JP2013095292A - Led light - Google Patents

Led light Download PDF

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JP2013095292A
JP2013095292A JP2011240419A JP2011240419A JP2013095292A JP 2013095292 A JP2013095292 A JP 2013095292A JP 2011240419 A JP2011240419 A JP 2011240419A JP 2011240419 A JP2011240419 A JP 2011240419A JP 2013095292 A JP2013095292 A JP 2013095292A
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terminal
housing
substrate
end portion
led light
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Shozo Maeno
正蔵 前野
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a LED light that can prevent a base end part soldered on a base plate of a terminal from being damaged or peeled off even when excessive stress is applied to the terminal.SOLUTION: In the LED light 1, the base end part 8A of the terminal 8 is soldered on the base plate 3 mounting the LED 5, and a tip end 8B extending from the base plate 3 of the terminal 8 penetrates a through-hole 2f formed in a housing 2. The tip end 8B extending from the base plate 3 of the terminal 8, and penetrating the through-hole 2f of the housing 2 is offset in the direction orthogonally intersecting the base plate 3 surface toward the base end part 8A. A land for soldering to the base plate 3 of the base end part 8A of the terminal 8 is extended in the longitudinal direction of the base end part 8A.

Description

本発明は、ＬＥＤを光源とするＬＥＤライトに関するものである。   The present invention relates to an LED light using an LED as a light source.

近年、省電力で高寿命であるＬＥＤ（発光ダイオード）を光源として使用するＬＥＤライトが増えつつある。斯かるＬＥＤライトは、その指向性の高さからスポットライト的な照明に適しており、例えばフットライトやカップホルダライト、グローボックスライト等の車載用室内照明に供されている。   In recent years, LED lights that use power-saving and long-life LEDs (light-emitting diodes) as light sources are increasing. Such LED lights are suitable for spotlight-like lighting because of their high directivity, and are used for in-vehicle indoor lighting such as footlights, cup holder lights, and glow box lights.

ところで、ＬＥＤライトに関して特許文献１には、照度の均一化を図るためにＬＥＤからの光が通過する領域の周縁部分に光拡散部材を配置する構成が提案されている。   By the way, regarding the LED light, Patent Document 1 proposes a configuration in which a light diffusing member is arranged in a peripheral portion of a region through which light from the LED passes in order to make the illuminance uniform.

特開２００５−１８３１９３号公報JP 2005-183193 A

しかしながら、特許文献１において提案されたＬＥＤライトにおいては、端子を樹脂でモールドする構成が採用されているため、部品コストや金型コストが上がり、最終的に製品コストが上がるという問題がある。   However, the LED light proposed in Patent Document 1 employs a configuration in which the terminal is molded with resin, so that there is a problem that the component cost and the mold cost increase, and the product cost eventually increases.

そこで、端子を基板にハンダ付けする構成が採用されている。具体的には、ＬＥＤを実装した基板に端子の基端部をハンダ付けし、該端子の基板から延びる先端部をカプラー一体型のハウジングに形成された貫通孔に通してハウジングのカプラー部内に臨ませる構成が採用されている。   Therefore, a configuration is adopted in which the terminals are soldered to the substrate. Specifically, the base end portion of the terminal is soldered to the substrate on which the LED is mounted, and the tip end portion extending from the substrate of the terminal is passed through a through hole formed in the coupler-integrated housing so as to face the coupler portion of the housing. The structure which is not used is adopted.

しかしながら、端子の先端部を基板から真っ直ぐ延ばし、これをハウジングの貫通孔に通してハウジングのカプラー部に臨ませる構成を採用すると、ハウジングのカプラー部に他のカプラーを嵌め込んで接続した場合、端子の位置精度が悪いと該端子に余計な応力が加わり、端子の基板にハンダ付けされた基端部が基板から剥がれたり、破壊されるという問題が発生する。   However, when the tip of the terminal is extended straight from the board and is passed through the through-hole of the housing so that it faces the coupler part of the housing, when the other coupler is fitted and connected to the coupler part of the housing, the terminal If the positional accuracy is poor, excessive stress is applied to the terminal, and the base end portion soldered to the terminal substrate is peeled off or broken.

本発明は上記問題に鑑みてなされたもので、その目的とする処は、端子に余計な応力が加わっても該端子の基板にハンダ付けされた基端部の破壊や剥がれを防ぐことができるＬＥＤライトを提供することにある。   The present invention has been made in view of the above problems, and the purpose of the process is to prevent the base end portion soldered to the terminal board from being broken or peeled off even if excessive stress is applied to the terminal. It is to provide an LED light.

上記目的を達成するため、請求項１記載の発明は、ＬＥＤを実装した基板に端子の基端部をハンダ付けし、該端子の前記基板から延びる先端部をハウジングに形成された貫通孔を貫通して成るＬＥＤライトにおいて、前記端子の前記基板から延びて前記ハウジングの貫通孔を貫通する先端部を基端部に対して基板面と直交する方向にオフセットさせたことを特徴とする。   In order to achieve the above object, according to a first aspect of the present invention, a base end portion of a terminal is soldered to a substrate on which an LED is mounted, and a distal end portion extending from the substrate passes through a through hole formed in the housing. In this LED light, the tip of the terminal extending from the substrate and penetrating the through hole of the housing is offset with respect to the base end in a direction perpendicular to the substrate surface.

請求項２記載の発明は、請求項１記載の発明において、前記端子の基端部の前記基板へのハンダ付けランドを該基端部の長手方向に沿って延ばしたことを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, a soldering land of the base end portion of the terminal to the substrate is extended along the longitudinal direction of the base end portion.

請求項１記載の発明によれば、端子の基板から延びてハウジングの貫通孔を貫通する先端部を基端部に対して基板面と直交する方向にオフセットさせたため、端子の先端部に余計な応力が加わっても、その応力は貫通孔を介してハウジングによって受けられ、端子の基端部に応力が及ぶことがない。このため、端子の先端部のみが変形し、端子の基端部に力が直接加わることがなく、基板にハンダ付けされた端子の基端部の破壊や剥がれが確実に防がれる。   According to the first aspect of the present invention, the distal end portion extending from the substrate of the terminal and penetrating the through hole of the housing is offset in the direction perpendicular to the substrate surface with respect to the base end portion. Even if stress is applied, the stress is received by the housing through the through hole, and the stress does not reach the base end portion of the terminal. For this reason, only the distal end portion of the terminal is deformed, and no force is directly applied to the proximal end portion of the terminal, and destruction and peeling of the proximal end portion of the terminal soldered to the substrate are surely prevented.

請求項２記載の発明によれば、端子の基端部の基板へのハンダ付けランドを該基端部の長手方向に沿って延ばしたため、大きなハンダ面積が確保されて端子の基端部の基板への取付強度が高められ、該基端部の応力による破壊や剥がれが一層確実に防がれる。   According to the second aspect of the present invention, since the soldering lands to the base end portion of the terminal are extended along the longitudinal direction of the base end portion, a large solder area is secured and the base end end substrate of the terminal is secured. As a result, the strength and strength of the base end can be increased, and destruction and peeling due to stress at the base end can be prevented more reliably.

本発明に係るＬＥＤライトの斜視図である。It is a perspective view of the LED light which concerns on this invention. 本発明に係るＬＥＤライトの側面図である。It is a side view of the LED light which concerns on this invention. 本発明に係るＬＥＤライトの平面図である。It is a top view of the LED light which concerns on this invention. 本発明に係るＬＥＤライトの底面図である。It is a bottom view of the LED light which concerns on this invention. 図２の矢視Ａ方向の図である。It is a figure of the arrow A direction of FIG. 図５のＢーＢ線断面図である。FIG. 6 is a sectional view taken along line B-B in FIG. 5. 本発明に係るＬＥＤライトにおける端子の基板への固定構造を示す側面図である。It is a side view which shows the fixation structure to the board | substrate of the terminal in the LED light which concerns on this invention. 本発明に係るＬＥＤライトの端子における基板への固定構造を示す底面図である。It is a bottom view which shows the fixation structure to the board | substrate in the terminal of the LED light which concerns on this invention. 本発明に係るＬＥＤライトのハウジングの斜視図である。It is a perspective view of the housing of the LED light which concerns on this invention. 本発明に係るＬＥＤライトのハウジングの側面図である。It is a side view of the housing of the LED light which concerns on this invention. 図１０の矢視Ｃ方向の図である。It is a figure of the arrow C direction of FIG. 図１１のＤ部拡大詳細図である。It is the D section enlarged detail drawing of FIG. 本発明に係るＬＥＤライトのカバーレンズの側面図である。It is a side view of the cover lens of the LED light which concerns on this invention. 本発明に係るＬＥＤライトのカバーレンズの底面図である。It is a bottom view of the cover lens of the LED light which concerns on this invention. 図１３の矢視Ｅ方向の図である。It is a figure of the arrow E direction of FIG. （ａ）〜（ｄ）は本発明に係るＬＥＤライトの組立要領をその工程順に示す斜視図である。(A)-(d) is a perspective view which shows the assembly point of the LED light which concerns on this invention in the order of the process.

以下に本発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

図１は本発明に係るＬＥＤライトの斜視図、図２は同ＬＥＤライトの側面図、図３は同ＬＥＤライトの平面図、図４はＬＥＤライトの底面図、図５は図２の矢視Ａ方向の図、図６は図５のＢーＢ線断面図、図７は同ＬＥＤライトにおける端子の基板への取付構造を示す側面図、図８は同取付構造を示す底面図、図９は同ＬＥＤライトのハウジングの斜視図、図１０は同ハウジングの側面図、図１１は図１０の矢視Ｃ方向の図、図１２は図１１のＤ部拡大詳細図、図１３は同ＬＥＤライトのカバーレンズの側面図、図１４は同カバーレンズの底面図、図１５は図１３の矢視Ｅ方向の図である。   1 is a perspective view of an LED light according to the present invention, FIG. 2 is a side view of the LED light, FIG. 3 is a plan view of the LED light, FIG. 4 is a bottom view of the LED light, and FIG. FIG. 6 is a cross-sectional view taken along the line BB in FIG. 5, FIG. 7 is a side view showing a mounting structure of a terminal in the LED light, and FIG. 8 is a bottom view showing the mounting structure. Is a perspective view of the housing of the LED light, FIG. 10 is a side view of the housing, FIG. 11 is a view in the direction of arrow C in FIG. 10, FIG. 12 is an enlarged detail view of a portion D in FIG. 14 is a side view of the cover lens, FIG. 14 is a bottom view of the cover lens, and FIG. 15 is a view in the direction of arrow E in FIG.

図１〜図６に示すＬＥＤライト１は、カプラー一体型のハウジング２に基板３をスライドによって嵌め込んで固定するとともに、ハウジング２の一部を覆うカバーレンズ４をハウジング２に基板３と同方向にスライドさせて嵌め込んで固定することによって構成されている。   The LED light 1 shown in FIG. 1 to FIG. 6 is configured such that a substrate 3 is fitted and fixed to a coupler-integrated housing 2 by sliding, and a cover lens 4 covering a part of the housing 2 is disposed in the housing 2 in the same direction as the substrate 3. It is configured by sliding and fitting in and fixing.

上記ハウジング２は、光不透過性樹脂によって２段の矩形筒状に一体成形されており、その一部（図８の左半分）は基板収納部２Ａを構成し、他の部分（図１０の右半分）はカプラー部２Ｂを構成している。そして、このハウジング２の基板収納部２Ａの上面には、図９に示すように矩形切欠状の開口部２ａが形成されており、基板収納部２Ａの両側部下部の相対向する箇所には、図２、図４及び図９に示すように係合突起２ｂが突設されている。   The housing 2 is integrally formed of a light-impermeable resin into a two-stage rectangular cylinder, part of which (the left half of FIG. 8) constitutes the substrate storage part 2A and the other part (of FIG. 10). The right half) constitutes the coupler part 2B. Then, a rectangular notch-shaped opening 2a is formed on the upper surface of the substrate housing portion 2A of the housing 2 as shown in FIG. As shown in FIGS. 2, 4 and 9, an engaging protrusion 2b is provided.

又、図１１に示すように、ハウジング２の基板収納部２Ａの両側部内面の相対向する箇所に断面矩形の嵌合溝２ｃが長手方向（図１１の紙面垂直方向）に水平に形成されており、図１２に示すように、各嵌合溝２ｃの上面には長手方向に沿う突起２ｄが下方（基板２のスライド方向に直交する方向）に向かって一体に突設されている。そして、図６、図１１及び図１２に示すように、ハウジング２の基板収納部２Ａとカプラー部２Ｂとを区画する縦壁２ｅには矩形の左右２つの貫通孔２ｆが貫設されている。   Further, as shown in FIG. 11, fitting grooves 2c having a rectangular cross section are formed horizontally in the longitudinal direction (perpendicular to the plane of FIG. 11) at opposite locations on the inner surfaces of both sides of the substrate storage portion 2A of the housing 2. As shown in FIG. 12, a protrusion 2d extending in the longitudinal direction is integrally formed on the upper surface of each fitting groove 2c downward (in a direction orthogonal to the sliding direction of the substrate 2). As shown in FIGS. 6, 11, and 12, two rectangular left and right through holes 2 f are provided in the vertical wall 2 e that partitions the substrate housing portion 2 </ b> A and the coupler portion 2 </ b> B of the housing 2.

前記基板３には、図６及び図７に示すように光源であるＬＥＤ５と電子部品であるダイオード６やチップ抵抗７が実装されるとともに、左右２本の端子８がハンダ付けによって取り付けられている。ここで、左右の各端子８は、基板３にハンダ付けされる基端部８Ａと該基端部８Ａ（基板３）から先に延びる先端部８Ｂを有しているが、先端部８Ｂは、基端部８Ａに対して基板３面と直交する方向（図６及び図７の上方）に図示のεだけオフセットされ、ハウジング２の縦壁２ｅに形成された貫通孔２ｆを貫通してハウジング２のカプラー部２Ｂ内に臨んでいる。   As shown in FIGS. 6 and 7, an LED 5 as a light source, a diode 6 as an electronic component, and a chip resistor 7 are mounted on the substrate 3, and two left and right terminals 8 are attached by soldering. . Here, each of the left and right terminals 8 has a base end portion 8A soldered to the substrate 3 and a tip end portion 8B extending from the base end portion 8A (substrate 3). The housing 2 passes through the through hole 2f formed in the vertical wall 2e of the housing 2 and is offset by ε shown in the direction perpendicular to the surface of the substrate 3 (upward in FIGS. 6 and 7) with respect to the base end portion 8A. It faces the coupler portion 2B.

又、各端子８の基端部８Ａの端部８ａは直角に屈曲して起立しており、この端部８ａは基板３に形成された左右２つの各円孔３ａを下方から貫通して基板の上方に突出している。そして、端子８の基端部８Ａは、基板３にハンダ付けされているが、ハンダ付けランドＲは、図８に斜線にて示すように基板３の円孔３ａの周囲と端子８の基端部８Ａの長手方向に沿う範囲に形成されている。即ち、ハンダ付けランドＲは、基板３の円孔３ａの周囲から端子８の基端部８Ａに沿って延ばされている。   Further, the end portion 8a of the base end portion 8A of each terminal 8 is bent and raised at a right angle, and this end portion 8a penetrates the two left and right circular holes 3a formed in the substrate 3 from below to form the substrate. Projecting upward. The base end portion 8A of the terminal 8 is soldered to the board 3. The soldered land R is formed around the circular hole 3a of the board 3 and the base end of the terminal 8 as shown by hatching in FIG. It is formed in a range along the longitudinal direction of the portion 8A. That is, the soldering land R is extended from the periphery of the circular hole 3 a of the substrate 3 along the base end portion 8 </ b> A of the terminal 8.

前記カバーレンズ４は、光透過性樹脂によって一体に形成されており、図１３に示すようにフランジ部４Ａの上面には略円柱状の配光用レンズ部４Ｂが突設され、フランジ部４Ａの下方にはキャップ部４Ｃが形成されている。ここで，キャップ部４Ｃは、ハウジング２の基板収納部２Ａの外側にスライドによって被せられる部分であって、その下面と長手方向一端面（図１３の右端面）が開口する矩形箱状に成形されている。   The cover lens 4 is integrally formed of a light-transmitting resin, and as shown in FIG. 13, a substantially cylindrical light distribution lens portion 4B is projected on the upper surface of the flange portion 4A, and the flange portion 4A A cap portion 4C is formed below. Here, the cap portion 4C is a portion that is slid on the outside of the substrate storage portion 2A of the housing 2, and is formed in a rectangular box shape having an open bottom surface and one end surface in the longitudinal direction (the right end surface in FIG. 13). ing.

又、レンズカバー４のキャップ部４Ｃの左右両側部の下端には、図１４及び図１５に示すように内側に向かって直角に延びる嵌合リブ４ａが長手方向（図１４の左右方向）に沿って形成されており、これらの嵌合リブ４ａとキャップ部４Ｃの左右両側部の所定箇所（ハウジング２の基板収納部２Ａの両側部に形成された前記係合突起２ｂ（図１０参照）に対応する箇所）には図１３及び図１４に示すように矩形切欠状の係合凹部４ｂがそれぞれ形成されている。   Further, at the lower ends of the left and right side portions of the cap portion 4C of the lens cover 4, fitting ribs 4a extending at right angles toward the inside as shown in FIGS. 14 and 15 extend along the longitudinal direction (left and right direction in FIG. 14). These fitting ribs 4a and the right and left sides of the cap portion 4C correspond to predetermined positions (the engagement protrusions 2b (see FIG. 10) formed on both sides of the substrate storage portion 2A of the housing 2). As shown in FIG. 13 and FIG. 14, rectangular cut-out engagement recesses 4 b are respectively formed at the locations where the operation is performed.

次に、以上のハウジング２と基板３及びカバーレンズ４によって構成されるＬＥＤライト１の組立要領を図１６（ａ）〜（ｄ）に基づいて以下に説明する。   Next, the assembly procedure of the LED light 1 constituted by the housing 2, the substrate 3, and the cover lens 4 will be described below with reference to FIGS.

図１６（ａ）〜（ｄ）は本発明に係るＬＥＤライト１の組立要領をその工程順に示す斜視図であり、ＬＥＤライト１の組み立てに際しては、先ず、図１６（ａ）に示すようにＬＥＤ５とダイオード６及びチップ抵抗７が実装された基板３がハウジング２の基板収納部２Ａの一端開口部から差し込まれて組み付けられる。即ち、基板３の左右両端部をハウジング２の基板収納部２Ａに形成された左右の嵌合溝２ｃに嵌め込み、該基板３を奥側（矢印方向）にスライドさせれば、図１６（ｂ）に示すように基板３がハウジング２の基板収納部２Ａに収容されて固定される。このように基板２をハウジング２の基板収納部２Ａに嵌め込んで収納した状態では、図６に示すように、基板３から水平に延びる左右２本の端子８は、ハウジング２の縦壁２ｅに形成された２つの貫通孔２ｆをそれぞれ貫通してハウジング２のカプラー部２Ｂの内部に臨んでいる。   16 (a) to 16 (d) are perspective views showing the assembly procedure of the LED light 1 according to the present invention in the order of the steps. In assembling the LED light 1, first, as shown in FIG. 16 (a), the LED 5 The substrate 3 on which the diode 6 and the chip resistor 7 are mounted is inserted and assembled from one end opening of the substrate housing portion 2A of the housing 2. That is, if the left and right end portions of the substrate 3 are fitted in the left and right fitting grooves 2c formed in the substrate housing portion 2A of the housing 2, and the substrate 3 is slid in the back (arrow direction), FIG. As shown, the substrate 3 is accommodated in the substrate accommodating portion 2A of the housing 2 and fixed. In the state in which the substrate 2 is fitted and stored in the substrate storage portion 2A of the housing 2 as described above, the left and right terminals 8 extending horizontally from the substrate 3 are placed on the vertical wall 2e of the housing 2 as shown in FIG. Each of the two through holes 2f formed passes through the coupler portion 2B of the housing 2.

次に、図１６（ｃ）に示すようにカバーレンズ４のキャップ部４Ｃをハウジング２の基板収納部２Ａの外面に嵌め込み、該カバーレンズ４を基板３のスライド方向と同方向（図示矢印方向）にスライドさせると、図２及び図４に示すように、該カバーレンズ４のキャップ部４Ｃに形成された左右２つの係合凹部４ｂにハウジング２の基板収納部２Ａの両側部に突設された係合突起２ｂが係合するため、カバーレンズ４がハウジング２の基板収納部２Ａを外側から覆うように被着され、図１６（ｄ）に示すように製品としてのＬＥＤライト１が組み立てられる。このとき、ハウジング２の基板収納部２Ａの上面に形成された開口部２ａはカバーレンズ４によって覆われる。   Next, as shown in FIG. 16C, the cap portion 4C of the cover lens 4 is fitted into the outer surface of the substrate housing portion 2A of the housing 2, and the cover lens 4 is in the same direction as the sliding direction of the substrate 3 (arrow direction shown in the drawing). 2 and 4, the left and right engaging recesses 4b formed on the cap portion 4C of the cover lens 4 are protruded from both sides of the substrate storage portion 2A of the housing 2, as shown in FIGS. Since the engagement protrusion 2b is engaged, the cover lens 4 is attached so as to cover the substrate housing portion 2A of the housing 2 from the outside, and the LED light 1 as a product is assembled as shown in FIG. At this time, the opening 2 a formed on the upper surface of the substrate storage portion 2 </ b> A of the housing 2 is covered with the cover lens 4.

以上のようにして組み立てられたＬＥＤライト１において、不図示の電源から端子８及び基板３の不図示の回路を経てＬＥＤ５に電流が供給されると、該ＬＥＤ５が起動されて光が上方に向かって出射されるが、この光は、ハウジング２の基板収納部２Ａに形成された開口部２ａとカバーレンズ４の配光用レンズ部４Ｂを通過することによって配光が制御されつつ上方に向かって出射されて上方の照明に供される。   In the LED light 1 assembled as described above, when a current is supplied to the LED 5 from a power source (not shown) through a terminal 8 and a circuit (not shown) of the substrate 3, the LED 5 is activated and the light is directed upward. The light passes through the opening 2a formed in the substrate housing portion 2A of the housing 2 and the light distribution lens portion 4B of the cover lens 4 and is directed upward while the light distribution is controlled. It is emitted and used for upper illumination.

而して、本発明に係るＬＥＤ照明装置１によれば、端子８の基板３から延びてハウジング２の貫通孔２ｆを貫通する先端部８Ｂを基端部８Ａに対して基板３面と直交する方向（図６及び図７の上方）にεだけオフセットさせたため、端子８の先端部８Ｂに余計な応力が加わっても、その応力は貫通孔２ｆを介してハウジング２によって受けられ、端子８の基端部８Ａに応力が及ぶことがない。このため、端子８の先端部８Ｂのみが変形し、端子８の基端部８Ａに力が直接加わることがなく、基板３にハンダ付けされた端子８の基端部８Ａの破壊や剥がれが確実に防がれる。   Thus, according to the LED lighting device 1 of the present invention, the distal end portion 8B extending from the substrate 3 of the terminal 8 and passing through the through hole 2f of the housing 2 is orthogonal to the surface of the substrate 3 with respect to the base end portion 8A. Since it is offset by ε in the direction (upper direction in FIGS. 6 and 7), even if excessive stress is applied to the tip 8B of the terminal 8, the stress is received by the housing 2 through the through hole 2f, and the terminal 8 The stress does not reach the base end portion 8A. Therefore, only the distal end portion 8B of the terminal 8 is deformed, and no force is directly applied to the proximal end portion 8A of the terminal 8, and the destruction or peeling of the proximal end portion 8A of the terminal 8 soldered to the substrate 3 is ensured. Is prevented.

又、本発明に係るＬＥＤライト１においては、端子８の基端部８Ａの基板３へのハンダ付けランドＲを図８に示すように該基端部８Ａの長手方向に沿って延ばしたため、大きなハンダ面積が確保されて端子８の基端部８Ａの基板３への取付強度が高められ、該基端部８Ａの応力による破壊や剥がれが一層確実に防がれる。   Further, in the LED light 1 according to the present invention, the soldering land R to the substrate 3 of the base end portion 8A of the terminal 8 is extended along the longitudinal direction of the base end portion 8A as shown in FIG. The solder area is secured, the strength of attachment of the base end portion 8A of the terminal 8 to the substrate 3 is increased, and the breakage and peeling due to the stress of the base end portion 8A are more reliably prevented.

尚、本実施の形態では、製品薄型化のためにハウジング２の基板収納部２Ａの下面をカバーレンズ４によって覆っていないが、この部分もカバーレンズ４で覆うことによって製品内部を静電気、埃、水等から確実に保護することができる。   In the present embodiment, the lower surface of the substrate housing portion 2A of the housing 2 is not covered with the cover lens 4 in order to reduce the thickness of the product. It can be reliably protected from water.

本発明に係るＬＥＤライトは、車室内の照明（フットライト、カップホルダーライト、グローブボックスライ用、アンビエントライト、読書ライト、ラゲッジルームライト）の他、防水構造とすれば外装品に対しても応用が可能である。   The LED light according to the present invention can be applied to exterior parts in addition to interior lighting (foot lights, cup holder lights, glove box lights, ambient lights, reading lights, luggage room lights) as well as waterproof structures. Is possible.

１ ＬＥＤライト
２ ハウジング
２Ａ ハウジングの基板収納部
２Ｂ ハウジングのカプラー部
２ａ ハウジングの開口部
２ｂ ハウジングの係合突起
２ｃ ハウジングの嵌合溝
２ｄ ハウジングの突起
２ｅ ハウジングの縦壁
２ｆ ハウジングの貫通孔
３ 基板
３ａ 基板の円孔
４ カバーレンズ
４Ａ カバーレンズのフランジ部
４Ｂ カバーレンズの配光用レンズ部
４Ｃ カバーレンズのキャップ部
４ａ カバーレンズの嵌合リブ
４ｂ カバーレンズの係合凹部
５ ＬＥＤ
６ ダイオード
７ チップ抵抗
８ 端子
８Ａ 端子の基端部
８Ｂ 端子の先端部
８ａ 端子の端部
Ｒ ハンダ付けランド
ε 端子の先端部のオフセット量
DESCRIPTION OF SYMBOLS 1 LED light 2 Housing 2A Housing board | substrate storage part 2B Housing coupler part 2a Housing opening part 2b Housing engaging protrusion 2c Housing fitting groove 2d Housing protrusion 2e Housing vertical wall 2f Housing through-hole 3 Substrate 3a Circular hole of substrate 4 Cover lens 4A Cover lens flange 4B Cover lens light distribution lens 4C Cover lens cap 4a Cover lens fitting rib 4b Cover lens engagement recess 5 LED
6 Diode 7 Chip resistor 8 Terminal 8A Terminal base 8B Terminal 8 8 Terminal R R Soldering land ε Terminal offset

Claims (2)

ＬＥＤを実装した基板に端子の基端部をハンダ付けし、該端子の前記基板から延びる先端部をハウジングに形成された貫通孔を貫通して成るＬＥＤライトにおいて、
前記端子の前記基板から延びて前記ハウジングの貫通孔を貫通する先端部を基端部に対して基板面と直交する方向にオフセットさせたことを特徴とするＬＥＤライト。 In the LED light formed by soldering the base end portion of the terminal to the board on which the LED is mounted and penetrating the through hole formed in the housing at the tip end portion extending from the board of the terminal,
An LED light, wherein a distal end portion of the terminal extending from the substrate and penetrating the through hole of the housing is offset in a direction perpendicular to the substrate surface with respect to the proximal end portion. 前記端子の基端部の前記基板へのハンダ付けランドを該基端部の長手方向に沿って延ばしたことを特徴とする請求項１記載のＬＥＤライト。
The LED light according to claim 1, wherein a soldering land to the substrate at a base end portion of the terminal is extended along a longitudinal direction of the base end portion.
JP2011240419A 2011-11-01 2011-11-01 Led light Pending JP2013095292A (en)

Priority Applications (1)

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Publication Number Publication Date
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676873A (en) * 1992-08-31 1994-03-18 Omron Corp Electronic part
JPH06181374A (en) * 1992-12-11 1994-06-28 Hitachi Telecom Technol Ltd Manufacture of printed-wiring board
JPH10233269A (en) * 1997-02-19 1998-09-02 Yazaki Corp Connector for substrate
JP2003208939A (en) * 2002-01-16 2003-07-25 Yazaki Corp Mounting method and mounting structure of terminal
JP2003317839A (en) * 2002-04-22 2003-11-07 Sumitomo Electric Ind Ltd Flat wiring material, electronic component mounted body, and connection method
JP2009158208A (en) * 2007-12-25 2009-07-16 Ichikoh Ind Ltd Leveling device of vehicular headlight
JP2011518420A (en) * 2008-04-21 2011-06-23 マルチソーブ テクノロジーズ インコーポレイティド Lamp assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676873A (en) * 1992-08-31 1994-03-18 Omron Corp Electronic part
JPH06181374A (en) * 1992-12-11 1994-06-28 Hitachi Telecom Technol Ltd Manufacture of printed-wiring board
JPH10233269A (en) * 1997-02-19 1998-09-02 Yazaki Corp Connector for substrate
JP2003208939A (en) * 2002-01-16 2003-07-25 Yazaki Corp Mounting method and mounting structure of terminal
JP2003317839A (en) * 2002-04-22 2003-11-07 Sumitomo Electric Ind Ltd Flat wiring material, electronic component mounted body, and connection method
JP2009158208A (en) * 2007-12-25 2009-07-16 Ichikoh Ind Ltd Leveling device of vehicular headlight
JP2011518420A (en) * 2008-04-21 2011-06-23 マルチソーブ テクノロジーズ インコーポレイティド Lamp assembly

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