JP2012162093A5 - - Google Patents

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JP2012162093A5
JP2012162093A5 JP2012127292A JP2012127292A JP2012162093A5 JP 2012162093 A5 JP2012162093 A5 JP 2012162093A5 JP 2012127292 A JP2012127292 A JP 2012127292A JP 2012127292 A JP2012127292 A JP 2012127292A JP 2012162093 A5 JP2012162093 A5 JP 2012162093A5
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Japan
Prior art keywords
mold clamping
current command
clamping force
current
electromagnet
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JP2012127292A
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Japanese (ja)
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JP2012162093A (en
JP5437443B2 (en
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Priority to JP2012127292A priority Critical patent/JP5437443B2/en
Priority claimed from JP2012127292A external-priority patent/JP5437443B2/en
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Publication of JP2012162093A5 publication Critical patent/JP2012162093A5/ja
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Publication of JP5437443B2 publication Critical patent/JP5437443B2/en
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Claims (8)

電磁石によって型締力を作用させる型締装置であって、
目標型締力に応じた前記電磁石への電流指令を生成する第一の電流指令生成部と、
前記電磁石による前記型締力を検出する型締力検出部と、
前記型締力検出部によって検出される型締力の検出値に基づいて前記電流指令を補正する補正指令を生成する第二の電流指令生成部とを有することを特徴とする型締装置。
A mold clamping device that applies a clamping force by an electromagnet,
A first current command generation unit that generates a current command to the electromagnet according to a target clamping force;
A mold clamping force detection unit for detecting the mold clamping force by the electromagnet;
A mold clamping device comprising: a second current command generation unit configured to generate a correction command for correcting the current command based on a detection value of the mold clamping force detected by the mold clamping force detection unit.
前記第一の電流指令生成部は、前記目標型締力に応じた電流パターンを生成し、当該電流パターンに従って、前記電磁石への電流指令を生成することを特徴とする請求項1記載の型締装置。2. The mold clamping according to claim 1, wherein the first current command generation unit generates a current pattern corresponding to the target mold clamping force, and generates a current command to the electromagnet according to the current pattern. apparatus. 前記第一の電流指令生成部は、前記型締力を発生させる立ち上がり電流指令と、発生させられた型締力を維持する維持電流指令とを有する電流指令を生成することを特徴とする請求項1又は2記載の型締装置。 The first current command generation unit generates a current command having a rising current command for generating the mold clamping force and a maintenance current command for maintaining the generated mold clamping force. The mold clamping apparatus according to 1 or 2 . 前記第二の電流指令生成部は、前記維持電流指令に基づき維持されている型締力と前記型締力検出部により検出される型締力の検出値との誤差に基づいて前記補正指令を生成することを特徴とする請求項3記載の型締装置。   The second current command generation unit outputs the correction command based on an error between a mold clamping force maintained based on the maintenance current command and a detected value of the mold clamping force detected by the mold clamping force detection unit. The mold clamping device according to claim 3, wherein the mold clamping device is generated. 前記第一の電流指令生成部は、型締め開始時には前記目標型締力に対応する電流よりも大きな電流値を示す電流指令を生成することを特徴とする請求項1〜4のいずれか一項記載の型締装置。 It said first current command generation unit, mold clamping start any one of claims 1-4, characterized in that for generating a current command indicating a larger current value than the current corresponding to the target mold clamping force at the time The mold clamping apparatus described. 前記第一の電流指令生成部にて生成された前記電流指令と前記第二の電流生成指令部にて生成された前記補正指令とに基づいて、前記電磁石へ供給する補正電流指令を算出する補正電流指令算出部を有することを特徴とする請求項1〜5のいずれか一項記載の型締装置。 Correction for calculating a correction current command to be supplied to the electromagnet based on the current command generated by the first current command generation unit and the correction command generated by the second current generation command unit clamping device according to any one of claims 1-5, characterized in that it comprises a current command calculation unit. 前記第二の電流指令生成部は、前記目標型締力と前記型締力の検出値との誤差に基づいて前記補正指令を生成することを特徴とする請求項1〜6のいずれか一項記載の型締装置。 Said second current command generation unit, to any one of claims 1-6 for, characterized in that to generate the correction command on the basis of the error between the detected value of the clamping force and the target mold clamping force The mold clamping apparatus described. 電磁石によって型締力を作用させる型締制御方法であって、
目標型締力に応じた前記電磁石への電流指令を生成し、
前記電磁石による前記型締力を検出し、
前記型締力の検出値に基づいて前記電流指令を補正する補正指令を生成することを特徴とする型締制御方法。

A mold clamping control method in which a clamping force is applied by an electromagnet,
Generate a current command to the electromagnet according to the target clamping force,
Detecting the clamping force by the electromagnet;
A mold clamping control method, comprising: generating a correction command for correcting the current command based on the detected value of the mold clamping force.

JP2012127292A 2007-08-28 2012-06-04 Mold clamping apparatus and mold clamping control method Expired - Fee Related JP5437443B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012127292A JP5437443B2 (en) 2007-08-28 2012-06-04 Mold clamping apparatus and mold clamping control method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007221573 2007-08-28
JP2007221573 2007-08-28
JP2012127292A JP5437443B2 (en) 2007-08-28 2012-06-04 Mold clamping apparatus and mold clamping control method

Related Parent Applications (1)

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JP2009530122A Division JP5037619B2 (en) 2007-08-28 2008-08-26 Mold clamping apparatus and mold clamping control method

Publications (3)

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JP2012162093A JP2012162093A (en) 2012-08-30
JP2012162093A5 true JP2012162093A5 (en) 2012-10-11
JP5437443B2 JP5437443B2 (en) 2014-03-12

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JP2009530122A Expired - Fee Related JP5037619B2 (en) 2007-08-28 2008-08-26 Mold clamping apparatus and mold clamping control method
JP2012127292A Expired - Fee Related JP5437443B2 (en) 2007-08-28 2012-06-04 Mold clamping apparatus and mold clamping control method

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JP2009530122A Expired - Fee Related JP5037619B2 (en) 2007-08-28 2008-08-26 Mold clamping apparatus and mold clamping control method

Country Status (5)

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JP (2) JP5037619B2 (en)
CN (2) CN101784380B (en)
DE (1) DE112008002284T5 (en)
TW (1) TWI405658B (en)
WO (1) WO2009028488A1 (en)

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JP5774442B2 (en) * 2011-10-21 2015-09-09 住友重機械工業株式会社 Injection molding machine
JP5774441B2 (en) * 2011-10-21 2015-09-09 住友重機械工業株式会社 Injection molding machine and mold thickness adjusting method for injection molding machine
JP5774443B2 (en) * 2011-10-21 2015-09-09 住友重機械工業株式会社 Injection molding machine
JP5778023B2 (en) * 2011-12-26 2015-09-16 住友重機械工業株式会社 Injection molding machine
CN102825751B (en) * 2012-09-17 2014-10-29 深圳市华成工业控制有限公司 Mould locking signal control device and control method of injection molding machine
JP6000891B2 (en) * 2013-03-29 2016-10-05 住友重機械工業株式会社 Injection molding machine
JP6289904B2 (en) * 2013-12-27 2018-03-07 住友重機械工業株式会社 Injection molding machine
JP6644473B2 (en) * 2015-03-27 2020-02-12 住友重機械工業株式会社 Injection molding machine
JP7477419B2 (en) * 2020-09-30 2024-05-01 住友重機械工業株式会社 Injection molding machine
CN112895363B (en) * 2021-01-18 2022-05-20 杭州电子科技大学 Low-pressure mold protection self-adaptive control method and device of injection molding machine

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JPH0622832B2 (en) * 1986-07-07 1994-03-30 三菱重工業株式会社 Injection compression molding method and apparatus
JP2976366B2 (en) * 1995-04-10 1999-11-10 住友重機械工業株式会社 Control method of injection molding machine
JPH10119099A (en) * 1996-10-16 1998-05-12 Sumitomo Heavy Ind Ltd Mold clamping force controller for toggle type motor operated injection molding machine
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