JP2013138002A5 - Encapsulant and light emitting module - Google Patents

Encapsulant and light emitting module Download PDF

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Publication number
JP2013138002A5
JP2013138002A5 JP2012259489A JP2012259489A JP2013138002A5 JP 2013138002 A5 JP2013138002 A5 JP 2013138002A5 JP 2012259489 A JP2012259489 A JP 2012259489A JP 2012259489 A JP2012259489 A JP 2012259489A JP 2013138002 A5 JP2013138002 A5 JP 2013138002A5
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Prior art keywords
substrate
region
sealing material
reflectance region
light emitting
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JP2012259489A
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JP2013138002A (en
JP6025523B2 (en
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Priority claimed from JP2012259489A external-priority patent/JP6025523B2/en
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Publication of JP2013138002A5 publication Critical patent/JP2013138002A5/en
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Claims (6)

第1の基板と、
エネルギー線を透過する第2の基板と、
前記第1の基板と前記第2の基板の間に被封止体と、
前記被封止体を囲み、前記第1の基板と前記第2の基板を貼り合わせる封止材と、を有し、
前記第1の基板は、前記エネルギー線の一部を反射する高反射率領域と、前記エネルギー線に対する反射率が前記高反射率領域より低い低反射率領域と、を交互に前記封止材と重なる位置に備え、
前記封止材は、前記エネルギー線の一部を吸収する低融点ガラス層を含む封止体。
A first substrate;
A second substrate that transmits energy rays;
A sealed body between the first substrate and the second substrate;
A sealing material that surrounds the object to be sealed and bonds the first substrate and the second substrate;
The first substrate alternately includes a high reflectance region that reflects a part of the energy rays and a low reflectance region that has a reflectance with respect to the energy rays that is lower than the high reflectance region. Prepare for overlapping positions,
The sealing material includes a low melting point glass layer that absorbs part of the energy rays.
前記高反射率領域と前記低反射率領域が、前記封止材に沿って延在する請求項1記載の封止体。   The sealing body according to claim 1, wherein the high reflectance region and the low reflectance region extend along the sealing material. 前記高反射率領域と前記低反射率領域が、交互に封止材と交差して、封止材の外側に延在する請求項1記載の封止体。   The sealing body according to claim 1, wherein the high reflectance region and the low reflectance region alternately cross the sealing material and extend to the outside of the sealing material. 前記高反射率領域の面積に対する前記低反射率領域の面積の比率は、曲率半径の小さい前記封止材が重なる部分に比べて、曲率半径の大きい前記封止材が重なる部分において小さい、請求項1乃至請求項3のいずれか一に記載の封止体。   The ratio of the area of the low-reflectance region to the area of the high-reflectance region is smaller in a portion where the sealing material with a large curvature radius overlaps than a portion where the sealing material with a small curvature radius overlaps. The sealing body as described in any one of Claim 1 thru | or 3. 前記高反射率領域に金属層と、前記低反射率領域に絶縁層とを備える、請求項1乃至請求項4のいずれか一に記載の封止体。   The sealing body as described in any one of Claims 1 thru | or 4 provided with a metal layer in the said high reflectance area | region, and an insulating layer in the said low reflectance area | region. 請求項1乃至請求項5のいずれか一に記載の封止体に、
前記被封止体として、第1の電極と第2の電極の間に発光性の有機化合物を含む層を備える発光素子が封止された発光モジュール。
In the sealing body according to any one of claims 1 to 5,
A light emitting module in which a light emitting element including a layer containing a light emitting organic compound between a first electrode and a second electrode is sealed as the sealed body.
JP2012259489A 2011-11-28 2012-11-28 Encapsulant and light emitting module Active JP6025523B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012259489A JP6025523B2 (en) 2011-11-28 2012-11-28 Encapsulant and light emitting module

Applications Claiming Priority (3)

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JP2011259289 2011-11-28
JP2011259289 2011-11-28
JP2012259489A JP6025523B2 (en) 2011-11-28 2012-11-28 Encapsulant and light emitting module

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JP2016199904A Division JP6294932B2 (en) 2011-11-28 2016-10-11 Encapsulant and light emitting module

Publications (3)

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JP2013138002A JP2013138002A (en) 2013-07-11
JP2013138002A5 true JP2013138002A5 (en) 2015-12-17
JP6025523B2 JP6025523B2 (en) 2016-11-16

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JP2012259489A Active JP6025523B2 (en) 2011-11-28 2012-11-28 Encapsulant and light emitting module
JP2016199904A Expired - Fee Related JP6294932B2 (en) 2011-11-28 2016-10-11 Encapsulant and light emitting module
JP2018025994A Active JP6644098B2 (en) 2011-11-28 2018-02-16 Manufacturing method of sealed body
JP2019214055A Active JP6913731B2 (en) 2011-11-28 2019-11-27 Encapsulant and light emitting device
JP2021114989A Active JP7254121B2 (en) 2011-11-28 2021-07-12 Light-emitting device and light-emitting module
JP2023050937A Active JP7406663B2 (en) 2011-11-28 2023-03-28 Method for manufacturing a light emitting device
JP2023211928A Pending JP2024023685A (en) 2011-11-28 2023-12-15 Light-emitting device and light-emitting module

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JP2016199904A Expired - Fee Related JP6294932B2 (en) 2011-11-28 2016-10-11 Encapsulant and light emitting module
JP2018025994A Active JP6644098B2 (en) 2011-11-28 2018-02-16 Manufacturing method of sealed body
JP2019214055A Active JP6913731B2 (en) 2011-11-28 2019-11-27 Encapsulant and light emitting device
JP2021114989A Active JP7254121B2 (en) 2011-11-28 2021-07-12 Light-emitting device and light-emitting module
JP2023050937A Active JP7406663B2 (en) 2011-11-28 2023-03-28 Method for manufacturing a light emitting device
JP2023211928A Pending JP2024023685A (en) 2011-11-28 2023-12-15 Light-emitting device and light-emitting module

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US (2) US9048350B2 (en)
JP (7) JP6025523B2 (en)
KR (3) KR20130059276A (en)
TW (1) TWI569490B (en)

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