JP2013102001A - Wiring board and organic device using the same - Google Patents

Wiring board and organic device using the same Download PDF

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JP2013102001A
JP2013102001A JP2011243888A JP2011243888A JP2013102001A JP 2013102001 A JP2013102001 A JP 2013102001A JP 2011243888 A JP2011243888 A JP 2011243888A JP 2011243888 A JP2011243888 A JP 2011243888A JP 2013102001 A JP2013102001 A JP 2013102001A
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conductor
wiring
island
wiring board
electronic device
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Yoshiharu Nakamura
芳春 中村
Shintaro Hayashi
真太郎 林
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Panasonic Corp
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Panasonic Corp
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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board and an organic device using the wiring board, that can be easily re-designed and be manufactured at low cost and each have a wiring with a large current capacity.SOLUTION: A wiring board 2 includes: an insulating substrate 21; a plurality of island-shaped conductors 22 provided on the surface of the insulating substrate 21; and conductor wiring 23 connecting the island-shaped conductors together. An electronic device 3 includes; a film; an organic element on the film; and an electrode electrically connecting the organic element on the film. The conductor wiring 23 is formed of a metal wire or a metal ribbon, and a junction member 4 electrically connects the electrode of the electronic device 3 to be mounted and the conductor wiring 23 together. The organic device 1 is configured so that the electronic device 3 is mounted face down on the wiring board 2, the electrode is connected to the conductor wiring 23 by the junction member 4, and the whole organic device is sealed by a sealing member 5. The conductor wiring 23 can have a large current capacity and can be easily re-designed as appropriate by change of wiring between the island-shaped conductors 22.

Description

本発明は、電子デバイス実装用の配線基板とそれを用いた有機デバイスに関する。   The present invention relates to a wiring board for mounting an electronic device and an organic device using the wiring board.

従来、電子デバイス、例えば発光素子などを実装する配線基板として、プリント配線基板が用いられている。プリント配線基板は、リソグラフィ技術などの印刷類似技術を用いて形成した配線パターンを絶縁基板上に備えている。配線パターンは、例えば、導電膜形成、レジストマスク形成、エッチング処理、などの多くの工程とそのための多種類の装置を用いて形成される。また、一般に配線基板と呼ばれる基板として、複数の絶縁被覆ワイヤを絶縁基板上に這わせて（布線、配索などという）絶縁基板上に接着固定することにより形成したマルチワイヤ配線板が知られている（例えば、特許文献１参照）。   Conventionally, printed wiring boards have been used as wiring boards for mounting electronic devices such as light emitting elements. A printed wiring board includes a wiring pattern formed using a printing-like technique such as a lithography technique on an insulating substrate. For example, the wiring pattern is formed by using many processes such as conductive film formation, resist mask formation, and etching treatment, and various types of apparatuses therefor. In addition, as a substrate generally called a wiring substrate, a multi-wire wiring board formed by bonding and fixing a plurality of insulating coated wires on an insulating substrate (such as wiring or wiring) is known. (For example, refer to Patent Document 1).

特開２００２−３４４１１２号公報JP 2002-344112 A

しかしながら、上述したようなプリント配線基板においては、その製法が多工程かつ多種類の装置を必要とするので製造コストが高く、また、設計変更に際してレジストマスク形成用の露光用マスク変更が必要であり、設計変更が容易でなく、高コストになる。また、プリント配線基板においては、その配線パターンを電流容量の大きい電源用などとする場合、厚い銅層を有する銅箔積層板のエッチングや、配線パターンの厚膜化のためのめっき層形成などが必要であり、コスト高や設計変更の非容易性がさらに加わる。また、上述のマルチワイヤ配線板は、配線用のワイヤが絶縁被覆されているので互いに交差させて高密度配線をすることができるという利点があるものの、その利点が電子デバイス実装用に役立つというものではない。   However, in the printed wiring board as described above, the manufacturing method requires many steps and many kinds of apparatuses, so that the manufacturing cost is high, and the exposure mask for forming the resist mask needs to be changed when the design is changed. Design changes are not easy and costly. In printed wiring boards, when the wiring pattern is used for a power source having a large current capacity, etching of a copper foil laminate having a thick copper layer, formation of a plating layer for increasing the thickness of the wiring pattern, etc. This is necessary and adds to the cost and the inability to change the design. In addition, the above-described multi-wire wiring board has the advantage that high-density wiring can be made by crossing each other because the wiring wires are covered with insulation, but the advantage is useful for mounting electronic devices. is not.

本発明は、上記課題を解消するものであって、設計変更対応が容易であり、電流容量の大きい配線を有して低コストで製造できる配線基板とそれを用いた有機デバイスを提供することを目的とする。   The present invention solves the above-described problems, and provides a wiring board that can be easily changed in design, can be manufactured at a low cost with wiring having a large current capacity, and an organic device using the wiring board. Objective.

上記課題を達成するために、本発明の配線基板は、電子デバイス実装用の配線基板において、絶縁基板と、絶縁基板の表面に島状に設けられた複数の島状導体と、島状導体間を電気的に接続する導体配線と、を備え、導体配線は、金属ワイヤまたは金属リボンから成り、実装される電子デバイスの電極が該導体配線に電気的に接続可能に構成されていることを特徴とする。   In order to achieve the above object, a wiring board according to the present invention includes an insulating substrate, a plurality of island-like conductors provided in an island shape on the surface of the insulating substrate, and an island-like conductor. A conductor wiring, the conductor wiring is made of a metal wire or a metal ribbon, and the electrode of the electronic device to be mounted is configured to be electrically connectable to the conductor wiring. And

この配線基板において、絶縁基板の表面に成膜された導体膜が島状導体を構成してもよい。   In this wiring board, the conductor film formed on the surface of the insulating substrate may constitute an island-shaped conductor.

この配線基板において、絶縁基板は、その表裏を電気的に接続するビアを有し、ビアは、島状導体に電気的に接続されているものとすることができる。   In this wiring board, the insulating substrate may have vias that electrically connect the front and back surfaces, and the vias may be electrically connected to the island-shaped conductors.

この配線基板において、絶縁基板は、貫通孔を有し、導体配線は、その端部が貫通孔に挿通されているものとすることができる。   In this wiring board, the insulating substrate may have a through hole, and the conductor wiring may have an end inserted through the through hole.

この配線基板において、絶縁基板に挿通された導体ピンの端部が島状導体を構成してもよい。   In this wiring board, the end portion of the conductor pin inserted through the insulating board may constitute an island-shaped conductor.

この配線基板において、絶縁基板は、ガラス基板とすることができる。   In this wiring board, the insulating substrate can be a glass substrate.

また、本発明の有機デバイスは、請求項１乃至請求項６のいずれか一項に記載の配線基板に電子デバイスが実装され、電子デバイスは、有機素子と、その有機素子に対して電気的接続を行う電極と、をフィルムの表面に備え、電極が接合部材によって配線基板の導体配線に電気的に接続されていることを特徴とする。   An organic device of the present invention is mounted on the wiring substrate according to any one of claims 1 to 6, and the electronic device is electrically connected to the organic element and the organic element. And an electrode that performs electrical contact on the surface of the film, and the electrode is electrically connected to the conductor wiring of the wiring board by a bonding member.

本発明の配線基板によれば、島状導体間を接続する導体配線に電子デバイスの電極が電気的に接続可能とされているので、導体配線の配置変更によって設計変更に容易に対応でき、また、断面が大きい導体配線を用いて電流容量の大きい配線を実現できる。このような配線基板を用いる有機デバイスは、電流容量を大きくすることができることに加え、設計変更にかかるコストを抑えて低コストで製造することができる。   According to the wiring board of the present invention, since the electrode of the electronic device can be electrically connected to the conductor wiring connecting the island-shaped conductors, the design change can be easily handled by changing the arrangement of the conductor wiring. A wiring having a large current capacity can be realized by using a conductor wiring having a large cross section. An organic device using such a wiring board can be manufactured at a low cost while suppressing the cost required for the design change in addition to increasing the current capacity.

（ａ）は本発明の一実施形態に係る配線基板を用いた有機デバイスについて封止部材と電子デバイスとを透視して示す平面図、（ｂ）同有機デバイスの断面図。(A) is a top view which shows through a sealing member and an electronic device about the organic device using the wiring board which concerns on one Embodiment of this invention, (b) Sectional drawing of the organic device. 同有機デバイスにおける電子デバイス部分を抜き出した斜視図。The perspective view which extracted the electronic device part in the organic device. （ａ）〜（ｇ）は同有機デバイスの製造工程を順次示す断面図。(A)-(g) is sectional drawing which shows the manufacturing process of the organic device sequentially. 同有機デバイスの製造方法を説明するフローチャート。The flowchart explaining the manufacturing method of the organic device. 同有機デバイスの変形例を示す平面図。The top view which shows the modification of the organic device. （ａ）は同有機デバイスの他の変形例の一部分を示す部分平面図、（ｂ）は同変形例の断面図。(A) is a partial top view which shows a part of other modification of the organic device, (b) is sectional drawing of the modification. 同有機デバイスのさらに他の変形例の一部分を示す部分平面図。The fragmentary top view which shows a part of other modification of the organic device. （ａ）は同有機デバイスのさらに他の変形例の分解断面図、（ｂ）は同有機デバイスの断面図。(A) is decomposition | disassembly sectional drawing of the further another modification of the organic device, (b) is sectional drawing of the organic device. （ａ）〜（ｅ）は同配線基板の他の製造方法による製造工程を順次示す断面図。(A)-(e) is sectional drawing which shows the manufacturing process by the other manufacturing method of the same wiring board one by one. 図９に示した配線基板の製造方法を説明するフローチャート。10 is a flowchart for explaining a method of manufacturing the wiring board shown in FIG. 同有機デバイスのさらに他の変形例の断面図。Sectional drawing of the further another modification of the organic device. （ａ）〜（ｄ）は同変形例の配線基板の製造工程を順次示す断面図。(A)-(d) is sectional drawing which shows the manufacturing process of the wiring board of the modification sequentially. 図１２に示した配線基板の製造方法を説明するフローチャート。The flowchart explaining the manufacturing method of the wiring board shown in FIG. 同有機デバイスのさらに他の変形例の断面図。Sectional drawing of the further another modification of the organic device. （ａ）（ｂ）は同変形例の配線基板の製造工程を順次示す断面図。(A) (b) is sectional drawing which shows the manufacturing process of the wiring board of the modification sequentially. 同有機デバイスのさらに他の変形例の断面図。Sectional drawing of the further another modification of the organic device. （ａ）〜（ｄ）は同変形例の配線基板の製造工程を順次示す断面図。(A)-(d) is sectional drawing which shows the manufacturing process of the wiring board of the modification sequentially. 図１７に示した配線基板の製造方法を説明するフローチャート。The flowchart explaining the manufacturing method of the wiring board shown in FIG. 同有機デバイスのさらに他の変形例の断面図。Sectional drawing of the further another modification of the organic device. （ａ）〜（ｄ）は同変形例の配線基板の製造工程を順次示す断面図。(A)-(d) is sectional drawing which shows the manufacturing process of the wiring board of the modification sequentially. 図２０に示した配線基板の製造方法を説明するフローチャート。The flowchart explaining the manufacturing method of the wiring board shown in FIG. （ａ）は同有機デバイスのさらに他の変形例の電子デバイス部分を抜き出した斜視図、（ｂ）は（ａ）の一部分の断面図、（ｃ）は（ｂ）の平面図。(A) is the perspective view which extracted the electronic device part of the further another modification of the organic device, (b) is sectional drawing of the part of (a), (c) is a top view of (b).

以下、本発明の一実施形態に係る配線基板とそれを用いた有機デバイスについて、図面を参照して説明する。図１乃至図４は一実施形態に係る有機デバイス１を示す。有機デバイス１は、図１（ａ）（ｂ）に示すように、配線基板２と、有機素子を有する４つの同等の電子デバイス３と、電子デバイス３を配線基板２に電気的に接合する接合部材４と、電子デバイス３を封止する封止部材５と、を備えて構成されている。電子デバイス３の有機素子は、例えば、発光素子であり、有機デバイス１は照明器具である。配線基板２は、絶縁基板２１と、絶縁基板２１の表面に島状に設けられた複数の島状導体２２と、島状導体２２間を電気的に接続する導体配線２３と、を備えている。ここで、導体とは電気伝導性の導体のことである。絶縁基板２１は、矩形のガラス基板である。絶縁基板２１の一面には、３本の長い島状導体２２が互いに離間して左右と中央に平行に配置され、それらの、左右の島状導体２２の内側と、中央の島状導体２２の左右に、短い島状導体２２が各６個ずつ列状に、各島状導体２２に沿うように配置されている。各島状導体２２は、互いに電気的に絶縁されて電気的に孤立した導体であり、それらの表面は、ワイヤボンディング可能に表面処理されている。３本の長い島状導体２２の端部は、入出力用の電極２２ａとなっている。８本の長い導体配線２３が、絶縁基板２１の中央寄りの短い島状導体２２と外側寄りの短い島状導体２２とを電気的に接続して配置されている。長い導体配線２３は、短い導体配線２３によって、隣接するいずれかの長い島状導体２２に電気的に接続されている。導体配線２３は、金属ワイヤであり、ワイヤボンディングによって、各島状導体２２に接続されている。   Hereinafter, a wiring board and an organic device using the same according to an embodiment of the present invention will be described with reference to the drawings. 1 to 4 show an organic device 1 according to an embodiment. As shown in FIGS. 1A and 1B, the organic device 1 includes a wiring board 2, four equivalent electronic devices 3 having organic elements, and a joint for electrically joining the electronic device 3 to the wiring board 2. A member 4 and a sealing member 5 for sealing the electronic device 3 are provided. The organic element of the electronic device 3 is a light emitting element, for example, and the organic device 1 is a lighting fixture. The wiring substrate 2 includes an insulating substrate 21, a plurality of island-shaped conductors 22 provided in an island shape on the surface of the insulating substrate 21, and a conductor wiring 23 that electrically connects the island-shaped conductors 22. . Here, the conductor is an electrically conductive conductor. The insulating substrate 21 is a rectangular glass substrate. Three long island-shaped conductors 22 are arranged on one surface of the insulating substrate 21 so as to be spaced apart from each other and parallel to the left and right and the center of the left and right island-shaped conductors 22 and the center island-shaped conductor 22. On the left and right sides, six short island-shaped conductors 22 are arranged in a row along the island-shaped conductors 22. Each of the island-shaped conductors 22 is an electrically isolated conductor that is electrically insulated from each other, and the surface thereof is surface-treated so as to be capable of wire bonding. The ends of the three long island-shaped conductors 22 serve as input / output electrodes 22a. Eight long conductor wirings 23 are arranged by electrically connecting a short island-like conductor 22 near the center of the insulating substrate 21 and a short island-like conductor 22 near the outside. The long conductor wiring 23 is electrically connected to one of the adjacent long island conductors 22 by the short conductor wiring 23. The conductor wiring 23 is a metal wire and is connected to each island-like conductor 22 by wire bonding.

電子デバイス３は、図２に示すように、フィルム基板３１の上に、下部電極３２と、有機ＥＬ素子からなる発光部３３と、上部電極３４とを、この順に積層して形成した発光素子である。発光部３３および上部電極３４からの下部電極３２の露出部と、上部電極３４の上部全面とが、それぞれ発光部３３に対して電気的接続を行う接続電極部３ａ，３ｂとされている。各接続電極部３ａ，３ｂは、導電性接着剤からなる接合部材４によって導体配線２３に電気的に接続されている。この電子デバイス３は、配線基板２に対してフィルム基板３１を上側に配置するフェイスダウン実装とされている。フィルム基板３１側を光放出面とする場合、フィルム基板３１には透明フィルムが用いられる。   As shown in FIG. 2, the electronic device 3 is a light emitting element formed by laminating a lower electrode 32, a light emitting part 33 made of an organic EL element, and an upper electrode 34 in this order on a film substrate 31. is there. The exposed portion of the lower electrode 32 from the light emitting portion 33 and the upper electrode 34 and the entire upper surface of the upper electrode 34 are connection electrode portions 3a and 3b that make electrical connection to the light emitting portion 33, respectively. Each connection electrode part 3a, 3b is electrically connected to the conductor wiring 23 by the joining member 4 made of a conductive adhesive. The electronic device 3 is a face-down mounting in which a film substrate 31 is disposed on the upper side with respect to the wiring substrate 2. When the film substrate 31 side is a light emitting surface, a transparent film is used for the film substrate 31.

図１（ａ）（ｂ）に戻って、電子デバイス３の配置と有機デバイス１の封止構造とを説明する。電子デバイス３は、各接続電極部３ａ，３ｂを、長い導体配線２３の中央部分における接合部材４に対向させて、配線基板２上に実装されている。言い換えると、上述の８本の長い導体配線２３や８本の短い導体配線２３は、４つの電子デバイス３の各接続電極部３ａ，３ｂに適切に照明用の電力を供給できるように島状導体２２の対を選択してワイヤボンディングされている。電子デバイス３と配線基板２との間には、電子デバイス３を固定する固定材４１が充填されている。固定材４１は電子デバイス３の素子部分を封止する機能を有するものとすることができる。固定材４１として、例えば、ゲル状のポッテイング剤や、アウトガスの少ない樹脂フイルムなどを用いることができる。電子デバイス３を封止する封止部材５は、電子デバイス３の全体を囲むように配線基板２上に配置されたスペーサ５１と、スペーサ５１上に配置されたガラス製の透明カバー板５２と、これらと配線基板２とを互いに接着して封止する接着剤（不図示）とからなる。なお、長い島状導体２２に接続される３つの電極２２ａがスペーサ５１の下部を通って外部の非封止部に引き出されており、このため、スペーサ５１は、絶縁体とされている。   Returning to FIGS. 1A and 1B, the arrangement of the electronic device 3 and the sealing structure of the organic device 1 will be described. The electronic device 3 is mounted on the wiring board 2 with the connection electrode portions 3 a and 3 b facing the bonding member 4 in the center portion of the long conductor wiring 23. In other words, the eight long conductor wires 23 and the eight short conductor wires 23 described above are island-shaped conductors so that the power for illumination can be appropriately supplied to the connection electrode portions 3 a and 3 b of the four electronic devices 3. 22 pairs are selected and wire bonded. A fixing material 41 for fixing the electronic device 3 is filled between the electronic device 3 and the wiring board 2. The fixing material 41 can have a function of sealing the element portion of the electronic device 3. As the fixing material 41, for example, a gel-like potting agent or a resin film with little outgas can be used. The sealing member 5 for sealing the electronic device 3 includes a spacer 51 disposed on the wiring substrate 2 so as to surround the entire electronic device 3, a glass transparent cover plate 52 disposed on the spacer 51, These are composed of an adhesive (not shown) for adhering these and the wiring board 2 together for sealing. The three electrodes 22a connected to the long island-shaped conductor 22 are drawn out to the outside non-sealing portion through the lower part of the spacer 51. For this reason, the spacer 51 is an insulator.

次に、図３、および図４のフローチャートにより、有機デバイス１の製造方法を説明する。図３（ａ）（ｂ）に示すように、絶縁基板２１の表面に、島状に分布する島状導体２２を形成し（図４のステップＳ１）、島状導体２２間を金属ワイヤで電気的に接続して導体配線２３を形成し（ステップＳ２）、これにより、配線基板２が完成する。次に、図３（ｃ）（ｄ）に示すように、導体配線２３上の所定位置に導体ペースト（接合部材４）を配置し（ステップＳ３）、電子デバイス３の電極を導体ペーストに対向させて、配線基板２上に電子デバイス３を配置する（ステップＳ４）。次に、図３（ｅ）に示すように、導体ペーストを固化させることにより、電子デバイス３の電極と導体配線２３とを電気接続する（ステップＳ５）。この固化の際、または固化の前後に、電子デバイス３の封止と固定のための固定材４１を電子デバイス３と配線基板２との間に注入または配置して電子デバイス３を固定する。最後に、図３（ｆ）（ｇ）に示すように、スペーサ５１と、透明カバー板５２と、封止用接着剤とによって電子デバイス３を封止して（ステップＳ６）、有機デバイス１が完成する。なお、上記の製造工程の順序は、一例であって、適宜順番を入れ替えることができる。   Next, the manufacturing method of the organic device 1 is demonstrated with the flowchart of FIG. 3 and FIG. As shown in FIGS. 3A and 3B, island-shaped conductors 22 distributed in an island shape are formed on the surface of the insulating substrate 21 (step S1 in FIG. 4), and the island-shaped conductors 22 are electrically connected with metal wires. Thus, the conductor wiring 23 is formed (step S2), whereby the wiring board 2 is completed. Next, as shown in FIGS. 3C and 3D, a conductor paste (joining member 4) is disposed at a predetermined position on the conductor wiring 23 (step S3), and the electrodes of the electronic device 3 are made to face the conductor paste. Then, the electronic device 3 is arranged on the wiring board 2 (step S4). Next, as shown in FIG. 3E, the electrode of the electronic device 3 and the conductor wiring 23 are electrically connected by solidifying the conductor paste (step S5). During or after the solidification, a fixing material 41 for sealing and fixing the electronic device 3 is injected or arranged between the electronic device 3 and the wiring board 2 to fix the electronic device 3. Finally, as shown in FIGS. 3F and 3G, the electronic device 3 is sealed with the spacer 51, the transparent cover plate 52, and the sealing adhesive (step S6). Complete. In addition, the order of said manufacturing process is an example, Comprising: Order can be changed suitably.

ここで、有機デバイス１の各部材と製造方法について説明する。絶縁基板２１は、ガラス基板に限らず、シリコンやセラミックなどの無機基板、樹脂基板、これらの複合基板などを用いることができる。また、絶縁基板２１は、少なくとも島状導体２２を設ける表面が電気絶縁性であればよく、金属基板の表面に絶縁層を形成した基板でもよい。島状導体２２は、導体配線２３を接続できる導体であればよく、例えば、絶縁基板２１の表面に成膜された導体膜を用いて形成することができる。導体膜による島状導体２２の形成方法として、例えば、スパッタリング成膜とその後のレジスト塗布、パターン露光、現像、エッチング等のプロセスによる方法、メタルマスクを用いた蒸着やスパッタリングによる直接的パターン形成方法などを用いることができる。また、これらの方法に、無電解めっき、電解めっきなどを組み合わせたり、めっき単独で形成したりすることもできる。また、樹脂成形により、リードフレームなどをインサート成形またはアウトサート成形して、樹脂部分を絶縁基板２１とし、リードフレームなどの露出した金属部分を島状導体２２としてもよい。また、島状導体２２の表面は、高ワイヤボンディング性や、高はんだ密着性などとするために、金メッキ等による多層複合構造とすることができる。導体配線２３は、数十μｍ〜数百μｍの太さの金属ワイヤ、例えば、Ｃｕ製のワイヤであり、他の材質として、Ａｌ、Ａｌ−Ｓｉ合金、Ａｕ合金などの金属性ワイヤとすることができる。接合部材４は、導電性接着剤、例えば、Ａｇペーストを用いることができ、この他に、はんだペーストなどを用いることができる。導体配線２３と島状導体２２の接続方法として、熱や超音波振動を加えるワイヤボンディング方法の他に、導電性接着剤による接着、はんだ付け、レーザ溶接、抵抗溶接、リードフレームへのかしめ、などの種々の方法を用いることができる。   Here, each member and manufacturing method of the organic device 1 will be described. The insulating substrate 21 is not limited to a glass substrate, and an inorganic substrate such as silicon or ceramic, a resin substrate, a composite substrate thereof, or the like can be used. The insulating substrate 21 may be a substrate in which an insulating layer is formed on the surface of a metal substrate, as long as at least the surface on which the island-shaped conductor 22 is provided is electrically insulating. The island-like conductor 22 may be any conductor that can connect the conductor wiring 23, and can be formed using, for example, a conductor film formed on the surface of the insulating substrate 21. Examples of the method for forming the island-shaped conductor 22 using a conductor film include a method using a process such as sputtering film formation and subsequent resist coating, pattern exposure, development, and etching, and a direct pattern formation method using metal mask deposition and sputtering. Can be used. In addition, these methods can be combined with electroless plating, electrolytic plating, etc., or can be formed by plating alone. In addition, the lead frame or the like may be insert-molded or outsert-molded by resin molding so that the resin portion is the insulating substrate 21 and the exposed metal portion such as the lead frame is the island-shaped conductor 22. Further, the surface of the island-shaped conductor 22 can have a multi-layer composite structure by gold plating or the like in order to achieve high wire bonding properties, high solder adhesion, and the like. The conductor wiring 23 is a metal wire having a thickness of several tens of μm to several hundreds of μm, for example, a Cu wire, and other materials are metallic wires such as Al, Al—Si alloy, and Au alloy. Can do. For the bonding member 4, a conductive adhesive, for example, an Ag paste can be used, and besides this, a solder paste or the like can be used. As a method for connecting the conductor wiring 23 and the island-shaped conductor 22, in addition to a wire bonding method for applying heat or ultrasonic vibration, bonding with a conductive adhesive, soldering, laser welding, resistance welding, caulking to a lead frame, etc. Various methods can be used.

電子デバイス３は、フィルム基板３１の上に有機素子によって形成した発光素子であると説明したが、配線基板２には、このような素子に限らず任意機能を有する任意形状の電子デバイス３を実装することができる。例えば、上述の４つの個別の電子デバイスの代わりに、これらの電子デバイス３を一体化してなる大面積の１つの電子デバイスをフィルム基板３１上に柔軟なフィルム状の素子として形成したものを、配線基板２に実装することができる。フィルム基板３１は、有機フィルムであり、例えば、ＰＥＴ樹脂やＰＥＮ樹脂のフィルムを用いることができ、この他に、金属フィルムも用いることができる。金属フィルムの場合、熱放熱性の良いデバイスを形成でき、また、金属フィルムを電極として用いることもできる。スペーサ５１は、電極２２ａに対して電気絶縁できる表面を有するものであればよく、例えば、絶縁基板２１と同じ材質の材料で形成することができる。同じ材質の場合、熱応力に対する耐性が得られるので、絶縁基板２１、スペーサ５１、透明カバー板５２を、例えば、同じ材質のガラスで構成すると好適である。ガラスによって構成した封止構造は、耐湿性や透明性などの点で優れており、有機素子からなる電子デバイス３を実装する有機デバイス１に好適である。他の材料として、ガラス以外に、例えば、Ｓｉ（シリコン）やセラミックなどから、互いに近い線膨張率を有する材料を選択して用いることができる。封止部材５を配線基板２に接着して封止する接着剤は、例えば、ＵＶ硬化樹脂を用いることができ、この他に、低融点ガラスや熱硬化樹脂などを用いることができる。   The electronic device 3 has been described as a light emitting element formed by an organic element on the film substrate 31, but the wiring board 2 is not limited to such an element, and an electronic device 3 having an arbitrary shape having an arbitrary function is mounted. can do. For example, instead of the above-described four individual electronic devices, a single large-area electronic device formed by integrating these electronic devices 3 is formed on the film substrate 31 as a flexible film-like element. It can be mounted on the substrate 2. The film substrate 31 is an organic film. For example, a film of PET resin or PEN resin can be used, and a metal film can also be used. In the case of a metal film, a device having good heat dissipation can be formed, and the metal film can also be used as an electrode. The spacer 51 only needs to have a surface that can be electrically insulated from the electrode 22a. For example, the spacer 51 can be formed of the same material as that of the insulating substrate 21. In the case of the same material, resistance to thermal stress can be obtained. Therefore, it is preferable that the insulating substrate 21, the spacer 51, and the transparent cover plate 52 are made of glass of the same material, for example. The sealing structure made of glass is excellent in terms of moisture resistance and transparency, and is suitable for the organic device 1 on which the electronic device 3 made of an organic element is mounted. As other materials, materials having linear expansion coefficients close to each other can be selected and used, for example, from Si (silicon) or ceramics in addition to glass. For example, a UV curable resin can be used as an adhesive for sealing the sealing member 5 to the wiring substrate 2, and in addition, a low melting point glass, a thermosetting resin, or the like can be used.

次に、図５、図６、図７により、有機デバイス１および配線基板２の変形例を示す。図５に示す有機デバイス１は、上述の配線基板２における導体配線２３の配置を変更した配線基板に、上記の電子デバイス３よりも面積の小さい電子デバイス３を６つ、実装して成る変形例であり、他の構成は、上述の有機デバイス１と同様である。また、図６（ａ）（ｂ）に示す有機デバイス１は、図５に示した配線基板２において、電子デバイス３の電極と導体配線２３とを電気接続する接合部材４を増やしたものである。接合部材４の設置場所や個数は、任意に増やすことができる。これにより、より低抵抗で両者を電気接続することができ、導体配線２３の低抵抗性をより有効に発揮することができる。また、図７に示す有機デバイス１は、図５に示した有機デバイス１において、導体配線２３を形成する材料として、金属ワイヤに替えて金属リボンとしたものである。金属リボンは、金属ワイヤよりも、表面積を大きくすることができるので、導体配線２３と島状導体２２との接合部や、導体配線２３と電子デバイス３の電極との接合部においてより大きな面積で接合することができ、接合抵抗を低減することができる。さらに、金属リボンは、金属ワイヤよりも、断面積を大きくできることから、より電流容量の大きい電流路を形成することができる。金属リボンと島状導体２２との接合は、金属ワイヤの場合と同様の方法による他、例えば、パラレルギャップ溶接機を用いて溶接により接合することができる。また、金属リボンと電子デバイス３の電極との接合は、金属ワイヤの場合と同様の方法を用いることができる。   Next, modified examples of the organic device 1 and the wiring board 2 are shown in FIGS. 5, 6, and 7. The organic device 1 shown in FIG. 5 is a modification in which six electronic devices 3 having an area smaller than that of the electronic device 3 are mounted on a wiring board in which the arrangement of the conductor wiring 23 in the wiring board 2 is changed. Other configurations are the same as those of the organic device 1 described above. Moreover, the organic device 1 shown to Fig.6 (a) (b) is the thing which increased the joining member 4 which electrically connects the electrode of the electronic device 3, and the conductor wiring 23 in the wiring board 2 shown in FIG. . The installation location and the number of the joining members 4 can be arbitrarily increased. Thereby, both can be electrically connected with lower resistance, and the low resistance of the conductor wiring 23 can be exhibited more effectively. Further, the organic device 1 shown in FIG. 7 is a metal ribbon in place of the metal wire as a material for forming the conductor wiring 23 in the organic device 1 shown in FIG. Since the metal ribbon can have a larger surface area than the metal wire, the metal ribbon has a larger area at the junction between the conductor wiring 23 and the island-shaped conductor 22 and at the junction between the conductor wiring 23 and the electrode of the electronic device 3. Bonding can be performed, and the bonding resistance can be reduced. Furthermore, since the metal ribbon can have a larger cross-sectional area than the metal wire, a current path with a larger current capacity can be formed. The metal ribbon and the island-shaped conductor 22 can be joined by welding using a parallel gap welding machine, for example, in the same manner as in the case of a metal wire. Moreover, the same method as the case of a metal wire can be used for joining the metal ribbon and the electrode of the electronic device 3.

本実施形態の配線基板２によれば、島状導体２２間を接続する金属ワイヤや金属リボンによる導体配線２３を、電子デバイス３の電極を電気的に接続可能に容易に構成でき、断面が大きい導体配線を用いて電流容量の大きい配線を容易に実現できる。従い、配線基板２は、発光素子などの電流容量の大きい電子デバイス３を実装することができる。また、配線基板２は、導体配線２３の配置が島状導体２２間で容易に変更できるので、すなわち、導体配線２３の配線取り回しを容易に変更できるので、電子デバイス３や有機デバイス１の設計変更に容易に対応できる。このような配線基板２を用いる有機デバイス１は、電子デバイス３（有機素子）の電極パターン変更や電極配置変更などの設計変更に容易に対応できるので、コストを抑制することができる。   According to the wiring board 2 of the present embodiment, the conductor wiring 23 made of metal wires or metal ribbons connecting the island-shaped conductors 22 can be easily configured so that the electrodes of the electronic device 3 can be electrically connected, and the cross section is large. A wiring having a large current capacity can be easily realized by using the conductor wiring. Accordingly, the wiring board 2 can be mounted with an electronic device 3 having a large current capacity such as a light emitting element. In addition, since the wiring board 2 can easily change the arrangement of the conductor wiring 23 between the island-like conductors 22, that is, the wiring routing of the conductor wiring 23 can be easily changed, the design change of the electronic device 3 or the organic device 1 can be made. Can be easily accommodated. Since the organic device 1 using such a wiring board 2 can easily cope with a design change such as an electrode pattern change or an electrode arrangement change of the electronic device 3 (organic element), the cost can be suppressed.

有機デバイス１の他の変形例として、配線基板２と電子デバイス３との間に、透明または不透明の絶縁マスクシートであって、接合部材４を配置する部位に開口を有するシートを備えるようにしてもよい。絶縁マスクシートは、その両面または片面に接着剤や粘着材を備えてもよい。その接着剤や粘着材は、加熱によって接着や粘着の効果を発現し、加熱後の冷却状態において、その接着や粘着の効果維持する特性を有するものを好適に用いることができる。このような絶縁マスクシートを用いることにより、電子デバイス３と島状導体２２や導体配線２３との間の絶縁を自在に確保できるので、電子デバイス３の設計変更時における、配線基板２および有機デバイス１の設計変更対応性を強化することができる。   As another modified example of the organic device 1, a transparent or opaque insulating mask sheet is provided between the wiring substrate 2 and the electronic device 3, and a sheet having an opening at a portion where the bonding member 4 is disposed is provided. Also good. The insulating mask sheet may be provided with an adhesive or a pressure-sensitive adhesive on both sides or one side. As the adhesive and the pressure-sensitive adhesive material, those that exhibit the effect of adhesion or pressure-sensitive adhesive by heating and have the property of maintaining the effect of the adhesion or pressure-sensitive adhesive in the cooled state after heating can be suitably used. By using such an insulating mask sheet, insulation between the electronic device 3 and the island-like conductor 22 or the conductor wiring 23 can be secured freely. Therefore, the wiring board 2 and the organic device when the design of the electronic device 3 is changed It is possible to reinforce the design change compatibility of 1.

図８（ａ）（ｂ）により、有機デバイス１のさらに他の変形例を説明する。この変形例は、図１（ａ）（ｂ）に示した有機デバイス１におけるスペーサ５１と透明カバー板５２とを一体化して、封止部材５を形成したものである。一体化した封止部材５は、ガラス板材の一面に、周辺のスペーサ部を残すように、掘り込み部５ａを形成したものである。掘り込み部５ａの形成は、例えば、サンドブラスト加工、研削や切削による機械加工、化学エッチングによる加工などの加工方法を用いて行うことができる。このような封止部材５は、一体化されているので、スペーサ５１と透明カバー板５２とを組み合わせるものに比べて、取り扱いが容易であり、また、接合部が一平面だけであるので、封止の信頼性も向上する。   Still another modified example of the organic device 1 will be described with reference to FIGS. In this modification, the sealing member 5 is formed by integrating the spacer 51 and the transparent cover plate 52 in the organic device 1 shown in FIGS. The integrated sealing member 5 is formed by forming a dug portion 5a so as to leave a peripheral spacer portion on one surface of a glass plate material. The digging portion 5a can be formed by using a processing method such as sand blasting, machining by grinding or cutting, or processing by chemical etching. Since such a sealing member 5 is integrated, it is easier to handle than a combination of the spacer 51 and the transparent cover plate 52, and the joint portion is only one plane. The reliability of stopping is also improved.

次に、図９、図１０により、レーザ光を用いて島状導体２２を形成する方法を説明する。図９（ａ）に示すように、絶縁基板２１の表面にめっき用の導体下地膜２０を、例えばスパッタリング成膜法や蒸着法によって形成する（図１０のステップＳ１１）。他の成膜法として、ＣＶＤ法や無電解めっき法などを用いてもよい。次に、図９（ｂ）に示すように、島状導体領域２０ａと絶縁領域２０ｂとの境界部分の導体下地膜を、レーザ光ＬＢの照射と所定の経路に沿ったレーザ光ＬＢの走査とによって、蒸発除去する（ステップＳ１２）。島状導体領域２０ａは、所定の電子デバイス３を実装するために必要な領域に加え、予め、種々の設計変更が予定される電子デバイス３の実装に対応することを考慮して、多めに形成しておく。その後、島状導体領域２０ａにめっき層を形成し、図９（ｃ）に示すように、膜厚を増やして島状導体２２を形成する（ステップＳ１３）。次に、軽くエッチング処理することにより絶縁領域２０ｂである導体下地膜を除去して、図９（ｄ）に示すように、互いに絶縁され所定の厚みを有して島状に分布した島状導体２２を有する絶縁基板２１が完成する（ステップＳ１４）。なお、この工程の前または後に、めっきタイバーの除去などを行う。最後に、図９（ｅ）に示すように、島状導体２２間を、適宜導体配線２３によって接続して、配線基板２が完成する（ステップＳ１５）。このようなレーザ光を用いる島状導体２２の形成方法によれば、レーザ光の走査のための経路変更によって種々のパターンや配置の島状導体２２を容易に設計、変更でき、エッチングマスクや露光マスクが不要であり、低コストで配線基板２を製造することができる。また、めっきは、島状導体２２の形成のみに用いられ、導体配線はめっきによらないので、つまり最小限のめっき面積のもとで、低コストで効率良くめっきを行うことができる。   Next, a method of forming the island-shaped conductor 22 using laser light will be described with reference to FIGS. As shown in FIG. 9A, a conductor base film 20 for plating is formed on the surface of the insulating substrate 21 by, for example, a sputtering film forming method or a vapor deposition method (step S11 in FIG. 10). As another film forming method, a CVD method, an electroless plating method, or the like may be used. Next, as shown in FIG. 9B, the conductor base film at the boundary between the island-shaped conductor region 20a and the insulating region 20b is irradiated with the laser beam LB and scanned with the laser beam LB along a predetermined path. To evaporate and remove (step S12). The island-shaped conductor region 20a is formed in a large amount in consideration of the mounting of the electronic device 3 for which various design changes are planned in advance in addition to the region necessary for mounting the predetermined electronic device 3. Keep it. Thereafter, a plating layer is formed in the island-shaped conductor region 20a, and the island-shaped conductor 22 is formed by increasing the film thickness as shown in FIG. 9C (step S13). Next, the conductor base film which is the insulating region 20b is removed by performing a light etching process, and as shown in FIG. 9D, island-like conductors that are insulated from each other and have a predetermined thickness are distributed in an island shape. The insulating substrate 21 having 22 is completed (step S14). The plating tie bar is removed before or after this step. Finally, as shown in FIG. 9 (e), the island-like conductors 22 are appropriately connected by the conductor wiring 23 to complete the wiring board 2 (step S15). According to such a method for forming the island-shaped conductors 22 using laser light, the island-shaped conductors 22 having various patterns and arrangements can be easily designed and changed by changing the path for scanning the laser light. A mask is unnecessary, and the wiring board 2 can be manufactured at low cost. Further, the plating is used only for forming the island-like conductors 22 and the conductor wiring does not depend on the plating, that is, the plating can be efficiently performed at a low cost under the minimum plating area.

次に、図１１、図１２、図１３により、有機デバイス１と配線基板２の、さらに他の変形例を説明する。この変形例は、図１１に示すように、絶縁基板２１が、貫通孔６を有し、導体配線２３の端部が貫通孔６に挿通されているものであり、他の構成は、図１に示した有機デバイス１や配線基板２と同様である。貫通孔６は、封止部材５によって封止された内部領域に開口を有するように形成され、貫通孔６の内部は封止材５３によって封止されている。封止材５３は、例えば、低融点ガラスの他、ＵＶ硬化樹脂、熱硬化樹脂などを用いることができる。また、絶縁基板２１の裏面（電子デバイス３が実装されている面の反対側の面）にも、島状導体２２ｂが形成されており、貫通孔６を通過して裏面に導出された導体配線２３の端部が、前記裏面の島状導体２２ｂに接続されている。裏面の島状導体２２ｂは、図１（ａ）（ｂ）に示した入出力用の電極２２ａに相当する。封止部材５によって封止された空間から、外部空間の入出力用の島状導体２２ｂへの配線引き出しが、封止部材５と絶縁基板２１との接合部を経由しないので、スペーサ５１は絶縁体に限らず金属などの導体を用いることができる。また、封止部材５と絶縁基板２１との接合方法として、スペーサ５１が島状導体２２や導体配線２３と接触しないので、ロウ付けなどの金属を用いた接合も可能である。スペーサ５１を金属で形成する場合、例えば、ＦｅＮｉ合金などを用いることにより、ガラス製の絶縁基板２１や透明カバー板５２に対して線膨張率を合わせることができる。また、スペーサ５１が島状導体などのパターン導体を乗り越える必要がなく、絶縁基板２１の平面に対して平面同士の接合ができるので、封止処理が確実容易となる。   Next, still another modification example of the organic device 1 and the wiring board 2 will be described with reference to FIGS. 11, 12, and 13. In this modified example, as shown in FIG. 11, the insulating substrate 21 has a through hole 6, and the end portion of the conductor wiring 23 is inserted into the through hole 6. The same as the organic device 1 and the wiring board 2 shown in FIG. The through hole 6 is formed to have an opening in an internal region sealed by the sealing member 5, and the inside of the through hole 6 is sealed by a sealing material 53. As the sealing material 53, for example, a UV curable resin, a thermosetting resin, or the like can be used in addition to the low melting point glass. Further, island-like conductors 22b are also formed on the back surface of the insulating substrate 21 (the surface opposite to the surface on which the electronic device 3 is mounted), and the conductor wiring is led to the back surface through the through hole 6 An end portion of 23 is connected to the island-like conductor 22b on the back surface. The back surface island-shaped conductor 22b corresponds to the input / output electrode 22a shown in FIGS. Since the wiring drawing from the space sealed by the sealing member 5 to the island-shaped conductor 22b for input / output in the external space does not pass through the joint portion between the sealing member 5 and the insulating substrate 21, the spacer 51 is insulated. Not only the body but also a conductor such as metal can be used. Further, as a method of joining the sealing member 5 and the insulating substrate 21, since the spacer 51 does not contact the island-like conductor 22 and the conductor wiring 23, joining using a metal such as brazing is possible. When the spacer 51 is formed of a metal, for example, the linear expansion coefficient can be matched to the glass insulating substrate 21 and the transparent cover plate 52 by using an FeNi alloy or the like. Further, since the spacer 51 does not have to go over the pattern conductor such as the island-shaped conductor and the planes of the insulating substrate 21 can be joined to each other, the sealing process is surely easy.

配線基板２の製造方法を説明する。図１２（ａ）に示すように、絶縁基板２１に貫通孔６を形成し（図１３のステップＳ２１）、その後、図１２（ｂ）に示すように、絶縁基板２１の表裏に島状導体２２，２２ｂを形成する（ステップＳ２２）。貫通孔６の形成は、絶縁基板２１の材料に応じて適宜形成方法を選択することができ、例えば、サンドブラスト加工、化学エッチング加工、ドリルによる機械加工、などの加工方法を用いることができる。また、島状導体２２，２２ｂの形成は、上述した種々の形成方法を用いて行うことができる。次に、図１２（ｃ）に示すように、例えば、金属ワイヤからなる導体配線２３の一端を島状導体２２に電気的に接続し（ステップＳ２３）、他端を貫通孔６に通過させて裏面へ導出する（ステップＳ２４）。その後、図１２（ｄ）に示すように、貫通孔６の内部を封止材５３によって封止すると共に導体配線２３を固定し、裏面の島状導体２２ｂに導体配線２３の他端を電気的に接続して配線基板２が完成する（ステップＳ２５）。なお、導体配線２３は、表面の島状導体２２と裏面の島状導体２２ｂとの間で接続するだけでなく、表面における２つの島状導体２２間で接続する（不図示）。また、島状導体２２は、図１（ａ）に示したように、島状導体２２間を接続するための長い島状導体２２を備えている（不図示）。また、図１４、図１５（ａ）（ｂ）に示すように、導体配線２３の両端を裏面の島状導体２２ｂに電気的に接続するようにしてもよい。このような貫通孔６を有する配線基板２によれば、配線基板２の表面に入出力用の電極２２ａを設ける必要がなく、配線基板２、従って、これを用いる有機デバイス１の小面積化、小型化を実現できる。   A method for manufacturing the wiring board 2 will be described. As shown in FIG. 12A, the through-hole 6 is formed in the insulating substrate 21 (step S21 in FIG. 13), and then the island-like conductors 22 are formed on the front and back of the insulating substrate 21 as shown in FIG. , 22b (step S22). Formation of the through-hole 6 can be appropriately selected according to the material of the insulating substrate 21. For example, a processing method such as sand blasting, chemical etching, or machining by a drill can be used. The island-shaped conductors 22 and 22b can be formed by using the various forming methods described above. Next, as shown in FIG. 12C, for example, one end of the conductor wiring 23 made of a metal wire is electrically connected to the island-like conductor 22 (step S23), and the other end is passed through the through hole 6. Derived to the back surface (step S24). Thereafter, as shown in FIG. 12D, the inside of the through hole 6 is sealed with a sealing material 53 and the conductor wiring 23 is fixed, and the other end of the conductor wiring 23 is electrically connected to the island-like conductor 22b on the back surface. Then, the wiring board 2 is completed (step S25). The conductor wiring 23 is not only connected between the island conductor 22 on the front surface and the island conductor 22b on the back surface, but also connected between the two island conductors 22 on the front surface (not shown). Further, as shown in FIG. 1A, the island-shaped conductor 22 includes a long island-shaped conductor 22 for connecting the island-shaped conductors 22 (not shown). Further, as shown in FIGS. 14, 15A and 15B, both ends of the conductor wiring 23 may be electrically connected to the island-like conductor 22b on the back surface. According to the wiring board 2 having such a through-hole 6, it is not necessary to provide the input / output electrode 22a on the surface of the wiring board 2, and the wiring board 2, and thus the area of the organic device 1 using this can be reduced. Miniaturization can be realized.

次に、図１６、図１７、図１８により、有機デバイス１と配線基板２の、さらに他の変形例を説明する。この変形例は、図１６に示すように、絶縁基板２１が、その表裏を電気的に接続するビア７を有し、ビア７が、島状導体２２，２２ｂに電気的に接続されているものであり、他の構成は、図１、図１１等に示した有機デバイス１や配線基板２と同様である。配線基板２の製造方法を説明する。図１７（ａ）に示すように、絶縁基板２１に貫通孔６を形成し（図１８のステップＳ３１）、その後、図１７（ｂ）に示すように、貫通孔６を導体で充填してビア７（貫通孔内配線）を形成する（ステップＳ３２）。次に、図１７（ｃ）に示すように、絶縁基板２１の表裏に島状導体２２，２２ｂを形成し（ステップＳ３３）、その後、図１７（ｄ）に示すように、島状導体２２間に導体配線２３を接続して配線基板２が完成する（ステップＳ３４）。貫通孔６の形成と島状導体２２，２２ｂの形成は、例えば、上述の図１１に示した変形例と同様に行うことができる。ビア７の形成は、例えば、貫通孔６内へのめっき層形成、導電性ペースト充填、低融点金属（はんだ）充填、ＣＶＤ埋め込みプラグの形成などによって行うことができる。ビア７は、少なくとも、封止空間から外部に必要な配線を引き出すことができる個数だけ備えればよいが、設計変更の自由度を増すために、余裕をもって、より多くのビア７を分布させて備える。この場合、各ビア７は、電子デバイス３の仕様に応じて、使用されたり、使用されなかったりすることになる。このような構造を有する配線基板２は、導体配線２３の配置変更によって電子デバイス３や有機デバイス１の設計変更に容易に対応できる。   Next, still another modification example of the organic device 1 and the wiring board 2 will be described with reference to FIGS. 16, 17, and 18. In this modification, as shown in FIG. 16, the insulating substrate 21 has vias 7 that electrically connect the front and back thereof, and the vias 7 are electrically connected to the island-shaped conductors 22 and 22b. Other configurations are the same as those of the organic device 1 and the wiring board 2 shown in FIGS. A method for manufacturing the wiring board 2 will be described. As shown in FIG. 17A, the through hole 6 is formed in the insulating substrate 21 (step S31 in FIG. 18), and then the through hole 6 is filled with a conductor as shown in FIG. 7 (wiring in the through hole) is formed (step S32). Next, as shown in FIG. 17C, island-shaped conductors 22 and 22b are formed on the front and back of the insulating substrate 21 (step S33), and then between the island-shaped conductors 22 as shown in FIG. The conductor wiring 23 is connected to the wiring board 2 to complete the wiring board 2 (step S34). The formation of the through-hole 6 and the formation of the island-shaped conductors 22 and 22b can be performed, for example, in the same manner as the modification shown in FIG. The via 7 can be formed, for example, by forming a plating layer in the through hole 6, filling with a conductive paste, filling with a low melting point metal (solder), or forming a CVD buried plug. It is sufficient to provide at least as many vias 7 as necessary so that necessary wiring can be drawn outside from the sealing space. However, in order to increase the degree of freedom of design change, more vias 7 are distributed with a margin. Prepare. In this case, each via 7 is used or not used depending on the specifications of the electronic device 3. The wiring board 2 having such a structure can easily cope with a design change of the electronic device 3 or the organic device 1 by changing the arrangement of the conductor wiring 23.

次に、図１９、図２０、図２１により、有機デバイス１と配線基板２の、さらに他の変形例を説明する。この変形例は、図１９に示すように、絶縁基板２１が、その表裏を電気的に接続する導体ピン８を有し、導体ピン８の端部が島状導体２２を構成するものであり、他の構成は、図１６等に示した有機デバイス１や配線基板２と同様である。配線基板２の製造方法を説明する。図２０（ａ）に示すように、絶縁基板２１に貫通孔６を形成し（図２１のステップＳ４１）、その後、図２０（ｂ）に示すように、貫通孔６に導体ピン８を挿通する（ステップＳ４２）。次に、図２０（ｃ）に示すように、貫通孔６の内部に封止材５３を充填して貫通孔６を封止すると共に導体ピン８を固定して導体ピン８の端部を島状導体２２とする（ステップＳ４３）。その後、図２０（ｄ）に示すように、島状導体２２間に導体配線２３を接続して配線基板２が完成する（ステップＳ４４）。   Next, still another modification example of the organic device 1 and the wiring board 2 will be described with reference to FIGS. 19, 20, and 21. In this modified example, as shown in FIG. 19, the insulating substrate 21 has conductor pins 8 that electrically connect the front and back, and the ends of the conductor pins 8 constitute the island-shaped conductors 22. Other configurations are the same as those of the organic device 1 and the wiring board 2 shown in FIG. A method for manufacturing the wiring board 2 will be described. As shown in FIG. 20A, the through hole 6 is formed in the insulating substrate 21 (step S41 in FIG. 21), and then the conductor pin 8 is inserted into the through hole 6 as shown in FIG. 20B. (Step S42). Next, as shown in FIG. 20 (c), the inside of the through hole 6 is filled with a sealing material 53 to seal the through hole 6, and the conductor pin 8 is fixed and the end of the conductor pin 8 is connected to the island. The conductor 22 is formed (step S43). Thereafter, as shown in FIG. 20D, the conductor wiring 23 is connected between the island-shaped conductors 22 to complete the wiring board 2 (step S44).

貫通孔６は、導体ピン８の個数と同じかより多い個数で形成し、導体ピン８を有しないで封止だけされたものがあってもよい。導体ピン８は、島状導体２２となる部分が導体配線２３を接続可能な構造と材質であればよく、図示のように、島状導体２２とするための拡径した頭部を備えると、貫通孔６への挿通固定の際にも好適である。導体ピン８は、絶縁基板２１をガラスで形成する場合に、ガラスと線膨張率の近い金属、例えば、ＦｅＮｉ合金などを用いる。島状導体２２は、導体ピン８の端部だけでなく、導体ピン８によらないで、例えば成膜によって、絶縁基板２１の表面に形成して備えることができる（不図示）。また、導体配線２３は、導体ピン８（の島状導体２２）間を接続するだけでなく、導体ピン８と導体ピン８によらない島状導体２２との間、導体ピン８によらない島状導体２２どうしの間に配線される（不図示）。絶縁基板２１の裏面側における導体ピン８の端部は、例えば、上述の図１６における絶縁基板２１の裏面側の島状導体２２ｂに相当し、電子デバイス３への入出力用の端子とされる。貫通孔６の形成と島状導体２２の形成は、例えば、上述の図１１に示した変形例と同様に行うことができる。上述の貫通孔６に導体ピン８を挿通して封止材５３によって封止する製造方法に代えて、導体ピン８をインサートする樹脂成形によって、導体ピン８による島状導体２２を備えた絶縁基板２１を形成してもよい。このような導体ピン８を有する構造の配線基板２は、導体配線２３の配置変更や導体ピン８の配置変更などによって、電子デバイス３や有機デバイス１の設計変更に容易に対応することができる。   The through holes 6 may be formed with the same number as or more than the number of conductor pins 8 and sealed without the conductor pins 8. The conductor pin 8 only needs to have a structure and material in which the portion that becomes the island-shaped conductor 22 can be connected to the conductor wiring 23. It is also suitable for insertion and fixation into the through hole 6. When the insulating substrate 21 is formed of glass, the conductor pin 8 uses a metal having a linear expansion coefficient close to that of glass, for example, an FeNi alloy. The island-shaped conductor 22 can be provided not only on the end portion of the conductor pin 8 but also on the surface of the insulating substrate 21 by film formation, for example, without depending on the conductor pin 8 (not shown). Further, the conductor wiring 23 not only connects the conductor pins 8 (island conductors 22) between them, but also between the conductor pins 8 and the island conductors 22 that do not depend on the conductor pins 8, and the islands that do not depend on the conductor pins 8. Wiring is performed between the conductors 22 (not shown). The ends of the conductor pins 8 on the back surface side of the insulating substrate 21 correspond to, for example, the island-shaped conductors 22b on the back surface side of the insulating substrate 21 in FIG. 16 described above, and serve as input / output terminals for the electronic device 3. . The formation of the through holes 6 and the island-shaped conductors 22 can be performed, for example, in the same manner as the modification shown in FIG. Instead of the manufacturing method in which the conductor pin 8 is inserted into the through-hole 6 and sealed with the sealing material 53, an insulating substrate provided with the island-shaped conductor 22 by the conductor pin 8 by resin molding in which the conductor pin 8 is inserted. 21 may be formed. The wiring board 2 having the structure having the conductor pins 8 can easily cope with the design change of the electronic device 3 or the organic device 1 by changing the arrangement of the conductor wiring 23 or changing the arrangement of the conductor pins 8.

次に、図２２（ａ）（ｂ）（ｃ）により、配線基板２の、さらに他の変形例を説明する。この変形例は、配線基板２への電子デバイス３の実装構造にかかわるものである。絶縁基板２１の表面において島状導体２２の間に橋渡された２本の導体配線２３が平行に設けられている。電子デバイス３は、上述の図２に示した電子デバイス３と同様のデバイスであって、接続電極部３ａ，３ｂを一面に有し、フィルム基板３１を下にして接続電極部３ａ，３ｂを上に向けて、両導体配線２３の間に配置されている。接続電極部３ａ，３ｂのそれぞれは、導体配線２３に隣接しており、接合部材４によって導体配線２３に電気的に接続されている。すなわち、この変形例の電子デバイス３はフェイスアップ実装されているものであり、この点において、図２における電子デバイス３をフェイスダウン実装したものとは相違する。このような実装構造（および、他の実施形態や変形例の実装構造）における導体配線２３は、島状導体２２間で直線的に配設されている必要はなく、例えば、金属ワイヤで導体配線２３を形成する場合に、導体配線２３をたるませて配線してもよい。たるみのある導体配線２３に対して、電子デバイス３を両導体配線２３の間に容易に配置できる。また、電子デバイス３の接続電極部３ａ，３ｂに電気的に接続する際に、各導体配線２３を各接続電極部３ａ，３ｂ側に引き寄せたり、移動させたり、屈曲させたりして、接合部材４によって互いに電気接続することができる。   Next, still another modification of the wiring board 2 will be described with reference to FIGS. 22 (a), 22 (b), and 22 (c). This modification relates to the mounting structure of the electronic device 3 on the wiring board 2. Two conductor wires 23 bridged between the island-like conductors 22 on the surface of the insulating substrate 21 are provided in parallel. The electronic device 3 is the same device as the electronic device 3 shown in FIG. 2 described above, and has the connection electrode portions 3a and 3b on one side, and the connection electrode portions 3a and 3b with the film substrate 31 facing down. It is arranged between both conductor wirings 23. Each of the connection electrode portions 3 a and 3 b is adjacent to the conductor wiring 23 and is electrically connected to the conductor wiring 23 by the bonding member 4. In other words, the electronic device 3 of this modification is mounted face-up, and in this respect, is different from that in which the electronic device 3 in FIG. 2 is mounted face-down. The conductor wiring 23 in such a mounting structure (and mounting structures of other embodiments and modifications) need not be linearly arranged between the island-like conductors 22; When forming 23, the conductor wiring 23 may be slackened and wired. The electronic device 3 can be easily disposed between the conductor wires 23 with respect to the conductor wires 23 having slackness. Further, when electrically connecting to the connection electrode portions 3a and 3b of the electronic device 3, each conductor wiring 23 is pulled toward, moved to, or bent from the connection electrode portions 3a and 3b, thereby joining members. 4 can be electrically connected to each other.

なお、本発明は、上記構成に限られることなく種々の変形が可能である。例えば、上述した各実施形態や変形例の構成を互いに組み合わせた構成とすることができる。例えば、ビア７を有する構成、導体ピン８を有する構成、貫通孔６に導体配線２３を通過させる構成などの各構成要素や、金属ワイヤと金属リボンの両方を用いる構成などを、１つの配線基板２に混載して使用することができる。島状導体２２，２２ｂは、その個数、パターン形状、配置などを任意に選択して構成することができる。島状導体２２，２２ｂの断面構造は、十分な電流容量が得られる厚みや広さとされ、導体配線２３は、必要な電流容量を得るために複数本を並列配線することができ、それらの複数配線に対して接合部材４が用いられる。上述した配線基板２や有機デバイス１の製造工程間の順序は、一例であって、適宜順番を入れ替えることができる。   The present invention is not limited to the above-described configuration, and various modifications can be made. For example, the configurations of the above-described embodiments and modifications can be combined with each other. For example, each wiring board includes a configuration having a via 7, a configuration having a conductor pin 8, a configuration in which the conductor wiring 23 is passed through the through-hole 6, a configuration using both a metal wire and a metal ribbon, and the like. 2 can be used together. The island-shaped conductors 22 and 22b can be configured by arbitrarily selecting the number, pattern shape, arrangement, and the like. The cross-sectional structure of the island-shaped conductors 22 and 22b has a thickness and a width that can provide a sufficient current capacity, and a plurality of conductor wirings 23 can be wired in parallel to obtain a necessary current capacity. A joining member 4 is used for the wiring. The order between the manufacturing processes of the wiring board 2 and the organic device 1 described above is an example, and the order can be appropriately changed.

１ 有機デバイス
２ 配線基板
２１ 絶縁基板
２２，２２ｂ 島状導体
２３ 導体配線
３ 電子デバイス
４ 接合部材
５ 封止部材
６ 貫通孔
７ ビア
８ 導体ピン DESCRIPTION OF SYMBOLS 1 Organic device 2 Wiring board 21 Insulating board 22, 22b Island-like conductor 23 Conductor wiring 3 Electronic device 4 Joining member 5 Sealing member 6 Through-hole 7 Via 8 Conductor pin

Claims (7)

電子デバイス実装用の配線基板において、
絶縁基板と、
前記絶縁基板の表面に島状に設けられた複数の島状導体と、
前記島状導体間を電気的に接続する導体配線と、を備え、
前記導体配線は、金属ワイヤまたは金属リボンから成り、実装される電子デバイスの電極が該導体配線に電気的に接続可能に構成されていることを特徴とする配線基板。 In wiring boards for mounting electronic devices,
An insulating substrate;
A plurality of island-shaped conductors provided in an island shape on the surface of the insulating substrate;
A conductor wiring for electrically connecting the island-shaped conductors,
The wiring board is characterized in that the conductor wiring is made of a metal wire or a metal ribbon, and an electrode of an electronic device to be mounted is configured to be electrically connectable to the conductor wiring. 前記絶縁基板の表面に成膜された導体膜が前記島状導体を構成することを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the conductor film formed on the surface of the insulating substrate constitutes the island-shaped conductor. 前記絶縁基板は、その表裏を電気的に接続するビアを有し、
前記ビアは、前記島状導体に電気的に接続されていることを特徴とする請求項１または請求項２に記載の配線基板。 The insulating substrate has vias that electrically connect the front and back surfaces thereof,
The wiring board according to claim 1, wherein the via is electrically connected to the island-shaped conductor. 前記絶縁基板は、貫通孔を有し、
前記導体配線は、その端部が前記貫通孔に挿通されていることを特徴とする請求項１乃至請求項３のいずれか一項に記載の配線基板。 The insulating substrate has a through hole;
The wiring board according to any one of claims 1 to 3, wherein an end portion of the conductor wiring is inserted into the through hole. 前記絶縁基板に挿通された導体ピンの端部が前記島状導体を構成することを特徴とする請求項１乃至請求項４のいずれか一項に記載の配線基板。   5. The wiring board according to claim 1, wherein an end portion of a conductor pin inserted through the insulating board constitutes the island-shaped conductor. 前記絶縁基板は、ガラス基板であることを特徴とする請求項１乃至請求項５のいずれか一項に記載の配線基板。   The wiring board according to claim 1, wherein the insulating substrate is a glass substrate. 請求項１乃至請求項６のいずれか一項に記載の配線基板に電子デバイスが実装され、
前記電子デバイスは、有機素子と、その有機素子に対して電気的接続を行う電極と、をフィルムの表面に備え、前記電極が接合部材によって前記配線基板の導体配線に電気的に接続されていることを特徴とする有機デバイス。 An electronic device is mounted on the wiring board according to any one of claims 1 to 6,
The electronic device includes an organic element and an electrode that is electrically connected to the organic element on a surface of the film, and the electrode is electrically connected to the conductor wiring of the wiring board by a bonding member. An organic device characterized by that.
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WO2015033775A1 (en) * 2013-09-04 2015-03-12 コニカミノルタ株式会社 Surface light emitting unit
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