JP2013197380A - 半導体発光素子、および、車両用灯具、ならびに、半導体発光素子の製造方法 - Google Patents
半導体発光素子、および、車両用灯具、ならびに、半導体発光素子の製造方法 Download PDFInfo
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- JP2013197380A JP2013197380A JP2012063913A JP2012063913A JP2013197380A JP 2013197380 A JP2013197380 A JP 2013197380A JP 2012063913 A JP2012063913 A JP 2012063913A JP 2012063913 A JP2012063913 A JP 2012063913A JP 2013197380 A JP2013197380 A JP 2013197380A
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Abstract
【解決手段】支持基板上方に配置され、該支持基板に対して逆テーパ状の全体的断面形状を有する半導体積層20と、前記半導体積層と前記支持基板との間に配置され、該半導体積層側に配置される第1の接合層51、および、該支持基板側に配置される第2の接合層52、を含むジョイント層と、を含む断面構造を有し、平面視において、前記第1の接合層は前記第2の接合層に包含され、前記第2の接合層は前記半導体積層に包含され、前記半導体積層は、周縁部に辺部20sおよび角部20cを含む平面形状を有し、前記半導体積層の周縁部と前記第1の接合層の周縁部との間に画定される環状領域55において、該半導体積層の角部に対応する部分の幅を第1の幅L2とし、該半導体積層の辺部に対応する部分の幅を第2の幅L1としたとき、該第1の幅が該第2の幅よりも狭い。
【選択図】図2
Description
12 支持基板、
12a 酸化絶縁膜、
13 溝部、
15 デバイス領域、
15c デバイス領域の角部、
15s デバイス領域の辺部、
20 半導体積層、
20c 半導体積層の角部、
20s 半導体積層の辺部、
21 バッファ層、
22 下地層、
23 p型半導体層、
24 活性層、
25 n型半導体層、
30 p側電極、
31 透明電極、
32 反射電極、
33 キャップ層、
34 エッチングストップ層、
39 ITO膜、
41〜45 フォトレジスト、
51 第1の接合層、
52 第2の接合層、
55,56 環状領域、
61,63 n側電極、
62 保護膜、
64 引き出し電極、
70 コンタクト層、
80 半導体発光素子(第1の実施例)、
81 半導体発光素子アレイ、
82 半導体発光素子アレイからの出射光、
83 レンズ、
84 照射面、
85 蛍光体層、
90 半導体発光素子(第2の実施例)、
91 半導体発光素子アレイ、
92 半導体発光素子アレイからの出射光。
Claims (10)
- 支持基板と、
前記支持基板上方に配置され、少なくともp型半導体層、活性層、および、n型半導体層を含み、該支持基板に対して逆テーパ状の全体的断面形状を有する半導体積層と、
前記半導体積層と前記支持基板との間に配置され、該半導体積層側に配置される第1の接合層、および、該支持基板側に配置される第2の接合層、を含み、該第1および第2の接合層が接合することにより、該半導体積層および該支持基板の相対的位置関係を固定するジョイント層と、
を含む断面構造を有し、平面視において、
前記第1の接合層は、前記第2の接合層に包含される平面形状を有し、
前記第2の接合層は、前記半導体積層に包含される平面形状を有し、
前記半導体積層は、周縁部に辺部および角部を含む平面形状を有し、
前記半導体積層の周縁部と前記第1の接合層の周縁部との間に画定される環状領域において、該半導体積層の角部に対応する部分の幅を第1の幅とし、該半導体積層の辺部に対応する部分の幅を第2の幅としたとき、該第1の幅が該第2の幅よりも狭い半導体発光素子。 - 前記第1の幅は10μm以下である請求項1記載の半導体発光素子。
- 前記第2の幅は20μm以下である請求項1または2記載の半導体発光素子。
- 請求項1〜3いずれか1項記載の半導体発光素子と、
前記半導体発光素子から出射される光の光路上に配置された光学系と、
を含む車両用灯具。 - 支持基板と、
前記支持基板上方に配置され、少なくともp型半導体層、活性層、および、n型半導体層を含み、該支持基板に対して順テーパ状の全体的断面形状を有する半導体積層と、
前記半導体積層と前記支持基板との間に配置され、該半導体積層側に配置される第1の接合層、および、該支持基板側に配置される第2の接合層、を含み、該第1および第2の接合層が接合することにより、該半導体積層および該支持基板の相対的位置関係を固定するジョイント層と、
を含む断面構造を有し、平面視において、
前記支持基板の表面には、前記半導体積層および前記ジョイント層を取り囲んで、デバイス領域を画定する溝部が形成されており、
前記第1の接合層は、前記第2の接合層に包含される平面形状を有し、
前記第2の接合層は、前記デバイス領域に包含される平面形状を有し、
前記デバイス領域は、周縁部に辺部および角部を含む平面形状を有し、
前記デバイス領域の周縁部と前記第1の接合層の周縁部との間に画定される環状領域において、該デバイス領域の角部に対応する部分の幅を第1の幅とし、該デバイス領域の辺部に対応する部分の幅を第2の幅としたとき、該第1の幅が該第2の幅よりも狭い半導体発光素子。 - 前記支持基板上方には、前記半導体積層および前記ジョイント層が複数配置されており、
前記支持基板表面には、前記複数の半導体積層およびジョイント層各々を取り囲む溝部が複数形成されており、
前記複数の半導体積層は、それぞれ電気的に直列に接続されている請求項5記載の半導体発光素子。 - 請求項5または6記載の半導体発光素子と、
前記半導体発光素子から出射される光の光路上に配置される光学系と、
を含む車両用灯具。 - (a)成長基板上方に、少なくともn型半導体層、活性層、およびp型半導体層を含み、該成長基板に対して順テーパ状の全体的断面形状を有するとともに、周縁部に辺部および角部を含む平面形状を有する半導体積層を形成する工程と、
(b)前記半導体積層上方に、平面視で、該半導体積層に包含される第1の接合層を形成する工程と、
(c)前記半導体積層および前記第1の接合層が形成された前記成長基板と、表面に第2の接合層が形成された支持基板と、を、平面視で、該第2の接合層が該半導体積層に包含されるとともに該第1の接合層を包含するように配置して、該第1および第2の接合層を接合することにより、該成長基板、該半導体積層および該支持基板を含む貼り合せ構造体を形成する工程と、
(d)前記成長基板を、前記貼り合せ構造体から分離する工程と、
を含み、
前記工程(b)において、前記半導体積層の周縁部と前記第1の接合層の周縁部との間に画定される環状領域の、該半導体積層の角部に対応する部分の幅を第1の幅とし、該半導体積層の辺部に対応する部分の幅を第2の幅としたとき、前記第1の接合層は、該第1の幅が該第2の幅よりも狭くなるように形成される半導体発光素子の製造方法。 - 前記工程(b)において、前記第1の接合層は、前記第1の幅が10μm以下になるように形成される請求項8記載の半導体発光素子の製造方法。
- 前記工程(b)において、前記第1の接合層は、前記第2の幅が20μm以下になるように形成される請求項8または9記載の半導体発光素子の製造方法。
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