JP2013186971A - Film forming device and film forming method - Google Patents

Film forming device and film forming method Download PDF

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JP2013186971A
JP2013186971A JP2012049496A JP2012049496A JP2013186971A JP 2013186971 A JP2013186971 A JP 2013186971A JP 2012049496 A JP2012049496 A JP 2012049496A JP 2012049496 A JP2012049496 A JP 2012049496A JP 2013186971 A JP2013186971 A JP 2013186971A
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film
film forming
organic film
vacuum chamber
organic
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JP5988619B2 (en
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Itsushin Yo
一新 楊
Kyuzo Nakamura
久三 中村
Kazuhiko Saito
和彦 斎藤
Masayuki Iijima
正行 飯島
Hiroyuki Hirano
裕之 平野
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Ulvac Inc
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Ulvac Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a film forming device and a film forming method, capable of continuously manufacturing laminated films having a high barrier property in which an inorganic film and an organic film are laminated.SOLUTION: A film forming device comprises: a vacuum chamber 11; an evacuating unit 12 which evacuates the inside of the vacuum chamber 11; gas introduction units 14to 14which introduce a gas into the vacuum chamber 11; a control unit 15 which can increase pressure in the vacuum chamber 11 to 10Pa or higher by increasing an amount of the gases introduced by the gas introduction units 14to 14; organic film formation units 20aand 20awhich form an inorganic film on a surface of a film-formed object 50 arranged in the vacuum chamber 11 under pressure of 10Pa or higher; and an organic film formation unit 30 which forms an organic film. The organic film formation unit 30 includes: a material container 31 which is arranged in the vacuum chamber 11 and in which a liquid organic film material 35 is stored; a material coating unit 32 which coats the organic film material 35 in the material container 31 on a surface of the film-formed object 50; and a material hardening unit 36 which hardens the organic film material coated on the surface of the film-formed object 50.

Description

本発明は、成膜装置、成膜方法に係り、特に無機膜と有機膜との積層膜を形成する技術に関する。   The present invention relates to a film forming apparatus and a film forming method, and more particularly to a technique for forming a laminated film of an inorganic film and an organic film.

現在、有機ＥＬ素子は、発光効率が高く、薄い発光装置を組み立てることができることから、表示装置や照明機器の用途に注目されている。有機ＥＬ素子の有機層は大気中の水分や酸素と反応して劣化しやすいため、有機ＥＬ素子にはバリア性の高いバリア膜が必要とされている。
バリア膜には、無機膜と有機膜とが交互に積層された積層膜からなる構成が知られている（例えば、下記特許文献１の段落０１７２参照）。 At present, organic EL elements have high luminous efficiency and can be assembled into thin light emitting devices, and thus are attracting attention for applications such as display devices and lighting equipment. Since the organic layer of the organic EL element is easily deteriorated by reacting with moisture or oxygen in the atmosphere, the organic EL element needs a barrier film having a high barrier property.
As the barrier film, a configuration including a laminated film in which an inorganic film and an organic film are alternately laminated is known (see, for example, paragraph 0172 of Patent Document 1 below).

しかし、従来は、無機膜は真空成膜により形成するが、有機膜は、ディスペンサーを用いて大気中で樹脂を印刷した後、樹脂を硬化させて形成していた。そのため、無機膜と有機膜とを積層させるには、成膜対象物を大気／真空雰囲気で繰り返し出し入れする必要があり、時間や手間がかかっていた。また大気中では、水分が成膜対象物の表面に付着するおそれがあった。
そこで、真空蒸着法により、真空雰囲気中で有機膜材料を加熱して蒸発させ、蒸気を成膜対象物の表面に到達させて有機膜を形成する方法が考案された。 Conventionally, however, the inorganic film is formed by vacuum film formation, while the organic film is formed by printing the resin in the air using a dispenser and then curing the resin. Therefore, in order to laminate the inorganic film and the organic film, it is necessary to repeatedly put in and out the object to be formed in the air / vacuum atmosphere, which takes time and labor. Further, in the atmosphere, there is a risk that moisture may adhere to the surface of the film formation target.
Accordingly, a method has been devised in which an organic film material is formed by heating and evaporating an organic film material in a vacuum atmosphere by allowing the vapor to reach the surface of the film formation target by vacuum deposition.

しかし、真空蒸着法は成膜速度が遅いという不都合があり、また成膜対象物以外の部材にも着膜してダストを発生させるため、クリーニング装置が必要になり、コストが高いという問題があった。   However, the vacuum deposition method has the disadvantage that the film formation speed is slow, and also a member other than the film formation target is deposited to generate dust, which necessitates a cleaning device and is expensive. It was.

また、真空蒸着法は１０-4Ｐａ以下の圧力で行う必要があるため、無機膜をＣＶＤ法やスパッタ法により形成する場合には、無機膜と有機膜とを互いに異なる真空槽内で形成する必要があった。仮に同一の真空槽内で形成する場合には、無機膜形成後、有機膜形成前に、真空槽内の圧力を低減する工程が必要であり、積層膜を連続で生産することができなかった。 In addition, since the vacuum deposition method needs to be performed at a pressure of 10 −4 Pa or less, when the inorganic film is formed by the CVD method or the sputtering method, the inorganic film and the organic film are formed in different vacuum chambers. There was a need. If it is formed in the same vacuum chamber, it is necessary to reduce the pressure in the vacuum chamber after the inorganic film is formed and before the organic film is formed, and the laminated film cannot be produced continuously. .

無機膜と有機膜とを同一の真空槽内で連続で形成するには、無機膜も真空蒸着法で形成する必要があるが、真空蒸着法により形成された無機膜はＣＶＤ法やスパッタ法により形成された無機膜に比べてバリア性に劣るという不都合があった。   In order to continuously form an inorganic film and an organic film in the same vacuum chamber, it is necessary to form the inorganic film by a vacuum deposition method. However, an inorganic film formed by the vacuum deposition method can be formed by a CVD method or a sputtering method. There was an inconvenience that the barrier property was inferior to that of the formed inorganic film.

特開２０１０−１９８９５７号公報JP 2010-198957 A

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、無機膜と有機膜とが積層されたバリア性が高い積層膜を連続で生産できる成膜装置、成膜方法を提供することにある。   The present invention was created to solve the above-described disadvantages of the prior art, and its purpose is to form a film forming apparatus and a film forming apparatus capable of continuously producing a laminated film having a high barrier property in which an inorganic film and an organic film are laminated. It is to provide a membrane method.

上記課題を解決するために本発明は、真空槽と、前記真空槽内を真空排気する真空排気部と、前記真空槽内にガスを導入するガス導入部と、前記ガス導入部の前記ガスの導入量を増加させ、前記真空槽内の圧力を１０-2Ｐａ以上にできる制御部と、前記真空槽内に配置された成膜対象物の表面に、無機膜を１０-2Ｐａ以上の圧力で形成する無機膜形成部と、有機膜を形成する有機膜形成部と、を有し、前記有機膜形成部は、前記真空槽内に配置され、液状の有機膜材料が収容される材料容器と、前記材料容器内の前記有機膜材料を前記成膜対象物の表面に塗布する材料塗布部と、前記成膜対象物の表面に塗布された前記有機膜材料を硬化させる材料硬化部と、を有する成膜装置である。
本発明は成膜装置であって、前記無機膜形成部はＣＶＤ装置であり、前記ガスは前記無機膜の原料ガスである成膜装置である。
本発明は成膜装置であって、前記無機膜形成部はスパッタ装置であり、前記ガスはスパッタガスである成膜装置である。
本発明は成膜装置であって、前記材料塗布部は、互いに平行に配置され、外周側面が互いに接触された複数の材料伝送ローラと、各前記材料伝送ローラをそれぞれの中心軸線を中心に回転させ、隣り合う二つの前記材料伝送ローラを互いに逆方向に回転させる回転装置と、を有し、一の前記材料伝送ローラの外周側面は、前記材料容器内の前記有機膜材料に浸漬され、他の一の前記材料伝送ローラの外周側面は、前記成膜対象物の表面に接触され、前記回転装置により各前記材料伝送ローラをそれぞれ回転させると、前記材料容器内の前記有機膜材料は各前記材料伝送ローラの外周側面を伝って前記成膜対象物の表面に塗布される成膜装置である。
本発明は成膜装置であって、前記材料硬化部は、前記成膜対象物の表面に電子線又は紫外線のいずれか一方を照射する照射装置であり、前記有機膜材料は光硬化性樹脂である成膜装置である。
本発明は成膜装置であって、前記材料硬化部は、前記成膜対象物の表面を加熱する加熱装置であり、前記有機膜材料は熱硬化性樹脂である成膜装置である。
本発明は成膜装置であって、前記有機膜材料はシリコーン樹脂である成膜装置である。
本発明は成膜装置であって、前記有機膜材料はアクリル樹脂である成膜装置である。
本発明は成膜装置であって、前記成膜対象物は帯状のフレキシブル基板である成膜装置である。
本発明は成膜装置であって、前記成膜対象物を巻き取る巻き取り装置を備える成膜装置である。
本発明は成膜装置であって、前記無機膜形成部と前記有機膜形成部とは、前記成膜対象物の長手方向に沿って交互に並んで設けられた成膜装置である。
本発明は、真空排気された真空槽内にガスを導入して、前記真空槽内の圧力を１０-2Ｐａ以上に維持しながら、前記真空槽内に配置された成膜対象物の表面に、無機膜を形成する無機膜形成工程と、前記真空槽内に配置された成膜対象物の表面に、液状の有機膜材料を塗布する材料塗布工程と、塗布した前記有機膜材料を硬化させて有機膜を形成する材料硬化工程と、を有する成膜方法である。
本発明は成膜方法であって、前記ガスは前記無機膜の原料ガスであり、前記無機膜形成工程では、ＣＶＤ法により前記無機膜を形成する成膜方法である。
本発明は成膜方法であって、前記ガスはスパッタガスであり、前記無機膜形成工程では、スパッタ法により前記無機膜を形成する成膜方法である。
本発明は成膜方法であって、前記材料塗布工程では、外周側面に前記有機膜材料が付着した材料伝送ローラを前記成膜対象物の表面に接触させ、接触状態を維持しながら前記材料伝送ローラを回転させて前記有機膜材料を塗布する成膜方法である。
本発明は成膜方法であって、前記有機膜材料は光硬化性樹脂であり、前記材料硬化工程では、前記成膜対象物の表面に電子線又は紫外線を照射する成膜方法である。
本発明は成膜方法であって、前記有機膜材料は熱硬化性樹脂であり、前記有機膜材料を硬化させるときには、前記成膜対象物の表面を加熱する成膜方法である。
本発明は成膜方法であって、前記有機膜材料はシリコーン樹脂である成膜方法である。
本発明は成膜方法であって、前記有機膜材料はアクリル樹脂である成膜方法である。
本発明は成膜方法であって、前記成膜対象物は帯状のフレキシブル基板である成膜方法である。
本発明は成膜方法であって、前記成膜対象物を巻き取りながら、前記無機膜形成工程と前記材料塗布工程と前記材料硬化工程とを行う成膜方法である。
本発明は成膜方法であって、前記無機膜形成工程と前記材料塗布工程と前記材料硬化工程とをこの順に繰り返し行う成膜方法である。 In order to solve the above-described problems, the present invention provides a vacuum chamber, a vacuum exhaust portion that evacuates the vacuum chamber, a gas introduction portion that introduces gas into the vacuum chamber, and the gas in the gas introduction portion. introduction amount increases, and a control unit capable of pressure in the vacuum chamber than 10 -2 Pa, the surface of the object to be film disposed in said vacuum chamber, the pressure of an inorganic film over 10 -2 Pa A material container that contains an inorganic film forming part formed in step (b) and an organic film forming part that forms an organic film. The organic film forming part is disposed in the vacuum chamber and contains a liquid organic film material. A material application unit that applies the organic film material in the material container to the surface of the film formation target; a material curing unit that cures the organic film material applied to the surface of the film formation target; Is a film forming apparatus.
The present invention is a film forming apparatus, wherein the inorganic film forming unit is a CVD apparatus, and the gas is a raw material gas for the inorganic film.
The present invention is a film forming apparatus, wherein the inorganic film forming unit is a sputtering apparatus, and the gas is a sputtering gas.
The present invention is a film forming apparatus, wherein the material application unit is arranged in parallel to each other, and a plurality of material transmission rollers whose outer peripheral side surfaces are in contact with each other, and each of the material transmission rollers is rotated about a central axis. A rotating device that rotates two adjacent material transmission rollers in opposite directions, and an outer peripheral side surface of one of the material transmission rollers is immersed in the organic film material in the material container, and the other The outer peripheral side surface of one of the material transmission rollers is in contact with the surface of the film formation target, and when each of the material transmission rollers is rotated by the rotating device, the organic film material in the material container is It is the film-forming apparatus apply | coated to the surface of the said film-forming target object along the outer peripheral side surface of a material transmission roller.
This invention is a film-forming apparatus, Comprising: The said material hardening part is an irradiation apparatus which irradiates any one of an electron beam or an ultraviolet-ray on the surface of the said film-forming target object, The said organic film material is a photocurable resin. A film forming apparatus.
This invention is a film-forming apparatus, Comprising: The said material hardening part is a heating apparatus which heats the surface of the said film-forming target object, The said organic film material is a film-forming apparatus which is a thermosetting resin.
The present invention is a film forming apparatus, wherein the organic film material is a silicone resin.
The present invention is a film forming apparatus, wherein the organic film material is an acrylic resin.
This invention is a film-forming apparatus, Comprising: The said film-forming target object is a film-forming apparatus which is a strip | belt-shaped flexible substrate.
This invention is a film-forming apparatus, Comprising: A film-forming apparatus provided with the winding-up apparatus which winds up the said film-forming target object.
This invention is a film-forming apparatus, Comprising: The said inorganic film formation part and the said organic film formation part are film-forming apparatuses provided by arranging along the longitudinal direction of the said film-forming target alternately.
The present invention introduces gas into the evacuated vacuum chamber and maintains the pressure in the vacuum chamber at 10 −2 Pa or more, while maintaining the surface of the film formation target disposed in the vacuum chamber. An inorganic film forming step for forming an inorganic film; a material applying step for applying a liquid organic film material to the surface of a film forming object disposed in the vacuum chamber; and the applied organic film material is cured. A material curing step for forming an organic film.
The present invention is a film forming method, wherein the gas is a raw material gas for the inorganic film, and in the inorganic film forming step, the inorganic film is formed by a CVD method.
The present invention is a film forming method, wherein the gas is a sputtering gas, and in the inorganic film forming step, the inorganic film is formed by a sputtering method.
The present invention is a film forming method, wherein in the material application step, a material transmission roller having the organic film material adhered to an outer peripheral side surface is brought into contact with the surface of the film formation target, and the material transmission is performed while maintaining a contact state. In this film forming method, the organic film material is applied by rotating a roller.
The present invention is a film forming method, wherein the organic film material is a photocurable resin, and in the material curing step, the surface of the film forming object is irradiated with an electron beam or ultraviolet light.
The present invention is a film forming method, wherein the organic film material is a thermosetting resin, and the surface of the film formation target is heated when the organic film material is cured.
The present invention is a film forming method, wherein the organic film material is a silicone resin.
The present invention is a film forming method, wherein the organic film material is an acrylic resin.
This invention is a film-forming method, Comprising: The said film-forming target object is a film-forming method which is a strip | belt-shaped flexible substrate.
This invention is a film-forming method, Comprising: The film-forming method which performs the said inorganic film formation process, the said material application | coating process, and the said material hardening process, winding up the said film-forming target object.
This invention is a film-forming method, Comprising: The film-forming method which repeats the said inorganic film formation process, the said material application | coating process, and the said material hardening process in this order.

無機膜を１０-2Ｐａ以上の圧力の真空雰囲気で形成できるので、無機膜のバリア性を向上できる。
無機膜と有機膜とを同一の真空雰囲気中で形成するので、無機膜と有機膜とを連続して形成することができ、積層膜の生産時間を短縮できる。 Since the inorganic film can be formed in a vacuum atmosphere at a pressure of 10 −2 Pa or higher, the barrier property of the inorganic film can be improved.
Since the inorganic film and the organic film are formed in the same vacuum atmosphere, the inorganic film and the organic film can be formed continuously, and the production time of the laminated film can be shortened.

本発明の第一例の成膜装置の内部構成図FIG. 1 is an internal configuration diagram of a film forming apparatus according to a first example of the present invention. （ａ）〜（ｅ）：本発明の成膜方法を説明するための図(A)-(e): The figure for demonstrating the film-forming method of this invention 本発明の第二例の成膜装置の内部構成図The internal block diagram of the film-forming apparatus of the 2nd example of this invention

＜第一例の成膜装置の構造＞
本発明の第一例の成膜装置の構造を説明する。
図１は第一例の成膜装置１０ａの内部構成図である。 <Structure of film forming apparatus of first example>
The structure of the film forming apparatus of the first example of the present invention will be described.
FIG. 1 is an internal configuration diagram of the film forming apparatus 10a of the first example.

第一例の成膜装置１０ａは、真空槽１１と、真空槽１１内を真空排気する真空排気部１２と、真空槽１１内にガスを導入するガス導入部１４1〜１４4と、ガス導入部１４1〜１４4のガスの導入量を増加させ、真空槽１１内の圧力を１０-2Ｐａ以上にできる制御部１５と、真空槽１１内に配置された成膜対象物５０の表面に、無機膜を１０-2Ｐａ以上の圧力で形成する第一、第二の無機膜形成部２０ａ12、２０ａ34と、有機膜を形成する有機膜形成部３０とを有している。
真空排気部１２は、真空槽１１に接続されている。真空排気部１２を動作させると、真空槽１１内は真空排気される。 The film forming apparatus 10 a of the first example includes a vacuum chamber 11, a vacuum exhaust unit 12 that evacuates the inside of the vacuum chamber 11, gas introduction units 14 1 to 14 4 that introduce gas into the vacuum chamber 11, and a gas introduction On the surface of the film forming object 50 arranged in the vacuum chamber 11 and the control unit 15 that can increase the amount of gas introduced into the units 14 1 to 14 4 to increase the pressure in the vacuum chamber 11 to 10 −2 Pa or more. The first and second inorganic film forming portions 20a 12 and 20a 34 for forming the inorganic film at a pressure of 10 −2 Pa or more and the organic film forming portion 30 for forming the organic film are provided.
The vacuum exhaust unit 12 is connected to the vacuum chamber 11. When the evacuation unit 12 is operated, the vacuum chamber 11 is evacuated.

本実施形態では、真空槽１１には第一、第二の副真空槽６０1、６０2が気密に接続されている。第一、第二の副真空槽６０1、６０2には第一、第二の副真空排気部６８1、６８2がそれぞれ接続されており、第一、第二の副真空排気部６８1、６８2を動作させると、第一、第二の副真空槽６０1、６０2内はそれぞれ真空排気される。 In this embodiment, the vacuum chamber 11 is connected to the first and second sub vacuum chambers 60 1 and 60 2 in an airtight manner. First, the second sub-vacuum chamber 60 1, 60 2 first, 1 second sub evacuator 68, 68 2 are connected respectively, the first and second auxiliary evacuator 68 1 , 68 2 are operated, the first and second sub vacuum chambers 60 1 , 60 2 are evacuated.

第一、第二の副真空槽６０1、６０2内には巻き出しローラ６１、巻き取りローラ６２がそれぞれ配置されている。また、第一の副真空槽６０1内には第一の補助ローラ６５1が配置され、真空槽１１内には第二〜第九の補助ローラ６５2〜６５9が配置され、第二の副真空槽６０2内には第十の補助ローラ６５10が配置されている。
各ローラ６１、６２、６５1〜６５10は、中心軸線を互いに平行に向けられており、外部から回転力を受けると、回転力に応じてそれぞれ自身の中心軸線を中心に回転する。 An unwinding roller 61 and a winding roller 62 are disposed in the first and second sub vacuum chambers 60 1 and 60 2 , respectively. Further, the first sub-vacuum chamber 60 1 is arranged a first auxiliary roller 651, the vacuum chamber 11 the second to ninth auxiliary roller 65 2-65 9 is arranged, the second the auxiliary vacuum chamber 60 2 is disposed auxiliary rollers 65 10 tenth.
Each of the rollers 61, 62, 65 1 to 65 10 has a central axis oriented in parallel to each other, and when it receives a rotational force from the outside, it rotates around its own central axis according to the rotational force.

本実施形態では、成膜対象物５０は帯状のフレキシブル基板である。
成膜対象物５０は長手方向の一端を中心にロール状に巻かれた状態で第一の副真空槽６０1内に配置され、ロールの中心には巻き出しローラ６１が挿入される。 In the present embodiment, the film formation target 50 is a strip-shaped flexible substrate.
Forming target 50 is disposed on the first sub-vacuum chamber 60 1 in a state wound into a roll around a longitudinal end, in the center of the roll is inserted out roller 61 winding.

そしてロールの外周から引き出された成膜対象物５０の端部は第一の補助ローラ６５1に掛け渡された後、真空槽１１内に搬入され、第二〜第九の補助ローラ６５2〜６５9に順に掛け渡される。次いで、第二の副真空槽６０2内に搬入され、第十の補助ローラ６５10に掛け渡された後、巻き取りローラ６２に巻き付けられる。 And after the end of the object to be film 50 drawn from the outer periphery of the roll is passed over the first auxiliary roller 65 1 is carried into the vacuum chamber 11, the second to ninth auxiliary roller 65 2 to It is passed over in order to 65 9. Then it is carried into the second sub-vacuum vessel 60 in 2, after being passed over to a tenth auxiliary roller 65 10 is wound on the winding roller 62.

巻き取りローラ６２には、成膜対象物５０を巻き取る巻き取り装置６６が接続されている。巻き取り装置６６はモーターであり、巻き取りローラ６２に回転力を与えて、巻き取りローラ６２をその中心軸線を中心に回転させる。   A winding device 66 for winding the film formation target 50 is connected to the winding roller 62. The winding device 66 is a motor, and applies a rotational force to the winding roller 62 to rotate the winding roller 62 about its central axis.

ここでは、巻き取り装置６６は巻き出しローラ６１と第三、第八の補助ローラ６５3、６５8にも接続されており、巻き出しローラ６１と第三、第八の補助ローラ６５3、６５8にそれぞれ回転力を与えて、巻き取りローラ６２の回転に合わせてそれぞれ中心軸線を中心に回転させる。 Here, the winding device 66 out roller 61 wound with the third, is connected to the eighth auxiliary roller 65 3, 65 8, the unwinding roller 61 third, eighth auxiliary roller 65 3, 65 A rotational force is applied to each of 8 and rotated around the central axis in accordance with the rotation of the take-up roller 62.

巻き取りローラ６２と巻き出しローラ６１と第三、第八の補助ローラ６５3、６５8とが回転すると、巻き取りローラ６２に巻き付けられた成膜対象物５０が引っ張られ、その引っ張り力により第三、第八の補助ローラ６５3、６５8以外の各補助ローラ６５1、６５2、６５4〜６５7、６５9、６５10もそれぞれ回転して、成膜対象物５０はロールから繰り出される。 Take-up roller 62 and the take-out roller 61 and the third and the eighth auxiliary roller 65 3, 65 8 rotates, the film-forming target 50 wound around the take-up roller 62 is pulled, the by the pulling force Third, eighth auxiliary roller 65 3, 65 8 non-rotating each of the auxiliary rollers 65 1, 65 2, 65 4 to 65 7, 65 9, 65 10 also, the film-forming target 50 is fed out from the roll .

このとき巻き出しローラ６１には、引っ張り力による回転力とは逆向きの力が発生しており、その二力によって、成膜対象物５０は各補助ローラ６５1〜６５10の外周側面に密着され、隣り合う二本のローラ６１、６２、６５1〜６５10の間では平面状に張られる。 At this time, a force opposite to the rotational force due to the pulling force is generated in the unwinding roller 61, and the film forming object 50 is brought into close contact with the outer peripheral side surfaces of the auxiliary rollers 65 1 to 65 10 by the two forces. The two adjacent rollers 61, 62, 65 1 to 65 10 are stretched in a planar shape.

巻き取りローラ６２が更に回転すると、成膜対象物５０は、隣り合う二本のローラ６１、６２、６５1〜６５10の間では平面性を維持したまま、巻き出しローラ６１から巻き取りローラ６２に向かって搬送され、巻き取りローラ６２に巻き取られる。 When the take-up roller 62 further rotates, the film-forming target 50 is maintained from the take-out roller 61 to the take-up roller 62 while maintaining the flatness between the two adjacent rollers 61, 62, 65 1 to 65 10. Is taken up by the take-up roller 62.

本実施形態では、第一、第二の無機膜形成部２０ａ12、２０ａ34はＣＶＤ装置である。
第一、第二の無機膜形成部２０ａ12、２０ａ34は、ガス導入部１４1〜１４4に接続された放出容器２１1〜２１4と、放出容器２１1〜２１4に電圧を印加するＣＶＤ用電源２４1〜２４4とを有している。
各放出容器２１1〜２１4は細長形状であり、長手方向に沿って複数の放出口が設けられた放出面を備えている。 In the present embodiment, the first and second inorganic film forming portions 20a 12 and 20a 34 are CVD apparatuses.
The first and second inorganic film forming units 20a 12 and 20a 34 apply voltages to the discharge containers 21 1 to 21 4 and the discharge containers 21 1 to 21 4 connected to the gas introduction units 14 1 to 14 4. CVD power sources 24 1 to 24 4 are provided.
Each discharge container 21 1 to 21 4 has an elongated shape and includes a discharge surface provided with a plurality of discharge ports along the longitudinal direction.

ここでは第一の無機膜形成部２０ａ12の放出容器２１1、２１2は第三の補助ローラ６５3の外周に沿って並んで配置され、長手方向を第三の補助ローラ６５3の中心軸線と平行に向けられており、放出面は第三の補助ローラ６５3の外周側面と対向されている。また、第二の無機膜形成部２０ａ34の放出容器２１3、２１4は第八の補助ローラ６５8の外周に沿って並んで配置され、長手方向を第八の補助ローラ６５8の中心軸線と平行に向けられており、放出面は第八の補助ローラ６５8の外周側面と対向されている。 Here, the discharge containers 21 1 and 21 2 of the first inorganic film forming portion 20a 12 are arranged along the outer periphery of the third auxiliary roller 65 3 , and the longitudinal direction is the central axis of the third auxiliary roller 65 3. are oriented parallel to the emission surface is facing the outer peripheral side surface of the third auxiliary roller 653. Moreover, desorption chamber 21 3, 21 4 of the second inorganic film forming portion 20a 34 are arranged along the outer periphery of the eighth auxiliary roller 65 8, the central axis of the longitudinal eighth auxiliary roller 65 8 are oriented parallel to the emission surface is facing the outer peripheral side surface of the eighth auxiliary roller 65 8.

ＣＶＤ用電源２４1〜２４4は放出容器２１1〜２１4に電気的に接続されている。第三、第八の補助ローラ６５3、６５8と真空槽１１とは接地電位に置かれている。 The CVD power sources 24 1 to 24 4 are electrically connected to the discharge containers 21 1 to 21 4 . The third and eighth auxiliary rollers 65 3 and 65 8 and the vacuum chamber 11 are placed at the ground potential.

本実施形態では、ガス導入部１４1〜１４4は放出容器２１1〜２１4にそれぞれ接続され、放出容器２１1〜２１4内に無機膜の原料ガスを導入するように構成されている。
ガス導入部１４1〜１４4から放出容器２１1〜２１4内に原料ガスが導入されると、導入された原料ガスは放出面に設けられた放出口から真空槽１１内に放出される。 In the present embodiment, the gas introduction portions 14 1 to 14 4 are connected to the discharge containers 21 1 to 21 4 , respectively, and are configured to introduce the raw material gas for the inorganic film into the discharge containers 21 1 to 21 4 .
When the raw material gas to the discharge chamber 21 1 to 21 4 from the gas inlet 14 1-14 4 is introduced, the raw material gas introduced is discharged into the vacuum chamber 11 from the discharge port provided in the emitting surface.

制御部１５はガス導入部１４1〜１４4に接続され、ガス導入部１４1〜１４4のガスの導入量を増加させ、真空槽１１内を１０-2Ｐａ以上の圧力、本実施形態では好ましくは１０2Ｐａ以上の圧力に維持するように構成されている。 The control unit 15 is connected to the gas inlet 14 1-14 4 increases the introduction amount of the gas of the gas inlet portion 14 1-14 4, the vacuum chamber 11 10 -2 Pa or more pressure, in this embodiment Preferably, the pressure is maintained at 10 2 Pa or higher.

放出容器２１1〜２１4の放出口から原料ガスが放出され、ＣＶＤ用電源２４1〜２４4から放出容器２１1〜２１4に電圧が印加されると、放出容器２１1〜２１4の放出面と第三、第八の補助ローラ６５3、６５8の外周側面との間では原料ガスがプラズマ化され、第三、第八の補助ローラ６５3、６５8に掛け渡された成膜対象物５０の表面には原料ガスの反応生成物からなる無機膜が形成される。 Raw material gas is discharged from the discharge port of the discharge vessel 21 1 to 21 4, when a voltage is applied to the discharge chamber 21 1 to 21 4 from the CVD power supply 24 1-24 4, the release of desorption chamber 21 1 to 21 4 face and a third, source gas between the outer side surface of the eighth auxiliary roller 65 3, 65 8 is plasma, the third, eighth auxiliary roller 65 3, multiplied passed film target 65 8 An inorganic film made of a reaction product of the source gas is formed on the surface of the object 50.

有機膜形成部３０は、真空槽１１内に配置され、液状の有機膜材料３５が収容される材料容器３１と、材料容器３１内の有機膜材料３５を成膜対象物５０の表面に塗布する材料塗布部３２と、成膜対象物５０の表面に塗布された有機膜材料３５を硬化させる材料硬化部３６とを有している。   The organic film forming unit 30 is disposed in the vacuum chamber 11 and applies a material container 31 in which a liquid organic film material 35 is accommodated and an organic film material 35 in the material container 31 to the surface of the film formation target 50. The material application part 32 and the material hardening part 36 which hardens the organic film material 35 apply | coated to the surface of the film-forming target 50 are provided.

材料塗布部３２は、成膜対象物５０の搬送方向に対して第一の無機膜形成部２０ａ12よりも下流に配置され、ここでは第五の補助ローラ６５5と第六の補助ローラ６５6との間で張られた成膜対象物５０の下方に配置されている。 Material application unit 32, than the first inorganic film forming portion 20a 12 with respect to the conveying direction of the film-forming target 50 is located downstream, a fifth auxiliary roller 65 5 and a sixth auxiliary roller 65 6 here Are disposed below the film formation target 50 stretched between the two.

本実施形態では、材料塗布部３２は、互いに平行に配置され、外周側面が互いに接触された複数の材料伝送ローラ３２1〜３２3と、各材料伝送ローラ３２1〜３２3をそれぞれの中心軸線を中心に回転させ、隣り合う二つの材料伝送ローラ３２1〜３２3を互いに逆方向に回転させる回転装置３４とを有している。 In the present embodiment, the material application section 32 is arranged in parallel with each other, and a plurality of material transmission rollers 32 1 to 32 3 whose outer peripheral side surfaces are in contact with each other, and each of the material transmission rollers 32 1 to 32 3 are respectively connected to their respective central axes. And a rotating device 34 that rotates two adjacent material transmission rollers 32 1 to 32 3 in opposite directions.

図１の図面上では材料伝送ローラ３２1〜３２3の数は３個であるが、２個又は４個以上でもよい。
以下では３個の材料伝送ローラ３２1〜３２3を第一〜第三の材料伝送ローラと呼ぶと、第一〜第三の材料伝送ローラ３２1〜３２3は、下方から上方に向かってこの順に並んで配置され、第三の材料伝送ローラ３２3の一部は第五、第六の補助ローラ６５5、６５6の間に挿入され、外周側面の一部は第五、第六の補助ローラ６５5、６５6の間で張られた成膜対象物５０の表面に押しつけられて密着されている。 In the drawing of FIG. 1, the number of material transmission rollers 32 1 to 32 3 is three, but may be two or four or more.
Hereinafter, when the three material transmission rollers 32 1 to 32 3 are referred to as first to third material transmission rollers, the first to third material transmission rollers 32 1 to 32 3 are moved from below to above. are arranged in this order, a part of the third material transfer roller 32 3 fifth, is inserted between the sixth auxiliary roller 65 5, 65 6, the fifth part of the outer peripheral side surface, the sixth auxiliary It is pressed against and closely adhered to the surface of the film formation target 50 stretched between the rollers 65 5 and 65 6 .

材料容器３１は椀状であり、材料塗布部３２の下方に配置されている。第一の材料伝送ローラ３２1の一部は材料容器３１内に挿入され、外周側面の一部は有機膜材料３５に浸漬されている。
回転装置３４はここではモーターであり、第一〜第三の材料伝送ローラ３２1〜３２3に接続されている。 The material container 31 has a bowl shape and is disposed below the material application unit 32. A part of the first material transmission roller 32 1 is inserted into the material container 31, and a part of the outer peripheral side surface is immersed in the organic film material 35.
Here, the rotating device 34 is a motor and is connected to the first to third material transmission rollers 32 1 to 32 3 .

回転装置３４を動作させて、第一〜第三の材料伝送ローラ３２1〜３２3をそれぞれ回転させると、材料容器３１内の有機膜材料３５は第一の材料伝送ローラ３２1の外周側面に沿って伝送され、第一の材料伝送ローラ３２1と第二の材料伝送ローラ３２2との接触部分で、第二の材料伝送ローラ３２2の外周側面に受け渡される。次いで、有機膜材料３５は第二の材料伝送ローラ３２2の外周側面に沿って伝送され、第二の材料伝送ローラ３２2と第三の材料伝送ローラ３２3との接触部分で、第三の材料伝送ローラ３２3の外周側面に受け渡される。次いで、有機膜材料３５は第三の材料伝送ローラ３２3の外周側面に沿って伝送され、第三の材料伝送ローラ３２3と成膜対象物５０との接触部分で、成膜対象物５０の表面に受け渡されて塗布される。 When the rotating device 34 is operated to rotate the first to third material transmission rollers 32 1 to 32 3 , the organic film material 35 in the material container 31 is placed on the outer peripheral side surface of the first material transmission roller 32 1. along been transmitted, in the contact portion of the first material transfer roller 32 1 and the second material transfer roller 32 2 is transferred to the second outer peripheral side surface of the material transfer roller 32 2. Then, the organic film material 35 is transmitted along a second outer peripheral side surface of the material transfer roller 32 2, at the contact portion between the second material transfer roller 32 2 and the third material transfer roller 32 3, third It is transferred to the outer peripheral side surface of the material transfer roller 32 3. Then, the organic film material 35 is transmitted along the outer side surface of the third material transfer roller 32 3, at the contact portion between the third material transfer roller 32 3 and film formation object 50, the film-forming target 50 It is delivered to the surface and applied.

材料容器３１内の有機膜材料３５は液状のまま各材料伝送ローラ３２1〜３２3の外周側面を伝って成膜対象物５０の表面まで伝送される。そのため、真空槽１１内の圧力が１０-2Ｐａ以上であっても、成膜対象物５０の表面には真空槽１１内の圧力に影響されずに均一な膜厚で有機膜材料３５が塗布される。 The organic film material 35 in the material container 31 is transmitted to the surface of the film formation target 50 through the outer peripheral side surfaces of the material transmission rollers 32 1 to 32 3 while remaining in a liquid state. Therefore, even if the pressure in the vacuum chamber 11 is 10 −2 Pa or more, the organic film material 35 is applied to the surface of the film formation target 50 with a uniform film thickness without being affected by the pressure in the vacuum chamber 11. Is done.

第三の材料伝送ローラ３２3の外周側面は平らであり、成膜対象物５０の表面に液状のベタ膜が形成されてもよいし、第三の材料伝送ローラ３２3の外周側面にパターン形状の凹凸が設けられ、成膜対象物５０の表面にパターン形状の液状膜が形成されてもよい。 The outer peripheral side surface of the third material transmission roller 32 3 is flat, a liquid solid film may be formed on the surface of the film formation target 50, and the pattern shape is formed on the outer peripheral side surface of the third material transmission roller 32 3. The pattern-shaped liquid film may be formed on the surface of the film formation target 50.

材料硬化部３６は、成膜対象物５０の搬送方向に対して材料塗布部３２よりも下流に配置され、ここでは第六の補助ローラ６５6と第七の補助ローラ６５7との間で張られた成膜対象物５０の表面と対向する位置に配置されている。 Material curing unit 36 is disposed downstream of the material dispenser 32 with respect to the conveying direction of the forming target 50, where Zhang between the sixth auxiliary roller 65 6 and the seventh auxiliary roller 65 7 The film formation target 50 is disposed at a position facing the surface of the film formation target 50.

本実施形態では、有機膜材料３５は光硬化性樹脂であり、材料硬化部３６は、成膜対象物５０の表面に電子線又は紫外線のいずれか一方を照射する照射装置である。
材料硬化部３６から電子線又は紫外線を放射させると、放射された電子線又は紫外線は成膜対象物５０の表面の液状膜に入射し、液状膜を硬化させ、固体状の有機膜が形成される。 In the present embodiment, the organic film material 35 is a photocurable resin, and the material curing unit 36 is an irradiation device that irradiates the surface of the film formation target 50 with either an electron beam or ultraviolet rays.
When an electron beam or ultraviolet ray is emitted from the material curing unit 36, the emitted electron beam or ultraviolet ray is incident on the liquid film on the surface of the film formation target 50, and the liquid film is cured to form a solid organic film. The

＜成膜装置の使用方法＞
上述の成膜装置１０ａを用いた成膜方法を説明する。 <Usage method of film forming apparatus>
A film forming method using the above-described film forming apparatus 10a will be described.

有機膜形成部３０の材料容器３１内に液状の有機膜材料３５を収容しておく。
有機膜材料３５はここでは光硬化性樹脂であり、例えばトリシクロデカンジメタノールジアクリレートである。 A liquid organic film material 35 is accommodated in the material container 31 of the organic film forming unit 30.
Here, the organic film material 35 is a photocurable resin, for example, tricyclodecane dimethanol diacrylate.

有機膜材料３５は好ましくはシリコーン樹脂又はアクリル樹脂である。これらの樹脂を用いると、有機膜の耐性、透明性が向上するからである。
有機膜材料３５は、真空雰囲気中で蒸発しないものが好ましく、例えば粘度が３５０Ｐａ・ｓ以下のものである。 The organic film material 35 is preferably a silicone resin or an acrylic resin. This is because the use of these resins improves the resistance and transparency of the organic film.
The organic film material 35 preferably does not evaporate in a vacuum atmosphere. For example, the organic film material 35 has a viscosity of 350 Pa · s or less.

真空槽１１内と第一、第二の副真空槽６０1、６０2内を真空排気し、真空雰囲気を形成する。以後、真空槽１１内と第一、第二の副真空槽６０1、６０2内の真空排気を継続する。
ガス導入部１４1〜１４4から無機膜形成部２０ａ12、２０ａ34の放出容器２１1〜２１4内に無機膜材料の原料ガスを導入し、放出容器２１1〜２１4の放出口から真空槽１１内に放出させる。以後、ガスの導入を継続する。
原料ガスは例えばＳｉＨ4ガスと、ＮＨ3ガス又はＮ2Ｏガスとの混合ガスである。キャリアガスとして例えばＡｒガス、Ｈ2ガス又はＮ2ガスを添加してもよい。 The vacuum chamber 11 and the first and second sub vacuum chambers 60 1 and 60 2 are evacuated to form a vacuum atmosphere. Thereafter, the vacuum evacuation is continued in the vacuum chamber 11 and in the first and second sub vacuum chambers 60 1 and 60 2 .
Introducing a raw material gas of the inorganic film material discharge chamber 21 1 to 21 4 of the inorganic film forming portion 20a 12, 20a 34 through the gas inlet 14 1-14 4, the vacuum from the outlet of the discharge vessel 21 1 to 21 4 Release into the tank 11. Thereafter, the introduction of gas is continued.
The source gas is, for example, a mixed gas of SiH 4 gas and NH 3 gas or N 2 O gas. For example, Ar gas, H 2 gas, or N 2 gas may be added as the carrier gas.

ガス導入部１４1〜１４4のガスの導入量を増加させ、真空槽１１内のガスの圧力を１０-2Ｐａ以上、本実施形態では好ましくは１０2Ｐａ以上に維持する。
放出容器２１1〜２１4に電圧を印加して、放出容器２１1〜２１4と第三、第八の補助ローラ６５3、６５8との間でプラズマを生成し、原料ガスを化学反応させる。第三、第八の補助ローラ６５3、６５8に掛け渡された成膜対象物５０の表面には反応生成物から成る無機膜が形成される。無機膜は好ましくは金属酸化膜又は金属窒化膜であり、例えばＳｉＯx、ＳｉＯxＮy、ＳｉＮyの薄膜である。 The amount of gas introduced into the gas inlets 14 1 to 14 4 is increased, and the pressure of the gas in the vacuum chamber 11 is maintained at 10 −2 Pa or higher, preferably 10 2 Pa or higher in this embodiment.
By applying a voltage to the discharge chamber 21 1 to 21 4, desorption chamber 21 1 to 21 4 and the third, to generate plasma between the eighth auxiliary roller 65 3, 65 8, thereby chemically reacting the feed gas . Third, the inorganic film made of the reaction product is formed on the surface of the eighth auxiliary roller 65 3, 65 8 looped around the object to be film 50. The inorganic film is preferably a metal oxide film or a metal nitride film, for example, a thin film of SiO x , SiO x N y , or SiN y .

また、有機膜形成部３０の第一〜第三の材料伝送ローラ３２1〜３２3をそれぞれ回転させる。材料容器３１内の液状の有機膜材料３５は各材料伝送ローラ３２1〜３２3の外周側面を順に伝って成膜対象物５０の表面に到達され、成膜対象物５０の表面には有機膜材料の液状膜が形成される。 Further, the first to third material transmission rollers 32 1 to 32 3 of the organic film forming unit 30 are rotated. The liquid organic film material 35 in the material container 31 reaches the surface of the film formation target 50 in order through the outer peripheral side surfaces of the material transmission rollers 32 1 to 32 3 , and the organic film is formed on the surface of the film formation target 50. A liquid film of material is formed.

また、材料硬化部３６から成膜対象物５０の表面に向けて紫外線又は電子線を照射させる。
巻き取りローラ６２を回転させ、成膜対象物５０を巻き出しローラ６１から巻き取りローラ６２に向かって搬送させる。 Further, ultraviolet rays or electron beams are irradiated from the material curing unit 36 toward the surface of the film formation target 50.
The take-up roller 62 is rotated, and the film formation target 50 is conveyed from the take-out roller 61 toward the take-up roller 62.

成膜対象物５０が第三の補助ローラ６５3と密着する位置を通過するときに、成膜対象物５０の表面は第一の無機膜形成部２０ａ12の放出容器２１1、２１2と対向され、図２（ａ）を参照し、成膜対象物５０の下地層５１の表面には第一の無機膜５２1が形成される（第一の無機膜形成工程）。 When the film formation target 50 passes through a position where the film formation target 50 is in close contact with the third auxiliary roller 65 3 , the surface of the film formation target 50 is opposed to the discharge containers 21 1 and 21 2 of the first inorganic film forming unit 20a 12. Then, referring to FIG. 2A, the first inorganic film 52 1 is formed on the surface of the base layer 51 of the film formation target 50 (first inorganic film forming step).

次いで、成膜対象物５０が第五の補助ローラ６５5と第六の補助ローラ６５6との間を通過するときに、成膜対象物５０の表面は有機膜形成部３０の第三の材料伝送ローラ３２3と接触され、図２（ｂ）を参照し、第一の無機膜５２1の表面に有機膜材料３５が塗布される（材料塗布工程）。 Then, when passing between the film-forming target 50 and fifth auxiliary roller 65 5 and a sixth auxiliary roller 65 6, the third material of the surface of the film-forming target 50 is an organic film forming unit 30 With contact with the transmission roller 32 3 , the organic film material 35 is applied to the surface of the first inorganic film 52 1 with reference to FIG. 2B (material application process).

次いで、成膜対象物５０が第六の補助ローラ６５6と第七の補助ローラ６５7との間を通過するときに、成膜対象物５０の表面は材料硬化部３６と対面され、図２（ｃ）を参照し、第一の無機膜５２1の表面の有機膜材料３５が硬化されて第一の有機膜５３1が形成される（材料硬化工程）。 Then, when the film-forming target 50 passes between the sixth auxiliary roller 65 6 and seventh auxiliary rollers 65 7, the surface of the film-forming target 50 is facing the material curing unit 36, FIG. 2 Referring to (c), the organic film material 35 on the surface of the first inorganic film 52 1 is cured to form the first organic film 53 1 (material curing process).

次いで、成膜対象物が第八の補助ローラ６５8と密着する位置を通過するときに、図２（ｄ）を参照し、第一の有機膜５３1の表面に第二の無機膜５２2が形成される（第二の無機膜形成工程）。
このようにして下地層５１の表面には、第一の無機膜５２1と第一の有機膜５３1と第二の無機膜５２2とが順に積層された積層膜から成るバリア膜が形成される。 Then, when passing through the position where the film-forming target is in close contact with the eighth auxiliary roller 65 8, FIG. 2 (d) with reference to the second inorganic film 52 2 in the first organic film 53 1 on the surface Is formed (second inorganic film forming step).
This way, the surface of the base layer 51, a barrier film composed of a laminated film in which the first inorganic film 52 1 and the first organic film 53 1 and the second inorganic film 52 2 are laminated in this order is formed The

バリア膜が形成された成膜対象物５０は巻き取りローラ６２に巻き取られる。
材料塗布工程の前に無機膜形成工程を行うことにより、特に下地層５１がプラスチック基板の場合には、下地層５１からのガス放出が抑えられる。 The film formation target 50 on which the barrier film is formed is wound around the winding roller 62.
By performing the inorganic film forming step before the material applying step, particularly when the underlayer 51 is a plastic substrate, gas emission from the underlayer 51 can be suppressed.

無機膜形成工程と材料塗布工程とを同一の真空槽１１内で行うことにより、装置のコストが低減される。材料塗布工程を無機膜形成工程と同一圧力の真空雰囲気中で行うことにより、無機膜形成工程の後、材料塗布工程の前に真空槽１１内の圧力を低減させる工程が不要である。   By performing the inorganic film forming step and the material applying step in the same vacuum chamber 11, the cost of the apparatus is reduced. By performing the material application process in a vacuum atmosphere at the same pressure as the inorganic film forming process, there is no need to reduce the pressure in the vacuum chamber 11 after the inorganic film forming process and before the material applying process.

無機膜形成工程と材料塗布工程とを同一の真空槽１１内で同時に行うことにより、バリア膜の生産時間が短縮される。
無機膜形成工程ではＣＶＤ法より無機膜を形成することにより、形成された無機膜の緻密性が高くなり、ガスや水分に対するバリア性が向上する。
材料塗布工程と材料硬化工程とを順に行って有機膜を形成することにより、有機膜の応力が緩和される。 By simultaneously performing the inorganic film forming step and the material applying step in the same vacuum chamber 11, the production time of the barrier film is shortened.
In the inorganic film forming step, by forming the inorganic film by the CVD method, the denseness of the formed inorganic film is increased and the barrier property against gas and moisture is improved.
The stress of the organic film is relieved by forming the organic film by sequentially performing the material application process and the material curing process.

＜第二例の成膜装置の構造＞
本発明の第二例の成膜装置の構造を説明する。 <Structure of film forming apparatus of second example>
The structure of the film forming apparatus of the second example of the present invention will be described.

図３は第二例の成膜装置１０ｂの内部構成図である。
第二例の成膜装置１０ｂの構造のうち、第一例の成膜装置１０ａの構造と同じ部分には同じ符号を付して説明を省略する。 FIG. 3 is an internal configuration diagram of the film forming apparatus 10b of the second example.
Of the structure of the film forming apparatus 10b of the second example, the same parts as those of the film forming apparatus 10a of the first example are denoted by the same reference numerals and description thereof is omitted.

第二例の成膜装置１０ｂでは、第一、第二の無機膜形成部２０ｂ12、２０ｂ34はスパッタ装置であり、無機膜材料のターゲット２８1〜２８4を保持するカソード電極２７1〜２７4と、カソード電極２７1〜２７4に電圧を印加するスパッタ用電源２９1〜２９4とを有している。 In the second example of the deposition apparatus 10b, the first and second inorganic film forming unit 20b 12, 20b 34 is a sputtering apparatus, a cathode electrode 27 1-27 for holding the target 28 1-28 4 inorganic film materials 4, and a sputtering power source 29 1-29 4 for applying a voltage to the cathode electrode 27 1-27 4.

ここでは第一の無機膜形成部２０ｂ12のカソード電極２７1、２７2は第三の補助ローラ６５3の外周に沿って並んで配置され、ターゲット２８1、２８2の表面は第三の補助ローラ６５3の外周側面と対向されている。また、第二の無機膜形成部２０ｂ34のカソード電極２７3、２７4は第八の補助ローラ６５8の外周に沿って並んで配置され、ターゲット２８3、２８4の表面は第八の補助ローラ６５8の外周側面と対向されている。 Here, the cathode electrodes 27 1 and 27 2 of the first inorganic film forming portion 20b 12 are arranged side by side along the outer periphery of the third auxiliary roller 65 3 , and the surfaces of the targets 28 1 and 28 2 are the third auxiliary rollers. It is the outer circumferential side surface and the opposite roller 65 3. The cathode electrode 27 3, 27 4 of the second inorganic film forming unit 20b 34 are arranged along the outer periphery of the eighth auxiliary roller 65 8, the surface of the target 28 3, 28 4 an eighth auxiliary It is the outer circumferential side surface and the opposite roller 65 8.

スパッタ用電源２９1〜２９4はカソード電極２７1〜２７4に電気的に接続されている。第三、第八の補助ローラ６５3、６５8と真空槽１１とは接地電位に置かれている。
ガス導入部１４1〜１４4は真空槽１１に接続され、真空槽１１内にスパッタガスを導入するように構成されている。
制御部１５はガス導入部１４1〜１４4に接続され、ガス導入部１４1〜１４4のガスの導入量を増加させ、真空槽１１内を１０-2Ｐａ以上の圧力に維持するように構成されている。 Sputtering power source 29 1-29 4 is electrically connected to the cathode electrode 27 1-27 4. The third and eighth auxiliary rollers 65 3 and 65 8 and the vacuum chamber 11 are placed at the ground potential.
The gas introduction units 14 1 to 14 4 are connected to the vacuum chamber 11 and are configured to introduce sputtering gas into the vacuum chamber 11.
The control unit 15 is connected to the gas inlet 14 1-14 4 increases the introduction amount of the gas of the gas inlet portion 14 1-14 4, so as to maintain the vacuum chamber 11 to a pressure of more than 10 -2 Pa It is configured.

ガス導入部１４1〜１４4から真空槽１１内にスパッタガスが導入され、スパッタ用電源２９1〜２９4からカソード電極２７1〜２７4に電圧が印加されると、ターゲット２８1〜２８4の表面と第三、第八の補助ローラ６５3、６５8の外周側面との間ではスパッタガスがプラズマ化され、プラズマ中のイオンがターゲット２８1〜２８4の表面をスパッタして、ターゲット２８1〜２８4の表面から無機膜材料の粒子が放出され、第三、第八の補助ローラ６５3、６５8に掛け渡された成膜対象物５０の表面に到達して無機膜が形成される。 It is introduced sputtering gas into the vacuum chamber 11 through the gas inlet 14 1-14 4, when a voltage is applied to the cathode electrode 27 1-27 4 from the sputtering power source 29 1-29 4, the target 28 1 to 28 4 surface and the third, between the outer peripheral side surface of the eighth auxiliary roller 65 3, 65 8 sputtering gas is converted to plasma, ions in the plasma to sputter the surface of the target 28 1-28 4, the target 28 1-28 4 from the surface of the inorganic film material particles are released, the third, the inorganic film is formed to reach the surface of the eighth auxiliary roller 65 3, 65 8 looped around the object to be film-formed 50 The

第二例の成膜装置１０ｂの使用方法は、無機膜をスパッタ法で形成する以外は、第一例の成膜装置１０ａの使用方法と同じであり、説明を省略する。   The method of using the film forming apparatus 10b of the second example is the same as the method of using the film forming apparatus 10a of the first example except that the inorganic film is formed by sputtering, and the description thereof is omitted.

なお、第一、第二例の成膜装置１０ａ、１０ｂでは、無機膜形成部２０ａ12、２０ａ34又は２０ｂ12、２０ｂ34と有機膜形成部３０とが、同一の真空槽１１内で成膜対象物５０の長手方向に沿って交互に並んで設けられているならば、上述のように真空槽１１内に２個の無機膜形成部と１個の有機膜形成部とが配置された構成に限定されず、真空槽１１内に１個の無機膜形成部と２個の有機膜形成部とが配置されていてもよいし、真空槽１１内に１個の無機膜形成部と１個の有機膜形成部とが配置されていてもよい。 In the first and second film forming apparatuses 10 a and 10 b, the inorganic film forming units 20 a 12 , 20 a 34 or 20 b 12 , 20 b 34 and the organic film forming unit 30 are formed in the same vacuum chamber 11. If provided alternately along the longitudinal direction of the object 50, a configuration in which two inorganic film forming units and one organic film forming unit are arranged in the vacuum chamber 11 as described above. However, one inorganic film forming unit and two organic film forming units may be arranged in the vacuum chamber 11, or one inorganic film forming unit and one in the vacuum chamber 11. The organic film forming part may be arranged.

また、真空槽１１内に２個以上の無機膜形成部と２個以上の有機膜形成部とが配置されていてもよい。この構成では、図２（ｅ）を参照し、成膜対象物５０の表面には無機膜５２1、…、５２n+1と有機膜５３1、…、５３nとが交互に繰り返して積層されたバリア膜が形成され、バリア膜のバリア性がより向上する。 Further, two or more inorganic film forming parts and two or more organic film forming parts may be arranged in the vacuum chamber 11. In this configuration, referring to FIG. 2 (e), the inorganic film 52 1 on the surface of the film-forming target 50, ..., 52 n + 1 and the organic film 53 1, ..., and 53 n are alternately and repeatedly laminated As a result, the barrier property of the barrier film is further improved.

なお、材料硬化部３６は、上述のように紫外線又は電子線を放射する照射装置に限定されず、成膜対象物５０を加熱する加熱装置であってもよい。
材料硬化部３６が加熱装置の場合には、有機膜材料３５には熱硬化性樹脂を使用する。
材料硬化部３６から赤外線を放射させると、放射された赤外線は成膜対象物５０の表面の液状膜に入射し、液状膜は熱により硬化され、固体状の有機膜が形成される。 In addition, the material hardening part 36 is not limited to the irradiation apparatus which radiates | emits an ultraviolet-ray or an electron beam as mentioned above, The heating apparatus which heats the film-forming target object 50 may be sufficient.
When the material curing unit 36 is a heating device, a thermosetting resin is used for the organic film material 35.
When infrared rays are emitted from the material curing unit 36, the emitted infrared rays are incident on a liquid film on the surface of the film formation target 50, and the liquid film is cured by heat to form a solid organic film.

１０ａ、１０ｂ……成膜装置
１１……真空槽
１２……真空排気部
１４1〜１４4……ガス導入部
１５……制御部
２０ａ12、２０ａ34、２０ｂ12、２０ｂ34……無機膜形成部
３０……有機膜形成部
３１……材料容器
３２……材料塗布部
３２1〜３２3……材料伝送ローラ
３５……有機膜材料
３６……材料硬化部
５０……成膜対象物
６６……巻き取り装置
10a, 10b ...... deposition apparatus 11 ...... vacuum tank 12 ...... evacuator 14 1-14 4 ...... gas inlet 15 ...... controller 20a 12, 20a 34, 20b 12 , 20b 34 ...... inorganic film forming Section 30 ... Organic film forming section 31 ... Material container 32 ... Material application section 32 1 to 32 3 ... Material transmission roller 35 ... Organic film material 36 ... Material curing section 50 ... Film formation target 66 ... ... Rewinder

Claims (22)

真空槽と、
前記真空槽内を真空排気する真空排気部と、
前記真空槽内にガスを導入するガス導入部と、
前記ガス導入部の前記ガスの導入量を増加させ、前記真空槽内の圧力を１０-2Ｐａ以上にできる制御部と、
前記真空槽内に配置された成膜対象物の表面に、無機膜を１０-2Ｐａ以上の圧力で形成する無機膜形成部と、有機膜を形成する有機膜形成部と、
を有し、
前記有機膜形成部は、
前記真空槽内に配置され、液状の有機膜材料が収容される材料容器と、
前記材料容器内の前記有機膜材料を前記成膜対象物の表面に塗布する材料塗布部と、
前記成膜対象物の表面に塗布された前記有機膜材料を硬化させる材料硬化部と、
を有する成膜装置。 A vacuum chamber;
An evacuation unit for evacuating the vacuum chamber;
A gas introduction part for introducing gas into the vacuum chamber;
A control unit capable of increasing the amount of the gas introduced into the gas introduction unit to increase the pressure in the vacuum chamber to 10 −2 Pa or more;
An inorganic film forming unit for forming an inorganic film at a pressure of 10 −2 Pa or more on the surface of the film formation target disposed in the vacuum chamber; an organic film forming unit for forming an organic film;
Have
The organic film forming part is
A material container disposed in the vacuum chamber and containing a liquid organic film material;
A material application unit for applying the organic film material in the material container to the surface of the film formation target;
A material curing portion that cures the organic film material applied to the surface of the film formation target;
A film forming apparatus. 前記無機膜形成部はＣＶＤ装置であり、
前記ガスは前記無機膜の原料ガスである請求項１記載の成膜装置。 The inorganic film forming part is a CVD apparatus,
The film forming apparatus according to claim 1, wherein the gas is a raw material gas for the inorganic film. 前記無機膜形成部はスパッタ装置であり、
前記ガスはスパッタガスである請求項１記載の成膜装置。 The inorganic film forming unit is a sputtering device,
The film forming apparatus according to claim 1, wherein the gas is a sputtering gas. 前記材料塗布部は、
互いに平行に配置され、外周側面が互いに接触された複数の材料伝送ローラと、
各前記材料伝送ローラをそれぞれの中心軸線を中心に回転させ、隣り合う二つの前記材料伝送ローラを互いに逆方向に回転させる回転装置と、
を有し、
一の前記材料伝送ローラの外周側面は、前記材料容器内の前記有機膜材料に浸漬され、他の一の前記材料伝送ローラの外周側面は、前記成膜対象物の表面に接触され、前記回転装置により各前記材料伝送ローラをそれぞれ回転させると、前記材料容器内の前記有機膜材料は各前記材料伝送ローラの外周側面を伝って前記成膜対象物の表面に塗布される請求項１乃至請求項３のいずれか１項記載の成膜装置。 The material application part is
A plurality of material transmission rollers arranged in parallel with each other and whose outer peripheral side surfaces are in contact with each other;
A rotating device that rotates each of the material transmission rollers around a respective center axis, and rotates two adjacent material transmission rollers in opposite directions;
Have
The outer peripheral side surface of one of the material transmission rollers is immersed in the organic film material in the material container, and the outer peripheral side surface of the other one of the material transmission rollers is in contact with the surface of the film formation target, and the rotation The said organic film material in the said material container is apply | coated to the surface of the said film-forming target object along the outer peripheral side surface of each said material transmission roller, when each said material transmission roller is rotated by an apparatus, respectively. 4. The film forming apparatus according to any one of items 3. 前記材料硬化部は、前記成膜対象物の表面に電子線又は紫外線のいずれか一方を照射する照射装置であり、
前記有機膜材料は光硬化性樹脂である請求項１乃至請求項４のいずれか１項記載の成膜装置。 The material curing unit is an irradiation device that irradiates the surface of the film formation object with either an electron beam or ultraviolet rays,
The film forming apparatus according to claim 1, wherein the organic film material is a photocurable resin. 前記材料硬化部は、前記成膜対象物の表面を加熱する加熱装置であり、
前記有機膜材料は熱硬化性樹脂である請求項１乃至請求項４のいずれか１項記載の成膜装置。 The material curing unit is a heating device that heats the surface of the film formation target,
The film forming apparatus according to claim 1, wherein the organic film material is a thermosetting resin. 前記有機膜材料はシリコーン樹脂である請求項１乃至請求項６のいずれか１項記載の成膜装置。   The film forming apparatus according to claim 1, wherein the organic film material is a silicone resin. 前記有機膜材料はアクリル樹脂である請求項１乃至請求項６のいずれか１項記載の成膜装置。   The film forming apparatus according to claim 1, wherein the organic film material is an acrylic resin. 前記成膜対象物は帯状のフレキシブル基板である請求項１乃至請求項８のいずれか１項記載の成膜装置。   The film forming apparatus according to claim 1, wherein the film formation target is a strip-shaped flexible substrate. 前記成膜対象物を巻き取る巻き取り装置を備える請求項９記載の成膜装置。   The film-forming apparatus of Claim 9 provided with the winding-up apparatus which winds up the said film-forming target object. 前記無機膜形成部と前記有機膜形成部とは、前記成膜対象物の長手方向に沿って交互に並んで設けられた請求項９又は請求項１０のいずれか１項記載の成膜装置。   11. The film forming apparatus according to claim 9, wherein the inorganic film forming unit and the organic film forming unit are provided alternately along the longitudinal direction of the film formation target. 真空排気された真空槽内にガスを導入して、前記真空槽内の圧力を１０-2Ｐａ以上に維持しながら、前記真空槽内に配置された成膜対象物の表面に、無機膜を形成する無機膜形成工程と、
前記真空槽内に配置された成膜対象物の表面に、液状の有機膜材料を塗布する材料塗布工程と、
塗布した前記有機膜材料を硬化させて有機膜を形成する材料硬化工程と、
を有する成膜方法。 A gas is introduced into the evacuated vacuum chamber, and an inorganic film is formed on the surface of the film formation target disposed in the vacuum chamber while maintaining the pressure in the vacuum chamber at 10 −2 Pa or higher. An inorganic film forming step to be formed;
A material application step of applying a liquid organic film material to the surface of the film formation target disposed in the vacuum chamber;
A material curing step of curing the applied organic film material to form an organic film;
A film forming method comprising: 前記ガスは前記無機膜の原料ガスであり、
前記無機膜形成工程では、ＣＶＤ法により前記無機膜を形成する請求項１２記載の成膜方法。 The gas is a raw material gas for the inorganic film,
The film forming method according to claim 12, wherein in the inorganic film forming step, the inorganic film is formed by a CVD method. 前記ガスはスパッタガスであり、
前記無機膜形成工程では、スパッタ法により前記無機膜を形成する請求項１２記載の成膜方法。 The gas is a sputtering gas;
The film forming method according to claim 12, wherein in the inorganic film forming step, the inorganic film is formed by a sputtering method. 前記材料塗布工程では、外周側面に前記有機膜材料が付着した材料伝送ローラを前記成膜対象物の表面に接触させ、接触状態を維持しながら前記材料伝送ローラを回転させて前記有機膜材料を塗布する請求項１２乃至請求項１４のいずれか１項記載の成膜方法。   In the material application step, a material transmission roller having the organic film material attached to an outer peripheral side surface is brought into contact with the surface of the film formation target object, and the material transmission roller is rotated while maintaining the contact state to thereby form the organic film material. The film forming method according to claim 12, wherein the film forming method is applied. 前記有機膜材料は光硬化性樹脂であり、
前記材料硬化工程では、前記成膜対象物の表面に電子線又は紫外線を照射する請求項１２乃至請求項１５のいずれか１項記載の成膜方法。 The organic film material is a photocurable resin,
The film forming method according to claim 12, wherein, in the material curing step, the surface of the film forming object is irradiated with an electron beam or an ultraviolet ray. 前記有機膜材料は熱硬化性樹脂であり、
前記有機膜材料を硬化させるときには、前記成膜対象物の表面を加熱する請求項１２乃至請求項１５のいずれか１項記載の成膜方法。 The organic film material is a thermosetting resin,
The film forming method according to claim 12, wherein when the organic film material is cured, a surface of the object to be formed is heated. 前記有機膜材料はシリコーン樹脂である請求項１２乃至請求項１７のいずれか１項記載の成膜方法。   The film forming method according to claim 12, wherein the organic film material is a silicone resin. 前記有機膜材料はアクリル樹脂である請求項１２乃至請求項１７のいずれか１項記載の成膜方法。   The film forming method according to claim 12, wherein the organic film material is an acrylic resin. 前記成膜対象物は帯状のフレキシブル基板である請求項１２乃至請求項１９のいずれか１項記載の成膜方法。   The film forming method according to claim 12, wherein the film forming target is a strip-shaped flexible substrate. 前記成膜対象物を巻き取りながら、前記無機膜形成工程と前記材料塗布工程と前記材料硬化工程とを行う請求項２０記載の成膜方法。   21. The film forming method according to claim 20, wherein the inorganic film forming step, the material applying step, and the material curing step are performed while winding up the film forming target. 前記無機膜形成工程と前記材料塗布工程と前記材料硬化工程とをこの順に繰り返し行う請求項１２乃至請求項２０のいずれか１項記載の成膜方法。   21. The film forming method according to claim 12, wherein the inorganic film forming step, the material applying step, and the material curing step are repeated in this order.
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