JP2012164703A

JP2012164703A - Heat radiation structure of electronic component

Info

Publication number: JP2012164703A
Application number: JP2011021808A
Authority: JP
Inventors: Miwa Tomiyama; 美和富山
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2011-02-03
Filing date: 2011-02-03
Publication date: 2012-08-30
Anticipated expiration: 2031-02-03
Also published as: JP5706703B2

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic device capable of radiating heat of an electronic component with efficiency.SOLUTION: A power transformer 3 is mounted on a substrate 2. A heat radiation sheet 5 is provided on a ferrite core 4 of the power transformer 3. A heat transfer cooling plate 6 is provided on the heat radiation sheet 5 while being tightly adhered to the heat radiation sheet 5. Heat generated in the power transformer 3 is transferred to the heat transfer cooling plate 6 through the ferrite core 4 and the heat radiation sheet 5, and radiated from the heat transfer cooling plate 6 to the interior of a housing of an electronic device. The heat transfer cooling plate 6 is bent at a right angle at a position of contacting with a case 1 (the device housing) and tightly fixed to the case 1. The heat generated in the power transformer 3 is transferred from the heat transfer cooling plate 6 to the case 1, and radiated from the case 1 to the exterior of the electronic device.

Description

本発明は、電子部品の放熱構造に関する。 The present invention relates to a heat dissipation structure for an electronic component.

通信の高速大容量化にともない、通信基地局等の電子装置に内蔵された電子デバイスが演算処理の過程で極めて高温化する傾向にある。このため、電子デバイスからの熱を効果的に放熱する構造が望まれている。例えば、電源トランスは、通常、フェライトを備えている（特許文献１参照）。
さらに、従来の電源トランスの放熱構造としては、フェライトがアルミ等の金属のバンドで固定されたものが知られている。金属バンドは、電源トランスが発生する熱を自然空冷するようになっている。 Along with the increase in communication speed and capacity, electronic devices built in electronic devices such as communication base stations tend to become extremely hot in the process of arithmetic processing. For this reason, a structure that effectively dissipates heat from the electronic device is desired. For example, a power transformer usually includes ferrite (see Patent Document 1).
Further, as a conventional heat dissipation structure for a power transformer, a structure in which ferrite is fixed by a metal band such as aluminum is known. The metal band naturally cools the heat generated by the power transformer.

特開２００３−２７２８２５号公報JP 2003-272825 A

しかしながら、近年、筐体の小型化から電源トランスも小型化が進み、また、電源トランスの周囲の雰囲気温度も高温化しているため、従来の金属バンドのみの自然空冷では放熱が不十分であり、電源トランスの温度が上昇してトランスの温度許容値をオーバーする可能性がある。 However, in recent years, the power transformer has also been downsized due to the miniaturization of the housing, and the ambient temperature around the power transformer has also increased, so heat radiation is insufficient with natural air cooling using only a conventional metal band, There is a possibility that the temperature of the power transformer rises and exceeds the allowable temperature of the transformer.

本発明は、このような問題点に鑑みてなされたものであり、本発明の目的は、電子部品の熱を効率良く放熱することのできる電子装置の放熱構造を提供することにある。 The present invention has been made in view of such problems, and an object of the present invention is to provide a heat dissipation structure for an electronic device that can efficiently dissipate heat of an electronic component.

上記目的を達成するため、本発明は、筐体内の基板上に配置される電子部品の放熱構造であって、前記電子部品の上面に密着させた伝熱冷却板を設けたことを特徴とする。 In order to achieve the above object, the present invention is a heat dissipation structure for an electronic component disposed on a substrate in a housing, and is provided with a heat transfer cooling plate in close contact with the upper surface of the electronic component. .

前記伝熱冷却板は第１面および第２面を有し、前記伝熱冷却板の第１面を前記電子部品の上面に密着させ、前記伝熱冷却板の第２面を前記筐体の側面に密着させたことを特徴とする。 The heat transfer cooling plate has a first surface and a second surface, the first surface of the heat transfer cooling plate is brought into close contact with the upper surface of the electronic component, and the second surface of the heat transfer cooling plate is attached to the housing. It is characterized by being in close contact with the side surface.

また、前記伝熱冷却板は第１面および第２面を有し、前記伝熱冷却板の第１面を前記電子部品の上面に密着させ、前記伝熱冷却板の第２面を前記電子部品の側面に密着させたことを特徴とする。 The heat transfer cooling plate has a first surface and a second surface, the first surface of the heat transfer cooling plate is brought into close contact with the upper surface of the electronic component, and the second surface of the heat transfer cooling plate is attached to the electronic device. It is characterized by being in close contact with the side surface of the part.

さらに、前記伝熱冷却板は、前記電子部品を固定していることを特徴とする。 Furthermore, the heat transfer cooling plate fixes the electronic component.

本発明は、電子部品に接して伝熱冷却板が設けられているので、電子部品の熱を効率良く放熱することができる。
また、本発明は、伝熱冷却板を延伸、拡大させて電子装置筐体に固定すると、電子部品の熱を電子装置外部にも放熱させることができるので、更に効率良く放熱することができる。 In the present invention, since the heat transfer cooling plate is provided in contact with the electronic component, the heat of the electronic component can be efficiently radiated.
Further, according to the present invention, when the heat transfer cooling plate is stretched and expanded and fixed to the electronic device casing, the heat of the electronic component can be radiated to the outside of the electronic device, so that the heat can be radiated more efficiently.

本発明の放熱構造の一例を示す電子装置の一部断面図である。It is a partial cross section figure of the electronic device which shows an example of the thermal radiation structure of this invention. 図１に示す放熱構造に係る伝熱冷却板の一例を示す斜視図である。It is a perspective view which shows an example of the heat-transfer cooling plate which concerns on the thermal radiation structure shown in FIG. 図１に示す放熱構造に係る伝熱冷却板の他の例を示す斜視図である。It is a perspective view which shows the other example of the heat-transfer cooling plate which concerns on the thermal radiation structure shown in FIG. 本発明の放熱構造の他の例を示す電子装置の一部断面図である。It is a partial cross section figure of the electronic device which shows the other example of the thermal radiation structure of this invention. 図４に示す放熱構造に係る伝熱冷却板の一例を示す斜視図である。It is a perspective view which shows an example of the heat-transfer cooling plate which concerns on the thermal radiation structure shown in FIG. 伝熱冷却板の他の例を示す斜視図である。It is a perspective view which shows the other example of a heat-transfer cooling plate. 伝熱冷却板の更に他の例を示す斜視図である。It is a perspective view which shows the other example of a heat-transfer cooling plate.

本発明の実施の形態について、図面を参照して説明する。図１は、本発明の放熱構造の一例を示す電子装置の一部断面図である。なお、以下の実施例では、電子装置の電源トランスの放熱構造について説明するが、本発明は、基板上にあって発熱する一般的な電子部品に適用可能である。 Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partial cross-sectional view of an electronic device showing an example of a heat dissipation structure of the present invention. In the following embodiments, the heat dissipation structure of the power transformer of the electronic device will be described. However, the present invention is applicable to general electronic components that are on a substrate and generate heat.

基板２上には電源トランス３が搭載され、電源トランス３のフェライトコア４の上には弾性をもつ放熱シート５が設けられ、さらに、放熱シート５の上には放熱シート５に密着させて伝熱冷却板６が設けられている。伝熱冷却板６は、厚さ１〜２ｍｍのアルミニウム、銅等の金属板である。放熱シート５は、絶縁性部材からなり、電源トランス３と伝熱冷却板６とは、放熱シート５を介することにより電気的に絶縁されている。電源トランス３で発生した熱は、フェライトコア４、放熱シート５を通って、伝熱冷却板６に伝熱され、伝熱冷却板６から電子装置の筐体内部に放熱される。 A power transformer 3 is mounted on the substrate 2, an elastic heat radiating sheet 5 is provided on the ferrite core 4 of the power transformer 3, and the heat radiating sheet 5 is in close contact with the heat radiating sheet 5 to be transmitted. A thermal cooling plate 6 is provided. The heat transfer cooling plate 6 is a metal plate such as aluminum or copper having a thickness of 1 to 2 mm. The heat radiating sheet 5 is made of an insulating member, and the power transformer 3 and the heat transfer cooling plate 6 are electrically insulated by the heat radiating sheet 5 interposed therebetween. The heat generated in the power transformer 3 is transferred to the heat transfer cooling plate 6 through the ferrite core 4 and the heat dissipation sheet 5, and is radiated from the heat transfer cooling plate 6 to the inside of the housing of the electronic device.

また、伝熱冷却板６は、ケース１（装置筐体）に接するところで直角に折り曲げられ、延伸、拡大され、拡大伝熱部（第１の伝熱部）で、放熱グリス（図示せず）を介してケース１に止めネジ等で密着固定されている。図２は、伝熱冷却板６の一例を示す斜視図である。電源トランス３で発生した熱は、伝熱冷却板６からケース１に伝熱されて、ケース１から電子装置外部にも放熱される。また、伝熱冷却板６が、電源トランス３およびフェライトコア４を固定するようにしてもよい。 Further, the heat transfer cooling plate 6 is bent at a right angle where it contacts the case 1 (apparatus housing), stretched and enlarged, and is expanded heat transfer section (first heat transfer section) to dissipate heat radiation (not shown). It is closely fixed to the case 1 with a set screw or the like. FIG. 2 is a perspective view showing an example of the heat transfer cooling plate 6. The heat generated in the power transformer 3 is transferred from the heat transfer cooling plate 6 to the case 1 and radiated from the case 1 to the outside of the electronic device. Further, the heat transfer cooling plate 6 may fix the power transformer 3 and the ferrite core 4.

図３は、伝熱冷却板の他の例を示す斜視図である。図３では、伝熱冷却板１１の筐体固定部１２（第１の伝熱部）を、ケース１の側面に沿って左右に延伸、拡大させて、ケース１に接する面積を大きくしている。筐体固定部１２とケース１との接する面積を大きくすることによって、電源トランス３で発生した熱を、電子装置外部に更に効率よく放熱させることができる。 FIG. 3 is a perspective view showing another example of the heat transfer cooling plate. In FIG. 3, the housing fixing portion 12 (first heat transfer portion) of the heat transfer cooling plate 11 is extended to the left and right along the side surface of the case 1 to enlarge the area in contact with the case 1. . By increasing the contact area between the housing fixing part 12 and the case 1, the heat generated in the power transformer 3 can be radiated more efficiently to the outside of the electronic device.

図４は、本発明の放熱構造の他の例を示す電子装置の一部断面図である。図１に示す放熱構造と比較すると、図４に示す放熱構造は、電源トランス３のフェライトコア４の上には弾性をもつ放熱シート５が設けられ、さらに、放熱シート５の上には放熱シート５に密着させて伝熱冷却板７が設けられ、さらに、伝熱冷却板７が、ケース１（装置筐体）に接するところで直角に折り曲げられ、延伸、拡大され、拡大伝熱部で、放熱グリス（図示せず）を介してケース１に止めネジ等で密着固定されている点で図１に示す放熱構造と同一であるが、伝熱冷却板７を、電源トランス３の角部で直角に折り曲げて延伸、拡大させて、拡大伝熱部（第２の伝熱部）で電源トランス３の１つの側面部（コイル部）に放熱シート５を介して密着させている点で図１に示す放熱構造と相違する。以下、図４において、図１と共通する部分には図１と同一の符号を付し、その詳しい説明は省略する。 FIG. 4 is a partial cross-sectional view of an electronic device showing another example of the heat dissipation structure of the present invention. Compared with the heat dissipation structure shown in FIG. 1, the heat dissipation structure shown in FIG. 4 is provided with a heat dissipation sheet 5 having elasticity on the ferrite core 4 of the power transformer 3, and further on the heat dissipation sheet 5. 5, a heat transfer cooling plate 7 is provided, and the heat transfer cooling plate 7 is bent at a right angle where it contacts the case 1 (apparatus housing), stretched, enlarged, and radiated at the enlarged heat transfer portion. 1 is the same as the heat dissipation structure shown in FIG. 1 in that it is closely fixed to the case 1 with a set screw or the like via grease (not shown), but the heat transfer cooling plate 7 is perpendicular to the corner of the power transformer 3. 1 in that it is bent and stretched and expanded, and is brought into close contact with one side surface portion (coil portion) of the power transformer 3 via the heat radiating sheet 5 at the expanded heat transfer portion (second heat transfer portion). It differs from the heat dissipation structure shown. In the following, in FIG. 4, the same reference numerals as those in FIG.

図５は、図４に示す放熱構造に係る伝熱冷却板の一例を示す斜視図である。図５に示す伝熱冷却板は、延伸、拡大された拡大伝熱部（第２の伝熱部）を備えて、電源トランス３の上面と、少なくとも１つの側面に密着できるように形成されており、図５に示す伝熱冷却板を用いた放熱構造では、電源トランス３の上面と、１つの側面の合計２面から放熱が行えるので、電源トランス３で発生した熱を、図１に示す放熱構造よりも、さらに効率良く放熱することができる。 FIG. 5 is a perspective view showing an example of a heat transfer cooling plate according to the heat dissipation structure shown in FIG. The heat transfer cooling plate shown in FIG. 5 includes an expanded heat transfer section (second heat transfer section) that is stretched and expanded, and is formed so as to be in close contact with the upper surface of the power transformer 3 and at least one side surface. In the heat dissipation structure using the heat transfer cooling plate shown in FIG. 5, heat can be radiated from a total of two surfaces including the upper surface of the power transformer 3 and one side surface. Therefore, the heat generated in the power transformer 3 is shown in FIG. Heat can be radiated more efficiently than the heat dissipation structure.

図６は、伝熱冷却板の他の例を示す斜視図である。図６に示す伝熱冷却板は、延伸、拡大された拡大伝熱部（第３の伝熱部）を備えて、電源トランス３の上面と、少なくとも２つの側面に密着できるように形成されており、図６に示す伝熱冷却板を用いた放熱構造では、電源トランス３の３面から放熱が行えるので、さらに放熱を高めることができる。 FIG. 6 is a perspective view showing another example of the heat transfer cooling plate. The heat transfer cooling plate shown in FIG. 6 includes an expanded heat transfer portion (third heat transfer portion) that is stretched and enlarged, and is formed so as to be in close contact with the upper surface of the power transformer 3 and at least two side surfaces. In the heat dissipation structure using the heat transfer cooling plate shown in FIG. 6, heat can be dissipated from the three surfaces of the power transformer 3, so that heat dissipation can be further increased.

図７は、伝熱冷却板の更に他の例を示す斜視図である。図７に示す伝熱冷却板は、延伸、拡大された拡大伝熱部（第４の伝熱部）を備えて、電源トランス３の上面と、少なくとも３つの側面に密着できるように箱形に形成されており、図７に示す伝熱冷却板を用いた放熱構造では、電源トランス３の上面と、３つの側面の合計４面から放熱が行えるので、さらに放熱を高めることができる。 FIG. 7 is a perspective view showing still another example of the heat transfer cooling plate. The heat transfer cooling plate shown in FIG. 7 has an expanded heat transfer section (fourth heat transfer section) that is extended and expanded, and is in a box shape so that it can be in close contact with the upper surface of the power transformer 3 and at least three side surfaces. In the heat dissipation structure using the heat transfer cooling plate shown in FIG. 7, heat can be radiated from a total of four surfaces including the upper surface of the power transformer 3 and the three side surfaces.

１ケース
２基板
３電源トランス
４フェライトコア
５放熱シート
６、７、１１伝熱冷却板
１２筐体固定部 DESCRIPTION OF SYMBOLS 1 Case 2 Board | substrate 3 Power supply transformer 4 Ferrite core 5 Heat radiation sheet 6, 7, 11 Heat transfer cooling plate 12 Case fixing | fixed part

Claims

筐体内の基板上に配置される電子部品の放熱構造であって、
前記電子部品の上面に密着させた伝熱冷却板を設けたことを特徴とする電子部品の放熱構造。 A heat dissipation structure for electronic components arranged on a substrate in a housing,
A heat dissipation structure for an electronic component, comprising a heat transfer cooling plate in close contact with the upper surface of the electronic component.

前記伝熱冷却板は第１面および第２面を有し、
前記伝熱冷却板の第１面を前記電子部品の上面に密着させ、
前記伝熱冷却板の第２面を前記筐体の側面に密着させたことを特徴とする請求項１に記載の電子部品の放熱構造。 The heat transfer cooling plate has a first surface and a second surface;
The first surface of the heat transfer cooling plate is closely attached to the upper surface of the electronic component,
2. The heat dissipation structure for an electronic component according to claim 1, wherein the second surface of the heat transfer cooling plate is in close contact with a side surface of the housing.

前記伝熱冷却板は第１面および第２面を有し、
前記伝熱冷却板の第１面を前記電子部品の上面に密着させ、
前記伝熱冷却板の第２面を前記電子部品の側面に密着させたことを特徴とする請求項１に記載の電子部品の放熱構造。 The heat transfer cooling plate has a first surface and a second surface;
The first surface of the heat transfer cooling plate is closely attached to the upper surface of the electronic component,
2. The heat dissipation structure for an electronic component according to claim 1, wherein the second surface of the heat transfer cooling plate is in close contact with a side surface of the electronic component.

前記伝熱冷却板は、前記電子部品を固定していることを特徴とする請求項１に記載の電子部品の放熱構造。 The heat dissipation structure for an electronic component according to claim 1, wherein the heat transfer cooling plate fixes the electronic component.