JP2013012305A - Illumination device - Google Patents

Illumination device Download PDF

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JP2013012305A
JP2013012305A JP2011142490A JP2011142490A JP2013012305A JP 2013012305 A JP2013012305 A JP 2013012305A JP 2011142490 A JP2011142490 A JP 2011142490A JP 2011142490 A JP2011142490 A JP 2011142490A JP 2013012305 A JP2013012305 A JP 2013012305A
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substrate
light emitting
emitting element
side light
light
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Tomomichi Satake
友路 佐竹
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Nichia Corp
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Nichia Corp
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Abstract

PROBLEM TO BE SOLVED: To obtain an illumination device excellent in heat dissipation characteristic while having wide light distribution characteristics.SOLUTION: The illumination device is provided with a substrate, front surface side light-emitting elements installed on a front surface of the substrate, and rear face side light-emitting elements installed on a rear surface of the substrate. The rear surface of the substrate has an outer region and an inner region, and the rear face side light-emitting elements are installed on the outer region and a heat dissipation member is installed on the inner region. The heat dissipation member has an inclined part of which the side face is inclined so that it may be widened toward a space above the outer region as it is separated from the substrate 1. In addition, the inclined part has a reflection structure capable of reflecting the light from the rear surface side light-emitting elements.

Description

本発明は照明装置に関する。   The present invention relates to a lighting device.

近年、発光素子としてＬＥＤ（発光ダイオード）を用いた照明装置が提案されている。しかし、ＬＥＤは指光性が強いため、ＬＥＤを用いた照明装置は、白熱電球等と比べると正面方向に配光が強く、斜め後ろ方向や横方向への配光が弱いという問題がある。   In recent years, lighting devices using LEDs (light emitting diodes) as light emitting elements have been proposed. However, since the LED has strong finger-lighting properties, the illumination device using the LED has a problem that light distribution is strong in the front direction compared to incandescent light bulbs and the like, and light distribution in the obliquely rearward and lateral directions is weak.

この問題を解決するために、種々の提案がされている。例えば、特許文献１（図１−Ａ（Ｂ））、特許文献２（図１６等）及び特許文献３（図１５等）には基板の表面だけでなく裏面にも発光素子を設けることで、配光特性の改善を図る旨が記載されている。   Various proposals have been made to solve this problem. For example, Patent Document 1 (FIG. 1-A (B)), Patent Document 2 (FIG. 16 and the like) and Patent Document 3 (FIG. 15 and the like) provide light emitting elements not only on the front surface but also on the back surface. It describes that the light distribution characteristics are improved.

実用新案登録第３１６５９６８号公報Utility Model Registration No. 3165968 特開２０１０−１５７４５９号公報JP 2010-157459 A 特開２０１０−１２９３００号公報JP 2010-129300 A

しかしながら、引用文献１〜３に記載された照明装置では、基板１からの放熱を十分に行うことができず、実際の使用は困難であった。   However, in the illuminating devices described in the cited documents 1 to 3, the heat radiation from the substrate 1 cannot be sufficiently performed, and the actual use is difficult.

本発明は上記問題に鑑みてなされたものであり、広角な配光特性を得つつ放熱性に優れた照明装置を得ること課題とする。   This invention is made | formed in view of the said problem, and makes it the subject to obtain the illuminating device excellent in heat dissipation, obtaining the wide-angle light distribution characteristic.

本発明の一実施形態に係る照明装置は、基板と、基板の表面に設けられた表面側発光素子と、基板の裏面に設けられた裏面側発光素子と、を備える。基板の裏面は外側領域及び内側領域を有し、外側領域には裏面側発光素子が設けられ、内側領域には放熱部材が設けられている。放熱部材は、基板１から離れるにつれて外側領域の上方に広がるように側面が傾斜した傾斜部を有している。そして、傾斜部は、裏面側発光素子からの光を反射可能な反射構造を有する。   An illumination device according to an embodiment of the present invention includes a substrate, a front surface side light emitting element provided on the surface of the substrate, and a back surface side light emitting element provided on the back surface of the substrate. The back surface of the substrate has an outer region and an inner region, a rear light emitting element is provided in the outer region, and a heat dissipation member is provided in the inner region. The heat radiating member has an inclined portion whose side surface is inclined so as to spread above the outer region as it is separated from the substrate 1. The inclined portion has a reflection structure capable of reflecting light from the back surface side light emitting element.

本発明の一実施形態に係る照明装置の斜視図である。It is a perspective view of the illuminating device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る照明装置を正面から見た平面図である。It is the top view which looked at the illuminating device which concerns on one Embodiment of this invention from the front. 図２の線分Ｘ−Ｘ’における断面図である。FIG. 3 is a sectional view taken along line X-X ′ in FIG. 2. 本発明の一実施形態に係る照明装置に用いた基板を表面側から見た斜視図である。It is the perspective view which looked at the board | substrate used for the illuminating device which concerns on one Embodiment of this invention from the surface side. 本発明の一実施形態に係る照明装置に用いた基板を裏面側から見た斜視図である。It is the perspective view which looked at the board | substrate used for the illuminating device which concerns on one Embodiment of this invention from the back surface side. 本発明の一実施形態に係る照明装置に用いた基板を裏面側から見た平面図である。It is the top view which looked at the board | substrate used for the illuminating device which concerns on one Embodiment of this invention from the back surface side.

以下、図面を参照しながら、本発明に係る照明装置を実施するための形態を説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための例示であって、本発明を以下に限定するものではない。   Hereinafter, an embodiment for carrying out an illumination device according to the present invention will be described with reference to the drawings. However, the form shown below is the illustration for materializing the technical idea of this invention, Comprising: This invention is not limited to the following.

図１に本実施形態に係る照明装置１００の斜視図を、図２に照明装置１００を正面方向から見た平面図を、図３に図２の線分Ｘ−Ｘ’における断面図を、示す。さらに、図４に基板１を表面側から見た斜視図を、図５に基板１を裏面側から見た斜視図を、図６に基板１を裏面側から見た平面図を示す。   FIG. 1 is a perspective view of the illuminating device 100 according to the present embodiment, FIG. 2 is a plan view of the illuminating device 100 viewed from the front, and FIG. 3 is a cross-sectional view taken along line XX ′ in FIG. . 4 is a perspective view of the substrate 1 viewed from the front surface side, FIG. 5 is a perspective view of the substrate 1 viewed from the back surface side, and FIG. 6 is a plan view of the substrate 1 viewed from the back surface side.

各図に示すように、照明装置１００は、基板１と、基板の表面１ａに設けられた表面側発光素子２ａと、基板の裏面１ｂに設けられた裏面側発光素子２ｂと、を備える（（以下、「表面側発光素子２ａ」と「裏面側発光素子２ｂ」とを合わせて「発光素子２」ともいう。）。図６に示すように、基板裏面１ｂは、外側領域１ｂｏ及び内側領域１ｂｉを有し、外側領域１ｂｏには裏面側発光素子２ｂが設けられ、内側領域１ｂｉには放熱部材３が設けられている。図１及び図３に示すように、放熱部材３は、基板１から離れるにつれて外側領域１ｏの上方に広がるように側面が傾斜した傾斜部３ａを有している。傾斜部３ａは、裏面側発光素子２ｂからの光を反射可能な反射構造を有する。これにより、放熱性に優れ且つ広角の配光特性を有するに照明装置とすることができる。以下、その理由について詳細に説明する。   As shown in each drawing, the illumination device 100 includes a substrate 1, a front surface side light emitting element 2a provided on the front surface 1a of the substrate, and a back surface side light emitting element 2b provided on the back surface 1b of the substrate (( Hereinafter, the “front surface side light emitting element 2a” and the “back surface side light emitting element 2b” are collectively referred to as “light emitting element 2.” As shown in FIG. 6, the substrate rear surface 1b includes an outer region 1bo and an inner region 1bi. The outer region 1bo is provided with a back surface side light emitting element 2b, and the inner region 1bi is provided with a heat radiating member 3. As shown in FIGS. As the distance increases, the inclined portion 3a has an inclined portion 3a whose side surface is inclined so as to spread above the outer region 1o, and the inclined portion 3a has a reflective structure capable of reflecting light from the back-side light emitting element 2b. Excellent light distribution and wide-angle light distribution May be illuminating device. Will be described below in detail why.

基板１の両面に発光素子２を設ける場合、基板の片面に発光素子を設ける場合に比べて使用する発光素子２の数は必然的に多くなるので、基板１に生じる熱量も大きくなる。さらに、基板裏面１ｂに発光素子２を設けようとすれば、基板裏面１ｂの全面に放熱部材３を設けることができないので、放熱性の確保がより困難となる。そこで、傾斜部３ａを設けることにより、放熱部材３が単に円柱状等とする場合と比較して、放熱部材３自体の体積を大きくすることができるので、放熱性を向上させることができる。さらに、基板１の両面に発光素子２を設ければ、前方なる正面方向（図３の上方）と後方となる背面方向（図３の下方）の両方に光を放出することができるが、それだけでは十分に広い配光特性を得ることはできない。そこで、照明装置１００では、傾斜部３に反射構造を設けることにより裏面側発光素子２ｂからの光を外側に反射可能なように構成している。これにより、より広角の配光特性が得られる。つまり、放熱部材３に反射構造を有する傾斜部３ａを含ませることで、比較的簡単な構造にも関わらず、放熱性に優れ且つ広角の配光特性を有する照明装置とすることができる。   When the light emitting elements 2 are provided on both sides of the substrate 1, the number of the light emitting elements 2 to be used is inevitably increased as compared with the case where the light emitting elements are provided on one side of the substrate, and the amount of heat generated in the substrate 1 is also increased. Furthermore, if it is going to provide the light emitting element 2 in the board | substrate back surface 1b, since the thermal radiation member 3 cannot be provided in the whole surface of the board | substrate back surface 1b, ensuring of heat dissipation becomes more difficult. Therefore, by providing the inclined portion 3a, it is possible to increase the volume of the heat radiating member 3 itself as compared with the case where the heat radiating member 3 is simply formed in a columnar shape or the like, so that the heat dissipation can be improved. Furthermore, if the light emitting elements 2 are provided on both surfaces of the substrate 1, light can be emitted both in the front direction (upward in FIG. 3) and in the rear direction (downward in FIG. 3). However, a sufficiently wide light distribution characteristic cannot be obtained. Therefore, the illumination device 100 is configured so that the light from the back side light emitting element 2b can be reflected to the outside by providing the inclined portion 3 with a reflection structure. Thereby, a wider-angle light distribution characteristic can be obtained. That is, by including the inclined portion 3a having the reflecting structure in the heat radiating member 3, it is possible to provide an illuminating device that has excellent heat dissipation and wide-angle light distribution characteristics in spite of a relatively simple structure.

以下、照明装置１００を構成する主な部材について説明する。   Hereinafter, main members constituting the illumination device 100 will be described.

（基板１）
基板（発光素子基板）１は、発光素子２を実装するための所謂回路基板である。本実施形態では、基板表面１ａと基板裏面１ｂとに発光素子２を実装する必要があるため、両面に発光素子２を実装するための配線パターンが形成されている。基板１の母材には、ガラスエポキシ等を採用することができるが、放熱性を考慮してアルミニウム等の熱伝導率の高い材料を含めることもできる。 (Substrate 1)
The substrate (light emitting element substrate) 1 is a so-called circuit board for mounting the light emitting element 2. In this embodiment, since it is necessary to mount the light emitting elements 2 on the substrate front surface 1a and the substrate back surface 1b, wiring patterns for mounting the light emitting elements 2 are formed on both surfaces. Glass epoxy or the like can be used as the base material of the substrate 1, but a material having high thermal conductivity such as aluminum can also be included in consideration of heat dissipation.

図６に示すように、基板裏面１ｂは、基板１の周縁を含む外側領域１ｂｏと、基板１の周縁から離間し外側領域１ｂｏの内側に位置する内側領域１ｂｉと、を有する。図６では、外側領域１ｂｏ及び内側領域１ｂｉの位置関係を明確にするために、外側領域１ｂｏを右斜め上に延びる破線で示し、内側領域１ｂｉを左斜め上に延びる破線で示し、両者の境界を破線の円で示しているが、実際にそれらが存在しないことは言うまでもない。   As shown in FIG. 6, the substrate back surface 1 b has an outer region 1 bo that includes the periphery of the substrate 1 and an inner region 1 bi that is separated from the periphery of the substrate 1 and is located inside the outer region 1 bo. In FIG. 6, in order to clarify the positional relationship between the outer region 1bo and the inner region 1bi, the outer region 1bo is indicated by a broken line extending diagonally upward to the right, and the inner region 1bi is indicated by a broken line extending diagonally upward to the left. Are shown by dashed circles, but it goes without saying that they do not actually exist.

（発光素子２）
発光素子２には、典型的には白色の表面実装型のＬＥＤを用いることができる。ここでは、基板表面１ａに実装される表面側発光素子２ａとして９個の上面発光型ＬＥＤ（トップビューＬＥＤ）を用い、基板裏面１ｂに実装される裏面側発光素子２ｂとして６個の上面発光型ＬＥＤ２ｂ１と１６個の側面発光型ＬＥＤ（サイドビューＬＥＤ）２ｂ２とを用いた（特に図４及び図５参照）。ここで、上面発光型ＬＥＤとは基板に対して主に垂直方向に発光可能なＬＥＤをいい、側面発光型ＬＥＤとは基板に対して主に水平方向に発光可能なＬＥＤをいう。なお、図１及び図３では、上面発光型ＬＥＤ２ｂ１と側面発光型ＬＥＤ２ｂ２とをまとめて裏面側発光素子２として示している。 (Light emitting element 2)
The light-emitting element 2 can typically be a white surface-mounted LED. Here, nine top-emitting LEDs (top view LEDs) are used as the surface-side light emitting elements 2a mounted on the substrate surface 1a, and six top-emitting LEDs are used as the back-side light emitting elements 2b mounted on the substrate back surface 1b. The LED 2b1 and 16 side-emitting LEDs (side-view LEDs) 2b2 were used (see particularly FIGS. 4 and 5). Here, the top-emitting LED refers to an LED that can emit light mainly in the vertical direction with respect to the substrate, and the side-emitting LED refers to an LED that can emit light mainly in the horizontal direction with respect to the substrate. In FIG. 1 and FIG. 3, the top-emitting LED 2 b 1 and the side-emitting LED 2 b 2 are collectively shown as the back-side light-emitting element 2.

裏面側発光素子２ｂに上面発光型ＬＥＤを含めることにより、裏面側発光素子２ｂからの光を傾斜部３ａ表面に設けられた反射構造でより反射しやすくすることができる。これにより、斜め後ろ方向又は横方向における配光を強くすることができるので、より広角の配光特性とすることができる。光の反射方向は、反射構造表面の傾斜角で調整することができる。   By including the top emission LED in the back side light emitting element 2b, the light from the back side light emitting element 2b can be more easily reflected by the reflecting structure provided on the surface of the inclined portion 3a. Thereby, since the light distribution in the diagonally backward direction or the horizontal direction can be strengthened, it is possible to obtain a wider-angle light distribution characteristic. The light reflection direction can be adjusted by the inclination angle of the reflection structure surface.

表面側発光素子２ａ又は裏面側発光素子２ｂの少なくとも一方には、側面発光型ＬＥＤを含めることが好ましい（本実施形態では、裏面側発光素子２ｂに側面発光型ＬＥＤ２ｂ２を含めている）。側面発光型ＬＥＤを採用することにより、横方向における配光を強くすることができるので、より広角の配光特性とすることができる。   It is preferable that at least one of the front surface side light emitting element 2a or the back surface side light emitting element 2b includes a side surface light emitting LED (in the present embodiment, the back surface side light emitting element 2b includes the side surface light emitting LED 2b2). By adopting the side-emitting LED, the light distribution in the lateral direction can be strengthened, so that a wider-angle light distribution characteristic can be obtained.

表面側発光素子２ａ又は裏面側発光素子２ｂの少なくとも一方に側面発光型ＬＥＤを含める場合、側面発光型ＬＥＤ２ｂ２は基板１の周縁近傍に配置することができる。これにより、側面発光型ＬＥＤ２ｂ２からの外側への光が基板１に遮られ難くすることができるので、より広角の配光特性とすることができる。また、照明装置１００を駆動させたときに基板１が影になることを抑制することができるので、見た目にも好ましい。   When a side-emitting LED is included in at least one of the front-side light-emitting element 2a or the back-side light-emitting element 2b, the side-emitting LED 2b2 can be disposed near the periphery of the substrate 1. Thereby, since the light to the outer side from the side light emission type LED 2b2 can be made difficult to be blocked by the substrate 1, it is possible to obtain a wider-angle light distribution characteristic. Moreover, since it can suppress that the board | substrate 1 becomes a shadow when the illuminating device 100 is driven, it is preferable also visually.

（放熱部材３）
放熱部材３は、基板裏面１ｂの内側領域１ｂｉに熱的に接続され、基板１を介して主に発光素子２で生じた熱を放熱するための部材である。ここでは、熱伝導率に優れたアルミニウムを用いて放熱部材３を構成し、ビスにより基板１を固定している。照明装置１００では、内側領域１ｂｉの形状（つまり放熱部材３と基板裏面１ｂとの接続領域の形状）を円形としたが、放熱性をより向上させるために、例えば、図６における隣接する２つの上面発光型ＬＥＤ２ｂ２の間の領域において内側領域１ｂｉを側面発光型ＬＥＤ２ｂ２の近傍まで広げることもできる。なお、放熱部材３と内側領域１ｂｉとの間に放熱性に優れた他の部材を介してもよいことは言うまでもない。 (Heat dissipation member 3)
The heat dissipating member 3 is a member that is thermally connected to the inner region 1bi of the substrate back surface 1b and dissipates heat generated mainly by the light emitting element 2 through the substrate 1. Here, the heat radiating member 3 is made of aluminum having excellent thermal conductivity, and the substrate 1 is fixed with screws. In the illumination device 100, the shape of the inner region 1bi (that is, the shape of the connection region between the heat dissipation member 3 and the substrate back surface 1b) is circular. However, in order to further improve heat dissipation, for example, two adjacent regions in FIG. In the region between the top-emitting LEDs 2b2, the inner region 1bi can be extended to the vicinity of the side-emitting LEDs 2b2. Needless to say, another member excellent in heat dissipation may be interposed between the heat dissipation member 3 and the inner region 1bi.

図１及び図３に示すように、放熱部材３は、側面が外側領域１ｂｏの上方を斜めに横切るように傾斜した傾斜部３ａを有する（つまり、傾斜部３ａは基板１から離れるにつれて太くなるように構成される。）。傾斜部３ａにより放熱性を向上させることができる。傾斜部３ａがなく放熱部材３が円柱等である場合に比較して、放熱部材３の体積を大きく確保することができるからである。つまり、放熱部材３を基板裏面１ｂの一領域（内側領域１ｂｉ）にしか接続できないにもかかわらず、放熱性をより向上させることができる。図１及び図３に示すように、本実施形態では、透光カバー８の内側だけでなく外側においても傾斜部（第２傾斜部）形成されている。これにより、放熱部材３の体積をより大きくすることができるので、さらなる放熱性の向上が期待できる。本実施形態では、放熱部材３の体積をより大きくするため、傾斜部３ａが外側領域１ｂｏ上方の全域に亘って内側領域１ｂｉから外側に広がるように構成したが、外側領域１ｂｏ上方において部分的に傾斜部を設けてもよい。さらに、本実施形態では、傾斜部３ａ側面が連続的に傾斜するように構成したが、断続的（階段状）に傾斜させることもできる。   As shown in FIGS. 1 and 3, the heat radiating member 3 has an inclined portion 3 a whose side surface is inclined so as to obliquely cross over the outer region 1 bo (that is, the inclined portion 3 a becomes thicker as the distance from the substrate 1 increases). Configured.). The heat dissipation can be improved by the inclined portion 3a. This is because a larger volume of the heat radiating member 3 can be ensured than when the heat radiating member 3 is a cylinder or the like without the inclined portion 3a. That is, although the heat radiation member 3 can be connected to only one region (inner region 1bi) of the substrate back surface 1b, the heat radiation property can be further improved. As shown in FIGS. 1 and 3, in the present embodiment, an inclined portion (second inclined portion) is formed not only on the inner side but also on the outer side of the translucent cover 8. Thereby, since the volume of the heat radiating member 3 can be made larger, further improvement in heat dissipation can be expected. In the present embodiment, in order to further increase the volume of the heat dissipation member 3, the inclined portion 3a is configured to spread outward from the inner region 1bi over the entire region above the outer region 1bo. An inclined portion may be provided. Further, in the present embodiment, the side surface of the inclined portion 3a is configured to be continuously inclined, but can be inclined intermittently (stepwise).

反射構造は、透光カバー８の内部において、外側領域１ｂｏ上方の全域に亘って内側領域１ｂｉから外側に広がるように構成されることが好ましい。裏面側発光素子２ｂからの光を反射構造でより反射させることができるからである。また、放熱部材３を構成する材料が光反射性材料である場合はその表面を反射構造としてそのまま利用することもできるが、反射率を向上させるために、反射構造として、白色粉体塗装等を傾斜部３ａに施したり光反射性部材で傾斜部３ａを被覆することもできる。本実施形態では、反射構造の表面積をより大きくするため、反射構造が外側領域１ｂｏ上方の全域に亘って内側領域１ｂｉから外側に広がるように構成したが、外側領域１ｂｏ上方において部分的に反射構造を設けてもよい。さらに、本実施形態では、反射構造の表面が連続的に傾斜するように構成したが、断続的（階段状）に傾斜させることもできる。
る。 The reflecting structure is preferably configured to spread outward from the inner region 1bi over the entire region above the outer region 1bo inside the light-transmitting cover 8. This is because the light from the back surface side light emitting element 2b can be more reflected by the reflecting structure. Moreover, when the material which comprises the heat radiating member 3 is a light reflective material, the surface can also be utilized as it is as a reflective structure, but in order to improve a reflectance, white powder coating etc. are used as a reflective structure. The inclined portion 3a can be applied to the inclined portion 3a or covered with the light reflecting member. In the present embodiment, in order to increase the surface area of the reflecting structure, the reflecting structure is configured to spread outward from the inner area 1bi over the entire area above the outer area 1bo, but the reflecting structure is partially partially above the outer area 1bo. May be provided. Furthermore, in this embodiment, although it comprised so that the surface of a reflective structure might incline continuously, it can also make it incline intermittently (step shape).
The

図３に示すように、放熱部材３に貫通孔を設けることができる。本実施形態では、貫通孔には絶縁部材５を介して基板（電源基板）６が挿入されており、基板６には発光素子２を駆動するために必要なＡＣ−ＤＣ変換回路等の電子部品（図示せず）が実装されている。照明装置１００がＡＣ−ＤＣ変換回路を有することにより、家庭用の交流電源をそのまま用いることができる。なお、基板６はワイヤ（図示せず）にて基板１と電気的に接続されている。   As shown in FIG. 3, the heat radiating member 3 can be provided with a through hole. In the present embodiment, a substrate (power supply substrate) 6 is inserted into the through hole via an insulating member 5, and an electronic component such as an AC-DC conversion circuit necessary for driving the light emitting element 2 is inserted into the substrate 6. (Not shown) is mounted. When the lighting device 100 includes the AC-DC conversion circuit, a home AC power source can be used as it is. The substrate 6 is electrically connected to the substrate 1 with a wire (not shown).

（口金７）
図１及び図３に示すように、照明装置１００は、口金７を有することができる。ここでは、基板１が設けられた側と反対側において放熱部材３に口金７が設けられている。照明装置１００が口金７を備えることにより、既存の白熱電球等用のソケットに照明装置１００を装着することができる。ここでは、絶縁部材５が放熱部材３の外側まで延在しており、延在部分が口金７に挿入されることにより、両者が固定されている。口金７はワイヤ（図示せず）にて基板６と電気的に接続されている。 (Base 7)
As shown in FIGS. 1 and 3, the lighting device 100 can have a base 7. Here, a base 7 is provided on the heat dissipating member 3 on the side opposite to the side on which the substrate 1 is provided. Since the lighting device 100 includes the base 7, the lighting device 100 can be attached to an existing socket for an incandescent lamp or the like. Here, the insulating member 5 extends to the outside of the heat dissipating member 3, and both are fixed by inserting the extending portion into the base 7. The base 7 is electrically connected to the substrate 6 by a wire (not shown).

（透光カバー８）
図１及び図３に示すように、照明装置１００は、透光カバー８を有することができる。透光カバー８は、傾斜部３ａと基板１を覆う部材であり、発光素子２からの光の少なくとも一部を外部に透過可能な材料で構成される。観測者から見て、発光素子２からの光が透光カバー８を介してより均一に見えるように、透光カバー８には粒子状の光拡散剤を含有させたりサンドブラスト処理等を施すことが好ましい。透光カバー８を構成する材料としては、例えば、ポリカーボネート樹脂（ＰＣ）やポリメタクリル酸樹脂（ＰＭＭＡ）を用いることができる。本実施形態では、ポリメタクリル酸樹脂（ＰＭＭＡ）から構成されサンドブラスト処理した透光カバー８を用いた。 (Translucent cover 8)
As shown in FIGS. 1 and 3, the lighting device 100 can include a light-transmitting cover 8. The translucent cover 8 is a member that covers the inclined portion 3a and the substrate 1, and is made of a material that can transmit at least part of the light from the light emitting element 2 to the outside. From the viewpoint of the observer, the light-transmitting cover 8 may contain a particulate light diffusing agent or be subjected to sandblasting so that the light from the light-emitting element 2 can be seen more uniformly through the light-transmitting cover 8. preferable. As a material constituting the translucent cover 8, for example, polycarbonate resin (PC) or polymethacrylic acid resin (PMMA) can be used. In the present embodiment, a translucent cover 8 made of polymethacrylic acid resin (PMMA) and subjected to sandblasting is used.

図１〜３に示すように、透光カバー８は、基板１の周縁と離間するようにして設けることができる。基板１と透光カバー８を直接接続して両者を固定する手段も考えられるが、係る場合だと、基板１の部分が影になり透光カバー８からの光を均一に見せることができない。そこで、両者を離間させることで、透光カバー８内部において発光素子２からの光が基板近傍において拡散しやすくなり、より均一に発光させることができる。特に、発光素子２として側面発光型ＬＥＤを用いる場合は、側面発光型ＬＥＤと透光カバー８との距離が近いと、外部から発光点が比較的明確に認識されるので、両者の距離を十分に取ることが重要である。   As shown in FIGS. 1 to 3, the translucent cover 8 can be provided so as to be separated from the periphery of the substrate 1. A means for directly connecting the substrate 1 and the translucent cover 8 and fixing them may be considered. However, in such a case, the portion of the substrate 1 becomes a shadow and the light from the translucent cover 8 cannot be shown uniformly. Therefore, by separating them from each other, the light from the light emitting element 2 is easily diffused in the vicinity of the substrate inside the translucent cover 8, and light can be emitted more uniformly. In particular, when a side-emitting LED is used as the light emitting element 2, if the distance between the side-emitting LED and the translucent cover 8 is short, the light emitting point is recognized relatively clearly from the outside. It is important to take

１００…照明装置
１…基板（発光素子基板）
１ａ…基板表面
１ｂ…基板裏面
２…発光素子
２ａ…表面側発光素子
２ｂ…裏面側発光素子
３…放熱部材
３ａ…傾斜部
４…ビス
５…絶縁部材
６…基板（電源基板）
７…口金
８…透光カバー DESCRIPTION OF SYMBOLS 100 ... Illuminating device 1 ... Substrate (light emitting element substrate)
DESCRIPTION OF SYMBOLS 1a ... Substrate surface 1b ... Substrate back surface 2 ... Light emitting element 2a ... Front side light emitting element 2b ... Back side light emitting element 3 ... Heat radiation member 3a ... Inclined part 4 ... Screw 5 ... Insulating member 6 ... Substrate (power supply substrate)
7 ... base 8 ... translucent cover

Claims (6)

基板と、前記基板の表面に設けられた表面側発光素子と、前記基板の裏面に設けられた裏面側発光素子と、を備える照明装置であって、
前記基板の裏面は、外側領域及び内側領域を有し、
前記外側領域には、前記裏面側発光素子が設けられ、
前記内側領域には、放熱部材が設けられ、
前記放熱部材は、前記基板から離れるにつれて前記外側領域の上方に広がるように側面が傾斜した傾斜部を有しており、
前記傾斜部は、前記裏面側発光素子からの光を反射可能な反射構造を有することを特徴とする照明装置。 A lighting device comprising: a substrate; a front side light emitting element provided on a surface of the substrate; and a back side light emitting element provided on a back surface of the substrate,
The back surface of the substrate has an outer region and an inner region,
In the outer region, the back side light emitting element is provided,
In the inner region, a heat dissipation member is provided,
The heat radiating member has an inclined portion whose side surface is inclined so as to spread above the outer region as the distance from the substrate increases.
The inclined unit has a reflecting structure capable of reflecting light from the back surface side light emitting element. 前記表面側発光素子又は前記裏面側発光素子の少なくとも一方は、側面発光型ＬＥＤを含むことを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein at least one of the front surface side light emitting element or the back surface side light emitting element includes a side light emitting LED. 前記側面発光型ＬＥＤは、前記基板の周縁近傍に配置されている請求項３に記載の照明装置。   The lighting device according to claim 3, wherein the side-emitting LED is disposed in the vicinity of the periphery of the substrate. 前記照明装置は、前記表面側発光素子及び前記裏面側発光素子からの光を透過する透光カバーを備え、
前記透光カバーは、前記基板の周縁と離間して配置されていることを特徴とする請求項１から３のいずれかに記載の照明装置。 The lighting device includes a translucent cover that transmits light from the front surface side light emitting element and the back surface side light emitting element,
The lighting device according to claim 1, wherein the translucent cover is disposed apart from a peripheral edge of the substrate. 前記裏面側発光素子は、上面発光型ＬＥＤを含むことを特徴とする請求項１から４のいずれかに記載の照明装置。   The lighting device according to claim 1, wherein the back-side light emitting element includes a top-emitting LED. 前記放熱部材は、前記基板と反対側に口金を有することを特徴とする請求項１から５のいずれかに記載の照明装置。   The lighting device according to claim 1, wherein the heat radiating member has a base on a side opposite to the substrate.
JP2011142490A 2011-06-28 2011-06-28 Illumination device Pending JP2013012305A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185374A (en) * 2014-03-24 2015-10-22 アイリスオーヤマ株式会社 Led lighting fixture and led lighting device
JP2020115436A (en) * 2019-01-18 2020-07-30 パナソニックＩｐマネジメント株式会社 Illuminating device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348252U (en) * 1989-09-16 1991-05-08
US5929788A (en) * 1997-12-30 1999-07-27 Star Headlight & Lantern Co. Warning beacon
JP2002525814A (en) * 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED bulb
JP2010262780A (en) * 2009-04-30 2010-11-18 Toshiba Lighting & Technology Corp Lamp device, and lighting fixture
JP2012181969A (en) * 2011-02-28 2012-09-20 Toshiba Lighting & Technology Corp Bulb type light-emitting element lamp, and lighting fixture
JP2012248533A (en) * 2011-05-25 2012-12-13 Seoul Semiconductor Co Ltd Led lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348252U (en) * 1989-09-16 1991-05-08
US5929788A (en) * 1997-12-30 1999-07-27 Star Headlight & Lantern Co. Warning beacon
JP2002525814A (en) * 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED bulb
JP2010262780A (en) * 2009-04-30 2010-11-18 Toshiba Lighting & Technology Corp Lamp device, and lighting fixture
JP2012181969A (en) * 2011-02-28 2012-09-20 Toshiba Lighting & Technology Corp Bulb type light-emitting element lamp, and lighting fixture
JP2012248533A (en) * 2011-05-25 2012-12-13 Seoul Semiconductor Co Ltd Led lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185374A (en) * 2014-03-24 2015-10-22 アイリスオーヤマ株式会社 Led lighting fixture and led lighting device
JP2020115436A (en) * 2019-01-18 2020-07-30 パナソニックＩｐマネジメント株式会社 Illuminating device
JP7394369B2 (en) 2019-01-18 2023-12-08 パナソニックＩｐマネジメント株式会社 lighting equipment

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