JP2013038483A - Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device - Google Patents

Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device Download PDF

Info

Publication number
JP2013038483A
JP2013038483A JP2011170753A JP2011170753A JP2013038483A JP 2013038483 A JP2013038483 A JP 2013038483A JP 2011170753 A JP2011170753 A JP 2011170753A JP 2011170753 A JP2011170753 A JP 2011170753A JP 2013038483 A JP2013038483 A JP 2013038483A
Authority
JP
Japan
Prior art keywords
fork type
vibrating piece
tuning
tuning fork
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011170753A
Other languages
Japanese (ja)
Inventor
Sachiyuki Yamada
祥之 山田
Hideo Tanaya
英雄 棚谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2011170753A priority Critical patent/JP2013038483A/en
Publication of JP2013038483A publication Critical patent/JP2013038483A/en
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To simply and highly accurately manufacture a tuning-fork type vibration piece in which joint portions of supporting arms have thicknesses greater than those of vibrating arms.SOLUTION: A manufacturing method of a tuning-fork type vibration piece 1 comprising vibrating arms 7 that extend from a base portion and have grooves 9 along extension directions thereof and supporting arms 8 disposed along the vibrating arms 7 and coupled to the base portion includes the steps of: forming a thin-wall portion that has the same thickness as those of the vibrating arms 7 in practical use by etching one surface of a wafer and forming a recess thereon such that the thin-wall portion includes at least margin portions outside portions corresponding to contours of the vibrating arms 7; transferring a contour pattern of the tuning-fork type vibration piece 1 to corrosion resistant films of both surfaces of the wafer; etching exposed wafer surfaces and processing contours of the tuning-fork type vibration piece 1; transferring an opening pattern of the grooves 9 to the same corrosion resistant films; and etching the wafer by using the corrosion resistant films and forming the grooves 9 on the vibrating arms 7. Joint portions 11 that have thicknesses greater than those of the vibrating arms 7 are defined by stepped portions 12 between the one surface of the wafer and the thin-wall portion on the supporting arms 8.

Description

本発明は、音叉型振動片の製造方法及びその方法により製造された音叉型振動片に関する。更に本発明は、音叉型振動片をパッケージに搭載した振動子や発振器等の様々な電子デバイスに関する。   The present invention relates to a method for manufacturing a tuning fork type vibrating piece and a tuning fork type vibrating piece manufactured by the method. Furthermore, the present invention relates to various electronic devices such as a vibrator and an oscillator in which a tuning fork type resonator element is mounted in a package.

従来より、携帯電話等の通信機器、パーソナルコンピュータ等の情報機器、その他の様々な電子機器には、音叉型振動片を搭載した振動子、発振器等の電子デバイスが広く使用されている。これら電子デバイスは、最近の電子機器の急激な小型化に伴い、より一層の小型化、低背化が要求されている。   2. Description of the Related Art Conventionally, electronic devices such as vibrators and oscillators equipped with a tuning fork type resonator element have been widely used in communication devices such as mobile phones, information devices such as personal computers, and other various electronic devices. These electronic devices are required to be further reduced in size and height with the recent rapid downsizing of electronic equipment.

従来の音叉型振動片は、基部から延長する１対の振動腕を有し、該基部においてパッケージ側に片持ちで固定支持されている。そのため、音叉型振動片に大きな衝撃や振動が作用すると、振動腕の先端が撓んでパッケージ内面に接触して破損したり、発振停止や周波数変動等の問題を生じる虞がある。特に音叉型振動片が小型化すると、一定の高さに安定して固定支持することが困難で、小型化、低背化を十分に対応することができない。そこで、基部を振動腕よりも厚く形成しかつ振動腕よりも厚くした側の面でパッケージ側に固定することによって、振動腕とパッケージ内面との間に一定の隙間を確保し、小型化に対応した構造が広く知られている（例えば、特許文献１〜３を参照）。   A conventional tuning fork type vibrating piece has a pair of vibrating arms extending from a base portion, and is fixedly supported by the base side in a cantilever manner on the package side. For this reason, when a large impact or vibration is applied to the tuning fork type vibrating piece, the tip of the vibrating arm may be bent and contact the inner surface of the package to be damaged, or problems such as oscillation stoppage or frequency fluctuation may occur. In particular, when the tuning fork type resonator element is downsized, it is difficult to stably fix and support the tuning fork type resonator element, and it is not possible to sufficiently cope with downsizing and low profile. Therefore, by forming the base part thicker than the vibrating arm and fixing it to the package side with the side thicker than the vibrating arm, a certain gap is secured between the vibrating arm and the inner surface of the package, and it is compatible with miniaturization. Such a structure is widely known (see, for example, Patent Documents 1 to 3).

また、音叉型圧電振動片を基部で接着固定するのではなく、基部から振動腕と平行に延出する支持腕を枠状に設け、かつ該支持腕で固定支持する構造のものが知られている（例えば、特許文献４、５を参照）。この音叉型圧電振動片は、長手方向に基部の寸法を短くして小型化を図り、かつ振動腕から支持腕の固定位置までの距離を長くして、振動漏れを抑制することができる。   Also known is a structure in which a tuning fork-type piezoelectric vibrating piece is not bonded and fixed at the base, but a support arm extending in parallel with the vibrating arm from the base is provided in a frame shape and fixed and supported by the support arm. (For example, see Patent Documents 4 and 5). This tuning fork type piezoelectric vibrating piece can be reduced in size by shortening the dimension of the base in the longitudinal direction, and can increase the distance from the vibrating arm to the fixing position of the support arm to suppress vibration leakage.

このような支持腕によりパッケージ側に固定支持する音叉型圧電振動片においても、支持腕の厚さを振動腕よりも厚く形成した構造が提案されている（例えば、特許文献５を参照）。この振動片は、振動腕よりも厚い支持腕先端のパーム部をパッケージ内に直接接合することにより、振動腕がパッケージ内面に接触することを防止すると共に、圧電デバイスの低背化を図っている。   Also in the tuning fork type piezoelectric vibrating piece fixedly supported on the package side by such a supporting arm, a structure in which the thickness of the supporting arm is formed thicker than that of the vibrating arm has been proposed (for example, see Patent Document 5). This vibrating piece prevents the vibrating arm from coming into contact with the inner surface of the package by directly joining the palm portion at the tip of the supporting arm thicker than the vibrating arm into the package, and lowers the height of the piezoelectric device. .

一般に音叉型振動片は、フォトリソグラフィ技術を利用して水晶その他の圧電材料のウエハをウエットエッチングすることによって所望の外形形状及び振動腕の溝部を加工し、かつその表面に成膜した電極膜をパターニングすることによって、所望の電極や配線パターンを形成している。例えば、特許文献３記載の音叉型圧電振動片は、水晶ウエハ全体に金属膜及びその上にレジスト膜を形成し、振動片の外形パターンを転写しかつウエットエッチングして振動片の外形を加工し、残存する金属膜及びレジスト膜を除去した後に、水晶ウエハ全体に新たな金属膜及びレジスト膜を形成し、厚さの薄い振動腕のパターンを転写しかつ振動腕を所望の厚さにハーフエッチングし、再び残存する金属膜及びレジスト膜を除去した後に、同様に水晶ウエハ全体に新たに形成した金属膜及びレジスト膜をパターニングし、振動腕の溝部を所望の深さにハーフエッチングして加工する。   Generally, a tuning fork type vibrating piece is formed by processing a desired outer shape and a groove portion of a vibrating arm by wet etching a crystal or other piezoelectric material wafer using a photolithographic technique, and forming an electrode film formed on the surface thereof. By patterning, desired electrodes and wiring patterns are formed. For example, in the tuning fork type piezoelectric vibrating piece described in Patent Document 3, a metal film and a resist film are formed on the entire quartz wafer, and an outer pattern of the vibrating piece is transferred and wet etched to process the outer shape of the vibrating piece. After removing the remaining metal film and resist film, a new metal film and resist film are formed on the entire crystal wafer, the pattern of the thin vibrating arm is transferred, and the vibrating arm is half-etched to the desired thickness. Then, after the remaining metal film and resist film are removed again, similarly, the newly formed metal film and resist film are patterned on the entire quartz wafer, and the groove portion of the vibrating arm is half-etched to a desired depth and processed. .

特開２００３−３４７８８５号公報Japanese Patent Laid-Open No. 2003-347885 特開２０１０−２２６４２０号公報JP 2010-226420 A 特開２００８−１３６０９５号公報JP 2008-136095 A 特開２００６−１４８８５７号公報JP 2006-148857 A 特開２００８−３０１０２２号公報JP 2008-301022 A 特開２００９−１６９８８号公報JP 2009-16988 A

しかしながら、上述した音叉型圧電振動片の製造方法は、振動片の外形加工、振動腕の薄肉化、及び振動腕の溝部加工を行う毎に、金属膜及びレジスト膜を形成しかつパターニングして水晶ウエハをウエットエッチングする工程を繰り返す。そのため、工数が多くかつ複雑で、多くの労力及び時間を要するので生産性の向上が図れない。しかも、１つの加工工程を終了する度に金属膜及びレジスト膜を全部剥離するので、次の加工工程で異なるフォトマスクを使用する際にアライメントずれの問題を生じ易い。特に、最初に加工した振動片の外形と、薄肉化する振動腕及びその溝部との間にアライメントずれが生じると、振動片の性能、周波数特性に大きな影響を及ぼす虞がある。   However, the above-described method of manufacturing a tuning-fork type piezoelectric vibrating piece involves forming and patterning a metal film and a resist film each time the outer shape of the vibrating piece, the thinning of the vibrating arm, and the groove processing of the vibrating arm are performed. The process of wet etching the wafer is repeated. For this reason, the man-hours are large and complicated, and a lot of labor and time are required. Therefore, the productivity cannot be improved. In addition, since the metal film and the resist film are all removed every time one processing step is completed, a problem of misalignment tends to occur when a different photomask is used in the next processing step. In particular, if misalignment occurs between the outer shape of the vibrating piece processed first, the vibrating arm and its groove portion to be thinned, the performance and frequency characteristics of the vibrating piece may be greatly affected.

そこで本発明は、上述した従来の問題点に鑑みてなされたものであり、その目的は、衝撃や振動に対して高い信頼性、安定性を発揮し得るように振動腕とパッケージ等の実装面との間に所定の隙間を確保しつつ、安定して一定の高さに支持し得ると共に、小型化、低背化の要請に対応するために、支持腕の接合部分の厚さを振動腕よりも厚くした音叉型振動片を、従来よりも簡単にかつ高精度に加工し得る製造方法を提供することにある。   Therefore, the present invention has been made in view of the above-described conventional problems, and its purpose is to mount a vibrating arm, a package, and the like so as to exhibit high reliability and stability against impact and vibration. In order to support a stable and constant height while securing a predetermined gap between the support arm and the vibration arm, the thickness of the joint portion of the support arm can be adjusted to meet the demands for downsizing and low profile. An object of the present invention is to provide a manufacturing method capable of processing a tuning-fork type vibrating piece having a larger thickness more easily and with higher accuracy than before.

本発明の別の目的は、そのように振動腕と実装面との間に所定の隙間を確保しつつ、安定して一定の高さに支持することができ、かつ小型化、低背化の要請に対応し得る音叉型振動片、該振動片を搭載した振動子及びその他の電子デバイスを提供することにある。   Another object of the present invention is that it can be stably supported at a constant height while ensuring a predetermined gap between the vibrating arm and the mounting surface, and can be reduced in size and height. The object is to provide a tuning-fork type vibration piece that can meet the demand, a vibrator on which the vibration piece is mounted, and other electronic devices.

本発明の音叉型振動片の製造方法は、上記目的を達成するためになされたもので、
基部と、基部から延出する対の振動腕と、振動腕に沿って配置されかつ基部に結合された支持部とを備え、支持部が振動腕の厚さよりも厚い接合部分を有する音叉型振動片を製造するために、
ウエハの一方の面に凹所をエッチングして、振動腕と実用上同じ厚さの薄肉部分を形成する過程と、
ウエハの両面に耐蝕膜を形成し、薄肉部分に少なくとも音叉型振動片の振動腕が含まれるように音叉型振動片の外形パターンを耐蝕膜に転写する過程と、
この耐蝕膜を用いてウエハをエッチングすることによって、薄肉部分と一方の面との段差により支持部の接合部分が形成されるように音叉型振動片の外形を加工する過程とを含むことを特徴とする。 The method for manufacturing a tuning-fork type resonator element according to the present invention was made to achieve the above object,
A tuning fork type vibration having a base, a pair of vibrating arms extending from the base, and a support portion disposed along the vibrating arm and coupled to the base, the support portion having a joint portion thicker than the thickness of the vibrating arm To manufacture the pieces,
Etching a recess on one side of the wafer to form a thin part of the same thickness as the vibrating arm,
A process of forming a corrosion-resistant film on both surfaces of the wafer and transferring the outer pattern of the tuning-fork type vibrating piece to the corrosion-resistant film so that at least the vibrating arm of the tuning-fork type vibrating piece is included in the thin portion;
Etching the wafer using the corrosion-resistant film, and processing the outer shape of the tuning-fork type vibration piece so that the joint portion of the support portion is formed by the step between the thin portion and one surface. And

このように支持部の接合部分を振動腕の厚さよりも厚く形成するために、ウエハの一方の面をエッチングして薄肉部分を形成した後に音叉型振動片の外形を加工するので、従来のように音叉型振動片の外形加工後に支持部の接合部分以外の部分をエッチングして薄肉化する場合よりも、簡単にかつ高精度に加工を行うことができる。   Thus, in order to form the joint portion of the support portion thicker than the thickness of the vibrating arm, the outer shape of the tuning fork type vibrating piece is processed after forming one thin portion by etching one surface of the wafer. In addition, it is possible to perform processing more easily and with higher accuracy than when the tuning fork type vibrating piece is processed to be thin after etching the portions other than the joint portion of the support portion.

このように製造した音叉型振動片は、支持部の接合部分をウエハの段差が設けられている側の面でパッケージ等の実装面のマウント電極に直接接着することによって、従来のような電極パッドをマウント電極上に設けることなく、振動腕と実装面との間に所定の隙間を画定しつつ、概ね一定の高さ位置に安定して支持することができる。従って、使用時に振動腕の先端が実装面に接触又は衝突して破損したり、発振が阻害されたり、周波数が変動する等の問題を生じる虞が解消され、優れた耐衝撃性、高い安定性及び信頼性が確保されると共に、音叉型振動片を搭載した振動子、発振器等の電子デバイスを小型化、低背化することができる。   The tuning fork type resonator element manufactured in this way is obtained by directly bonding the joint portion of the support portion to the mount electrode on the mounting surface of the package or the like on the surface on the side where the step of the wafer is provided. Without being provided on the mount electrode, a predetermined gap can be defined between the vibrating arm and the mounting surface, and can be stably supported at a substantially constant height position. This eliminates the possibility of problems such as breakage of the tip of the vibrating arm that contacts or collides with the mounting surface, obstruction of oscillation, or fluctuation in frequency during use, and excellent impact resistance and high stability. In addition, reliability and reliability can be ensured, and electronic devices such as vibrators and oscillators equipped with tuning fork type resonator elements can be reduced in size and height.

或る実施例では、音叉型振動片が振動腕の表面にその延長方向に沿って溝部を有し、音叉型振動片の外形加工過程の後に、音叉型振動片の外形パターンを転写した耐蝕膜に溝部の開口パターンを転写し、該耐蝕膜を用いてウエハをエッチングすることによって、振動腕の溝部を形成する過程を更に含むことができる。これにより、同じ耐蝕膜を用いてウエハに音叉型振動片の外形と振動腕の溝部とを加工することができ、工数を減らして生産性の向上を図ることができる。   In one embodiment, the tuning fork type vibrating piece has a groove on the surface of the vibrating arm along its extending direction, and the outer pattern of the tuning fork type vibrating piece is transferred to the corrosion resistant film after transferring the outer shape pattern of the tuning fork type vibrating piece. The method may further include forming a groove portion of the vibrating arm by transferring the opening pattern of the groove portion and etching the wafer using the corrosion-resistant film. Accordingly, the outer shape of the tuning fork type vibrating piece and the groove portion of the vibrating arm can be processed on the wafer using the same corrosion-resistant film, and man-hours can be reduced and productivity can be improved.

更にこの場合には、音叉型振動片の外形を加工する過程の前に、音叉型振動片の外形パターンを転写した耐蝕膜及びウエハの上にフォトレジスト膜を形成し、フォトレジスト膜に音叉型振動片の外形パターン及び溝部の開口パターンを形成する過程を更に含み、音叉型振動片の外形を加工する過程の後に、フォトレジスト膜を用いて耐蝕膜に溝部の開口パターンを転写することができる。これにより、ウエハに音叉型振動片の外形と溝部とを高精度に位置合わせして加工することができる。   Further, in this case, before the process of processing the outer shape of the tuning fork type vibrating piece, a photoresist film is formed on the corrosion-resistant film and wafer on which the outer shape pattern of the tuning fork type vibrating piece is transferred, and the tuning fork type is formed on the photoresist film. The method further includes a step of forming an outer pattern of the vibrating piece and an opening pattern of the groove, and after the step of processing the outer shape of the tuning fork type vibrating piece, the opening pattern of the groove can be transferred to the corrosion-resistant film using a photoresist film. . As a result, the outer shape and the groove of the tuning fork type vibrating piece can be aligned and processed on the wafer with high accuracy.

また、或る実施例では、少なくとも振動腕の外形に対応する部分の外側に余白部分を含むように、薄肉部分を形成することができる。これによって、ウエハの薄肉部分を画定する凹所内に耐蝕膜及び該耐蝕膜をパターニングするためのフォトレジスト膜を、少なくとも振動腕を含む振動片の外形形状より外側の領域まで平坦に一様な厚さで形成し、高精度にパターニングすることができる。しかも、次の外形加工工程において、フォトマスクを薄肉部分に高精度に位置合わせする必要が無い。従って、少なくとも振動腕を含む振動片の外形を簡単に高精度に加工することができる。   In some embodiments, the thin portion can be formed so as to include a blank portion at least outside the portion corresponding to the outer shape of the vibrating arm. As a result, the corrosion-resistant film and the photoresist film for patterning the corrosion-resistant film in the recess that defines the thin portion of the wafer are flatly and uniformly thickened to a region outside the outer shape of the vibrating piece including at least the vibrating arm. It can be formed and patterned with high accuracy. In addition, it is not necessary to align the photomask with a thin portion with high accuracy in the next outer shape processing step. Therefore, the outer shape of the vibrating piece including at least the vibrating arm can be easily processed with high accuracy.

本発明の音叉型振動片は、上述した本発明の方法により製造されることによって、支持部の接合部分を段差が設けられている側の面でパッケージ等の実装面のマウント電極に直接接着することによって、振動腕と実装面との間に所定の隙間を画定しつつ、概ね一定の高さ位置に安定して支持される。これにより、使用時に振動腕の先端の実装面との接触又は衝突による破損や、発振停止又は周波数変動等の問題を生じる虞を解消できると共に、振動子や発振器等の他の電子デバイスに搭載した場合に、小型化、低背化が可能で、耐衝撃性に優れた高い安定性、信頼性を実現することができる。   The tuning fork type resonator element of the present invention is manufactured by the above-described method of the present invention, whereby the joint portion of the support portion is directly bonded to the mount electrode on the mounting surface of the package or the like on the surface where the step is provided. As a result, a predetermined gap is defined between the vibrating arm and the mounting surface, and is stably supported at a substantially constant height position. This eliminates the possibility of problems such as damage due to contact or collision with the mounting surface at the tip of the vibrating arm, oscillation stop, or frequency fluctuation during use, and is mounted on other electronic devices such as vibrators and oscillators. In this case, it is possible to reduce the size and height, and to achieve high stability and reliability excellent in impact resistance.

また本発明の振動子は、上述した本発明の音叉型振動片と、該音叉型振動片を収容するためのパッケージとを備え、音叉型振動片が、その支持部の厚肉部分の段差が設けられている側の面においてパッケージ内部のマウント電極に直接固定して支持されていることを特徴とする。これにより、小型化、低背化が可能で、耐衝撃性に優れた高い安定性、信頼性の振動子が提供される。   The vibrator of the present invention includes the above-described tuning fork type vibrating piece of the present invention and a package for housing the tuning fork type vibrating piece. It is characterized in that the surface on the side provided is fixed and supported directly on the mount electrode inside the package. As a result, it is possible to reduce the size and height of the vibrator, and to provide a highly stable and reliable vibrator having excellent impact resistance.

更に本発明の電子デバイスは、上述した本発明の音叉型振動片と、該音叉型振動片を収容するためのパッケージとを備え、音叉型振動片が、その支持部の厚肉部分の段差が設けられている側の面においてパッケージ内部のマウント電極に直接固定して支持されていることを特徴とする。これにより、小型化、低背化が可能で、耐衝撃性に優れた高い安定性、信頼性の発振器、その他の様々な電子デバイスが提供される。   Furthermore, an electronic device of the present invention includes the above-described tuning fork type vibrating piece of the present invention and a package for accommodating the tuning fork type vibrating piece, and the tuning fork type vibrating piece has a step in a thick portion of the support portion. It is characterized in that the surface on the side provided is fixed and supported directly on the mount electrode inside the package. As a result, it is possible to reduce the size and height of the device, and to provide a highly stable and reliable oscillator excellent in impact resistance, and various other electronic devices.

（Ａ）図は本発明による音叉型振動片の実施例及びそれを搭載した圧電振動子の平面図、（Ｂ）図はそのＩ−Ｉ線における断面図。(A) is a plan view of an embodiment of a tuning-fork type resonator element according to the present invention and a piezoelectric vibrator on which it is mounted, and (B) is a cross-sectional view taken along the line II. 本発明による音叉型振動片の製造方法の実施例を工程順に示すフロー図。The flowchart which shows the Example of the manufacturing method of the tuning fork type vibration piece by this invention in process order. （Ａ）〜（Ｄ）図はステップＳ１の加工工程を示す断面図。(A)-(D) figure is sectional drawing which shows the process of step S1. 図３（Ｄ）に対応するウエハの平面図。FIG. 4 is a plan view of a wafer corresponding to FIG. （Ａ）〜（Ｄ）図はステップＳ２の加工工程を示す断面図。(A)-(D) figure is sectional drawing which shows the process of step S2. 図５（Ｄ）に対応するウエハの平面図。FIG. 6 is a plan view of a wafer corresponding to FIG. （Ａ）〜（Ｄ）図はステップＳ３の加工工程を示す断面図。(A)-(D) figure is sectional drawing which shows the process of step S3. （Ａ）〜（Ｅ）図はステップＳ４〜Ｓ７の加工工程を示す断面図。(A)-(E) figure is sectional drawing which shows the manufacturing process of step S4-S7. 図８（Ｃ）に対応するウエハの平面図。The top view of the wafer corresponding to FIG.8 (C).

以下に、添付図面を参照しつつ、本発明の好適な実施例を詳細に説明する。尚、添付図面において、同一又は類似の構成要素には同一又は類似の参照符号を付して示す。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are denoted by the same or similar reference numerals.

図１（Ａ）（Ｂ）は、本発明を適用した音叉型圧電振動片を搭載した圧電振動子の実施例を概略的に示している。本実施例の圧電振動子１は、音叉型圧電振動片２と、該圧電振動片を収容するためのパッケージ３とを備える。パッケージ３は、例えばセラミック材料からなる矩形箱型のベース４と、例えば透明なガラス薄板又は金属薄板で形成されるリッド５とから構成される。リッド５は、ベース４の上端に接合されて該ベースの内部を気密封止する。   1A and 1B schematically show an embodiment of a piezoelectric vibrator on which a tuning fork type piezoelectric vibrating piece to which the present invention is applied is mounted. The piezoelectric vibrator 1 according to the present embodiment includes a tuning fork type piezoelectric vibrating piece 2 and a package 3 for housing the piezoelectric vibrating piece. The package 3 includes a rectangular box base 4 made of, for example, a ceramic material, and a lid 5 made of, for example, a transparent glass thin plate or metal thin plate. The lid 5 is joined to the upper end of the base 4 to hermetically seal the inside of the base.

音叉型圧電振動片２は、例えば水晶等の圧電材料で一体に形成され、基部６と、１対の振動腕７と、１対の支持腕８とを有する。各振動腕７は、基部６の一方の端部から互いに平行に延出している。振動腕７の表裏主面には、それぞれその延長方向即ち長手方向に沿って溝部９が形成されている。溝部９は、圧電振動片２の小型化に伴う面外振動を抑制するために、タイバー１０と称する幅方向の仕切壁によって前記長手方向に２つの溝部分に分割されている。振動腕７には、図示していないが、溝部９の内面を含む表裏主面及び両側面に、該振動腕を屈曲振動させるためにそれぞれ励振電極が形成されている。   The tuning fork type piezoelectric vibrating piece 2 is integrally formed of a piezoelectric material such as quartz, and has a base 6, a pair of vibrating arms 7, and a pair of support arms 8. Each vibrating arm 7 extends in parallel with each other from one end of the base 6. Grooves 9 are formed on the front and back main surfaces of the vibrating arm 7 along the extending direction, that is, the longitudinal direction. The groove portion 9 is divided into two groove portions in the longitudinal direction by a partition wall in the width direction called a tie bar 10 in order to suppress out-of-plane vibration accompanying downsizing of the piezoelectric vibrating piece 2. Although not shown, the vibrating arm 7 is formed with excitation electrodes on the front and back main surfaces including the inner surface of the groove portion 9 and on both side surfaces in order to cause the vibrating arm to flexurally vibrate.

各支持腕８は、振動腕７の幅方向の両側に該振動腕に沿って配置され、基部６の他方の端部付近に結合されている。支持腕８は、前記基部との結合部分から圧電振動片２の長手方向の中央付近まで延長している。支持腕８の先端には、その厚さが振動腕７及び基部６よりも厚い接合部１１が設けられている。接合部１１は、支持腕８の一方の面に段差１２を設けることによって形成されている。更に接合部１１の表面には、前記励振電極から引き出した接続電極１３が設けられている。   Each support arm 8 is disposed along the vibrating arm on both sides in the width direction of the vibrating arm 7, and is coupled to the vicinity of the other end of the base portion 6. The support arm 8 extends from the coupling portion with the base portion to the vicinity of the center in the longitudinal direction of the piezoelectric vibrating piece 2. At the tip of the support arm 8, a joint portion 11 having a thickness greater than that of the vibrating arm 7 and the base portion 6 is provided. The joint portion 11 is formed by providing a step 12 on one surface of the support arm 8. Further, a connection electrode 13 drawn from the excitation electrode is provided on the surface of the joint portion 11.

別の実施例では、段差１２を設ける位置によって、支持腕８の全体を厚肉の接合部１１に形成したり、前記基部との結合部分との間に更に段差を設けて厚肉の接合部を追加することもできる。また、接合部１１は、少なくとも振動腕７の厚さよりも厚くなるように設ければ良く、基部２の一部を含むように形成することもできる。   In another embodiment, depending on the position where the step 12 is provided, the entire support arm 8 is formed in the thick joint 11, or a further step is provided between the joint with the base and the thick joint is formed. Can also be added. Moreover, the joining part 11 should just be provided so that it may become thicker than the thickness of the vibration arm 7, and can also be formed so that a part of base 2 may be included.

また、基部６の両側部には、前記振動腕からの振動漏れを抑制するために、支持腕８の結合部分と前記一方の端部との間に切欠き部１４が設けられている。更に振動腕７の先端には、金属膜を被着した錘部１５が設けられている。   Moreover, in order to suppress vibration leakage from the vibrating arm, notches 14 are provided between the coupling portion of the support arm 8 and the one end portion on both sides of the base portion 6. Furthermore, a weight portion 15 having a metal film attached thereto is provided at the tip of the vibrating arm 7.

図１（Ｂ）に示すように、パッケージ３のベース４には、その内部に画定される空所の底面にマウント電極１６が形成されている。マウント電極１６は、セラミック材料のベース４底面をメタライズすることによって形成することができる。圧電振動片２は、段差１２を設けた面を下向きにして即ちベース４底面に向けて、支持腕８の接合部１１をマウント電極１６に導電性接着剤で接着することにより直接固定支持されている。   As shown in FIG. 1B, the mount electrode 16 is formed on the base 4 of the package 3 on the bottom surface of the void defined therein. The mount electrode 16 can be formed by metallizing the bottom surface of the base 4 of the ceramic material. The piezoelectric vibrating reed 2 is directly fixed and supported by bonding the joint 11 of the support arm 8 to the mount electrode 16 with a conductive adhesive with the surface provided with the step 12 facing downward, that is, toward the bottom of the base 4. Yes.

本実施例によれば、このように圧電振動片２をパッケージ３に実装することによって、従来のような電極パッドをマウンド電極上に設けなくても、振動腕７とベース４底面との間に、接合部１１と前記振動腕との厚さの差以上の隙間が確保される。各支持腕８は、接合部１１をマウント電極１６に直接固定することによって、左右でばらつきを生じることなく安定して略同じ高さに支持される。これにより、使用時に振動腕７の先端がベース４底面に接触又は衝突してその励振を阻害したり、周波数を変動させたり、破損する等の問題が生じる虞を解消することができる。更に、ベース４底面のマウンド電極上に電極パッドを設けない分だけ、ベース４を即ちパッケージ３を低背化することができる。   According to the present embodiment, by mounting the piezoelectric vibrating reed 2 on the package 3 in this way, a conventional electrode pad is not provided on the mound electrode, but between the vibrating arm 7 and the base 4 bottom surface. A gap larger than the difference in thickness between the joint 11 and the vibrating arm is ensured. Each support arm 8 is stably supported at substantially the same height without causing variations in right and left by directly fixing the joint 11 to the mount electrode 16. As a result, it is possible to eliminate the possibility that the tip of the vibrating arm 7 contacts or collides with the bottom surface of the base 4 during use, thereby obstructing the excitation, changing the frequency, or damaging. Further, the height of the base 4, that is, the package 3 can be reduced by the amount not provided with the electrode pad on the mound electrode on the bottom surface of the base 4.

本実施例では、厚肉の接合部１１を画定するための段差１２が、ベース４底面にマウントする側の面にのみ設けられている。これによって、リッド５が透明なガラス薄板からなる場合は、パッケージ３内に封止した圧電振動片２の振動腕先端の錘部１５に向けて、リッド５の外側からレーザー光を照射して行う周波数の微調整を良好に行うことができる。しかしながら、別の実施例では、前記支持腕の段差１２を両面に設けることによって、厚肉の接合部１１を形成することもできる。   In this embodiment, the step 12 for defining the thick joint 11 is provided only on the surface mounted on the bottom surface of the base 4. Accordingly, when the lid 5 is made of a transparent glass thin plate, laser light is irradiated from the outside of the lid 5 toward the weight portion 15 at the tip of the vibrating arm of the piezoelectric vibrating piece 2 sealed in the package 3. Fine adjustment of the frequency can be performed satisfactorily. However, in another embodiment, the thick joint portion 11 can be formed by providing the support arm step 12 on both sides.

図１の音叉型圧電振動片２は、従来のフォトリソグラフィ技術を利用した本発明の方法によって製造することができる。図２は、本発明による音叉型振動片の製造方法の実施例を工程順に示すフロー図である。本実施例では、水晶ウエハを使用するが、他の圧電材料からなるウエハを使用することができる。   The tuning fork type piezoelectric vibrating piece 2 of FIG. 1 can be manufactured by the method of the present invention using a conventional photolithography technique. FIG. 2 is a flowchart showing an embodiment of a method for manufacturing a tuning-fork type vibrating piece according to the present invention in the order of steps. In this embodiment, a quartz wafer is used, but a wafer made of another piezoelectric material can be used.

最初に、水晶ウエハの一方の面に薄肉部分を形成する（ステップＳ１）。図３は、ステップ１の加工を具体的に、図１（Ａ）のＩ−Ｉ線と同じ断面位置で工程順に示している。先ず、水晶ウエハ２１の両面全面に耐蝕膜２２を形成し、かつその上にフォトレジスト膜２３をスピンコート等によりウエハ全面に形成する（図３（Ａ））。耐蝕膜２２は、水晶との密着性に優れたＣｒ、Ｎｉ、Ａｌ，Ｔｉ等の下地膜と、水晶用エッチング液に対する耐蝕性に優れたＡｕ膜とを、それぞれスパッタリング又は蒸着で積層した２層構造で構成される。   First, a thin portion is formed on one surface of the quartz wafer (step S1). FIG. 3 specifically shows the processing in step 1 in the order of steps at the same cross-sectional position as the II line in FIG. First, the anticorrosion film 22 is formed on the entire surface of the quartz wafer 21, and the photoresist film 23 is formed on the entire surface of the wafer by spin coating or the like (FIG. 3A). Corrosion-resistant film 22 is a two-layer structure in which a base film made of Cr, Ni, Al, Ti or the like excellent in adhesion to quartz and an Au film excellent in corrosion resistance against a crystal etching solution are laminated by sputtering or vapor deposition, respectively. Composed of structure.

水晶ウエハ２１の一方の面側に第１フォトマスク２４を配置し、該一方の面のフォトレジスト膜２３を露光してパターニングする（図３（Ｂ））。パターニングしたフォトレジスト層２３から露出した耐蝕膜２２をエッチングして、ウエハ２１の前記一方の面を露出させる（図３（Ｃ））。露出したウエハ表面をエッチングして所望の一定深さの凹所を加工することによって、所望の振動腕７の厚さと実用上同じ厚さの薄肉部分２５をウエハ２１に形成する（図３（Ｄ））。   A first photomask 24 is disposed on one surface side of the quartz wafer 21, and the photoresist film 23 on the one surface is exposed and patterned (FIG. 3B). The corrosion-resistant film 22 exposed from the patterned photoresist layer 23 is etched to expose the one surface of the wafer 21 (FIG. 3C). The exposed wafer surface is etched to form a recess having a desired constant depth, thereby forming a thin portion 25 having the same thickness as the desired vibrating arm 7 on the wafer 21 (FIG. 3D). )).

薄肉部分２５は、図４に平面視するように、圧電振動片２の外形形状に対応する部分２´から接合部１１に対応する部分１１´を除いた部分を全部含み、かつその外側に拡大した余白部分を含むように加工する。別の実施例では、少なくとも圧電振動片２の振動腕７に対応する部分の外側に拡大した余白部分を含むように、薄肉部分２５を加工することができる。   As shown in a plan view in FIG. 4, the thin-walled portion 25 includes all portions excluding the portion 2 ′ corresponding to the outer shape of the piezoelectric vibrating reed 2 except the portion 11 ′ corresponding to the joint portion 11, and is expanded outside thereof. Process to include the margins. In another embodiment, the thin-walled portion 25 can be processed so as to include a blank portion that is expanded outside the portion corresponding to the vibrating arm 7 of the piezoelectric vibrating piece 2.

次に、水晶ウエハ２１の両面に耐蝕膜を形成して圧電振動片２の外形パターンを転写する（ステップＳ２）。図５は、ステップ２の加工を具体的に、図３に連続して同じ断面位置で工程順に示している。先ず、水晶ウエハ２１の両面から残存するフォトレジスト膜２３及び耐蝕膜２２を除去し（図５（Ａ））、薄肉部分２５を含む水晶ウエハ２１の両面全面に新たな耐蝕膜２６及びその上にフォトレジスト膜２７を形成する（図５（Ｂ））。薄肉部分２５の耐蝕膜２６及びフォトレジスト膜２７は、圧電振動片２の外形形状より外側の領域まで平坦に一様な厚さで形成される。   Next, an anti-corrosion film is formed on both surfaces of the quartz wafer 21, and the external pattern of the piezoelectric vibrating piece 2 is transferred (step S2). FIG. 5 specifically shows the processing of step 2 in the order of steps at the same cross-sectional position continuously from FIG. First, the remaining photoresist film 23 and corrosion-resistant film 22 are removed from both surfaces of the quartz wafer 21 (FIG. 5A), and a new corrosion-resistant film 26 and a new corrosion-resistant film 26 are formed on both surfaces of the quartz wafer 21 including the thin portion 25. A photoresist film 27 is formed (FIG. 5B). The corrosion resistant film 26 and the photoresist film 27 in the thin portion 25 are formed in a flat and uniform thickness up to a region outside the outer shape of the piezoelectric vibrating piece 2.

圧電振動片２の外形形状に対応するマスクパターンを有する第２フォトマスク２８を水晶ウエハ２１の両面側にそれぞれ配置し、両面のフォトレジスト膜２７を同時に露光してパターニングする（図５（Ｃ））。第２フォトマスク２８は、薄肉部分２５に圧電振動片２の外形形状に対して余白部分が設けられているので、該薄肉部分に高精度に位置合わせする必要が無い。   A second photomask 28 having a mask pattern corresponding to the outer shape of the piezoelectric vibrating piece 2 is disposed on both sides of the quartz wafer 21, and the photoresist films 27 on both sides are simultaneously exposed and patterned (FIG. 5C). ). Since the second photomask 28 is provided with a blank portion in the thin portion 25 with respect to the outer shape of the piezoelectric vibrating piece 2, it is not necessary to align the thin portion with high accuracy.

露出した耐蝕膜２６をエッチングして圧電振動片２の外形形状を転写し、ウエハ２１の両面を露出させる（図５（Ｄ））。このとき、水晶ウエハ２１の薄肉部分２５を形成した前記一方の面側は、露光光を薄肉部分２５の深さに焦点を合わせて照射する。これにより、薄肉部分２５の耐蝕膜２６に圧電振動片２の外形形状を高精度に転写することができる。また、第２フォトマスク２８を通して露光する際に、フォトレジスト膜２７にアライメントマークをパターニングし、耐蝕膜２６にアライメントマークを形成する。   The exposed corrosion-resistant film 26 is etched to transfer the outer shape of the piezoelectric vibrating reed 2 to expose both surfaces of the wafer 21 (FIG. 5D). At this time, the one surface side where the thin portion 25 of the quartz wafer 21 is formed irradiates the exposure light with a focus on the depth of the thin portion 25. Thereby, the outer shape of the piezoelectric vibrating piece 2 can be transferred to the corrosion resistant film 26 of the thin portion 25 with high accuracy. Further, when exposure is performed through the second photomask 28, an alignment mark is patterned on the photoresist film 27, and an alignment mark is formed on the corrosion resistant film 26.

他方、耐蝕膜２６の接合部１１に対応する部分１１´は、圧電振動片２の外形形状に対応する他の部分よりも、露光光の焦点位置が薄肉部分２５の深さ分だけずれるので、それだけパターン転写精度が低下する。しかしながら、振動腕７の接合部１１は、その加工及び平面寸法精度が圧電振動片２の共振周波数及び周波数特性に影響することはないので、パターン転写精度が低くても、何ら問題を生じない。   On the other hand, in the portion 11 ′ corresponding to the joint portion 11 of the corrosion resistant film 26, the focal position of the exposure light is shifted by the depth of the thin portion 25 than the other portions corresponding to the outer shape of the piezoelectric vibrating piece 2. The pattern transfer accuracy decreases accordingly. However, since the processing and planar dimensional accuracy of the joint 11 of the vibrating arm 7 do not affect the resonance frequency and frequency characteristics of the piezoelectric vibrating reed 2, no problem occurs even if the pattern transfer accuracy is low.

次に、水晶ウエハ２１の両面にフォトレジスト膜を形成して圧電振動片２の外形パターン及び溝部９の開口パターンを形成する（ステップＳ３）。図７は、ステップＳ３の加工を具体的に、図５に連続して同じ断面位置で工程順に示している。先ず、水晶ウエハ２１の両面から残存するフォトレジスト膜２７を除去し（図７（Ａ））、耐蝕膜２６を残したまま、水晶ウエハ２１の両面全面に新たなフォトレジスト膜２９を形成する（図７（Ｂ））。   Next, a photoresist film is formed on both surfaces of the quartz wafer 21 to form an outer pattern of the piezoelectric vibrating piece 2 and an opening pattern of the groove 9 (step S3). FIG. 7 specifically shows the processing in step S3 in the order of steps at the same cross-sectional position continuously from FIG. First, the remaining photoresist film 27 is removed from both surfaces of the quartz wafer 21 (FIG. 7A), and a new photoresist film 29 is formed on both surfaces of the quartz wafer 21 while leaving the corrosion resistant film 26 (FIG. 7A). FIG. 7 (B)).

圧電振動片２の外形形状及び溝部９の開口形状に対応するマスクパターンを有する第３フォトマスク３０を水晶ウエハ２１の両面側にそれぞれ配置し、両面のフォトレジスト膜２９を同時に露光してパターニングする（図７（Ｃ））。第３フォトマスク３０は、ステップ２において耐蝕膜２６に形成した前記アライメントマークを用いて位置合わせする。従って、フォトレジスト膜２９には、圧電振動片２の外形パターンが、先にパターニングした耐蝕膜２６に合わせて正確に形成される。更に、圧電振動片２の振動腕７に対応する部分に形成された耐蝕膜２６上のフォトレジスト膜２９には、同様に溝部９の開口パターンが前記振動腕の外形パターンに合わせて正確に形成される（図７（Ｄ））。   A third photomask 30 having a mask pattern corresponding to the outer shape of the piezoelectric vibrating piece 2 and the opening shape of the groove 9 is arranged on both sides of the quartz wafer 21, and the photoresist films 29 on both sides are simultaneously exposed and patterned. (FIG. 7C). The third photomask 30 is aligned using the alignment mark formed on the corrosion-resistant film 26 in step 2. Accordingly, the outer shape pattern of the piezoelectric vibrating reed 2 is accurately formed on the photoresist film 29 according to the corrosion-resistant film 26 previously patterned. Further, in the photoresist film 29 on the corrosion-resistant film 26 formed in the portion corresponding to the vibrating arm 7 of the piezoelectric vibrating piece 2, similarly, the opening pattern of the groove 9 is accurately formed in accordance with the outer pattern of the vibrating arm. (FIG. 7D).

次にステップＳ４において、フォトレジスト膜２９から露出する水晶ウエハ２１表面をエッチングして、圧電振動片２の外形を加工する（図８（Ａ））。外形加工した振動腕７上のフォトレジスト膜２９から露出する耐蝕膜２６をエッチングして、溝部９の開口パターンを転写する（ステップＳ５）。次にステップＳ６において、振動腕７の表裏両側の水晶露出面をハーフエッチングして、溝部９を所定の深さに加工する（図８（Ｂ））。水晶ウエハ２１表面に残存するフォトレジスト膜２９及び耐蝕膜２６を完全に除去すると、図９及び図８（Ｃ）に示すように、所望の圧電振動片２の外形及び溝部９の形状を有する振動素子片が水晶ウエハ２１に加工される。   Next, in step S4, the surface of the quartz wafer 21 exposed from the photoresist film 29 is etched to process the outer shape of the piezoelectric vibrating piece 2 (FIG. 8A). The corrosion-resistant film 26 exposed from the photoresist film 29 on the vibration arm 7 whose outer shape has been processed is etched to transfer the opening pattern of the groove 9 (step S5). Next, in step S6, the crystal exposed surfaces on both the front and back sides of the vibrating arm 7 are half-etched to process the groove 9 to a predetermined depth (FIG. 8B). When the photoresist film 29 and the corrosion-resistant film 26 remaining on the surface of the quartz wafer 21 are completely removed, as shown in FIGS. 9 and 8C, the vibration having the desired outer shape of the piezoelectric vibrating piece 2 and the shape of the groove 9 is obtained. The element piece is processed into the quartz wafer 21.

更にステップＳ７において、従来の加工方法に従って、前記振動素子片の表面に電極膜をパターニングする。即ち、前記振動素子片の表面全面に電極膜３１をスパッタリング又は蒸着等によって成膜する（図８（Ｄ））。この電極膜３１をフォトエッチングすることによって、前記励振電極、接続電極及び配線等を所望のパターンに形成する。最後に、水晶ウエハ２１との連結部３２を切断して個片化することによって、音叉型圧電振動片２が完成する。   In step S7, an electrode film is patterned on the surface of the vibrating element piece according to a conventional processing method. That is, the electrode film 31 is formed on the entire surface of the vibration element piece by sputtering or vapor deposition (FIG. 8D). The electrode film 31 is photoetched to form the excitation electrode, connection electrode, wiring, and the like in a desired pattern. Finally, the tuning fork-type piezoelectric vibrating piece 2 is completed by cutting the connecting portion 32 with the crystal wafer 21 into pieces.

本発明は、上記実施例に限定されるものでなく、その技術的範囲内で様々な変形又は変更を加えて実施することができる。例えば、本発明の音叉型振動片及びその製造方法は、被加工材料としてウエットエッチング可能である限り、水晶以外の圧電材料、ガラス等の絶縁性材料、単結晶シリコン等の半導体材料等、ウエットエッチングに対して等方性を示すものも含めて、各種電子部品に使用されている様々な材料を使用することができる。また、被加工材料は基板以外の様々な形態であってもよい。更に上記実施例では、水晶ウエハ表面の耐蝕膜を２層構造の金属膜で形成したが、圧電基板に対する密着性と耐エッチング性とを有する金属材料であれば、単層の金属膜で形成することもできる。更に本発明の音叉型振動片は、振動子以外の発振器等の様々な電子デバイスにも搭載して使用することができる。   The present invention is not limited to the above embodiments, and can be implemented with various modifications or changes within the technical scope thereof. For example, the tuning-fork type resonator element and the manufacturing method thereof according to the present invention are wet-etched as a material to be processed as long as wet-etching is possible. Various materials used for various electronic components can be used, including those that are isotropic. Further, the material to be processed may be in various forms other than the substrate. Further, in the above embodiment, the corrosion-resistant film on the surface of the quartz wafer is formed by a metal film having a two-layer structure. However, if the metal material has adhesion to the piezoelectric substrate and etching resistance, it is formed by a single-layer metal film. You can also. Furthermore, the tuning fork type resonator element of the present invention can be used by being mounted on various electronic devices such as an oscillator other than the vibrator.

１…圧電振動子、２…音叉型圧電振動片、３…パッケージ、４…ベース、５…リッド、６…基部、７…振動腕、８…支持腕、９…溝部、１０…タイバー、１１…接合部、１２…段差、１３…接続電極、１４…切欠き部、１５…錘部、１６…マウント電極、２１…水晶ウエハ、２２，２６…耐蝕膜、２３，２７，２９…フォトレジスト膜、２４…第１フォトマスク、２５…薄肉部分、２８…第２フォトマスク、３０…第３フォトマスク、３１…電極膜、３２…連結部。 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator, 2 ... Tuning fork type piezoelectric vibrating piece, 3 ... Package, 4 ... Base, 5 ... Lid, 6 ... Base part, 7 ... Vibration arm, 8 ... Support arm, 9 ... Groove part, 10 ... Tie bar, 11 ... Joining part, 12 ... step, 13 ... connection electrode, 14 ... notch part, 15 ... weight part, 16 ... mount electrode, 21 ... crystal wafer, 22,26 ... corrosion-resistant film, 23,27,29 ... photoresist film, 24 ... 1st photomask, 25 ... Thin part, 28 ... 2nd photomask, 30 ... 3rd photomask, 31 ... Electrode film, 32 ... Connection part.

Claims (7)

基部と、前記基部から延出する１対の振動腕と、前記振動腕に沿って配置されかつ前記基部に結合された支持部とを備え、前記支持部が前記振動腕の厚さよりも厚い接合部分を有する音叉型振動片を製造するために、
ウエハの一方の面に凹所をエッチングして、前記振動腕と実用上同じ厚さの薄肉部分を形成する過程と、
前記ウエハの両面に耐蝕膜を形成し、前記薄肉部分に少なくとも前記音叉型振動片の前記振動腕が含まれるように前記音叉型振動片の外形パターンを前記耐蝕膜に転写する過程と、
前記耐蝕膜を用いて前記ウエハをエッチングすることによって、前記薄肉部分と前記一方の面との段差により前記支持部の前記接合部分が形成されるように前記音叉型振動片の外形を加工する過程とを含むことを特徴とする音叉型振動片の製造方法。 A base, a pair of resonating arms extending from the base, and a support disposed along the resonating arm and coupled to the base, wherein the support is thicker than the thickness of the resonating arm In order to manufacture a tuning fork type vibrating piece having a part,
Etching a recess on one side of the wafer to form a thin portion of the same thickness as the vibrating arm in practice,
Forming a corrosion-resistant film on both surfaces of the wafer, and transferring an outer pattern of the tuning-fork type vibrating piece to the corrosion-resistant film so that at least the vibrating arm of the tuning-fork type vibrating piece is included in the thin portion;
A process of processing the outer shape of the tuning fork type vibrating piece so that the joining portion of the support portion is formed by a step between the thin portion and the one surface by etching the wafer using the corrosion-resistant film. A method for manufacturing a tuning-fork type vibrating piece, comprising: 前記音叉型振動片が前記振動腕の表面にその延長方向に沿って溝部を有し、前記音叉型振動片の外形加工過程の後に、前記音叉型振動片の外形パターンを転写した前記耐蝕膜に前記溝部の開口パターンを転写し、該耐食膜を用いて前記ウエハをエッチングすることによって、前記振動腕の前記溝部を形成する過程を更に含むことを特徴とする請求項１記載の音叉型振動片の製造方法。   The tuning fork type vibration piece has a groove portion along the extending direction on the surface of the vibrating arm, and after the outer shape machining process of the tuning fork type vibration piece, the outer pattern of the tuning fork type vibration piece is transferred to the corrosion-resistant film. The tuning fork type vibrating piece according to claim 1, further comprising a step of forming the groove portion of the vibrating arm by transferring the opening pattern of the groove portion and etching the wafer using the corrosion-resistant film. Manufacturing method. 前記音叉型振動片の外形を加工する過程の前に、前記音叉型振動片の外形パターンを転写した前記耐蝕膜及び前記ウエハの上にフォトレジスト膜を形成し、前記フォトレジスト膜に前記音叉型振動片の外形パターン及び前記溝部の開口パターンを形成する過程を更に含み、前記音叉型振動片の外形を加工する過程の後に、前記フォトレジスト膜を用いて前記耐蝕膜に前記溝部の開口パターンを転写することを特徴とする請求項２記載の音叉型振動片の製造方法。   Before the process of processing the outer shape of the tuning fork type vibrating piece, a photoresist film is formed on the corrosion-resistant film and the wafer to which the outer shape pattern of the tuning fork type vibrating piece is transferred, and the tuning fork type is formed on the photoresist film. The method further includes a step of forming an outer shape pattern of the vibrating piece and an opening pattern of the groove portion. After the process of processing the outer shape of the tuning fork type vibrating piece, the opening pattern of the groove portion is formed in the corrosion-resistant film using the photoresist film. The method for producing a tuning-fork type vibrating piece according to claim 2, wherein transfer is performed. 少なくとも前記振動腕の外形に対応する部分の外側に余白部分を含むように、前記薄肉部分を形成することを特徴とする請求項１乃至３のいずれか記載の音叉型振動片の製造方法。   4. The method for manufacturing a tuning-fork type vibrating piece according to claim 1, wherein the thin-walled portion is formed so as to include a blank portion at least outside a portion corresponding to the outer shape of the vibrating arm. 請求項１乃至４のいずれか記載の方法により製造したことを特徴とする音叉型振動片。   A tuning fork-type vibrating piece manufactured by the method according to claim 1. 請求項５記載の音叉型振動片と、前記音叉型振動片を収容するためのパッケージとを備え、前記音叉型振動片が、前記支持部の前記厚肉部分の前記段差が設けられている側の面において前記パッケージ内部のマウント電極に直接固定して支持されていることを特徴とする振動子。   A tuning fork type vibrating piece according to claim 5 and a package for accommodating the tuning fork type vibrating piece, wherein the tuning fork type vibrating piece is provided on the side where the step of the thick portion of the support portion is provided. The vibrator is fixed and supported directly on the mount electrode inside the package on the surface. 請求項５記載の音叉型振動片と、前記音叉型振動片を収容するためのパッケージとを備え、前記音叉型振動片が、前記支持部の前記厚肉部分の前記段差が設けられている側の面において前記パッケージ内部のマウント電極に直接固定して支持されていることを特徴とする電子デバイス。   A tuning fork type vibrating piece according to claim 5 and a package for accommodating the tuning fork type vibrating piece, wherein the tuning fork type vibrating piece is provided on the side where the step of the thick portion of the support portion is provided. The electronic device is fixed and supported directly on a mount electrode inside the package on the surface.
JP2011170753A 2011-08-04 2011-08-04 Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device Withdrawn JP2013038483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011170753A JP2013038483A (en) 2011-08-04 2011-08-04 Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011170753A JP2013038483A (en) 2011-08-04 2011-08-04 Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device

Publications (1)

Publication Number Publication Date
JP2013038483A true JP2013038483A (en) 2013-02-21

Family

ID=47887703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011170753A Withdrawn JP2013038483A (en) 2011-08-04 2011-08-04 Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device

Country Status (1)

Country Link
JP (1) JP2013038483A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179672A (en) * 2013-03-13 2014-09-25 Sii Crystal Technology Inc Piezoelectric vibration piece, piezoelectric vibrator, electronic apparatus, and radio clock

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179672A (en) * 2013-03-13 2014-09-25 Sii Crystal Technology Inc Piezoelectric vibration piece, piezoelectric vibrator, electronic apparatus, and radio clock

Similar Documents

Publication Publication Date Title
JP4714770B2 (en) Tuning fork type piezoelectric vibrating piece and method for manufacturing tuning fork type piezoelectric vibrating piece
JP5912557B2 (en) Tuning fork type piezoelectric vibrating piece and piezoelectric device
JP5123962B2 (en) Tuning fork type piezoelectric vibrating piece, piezoelectric frame, piezoelectric device, tuning fork type piezoelectric vibrating piece, and method for manufacturing piezoelectric frame
US7982374B2 (en) Piezoelectric vibrating piece with extended supporting arms
JP5085682B2 (en) Piezoelectric device
JP5534828B2 (en) Tuning fork type bending crystal resonator element
JP2004007428A (en) Tuning fork piezoelectric vibration chip, manufacturing method thereof, and piezoelectric device
JP5085681B2 (en) Piezoelectric vibrating piece, piezoelectric device, and method of manufacturing piezoelectric vibrating piece
JP5520618B2 (en) Tuning fork type bending crystal resonator element
JP5059387B2 (en) Tuning fork type piezoelectric resonator element, piezoelectric device, and tuning fork type piezoelectric resonator element
JP2005151423A (en) Piezoelectric vibration chip and piezoelectric device and method of manufacturing them, and mobile telephone apparatus using piezoelectric device, and electronic apparatus using piezoelectric device
JP3844213B2 (en) Method for manufacturing piezoelectric vibrating piece, photomask, piezoelectric vibrating piece, and piezoelectric device
JP5272651B2 (en) Manufacturing method of vibrating piece
JP2011211452A (en) Method of manufacturing tuning fork type crystal vibration chip, crystal device
JP2008219827A (en) Piezoelectric vibration chip and piezoelectric device
JP4102839B2 (en) Tuning fork type crystal vibrating piece manufacturing method, crystal vibrating device manufacturing method, tuning fork type crystal vibrating piece and crystal vibrating device
JP5584728B2 (en) Tuning fork type piezoelectric vibrating piece and vibrating device
JP2009152988A (en) Piezoelectric vibration chip, piezoelectric device and manufacturing methods for them
JP2008131486A (en) Process for producing tuning fork type crystal vibration chip and process for fabricating crystal oscillating device, and tuning fork type crystal vibration chip and crystal oscillating device
JP5154977B2 (en) Piezoelectric vibrating piece, piezoelectric device, and tuning fork type piezoelectric vibrator frequency adjusting method
JP5465041B2 (en) Tuning fork type bending crystal resonator element
JP2013038483A (en) Manufacturing method of tuning-fork type vibration piece, tuning-fork type vibration piece, vibrator, and electronic device
JP2010283805A (en) Manufacturing method of manufacturing tuning fork type piezoelectric vibration piece, tuning fork type piezoelectric vibration piece, and piezoelectric vibration device
JP2009152989A (en) Piezoelectric vibration chip and piezoelectric device
JP2008098748A (en) Tuning fork type piezoelectric vibrator, piezoelectric vibrating device and piezoelectric oscillator

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140717

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20150107

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150707

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20150817