JP2013214391A - Lumpy spot alleviation structure of led illumination lamp - Google Patents

Lumpy spot alleviation structure of led illumination lamp Download PDF

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JP2013214391A
JP2013214391A JP2012083599A JP2012083599A JP2013214391A JP 2013214391 A JP2013214391 A JP 2013214391A JP 2012083599 A JP2012083599 A JP 2012083599A JP 2012083599 A JP2012083599 A JP 2012083599A JP 2013214391 A JP2013214391 A JP 2013214391A
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led
light
cover
illumination lamp
led illumination
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Yutaka Sasaki
裕 佐々木
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Nanbu Plastics Co Ltd
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Nanbu Plastics Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an LED illumination lamp with particles of LEDs made inconspicuous, even if luminance efficiency is enhanced by reducing an amount of a light diffusion material.SOLUTION: For a straight-tube LED illumination lamp 10 including an LED substrate 11 mounting a plurality of LEDs 12 and a cylindrical cover 20 covering the LED substrate 11, the cover 20 includes a light-transmitting part 25b for transmitting light of the LEDs 12 at a lower face and side faces of the LED substrate 11, and the light-transmitting part 25b has its transmittance set lower at the side faces than at the lower face.

Description

この発明は、直管形のＬＥＤ照明灯に関し、特に、ＬＥＤの粒が目立たないようにしたＬＥＤ照明灯に関するものである。   The present invention relates to a straight tube type LED illumination lamp, and more particularly to an LED illumination lamp in which LED particles are not conspicuous.

近年、既存の蛍光灯と構造的に互換性のあるＬＥＤ照明灯が提案されている（例えば特許文献１参照）。   In recent years, LED illumination lamps that are structurally compatible with existing fluorescent lamps have been proposed (see, for example, Patent Document 1).

こうしたＬＥＤ照明灯は、円筒状に形成されて外形状は従来の蛍光灯と同様となっており、内部にＬＥＤ基盤が収容され、ポリカーボネート等で形成した光を透過するカバーによって覆われている。こうしたカバーに光拡散材を混合することも一般に行われている。   Such an LED illuminating lamp is formed in a cylindrical shape and has an outer shape similar to that of a conventional fluorescent lamp. The LED base is housed inside and covered with a light-transmitting cover formed of polycarbonate or the like. In general, a light diffusing material is mixed in such a cover.

特開２０１１−２１０７２９号公報JP 2011-210729 A

こうしたＬＥＤ照明灯において、光拡散材の量を減らすと、光透過率が高くなるので照度は増すものの、ＬＥＤの粒が目立つので消費者に好まれない傾向がある。   In such an LED illuminating lamp, if the amount of the light diffusing material is reduced, the light transmittance increases, so that the illuminance increases. However, the LED particles tend to stand out, so that they are not preferred by consumers.

一方、光拡散材の量を増やすと、ＬＥＤの粒は目立たなくなるものの、光透過率が低くなるので電力あたりの照度が低くなり、照度効率が不利となってしまう。   On the other hand, when the amount of the light diffusing material is increased, the LED grains become inconspicuous, but since the light transmittance is lowered, the illuminance per electric power is lowered and the illuminance efficiency is disadvantageous.

そこで、本発明は、光拡散材の量を減らして照度効率を上げた場合でも、ＬＥＤの粒が目立ちにくいＬＥＤ照明灯を提供することを課題とする。   Therefore, an object of the present invention is to provide an LED illuminating lamp in which the LED particles are hardly noticeable even when the illuminance efficiency is increased by reducing the amount of the light diffusing material.

本発明は、上記した課題を解決するためになされたものであり、以下を特徴とする。   The present invention has been made to solve the above-described problems, and is characterized by the following.

（請求項１）
請求項１に記載の発明は、以下の点を特徴とする。 (Claim 1)
The invention described in claim 1 is characterized by the following points.

すなわち、請求項１に記載のＬＥＤ照明灯の粒斑緩和構造は、複数のＬＥＤを配設したＬＥＤ基板と、前記ＬＥＤ基板を覆う筒状のカバーと、を備えた直管形のＬＥＤ照明灯において、前記カバーは、前記ＬＥＤ基板の下面及び側面においてＬＥＤの光を透過する光透過部を備え、前記光透過部は、下面部よりも側面部において光の透過率が低く設定されていることを特徴とする。   That is, the particle spot mitigation structure of the LED lighting lamp according to claim 1 is a straight tube type LED lighting lamp including an LED substrate on which a plurality of LEDs are arranged and a cylindrical cover that covers the LED substrate. The cover includes a light transmission portion that transmits the light of the LED on the lower surface and side surface of the LED substrate, and the light transmission portion is set to have a light transmittance lower on the side surface portion than on the lower surface portion. It is characterized by.

（請求項２）
請求項２に記載の発明は、上記した請求項１記載の発明の特徴点に加え、以下の点を特徴とする。 (Claim 2)
The invention described in claim 2 has the following features in addition to the features of the invention described in claim 1 described above.

すなわち、前記光透過部は、下面部よりも側面部が肉厚に形成されていることを特徴とする。   That is, the light transmission part is characterized in that the side part is formed thicker than the bottom part.

（請求項３）
請求項３に記載の発明は、上記した請求項１記載の発明の特徴点に加え、以下の点を特徴とする。 (Claim 3)
The invention described in claim 3 is characterized by the following points in addition to the characteristics of the invention described in claim 1.

すなわち、前記光透過部は、側面部が二重に形成されていることを特徴とする。   That is, the light transmission part is characterized in that the side part is doubled.

本発明は上記の通りであり、光透過部は、下面部よりも側面部において光の透過率が低く設定されている。これにより、必要な部分のみ光の透過率を低く設定できるので、光拡散材の量を減らして照度効率を上げた場合でも、ＬＥＤの粒が目立ちにくいＬＥＤ照明灯を提供することができる。すなわち、ＬＥＤとカバーとの位置関係において、カバーの側面部の方がカバーの下面部よりもＬＥＤに近いためＬＥＤの粒が目立つが、このＬＥＤの粒が目立つカバーの側面部のみ光の透過率を低く設定することで、照度効率を改善させるとともに、ＬＥＤの粒を目立たなくさせることができる。   The present invention is as described above, and the light transmission portion is set such that the light transmittance is lower in the side surface portion than in the lower surface portion. Thereby, since the transmittance | permeability of light can be set low only for the required part, even when it reduces the quantity of a light-diffusion material and raises illumination efficiency, the LED illumination light with which the particle | grains of LED are not conspicuous can be provided. That is, in the positional relationship between the LED and the cover, the side surface portion of the cover is closer to the LED than the lower surface portion of the cover, so that the LED particles are conspicuous. Is set low, the illuminance efficiency can be improved and the LED grains can be made inconspicuous.

なお、下面部よりも側面部において光の透過率を低く設定する方法としては、下面部よりも側面部を肉厚に形成するようにしてもよい。   As a method for setting the light transmittance lower in the side surface than in the lower surface, the side surface may be formed thicker than the lower surface.

また、下面部よりも側面部において光の透過率を低く設定する方法としては、側面部を二重に形成するようにしてもよい。   Further, as a method for setting the light transmittance lower in the side surface than in the lower surface, the side surface may be doubled.

ＬＥＤ照明灯の（ａ）正面図、（ｂ）中間部を省略した側面図である。It is the side view which abbreviate | omitted (a) front view and (b) intermediate part of LED lighting. ＬＥＤ照明灯を上から見た一部拡大分解図である。It is the partially expanded exploded view which looked at the LED illumination light from the top. ＬＥＤ照明灯を下から見た一部拡大分解図である。It is the partially expanded exploded view which looked at the LED illumination light from the bottom. ＬＥＤ照明灯のＡ−Ａ断面図である。It is AA sectional drawing of a LED illumination lamp. 変形例に係るＬＥＤ照明灯のＡ−Ａ断面図である。It is AA sectional drawing of the LED lighting lamp which concerns on a modification.

本実施形態に係るＬＥＤ照明灯１０は、図１に示すように、従来の蛍光灯と構造的に互換性のある直管形の照明灯であり、従来の蛍光灯用の灯具本体に接続可能となっている。   As shown in FIG. 1, the LED illumination lamp 10 according to the present embodiment is a straight tube illumination lamp that is structurally compatible with a conventional fluorescent lamp, and can be connected to a conventional lamp body for a fluorescent lamp. It has become.

このＬＥＤ照明灯１０は、複数のＬＥＤ１２を配設したＬＥＤ基板１１と、このＬＥＤ基板１１への電力供給を制御する制御基板４０と、ＬＥＤ基板１１及び制御基板４０を覆う筒状のカバー２０と、このカバー２０の両端に冠着されるソケット３０と、を備えている。このＬＥＤ照明灯１０は、従来の蛍光灯と同様に、両端のソケット３０が灯具本体の接続部に取り付けられ、この接続部を介して電力が供給されることで点灯する。   The LED illumination lamp 10 includes an LED board 11 on which a plurality of LEDs 12 are arranged, a control board 40 that controls power supply to the LED board 11, and a cylindrical cover 20 that covers the LED board 11 and the control board 40. , And sockets 30 attached to both ends of the cover 20. As in the case of a conventional fluorescent lamp, the LED illumination lamp 10 is lit when power is supplied through the connection portion with the sockets 30 at both ends attached to the connection portion of the lamp body.

（ＬＥＤ基板１１）
ＬＥＤ基板１１は、図３等に示すように、複数のＬＥＤ１２を表面に実装した基盤である。このＬＥＤ基板１１には、ＬＥＤ１２に対して供給する電気を蓄えたコンデンサ１３も実装されている。 (LED board 11)
As shown in FIG. 3 and the like, the LED substrate 11 is a base on which a plurality of LEDs 12 are mounted on the surface. A capacitor 13 that stores electricity to be supplied to the LED 12 is also mounted on the LED substrate 11.

（制御基板４０）
制御基板４０は、図２等に示すように、ＬＥＤ基板１１上の複数のＬＥＤ１２のオン・オフを切り替えるためのトランジスタ等が実装された基板である。特に図示しないが、この制御基板４０は、外部から供給された電力を制御するための制御回路を備えており、この制御回路を介してＬＥＤ基板１１へと電力を供給する。 (Control board 40)
As shown in FIG. 2 and the like, the control board 40 is a board on which transistors and the like for switching on / off of the plurality of LEDs 12 on the LED board 11 are mounted. Although not particularly illustrated, the control board 40 includes a control circuit for controlling power supplied from the outside, and supplies power to the LED board 11 via the control circuit.

（カバー２０）
カバー２０は、図２、３等に示すように、ＬＥＤ基板１１を下方に向けて支持する支持部材としての放熱パイプ２１と、放熱パイプ２１の下側に固定される光拡散カバー２５と、を備えている。このカバー２０は、光拡散カバー２５と放熱パイプ２１とが接合されると全体として円筒形状を形成する。 (Cover 20)
As shown in FIGS. 2 and 3, the cover 20 includes a heat radiation pipe 21 as a support member that supports the LED substrate 11 downward, and a light diffusion cover 25 that is fixed to the lower side of the heat radiation pipe 21. I have. The cover 20 forms a cylindrical shape as a whole when the light diffusion cover 25 and the heat radiating pipe 21 are joined.

（放熱パイプ２１）
放熱パイプ２１は、アルミ製の押し出し型材であり、図２〜４に示すように、略半月状のパイプ部２１ａと、このパイプ部２１ａの下方に一体的に延設された下垂部２１ｂと、を備えている。この放熱パイプ２１は、ＬＥＤ基板１１及び制御基板４０が面接触するように取り付けられ、基板の熱を放熱するためのヒートシンクの役割を果たすようになっている。 (Heat dissipation pipe 21)
The heat radiating pipe 21 is an aluminum extrusion mold material, and as shown in FIGS. 2 to 4, a substantially half-moon-shaped pipe portion 21 a, and a hanging portion 21 b integrally extending below the pipe portion 21 a It has. The heat radiating pipe 21 is attached so that the LED board 11 and the control board 40 are in surface contact with each other, and serves as a heat sink for radiating the heat of the board.

略半月状のパイプ部２１ａは、内部が中空となっており、この中空の内部に制御基板４０をスライド挿入できるようになっている。   The substantially half-moon shaped pipe portion 21a has a hollow inside, and the control board 40 can be slid into the hollow inside.

下垂部２１ｂは、パイプ部２１ａの平坦面から下方に突出しており、カバー２０の長手方向全長に渡って両側に平行に２つ形成されている。この２つの下垂部２１ｂの内側面には、対向する位置に狭持溝２１ｃが形成されており、この狭持溝２１ｃにＬＥＤ基板１１を差し込んでスライドさせることで、ＬＥＤ１２の実装面が下方を向くようにＬＥＤ基板１１を保持できるようになっている。また、２つの下垂部２１ｂの外側面には外溝２１ｄが形成されており、この外溝２１ｄによって光拡散カバー２５を取り付け可能となっている。   The hanging part 21b protrudes downward from the flat surface of the pipe part 21a and is formed in parallel on both sides over the entire length of the cover 20 in the longitudinal direction. Nipping grooves 21c are formed at opposing positions on the inner side surfaces of the two hanging portions 21b. By inserting and sliding the LED board 11 into the holding grooves 21c, the mounting surface of the LED 12 is lowered below. The LED substrate 11 can be held so as to face. An outer groove 21d is formed on the outer surface of the two hanging parts 21b, and the light diffusion cover 25 can be attached by the outer groove 21d.

（光拡散カバー２５）
光拡散カバー２５は、図２〜４に示すように、略Ｃ字形に形成された樹脂製の押し出し型材である。光拡散カバー２５は、全体が透光性の光透過部２５ｂを構成しており、下方及び側方にＬＥＤ１２の発する光を放出させるように形成されている。 (Light diffusion cover 25)
As shown in FIGS. 2 to 4, the light diffusing cover 25 is a resin extruded mold formed in a substantially C shape. The light diffusion cover 25 as a whole constitutes a light-transmitting light transmitting portion 25b, and is formed so as to emit light emitted from the LED 12 downward and laterally.

この光拡散カバー２５の両側の開放端部は、内側に鉤状に突出しており、係合爪部２５ａを形成している。この係合爪部２５ａが前述した放熱パイプ２１の外溝２１ｄに差し込まれることにより、光拡散カバー２５は放熱パイプ２１に取り付け可能となっている。光拡散カバー２５を放熱パイプ２１に取り付ける際には、光拡散カバー２５の弾性を利用して両側の係合爪部２５ａが離れる方向に押し広げ、外溝２１ｄに差し込む。これにより、両側の係合爪部２５ａが外溝２１ｄを外から挟み込んで、光拡散カバー２５と放熱パイプ２１とが互いに接合される。   The open end portions on both sides of the light diffusing cover 25 protrude inward in a bowl shape, and form an engaging claw portion 25a. The light diffusing cover 25 can be attached to the heat radiating pipe 21 by inserting the engaging claw portion 25a into the outer groove 21d of the heat radiating pipe 21 described above. When the light diffusing cover 25 is attached to the heat radiating pipe 21, the engaging claws 25a on both sides are pushed away in the direction away from each other by using the elasticity of the light diffusing cover 25 and inserted into the outer groove 21d. Thereby, the engagement claw portions 25a on both sides sandwich the outer groove 21d from the outside, and the light diffusion cover 25 and the heat radiating pipe 21 are joined to each other.

（ソケット３０）
ソケット３０は、カバー２０の両端に冠着される有底円筒状の部材であり、樹脂製の筒部材３１と、この筒部材３１の端部に装着される電極キャップ３２と、を備えている。 (Socket 30)
The socket 30 is a bottomed cylindrical member that is attached to both ends of the cover 20, and includes a resin tubular member 31 and an electrode cap 32 that is attached to an end of the tubular member 31. .

筒部材３１は、カバー２０の端部外周に外装されるために筒状に形成されている。   The cylindrical member 31 is formed in a cylindrical shape in order to be covered on the outer periphery of the end portion of the cover 20.

また、電極キャップ３２は、２つのピン３２ａが突出形成された金属製の部材である。ＬＥＤ照明灯１０は、この電極キャップ３２のピン３２ａを灯具本体の接続部に挿入接続することで灯具本体に装着され、このピン３２ａによって自重を支えられるようになっている。   The electrode cap 32 is a metal member having two pins 32a protruding therefrom. The LED illuminating lamp 10 is mounted on the lamp body by inserting and connecting the pin 32a of the electrode cap 32 to the connection portion of the lamp body, and the weight of the LED illumination lamp 10 can be supported by the pin 32a.

（光拡散カバー２５の偏肉部２５ｃについて）
上述した光拡散カバー２５は、図４に示すように、厚みが一定な同心円形状ではなく、下面部よりも側面部が肉厚に形成されて、側面部に偏肉部２５ｃを備えた形状となっている。この偏肉部２５ｃは、光拡散カバー２５の側部内周面を垂直方向に平坦にすることで形成されている。 (About the uneven thickness portion 25c of the light diffusion cover 25)
As shown in FIG. 4, the light diffusion cover 25 described above is not a concentric circular shape with a constant thickness, but has a shape in which a side surface portion is formed thicker than a lower surface portion, and a side wall portion includes an uneven thickness portion 25 c. It has become. The uneven thickness portion 25c is formed by flattening the side inner peripheral surface of the light diffusion cover 25 in the vertical direction.

この偏肉部２５ｃが設けられることで、光拡散カバー２５の光透過部２５ｂは、下面部よりも側面部において光の透過率が低く設定されている。これにより、必要な部分のみ光の透過率を低く設定できるので、光拡散材の量を減らして照度効率を上げた場合でも、ＬＥＤ１２の粒が目立ちにくいＬＥＤ照明灯１０を提供することができる。   By providing the uneven thickness portion 25c, the light transmission portion 25b of the light diffusion cover 25 is set to have a light transmittance lower in the side surface portion than in the lower surface portion. Thereby, since the transmittance | permeability of light can be set low only in the necessary part, even when the quantity of a light-diffusion material is reduced and illuminance efficiency is raised, the LED illumination light 10 with which the particle | grains of LED12 are not conspicuous can be provided.

すなわち、図４に示すように、ＬＥＤ１２とカバー２０との位置関係において、カバー２０の側面部の方がカバー２０の下面部よりもＬＥＤ１２に近いためＬＥＤ１２の粒が目立つが、このＬＥＤ１２の粒が目立つカバー２０の側面部のみ光の透過率を低く設定することで、照度効率を改善させるとともに、ＬＥＤ１２の粒を目立たなくさせることができる。   That is, as shown in FIG. 4, in the positional relationship between the LED 12 and the cover 20, the side surface portion of the cover 20 is closer to the LED 12 than the lower surface portion of the cover 20. By setting the light transmittance only to the side portion of the conspicuous cover 20, the illuminance efficiency can be improved and the grains of the LED 12 can be made inconspicuous.

なお、下面部よりも側面部において光の透過率を低く設定する方法としては、上記した偏肉部２５ｃを設ける態様に限らない。   The method for setting the light transmittance lower in the side surface than in the lower surface is not limited to the aspect in which the above-described uneven thickness portion 25c is provided.

例えば、図５に示すように、光拡散カバー２５の両側面部の内側に内部壁２５ｄを設けて側面部を二重に形成するようにしてもよい。図５の例においては、内部壁２５ｄは、光拡散カバー２５の内側に垂直方向に立ち上げて形成されている。このような態様によっても、下面部よりも側面部において光の透過率を低く設定することができ、照度効率の改善とＬＥＤ１２の粒を目立たなくさせることとを両立させることができる。   For example, as shown in FIG. 5, the inner wall 25 d may be provided inside the both side surface portions of the light diffusion cover 25 to form the side surface portions doubly. In the example of FIG. 5, the inner wall 25 d is formed to rise in the vertical direction inside the light diffusion cover 25. Also according to such an aspect, the light transmittance can be set lower in the side surface portion than in the lower surface portion, and both the improvement of the illumination efficiency and the conspicuousness of the LED 12 grains can be achieved.

１０ ＬＥＤ照明灯
１１ ＬＥＤ基板
１２ ＬＥＤ
１３ コンデンサ
２０ カバー
２１ 放熱パイプ（支持部材）
２１ａ パイプ部
２１ｂ 下垂部
２１ｃ 狭持溝
２１ｄ 外溝
２５ 光拡散カバー
２５ａ 係合爪部
２５ｂ 光透過部
２５ｃ 偏肉部
２５ｄ 内部壁
３０ ソケット
３１ 筒部材
３２ 電極キャップ
３２ａ ピン
４０ 制御基板 10 LED lighting 11 LED substrate 12 LED
13 Capacitor 20 Cover 21 Radiating pipe (supporting member)
21a Pipe part 21b Hanging part 21c Nipping groove 21d Outer groove 25 Light diffusion cover 25a Engaging claw part 25b Light transmitting part 25c Thickening part 25d Internal wall 30 Socket 31 Tube member 32 Electrode cap 32a Pin 40 Control board

Claims (3)

複数のＬＥＤを配設したＬＥＤ基板と、
前記ＬＥＤ基板を覆う筒状のカバーと、
を備えた直管形のＬＥＤ照明灯において、
前記カバーは、前記ＬＥＤ基板の下面及び側面においてＬＥＤの光を透過する光透過部を備え、
前記光透過部は、下面部よりも側面部において光の透過率が低く設定されていることを特徴とする、ＬＥＤ照明灯の粒斑緩和構造。 An LED substrate on which a plurality of LEDs are disposed;
A cylindrical cover that covers the LED substrate;
In a straight tube type LED lighting with
The cover includes a light transmission part that transmits the light of the LED on the lower surface and the side surface of the LED substrate,
The light transmission part is set to have a light transmittance lower in the side part than in the lower part, and is a particle spot mitigation structure for an LED illumination lamp. 前記光透過部は、下面部よりも側面部が肉厚に形成されていることを特徴とする、請求項１記載のＬＥＤ照明灯の粒斑緩和構造。   2. The particle spot mitigating structure for an LED lighting lamp according to claim 1, wherein the light transmitting portion is formed such that a side surface portion is thicker than a lower surface portion. 前記光透過部は、側面部が二重に形成されていることを特徴とする、請求項１記載のＬＥＤ照明灯の粒斑緩和構造。   2. The particle spot mitigating structure for an LED lighting lamp according to claim 1, wherein the light transmitting portion has a double side surface portion.
JP2012083599A 2012-04-02 2012-04-02 Lumpy spot alleviation structure of led illumination lamp Pending JP2013214391A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015170565A (en) * 2014-03-10 2015-09-28 パナソニックＩｐマネジメント株式会社 Light source for illumination and luminaire
JP2015185219A (en) * 2014-03-20 2015-10-22 三菱電機株式会社 Lighting device and manufacturing method of the same
JP2016162674A (en) * 2015-03-04 2016-09-05 オーデリック株式会社 Led light source unit and luminaire

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015170565A (en) * 2014-03-10 2015-09-28 パナソニックＩｐマネジメント株式会社 Light source for illumination and luminaire
JP2015185219A (en) * 2014-03-20 2015-10-22 三菱電機株式会社 Lighting device and manufacturing method of the same
JP2016162674A (en) * 2015-03-04 2016-09-05 オーデリック株式会社 Led light source unit and luminaire

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