JP2013140866A - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 119
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 150000004767 nitrides Chemical class 0.000 claims abstract description 77
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 125000004429 atom Chemical group 0.000 claims abstract description 30
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 12
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000001228 spectrum Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910002515 CoAl Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910016583 MnAl Inorganic materials 0.000 description 1
- 229910000943 NiAl Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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Abstract
【解決手段】第1窒化物半導体層100は、Gaを含んでいる。第1窒化物半導体層100は、例えばGaN層、AlGaN層、又はAlInGaN層である。そして酸化アルミニウム層200は、第1窒化物半導体層100との界面領域において、Al原子として、4つのO原子に囲まれた4配位Al原子と、6つのO原子に囲まれた6配位Al原子を有している。界面領域は、例えば第1窒化物半導体層100との界面から1.5nm以下の領域である。そして界面領域では、4配位Al原子は、Al原子の総数に対して30原子%以上50原子%未満となっている。
【選択図】図1
Description
図1は、第1の実施形態に係る半導体装置に用いられる層構造を示す図である。この半導体装置は、第1窒化物半導体層100及び酸化アルミニウム層200を備えている。第1窒化物半導体層100は、Gaを含んでいる。第1窒化物半導体層100は、例えばGaN層、AlGaN層、又はAlInGaN層である。そして酸化アルミニウム層200は、第1窒化物半導体層100との界面領域において、Al原子として、4つのO原子に囲まれた4配位Al原子と、6つのO原子に囲まれた6配位Al原子を有している。
図7は、第2の実施形態に係る半導体装置に用いられる層構造を示す断面図である。この層構造は、基板10と第1窒化物半導体層100の間に第2窒化物半導体層102を有している点を除いて、第1の実施形態に係る層構造と同様である。本実施形態において、第1窒化物半導体層100はAlGaN層又はAlInGaN層である。そして第2窒化物半導体層102は、GaN層である。
図8は、第3の実施形態に係る半導体装置の構成を示す図である。この半導体装置は、HEMT(High Electron Mobility Transistor)を有している。HEMTは、図7に示した層構造を用いて形成されている。具体的には、第2窒化物半導体層102と第1窒化物半導体層100は、互いに電子親和力の異なる材料により形成されている。このため、第2窒化物半導体層102と第1窒化物半導体層100の界面はヘテロ接合している。そして第1窒化物半導体層100は2次元電子ガスの供給層として機能し、第2窒化物半導体層102はチャネル層として機能する。
図10は、第4の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、電界効果型のトランジスタを有している。このトランジスタは、図1に示した層構造を用いて形成されている。本実施形態において、第1窒化物半導体層100は、例えばGaNである。
50 レジストパターン
100 第1窒化物半導体層
102 第2窒化物半導体層
200 酸化アルミニウム層
202 界面層
204 本体層
210 ゲート電極
222 ソース電極
224 ドレイン電極
230 フィールドプレート電極
232 ソース領域
234 ドレイン領域
236 LDD領域
Claims (11)
- Gaを含む第1窒化物半導体層と、
前記第1窒化物半導体層に接して形成された酸化アルミニウム層と、
を備え、
前記酸化アルミニウム層は、前記第1窒化物半導体層との界面から1.5nm以下の領域に位置する界面領域において、
Al原子として、4つのO原子に囲まれた4配位Al原子と、6つのO原子に囲まれた6配位Al原子を有しており、
前記4配位Al原子が前記Al原子の総数に対して30原子%以上50原子%未満である半導体装置。 - 請求項1に記載の半導体装置において、
前記第1窒化物半導体層はGaN層、AlGaN層、又はAlInGaN層である半導体装置。 - 請求項1又は2に記載の半導体装置において、
前記界面領域において、前記酸化アルミニウム層の90原子%以上がγAl2O3である半導体装置。 - 請求項1〜3のいずれか一項に記載の半導体層において、
前記酸化アルミニウム層は、前記界面領域としての界面層と、前記界面層上に積層された本体層とを有している半導体装置。 - 請求項1〜4のいずれか一項に記載の半導体装置において、
前記第1窒化物半導体層は、前記酸化アルミニウム層との界面に、Gaの酸化物を有している半導体装置。 - 請求項1〜5のいずれか一項に記載の半導体装置において、
前記酸化アルミニウム層はゲート絶縁膜であり、
前記酸化アルミニウム層上に形成されたゲート電極を有している半導体装置。 - 請求項6に記載の半導体装置において、
前記第1窒化物半導体層の下に形成され、前記第1窒化物半導体層にヘテロ接合している第2窒化物半導体層を有している半導体装置。 - 請求項7に記載の半導体層において、
前記第1窒化物半導体層に形成され、平面視で前記ゲート絶縁膜を挟んで互いに対向するソース及びドレインを有している半導体装置。 - Gaを含む窒化物半導体層上に、酸化アルミニウムからなる界面層を形成する工程と、
前記界面層を、酸化材を含まない雰囲気中で熱処理する工程と、
前記界面層上に、酸化アルミニウム層を形成する工程と、
を備える半導体装置の製造方法。 - 請求項9に記載の半導体装置の製造方法において、
前記界面層の厚さは、1nm以上3nm以下である半導体装置の製造方法。 - 請求項9又は10に記載の半導体装置の製造方法において、
前記熱処理の温度は500℃以上1000℃以下である半導体装置の製造方法。
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JP2012000164A JP2013140866A (ja) | 2012-01-04 | 2012-01-04 | 半導体装置及び半導体装置の製造方法 |
US13/734,844 US8872234B2 (en) | 2012-01-04 | 2013-01-04 | Semiconductor device and method of manufacturing the semiconductor device |
CN201310008686.4A CN103199103B (zh) | 2012-01-04 | 2013-01-04 | 半导体器件和制造半导体器件的方法 |
US14/466,966 US9362110B2 (en) | 2012-01-04 | 2014-08-23 | Semiconductor device and method of manufacturing the semiconductor device |
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US9466706B2 (en) | 2014-07-08 | 2016-10-11 | Toyoda Gosei Co., Ltd. | Semiconductor device including first and second gate insulating films disposed on a semiconductor layer and manufacturing method of the same |
US11257676B2 (en) | 2018-01-19 | 2022-02-22 | Fuji Electric Co., Ltd. | Gallium nitride based semiconductor device and manufacturing method of gallium nitride based semiconductor device |
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JP6207352B2 (ja) * | 2013-11-13 | 2017-10-04 | キヤノン株式会社 | 現像剤担持体、現像装置、プロセスカートリッジ、画像形成装置 |
CN108022833A (zh) * | 2017-11-17 | 2018-05-11 | 清华大学 | 制备半导体结构的方法、半导体结构及场效应晶体管 |
CN109786256B (zh) * | 2019-01-17 | 2021-05-04 | 中国电子科技集团公司第十三研究所 | 自对准表面沟道场效应晶体管的制备方法及功率器件 |
US11133408B2 (en) * | 2019-08-06 | 2021-09-28 | Iqe Plc | Dielectric passivation for layered structures |
CN113823681A (zh) * | 2021-08-30 | 2021-12-21 | 瑶芯微电子科技(上海)有限公司 | 基于栅极场板和双源极场板的hemt器件及其制备方法 |
CN113871477A (zh) * | 2021-08-30 | 2021-12-31 | 瑶芯微电子科技(上海)有限公司 | 基于栅极场板和源极场板的双异质结hemt器件及其制备方法 |
CN113823685A (zh) * | 2021-08-30 | 2021-12-21 | 瑶芯微电子科技(上海)有限公司 | 基于复合盖帽层/介质层/钝化层的hemt器件及其制备方法 |
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Also Published As
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US20130168690A1 (en) | 2013-07-04 |
US8872234B2 (en) | 2014-10-28 |
CN103199103B (zh) | 2017-11-10 |
US20140363982A1 (en) | 2014-12-11 |
CN103199103A (zh) | 2013-07-10 |
US9362110B2 (en) | 2016-06-07 |
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