JP2013214671A - Light source device - Google Patents

Light source device Download PDF

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JP2013214671A
JP2013214671A JP2012085173A JP2012085173A JP2013214671A JP 2013214671 A JP2013214671 A JP 2013214671A JP 2012085173 A JP2012085173 A JP 2012085173A JP 2012085173 A JP2012085173 A JP 2012085173A JP 2013214671 A JP2013214671 A JP 2013214671A
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wiring board
shielding plate
light source
light
light shielding
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Masahiro Sawayanagi
昌広 澤柳
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Yazaki Corp
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Yazaki Corp
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Abstract

PROBLEM TO BE SOLVED: To reduce the size of a case, and prevent a mistake at work that a douser is assembled to a wiring board that is different from a wiring board originally intended for the assembly.SOLUTION: A light source device includes: a square cylindrical case 3 in which at least one side face is formed of a transparent member; a wiring board 5 that is accommodated in the case 3, and on which a light source 11 that radiates light transmitting the transparent member is mounted; and a douser 7 that has a through hole 2 that passes light from the light source formed thereon, and is arranged on the wiring board. The douser 7 has recesses 25 that are formed at positions facing electronic components 13 mounted on the wiring board, and can accommodate the electronic components 13 mounted at facing positions.

Description

本発明は、光源装置に関する。   The present invention relates to a light source device.

ＬＥＤ（発光ダイオード）等の光源を有する光源装置として、一つの側面が透明部材で形成されたケースの内側に複数のＬＥＤを搭載した配線基板を収容し、その配線基板と透明部材との間に遮光板を配置した光源装置が知られている（例えば、特許文献１参照。）。この種の遮光板は、複数の貫通穴を有しており、それぞれの貫通穴にＬＥＤを収容して配線基板上に配置される。これによれば、各ＬＥＤから発光される光は、それぞれ貫通穴を通じて透明部材を透過するため、各ＬＥＤの発光状態をケースの外側から個別に視認することができる。   As a light source device having a light source such as an LED (light emitting diode), a wiring board on which a plurality of LEDs are mounted is accommodated inside a case having one side formed of a transparent member, and between the wiring board and the transparent member. A light source device in which a light shielding plate is arranged is known (for example, see Patent Document 1). This type of light shielding plate has a plurality of through holes, and the LEDs are accommodated in the respective through holes and arranged on the wiring board. According to this, since the light emitted from each LED is transmitted through the transparent member through the through hole, the light emission state of each LED can be individually visually recognized from the outside of the case.

特開２００８−１９８６５７号公報JP 2008-198657 A

ところで、ＬＥＤ等の光源を搭載する配線基板上には、通常、複数の電子部品が基板面から突出して設けられている。特許文献１では、遮光板と電子部品との接触を避けるために、遮光板の配線基板と対向する面に段付き面を形成し、電子部品と対向する面を電子部品から浮かせた状態で配置することが記載されている。   Incidentally, a plurality of electronic components are usually provided so as to protrude from the substrate surface on a wiring board on which a light source such as an LED is mounted. In Patent Document 1, in order to avoid contact between the light shielding plate and the electronic component, a stepped surface is formed on the surface of the light shielding plate facing the wiring substrate, and the surface facing the electronic component is arranged in a state of being floated from the electronic component. It is described to do.

しかし、このように遮光板に段付き面を設けると、遮光板の厚みが大きくなるとともに、遮光板を配線基板に固定するための構造が複雑になるため、ケースの小型化が難しくなるという問題がある。   However, providing a stepped surface on the light shielding plate in this way increases the thickness of the light shielding plate and complicates the structure for fixing the light shielding plate to the wiring board, making it difficult to reduce the size of the case. There is.

一方、別の問題として、遮光板を配線基板に組み付ける際、遮光板と配線基板上の電子部品は、互いに何ら干渉しないため、例えば、配線基板において、ある特定の電子部品が本来搭載される位置と異なる位置に搭載されている場合、或いは、ある電子部品が本来搭載される位置に別の電子部品が搭載（以下、この種の配線基板を異種基板という。）されている場合であっても、それに気が付かず、このような異種基板に遮光板を取り付けてしまうおそれがあった。   On the other hand, as another problem, when the light shielding plate is assembled to the wiring board, the light shielding plate and the electronic components on the wiring board do not interfere with each other. For example, the position where a specific electronic component is originally mounted on the wiring board. Even when a different electronic component is mounted at a position where an electronic component is originally mounted (hereinafter, this type of wiring board is referred to as a heterogeneous substrate). There is a possibility that the light shielding plate may be attached to such a different substrate without noticing it.

本発明が解決しようとする課題は、ケースの小型化を図るとともに、遮光板を異種基板に組み付ける作業ミスを防ぐことにある。   The problem to be solved by the present invention is to reduce the size of the case and to prevent an operation error of assembling the light shielding plate to the different substrate.

上記課題を解決するため、本発明は、少なくとも一つの側面が透明部材で形成される角筒状のケースと、このケースに収容され、透明部材を透過させて光を照射する光源が搭載される配線基板と、光源からの光を通す貫通穴が形成され、配線基板上に配置される遮光板とを備える光源装置において、遮光板には、配線基板上に搭載される電子部品と対向する位置にその対向する電子部品を収容可能な凹部が形成されてなることを特徴とする。   In order to solve the above-described problems, the present invention is equipped with a rectangular tube-shaped case having at least one side surface formed of a transparent member, and a light source that is accommodated in the case and transmits light through the transparent member. In a light source device comprising a wiring board and a light shielding plate formed with a through hole through which light from the light source passes and disposed on the wiring board, the light shielding plate has a position facing an electronic component mounted on the wiring board And a recess capable of accommodating the opposing electronic component.

これによれば、遮光板は、配線基板上に搭載される電子部品をそれぞれ凹部に収容した状態で配線基板上に配置することができるため、遮光板と配線基板との隙間を小さくすることができる。また、遮光板は、従来のように電子部品との接触を避けるために、段付き形状にする必要がない。したがって、配線基板に遮光板を取り付けたときの厚みを薄くすることができ、しかも遮光板と配線基板を固定する構造を簡単にすることができるため、ケースの小型化が可能になる。また、遮光板と配線基板との隙間を小さくすることにより、光源から発光する光の漏れを抑制できるため、光源の発光状態の視認性を高めることができる。   According to this, since the light shielding plate can be arranged on the wiring board in a state where the electronic components mounted on the wiring board are respectively accommodated in the recesses, the gap between the light shielding plate and the wiring board can be reduced. it can. Further, the light-shielding plate does not need to have a stepped shape in order to avoid contact with an electronic component as in the prior art. Therefore, the thickness when the light shielding plate is attached to the wiring board can be reduced, and the structure for fixing the light shielding plate and the wiring board can be simplified, and the case can be downsized. Moreover, since the leakage of light emitted from the light source can be suppressed by reducing the gap between the light shielding plate and the wiring board, the visibility of the light emission state of the light source can be enhanced.

また、遮光板に形成される凹部は、それぞれ配線基板上の電子部品と対向する位置に配置されるため、複数の電子部品のうち一つでも本来搭載される位置と異なる位置に搭載されていると、電子部品と凹部がかみ合わなくなるため、そのような配線基板には、遮光板を組み付けることができない。したがって、このような異種基板は、作業中に判別できるため、遮光板を異種基板に組み付ける作業ミスを防ぐことができる。   Moreover, since the recessed part formed in a light-shielding board is each arrange | positioned in the position which opposes the electronic component on a wiring board, even one of several electronic components is mounted in the position different from the original mounting position. Then, since the electronic component and the recess are not engaged with each other, the light shielding plate cannot be assembled to such a wiring board. Therefore, since such a different type | mold board | substrate can be discriminate | determined during an operation | work, the operation | work mistake which attaches a light-shielding plate to a different type | mold board | substrate can be prevented.

この場合において、凹部は、複数の電子部品がそれぞれ別々に収容可能に形成されてなるものとする。   In this case, the recess is formed so that a plurality of electronic components can be accommodated separately.

すなわち、複数の電子部品を一つの凹部に収容することも可能であるが、異種基板を高い精度で認識するためには、一つの凹部に一つの電子部品を収容するように構成するのが好ましい。   That is, it is possible to accommodate a plurality of electronic components in one recess, but in order to recognize different types of substrates with high accuracy, it is preferable to configure one electronic component in one recess. .

また、遮光板は、空気よりも熱伝導率の高い材料で形成されてなるものとする。   The light shielding plate is made of a material having a higher thermal conductivity than air.

これによれば、凹部に収容された電子部品から放出された熱を効果的に凹部の外側へ逃がすことができるため、電子部品の温度上昇による機能低下を防ぐことができる。   According to this, since the heat released from the electronic component accommodated in the recess can be effectively released to the outside of the recess, it is possible to prevent a functional deterioration due to a temperature rise of the electronic component.

本発明によれば、ケースの小型化を図るとともに、遮光板を異種基板に組み付ける作業ミスを防ぐことができる。   According to the present invention, it is possible to reduce the size of the case and to prevent an operation error in assembling the light shielding plate to the different substrate.

本実施の形態に係る光源装置の外観の斜視図である。It is a perspective view of the external appearance of the light source device which concerns on this Embodiment. 図１のａ−ａ矢印が示す方向の断面図である。It is sectional drawing of the direction which the aa arrow of FIG. 1 shows. 本実施の形態の遮光板が異種基板を認識する原理を説明する図である。It is a figure explaining the principle which the light-shielding plate of this Embodiment recognizes a different kind | species board | substrate.

以下、本発明の光源装置の実施の形態について、図面を用いて説明する。本実施形態では、本発明の光源装置を自動車に搭載される光源装置に適用する例を説明するが、例えば、自動車に搭載されるメータ等の計器類、文字や記号等による各種の情報表示のインジケータ意匠が施された表示板を背面側から照明して視認性を向上させる表示装置等に本発明を適用することもできる。   Hereinafter, embodiments of a light source device of the present invention will be described with reference to the drawings. In the present embodiment, an example in which the light source device of the present invention is applied to a light source device mounted on an automobile will be described. For example, various information displays such as meters such as meters mounted on an automobile, characters and symbols, etc. The present invention can also be applied to a display device or the like that illuminates a display board on which an indicator design has been applied from the back side to improve visibility.

図１に本発明が適用される光源装置の概略の構成を示し、図２に図１のａ−ａ矢印が示す断面を示す。図１、２に示すように、光源装置１は、一つの側面を開口させて形成される角筒状のケース３と、ケース３に収容される配線基板５と、配線基板５上に取り付けられ、ケース３の側面と配線基板５との間に配置される遮光板７とを備える。   FIG. 1 shows a schematic configuration of a light source device to which the present invention is applied, and FIG. 2 shows a cross section indicated by arrows aa in FIG. As shown in FIGS. 1 and 2, the light source device 1 is attached to the rectangular tube case 3 formed by opening one side surface, the wiring substrate 5 accommodated in the case 3, and the wiring substrate 5. And a light shielding plate 7 disposed between the side surface of the case 3 and the wiring board 5.

ケース３は、ケース３を構成する６面のうち開口する面を除くすべての側面が光を透過する透明部材で形成され、開口する側面８から配線基板５等が挿入されるようになっている。開口する側面８は、他の側面に対して着脱自在に形成されるとともに、配線基板５に接続される電線が通る開口部を有しており、側面８の周縁と開口部はそれぞれケース３内に水等が浸入しないように周知の防水構造を有している。   The case 3 is formed of a transparent member that transmits light, except for the opening surface among the six surfaces constituting the case 3, and the wiring board 5 and the like are inserted from the opening side surface 8. . The side surface 8 that opens is detachably formed with respect to the other side surface, and has an opening through which an electric wire connected to the wiring board 5 passes. The periphery and the opening of the side surface 8 are respectively in the case 3. It has a well-known waterproof structure so that water or the like does not enter.

配線基板５は、ケース３内に収容可能な大きさの板状に形成され、遮光板７と対向する基板面９に、光源となるＬＥＤ１１（発光ダイオード）と複数の電子部品１３が搭載される。また、配線基板５は、基板面９と反対側の裏面１５に、ＬＥＤ１７が搭載される。ここで、電子部品１３とは、配線基板５の基板面９に搭載され、所定の電気的機能を有し、かつ配線基板５の基板面９から所定の高さに突出して形成されるものという。   The wiring substrate 5 is formed in a plate shape having a size that can be accommodated in the case 3, and an LED 11 (light emitting diode) serving as a light source and a plurality of electronic components 13 are mounted on a substrate surface 9 facing the light shielding plate 7. . Further, the wiring board 5 has the LEDs 17 mounted on the back surface 15 opposite to the substrate surface 9. Here, the electronic component 13 is mounted on the board surface 9 of the wiring board 5, has a predetermined electrical function, and is formed to protrude from the board surface 9 of the wiring board 5 to a predetermined height. .

なお、本実施形態では、説明の複雑化を避けるために、ＬＥＤ１１は基板面９に１個搭載し、電子部品１３は基板面９にのみ搭載する例を示すが、これに限られるものではなく、ＬＥＤ１７は基板面９に複数個搭載してもよいし、電子部品１３は基板面９と裏面１５の両方に搭載してもよい。   In this embodiment, in order to avoid complication of explanation, an example in which one LED 11 is mounted on the substrate surface 9 and the electronic component 13 is mounted only on the substrate surface 9 is shown, but the present invention is not limited to this. A plurality of LEDs 17 may be mounted on the substrate surface 9, and the electronic component 13 may be mounted on both the substrate surface 9 and the back surface 15.

遮光板７は、光を透過させない不透明の材料からなり、全体として略矩形に形成される。遮光板７の配線基板５（基板面９）と対向する下面１９は、配線基板５と略同じ大きさの長方形に形成される。遮光板７は、下面１９からその反対側の上面２１へ貫通する断面が円形の貫通穴２３を有している。貫通穴２３の断面は、ＬＥＤ１１を収容可能な大きさに設定され、貫通穴２３の軸方向の長さは、基板面９と直交する方向のＬＥＤの全長よりも長く設定されている。   The light shielding plate 7 is made of an opaque material that does not transmit light, and is formed in a substantially rectangular shape as a whole. The lower surface 19 of the light shielding plate 7 facing the wiring substrate 5 (substrate surface 9) is formed in a rectangular shape having substantially the same size as the wiring substrate 5. The light shielding plate 7 has a through hole 23 having a circular cross section penetrating from the lower surface 19 to the upper surface 21 on the opposite side. The cross section of the through hole 23 is set to a size that can accommodate the LED 11, and the axial length of the through hole 23 is set to be longer than the total length of the LED in the direction orthogonal to the substrate surface 9.

遮光板７の下面１９には、複数の凹部２５が形成されている。これらの凹部２５は、遮光板７を配線基板５の基板面９と対向させて配置したときに、配線基板５上に搭載される電子部品１３とそれぞれ対向する位置に配置され、かつ対向する電子部品をそれぞれ収容可能に形成される。具体的に、各凹部２５は、それぞれ対向する電子部品１３の大きさ及び形状に応じて形成され、対向する電子部品１３の基板面９における投影領域と相似する輪郭に沿って凹みが形成され、その凹みの深さは、対向する電子部品１３の基板面９と直交する方向の全長よりも大きく設定されている。   A plurality of recesses 25 are formed on the lower surface 19 of the light shielding plate 7. These concave portions 25 are arranged at positions facing the electronic components 13 mounted on the wiring board 5 when the light shielding plate 7 is arranged to face the board surface 9 of the wiring board 5, and opposed electrons. Each part can be accommodated. Specifically, each recess 25 is formed according to the size and shape of the opposing electronic component 13, and a recess is formed along an outline similar to the projection region on the substrate surface 9 of the opposing electronic component 13. The depth of the dent is set to be larger than the total length in the direction orthogonal to the substrate surface 9 of the electronic component 13 facing the dent.

このようにして構成される光源装置１の組み付け手順としては、まず、配線基板５の基板面９の上に遮光板７を配置する。このとき、遮光板７は、ＬＥＤ１１が貫通穴２３に収容されるとともに、各電子部品１３がそれぞれ対向する凹部２５に収容された状態で基板面９に載置される。なお、本実施形態では、遮光板７を基板面９の上に載置する例を示すが、遮光板７は、スペーサ等で基板面９との間に所定の隙間を開けて配置してもよい。   As a procedure for assembling the light source device 1 configured as described above, first, the light shielding plate 7 is disposed on the substrate surface 9 of the wiring substrate 5. At this time, the light shielding plate 7 is placed on the substrate surface 9 in a state where the LEDs 11 are accommodated in the through holes 23 and the respective electronic components 13 are accommodated in the opposing recesses 25. In this embodiment, an example in which the light shielding plate 7 is placed on the substrate surface 9 is shown. However, the light shielding plate 7 may be arranged with a predetermined gap between the light shielding plate 7 and the substrate surface 9 by a spacer or the like. Good.

次に、遮光板７を周知の取付構造により配線基板５に固定する。この取付構造は、図示していないが、遮光板７を配線基板５にねじ止めする構造等が採用される。続いて、遮光板７が取り付けられた配線基板５を、ケース３の側面８が取り外された開口からケース３内に収容し、配線基板５と接続される電線２７をケース３の側面８に形成された開口部に通し、側面８をケース３に取り付ける。この状態で、ケース３に収容された配線基板５は、周知の構造により、ケース３内の所定位置に保持される。また、開口部と電線２７との隙間は、周知の方法により封止される。   Next, the light shielding plate 7 is fixed to the wiring board 5 by a known mounting structure. Although this mounting structure is not shown, a structure in which the light shielding plate 7 is screwed to the wiring board 5 is employed. Subsequently, the wiring substrate 5 to which the light shielding plate 7 is attached is accommodated in the case 3 from the opening from which the side surface 8 of the case 3 is removed, and the electric wires 27 connected to the wiring substrate 5 are formed on the side surface 8 of the case 3. The side surface 8 is attached to the case 3 through the opened opening. In this state, the wiring board 5 accommodated in the case 3 is held at a predetermined position in the case 3 by a known structure. Moreover, the clearance gap between an opening part and the electric wire 27 is sealed by a well-known method.

このようにして組み付けられた光源装置１は、ＬＥＤ１１が発光すると、光が貫通穴２３を通じて遮光板７の上面２１に向かって導かれ、ケース３の透明部材の所定領域を透過する（図１、２の矢印）。これにより、ケース３の外部からＬＥＤ１１の発光状態を視認することができる。また、本実施形態では、ＬＥＤ１１が１個の場合を示しているが、複数のＬＥＤ１１が配線基板５に搭載される場合は、各ＬＥＤ１１をそれぞれ別々の貫通穴に収容することにより、それぞれのＬＥＤ１１の発光状態を個別に視認することができる。なお、配線基板５の裏面１５に搭載されるＬＥＤ１７は、図示しない遮光壁等を設けることにより、図１の矢印の方向に光を導くことができる。   In the light source device 1 assembled in this manner, when the LED 11 emits light, the light is guided toward the upper surface 21 of the light shielding plate 7 through the through hole 23 and passes through a predetermined region of the transparent member of the case 3 (FIG. 1). 2 arrows). Thereby, the light emission state of the LED 11 can be visually recognized from the outside of the case 3. Moreover, in this embodiment, although the case where one LED11 is shown is shown, when several LED11 is mounted in the wiring board 5, each LED11 is each accommodated in a separate through-hole, and each LED11 is shown. The light emission state can be visually confirmed individually. The LED 17 mounted on the back surface 15 of the wiring board 5 can guide light in the direction of the arrow in FIG. 1 by providing a light shielding wall (not shown).

本実施形態では、遮光板７は、ＬＥＤ１１を貫通穴２３に収容するとともに、配線基板５の基板面９に搭載される電子部品１３をそれぞれ凹部２５に収容した状態で配線基板５上に配置されるので、遮光板７を配線基板５上に載せることができ、或いは、載せない場合でも、遮光板７を配線基板５に近づけて配置することができる。また、遮光板７は、電子部品１３との接触を避けるために、段付き形状にする必要がなく、形状の複雑化を避けることができる。したがって、配線基板５に遮光板７を取り付けたときの配線基板５と遮光板７との合計の厚みを薄くすることができ、しかも遮光板７を配線基板５に固定する構造を簡単にできるため、より小さなケース３に収容することができる。また、遮光板７と配線基板５との隙間を小さくすることにより、ＬＥＤ１１から発光する光の漏れを少なくできるため、貫通穴２３を通じたＬＥＤ１１の発光状態の視認性を高めることができる。   In the present embodiment, the light shielding plate 7 is disposed on the wiring board 5 in a state where the LEDs 11 are accommodated in the through holes 23 and the electronic components 13 mounted on the board surface 9 of the wiring board 5 are accommodated in the recesses 25. Therefore, the light shielding plate 7 can be placed on the wiring substrate 5, or the light shielding plate 7 can be disposed close to the wiring substrate 5 even when it is not placed. Moreover, in order to avoid the contact with the electronic component 13, the light-shielding plate 7 does not need to be a stepped shape, and the complexity of the shape can be avoided. Therefore, the total thickness of the wiring substrate 5 and the light shielding plate 7 when the light shielding plate 7 is attached to the wiring substrate 5 can be reduced, and the structure for fixing the light shielding plate 7 to the wiring substrate 5 can be simplified. It can be accommodated in a smaller case 3. Further, by reducing the gap between the light shielding plate 7 and the wiring substrate 5, leakage of light emitted from the LED 11 can be reduced, and thus the visibility of the light emitting state of the LED 11 through the through hole 23 can be enhanced.

一方、遮光板７は、すべての凹部２５にそれぞれ電子部品１３を収容できなければ、配線基板５に組み付けることができないようになっている。例えば、図３に示すように、配線基板５の基板面９において、ある特定の電子部品１３ａが本来搭載される位置と異なる位置に搭載されている場合、或いは、ある電子部品が本来搭載される位置に別の電子部品１３ａが搭載されている場合、他の電子部品１３ｂ〜１３ｅがそれぞれ凹部２５と対向する位置に配置されていても、電子部品１３ａが凹部２５に収容できないため、遮光板７を配線基板５に組み付けることができない。したがって、本実施形態によれば、組み付け作業の際にこのような異種基板を容易に把握することができ、遮光板７を異種基板に組み付けてしまうような作業ミスを確実に防ぐことができる。   On the other hand, the light shielding plate 7 cannot be assembled to the wiring board 5 unless the electronic components 13 can be accommodated in all the recesses 25, respectively. For example, as shown in FIG. 3, when a specific electronic component 13 a is mounted at a position different from the position where the specific electronic component 13 a is originally mounted on the substrate surface 9 of the wiring board 5, or a certain electronic component is originally mounted. When another electronic component 13a is mounted at a position, the electronic component 13a cannot be accommodated in the recess 25 even if the other electronic components 13b to 13e are disposed at positions facing the recess 25, respectively. Cannot be assembled to the wiring board 5. Therefore, according to the present embodiment, such a heterogeneous substrate can be easily grasped at the time of assembling work, and an operation error such as assembling the light shielding plate 7 to the heterogeneous substrate can be surely prevented.

また、遮光板７は、空気よりも熱伝導率の高い材料で形成することが好ましい。これによれば、凹部２５に収容された電子部品１３が放出する熱を効率良く凹部２５の外側へ逃がすことができるため、凹部２５内の温度上昇を抑制することができ、温度上昇による電子部品１３の機能低下を抑制することができる。   The light shielding plate 7 is preferably formed of a material having a higher thermal conductivity than air. According to this, since the heat released from the electronic component 13 accommodated in the recess 25 can be efficiently released to the outside of the recess 25, the temperature increase in the recess 25 can be suppressed, and the electronic component due to the temperature increase can be suppressed. 13 functional deterioration can be suppressed.

以上、本発明の実施形態を図面により詳述してきたが、上記実施形態は本発明の例示にしか過ぎないものであり、本発明は上記実施形態の構成にのみ限定されるものではない。本発明の要旨を逸脱しない範囲の設計の変更などがあっても、本発明に含まれることは勿論である。   As mentioned above, although embodiment of this invention has been explained in full detail with drawing, the said embodiment is only an illustration of this invention and this invention is not limited only to the structure of the said embodiment. Needless to say, even if there is a design change within a range not departing from the gist of the present invention, it is included in the present invention.

例えば、本実施形態では、遮光板７の下面１９に電子部品１３の数と同じ数だけ凹部２５を形成し、各電子部品１３をそれぞれ別々の凹部２５に収容する例を説明したが、これ以外に、例えば、複数の電子部品１３をいくつかの電子部品１３の集合体に分け、これらの電子部品１３の集合体をやや大きく形成した凹部に収容するようにしてもよい。これによれば、異種基板の検出精度は低下するが、遮光板７の形状を簡単化できるため、製造コストを下げることができる。   For example, in the present embodiment, an example has been described in which the same number of recesses 25 as the number of electronic components 13 are formed on the lower surface 19 of the light shielding plate 7, and each electronic component 13 is accommodated in a separate recess 25. In addition, for example, the plurality of electronic components 13 may be divided into a group of several electronic components 13, and the group of these electronic components 13 may be accommodated in a slightly formed recess. According to this, although the detection accuracy of a different type | mold board | substrate falls, since the shape of the light-shielding plate 7 can be simplified, manufacturing cost can be reduced.

また、本実施形態では、光源としてＬＥＤを用いる例を説明したが、他の種類の光源を用いた光源装置においても、本発明を適用することができるのは言うまでもない。また、本実施形態では、遮光板７に断面円形の貫通穴２３を形成する例を説明したが、貫通孔２３の形状はこれに限られるものではなく、照明する目的に応じて、例えばスリット状に形成することもできる。また、ケース３は、全面が透明部材で形成される例を説明したが、これに限られるものではなく、少なくとも、遮光板７の上面２１と対向する側面及びＬＥＤ１７から発光した光を透過させる側面が透明部材で形成されていればよい。   In this embodiment, an example in which an LED is used as a light source has been described. Needless to say, the present invention can also be applied to a light source device using another type of light source. Further, in the present embodiment, the example in which the through hole 23 having a circular cross section is formed in the light shielding plate 7 is described. However, the shape of the through hole 23 is not limited to this. It can also be formed. In addition, the case 3 has been described as an example in which the entire surface is formed of a transparent member. However, the present invention is not limited to this. May be formed of a transparent member.

１ 光源装置
３ ケース
５ 配線基板
７ 遮光板
９ 基板面
１１，１７ ＬＥＤ
１３ 電子部品
２３ 貫通穴
２５ 凹部 DESCRIPTION OF SYMBOLS 1 Light source device 3 Case 5 Wiring board 7 Light-shielding plate 9 Substrate surface 11, 17 LED
13 Electronic component 23 Through hole 25 Recess

Claims (3)

少なくとも一つの側面が透明部材で形成される角筒状のケースと、該ケースに収容され、前記透明部材を透過させて光を照射する光源が搭載される配線基板と、前記光源からの光を通す貫通穴が形成され、前記配線基板上に配置される遮光板とを備える光源装置において、
前記遮光板には、前記配線基板上に搭載される電子部品と対向する位置にその対向する電子部品を収容可能な凹部が形成されてなることを特徴とする光源装置。 A rectangular tube-shaped case having at least one side surface formed of a transparent member, a wiring board that is housed in the case and is mounted with a light source that transmits light through the transparent member, and light from the light source In the light source device having a through hole formed therethrough and including a light shielding plate disposed on the wiring board,
The light source device, wherein the light shielding plate is formed with a recess capable of accommodating the electronic component facing the electronic component mounted on the wiring board. 前記凹部は、複数の前記電子部品がそれぞれ別々に収容可能に形成されてなることを特徴とする請求項１に記載の光源装置。   The light source device according to claim 1, wherein the concave portion is formed so that a plurality of the electronic components can be accommodated separately. 前記遮光板は、空気よりも熱伝導率の高い材料で形成されてなることを特徴とする請求項１又は２に記載の光源装置。   The light source device according to claim 1, wherein the light shielding plate is formed of a material having a higher thermal conductivity than air.
JP2012085173A 2012-04-04 2012-04-04 Light source device Pending JP2013214671A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025034A (en) * 2018-08-08 2020-02-13 ローム株式会社 Led package and led display device
JP2020027824A (en) * 2018-08-09 2020-02-20 ローム株式会社 Light-emitting device and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025034A (en) * 2018-08-08 2020-02-13 ローム株式会社 Led package and led display device
CN110828641A (en) * 2018-08-08 2020-02-21 罗姆股份有限公司 LED assembly and LED display device
JP2020027824A (en) * 2018-08-09 2020-02-20 ローム株式会社 Light-emitting device and display device
CN110828631A (en) * 2018-08-09 2020-02-21 罗姆股份有限公司 Light emitting device and display device
JP2022190094A (en) * 2018-08-09 2022-12-22 ローム株式会社 Light-emitting device and display device
CN110828631B (en) * 2018-08-09 2023-01-03 罗姆股份有限公司 Light emitting device and display device

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