JP2013053898A5 - Semiconductor test jig - Google Patents
Semiconductor test jig Download PDFInfo
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- JP2013053898A5 JP2013053898A5 JP2011191466A JP2011191466A JP2013053898A5 JP 2013053898 A5 JP2013053898 A5 JP 2013053898A5 JP 2011191466 A JP2011191466 A JP 2011191466A JP 2011191466 A JP2011191466 A JP 2011191466A JP 2013053898 A5 JP2013053898 A5 JP 2013053898A5
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- base
- test jig
- vertical semiconductor
- semiconductor device
- semiconductor test
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Claims (10)
前記下面電極が接触した状態で前記複数の縦型半導体装置がそれぞれ個別に設置される複数の設置部を有する導電性の基台と、
前記基台上に設けられ、前記複数の設置部をそれぞれ囲う格子状の絶縁性の枠部とを備えることを特徴とする半導体試験治具。 A semiconductor test jig for testing a plurality of vertical semiconductor devices having a lower electrode and an upper electrode,
A conductive base having a plurality of installation portions on which the plurality of vertical semiconductor devices are individually installed in a state in which the lower surface electrode is in contact;
What is claimed is: 1. A semiconductor test jig comprising: a grid-like insulating frame portion provided on the base and surrounding the plurality of installation portions.
前記縦型半導体装置の前記上面電極に接触する導電性のプローブと、
前記縦型半導体装置が前記設置部に設置された状態で、前記基台、前記ステージ及び前記プローブを介して前記縦型半導体装置の試験を行う試験装置とを更に備えることを特徴とする請求項１に記載の半導体試験治具。 A conductive stage on which the base is installed with the back surface of the base being in contact;
A conductive probe in contact with the top electrode of the vertical semiconductor device;
A test apparatus for testing the vertical semiconductor device through the base, the stage, and the probe in a state where the vertical semiconductor device is installed in the installation unit. The semiconductor test jig according to 1.
前記複数の縦型半導体装置がそれぞれ個別に設置される複数の設置部と、前記複数の設置部にそれぞれ設けられ、前記設置部に設置された前記縦型半導体装置の前記下面電極の少なくとも一部を露出させる開口部とを有する基台と、
前記基台上に設けられ、前記複数の設置部をそれぞれ囲う格子状の絶縁性の枠部とを備えることを特徴とする半導体試験治具。 A semiconductor test jig for testing a plurality of vertical semiconductor devices having a lower electrode and an upper electrode,
At least a portion of the lower surface electrode of the vertical semiconductor device provided in each of the plurality of installation portions where the plurality of vertical semiconductor devices are individually installed, and provided in the plurality of installation portions. A base having an opening for exposing the
What is claimed is: 1. A semiconductor test jig comprising: a grid-like insulating frame portion provided on the base and surrounding the plurality of installation portions.
前記縦型半導体装置の前記上面電極に接触する導電性の第２のプローブと、
前記縦型半導体装置が前記設置部に設置された状態で、前記第１及び第２のプローブを介して前記縦型半導体装置の試験を行う試験装置とを更に備えることを特徴とする請求項３に記載の半導体試験治具。 A conductive first probe that contacts the lower surface electrode of the vertical semiconductor device installed in the installation portion through the opening;
A conductive second probe in contact with the top electrode of the vertical semiconductor device;
4. The apparatus according to claim 3, further comprising: a test apparatus for testing the vertical semiconductor device via the first and second probes in a state where the vertical semiconductor device is installed in the installation unit. The semiconductor test jig as described in.
前記基台に凹部が設けられ、
前記基台の前記凹部内に前記枠部の前記土台部が設置されていることを特徴とする請求項１〜４の何れか１項に記載の半導体試験治具。 The frame portion has a frame main body whose side surface facing the vertical semiconductor device is an inclined surface, and a base portion provided under the frame main body and having a width wider than the frame main body.
The base is provided with a recess,
The semiconductor test jig according to any one of claims 1 to 4, wherein the base portion of the frame portion is installed in the concave portion of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011191466A JP5696624B2 (en) | 2011-09-02 | 2011-09-02 | Semiconductor test jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011191466A JP5696624B2 (en) | 2011-09-02 | 2011-09-02 | Semiconductor test jig |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013053898A JP2013053898A (en) | 2013-03-21 |
| JP2013053898A5 true JP2013053898A5 (en) | 2014-01-23 |
| JP5696624B2 JP5696624B2 (en) | 2015-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011191466A Active JP5696624B2 (en) | 2011-09-02 | 2011-09-02 | Semiconductor test jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5696624B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512306B (en) | 2013-04-25 | 2015-12-11 | Murata Manufacturing Co | Test equipment for electronic parts |
| JP6127826B2 (en) * | 2013-08-07 | 2017-05-17 | 三菱電機株式会社 | Semiconductor test jig |
| JP6109032B2 (en) * | 2013-10-02 | 2017-04-05 | 三菱電機株式会社 | Semiconductor test jig, its transfer jig, and foreign substance removal method using the same |
| JP6339345B2 (en) * | 2013-10-31 | 2018-06-06 | 三菱電機株式会社 | Semiconductor evaluation apparatus and semiconductor evaluation method |
| JP6480099B2 (en) * | 2013-11-13 | 2019-03-06 | 三菱電機株式会社 | Semiconductor test jig, measuring device, test method |
| JP6237242B2 (en) * | 2014-01-08 | 2017-11-29 | 三菱電機株式会社 | Semiconductor test jig, test method |
| JP2015132476A (en) * | 2014-01-09 | 2015-07-23 | 三菱電機株式会社 | Semiconductor chip testing device, semiconductor chip testing method, and stage for semiconductor chip testing device |
| JP6233039B2 (en) * | 2014-01-16 | 2017-11-22 | 三菱電機株式会社 | Semiconductor test jig, measuring device, test method |
| JP6451097B2 (en) * | 2014-06-19 | 2019-01-16 | 富士電機株式会社 | Semiconductor test equipment |
| JP6477947B2 (en) * | 2018-03-05 | 2019-03-06 | 三菱電機株式会社 | Semiconductor test jig, measuring device, test method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649143U (en) * | 1979-09-21 | 1981-05-01 | ||
| JP2821046B2 (en) * | 1991-09-05 | 1998-11-05 | 三菱電機エンジニアリング株式会社 | Characteristics inspection equipment for semiconductor devices |
| JP4525117B2 (en) * | 2004-03-12 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | tray |
| JP2010243314A (en) * | 2009-04-06 | 2010-10-28 | Syswave Corp | Semiconductor chip element test tool and automatic test equipment |
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2011
- 2011-09-02 JP JP2011191466A patent/JP5696624B2/en active Active
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