JP2012146912A - Manufacturing method and manufacturing apparatus of thin film photoelectric conversion element, and deposit apparatus - Google Patents

Manufacturing method and manufacturing apparatus of thin film photoelectric conversion element, and deposit apparatus Download PDF

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JP2012146912A
JP2012146912A JP2011005844A JP2011005844A JP2012146912A JP 2012146912 A JP2012146912 A JP 2012146912A JP 2011005844 A JP2011005844 A JP 2011005844A JP 2011005844 A JP2011005844 A JP 2011005844A JP 2012146912 A JP2012146912 A JP 2012146912A
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holding
flexible substrate
pulling mechanism
mechanism portion
thin film
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Hitoshi Shimizu
均 清水
Takenori Wada
剛典 和田
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Fuji Electric Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus of a thin film photoelectric conversion element, and a deposition apparatus which can obtain a thin film having improved flatness on all over the surface and stabilized uniform film thickness distribution, even for a flexible substrate of large area, by inhibiting generation of wrinkles in a width direction and a length direction of a flexible substrate.SOLUTION: A manufacturing method of a thin film photoelectric conversion element using a deposit apparatus 100 comprises: stopping transportation of a flexible substrate 1 while applying a tensile force to the flexible substrate 1 in a width direction; heating the flexible substrate 1 by contact of a ground electrode 4 incorporating a heater 8 with a non-deposition face of a rear face of the flexible substrate 1; holding near an upper end of the flexible substrate 1 with a first hold and tension mechanism part 12A; holding near the upper end of the flexible substrate 1 with a third hold and tension mechanism part 12B opposite to the first hold and tension mechanism part 12A; and holding near a lower end of the flexible substrate 1 with a second hold and tension mechanism part 12C and a fourth hold and tension mechanism part 12D; and shifting the mechanism parts in a direction extending an opposing distance between the holding and tension mechanism parts to pull the flexible substrate 1; and performing deposition by fastening the flexible substrate 1 with pulling the flexible substrate 1.

Description

本発明は、特に薄膜光電変換素子並びにその他の可撓性基板上に複数の薄膜層を成膜するような成膜装置を用い、大面積で柔軟かつ薄い可撓性基板を対象として電圧制御を行う際に必要とされる、電界強度に関わる電極間距離を均一に維持して、薄膜を製造する製造方法及び製造装置、並びに成膜装置に関する。   In particular, the present invention uses a film forming apparatus that forms a plurality of thin film layers on a thin film photoelectric conversion element and other flexible substrates, and controls voltage for a flexible flexible thin substrate with a large area. The present invention relates to a manufacturing method, a manufacturing apparatus, and a film forming apparatus for manufacturing a thin film while maintaining a uniform inter-electrode distance related to electric field strength, which is required when performing the process.

薄膜太陽電池は、薄型で軽量、製造コストの安さ、大面積化が容易であることなどから、今後の太陽電池の主流となると考えられており、かかる薄膜太陽電池の薄膜を製造する装置として、プラズマ化学蒸着気相法（プラズマＣＶＤ）などを利用した成膜装置がある。
この成膜装置においては、巻出しロールと巻取りロールとの間に設置された成膜室内に可撓性基板を搬送し、当該成膜室内で高周波電圧の印加により作用する電界効果にて電極間にプラズマを生成し、原材料となる物質を分解、励起することで周辺雰囲気下に存在する可撓性基板上にアモルファスシリコン膜などの半導体薄膜を成膜している。 Thin film solar cells are considered to become the mainstream of future solar cells because they are thin and lightweight, inexpensive to manufacture, and easy to increase in area.As a device for manufacturing thin films of such thin film solar cells, There is a film forming apparatus using plasma chemical vapor deposition (plasma CVD) or the like.
In this film forming apparatus, a flexible substrate is transported into a film forming chamber installed between an unwinding roll and a winding roll, and an electrode is formed by an electric field effect that acts by applying a high frequency voltage in the film forming chamber. A semiconductor thin film such as an amorphous silicon film is formed on a flexible substrate existing in the surrounding atmosphere by generating plasma in between and decomposing and exciting a material as a raw material.

特に、ａ−Ｓｉ（アモルファスシリコン）光電変換装置を用いた太陽電池の高品質な光電変換装置として、微結晶Ｓｉ系の研究開発が推進されている。微結晶Ｓｉ膜は光吸収係数が小さく、光電変換装置として膜を積層する場合は、通常２μｍ程度の膜厚が必要となり、プラズマＣＶＤ装置のタクトはＩ層の成膜速度により律速されることから、成膜速度の向上を図る必要がある。   In particular, research and development of a microcrystalline Si system has been promoted as a high-quality photoelectric conversion device for a solar cell using an a-Si (amorphous silicon) photoelectric conversion device. A microcrystalline Si film has a small light absorption coefficient, and when a film is stacked as a photoelectric conversion device, a film thickness of about 2 μm is usually required, and the tact of the plasma CVD device is limited by the deposition rate of the I layer. Therefore, it is necessary to improve the deposition rate.

また、薄膜光電変換素子の製造方法として、プラズマＣＶＤ装置の平行平板電極の電極間距離を１ｍｍ〜１ｃｍとなるように狭間隔に制御して成膜する手法がある。フィルム等の可撓性基板に成膜する場合、フィルムには張力と加熱により皺が発生することになる。 このような皺は、狭間隔の電極間距離の条件をさらに不均一にする要因であり、結果として、薄膜特性が著しく低下したり、色むらが生じて外観上の製品価値が低下したりするといった問題を生ずることになる。   As a method for manufacturing a thin film photoelectric conversion element, there is a method of forming a film by controlling the distance between parallel plate electrodes of a plasma CVD apparatus so as to be 1 mm to 1 cm at a narrow interval. When a film is formed on a flexible substrate such as a film, wrinkles are generated in the film by tension and heating. Such wrinkles are factors that make the condition of the distance between the electrodes with a narrow gap even more uneven. As a result, the thin film characteristics are remarkably deteriorated, or color unevenness occurs and the product value in appearance is reduced. This causes the problem.

従来、かかる問題を解決するために、例えば、可撓性基板の幅両端部をそれぞれ保持機構により挟持し、この挟持した保持機構がその間の距離が離れる方向に移動して可撓性基板の幅方向に力を与えながら延伸することによって、可撓性基板に生じた皺を伸ばし、この状態で、薄膜を形成する方法が提案されている（特許文献１参照）。
この技術は、図７に示す可撓性基板の支持方式の平面図において、プラズマＣＶＤ室２の可撓性基板１の搬送方向両側で、第１保持機構部３０によって可撓性基板１の幅方向における一端部を挟持し、第２保持機構部４０によって可撓性基板１の幅方向における他端部を挟持し、この第２保持機構部４０で挟持された他端部を引張機構部５０によって可撓性基板１の幅方向に引っ張るように構成している。すなわち、かかる技術では、第１保持機構部３０と第２保持機構部４０のいずれか片方の距離を広げる２点引張りにより、可撓性基板１の皺を伸ばすようにしている。
これにより、可撓性基板１の皺が伸ばされ、その平坦性が向上し、膜厚分布の良好な薄膜を安定して形成することが可能となる。なお、図７において、１００ａは真空容器、２ａは巻出しロール、２ｂは巻取りロールである。 Conventionally, in order to solve such a problem, for example, both end portions of the width of the flexible substrate are sandwiched by holding mechanisms, and the sandwiched holding mechanism is moved in a direction in which the distance between them is increased, so that the width of the flexible substrate is increased. A method has been proposed in which a wrinkle generated on a flexible substrate is stretched by stretching while applying a force in a direction, and a thin film is formed in this state (see Patent Document 1).
In this technique, in the plan view of the flexible substrate support method shown in FIG. 7, the width of the flexible substrate 1 is measured by the first holding mechanism 30 on both sides of the plasma CVD chamber 2 in the conveyance direction of the flexible substrate 1. One end portion in the direction is sandwiched, the other end portion in the width direction of the flexible substrate 1 is sandwiched by the second holding mechanism portion 40, and the other end portion sandwiched by the second holding mechanism portion 40 is held in the tension mechanism portion 50. Therefore, the flexible substrate 1 is pulled in the width direction. That is, in this technique, the folds of the flexible substrate 1 are extended by two-point tension that increases the distance between one of the first holding mechanism portion 30 and the second holding mechanism portion 40.
Thereby, the wrinkles of the flexible substrate 1 are extended, the flatness thereof is improved, and a thin film having a good film thickness distribution can be stably formed. In FIG. 7, 100a is a vacuum vessel, 2a is an unwinding roll, and 2b is a winding roll.

特開２００５−７２４０８号公報JP 2005-72408 A

ところで、プラズマＣＶＤ装置により成膜を行う際には、薄膜を高い精度での水平な平面に形成して維持することが必要であるが、成膜に必要な加熱による基板の伸縮が可撓性基板の形状を平面にすることを阻害している。その一方で、薄膜を製造することに関し、大面積の基板にて成膜を行うことにより生産性の向上を図るという要望がある。
しかしながら、上記従来の製造方法では、可撓性基板の幅方向の皺の除去は十分であるが、可撓性基板の長手方向の皺を確実に除去するのは困難である。このため、可撓性基板の長手方向の皺の発生による平坦性の低下及び、膜厚分布の安定化が阻害されている。 By the way, when a film is formed by a plasma CVD apparatus, it is necessary to form and maintain a thin film on a horizontal plane with high accuracy. However, the expansion and contraction of the substrate due to heating necessary for film formation is flexible. This obstructs the flat shape of the substrate. On the other hand, regarding the production of thin films, there is a demand for improving productivity by forming a film on a large-area substrate.
However, the conventional manufacturing method described above is sufficient to remove wrinkles in the width direction of the flexible substrate, but it is difficult to reliably remove wrinkles in the longitudinal direction of the flexible substrate. For this reason, deterioration of flatness due to generation of wrinkles in the longitudinal direction of the flexible substrate and stabilization of the film thickness distribution are hindered.

本発明は、このような実状に鑑みてなされたものであって、その目的は、可撓性基板の幅方向及び長手方向の皺の発生を防止して、大面積の可撓性基板でも、全面に亘って平坦性が向上し、均一な膜厚分布の安定化した薄膜が得られる薄膜光電変換素子の製造方法及び製造装置、並びに成膜装置を提供することにある。   The present invention has been made in view of such a situation, and the object thereof is to prevent generation of wrinkles in the width direction and the longitudinal direction of the flexible substrate, and even a flexible substrate having a large area, An object of the present invention is to provide a method and apparatus for manufacturing a thin film photoelectric conversion element, and a film forming apparatus, in which flatness is improved over the entire surface and a thin film having a uniform film thickness distribution is obtained.

上記従来技術の有する課題を解決するために、本発明は、可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造方法において、前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部と、をそれぞれ配置し、前記可撓性基板の搬送を停止させ、張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持し、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部のいずれか１点を固定点とし、この固定点と搬送方向に対向する部位に配置された前記保持及び引張機構部が前記可撓性基板の搬送方向と平行ないし一定角度以内になるように保持して引っ張り、他の前記保持及び引張機構部が互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜を行っている。
また、本発明において、前記可撓性基板の対向した幅方向端部を挟持する２つの前記保持及び引張機構部のいずれかを固定とし、他の前記保持及び引張機構部は互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜している。 In order to solve the above-described problems of the prior art, the present invention transports the flexible substrate between a winding roll wound with the flexible substrate and a winding roll that winds the flexible substrate. A film formation chamber installed in the middle; a ground electrode having a heater in the film formation chamber; and a high-frequency electrode connected to a high-frequency power source in the film formation chamber; the ground electrode and the high-frequency electrode; In the method of manufacturing a thin film photoelectric conversion element, in which the flexible substrate is caused to travel and a thin film is formed on the flexible substrate in the film formation chamber, the grounding with respect to the transport direction of the flexible substrate A first holding and pulling mechanism portion for sandwiching an upper end portion in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate on both sides of the electrode, and a lower portion in the width direction of the flexible substrate A second holding and pulling mechanism for sandwiching one end, 1 width of the flexible substrate facing the 2nd holding | maintenance mechanism part, 3rd holding | maintenance and a tensioning mechanism part which clamps the width direction other end part of the said flexible substrate facing the 1 holding | maintenance and tensioning mechanism part A fourth holding mechanism and a tension mechanism that sandwich the other end in the direction, respectively, stop the conveyance of the flexible substrate, and contact the ground electrode with the back surface of the flexible substrate while applying tension. The flexible substrate is heated by the first holding and pulling mechanism, the second holding and pulling mechanism, the third holding and pulling mechanism, and the fourth holding and pulling mechanism. The first holding and pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, and the fourth holding and pulling mechanism part are fixed. It is said point, and it is arranged in the part which counters this fixed point in the conveyance direction The holding and pulling mechanism part is held and pulled so as to be parallel to or within a certain angle with the conveyance direction of the flexible substrate, and the other holding and pulling mechanism parts move in a direction to increase the distance between the opposing surfaces. The film is formed while the flexible substrate is pulled and stretched.
In the present invention, either one of the two holding and pulling mechanism portions that sandwich the opposing widthwise end portions of the flexible substrate is fixed, and the other holding and pulling mechanism portions are located between the opposing surfaces. The film is moved while extending the distance, and the flexible substrate is pulled and stretched.

そして、本発明は、可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造方法において、前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部と、をそれぞれ配置し、前記可撓性基板の搬送を停止させ、張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持し、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部の４点が前記可撓性基板の搬送方向と平行ないし一定角度以内に保持し、前記搬送方向と対向する前記保持及び引張機構部間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜を行っている。
また、本発明において、前記接地電極の前記可撓性基板の搬送方向両側に配置した、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向と逆方向に引っ張り、他の前記保持及び引張機構部の２点は互いの対向間距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜している。
さらに、本発明において、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向に平行ないし一定角度以内になるように保持して引っ張っている。 And this invention, the film-forming chamber installed in the middle of conveyance of the said flexible substrate between the unwinding roll which wound the flexible substrate, and the winding roll which winds up the said flexible substrate, A ground electrode having a heater in the film formation chamber and a high-frequency electrode connected to a high-frequency power source in the film formation chamber are provided, and the flexible substrate runs between the ground electrode and the high-frequency electrode. In the method of manufacturing a thin film photoelectric conversion element in which a thin film is formed on the flexible substrate in the film formation chamber, the flexible substrate is disposed on both sides of the ground electrode with respect to the transport direction of the flexible substrate. A first holding and pulling mechanism portion for sandwiching the upper end portion in the width direction of the flexible substrate orthogonal to the transport direction of the second substrate, and a second holding and tension mechanism for sandwiching the lower end portion in the width direction of the flexible substrate. Before the mechanism portion and the first holding and pulling mechanism portion A third holding and pulling mechanism portion for holding the other end portion in the width direction of the flexible substrate, and a fourth holding for holding the other end portion in the width direction of the flexible substrate facing the second holding and pulling mechanism portion. And a tension mechanism unit, respectively, stopping the conveyance of the flexible substrate, heating the ground electrode in contact with the back surface of the flexible substrate while applying tension, and the first holding and The vicinity of both ends of the flexible substrate is clamped by the tension mechanism, the second retention and tension mechanism, the third retention and tension mechanism, and the fourth retention and tension mechanism. Four points of 1 holding and pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, and the fourth holding and pulling mechanism part are parallel to the conveyance direction of the flexible substrate at a constant angle. Between the holding and pulling mechanism sections that are held within and opposite the transport direction Distance by moving in a direction to widen the pull on the flexible substrate, is performed film formation while stretching it.
Further, in the present invention, the first holding and pulling mechanism unit, the second holding and pulling mechanism unit, the third holding and pulling mechanism unit disposed on both sides of the ground electrode in the transport direction of the flexible substrate, Pull any two points along the transport direction of the fourth holding and pulling mechanism portion in the direction opposite to the transport direction, and the other two points of the holding and pulling mechanism portions move in a direction to increase the distance between the opposing surfaces. Then, the flexible substrate is pulled and formed while being stretched.
Furthermore, in the present invention, any two of the first holding and pulling mechanism sections, the second holding and pulling mechanism sections, the third holding and pulling mechanism sections, and the fourth holding and pulling mechanism sections along the transport direction. The point is held and pulled so as to be parallel to the transport direction or within a certain angle.

また、本発明において、前記第１保持及び引張機構部と前記第３保持及び引張機構部を上側に配置し、前記第２保持及び引張機構部と前記第４保持及び引張機構部を下側に配置した前記可撓性基板の垂直配置状態において、下側に配置した前記第２保持及び引張機構部または前記第４保持及び引張機構部の１点を固定点とし、他の前記保持及び引張機構部の引張り力及び引張り方向の釣り合いから、皺伸ばし張力を調整している。   In the present invention, the first holding and pulling mechanism part and the third holding and pulling mechanism part are arranged on the upper side, and the second holding and pulling mechanism part and the fourth holding and pulling mechanism part are on the lower side. In the vertical arrangement state of the arranged flexible substrate, one point of the second holding and pulling mechanism part or the fourth holding and pulling mechanism part arranged on the lower side is used as a fixed point, and the other holding and pulling mechanism is provided. The stretch tension is adjusted based on the balance of the tensile force and tension direction of the part.

一方、本発明は、可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造装置において、前記可撓性基板を走行及び停止する際に、前記可撓性基板に張力を与える張力制御手段と、前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部とをそれぞれ配置し、前記可撓性基板の搬送を停止した状態で、前記張力制御手段により張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持するとともに、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部を可動することにより、互いの対向間の距離を広げるように前記可撓性基板を引っ張り、延伸しながら成膜するように構成している。   On the other hand, the present invention provides a film forming chamber installed in the middle of transporting the flexible substrate between an unwinding roll on which the flexible substrate is wound and a winding roll for winding the flexible substrate, A ground electrode having a heater in the film formation chamber and a high-frequency electrode connected to a high-frequency power source in the film formation chamber are provided, and the flexible substrate runs between the ground electrode and the high-frequency electrode. In the thin film photoelectric conversion element manufacturing apparatus for forming a thin film on the flexible substrate in the film forming chamber, tension is applied to the flexible substrate when the flexible substrate is run and stopped. Tension control means and a first upper end portion in the width direction of the flexible substrate that is orthogonal to the conveyance direction of the flexible substrate on both sides of the ground electrode with respect to the conveyance direction of the flexible substrate. Holding and pulling mechanism, and lower portion of the flexible substrate in the width direction A second holding and pulling mechanism portion for holding the end portion; a third holding and pulling mechanism portion for holding the other widthwise end portion of the flexible substrate facing the first holding and pulling mechanism portion; 2 in the state where the fourth holding and tensioning mechanism part for sandwiching the other end in the width direction of the flexible substrate facing the holding and tensioning mechanism part is disposed, and the conveyance of the flexible substrate is stopped, While applying tension by a tension control means, the ground electrode is brought into contact with the back surface of the flexible substrate and heated, and the first holding and pulling mechanism unit, the second holding and pulling mechanism unit, and the third The holding and pulling mechanism part and the fourth holding and pulling mechanism part sandwich the vicinity of both ends of the flexible substrate, the first holding and pulling mechanism part, the second holding and pulling mechanism part, Third holding and pulling mechanism, fourth holding and pulling machine By moving the parts, pulling the flexible substrate so as to widen the distance between mutual opposed, it is configured so as to deposit while stretching.

上述の如く、本発明に係る薄膜光電変換素子の製造方法は、可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する成膜装置を用いて、前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部と、をそれぞれ配置し、前記可撓性基板の搬送を停止させ、張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持し、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部のいずれか１点を固定点とし、この固定点と搬送方向に対向する部位に配置された前記保持及び引張機構部が前記可撓性基板の搬送方向と平行ないし一定角度以内になるように保持して引っ張り、他の前記保持及び引張機構部が互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜し、あるいは、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部の４点が前記可撓性基板の搬送方向と平行ないし一定角度以内に保持し、前記搬送方向と対向する前記保持及び引張機構部間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜しているので、４箇所の保持及び引張機構部にて囲まれた領域で、隈なく可撓性基板を延伸させることが可能となる。
したがって、本発明によれば、可撓性基板の大型化のため、加熱による可撓性基板の熱膨張に起因して伸縮量が増加しても、２個の引張機構部により張力を負荷することで張力負荷の不可能な位置が存在しないことになり、均一な平面が得られることで可撓性基板の平面性を向上させることができる。しかも、可撓性基板の熱膨張による伸びに対する延伸が可能となるため、可撓性基板の熱膨張による伸びによって発生していた当該可撓性基板の緩みが抑制され、当該可撓性基板に発生していた皺状の変位を抑えることができ、膜厚の均一性が良好な薄膜を形成することができる。 As described above, the method for manufacturing a thin film photoelectric conversion element according to the present invention includes a flexible substrate between an unwinding roll wound with a flexible substrate and a winding roll that winds the flexible substrate. A film forming chamber installed in the middle of conveyance; a ground electrode having a heater in the film forming chamber; and a high-frequency electrode connected to a high-frequency power source in the film forming chamber, the ground electrode and the high-frequency electrode The grounding electrode with respect to the transport direction of the flexible substrate, using a film forming apparatus for forming a thin film on the flexible substrate in the film forming chamber. A first holding and pulling mechanism portion for sandwiching an upper end portion in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate, and a lower end in the width direction of the flexible substrate. Second holding and pulling mechanism portion for clamping the portion, and the first holding and pulling portion A third holding and pulling mechanism portion that sandwiches the other widthwise end portion of the flexible substrate facing the structural portion, and another widthwise other end portion of the flexible substrate facing the second holding and pulling mechanism portion A fourth holding mechanism and a tension mechanism section for holding the substrate, respectively, stopping the conveyance of the flexible substrate, and applying the tension while bringing the ground electrode into contact with the back surface of the flexible substrate and heating. The first holding and pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, and the fourth holding and pulling mechanism part near both ends of the flexible substrate. And holding any one of the first holding and pulling mechanism, the second holding and pulling mechanism, the third holding and pulling mechanism, and the fourth holding and pulling mechanism with a fixed point. The holding and pulling mechanism disposed at a portion facing the fixed point in the transport direction Is held and pulled so as to be parallel to or within a certain angle with respect to the conveyance direction of the flexible substrate, and the other holding and pulling mechanism portions are movable in a direction to increase the distance between the opposing surfaces, and the flexible substrate The substrate is pulled and stretched to form a film, or the first holding and pulling mechanism, the second holding and pulling mechanism, the third holding and pulling mechanism, the fourth holding and pulling mechanism The four points are held in parallel or within a certain angle with the conveyance direction of the flexible substrate, and are moved in a direction to widen the distance between the holding and pulling mechanism portions opposed to the conveyance direction, so that the flexible substrate is Since the film is formed while being pulled and stretched, the flexible substrate can be stretched without any wrinkles in the region surrounded by the four holding and pulling mechanism portions.
Therefore, according to the present invention, due to the increase in size of the flexible substrate, even if the expansion / contraction amount increases due to the thermal expansion of the flexible substrate due to heating, tension is applied by the two tension mechanism portions. Thus, there is no position where tension load is impossible, and the flatness of the flexible substrate can be improved by obtaining a uniform plane. In addition, since the flexible substrate can be stretched with respect to elongation due to thermal expansion, loosening of the flexible substrate caused by elongation due to thermal expansion of the flexible substrate is suppressed, and the flexible substrate is The generated wrinkle-like displacement can be suppressed, and a thin film with good film thickness uniformity can be formed.

また、本発明において、前記可撓性基板の対向した幅方向端部を挟持する２つの前記保持及び引張機構部のいずれかを固定とし、他の前記保持及び引張機構部は互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜しているので、より一層、可撓性基板に発生した皺状の変位を抑えることができる。   In the present invention, either one of the two holding and pulling mechanism portions that sandwich the opposing widthwise end portions of the flexible substrate is fixed, and the other holding and pulling mechanism portions are located between the opposing surfaces. Since the film is formed while moving in the direction of increasing the distance and pulling and stretching the flexible substrate, it is possible to further suppress the saddle-like displacement generated in the flexible substrate.

さらに、本発明において、前記接地電極の前記可撓性基板の搬送方向両側に配置した、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向と逆方向に引っ張り、他の前記保持及び引張機構部の２点は互いの対向間距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜し、また、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向に平行ないし一定角度以内になるように保持して引っ張っているので、引張機構部の固定部が無くなり、可撓性基板の配置に関しては慎重な張力の釣り合いは要求されるが、高い引っ張り荷重の延伸効果が得られることになる。   Further, in the present invention, the first holding and pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, which are arranged on both sides of the flexible substrate in the transport direction of the ground electrode, Pull any two points along the transport direction of the fourth holding and pulling mechanism portion in the direction opposite to the transport direction, and the other two points of the holding and pulling mechanism portions move in a direction to increase the distance between the opposing surfaces. The flexible substrate is pulled and stretched to form a film, and the first holding and pulling mechanism unit, the second holding and pulling mechanism unit, the third holding and pulling mechanism unit, the fourth holding and Since any two points along the transport direction of the tension mechanism section are held and pulled so that they are parallel to the transport direction or within a certain angle, the fixing section of the tension mechanism section is eliminated, and the flexible substrate is disposed. With regard to careful tension balance is required It is, but so that the stretching effect of the high tensile load is obtained.

また、本発明において、前記第１保持及び引張機構部と前記第３保持及び引張機構部を上側に配置し、前記第２保持及び引張機構部と前記第４保持及び引張機構部を下側に配置した前記可撓性基板の垂直配置状態において、下側に配置した前記第２保持及び引張機構部または前記第４保持及び引張機構部の１点を固定点とし、他の前記保持及び引張機構部の引張り力及び引張り方向の釣り合いから、皺伸ばし張力を調整しているので、可撓性基板を垂直にして搬送した場合に、上部端部の手前に倒れが生じても、皺の伸ばし張力を調整することにより上部の倒れを抑制でき、修正した皺状変位の伸ばしを行うことができる。
さらに、本発明において、前記引張機構部により前記可撓性基板に延伸効果を与える前に、張力を与え停止している前記可撓性基板の裏面の非成膜面に前記接地電極を接触させて加熱し、前記可撓性基板に熱膨張分の伸びを発生した後、引っ張り荷重を与えて延伸することにより、熱膨張分にて発生していた皺状の変位を抑制する効果を得ることができる。 In the present invention, the first holding and pulling mechanism part and the third holding and pulling mechanism part are arranged on the upper side, and the second holding and pulling mechanism part and the fourth holding and pulling mechanism part are on the lower side. In the vertical arrangement state of the arranged flexible substrate, one point of the second holding and pulling mechanism part or the fourth holding and pulling mechanism part arranged on the lower side is used as a fixed point, and the other holding and pulling mechanism is provided. The tension stretching tension is adjusted based on the balance of the tensile force and tension direction of the section, so even if the flexible substrate is transported vertically, even if the top edge falls down, the tension stretching tension of the collar By adjusting the angle, the upper part can be prevented from being tilted and the corrected saddle-like displacement can be extended.
Furthermore, in the present invention, the ground electrode is brought into contact with a non-film-forming surface on the back surface of the flexible substrate that is stopped by applying tension before the stretching mechanism portion imparts a stretching effect to the flexible substrate. After heating and generating an elongation for the thermal expansion of the flexible substrate, by applying a tensile load and stretching, the effect of suppressing the saddle-like displacement generated by the thermal expansion is obtained. Can do.

本発明に係る薄膜光電変換素子の製造装置は、可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜するものであって、前記可撓性基板を走行及び停止する際に、前記可撓性基板に張力を与える張力制御手段と、前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部とをそれぞれ配置し、前記可撓性基板の搬送を停止した状態で、前記張力制御手段により張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持するとともに、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部を可動することにより、互いの対向間の距離を広げるように前記可撓性基板を引っ張り、延伸しながら成膜するように構成しているので、上記製造方法の発明と同様の効果を得ることができる。   The apparatus for manufacturing a thin film photoelectric conversion element according to the present invention is installed in the middle of transporting the flexible substrate between a winding roll wound with the flexible substrate and a winding roll winding the flexible substrate. A film-forming chamber, a ground electrode having a heater in the film-forming chamber, and a high-frequency electrode connected to a high-frequency power source in the film-forming chamber, between the ground electrode and the high-frequency electrode. The flexible substrate is run to form a thin film on the flexible substrate in the film forming chamber. When the flexible substrate is run and stopped, the flexible substrate is placed on the flexible substrate. Tension control means for applying tension, and upper end portions in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate are sandwiched on both sides of the ground electrode with respect to the conveyance direction of the flexible substrate. A first holding and pulling mechanism portion, and a width direction of the flexible substrate A second holding and pulling mechanism portion for sandwiching one end of the portion, a third holding and pulling mechanism portion for sandwiching the other end in the width direction of the flexible substrate facing the first holding and pulling mechanism portion, In a state where the fourth holding and pulling mechanism part that sandwiches the other end in the width direction of the flexible substrate facing the second holding and pulling mechanism part is disposed, and the conveyance of the flexible substrate is stopped, While applying tension by the tension control means, the ground electrode is brought into contact with the back surface of the flexible substrate and heated, and the first holding and pulling mechanism part, the second holding and pulling mechanism part, and the first 3 holding and pulling mechanism portion and the fourth holding and pulling mechanism portion sandwich the vicinity of both ends of the flexible substrate, the first holding and pulling mechanism portion, the second holding and pulling mechanism portion, The third holding and pulling mechanism, the fourth holding and pulling; By moving the mechanism part, the flexible substrate is pulled so as to increase the distance between the opposing surfaces, and the film is formed while being stretched. Obtainable.

本発明の第１実施形態に係る成膜装置を示す概略構成配置図である。1 is a schematic configuration layout diagram showing a film forming apparatus according to a first embodiment of the present invention. （Ａ）〜（Ｃ）は、上記第１実施形態の可撓性基板の成膜室における形成手順を示す概略断面図である。(A)-(C) are schematic sectional drawings which show the formation procedure in the film-forming chamber of the flexible substrate of the said 1st Embodiment. 可撓性基板の保持方式を比較して示すものであり、（Ａ）は上記第１実施形態の平面図、（Ｂ）は比較例の平面図である。The holding methods of a flexible substrate are shown in comparison, (A) is a plan view of the first embodiment, and (B) is a plan view of a comparative example. （Ａ）〜（Ｄ）は、本発明の第１実施形態における皺状変位を抑える手順を示す概略断面図である。(A)-(D) are schematic sectional drawings which show the procedure which suppresses the saddle-like displacement in 1st Embodiment of this invention. 可撓性基板の皺状変位を比較して示すものであり、（Ａ）は上記第１実施形態の線図、（Ｂ）は比較例の線図である。FIG. 2 shows a comparison of the saddle-like displacement of a flexible substrate, in which (A) is a diagram of the first embodiment, and (B) is a diagram of a comparative example. 本発明の第２実施形態に係る可撓性基板の保持方式を示す平面配置図である。It is a plane arrangement view showing a holding system of a flexible substrate concerning a 2nd embodiment of the present invention. 従来技術における可撓性基板の保持方式を示す平面配置図である。It is a plane arrangement | positioning figure which shows the holding system of the flexible substrate in a prior art.

以下、本発明に係る薄膜光電変換素子の製造方法及び製造装置、並びに成膜装置について、その実施の形態に基づき図面を参照しながら詳細に説明する。   Hereinafter, the manufacturing method and manufacturing apparatus of a thin film photoelectric conversion element and a film forming apparatus according to the present invention will be described in detail with reference to the drawings based on the embodiments.

［第１実施形態］
図１は本発明の第１実施形態に係る成膜装置の概略構成配置図である。
図１において、可撓性基板１を巻装した巻出しロール２ａと、可撓性基板１を巻取る巻取りロール２ｂとの間であって、可撓性基板１の搬送途中には、成膜装置１００が設置されており、可撓性基板１は、２つのロール２ａ，２ｂの回転駆動により搬送されるようになっている。
成膜装置１００の成膜室（反応室）１０内には、可撓性基板１を支持し内部に基板への加熱ヒータ８を有する接地電極４と、高周波電源３ａに電気的に接続される高周波電極３とが、走行させる可撓性基板１を挟んで所定の間隔を空けて対向して配置されている。しかも、可撓性基板１への加熱ヒータ８を有する接地電極４と高周波電極３とは、お互いが平行となるように配置されている。 [First Embodiment]
FIG. 1 is a schematic configuration layout diagram of a film forming apparatus according to a first embodiment of the present invention.
In FIG. 1, between the unwinding roll 2a around which the flexible substrate 1 is wound and the winding roll 2b around which the flexible substrate 1 is wound. A membrane device 100 is installed, and the flexible substrate 1 is conveyed by rotational driving of the two rolls 2a and 2b.
In the film forming chamber (reaction chamber) 10 of the film forming apparatus 100, the flexible substrate 1 is supported and a ground electrode 4 having a heater 8 for the substrate is electrically connected to the high frequency power source 3a. The high-frequency electrode 3 is disposed to face the flexible substrate 1 to be run with a predetermined interval therebetween. Moreover, the ground electrode 4 having the heater 8 for the flexible substrate 1 and the high-frequency electrode 3 are arranged so as to be parallel to each other.

また、成膜装置１００は、接地電極４と高周波電極３を内部に収納して、成膜室１０を形成する仕切りとなる一対の押さえ枠５，６を備えている。これら押さえ枠５，６は、互いの開口部が向き合う断面コ字状に形成され、少なくとも一方の接地電極側の押さえ枠６は移動可能に構成されており、これら押さえ枠５，６の周辺部を重ね合わせることによって可撓性基板１を挟み込み、成膜室１０を分離している。
さらに、成膜装置１００の成膜室１０の外側に位置する内側壁面には、可撓性基板１の端部を挟持する端部保持機構部と、可撓性基板１を引っ張る引張機構部の機能を兼備している４個の保持及び引張機構部１２が可撓性基板１の搬送方向の上下流の出入口付近で互いに対向して配置されている。 The film forming apparatus 100 also includes a pair of holding frames 5 and 6 that house the ground electrode 4 and the high-frequency electrode 3 and serve as partitions for forming the film forming chamber 10. These holding frames 5 and 6 are formed in a U-shaped cross section in which the openings of each other face each other, and the holding frame 6 on the side of at least one ground electrode is configured to be movable. Are stacked together to sandwich the flexible substrate 1 and separate the film formation chamber 10.
Further, an inner wall surface located outside the film forming chamber 10 of the film forming apparatus 100 has an end holding mechanism portion that holds the end portion of the flexible substrate 1 and a tension mechanism portion that pulls the flexible substrate 1. Four holding and pulling mechanism portions 12 having a function are arranged opposite to each other in the vicinity of the upstream and downstream entrances in the conveyance direction of the flexible substrate 1.

図２（Ａ）〜（Ｃ）は、本発明の第１実施形態における可撓性基板１の成膜室１０の形成手順を示す概略断面図である。
可撓性基板１を搬送するときには、図２（Ａ）に示すように、接地電極４を反対側方向に引いて、接地電極４と高周波電極３とが接触しないようになっており、成膜室１０内で薄膜を形成するときには、図２（Ｂ）に示すように、加熱ヒータ８を内蔵した接地電極４をＹ１方向へ移動させることにより可撓性基板１に押し付けて、可撓性基板１を加熱して設定の温度に昇温する。次いで、後述するように、保持及び引張機構部１２により可撓性基板１に対する固定保持と張力の負荷の調整を行った後、図２（Ｃ）に示すように、押さえ枠５，６を互いに向き合うＹ２方向へ押し込めば、当該押さえ枠５，６に囲まれた成膜室１０が形成されることになる。 2A to 2C are schematic cross-sectional views illustrating a procedure for forming the film forming chamber 10 of the flexible substrate 1 in the first embodiment of the present invention.
When the flexible substrate 1 is transported, as shown in FIG. 2A, the ground electrode 4 is pulled in the opposite direction so that the ground electrode 4 and the high-frequency electrode 3 do not come into contact with each other. When forming a thin film in the chamber 10, as shown in FIG. 2B, the ground electrode 4 incorporating the heater 8 is pressed against the flexible substrate 1 by moving it in the Y1 direction. 1 is heated to a set temperature. Next, as will be described later, after the holding and tensioning mechanism unit 12 fixes and holds the flexible substrate 1 and adjusts the load of tension, as shown in FIG. When pushed in the facing Y2 direction, the film forming chamber 10 surrounded by the pressing frames 5 and 6 is formed.

本発明の第１実施形態に係る成膜装置１００は、以上のように構成されているが、本発明はさらに、かかる成膜装置１００を用いた以下の薄膜光電変換素子の製造方法及びその製造装置に関するものである。   Although the film forming apparatus 100 according to the first embodiment of the present invention is configured as described above, the present invention further includes the following method for manufacturing a thin film photoelectric conversion element using the film forming apparatus 100 and the manufacturing thereof. It relates to the device.

図３は、可撓性基板の保持方式を比較して示すものであり、（Ａ）は本発明の第１実施形態の平面図、（Ｂ）は比較例（例えば、特願２００９−６３５２号）の平面図であり、図３（Ａ）、（Ｂ）において、Ｘは可撓性基板１の運動方向、１ａは可撓性基板１の表面変位測定方位である。
また、図３において、１２Ａ、１２Ｂ、１２Ｃ、１２Ｄは可撓性基板１の保持及び引張機構部である。各保持及び引張機構部１２Ａ、１２Ｂ、１２Ｃ、１２Ｄは、可撓性基板１の幅端部を挟持する保持部１２Ａ１、１２Ｂ１、１２Ｃ１、１２Ｄ１と、引張機構部１２Ａ２、１２Ｂ２、１２Ｃ２、１２Ｄ２とから成り、可撓性基板１を保持するととともに、可撓性基板１に引張り作用を行うことが可能に構成されている。 FIG. 3 shows a comparison of holding methods of flexible substrates, (A) is a plan view of the first embodiment of the present invention, and (B) is a comparative example (for example, Japanese Patent Application No. 2009-6352). 3A and 3B, X is the movement direction of the flexible substrate 1, and 1a is the surface displacement measurement direction of the flexible substrate 1.
In FIG. 3, 12 </ b> A, 12 </ b> B, 12 </ b> C, and 12 </ b> D are holding and pulling mechanism units for the flexible substrate 1. Each of the holding and pulling mechanism portions 12A, 12B, 12C, and 12D includes the holding portions 12A1, 12B1, 12C1, and 12D1 that sandwich the width end portion of the flexible substrate 1, and the pulling mechanism portions 12A2, 12B2, 12C2, and 12D2. Thus, the flexible substrate 1 can be held and the flexible substrate 1 can be pulled.

これら保持及び引張機構部１２のうち、第１の保持及び引張機構部１２Ａは、第１の保持部１２Ａ１により可撓性基板１の幅方向一端部を挟持するものであって、第１の引張機構部１２Ａ２は可動せず可撓性基板１上に固定されている。
また、保持及び引張機構部１２のうち、第２の保持及び引張機構部１２Ｃは、第１の保持及び引張機構部１２Ａに対向して配置されており、第１の保持部１２Ａ１に対向した可撓性基板１の幅方向他端部を第２の保持部１２Ｃ１により挟持するとともに、第２の引張機構部１２Ｃ２により、図３の矢印方向の外向きの引張り荷重１２Ｃ３を可撓性基板１に与えるように構成されている。 Of these holding and pulling mechanism parts 12, the first holding and pulling mechanism part 12A sandwiches one end in the width direction of the flexible substrate 1 with the first holding part 12A1, and the first pulling and pulling mechanism part 12A1 The mechanism portion 12A2 is not movable and is fixed on the flexible substrate 1.
Of the holding and pulling mechanism parts 12, the second holding and pulling mechanism part 12C is arranged to face the first holding and pulling mechanism part 12A and can be opposed to the first holding part 12A1. The other end in the width direction of the flexible substrate 1 is held by the second holding portion 12C1, and an outward tensile load 12C3 in the direction of the arrow in FIG. 3 is applied to the flexible substrate 1 by the second tension mechanism portion 12C2. Is configured to give.

さらに、保持及び引張機構部１２のうち、第３の保持及び引張機構部１２Ｂは、第１の保持及び引張機構部１２Ａから可撓性基板１の長手方向に距離Ｓ１の間隔を空けて設けられ、第３の保持部１２Ｂ１により可撓性基板１を挟持し、かつ、第３の引張機構部１２Ｂ２により、図３（Ａ）の矢印方向の引張り荷重１２Ｂ３、つまり可撓性基板１の搬送方向（矢印Ｘ方向）またはやや垂直方向に角度αを付けて、可撓性基板１を引張り、該可撓性基板１に張力を与えるように構成されている。この角度αは、後述するように±１５°以内が好適である。
そして、保持及び引張機構部１２のうち、第４の保持及び引張機構部１２Ｄは、第２の保持及び引張機構部１２Ｃから可撓性基板１の長手方向に距離Ｓ２の間隔を空けて設けられ、第４の保持部１２Ｄ１により可撓性基板１を挟持し、かつ、第４の引張機構部１２Ｄ２により、図３の矢印方向の外向きの引張り荷重１２Ｄ３を可撓性基板１に与えるように構成されている。 Further, among the holding and pulling mechanism portions 12, the third holding and pulling mechanism portion 12B is provided at a distance S1 from the first holding and pulling mechanism portion 12A in the longitudinal direction of the flexible substrate 1. The flexible substrate 1 is sandwiched by the third holding portion 12B1, and the tensile load 12B3 in the direction of the arrow in FIG. 3A, that is, the conveyance direction of the flexible substrate 1 is secured by the third tension mechanism portion 12B2. It is configured to pull the flexible substrate 1 and give a tension to the flexible substrate 1 with an angle α (in the direction of the arrow X) or slightly perpendicular. The angle α is preferably within ± 15 ° as will be described later.
Of the holding and pulling mechanism portion 12, the fourth holding and pulling mechanism portion 12D is provided at a distance S2 from the second holding and pulling mechanism portion 12C in the longitudinal direction of the flexible substrate 1. The flexible substrate 1 is clamped by the fourth holding portion 12D1, and an outward tensile load 12D3 in the direction of the arrow in FIG. 3 is applied to the flexible substrate 1 by the fourth tension mechanism portion 12D2. It is configured.

なお、本発明の第１実施形態において、第１及び第２の保持及び引張機構部１２Ａ，１２Ｃと、第３及び第４の保持及び引張機構部１２Ｂ，１２Ｄの具体的な構成は、図７に示した特許文献１の第１保持機構部３０、第２保持機構部４０及び引張機構部５０と（３０，４０，５０は、特許文献１の符号）同様な構成を有している。   In the first embodiment of the present invention, the specific configurations of the first and second holding and pulling mechanism portions 12A and 12C and the third and fourth holding and pulling mechanism portions 12B and 12D are shown in FIG. The first holding mechanism section 30, the second holding mechanism section 40, and the pulling mechanism section 50 of Patent Document 1 shown in (1) have the same configuration (30, 40, 50 are the codes of Patent Document 1).

次に、前記第１実施形態に係る成膜装置１００を用いた薄膜光電変換素子の製造方法及びその製造装置の作用効果について説明する。
図３（Ａ）は本発明の第１実施形態の基板変位を示し、図３（Ｂ）は比較例（特願２００９−６３５２号）の基板変位を示している。図３（Ａ）及び（Ｂ）のどちらにおいても、Ａ点は固定点であり、可撓性基板１の位置が固定されている。
図３（Ｂ）に示す比較例（特願２００９−６３５２号）の成膜工程では、接地電極のみが可撓性基板１の非成膜面に移動して接触しながら可撓性基板１を加熱し、特許文献１（特開２００５−７２４０８号公報）と同様に、第１保持機構部と第２保持機構部とにより可撓性基板１の両端部を挟持し、挟持しながら第１保持機構部と第２保持機構部をお互いの距離が広がる方向へ引張機構部によって移動させて可撓性基板１の両端部を基板長手方向に引っ張る。そして、押さえ枠を移動して可撓性基板１を押さえ込んで挟み、成膜室の開口部を閉じて放電空間を形成した状態で、可撓性基板１に対して成膜している。 Next, the manufacturing method of the thin film photoelectric conversion element using the film forming apparatus 100 according to the first embodiment and the operation effect of the manufacturing apparatus will be described.
FIG. 3A shows the substrate displacement of the first embodiment of the present invention, and FIG. 3B shows the substrate displacement of the comparative example (Japanese Patent Application No. 2009-6352). 3A and 3B, the point A is a fixed point, and the position of the flexible substrate 1 is fixed.
In the film forming process of the comparative example (Japanese Patent Application No. 2009-6352) shown in FIG. 3B, only the ground electrode moves to the non-film forming surface of the flexible substrate 1 and contacts the flexible substrate 1. As in Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-72408), both ends of the flexible substrate 1 are sandwiched between the first holding mechanism and the second holding mechanism, and the first holding is performed while sandwiching. The mechanism portion and the second holding mechanism portion are moved by the pulling mechanism portion in a direction in which the distance between them increases, and both end portions of the flexible substrate 1 are pulled in the substrate longitudinal direction. Then, a film is formed on the flexible substrate 1 in a state where the holding frame is moved and the flexible substrate 1 is pressed and sandwiched, and the opening of the film forming chamber is closed to form a discharge space.

図３（Ｂ）の比較例では、第１の保持及び引張機構部１２Ａにより挟持される可撓性基板１の位置が固定点であることから、第１の保持及び引張機構部１２Ａと第３の保持及び引張機構部１２Ｂとの距離Ｓ３は固定されるため、これら第１の保持及び引張機構部１２Ａ〜第３の保持及び引張機構部１２Ｂ間（距離Ｓ３）における可撓性基板１の熱伸びを延伸することはできなかった。
このため、可撓性基板１の第１の保持及び引張機構部１２Ａと第３の保持及び引張機構部１２Ｂ間の熱による伸びが長くなり、第１の保持及び引張機構部１２Ａと第３の保持及び引張機構部１２Ｂ間の距離が長くなると、可撓性基板１の熱伸びによる皺が発生することになる。この皺は、第２の保持及び引張機構部１２Ｃと第４の保持及び引張機構部１２Ｄとの間（距離Ｓ４）においても同様に、張力が負荷された方位に皺が伝播して広がり、その結果、可撓性基板１の平面性を低下させることになった。 In the comparative example of FIG. 3B, since the position of the flexible substrate 1 sandwiched by the first holding and pulling mechanism portion 12A is a fixed point, the first holding and pulling mechanism portion 12A and the third Since the distance S3 to the holding and pulling mechanism portion 12B is fixed, the heat of the flexible substrate 1 between the first holding and pulling mechanism portion 12A to the third holding and pulling mechanism portion 12B (distance S3). It was not possible to stretch the elongation.
For this reason, the elongation by the heat | fever between the 1st holding | maintenance and tension | tensile_strength mechanism part 12A and the 3rd holding | maintenance / tensioning mechanism part 12B of the flexible substrate 1 becomes long, and the 1st holding | maintenance and tension | pulling mechanism part 12A and 3rd When the distance between the holding and pulling mechanism portions 12B is increased, wrinkles due to thermal expansion of the flexible substrate 1 are generated. In the same manner, the wrinkles spread between the second holding and pulling mechanism portion 12C and the fourth holding and pulling mechanism portion 12D (distance S4) and spread in the direction in which the tension is loaded. As a result, the flatness of the flexible substrate 1 was reduced.

一方、本発明の第１実施形態では、図３（Ａ）に示すように、第３の保持及び引張機構部１２Ｂは、第１の保持及び引張機構部１２Ａから可撓性基板１の長手方向に距離Ｓ１の間隔を空けて設けられ、可撓性基板１を挟持し、かつ図中矢印方向の引張り荷重１２Ｂ３を可撓性基板１に与えている。
すなわち、第３の保持及び引張機構部１２Ｂによる可撓性基板１の保持点Ｂにおいて、基板１の搬送方向（矢印Ｘ方向）またはやや垂直方向に角度αを付けて、第３の保持及び引張機構部１２Ｂによって可撓性基板１に張力を与えている。この角度αは、±１５°以内が好適である。 On the other hand, in the first embodiment of the present invention, as shown in FIG. 3A, the third holding and pulling mechanism portion 12B extends from the first holding and pulling mechanism portion 12A in the longitudinal direction of the flexible substrate 1. Are spaced apart by a distance S1, sandwiching the flexible substrate 1, and applying a tensile load 12B3 in the direction of the arrow in the drawing to the flexible substrate 1.
That is, at the holding point B of the flexible substrate 1 by the third holding and pulling mechanism unit 12B, the third holding and pulling is performed with an angle α in the transport direction (arrow X direction) or a slightly vertical direction of the substrate 1. Tension is applied to the flexible substrate 1 by the mechanism portion 12B. This angle α is preferably within ± 15 °.

この張力により、可撓性基板１の両端部近傍の２箇所（第１の保持及び引張機構部１２Ａと第２の保持及び引張機構部１２Ｃ）を挟持しながら、第１の保持及び引張機構部１２Ａと第２の保持及び引張機構部１２Ｃから長手方向に距離Ｓ１、Ｓ２の間隔を空けて設けた第３の保持及び引張機構部１２Ｂと第４の保持及び引張機構部１２Ｄにより、可撓性基板１の互いの距離を広げる方向に保持しながら引っ張るので、４箇所の保持及び引張機構部１２Ａ〜１２Ｄに囲まれた領域で、隈なく可撓性基板１を延伸させることが可能となる。
本発明の第１実施形態は、図３（Ａ）の可撓性基板１の保持方式によって、可撓性基板１の皺状変位を抑制する手段を提供するものである。 With this tension, the first holding and tensioning mechanism part is sandwiched between the two locations (the first holding and tensioning mechanism part 12A and the second holding and tensioning mechanism part 12C) in the vicinity of both ends of the flexible substrate 1. The third holding and pulling mechanism portion 12B and the fourth holding and pulling mechanism portion 12D that are spaced apart from each other by 12A and the second holding and pulling mechanism portion 12C in the longitudinal direction are flexible. Since the substrate 1 is pulled while being held in the direction in which the distance between the substrates 1 is increased, the flexible substrate 1 can be stretched without any wrinkles in the region surrounded by the four holding and tensioning mechanisms 12A to 12D.
1st Embodiment of this invention provides the means which suppresses the saddle-like displacement of the flexible substrate 1 with the holding system of the flexible substrate 1 of FIG. 3 (A).

図４（Ａ）〜（Ｄ）は、本発明の第１実施形態における皺状変位を抑える手順を示す概略断面図である。
図３に示されるような可撓性基板１の保持方式において、熱膨張により発生する可撓性基板１の皺状の変位を抑える効果を十分に得るには、既に説明した引張り荷重を可撓性基板１に与える以前に、搬送停止している可撓性基板１の長手方向に搬送張力を与えながら、加熱ヒータ８を内蔵した接地電極４を可撓性基板１の裏面の非成膜面に接触させ、熱膨張による皺状変位を発生させる加熱工程を行う手順を踏む必要がある。本発明の第１実施形態では、図３（Ａ）の可撓性基板１の保持方式において、搬送張力３０Ｎ〜１００Ｎを与えながら、加熱を行った。 4A to 4D are schematic cross-sectional views showing a procedure for suppressing saddle-like displacement in the first embodiment of the present invention.
In the holding method of the flexible substrate 1 as shown in FIG. 3, in order to sufficiently obtain the effect of suppressing the hook-like displacement of the flexible substrate 1 generated by thermal expansion, the tensile load described above is flexibly applied. The non-film-forming surface on the back surface of the flexible substrate 1 is provided with the ground electrode 4 with the built-in heater 8 while applying conveyance tension in the longitudinal direction of the flexible substrate 1 that is stopped conveyance before being applied to the flexible substrate 1. It is necessary to follow the procedure of performing the heating process which makes it contact with and generate | occur | produces the saddle-like displacement by thermal expansion. In the first embodiment of the present invention, in the holding method of the flexible substrate 1 in FIG. 3A, heating is performed while applying a transport tension of 30N to 100N.

図４（Ａ）〜（Ｄ）においては、図１及び図３（Ａ）と同様に、成膜装置１００や保持及び引張機構部１２Ａ，１２Ｂ，１２Ｃ，１２Ｄが配置構成されている。
図４（Ａ）は、可撓性基板１が成膜室１０に搬送され、張力を与えながら停止した状態を示している。この状態において、第１〜第４の保持及び引張機構部１２Ａ〜１２Ｄを構成する保持部１２Ａ１〜１２Ｄ１と引張機構部１２Ａ２〜１２Ｄ２は、可撓性基板１から離間して配置されている。
この状態で可撓性基板１の裏面の非成膜面に、加熱ヒータ８を内蔵した接地電極４を押し当て、図４（Ｂ）に示すように、接触させて加熱する。この加熱により、可撓性基板１は熱膨張して伸びが生じ、当該可撓性基板１の幅方向には、伸びを引っ張る力が作用されておらず、図４（Ｂ）に示すように、皺１３が発生する。この状態において、第１〜第４の保持及び引張機構部１２Ａ〜１２Ｄを構成する引張機構部１２Ａ２〜１２Ｄ２は、可撓性基板１に接触して配置されている。 4A to 4D, the film forming apparatus 100 and the holding and pulling mechanism sections 12A, 12B, 12C, and 12D are arranged and configured as in FIGS. 1 and 3A.
FIG. 4A shows a state where the flexible substrate 1 is transported to the film formation chamber 10 and stopped while applying tension. In this state, the holding portions 12A1 to 12D1 and the pulling mechanism portions 12A2 to 12D2 constituting the first to fourth holding and pulling mechanism portions 12A to 12D are arranged apart from the flexible substrate 1.
In this state, the ground electrode 4 incorporating the heater 8 is pressed against the non-film-forming surface on the back surface of the flexible substrate 1, and is heated by contact as shown in FIG. By this heating, the flexible substrate 1 expands due to thermal expansion, and no force pulling the extension is applied in the width direction of the flexible substrate 1, as shown in FIG. , Soot 13 is generated. In this state, the tension mechanism portions 12A2 to 12D2 constituting the first to fourth holding and tension mechanism portions 12A to 12D are arranged in contact with the flexible substrate 1.

この発生した皺１３を伸ばすため、図４（Ｃ）に示すように、可撓性基板１の幅端を第１〜第４の保持部１２Ａ１，１２Ｂ１，１２Ｃ１，１２Ｄ１により挟持し、最終的には図４（Ｄ）に示すように、第２の引張機構部１２Ｃ２、第３の引張機構部１２Ｂ２、第４の引張機構部１２Ｄ２により幅方向（矢印Ｚ方向）の引張り力を与えて、可撓性基板１の幅方向に発生した皺１３を伸ばし、膜厚の均一性が良好な成膜形成を可能とする。   In order to extend the generated collar 13, as shown in FIG. 4C, the width end of the flexible substrate 1 is sandwiched by the first to fourth holding portions 12A1, 12B1, 12C1, and 12D1, and finally As shown in FIG. 4 (D), the second tension mechanism 12C2, the third tension mechanism 12B2, and the fourth tension mechanism 12D2 can be applied by applying a tensile force in the width direction (arrow Z direction). The wrinkles 13 generated in the width direction of the flexible substrate 1 are extended to enable film formation with good film thickness uniformity.

なお、本発明の第１実施形態において、第１の保持及び引張機構部１２Ａは、第１の保持部１２Ａ１が可撓性基板１を挟持した状態で第１の引張機構部１２Ａ２が作動して引っ張ったりせず固定としているが、他の保持及び引張機構部１２Ｂ〜１２Ｄの引張機構部、すなわち第２の引張機構部１２Ｃ２、第３の引張機構部１２Ｂ２、第４の引張機構部１２Ｄ２との引張り力とバランスを取ることにより、第１の引張機構部１２Ａ２に引張り力を与えることは可能である。   In the first embodiment of the present invention, the first holding and pulling mechanism portion 12A is operated when the first pulling mechanism portion 12A2 is operated with the first holding portion 12A1 sandwiching the flexible substrate 1. Although it is fixed without being pulled, it is fixed with other holding and pulling mechanism portions 12B to 12D, that is, with the second pulling mechanism portion 12C2, the third pulling mechanism portion 12B2, and the fourth pulling mechanism portion 12D2. By taking a balance with the tensile force, it is possible to apply a tensile force to the first tensile mechanism portion 12A2.

このような手順を踏まずに、引張り工程を実施した後、加熱した場合は、可撓性基板１に与えている引張り荷重に沿う皺１３が発生することになり、皺状の変位を抑える効果は得られない。   When heating is performed after performing the pulling step without following such a procedure, the scissors 13 along the tensile load applied to the flexible substrate 1 are generated, and the effect of suppressing the scissor-like displacement is generated. Cannot be obtained.

また、可撓性基板１を垂直の状態、例えば、第１の保持及び引張機構部１２Ａと第３の保持及び引張機構部１２Ｂを上側に配置し、第２の保持及び引張機構部１２Ｃと第４の保持及び引張機構部１２Ｄを下側に配置して、垂直に搬送した場合は、可撓性基板１の自重による垂れ下がりが生じて基板自体の形状強度により下部で変形が拘束され、可撓性基板１の上部端部は手前に倒れが生じる。
この倒れは、可撓性基板１の４点の挟持点、すなわち第１の保持部１２Ａ１、第２の保持部１２Ｃ１、第３の保持部１２Ｂ１、第４の保持部１２Ｄ１のうち、固定点を１点配置する場合は下部に設置し（例えば、第２の保持部１２Ｃ１を垂直の下側に設置する）、他の３点の挟持点すなわち第１の引張機構部１２Ａ２、第３の引張機構部１２Ｂ２、第４の引張機構部１２Ｄ２の、引張り力及び引張り方向の釣り合いを取り、皺１３の伸ばし張力を調整して、上部の倒れを修正した皺１３の伸ばしを行うことが可能である。 Further, the flexible substrate 1 is placed in a vertical state, for example, the first holding and pulling mechanism portion 12A and the third holding and pulling mechanism portion 12B are arranged on the upper side, and the second holding and pulling mechanism portion 12C and 4 is arranged on the lower side and conveyed vertically, the flexible substrate 1 hangs down due to its own weight, and the deformation of the substrate itself is constrained by the shape strength of the flexible substrate 1. The upper end portion of the conductive substrate 1 falls forward.
This collapse is caused by the four holding points of the flexible substrate 1, that is, among the first holding portion 12A1, the second holding portion 12C1, the third holding portion 12B1, and the fourth holding portion 12D1. When one point is arranged, it is installed in the lower part (for example, the second holding part 12C1 is installed on the lower side in the vertical direction), and the other three holding points, that is, the first tension mechanism part 12A2 and the third tension mechanism. It is possible to stretch the ridge 13 with the upper portion being corrected by adjusting the stretching tension of the ridge 13 by balancing the tensile force and the tensile direction of the portion 12B2 and the fourth tension mechanism portion 12D2.

したがって、本発明の第１実施形態の製造方法及び製造装置によれば、皺状変位の計測及び皺伸ばしを行っているから、可撓性基板１の大型化のため、加熱による可撓性基板１の熱膨張に起因して伸縮量が増加しても、２個（第３及び第４）の保持及び引張機構部１２Ｂ，１２Ｄの引張機構部１２Ｂ２，１２Ｄ２により、可撓性基板１の幅端に幅方向（矢印Ｚ方向）の張力を負荷することで張力負荷の不可能な位置が存在しないことになり、平面性の向上を図ることができて、可撓性基板１の熱膨張による伸びが延伸可能となる。これにより、可撓性基板１の熱膨張による伸びによって発生していた当該可撓性基板１の緩みが抑制され、当該可撓性基板１に発生していた皺状の変位を抑えることができる。また、可撓性基板１の幅方向に発生した皺１３を伸ばすことにより、膜厚の均一性が良好な成膜を形成することができる。   Therefore, according to the manufacturing method and the manufacturing apparatus of the first embodiment of the present invention, the hook-shaped displacement is measured and the hook is stretched, so that the flexible board 1 is heated to increase the size of the flexible board 1. Even if the amount of expansion and contraction increases due to the thermal expansion of 1, the width of the flexible substrate 1 is maintained by the two holding mechanisms (third and fourth) and the pulling mechanism portions 12B2 and 12D2 of the pulling mechanism portions 12B and 12D. By applying tension in the width direction (arrow Z direction) to the end, there is no position where tension load is impossible, and planarity can be improved, and thermal expansion of the flexible substrate 1 can be achieved. The elongation becomes stretchable. Thereby, the looseness of the flexible substrate 1 that has occurred due to the expansion due to the thermal expansion of the flexible substrate 1 is suppressed, and the saddle-like displacement that has occurred in the flexible substrate 1 can be suppressed. . Further, by extending the ridge 13 generated in the width direction of the flexible substrate 1, it is possible to form a film with good film thickness uniformity.

図５は、１ｍ幅の可撓性基板１を用い、第１実施形態の基板表面の皺状変位と上記比較例の基板表面の皺状変位とを比較した線図である。すなわち、図５（Ａ）は、第１実施形態における可撓性基板１の皺状変位の実測値、図５（Ｂ）は、比較例における可撓性基板１の皺状変位の実測値である。
図５から明らかなように、（Ａ）で示す本発明の第１実施形態においては、前述の方法を行ったことにより、（Ｂ）で示す比較例に比べて可撓性基板１の皺状変位が大幅に減少し、小さな変位に収まっていることが分かる。 FIG. 5 is a diagram comparing the saddle-like displacement of the substrate surface of the first embodiment and the saddle-like displacement of the substrate surface of the comparative example using the flexible substrate 1 having a width of 1 m. 5A is an actual measurement value of the saddle-like displacement of the flexible substrate 1 in the first embodiment, and FIG. 5B is an actual measurement value of the saddle-like displacement of the flexible substrate 1 in the comparative example. is there.
As apparent from FIG. 5, in the first embodiment of the present invention shown in FIG. 5A, the flexible substrate 1 has a bowl-like shape as compared with the comparative example shown in FIG. It can be seen that the displacement is greatly reduced and is within a small displacement.

［第２実施形態］
図６は、本発明の第２実施形態における可撓性基板の保持方式を示す平面配置図である。
この第２実施形態においては、可撓性基板１の第２の保持及び引張機構部１２Ｃと第４の保持及び引張機構部１２Ｄを構成する、第２の引張機構部１２Ｃ２と第４の引張機構部１２Ｄ２を上記第１実施形態と同様に外向きに対称に配置している。また、可撓性基板１の第１の保持及び引張機構部１２Ａと第３の保持及び引張機構部１２Ｂを構成する、第１の引張機構部１２Ａ２と第３の引張機構部１２Ｂ２の引張り荷重の作用方向を、可撓性基板１の幅方向線１ｃを基準に対称に配置して、該幅方向線１ｃに対称な逆方向に作用させている。すなわち、第３の引張機構部１２Ｂ２は、可撓性基板１の搬送方向（矢印Ｘ方向）またはやや垂直方向に角度αを付けて、可撓性基板１を保持して引っ張るとともに、第１の引張機構部１２Ａ２は、可撓性基板１の搬送方向（矢印Ｘ方向）と逆方向またはやや垂直方向に角度αを付けて、可撓性基板１を保持して引っ張っている。その他の構成及び配置は、上記第１実施形態と同様である。
このように、第１〜第４の保持及び引張機構部１２Ａ，１２Ｂ，１２Ｃ，１２Ｄを遊動的に配置すれば、保持及び引張機構部の固定部が無くなるため、可撓性基板１の配置に関しては慎重な張力の釣り合いを要求するが、高い引張り荷重の延伸効果が得られることになる。その他の作用効果は、上記第１実施形態と同様である。 [Second Embodiment]
FIG. 6 is a plan layout view showing a flexible substrate holding method according to the second embodiment of the present invention.
In the second embodiment, the second tension mechanism 12C2 and the fourth tension mechanism constituting the second retention and tension mechanism 12C and the fourth retention and tension mechanism 12D of the flexible substrate 1 are provided. The parts 12D2 are symmetrically arranged outward as in the first embodiment. Further, the tensile load of the first tension mechanism portion 12A2 and the third tension mechanism portion 12B2 constituting the first holding and tension mechanism portion 12A and the third holding and tension mechanism portion 12B of the flexible substrate 1 is determined. The action direction is arranged symmetrically with respect to the width direction line 1c of the flexible substrate 1, and acts in the opposite direction symmetrical to the width direction line 1c. That is, the third pulling mechanism portion 12B2 holds and pulls the flexible substrate 1 with an angle α in the conveyance direction (arrow X direction) of the flexible substrate 1 or in a slightly vertical direction. The pulling mechanism portion 12A2 holds and pulls the flexible substrate 1 with an angle α in the direction opposite to or slightly perpendicular to the conveyance direction (arrow X direction) of the flexible substrate 1. Other configurations and arrangements are the same as those in the first embodiment.
As described above, if the first to fourth holding and pulling mechanism portions 12A, 12B, 12C, and 12D are arranged in a floating manner, the holding and pulling mechanism portions are not fixed. Requires a careful balance of tension, but a stretch effect with a high tensile load can be obtained. Other functions and effects are the same as those of the first embodiment.

また、可撓性基板１を垂直の状態で搬送した場合の倒れについても同様であり、可撓性基板１の４点の挟持点のうち、１点を固定点として下部に設置し、他の３点の挟持点の引張り力及び引張り方向の釣り合いを取り、皺１３の伸ばし張力を調整して、上部の倒れを修正した皺１３の伸ばしを行うことができる。   The same applies to the fall when the flexible substrate 1 is transported in a vertical state. Of the four holding points of the flexible substrate 1, one point is set as a fixed point at the lower part, and the other The tension of the three clamping points and the balance in the direction of the tension can be balanced, and the tension of the collar 13 can be adjusted to extend the collar 13 with the upper tilt corrected.

以上、本発明の実施の形態につき述べたが、本発明は既述の実施の形態に限定されるものではなく、本発明の技術的思想に基づいて各種の変更及び変形が可能である。   While the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various changes and modifications can be made based on the technical idea of the present invention.

１ 可撓性基板
２ａ 巻出しロール
２ｂ 巻取りロール
３ 高周波電極
３ａ 高周波電源
４ 接地電極
５，６ 押さえ枠
８ 加熱ヒータ
１０ 成膜室
１２Ａ 第１の保持及び引張機構部
１２Ｂ 第３の保持及び引張機構部
１２Ｃ 第２の保持及び引張機構部
１２Ｄ 第４の保持及び引張機構部
１２Ａ１ 第１の保持部
１２Ｂ１ 第３の保持部
１２Ｃ１ 第２の保持部
１２Ｄ１ 第４の保持部
１２Ａ２ 第１の引張機構部
１２Ｂ２ 第３の引張機構部
１２Ｃ２ 第２の引張機構部
１２Ｄ２ 第４の引張機構部
１００ 成膜装置
Ｘ 可撓性基板の運動方向 DESCRIPTION OF SYMBOLS 1 Flexible board | substrate 2a Unwinding roll 2b Winding roll 3 High frequency electrode 3a High frequency power supply 4 Ground electrode 5,6 Holding frame 8 Heater 10 Deposition chamber 12A 1st holding | maintenance and tension mechanism part 12B 3rd holding | maintenance and tension | tensile_strength Mechanism part 12C Second holding and tensioning mechanism part 12D Fourth holding and tensioning mechanism part 12A1 First holding part 12B1 Third holding part 12C1 Second holding part 12D1 Fourth holding part 12A2 First tensioning mechanism Part 12B2 Third tension mechanism part 12C2 Second tension mechanism part 12D2 Fourth tension mechanism part
100 Deposition apparatus X Direction of movement of flexible substrate

Claims (7)

可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造方法において、
前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、
前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、
前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、
前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部と、をそれぞれ配置し、
前記可撓性基板の搬送を停止させ、張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、
前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持し、
前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部のいずれか１点を固定点とし、
この固定点と搬送方向に対向する部位に配置された前記保持及び引張機構部が前記可撓性基板の搬送方向と平行ないし一定角度以内になるように保持して引っ張り、他の前記保持及び引張機構部が互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜することを特徴とする薄膜光電変換素子の製造方法。 A film forming chamber installed in the middle of transporting the flexible substrate between a winding roll wound with the flexible substrate and a winding roll winding the flexible substrate; And a high-frequency electrode connected to a high-frequency power source in the film-forming chamber, and the flexible substrate is allowed to travel between the ground electrode and the high-frequency electrode. In the method of manufacturing a thin film photoelectric conversion element in which a thin film is formed on the flexible substrate,
A first holding and pulling mechanism portion that sandwiches upper end portions in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate on both sides of the ground electrode with respect to the conveyance direction of the flexible substrate. When,
A second holding and pulling mechanism portion for sandwiching a lower end portion in the width direction of the flexible substrate;
A third holding and pulling mechanism portion for sandwiching the other end in the width direction of the flexible substrate facing the first holding and pulling mechanism portion;
A fourth holding and pulling mechanism portion that sandwiches the other end in the width direction of the flexible substrate facing the second holding and pulling mechanism portion, respectively.
While stopping the conveyance of the flexible substrate and applying tension, the ground electrode is brought into contact with the back surface of the flexible substrate and heated,
The first holding and pulling mechanism portion, the second holding and pulling mechanism portion, the third holding and pulling mechanism portion, and the fourth holding and pulling mechanism portion near the both ends of the flexible substrate. Pinching,
One point of the first holding and pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, the fourth holding and pulling mechanism part is a fixed point,
The holding and pulling mechanism portion disposed at a portion facing the fixing point in the transport direction is held and pulled so as to be parallel to or within a certain angle with respect to the transport direction of the flexible substrate, and the other holding and pulling is performed. A method of manufacturing a thin film photoelectric conversion element, wherein the mechanism part moves in a direction to increase the distance between the opposing parts, and the flexible substrate is pulled and stretched to form a film. 前記可撓性基板の対向した幅方向端部を挟持する２つの前記保持及び引張機構部のいずれかを固定とし、他の前記保持及び引張機構部は互いの対向間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜することを特徴とする請求項１に記載の薄膜光電変換素子の製造方法。   One of the two holding and pulling mechanism portions that sandwich the opposing widthwise end portions of the flexible substrate is fixed, and the other holding and pulling mechanism portions are movable in a direction that increases the distance between the facing portions. The thin film photoelectric conversion element manufacturing method according to claim 1, wherein the film is formed while the flexible substrate is pulled and stretched. 可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造方法において、
前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、
前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、
前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、
前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部と、をそれぞれ配置し、
前記可撓性基板の搬送を停止させ、張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、
前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持し、
前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部の４点が前記可撓性基板の搬送方向と平行ないし一定角度以内に保持し、前記搬送方向と対向する前記保持及び引張機構部間の距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜することを特徴とする薄膜光電変換素子の製造方法。 A film forming chamber installed in the middle of transporting the flexible substrate between a winding roll wound with the flexible substrate and a winding roll winding the flexible substrate; And a high-frequency electrode connected to a high-frequency power source in the film-forming chamber, and the flexible substrate is allowed to travel between the ground electrode and the high-frequency electrode. In the method of manufacturing a thin film photoelectric conversion element in which a thin film is formed on the flexible substrate,
A first holding and pulling mechanism portion that sandwiches upper end portions in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate on both sides of the ground electrode with respect to the conveyance direction of the flexible substrate. When,
A second holding and pulling mechanism portion for sandwiching a lower end portion in the width direction of the flexible substrate;
A third holding and pulling mechanism portion for sandwiching the other end in the width direction of the flexible substrate facing the first holding and pulling mechanism portion;
A fourth holding and pulling mechanism portion that sandwiches the other end in the width direction of the flexible substrate facing the second holding and pulling mechanism portion, respectively.
While stopping the conveyance of the flexible substrate and applying tension, the ground electrode is brought into contact with the back surface of the flexible substrate and heated,
The first holding and pulling mechanism portion, the second holding and pulling mechanism portion, the third holding and pulling mechanism portion, and the fourth holding and pulling mechanism portion near the both ends of the flexible substrate. Pinching,
The four points of the first holding and pulling mechanism unit, the second holding and pulling mechanism unit, the third holding and pulling mechanism unit, and the fourth holding and pulling mechanism unit are parallel to the conveyance direction of the flexible substrate. A thin film characterized in that it is held within a certain angle and is moved in a direction to increase the distance between the holding and tensioning mechanism portions facing the transport direction, and the flexible substrate is pulled and formed while being stretched. A method for producing a photoelectric conversion element. 前記接地電極の前記可撓性基板の搬送方向両側に配置した、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向と逆方向に引っ張り、他の前記保持及び引張機構部の２点は互いの対向間距離を広げる方向に可動して、前記可撓性基板を引っ張り、延伸しながら成膜する特徴とする請求項３に記載の薄膜光電変換素子の製造方法。   The first holding and pulling mechanism unit, the second holding and pulling mechanism unit, the third holding and pulling mechanism unit, the fourth holding and pulling mechanism disposed on both sides of the ground electrode in the conveyance direction of the flexible substrate. Pull any two points along the conveying direction of the part in the direction opposite to the conveying direction, and the other two points of the holding and pulling mechanism part move in a direction to increase the distance between the opposing parts, and the flexibility The method for producing a thin film photoelectric conversion element according to claim 3, wherein the film is formed while pulling and stretching the substrate. 前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、第４保持及び引張機構部の搬送方向に沿ったいずれかの２点を搬送方向に平行ないし一定角度以内になるように保持して引っ張ることを特徴とする請求項４に記載の薄膜光電変換素子の製造方法。   Two points along the transport direction of the first holding and pulling mechanism unit, the second holding and pulling mechanism unit, the third holding and pulling mechanism unit, and the fourth holding and pulling mechanism unit are parallel to the transport direction. The method for producing a thin film photoelectric conversion element according to claim 4, wherein the thin film photoelectric conversion element is held and pulled so as to be within a certain angle. 前記第１保持及び引張機構部と前記第３保持及び引張機構部を上側に配置し、前記第２保持及び引張機構部と前記第４保持及び引張機構部を下側に配置した前記可撓性基板の垂直配置状態において、下側に配置した前記第２保持及び引張機構部または前記第４保持及び引張機構部の１点を固定点とし、他の前記保持及び引張機構部の引張り力及び引張り方向の釣り合いから、皺伸ばし張力を調整することを特徴とする請求項１または３に記載の薄膜光電変換素子の製造方法。   The first holding and pulling mechanism part and the third holding and pulling mechanism part are arranged on the upper side, and the second holding and pulling mechanism part and the fourth holding and pulling mechanism part are arranged on the lower side. In the vertical arrangement state of the substrate, one point of the second holding and pulling mechanism portion or the fourth holding and pulling mechanism portion arranged on the lower side is a fixing point, and the pulling force and tension of the other holding and pulling mechanism portions are the same. The method for producing a thin film photoelectric conversion element according to claim 1, wherein the tension for stretching is adjusted from the balance of directions. 可撓性基板を巻装した巻出しロールと前記可撓性基板を巻取る巻取りロールとの間で前記可撓性基板の搬送途中に設置される成膜室と、前記成膜室内において内部に加熱ヒータを有する接地電極と、前記成膜室内において高周波電源に接続される高周波電極とを備え、前記接地電極と前記高周波電極との間に前記可撓性基板を走行させて前記成膜室内で前記可撓性基板上に薄膜を成膜する薄膜光電変換素子の製造装置において、
前記可撓性基板を走行及び停止する際に、前記可撓性基板に張力を与える張力制御手段と、
前記可撓性基板の搬送方向に対し前記接地電極の両側に、前記可撓性基板の搬送方向と直交する前記可撓性基板の幅方向の上部一端部を挟持する第１保持及び引張機構部と、
前記可撓性基板の幅方向の下部一端部を挟持する第２保持及び引張機構部と、
前記第１保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第３保持及び引張機構部と、
前記第２保持及び引張機構部に対向した前記可撓性基板の幅方向他端部を挟持する第４保持及び引張機構部とをそれぞれ配置し、
前記可撓性基板の搬送を停止した状態で、前記張力制御手段により張力を与えながら、前記可撓性基板の裏面に前記接地電極を接触させて加熱し、前記第１保持及び引張機構部と、前記第２保持及び引張機構部と、前記第３保持及び引張機構部と、前記第４保持及び引張機構部とにより前記可撓性基板の両端部近傍を挟持するとともに、前記第１保持及び引張機構部、前記第２保持及び引張機構部、前記第３保持及び引張機構部、前記第４保持及び引張機構部を可動することにより、互いの対向間の距離を広げるように前記可撓性基板を引っ張り、延伸しながら成膜するように構成したことを特徴とする薄膜光電変換素子の製造装置。 A film forming chamber installed in the middle of transporting the flexible substrate between a winding roll wound with the flexible substrate and a winding roll winding the flexible substrate; And a high-frequency electrode connected to a high-frequency power source in the film-forming chamber, and the flexible substrate is allowed to travel between the ground electrode and the high-frequency electrode. In the apparatus for manufacturing a thin film photoelectric conversion element for forming a thin film on the flexible substrate,
Tension control means for applying tension to the flexible substrate when the flexible substrate is run and stopped;
A first holding and pulling mechanism portion that sandwiches upper end portions in the width direction of the flexible substrate perpendicular to the conveyance direction of the flexible substrate on both sides of the ground electrode with respect to the conveyance direction of the flexible substrate. When,
A second holding and pulling mechanism portion for sandwiching a lower end portion in the width direction of the flexible substrate;
A third holding and pulling mechanism portion for sandwiching the other end in the width direction of the flexible substrate facing the first holding and pulling mechanism portion;
A fourth holding and pulling mechanism part for holding the other end in the width direction of the flexible substrate facing the second holding and pulling mechanism part, respectively;
In a state where conveyance of the flexible substrate is stopped, while applying tension by the tension control means, the ground electrode is brought into contact with the back surface of the flexible substrate and heated, and the first holding and pulling mechanism unit and The second holding and pulling mechanism portion, the third holding and pulling mechanism portion, and the fourth holding and pulling mechanism portion sandwich the vicinity of both ends of the flexible substrate, and the first holding and By moving the pulling mechanism part, the second holding and pulling mechanism part, the third holding and pulling mechanism part, and the fourth holding and pulling mechanism part, the flexibility so as to widen the distance between the opposing surfaces. An apparatus for manufacturing a thin film photoelectric conversion element, wherein a film is formed while a substrate is pulled and stretched.
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