JP2013053256A - Method for treating resin - Google Patents

Method for treating resin Download PDF

Info

Publication number
JP2013053256A
JP2013053256A JP2011193377A JP2011193377A JP2013053256A JP 2013053256 A JP2013053256 A JP 2013053256A JP 2011193377 A JP2011193377 A JP 2011193377A JP 2011193377 A JP2011193377 A JP 2011193377A JP 2013053256 A JP2013053256 A JP 2013053256A
Authority
JP
Japan
Prior art keywords
tar
resin
liquid product
product
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011193377A
Other languages
Japanese (ja)
Other versions
JP5867849B2 (en
Inventor
Toru Kamo
徹 加茂
Tadashi Imai
正 今井
Hiroshi Matsui
宏 松井
Hideki Nakagome
秀樹 中込
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Chiba University NUC
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Toshiba Corp
Chiba University NUC
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Chiba University NUC, National Institute of Advanced Industrial Science and Technology AIST filed Critical Toshiba Corp
Priority to JP2011193377A priority Critical patent/JP5867849B2/en
Publication of JP2013053256A publication Critical patent/JP2013053256A/en
Application granted granted Critical
Publication of JP5867849B2 publication Critical patent/JP5867849B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Landscapes

  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for treating a resin reducing or eliminating the use of a subsidiary material.SOLUTION: The method for treating a resin includes the steps of: applying solubilizing treatment to a thermosetting resin and/or a thermoplastic resin using tar as a solvent to obtain a solubilized substance; applying thermal decomposition to the solubilized substance to obtain a liquid product; distilling the liquid product to generate tar; and cyclically using the generated tar as a solvent of the thermosetting resin and/or the thermoplastic resin.

Description

本発明の実施形態は、熱硬化性樹脂及び/又は熱可塑性樹脂を可溶化する樹脂の処理方法に関する。   Embodiments of the present invention relate to a method for treating a resin that solubilizes a thermosetting resin and / or a thermoplastic resin.

周知の如く、プリント基板等の各種電化部品には、電気絶縁性や耐熱性等に優れた熱硬化性樹脂や熱可塑性樹脂が使用されている。これらの樹脂を使用した電化部品は、経時変化等により本来の機能を果たさなくなると、廃棄処分されることになる。従来、こうした廃棄処分の対象である電化部品は、リン酸などの触媒、アルコール系溶媒、バイオマスから製造したタールなどの可溶化溶媒により処理されている。しかしながら、可溶化させる際、リン酸などの触媒、アルコール系溶媒あるいはバイオマスなどの副資材を必要とする。   As is well known, thermosetting resins and thermoplastic resins having excellent electrical insulation and heat resistance are used for various electrical components such as printed boards. Electrical parts using these resins are disposed of when they do not perform their original functions due to changes over time. Conventionally, the electrical components that are the targets of such disposal are treated with a catalyst such as phosphoric acid, an alcohol solvent, and a solubilizing solvent such as tar produced from biomass. However, when solubilizing, a secondary material such as a catalyst such as phosphoric acid, an alcohol solvent or biomass is required.

特開2010−174150号公報JP 2010-174150 A

実施形態の目的は、副資材を削減あるいは不要とした樹脂の処理方法を提供することにある。   An object of the embodiment is to provide a resin processing method in which auxiliary materials are reduced or unnecessary.

実施形態によれば、熱硬化性樹脂及び/又は熱可塑性樹脂を、溶媒としてタールを用い可溶化処理して可溶化物を得る工程と、前記可溶化物を熱分解して液体生成物を得る工程と、前記液体生成物を蒸留してタールを生成する工程と、生成したタールを、熱硬化性樹脂及び/又は熱可塑性樹脂の溶媒として循環的に使用することを特徴とする樹脂の処理方法を提供できる。   According to the embodiment, a step of solubilizing a thermosetting resin and / or a thermoplastic resin using tar as a solvent to obtain a solubilizate, and thermally decomposing the solubilized product to obtain a liquid product A process for producing a tar by distilling the liquid product, and a method for treating a resin, wherein the produced tar is cyclically used as a solvent for a thermosetting resin and / or a thermoplastic resin. Can provide.

エポキシ基板を加熱処理した時の温度を変えた場合の、液体生成物、残渣及びガス生成物と収率との関係を示す特性図。The characteristic view which shows the relationship between a liquid product, a residue, a gas product, and a yield at the time of changing the temperature at the time of heat-processing an epoxy substrate. タールに対するエポキシ基板の比率を変えた場合の、タール製造温度と可溶化率との関係を示す特性図。The characteristic view which shows the relationship between tar production temperature and solubilization rate at the time of changing the ratio of the epoxy board | substrate with respect to tar. (エポキシ基板+タール)に対するエポキシ基板の比率を変えた場合の、液体生成物とガス生成物と残渣の収率を示す特性図。The characteristic view which shows the yield of a liquid product, a gas product, and a residue at the time of changing the ratio of the epoxy substrate with respect to (epoxy substrate + tar). エポキシ樹脂を764℃で加熱処理して得たタールのGC−MASS分析結果を示す図。The figure which shows the GC-MASS analysis result of the tar obtained by heat-processing an epoxy resin at 764 degreeC.

以下、本実施形態に係る樹脂の処理方法について説明する。なお、本実施形態は下記に述べることに限定されない。
本実施形態において、熱硬化性樹脂としては、例えばフェノール樹脂、エポキシ樹脂が挙げられる。ここで、フェノール樹脂は、芳香族化合物であるフェノールを構成要素に持つ樹脂であり、エポキシ樹脂も、例えば代表的なエポキシ樹脂であるビスフェノールA型エポキシ樹脂は芳香族化合物を構成要素として持っている。熱可塑性樹脂としては、例えば芳香族ポリアミド樹脂やスルホン化芳香族ポリカーボネート、芳香族ポリエーテルケトン等の芳香族化合物を含む熱可塑性樹脂が挙げられる。
Hereinafter, the resin processing method according to the present embodiment will be described. Note that the present embodiment is not limited to the following description.
In the present embodiment, examples of the thermosetting resin include a phenol resin and an epoxy resin. Here, the phenol resin is a resin having phenol, which is an aromatic compound, as a constituent element, and the epoxy resin, for example, a bisphenol A type epoxy resin, which is a typical epoxy resin, has an aromatic compound as a constituent element. . Examples of the thermoplastic resin include thermoplastic resins containing aromatic compounds such as aromatic polyamide resins, sulfonated aromatic polycarbonates, and aromatic polyether ketones.

本発明者らは、種々研究を重ねた結果、上述した芳香族を構成要素に持つ熱硬化性樹脂及び/又は熱可塑性樹脂を加熱処理により低分子化し、得られたタールにより熱硬化性樹脂及び/又は熱可塑性樹脂の可溶化を行うことにより、前記タールを可溶化溶媒として循環的に使用する樹脂の処理方法を究明するに至った。なお、本実施形態において、生成したタールを、熱硬化性樹脂及び/又は熱可塑性樹脂の溶媒として循環的に使用するが、タールの一部としてバイオマス由来のタールを補給することも可能である。また、加熱処理して得られるタールには、クレゾールやクレゾール誘導体などのフェノール性水酸基含有化合物を含んでいることが好ましい。ここで、タールにフェノール性水酸基含有化合物が含んでいることにより、タールが比較的低温でエポキシ基板等のプリント基板中の樹脂を容易に可溶化することができる。   As a result of repeating various studies, the inventors of the present invention have reduced the molecular weight of the above-described thermosetting resin and / or thermoplastic resin having an aromatic component by heat treatment, and the resulting tar makes the thermosetting resin and By solubilizing the thermoplastic resin, a method for treating the resin using the tar as a solubilizing solvent in a cyclic manner has been investigated. In addition, in this embodiment, although the produced | generated tar is used cyclically as a solvent of a thermosetting resin and / or a thermoplastic resin, it is also possible to replenish biomass-derived tar as a part of tar. The tar obtained by heat treatment preferably contains a phenolic hydroxyl group-containing compound such as cresol or a cresol derivative. Here, when the tar contains the phenolic hydroxyl group-containing compound, the tar can easily solubilize the resin in the printed board such as an epoxy board at a relatively low temperature.

次に、本実施形態に係る樹脂の処理方法について説明する。
(実施形態)
まず、エポキシ樹脂とガラス繊維の複合材である数g〜数百gのエポキシ基板を、不活性ガス(窒素)雰囲気下で600〜900℃の反応温度で一定時間おいて加熱処理し、生成物を得た。つづいて、この生成物を室温まで冷却して、固体状の固体生成物(残渣)、液体生成物、気体状のガス生成物の3種を得た。各生成物の収率を図1に示す。図1で、横軸は反応温度を示し、縦軸は各生成物の収率を示す。エポキシ基板は重量割合で40%のエポキシ樹脂と60%のガラス繊維からなるが、ここでは各収率は加熱処理する前のエポキシ基板中の樹脂成分重量を100とした、樹脂基準の収率とした。なお、図1において、符号(a)は液体生成物を、符号(b)は固体生成物(残渣)を、符号(c)はガス生成物を示す曲線である。
Next, a resin processing method according to this embodiment will be described.
(Embodiment)
First, several g to several hundred g of epoxy substrate, which is a composite material of epoxy resin and glass fiber, is heat-treated at a reaction temperature of 600 to 900 ° C. in an inert gas (nitrogen) atmosphere for a certain period of time. Got. Subsequently, this product was cooled to room temperature to obtain three kinds of solid product (residue), liquid product, and gaseous gas product. The yield of each product is shown in FIG. In FIG. 1, the horizontal axis represents the reaction temperature, and the vertical axis represents the yield of each product. The epoxy substrate is composed of 40% epoxy resin and 60% glass fiber by weight. Here, each yield is a resin-based yield with the resin component weight in the epoxy substrate before heat treatment as 100. did. In FIG. 1, symbol (a) is a liquid product, symbol (b) is a solid product (residue), and symbol (c) is a gas product.

図1に示したように、反応温度600〜900℃で加熱処理することにより、エポキシ基板中に含まれた樹脂のうち、70〜80%の収率で液体生成物が得られた。
次に、得られた液体生成物を蒸留し、次工程である可溶化処理温度(150〜350℃)以下の沸点を有する軽質留分を除いてタールを製造した。つづいて、このタールに触媒として例えば硫酸を添加し、常圧で150〜350℃の温度範囲で再加熱し、当該タールにエポキシ基板を浸漬させて、エポキシ基板中の樹脂をタールに可溶化させ、溶解物を含んだタール(以下、可溶化物と呼ぶ)を得た。なお、可溶化物を得る際、エポキシ基板に使用されている例えば銅配線、金、ガラス繊維等の不溶物は、取り除く。
As shown in FIG. 1, a liquid product was obtained in a yield of 70 to 80% of the resin contained in the epoxy substrate by heat treatment at a reaction temperature of 600 to 900 ° C.
Next, the obtained liquid product was distilled, and tar was produced by removing a light fraction having a boiling point equal to or lower than the solubilization temperature (150 to 350 ° C.) as the next step. Subsequently, for example, sulfuric acid is added to the tar as a catalyst, reheated at a normal pressure in a temperature range of 150 to 350 ° C., and the epoxy substrate is immersed in the tar so that the resin in the epoxy substrate is solubilized in the tar. A tar containing a dissolved product (hereinafter referred to as a solubilized product) was obtained. When obtaining a solubilized product, insoluble materials such as copper wiring, gold, and glass fiber used for the epoxy substrate are removed.

図2は、硫酸0.24%を添加して250℃で再加熱した結果を示す。図2において、横軸は、エポキシ基板(ガラス繊維+エポキシ樹脂)とタールとの重量比を示している。縦軸の可溶化率は、エポキシ基板に含まれる樹脂成分を100とし、このうち、可溶化した樹脂(以下、溶解物とする)の割合を100分率で示した。
図2に示したように、エポキシ基板を反応温度600℃以上で加熱処理して製造したタールにより、150〜350℃と比較的低温でもエポキシ基板中の樹脂を可溶化できることがわかる。なお、比較的高温(800℃)で加熱処理して製造したタールの方が可溶化率は比較的高く、ほぼ100%の樹脂を可溶化し、エポキシ基板を樹脂とガラス繊維に分離できる。また、可溶化の際に、エポキシ基板以外の熱硬化性樹脂や熱可塑性樹脂またはバイオマスを添加すると、可溶化物を多く製造することができる。
FIG. 2 shows the result of reheating at 250 ° C. with the addition of 0.24% sulfuric acid. In FIG. 2, the horizontal axis represents the weight ratio of the epoxy substrate (glass fiber + epoxy resin) and tar. The solubilization rate on the vertical axis is defined as 100 for the resin component contained in the epoxy substrate, and the ratio of the solubilized resin (hereinafter referred to as “dissolved material”) is shown as 100 fractions.
As shown in FIG. 2, it can be seen that the tar produced by heat-treating the epoxy substrate at a reaction temperature of 600 ° C. or higher can solubilize the resin in the epoxy substrate even at a relatively low temperature of 150 to 350 ° C. Note that tar produced by heat treatment at a relatively high temperature (800 ° C.) has a relatively high solubilization rate, so that almost 100% of the resin can be solubilized and the epoxy substrate can be separated into the resin and the glass fiber. Further, when a thermosetting resin other than an epoxy substrate, a thermoplastic resin, or biomass is added during solubilization, a large amount of solubilized product can be produced.

ここで、図2において、タール製造温度(反応温度)800℃の可溶化率を見ると、エポキシ基板/タール比が大きくなると可溶化率が徐々に低下していく傾向がある。即ち、樹脂を可溶化していくと、タールが樹脂を可溶化する能力が低下していく傾向にある。このため、ある程度可溶化率が低下したタールは、全部あるいは一部を新規に作成したタールと交換・補充し、可溶化率を維持する必要がある。   Here, in FIG. 2, when the solubilization rate at the tar production temperature (reaction temperature) of 800 ° C. is seen, the solubilization rate tends to gradually decrease as the epoxy substrate / tar ratio increases. That is, as the resin is solubilized, the ability of tar to solubilize the resin tends to decrease. For this reason, the tar whose solubilization rate has fallen to some extent needs to be replaced or supplemented with a newly created tar in whole or in part to maintain the solubilization rate.

新規のタールの作成方法としては、前記と同様に熱硬化性樹脂及び/又は熱可塑性樹脂を加熱処理して作成する方法以外に、タール中に可溶化した熱硬化性樹脂及び/又は熱可塑性樹脂の溶解物を加熱処理して再度タールを作成する方法が考えられる。溶解物からタールを作成できれば、タールを製造するためだけに熱硬化性樹脂や熱可塑性樹脂またはバイオマスを加熱処理する必要はなく、また可溶化物を有効利用できるメリットがある。   As a method for producing a new tar, a thermosetting resin and / or a thermoplastic resin solubilized in tar other than the method for producing a thermosetting resin and / or a thermoplastic resin by heat treatment as described above. A method of preparing a tar again by heat-treating the dissolved product is considered. If tar can be produced from the dissolved product, it is not necessary to heat-treat the thermosetting resin, thermoplastic resin or biomass only for producing tar, and there is an advantage that the solubilized product can be effectively used.

可溶化物を反応温度700℃で加熱処理し、液体生成物を得たときの収率を図3に示す。横軸は可溶化物のエポキシ基板とタールの比を示し、例えば0.4の場合は、タール1kgでエポキシ基板0.4kg(エポキシ樹脂0.16kg、ガラス繊維0.24kg)を可溶化処理した後の可溶化物を加熱処理したことを示す。縦軸は、得られた液体生成物と残渣の収率を示す。なお、図3において、符号(a)は液体生成物を、符号(b)は残渣を、符号(c)はガス生成物を夫々示す曲線である。   The yield when the solubilized product was heat-treated at a reaction temperature of 700 ° C. to obtain a liquid product is shown in FIG. The horizontal axis indicates the ratio of the solubilized epoxy substrate to tar. For example, in the case of 0.4, 0.4 kg of epoxy substrate (epoxy resin 0.16 kg, glass fiber 0.24 kg) was solubilized with 1 kg of tar. It shows that the subsequent solubilizate was heat-treated. A vertical axis | shaft shows the yield of the obtained liquid product and residue. In FIG. 3, symbol (a) represents a liquid product, symbol (b) represents a residue, and symbol (c) represents a gas product.

図3より、可溶化物を加熱処理することにより、溶解物からもタールが得られることがわかる。しかしながら、プリント基板を可溶化させた可溶化物ほど、そのタール収率は徐々に低下していく。図3から、(エポキシ基板/タール)比<0.4以下の可溶化物であれば、液体生成物(タール)収率は70%以上であり、図1のプリント基板を700℃で加熱処理したときのタール収率とほぼ同じである。従って、この反応温度の場合は、(エポキシ基板/タール)比<0.6以下程度の可溶化物からタールを製造することが望ましい。   From FIG. 3, it can be seen that tar is also obtained from the dissolved product by heat-treating the solubilized product. However, the solubilized product obtained by solubilizing the printed circuit board gradually decreases the tar yield. From FIG. 3, the liquid product (tar) yield is 70% or more if the (epoxy substrate / tar) ratio <0.4 or less, and the printed circuit board of FIG. The tar yield is almost the same. Therefore, at this reaction temperature, it is desirable to produce tar from a solubilized product having an (epoxy substrate / tar) ratio of about 0.6 or less.

なお、例えば、熱分解温度800℃で製造した溶媒(タール)10kgにエポキシ基板樹脂を6kg可溶化処理した場合、エポキシ基板/タール比=6kg/10kg=0.6の時のエポキシ樹脂の可溶化率は図2より95〜100%である。可溶化率95%とした場合、6×0.4×0.95=2.3kgのエポキシ樹脂が溶剤に溶けたことになる。この可溶化物を700℃で加熱処理して、タールを再度製造すると、図3よりエポキシ基板/タール比=0.6の時の液体生成物の収率は約71%なので、2.3kg×0.71=1.6kgのタールが得られることになる。   For example, when 6 kg of epoxy substrate resin is solubilized in 10 kg of solvent (tar) produced at a thermal decomposition temperature of 800 ° C., solubilization of epoxy resin when epoxy substrate / tar ratio = 6 kg / 10 kg = 0.6 The rate is 95 to 100% from FIG. When the solubilization rate was 95%, 6 × 0.4 × 0.95 = 2.3 kg of epoxy resin was dissolved in the solvent. When the solubilized product is heat-treated at 700 ° C. to produce tar again, the yield of the liquid product when the epoxy substrate / tar ratio = 0.6 is about 71% from FIG. 0.71 = 1.6 kg of tar is obtained.

可溶化率を維持することを目的に、タールの全部あるいは一部を新規に作成したタールと交換・補充する場合、交換・補充するタールは、前記プリント基板を加熱処理して得たタール以外に、前記溶解物を加熱処理して得ることも可能である。また、可溶化に必要なタールを多く製造するため、可溶化物に熱硬化性樹脂や熱可塑性樹脂あるいはバイオマスを添加して加熱処理することも可能である。   In order to maintain the solubilization rate, when replacing or replenishing all or part of the tar with a newly created tar, the tar to be replaced or replenished is not the tar obtained by heat-treating the printed circuit board. It is also possible to obtain the lysate by heat treatment. In addition, in order to produce a large amount of tar necessary for solubilization, it is possible to add a thermosetting resin, a thermoplastic resin or biomass to the solubilized product and heat-treat it.

ここで、前記タールが樹脂を可溶化できる理由について、タール中の成分をGC-MASSにより分析し考察をしてみた。エポキシ樹脂を反応温度764℃で加熱処理して得たタールの、GC-MASS分析結果を図4に示す。図4に示すように、タールの成分には、フェノール類、クレゾール類といったフェノール性水酸基含有化合物が含まれていた。今回、芳香族化合物を構成要素中に含むエポキシ樹脂を加熱処理してタールを製造したため、タール中にこれらフェノール性水酸基含有化合物が含まれたと考えられる。また、これらフェノール性水酸基含有化合物が存在することにより、タールが150〜350℃と比較的低温でエポキシ基板中の樹脂を可溶化出来たと推定される。   Here, the reason why the tar can solubilize the resin was examined by analyzing the components in the tar by GC-MASS. FIG. 4 shows the GC-MASS analysis result of tar obtained by heating the epoxy resin at a reaction temperature of 764 ° C. As shown in FIG. 4, the tar component contained phenolic hydroxyl group-containing compounds such as phenols and cresols. This time, it was considered that these phenolic hydroxyl group-containing compounds were contained in tar because the tar was produced by heat-treating the epoxy resin containing the aromatic compound in the constituent elements. Moreover, it is estimated that the presence of these phenolic hydroxyl group-containing compounds could solubilize the resin in the epoxy substrate at a relatively low temperature of 150 to 350 ° C.

なお、上記実施形態では、触媒として硫酸を用いた場合について述べたが、硫酸の他に硝酸や塩酸等の酸類、水酸化ナトリウム、水酸化カリウム、水酸化リチウム、水酸化カルシウム、炭酸ナトリウム、炭酸カリウム、炭酸リチウム、炭酸カルシウムなどのアルカリ類、三リン酸カリウムなどのリン酸塩類、およびリチウムアミド、N,N−ジメチルアミノ−4−ピリジン等のアミン類が有効であった。   In the above embodiment, the case where sulfuric acid is used as the catalyst has been described. In addition to sulfuric acid, acids such as nitric acid and hydrochloric acid, sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, sodium carbonate, carbonate Alkalis such as potassium, lithium carbonate and calcium carbonate, phosphates such as potassium triphosphate, and amines such as lithium amide and N, N-dimethylamino-4-pyridine were effective.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

Claims (4)

熱硬化性樹脂及び/又は熱可塑性樹脂を、溶媒としてタールを用い可溶化処理して可溶化物を得る工程と、
前記可溶化物を熱分解して液体生成物を得る工程と、
前記液体生成物を蒸留してタールを生成する工程と、
生成したタールを、熱硬化性樹脂及び/又は熱可塑性樹脂の溶媒として循環的に使用する
ことを特徴とする樹脂の処理方法。
A step of solubilizing the thermosetting resin and / or thermoplastic resin with tar as a solvent to obtain a solubilizate;
Pyrolyzing the solubilizate to obtain a liquid product;
Distilling the liquid product to produce tar;
A method for treating a resin, characterized in that the generated tar is cyclically used as a solvent for a thermosetting resin and / or a thermoplastic resin.
熱硬化性樹脂及び/又は熱可塑性樹脂を初回に可溶化処理する際に溶媒として用いるタールは、熱硬化性樹脂及び/又は熱可塑性樹脂又はその溶解物を熱分解して液体生成物を得て、前記液体生成物を蒸留して生成したタールであることを特徴とする請求項1記載の樹脂の処理方法。   The tar used as a solvent when the thermosetting resin and / or thermoplastic resin is solubilized for the first time is obtained by thermally decomposing the thermosetting resin and / or thermoplastic resin or a solution thereof to obtain a liquid product. The resin treatment method according to claim 1, wherein the resin is tar produced by distillation of the liquid product. 前記タールは、フェノール性水酸基含有化合物を含むことを特徴とする請求項1又は2記載の樹脂の処理方法。   The method for treating a resin according to claim 1, wherein the tar contains a phenolic hydroxyl group-containing compound. 前記タールの一部として、バイオマス由来のタールを補給することを特徴とする請求項1乃至3のいずれか記載の樹脂の処理方法。   The method for treating a resin according to any one of claims 1 to 3, wherein tar derived from biomass is replenished as part of the tar.
JP2011193377A 2011-09-05 2011-09-05 Resin treatment method Expired - Fee Related JP5867849B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011193377A JP5867849B2 (en) 2011-09-05 2011-09-05 Resin treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011193377A JP5867849B2 (en) 2011-09-05 2011-09-05 Resin treatment method

Publications (2)

Publication Number Publication Date
JP2013053256A true JP2013053256A (en) 2013-03-21
JP5867849B2 JP5867849B2 (en) 2016-02-24

Family

ID=48130539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011193377A Expired - Fee Related JP5867849B2 (en) 2011-09-05 2011-09-05 Resin treatment method

Country Status (1)

Country Link
JP (1) JP5867849B2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492878A (en) * 1972-04-20 1974-01-11
JPH10324770A (en) * 1997-05-23 1998-12-08 Good Uiru Kk Treatment of waste plastic material
JP2002226626A (en) * 2000-11-30 2002-08-14 Research Institute Of Innovative Technology For The Earth Treating method and apparatus of plastic
US20060281956A1 (en) * 2003-04-24 2006-12-14 Bochaver Kirill Z Method for recycling rubber-containing wastes
JP2007291281A (en) * 2006-04-27 2007-11-08 Jfe Chemical Corp Treatment method for plastic
JP2009221273A (en) * 2008-03-14 2009-10-01 National Institute Of Advanced Industrial & Technology Method for solubilization treatment of thermosetting resin, and solvent to be used in the treatment
JP2010174150A (en) * 2009-01-30 2010-08-12 National Institute Of Advanced Industrial Science & Technology Solubilizing solvent for resin comprising biomass-derived tar
JP2011057773A (en) * 2009-09-08 2011-03-24 Olympus Corp Method for liquefying resin

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492878A (en) * 1972-04-20 1974-01-11
JPH10324770A (en) * 1997-05-23 1998-12-08 Good Uiru Kk Treatment of waste plastic material
JP2002226626A (en) * 2000-11-30 2002-08-14 Research Institute Of Innovative Technology For The Earth Treating method and apparatus of plastic
US20060281956A1 (en) * 2003-04-24 2006-12-14 Bochaver Kirill Z Method for recycling rubber-containing wastes
JP2007291281A (en) * 2006-04-27 2007-11-08 Jfe Chemical Corp Treatment method for plastic
JP2009221273A (en) * 2008-03-14 2009-10-01 National Institute Of Advanced Industrial & Technology Method for solubilization treatment of thermosetting resin, and solvent to be used in the treatment
JP2010174150A (en) * 2009-01-30 2010-08-12 National Institute Of Advanced Industrial Science & Technology Solubilizing solvent for resin comprising biomass-derived tar
JP2011057773A (en) * 2009-09-08 2011-03-24 Olympus Corp Method for liquefying resin

Also Published As

Publication number Publication date
JP5867849B2 (en) 2016-02-24

Similar Documents

Publication Publication Date Title
Gu et al. Flame-retardant, thermal, mechanical and dielectric properties of structural non-halogenated epoxy resin composites
JP6481494B2 (en) Inorganic filler-containing cured epoxy resin and laminate using the same
BR112013029221A2 (en) curable epoxy resin formulation composition, process for preparing a curable epoxy resin formulation composition, process for preparing an epoxy insulating material and product
Zhu et al. A novel approach to separation of waste printed circuit boards using dimethyl sulfoxide
BR112012025394A2 (en) process to produce electrical circuits on a given surface
JP5867849B2 (en) Resin treatment method
US10351660B2 (en) Phenolic resin composition, epoxy resin composition, and cured epoxy resin
KR102230098B1 (en) Epoxy resin composition and cured product thereof
WO2015137294A1 (en) Phenolic resin, phenolic resin mixture, epoxy resin, epoxy resin composition, and cured products thereof
JP6550843B2 (en) Epoxy resin, epoxy resin composition, cured product, and laminate for electric / electronic circuit
JP2002265562A (en) Phosphorus-containing epoxy resin and flame-retardant resin composition
US20140378622A1 (en) Phosphorus-containing phenolic resin, method for manufacturing the same, and use of the same
KR102542809B1 (en) Substituted allyl ether resins, methallyl ether resins, epoxy resins, epoxy resin compositions, and cured products thereof
JP2014189489A (en) Cyclic phosphazene compound and method for producing the same
KR102168012B1 (en) Distilled epoxy novolac resins
JP2003183356A (en) Epoxy resin composition
Ding et al. Synthesis and properties of fluorinated biphenyl‐type epoxy resin
JP4969931B2 (en) Epoxy resin, production method thereof and use thereof
JP6483588B2 (en) Isocyanurate compound, resin composition and use thereof
KR102221687B1 (en) Epoxy resin composite, printed circuit board and light emitting element module comprising isolation layer using the same
KR102272848B1 (en) Distilled epoxy novolac resins
KR20150125330A (en) Epoxy resin composite and printed curcuit board comprising insulating layer using the same
JP2013010665A (en) Heat-resistant aluminum hydroxide particle, method for producing the same, resin composition, prepreg, and laminated plate
Lusi et al. Plasma electrolysis of cellulose in polar aprotic solvents for production of levoglucosenone [Erratum: Dec. 14, 2020, v. 22 (24), p. 8745]
JP2016094334A (en) Heat resistant aluminum hydroxide particle and manufacturing method therefor, resin composition, prepreg and laminate

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20131205

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20131212

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20131219

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20131226

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20140109

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20140903

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140905

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141016

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150608

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150630

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151106

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151201

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151225

R150 Certificate of patent or registration of utility model

Ref document number: 5867849

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees