JP2012182309A - Optical device - Google Patents

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JP2012182309A
JP2012182309A JP2011044126A JP2011044126A JP2012182309A JP 2012182309 A JP2012182309 A JP 2012182309A JP 2011044126 A JP2011044126 A JP 2011044126A JP 2011044126 A JP2011044126 A JP 2011044126A JP 2012182309 A JP2012182309 A JP 2012182309A
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electrode
optical device
active region
recess
region
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Keiichiro Hayashi
恵一郎 林
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Seiko Instruments Inc
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Seiko Instruments Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Solid State Image Pick-Up Elements (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a compact optical device 1 which can be flip-chip mounted on a flat surface of a circuit board or the like.SOLUTION: An optical device 1 comprises: an optical element 4 which is provided with a first surface 5 having an optically active region 7 and a first electrode 10, and a second surface 6 on a side opposite to the first surface 5; and a housing member 2 which has a hollow 3 at the center, and which houses the optical element 4 in such a manner that the first surface 5 is directed to a bottom face 8 side of the hollow 3, and that the second surface 6 does not protrude from an upper end face 23 on an opening side of the hollow 3. A region on the bottom face 8 of the housing member 2 facing the active region 7 is a transparent region 9. The housing member 2 has, on the bottom face 8, a second electrode 11 electrically connected to the first electrode 10. The housing member 2 also has, on its upper end face, a third electrode 12 electrically connected to the second electrode 11.

Description

本発明は、発光素子や受光素子等の光学素子とこれを収納する収納部材からなる光学デバイスに関する。   The present invention relates to an optical device including an optical element such as a light emitting element or a light receiving element and a storage member for storing the optical element.

従来から、発光素子や受光素子等の光学素子はパッケージに収納されて光学デバイスとして利用されている。これらの光学素子は、発光面や受光面等の活性面と同じ表面に駆動用の電極が形成されている。そのため、光学素子の活性面側から電気的に接続する必要があり、光学素子や収納部材の他に光学素子と収納部材とを電気的に接続するボンディングワイヤや収納部材を光学素子の活性面側からキャップする透明キャップ材を必要とした。その結果、部品点数が多くなるとともに製造工数がかかりコスト高となった。そこで、部品点数を減らして製造工数を少なくした光学デバイスが求められている。   Conventionally, optical elements such as a light emitting element and a light receiving element are housed in a package and used as an optical device. In these optical elements, driving electrodes are formed on the same surface as an active surface such as a light emitting surface and a light receiving surface. Therefore, it is necessary to electrically connect from the active surface side of the optical element, and in addition to the optical element and the storage member, a bonding wire and a storage member that electrically connect the optical element and the storage member are connected to the active surface side of the optical element. We needed a transparent cap material to cap from. As a result, the number of parts increases and the number of manufacturing steps increases, resulting in an increase in cost. Therefore, there is a demand for an optical device that reduces the number of parts and manufacturing man-hours.

特許文献１には、部品点数を減らした光学素子が記載されている。図１１は光学素子としての撮像素子をガラス基板に貼りつけた固体撮像素子の断面模式図である（特許文献１の図１）。固体撮像素子１０１は、撮像素子１０２と光学ガラス配線基板１０３から構成される。撮像素子１０２の上面に有効撮像領域１０４が形成され、その周囲に複数の電極パッド１０５が形成され、その電極パッド１０５の上面にはバンプ等の突起電極１０６が形成されている。光学ガラス配線基板１０３は、光学ガラス板１０７の裏側に配線パターン１０８が形成され、この配線パターン形成面の略中央に接合材料１０９を介して撮像素子１０２が接合されている。そして、光学ガラス板１０７の裏側において配線パターン１０８の一端と撮像素子１０２の電極パット１０５とが突起電極１０６を介してフリップチップ方式で電気的に接続される。接合材料１０９は、撮像素子１０２の有効撮像領域１０４を除いた素子周縁領域に形成され、有効撮像領域１０４と光学ガラス配線基板１０３との間には突起電極１０６の高さ分の中空領域（隙間）が形成されている。このように構成することにより、部品点数を減らし製造工数を少なくしてコストダウンを図ることができる、というものである。   Patent Document 1 describes an optical element with a reduced number of parts. FIG. 11 is a schematic cross-sectional view of a solid-state image sensor in which an image sensor as an optical element is attached to a glass substrate (FIG. 1 of Patent Document 1). The solid-state image sensor 101 includes an image sensor 102 and an optical glass wiring board 103. An effective imaging region 104 is formed on the upper surface of the imaging element 102, a plurality of electrode pads 105 are formed around the effective imaging region 104, and protruding electrodes 106 such as bumps are formed on the upper surface of the electrode pad 105. In the optical glass wiring substrate 103, a wiring pattern 108 is formed on the back side of the optical glass plate 107, and the imaging element 102 is bonded to a substantially center of the wiring pattern forming surface via a bonding material 109. Then, one end of the wiring pattern 108 and the electrode pad 105 of the image sensor 102 are electrically connected to each other on the back side of the optical glass plate 107 through the protruding electrode 106 by a flip chip method. The bonding material 109 is formed in an element peripheral area excluding the effective imaging area 104 of the imaging element 102, and a hollow area (gap) between the effective imaging area 104 and the optical glass wiring substrate 103 is as high as the protruding electrode 106. ) Is formed. With this configuration, the number of parts can be reduced, the number of manufacturing steps can be reduced, and the cost can be reduced.

特開平９-１７９８６号公報Japanese Patent Laid-Open No. 9-17986

しかしながら、特許文献１の光学素子は、撮像素子１０２が光学ガラス配線基板１０３の背面側に突出して接合され、撮像素子１０２に駆動信号を供給するための配線パターン１０８は光学ガラス板１０７の裏側に形成されている。そのため、この光学素子を回路基板等の平坦面に実装しようとすると、光学素子と平坦面との間に実装用基板を設け、この実装用基板を介して配線パターン１０８と平坦面の電極との間を電気的に接続する必要がある。その結果、部品点数が増加するとともに製造工数が増えてコスト高となる。本発明は上記課題に鑑みてなされたものであり、小型で回路基板等に実装が容易な光学デバイスを提供することを目的とする。   However, in the optical element of Patent Document 1, the image sensor 102 is protruded and joined to the back side of the optical glass wiring substrate 103, and the wiring pattern 108 for supplying a drive signal to the image sensor 102 is provided on the back side of the optical glass plate 107. Is formed. Therefore, when this optical element is to be mounted on a flat surface such as a circuit board, a mounting substrate is provided between the optical element and the flat surface, and the wiring pattern 108 and the flat surface electrode are interposed via the mounting substrate. It is necessary to electrically connect between them. As a result, the number of parts increases, the number of manufacturing steps increases, and the cost increases. The present invention has been made in view of the above problems, and an object thereof is to provide an optical device that is small and can be easily mounted on a circuit board or the like.

本発明の光学デバイスは、光学的に活性な活性領域と第一電極を有する第一面と前記第一面の反対側に第二面を有する光学素子と、中央に窪みを有し、前記窪みの底面の側に前記第一面を向け、前記窪みの開口側の上端面から前記第二面が突出しないよう前記光学素子を収納する収納部材と、を備え、前記収納部材は、前記活性領域に対面する前記窪みの底部の領域が透明領域であり、前記底面に前記第一電極と電気的に接続する第二電極と、前記上端面に前記第二電極と電気的に接続する第三電極を有することとした。   The optical device of the present invention includes an optical element having an optically active active region, a first surface having a first electrode, an optical element having a second surface opposite to the first surface, and a recess in the center. And a storage member that stores the optical element so that the second surface does not protrude from an upper end surface on the opening side of the recess, and the storage member includes the active region. The bottom region of the depression facing the transparent region is a transparent region, the second electrode electrically connected to the first electrode on the bottom surface, and the third electrode electrically connected to the second electrode on the top surface It was decided to have.

また、前記窪みの内側面は、前記第二電極と前記第三電極とを電気的に接続する側面電極を有することとした。   Further, the inner side surface of the recess has a side electrode that electrically connects the second electrode and the third electrode.

また、前記側面電極の電極面は、前記底面に対して６０°を超えない傾斜角を有することとした。   Further, the electrode surface of the side electrode has an inclination angle not exceeding 60 ° with respect to the bottom surface.

また、前記内側面は、前記底面に対して傾斜する傾斜路を有し、前記傾斜路の路面上に前記側面電極が形成されていることとした。   In addition, the inner side surface has a slope inclined with respect to the bottom surface, and the side electrode is formed on a road surface of the slope.

また、前記傾斜路は、前記底面から前記上端面にかけて葛折り状の形状を有することとした。   Further, the ramp has a twisted shape from the bottom surface to the upper end surface.

また、前記側面電極はナノ金属粒子を塗布して形成されることとした。   The side electrode is formed by applying nano metal particles.

また、前記底面は、前記活性領域を囲む土手を有することとした。   Further, the bottom surface has a bank surrounding the active region.

また、前記第一面は、前記土手により囲まれる領域を除いてモールド材によりモールドされていることとした。   Further, the first surface is molded with a molding material except for a region surrounded by the bank.

また、前記光学素子は、前記第一面に前記活性領域に隣接して第二の活性領域を有し、前記収納部材は、前記第二の活性領域に対面する前記底部の領域が第二の透明領域であることとした。   Further, the optical element has a second active region adjacent to the active region on the first surface, and the storage member has a second region facing the second active region at the second region. It was decided to be a transparent area.

また、機能性素子と、前記機能性素子を前記窪みの側に有し、前記上端面に接合される機能性素子基板とを更に備え、前記機能性素子基板は貫通電極を有し、前記機能性素子は前記貫通電極に電気的に接続し、前記貫通電極は前記第三電極に電気的に接続することとした。   The functional element further includes a functional element and a functional element substrate having the functional element on the recess side and bonded to the upper end surface, the functional element substrate having a through electrode, and the function The electrically conductive element is electrically connected to the through electrode, and the through electrode is electrically connected to the third electrode.

また、前記機能性素子は、前記光学素子の側に光学的に活性な第二の活性領域を有し、前記収納部材は、前記第二の活性領域に対面する前記底部の領域が第二の透明領域であることとした。   In addition, the functional element has a second active region that is optically active on the optical element side, and the storage member has a second region in the bottom that faces the second active region. It was decided to be a transparent area.

本発明による光学デバイスは、光学的に活性な活性領域と第一電極を有する第一面と第一面の反対側に第二面を有する光学素子と、中央に窪みを有し、窪みの底面の側に第一面を向け、窪みの開口側の上端面から第二面が突出しないよう光学素子を収納する収納部材と、を備え、収納部材は、活性領域に対面する窪みの底部の領域が透明領域であり、底面に第一電極と電気的に接続する第二電極と、上端面に第二電極と電気的に接続する第三電極を有する構成とした。これにより、収納部材から光学素子が突出しないので、光学デバイスを回路基板等の平坦面に実装用基板を介在させることなく容易に設置することができる。また、収納部材の窪みの上端面に第三電極を設けたので、光学デバイスを回路基板等にフリップ・チップ・ボンディング（以下、フリップチップ実装、という。）することができ、光学デバイスの実装後の容積を小さく構成することができる。   An optical device according to the present invention includes an optically active active region, a first surface having a first electrode, an optical element having a second surface opposite to the first surface, a recess in the center, and a bottom surface of the recess. And a storage member for storing the optical element so that the second surface does not protrude from the upper end surface on the opening side of the recess, and the storage member is a region at the bottom of the recess facing the active region Is a transparent region, and has a second electrode electrically connected to the first electrode on the bottom surface and a third electrode electrically connected to the second electrode on the upper end surface. Thereby, since the optical element does not protrude from the housing member, the optical device can be easily installed on a flat surface such as a circuit board without interposing the mounting substrate. In addition, since the third electrode is provided on the upper end surface of the recess of the storage member, the optical device can be flip-chip bonded (hereinafter referred to as flip-chip mounting) to a circuit board or the like. The volume of can be made small.

本発明の第一実施形態に係る光学デバイスの縦断面模式図である。It is a longitudinal cross-sectional schematic diagram of the optical device which concerns on 1st embodiment of this invention. 本発明の第一実施形態に係る光学デバイスの収納部材の平面模式図である。It is a plane schematic diagram of the storage member of the optical device according to the first embodiment of the present invention. 本発明の第二実施形態に係る光学デバイスの縦断面模式図である。It is a longitudinal cross-sectional schematic diagram of the optical device which concerns on 2nd embodiment of this invention. 本発明の第二実施形態に係る光学デバイスの収納部材の平面模式図である。It is a plane schematic diagram of the storage member of the optical device which concerns on 2nd embodiment of this invention. 本発明の第三実施形態に係る光学デバイスの縦断面模式図である。It is a longitudinal cross-sectional schematic diagram of the optical device which concerns on 3rd embodiment of this invention. 本発明の第三実施形態に係る光学デバイスを説明するための図である。It is a figure for demonstrating the optical device which concerns on 3rd embodiment of this invention. 本発明の第三実施形態に係る光学デバイスの収納部材の模式的な斜視図である。It is a typical perspective view of the storage member of the optical device which concerns on 3rd embodiment of this invention. 本発明の第四実施形態に係る光学デバイスの断面模式図である。It is a cross-sectional schematic diagram of the optical device which concerns on 4th embodiment of this invention. 本発明の第五実施形態に係る光学デバイスの断面模式図である。It is a cross-sectional schematic diagram of the optical device which concerns on 5th embodiment of this invention. 本発明の第六実施形態に係る光学デバイスの断面模式図である。It is a cross-sectional schematic diagram of the optical device which concerns on 6th embodiment of this invention. 従来公知の光学デバイスの説明図である。It is explanatory drawing of a conventionally well-known optical device.

（第一実施形態）
図１は、本発明の第一実施形態に係る光学デバイス１の縦断面模式図である。光学デバイス１は、光学素子４と収納部材２を備えている。光学素子４は、光学的に活性な活性領域７と第一電極１０とを有する第一面５と、この第一面５の反対側に第二面６を有している。収納部材２は、中央に窪み３を有し、上記第一面５が窪み３の底面８に対面し、上記第二面６が窪み３の開口側の上端面２３から突出しないように光学素子４を収納する。収納部材２は、上記活性領域７に対面する窪み３の底部の領域が透明領域９であり、底面８に第一電極１０と電気的に接続する第二電極１１と、上端面２３に第二電極１１と電気的に接続する第三電極１２を有している。ここで、第二電極１１は第三電極１２と窪み３の内側面に形成した側面電極１４を介して電気的に接続している。 (First embodiment)
FIG. 1 is a schematic longitudinal sectional view of an optical device 1 according to the first embodiment of the present invention. The optical device 1 includes an optical element 4 and a storage member 2. The optical element 4 has a first surface 5 having an optically active active region 7 and a first electrode 10, and a second surface 6 on the opposite side of the first surface 5. The storage member 2 has a recess 3 at the center, the first surface 5 faces the bottom surface 8 of the recess 3, and the second surface 6 does not protrude from the upper end surface 23 on the opening side of the recess 3. 4 is stored. The storage member 2 has a transparent region 9 at the bottom of the recess 3 facing the active region 7, a second electrode 11 electrically connected to the first electrode 10 on the bottom surface 8, and a second electrode on the upper end surface 23. A third electrode 12 that is electrically connected to the electrode 11 is provided. Here, the second electrode 11 is electrically connected to the third electrode 12 via a side electrode 14 formed on the inner surface of the recess 3.

図２は、図１に示す収納部材２を窪み３の開口側から見た平面模式図である。図１に示す光学デバイス１は、部分ＡＡの断面に相当する。窪み３の底部に設置した透明領域９は底面８の略中央に位置する。収納部材２は、底面８の四隅に第二電極１１を備え、窪み３の上端面２３の四隅に第三電極１２を備え、窪み３の内側面１３に側面電極１４を備えている。内側面１３は底面８に対して傾斜している。第二電極１１とこの第二電極１１に近接する第三電極１２は側面電極１４を介して電気的に接続する。   FIG. 2 is a schematic plan view of the storage member 2 shown in FIG. 1 viewed from the opening side of the recess 3. The optical device 1 shown in FIG. 1 corresponds to a cross section of the portion AA. The transparent region 9 installed at the bottom of the recess 3 is located at the approximate center of the bottom surface 8. The storage member 2 includes the second electrodes 11 at the four corners of the bottom surface 8, the third electrodes 12 at the four corners of the upper end surface 23 of the recess 3, and the side electrodes 14 on the inner surface 13 of the recess 3. The inner side surface 13 is inclined with respect to the bottom surface 8. The second electrode 11 and the third electrode 12 adjacent to the second electrode 11 are electrically connected through the side electrode 14.

この構成により、光学デバイス１の上端面２３の側に光学素子４が突出することがないので、回路基板等の平坦面に光学デバイス１を容易に設置することができる。また、窪み３の上端面２３に第三電極１２を設けたので、実装しようとする回路基板等との間の電気的接続が容易となる。即ち、光学デバイス１を回路基板等に実装用基板を必要としないで容易にフリップチップ実装することができる。また、収納部材２の底部の外表面は平坦面なので、他の部材、例えばフィルター等を容易に設置することができる。   With this configuration, since the optical element 4 does not protrude toward the upper end surface 23 of the optical device 1, the optical device 1 can be easily installed on a flat surface such as a circuit board. In addition, since the third electrode 12 is provided on the upper end surface 23 of the recess 3, electrical connection with a circuit board or the like to be mounted is facilitated. That is, the optical device 1 can be easily flip-chip mounted on a circuit board or the like without requiring a mounting board. Further, since the outer surface of the bottom portion of the storage member 2 is a flat surface, other members such as a filter can be easily installed.

光学素子４として、発光ダイオード等の発光素子やフォトダイオード、イメージセンサ等の受光素子を使用することができる。活性領域７は、光学素子４が発光素子の場合はその発光面であり、光学素子４が受光素子の場合はその受光面である。光学素子４は、活性領域７が形成される第一面５に駆動用の第一電極１０が形成されている。収納部材２として、ガラス材料やプラスチック材料を使用することができる。ガラス材料として、ソーダガラス、硬質ガラス、石英、アルミナガラス、各種セラミックス等を使用することができる。プラスチック材料として、エポキシ系樹脂、ガラスエポキシ樹脂、アラミド不織布、アクリル系樹脂、ポリイミド系樹脂等を使用することができる。また、表面に絶縁膜を形成した金属材料を使用することができる。窪み３は、型成形法により形成することができる。窪み３の底面部に形成する透明領域９は、光学素子４が発光し又は受光する光の波長に対して透明である。   As the optical element 4, a light emitting element such as a light emitting diode or a light receiving element such as a photodiode or an image sensor can be used. The active region 7 is the light emitting surface when the optical element 4 is a light emitting element, and the light receiving surface when the optical element 4 is a light receiving element. In the optical element 4, a first electrode 10 for driving is formed on the first surface 5 on which the active region 7 is formed. As the storage member 2, a glass material or a plastic material can be used. As the glass material, soda glass, hard glass, quartz, alumina glass, various ceramics, and the like can be used. As the plastic material, an epoxy resin, a glass epoxy resin, an aramid nonwoven fabric, an acrylic resin, a polyimide resin, or the like can be used. Further, a metal material having an insulating film formed on the surface can be used. The depression 3 can be formed by a molding method. The transparent region 9 formed on the bottom surface of the recess 3 is transparent to the wavelength of the light that the optical element 4 emits or receives.

第二電極１１、第三電極１２及び側面電極１４は、印刷法、めっき法、蒸着法、スパッタ法、インクジェット法等により導体を堆積して形成することができる。回路基板の配線材料として通常用いられる材料を使用することができ、例えば金、銀、銅、ニッケル、クロム、アルミニウム等の単体、或いはこれらを積層して用いることができる。第一面５に形成した第一電極１０と窪み３の底面に形成した第二電極１１とは導電接着材により電気的に接続することができる。また、第一電極１０をバンプによる突起電極とし、光学素子４を窪み３の底面８にフリップチップ実装して第二電極１１と電気的に接続することができる。突起電極として、金、銅、はんだ等とすることができる。   The second electrode 11, the third electrode 12, and the side electrode 14 can be formed by depositing a conductor by a printing method, a plating method, a vapor deposition method, a sputtering method, an ink jet method, or the like. A material usually used as a wiring material for the circuit board can be used. For example, a single material such as gold, silver, copper, nickel, chromium, aluminum, or the like can be laminated. The first electrode 10 formed on the first surface 5 and the second electrode 11 formed on the bottom surface of the recess 3 can be electrically connected by a conductive adhesive. Also, the first electrode 10 can be a bump protruding electrode, and the optical element 4 can be flip-chip mounted on the bottom surface 8 of the recess 3 to be electrically connected to the second electrode 11. The protruding electrode can be gold, copper, solder, or the like.

なお、光学デバイス１を回路基板等に実装する際に窪み３の内側を外部から密閉することができる。また、光学素子４の第二面６側にモールド材を充填し、第一面５の活性領域７を外部から密閉することができる。この場合も、モールド材は窪み３の上端面から突出しないようにモールドする。また、モールド材として黒色の材料を使用すれば、背面側からのノイズ光や漏れ光を遮蔽することができる。また、土手２２、透明領域９、活性領域７の位置、形状は図３又は図４に示すものに限定されない。また、底面８、上端面２３及び内側面１３のそれぞれに４個所電極を形成したが、これら電極の形成個所を変更する或いは形成数を増減することができることはいうまでもない。   When the optical device 1 is mounted on a circuit board or the like, the inside of the recess 3 can be sealed from the outside. Further, the second element 6 side of the optical element 4 can be filled with a molding material, and the active region 7 of the first element 5 can be sealed from the outside. Also in this case, the molding material is molded so as not to protrude from the upper end surface of the recess 3. Further, if a black material is used as the molding material, noise light and leakage light from the back side can be shielded. Further, the positions and shapes of the bank 22, the transparent region 9, and the active region 7 are not limited to those shown in FIG. 3 or FIG. Further, although four electrodes are formed on each of the bottom surface 8, the upper end surface 23, and the inner surface 13, it goes without saying that the positions where these electrodes are formed can be changed or the number of formed electrodes can be increased or decreased.

（第二実施形態）
図３は、本発明の第二実施形態に係る光学デバイス１の縦断面模式図である。図４は、図３に示す収納部材２を窪み３の開口側から見た平面模式図である。図３に示す光学デバイス１は、部分ＢＢの断面に相当する。第一実施形態と異なる点は窪み３の底面に土手２２を設置した点及び光学素子４の第二面６側をモールド材１６によりモールドした点であり、その他は第一実施形態と同様である。従って、以下、主に異なる部分について説明する。同一の部分又は同一の機能を有する部分には同一の符号を付している。 (Second embodiment)
FIG. 3 is a schematic longitudinal sectional view of the optical device 1 according to the second embodiment of the present invention. FIG. 4 is a schematic plan view of the storage member 2 shown in FIG. 3 as viewed from the opening side of the recess 3. The optical device 1 shown in FIG. 3 corresponds to a cross section of the portion BB. The difference from the first embodiment is that the bank 22 is installed on the bottom surface of the recess 3 and the second surface 6 side of the optical element 4 is molded with the molding material 16, and the other points are the same as in the first embodiment. . Therefore, different parts will be mainly described below. The same portions or portions having the same function are denoted by the same reference numerals.

収納部材２の窪み３の底面８には光学素子４の活性領域７を囲むように土手２２が形成されている。土手２２の上端面は光学素子４の第一面５に当接又は近接している。土手２２は透明領域９の底面８側に露出する露出面を取り囲んでいる。第一面５に形成した第一電極１０は、バンプから成り突起形状を有し、光学素子４を底面８にフリップチップ実装して第二電極１１と電気的に接続する。光学素子４はモールド材１６によりモールドされている。モールド材１６は光学素子４の第二面６から第一面５にかけて回り込んでいる。土手２２は活性領域７の周囲を取り囲み、モールド材１６の活性領域７への浸入を防いでいる。即ち、第一面５は土手２２により囲まれる領域を除いてモールド材１６によりモールドされている。その他、収納部材２の材料や光学素子４は第一実施形態と同様に構成することができる。なお、土手２２はモールド材１６が活性領域７に流れ込むことを防止するとともに、フリップチップ実装の際に接着剤が活性領域７に流れ込むことも防止する。この流れ込み防止機能は、土手２２の上端面が光学素子４の第一面５に当接している場合の他に近接している場合でも有効である。モールド材や接着剤には粘性があるので、土手２２の上端面と第一面５との間に多少隙間が生じてもモールド材や接着剤は活性領域７側に浸入しない。   A bank 22 is formed on the bottom surface 8 of the recess 3 of the storage member 2 so as to surround the active region 7 of the optical element 4. The upper end surface of the bank 22 is in contact with or close to the first surface 5 of the optical element 4. The bank 22 surrounds the exposed surface exposed to the bottom surface 8 side of the transparent region 9. The first electrode 10 formed on the first surface 5 is formed of a bump and has a protruding shape. The optical element 4 is flip-chip mounted on the bottom surface 8 to be electrically connected to the second electrode 11. The optical element 4 is molded with a molding material 16. The molding material 16 wraps around from the second surface 6 to the first surface 5 of the optical element 4. The bank 22 surrounds the periphery of the active region 7 and prevents the mold material 16 from entering the active region 7. That is, the first surface 5 is molded with the molding material 16 except for the region surrounded by the bank 22. In addition, the material of the storage member 2 and the optical element 4 can be configured similarly to the first embodiment. The bank 22 prevents the molding material 16 from flowing into the active region 7 and also prevents the adhesive from flowing into the active region 7 during flip chip mounting. This inflow prevention function is effective even when the upper end surface of the bank 22 is close to the first surface 5 of the optical element 4 in addition to the case. Since the molding material and the adhesive are viscous, the molding material and the adhesive do not enter the active region 7 even if a slight gap is generated between the upper end surface of the bank 22 and the first surface 5.

このように、第一電極１０及び第二電極１１がモールドされるので腐食等に基づく断線を防止することができる。モールド材１６として黒色の材料を使用すれば、背面側からのノイズ光や漏れ光を遮蔽することができる。これにより、信頼性の高い光学デバイス１を形成することができる。更に、光学デバイス１の背面側に光学素子４が突出しないので回路基板等の平坦面に容易にフリップチップ実装することができる。   Thus, since the 1st electrode 10 and the 2nd electrode 11 are molded, the disconnection based on corrosion etc. can be prevented. If a black material is used as the molding material 16, noise light and leakage light from the back side can be shielded. Thereby, the optical device 1 with high reliability can be formed. Furthermore, since the optical element 4 does not protrude on the back side of the optical device 1, it can be easily flip-chip mounted on a flat surface such as a circuit board.

（第三実施形態）
図５、図６及び図７は、本発明の第三実施形態に係る光学デバイス１を説明するための図である。図５は光学デバイス１の縦断面模式図であり、図６（ａ）は収納部材２を窪み３の開口側から見た平面模式図であり、図６（ｂ）は部分ＤＤの断面から上方を見た状態を表す模式図であり、図７は収納部材２の模式的な斜視図である。 (Third embodiment)
5, 6 and 7 are diagrams for explaining the optical device 1 according to the third embodiment of the present invention. FIG. 5 is a schematic vertical sectional view of the optical device 1, FIG. 6 (a) is a schematic plan view of the storage member 2 viewed from the opening side of the recess 3, and FIG. 6 (b) is an upper view from the cross section of the portion DD. FIG. 7 is a schematic perspective view of the storage member 2.

図５は、図６（ａ）に示す収納部材２の部分ＣＣの縦断面に相当する。光学デバイス１は、光学素子４と収納部材２とを備えている。光学素子４は、光学的に活性な活性領域７と図示しない第一電極とを有する第一面５と、この第一面５の反対側に第二面６を有している。収納部材２は、窪み３を有し、第一面５が窪み３の底面８に対面し、第二面６が窪み３の開口側の上端面２３から突出しないように光学素子４を収納する。   FIG. 5 corresponds to a longitudinal section of the portion CC of the storage member 2 shown in FIG. The optical device 1 includes an optical element 4 and a storage member 2. The optical element 4 has a first surface 5 having an optically active active region 7 and a first electrode (not shown), and a second surface 6 on the opposite side of the first surface 5. The storage member 2 has a recess 3, and stores the optical element 4 so that the first surface 5 faces the bottom surface 8 of the recess 3 and the second surface 6 does not protrude from the upper end surface 23 on the opening side of the recess 3. .

収納部材２は、活性領域７に対面する窪み３の底部の領域が透明領域９であり、この活性領域７を取り囲むように底面８から突出する土手２２を備えている。収納部材２は、底面８に第一電極と電気的に接続する第二電極１１と、上端面２３に第二電極１１と電気的に接続する第三電極１２と、内側面１３に第二電極１１と第三電極１２とを電気的に接続する側面電極１４を備えている。収納部材２の内側面１３は底面８から上端面２３に伸びる傾斜路１５を備え、傾斜路１５の上面（路面）に側面電極１４が形成されている。第二電極１１は底面８の４つの角に設置され、第三電極１２は上端面２３の４つの角の近傍に設置され、側面電極１４は４つの内側面１３（図６（ａ）の平面図において、上内側面１３ａ、右内側面１３ｂ、下内側面１３ｃ、左内側面１３ｄという。）に設置されている。そして、左上角の第二電極１１と右上角の第三電極１２とは上内側面１３ａに形成した側面電極１４を介して電気的に接続される。同様に、右上角の第二電極１１と右下角の第三電極１２とは右内側面１３ｂに形成した側面電極１４を介して電気的に接続されている。その他の角に形成した第二電極１１、第三電極１２及び内側面１３ｃ、１３ｄに形成した側面電極１４も同様に構成されている。   The storage member 2 is provided with a bank 22 that protrudes from the bottom surface 8 so as to surround the active region 7 so that the bottom region of the recess 3 facing the active region 7 is a transparent region 9. The storage member 2 includes a second electrode 11 electrically connected to the first electrode on the bottom surface 8, a third electrode 12 electrically connected to the second electrode 11 on the upper end surface 23, and a second electrode on the inner surface 13. 11 and the third electrode 12 are provided. The inner side surface 13 of the storage member 2 includes an inclined path 15 extending from the bottom surface 8 to the upper end surface 23, and a side electrode 14 is formed on the upper surface (road surface) of the inclined path 15. The second electrode 11 is installed at the four corners of the bottom surface 8, the third electrode 12 is installed near the four corners of the upper end surface 23, and the side electrode 14 is composed of four inner side surfaces 13 (the plane of FIG. 6A). In the figure, they are installed on the upper inner surface 13a, the right inner surface 13b, the lower inner surface 13c, and the left inner surface 13d). The second electrode 11 at the upper left corner and the third electrode 12 at the upper right corner are electrically connected via a side electrode 14 formed on the upper inner side surface 13a. Similarly, the second electrode 11 at the upper right corner and the third electrode 12 at the lower right corner are electrically connected via a side electrode 14 formed on the right inner side surface 13b. The second electrode 11, the third electrode 12, and the side electrodes 14 formed on the inner side surfaces 13c and 13d are also configured in the same manner.

ここで、第二電極１１、第三電極１２及び側面電極１４をインクジェット方式により液状の導電材料を吐出させて収納部材２に塗布し、その後乾燥・焼結させて形成することができる。例えばペースト状のナノ金属粒子をインクジェット方式で窪み３の底面８、上端面２３及び内側面１３に塗布し、その後乾燥、焼成してナノ金属粒子に基づく第二電極１１、第三電極１２及び側面電極１４を形成することができる。ナノ金属粒子として金、銀又は銅を主成分とする材料を使用することができる。インクジェット方式は、窪み３の上端面２３、内側面１３及び底面８のように高低差のある場所に高精度の形状の電極パターンを形成することができる。また、インクジェット方式によれば蒸着法やスパッタ法よりも膜厚を厚く形成できるので、低抵抗の電極を形成することができる。更に、被塗布体の形状や基準位置を認識しながら必要な個所に電極パターンを形成することができるので、電極形成時の基板間に形状誤差が発生する場合や設計変更等の場合に容易に対応することができる。また、ナノ金属粒子にガラスフリットを混ぜてガラス基板等との間の密着性を向上させることができる。また、ナノ金属粒子は反応性が高いので１００℃〜２００℃の低温で硬化し、厚さが１μｍ〜１０μｍの低抵抗の配線電極を形成することができる。なお、インクジェット方式でナノ金属粒子を塗布し、乾燥・焼結させた電極の表面はうろこ状の模様を呈する。   Here, the second electrode 11, the third electrode 12, and the side electrode 14 can be formed by ejecting a liquid conductive material by an ink jet method and applying it to the housing member 2, followed by drying and sintering. For example, paste-like nano metal particles are applied to the bottom surface 8, the upper end surface 23, and the inner side surface 13 of the recess 3 by an ink jet method, and then dried and fired to form the second electrode 11, the third electrode 12, and the side surfaces based on the nano metal particles Electrode 14 can be formed. A material mainly composed of gold, silver, or copper can be used as the nanometal particles. The ink jet method can form an electrode pattern having a high accuracy in a place having a height difference such as the upper end surface 23, the inner side surface 13, and the bottom surface 8 of the recess 3. In addition, since the ink jet method can be formed thicker than the evaporation method or the sputtering method, a low-resistance electrode can be formed. In addition, it is possible to form electrode patterns where necessary while recognizing the shape and reference position of the object to be coated, so it is easy to use when there is a shape error between the substrates during electrode formation or when the design is changed. Can respond. In addition, glass frit can be mixed with nano metal particles to improve the adhesion between the glass substrate and the like. In addition, since the nano metal particles are highly reactive, they can be cured at a low temperature of 100 ° C. to 200 ° C. to form a low resistance wiring electrode having a thickness of 1 μm to 10 μm. In addition, the surface of the electrode which apply | coated the nano metal particle by the inkjet system, and was dried and sintered shows a scaly pattern.

図６（ａ）に示す収納部材２は、一辺が概ね１ｍｍ〜２．５ｍｍであり、厚さが略０．５ｍｍであり、窪み３の上端面２３の幅が０．１ｍｍ〜０．５ｍｍであり、窪み３の深さが略０．３ｍｍであり、底部の厚さが略０．２ｍｍである。また、図６（ｂ）に示すように、底面８に対する内側面１３の傾斜角φは６５°〜７５°であり、底面８に対する側面電極１４の電極面の傾斜角θは１７°〜２３°であり、傾斜路１５の幅は略４０μｍである。内側面１３の傾斜角φが７５°を超えると収納部材２を型成形により形成する際の離型性が低下する。インクジェット方式により吐出される一滴の液滴の広がり径が略３０μｍであることから、傾斜路１５の幅はインクジェットによる液滴吐出ばらつきを考慮すると略４０μｍを下回らないことが望ましい。側面電極１４の傾斜角θを１７°〜２３°にすることにより、傾斜路１５にインクジェット方式により電極材料を塗布した際に塗布液が流れ落ちることが無い。インクジェット方式により液滴を塗布する場合は、傾斜路１５、即ち側面電極１４の電極面の傾斜角θを６０°未満とすることが好ましい。傾斜角θを６０°未満とすればインクジェット方式によりナノ金属粒子を塗布したときに液だれを防止することができ、均一な又は必要な厚さの側面電極１４を形成することができる。傾斜角θを６０°以上とすると塗布されたナノ金属粒子が流れて目的の厚さの電極を形成することが難しくなる。   The storage member 2 shown in FIG. 6A has a side of approximately 1 mm to 2.5 mm, a thickness of approximately 0.5 mm, and a width of the upper end surface 23 of the recess 3 of 0.1 mm to 0.5 mm. Yes, the depth of the recess 3 is approximately 0.3 mm, and the thickness of the bottom is approximately 0.2 mm. 6B, the inclination angle φ of the inner surface 13 with respect to the bottom surface 8 is 65 ° to 75 °, and the inclination angle θ of the electrode surface of the side electrode 14 with respect to the bottom surface 8 is 17 ° to 23 °. The width of the ramp 15 is approximately 40 μm. When the inclination angle φ of the inner side surface 13 exceeds 75 °, the releasability when the storage member 2 is formed by molding is deteriorated. Since the spread diameter of one droplet ejected by the ink jet method is about 30 μm, it is desirable that the width of the inclined path 15 should not be less than about 40 μm in consideration of variations in ejecting droplets by ink jet. By setting the inclination angle θ of the side electrode 14 to 17 ° to 23 °, the coating liquid does not flow down when the electrode material is applied to the inclined path 15 by the ink jet method. When applying droplets by the ink jet method, it is preferable that the inclination angle θ of the inclined path 15, that is, the electrode surface of the side electrode 14, be less than 60 °. If the inclination angle θ is less than 60 °, dripping can be prevented when the nano metal particles are applied by the ink jet method, and the side electrode 14 having a uniform or necessary thickness can be formed. When the inclination angle θ is 60 ° or more, the applied nano metal particles flow and it becomes difficult to form an electrode having a desired thickness.

なお、本発明は、傾斜路１５が内側面１３を斜めに横切るように形成することに限定されない。例えば、内側面１３の傾斜角φが底面８に対して６０°未満であれば、段差状の傾斜路１５を形成しないで、第一実施形態や第二実施形態のように内側面１３の傾斜面に側面電極１４を形成することができる。この場合は、例えば図２又は図４に示すように左上角の第二電極１１と左上角の第三電極１２の最短距離の側面電極１４により電気的に接続することができる。また、傾斜路１５が２つの内側面１３に跨って連続的に形成するものであっても良い。例えば、傾斜路１５を上内側面１３ａから右内側面１３ｂに跨って形成し、傾斜路１５の上面に側面電極１４を形成し、底面８の左上角の第二電極１１と上端面２３の右下角の第三電極１２とを電気的に接続するように構成することができる。これにより、側面電極１４の傾斜角θを一層小さくすることができる。また、傾斜路１５を一つの内側面に葛折り状に形成することができる。この場合も、側面電極１４の傾斜角θを小さく形成することができる。   In addition, this invention is not limited to forming so that the slope 15 may cross the inner surface 13 diagonally. For example, if the inclination angle φ of the inner side surface 13 is less than 60 ° with respect to the bottom surface 8, the slope of the inner side surface 13 is not formed as in the first embodiment or the second embodiment without forming the step-like inclined path 15. Side electrodes 14 can be formed on the surface. In this case, for example, as shown in FIG. 2 or FIG. 4, the shortest distance side electrode 14 between the second electrode 11 at the upper left corner and the third electrode 12 at the upper left corner can be electrically connected. Alternatively, the slope 15 may be formed continuously across the two inner side surfaces 13. For example, the slope 15 is formed to extend from the upper inner surface 13 a to the right inner surface 13 b, the side electrode 14 is formed on the upper surface of the slope 15, and the second electrode 11 at the upper left corner of the bottom surface 8 and the right of the upper end surface 23 are formed. The lower corner third electrode 12 can be electrically connected. Thereby, the inclination angle θ of the side electrode 14 can be further reduced. Moreover, the inclined path 15 can be formed in the shape of a fold on one inner surface. Also in this case, the inclination angle θ of the side electrode 14 can be made small.

底面８から突出する土手２２は、光学素子４の活性領域７を囲み、第一面５に当接又は近接する。これにより、窪み３の開口側からモールド材を充填しても、モールド材が活性領域７と透明領域９の間の隙間に浸入することが無い。また、底面８の第一電極１０と第二電極１１はモールド材に埋め込まれるので電極の劣化を防止することができる。   A bank 22 protruding from the bottom surface 8 surrounds the active region 7 of the optical element 4 and abuts or approaches the first surface 5. Thereby, even if the mold material is filled from the opening side of the recess 3, the mold material does not enter the gap between the active region 7 and the transparent region 9. In addition, since the first electrode 10 and the second electrode 11 on the bottom surface 8 are embedded in the molding material, electrode deterioration can be prevented.

図７に示すように、収納部材２は枡形状を有し窪み３の底面８の中央部に土手２２を備えている。底面８の４つの角に第二電極１１を、上端面２３の４つの角の近傍に第三電極１２をそれぞれ有し、各内側面１３に形成した傾斜路１５の上面に側面電極１４を有している。側面電極１４は第二電極１１と第三電極１２とを電気的に接続している。なお、収納部材２の窪み３、傾斜路１５、土手２２は型成形により同時に形成することができる。   As shown in FIG. 7, the storage member 2 has a bowl shape and includes a bank 22 at the center of the bottom surface 8 of the recess 3. The second electrode 11 is provided at the four corners of the bottom surface 8, the third electrode 12 is provided near the four corners of the upper end surface 23, and the side electrode 14 is provided on the upper surface of the ramp 15 formed on each inner side surface 13. is doing. The side electrode 14 electrically connects the second electrode 11 and the third electrode 12. In addition, the dent 3, the slope 15, and the bank 22 of the storage member 2 can be simultaneously formed by molding.

この構成により、第二電極１１と第三電極１２とを低抵抗の側面電極１４により電気的に接続することができる。また、内側面１３の傾斜角φを６０°以上とすることができるので、収納部材２の外径を小さく構成することができる。更に、光学デバイス１の背面側に光学素子が突出しないので回路基板等の平坦面に容易に設置することができる。また、収納部材の窪みの上端面に第三電極１２を設けたので、光学デバイスを回路基板等に容易にフリップチップ実装することができ、実装後の光学デバイスの容積を小さく構成することができる。   With this configuration, the second electrode 11 and the third electrode 12 can be electrically connected by the low-resistance side electrode 14. Moreover, since the inclination | tilt angle (phi) of the inner surface 13 can be 60 degrees or more, the outer diameter of the storage member 2 can be comprised small. Furthermore, since the optical element does not protrude on the back side of the optical device 1, it can be easily installed on a flat surface such as a circuit board. In addition, since the third electrode 12 is provided on the upper end surface of the recess of the housing member, the optical device can be easily flip-chip mounted on a circuit board or the like, and the volume of the optical device after mounting can be reduced. .

（第四実施形態）
図８は、本発明の第四実施形態に係る光学デバイス１の縦断面模式図である。第二実施形態と異なる部分は、収納部材２がその底部に透明領域９の他に第二の透明領域２１を有し、底面８の第二の透明領域２１に対応して第二の土手２４を有し、光学素子４が活性領域７の他に第二の活性領域２０を有する点であり、その他の構成は第二実施形態と同様である。同一の部分または同一の機能を有する部分には同一の符号を付した。 (Fourth embodiment)
FIG. 8 is a schematic longitudinal sectional view of an optical device 1 according to the fourth embodiment of the present invention. The difference from the second embodiment is that the storage member 2 has a second transparent region 21 in addition to the transparent region 9 at the bottom, and a second bank 24 corresponding to the second transparent region 21 on the bottom surface 8. The optical element 4 has a second active region 20 in addition to the active region 7, and the other configuration is the same as that of the second embodiment. The same reference numerals are assigned to the same parts or parts having the same function.

図８に示すように、光学素子４はその第一面５に活性領域７と第二の活性領域２０を有する。例えば、活性領域７が発光素子であり第二の活性領域２０が受光素子であり、同一の半導体基板に形成されている。収納部材２はその底面８に土手２２と第二の土手２４を有し、土手２２が活性領域７を取り囲むように第一面５に当接又は近接し、第二の土手２４が第二の活性領域２０を取り囲むように第一面５に当接又は近接している。収納部材２はその底部の、活性領域７に対面する位置に透明領域９を有し、第二の活性領域２０に対面する位置に第二の透明領域２１を有している。従って、活性領域７が発光した光は透明領域９を介して外部に放射され、第二の透明領域２１に入射した光を第二の活性領域２０が受光する。光学素子４の第一面５に形成される第一電極１０は、底面８に形成した第二電極１１、内側面１３に形成した側面電極１４を介して上端面２３に形成した第三電極１２に電気的に接続する。   As shown in FIG. 8, the optical element 4 has an active region 7 and a second active region 20 on its first surface 5. For example, the active region 7 is a light emitting element and the second active region 20 is a light receiving element, which are formed on the same semiconductor substrate. The storage member 2 has a bank 22 and a second bank 24 on its bottom surface 8. The bank 22 abuts or is close to the first surface 5 so as to surround the active region 7, and the second bank 24 is a second bank 24. It is in contact with or close to the first surface 5 so as to surround the active region 20. The storage member 2 has a transparent region 9 at a position facing the active region 7 on the bottom thereof, and a second transparent region 21 at a position facing the second active region 20. Therefore, the light emitted from the active region 7 is radiated to the outside through the transparent region 9, and the second active region 20 receives the light incident on the second transparent region 21. The first electrode 10 formed on the first surface 5 of the optical element 4 includes a second electrode 11 formed on the bottom surface 8 and a third electrode 12 formed on the upper end surface 23 via a side electrode 14 formed on the inner side surface 13. Electrically connect to

光学素子４は、黒色のモールド材１６によりモールドされている。モールド材１６は活性領域７と透明領域９との隙間、及び第二の活性領域２０と第二の透明領域２１との隙間を除いて光学素子４を覆っている。つまり、光学素子４の第一面５は土手２２及び第二の土手２４により囲まれる領域を除いて黒色のモールド材１６によりモールドされる。そのために、活性領域７で発光した光は第二の活性領域２０に入射されない。なお、活性領域７と第二の活性領域２０とを光学的に完全に分離するために、例えば収納部材２の底部の外面に透明領域９と第二の透明領域２１の領域のみ開口したフィルターやブラックマスクを設置することができる。また、収納部材２の材料を、透明領域９と第二の透明領域２１以外の領域を黒色等に着色することにより、光学的に完全に分離することができる。   The optical element 4 is molded with a black molding material 16. The molding material 16 covers the optical element 4 except for the gap between the active area 7 and the transparent area 9 and the gap between the second active area 20 and the second transparent area 21. That is, the first surface 5 of the optical element 4 is molded by the black molding material 16 except for the area surrounded by the bank 22 and the second bank 24. Therefore, the light emitted from the active region 7 is not incident on the second active region 20. In order to optically completely separate the active region 7 and the second active region 20, for example, a filter in which only the regions of the transparent region 9 and the second transparent region 21 are opened on the outer surface of the bottom of the storage member 2, A black mask can be installed. Further, the material of the storage member 2 can be optically completely separated by coloring the region other than the transparent region 9 and the second transparent region 21 to black or the like.

なお、光学素子４は、活性領域７と第二の活性領域２０とが半導体基板上に作り込まれているものに限定されず、発光素子と受光素子が同一基板上に並列して実装されているものであってもよい。また、側面電極１４は、内側面１３に傾斜路１５を形成しその上面にインクジェット方式によりナノ金属粒子を塗布して形成することができる。   The optical element 4 is not limited to the one in which the active region 7 and the second active region 20 are formed on the semiconductor substrate, and the light emitting element and the light receiving element are mounted in parallel on the same substrate. It may be. Further, the side electrode 14 can be formed by forming an inclined path 15 on the inner side surface 13 and applying nano metal particles on the upper surface thereof by an ink jet method.

（第五実施形態）
図９は、本発明の第五実施形態に係る光学デバイス１の縦断面模式図である。本第五実施形態の光学デバイス１は、第二実施形態の光学デバイス１の上端面２３に機能性素子基板２６を接合した構造を備えている。従って、以下、主に第二実施形態と異なる部分について説明し、第二実施形態と同一の部分については説明を省略する。同一の部分または同一の機能を有する部分には同一の符号を付している。 (Fifth embodiment)
FIG. 9 is a schematic longitudinal sectional view of an optical device 1 according to the fifth embodiment of the present invention. The optical device 1 of the fifth embodiment has a structure in which a functional element substrate 26 is bonded to the upper end surface 23 of the optical device 1 of the second embodiment. Accordingly, the following description will mainly focus on the differences from the second embodiment, and omit the description of the same parts as in the second embodiment. The same portions or portions having the same function are denoted by the same reference numerals.

機能性素子基板２６は、窪み３側の表面に機能性素子２５と、第四電極２９と、機能性素子２５と第四電極２９と電気的に接続するワイヤー２８を備え、窪み３の上端面２３の位置に貫通電極２７を備えている。貫通電極２７は、機能性素子２５側からその反対側に貫通して露出し、他の素子と電気的に接続可能に構成されている。貫通電極２７は、第四電極２９及び第三電極１２と電気的に接続している。   The functional element substrate 26 includes a functional element 25, a fourth electrode 29, and a wire 28 that is electrically connected to the functional element 25 and the fourth electrode 29 on the surface on the recess 3 side. A through electrode 27 is provided at a position 23. The through electrode 27 is exposed to penetrate from the functional element 25 side to the opposite side, and is configured to be electrically connectable to other elements. The through electrode 27 is electrically connected to the fourth electrode 29 and the third electrode 12.

機能性素子２５は、例えば演算回路や、光学素子４の発光を制御する制御回路や、光学素子４が受光した光の検出回路等とすることができる。機能性素子基板２６は窪み３の開口部を密閉するので光学素子４や機能性素子２５が湿度や不純物により腐食し、或いは汚染されるのを防止することができる。このように高機能又は多機能な光学素子をコンパクトに構成することができる。なお、側面電極１４は、内側面１３に傾斜路１５を形成しその上面にインクジェット方式によりナノ金属粒子を塗布して形成することができる。なお、本実施形態において、窪み３の底面８に土手２２を設置しているが、窪み３の内部にモールド材を充填しない場合や、第一電極１０と第二電極１１の電気的接続の際に接着剤等が活性領域７に浸みこまなければ土手２２を除去しても良い。   The functional element 25 can be, for example, an arithmetic circuit, a control circuit that controls light emission of the optical element 4, a detection circuit for light received by the optical element 4, or the like. Since the functional element substrate 26 seals the opening of the recess 3, the optical element 4 and the functional element 25 can be prevented from being corroded or contaminated by humidity or impurities. In this way, a high-functional or multifunctional optical element can be configured compactly. The side electrode 14 can be formed by forming an inclined path 15 on the inner side surface 13 and applying nano metal particles on the upper surface thereof by an ink jet method. In addition, in this embodiment, although the bank 22 is installed in the bottom face 8 of the hollow 3, the case where the molding material is not filled in the hollow 3 or when the first electrode 10 and the second electrode 11 are electrically connected. If the adhesive does not soak into the active region 7, the bank 22 may be removed.

（第六実施形態）
図１０は、本発明の第六実施形態に係る光学デバイス１の縦断面模式図である。本第六実施形態の光学デバイス１は、機能性素子２５が光学的な機能を有し、窪み３の底部に形成した透明領域９と異なる第二の透明領域２１を介して光を入射し又は出射する。第四実施形態と異なる点は活性領域７と第二の活性領域２０とが異なる基板に形成されていることである。同一の部分または同一の機能を有する部分には同一の符号を付している。 (Sixth embodiment)
FIG. 10 is a schematic longitudinal sectional view of the optical device 1 according to the sixth embodiment of the present invention. In the optical device 1 of the sixth embodiment, the functional element 25 has an optical function, and light is incident through a second transparent region 21 different from the transparent region 9 formed at the bottom of the recess 3 or Exit. The difference from the fourth embodiment is that the active region 7 and the second active region 20 are formed on different substrates. The same portions or portions having the same function are denoted by the same reference numerals.

光学デバイス１は、窪み３を有する収納部材２と、窪み３の底面８に設置した光学素子４と、窪み３の上端面２３に設置した機能性素子基板２６と、機能性素子基板２６の窪み３側に実装された機能性素子２５を備えている。光学素子４は第一面５が窪み３の底面８に対面し、第一面５は光学的に活性な活性領域７と第一電極１０を備えている。収納部材２は、活性領域７に対面する窪み３の底部の透明領域９と、機能性素子２５に対面する窪み３の底部の第二の透明領域２１を備えている。収納部材２は、底面８に活性領域７を囲む土手２２を備え、土手２２の上端面が光学素子４の第一面５に当接又は近接している。収納部材２は、底面８に第二電極１１を備え、第二電極１１は光学素子４に設置された第一電極１０と電気的に接続している。窪み３の内側面１３は側面電極１４を備え、窪み３の開口側の上端面２３は第三電極１２を備え、上端面２３は側面電極１４を介して第二電極１１に電気的に接続する。   The optical device 1 includes a storage member 2 having a recess 3, an optical element 4 installed on the bottom surface 8 of the recess 3, a functional element substrate 26 installed on the upper end surface 23 of the recess 3, and a recess of the functional element substrate 26. A functional element 25 mounted on the third side is provided. In the optical element 4, the first surface 5 faces the bottom surface 8 of the recess 3, and the first surface 5 includes an optically active active region 7 and a first electrode 10. The storage member 2 includes a transparent region 9 at the bottom of the recess 3 facing the active region 7 and a second transparent region 21 at the bottom of the recess 3 facing the functional element 25. The storage member 2 includes a bank 22 that surrounds the active region 7 on the bottom surface 8, and an upper end surface of the bank 22 is in contact with or close to the first surface 5 of the optical element 4. The storage member 2 includes a second electrode 11 on the bottom surface 8, and the second electrode 11 is electrically connected to the first electrode 10 installed on the optical element 4. The inner surface 13 of the recess 3 includes a side electrode 14, the upper end surface 23 on the opening side of the recess 3 includes a third electrode 12, and the upper end surface 23 is electrically connected to the second electrode 11 via the side electrode 14. .

機能性素子基板２６は、第二の透明領域２１に対応する位置に機能性素子２５を備えている。機能性素子２５は、第二の透明領域２１に対面する位置に第二の活性領域２０を有し、機能性素子基板２６の窪み３側に設置された第四電極２９とワイヤー２８を介して電気的に接続している。機能性素子基板２６は、上端面２３の位置に貫通電極２７を備え、貫通電極２７は第三電極１２及び第四電極２９と電気的に接続する。貫通電極２７は機能性素子２５とは反対側に露出し、外部回路に接続することができる。   The functional element substrate 26 includes a functional element 25 at a position corresponding to the second transparent region 21. The functional element 25 has the second active region 20 at a position facing the second transparent region 21, and the fourth element 29 disposed on the side of the depression 3 of the functional element substrate 26 and the wire 28. Electrically connected. The functional element substrate 26 includes a through electrode 27 at the position of the upper end surface 23, and the through electrode 27 is electrically connected to the third electrode 12 and the fourth electrode 29. The through electrode 27 is exposed on the side opposite to the functional element 25 and can be connected to an external circuit.

これにより、多機能な光学デバイス１をコンパクトに構成することができる。機能性素子基板２６は窪み３の開口端を閉塞するので、機能性素子２５や光学素子４が湿度や不純物により腐食し或いは汚染されるのを防止することができる。また、側面電極１４は、内側面１３に傾斜路を形成しその上面にインクジェット方式によりナノ金属を塗布して形成することができる。なお、本実施形態において、窪み３の底面８に設置した土手２２は除去することができる。
以上、第一〜第六実施形態を単体の光学デバイス１を用いて説明したが、一つの基板に多数の光学デバイス１を同時に形成することができる。 Thereby, the multifunctional optical device 1 can be comprised compactly. Since the functional element substrate 26 closes the opening end of the recess 3, the functional element 25 and the optical element 4 can be prevented from being corroded or contaminated by humidity or impurities. Further, the side electrode 14 can be formed by forming a slope on the inner side surface 13 and applying a nano metal on the upper surface by an ink jet method. In the present embodiment, the bank 22 installed on the bottom surface 8 of the recess 3 can be removed.
As described above, the first to sixth embodiments have been described using the single optical device 1, but a large number of optical devices 1 can be simultaneously formed on one substrate.

１ 光学デバイス１
２ 収納部材
３ 窪み
４ 光学素子
５ 第一面
６ 第二面
７ 活性領域
８ 底面
９ 透明領域
１０ 第一電極
１１ 第二電極
１２ 第三電極
１４ 側面電極
１５ 傾斜路
１６ モールド材 1 Optical device 1
2 Housing member 3 Dimple 4 Optical element 5 First surface 6 Second surface 7 Active region 8 Bottom surface 9 Transparent region 10 First electrode 11 Second electrode 12 Third electrode 14 Side electrode 15 Slope 16 Mold material

Claims (11)

光学的に活性な活性領域と第一電極を有する第一面と前記第一面の反対側に第二面を有する光学素子と、
中央に窪みを有し、前記窪みの底面の側に前記第一面を向け、前記窪みの開口側の上端面から前記第二面が突出しないよう前記光学素子を収納する収納部材と、を備え、
前記収納部材は、前記活性領域に対面する前記窪みの底部の領域が透明領域であり、前記底面に前記第一電極と電気的に接続する第二電極と、前記上端面に前記第二電極と電気的に接続する第三電極を有する光学デバイス。 An optical element having an optically active active region, a first surface having a first electrode, and a second surface opposite the first surface;
A housing member that has a recess in the center, faces the first surface toward the bottom surface of the recess, and stores the optical element so that the second surface does not protrude from the upper end surface on the opening side of the recess. ,
The storage member includes a transparent region in a bottom region of the depression facing the active region, a second electrode electrically connected to the first electrode on the bottom surface, and the second electrode on the upper end surface. An optical device having a third electrode for electrical connection. 前記窪みの内側面は、前記第二電極と前記第三電極とを電気的に接続する側面電極を有する請求項１に記載の光学デバイス。   The optical device according to claim 1, wherein an inner side surface of the recess has a side electrode that electrically connects the second electrode and the third electrode. 前記側面電極の電極面は、前記底面に対して６０°を超えない傾斜角を有する請求項２に記載の光学デバイス。   The optical device according to claim 2, wherein the electrode surface of the side electrode has an inclination angle not exceeding 60 ° with respect to the bottom surface. 前記内側面は、前記底面に対して傾斜する傾斜路を有し、
前記傾斜路の路面上に前記側面電極が形成されている請求項３に記載の光学デバイス。 The inner side surface has an inclined path inclined with respect to the bottom surface,
The optical device according to claim 3, wherein the side electrode is formed on a road surface of the ramp. 前記傾斜路は、前記底面から前記上端面にかけて葛折り状の形状を有する請求項４に記載の光学デバイス。   The optical device according to claim 4, wherein the ramp has a distorted shape from the bottom surface to the upper end surface. 前記側面電極はナノ金属粒子を塗布して形成される請求項２〜５のいずれか一項に記載の光学デバイス。   The optical device according to claim 2, wherein the side electrode is formed by applying nano metal particles. 前記底面は、前記活性領域を囲む土手を有する請求項１〜６のいずれか一項に記載の光学デバイス。   The optical device according to claim 1, wherein the bottom surface has a bank surrounding the active region. 前記第一面は、前記土手により囲まれる領域を除いてモールド材によりモールドされている請求項７に記載の光学デバイス。   The optical device according to claim 7, wherein the first surface is molded with a molding material except for a region surrounded by the bank. 前記光学素子は、前記第一面に前記活性領域に隣接して第二の活性領域を有し、
前記収納部材は、前記第二の活性領域に対面する前記底部の領域が第二の透明領域である請求項１〜８のいずれか一項に記載の光学デバイス。 The optical element has a second active region adjacent to the active region on the first surface;
The optical device according to any one of claims 1 to 8, wherein the storage member has a second transparent region in the bottom region facing the second active region. 機能性素子と、前記機能性素子を前記窪みの側に有し、前記上端面に接合される機能性素子基板とを更に備え、
前記機能性素子基板は貫通電極を有し、前記機能性素子は前記貫通電極に電気的に接続し、前記貫通電極は前記第三電極に電気的に接続する請求項１〜７のいずれか一項に記載の光学デバイス。 A functional element; and a functional element substrate having the functional element on the recess side and bonded to the upper end surface;
The functional element substrate has a through electrode, the functional element is electrically connected to the through electrode, and the through electrode is electrically connected to the third electrode. The optical device according to Item. 前記機能性素子は、前記光学素子の側に光学的に活性な第二の活性領域を有し、
前記収納部材は、前記第二の活性領域に対面する前記底部の領域が第二の透明領域である請求項１０に記載の光学デバイス。 The functional element has a second active region that is optically active on the side of the optical element;
The optical device according to claim 10, wherein in the housing member, the bottom region facing the second active region is a second transparent region.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014123588A (en) * 2012-12-20 2014-07-03 Seiko Instruments Inc Optical device and manufacturing method of the same
JP2016535533A (en) * 2013-08-26 2016-11-10 オプティツ インコーポレイテッド Integrated camera module and manufacturing method thereof
JP2018148155A (en) * 2017-03-09 2018-09-20 キヤノン株式会社 Electronic component and manufacturing method of the same
JP2021027321A (en) * 2019-07-31 2021-02-22 株式会社京都セミコンダクター Light-receiving element unit

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330581A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device and video camera unit using the same and its manufacture
JPH0660156U (en) * 1993-01-25 1994-08-19 松下電工株式会社 Printed board
JP2001250889A (en) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd Mounting structure of optical element and its manufacturing method
JP2002118270A (en) * 2000-10-06 2002-04-19 Tokai Rika Co Ltd Optical device and its fabricating method
JP2003140008A (en) * 2001-11-06 2003-05-14 Seiko Epson Corp Optical module, its manufacturing method, and light transmission device
WO2003092032A1 (en) * 2002-04-23 2003-11-06 Yuugenkaisha Omega Techno Modeling Method of manufacturing rear substrate for plasma display panel
JP2005268567A (en) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd Substrate and its manufacturing method
JP2005338218A (en) * 2004-05-25 2005-12-08 Matsushita Electric Ind Co Ltd Imaging apparatus
JP2006201427A (en) * 2005-01-20 2006-08-03 Kyocera Corp Package for housing imaging element, imaging apparatus and imaging module
WO2007083579A1 (en) * 2006-01-20 2007-07-26 Matsushita Electric Industrial Co., Ltd. Compound eye camera module and method of producing the same
JP2007335241A (en) * 2006-06-15 2007-12-27 Canon Inc Wiring substrate, electron source, image display device and image reproducing device
JP2008124923A (en) * 2006-11-14 2008-05-29 Matsushita Electric Works Ltd Camera module
JP2010016012A (en) * 2008-06-30 2010-01-21 Fujitsu Ltd Photoelectric conversion device, photoelectric conversion module, and method of manufacturing photoelectric conversion device
JP2010153691A (en) * 2008-12-26 2010-07-08 Seiko Instruments Inc Method of manufacturing electronic device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330581A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device and video camera unit using the same and its manufacture
JPH0660156U (en) * 1993-01-25 1994-08-19 松下電工株式会社 Printed board
JP2001250889A (en) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd Mounting structure of optical element and its manufacturing method
JP2002118270A (en) * 2000-10-06 2002-04-19 Tokai Rika Co Ltd Optical device and its fabricating method
JP2003140008A (en) * 2001-11-06 2003-05-14 Seiko Epson Corp Optical module, its manufacturing method, and light transmission device
WO2003092032A1 (en) * 2002-04-23 2003-11-06 Yuugenkaisha Omega Techno Modeling Method of manufacturing rear substrate for plasma display panel
JP2005268567A (en) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd Substrate and its manufacturing method
JP2005338218A (en) * 2004-05-25 2005-12-08 Matsushita Electric Ind Co Ltd Imaging apparatus
JP2006201427A (en) * 2005-01-20 2006-08-03 Kyocera Corp Package for housing imaging element, imaging apparatus and imaging module
WO2007083579A1 (en) * 2006-01-20 2007-07-26 Matsushita Electric Industrial Co., Ltd. Compound eye camera module and method of producing the same
JP2007335241A (en) * 2006-06-15 2007-12-27 Canon Inc Wiring substrate, electron source, image display device and image reproducing device
JP2008124923A (en) * 2006-11-14 2008-05-29 Matsushita Electric Works Ltd Camera module
JP2010016012A (en) * 2008-06-30 2010-01-21 Fujitsu Ltd Photoelectric conversion device, photoelectric conversion module, and method of manufacturing photoelectric conversion device
JP2010153691A (en) * 2008-12-26 2010-07-08 Seiko Instruments Inc Method of manufacturing electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014123588A (en) * 2012-12-20 2014-07-03 Seiko Instruments Inc Optical device and manufacturing method of the same
JP2016535533A (en) * 2013-08-26 2016-11-10 オプティツ インコーポレイテッド Integrated camera module and manufacturing method thereof
JP2018148155A (en) * 2017-03-09 2018-09-20 キヤノン株式会社 Electronic component and manufacturing method of the same
US10367102B2 (en) 2017-03-09 2019-07-30 Canon Kabushiki Kaisha Electronic component and equipment
JP2021027321A (en) * 2019-07-31 2021-02-22 株式会社京都セミコンダクター Light-receiving element unit

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