JP2013073943A - Substrate cutting apparatus - Google Patents
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Description
本発明は、基板切断装置に関する。 The present invention relates to a substrate cutting apparatus.
ＣＰＵ基板（マザーボード）を製造する場合、図７に示すように、複数の回路パターンを形成した基板５１を形成した後、この基板５１を切断分離装置にて切断して個片化することによって、複数個のマザーボード５２となる。図６において、５４は切断線を示している。 When manufacturing a CPU substrate (motherboard), as shown in FIG. 7, after forming a substrate 51 on which a plurality of circuit patterns are formed, the substrate 51 is cut into pieces by a cutting and separating device. A plurality of mother boards 52 are formed. In FIG. 6, 54 indicates a cutting line.
図７に示すように個片化すれば、基板の各辺側において不要な端材（廃材）５５が発生する。このため、発生した端材（廃材）５５を廃棄する必要が生じる。このため、従来には、基板５１に切断装置において、不要な廃材５５を効率よく収集して排出できるようにしたものが提案されている（特許文献１）。なお、この特許文献１では、複数個のＩＣ等の電子部品を樹脂材料にて封止成形した成形済基板を個片化するものである。 As shown in FIG. 7, unnecessary pieces (waste material) 55 are generated on each side of the substrate. For this reason, it is necessary to discard the generated end material (waste material) 55. For this reason, conventionally, there has been proposed a substrate cutting apparatus that can efficiently collect and discharge unnecessary waste material 55 (Patent Document 1). In this patent document 1, a molded substrate in which a plurality of electronic components such as ICs are sealed with a resin material is separated into pieces.
この特許文献１に記載のものは、基板を切断する切断機構と、切断機構にて切断された廃材を含む廃水から水と廃材とを分離する廃水分離部と、廃水分離部に収集された廃材を収容する廃材収容箱とを備えたものである。 The one described in Patent Document 1 includes a cutting mechanism for cutting a substrate, a waste water separation unit that separates water and waste material from waste water containing waste material cut by the cutting mechanism, and waste material collected in the waste water separation unit. And a waste material storage box for storing the waste.
この場合、切断機構にて切断された廃材を、廃水分離部にて水と分離し、この廃材を排出部材にて廃材を廃材収容箱に収容させるものである。すなわち、廃材の排出機構部において、まず、廃材を含む廃水を廃水受部から廃水分離部に落下流出させ、次に、廃水分離部において、廃材を含む廃水から廃水を分離除去して廃水収容部に収容し、且つ、廃水分離部に廃材を残存させ、更に、排出部材を廃材の排出方向に移動させることにより、廃材を移動させ、廃材収容箱内に廃材を落下させて収容することができるように構成されている。 In this case, the waste material cut by the cutting mechanism is separated from the water by the waste water separator, and the waste material is stored in the waste material storage box by the discharge member. That is, in the waste material discharge mechanism part, first, waste water containing waste material is dropped and discharged from the waste water receiving part to the waste water separation part, and then in the waste water separation part, the waste water is separated and removed from the waste water containing waste material. In addition, the waste material is left in the waste water separation unit, and further, the waste material is moved by moving the discharge member in the discharge direction of the waste material, and the waste material can be dropped and stored in the waste material storage box. It is configured as follows.
前記特許文献１に記載のものでは、排出部材を廃材収容箱側に移動させることによって、廃水分離部の廃材を廃材収容箱に供給するものであるため、排出部材を移動させる際に、排出部材に廃材が引っ掛かってうまく廃材収容箱に供給できなかったり、移動が規制されたりするおそれがある。また、排出部材を移動させるものであるので、自動的に移動させる構造とすれば、装置構成が複雑化し、手動にて移動させる構造とすれば、作業者の負担が大となって、作業性におとることになる。 In the thing of the said patent document 1, since the waste material of a waste-water separation part is supplied to a waste material storage box by moving a discharge member to the waste material storage box side, when moving a discharge member, a discharge member There is a possibility that the waste material is caught on the surface and cannot be supplied to the waste material storage box or the movement is restricted. In addition, since the discharge member is moved, the structure of the apparatus that moves automatically complicates the configuration of the apparatus, and the structure that moves manually increases the burden on the operator and increases the workability. I will take it.
そこで、本発明は斯かる実情に鑑み、切断分離された端材（廃材）を安定して外部へ排出できて、切断分離作業の作業性の向上を図ることが可能な基板切断装置を提供しようとするものである。 Therefore, in view of such circumstances, the present invention is to provide a substrate cutting apparatus capable of stably discharging cut and separated end materials (waste materials) to the outside and improving workability of cutting and separating work. It is what.
本発明の基板切断装置は、基板を切断して個片化する基板切断装置であって、基板を受けるテーブルと、このテーブル上の基板を切断分離する切断手段と、この切断手段にて基板から切断分離される基板端材を受ける受け手段と、噴き付け媒体を噴き付けて前記切断手段にて切断された基板端材を受け手段側に押し流すブロー手段と、基板端材を受け手段に案内するガイド手段とを備えたものである。 The substrate cutting device of the present invention is a substrate cutting device that cuts a substrate into pieces, and includes a table that receives the substrate, a cutting means that cuts and separates the substrate on the table, and a cutting means that separates the substrate from the substrate. A receiving means for receiving the substrate end material to be cut and separated, a blowing means for spraying a spray medium and forcing the substrate end material cut by the cutting means to the receiving means side, and guiding the substrate end material to the receiving means. And a guide means.
本発明の基板切断装置によれば、切断手段にてテーブル上の基板を切断分離できて個片化できる。切断手段にて切断された基板端材をブロー手段にて受け手段側に押し流すことができる。押し流す際には、基板端材はガイド手段にて受け手段に案内される。 According to the substrate cutting apparatus of the present invention, the substrate on the table can be cut and separated by the cutting means and separated into pieces. The substrate end material cut by the cutting means can be pushed away to the receiving means side by the blowing means. When pushing away, the substrate edge material is guided to the receiving means by the guide means.
前記ガイド手段は、前記噴き付け媒体が受け手段側へ流れる凹溝を上面に有し、基板側から受け手段側に向かって斜め下方に傾斜するガイド板にて構成できる。このようなガイド板を有するものでは、凹溝を噴き付け媒体が流れるので、ガイド板上に基板端材が付着することなく受け手段側に流れていく。 The guide means may be constituted by a guide plate having a concave groove on the upper surface through which the spray medium flows toward the receiving means, and inclined obliquely downward from the substrate side toward the receiving means. In the case having such a guide plate, since the jetting medium flows through the concave groove, the substrate end material flows on the guide plate without adhering to the guide plate.
前記ブロー手段による噴射ノズルと切断手段の基板切断部とは一体的に移動するようにするのが好ましい。このように一体的とすることによって、ブロー手段による媒体噴き付け位置が安定し、基板端材の受け手段側への押し流しが安定する。 It is preferable that the spray nozzle by the blowing means and the substrate cutting portion of the cutting means move integrally. By being integrated in this way, the position of the medium spraying by the blowing means is stabilized, and the pushing of the substrate end material toward the receiving means is stabilized.
前記切断手段の基板切断部は、基板切断用のカッタと、冷却媒体をカッタ乃至カッタにて切断されている切断部位とに噴射する冷却用噴射ノズルとを有するものとできる。これによって、冷却用噴射ノズルから噴射される冷却媒体をカッタおよび切断部位を冷却することができる。 The substrate cutting portion of the cutting means may include a substrate cutting cutter and a cooling spray nozzle that sprays a cooling medium to the cutter or a cutting site cut by the cutter. Accordingly, the cutter and the cutting site can be cooled by the cooling medium injected from the cooling injection nozzle.
前記切断手段の基板切断部とブロー手段による噴射ノズルとを一体的にＸＹＺ軸方向に移動させるＸＹＺ移動機構と、前記テーブルをθ方向に回転させる回転駆動機構とを備えるのが好ましい。このように構成することによって、基板切断部をＸＹＺ移動機構にて、Ｘ軸方向、Ｙ軸方向、及びＺ軸方向に３軸方向に移動させることができる。このため、まず、基板切断部をＺ軸方向に沿って上昇させた状態からＺ軸方向に沿って下降させて、Ｘ軸方向に沿って移動させれば、基板に対してＸ軸方向の切断線を形成することができる。その後、基板切断部をＺ軸方向に沿って上昇させた後、所定ピッチだけ基板切断部をＹ軸方向に移動させ、次に上昇させた状態からＺ軸方向に沿って下降させて、Ｘ軸方向に沿って移動させれば、基板に対して、前回のＸ軸方向の切断線よりも所定ピッチだけＹ軸方向にずれたＸ軸方向の切断線を形成することができる。以後同様に、所定ピッチだけＹ軸方向にずれたＸ軸方向の切断線を形成することによって、基板のＹ軸方向全範囲に、所定ピッチだけＹ軸方向にずれた複数本のＸ軸方向の切断線を形成できる。次に、回転駆動機構にてテーブルを９０°回転させれば、前記形成された切断線は、基板のＸ軸方向全範囲に、所定ピッチだけＸ軸方向にずれた複数本のＹ軸方向の切断線となる。そこで、前記した工程を行うことによって、基板のＹ軸方向全範囲に、所定ピッチだけＹ軸方向にずれた複数本のＸ軸方向の切断線を形成する。これによって、基板にマトリックス状の切断線を形成することができ、基板の個片化が可能となる。 It is preferable to include an XYZ moving mechanism that integrally moves the substrate cutting portion of the cutting means and the spray nozzle by the blowing means in the XYZ axial directions, and a rotational drive mechanism that rotates the table in the θ direction. With this configuration, the substrate cutting unit can be moved in the three-axis directions in the X-axis direction, the Y-axis direction, and the Z-axis direction by the XYZ moving mechanism. For this reason, first, if the substrate cutting part is lowered along the Z-axis direction from the state where it is raised along the Z-axis direction and moved along the X-axis direction, the substrate is cut along the X-axis direction. A line can be formed. Thereafter, the substrate cutting part is raised along the Z-axis direction, and then the substrate cutting part is moved in the Y-axis direction by a predetermined pitch, and then lowered from the raised state along the Z-axis direction. If the substrate is moved along the direction, it is possible to form a cutting line in the X-axis direction that is shifted in the Y-axis direction by a predetermined pitch from the previous cutting line in the X-axis direction. Thereafter, similarly, by forming a cutting line in the X-axis direction that is shifted in the Y-axis direction by a predetermined pitch, a plurality of X-axis-direction shifts in the Y-axis direction by a predetermined pitch in the entire range of the Y-axis direction of the substrate. A cutting line can be formed. Next, if the table is rotated by 90 ° with the rotation drive mechanism, the formed cutting line extends in the X-axis direction by a predetermined pitch across the entire range of the substrate in the X-axis direction. It becomes a cutting line. Therefore, by performing the above-described process, a plurality of cutting lines in the X-axis direction that are shifted in the Y-axis direction by a predetermined pitch are formed in the entire range in the Y-axis direction of the substrate. Thereby, a matrix-like cutting line can be formed on the substrate, and the substrate can be separated.
受け手段は、テーブルの外周側に配設される樋部材を有するものとできる。このような樋部材を設けることによって、基板端材をこの樋部材にて受けることができる。 The receiving means may have a flange member disposed on the outer peripheral side of the table. By providing such a flange member, the substrate edge material can be received by the flange member.
ガイド手段は、前記ガイド板の下方に、その外端縁部がこのガイド板よりも外方に突出する下ガイド板を有するものであってもよい。このように下ガイド板を設けることによって、上方のガイド板で届かない位置への受け手段への案内が可能となる。下ガイド板が、基板側から受け手段側に向かって斜め下方に傾斜するとともに、噴き付け媒体が受け手段側へ流れる凹溝を上面に設けたものであってもよい。 The guide means may have a lower guide plate having an outer edge that protrudes outward from the guide plate below the guide plate. By providing the lower guide plate in this way, it is possible to guide the receiving means to a position that cannot be reached by the upper guide plate. The lower guide plate may be inclined obliquely downward from the substrate side toward the receiving means side and provided with a concave groove on the upper surface through which the spray medium flows to the receiving means side.
前記テーブルに、個片化されてなる各基板小片をテーブルの基板載置面に吸着する吸着手段を設けたものが好ましい。このように吸着手段を設けたものでは、各基板小片をテーブルの基板載置面に吸着することができ、切断時に基板がずれることがなくなって、形成される切断線は安定する。ブロー手段の噴き付け媒体及び切断手段の冷却媒体が水であるのが好ましい。 It is preferable that the table is provided with suction means for sucking each piece of the substrate, which is divided into pieces, onto the substrate mounting surface of the table. In the case where the suction means is provided in this way, each of the substrate pieces can be sucked onto the substrate mounting surface of the table, the substrate is not displaced during cutting, and the formed cutting line is stable. The spraying medium of the blowing means and the cooling medium of the cutting means are preferably water.
本発明では、切断手段にて切断された基板端材をブロー手段にて受け手段側に押し流すことができ、しかも、押し流す際には、基板端材はガイド手段にて受け手段に案内される。このため、基板端材が受け手段に安定して供給でき、テーブル等に停滞することがなくなって、作用者による基板端材の除去作業を不要とする。 In the present invention, the substrate end material cut by the cutting means can be pushed away to the receiving means side by the blow means, and when being pushed away, the substrate end material is guided to the receiving means by the guide means. For this reason, the substrate end material can be stably supplied to the receiving means, and the substrate end material does not stagnate on the table or the like.
ガイド手段が凹溝を上面に有するガイド板を有するものでは、ガイド板の基板端材が付着することなく基板端材を受け手段に供給することができ、基板端材の回収作業が安定する。 When the guide means has a guide plate having a concave groove on the upper surface, the substrate end material of the guide plate can be supplied to the receiving means without adhering to the substrate, and the recovery operation of the substrate end material is stabilized.
噴射ノズルと基板切断部とが一体的に移動できるものでは、基板端材に対して安定して媒体を噴き付けることができ、基板端材を安定して押し流すことができる。 In the case where the spray nozzle and the substrate cutting part can move integrally, the medium can be stably sprayed to the substrate end material, and the substrate end material can be stably swept away.
冷却用噴射ノズルから噴射される冷却媒体をカッタおよび切断部位を冷却することができるものでは、カッタの切断機能を低下させないとともに、カッタや基板の損傷を有効に防止できる。 In the case where the cutter and the cutting portion can be cooled by the cooling medium injected from the cooling injection nozzle, the cutting function of the cutter is not lowered, and damage to the cutter and the substrate can be effectively prevented.
ＸＹＺ移動機構と回転駆動機構とを備えたものでは、基板にマトリックス状の切断線を形成することができ、基板の個片化が可能となって、基板切断装置として安定する。 In the case where the XYZ moving mechanism and the rotation driving mechanism are provided, a matrix-like cutting line can be formed on the substrate, the substrate can be separated into pieces, and the substrate cutting apparatus is stable.
樋部材を設けたものでは、基板端材をこの樋部材にて受けることができ、しかも、構成の簡素化を図ることが可能となる。 In the case where the flange member is provided, the substrate end material can be received by the flange member, and the configuration can be simplified.
下ガイド板を設けたものでは、上方のガイド板で届かない位置への受け手段への案内が可能となり、受け手段外への基板端材の排出がなくなる。また、テーブルを回転させる場合の回転スペースを考慮して、上方のガイド板を大きくできない場合等において、このような下ガイド板を設けることによって、回転スペースを大きくとれない部位に、この装置を設置できる利点がある。 In the case where the lower guide plate is provided, it is possible to guide the receiving means to a position that cannot be reached by the upper guide plate, and the substrate end material is not discharged out of the receiving means. In addition, if the upper guide plate cannot be enlarged in consideration of the rotation space when rotating the table, this device is installed at a location where the rotation space cannot be increased by providing such a lower guide plate. There are advantages you can do.
上面に凹溝を下ガイド板に設けたものであってもよい。凹溝を噴き付け媒体が流れるので、ガイド板上に基板端材が付着することなく受け手段側に流れていく。 The lower guide plate may be provided with a concave groove on the upper surface. Since the jetting medium flows through the concave groove, the substrate end material flows to the receiving means side without adhering to the guide plate.
前記吸着手段を設けたものでは、切断時に基板がずれることがなくなって、形成される切断線は安定する。 In the case where the suction means is provided, the substrate is not displaced at the time of cutting, and the formed cutting line is stabilized.
ブロー手段の噴き付け媒体及び切断手段の冷却媒体に水を用いることによって、低コスト化を図ることができ、安定した噴き付けと冷却が可能となる。 By using water for the blowing medium of the blowing means and the cooling medium of the cutting means, the cost can be reduced, and stable blowing and cooling can be achieved.
以下本発明の実施の形態を図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
図１は、本発明にかかる基板切断装置を示し、この基板切断装置は、基板１を受けるテーブル２と、このテーブル２上の基板１を切断分離する切断手段３と、この切断手段３にて基板１から切断分離される基板端材１ｂを受ける受け手段４と、噴き付け媒体を噴き付けて前記切断手段にて切断された基板端材１ｂを受け手段４側に押し流すブロー手段５と、基板端材１ｂを受け手段４に案内するガイド手段６とを備える。 FIG. 1 shows a substrate cutting apparatus according to the present invention, which includes a table 2 that receives a substrate 1, a cutting means 3 that cuts and separates the substrate 1 on the table 2, and the cutting means 3. Receiving means 4 for receiving a substrate end material 1b cut and separated from the substrate 1, blow means 5 for spraying a spray medium and forcing the substrate end material 1b cut by the cutting means to the receiving means 4 side, and a substrate And a guide means 6 for guiding the end material 1b to the receiving means 4.
基板１は、複数の回路パターンを形成したものであって、図５に示すように、個片化して、ＣＰＵ基板（マザーボード基板）である基板小片１ａを形成するものである。このように、基板１にマトリックス状の切断線Ｌ１，Ｌ２を作成することによって、製品としての基板小片１ａを形成した場合、基板１の４つの辺側に、廃材としての前記基板端材１ｂが形成される。 The substrate 1 is formed with a plurality of circuit patterns. As shown in FIG. 5, the substrate 1 is divided into individual pieces to form a small substrate piece 1a which is a CPU substrate (motherboard substrate). Thus, when the substrate small piece 1a as the product is formed by creating the matrix-like cutting lines L1 and L2 on the substrate 1, the substrate end material 1b as the waste material is formed on the four sides of the substrate 1. It is formed.
テーブル２は、その上壁が平面視において正方形状をなし、図１と図２に示すように、複数個に分割された小ブロック片部１０を形成している。すなわち、小ブロック片部１０は、この切断装置にて切断分離されて形成される基板小片１ａに対応する。そして、このテーブル２には、基板小片１ａが各小ブロック片部１０に吸着される吸着手段１１が付設される。吸着手段１１は、図示省略の真空機構を備え、テーブル内には、真空通路１２が形成される。また、各小ブロック片部１０には吸引口１３が設けられ、この吸引口１３が真空通路１２に連通している。このため、真空機構を駆動させて、真空通路１２を負圧状態とすることによって、吸引口１３を介して、各基板小片１ａが各小ブロック片部１０に吸着される。なお、真空機構としては、真空ポンプや真空エジェクタ等が使用される。 The table 2 has a square shape in the plan view, and forms a small block piece 10 divided into a plurality of pieces as shown in FIGS. That is, the small block piece portion 10 corresponds to the substrate small piece 1a formed by being cut and separated by this cutting apparatus. The table 2 is provided with suction means 11 for sucking the substrate small pieces 1a to the small block pieces 10. The suction means 11 includes a vacuum mechanism (not shown), and a vacuum passage 12 is formed in the table. Each small block piece 10 is provided with a suction port 13, and the suction port 13 communicates with the vacuum passage 12. For this reason, by driving the vacuum mechanism to bring the vacuum passage 12 into a negative pressure state, each substrate small piece 1 a is adsorbed to each small block piece portion 10 through the suction port 13. As the vacuum mechanism, a vacuum pump, a vacuum ejector, or the like is used.
また、このテーブル２は、図示省略の回転駆動機構によって、その中心部を中心にθ方向に回転する。なお、回転駆動機構は、例えば、駆動用モータ（サーボモータ等）と、この駆動用モータの回転駆動力をテーブル２に伝達する駆動力伝達機構とからなる。駆動力伝達機構としては、ギア機構やベルト機構等から構成することができる。 Further, the table 2 is rotated in the θ direction around the central portion by a rotation drive mechanism (not shown). The rotational drive mechanism includes, for example, a drive motor (servo motor or the like) and a drive force transmission mechanism that transmits the rotational drive force of the drive motor to the table 2. The driving force transmission mechanism can be constituted by a gear mechanism, a belt mechanism, or the like.
切断手段３は、円盤状のカッタ１５と、このカッタ１５をその軸心周りに回転させるモータ１６と、冷却媒体（例えば、冷却水）を噴射する噴射機構とを備える。噴射機構は、回転駆動するカッタ１５の近傍に配置される冷却用噴射ノズル（図示省略）を有し、図外の冷却媒体供給源からの冷却媒体を冷却用噴射ノズルを介してカッタ１５乃至カッタ１５による基板１の切断部位に噴き付けることになる。 The cutting means 3 includes a disk-shaped cutter 15, a motor 16 that rotates the cutter 15 around its axis, and an injection mechanism that injects a cooling medium (for example, cooling water). The injection mechanism has a cooling injection nozzle (not shown) arranged in the vicinity of the rotationally driven cutter 15, and the cooling medium from a cooling medium supply source (not shown) is supplied to the cutter 15 through the cutter via the cooling injection nozzle. 15 is sprayed onto the cutting portion of the substrate 1.
この場合、カッタ１５とモータ１６と噴射ノズル等で構成される基板切断部ＭがＸＹＺ移動機構（図示省略）によって、相互に直交するＸ軸方向、Ｙ軸方向、Ｚ軸方向に移動することができる。ここで、Ｘ軸方向とＹ軸方向とは、水平面内での図４の座標で示す方向であり、Ｚ軸方向は鉛直方向である。ＸＹＺ移動機構は、ＸＹＺ軸ステージやＸＹＺアームを用いることができる。 In this case, the substrate cutting part M composed of the cutter 15, the motor 16, the injection nozzle, and the like can be moved in the X axis direction, the Y axis direction, and the Z axis direction orthogonal to each other by an XYZ moving mechanism (not shown). it can. Here, the X-axis direction and the Y-axis direction are directions indicated by the coordinates of FIG. 4 in the horizontal plane, and the Z-axis direction is a vertical direction. The XYZ movement mechanism can use an XYZ axis stage or an XYZ arm.
受け手段４は、テーブル２の外周側に配設される樋部材２０（２０ａ、２０ｂ）を有する。樋部材２０は、図２に示すように、テーブル２の前方および後方に配設され、上方向開口部を有する枠体からなる。すなわち、図１に示すように、前方の樋部材２０ａは、前壁２１ａと後壁２２ａと底壁２３ａとを備え、ガイド手段６にて案内された端材１ｂが収容される。また、後方の樋部材２０ｂは、前壁２１ｂと後壁２２ｂと底壁２３ｂとを備え、ガイド手段６にて案内された端材１ｂが収容される。 The receiving means 4 has a flange member 20 (20a, 20b) disposed on the outer peripheral side of the table 2. As shown in FIG. 2, the eaves member 20 includes a frame body that is disposed in front of and behind the table 2 and has an upward opening. That is, as shown in FIG. 1, the front eaves member 20 a includes a front wall 21 a, a rear wall 22 a, and a bottom wall 23 a and accommodates the end material 1 b guided by the guide means 6. The rear eaves member 20b includes a front wall 21b, a rear wall 22b, and a bottom wall 23b, and accommodates the end material 1b guided by the guide means 6.
また、テーブル２の両側方側には、図２に示すように、樋部材２０ａ、２０ｂ間に端材１ｂをガイドするガイド部材２５（２５ａ、２５ｂ）が配置されている。ガイド部材２５は、前後の樋部材２０ａ、２０ｂの中間部から前方に向かって下傾する傾斜板２６と、前後の樋部材２０ａ、２０ｂの中間部から後方に向かって下傾する傾斜板２７とを備える。このため、ガイド部材２５（２５ａ、２５ｂ）に落下した端材１ｂがガイド部材２５の傾斜板２６、２７に案内されて前方の樋部材２０ａか後方の樋部材２０ｂに供給される。 Moreover, as shown in FIG. 2, the guide member 25 (25a, 25b) which guides the end material 1b between the eaves members 20a and 20b is arrange | positioned at the both sides of the table 2. As shown in FIG. The guide member 25 includes an inclined plate 26 inclined downward from the middle part of the front and rear flange members 20a and 20b, and an inclined plate 27 inclined downward from the intermediate part of the front and rear flange members 20a and 20b. Is provided. For this reason, the end material 1b dropped on the guide member 25 (25a, 25b) is guided by the inclined plates 26, 27 of the guide member 25 and supplied to the front flange member 20a or the rear flange member 20b.
ガイド手段６は、テーブル２の４つの辺にそれぞれ付設され、基板２側から受け手段４側に向かって斜め下方に傾斜するガイド板３０を有するものである。このガイド板３０の上面３１には、テーブル２の対応する辺と直交する方向の複数本の凹溝３２がその辺に沿って所定ピッチで配設されている。 The guide means 6 is attached to each of the four sides of the table 2 and has a guide plate 30 that is inclined obliquely downward from the substrate 2 side toward the receiving means 4 side. On the upper surface 31 of the guide plate 30, a plurality of concave grooves 32 in a direction orthogonal to the corresponding side of the table 2 are arranged at a predetermined pitch along the side.
また、ガイド手段６には、図１においてはその図示を省略したが、図２と図３に示すように、各樋部材２０ａ、２０ｂ側にガイド板３０よりも下方位置に配設される下ガイド板３５を設けるようにしてもよい。この場合の下ガイド板３５は、基板１側から受け手段４側に向かって斜め下方に傾斜するものであって、その外端縁部がガイド板３０よりも外方に突出している。また、ガイド板３０と同様に、上面に凹溝を設けてもよい。 Although not shown in FIG. 1, the guide means 6 is disposed below the guide plate 30 on the side of the flange members 20 a and 20 b as shown in FIGS. 2 and 3. A guide plate 35 may be provided. In this case, the lower guide plate 35 is inclined obliquely downward from the substrate 1 side toward the receiving means 4 side, and its outer end edge protrudes outward from the guide plate 30. Further, similarly to the guide plate 30, a concave groove may be provided on the upper surface.
ブロー手段５は、カッタ１５とモータ１６と冷却用噴射ノズル等で構成される基板切断部Ｍに付設される媒体噴き付け部としての噴射ノズル４０を備え、この噴射ノズル４０から噴き付け媒体としての水が基板の切断部位に噴射される。すなわち、ブロー手段５は、この噴射ノズル４０と、この噴射ノズル４０に噴き付け媒体としての水を供給する図示省略の供給源とを備える。このため、基板切断部Ｍと噴射ノズル４０とは一体に、前記ＸＹＺ移動機構によって、移動することになる。 The blow means 5 includes an injection nozzle 40 as a medium spraying portion attached to the substrate cutting portion M composed of a cutter 15, a motor 16, a cooling spray nozzle, and the like, and the spray nozzle 40 serves as a spraying medium. Water is sprayed onto the cutting site of the substrate. That is, the blow unit 5 includes the spray nozzle 40 and a supply source (not shown) that supplies water as a spray medium to the spray nozzle 40. For this reason, the board | substrate cutting part M and the injection | spray nozzle 40 move by the said XYZ moving mechanism integrally.
基板切断部Ｍと噴射ノズル４０とで構成される移動ユニット体Ａは、図例では１機であったが、切断効率等を考慮すれば２機備えるのが好ましい。移動ユニット体Ａを２機配置する場合、基板１に対して対称位置に配設する。 Although the moving unit body A composed of the substrate cutting part M and the injection nozzle 40 is one in the illustrated example, it is preferable to provide two moving units A in consideration of cutting efficiency and the like. When two mobile unit bodies A are arranged, they are arranged at symmetrical positions with respect to the substrate 1.
次に前記したように構成された基板切断装置を用いた基板１の切断分離方法を説明する。まず、テーブル２上に基板１を載置する。そして、吸着手段１１にて、各小ブロック片部１０ごとに基板１を吸着する。この状態で、基板切断部Ｍと噴射ノズル４０とで構成される移動ユニット体Ａを、ＸＹＺ移動機構の駆動によって、図４に示すように、基板１に対して切断線Ｌ１を形成する。 Next, a method for cutting and separating the substrate 1 using the substrate cutting apparatus configured as described above will be described. First, the substrate 1 is placed on the table 2. Then, the suction means 11 sucks the substrate 1 for each small block piece 10. In this state, as shown in FIG. 4, the moving unit body A composed of the substrate cutting part M and the injection nozzle 40 forms a cutting line L <b> 1 with respect to the substrate 1 by driving the XYZ moving mechanism.
すなわち、基板切断部Ｍ、ひいては移動ユニット体ＡをＺ軸方向に沿って上昇させた状態からＺ軸方向に沿って下降させて、図４（ａ）の座標軸で示すＸ軸方向に沿って移動させることによって、基板に対してＸ軸方向の切断線を形成することができる。この場合、移動ユニット体Ａが２機あれば、まず、一方の移動ユニット体Ａで前方側の切断線Ｌ１を形成するとともに、他方のユニット体Ａで後方側の切断線Ｌ１を形成する。 That is, the substrate cutting unit M, and consequently the moving unit body A, is moved down along the Z-axis direction from the state where it is moved up along the Z-axis direction, and moved along the X-axis direction indicated by the coordinate axes in FIG. By doing so, a cutting line in the X-axis direction can be formed with respect to the substrate. In this case, if there are two moving unit bodies A, first, one moving unit body A forms a cutting line L1 on the front side, and the other unit body A forms a cutting line L1 on the rear side.
その後、各ユニット体ＡをＺ軸方向に沿って上昇させた後、一方の移動ユニット体Ａを所定ピッチだけＹ軸方向後方側に移動させ、次に上昇させた状態からＺ軸方向に沿って下降させて、Ｘ軸方向に沿って移動させる。これによって、基板１に対して、前回のＸ軸方向の切断線よりも所定ピッチだけＹ軸方向後方側にずれたＸ軸方向の切断線Ｌ１を形成することができる。また、他方の移動ユニット体Ａを所定ピッチだけＹ軸方向前方側に移動させ、次に上昇させた状態からＺ軸方向に沿って下降させて、Ｘ軸方向に沿って移動させる。これによって、基板に対して、前回のＸ軸方向の切断線よりも所定ピッチだけＹ軸方向前方側にずれたＸ軸方向の切断線Ｌ１を形成することができる。 Thereafter, each unit body A is raised along the Z-axis direction, and then one moving unit body A is moved to the rear side in the Y-axis direction by a predetermined pitch, and then moved upward along the Z-axis direction. Lower and move along the X-axis direction. As a result, it is possible to form the cutting line L1 in the X-axis direction that is shifted to the rear side in the Y-axis direction by a predetermined pitch from the previous cutting line in the X-axis direction. Further, the other moving unit body A is moved forward in the Y-axis direction by a predetermined pitch, then moved downward along the Z-axis direction from the raised state, and moved along the X-axis direction. As a result, it is possible to form the X-axis direction cutting line L1 which is shifted to the front side in the Y-axis direction by a predetermined pitch from the previous X-axis direction cutting line.
以後同様に、所定ピッチだけＹ軸方向にずれたＸ軸方向の切断線Ｌ１を、順次形成していけば、図４（ａ）に示すように、基板のＹ軸方向全範囲に、所定ピッチだけＹ軸方向にずれた複数本のＸ軸方向の複数本の切断線Ｌ１を形成できる。 Thereafter, similarly, if the cutting line L1 in the X-axis direction shifted in the Y-axis direction by a predetermined pitch is sequentially formed, as shown in FIG. 4 (a), the predetermined pitch is provided over the entire range in the Y-axis direction of the substrate. Thus, a plurality of cutting lines L1 in the X-axis direction that are shifted in the Y-axis direction can be formed.
次に、回転駆動機構にて、図４（ｂ）に示すように、テーブルを９０°回転させれば、前記形成された切断線Ｌ１は、基板のＸ軸方向全範囲に、所定ピッチだけＸ軸方向にずれた複数本のＹ軸方向の複数本の切断線となる。 Next, as shown in FIG. 4B, if the table is rotated by 90 ° by the rotation drive mechanism, the formed cutting line L1 is X by a predetermined pitch over the entire range in the X-axis direction of the substrate. A plurality of cutting lines in the Y-axis direction are displaced in the axial direction.
そこで、前記した工程を行うことによって、図５に示すように、基板のＹ軸方向全範囲に、所定ピッチだけＹ軸方向にずれた複数本のＸ軸方向の複数本の切断線Ｌ２を形成する。これによって、基板１にマトリックス状の切断線Ｌ１，Ｌ２を形成することができ、基板１の個片化が可能となる。 Therefore, by performing the above-described steps, as shown in FIG. 5, a plurality of cutting lines L2 in the X-axis direction that are shifted in the Y-axis direction by a predetermined pitch are formed in the entire range in the Y-axis direction of the substrate. To do. Thereby, the matrix-like cutting lines L1 and L2 can be formed on the substrate 1, and the substrate 1 can be separated into individual pieces.
ところで、切断線Ｌ１，Ｌ２の形成時には、切断手段３では冷却媒体（冷却水）が噴射され、ブロー手段５からは噴き付け媒体（噴き付け水）が噴射される。このため、端材１ｂを基板１から切断分離される際には、図１に示すように、ガイド板３０側へ噴き付け媒体にて押し流される。 By the way, when the cutting lines L1 and L2 are formed, a cooling medium (cooling water) is jetted from the cutting means 3, and a spraying medium (spraying water) is jetted from the blow means 5. For this reason, when the end material 1b is cut and separated from the substrate 1, as shown in FIG. 1, it is pushed away by the spray medium toward the guide plate 30 side.
この際、噴き付け媒体（水）及び冷却媒体（冷却水）がガイド板３０の凹溝３２を、基板側から樋部材２０（２０ａ、２０ｂ）へと流れる。このため、ガイド板３０側に押し流された端材１ｂは、樋部材２０（２０ａ、２０ｂ）へと流れる。すなわち、前方の樋部材２０ａ側で切断分離された端材１ｂは、ガイド板３０と下ガイド板３５にガイドされて、前方の樋部材２０ａに案内される。また、後方の樋部材２０ｂ側で切断分離された端材１ｂは、ガイド板３０と下ガイド板３５にガイドされて、後方の樋部材２０ｂに案内される。側方のガイド部材２５ａ、２５ｂ側で断分離された端材１ｂは、ガイド部材２５ａ、２５ｂにガイドされて、前方の樋部材２０ａ又は後方の樋部材２０ｂ側へと供給される。なお、樋部材２０ａ、２０ｂに供給された端材１ｂとしては、作業者が排出（回収）するようにしても、樋部材２０ａ、２０ｂに水等の流体を流して、これによって回収するようにしてもよい。 At this time, the spray medium (water) and the cooling medium (cooling water) flow through the concave groove 32 of the guide plate 30 from the substrate side to the flange member 20 (20a, 20b). For this reason, the end material 1b pushed away to the guide plate 30 side flows to the flange member 20 (20a, 20b). That is, the end material 1b cut and separated on the front saddle member 20a side is guided by the guide plate 30 and the lower guide plate 35 and guided to the forward saddle member 20a. Further, the end material 1b cut and separated on the rear flange member 20b side is guided by the guide plate 30 and the lower guide plate 35, and is guided to the rear flange member 20b. The end material 1b cut and separated on the side guide members 25a and 25b is guided by the guide members 25a and 25b and supplied to the front flange member 20a or the rear flange member 20b side. In addition, as the end material 1b supplied to the flange members 20a and 20b, even if the operator discharges (recovers), a fluid such as water is allowed to flow through the flange members 20a and 20b, thereby recovering. May be.
ところで、この装置では、ＸＹＺ移動機構、回転駆動機構、切断手段３、及びブロー手段５等が、図示省略の制御手段にて制御され、前記切断工程が実施される。制御手段は、例えば、ＣＰＵ（Central Processing Unit）を中心としてＲＯＭ（Read Only Memory）やＲＡＭ（Random Access Memory）等がバスを介して相互に接続されたマイクロコンピューターである。なお、前記ＲＯＭには、ＣＰＵが実行するプログラムやデータが格納されている。 By the way, in this apparatus, the XYZ movement mechanism, the rotation drive mechanism, the cutting means 3, the blowing means 5, and the like are controlled by a control means (not shown), and the cutting step is performed. The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The ROM stores programs executed by the CPU and data.
本発明では、切断手段３にて切断された基板端材１ｂをブロー手段５にて受け手段４側に押し流すことができ、しかも、押し流す際には、基板端材１ｂはガイド手段６にて受け手段４に案内される。このため、基板端材１ｂが受け手段４に安定して供給でき、テーブル２等に停滞することがなくなって、作用者による基板端材１ｂの除去作業を不要とする。 In the present invention, the substrate end material 1b cut by the cutting means 3 can be pushed away to the receiving means 4 side by the blow means 5, and the substrate end material 1b is received by the guide means 6 when being pushed away. Guided by means 4. For this reason, the substrate end material 1b can be stably supplied to the receiving means 4, and it does not stagnate in the table 2 etc., and the removal operation | work of the substrate end material 1b by an operator becomes unnecessary.
ガイド手段６が凹溝３２を上面に有するガイド板３０を有するので、ガイド板３０の基板端材１ｂが付着することなく基板端材１ｂを受け手段４に供給することができ、基板端材１ｂの回収作業が安定する。また、噴射ノズル４０と基板切断部Ｍとが一体的に移動できるので、基板端材１ｂに対して安定して媒体を噴き付けることができ、基板端材１ｂを安定して押し流すことができる。 Since the guide means 6 has the guide plate 30 having the concave groove 32 on the upper surface, the substrate end material 1b of the guide plate 30 can be supplied to the receiving means 4 without being attached to the substrate end material 1b. The collection work becomes stable. Further, since the spray nozzle 40 and the substrate cutting part M can move integrally, the medium can be stably sprayed onto the substrate end material 1b, and the substrate end material 1b can be stably swept away.
冷却用噴射ノズルから噴射される冷却媒体にてカッタ１５および切断部位を冷却することができるので、カッタ１５の切断機能を低下させないとともに、カッタ１５や基板１の損傷を有効に防止できる。ＸＹＺ移動機構と回転駆動機構とを備えるので、基板１にマトリックス状の切断線Ｌ１，Ｌ２を形成することができ、基板１の個片化が可能となって、基板切断装置として安定する。 Since the cutter 15 and the cutting part can be cooled by the cooling medium injected from the cooling injection nozzle, the cutting function of the cutter 15 is not lowered, and damage to the cutter 15 and the substrate 1 can be effectively prevented. Since the XYZ moving mechanism and the rotation drive mechanism are provided, the matrix-like cutting lines L1 and L2 can be formed on the substrate 1, and the substrate 1 can be separated into pieces, which is stable as a substrate cutting apparatus.
樋部材２０を設けているので、基板端材１ｂをこの樋部材２０にて受けることができ、しかも、構成の簡素化を図ることが可能となる。 Since the flange member 20 is provided, the substrate end material 1b can be received by the flange member 20, and the structure can be simplified.
下ガイド板３５を設けたことにより、上方のガイド板３０で届かない位置への受け手段４への案内が可能となり、受け手段４外への基板端材１ｂの排出がなくなる。また、テーブル２を回転させる場合の回転スペースを考慮して、上方のガイド板３０を大きくできない場合等において、このような下ガイド板３５を設けることによって、回転スペースを大きくとれない部位に、この装置を設置できる利点がある。下ガイド板３５の上面に凹溝を設けたことによって、この凹溝を噴き付け媒体が流れるので、ガイド板３０上に基板端材１ｂが付着することなく受け手段４側に流れていく。 By providing the lower guide plate 35, it is possible to guide the receiving means 4 to a position that cannot be reached by the upper guide plate 30, and the substrate end material 1 b is not discharged out of the receiving means 4. In addition, in consideration of the rotation space when the table 2 is rotated, when the upper guide plate 30 cannot be enlarged, the lower guide plate 35 is provided so that the rotation space cannot be increased. There is an advantage that the device can be installed. By providing a concave groove on the upper surface of the lower guide plate 35, the sprayed medium flows through the concave groove, so that the substrate end material 1b flows on the guide plate 30 without adhering to the receiving means 4 side.
吸着手段１１によって、各基板小片１ａが小ブロック片部１０に吸着されるので、切断時に基板１がずれることがなくなって、形成される切断線Ｌ１，Ｌ２は安定する。ブロー手段５の噴き付け媒体及び切断手段３の冷却媒体に水を用いることによって、低コスト化を図ることができ、安定した噴き付けと冷却が可能となる。 Since each of the small substrate pieces 1a is attracted to the small block piece portion 10 by the suction means 11, the substrate 1 is not displaced during cutting, and the formed cutting lines L1 and L2 are stable. By using water as the spray medium of the blow means 5 and the cooling medium of the cutting means 3, the cost can be reduced, and stable spraying and cooling can be achieved.
ところで、図７は、比較例として、ガイド手段６を有さない場合を示している。このように、ガイド手段６がなければ、ブロー手段５にて端材１ｂを吹き飛ばしても、樋部材２０（２０ａ）（２０ｂ）に収容されにくく、テーブル１の段部等に溜まるおそれがある。このように、溜まれば、溜まった端材１ｂが設備エラーを引き起す場合があり、これを防止するために、定期的に(短時間間隔に)作業者がこの端材１ｂの除去作業を行う必要があり、作業性に劣るものとなる。 Incidentally, FIG. 7 shows a case where the guide means 6 is not provided as a comparative example. Thus, if the guide means 6 is not provided, even if the end material 1b is blown off by the blowing means 5, it is difficult to be accommodated in the flange members 20 (20a) and (20b), and there is a possibility that it will accumulate on the step portion of the table 1. In this way, if accumulated, the collected end material 1b may cause an equipment error. In order to prevent this, an operator periodically removes the end material 1b (at short intervals). It is necessary to carry out, and it becomes inferior to workability | operativity.
これに対して、本発明のように、ガイド手段６を設けることによって、端材１ｂが樋部材２０以外の部位に溜まることがなく、短時間間隔毎の作業者による端材１ｂの除去作業を行う必要がなく、大幅な作業性の向上を図ることができる。 On the other hand, by providing the guide means 6 as in the present invention, the end material 1b is not collected in a part other than the flange member 20, and the work of removing the end material 1b by an operator at every short time interval is performed. There is no need to do this, and the workability can be greatly improved.
以上、本発明の実施形態につき説明したが、前記実施形態に限定されることなく種々の変形が可能であって、例えば、前記実施形態では、噴き付け媒体として、前記実施形態では、水を用いたが、水以外の種々の液体、気体、気泡を含んだ液体等の種々の流体を用いてもよい。水以外の流体としては、基板を洗浄する洗浄液等を用いることができる。また、気体としてエア等を用いることができる。ガイド板３０の傾斜角度、凹溝３２の幅寸法、凹溝３２の深さ寸法、凹溝３２の断面形状、凹溝３２の配設数、凹溝３２の配設ピッチ等も、切断分離される端材を、ガイド板３０に付着させることなく、受け手段４側に押し流すことができる範囲で任意に設定できる。また、下ガイド板３５を有さないものであってもよい。 As described above, the embodiment of the present invention has been described, but various modifications are possible without being limited to the embodiment. For example, in the embodiment, water is used as a spraying medium in the embodiment. However, various fluids such as various liquids other than water, gas, and liquid containing bubbles may be used. As the fluid other than water, a cleaning solution for cleaning the substrate can be used. Moreover, air etc. can be used as gas. The inclination angle of the guide plate 30, the width of the groove 32, the depth of the groove 32, the cross-sectional shape of the groove 32, the number of grooves 32, the pitch of the grooves 32, etc. are also cut and separated. The end material can be arbitrarily set as long as it can be swept away to the receiving means 4 side without adhering to the guide plate 30. Further, the lower guide plate 35 may not be provided.
移動ユニット体Ａの数としても１機以上あればよいので、３機であっても、４機であってもよい。また、形成される切断線Ｌ１、Ｌ２の配設ピッチとしても、任意に設定できる。すなわち、テーブル２の小ブロック片部１０の大きさに応じて種々設定できる。また、切断手段３のカッタ１５として円盤カッタを用いたが、ルータビット等の他の切断工具を用いてもよい。 Since the number of the mobile unit bodies A may be one or more, it may be three or four. Further, the arrangement pitch of the cutting lines L1 and L2 to be formed can be arbitrarily set. That is, various settings can be made according to the size of the small block piece 10 of the table 2. Moreover, although the disk cutter was used as the cutter 15 of the cutting means 3, other cutting tools, such as a router bit, may be used.
テーブル２の小ブロック片部１０の数や大きさ等任意に設定できる。また、図例では、小ブロック片部１０は平面的に見て正方形であったが、長方形であってもよい。 The number and size of the small block pieces 10 of the table 2 can be arbitrarily set. In the illustrated example, the small block piece 10 is square when viewed in plan, but may be rectangular.
Ｍ 基板切断部
Ｌ１，Ｌ２ 切断線
１ 基板
１ｂ 基板端材
２ テーブル
３ 切断手段
４ 受け手段
５ ブロー手段
６ ガイド手段
１１ 吸着手段
１５ カッタ
２０、２０ａ、２０ｂ 樋部材
３０ ガイド板
３１ 上面
３２ 凹溝
３５ 下ガイド板
４０ 噴射ノズル
M Substrate cutting part L1, L2 Cutting line 1 Substrate 1b Substrate edge 2 Table 3 Cutting means 4 Receiving means 5 Blow means 6 Guide means 11 Suction means 15 Cutter 20, 20a, 20b Cutter member 30 Guide plate 31 Upper surface 32 Concave groove 35 Lower guide plate 40 spray nozzle
Claims (10)
基板を受けるテーブルと、このテーブル上の基板を切断分離する切断手段と、この切断手段にて基板から切断分離される基板端材を受ける受け手段と、噴き付け媒体を噴き付けて前記切断手段にて切断された基板端材を受け手段側に押し流すブロー手段と、基板端材を受け手段に案内するガイド手段とを備えたことを特徴とする基板切断装置。 A substrate cutting device for cutting a substrate into individual pieces,
A table for receiving the substrate, a cutting means for cutting and separating the substrate on the table, a receiving means for receiving the substrate end material cut and separated from the substrate by the cutting means, and a spray medium sprayed onto the cutting means A substrate cutting apparatus comprising: a blowing unit that pushes the cut substrate end material toward the receiving unit; and a guide unit that guides the substrate end material to the receiving unit.
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| JP2020181896A (en) * | 2019-04-25 | 2020-11-05 | 日亜化学工業株式会社 | Manufacturing method of semiconductor device |
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