JP2013138099A - Led module - Google Patents

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JP2013138099A
JP2013138099A JP2011288092A JP2011288092A JP2013138099A JP 2013138099 A JP2013138099 A JP 2013138099A JP 2011288092 A JP2011288092 A JP 2011288092A JP 2011288092 A JP2011288092 A JP 2011288092A JP 2013138099 A JP2013138099 A JP 2013138099A
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led
light
white
white led
led module
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Miyuki Hatanaka
三幸 畠中
Takashi Sato
敬 佐藤
Takanori Komiya
敬哲 小宮
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Iwasaki Denki KK
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Iwasaki Denki KK
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Abstract

PROBLEM TO BE SOLVED: To provide an LED module which can restrict irradiation of light lopsided to a fluorescent color, without causing the irradiated amount of light to decrease.SOLUTION: In an LED module 1, a white LED 11 which obtains white light by a mixture of luminous colors of an LED element and a phosphor combined with the LED element is included as a light source. The LED module 11 is provided with a reflection plane 16 which covers the white LED 11 and which, among light components emitted from an outgoing radiation plane of the white LED 11, reflects a light component L2 emitted from an outer edge of the outgoing radiation plane, having a long distance to pass through the phosphor, and lopsided to a fluorescent color component, so that it is mixed with a direct light component L1 of the white LED 11 before being irradiated.

Description

本発明は、ＬＥＤを光源に採用したＬＥＤモジュールに係り、特に、ＬＥＤの素子と組み合わせる蛍光体の発光色との混合により白色光を得る白色ＬＥＤを備えたＬＥＤモジュールに関する。   The present invention relates to an LED module that employs an LED as a light source, and more particularly to an LED module including a white LED that obtains white light by mixing with an emission color of a phosphor combined with an LED element.

従来、白色光を出力する白色ＬＥＤとして、黄色蛍光体を分散させた蛍光体樹脂で青色ＬＥＤを封止することで、青色ＬＥＤの発光色と黄色蛍光体の蛍光色との混色によって白色光を得るものが広く用いられている（例えば、特許文献１参照）。   Conventionally, as a white LED that outputs white light, a blue LED is sealed with a phosphor resin in which a yellow phosphor is dispersed, so that white light is emitted by mixing the emission color of the blue LED and the fluorescent color of the yellow phosphor. What is obtained is widely used (see, for example, Patent Document 1).

特開２００９−１４７３１２号公報JP 2009-147312 A

しかしながら、青色ＬＥＤの発光面から出た光が黄色蛍光体を通過したときの経路の違いによっては、黄色の蛍光色が強くなりすぎて青色との混合でも白色光が得られずに、黄色光となる。このため、照射光には白色光の他に黄色光が含まれることとなり、係る照射光が照射された照射面では黄色味を帯びた箇所（イエローリング）が生じることで色むらの発生や、被照射体の発色不良を招いていた。この問題を解決するために、出射面から放射される光のうち、当該出射面の外縁部から放射される蛍光色に偏った光を遮光部材で遮光して照射光に黄色光が含まれるのを防止することで、照射面で色むらの発生を抑えることが考え得るが、そうすると照射光量が低下する、という問題がある。
本発明は、上述した事情に鑑みてなされたものであり、照射光量を低下させることなく、蛍光色に偏った光の照射を抑制することができるＬＥＤモジュールを提供することを目的とする。 However, depending on the path when the light emitted from the light emitting surface of the blue LED passes through the yellow phosphor, the yellow fluorescent color becomes too strong and white light cannot be obtained even when mixed with blue. It becomes. For this reason, the irradiation light will contain yellow light in addition to white light, and the occurrence of color unevenness due to the occurrence of a yellowish spot (yellow ring) on the irradiation surface irradiated with such irradiation light, Insufficient color development of the irradiated object. In order to solve this problem, among the light emitted from the emission surface, the light that is biased to the fluorescent color emitted from the outer edge of the emission surface is shielded by the light shielding member, and the irradiation light includes yellow light. It is conceivable to prevent the occurrence of color unevenness on the irradiated surface by preventing this, but there is a problem in that the amount of irradiated light decreases.
This invention is made | formed in view of the situation mentioned above, and it aims at providing the LED module which can suppress irradiation of the light biased to the fluorescence color, without reducing irradiation light quantity.

上記目的を達成するために、本発明は、ＬＥＤ素子と、当該ＬＥＤ素子に組み合わせる蛍光体と、の発光色の混合により白色光を得る白色ＬＥＤを光源に備えたＬＥＤモジュールにおいて、前記白色ＬＥＤの周囲を覆い、前記白色ＬＥＤの出射面から放射される光成分のうち、当該出射面の外縁部から放射され前記蛍光体を通過する距離が長く蛍光色成分に偏った光成分を反射させて、前記白色ＬＥＤの直射光成分と混合して照射する反射面を備えたことを特徴とする。   In order to achieve the above object, the present invention provides an LED module including a white LED that obtains white light by mixing a luminescent color of an LED element and a phosphor combined with the LED element in a light source. Covering the periphery, among the light components radiated from the emission surface of the white LED, the light component radiated from the outer edge of the emission surface and passing through the phosphor is reflected to reflect the light component biased to the fluorescent color component, A reflection surface for mixing and irradiating with the direct light component of the white LED is provided.

また、本発明は、上記ＬＥＤモジュールにおいて、前記反射面の前方に、前記反射面で反射された光成分と前記白色ＬＥＤの直射光成分とが混合された混合光に残った蛍光色に偏った光成分を拡散する拡散シートを設けたことを特徴とする。   Further, in the LED module described above, the fluorescent color remaining in the mixed light in which the light component reflected by the reflecting surface and the direct light component of the white LED are mixed in front of the reflecting surface is biased. A diffusion sheet for diffusing light components is provided.

また、本発明は、上記ＬＥＤモジュールにおいて、前記反射面の出射開口は、前記白色ＬＥＤの出射面から放射される光の照射野を規定することを特徴とする。   Moreover, the present invention is characterized in that, in the LED module, the exit opening of the reflecting surface defines an irradiation field of light emitted from the exit surface of the white LED.

また、本発明は、上記ＬＥＤモジュールにおいて、前記白色ＬＥＤの周囲を囲む外囲壁を備え、前記外囲壁の内壁面に、前記反射面を設けたことを特徴とする。   According to the present invention, in the LED module, an outer wall surrounding the white LED is provided, and the reflecting surface is provided on an inner wall surface of the outer wall.

また、本発明は、上記ＬＥＤモジュールにおいて、前記外囲壁に、前記白色ＬＥＤが実装される実装基板が係合されるスリットを設け、前記外囲壁の外側にはみ出る前記実装基板の端部に前記実装基板を取付面に取り付ける取付部を設けたことを特徴とする。   According to the present invention, in the LED module, a slit is provided in the outer wall to be engaged with a mounting board on which the white LED is mounted, and the mounting is provided at an end of the mounting board that protrudes outside the outer wall. An attachment portion for attaching the substrate to the attachment surface is provided.

本発明によれば、ＬＥＤ素子と、当該ＬＥＤ素子に組み合わせる蛍光体と、の発光色の混合により白色光を得る白色ＬＥＤを光源に備えたＬＥＤモジュールにおいて、前記白色ＬＥＤの周囲を覆い、前記白色ＬＥＤの出射面から放射される光成分のうち、当該出射面の外縁部から放射され前記蛍光体を通過する距離が長く蛍光色成分に偏った光成分を反射させて、前記白色ＬＥＤの直射光成分と混合して照射する反射面を備えた。このため、白色ＬＥＤの放射光は、出射面の外縁部から放射される蛍光色成分に偏った放射光が白色ＬＥＤの直射光成分と混合されて照射面に照射され、照射光量を低下させることなく、照射面に蛍光色に偏った光が照射させるのを抑制することができる。   According to the present invention, in an LED module provided with a white LED that obtains white light by mixing light emission colors of an LED element and a phosphor combined with the LED element as a light source, the white LED covers the periphery of the white LED, and the white LED Of the light components radiated from the exit surface of the LED, the light component emitted from the outer edge of the exit surface and having a long distance passing through the phosphor is biased toward the fluorescent color component, and reflected directly from the white LED. A reflective surface for mixing and irradiating the components was provided. For this reason, the radiated light of the white LED is mixed with the direct light component of the white LED and the radiated light biased to the fluorescent color component emitted from the outer edge of the emission surface is irradiated to the irradiation surface, thereby reducing the amount of irradiation light. In other words, it is possible to suppress the irradiation surface from being irradiated with light biased to the fluorescent color.

本発明の実施形態に係るＬＥＤモジュールの平面図である。It is a top view of the LED module which concerns on embodiment of this invention. ＬＥＤモジュールの断面における概略構成を示す図である。It is a figure which shows schematic structure in the cross section of an LED module. 本発明に用いる白色ＬＥＤの概略構成を示す拡大断面図である。It is an expanded sectional view which shows schematic structure of white LED used for this invention. ＬＥＤモジュールの分解斜視図である。It is a disassembled perspective view of an LED module. 放射角度と分光分布を示す図であり、（Ａ）は反射面／拡散シートを用いていないＬＥＤモジュール、（Ｂ）は反射面／拡散シートを用いたＬＥＤモジュールの放射角度と分光分布を示す図である。It is a figure which shows a radiation angle and spectral distribution, (A) is an LED module which does not use a reflective surface / diffusion sheet, (B) is a figure which shows a radiation angle and spectral distribution of the LED module using a reflective surface / diffusion sheet. It is.

以下、本発明の実施の形態を、図面を参照しながら説明する。
図１は、本発明の実施の形態に係わるＬＥＤモジュール１を示す平面図であり、図２は、ＬＥＤモジュール１の概略構成を示す図である。ＬＥＤモジュール１は、白色ＬＥＤ１１を実装する実装基板１０と、白色ＬＥＤ１１の周囲を囲む外囲壁２０と、を備える。
実装基板１０は、高熱伝導性を有するアルミニウム合金などから形成されるアルミ基板である。実装基板１０は、両端部１２が外囲壁２０の外側に延出する長尺の略矩形板状に形成される。実装基板１０の、この外囲壁から延出した両端部１２には、ＬＥＤモジュール１を照明器具の取付面など、所望の取付面に取り付けるための取付部（取付孔）１３が設けられる。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing an LED module 1 according to an embodiment of the present invention, and FIG. 2 is a diagram showing a schematic configuration of the LED module 1. The LED module 1 includes a mounting substrate 10 on which the white LED 11 is mounted and an outer wall 20 that surrounds the white LED 11.
The mounting substrate 10 is an aluminum substrate formed from an aluminum alloy or the like having high thermal conductivity. The mounting substrate 10 is formed in a long, substantially rectangular plate shape in which both end portions 12 extend outside the outer wall 20. At both ends 12 of the mounting substrate 10 extending from the outer wall, there are provided mounting portions (mounting holes) 13 for mounting the LED module 1 on a desired mounting surface such as a mounting surface of a lighting fixture.

外囲壁２０は、例えば耐熱性を有するポリカーボネイト樹脂、またはアルミダイカスト等の高熱伝導性を有する材料から成形され、平面視略矩形状に形成される。外囲壁２０は、白色ＬＥＤ１１の正面に照射開口２１を備える。照射開口２１には、ガラス製、或いは、樹脂製の、詳細については後述する拡散シート１４が嵌め込まれている。ＬＥＤモジュール１は、白色ＬＥＤ１１から放射された光を、この照射開口２１から正面に向けて照射する。   The outer wall 20 is formed from a material having high thermal conductivity, such as polycarbonate resin having heat resistance or aluminum die casting, and is formed in a substantially rectangular shape in plan view. The outer wall 20 includes an irradiation opening 21 in front of the white LED 11. A diffusion sheet 14, which will be described later in detail, is fitted into the irradiation opening 21 made of glass or resin. The LED module 1 irradiates light emitted from the white LED 11 from the irradiation opening 21 toward the front.

白色ＬＥＤ１１は、図３（Ａ）に示すように、例えばセラミック板から成るパッケージ基板５に青色ＬＥＤのチップ（ＬＥＤ素子）６を実装し、この青色ＬＥＤのチップ６を黄色蛍光体（蛍光体）７が分散封入された樹脂で覆う方式で形成されている。また、白色ＬＥＤ１１は、図３（Ｂ）に示すように、例えばセラミック板から成るパッケージ基板５に実装された青色ＬＥＤのチップ６の上面に黄色蛍光体８を載せる方式により形成されている。白色ＬＥＤ１１は、パッケージ基板５と、青色ＬＥＤのチップ６及び黄色蛍光体７，８から成る発光体９と、を備えた表面実装型のパッケージ化されたＬＥＤ光源であり、青色ＬＥＤのチップ６の発光色と黄色蛍光体７，８の発光色との混合により白色光Ｌを得る。
白色ＬＥＤ１１の上方には、図２に示すように、白色ＬＥＤ１１を覆うように半球状のレンズ１５が設けられている。なお、レンズ１５を省略する構成であっても良い。 As shown in FIG. 3A, the white LED 11 has a blue LED chip (LED element) 6 mounted on a package substrate 5 made of, for example, a ceramic plate, and the blue LED chip 6 is replaced with a yellow phosphor (phosphor). 7 is formed by a method of covering with a resin encapsulated in a dispersed manner. Further, as shown in FIG. 3B, the white LED 11 is formed by a system in which a yellow phosphor 8 is placed on the upper surface of a blue LED chip 6 mounted on a package substrate 5 made of, for example, a ceramic plate. The white LED 11 is a surface-mounted packaged LED light source including a package substrate 5, a blue LED chip 6 and a light emitter 9 composed of yellow phosphors 7 and 8. White light L is obtained by mixing the emission color and the emission color of the yellow phosphors 7 and 8.
As shown in FIG. 2, a hemispherical lens 15 is provided above the white LED 11 so as to cover the white LED 11. Note that the lens 15 may be omitted.

ところで、青色ＬＥＤチップ６の発光色と黄色蛍光体７，８の発光色との混合により白色光Ｌを得る白色ＬＥＤ１１では、青色ＬＥＤチップ６の発光面から出た光が黄色蛍光体７，８を通過したときの経路の違いによっては、黄色の蛍光色が強くなりすぎて青色との混合でも白色光が得られずに、黄色光となる。特に、白色ＬＥＤ１１の外縁部から放射される光成分は、黄色蛍光体を通過する距離が長くなるため、黄色光となる。これにより、照射光が照射された照射面では照射光の外縁部が黄色味を帯びるイエローリングが生じることがある。
本願発明の実施例では、このイエローリングの発生を抑制すべく、外囲壁２０の内壁面２２に、白色ＬＥＤ１１の外縁部から放射される光成分を反射させて、白色ＬＥＤの直射光成分と混合する反射面１６を設けた。 By the way, in the white LED 11 that obtains the white light L by mixing the emission color of the blue LED chip 6 and the emission color of the yellow phosphors 7 and 8, the light emitted from the light emitting surface of the blue LED chip 6 is the yellow phosphors 7 and 8. Depending on the path difference when passing through, the yellow fluorescent color becomes too strong, and even when mixed with blue, white light cannot be obtained and becomes yellow light. In particular, the light component emitted from the outer edge portion of the white LED 11 becomes yellow light because the distance passing through the yellow phosphor becomes long. As a result, a yellow ring in which the outer edge of the irradiated light is yellowish may occur on the irradiated surface irradiated with the irradiated light.
In the embodiment of the present invention, in order to suppress the occurrence of this yellow ring, the light component emitted from the outer edge of the white LED 11 is reflected on the inner wall surface 22 of the outer wall 20 and mixed with the direct light component of the white LED. A reflecting surface 16 is provided.

以下、反射面１６について詳述する。
反射面１６は、図２（Ａ）に示すように、白色ＬＥＤ１１の外縁部から放射される蛍光色成分に偏った光成分を１回反射させて照射開口２１から照射するように、白色ＬＥＤ１１の出射面１１Ａから所定の高さ寸法Ｈに形成される。つまり、照射開口２１は、白色ＬＥＤ１１の出射面１１Ａの上に所定の間隔で設けられ、照射開口２１と、白色ＬＥＤ１１の出射面１１Ａとの間隔は、白色ＬＥＤ１１の外縁部から放射される蛍光色成分に偏った光成分を、外囲壁２０の内壁面２２に設けられた反射面１６で１回反射させて照射開口２１から照射する所定距離に設定されている。 Hereinafter, the reflecting surface 16 will be described in detail.
As shown in FIG. 2A, the reflecting surface 16 reflects the light component biased to the fluorescent color component emitted from the outer edge of the white LED 11 once and irradiates it from the irradiation opening 21 so that the white LED 11 A predetermined height dimension H is formed from the emission surface 11A. That is, the irradiation opening 21 is provided at a predetermined interval on the emission surface 11A of the white LED 11, and the interval between the irradiation opening 21 and the emission surface 11A of the white LED 11 is a fluorescent color emitted from the outer edge of the white LED 11. The light component biased to the component is reflected once by the reflecting surface 16 provided on the inner wall surface 22 of the outer wall 20 and set to a predetermined distance to be irradiated from the irradiation opening 21.

この構成によれば、白色ＬＥＤ１１の外縁部から放射される蛍光色成分に偏った光成分Ｌ２は、反射面１６で反射されて、白色ＬＥＤ１１の直射光成分Ｌ１と混合される。これにより、照射開口２１からは、白色ＬＥＤ１１の蛍光色成分に偏った光成分Ｌ２と、直射光成分Ｌ１とが混合された混合光が照射される。そのため、照射面では黄色味を帯びた箇所が生じることがなく、照射面での色むらの発生、及び、被照射体の発色不良を抑制することができる。   According to this configuration, the light component L2 biased toward the fluorescent color component emitted from the outer edge of the white LED 11 is reflected by the reflecting surface 16 and mixed with the direct light component L1 of the white LED 11. Thereby, from the irradiation opening 21, the mixed light in which the light component L2 biased to the fluorescent color component of the white LED 11 and the direct light component L1 are mixed is irradiated. Therefore, a yellowish spot does not occur on the irradiated surface, and the occurrence of uneven color on the irradiated surface and the color development failure of the irradiated object can be suppressed.

照射開口２１には、図２（Ｂ）に示すように、拡散シート１４が嵌め込まれている構成であっても良い。拡散シート１４は、高透過率を有し、拡散シート１４を通過する光成分を拡散整形する。白色ＬＥＤ１１の直射光成分Ｌ１と、反射面１６で反射された光成分Ｌ２とは、拡散シート１４を通過して拡散された混合光Ｌ３となり、混合光Ｌ３が照射される照射面での色むらが解消される。これにより、照射面では黄色味を帯びた箇所が生じることがなく、照射面での色むらの発生、及び、被照射体の発色不良を抑制することができる。   As shown in FIG. 2B, the irradiation opening 21 may have a configuration in which the diffusion sheet 14 is fitted. The diffusion sheet 14 has a high transmittance, and diffuses and shapes light components that pass through the diffusion sheet 14. The direct light component L1 of the white LED 11 and the light component L2 reflected by the reflecting surface 16 become mixed light L3 diffused through the diffusion sheet 14, and color unevenness on the irradiation surface irradiated with the mixed light L3. Is resolved. As a result, a yellowish spot does not occur on the irradiated surface, and the occurrence of uneven color on the irradiated surface and the color development failure of the irradiated object can be suppressed.

図４は、ＬＥＤモジュール１の分解斜視図である。ＬＥＤモジュール１は、図４に示すように、実装基板１０の略中央に並べられた２つの白色ＬＥＤ１１を備える。反射面１６は、これらの２つの白色ＬＥＤ１１の周囲を覆う反射シート１７によって形成される。反射シート１７は、鏡面反射する反射面１６を備える細長い矩形状のシート部材であり、反射面１６を内側にして環状に曲げて形成され、外囲壁２０の照射開口２１に挿入されている。   FIG. 4 is an exploded perspective view of the LED module 1. As shown in FIG. 4, the LED module 1 includes two white LEDs 11 arranged approximately at the center of the mounting substrate 10. The reflective surface 16 is formed by a reflective sheet 17 that covers the periphery of these two white LEDs 11. The reflection sheet 17 is an elongated rectangular sheet member having a reflection surface 16 that is specularly reflected, is formed by bending the reflection surface 16 in an annular shape, and is inserted into the irradiation opening 21 of the outer wall 20.

反射面１６の出射開口１６Ａは、白色ＬＥＤ１１の出射面１１Ａから放射される光の照射野を規定する。本実施形態では、反射面１６の出射開口１６Ａは、並んで設けられた２つの白色ＬＥＤ１１の周囲を囲む略楕円形状に形成される。これにより、ＬＥＤモジュール１の照射面での照射野は、略楕円形状となる。
なお、反射面１６は、反射シート１７を用いる以外に、例えば外囲壁２０の照射開口２１の内側に反射材料を塗布して設けられる構成でもよく、この場合には、ＬＥＤモジュール１の照射野は、照射開口２１の形状によって規定される。 The exit opening 16 </ b> A of the reflection surface 16 defines an irradiation field of light emitted from the exit surface 11 </ b> A of the white LED 11. In the present embodiment, the exit opening 16A of the reflecting surface 16 is formed in a substantially elliptical shape surrounding the periphery of the two white LEDs 11 provided side by side. Thereby, the irradiation field in the irradiation surface of LED module 1 becomes a substantially elliptical shape.
In addition to using the reflection sheet 17, the reflection surface 16 may have a configuration in which, for example, a reflection material is applied inside the irradiation opening 21 of the outer wall 20. In this case, the irradiation field of the LED module 1 is , Defined by the shape of the irradiation aperture 21.

外囲壁２０の前面２４には、照射開口２１に沿って、前面２４より一段低く形成された溝２５が設けられる。拡散シート１４は、予め、この溝２５に嵌合する寸法に形成されて、溝２５に嵌め込まれて備えられる。また、拡散シート１４は、例えば溝２５に塗布された接着剤によって接着されて外囲壁２０に固定される構成であっても良い。この構成によれば、溝２５に拡散シート１４を嵌め込むことで、拡散シート１４を簡単に外囲壁２０に設けることができ、ＬＥＤモジュール１の組み立て作業性を向上することができる。   On the front surface 24 of the outer wall 20, a groove 25 is formed along the irradiation opening 21 so as to be one step lower than the front surface 24. The diffusion sheet 14 is previously formed in a size that fits into the groove 25 and is fitted into the groove 25. Further, the diffusion sheet 14 may be configured to be fixed to the outer wall 20 by being adhered by, for example, an adhesive applied to the groove 25. According to this configuration, the diffusion sheet 14 can be easily provided on the outer wall 20 by fitting the diffusion sheet 14 into the groove 25, and the assembling workability of the LED module 1 can be improved.

外囲壁２０の底部には、実装基板１０に係合する係合部２３が設けられる。ＬＥＤモジュール１の組み立て時には、外囲壁２０には、反射シート１７、及び、拡散シート１４が取り付けられ、実装基板１０には、表面１８Ａに白色ＬＥＤ１１が実装される。次に、照射開口２１の内側に白色ＬＥＤ１１が収容されるよう、外囲壁２０を白色ＬＥＤ１１に覆い被せ、係合部２３に実装基板１０を係合する。係合部２３は、外囲壁２０の後面２６を実装基板１０の表面１８Ａに密着させた際に、実装基板１０の側面１８Ｃ，１８Ｄに係合し、かつ、下端面２７が、実装基板１０の裏面１８Ｂと面一になるように形成されている。   An engagement portion 23 that engages with the mounting substrate 10 is provided at the bottom of the outer wall 20. When the LED module 1 is assembled, the reflection sheet 17 and the diffusion sheet 14 are attached to the outer wall 20, and the white LED 11 is mounted on the surface 18 </ b> A of the mounting substrate 10. Next, the outer wall 20 is covered with the white LED 11 so that the white LED 11 is accommodated inside the irradiation opening 21, and the mounting substrate 10 is engaged with the engaging portion 23. The engaging portion 23 is engaged with the side surfaces 18C and 18D of the mounting substrate 10 when the rear surface 26 of the outer wall 20 is brought into close contact with the surface 18A of the mounting substrate 10, and the lower end surface 27 is connected to the mounting substrate 10. It is formed so as to be flush with the back surface 18B.

この構成によれば、ＬＥＤモジュール１の組み立て時には、実装基板１０に係合部２３を係合させて、実装基板１０に外囲壁２０を簡単に装着することができ、ＬＥＤモジュール１の組み立て作業性が向上する。また、実装基板１０に係合部２３を係合させることで、実装基板１０と外囲壁２０との接触面積を増やすことができる。これにより、実装基板１０の熱を外囲壁２０に伝熱して放熱することができ、ＬＥＤモジュール１の放熱効率が向上する。また、白色ＬＥＤ１１の周囲を外囲壁２０で覆うことができるため、白色ＬＥＤ１１が外部からの衝撃等を直接受けるのを防止することができ、白色ＬＥＤ１１を保護することができる。   According to this configuration, when the LED module 1 is assembled, the outer wall 20 can be easily attached to the mounting substrate 10 by engaging the engaging portion 23 with the mounting substrate 10. Will improve. Further, by engaging the engagement portion 23 with the mounting substrate 10, the contact area between the mounting substrate 10 and the outer wall 20 can be increased. Thereby, the heat of the mounting substrate 10 can be transferred to the outer wall 20 to be dissipated, and the heat dissipation efficiency of the LED module 1 is improved. Moreover, since the circumference | surroundings of white LED11 can be covered with the surrounding wall 20, it can prevent that white LED11 receives the impact etc. from the outside directly, and can protect white LED11.

実装基板１０は、両端部１２が、係合部２３から外囲壁２０の外側に延出し、この外囲壁２０の外側に延出した両端部１２に、取付部１３としての貫通孔が設けられている。ＬＥＤモジュール１は、この取付部１３を介して、任意の固定方式で照明器具の取付面に取付可能に構成されている。
この構成によれば、実装基板１０に、ＬＥＤモジュール１を照明器具の取付面に取り付ける取付部１３を一体に形成したため、部品点数を増加させる、或いは、構造を複雑化することなく、ＬＥＤモジュール１に取付部１３を設けることができる。また、取付部１３を、外囲壁２０の外側に延出する実装基板１０の両端部１２に設けたため、ＬＥＤモジュール１を、実装基板１０と外囲壁２０とを一体に取付部１３を介して簡単に取付面に取り付けることができ、ＬＥＤモジュール１の交換等のメンテナンス性を向上することができる。 The mounting substrate 10 has both end portions 12 extending from the engagement portion 23 to the outside of the outer wall 20, and through holes serving as attachment portions 13 are provided at both end portions 12 extending to the outside of the outer wall 20. Yes. The LED module 1 is configured to be attachable to the attachment surface of the lighting fixture through the attachment portion 13 by an arbitrary fixing method.
According to this configuration, since the mounting portion 13 that integrally attaches the LED module 1 to the mounting surface of the lighting fixture is integrally formed on the mounting substrate 10, the LED module 1 can be obtained without increasing the number of components or complicating the structure. A mounting portion 13 can be provided. In addition, since the mounting portion 13 is provided at both end portions 12 of the mounting substrate 10 extending to the outside of the outer surrounding wall 20, the LED module 1 can be easily integrated with the mounting substrate 10 and the outer surrounding wall 20 via the mounting portion 13. It can be attached to the attachment surface, and maintainability such as replacement of the LED module 1 can be improved.

図５は、ＬＥＤモジュール１の照射面での分光分布を示す図であり、（Ａ）は反射面１６、及び、拡散シート１４を取り付けていない状態、（Ｂ）は反射面１６、及び、拡散シート１４を取り付けた状態のＬＥＤモジュール１の照射面での分光分布を示す図である。図４（Ａ）に示すように、ＬＥＤモジュール１は、反射面１６、及び、拡散シート１４を取り付けていない状態では、放射角が低角度の光成分、つまり、白色ＬＥＤ１１の外縁部から照射された光成分Ｌ２には、波長が５７０ｎｍ付近の黄色光が、波長４５０ｎｍ付近の青色光に比べて多く含まれる。   5A and 5B are diagrams showing the spectral distribution on the irradiation surface of the LED module 1, in which FIG. 5A shows a state in which the reflection surface 16 and the diffusion sheet 14 are not attached, and FIG. 5B shows the reflection surface 16 and diffusion. It is a figure which shows the spectral distribution in the irradiation surface of the LED module 1 in the state where the sheet | seat 14 was attached. As shown in FIG. 4A, the LED module 1 is irradiated from a light component having a low emission angle, that is, from the outer edge of the white LED 11 in a state where the reflecting surface 16 and the diffusion sheet 14 are not attached. The light component L2 contains more yellow light having a wavelength of about 570 nm than blue light having a wavelength of about 450 nm.

つまり、ＬＥＤモジュール１に反射面１６、及び、拡散シート１４を取り付けていない状態では、照射面に照射される照射光は、黄色の蛍光色が強くなりすぎて青色との混合でも白色光が得られていない。また、白色ＬＥＤ１１の周囲を外囲壁２０で囲み、外囲壁２０の内壁面２２に反射面１６を設けない場合には、白色ＬＥＤ１１の外縁部から照射された光成分Ｌ２は、外囲壁２０に遮光される。これにより、照射開口２１から照射される照射光に黄色光が含まれるのを抑制することができるが、白色ＬＥＤ１１の外縁部から放射された光成分を遮光することで、照射面での照射光量は低下する。   In other words, in a state where the LED module 1 is not attached with the reflection surface 16 and the diffusion sheet 14, the irradiation light irradiated on the irradiation surface is too strong in yellow fluorescent color, and white light is obtained even when mixed with blue. It is not done. When the periphery of the white LED 11 is surrounded by the outer wall 20 and the reflecting surface 16 is not provided on the inner wall surface 22 of the outer wall 20, the light component L2 irradiated from the outer edge of the white LED 11 is blocked by the outer wall 20. Is done. Thereby, it is possible to suppress the yellow light from being included in the irradiation light irradiated from the irradiation opening 21, but by blocking the light component emitted from the outer edge portion of the white LED 11, the amount of irradiation light on the irradiation surface Will decline.

これに比べて、反射面１６、及び、拡散シート１４を取り付けた状態のＬＥＤモジュール１では、図５（Ｂ）に示すように、放射角が低角度の光成分、つまり、白色ＬＥＤ１１の外縁部から照射された光成分Ｌ２と、放射角が高角度の光成分、つまり、白色ＬＥＤ１１の直射光成分Ｌ１とで、波長が５７０ｎｍ付近の黄色光と、波長４５０ｎｍ付近の青色光とを略均等な比率にすることができる。つまり、ＬＥＤモジュール１に反射面１６、及び、拡散シート１４を取り付けた状態では、照射面に照射される照射光を、照射面全体で略均等な白色光とすることができる。   Compared to this, in the LED module 1 in a state where the reflecting surface 16 and the diffusion sheet 14 are attached, as shown in FIG. 5B, the light component having a low radiation angle, that is, the outer edge portion of the white LED 11. The light component L2 emitted from the light source and the light component having a high radiation angle, that is, the direct light component L1 of the white LED 11, the yellow light having a wavelength of about 570 nm and the blue light having a wavelength of about 450 nm are substantially equal. It can be a ratio. That is, in the state where the reflection surface 16 and the diffusion sheet 14 are attached to the LED module 1, the irradiation light irradiated on the irradiation surface can be substantially uniform white light over the entire irradiation surface.

以上説明したように、本発明を適用した実施形態によれば、青色ＬＥＤのチップ６を黄色蛍光体７が分散封入された樹脂で覆う方式、または、青色ＬＥＤのチップ６上面に黄色蛍光体８を載せる方式により、青色ＬＥＤチップ６の発光色と黄色蛍光体７，８の発光色との混合により白色光Ｌを得る白色ＬＥＤ１１を光源に備えたＬＥＤモジュール１において、白色ＬＥＤ１１の周囲を覆い、白色ＬＥＤ１１の出射面１１Ａから放射される光成分Ｌ１，Ｌ２のうち、当該出射面１１Ａの外縁部から放射され樹脂を通過する距離が長く蛍光色成分に偏った光成分Ｌ２を反射させて、白色ＬＥＤ１１の直射光成分Ｌ１と混合する反射面１６を備えた。これにより、白色ＬＥＤ１１の出射面の外縁部から放射される蛍光色成分に偏った光成分は、反射面１６で反射されて、白色ＬＥＤの直射光成分と混合されて、照射面に照射される。そのため、射光量を低下させることなく、照射面に白色ＬＥＤの放射光を照射することができ、かつ、照射面の所定箇所に蛍光色に偏った光が照射させるのを抑制することができ、照射面での色むらの発生や、被照射体の発色不良を防止することができる。   As described above, according to the embodiment to which the present invention is applied, the blue LED chip 6 is covered with the resin in which the yellow phosphors 7 are dispersed and encapsulated, or the yellow phosphor 8 is formed on the upper surface of the blue LED chip 6. In the LED module 1 having a white LED 11 that obtains white light L by mixing the emission color of the blue LED chip 6 and the emission color of the yellow phosphors 7 and 8 as a light source, the periphery of the white LED 11 is covered. Of the light components L1 and L2 radiated from the emission surface 11A of the white LED 11, the light component L2 radiated from the outer edge of the emission surface 11A and having a long distance passing through the resin is reflected in the fluorescent color component to reflect white light. The reflective surface 16 mixed with the direct light component L1 of LED11 was provided. Thereby, the light component biased to the fluorescent color component emitted from the outer edge portion of the emission surface of the white LED 11 is reflected by the reflection surface 16, mixed with the direct light component of the white LED, and irradiated to the irradiation surface. . Therefore, it is possible to irradiate the irradiated surface with the radiated light of the white LED without reducing the amount of radiant light, and to suppress the irradiation of the light biased to the fluorescent color to the predetermined portion of the irradiated surface, It is possible to prevent color unevenness on the irradiated surface and poor color development of the irradiated object.

また、本発明を適用した実施形態によれば、反射面１６の前方に、反射面１６で反射された光成分Ｌ２と白色ＬＥＤ１１の直射光成分Ｌ１とが混合された混合光に残った蛍光色に偏った光成分を拡散する拡散シート１４を設けた。これにより、照射面に照射される白色ＬＥＤ１１の直射光成分Ｌ１と、反射面１６で反射された光成分Ｌ２との混合光は、拡散シート１４を通過してさらに拡散される。よって、照射面では黄色味を帯びた箇所が生じることがなく、照射面での色むらの発生、及び、被照射体の発色不良を抑制することができる。   According to the embodiment to which the present invention is applied, the fluorescent color remaining in the mixed light in which the light component L2 reflected by the reflective surface 16 and the direct light component L1 of the white LED 11 are mixed in front of the reflective surface 16. A diffusion sheet 14 is provided for diffusing light components that are biased toward the surface. Thereby, the mixed light of the direct light component L1 of the white LED 11 irradiated to the irradiation surface and the light component L2 reflected by the reflection surface 16 passes through the diffusion sheet 14 and is further diffused. Therefore, a yellowish spot does not occur on the irradiated surface, and the occurrence of uneven color on the irradiated surface and the color development failure of the irradiated object can be suppressed.

また、本発明を適用した実施形態によれば、反射面１６の出射開口１６Ａは、白色ＬＥＤ１１の出射面１１Ａから放射される光の照射野を規定する。これにより、反射面の出射開口１６Ａを任意の形状に形成することで所望の照射野を得ることができる。特に、本実施形態では反射面１６は、所望の形状に容易に変形させることができる反射シート１７を曲げて形成しているため、簡単に出射開口１６Ａを任意の形状に形成することができる。   Further, according to the embodiment to which the present invention is applied, the exit opening 16A of the reflecting surface 16 defines an irradiation field of light emitted from the exit surface 11A of the white LED 11. Thereby, a desired irradiation field can be obtained by forming the exit opening 16A of the reflecting surface into an arbitrary shape. In particular, in the present embodiment, the reflecting surface 16 is formed by bending the reflecting sheet 17 that can be easily deformed into a desired shape, so that the emission opening 16A can be easily formed in an arbitrary shape.

また、本発明を適用した実施形態によれば、白色ＬＥＤ１１の周囲を囲む外囲壁２０を備え、外囲壁２０の内壁面２２に、反射面１６を設けた。これにより、反射面１６を簡単に白色ＬＥＤ１１の周囲を囲むように設けることができ、ＬＥＤモジュール１の組み立て作業性が向上する。また、外囲壁２０で白色ＬＥＤ１１の周囲を囲むことで、白色ＬＥＤが外部からの衝撃等により破損するのを防止することができ、白色ＬＥＤ１１を保護することができる。   Further, according to the embodiment to which the present invention is applied, the outer wall 20 surrounding the white LED 11 is provided, and the reflecting surface 16 is provided on the inner wall surface 22 of the outer wall 20. Thereby, the reflective surface 16 can be easily provided so that the circumference | surroundings of white LED11 may be enclosed, and the assembly workability | operativity of the LED module 1 improves. Further, by surrounding the white LED 11 with the outer wall 20, it is possible to prevent the white LED from being damaged by an external impact or the like, and to protect the white LED 11.

また、本発明を適用した実施形態によれば、外囲壁２０に、白色ＬＥＤ１１が実装される実装基板１０が係合される係合部を設け、外囲壁２０の外側にはみ出る実装基板１０の端部１２に実装基板１０を取付面に取り付ける取付部１３を設けた。これにより、ＬＥＤモジュール１の組み立て時には、実装基板１０に係合部２３を係合させて、実装基板１０に外囲壁２０を簡単に装着することができ、ＬＥＤモジュール１の組み立て作業性が向上する。また、実装基板１０に係合部２３を係合させることで、実装基板１０と外囲壁２０との接触面積を増やすことができ、実装基板１０の熱を外囲壁２０に伝熱して放熱することができるため、ＬＥＤモジュール１の放熱効率を向上することができる。   In addition, according to the embodiment to which the present invention is applied, the outer wall 20 is provided with the engaging portion to which the mounting board 10 on which the white LED 11 is mounted is provided, and the end of the mounting board 10 protruding outside the outer wall 20. An attachment portion 13 for attaching the mounting substrate 10 to the attachment surface is provided in the portion 12. Thereby, when the LED module 1 is assembled, the outer wall 20 can be easily mounted on the mounting substrate 10 by engaging the engaging portion 23 with the mounting substrate 10, and the assembling workability of the LED module 1 is improved. . Further, by engaging the engagement portion 23 with the mounting substrate 10, the contact area between the mounting substrate 10 and the outer wall 20 can be increased, and the heat of the mounting substrate 10 is transferred to the outer wall 20 to be dissipated. Therefore, the heat dissipation efficiency of the LED module 1 can be improved.

以上、実施形態に基づいて本発明を説明したが、本発明はこれに限定されるものではない。本実施形態では、青色ＬＥＤのチップを黄色蛍光体が分散された樹脂で覆う方式、または青色ＬＥＤのチップ上面に黄色蛍光体を載せる方式により、前記青色ＬＥＤチップの発光色と前記黄色蛍光体の発光色との混合により白色光を得る白色ＬＥＤ１１を光源に備えたＬＥＤモジュール１としたが、青色ＬＥＤより短波長である近紫外ＬＥＤに赤・緑・青色蛍光体を組合せ、白色光を得る白色ＬＥＤを光源として用いても良く、同様に照射面での色むらの発生や被照射体の発色不良を防止することができる。
また、ＬＥＤモジュール１は、実装基板１０に白色ＬＥＤ１１が２つ並べて実装される構成としたが、これに限らず、ＬＥＤモジュール１は、１つ、或いは、複数の白色ＬＥＤ１１が実装基板１０に実装されている構成であっても良い。 As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to this. In the present embodiment, the blue LED chip is covered with a resin in which a yellow phosphor is dispersed, or the yellow phosphor is placed on the top surface of the blue LED chip. Although the LED module 1 is provided with a white LED 11 that obtains white light by mixing with the emission color as a light source, a white light that obtains white light by combining a near ultraviolet LED having a shorter wavelength than a blue LED with a red, green, and blue phosphor. An LED may be used as a light source, and similarly, color unevenness on the irradiated surface and poor color development of the irradiated object can be prevented.
In addition, the LED module 1 is configured such that two white LEDs 11 are mounted side by side on the mounting substrate 10. However, the LED module 1 is not limited to this, and one or a plurality of white LEDs 11 are mounted on the mounting substrate 10. It may be configured.

１ ＬＥＤモジュール
５ パッケージ基板
６ 青色ＬＥＤチップ（ＬＥＤ素子）
７，８ 黄色蛍光体（蛍光体）
１０ 実装基板
１１ 白色ＬＥＤ
１１Ａ 出射面
１２ 端部
１３ 取付部
１４ 拡散シート
１６ 反射面
１６Ａ 出射開口
２０ 外囲壁
２１ 照射開口
２２ 内壁面
２３ 係合部
Ｌ１ 直射光成分
Ｌ２ 蛍光色成分に偏った光成分 1 LED module 5 Package substrate 6 Blue LED chip (LED element)
7,8 Yellow phosphor (phosphor)
10 Mounting board 11 White LED
11A Emission surface 12 End portion 13 Mounting portion 14 Diffusion sheet 16 Reflecting surface 16A Emission opening 20 Outer wall 21 Irradiation opening 22 Inner wall surface 23 Engagement portion L1 Direct light component L2 Light component biased to fluorescent color component

Claims (5)

ＬＥＤ素子と、当該ＬＥＤ素子に組み合わせる蛍光体と、の発光色の混合により白色光を得る白色ＬＥＤを光源に備えたＬＥＤモジュールにおいて、
前記白色ＬＥＤの周囲を覆い、前記白色ＬＥＤの出射面から放射される光成分のうち、当該出射面の外縁部から放射され前記蛍光体を通過する距離が長く蛍光色成分に偏った光成分を反射させて、前記白色ＬＥＤの直射光成分と混合して照射する反射面を備えたことを特徴とするＬＥＤモジュール。 In an LED module provided with a white LED as a light source, which obtains white light by mixing an emission color of an LED element and a phosphor to be combined with the LED element,
Of the light components that cover the periphery of the white LED and are emitted from the emission surface of the white LED, the light components that are emitted from the outer edge of the emission surface and that pass through the phosphor are long and biased toward the fluorescent color component An LED module comprising a reflective surface that reflects and irradiates the white LED with a direct light component of the white LED. 前記反射面の前方に、前記反射面で反射された光成分と前記白色ＬＥＤの直射光成分とが混合された混合光に残った蛍光色に偏った光成分を拡散する拡散シートを設けたことを特徴とする請求項１に記載のＬＥＤモジュール。   A diffusion sheet is provided in front of the reflecting surface for diffusing the light component biased in the fluorescent color remaining in the mixed light in which the light component reflected by the reflecting surface and the direct light component of the white LED are mixed. The LED module according to claim 1. 前記反射面の出射開口は、前記白色ＬＥＤの出射面から放射される光の照射野を規定することを特徴とする請求項１または２に記載のＬＥＤモジュール。   The LED module according to claim 1, wherein the exit opening of the reflection surface defines an irradiation field of light emitted from the exit surface of the white LED. 前記白色ＬＥＤの周囲を囲む外囲壁を備え、前記外囲壁の内壁面に、前記反射面を設けたことを特徴とする請求項１乃至３のいずれかに記載のＬＥＤモジュール。   4. The LED module according to claim 1, further comprising an outer wall surrounding the white LED, wherein the reflecting surface is provided on an inner wall surface of the outer wall. 5. 前記外囲壁に、前記白色ＬＥＤが実装される実装基板が係合される係合部を設け、前記外囲壁の外側にはみ出る前記実装基板の端部に前記実装基板を取付面に取り付ける取付部を設けたことを特徴とする請求項１乃至４のいずれかに記載のＬＥＤモジュール。   An engagement portion for engaging a mounting substrate on which the white LED is mounted is provided on the outer surrounding wall, and an attachment portion for attaching the mounting substrate to an attachment surface at an end portion of the mounting substrate protruding outside the outer surrounding wall. The LED module according to claim 1, wherein the LED module is provided.
JP2011288092A 2011-12-28 2011-12-28 Led module Pending JP2013138099A (en)

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JP2002299698A (en) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd Light-emitting device
JP2002304903A (en) * 2001-04-04 2002-10-18 Matsushita Electric Works Ltd Luminaire
JP2003005677A (en) * 2001-06-20 2003-01-08 Fujitsu General Ltd Led display unit
JP2011181248A (en) * 2010-02-26 2011-09-15 Toshiba Lighting & Technology Corp Bulb-shaped lamp and lighting fixture
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JP2002299698A (en) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd Light-emitting device
JP2002304903A (en) * 2001-04-04 2002-10-18 Matsushita Electric Works Ltd Luminaire
JP2003005677A (en) * 2001-06-20 2003-01-08 Fujitsu General Ltd Led display unit
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JP2011243356A (en) * 2010-05-17 2011-12-01 Koito Mfg Co Ltd Lighting device

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