JP2013029538A - Imaging apparatus - Google Patents

Imaging apparatus Download PDF

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JP2013029538A
JP2013029538A JP2011163466A JP2011163466A JP2013029538A JP 2013029538 A JP2013029538 A JP 2013029538A JP 2011163466 A JP2011163466 A JP 2011163466A JP 2011163466 A JP2011163466 A JP 2011163466A JP 2013029538 A JP2013029538 A JP 2013029538A
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spacer
thickness
imaging
substrate
outer edge
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JP5898427B2 (en
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Yasuaki Fukui
泰明 福井
Takahiro Okada
貴裕 岡田
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an imaging device which has excellent heat radiation, to which mix-up prevention measures during assembly work are applied and which is equipped with a spacer for distance adjustment between an imaging lens and an imaging element capable of making a product quality uniform.SOLUTION: An imaging apparatus (1) includes: a lens holder (3) for holding an imaging lens (2); a substrate (5) on which an imaging element (4) is mounted; and a spacer (6) which has an annular shape so as to surround the imaging element and is formed of a metal material interposed between the substrate and the lens holder fixed to each other. Specially, in the spacer, an annular outer edge part is provided which has a different shape for each thickness thereof.

Description

本発明は、撮像レンズを介して撮像素子に結像させた被写体像を撮像する撮像装置の技術分野に関する。   The present invention relates to a technical field of an imaging apparatus that captures a subject image formed on an imaging element via an imaging lens.

撮像レンズを介して、例えばＣＣＤイメージセンサやＣＭＯＳイメージセンサなどの撮像素子に結像させた被写体像を撮像する撮像装置が広く知られている。この種の撮像装置では、撮像レンズと撮像素子との光軸方向の距離を調整することによって、撮像素子に集光される被写体像のピント合わせを行う。このようなピント合わせは、撮像レンズを保持するレンズホルダと、該レンズホルダに組み合わされる撮像素子が実装された基板との間に、所定の厚みを有するスペーサなどの距離調整部材を介在させることにより行われることが知られている。   2. Description of the Related Art An imaging device that captures a subject image formed on an imaging element such as a CCD image sensor or a CMOS image sensor via an imaging lens is widely known. In this type of imaging apparatus, the subject image focused on the imaging element is focused by adjusting the distance in the optical axis direction between the imaging lens and the imaging element. Such focusing is achieved by interposing a distance adjusting member such as a spacer having a predetermined thickness between a lens holder that holds the imaging lens and a substrate on which an imaging element combined with the lens holder is mounted. It is known to be done.

例えば特許文献１には、撮像素子が実装された基板をレンズホルダに固定する際に、基板表面のうち撮像素子の周囲に沿って接着剤を塗布し、該接着剤を硬化した際に撮像レンズと撮像素子との距離が適切な値になるように、距離調整部材として接着剤を利用することが記載されている。これにより、特許文献１では撮像素子における被写体像のピント合わせと共に、レンズホルダと撮像素子が実装された基板間の隙間を接着剤で密閉することにより、撮像素子の周囲における防塵性を確保できるとされている。   For example, in Patent Document 1, when a substrate on which an image sensor is mounted is fixed to a lens holder, an imaging lens is applied when an adhesive is applied along the periphery of the image sensor on the surface of the substrate and the adhesive is cured. The use of an adhesive as a distance adjusting member is described so that the distance between the sensor and the image sensor becomes an appropriate value. Accordingly, in Patent Document 1, when the subject image is focused on the image sensor and the gap between the lens holder and the substrate on which the image sensor is mounted is sealed with an adhesive, dust resistance around the image sensor can be secured. Has been.

特開２００６−１２８７５５号公報JP 2006-128755 A

しかしながら、上記特許文献１では撮像素子の周辺空間が密封されているので、撮像素子で生じた熱量の放熱性が問題となる。また、接着剤は硬化の際に内包する水分を放出する場合があり、それが密封空間に存在すると、温度変化に伴なって結露が生じる可能性もある。また、硬化前の接着剤は定型を有していないため、撮像レンズと撮像素子との間の距離を精度よく調整することが困難であり、ピントを合わせにくいという問題点もある。   However, since the peripheral space of the image sensor is sealed in Patent Document 1, the heat dissipation of the amount of heat generated in the image sensor becomes a problem. In addition, the adhesive may release moisture contained in the case of curing, and if it exists in the sealed space, there is a possibility that dew condensation occurs with a change in temperature. Further, since the adhesive before curing does not have a fixed form, it is difficult to accurately adjust the distance between the imaging lens and the imaging element, and there is a problem that it is difficult to focus.

また接着剤に代えて、撮像レンズと撮像素子との間の距離調整用のスペーサを用いた場合であっても、撮像装置の組立時に当該距離を様々な値に変更しながら調整できるように、厚みの異なるスペーサを複数種類用意する必要がある。従来のこの種のスペーサは、厚み以外の構成が一様であるため、異なる厚みのスペーサを作業者が視覚的に判別することが困難であり、組立作業時に取り違えが生じやすいという問題がある。その対策の一案として、本願発明者はスペーサの厚み毎に特徴付けた取り違え防止用の形状を付加することが有効であると考えた。しかしながら、このような対応ではスペーサの厚み毎に表面積が変化することによって放熱性や剛性にバラツキが生じ、完成品の品質を均一に保つことが困難であるという課題を見出した。   Further, in place of the adhesive, even when a spacer for adjusting the distance between the imaging lens and the imaging element is used, it can be adjusted while changing the distance to various values when the imaging device is assembled. It is necessary to prepare a plurality of types of spacers having different thicknesses. Since this type of conventional spacer has a uniform configuration other than the thickness, it is difficult for the operator to visually distinguish the spacers having different thicknesses, and there is a problem that they are likely to be mixed up during assembly work. As one countermeasure, the inventor of the present application thought that it would be effective to add a shape for preventing the mixup characterized for each spacer thickness. However, in such a correspondence, it has been found that it is difficult to keep the quality of the finished product uniform because variations in heat dissipation and rigidity occur due to changes in the surface area for each spacer thickness.

本発明は上記問題点に鑑みなされたものであり、良好な放熱性を有すると共に、組立作業時の取り違え防止対策が施されており、製品の品質を均一化できる撮像レンズと撮像素子との間の距離調整用スペーサを備えた撮像装置を提供することを目的とする。   The present invention has been made in view of the above-described problems, and has good heat dissipation and measures for preventing misunderstanding at the time of assembling work, and between an imaging lens and an imaging element that can make product quality uniform. An object of the present invention is to provide an imaging device provided with a distance adjusting spacer.

本発明に係る撮像装置は上記課題を解決するために、撮像レンズを介して撮像素子に結像させた被写体像を撮像する撮像装置であって、前記撮像レンズを保持するレンズホルダと、前記撮像素子が実装された基板と、前記基板を前記レンズホルダに固定した際に、前記撮像素子の周りを囲むように環形状を有すると共に、前記基板及び前記レンズホルダ間に介在するように配置される金属材料からなるスペーサとを備え、前記スペーサには、その厚み毎に異なる形状を有する環状外縁部が設けられていることを特徴とする。   In order to solve the above problems, an imaging apparatus according to the present invention is an imaging apparatus that images a subject image formed on an imaging element via an imaging lens, the lens holder holding the imaging lens, and the imaging When a substrate on which an element is mounted and the substrate are fixed to the lens holder, the substrate has a ring shape so as to surround the imaging device, and is disposed so as to be interposed between the substrate and the lens holder. And a spacer made of a metal material, wherein the spacer is provided with an annular outer edge portion having a different shape for each thickness.

本発明によれば、レンズホルダと基板間に熱伝導性に優れた金属材料からなるスペーサを介在させることにより、撮像レンズと撮像素子との間の距離調整を精度よく行いつつ、撮像素子や基板からの発熱を外部へ効率よく放熱できる。このスペーサは厚みによって異なる形状を有する環状外縁部を有するので、作業者が視覚的に厚みの違いを判別しやすく、組立作業時の取り違えを有効に防止できる。特に環状外縁部は、厚みの違いによる表面積や剛性の違い等を相殺するように設けられることによって、スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。   According to the present invention, by interposing a spacer made of a metal material having excellent thermal conductivity between the lens holder and the substrate, the distance between the image pickup lens and the image pickup device can be adjusted accurately, and the image pickup device or the substrate. The heat generated from can be efficiently radiated to the outside. Since this spacer has an annular outer edge portion having a shape that varies depending on the thickness, it is easy for an operator to visually distinguish the difference in thickness, and it is possible to effectively prevent a mistake during assembly work. In particular, the annular outer edge portion is provided so as to offset the difference in surface area and rigidity due to the difference in thickness, so that the quality of the imaging device in which the spacer is incorporated can be made uniform.

本発明の一態様によれば、前記環状外縁部は、前記スペーサの厚みに対応する数の凹部若しくは凸部が形成されており、前記凹部若しくは凸部の数は、前記スペーサの厚みが厚いほど少なく設定されている。スペーサの厚みが薄くなると該スペーサの外気と接触する表面積が減少して放熱性が低下する。この態様では、スペーサの厚みが薄くなるに従い凹部若しくは凸部の数を増加させることにより、外気に触れる表面積を増加させて放熱性の低下を抑制できる。また凸部に関しては、スペーサの厚みが薄くなると該スペーサの剛性や重量が減少するので、凸部の数を増加させることにより剛性や重量の減少を抑制することができる。このように本態様によれば、厚みの違いによるスペーサの放熱性、剛性、重量のバラツキを抑制して、該スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。   According to one aspect of the present invention, the annular outer edge is formed with a number of recesses or protrusions corresponding to the thickness of the spacer, and the number of the recesses or protrusions increases as the thickness of the spacer increases. It is set less. When the thickness of the spacer is reduced, the surface area of the spacer that comes into contact with the outside air is reduced and heat dissipation is reduced. In this aspect, by increasing the number of concave portions or convex portions as the spacer becomes thinner, the surface area that comes into contact with the outside air can be increased, and a decrease in heat dissipation can be suppressed. Further, regarding the convex portion, when the thickness of the spacer is reduced, the rigidity and weight of the spacer are reduced. Therefore, the decrease in rigidity and weight can be suppressed by increasing the number of convex portions. As described above, according to this aspect, variations in the heat dissipation, rigidity, and weight of the spacer due to the difference in thickness can be suppressed, and the quality of the imaging device in which the spacer is incorporated can be made uniform.

また本発明の他の態様としては、前記環状外縁部は、前記スペーサの厚みに対応する数の凹部が形成されており、前記凹部の数は、前記スペーサの厚みが厚いほど多く設定されていてもよい。スペーサの厚みが厚くなると該スペーサの剛性が増し、組み込み時にスペーサが有する反りの矯正が困難になる。この態様では、スペーサの厚みが厚くなるに従い凹部の数を増加させてスペーサの剛性を減少させ、反りの矯正を容易にすることができる。これにより、厚みの違いによるスペーサの組み込み容易性のバラツキを防止して、該スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。また、スペーサの厚みが厚くなると該スペーサの重量が増すので、凹部の数を増加させることによりスペーサの重量を減少させ、該スペーサが組み込まれる撮像装置の重量の均一化も図ることができる。   As another aspect of the present invention, the annular outer edge portion has a number of recesses corresponding to the thickness of the spacer, and the number of the recesses is set to increase as the spacer thickness increases. Also good. When the spacer becomes thicker, the rigidity of the spacer increases, and it becomes difficult to correct the warp of the spacer during assembly. In this aspect, as the thickness of the spacer increases, the number of recesses is increased to reduce the rigidity of the spacer, and the correction of warpage can be facilitated. Thereby, it is possible to prevent the variation in the ease of assembling the spacer due to the difference in thickness, and to uniform the quality of the imaging device in which the spacer is incorporated. Further, since the weight of the spacer increases as the thickness of the spacer increases, the weight of the spacer can be reduced by increasing the number of recesses, and the weight of the imaging device in which the spacer is incorporated can be made uniform.

また本発明の他の態様としては、前記環状外縁部は、前記スペーサの厚みに対応する大きさの凹部若しくは凸部が形成されており、前記凹部若しくは凸部の大きさは、前記スペーサの厚みが厚いほど小さく設定されていてもよい。スペーサの厚みが薄くなると該スペーサの表面積が減少して放熱性が低下する。この態様では、スペーサの厚みが薄くなるに従って凹部若しくは凸部の大きさを増加させることにより、外気に触れる表面積を増加させて放熱性の低下を抑制できる。また凸部に関しては、スペーサの厚みが薄くなると該スペーサの剛性や重量が減少するので、凸部の大きさを増加させることによりスペーサの剛性や重量の減少を抑制することができる。このように本態様によれば、厚みの違いによるスペーサの放熱性、剛性、重量のバラツキを抑制して、該スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。   As another aspect of the present invention, the annular outer edge portion is formed with a recess or projection having a size corresponding to the thickness of the spacer, and the size of the recess or projection is the thickness of the spacer. The thickness may be set smaller as the thickness increases. When the thickness of the spacer is reduced, the surface area of the spacer is reduced and heat dissipation is reduced. In this aspect, by increasing the size of the concave portion or the convex portion as the thickness of the spacer is reduced, the surface area in contact with the outside air can be increased, and the reduction in heat dissipation can be suppressed. Further, regarding the convex portion, when the thickness of the spacer is reduced, the rigidity and weight of the spacer are reduced. Therefore, the decrease in the rigidity and weight of the spacer can be suppressed by increasing the size of the convex portion. As described above, according to this aspect, variations in the heat dissipation, rigidity, and weight of the spacer due to the difference in thickness can be suppressed, and the quality of the imaging device in which the spacer is incorporated can be made uniform.

また本発明の他の態様としては、前記環状外縁部は、前記スペーサの厚みに対応する大きさの凹部が形成されており、前記凹部の大きさは、前記スペーサの厚みが厚いほど大きく設定されていてもよい。スペーサの厚みが厚くなると該スペーサの剛性が増加し、組み込み時にスペーサが有する反りの矯正が困難になる。この態様では、スペーサの厚みが厚くなるに従って凹部の大きさを増加させることにより、スペーサの剛性を減少させ、反りの矯正を容易にすることができる。これにより、厚みの違いによるスペーサの組み込み容易性のバラツキを防止して、該スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。また、スペーサの厚みが厚くなると該スペーサの重量が増すので、凹部の大きさを増加させることによりスペーサの重量を減少させ、該スペーサが組み込まれる撮像装置の重量の均一化を図ることができる。   As another aspect of the present invention, the annular outer edge portion is formed with a recess having a size corresponding to the thickness of the spacer, and the size of the recess is set to be larger as the thickness of the spacer is larger. It may be. When the thickness of the spacer increases, the rigidity of the spacer increases, and it becomes difficult to correct the warp of the spacer during assembly. In this aspect, by increasing the size of the recess as the thickness of the spacer increases, the rigidity of the spacer can be reduced and the correction of warpage can be facilitated. Thereby, it is possible to prevent the variation in the ease of assembling the spacer due to the difference in thickness, and to uniform the quality of the imaging device in which the spacer is incorporated. Further, since the weight of the spacer increases as the thickness of the spacer increases, the weight of the spacer can be reduced by increasing the size of the recess, and the weight of the imaging device in which the spacer is incorporated can be made uniform.

本発明によれば、レンズホルダと基板間に熱伝導性に優れた金属材料からなるスペーサを介在させることにより、撮像レンズと撮像素子との間の距離調整を精度よく行いつつ、撮像素子や基板からの発熱を外部へ効率よく放熱できる。このスペーサは厚みによって異なる形状を有する環状外縁部を有するので、作業者が視覚的に厚みの違いを判別しやすく、組立作業時の取り違えを有効に防止できる。特に環状外縁部は、厚みの違いによる表面積や剛性の違い等を相殺するように設けられることによって、スペーサが組み込まれる撮像装置の品質の均一化を図ることができる。   According to the present invention, by interposing a spacer made of a metal material having excellent thermal conductivity between the lens holder and the substrate, the distance between the image pickup lens and the image pickup device can be adjusted accurately, and the image pickup device or the substrate. The heat generated from can be efficiently radiated to the outside. Since this spacer has an annular outer edge portion having a shape that varies depending on the thickness, it is easy for an operator to visually distinguish the difference in thickness, and it is possible to effectively prevent a mistake during assembly work. In particular, the annular outer edge portion is provided so as to offset the difference in surface area and rigidity due to the difference in thickness, so that the quality of the imaging device in which the spacer is incorporated can be made uniform.

本発明に係る撮像装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the imaging device which concerns on this invention. 図１に示す撮像装置のネジ止め部の拡大図である。It is an enlarged view of the screwing part of the imaging device shown in FIG. 基板をスペーサに面する側から示す平面図である。It is a top view which shows a board | substrate from the side which faces a spacer. スペーサの構成を示す平面図である。It is a top view which shows the structure of a spacer. 第１実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 1st Example. 第２実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 2nd Example. 第３実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 3rd Example. 撮像装置の組立時に、スペーサをレンズホルダと基板との間に挟み込む様子を示す模式図である。It is a schematic diagram which shows a mode that a spacer is inserted | pinched between a lens holder and a board | substrate at the time of an assembly of an imaging device. 第４実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 4th Example. 第５実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 5th Example. 第６実施例に係るスペーサ形状を示す平面図である。It is a top view which shows the spacer shape which concerns on 6th Example.

図１は本発明に係る撮像装置１の全体構成を示す断面図であり、図２は図１に示す撮像装置１のネジ止め部１ａの拡大図である。撮像装置１は乗用車などの車両の外装（フロント側、バック側、サイド側を問わない）に取り付けられることによって、車外にある被写体を撮像する車載カメラである。   FIG. 1 is a cross-sectional view showing the overall configuration of an imaging apparatus 1 according to the present invention, and FIG. 2 is an enlarged view of a screwing portion 1a of the imaging apparatus 1 shown in FIG. The imaging device 1 is an in-vehicle camera that images a subject outside the vehicle by being attached to the exterior of a vehicle such as a passenger car (regardless of the front side, the back side, or the side side).

撮像装置１は、被写体像を結像させるための撮像レンズ２と、該撮像レンズ２を保持するためのレンズホルダ３と、表面に結像した被写体像を撮像する撮像素子４と、該撮像素子４が実装された基板５とを備えてなる。撮像素子４は、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅ）やＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ Ｍｅｔａｌ Ｏｘｉｄｅ Ｓｅｍｉｃｏｎｄｕｃｔｅｒ）などの固体撮像素子であり、基板５上にプリント回路と共に実装搭載されている。   The imaging device 1 includes an imaging lens 2 for forming a subject image, a lens holder 3 for holding the imaging lens 2, an imaging device 4 for imaging a subject image formed on the surface, and the imaging device. 4 and a substrate 5 mounted thereon. The imaging device 4 is a solid-state imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), and is mounted on the substrate 5 together with a printed circuit.

撮像レンズ２は、被写体像を基板５上に実装された撮像素子４に結像させるための光学レンズであり、レンズホルダ３によって保持固定されている。レンズホルダ３は撮像レンズ２を保持する関係上強度が必要であり、例えばガラスフィラーが入ったポリカーボネートなどのエンジニアリングプラスチックなどで構成されている。本実施例では２枚の撮像レンズを用いているが、２枚以上の撮像レンズからなる撮像レンズ群であってもよいし、単体の撮像レンズであってもよいし、用途に応じてズームレンズとしてもよい。   The imaging lens 2 is an optical lens for forming a subject image on the imaging device 4 mounted on the substrate 5, and is held and fixed by the lens holder 3. The lens holder 3 needs to be strong enough to hold the imaging lens 2 and is made of, for example, engineering plastic such as polycarbonate containing a glass filler. In the present embodiment, two imaging lenses are used. However, an imaging lens group including two or more imaging lenses may be used, or a single imaging lens may be used. It is good.

撮像素子４が実装された基板５は、撮像レンズ２が保持されたレンズホルダ３に対して、間にスペーサ６を介して、ボルト７によってネジ止め固定されている。スペーサ６の詳細については後述するが、該スペーサ６は撮像素子４に結像する被写体像のピントを合わせるために、レンズホルダ３に保持された撮像レンズ２と基板５上に実装された撮像素子４との距離を調整すべく、所定の厚みを有している。スペーサ６の厚みは、調整用に複数種類用意されており、撮像装置１を組み立てる作業者によって撮像素子４に結像する被写体像のピントが合うように適宜選択される。   The substrate 5 on which the imaging element 4 is mounted is fixed to the lens holder 3 holding the imaging lens 2 by screws 7 with a spacer 6 interposed therebetween. Although details of the spacer 6 will be described later, the spacer 6 is mounted on the substrate 5 and the imaging lens 2 held by the lens holder 3 in order to focus the subject image formed on the imaging device 4. In order to adjust the distance to 4, it has a predetermined thickness. A plurality of types of spacers 6 are prepared for adjustment, and are appropriately selected by an operator who assembles the imaging device 1 so that the subject image formed on the imaging element 4 is in focus.

スペーサ６は、例えばステンレスやアルミニウムなどの熱伝導性に優れた金属材料からなっている。これにより、撮像素子４や基板５で発生した熱を効率よく外部へ放熱することができるようになっている。   The spacer 6 is made of a metal material having excellent thermal conductivity such as stainless steel or aluminum. Thereby, the heat generated in the image sensor 4 and the substrate 5 can be efficiently radiated to the outside.

図３は基板５をスペーサ６に面する側から示す平面図である。基板５にはレンズホルダ３に固定するためのボルト７を貫通させるためのスルーホール８が設けられている。図３（ａ）の例では、スルーホール８には、基板５の両表面をスルーホール８のボルト７に面する内壁を介して連結するように、熱伝導性に優れた金属材料からなる基板導通部９が設けられている。基板導通部９のうちスペーサ６に面する側は、基板５がボルト７でレンズホルダ３に固定された際にスペーサ６に接触することにより、基板５で発生した熱が効率的にスペーサ６に伝達されるようになっている。また基板導通部９は、図２に示すように、基板５の両表面を、基板５を貫通するボルト７に面する内壁を介して連結するように設けられており、基板５からボルト７を介してレンズホルダ３にも効率よく熱が伝達されるように構成されている。   FIG. 3 is a plan view showing the substrate 5 from the side facing the spacer 6. The substrate 5 is provided with a through hole 8 through which a bolt 7 for fixing to the lens holder 3 is passed. In the example of FIG. 3A, a substrate made of a metal material having excellent thermal conductivity so that both surfaces of the substrate 5 are connected to the through holes 8 via inner walls facing the bolts 7 of the through holes 8. A conduction part 9 is provided. The side of the substrate conducting portion 9 facing the spacer 6 contacts the spacer 6 when the substrate 5 is fixed to the lens holder 3 with the bolt 7, so that the heat generated in the substrate 5 is efficiently transferred to the spacer 6. It is to be transmitted. Further, as shown in FIG. 2, the substrate conducting portion 9 is provided so as to connect both surfaces of the substrate 5 via an inner wall facing the bolt 7 penetrating the substrate 5. Thus, heat is efficiently transmitted to the lens holder 3 through the lens holder 3.

尚、図３（ｂ）の例のように、基板導通部９をボルト７の貫通領域（スルーホール８）の周囲だけでなく、スペーサ６の形状に対応するように互いに連結するように環状に形成してもよい。この場合、スペーサ６と基板導通部９との接触面積を増加させることができるので、より高い放熱性を得ることができる。   As shown in the example of FIG. 3B, not only the periphery of the through region (through hole 8) of the bolt 7 but also the substrate conductive portion 9 is annularly connected so as to correspond to the shape of the spacer 6. It may be formed. In this case, since the contact area of the spacer 6 and the board | substrate conduction | electrical_connection part 9 can be increased, higher heat dissipation can be obtained.

続いて、スペーサ６の構成について詳細に説明する。図４はスペーサ６の構成を示す平面図である。スペーサ６は略長方形上の基板５の縁に沿って環状に設けられた環状外縁部６ａを有している。該環状外縁部６ａには、スペーサ６の厚みに応じて数や大きさが異なるように形成された凹部１０ａ若しくは凸部１０ｂが設けられている（図４では、略長方形状を有する環状外縁部６ａの各頂点に１つずつ凹部１０ａが形成されている場合を例示している）。   Next, the configuration of the spacer 6 will be described in detail. FIG. 4 is a plan view showing the configuration of the spacer 6. The spacer 6 has an annular outer edge portion 6 a provided in an annular shape along the edge of the substantially rectangular substrate 5. The annular outer edge portion 6a is provided with a concave portion 10a or a convex portion 10b formed so as to differ in number and size depending on the thickness of the spacer 6 (in FIG. 4, the annular outer edge portion having a substantially rectangular shape). The case where the recessed part 10a is formed 1 each in each vertex of 6a is illustrated.

スペーサ６の短手方向の幅ａは、長手方向の幅ｂに比べて広くなるように形成されている（すなわち、ａ＞ｂ）。これにより、基板５や撮像素子４から熱が伝達される基板導通部９近辺の基板５と接触する表面積を大きくし、放熱性を向上させている。逆に言えば、基板導通部９から伝達される熱が再び基板５全体に拡散しないように、長手方向の幅ｂを狭くすることにより、撮像素子４などの実装部品から距離の離れたスルーホール８近辺にて主に放熱されるように構成している。   The width a in the short direction of the spacer 6 is formed to be wider than the width b in the longitudinal direction (that is, a> b). Thereby, the surface area which contacts the board | substrate 5 of the board | substrate conduction | electrical_connection part 9 vicinity where the heat | fever is transmitted from the board | substrate 5 or the image pick-up element 4 is enlarged, and the heat dissipation is improved. In other words, a through-hole that is separated from the mounting component such as the image sensor 4 by narrowing the width b in the longitudinal direction so that the heat transmitted from the board conductive portion 9 does not diffuse again to the entire board 5. It is configured so that heat is mainly dissipated in the vicinity of 8.

環状外縁部６ａに設けられた凹部１０ａ（後述する環状外縁部６ａに形成される凸部１０ｂについても同様）は、スペーサ６の厚みに応じて数や大きさを異ならしめることによって、撮像装置１の組立作業を行う作業者がスペーサ６の厚みを視覚的に判別可能なように構成されている。ここで、図５から図１１を参照して、環状外縁部６ａに設けられた凹部１０ａ若しくは凸部１０ｂの数又は大きさのバリエーションについて説明する。   The recesses 10a provided in the annular outer edge portion 6a (the same applies to the protrusions 10b formed in the annular outer edge portion 6a described later) are made different in number and size according to the thickness of the spacer 6, whereby the imaging device 1 The worker who performs the assembling work can visually determine the thickness of the spacer 6. Here, with reference to FIGS. 5 to 11, variations in the number or size of the concave portions 10 a or the convex portions 10 b provided in the annular outer edge portion 6 a will be described.

（第１実施例）
図５は環状外縁部６ａにスペーサ６の厚みが厚いほど少ない数の凹部１０ａを設けた場合の、スペーサ６形状を示す平面図である。スペーサ６の厚みが薄くなると該スペーサ６の側面が外気に接触する表面積が減少して放熱性が低下する。そのため、本実施例では、スペーサ６の厚みが薄くなるに従って環状外縁部６ａに設ける凹部１０ａの数を増加させることにより、スペーサ６を撮像装置１に組み込んだ際に外気と接触する表面積を増加させて放熱性の低下を抑制している。 (First embodiment)
FIG. 5 is a plan view showing the shape of the spacer 6 in the case where a smaller number of recesses 10a are provided in the annular outer edge portion 6a as the thickness of the spacer 6 increases. When the thickness of the spacer 6 is reduced, the surface area with which the side surface of the spacer 6 is in contact with the outside air is reduced, and the heat dissipation is reduced. Therefore, in this embodiment, the surface area that comes into contact with the outside air when the spacer 6 is incorporated in the imaging device 1 is increased by increasing the number of the concave portions 10a provided in the annular outer edge portion 6a as the thickness of the spacer 6 is reduced. This suppresses the decrease in heat dissipation.

（第２実施例）
図６は環状外縁部６ａにスペーサ６の厚みが厚いほど少ない数の凸部１０ｂを設けた場合の、スペーサ６形状を示す平面図である。第１実施例（図５を参照）の場合と同様に、スペーサ６の厚みが薄くなると該スペーサ６の側面が外気に接触する表面積が減少して放熱性が低下する。そのため、本実施例では、スペーサ６の厚みが薄くなるに従って環状外縁部６ａに設ける凸部１０ｂの数を増加させることにより、スペーサ６を撮像装置１に組み込んだ際に外気と接触する表面積を増加させて放熱性の低下を抑制している。 (Second embodiment)
FIG. 6 is a plan view showing the shape of the spacer 6 when the annular outer edge portion 6a is provided with a smaller number of convex portions 10b as the spacer 6 is thicker. As in the case of the first embodiment (see FIG. 5), when the thickness of the spacer 6 is reduced, the surface area with which the side surface of the spacer 6 comes into contact with the outside air is reduced and the heat dissipation is reduced. Therefore, in this embodiment, the surface area that comes into contact with the outside air when the spacer 6 is incorporated into the imaging device 1 is increased by increasing the number of the convex portions 10b provided on the annular outer edge portion 6a as the thickness of the spacer 6 is reduced. This prevents the heat dissipation from decreasing.

またスペーサ６の厚みが薄くなると該スペーサ６の剛性や重量が減少するので、凸部１０ｂの数を増加させることによりスペーサ６の容積を増やし、剛性や重量の減少を抑制している。このように本実施例によれば、厚みの違いによるスペーサ６の放熱性、剛性、重量のバラツキを抑制して、該スペーサ６が組み込まれる撮像装置１の品質の均一化を図ることができる。   Further, since the rigidity and weight of the spacer 6 are reduced when the thickness of the spacer 6 is reduced, the volume of the spacer 6 is increased by increasing the number of the convex portions 10b, and the reduction in rigidity and weight is suppressed. As described above, according to the present embodiment, variations in the heat dissipation, rigidity, and weight of the spacer 6 due to the difference in thickness can be suppressed, and the quality of the imaging device 1 in which the spacer 6 is incorporated can be made uniform.

（第３実施例）
図７は環状外縁部６ａにスペーサ６の厚みが厚いほど多い数の凹部１０ａを設けた場合の、スペーサ６形状を示す平面図である。また図８は撮像装置１の組立時に、スペーサ６をレンズホルダ３と基板５との間に挟み込む様子を示す模式図である。図８に示すように、レンズホルダ３と基板５との間に挟み込まれる以前のスペーサ６には、プレスなどで製造される際に生じた反りが少なからず生じている。このスペーサ６が有する反りは、スペーサ６がレンズホルダ３と基板５との間に挟み込まれてボルト７で締め込まれることによって、上下方向から印加される圧力によって矯正されることとなる。 (Third embodiment)
FIG. 7 is a plan view showing the shape of the spacer 6 when the annular outer edge 6a is provided with a larger number of recesses 10a as the thickness of the spacer 6 increases. FIG. 8 is a schematic diagram showing a state in which the spacer 6 is sandwiched between the lens holder 3 and the substrate 5 when the imaging apparatus 1 is assembled. As shown in FIG. 8, the spacer 6 before being sandwiched between the lens holder 3 and the substrate 5 has a considerable amount of warpage caused when it is manufactured by a press or the like. The warpage of the spacer 6 is corrected by the pressure applied from above and below when the spacer 6 is sandwiched between the lens holder 3 and the substrate 5 and tightened with the bolts 7.

ここで、スペーサ６の厚みが厚くなると該スペーサ６の剛性が増加し、撮像装置１への組み込み時にスペーサ６が有する反りの矯正が困難になる。そのため、本実施例では図７に示すように、スペーサ６の厚みが増すに従って凹部１０ａの数を増加させることによりスペーサ６の容積を減らして剛性を減少させ、反りの矯正を容易にしている。これにより、厚みの違いによるスペーサ６の組み込み容易性のバラツキを防止して、該スペーサ６が組み込まれる撮像装置１の品質の均一化を図ることができる。また、スペーサ６の厚みが厚くなると該スペーサ６の重量が増すので、凹部１０ａの数を増加させることによりスペーサ６の重量を減少させ、該スペーサ６が組み込まれる撮像装置１０の重量の均一化を図ることもできる。   Here, as the thickness of the spacer 6 increases, the rigidity of the spacer 6 increases, and it becomes difficult to correct the warp of the spacer 6 when the spacer 6 is incorporated into the imaging apparatus 1. Therefore, in this embodiment, as shown in FIG. 7, the number of the recesses 10a is increased as the thickness of the spacer 6 is increased, thereby reducing the volume of the spacer 6 to reduce the rigidity and facilitating the correction of the warp. Thereby, it is possible to prevent variation in the ease of assembling the spacer 6 due to the difference in thickness, and to achieve uniform quality of the imaging device 1 in which the spacer 6 is incorporated. Further, since the weight of the spacer 6 increases as the thickness of the spacer 6 increases, the weight of the spacer 6 is decreased by increasing the number of the recesses 10a, and the weight of the imaging device 10 in which the spacer 6 is incorporated is made uniform. You can also plan.

（第４実施例）
図９は環状外縁部６ａにスペーサ６の厚みが厚いほどサイズが小さい凹部１０ａを設けた場合の、スペーサ６形状を示す平面図である。スペーサ６の厚みが薄くなると該スペーサ６の外気と接触する表面積が減少して放熱性が低下する。そのため、本実施例では、スペーサ６の厚みが薄くなるに従い凹部１０ａのサイズを大きくすることにより外気と接触する表面積を増加させて放熱性の低下を抑制している。 (Fourth embodiment)
FIG. 9 is a plan view showing the shape of the spacer 6 when the concave portion 10a having a smaller size is provided on the annular outer edge portion 6a. When the thickness of the spacer 6 is reduced, the surface area of the spacer 6 in contact with the outside air is reduced and heat dissipation is reduced. For this reason, in this embodiment, the surface area in contact with the outside air is increased by increasing the size of the recess 10a as the thickness of the spacer 6 is reduced, thereby suppressing a decrease in heat dissipation.

（第５実施例）
図１０は環状外縁部６ａにスペーサ６の厚みが厚いほどサイズが小さい凸部１０ｂを設けた場合の、スペーサ６形状を示す平面図である。第４実施例（図９を参照）の場合と同様に、スペーサ６の厚みが薄くなると該スペーサ６の外気と接触する表面積が減少して放熱性が低下する。そのため本実施例では、スペーサ６の厚みが薄くなるに従って凸部のサイズを大きくすることにより外気と接触する表面積を増加させて放熱性の低下を抑制している。 (5th Example)
FIG. 10 is a plan view showing the shape of the spacer 6 when the annular outer edge portion 6a is provided with a convex portion 10b having a smaller size as the spacer 6 is thicker. As in the case of the fourth embodiment (see FIG. 9), when the thickness of the spacer 6 is reduced, the surface area of the spacer 6 that comes into contact with the outside air is reduced and the heat dissipation is reduced. Therefore, in this embodiment, the surface area in contact with the outside air is increased by increasing the size of the convex portion as the thickness of the spacer 6 is reduced, thereby suppressing a decrease in heat dissipation.

またスペーサ６の厚みが薄くなると該スペーサ６の剛性や重量が減少するので、凸部１０ｂの大きさを増加させることによりスペーサ６の剛性や重量の減少を抑制することができる。このように本実施例によれば、厚みの違いによるスペーサ６の放熱性、剛性、重量のバラツキを抑制して、該スペーサ６が組み込まれる撮像装置１の品質の均一化を図ることができる。   Further, since the rigidity and weight of the spacer 6 are reduced when the thickness of the spacer 6 is reduced, the rigidity and weight of the spacer 6 can be suppressed from decreasing by increasing the size of the convex portion 10b. As described above, according to the present embodiment, variations in the heat dissipation, rigidity, and weight of the spacer 6 due to the difference in thickness can be suppressed, and the quality of the imaging device 1 in which the spacer 6 is incorporated can be made uniform.

（第６実施例）
図１１は環状外縁部６ａにスペーサ６の厚みが厚いほどサイズが大きい凹部１０ａを設けた場合の、スペーサ６形状を示す平面図である。上述の第３実施例にて図８を参照して説明したように、スペーサ６の厚みが厚くなると該スペーサ６の剛性が増加し、撮像装置１への組み込み時にスペーサ６が有する反りの矯正が困難になる。そのため、本実施例では、スペーサの厚みが厚くなるに従って凹部１０ａの大きさを増加させることによりスペーサの剛性を減少させ、組み込み時における反りの矯正を容易にしている。これにより、厚みの違いによるスペーサ１の組み込み容易性のバラツキを防止して、該スペーサ６が組み込まれる撮像装置１の品質の均一化を図ることができる。また、スペーサ６の厚みが厚くなると該スペーサ６の重量が増すので、凹部１０ａの大きさを増加させることによりスペーサ６の重量を減少させ、該スペーサ６が組み込まれる撮像装置１の重量の均一化を図ることができる。 (Sixth embodiment)
FIG. 11 is a plan view showing the shape of the spacer 6 when the annular outer edge 6a is provided with a recess 10a having a larger size as the spacer 6 is thicker. As described with reference to FIG. 8 in the third embodiment described above, as the thickness of the spacer 6 increases, the rigidity of the spacer 6 increases, and the warp of the spacer 6 when it is incorporated into the imaging apparatus 1 can be corrected. It becomes difficult. Therefore, in this embodiment, the rigidity of the spacer is decreased by increasing the size of the concave portion 10a as the thickness of the spacer is increased, thereby facilitating the correction of the warp at the time of incorporation. Thereby, variation in the ease of assembling the spacer 1 due to the difference in thickness can be prevented, and the quality of the imaging device 1 in which the spacer 6 is incorporated can be made uniform. Further, since the weight of the spacer 6 increases as the thickness of the spacer 6 increases, the weight of the spacer 6 is decreased by increasing the size of the recess 10a, and the weight of the imaging device 1 in which the spacer 6 is incorporated is made uniform. Can be achieved.

以上説明したように、本実施例に係る撮像装置１によれば、レンズホルダ３と基板５間に熱伝導性に優れた金属材料からなるスペーサ６を介在させることにより、撮像レンズ２と撮像素子４との間の距離調整を精度よく行いつつ、撮像素子４や基板５からの発熱を外部へ効率よく放熱できる。このスペーサ６は厚みによって異なる形状を有する環状外縁部６ａを有するので、作業者が視覚的に厚みの違いを判別しやすく、組立作業時の取り違えを有効に防止できる。特に環状外縁部６ａは、厚みの違いによる表面積や剛性の違い等を相殺するように設けられることによって、スペーサ６が組み込まれる撮像装置１の品質の均一化を図ることができる。
As described above, according to the imaging apparatus 1 according to the present embodiment, the imaging lens 2 and the imaging element are provided by interposing the spacer 6 made of a metal material having excellent thermal conductivity between the lens holder 3 and the substrate 5. The heat generated from the image sensor 4 and the substrate 5 can be efficiently radiated to the outside while accurately adjusting the distance to the image sensor 4. Since the spacer 6 has the annular outer edge portion 6a having a shape that varies depending on the thickness, it is easy for the operator to visually distinguish the difference in thickness, and it is possible to effectively prevent a mistake during assembly work. In particular, the annular outer edge portion 6a is provided so as to offset the difference in surface area and rigidity due to the difference in thickness, so that the quality of the imaging device 1 in which the spacer 6 is incorporated can be made uniform.

本発明は、撮像レンズを介して撮像素子に被写体像を結像させることにより撮像する撮像装置に利用可能である。   The present invention is applicable to an imaging apparatus that captures an image by forming a subject image on an imaging element via an imaging lens.

１ 撮像装置
２ 撮像レンズ
３ レンズホルダ
４ 撮像素子
５ 基板
６ スペーサ
６ａ 環状外縁部
７ ボルト
８ スルーホール
９ 基板導通部
１０ａ 凹部
１０ｂ 凸部 DESCRIPTION OF SYMBOLS 1 Imaging device 2 Imaging lens 3 Lens holder 4 Imaging element 5 Board | substrate 6 Spacer 6a Annular outer edge part 7 Bolt 8 Through hole 9 Substrate conduction | electrical_connection part 10a Concave part 10b Convex part

Claims (5)

撮像レンズを介して撮像素子に結像させた被写体像を撮像する撮像装置であって、
前記撮像レンズを保持するレンズホルダと、
前記撮像素子が実装された基板と、
前記基板を前記レンズホルダに固定した際に、前記撮像素子の周りを囲むように環形状を有すると共に、前記基板及び前記レンズホルダ間に介在するように配置される金属材料からなるスペーサと
を備え、
前記スペーサには、その厚み毎に異なる形状を有する環状外縁部が設けられていることを特徴とする撮像装置。 An imaging device that captures a subject image formed on an image sensor via an imaging lens,
A lens holder for holding the imaging lens;
A substrate on which the image sensor is mounted;
A spacer made of a metal material that has a ring shape so as to surround the imaging element when the substrate is fixed to the lens holder, and is disposed so as to be interposed between the substrate and the lens holder. ,
An imaging device, wherein the spacer is provided with an annular outer edge portion having a different shape for each thickness. 前記環状外縁部は、前記スペーサの厚みに対応する数の凹部若しくは凸部が形成されており、
前記凹部若しくは凸部の数は、前記スペーサの厚みが厚いほど少なく設定されていることを特徴とする請求項１に記載の撮像装置。 The annular outer edge is formed with a number of recesses or protrusions corresponding to the thickness of the spacer,
The imaging device according to claim 1, wherein the number of the concave portions or the convex portions is set to be smaller as the spacer is thicker. 前記環状外縁部は、前記スペーサの厚みに対応する数の凹部が形成されており、
前記凹部の数は、前記スペーサの厚みが厚いほど多く設定されていることを特徴とする請求項１に記載の撮像装置。 The annular outer edge portion has a number of recesses corresponding to the thickness of the spacer,
The imaging device according to claim 1, wherein the number of the recesses is set to be larger as the spacer is thicker. 前記環状外縁部は、前記スペーサの厚みに対応する大きさの凹部若しくは凸部が形成されており、
前記凹部若しくは凸部の大きさは、前記スペーサの厚みが厚いほど小さく設定されていることを特徴とする請求項１に記載の撮像装置。 The annular outer edge is formed with a recess or projection having a size corresponding to the thickness of the spacer,
The image pickup apparatus according to claim 1, wherein the size of the concave portion or the convex portion is set to be smaller as the thickness of the spacer is larger. 前記環状外縁部は、前記スペーサの厚みに対応する大きさの凹部が形成されており、
前記凹部の大きさは、前記スペーサの厚みが厚いほど大きく設定されていることを特徴とする請求項１に記載の撮像装置。 The annular outer edge is formed with a recess having a size corresponding to the thickness of the spacer,
The image pickup apparatus according to claim 1, wherein the size of the concave portion is set to increase as the thickness of the spacer increases.
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