JP2012243487A - Socket for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component having an electronic component such as an IC chip mounted therein, in which shield performance to an intermediate member interposed between the electronic component and a main substrate is improved.SOLUTION: An electronic component support part 5a by which an electronic component 30 is supported and a connection member mounting part 6a on which a connection member 20 is mounted are provided in an insulating housing 2. A first metal plate 3 and a second metal plate 4 are provided between the component support part 5a and the connection member mounting part 6a, and an intermediate terminal 10 is held by through-holes 7 and 8 formed in respective metal plates 3 and 4 via an insulator 15. A side part shield surface 3c is folded to the first metal plate 3, and a side part of the connection member mounting part 6a is covered with the side part shield surface 3c. The connection member 20 allows enhancing a shield effect by covering the upper surface and the side part with the metal plate.

Description

本発明は、下面に複数の電極部を有するＩＣチップなどの電子部品をメイン基板に実装するための電子部品用ソケットに係り、特に、導通部のシールド性能を向上させた電子部品用ソケットに関する。   The present invention relates to an electronic component socket for mounting an electronic component such as an IC chip having a plurality of electrode portions on its lower surface on a main substrate, and more particularly to an electronic component socket with improved shielding performance of a conducting portion.

以下の特許文献１に記載されたＩＣソケットは、上面に現れる接続端子よりも下面に現れる接続端子のピッチが広げられた信号変換用基板を有している。下面に複数の電極部を有するＩＣデバイスが、信号変換用基板の上方に配置され、ＩＣデバイスの電極部と、信号変換用基板の上面の接続端子とが、デバイス側コンタクトソケットを介して接続される。信号変換用基板はソケットボード基板の上に実装され、ソケットボード基板に設けられた接続端子と、信号変換用基板の下面の接続端子とが、ソケットボード側コンタクトソケットを介して接続される。   The IC socket described in the following Patent Document 1 has a signal conversion substrate in which the pitch of the connection terminals appearing on the lower surface is wider than the connection terminals appearing on the upper surface. An IC device having a plurality of electrode portions on the lower surface is disposed above the signal conversion substrate, and the electrode portion of the IC device and the connection terminal on the upper surface of the signal conversion substrate are connected via a device-side contact socket. The The signal conversion board is mounted on the socket board board, and the connection terminals provided on the socket board board and the connection terminals on the lower surface of the signal conversion board are connected via the socket board side contact socket.

特許文献２に記載されたＩＣソケットは、特許文献１に記載されたものと実質的に同じ構造であり、ＩＣチップを保持する凹部を有する構造物の下に、上部パッドと下部パッドのピッチが相違するアダプタボードが設けられ、メイン基板とアダプタボードとの間がコネクタを介在して接続される。   The IC socket described in Patent Document 2 has substantially the same structure as that described in Patent Document 1, and the pitch between the upper pad and the lower pad is below the structure having a recess for holding the IC chip. Different adapter boards are provided, and the main board and the adapter board are connected via a connector.

特開２００４−１３８５５２号公報JP 2004-138552 A 米国特許公開公報 ２０１０／０２１６３２０US Patent Publication 2010/0216320

特許文献１に記載されたＩＣソケットに、信号変換用基板が設けられ、特許文献２に記載されたＩＣソケットに、アダプタボードが設けられていることによって、共に下面に設けられた電極部の配列ピッチが短いＩＣデバイスまたはＩＣチップを、接続端子の配置ピッチが広いソケットボード基板またはメイン基板に実装することが可能になる。   An IC socket described in Patent Document 1 is provided with a signal conversion board, and an IC board described in Patent Document 2 is provided with an adapter board. An IC device or IC chip having a short pitch can be mounted on a socket board substrate or a main substrate having a wide arrangement pitch of connection terminals.

ソケットボード基板またはメイン基板は、一般に多層基板により形成されるが、その表面の接続端子の配列ピッチを広くすることで、これら基板の層数を削減でき、基板の製造価格の上昇を抑制できるようになる。   The socket board substrate or the main substrate is generally formed of a multilayer substrate, but by increasing the arrangement pitch of the connection terminals on the surface, the number of layers of these substrates can be reduced, and an increase in the manufacturing cost of the substrate can be suppressed. become.

しかしながら、これらのＩＣソケットでは、ＩＣデバイスまたはＩＣチップと、ソケットボード基板またはメイン基板との間に、複数段階の接触導通部が介在しているために、ＩＣデバイスまたはＩＣチップの信号経路に外部ノイズが重畳しやすい課題を有している。特に、今後のＩＣデバイスまたはＩＣチップは信号の転送レートが早く、使用する信号の周波数帯が高くなるため、外部ノイズの影響を受けやすくなって、電子機器の動作不良の原因となりやすくなる。   However, in these IC sockets, since a multi-stage contact conducting portion is interposed between the IC device or IC chip and the socket board substrate or main substrate, the signal path of the IC device or IC chip is externally provided. There is a problem that noise is easily superimposed. In particular, a future IC device or IC chip has a high signal transfer rate and a high frequency band of signals to be used. Therefore, the IC device or IC chip is easily affected by external noise, and easily causes an electronic device to malfunction.

本発明は、上記従来の課題を解決するものであり、ＩＣチップなどの電子部品に与えられる信号経路が外部ノイズの影響を受けにくい構造の電子部品用ソケットを提供することを目的としている。   SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a socket for an electronic component having a structure in which a signal path given to an electronic component such as an IC chip is hardly affected by external noise.

本発明は、下面に複数の部品電極部を有する電子部品が設置される部品支持部と、上面に複数の上部接続電極部を有し下面に複数の下部接続電極部を有する接続部材が設置される接続部材装着部とが設けられた電子部品用ソケットにおいて、
絶縁性のハウジングが設けられ、前記ハウジングの上側に前記部品支持部が、下側に前記接続部材装着部が形成され、前記部品支持部と前記接続部材装着部との間に、金属板で形成された端子保持部が位置し、前記端子保持部に複数の貫通穴が形成されて、それぞれの貫通穴に、前記部品電極部と前記上部接続電極部とを導通させる中間端子が、絶縁体を介して保持されており、
前記金属板が前記端子保持部の側方で折り曲げられてシールド面が形成され、このシールド面が、前記接続部材装着部の側部に位置していることを特徴とするものである。 In the present invention, a component support portion on which an electronic component having a plurality of component electrode portions on the lower surface is installed, and a connection member having a plurality of upper connection electrode portions on the upper surface and a plurality of lower connection electrode portions on the lower surface are installed. In a socket for an electronic component provided with a connecting member mounting portion
An insulating housing is provided, the component support portion is formed on the upper side of the housing, the connection member mounting portion is formed on the lower side, and a metal plate is formed between the component support portion and the connection member mounting portion. A plurality of through holes are formed in the terminal holding part, and an intermediate terminal for conducting the component electrode part and the upper connection electrode part in each through hole is provided with an insulator. Is held through
The metal plate is bent at a side of the terminal holding portion to form a shield surface, and the shield surface is located on a side portion of the connection member mounting portion.

本発明の電子部品用ソケットは、電子部品と接続部材とを導通させる中間端子が金属板の穴を貫通して配置されているため、複数の中間端子どうしが金属板でシールドされることになり、中間端子で伝送される信号がノイズの影響を受けにくくなる。また、金属板にシールド面が形成され、接続部材の上部のみならず側部が金属板で覆われるため、接続部材と中間端子との接続部や内部の配線部が、外部ノイズの影響を受けにくくなる。   In the socket for electronic parts of the present invention, since the intermediate terminals for conducting the electronic parts and the connection member are disposed through the holes of the metal plate, the plurality of intermediate terminals are shielded by the metal plate. The signal transmitted at the intermediate terminal is less susceptible to noise. In addition, since a shield surface is formed on the metal plate and not only the upper part of the connection member but also the side part is covered with the metal plate, the connection part between the connection member and the intermediate terminal and the internal wiring part are affected by external noise. It becomes difficult.

本発明の電子部品用ソケットは、前記ハウジングが合成樹脂で形成されて、前記金属板が前記ハウジングに埋設されており、前記ハウジングの上部に支持側壁部で囲まれた上側凹部が形成されて、前記部品支持部が前記上側凹部の内部に形成され、前記ハウジングの下部に装着側壁部で囲まれた下側凹部が形成されて、前記接続部材装着部が前記下側凹部の内部に形成されており、前記上側凹部と前記下側凹部とが前記金属板で仕切られている。   In the electronic component socket according to the present invention, the housing is formed of a synthetic resin, the metal plate is embedded in the housing, and an upper concave portion surrounded by a supporting side wall is formed at an upper portion of the housing. The component support portion is formed in the upper recess, a lower recess surrounded by a mounting side wall is formed in the lower portion of the housing, and the connection member mounting portion is formed in the lower recess. The upper concave portion and the lower concave portion are partitioned by the metal plate.

本発明の電子部品用ソケットは、部品支持部を形成する上側凹部と接続部材装着部を形成する下側凹部とが金属板で区切られているため、この金属板でシールド効果を高めることができる。   In the electronic component socket according to the present invention, the upper concave portion forming the component supporting portion and the lower concave portion forming the connection member mounting portion are separated by the metal plate, so that the shielding effect can be enhanced by the metal plate. .

本発明は、前記接続部材装着部の４つの側部に前記シールド面が位置しているものが好ましい。この構成では、接続部材の上面と４つの側部が金属板で囲まれることになり、接続部材に対するシールド効果を高めることが可能である。   In the present invention, it is preferable that the shield surface is located on four side portions of the connection member mounting portion. In this configuration, the upper surface and the four side portions of the connection member are surrounded by the metal plate, and the shielding effect on the connection member can be enhanced.

本発明は、前記部品支持部と前記接続部材装着部との間に、前記金属板が複数枚設けられ、少なくとも１枚の金属板から前記シールド面が折り曲げられているものとして構成できる。   The present invention can be configured such that a plurality of the metal plates are provided between the component support portion and the connection member mounting portion, and the shield surface is bent from at least one metal plate.

部品支持部と接続部材装着部との間に位置する端子保持部を複数枚の金属板で構成することにより、端子保持部の強度を高めることができ、複数の中間端子を絶縁体を介して保持する保持強度が高くなる。また、金属板を複数枚介在させることで、接続部材に対するシールド効果をさらに高めることができる。   By configuring the terminal holding portion located between the component support portion and the connection member mounting portion with a plurality of metal plates, the strength of the terminal holding portion can be increased, and the plurality of intermediate terminals can be connected via an insulator. The holding strength to hold becomes high. Moreover, the shielding effect with respect to a connection member can further be improved by interposing a plurality of metal plates.

本発明は、前記接続部材は、その内部に上部接続電極部と下部接続電極部とを導通させる配線部が設けられ、上部接続電極部の配列ピッチよりも下部接続電極部の配列ピッチが広く形成されているものが好ましい。   In the present invention, the connection member is provided with a wiring portion for conducting the upper connection electrode portion and the lower connection electrode portion therein, and the arrangement pitch of the lower connection electrode portions is wider than the arrangement pitch of the upper connection electrode portions. What is done is preferable.

上記接続部材を使用すると、この接続部材が実装されるメイン基板の表面のメイン電極部のピッチを、電子部品の部品電極部のピッチよりも広げることができ、多層基板であるメイン基板の層の数を減らして、メイン基板のコストを低減させることが可能になる。   When the connection member is used, the pitch of the main electrode part on the surface of the main board on which the connection member is mounted can be made wider than the pitch of the component electrode part of the electronic component. By reducing the number, the cost of the main board can be reduced.

この場合に、前記金属板は、前記端子保持部の周囲に天井シールド面を有しており、前記接続部材装着部が前記部品支持部から側方に張り出し、前記天井シールド面が、張り出した部分の前記接続部材装着部の天井部に位置しているものとして構成される。   In this case, the metal plate has a ceiling shield surface around the terminal holding portion, the connection member mounting portion protrudes laterally from the component support portion, and the ceiling shield surface extends. It is comprised as what is located in the ceiling part of the said connection member mounting part.

金属板に天井シールド面を配置することで、接続部材装着部の張り出した部に対するシールド効果を高めることができる。   By arranging the ceiling shield surface on the metal plate, it is possible to enhance the shielding effect for the protruding portion of the connecting member mounting portion.

本発明は、前記金属板の一部がいずれかの中間端子に導通して、接地電位に設定可能とすることが可能である。   According to the present invention, a part of the metal plate can be conducted to any one of the intermediate terminals, and can be set to the ground potential.

本発明は、部品支持部と接続部材設置部との間が、金属板で仕切られた構造であるため、接続部材に対するシールド効果を高めることができ、電子部品への信号経路をノイズの影響から守りやすくなる。   Since the present invention has a structure in which the component support portion and the connection member installation portion are partitioned by a metal plate, the shielding effect for the connection member can be enhanced, and the signal path to the electronic component can be reduced from the influence of noise. It becomes easy to protect.

本発明の実施の形態の電子部品用ソケットの斜視図、The perspective view of the socket for electronic components of embodiment of this invention, 本発明の実施の形態の電子部品用ソケットと、その接続部材装着部に装着される接続部材を示すものであり、図１のＩＩ−ＩＩ線の断面図、1 is a cross-sectional view taken along line II-II in FIG. 1, showing a socket for electronic components according to an embodiment of the present invention and a connection member mounted on the connection member mounting portion; 本発明の実施の形態の電子部品用ソケットに接続部材が装着された状態を示す断面図、Sectional drawing which shows the state by which the connection member was mounted | worn with the socket for electronic components of embodiment of this invention, 接続部材と２枚の金属板を示す分解斜視図、An exploded perspective view showing a connecting member and two metal plates; 第１の金属板の平面図、A plan view of the first metal plate; 第１の金属板と、複数の中間端子を保持した絶縁体とを示す分解斜視図、An exploded perspective view showing a first metal plate and an insulator holding a plurality of intermediate terminals;

図１ないし図３に示すように、本発明の実施の形態の電子部品用ソケット１は、絶縁性のハウジング２と、このハウジング２に埋設された第１の金属板３および第２の金属板４を有している。ハウジング２と２つの金属板３，４はいわゆるインサート成型法によって一体化されている。すなわち、第１の金属板３と第２の金属板４とが合わされて金型のキャビティの内部に支持された状態で、キャビティ内に溶融樹脂が射出され、金属板３，４を埋設したハウジング２が形成される。第１の金属板３と第２の金属板４は合わされているため、互いに電気的に導通している。   As shown in FIGS. 1 to 3, an electronic component socket 1 according to an embodiment of the present invention includes an insulating housing 2, a first metal plate 3 and a second metal plate embedded in the housing 2. 4. The housing 2 and the two metal plates 3 and 4 are integrated by a so-called insert molding method. That is, the housing in which the molten metal is injected into the cavity and the metal plates 3 and 4 are embedded in a state where the first metal plate 3 and the second metal plate 4 are combined and supported inside the cavity of the mold. 2 is formed. Since the first metal plate 3 and the second metal plate 4 are combined, they are electrically connected to each other.

図１ないし図３に示すように、ハウジング２の上部に支持側壁部２ａが形成されており、この支持側壁部２ａで４面が囲まれた上側凹部５が形成されている。４面の支持側壁部２ａのそれぞれの内側面に段差底部２ｂが形成されており、上側凹部５は、段差底部２ｂよりも上側の部分が部品支持部５ａとなり、段差底部２ｂよりも下側の部分が端子変形空間５ｂとなっている。第１の金属板３と第２の金属板４の一部は、上側凹部５の底部すなわち端子変形空間５ｂの底部に位置している。   As shown in FIGS. 1 to 3, a support side wall 2 a is formed on the upper portion of the housing 2, and an upper recess 5 having four sides surrounded by the support side wall 2 a is formed. A step bottom 2b is formed on each inner side surface of the four support side walls 2a, and the upper recess 5 is a part support 5a at a portion above the step bottom 2b, and is located below the step bottom 2b. The portion is a terminal deformation space 5b. Part of the first metal plate 3 and the second metal plate 4 is located at the bottom of the upper recess 5, that is, the bottom of the terminal deformation space 5b.

図２と図３に示すように、ハウジング２には、支持側壁部２ａからさらに４方向の外側に張り出す天井壁部２ｃが形成され、天井壁部２ｃの周囲から下側に延びる装着側壁部２ｄが一体に形成されて、装着側壁部２ｄで４面が囲まれた下側凹部６が形成されている。下側凹部６は、天井壁部２ｃの下面２ｅよりも下側の部分が接続部材装着部６ａとなり、前記下面２ｅよりも上側の部分が端子接続空間６ｂとなっている。ハウジング２は、接続部品装着部６ａが部品支持部５ａよりも外周側に張り出した構造である。   As shown in FIGS. 2 and 3, the housing 2 is formed with a ceiling wall portion 2 c that extends further outward in four directions from the support side wall portion 2 a, and the mounting sidewall portion extends downward from the periphery of the ceiling wall portion 2 c. 2d is integrally formed, and a lower concave portion 6 is formed in which four surfaces are surrounded by the mounting side wall portion 2d. In the lower concave portion 6, a portion below the lower surface 2e of the ceiling wall portion 2c serves as a connection member mounting portion 6a, and a portion above the lower surface 2e serves as a terminal connection space 6b. The housing 2 has a structure in which the connection component mounting portion 6a projects to the outer peripheral side from the component support portion 5a.

合成樹脂製のハウジング２の内部では、上側凹部５と下側凹部６とが連通しており、上側凹部５と下側凹部６とが、第１の金属板３および第２の金属板４で仕切られている。   Inside the synthetic resin housing 2, the upper concave portion 5 and the lower concave portion 6 communicate with each other, and the upper concave portion 5 and the lower concave portion 6 are formed by the first metal plate 3 and the second metal plate 4. It is partitioned.

第１の金属板３と第２の金属板４は、鋼板などの比較的低抵抗の金属板で構成されている。   The 1st metal plate 3 and the 2nd metal plate 4 are comprised with the metal plate of comparatively low resistance, such as a steel plate.

図４と図５に示すように、第１の金属板３は、平面で見た形状が矩形状である。第１の金属板３の中央部に、小さな面積の矩形状の中央開口部３ａが形成され、中央開口部３ａを囲む矩形状の領域が、端子保持部３ｂとなっている。端子保持部３ｂである矩形状の領域の全域に、複数の貫通穴７が規則的に並んで設けられている。貫通穴７は、第１の金属板３を貫通する長方形の穴である。   As shown in FIGS. 4 and 5, the first metal plate 3 has a rectangular shape when viewed in plan. A rectangular central opening 3a having a small area is formed in the central portion of the first metal plate 3, and a rectangular region surrounding the central opening 3a is a terminal holding portion 3b. A plurality of through-holes 7 are regularly arranged in the entire rectangular region that is the terminal holding portion 3b. The through hole 7 is a rectangular hole that penetrates the first metal plate 3.

図４と図５に示すように、第１の金属板３には、端子保持部３ｂと同一面で且つ端子保持部３ｂから４方向の側方に延びる天井シールド面３ｄが設けられている。天井シールド面３ｄには貫通穴７が形成されていない。端子保持部３ｂから４方向の側方へ離れた位置に、天井シールド面３ｄからほぼ直角に折り曲げられた４面の側部シールド面３ｃが形成されている。   As shown in FIGS. 4 and 5, the first metal plate 3 is provided with a ceiling shield surface 3d that is flush with the terminal holding portion 3b and extends laterally in four directions from the terminal holding portion 3b. The through hole 7 is not formed in the ceiling shield surface 3d. Four side shield surfaces 3c that are bent substantially perpendicularly from the ceiling shield surface 3d are formed at positions away from the terminal holding portions 3b in the four directions.

図４に示すように、第２の金属板４は平板であり、第１の金属板３から側部シールド面３ｃを削除したものと同じ形状で同じ大きさである。第２の金属板４は、中央部に矩形状の中央開口部４ａが形成されている。中央開口部４ａの周囲の矩形状の領域が端子保持部４ｂであり、その外周部に天井シールド面４ｄが一体に形成されている。中央開口部４ａおよび端子保持部４ｂの形状と大きさは、第１の金属板３の中央開口部３ａならびに端子保持部３ｂと同じである。   As shown in FIG. 4, the second metal plate 4 is a flat plate, and has the same shape and the same size as those obtained by removing the side shield surface 3 c from the first metal plate 3. The second metal plate 4 has a rectangular center opening 4a formed at the center. A rectangular region around the central opening 4a is a terminal holding portion 4b, and a ceiling shield surface 4d is integrally formed on the outer periphery thereof. The shape and size of the central opening 4a and the terminal holding part 4b are the same as the central opening 3a and the terminal holding part 3b of the first metal plate 3.

図２と図３に示すように、第２の金属板４の端子保持部４ｂに複数の貫通穴８が形成されている。この貫通穴８の開口面積と形状、ならびに配列状態は、第１の金属板３の端子保持部３ｂに形成された貫通穴７と同じである。   As shown in FIGS. 2 and 3, a plurality of through holes 8 are formed in the terminal holding portion 4 b of the second metal plate 4. The opening area, shape, and arrangement state of the through holes 8 are the same as those of the through holes 7 formed in the terminal holding portion 3 b of the first metal plate 3.

第１の金属板３と第２の金属板４は、中央開口部３ａと中央開口部４ａとが一致し、複数の貫通穴７と複数の貫通穴８が個別に一致するように重ねられて、金型のキャビティ内に保持される。なお、第２の金属板４は第１の金属板３の下面側に重ねられる。そして、キャビティ内に溶融樹脂が射出されてハウジング２が成型される。   The first metal plate 3 and the second metal plate 4 are overlapped so that the central opening 3a and the central opening 4a are aligned, and the plurality of through holes 7 and the plurality of through holes 8 are individually aligned. Held in the mold cavity. The second metal plate 4 is stacked on the lower surface side of the first metal plate 3. Then, the molten resin is injected into the cavity to mold the housing 2.

上記工程で成型された電子部品用ソケット１は、図１ないし図３に示すように、第１の金属板３の中央開口部３ａおよび端子保持部３ｂと、第２の金属板４の中央開口部４ａおよび端子保持部４ｂとが、上側凹部５と下側凹部６との境界部に位置する。   As shown in FIG. 1 to FIG. 3, the electronic component socket 1 molded in the above process includes a central opening 3 a and a terminal holding portion 3 b of the first metal plate 3, and a central opening of the second metal plate 4. The part 4 a and the terminal holding part 4 b are located at the boundary between the upper recess 5 and the lower recess 6.

第１の金属板３の天井シールド面３ｄと第２の金属板４の天井シールド面４ｄは、ハウジング２の天井壁部２ｃの上に位置し、第１の金属板３の天井シールド面３ｄが天井壁部２ｃの最表面に現れる。また、第１の金属板３の側部シールド面３ｃが、装着側壁部２ｄの表面に現れる。部品支持部５ａよりも周囲に張り出した形状の接続部材装着部６ａは、天井部と４面の側部が金属板で覆われることになる。   The ceiling shield surface 3d of the first metal plate 3 and the ceiling shield surface 4d of the second metal plate 4 are located on the ceiling wall portion 2c of the housing 2, and the ceiling shield surface 3d of the first metal plate 3 is It appears on the outermost surface of the ceiling wall 2c. Further, the side shield surface 3c of the first metal plate 3 appears on the surface of the mounting side wall 2d. The connecting member mounting portion 6a having a shape projecting to the periphery of the component support portion 5a is covered with a metal plate at the ceiling and the four sides.

ハウジング２に埋設された第１の金属板３の端子保持部３ｂと第２の金属板４の端子保持部４ｂに、複数の中間端子１０が保持されている。中間端子１０は、端子保持部３ｂおよび端子保持部４ｂの領域の全域に配置されているが、図２と図３には、図示の都合上一部の中間端子１０のみが図示されている。   A plurality of intermediate terminals 10 are held by the terminal holding portion 3 b of the first metal plate 3 and the terminal holding portion 4 b of the second metal plate 4 embedded in the housing 2. The intermediate terminals 10 are arranged in the entire region of the terminal holding portion 3b and the terminal holding portion 4b, but only some of the intermediate terminals 10 are shown in FIGS. 2 and 3 for convenience of illustration.

図６に示すように、複数の中間端子１０は、合成樹脂材料で形成された絶縁体１５に保持されている。絶縁体１５は細長い棒形状であり、上下に貫通する保持穴１５ａが、長手方向に向けて一定のピッチで開口している。それぞれの中間端子１０は、保持穴１５ａに個別に圧入されて保持されている。あるいは、いわゆるインサート成型法で、絶縁体１５と中間端子１０とが一体化されている。   As shown in FIG. 6, the plurality of intermediate terminals 10 are held by an insulator 15 formed of a synthetic resin material. The insulator 15 has an elongated bar shape, and holding holes 15a penetrating vertically are opened at a constant pitch in the longitudinal direction. Each intermediate terminal 10 is individually press-fitted and held in the holding hole 15a. Alternatively, the insulator 15 and the intermediate terminal 10 are integrated by a so-called insert molding method.

図６に示すように、絶縁体１５に、長手方向の幅寸法が一定の値Ｗとなるように区分されて下向きに突出する複数の凸部１５ｂが一体に形成されている。それぞれの凸部１５ｂには、２個の保持穴１５ａが含まれ、絶縁体１５は、幅寸法Ｗの範囲にそれぞれ２組の中間端子１０を保持している。   As shown in FIG. 6, the insulator 15 is integrally formed with a plurality of convex portions 15 b that are sectioned so as to have a constant width W in the longitudinal direction and project downward. Each protrusion 15b includes two holding holes 15a, and the insulator 15 holds two sets of intermediate terminals 10 in the range of the width dimension W, respectively.

前記凸部１５ｂは、第１の金属板３の端子保持部３ｂに形成された貫通穴７および第２の金属板４の端子保持部４ｂに形成された貫通穴８に個別に圧入できる寸法で形成されている。それぞれの凸部１５ｂが、上下に並んでいる２つの貫通穴７，８に圧入されて、複数の中間端子１０が、端子保持部３ｂおよび端子保持部４ｂの領域に保持される。   The convex portion 15b is dimensioned so that it can be individually press-fitted into the through hole 7 formed in the terminal holding portion 3b of the first metal plate 3 and the through hole 8 formed in the terminal holding portion 4b of the second metal plate 4. Is formed. Each convex part 15b is press-fitted into two through holes 7 and 8 arranged vertically, and the plurality of intermediate terminals 10 are held in the region of the terminal holding part 3b and the terminal holding part 4b.

信号線を伝達するための中間端子１０とそれぞれの金属板３，４との間は、絶縁体１５で絶縁されている。図６に示すように、絶縁体１５では、凸部１５ｂの側部に、少なくともアース端子として機能する中間端子１０が露出する凹部１５ｃが形成されている。この凹部１５ｃに対向する部分に、金属板３に形成された一部の貫通穴７の内縁部から一体に突出する導通突起７ａが設けられている。絶縁体１５が貫通穴７に保持されたときに、導通突起７ａが凹部１５ｃの内部に入り込んで中間端子１０と接触し、第１の金属板３とアース端子として機能する中間端子１０とが同電位（接地電位）となる。第１の金属板３と第２の金属板４が電気的に導通しているため、第１の金属板３ならびに第２の金属板４の双方が、前記中間端子１０と同電位（接地電位）に設定される。   The intermediate terminal 10 for transmitting the signal line and each metal plate 3, 4 are insulated by an insulator 15. As shown in FIG. 6, in the insulator 15, a concave portion 15 c is formed on the side of the convex portion 15 b to expose at least the intermediate terminal 10 that functions as a ground terminal. Conductive protrusions 7 a that protrude integrally from the inner edge of some through holes 7 formed in the metal plate 3 are provided at a portion facing the recess 15 c. When the insulator 15 is held in the through hole 7, the conductive protrusion 7 a enters the recess 15 c and contacts the intermediate terminal 10, and the first metal plate 3 and the intermediate terminal 10 functioning as a ground terminal are the same. Potential (ground potential). Since the first metal plate 3 and the second metal plate 4 are electrically connected, both the first metal plate 3 and the second metal plate 4 have the same potential (ground potential) as the intermediate terminal 10. ).

また、第１の金属板３に前記導通突起７ａが形成されるとともに、第２の金属板４の一部の貫通孔８の内縁部にも導通突起が一体に形成されてもよい。この構成でも、第１の金属板３と第２の金属板４の双方が、アース端子として機能する中間端子１０と同電位（接地電位）に設定される。この場合に、第１の金属板３に形成される導通突起７ａと第２の金属板４に形成される導通突起は、同じ場所で重ねられて設けられて同じ中間端子１０に接触してもよいし、別々の場所に設けられて異なる中間端子１０に接触していてもよい。   In addition, the conductive protrusion 7 a may be formed on the first metal plate 3, and the conductive protrusion may be integrally formed on an inner edge portion of a part of the through hole 8 of the second metal plate 4. Even in this configuration, both the first metal plate 3 and the second metal plate 4 are set to the same potential (ground potential) as the intermediate terminal 10 that functions as a ground terminal. In this case, the conductive protrusion 7a formed on the first metal plate 3 and the conductive protrusion formed on the second metal plate 4 are provided so as to be overlapped at the same place and contact the same intermediate terminal 10. Alternatively, they may be provided at different places and contact different intermediate terminals 10.

いずれにせよ、第１の金属板３と第２の金属板４の双方が、接地電位に設定されるため、両金属板３，４によるシールド効果を高くできる。   In any case, since both the first metal plate 3 and the second metal plate 4 are set to the ground potential, the shielding effect by both the metal plates 3 and 4 can be enhanced.

ハウジング２の上側凹部５と下側凹部６の境界部に、第１の金属板３の端子保持部３ｂと第２の金属板４の端子保持部４ｂが重ねられて位置しているため、ハウジング２の内部空間内に位置する端子保持部３ｂ，４ｂの強度を高く維持でき、撓みなどが発生しにくくなる。また、中間端子１０を保持している絶縁体１５の凸部１５ｂが、上下に重ねられた２枚の金属板３，４の貫通穴７，８で保持されるため、絶縁体１５の保持強度が高くなる。   Since the terminal holding part 3b of the first metal plate 3 and the terminal holding part 4b of the second metal plate 4 are positioned so as to overlap each other at the boundary between the upper recess 5 and the lower recess 6 of the housing 2, the housing The strength of the terminal holding portions 3b and 4b located in the internal space 2 can be maintained high, and bending or the like is less likely to occur. Moreover, since the convex part 15b of the insulator 15 holding the intermediate terminal 10 is held by the through holes 7 and 8 of the two metal plates 3 and 4 stacked one above the other, the holding strength of the insulator 15 Becomes higher.

中間端子１０を組み付ける工程としては、先に第１の金属板３と第２の金属板４が重ねられて、貫通穴７，８に絶縁体１５の凸部１５ｂが圧入された後に、中間端子１０を保持した第１の金属板３と第２の金属板４とが金型のキャビティ内に保持された状態で、溶融樹脂が射出されてハウジング２が形成される。あるいは、第１の金属板３と第２の金属板４が埋設されたハウジング２が成型された後の工程で、端子保持部３ｂ，４ｂの貫通穴７，８に、絶縁体１５が圧入されてもよい。   As a process of assembling the intermediate terminal 10, the first metal plate 3 and the second metal plate 4 are first overlapped, and the protrusion 15 b of the insulator 15 is press-fitted into the through holes 7 and 8. In a state where the first metal plate 3 and the second metal plate 4 holding 10 are held in the cavity of the mold, the molten resin is injected to form the housing 2. Alternatively, in the step after the housing 2 in which the first metal plate 3 and the second metal plate 4 are embedded is molded, the insulator 15 is press-fitted into the through holes 7 and 8 of the terminal holding portions 3b and 4b. May be.

図６に示すように、それぞれの中間端子１０は第１の金属片１１と第２の金属片１２とが重ねられて構成されている。第１の金属片１１の弾性変形部１１ａと第２の金属片１２の弾性変形部１２ａが、絶縁体１５から上方へ突出している。第１の金属片１１の基端部１１ｂと第２の金属片１２の基端部１２ｂは、絶縁体１５から下方へ突出し、第２の金属片１２の基端部１２ｂに導通片１２ｃが折曲げられている。   As shown in FIG. 6, each intermediate terminal 10 is configured by overlapping a first metal piece 11 and a second metal piece 12. An elastic deformation portion 11 a of the first metal piece 11 and an elastic deformation portion 12 a of the second metal piece 12 protrude upward from the insulator 15. The base end portion 11 b of the first metal piece 11 and the base end portion 12 b of the second metal piece 12 protrude downward from the insulator 15, and the conductive piece 12 c is folded at the base end portion 12 b of the second metal piece 12. It is bent.

図２と図３に示すように、ハウジング２の内部では、第１の金属片１１の弾性変形部１１ａと第２の金属片１２の弾性変形部１２ａが、端子変形空間５ｂに位置し、中間端子１０に外力が作用していないときは、少なくとも第１の金属片１１の弾性変形部１１ａが、部品支持部５ａの内部に延びている。また、第１の金属片１１の基端部１１ｂと第２の金属片１２の基端部１２ｂは、ハウジング２の端子接続空間６ｂの内部に位置している。   As shown in FIGS. 2 and 3, in the housing 2, the elastic deformation portion 11a of the first metal piece 11 and the elastic deformation portion 12a of the second metal piece 12 are located in the terminal deformation space 5b, When no external force is applied to the terminal 10, at least the elastically deforming portion 11a of the first metal piece 11 extends into the component support portion 5a. Further, the base end portion 11 b of the first metal piece 11 and the base end portion 12 b of the second metal piece 12 are located inside the terminal connection space 6 b of the housing 2.

図２と図３に示すように、電子部品用ソケット１の接続部材装着部６ａに、接続部材２０が保持される。   As shown in FIGS. 2 and 3, the connection member 20 is held by the connection member mounting portion 6 a of the electronic component socket 1.

接続部材２０は、コネクタ基板であり、上面２０ａに複数の上部接続電極部２１が配列し、下面２０ｂに複数の下部接続電極部２２が配列している。上部接続電極部２１は、表面に半田層を有している。下部接続電極部２２も表面に球形状の半田層を有している。   The connection member 20 is a connector substrate, and a plurality of upper connection electrode portions 21 are arranged on the upper surface 20a, and a plurality of lower connection electrode portions 22 are arranged on the lower surface 20b. The upper connection electrode portion 21 has a solder layer on the surface. The lower connection electrode portion 22 also has a spherical solder layer on the surface.

図４に示すように、接続部材２０の上面２０ａに、矩形状の電極配列領域２０ｃが形成され、この電極配列領域２０ｃに複数の上部接続電極部２１が規則的に配列している。電極配列領域２０ｃの形状および面積は、第１の金属板３の端子保持部３ｂおよび第２の金属板４の端子保持部４ｂの領域の形状ならびに面積と同等である。また、上部接続電極部２１の配列状態が、中間端子１０の配列状態と一致し、上部接続電極部２１の配列ピッチＰ１が、中間端子１０の配列ピッチＰ１と一致している。   As shown in FIG. 4, a rectangular electrode array region 20c is formed on the upper surface 20a of the connection member 20, and a plurality of upper connection electrode portions 21 are regularly arrayed in the electrode array region 20c. The shape and area of the electrode array region 20 c are equivalent to the shape and area of the region of the terminal holding part 3 b of the first metal plate 3 and the terminal holding part 4 b of the second metal plate 4. Further, the arrangement state of the upper connection electrode portions 21 matches the arrangement state of the intermediate terminals 10, and the arrangement pitch P <b> 1 of the upper connection electrode portions 21 matches the arrangement pitch P <b> 1 of the intermediate terminals 10.

接続部材２０はいわゆる多層基板であり、厚さ方向に重ねられた複数の絶縁層によって構成されている。図２に示すように、接続部材２０の内部の各層の表面に内部配線層２３がパターン形成され、上部接続電極部２１と下部接続電極部２２とが、内部配線層２３を介して一対一の関係で導通している。そして、下部接続電極部２２の配列ピッチＰ２が、上部接続電極部２１の配列ピッチＰ１よりも広く形成されている。   The connection member 20 is a so-called multilayer substrate, and is constituted by a plurality of insulating layers stacked in the thickness direction. As shown in FIG. 2, the internal wiring layer 23 is patterned on the surface of each layer inside the connection member 20, and the upper connection electrode portion 21 and the lower connection electrode portion 22 are in a one-to-one relationship via the internal wiring layer 23. Conducted in relationship. The arrangement pitch P <b> 2 of the lower connection electrode portion 22 is formed wider than the arrangement pitch P <b> 1 of the upper connection electrode portion 21.

図３に示すように、接続部材２０は、ハウジング２の接続部材装着部６ａの内部に挿入される。接続部材２０を装着側壁部２ｄの内部に挿入し、天井壁部２ｃの下面２ｅに突き当てることで、ハウジング２に対して接続部材２０が位置決めされ、それぞれの中間端子１０の導通片１２ｃと接続部材２０の上部接続電極部２１とが当接させられる。この状態で加熱炉に供給されると、上部接続電極部２１の表面の半田層が溶融し、上部接続電極部２１と中間端子１０の導通片１２ｃとが個別に半田付けされ、ハウジング２に接続部材２０が保持される。   As shown in FIG. 3, the connection member 20 is inserted into the connection member mounting portion 6 a of the housing 2. The connecting member 20 is inserted into the mounting side wall portion 2d and abutted against the lower surface 2e of the ceiling wall portion 2c, so that the connecting member 20 is positioned with respect to the housing 2 and connected to the conductive piece 12c of each intermediate terminal 10. The upper connection electrode portion 21 of the member 20 is brought into contact. When supplied to the heating furnace in this state, the solder layer on the surface of the upper connection electrode portion 21 is melted, and the upper connection electrode portion 21 and the conductive piece 12 c of the intermediate terminal 10 are individually soldered and connected to the housing 2. The member 20 is held.

または、導通片１２ｃの上部接続電極部２１と対向する部分に、予め球状の半田層が付着して設けられ、前記半田層と上部接続電極部２１とを当接させた状態で加熱炉に供給し、半田層を溶融させて上部接続電極部２１と導通片１２ｃとが半田付けされてもよい。   Alternatively, a spherical solder layer is provided in advance on a portion of the conductive piece 12c facing the upper connection electrode portion 21, and the solder layer and the upper connection electrode portion 21 are in contact with each other and supplied to the heating furnace. Then, the upper connection electrode portion 21 and the conductive piece 12c may be soldered by melting the solder layer.

電子部品用ソケット１が実装されるメイン基板（マザーボード）は、その表面にメイン電極部を有しており、メイン電極部は、接続部材２０の下部接続電極部２２の配列ピッチＰ２と同じピッチで配置されている。接続部材２０の下部接続電極部２２と、メイン電極部とを個別に対面させ、下部接続電極部２２の半田層を溶融させることで、下部接続電極部２２とメイン電極部とが個別に半田付けされ、電子部品用ソケット１が接続部材２０を介してメイン基板に実装される。   The main board (motherboard) on which the electronic component socket 1 is mounted has a main electrode portion on the surface thereof, and the main electrode portion has the same pitch as the arrangement pitch P2 of the lower connection electrode portions 22 of the connection member 20. Has been placed. The lower connection electrode part 22 and the main electrode part are individually soldered by causing the lower connection electrode part 22 of the connection member 20 and the main electrode part to face each other and melting the solder layer of the lower connection electrode part 22. Then, the electronic component socket 1 is mounted on the main board via the connection member 20.

また、複数の中間端子１０のうちのアース端子が、図６に示される導通突起７ａによって金属板３，４に導通されるため、金属板３，４が接地電位に設定される。   Further, since the ground terminal among the plurality of intermediate terminals 10 is conducted to the metal plates 3 and 4 by the conduction protrusion 7a shown in FIG. 6, the metal plates 3 and 4 are set to the ground potential.

中間端子１０の配列ピッチＰ１に対し、下部接続電極部２２の配列ピッチＰ２が広いため、メイン基板のメイン電極部のピッチを広くでき、多層基板であるメイン基板の層の数を少なくして、メイン基板の製造コストを削減することが可能である。   Since the arrangement pitch P2 of the lower connection electrode portions 22 is wider than the arrangement pitch P1 of the intermediate terminals 10, the pitch of the main electrode portions of the main board can be widened, and the number of layers of the main board which is a multilayer board is reduced. The manufacturing cost of the main board can be reduced.

図３に示すように、メイン基板に実装された電子部品用ソケット１に、電子部品３０が装着される。電子部品３０は、ＩＣのベアチップ、あるいはＩＣパッケージである。電子部品３０の下面３０ａに、複数の部品電極部３１が形成されている。部品電極部３１は表面が平坦面の金属層で形成されている。電子部品３０の下面３０ａにおける部品電極部３１の配列領域は、多数の中間端子１０が配列している領域と同じである。部品電極部３１の配列ピッチＰ１は、中間端子１０の配列ピッチＰ１と同じである。   As shown in FIG. 3, the electronic component 30 is mounted on the electronic component socket 1 mounted on the main board. The electronic component 30 is an IC bare chip or an IC package. A plurality of component electrode portions 31 are formed on the lower surface 30 a of the electronic component 30. The component electrode part 31 is formed of a metal layer having a flat surface. The arrangement region of the component electrode portions 31 on the lower surface 30a of the electronic component 30 is the same as the region in which many intermediate terminals 10 are arranged. The arrangement pitch P1 of the component electrode portions 31 is the same as the arrangement pitch P1 of the intermediate terminals 10.

電子部品３０は、電子部品用ソケット１の部品支持部５ａに装着され、上方から図示しない押さえ部材で押さえられて固定される。電子部品３０は支持側壁部２ａに囲まれて位置決めされ、電子部品３０の下面３０ａの周囲部が段差底部２ｂに押し付けられる。このとき、それぞれの部品電極部３１が中間端子１０の第１の金属片１１の弾性変形部１１ａに接触し、弾性変形部１１ａが端子変形空間５ｂの内部で弾性変形させられる。これにより、部品電極部３１が中間端子１０に個別に圧接されて導通する。   The electronic component 30 is mounted on the component support portion 5a of the electronic component socket 1, and is pressed and fixed from above by a pressing member (not shown). The electronic component 30 is positioned by being surrounded by the support side wall portion 2a, and the peripheral portion of the lower surface 30a of the electronic component 30 is pressed against the step bottom portion 2b. At this time, each component electrode part 31 contacts the elastic deformation part 11a of the 1st metal piece 11 of the intermediate terminal 10, and the elastic deformation part 11a is elastically deformed inside the terminal deformation space 5b. As a result, the component electrode portion 31 is brought into pressure contact with the intermediate terminal 10 and is conducted.

この電子部品用ソケット１は、複数の中間端子１０が金属板３，４に形成された複数の貫通穴７，８を貫通しているため、２枚の金属板３，４によって中間端子１０が相互にシールドされることになり、中間端子１０で伝送される信号に外部ノイズが重畳されにくくなる。   In the electronic component socket 1, since the plurality of intermediate terminals 10 pass through the plurality of through holes 7 and 8 formed in the metal plates 3 and 4, the intermediate terminals 10 are formed by the two metal plates 3 and 4. They are shielded from each other, and external noise is less likely to be superimposed on the signal transmitted at the intermediate terminal 10.

接続部材２０は、上面が２枚の金属板３，４で覆われ、４面の側部が側部シールド面３ｃで覆われる構造であるため、接続部材２０の上部接続電極部２１と中間端子１０との導通部、および下部接続電極部２２とメイン基板のメイン電極部との接続部、さらには内部配線層２３をシールドすることができ、接続部材２０を介して伝送される信号を外部ノイズから保護しやすくなる。   Since the connection member 20 has a structure in which the upper surface is covered with the two metal plates 3 and 4 and the side portions of the four surfaces are covered with the side shield surface 3c, the upper connection electrode portion 21 of the connection member 20 and the intermediate terminal 10, the connection portion between the lower connection electrode portion 22 and the main electrode portion of the main board, and the internal wiring layer 23 can be shielded, and the signal transmitted through the connection member 20 is external noise. It becomes easy to protect from.

図２と図３に示すように、接続部材２０は、中間端子１０に接続される上部接続電極部２１の配列ピッチＰ１よりも、メイン基板に接続される下部接続電極部２２の配列ピッチＰ２が広くなっている。したがって、接続部材２０が設置される接続部材装着部６ａは、部品支持部５ａよりも側方へ張り出した形状である。この張り出した部分の天井部が天井シールド面３ｄ，４ｄで覆われ、側部が側部シールド面３ｃで覆われているため、接続部材２０の電子部品３０からはみ出した部分を効果的にシールドでき、接続部材２０で伝送される信号を保護できるようになる。   As shown in FIGS. 2 and 3, the connection member 20 has an arrangement pitch P2 of the lower connection electrode portions 22 connected to the main board, rather than an arrangement pitch P1 of the upper connection electrode portions 21 connected to the intermediate terminal 10. It is getting wider. Therefore, the connection member mounting portion 6a on which the connection member 20 is installed has a shape that protrudes laterally from the component support portion 5a. Since the protruding ceiling part is covered with the ceiling shield surfaces 3d and 4d and the side part is covered with the side shield surface 3c, the part of the connecting member 20 protruding from the electronic component 30 can be effectively shielded. The signal transmitted by the connecting member 20 can be protected.

なお、本発明では、第１の金属板３と第２の金属板４とが上下に間隔を空けて設けられ、中間端子１０を支持している絶縁体１５が、上下に離れた位置で２つの金属板３，４で保持された構造としてもよい。この構造により絶縁体１５を安定して保持することができる。   In the present invention, the first metal plate 3 and the second metal plate 4 are provided with a space therebetween in the vertical direction, and the insulator 15 supporting the intermediate terminal 10 is positioned 2 away from the top and bottom. It is good also as a structure hold | maintained with the two metal plates 3 and 4. FIG. With this structure, the insulator 15 can be stably held.

この場合に、第１の金属板３と第２の金属板４のいずれか一方を、アース端子として機能する中間端子１０と導通させて接地電位に設定してもよいし、第１の金属板３と第２の金属板４の双方を前記中間端子１０に接触させて、２つの金属板３，４を接地電位としてもよい。   In this case, either the first metal plate 3 or the second metal plate 4 may be set to the ground potential by being electrically connected to the intermediate terminal 10 functioning as a ground terminal, or the first metal plate 3 and the second metal plate 4 may be brought into contact with the intermediate terminal 10 and the two metal plates 3 and 4 may be set to the ground potential.

また、絶縁体１５を保持する金属板を１枚として部品点数を削減してもよいし、または絶縁体１５を３枚以上の金属板で保持して、絶縁体１５の保持強度を高くしてもよい。   Further, the number of parts may be reduced by using one metal plate for holding the insulator 15, or the insulator 15 may be held by three or more metal plates to increase the holding strength of the insulator 15. Also good.

１ 電子部品用ソケット
２ ハウジング
２ａ 支持側壁部
２ｂ 段差底部
２ｃ 天井壁部
２ｄ 装着側壁部
３ 第１の金属板
３ｂ 端子保持部
３ｃ 側部シールド面
３ｄ 天井シールド面
４ 第２の金属板
４ｂ 端子保持部
４ｄ 天井シールド面
５ 上側凹部
５ａ 部品支持部
５ｂ 端子変形空間
６ 下側凹部
６ａ 接続部材装着部
６ｂ 端子接続空間
７，８ 貫通穴
７ａ 導通突起
１０ 中間端子
１１ 第１の金属片
１２ 第２の金属片
１５ 絶縁体
２０ 接続部材
２０ｃ 電極配列領域
２１ 上部接続電極部
２２ 下部接続電極部
２３ 内部配線層
３０ 電子部品
３１ 部品電極部 DESCRIPTION OF SYMBOLS 1 Electronic component socket 2 Housing 2a Support side wall 2b Step bottom 2c Ceiling wall 2d Mounting side wall 3 First metal plate 3b Terminal holding part 3c Side shield surface 3d Ceiling shield surface 4 Second metal plate 4b Terminal holding Portion 4d Ceiling shield surface 5 Upper concave portion 5a Component support portion 5b Terminal deformation space 6 Lower concave portion 6a Connection member mounting portion 6b Terminal connection space 7, 8 Through hole 7a Conductive protrusion 10 Intermediate terminal 11 First metal piece 12 Second Metal piece 15 Insulator 20 Connection member 20c Electrode arrangement region 21 Upper connection electrode portion 22 Lower connection electrode portion 23 Internal wiring layer 30 Electronic component 31 Component electrode portion

Claims (7)

下面に複数の部品電極部を有する電子部品が設置される部品支持部と、上面に複数の上部接続電極部を有し下面に複数の下部接続電極部を有する接続部材が設置される接続部材装着部とが設けられた電子部品用ソケットにおいて、
絶縁性のハウジングが設けられ、前記ハウジングの上側に前記部品支持部が、下側に前記接続部材装着部が形成され、前記部品支持部と前記接続部材装着部との間に、金属板で形成された端子保持部が位置し、前記端子保持部に複数の貫通穴が形成されて、それぞれの貫通穴に、前記部品電極部と前記上部接続電極部とを導通させる中間端子が、絶縁体を介して保持されており、
前記金属板が前記端子保持部の側方で折り曲げられてシールド面が形成され、このシールド面が、前記接続部材装着部の側部に位置していることを特徴とする電子部品用ソケット。 A component support portion on which an electronic component having a plurality of component electrode portions on the lower surface is installed, and a connection member mounting on which a connection member having a plurality of upper connection electrode portions on the upper surface and a plurality of lower connection electrode portions on the lower surface is installed. In the socket for electronic parts provided with
An insulating housing is provided, the component support portion is formed on the upper side of the housing, the connection member mounting portion is formed on the lower side, and a metal plate is formed between the component support portion and the connection member mounting portion. A plurality of through holes are formed in the terminal holding part, and an intermediate terminal for conducting the component electrode part and the upper connection electrode part in each through hole is provided with an insulator. Is held through
A socket for electronic parts, wherein the metal plate is bent at a side of the terminal holding portion to form a shield surface, and the shield surface is located at a side portion of the connection member mounting portion. 前記ハウジングが合成樹脂で形成されて、前記金属板が前記ハウジングに埋設されており、
前記ハウジングの上部に支持側壁部で囲まれた上側凹部が形成されて、前記部品支持部が前記上側凹部の内部に形成され、前記ハウジングの下部に装着側壁部で囲まれた下側凹部が形成されて、前記接続部材装着部が前記下側凹部の内部に形成されており、
前記上側凹部と前記下側凹部とが前記金属板で仕切られている請求項１記載の電子部品用ソケット。 The housing is formed of synthetic resin, and the metal plate is embedded in the housing;
An upper recess surrounded by a support side wall is formed in the upper part of the housing, the component support is formed in the upper recess, and a lower recess surrounded by a mounting side wall is formed in the lower part of the housing. The connecting member mounting portion is formed inside the lower recess,
The socket for electronic components according to claim 1, wherein the upper concave portion and the lower concave portion are partitioned by the metal plate. 前記接続部材装着部の４つの側部に前記シールド面が位置している請求項１または２記載の電子部品用ソケット。   The electronic component socket according to claim 1, wherein the shield surface is located on four side portions of the connection member mounting portion. 前記部品支持部と前記接続部材装着部との間に、前記金属板が複数枚設けられ、少なくとも１枚の金属板から前記シールド面が折り曲げられている請求項１ないし３のいずれかに記載の電子部品用ソケット。   4. The device according to claim 1, wherein a plurality of the metal plates are provided between the component support portion and the connection member mounting portion, and the shield surface is bent from at least one metal plate. 5. Socket for electronic parts. 前記接続部材は、その内部に上部接続電極部と下部接続電極部とを導通させる配線部が設けられ、上部接続電極部の配列ピッチよりも下部接続電極部の配列ピッチが広く形成されている請求項１ないし４のいずれかに記載の電子部品用ソケット。   The connection member includes a wiring portion for electrically connecting the upper connection electrode portion and the lower connection electrode portion therein, and the arrangement pitch of the lower connection electrode portions is wider than the arrangement pitch of the upper connection electrode portions. Item 5. The electronic component socket according to any one of Items 1 to 4. 前記金属板は、前記端子保持部の周囲に天井シールド面を有しており、
前記接続部材装着部が前記部品支持部から側方に張り出し、前記天井シールド面が、張り出した部分の前記接続部材装着部の天井部に位置している請求項５記載の電子部品用ソケット。 The metal plate has a ceiling shield surface around the terminal holding portion,
The electronic component socket according to claim 5, wherein the connection member mounting portion protrudes laterally from the component support portion, and the ceiling shield surface is positioned on a ceiling portion of the connection member mounting portion in the protruding portion. 前記金属板の一部がいずれかの中間端子に導通して、接地電位に設定可能とされている請求項１ないし６のいずれかに記載の電子部品用ソケット。   The electronic component socket according to claim 1, wherein a part of the metal plate is electrically connected to one of the intermediate terminals and can be set to a ground potential.

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