JP2013197020A - Heat sink for in-vehicle led lamp - Google Patents
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- JP2013197020A JP2013197020A JP2012065237A JP2012065237A JP2013197020A JP 2013197020 A JP2013197020 A JP 2013197020A JP 2012065237 A JP2012065237 A JP 2012065237A JP 2012065237 A JP2012065237 A JP 2012065237A JP 2013197020 A JP2013197020 A JP 2013197020A
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Abstract
Description
本発明は、発光ダイオード（ＬＥＤ）素子を発光源とするＬＥＤランプが発光時に発生する熱を、閉空間からなる周囲の空間に放射により放熱するための、車載ＬＥＤランプ用ヒートシンクに関するものである。 The present invention relates to a heat sink for an in-vehicle LED lamp for radiating heat generated by an LED lamp having a light emitting diode (LED) element as a light source during light emission to a surrounding space including a closed space by radiation.
発光ダイオード（ＬＥＤ）素子を発光源とする照明は、低消費電力であり且つ長寿命であることから徐々に市場に浸透し始めている。その中でも、近年特に注目を集めているのが、自動車のヘッドライトなどの車載ＬＥＤランプ（車両用灯具、車両用前照灯）であり、ＬＥＤ素子への置き換えが始まっている。また、この車載ＬＥＤランプ(ＬＥＤ照明)を応用して、建物等その他の分野の埋め込み照明でも、ＬＥＤランプへの置き換えが始まっている。 Lighting that uses a light emitting diode (LED) element as a light source is gradually penetrating the market due to its low power consumption and long life. Among these, in-vehicle LED lamps (vehicle lamps, vehicle headlamps) such as automobile headlights have attracted particular attention in recent years, and replacement with LED elements has begun. In addition, by applying this in-vehicle LED lamp (LED lighting), replacement with LED lamps has begun in embedded lighting in other fields such as buildings.
しかしながら、このＬＥＤランプの発光源であるＬＥＤ素子は熱に非常に弱く、例えば１００℃などの許容温度を超えると発光効率が低下し、更には、その寿命にも影響を及ぼしてしまうという問題がある。この問題を解決するためには、ＬＥＤ素子の発光時の熱を周囲の空間に放熱する必要があるため、ＬＥＤランプには大型のヒートシンクが備えられている。 However, the LED element that is the light source of this LED lamp is very vulnerable to heat. For example, when the temperature exceeds an allowable temperature such as 100 ° C., the luminous efficiency is lowered, and further, the life of the LED element is affected. is there. In order to solve this problem, since it is necessary to dissipate heat at the time of light emission of the LED element to the surrounding space, the LED lamp is provided with a large heat sink.
このＬＥＤランプ（ＬＥＤ照明）用ヒートシンクには、従来から、アルミニウム（アルミニウム合金を含む）を材料とした、アルミダイキャストや押出形材によるものが多く採用されている。 Conventionally, heat sinks for LED lamps (LED lighting), which are made of aluminum (including an aluminum alloy) and are made of aluminum die cast or extruded shape material, are often used.
図８、９に斜視図で例示するように、特許文献１〜４などに例示されるヒートシンクは、共通して、ＬＥＤ素子（光源）Ｌが正面側に配置固定された基板部３０と、その基板部３０の背面側に間隔を置いて突出する複数枚の平行に配置されたフィン部４０を有してなる。 As illustrated in perspective views in FIGS. 8 and 9, the heat sinks exemplified in Patent Documents 1 to 4 and the like commonly have a substrate portion 30 on which LED elements (light sources) L are arranged and fixed on the front side, It has a plurality of fin portions 40 arranged in parallel and projecting at an interval on the back side of the substrate portion 30.
ただ、このようなヒートシンクを自動車のヘッドライトやテールランプなどの車載照明としてハウジングに組み込んで適用する場合には、必然的に、限られた狭い空間乃至閉鎖空間のなかに設置され、使用されることになる。 However, when such a heat sink is applied to a housing as in-vehicle lighting such as an automobile headlight or tail lamp, it must be installed and used in a limited narrow space or closed space. become.
このような車載照明用のハウジングの狭い空間内乃至閉鎖空間内では、放熱空間も小さく限定され、前記した従来のヒートシンクの基板部３０やフィン部４０が位置する周囲の放熱空間（容積）も小さくなり、空気の対流がほとんどない。このような使用環境下では、空気の対流による放熱効果がほとんど期待できず、放射による放熱が必要とされる。 In such a narrow space or closed space of the housing for in-vehicle lighting, the heat dissipation space is limited to be small, and the surrounding heat dissipation space (volume) where the substrate portion 30 and the fin portion 40 of the conventional heat sink are located is also small. There is almost no air convection. Under such a use environment, almost no heat dissipation effect due to air convection can be expected, and radiation heat dissipation is required.
しかし、前記した従来のヒートシンクは、前記フィン部による放熱面の面積を増加させて、この放熱面からの空気の対流による放熱効果を主体としており、前記放射による放熱が考慮されていない。このため、従来のヒートシンクは、必然的に、前記放射による放熱が不十分となり、車載照明用のハウジングの狭い空間内乃至閉鎖空間内では、効率的な放熱が達成できない問題を抱えていた。 However, the above-described conventional heat sink increases the area of the heat radiating surface by the fin portion and mainly has a heat radiating effect by convection of air from the heat radiating surface, and does not consider heat radiation by the radiation. For this reason, the conventional heat sink inevitably has insufficient heat radiation due to the radiation, and has a problem that efficient heat radiation cannot be achieved in a narrow space or a closed space of the housing for in-vehicle illumination.
これに対して、より軽量化および低コスト化を図ったヒートシンクも提案されている。例えば特許文献５では、車両用灯具のヒートシンクとして、アルミニウム等の高熱伝導率の金属平板を折り曲げ加工されて形成したヒートシンクが提案されている。このヒートシンクは、金属平板を断面がひしゃく状に折り曲げ加工し、縦断面がコの字状のひしゃく部分の放熱部と、縦断面がひしゃくの柄の部分のＬＥＤ光源を支持する基板とからなる。また、前記放熱部を一定間隔で細断したスリット状の開口部を多数設け、多数の狭幅の開口部と狭幅の放熱部とが交互に平行に並んだ櫛の歯状としている。そして、このように、放熱部にスリット状の開口部が隣接して設けられているため、車載照明用の限られた狭い空間乃至閉鎖空間であっても、灯室内を対流する空気が前記放熱部内に流れ込むと同時に、前記開口部から通り抜けていくという空気の流れが発生するとしている。そして、この空気の流れ（対流）の発生によって、放熱効率を向上することができるとしている。 On the other hand, heat sinks that have been further reduced in weight and cost have been proposed. For example, Patent Document 5 proposes a heat sink formed by bending a metal plate having a high thermal conductivity such as aluminum as a heat sink of a vehicle lamp. This heat sink is composed of a heat radiating portion of a ladle portion having a U-shaped cross section, which is formed by bending a metal flat plate into a ladle shape, and a substrate for supporting an LED light source having a lamellar handle portion. In addition, a large number of slit-like openings formed by chopping the heat-dissipating part at regular intervals are provided, and a plurality of narrow-opening parts and narrow heat-dissipating parts are alternately arranged in parallel. Thus, since the slit-shaped opening is provided adjacent to the heat radiating portion, air convection in the lamp chamber is radiated even in a limited narrow space or closed space for in-vehicle lighting. At the same time as flowing into the section, an air flow is generated that passes through the opening. The heat dissipation efficiency can be improved by the generation of the air flow (convection).
ただ、この特許文献５も、前記した特許文献１〜４と同様に、いずれも共通して、空気の対流による放熱効果を主体とし、放射による効率的な放熱を考慮していない。この結果、空気の対流による放熱効果が期待できない、車載照明用の限られた狭い空間内乃至閉鎖空間内では、やはり効率的な放熱が達成できない。 However, this Patent Document 5 also has a common heat dissipation effect by air convection and does not consider efficient heat dissipation by radiation, as in Patent Documents 1 to 4 described above. As a result, efficient heat dissipation cannot be achieved in a narrow space or a closed space for in-vehicle illumination, where a heat dissipation effect due to air convection cannot be expected.
本発明は、このような問題に鑑みてなされたもので、その目的とするところは、放射による効率的な放熱が可能な車載ＬＥＤランプ用ヒートシンクを提供することにある。言い換えると、空気による対流がないか少ない（空気の対流による放熱が期待できない）閉鎖された空間内に設置される場合であっても、ＬＥＤ発光源からの熱を放射主体で効率的に放熱できる、車載ＬＥＤランプ用ヒートシンクを提供することにある。 This invention is made | formed in view of such a problem, The place made into the objective is to provide the heat sink for vehicle-mounted LED lamps which can perform efficient heat dissipation by radiation | emission. In other words, even when installed in a closed space where there is little or no convection due to air (heat dissipation due to air convection cannot be expected), heat from the LED light source can be efficiently radiated mainly by the radiation. It is in providing the heat sink for vehicle-mounted LED lamps.
上記目的達成のために、本発明車載ＬＥＤランプ用ヒートシンクは、ＬＥＤ素子を表裏いずれかの面に取り付けた基板に対し、平板状の放熱フィンがこの基板の表裏いずれかあるいは両方の面に一体に形成されており、前記放熱フィンは前記基板の表裏いずれかの面から外方に向かって立設するとともに互いに間隔をあけて形成されており、これらの放熱フィンの、互いに同じ方向に向いて延在するフィンの枚数が、前記基板の表裏いずれかの面に直交する任意の断面において２枚以下であることとする。 In order to achieve the above object, the heat sink for an in-vehicle LED lamp according to the present invention has a flat plate-like heat radiating fin integrally on either or both of the front and back surfaces of the substrate with the LED element mounted on either of the front and back surfaces. The radiating fins are erected outwardly from either the front or back surface of the substrate and are spaced apart from each other. The radiating fins extend in the same direction. It is assumed that the number of existing fins is 2 or less in an arbitrary cross section orthogonal to either the front or back surface of the substrate.
本発明では、ＬＥＤ素子を表裏いずれかの面で支持した基板に対し、前記表裏いずれかの面に立設して外方に張り出す平板状の放熱フィンが、前記基板の面と連続かつ一体に互いに間隔をあけて形成されるものとする。そして、これらの放熱フィンのうち、互いに平行な方向に延在するフィンの枚数が、前記基板の表裏いずれかの面に直交する任意の断面においても（この方向の断面で切断したヒートシンクのいずれの断面においても）２枚以下とする。 In the present invention, a flat plate-like heat-dissipating fin standing on either the front or back surface and projecting outward is continuous and integrated with the surface of the substrate. Are formed at intervals. Of these heat dissipating fins, the number of fins extending in a direction parallel to each other may be any cross section orthogonal to either the front or back surface of the substrate (any of the heat sinks cut in the cross section in this direction). (Even in the cross-section) The number is 2 or less.
これによって、本発明によれば、空気による対流がないか少ない（空気の対流による放熱が期待できない）閉鎖された空間内に設置される場合であっても、ＬＥＤ発光源からの熱を放射主体で効率的に放熱できる、車載ＬＥＤランプ用ヒートシンクを提供することができる。言い換えると、具体的には後述する通り、３次元方向のいずれの方向においても、材料のムダがなく、空間占有率が低い割りに熱の放射効率が高い、放射主体の放熱性を有する車載ＬＥＤランプ用ヒートシンクを提供することができる。 Thus, according to the present invention, heat from the LED light source is mainly emitted even when installed in a closed space where there is little or no convection due to air (heat dissipation due to air convection cannot be expected). It is possible to provide an on-vehicle LED lamp heat sink that can efficiently dissipate heat. In other words, specifically, as will be described later, the vehicle-mounted LED that has no radiation waste in any of the three-dimensional directions, has a high heat radiation efficiency for a low space occupancy, and has a radiation-based heat dissipation property. A heat sink for the lamp can be provided.
また、本発明によれば、これらの効果を、ヒートシンクの形状、構造、特に、放熱フィンの形状、構造を複雑化させず、放熱フィンの数を多くせずに達成できる。それどころか、逆に、放熱フィンの形状、構造を単純化し、放熱フィンの数を少なくすることによって達成できる。 In addition, according to the present invention, these effects can be achieved without complicating the shape and structure of the heat sink, in particular, the shape and structure of the radiating fins, and without increasing the number of radiating fins. On the contrary, this can be achieved by simplifying the shape and structure of the radiating fins and reducing the number of radiating fins.
更に、本発明によれば、種々の素材材料や製造方法あるいは製造工程を選択することができ（選択肢が広がり）、安価でつくりやすいヒートシンクを提供することができる。例えば、素材材料としては、アルミニウム（純アルミニウム）やアルミニウム合金、銅（純銅）や銅合金、鋼板、樹脂、セラミックなどの種々の素材材料や、種々の製造方法あるいは製造工程を選択することができる。そして、これらのいずれの材料や製法によっても、ＬＥＤ素子取付面に設置されたＬＥＤ素子から伝導される熱の、３次元のいずれの方向へも、放射による高い放熱効率が得られる。すなわち、その設置、使用箇所が、閉鎖された空気による対流がない又は少ない（空気の対流による放熱がほとんど期待できない））空間においても、ＬＥＤ発光源からの熱を効率的に放射することができる。 Furthermore, according to the present invention, it is possible to select various raw materials, manufacturing methods, or manufacturing processes (expanding options), and it is possible to provide a heat sink that is inexpensive and easy to manufacture. For example, various raw materials such as aluminum (pure aluminum), aluminum alloy, copper (pure copper), copper alloy, steel plate, resin, ceramic, and various production methods or production processes can be selected as the raw material. . And by any of these materials and manufacturing methods, high heat radiation efficiency by radiation can be obtained in any of the three-dimensional directions of heat conducted from the LED elements installed on the LED element mounting surface. That is, even in a space where there is no convection due to closed air or where there is little or no convection (almost no heat dissipation due to air convection), the heat from the LED light source can be radiated efficiently. .
また、本発明では、ヒートシンクの前記基板と前記放熱フィンとが一体に形成されているため、前記基板と前記放熱フィンの互いの面同士が連続しており、これらの面あるいは材料による熱伝導の経路が連続して形成されている。このため、前記従来技術のような熱伝導の経路を分断するスリットなどの障害が無く、ヒートシンク内での熱伝導の経路が分断されることが無く、ヒートシンクを構成する各部までＬＥＤ素子からの熱が伝達される。したがって、ヒートシンクの極めて高い放熱性が確保される。 In the present invention, since the substrate of the heat sink and the radiating fin are integrally formed, the surfaces of the substrate and the radiating fin are continuous with each other. A path is formed continuously. For this reason, there is no obstacle such as a slit that divides the heat conduction path as in the prior art, the heat conduction path in the heat sink is not divided, and the heat from the LED element reaches each part constituting the heat sink. Is transmitted. Therefore, extremely high heat dissipation of the heat sink is ensured.
以下に図面を参照しながら、本発明の好適な実施の形態について詳細に説明する。なお、本明細書及び図面において、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重複説明を省略する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol.
図１〜７に、本発明のＬＥＤ照明用ヒートシンクの実施形態を各々斜視図で示す。 In FIGS. 1-7, embodiment of the heat sink for LED lighting of this invention is each shown with a perspective view.
ヒートシンクの基本構造：
先ず、図１〜７における、本発明のＬＥＤ照明用ヒートシンク１の共通する基本構造を説明する。これら図１〜７では、本発明のＬＥＤ照明用ヒートシンク１は、共通して、ＬＥＤ素子を取りつける平板状の基板２を有している。この基板２は、各図のＹ方向（上下方向）側に表裏２つの面を各々有し、これらの面は各図のＸ、Ｚ方向に延在している。この平板状の基板２は、これら表裏２つの面のいずれか一方の面にＬＥＤ素子を取り付けて支持しており、図１〜７では、便宜的に各図の上側の面をＬＥＤ素子９の取付面３とし、その平面の中央部に取り付けている。そして、各図の下側の他方の面を、これも便宜的に裏面４としている。
Basic structure of heat sink:
First, the common basic structure of the heat sink 1 for LED illumination of the present invention in FIGS. 1 to 7 will be described. In these FIGS. 1-7, the heat sink 1 for LED illumination of this invention has the flat board | substrate 2 which attaches an LED element in common. The substrate 2 has two front and back surfaces on the Y direction (vertical direction) side of each drawing, and these surfaces extend in the X and Z directions of each drawing. The flat substrate 2 supports an LED element attached to either one of the two front and back surfaces. In FIGS. 1 to 7, the upper surface of each figure is shown as the LED element 9 for convenience. The mounting surface 3 is attached to the center of the plane. The other surface on the lower side of each figure is also referred to as a back surface 4 for convenience.
更に、基板２の表裏面３、４は、いずれかあるいは両方の面に直交して（面の延在方向＝各図のＸ、Ｚ方向に直交して）、各図のＹ方向（上下方向）に張り出して延在する、平板状の放熱フィン１０〜１３を有する。これら平板状の放熱フィン１０〜１３は、基板２の表裏面３、４に外方に向かう形で立設されているが、必ずしも図１〜７のように基板２の表裏面３、４に９０度の角度で平板状の放熱側面が直交する必要は無い。例えば、放熱側面が９０度未満や９０度を超える角度で、基板２の表裏面３、４に対して傾斜して外方に向かって立設しても良い。ただ、いずれの場合でも、これら平板状の放熱フィン１０〜１３は、基板２と、材料的に一体かつ連続して形成されてなる。すなわち、これら平板状の放熱フィン１０〜１３の少なくとも平板状の各表裏面は、基板２の面３、４と、途切れることなく連続して形成されている。 Further, the front and back surfaces 3 and 4 of the substrate 2 are orthogonal to either or both surfaces (surface extension direction = perpendicular to the X and Z directions in each figure), and the Y direction (vertical direction in each figure). ) And have flat plate-like heat radiation fins 10-13. These flat heat radiation fins 10 to 13 are erected outwardly on the front and back surfaces 3 and 4 of the substrate 2, but are not necessarily provided on the front and back surfaces 3 and 4 of the substrate 2 as shown in FIGS. There is no need for the flat heat-dissipating side surfaces to be orthogonal at an angle of 90 degrees. For example, the heat radiating side surface may be tilted with respect to the front and back surfaces 3 and 4 of the substrate 2 at an angle of less than 90 degrees or greater than 90 degrees, and may be erected outward. However, in any case, these flat plate-like heat radiation fins 10 to 13 are formed integrally and continuously with the substrate 2. That is, at least the flat front and back surfaces of the flat radiating fins 10 to 13 are continuously formed with the surfaces 3 and 4 of the substrate 2 without interruption.
このため、ＬＥＤ素子９からの熱が、基板２のＬＥＤ素子取付側の面（表面）３を介して、裏面４や、各放熱フィンの周囲の側面や板厚方向の面へ連続して伝熱される連続伝熱面を形成している。また、これら連続伝熱面から連続して熱を放射する連続放熱面も形成されている。 For this reason, the heat from the LED element 9 is continuously transmitted to the back surface 4, the side surface around each radiating fin, and the surface in the plate thickness direction via the surface (front surface) 3 on the LED element mounting side of the substrate 2. A continuous heat transfer surface to be heated is formed. Moreover, the continuous heat radiation surface which radiates | emits a heat | fever continuously from these continuous heat transfer surfaces is also formed.
なお、基板２の形状につき、図１〜７では、矩形（四角形）の平板状乃至平面形状を例示している。ただ、この基板２の形状は、ＬＥＤ照明用ヒートシンクの用途に応じて、円形、三角形、多角形、不定形などの平面形状、あるいは全体が円筒形、角筒形や段差を有するなどの３次元形状などが適宜選択できる。 In addition, about the shape of the board | substrate 2, in FIGS. 1-7, the flat form thru | or planar shape of a rectangle (square) is illustrated. However, the shape of the substrate 2 is a three-dimensional shape such as a circular shape, a triangular shape, a polygonal shape, an indefinite shape, or a whole shape having a cylindrical shape, a rectangular tube shape, or a step, depending on the use of the heat sink for LED lighting. A shape etc. can be selected suitably.
放熱フィンの特徴：
以上説明した本発明のＬＥＤ照明用ヒートシンク１の基本構造自体は、前記図８、９に例示した従来のヒートシンクの構造と、一見すれば大差無いように見える。しかし、その平板状の放熱フィン１０〜１３の配置の仕方に、車載照明用のハウジングの狭い空間内乃至閉鎖空間内で必要とされる、放射による放熱を主体とするための工夫がある点が大きく異なる。
Features of heat dissipation fins:
The basic structure of the LED lighting heat sink 1 of the present invention described above seems to be not much different from the conventional heat sink structure illustrated in FIGS. However, the arrangement of the flat plate-like heat radiation fins 10 to 13 has a feature to mainly radiate heat by radiation, which is required in a narrow space or a closed space of a housing for in-vehicle illumination. to differ greatly.
先ず、本発明のＬＥＤ照明用ヒートシンク１は、前記ヒートシンクの基本構造を前提として、平板状の放熱フィン１０〜１３を、好ましくは基板２の二つの面３、４に各々設けられた合計で２〜８枚の枚数、基板２の面３、４と連続してかつ一体に、互いに間隔をあけて形成している。 First, the heat sink 1 for LED lighting of the present invention is premised on the basic structure of the heat sink, and plate-like radiation fins 10 to 13 are preferably provided on the two surfaces 3 and 4 of the substrate 2 in total 2 respectively. ˜8 sheets are formed continuously and integrally with the surfaces 3 and 4 of the substrate 2 so as to be spaced apart from each other.
そして、これら放熱フィン１０〜１３のうち、平行な状態を含めて、互いに同じ方向に向いて延在するフィンの枚数が、基板２の二つの面３、４に直交する任意の断面において２枚以下であるものとしている。すなわち、基板２の二つの面３、４に直交する任意の方向の断面で切断した、ヒートシンク１のいずれの断面においても２枚以下としている。 Of these radiating fins 10 to 13, the number of fins extending in the same direction including the parallel state is two in any cross section orthogonal to the two surfaces 3 and 4 of the substrate 2. It is assumed that: That is, the number of the heat sinks 1 is two or less in any cross section cut in a cross section in an arbitrary direction orthogonal to the two surfaces 3 and 4 of the substrate 2.
放熱フィン延在方向の規定の意味：
ここで、本発明でいう「互いに同じ方向に向いて延在する」とは、平行な状態を当然含むものの、厳密な意味での平行だけの意味ではなく、放熱フィン同士の互いの平板状側面の延在方向の角度が多少違っていても良い。本発明では、ヒートシンクの３次元方向のいずれの方向においても、放熱フィン同士の過度な重なり合いを無くして、材料のムダがなく、熱の放射効率が高い性能を得ることを目的としている。したがって、この目的や効果を阻害しない範囲で、放熱フィン同士の互いの平板状側面の延在方向の角度が多少違っていても、それは互いに同じ方向に向いて延在すると見なすことができる。放熱フィン同士の互いの平板状側面の延在方向の角度が多少違っていても、あるいは厳密に平行であってその角度が違っていなくても、図８〜９のように、本発明で規制すべき、同じ方向に放熱フィン同士が向いて互いに重なり合うことには、大差がないからである。
Meaning of rules for extending direction of radiating fins:
Here, “extending in the same direction as each other” as used in the present invention includes a parallel state as a matter of course, but it does not mean only parallel in a strict sense, but also a flat plate-like side surface of radiating fins. The angle of the extending direction may be slightly different. The object of the present invention is to eliminate the excessive overlap of the heat dissipating fins in any of the three-dimensional directions of the heat sink, to obtain a performance with no material waste and high heat radiation efficiency. Therefore, even if the angles of the extending directions of the flat plate side surfaces of the radiating fins are slightly different within a range not hindering the purpose and effect, it can be considered that they extend in the same direction. Even if the angle of the extending direction of the flat plate side surfaces of the radiating fins is slightly different, or even if they are strictly parallel and the angle is not different, it is regulated by the present invention as shown in FIGS. This is because there is no great difference between heat radiation fins facing each other in the same direction and overlapping each other.
この角度の違いの目安につき、放熱フィン同士の互いの平板状側面の延在方向のなす角度が３０度以下であれば、放熱フィン同士が互いに同じ方向に向いて延在すると見なす。逆に、放熱フィン同士の互いの平板状側面の延在方向のなす角度が３０度を超えていれば、放熱フィン同士が互いに同じ方向に向いて延在するとは見なさない。 As a measure of the difference in angle, if the angle formed by the extending directions of the flat plate side surfaces of the radiating fins is 30 degrees or less, it is considered that the radiating fins extend in the same direction. On the contrary, if the angle formed by the extending directions of the flat plate-shaped side surfaces of the radiating fins exceeds 30 degrees, the radiating fins are not considered to extend in the same direction.
後述する図１〜７では、２枚の放熱フィン同士がＬＥＤ素子９を挟んで、互いに同じ方向に向いて延在する態様として互いに平行に並び、ＬＥＤ素子９を中心とした矩形状に四周囲を取り囲み、隣り合う放熱フィン同士が互いに直交（直角に交差）した配置としている。ただ、本発明では、このような配置に限らず、ＬＥＤ素子９を中心点にした円周上や円弧上に、ＬＥＤ素子９の周囲を取り囲んで、例えばドミノ倒し状に、平板状側面の角度を順次変えながら、放熱フィンを間隔をあけて配置しても良い。 In FIGS. 1 to 7 to be described later, two radiating fins are arranged in parallel to each other as an aspect of extending in the same direction with the LED element 9 sandwiched between them, and four surroundings in a rectangular shape centering on the LED element 9 The adjacent radiating fins are arranged orthogonally to each other (crossing at right angles). However, the present invention is not limited to such an arrangement, and surrounds the periphery of the LED element 9 on a circumference or arc with the LED element 9 as the center point, for example, in a domino-inclined manner, the angle of the flat plate side surface The heat radiating fins may be arranged at intervals while sequentially changing.
また、互いに同じ方向に向いて延在するフィンの枚数を、「基板２の二つの面３、４に直交する任意の断面において（この方向の断面で切断したヒートシンクのいずれの断面においても）２枚以下」と規定するのは、三次元空間内のある方向に対して、フィン同士が過度に重なりあうことを防止するためである。なお、後述するように、１枚のフィンであっても、Ｌ字状あるいはコの字状のような、異なる方向に延在する平板状の放熱面（放熱側面）を複数有する場合がある。平板状のフィンだけでなく、このような延在方向や形状が異なる複数の放熱面を有する形状のフィンに対しても、例えば平面形状がＬ字状あるいはコの字状を形成する角直線区間がそれぞれ単一のフィンとみなして、同一方向での枚数（重なり具合）をみる。このような見方によって、基板の表裏いずれかの面に直交する任意の断面において、同じ向きに延在するフィンの枚数が２枚以下とすることにより、放熱フィン同士あるいは放熱フィンの放熱側面同士が向いて互いに重なり合うことを避けることが出来る。すなわち、前記規定は、同じフィンの放熱面であるかどうかにかかわらず、放熱フィンの放熱面（放熱側面）の枚数をフィンの枚数と見なして、基板２の二つの面３、４の位置に関わらず、過度な重なり合いを避けて、前記２枚以下の規定とするためである。 Further, the number of fins extending in the same direction as each other is expressed as “2 in any cross section orthogonal to the two surfaces 3 and 4 of the substrate 2 (in any cross section of the heat sink cut in the cross section in this direction) 2. The reason why it is defined as “less than or equal to the number of sheets” is to prevent the fins from excessively overlapping each other in a certain direction in the three-dimensional space. Note that, as will be described later, even a single fin may have a plurality of flat plate-shaped heat radiation surfaces (heat radiation side surfaces) extending in different directions, such as an L shape or a U shape. Not only flat fins, but also such fins having a plurality of heat radiating surfaces with different extending directions and shapes, for example, a square straight section in which the planar shape forms an L shape or a U shape Are regarded as a single fin, and the number of sheets in the same direction (overlapping condition) is observed. From such a viewpoint, in any cross section orthogonal to either the front or back surface of the substrate, the number of fins extending in the same direction is two or less, so that the heat dissipating fins or the heat dissipating side surfaces of the heat dissipating fins are You can avoid overlapping each other. That is, the above rule is that the number of heat dissipating surfaces (heat dissipating side surfaces) of the heat dissipating fins is regarded as the number of fins regardless of whether they are heat dissipating surfaces of the same fin, and the positions of the two surfaces 3 and 4 of the substrate 2 are set. Regardless, excessive overlap is avoided and the two or less sheets are specified.
この点で、互いに同じ方向に向いて延在するフィンの枚数を、前記規定と違う表現として、仮に「基板２のいずれの面３、４においても２枚以下」と規定した場合には、放熱フィンの絶対的な枚数を規定することとなる。このため、Ｌ字状あるいはコの字状のような放熱フィンの異なる方向の放熱面をフィンの枚数と見なせず、基板２の二つの面３、４の位置によっては、過度な重なり合いが生じる可能性がある。したがって、前記「基板２の二つの面３、４に直交する任意の断面において（この方向の断面で切断したヒートシンクのいずれの断面においても）２枚以下」と規定とした。 In this regard, if the number of fins extending in the same direction as each other is defined as “two or less on any surface 3, 4 of the substrate 2” as an expression different from the above definition, heat dissipation The absolute number of fins will be specified. For this reason, the heat radiating surfaces in different directions of the heat radiating fins, such as L-shape or U-shape, are not regarded as the number of fins, and depending on the positions of the two surfaces 3 and 4 of the substrate 2, excessive overlapping occurs. there is a possibility. Therefore, it is defined as “two or less sheets in any cross section orthogonal to the two surfaces 3 and 4 of the substrate 2 (in any cross section of the heat sink cut in the cross section in this direction)”.
この平板状の放熱フィン１０〜１３の形状につき、図１〜７では、全体形状や平板状側面が矩形（四角形）の形状を例示しているが、この矩形に限らない平面形状や３次元形状が選択できる。例えば、平板状の放熱面（放熱側面）を、異なる方向（例えば９０度以上）に複数延在させる場合として、隣接する放熱フィン１０、１１同士、あるいは１２、１３が一体となったようなＬ字状、隣接する放熱フィン１０、１１、１０同士、あるいは１２、１３、１２が一体となったようなコの字状であっても良い。製造できるならば、これら平板状の放熱面（放熱側面）だけでなく、円弧状や曲線状の放熱面（放熱側面）あるいは全体形状を有していても良い。また、外方へ向かう板厚断面の形状や厚みが高さ位置でＬ字状や階段状に異なるようにしても良い。更に、放熱面を円形、三角形、多角形、不定形などの面形状とすることも適宜選択できる。 1 to 7 exemplify the shape of the flat plate-like heat radiation fins 10 to 13, the overall shape and the flat plate-like side surface are rectangular (square) shapes. However, the flat shape and three-dimensional shape are not limited to this rectangle. Can be selected. For example, when a plurality of flat heat radiation surfaces (heat radiation side surfaces) extend in different directions (for example, 90 degrees or more), the adjacent heat radiation fins 10 and 11 or 12 and 13 are integrated. The U-shape may be a U-shape such that the adjacent radiating fins 10, 11, 10 or 12, 13, 12 are integrated. If it can be manufactured, it may have not only these flat heat dissipation surfaces (heat dissipation side surfaces) but also arc-shaped or curved heat dissipation surfaces (heat dissipation side surfaces) or the entire shape. Moreover, you may make it the shape and thickness of the plate | board thickness cross section which goes outside differ in L shape or step shape in a height position. Furthermore, it is possible to appropriately select the heat radiating surface as a surface shape such as a circle, a triangle, a polygon, and an indeterminate shape.
以下に、図１〜７の本発明の具体的な実施形態を説明するが、その中で、本発明の平板状の放熱フィン１０〜１３の枚数や配置の規定の意義を説明する。すなわち、平板状の放熱フィン１０〜１３の枚数を好ましくは合計で２〜８枚とする点の意義についても説明する。また、これら放熱フィン１０〜１３のうち、互いに同じ方向に向いて延在するフィンの枚数を、基板２のいずれの面３、４に直交する任意の方向の断面で切断した、ヒートシンク１のいずれの断面においても２枚以下としている意義についても説明する。 In the following, specific embodiments of the present invention shown in FIGS. 1 to 7 will be described. Among them, the number of plate-like radiating fins 10 to 13 of the present invention and the significance of the definition of the arrangement will be described. That is, the significance of the point that the total number of flat radiating fins 10 to 13 is preferably 2 to 8 in total will be described. In addition, any of the heat sinks 1 to 13 in which the number of fins extending in the same direction among each of the radiating fins 10 to 13 is cut in a cross section in an arbitrary direction orthogonal to any of the surfaces 3 and 4 of the substrate 2. The significance of having two or less in the cross section will also be described.
図１：
図１の平板状の放熱フィン１０、１１は、基板２の、ＬＥＤ素子９を支持したＬＥＤ素子取付面３側に合計４枚、基板２の面３と、その平板状の各側面が一体かつ連続して設けられている。他方の裏面４側には放熱フィンは設けられておらず、平板状の裏面４のみ存在する。
Figure 1:
1 has a total of four plate-like heat radiation fins 10 and 11 on the side of the LED element mounting surface 3 of the substrate 2 that supports the LED element 9, and the surface 3 of the substrate 2 and the respective plate-like side surfaces are integrated. It is provided continuously. No heat radiating fin is provided on the other back surface 4 side, and only the flat back surface 4 exists.
そして、これらＬＥＤ素子取付面３側に設けられた放熱フィン１０、１１が、ＬＥＤ素子９を間に挟んで対称的に２枚ずつ、図の左右側の放熱フィン１０、１０同士、および図の上下側の放熱フィン１１、１１同士、互いに同じ方向に向いて延在する態様として、互いに平行に並んで設けられている。すなわち、互いに対向する平板状の放熱フィン１０、１０同士が、また１１、１１同士が、ＬＥＤ素子取付面３である表面側に、ＬＥＤ素子９を中間に挟む位置に形成されている。そして、これら放熱フィン１０、１１のうち、互いに同じ方向に向いて延在するフィンの枚数が、基板２の面３、４に直交する任意の断面においても（この方向の断面で切断したヒートシンク１のいずれの断面においても）２枚としている。 And the radiation fins 10 and 11 provided on the LED element mounting surface 3 side are symmetrically arranged two by two with the LED element 9 in between, the left and right radiation fins 10 and 10 in the figure, and the figure. The upper and lower radiating fins 11 are arranged in parallel with each other as an aspect extending in the same direction. That is, the flat radiating fins 10, 10 facing each other, and 11, 11 are formed on the surface side that is the LED element mounting surface 3 at a position sandwiching the LED element 9 in the middle. Of these radiating fins 10, 11, even if the number of fins extending in the same direction is perpendicular to the surfaces 3, 4 of the substrate 2 (the heat sink 1 cut along the cross section in this direction). (In any cross section), the number is 2.
また、ＬＥＤ素子９を間に挟んだ（ＬＥＤ素子９を中心とした）矩形状四周囲を、放熱フィン１０、１１が、隣り合う放熱フィン同士が互いに直交（直角に交差）して、形成、配置されて取り囲み、熱の放射率が大きな放熱フィン１０、１１の各平板状側面がＸ方向、Ｚ方向に各々向いている。そして、基板２の、熱の放射率が大きなＬＥＤ素子取付面３と他方の裏面４がＹ方向を向いている。 In addition, the four surroundings of the rectangular shape (with the LED element 9 as the center) sandwiching the LED elements 9 are formed so that the radiating fins 10 and 11 are perpendicular to each other (crossing at right angles). The flat plate-like side surfaces of the heat dissipating fins 10 and 11 that are disposed and surrounded and have a large heat emissivity are directed in the X direction and the Z direction, respectively. The LED element mounting surface 3 and the other back surface 4 of the substrate 2 having a large heat emissivity are directed in the Y direction.
この他、基板２の四周囲の板厚（厚み）方向の各面５、６、７、８（５は図の左側、６は図の下側、７は図の右側、８は図の上側）も、前記各面よりも面積的には比較的小さいが、Ｘ、Ｚの各方向への各方向へ向いており、これらの方向への熱の放射面となる。これは、各放熱フィン１０、１１の板厚（厚み）方向の各面（上面、両端部面）も同様で、前記平板状側面よりも面積的には比較的小さいが、面の数は多く、上面、両端部面とも、Ｘ、Ｙ、Ｚの各方向へ各々合計で４面ずつ向いており、これらの方向への熱の放射面となる。 In addition, each surface 5, 6, 7, 8 in the plate thickness (thickness) direction around the substrate 2 (5 is the left side of the figure, 6 is the lower side of the figure, 7 is the right side of the figure, and 8 is the upper side of the figure. ) Is relatively smaller in area than the respective surfaces, but is directed in each direction in the X and Z directions, and becomes a radiation surface of heat in these directions. This is the same for each surface (upper surface, both end surface) in the plate thickness (thickness) direction of each of the radiating fins 10 and 11, which is relatively smaller in area than the flat side surface, but has a large number of surfaces. The upper surface and the both end surfaces are directed in total in four directions in the X, Y, and Z directions, respectively, and serve as heat radiating surfaces in these directions.
したがって、放熱フィン１０、１１の平面上側面の中で，ＬＥＤ素子９が取り付けられる側の互いに向かい合う対をなす２面では放射面が互いに重なり合うことになるものの、これらＸ、Ｙ、Ｚの３次元方向のいずれの方向においても、放熱フィンの放熱面が過度に重複することが無く、材料のムダがない。このため、前記した、ＬＥＤ素子９からの熱が基板２の取付面３を介して、裏面４や、各放熱フィンの周囲の側面や板厚方向の面へ連続して伝熱される連続伝熱面の形成や、これら連続伝熱面から連続して熱を放射する連続放熱面の形成効果との相乗効果で、高い熱放射効率が得られる。 Accordingly, among the two upper surfaces of the heat sink fins 10 and 11 on the side where the LED element 9 is mounted, the radiation surfaces overlap each other, but the three-dimensional X, Y, and Z are formed. In any direction, the heat dissipating surfaces of the heat dissipating fins are not excessively overlapped, and there is no waste of material. For this reason, the above-mentioned continuous heat transfer in which the heat from the LED element 9 is continuously transferred through the mounting surface 3 of the substrate 2 to the back surface 4, the side surface around each radiating fin, and the surface in the plate thickness direction. High heat radiation efficiency is obtained by the synergistic effect of the formation of the surface and the effect of forming the continuous heat radiation surface that radiates heat continuously from these continuous heat transfer surfaces.
放熱フィンの枚数：
互いに同じ方向に向いて延在する放熱フィンの枚数を、更に減らして、基板２の面３、４に直交する任意の断面においても、好ましい下限である２枚だけ設ける場合には、図１の左右側の放熱フィン１０、１０のいずれかまたは両方、図の上下側の放熱フィン１１、１１のいずれかまたは両方の、２枚のみを残して、他の放熱フィンを除く形にする。この場合、図１の左右側の放熱フィン１０、１０同士を残してもよく、図１の上下側の放熱フィン１１、１１同士を残してもよく、放熱フィン１０、１１のどちらか片方ずつを残しても良い。
Number of radiating fins:
When the number of radiating fins extending in the same direction is further reduced and only two, which is a preferable lower limit, are provided in any cross section orthogonal to the surfaces 3 and 4 of the substrate 2, FIG. One or both of the left and right radiating fins 10 and 10 and either or both of the radiating fins 11 and 11 on the upper and lower sides of the figure are left, and the other radiating fins are removed. In this case, the left and right radiating fins 10 and 10 in FIG. 1 may be left, the upper and lower radiating fins 11 and 11 in FIG. 1 may be left, and either one of the radiating fins 10 and 11 may be left. May be left.
これに対して、平板状の放熱フィンの枚数が多くなった場合には、Ｘ、Ｙ、Ｚの３次元方向のいずれかの方向において、放熱フィンの放熱面が重複することとなり、材料のムダが生じ、空間占有率が高い割りに、熱の放射効率（放熱効率）が低くなる。したがって、設ける放熱フィンの枚数を、基板２の表裏二つの面３、４に各々設けられた枚数の合計で８枚以下、好ましくは２〜８枚の範囲とする。但し、図１〜７において、同じ放熱フィン１０〜１３を、各々そのまま、放熱側面の延在方向で、単にいくつかにあるいは細かく、分離、分割しただけのような態様の場合には、同じ放熱フィン１枚とみなす。 On the other hand, when the number of flat radiating fins increases, the radiating surfaces of the radiating fins overlap in any one of the three-dimensional directions of X, Y, and Z. As a result, the heat radiation efficiency (heat radiation efficiency) is lowered for a high space occupancy. Therefore, the total number of radiating fins to be provided is 8 or less, preferably 2 to 8 in total, the number of radiating fins provided on each of the two front and back surfaces 3 and 4 of the substrate 2. However, in FIGS. 1 to 7, the same heat radiation fins 10 to 13 are left in the extending direction of the heat radiation side surface, and in the case where the heat radiation side surface is simply divided into some or finely separated and divided, the same heat radiation Consider one fin.
この平板状の放熱フィンの合計枚数が多くなった場合の問題は、図１０の比較例のように、互いに同じ方向に向いて（平行に）延在するフィンの枚数が、基板２の表裏二つの面３、４に直交する任意の断面において３枚以上（基板２の表裏二つの面３、４に直交する任意の方向の断面で切断したヒートシンク１のいずれかの断面においても３枚以上）と、多すぎる場合も同様に生じる。図１０の比較例では、基板２の両方の表裏面３、４において、互いに平行な方向に延在するフィンの枚数が４枚ずつ存在する。これでは、図８、９の従来例の多数平行に並ぶ放熱フィンと同じとなって、Ｘ、Ｙ、Ｚの３次元方向のいずれかの方向において、放熱フィンの放熱面が重複して、材料のムダが生じ、空間占有率が高い割りに熱の放射効率が低くなる。 The problem when the total number of the flat plate-like radiating fins is large is that the number of fins extending in the same direction (in parallel) as shown in the comparative example of FIG. 3 or more in an arbitrary cross section perpendicular to the surfaces 3 and 4 (3 or more in any cross section of the heat sink 1 cut in a cross section in an arbitrary direction perpendicular to the two surfaces 3 and 4 of the substrate 2) If it is too much, it will occur as well. In the comparative example of FIG. 10, there are four fins each extending in a direction parallel to each other on both the front and back surfaces 3 and 4 of the substrate 2. This is the same as the heat radiation fins arranged in parallel in the conventional example of FIGS. 8 and 9, and the heat radiation surfaces of the heat radiation fins overlap in any of the three-dimensional directions of X, Y, and Z. As a result, the heat radiation efficiency is lowered for a high space occupancy.
図２：
図２の平板状の放熱フィンは、図１のような基板２のＬＥＤ素子取付面（表面）３の片側だけでなく、更に、基板２の他方の裏面４側にも放熱フィンを設けた形態を示している。具体的には、図１の基板２のＬＥＤ素子取付面３の片側に４枚設けた平板状の放熱フィン１０、１１に加えて、更に、他方の裏面４側にも、ＬＥＤ素子取付面３と対照に、放熱フィン１２、１３を２枚ずつ４枚、合計で８枚の枚数の好ましい上限だけ設けている。
Figure 2:
The plate-shaped heat radiation fin of FIG. 2 is a form in which heat radiation fins are provided not only on one side of the LED element mounting surface (front surface) 3 of the substrate 2 as shown in FIG. 1 but also on the other back surface 4 side of the substrate 2. Is shown. Specifically, in addition to the flat plate-like heat radiation fins 10 and 11 provided on one side of the LED element mounting surface 3 of the substrate 2 in FIG. 1, the LED element mounting surface 3 is also provided on the other back surface 4 side. In contrast, the number of the radiation fins 12 and 13 is set to four, two by two, which is a preferable upper limit of a total of eight.
これら裏面４側に設けられた放熱フィン１２、１３は、前記基板２のＬＥＤ素子取付面３の側に４枚設けた平板状の放熱フィン１０、１１と全く同様で、かつ図の上下方向で対称な配置をしている。すなわち、ＬＥＤ素子９を間に挟んで対称的に２枚ずつ、図の左右側の放熱フィン１２、１２同士、および図の上下側の放熱フィン１３、１３同士、互いに同じ方向に向いて延在する態様として、互いに平行に並んで設けられている。すなわち、裏面４側でも、互いに対向する平板状の放熱フィン１２、１２同士が、また１３、１３同士が、ＬＥＤ素子取付面３である表面側の平板状の放熱フィン１０、１０同士や１１、１１同士と同様に、裏面側のＬＥＤ素子９取り付け位置に相当する位置を中間に挟む位置に形成されている。言い換えると、平板状の放熱フィンが基板２の表裏の両方の面に、ＬＥＤ素子９を中間に挟む位置に形成されている。そして、これら放熱フィン１２、１３のうち、互いに同じ方向に向いて延在するフィンの枚数が、基板２の面４に直交する任意の断面においても（この方向の断面で切断したヒートシンク１のいずれの断面においても）２枚としている。 The heat radiation fins 12 and 13 provided on the back surface 4 side are exactly the same as the plate-shaped heat radiation fins 10 and 11 provided on the LED element mounting surface 3 side of the substrate 2 and in the vertical direction of the figure. It has a symmetrical arrangement. That is, two radiating fins 12 and 12 on the left and right sides of the drawing and two radiating fins 13 and 13 on the upper and lower sides of the drawing extend in the same direction symmetrically with the LED element 9 in between. As an aspect to perform, they are provided in parallel with each other. That is, even on the back surface 4 side, the flat plate-shaped heat radiation fins 12, 12 facing each other, and the plate-shaped heat radiation fins 10, 10, 11, 11, 13, 13 are the LED element mounting surface 3. Similarly to 11, it is formed at a position sandwiching a position corresponding to the attachment position of the LED element 9 on the back side. In other words, the plate-shaped radiating fins are formed on both the front and back surfaces of the substrate 2 at positions where the LED elements 9 are sandwiched between them. The number of fins extending in the same direction among the radiating fins 12 and 13 is not limited to any one of the heat sinks 1 cut along the cross section in this direction. (Even in the cross section), the number is 2.
このような、裏面４のＬＥＤ素子９の取り付け対応位置を中心とした矩形状四周囲を放熱フィン１２、１３が、隣り合う放熱フィン同士が互いに直交（直角に交差）した形で取り囲み、熱の放射率が大きな放熱フィン１２、１３の各平板状側面がＸ方向、Ｚ方向に各々向いている。そして、基板２の、熱の放射率が大きなＬＥＤ素子取付面３と他方の裏面４がＹ方向を向いている。
この他、基板２の四周囲の板厚方向の各面５、６、７、８や、前記基板２のＬＥＤ素子取付面３の側に４枚設けた平板状の放熱フィン１０、１１の板厚方向の各面（上面、両端部面）だけでなく、裏面４側の各放熱フィン１２、１３の板厚方向の各面（下面、両端部面）も熱の放射面となる。これら各放熱フィンの板厚方向の各面は面積的には比較的小さいが、上下面、両端部面とも、面の数は図１の２倍になり、Ｘ、Ｙ、Ｚの各方向へ各々合計で８面ずつ向いており、これらの方向への熱の放射面となる。
The rectangular surroundings of the LED element 9 on the back surface 4 centered around the mounting position are surrounded by the radiation fins 12 and 13 so that adjacent radiation fins are orthogonal to each other (crossing at right angles). The flat plate-like side surfaces of the radiation fins 12 and 13 having high emissivity are directed in the X direction and the Z direction, respectively. The LED element mounting surface 3 and the other back surface 4 of the substrate 2 having a large heat emissivity are directed in the Y direction.
In addition to this, the plates 5, 6, 7, 8 in the plate thickness direction around the four sides of the substrate 2, and four plate-like heat radiation fins 10, 11 provided on the LED element mounting surface 3 side of the substrate 2. Not only each surface in the thickness direction (upper surface, both end surfaces) but also each surface in the plate thickness direction (lower surface, both end surfaces) of each radiating fin 12, 12 on the back surface 4 side is a heat radiation surface. Each surface in the plate thickness direction of each of these radiating fins is relatively small in area, but the number of surfaces on both the upper and lower surfaces and both end surfaces is twice that in FIG. 1, and in each direction of X, Y, and Z Each of them faces a total of 8 surfaces, and becomes a radiation surface of heat in these directions.
したがって、図２の場合も、これらＸ、Ｙ、Ｚの３次元方向のいずれの方向においても、特に放熱フィンの放熱面が重複することが無く、材料のムダがなく、空間占有率が低い割りに、熱の高い放射効率が得られる。 Therefore, in the case of FIG. 2 as well, in any of these three-dimensional directions of X, Y, and Z, the heat radiation surfaces of the heat radiation fins do not overlap, there is no material waste, and the space occupation ratio is low. In addition, high radiation efficiency of heat can be obtained.
図３、４、５：
図３、４、５の平板状の放熱フィンは、枚数が上限である図２の場合から、基板２のＬＥＤ素子取付面３の片側、あるいは基板２の他方の裏面４側の、いずれかの放熱フィンを省いた実施形態を示している。
Figures 3, 4, 5:
3, 4, and 5, the flat plate-like radiating fin is either on the one side of the LED element mounting surface 3 of the substrate 2 or on the other back surface 4 side of the substrate 2 from the case of FIG. The embodiment which omitted the radiation fin is shown.
図３は、図２の放熱フィンの配置に対して、基板２のＬＥＤ素子取付面３側を、放熱フィン１１の２枚のうち図の下側の１枚を省いた３枚としている。そして、他方の裏面４側も、図の上下方向での非対称な放熱フィンの配置として、放熱フィン１２の２枚のうち図の左側の１枚を省いた３枚とし、合計で６枚の放熱フィンを設けている。 In FIG. 3, the LED element mounting surface 3 side of the substrate 2 in the arrangement of the heat dissipating fins in FIG. 2 is three, excluding the lower one of the two heat dissipating fins 11. The other back surface 4 side also has three asymmetrical heat dissipating fins arranged in the vertical direction in the figure, with three of the two heat dissipating fins 12 excluding the left one in the figure, and a total of six heat dissipating elements. Fins are provided.
図４は、図２の放熱フィンの配置に対して、基板２のＬＥＤ素子取付面３側を、図の上下側の放熱フィン１１、１１の２枚を省いた、図の左右側の放熱フィン１０、１０の２枚のみとしている。そして、他方の裏面４側も、図の上下方向での対称な放熱フィンの配置を維持して、図の上下側の放熱フィン１３、１３の２枚を省いた、図の左右側の放熱フィン１２、１２の２枚のみとし、合計で４枚の放熱フィンを設けている。 FIG. 4 shows the arrangement of the radiation fins of FIG. 2, and the LED element mounting surface 3 side of the substrate 2 is omitted from the radiation fins 11, 11 on the upper and lower sides of the figure. 10 and 10 only. And the other back surface 4 side also maintains the symmetrical arrangement of the radiating fins in the vertical direction in the figure, and omits the two radiating fins 13 in the upper and lower sides in the figure, and the left and right radiating fins in the figure. Only two of 12 and 12 are provided, and a total of four radiating fins are provided.
図５は、図２の放熱フィンの配置に対して、基板２のＬＥＤ素子取付面３側を、図の上下側の放熱フィン１１、１１の２枚を省いた、図の左右側の放熱フィン１０、１０の２枚のみとしている点は図４と同じである。そして、図の上下方向での非対称な放熱フィンの配置として、他方の裏面４側を、図の左右側の放熱フィン１２、１２の２枚を省いた、図の上下側の放熱フィン１３、１３の２枚のみとし、合計で４枚の放熱フィンを設けている。 FIG. 5 shows the heat dissipating fins on the left and right sides of the figure, with the LED element mounting surface 3 side of the substrate 2 being omitted from the heat dissipating fins 11 and 11 on the upper and lower sides of the figure, compared to the arrangement of the heat dissipating fins of FIG. 4 and 10 are the same as in FIG. And as arrangement | positioning of the asymmetrical radiation fin in the up-down direction of a figure, the heat sink fins 13 and 13 on the up-and-down side of a figure which omitted the 2 sheets of the radiation fins 12 and 12 of the left-right side of the figure on the other back surface 4 side These are only two, and a total of four radiating fins are provided.
図６、７：
図６、７に示すＬＥＤ照明用ヒートシンク１は、例えばアルミニウムなどの、一定の板厚を有する金属薄板から、基板２（面３、４）、平板状の放熱フィン１０〜１２を一体に成形してなる実施形態を示している。
Figures 6 and 7:
The heat sink 1 for LED illumination shown in FIGS. 6 and 7 is formed by integrally forming a substrate 2 (surfaces 3 and 4) and flat plate-like heat radiation fins 10 to 12 from a thin metal plate having a certain plate thickness such as aluminum. An embodiment is shown.
この場合、平板状の放熱フィン１０〜１２は、基板２の端部側から、それぞれの面の延在方向であるＺ方向（図の上下方向）に向かって折り曲げ加工されて、材料的に一体に形成される。図６はフィン１０、１０、１１、１１が互いに向き合う形に、図の上方側に折り曲げられている。図７はフィン１１、１１が互いに向き合う形に図の上方側に、フィン１０、１０が互いに向き合う形に図の下方側に、折り曲げられている。そして、これら平板状の放熱フィン１０〜１２の配置や枚数は、図６は図１の場合と、図７は図５の場合と同じである。但し、放熱フィン１０、１１が基板２の端部を折り曲げてできているゆえに、基板２の端部に各々位置している配置構造は異なる。 In this case, the flat radiating fins 10 to 12 are bent from the end side of the substrate 2 toward the Z direction (the vertical direction in the figure), which is the extending direction of each surface, and are integrally formed as a material. Formed. In FIG. 6, the fins 10, 10, 11, and 11 are bent upward in the figure so as to face each other. In FIG. 7, the fins 11 and 11 are bent on the upper side of the figure so as to face each other, and the fins 10 and 10 are bent on the lower side of the figure so as to face each other. The arrangement and the number of these flat radiating fins 10 to 12 are the same as those in FIG. 1 for FIG. 6 and FIG. 5 for FIG. However, since the radiating fins 10 and 11 are formed by bending the end portions of the substrate 2, the arrangement structures located at the end portions of the substrate 2 are different.
放熱の原理、作用：
このような本発明のヒートシンク１を、空気の対流のない空間に設置してＬＥＤ照明を行う場合の放熱の原理（作用）について説明する。ＬＥＤ素子取付面３に装着されたＬＥＤ素子９を発光させると、これに伴ってＬＥＤ素子９の発する熱（熱流束）Ｑが、基板２のＬＥＤ素子取付面３に、ＬＥＤ素子９の底部の装着部（図示せず）を通じて伝導される。これに引き続き，ＬＥＤ素子取付面３に伝導された熱Ｑは、取付面３側の放熱フィン１０、１１だけでなく、裏面４や、この裏面４側の放熱フィン１２、１３にも、前記した各放熱面に連続して速やかに（遅滞無く）、しかもほぼ等しく高いレベルで伝達（伝導）される。このため、これらフインの放熱表面からの対流、そして特に放射による放熱が等しく一定レベル以上で行われ、放熱効率を高めることができる。
Principle and action of heat dissipation:
The principle (action) of heat dissipation when the heat sink 1 of the present invention is installed in a space without air convection to perform LED illumination will be described. When the LED element 9 mounted on the LED element mounting surface 3 is caused to emit light, the heat (heat flux) Q generated by the LED element 9 along with this is generated on the LED element mounting surface 3 of the substrate 2 at the bottom of the LED element 9. Conducted through a mounting (not shown). Subsequently to this, the heat Q conducted to the LED element mounting surface 3 is not only applied to the radiation fins 10 and 11 on the mounting surface 3 side, but also to the rear surface 4 and the radiation fins 12 and 13 on the rear surface 4 side. It is transmitted (conducted) to each heat-dissipating surface quickly (without delay) and almost equally at a high level. For this reason, the convection of these fins from the heat radiating surface, and in particular, the heat radiated by radiation is equally performed at a certain level or higher, and the heat radiation efficiency can be improved.
前記本発明の規定の通り、放熱フィン１０〜１３は、互いに同じ方向に向いて延在するフィンの枚数が、基板２の面３、４に直交する任意の断面においても２枚以下とされ、同じ方向に過度に重なり合ってはいない。したがって、前記伝達された熱Ｑは、Ｘ、Ｙ、Ｚの３次元方向に各々向くとともに、基板２の取付面３や裏面４、放熱フィン１０〜１３の前記各放熱面の表面などから、周囲の閉鎖空間（放熱空間）に各々速やかで効率的に放射される。したがって、ＬＥＤ素子９の発する熱は３次元のＸ、Ｙ、Ｚのいずれの方向へも、放熱量が一定以上の高い放射効率で放熱される。これは、本発明のヒートシンク１が、放熱フィン１０〜１３の枚数が少ない割には、そして、その放熱の効率が放射によって支配される空気対流の少ない、照明具内の閉鎖された放熱空間においても、Ｘ、Ｙ、Ｚの方向のどの方向に対する各投影面積も大きいからである。本発明のヒートシンク１は、放熱フィン１０〜１３の枚数が少ない簡単な構造でありながら、放熱単位面積当たりの放熱効率が良いという優れた特性を有する。 As defined in the present invention, the number of fins extending in the same direction in the heat radiation fins 10 to 13 is two or less in any cross section orthogonal to the surfaces 3 and 4 of the substrate 2, There is no excessive overlap in the same direction. Accordingly, the transmitted heat Q is directed in the three-dimensional directions of X, Y, and Z, and from the mounting surface 3 and the back surface 4 of the substrate 2 and the surface of each of the heat radiation surfaces of the heat radiation fins 10 to 13. Are quickly and efficiently radiated to each closed space (heat radiation space). Therefore, the heat generated by the LED element 9 is dissipated in a three-dimensional X, Y, and Z direction with a high radiation efficiency in which the heat dissipation amount is a certain level or more. This is because the heat sink 1 of the present invention has a small heat radiating fins 10 to 13 in a closed heat radiating space in the lighting fixture in which the heat radiating efficiency is controlled by radiation and the air convection is small. This is because each projected area in any of the X, Y, and Z directions is large. The heat sink 1 of the present invention has an excellent characteristic that heat dissipation efficiency per unit area of heat dissipation is good while having a simple structure with a small number of heat dissipating fins 10 to 13.
車載照明用のハウジングの狭い空間内乃至閉鎖空間内で必要とされる、放射による放熱の場合には、図１〜図１０の左下あるいは右下に表示したＸ、Ｙ、Ｚ軸方向（３次元方向）での投影面積の大きさがその効率を左右することになり、この投影面積が大きいほど、熱の放射効率が向上することになる。 In the case of heat radiation by radiation, which is required in a narrow space or closed space of a housing for in-vehicle lighting, the X, Y, and Z axis directions (three-dimensional) displayed in the lower left or lower right of FIGS. The size of the projected area in (direction) affects the efficiency, and the larger the projected area, the better the heat radiation efficiency.
この点、図８〜図１０の従来例あるいは比較例のヒートシンクＨは、Ｙ方向の投影面積は、基板部３０の平面とフィン部４０の上側の平面との合計となるので、フィン部４０同士の重なりがないので、材料のムダがなく、投影面積が大きい。しかし、Ｚ方向の投影面積は、基板部３０の側面とフィン部４０の側面との合計となり、櫛歯状となり空間が多いため、基板部３０の長さとフィン部４０の高さを掛けた総面積の５０％に満たない小さな面積となる。また、Ｘ方向の投影面積は、基板部３０の正面とフィン部４０の正面の合計となり、フィン部３０が例えば４枚もあるにもかかわらず、これらが重複して１枚と同じ投影面積であり、材料のムダが多く、放熱面積当りの熱の放射効率が低い。すなわち、Ｘ方向においては、多数のフィンが重複して空間を占有しているが、この空間占有率が高い割には投影面積が小さく、熱の放射効率が低い。更には、このＸ方向フィンの枚数が過剰で、この過剰なフィンのために材料のムダも大きく、重量が重くなる問題もある。 In this respect, the heat sink H of the conventional example or the comparative example of FIGS. 8 to 10 has a projected area in the Y direction that is the sum of the plane of the substrate section 30 and the upper plane of the fin section 40, so Therefore, there is no waste of material and the projected area is large. However, since the projected area in the Z direction is the sum of the side surface of the substrate portion 30 and the side surface of the fin portion 40 and has a comb-like shape with a lot of space, the total of the length of the substrate portion 30 and the height of the fin portion 40 is multiplied. The area is less than 50% of the area. Further, the projected area in the X direction is the total of the front surface of the substrate portion 30 and the front surface of the fin portion 40. Even though there are, for example, four fin portions 30, these overlap and have the same projected area as one. There are many wastes of material, and the heat radiation efficiency per heat radiation area is low. That is, in the X direction, a large number of fins overlap and occupy the space, but the projection area is small and the heat radiation efficiency is low for this high space occupancy. Furthermore, there is a problem that the number of fins in the X direction is excessive, and the excessive fins increase the waste of material and increase the weight.
言い換えると、図８〜図１０の従来例あるいは比較例のヒートシンクＨは、Ｘ、Ｙ、Ｚ軸方向（３次元方向）のいずれかの方向の熱の放射効率が必ず低くなる。この結果、３次元方向のいずれの方向の熱の放射効率を高めることができないので、総合的な熱の放射効率が低くなる。また、前記したＸ方向などでフィンの枚数が過剰となって材料のムダも大きい。すなわち、これら従来技術に共通するのは、ヒートシンクの三次元のいずれの方向においても、材料のムダがなく、空間占有率が低い割りに、熱の放射効率が高いヒートシンクとはできなかったいう点である。 In other words, the heat radiation efficiency of the heat sink H of the conventional example or the comparative example of FIGS. 8 to 10 is necessarily low in the heat radiation efficiency in any of the X, Y, and Z axis directions (three-dimensional directions). As a result, the heat radiation efficiency in any one of the three-dimensional directions cannot be increased, so that the overall heat radiation efficiency is lowered. In addition, the number of fins is excessive in the X direction and the like, and material waste is large. In other words, what is common to these prior arts is that in any of the three-dimensional directions of the heat sink, there was no waste of material, and although the space occupancy was low, it could not be a heat sink with high heat radiation efficiency. It is.
ちなみに、この点は、前記特許文献５も同様であって、多数配列されたコの字状のひしゃく部分の放熱部が重複する方向では、空間占有率が高い割に、熱の放射効率が低く、３次元の３つの方向の総合的な熱の放射効率からすると、特にＸ方向の材料のムダが多い。また、前記スリット状の開口部の幅には、ヒートシンクの大きさ自体や前記放熱部の側の面積を確保するための大きな制約があって、必然的に狭幅となるため、閉鎖された空間内に適用される場合、空気の対流による放熱効率の向上も、実際に期待するほどには発揮されない。 Incidentally, this point is the same as in Patent Document 5, and in the direction where the heat radiation portions of the U-shaped ladle portions arranged in large numbers overlap, the heat radiation efficiency is low although the space occupancy is high. Considering the overall heat radiation efficiency in three directions in three dimensions, there is a lot of waste of material in the X direction in particular. In addition, the width of the slit-shaped opening has large restrictions for securing the size of the heat sink itself and the area on the side of the heat radiating portion, and inevitably becomes a narrow width. When applied to the inside, the improvement of the heat radiation efficiency by the convection of air is not exhibited as much as actually expected.
本発明ヒートシンクは、周囲の放熱空間が閉鎖されて容積が小さく空気の対流がほとんどないような使用（設置）状態で、空気の対流による放熱がほとんど期待できない使用（設置）環境で最適である。このような使用環境では、放熱のためには、放射による放熱を中心とする必要があり、フィンなどの放熱面表面積の増加によって空気の対流を主たる放熱性能とする、前記従来のヒートシンク構造では、この放射による放熱が不十分となり、全体として効率的な放熱が達成できない。これに対して、本発明ヒートシンクは、前記放熱側面などの放熱面からの熱の放射による放熱が主体であり、空気の対流による放熱がほとんど期待できない使用（設置）環境に最適なヒートシンクと言える。 The heat sink of the present invention is optimal in a use (installation) environment in which the heat dissipation by the air convection is hardly expected in a use (installation) state where the surrounding heat dissipation space is closed and the volume is small and there is almost no air convection. In such a use environment, for heat dissipation, it is necessary to focus on heat dissipation by radiation, and in the conventional heat sink structure, which is mainly heat dissipation performance of convection of air by increasing the surface area of the heat dissipation surface such as fins, Heat radiation due to this radiation becomes insufficient, and efficient heat radiation cannot be achieved as a whole. On the other hand, the heat sink of the present invention is a heat sink that is optimal for use (installation) environments where heat dissipation by heat radiation from the heat radiating surface such as the heat radiating side is mainly used and heat dissipation by air convection is hardly expected.
しかも、ＬＥＤ素子取り付け面３と放熱フィンを含めた各放熱面が、その間に接合面を介さない一体構造であるため、別個に製作されたこれら両者を接合する場合に発生するような接触熱抵抗が生じない。このため、ＬＥＤ素子取り付け面３と各放熱面の間の熱伝導が容易で、結果としてヒートシンク全体の放熱性能が著しく高くなる。また、ヒートシンク１の構造が、放熱フィンが３次元のＸ、Ｙ、Ｚのいずれの方向へも向いている構造ゆえに剛性が高い。このため、車載照明等において振動を受けるような用途であっても、特段の補強部材等を用いることなく、その形状を保つことができ、メンテナンスフリーや高寿命化を達成できる。 Moreover, since each heat radiating surface including the LED element mounting surface 3 and the heat radiating fins has an integral structure without a joint surface therebetween, contact thermal resistance that occurs when both of these manufactured separately are joined. Does not occur. For this reason, heat conduction between the LED element mounting surface 3 and each heat radiating surface is easy, and as a result, the heat radiating performance of the entire heat sink is remarkably enhanced. Further, the structure of the heat sink 1 is highly rigid because the heat radiating fins are oriented in any of the three-dimensional X, Y, and Z directions. For this reason, even if it is a use which receives a vibration in vehicle-mounted illumination etc., the shape can be maintained without using a special reinforcement member etc., and maintenance-free and lifetime improvement can be achieved.
実施形態の共通事項：
以上説明した、基板２の取付面３や裏面４、放熱フィン１０〜１３の各放熱面に、ヒートシンク１の用途や取り付け部位に応じて、部品取付け用の空間やスリットあるいは部分形状などが、これら各面の一部に、これらの面を切り欠く加工や、凹凸あるいは段差などを設ける三次元の成形加工によって設けられても良い。更には、放熱側面は、部品取付け等の必要に応じて、各面の一部が省略あるいは形状が変更されていても良い。
Common items of the embodiment:
The mounting surface 3 and back surface 4 of the substrate 2 and the heat radiating surfaces of the heat radiating fins 10 to 13 are provided with space for mounting components, slits or partial shapes, etc. A part of each surface may be provided by a process of cutting out these surfaces, or a three-dimensional forming process in which unevenness or a step is provided. Furthermore, as for the heat radiating side surface, a part of each surface may be omitted or the shape may be changed according to the necessity of component mounting or the like.
本発明のヒートシンク１は、優れた放熱効果を、ヒートシンクの形状、構造、特に、放熱フィンの形状、構造を複雑化させず、放熱フィンの数を多くせず、逆に、構造を単純化し、放熱フィンの数を少なくすることによって達成できる。この結果、種々の素材材料や製造方法あるいは製造工程を選択することができ、安価でつくりやすいヒートシンクを提供することができる。素材、材料は、例えば、アルミニウム（純アルミニウム）やアルミニウム合金、銅（純銅）や銅合金、鋼板、樹脂、セラミックなどの種々の素材材料や、板を素材とする絞り加工、折り曲げ加工、ダイキャストや鋳造、鍛造、押出などの製造方法あるいは製造工程を選択することができる。 The heat sink 1 of the present invention has an excellent heat dissipation effect, the shape and structure of the heat sink, in particular, the shape and structure of the heat dissipation fins are not complicated, the number of heat dissipation fins is not increased, and conversely the structure is simplified. This can be achieved by reducing the number of radiating fins. As a result, various material materials, manufacturing methods, or manufacturing processes can be selected, and a heat sink that is inexpensive and easy to manufacture can be provided. Materials and materials include, for example, aluminum (pure aluminum), aluminum alloys, copper (pure copper), copper alloys, steel plates, resins, ceramics, and other raw materials, drawing, bending, and die casting. Or a manufacturing method or manufacturing process such as casting, forging, or extrusion can be selected.
（アルミニウム）
ただ、ヒートシンク１としての必要特性である、強度、剛性、軽量化、耐食性、熱伝達性、熱放熱性、加工性などを兼備する素材としては、アルミニウム（純アルミニウム）やアルミニウム合金が好ましい。アルミニウム（純アルミニウム）やアルミニウム合金は、ヒートシンクに求められる熱伝導特性と放熱特性が特に大きく、ＡＡ乃至ＪＩＳ規格に規定される１０００系の純アルミニウムが好ましい。
(aluminum)
However, aluminum (pure aluminum) or an aluminum alloy is preferable as a material having strength, rigidity, weight reduction, corrosion resistance, heat transfer property, heat radiation property, workability and the like, which are necessary characteristics as the heat sink 1. Aluminum (pure aluminum) and aluminum alloys have particularly large heat conduction characteristics and heat dissipation characteristics required for heat sinks, and 1000 series pure aluminum specified in AA to JIS standards is preferable.
基板２、放熱フィン１０〜１３の板厚（厚み）、あるいは素材が金属薄板の場合の板厚（厚み）は、ヒートシンクの軽量化や、必要強度や剛性および絞り加工性（成形性）を考慮すると、０.４ｍｍ〜４ｍｍの範囲から選択することが好ましい。この板厚が薄すぎると、ヒートシンクの必要強度や剛性あるいは加工性（成形性）が確保できない。一方、この板厚が厚すぎると、ヒートシンクの軽量化が犠牲になる。 The thickness (thickness) of the substrate 2 and the radiation fins 10 to 13 or the thickness (thickness) when the material is a metal thin plate takes into consideration the weight reduction of the heat sink, the required strength and rigidity, and the drawability (formability). Then, it is preferable to select from a range of 0.4 mm to 4 mm. If this plate thickness is too thin, the required strength, rigidity or workability (formability) of the heat sink cannot be ensured. On the other hand, if this plate thickness is too thick, weight reduction of the heat sink is sacrificed.
（放熱面の表面放射率）
本発明のヒートシンクが高い放熱性を得るためには、前記金属薄板の表面放射率εは０．６以上であることが好ましい。このため、素材金属薄板の全表面に、絞り加工前に放熱率が高い、黒色、グレー、白色などの塗料のプレコート処理（塗装皮膜）を施しても良い。あるいは絞り加工後に、放射率が高いこれら塗料のアフターコート処理（塗装皮膜）を施しても良い。これによって、ヒートシンクとしての、放射による伝達熱量を増大することができる。このプレコート処理は、絞り加工前に予め素材金属薄板に施せば、絞り加工における潤滑剤の役割も果たす。
(Surface emissivity of heat dissipation surface)
In order for the heat sink of the present invention to obtain high heat dissipation, the surface emissivity ε of the metal thin plate is preferably 0.6 or more. For this reason, you may perform the precoat process (painting film) of coating materials, such as black, gray, white, etc. with a high heat dissipation rate, before drawing processing on the whole surface of a raw metal thin plate. Alternatively, after the drawing process, after-coating (paint film) of these paints having high emissivity may be performed. Thereby, the amount of heat transferred by radiation as a heat sink can be increased. This pre-coating process also serves as a lubricant in the drawing process if it is applied to the metal sheet in advance before the drawing process.
この放射率εとは、実際の物体の熱放射の理論値（理想的な熱放射体である黒体の熱放射）に対する割合であって、実際の測定は、特開２００２−２３４４６０号公報に記載された方法でもよく、市販のポータブル放射率測定装置によって測定してもよい。 This emissivity ε is a ratio with respect to a theoretical value of thermal radiation of an actual object (a thermal radiation of a black body which is an ideal thermal radiator), and actual measurement is disclosed in Japanese Patent Application Laid-Open No. 2002-234460. The described method may be used, and measurement may be performed by a commercially available portable emissivity measuring apparatus.
（車載ランプへの装着）
車載ＬＥＤランプなどへの本発明ヒートシンクの装着は、これまで汎用されているヒートシンクの装着と同様に行うことができ、この点が利点でもある。通常、車載ＬＥＤランプ（車両用灯具）は、光源としてのＬＥＤ素子が実装されたＬＥＤ基板、ＬＥＤからの光を光照射方向前方に向かって反射するリフレクタ、これらのＬＥＤ基板及びリフレクタを包囲するハウジング、ハウジングの開放した前端を閉鎖する透明材料から成るアウターレンズ、ＬＥＤ基板に熱的に接触して配置されたヒートシンクなどを含んでいる。前記リフレクタは、金属や樹脂材料などから形成されていて、ＬＥＤ基板上のＬＥＤ付近に焦点を有する放物面状の反射面を備えている。ここで、本発明のヒートシンクは、前記ＬＥＤ基板あるいはＬＥＤ基板に熱的に接触して配置されたヒートシンクとして用いられる。この場合でも、車載ＬＥＤランプとして、本発明ヒートシンクは、従来のヒートシンクのような空気に熱伝達された空気の対流による放熱ではなく、熱の放射による放熱が主体である点が大きく異なる。
(Mounting on vehicle lamp)
The mounting of the heat sink of the present invention to an in-vehicle LED lamp or the like can be performed in the same manner as the mounting of a heat sink that has been widely used so far, and this is also an advantage. Usually, an in-vehicle LED lamp (vehicle lamp) includes an LED board on which an LED element as a light source is mounted, a reflector that reflects light from the LED forward in the light irradiation direction, and a housing that surrounds the LED board and the reflector. And an outer lens made of a transparent material for closing the open front end of the housing, a heat sink disposed in thermal contact with the LED substrate, and the like. The reflector is formed of a metal or a resin material, and includes a parabolic reflecting surface having a focal point in the vicinity of the LED on the LED substrate. Here, the heat sink of the present invention is used as the LED substrate or a heat sink disposed in thermal contact with the LED substrate. Even in this case, as a vehicle-mounted LED lamp, the heat sink of the present invention is largely different from the heat dissipation by the radiation of heat, not the heat dissipation by the convection of air that is transferred to the air like the conventional heat sink.
前記図６、図２の各発明例、前記図８、９の従来例や図１０の比較例の各形状のヒートシンクを各々実際に製造し、ＬＥＤ素子を装着して、電流を加え、発光させた上で、ＬＥＤ素子の温度を測定した。この結果を表１に示す。 The heat sinks of the respective shapes of the invention examples of FIGS. 6 and 2, the conventional examples of FIGS. 8 and 9 and the comparative example of FIG. 10 are actually manufactured, LED elements are mounted, current is applied, and light is emitted. After that, the temperature of the LED element was measured. The results are shown in Table 1.
前記図２の発明例、前記図８、９、１０の従来例や比較例の各形状のヒートシンクは、素材のＪＩＳの１１００系アルミニウムの押出棒材から切削加工などの機械加工により製造した。前記図６の発明例のヒートシンクのみは、プレス成形にてＪＩＳの１１００系アルミニウム冷延板の端部を放熱フィンに折り曲げ加工して製造した。 The heat sinks of the respective shapes of the invention example of FIG. 2, the conventional examples of FIGS. 8, 9, and 10 and the comparative example were manufactured by machining such as cutting from extruded JIS 1100 series aluminum bar material. Only the heat sink of the invention example of FIG. 6 was manufactured by bending an end portion of a JIS 1100 series aluminum cold-rolled plate into a heat radiating fin by press molding.
各例とも共通して、基板の矩形形状の大きさは１００ｍｍ（Ｚ方向）×１００ｍｍ（Ｘ方向）×板厚２ｍｍ、放熱フィンの矩形形状は７０ｍｍ（平板状側面のＺ方向の長さ）×３０ｍｍ（平板状側面のＹ方向の高さ）×板厚２ｍｍとした。発明例の互いに平行な放熱フィン同士、左右側の１０と１０、上下側の１１と１１の間隔は８０ｍｍ以上とした（ＬＥＤ素子中心からの距離は３５ｍｍ以上）。従来例、比較例の隣り合う放熱フィン同士の間隔は１０ｍｍとした。また、各例とも共通して、表面には、市販の黒色のカチオン系樹脂皮膜を電着塗装した。このときの表面放射率は、宇宙航空研究開発機構が開発した市販のポータブル放射率測定装置で測定すると各例とも基板２と放熱フィン１０〜１３の各放熱面はいずれも共通して同じ０．８６であった。 In common with each example, the size of the rectangular shape of the substrate is 100 mm (Z direction) × 100 mm (X direction) × plate thickness 2 mm, and the rectangular shape of the radiation fin is 70 mm (the length of the flat plate side surface in the Z direction) × 30 mm (the height in the Y direction of the flat plate side surface) × the plate thickness was 2 mm. The intervals between the parallel heat radiation fins of the invention example, the left and right sides 10 and 10, and the upper and lower sides 11 and 11 were 80 mm or more (the distance from the center of the LED element was 35 mm or more). The interval between adjacent heat dissipating fins in the conventional example and the comparative example was 10 mm. Further, in common with each example, a commercially available black cationic resin film was electrodeposited on the surface. When the surface emissivity at this time is measured by a commercially available portable emissivity measuring device developed by the Japan Aerospace Exploration Agency, the heat radiation surfaces of the substrate 2 and the heat radiation fins 10 to 13 are the same in each example. 86.
各例とも共通して、基板市販のＬＥＤ素子を装着した上で、直流電源より、３．７Ｖ、０．８５Ａの電流を加えてＬＥＤ素子を発光させた。この際、ＬＥＤ素子の温度を熱電対でモニタしながら、車載ＬＥＤランプの空気の対流の無い閉空間を模擬した３００ｍｍ×３００ｍｍ×３００ｍｍの木製の筒体内にヒートシンクを密閉して置き、２０℃とした室内雰囲気中で発光させた。そして、一定時間経過後に上昇あるいは下降せずに定常状態となった温度を計測した。計測は各例とも５回行い、その平均温度を求めて評価した。 In common with each example, a commercially available LED element was mounted, and a current of 3.7 V and 0.85 A was applied from a DC power source to cause the LED element to emit light. At this time, while monitoring the temperature of the LED element with a thermocouple, the heat sink was hermetically sealed in a 300 mm × 300 mm × 300 mm wooden cylinder simulating a closed space without air convection of the vehicle LED lamp, and 20 ° C. Light was emitted in the indoor atmosphere. And the temperature which became a steady state, without rising or falling after progress for a fixed time was measured. Each example was measured five times, and the average temperature was obtained and evaluated.
表１に示す通り、前記図６、図２に相当する発明例１、２は、車載ＬＥＤランプの空気の対流の無い閉空間の中でも、定常時のＬＥＤ素子温度は、素子の発光効率が低下しない許容温度が例示した前記１００℃以下の、４２℃以下の極めて低温に保持できており、熱の放射による優れた放熱性能（冷却性能）を有することが確認できた。ちなみに、フィンの枚数が、好ましい上限の８枚と多い図２の発明例２の方が、フィンの枚数が４枚の図６の発明例２よりも、当然ながら放熱能が優れるが、重量は重くなり、放熱効率の点では大差ない。 As shown in Table 1, inventive examples 1 and 2 corresponding to FIGS. 6 and 2, the LED element temperature in the steady state reduces the luminous efficiency of the element even in the closed space without air convection of the in-vehicle LED lamp. It was confirmed that the permissible temperature could be kept at an extremely low temperature of 42 ° C. or lower, which is 100 ° C. or lower as exemplified, and had excellent heat dissipation performance (cooling performance) due to heat radiation. Incidentally, the invention example 2 in FIG. 2, which has the preferred number of fins of eight, is naturally superior to the invention example 2 in FIG. 6 in which the number of fins is four, but the weight is It becomes heavier and there is not much difference in terms of heat dissipation efficiency.
一方、前記図８、９に相当する従来例１、２や、前記図１０に相当する比較例３のヒートシンクは、定常時のＬＥＤ素子温度は、許容温度１００℃以下ではあるが、発明例よりも高温となっている。この結果、車載ＬＥＤランプの空気の対流の無い閉空間の中では、熱の放射による放熱性能（冷却性能）が、発明例よりも劣ることが確認できた。なお、これら一連の試験は、実際の車に搭載時に想定されるエンジンや熱交換器、各種の電気機器からの入熱、直射日光による入熱などが考慮されていない。このため、ＬＥＤ素子温度は、実際の車載ＬＥＤ（実車搭載ＬＥＤ）でのＬＥＤ素子温度よりも低めに出ていると考えられる。ただ、これら一連の試験は、ヒートシンクの性能比較としては十分な精度と再現性とを有する。 On the other hand, the heat sinks of the conventional examples 1 and 2 corresponding to FIGS. 8 and 9 and the heat sink of the comparative example 3 corresponding to FIG. 10 have a steady LED element temperature of an allowable temperature of 100 ° C. or less. Is also hot. As a result, it was confirmed that the heat radiation performance (cooling performance) due to heat radiation was inferior to that of the invention example in a closed space without air convection of the in-vehicle LED lamp. These series of tests do not take into account the heat input from an engine, heat exchanger, various electric devices, heat input by direct sunlight, etc. that are assumed when mounted in an actual vehicle. For this reason, it is thought that LED element temperature has come out lower than the LED element temperature in actual vehicle-mounted LED (real vehicle mounting LED). However, these series of tests have sufficient accuracy and reproducibility as a performance comparison of heat sinks.
以上の事実から、本発明ヒートシンクの特に放熱フィンの枚数と配置との規定の臨界的な意義が裏づけられる。 From the above facts, the critical significance of the definition of the number and arrangement of the radiating fins of the heat sink of the present invention is supported.
以上、本発明ヒートシンクは、前記放熱側面などの放熱面からの熱の放射による放熱が主体であり、空気対流がほとんどない（空気の対流による放熱がほとんど期待できない）狭い使用空間（使用、設置環境）に最適なヒートシンクである。このため、車載ＬＥＤランプなど車両用照明灯具向け放熱部品に使用することができる。 As described above, the heat sink of the present invention is mainly radiated by radiation of heat from the radiating surface such as the radiating side, and has almost no air convection (almost no heat radiated by air convection can be expected). ) Is the best heat sink. For this reason, it can be used for the heat radiating component for vehicle lighting lamps, such as a vehicle-mounted LED lamp.
１：ヒートシンク、２：基板、３：基板のＬＥＤ素子取付面、４：基板の裏面、５、６、７、８：基板の板厚方向面、９：ＬＥＤ素子、１０、１１、１２、１３：放熱フィン 1: heat sink, 2: substrate, 3: LED element mounting surface of substrate, 4: back surface of substrate, 5, 6, 7, 8: plate thickness direction surface of substrate, 9: LED element, 10, 11, 12, 13 : Heat radiation fin
Claims (5)
The heat sink for LED lighting according to any one of claims 1 to 4, wherein the heat sink is a heat sink for an in-vehicle LED lamp.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
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| JP2012065237A JP5902973B2 (en) | 2012-03-22 | 2012-03-22 | Heat sink for in-vehicle LED lamp |
| PCT/JP2012/057691 WO2012128383A1 (en) | 2011-03-24 | 2012-03-26 | Heat sink for led lighting |
| KR1020137024987A KR101586888B1 (en) | 2011-03-24 | 2012-03-26 | Heat sink for led lighting |
| CN201280014360.6A CN103443944B (en) | 2011-03-24 | 2012-03-26 | LED illumination radiator |
| US14/034,696 US20140020882A1 (en) | 2011-03-24 | 2013-09-24 | Heat sink for led lighting |
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| JP2012065237A JP5902973B2 (en) | 2012-03-22 | 2012-03-22 | Heat sink for in-vehicle LED lamp |
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| JP2015164121A (en) * | 2014-01-28 | 2015-09-10 | 株式会社小糸製作所 | light source unit |
| JP2016177162A (en) * | 2015-03-20 | 2016-10-06 | カシオ計算機株式会社 | Heat radiator, light source device, and projection device |
| CN109698263A (en) * | 2018-11-28 | 2019-04-30 | 广东晶科电子股份有限公司 | A kind of package substrate, semiconductor devices and preparation method thereof |
| WO2023048285A1 (en) * | 2021-09-24 | 2023-03-30 | 株式会社デンソー | Lidar device |
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| JP2016177162A (en) * | 2015-03-20 | 2016-10-06 | カシオ計算機株式会社 | Heat radiator, light source device, and projection device |
| CN109698263A (en) * | 2018-11-28 | 2019-04-30 | 广东晶科电子股份有限公司 | A kind of package substrate, semiconductor devices and preparation method thereof |
| CN109698263B (en) * | 2018-11-28 | 2023-11-03 | 广东晶科电子股份有限公司 | Packaging substrate, semiconductor device and manufacturing method thereof |
| WO2023048285A1 (en) * | 2021-09-24 | 2023-03-30 | 株式会社デンソー | Lidar device |
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