 35 calculates that the continuous laser cutting in the Y-axis direction is (number of columns + 1), and each column 7A to Piercing positions P1 to P4 are set corresponding to 7C.

前述のように、ピアス加工位置Ｐ１〜Ｐ４が設定されると、演算手段３３において、第１列７Ａにおける製品５Ａ〜５Ｄの一端部をＹ軸方向にレーザ切断加工を行うべくピアス加工位置Ｐ１が最初のレーザ切断開始位置であると設定する。そして、第１列７Ａにおける製品５Ａ〜５Ｄの他端部と第２列７Ｂにおける製品１１Ａ〜１１Ｃの一端部との境界線に対応して設定したピアス加工位置Ｐ２が２番目のレーザ切断開始位置であると設定する。   As described above, when the piercing positions P1 to P4 are set, the calculation means 33 sets the piercing positions P1 so as to perform laser cutting on the one end of the products 5A to 5D in the first row 7A in the Y-axis direction. Set to be the first laser cutting start position. And the piercing position P2 set corresponding to the boundary line between the other end of the products 5A to 5D in the first row 7A and one end of the products 11A to 11C in the second row 7B is the second laser cutting start position. Set to be.

第１列７Ａにおける製品５Ａ〜５Ｄの一端部及び他端部をＹ軸方向に連続してレーザ切断加工を行う条件の下に、次に、第１列７Ａにおける各製品５Ａ〜５Ｄを第１行目９Ａから順に切断分離するために、演算手段３５において、第１行目９Ａにおける製品５ＡにおけるＹ軸方向の２辺１Ａ，１Ｂを次にＸ軸方向にレーザ切断加工する順に設定する。ここで、前記形状判別手段３０によって前記製品５Ａに穴１３が含まれるものと既に判別されている場合には、Ｙ軸方向の前記２辺１Ａ，１ＢのＸ軸方向のレーザ切断加工よりも先に穴１３のレーザ切断加工を行うものとして順が設定される。   Under the condition that the laser cutting process is performed continuously on one end and the other end of the products 5A to 5D in the first row 7A in the Y-axis direction, each of the products 5A to 5D in the first row 7A is first In order to cut and separate in order from the line 9A, the calculation means 35 sets the two sides 1A and 1B in the Y-axis direction of the product 5A in the first line 9A in the order of the next laser cutting process in the X-axis direction. Here, when the shape discriminating means 30 has already discriminated that the product 5A includes the hole 13, the X-axis direction laser cutting of the two sides 1A and 1B in the Y-axis direction is performed. The order is set to perform laser cutting of the holes 13.

次に、第１列７Ａにおける第２行目９Ｂにおける製品５Ｂを切断分離するために、演算手段３３において、製品５ＢをＸ軸方向にレーザ切断加工を次の順に設定する。なお、製品５Ｂにおいても、穴１３が含まれるか否かの判別を行い、前記形状判別手段３０による判別結果が、穴１３を含む場合には、製品５Ｂに含まれる穴１３のレーザ切断加工を、製品５ＢをＸ軸方向にレーザ切断加工する場合よりも先に設定するものである。そして、第１列７Ａにおける次の製品５Ｃ，５Ｄの場合も、穴１３が含まれる場合には、演算手段３３において、穴１３のレーザ切断加工を行った後に、各製品５Ｃ，５Ｄを切断分離するためのレーザ切断加工を行うものと、レーザ切断加工順を設定するものである。   Next, in order to cut and separate the product 5B in the second row 9B in the first column 7A, the calculation means 33 sets the laser cutting processing of the product 5B in the X-axis direction in the following order. In the product 5B, whether or not the hole 13 is included is determined. If the determination result by the shape determining unit 30 includes the hole 13, the laser cutting process of the hole 13 included in the product 5B is performed. The product 5B is set before the laser cutting process in the X-axis direction. In the case of the next products 5C and 5D in the first row 7A, when the holes 13 are included, the products 5C and 5D are cut and separated after the holes 13 are laser-cut by the calculation means 33. For performing the laser cutting process to set the laser cutting process order.

前述のように、第１列７Ａにおける各製品５Ａ〜５Ｄを切断分離するためのレーザ切断加工順が設定されると、次に、第２列７Ｂにおける各製品１１Ａ〜１１Ｃの切断分離を行うために、第２列７Ｂにおける各製品１１Ａ〜１１Ｃの一端部の面取り加工１７を行うレーザ切断加工順を設定した後、前記ピアス加工位置Ｐ３からＹ軸方向に連続してレーザ切断加工を行うことを、演算手段３５によって、次のレーザ切断加工順に設定する。その後、第２列７Ｂにおける各製品１１Ａ〜１１Ｃを第１行目９Ａから順に切断分離するためのレーザ切断加工順を設定する。なお、各製品１１Ａ〜１１Ｃを切断分離する際に、各製品１１Ａ〜１１Ｃに穴１３が含まれるか否かを形状判別手段３０によって判別し、穴１３が含まれる場合には、各製品１１Ａ〜１１Ｃをレーザ切断加工によって切断分離する直前のレーザ切断加工として、穴１３のレーザ切断加工が演算手段３３によって設定される。   As described above, when the laser cutting processing order for cutting and separating the products 5A to 5D in the first row 7A is set, next, the products 11A to 11C in the second row 7B are cut and separated. In addition, after setting the laser cutting processing order for performing the chamfering process 17 on one end of each product 11A to 11C in the second row 7B, the laser cutting process is continuously performed in the Y-axis direction from the piercing position P3. The calculation means 35 sets the next laser cutting processing order. Thereafter, a laser cutting processing order for cutting and separating the products 11A to 11C in the second column 7B in order from the first row 9A is set. When the products 11A to 11C are cut and separated, it is determined by the shape determination means 30 whether or not the holes 11 are included in the products 11A to 11C. The laser cutting processing of the hole 13 is set by the arithmetic means 33 as the laser cutting processing immediately before 11C is cut and separated by laser cutting processing.

前述のごとく、第２列７Ｂにおける各製品１１Ａ〜１１Ｃを切断分離するためのレーザ切断加工順が設定された後、第３列７Ｃにおける各製品１９Ａ〜１９Ｃの一端部の面取り加工１７を行うためのレーザ切断加工順を設定する。その後に、第３列７Ｃにおける各製品１９Ａ〜１９Ｃの他端部を連続してレーザ切断加工すべく、前記第４ピアス位置Ｐ４からＹ軸方向にレーザ切断加工を行うことを、演算手段３３によって次のレーザ切断加工順に設定する。そして、次に、第３列７Ｃにおける各製品１１Ａ〜１１Ｃを第１行目９Ａから順にレーザ切断加工を行うレーザ切断加工順を、演算手段３３によって演算する。   As described above, after the laser cutting processing order for cutting and separating the products 11A to 11C in the second row 7B is set, the chamfering processing 17 for one end of each product 19A to 19C in the third row 7C is performed. Set the laser cutting processing order. Thereafter, the calculation means 33 performs laser cutting in the Y-axis direction from the fourth piercing position P4 in order to continuously perform laser cutting on the other end of each product 19A to 19C in the third row 7C. The next laser cutting processing order is set. Then, the laser cutting processing order for performing laser cutting processing on the products 11A to 11C in the third column 7C in order from the first row 9A is calculated by the calculation means 33.

前述のように、第１列７Ａ〜第３列７Ｃにおける各製品５Ａ〜５Ｄ：１１Ａ〜１１Ｃ：１９Ａ〜１９Ｃを切断分離するためのレーザ切断加工順が演算手段３３によって設定されると、レーザ切断加工順の演算結果及び前記入力手段２９から入力されたワークＷの材質、板厚、各製品の形状寸法の各情報並びにミクロジョイントパラメータメモリ３１から検索されたミクロジョイントの情報が出力手段３５から自動プログラミング装置３７へ出力される。   As described above, when the laser cutting processing order for cutting and separating the products 5A to 5D: 11A to 11C: 19A to 19C in the first column 7A to the third column 7C is set by the computing unit 33, the laser cutting is performed. The calculation result of the processing order, the information of the material of the workpiece W, the plate thickness, the shape dimension of each product inputted from the input means 29, and the information of the micro joint retrieved from the micro joint parameter memory 31 are automatically outputted from the output means 35. It is output to the programming device 37.

そして、自動プログラミング装置３７においては、前記出力手段３５から入力された各情報を参照して、レーザ切断加工機によってワークＷのレーザ切断加工を行うための加工プログラムを作成するものである。したがって、レーザ切断加工機においては、自動プログラミング装置３７から入力された加工プログラムに従って、ワークＷのレーザ切断加工を行うことになるものである。   The automatic programming device 37 refers to each piece of information input from the output means 35 and creates a machining program for performing laser cutting of the workpiece W by a laser cutting machine. Therefore, in the laser cutting machine, the workpiece W is laser-cut according to the processing program input from the automatic programming device 37.

既に理解されるように、本実施形態においては、複数の製品を複数列、複数行に配置してレーザ切断加工を行うものであるから、少なくとも２列以上、２行以上の配置を対象とするものである。   As already understood, in this embodiment, since a plurality of products are arranged in a plurality of columns and a plurality of rows and laser cutting is performed, it is intended to arrange at least two columns or more and two or more rows. Is.

なお、製品の列数を１列、複数行配置とすることも可能である。この場合、図１に示した第１列７Ａにおける各製品５Ａ〜５Ｄのみのレーザ切断加工を行い、第２列７Ｂ、第３列７Ｃには加工すべき製品が存在しない場合に相当するものである。したがって、第１列７Ａにおける複数行９Ａ〜９Ｄの各製品５Ａ〜５Ｄをレーザ切断加工によって切断分離するには、次のように行うものである。   It is also possible to arrange the number of product columns in one column and a plurality of rows. In this case, only the products 5A to 5D in the first row 7A shown in FIG. 1 are subjected to laser cutting, and there is no product to be processed in the second row 7B and the third row 7C. is there. Therefore, in order to cut and separate the products 5A to 5D in the plurality of rows 9A to 9D in the first column 7A by laser cutting, the following is performed.

すなわち、前述した説明と同様に、第１列７Ａにおける複数の製品５のＸ軸方向の一端部に近接した位置に第１のピアス加工Ｐ１を行い、全ての製品５Ａ〜５ＤのＸ軸方向の一端部を連続してＹ軸方向にレーザ切断加工する。次に、第１列７ＡにおけるＸ軸方向の他端部に近接した位置に第２のピアス加工Ｐ２を行い、各製品５Ａ〜５ＤのＸ軸方向の他端部を連続してＹ軸方向にレーザ切断加工する。   That is, in the same manner as described above, the first piercing P1 is performed at a position close to one end in the X-axis direction of the plurality of products 5 in the first row 7A, and all the products 5A to 5D in the X-axis direction are processed. One end is continuously laser cut in the Y-axis direction. Next, the second piercing process P2 is performed at a position close to the other end portion in the X-axis direction in the first row 7A, and the other end portions in the X-axis direction of the products 5A to 5D are continuously arranged in the Y-axis direction. Laser cutting process.

上述のように、第１列７Ａにおける全ての製品５Ａ〜５ＤのＸ軸方向の両端部をＹ軸方向に連続してレーザ切断加工を行った後、各製品５Ａ〜５Ｄを、第１行目９Ａから順に切断分離する。この際、各製品５Ａ〜５Ｄに穴１３が含まれる場合には、前述同様に、各製品５Ａ〜５Ｄを個別に切断分離するレーザ切断加工を行う直前に、各製品５Ａ〜５Ｄに個々に穴１３のレーザ切断加工を行うものである。そして、第２列７Ｂ以降には切断分離すべき製品が存在しないので、前述したごとくミクロジョイント１５を残すことなく切断分離するものである。   As described above, after laser cutting processing is performed continuously in the Y-axis direction on both ends in the X-axis direction of all the products 5A to 5D in the first column 7A, each product 5A to 5D is changed to the first row. Cut and separate sequentially from 9A. At this time, when the holes 13 are included in each of the products 5A to 5D, the holes are individually formed in each of the products 5A to 5D immediately before performing the laser cutting process for individually cutting and separating the products 5A to 5D as described above. 13 laser cutting processes are performed. Since there is no product to be cut and separated after the second row 7B, cutting and separation is performed without leaving the micro joint 15 as described above.

なお、上記説明は、製品を１列、複数行に配置した場合のレーザ切断加工方法であるが、複数の製品を複数列、１行に配置することも可能である。この場合、列と行を入れ替えてレーザ切断加工方向を変更することにより、上記説明と同様に行い得るものである。   In addition, although the said description is a laser cutting processing method when a product is arrange | positioned in 1 column and several rows, it is also possible to arrange | position several products in multiple columns and 1 row. In this case, it can be performed in the same manner as described above by changing the laser cutting direction by exchanging columns and rows.

ところで、本発明は、前述したごとき実施形態のみに限るものではなく、適宜の変更を行うことにより、その他の形態でも実施可能なものである。例えば、ミクロジョイントパラメータメモリ３１は自動プログラミング装置３７に備えることも可能である。また、製品の形状としては、同一形状の製品に限ることなく、各列に形状寸法の異なる製品を配置することも可能である。さらには、各列における行間が異なる配置とすることも可能である。   By the way, the present invention is not limited to the embodiment as described above, and can be implemented in other forms by making appropriate changes. For example, the micro joint parameter memory 31 can be provided in the automatic programming device 37. The product shape is not limited to products having the same shape, and products having different shape dimensions can be arranged in each row. Furthermore, it is possible to arrange the rows in each column differently.

１Ａ，１Ｂ Ｘ軸方向の辺
３Ａ，３Ｂ Ｙ軸方向の辺
５Ａ〜５Ｄ，１１Ａ〜１１Ｃ，１９Ａ〜１９Ｃ 製品
７Ａ〜７Ｃ 列
９Ａ〜９Ｄ 行
Ｐ１〜Ｐ４ ピアス加工
１３ 穴
１５ 微小連結部（ミクロジョイント） 1A, 1B X-axis side 3A, 3B Y-axis side 5A-5D, 11A-11C, 19A-19C Product 7A-7C Row 9A-9D Row P1-P4 Piercing 13 Hole 15 Micro-joint (micro joint )

Claims (5)

Ｘ軸方向の辺とＹ軸方向の辺を備えた製品を、板状のワークにＸ軸方向に複数列、Ｙ軸方向に複数行配置し、レーザ切断加工によって各製品をワークから切断分離するレーザ切断加工方法であって、
（ａ）第１列における複数の製品のＸ軸方向の一端部を、連続してＹ軸方向にレーザ切断加工を行う工程、
（ｂ）前記第１列における複数の製品のＸ軸方向の他端部と第２列における複数の製品のＸ軸方向の一端部との境界線を、連続してＹ軸方向にレーザ切断加工を行う工程、
（ｃ）前記第１列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行うとき、前記他端部の境界線との間に微小連結部を残す工程、
（ｄ）前記第２列における複数の製品におけるＸ軸方向の他端部を、連続してＹ軸方向にレーザ切断加工を行う工程、
（ｅ）前記第２列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行うとき、Ｘ軸方向の他端部のＹ軸方向の切断線との間に微小連結部を残す工程、
の各工程を備えていることを特徴とするレーザ切断加工方法。 A product having sides in the X-axis direction and sides in the Y-axis direction are arranged in a plate-like workpiece in a plurality of rows in the X-axis direction and in a plurality of rows in the Y-axis direction, and each product is cut and separated from the workpiece by laser cutting. A laser cutting method,
(A) A step of continuously cutting one end portion of the plurality of products in the first row in the X-axis direction in the Y-axis direction;
(B) Laser cutting of the boundary line between the other end in the X-axis direction of the plurality of products in the first row and the one end in the X-axis direction of the plurality of products in the second row in the Y-axis direction continuously. The process of performing,
(C) When laser cutting is performed from one end portion in the X-axis direction to the other end portion of each product in order to cut and separate the plurality of products in the first row from the workpiece, the boundary line of the other end portion Leaving a micro-connection between
(D) a step of continuously performing laser cutting in the Y-axis direction on the other end in the X-axis direction of the plurality of products in the second row;
(E) When performing laser cutting from one end of the X-axis direction to the other end of each product in order to cut and separate the plurality of products in the second row from the workpiece, Leaving a micro-connection between the cutting line in the Y-axis direction,
A laser cutting method comprising the steps of: 請求項１に記載のレーザ切断加工方法において、前記各製品において穴加工を含む製品においては、当該製品の切断分離のためのレーザ切断加工の直前に穴加工を行うことを特徴とするレーザ切断加工方法。   2. The laser cutting processing method according to claim 1, wherein in each of the products including a hole processing, the hole cutting is performed immediately before the laser cutting processing for cutting and separating the product. Method. Ｘ軸方向の辺とＹ軸方向の辺を備えた製品を、板状のワークにＸ軸方向に１列、Ｙ軸方向に複数行配置し、レーザ切断加工によって各製品をワークから切断分離するレーザ切断加工方法であって、
（ａ）第１列における複数の製品のＸ軸方向の一端部を、連続してＹ軸方向にレーザ切断加工を行う工程、
（ｂ）前記第１列における複数の製品のＸ軸方向の他端部を、連続してＹ軸方向にレーザ切断加工を行う工程、
（ｃ）前記第１列における複数の製品を前記ワークから切断分離するために、各製品のＸ軸方向の一端部から他端部へレーザ切断加工を行う工程、
の各工程を備えていることを特徴とするレーザ切断加工方法。 A product having sides in the X-axis direction and sides in the Y-axis direction is arranged on a plate-shaped workpiece in one row in the X-axis direction and in a plurality of rows in the Y-axis direction, and each product is cut and separated from the workpiece by laser cutting. A laser cutting method,
(A) A step of continuously cutting one end portion of the plurality of products in the first row in the X-axis direction in the Y-axis direction;
(B) a step of continuously performing laser cutting processing in the Y-axis direction on the other end portions in the X-axis direction of the plurality of products in the first row;
(C) a step of performing laser cutting from one end portion to the other end portion in the X-axis direction of each product in order to cut and separate the plurality of products in the first row from the workpiece;
A laser cutting method comprising the steps of: 請求項３に記載のレーザ切断加工方法において、前記各製品において穴加工を含む製品においては、当該製品の切断分離のためのレーザ切断加工の直前に穴加工を行うことを特徴とするレーザ切断加工方法。   4. The laser cutting processing method according to claim 3, wherein in each of the products including the hole processing, the hole cutting is performed immediately before the laser cutting processing for cutting and separating the product. Method. 請求項１〜４のいずれかに記載のレーザ切断加工方法のレーザ切断加工順を設定するためのレーザ切断加工順設定装置であって、製品の形状寸法及びＸ軸方向の列数並びにＹ軸方向の行数を入力する入力手段と、前記入力された列数及び行数を参照してＹ軸方向の切断回数及び切断順を演算すると共にＸ軸方向の切断回数及び切断順を演算する演算手段と、当該演算手段の演算結果をレーザ切断加工機側へ出力する出力手段と、を備えていることを特徴とするレーザ切断加工順設定装置。   A laser cutting processing order setting device for setting the laser cutting processing order of the laser cutting processing method according to any one of claims 1 to 4, wherein the shape dimension of the product, the number of columns in the X-axis direction, and the Y-axis direction Input means for inputting the number of rows, and calculating means for calculating the number of cuts and the cutting order in the Y-axis direction and calculating the number of cuts and the cutting order in the X-axis direction with reference to the input number of columns and rows And an output means for outputting the calculation result of the calculation means to the laser cutting machine side.
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