JP2012059915A - Ledパッケージ製造システム - Google Patents
Ledパッケージ製造システム Download PDFInfo
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- JP2012059915A JP2012059915A JP2010201653A JP2010201653A JP2012059915A JP 2012059915 A JP2012059915 A JP 2012059915A JP 2010201653 A JP2010201653 A JP 2010201653A JP 2010201653 A JP2010201653 A JP 2010201653A JP 2012059915 A JP2012059915 A JP 2012059915A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 64
- 229920005989 resin Polymers 0.000 claims abstract description 211
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- 239000000758 substrate Substances 0.000 claims abstract description 87
- 239000011248 coating agent Substances 0.000 claims abstract description 68
- 238000000576 coating method Methods 0.000 claims abstract description 68
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 29
- 238000003860 storage Methods 0.000 claims description 27
- 238000012545 processing Methods 0.000 abstract description 19
- 238000007689 inspection Methods 0.000 description 46
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- 238000004891 communication Methods 0.000 description 9
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- 239000002245 particle Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
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- 101001139126 Homo sapiens Krueppel-like factor 6 Proteins 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 101000911772 Homo sapiens Hsc70-interacting protein Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
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- 230000004907 flux Effects 0.000 description 1
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- 230000001678 irradiating effect Effects 0.000 description 1
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- 238000009832 plasma treatment Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】複数のLED素子の発光特性を予め個別に測定して得られた素子特性情報12、規定の発光特性を具備したLEDパッケージを得るための樹脂の適正塗布量と素子特性情報とを対応させた樹脂塗布情報14を予め準備し、部品実装装置M1によって実装されたLED素子の基板における位置を示す実装位置情報71aと素子特性情報12とを関連付けたマップデータ18をマップ作成処理部74によって基板毎に作成し、樹脂塗布装置M4において、マップデータ18と樹脂塗布情報14に基づき適正塗布量の樹脂を基板に実装された各LED素子に塗布する。
【選択図】図9
Description
2 LANシステム
4 基板
4a 個片基板
4b LED実装部
4c 反射部
5 LED素子
50 LEDパッケージ
8 樹脂
12 素子特性情報
13A,13B,13C LEDシート
14 樹脂塗布情報
18 マップデータ
23 樹脂接着剤
24 接着剤転写機構
25 部品供給機構
26 部品実装機構
32 樹脂吐出ヘッド
33 吐出ノズル
Claims (3)
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムであって、
前記基板に複数の前記LED素子を実装する部品実装装置と、
前記複数のLED素子の発光波長を含む発光特性を予め個別に測定して得られた情報を素子特性情報として提供する素子特性情報提供手段と、
規定の発光特性を具備したLEDパッケージを得るための前記樹脂の適正塗布量と前記素子特性情報とを対応させた情報を樹脂塗布情報として提供する樹脂情報提供手段と、
前記部品実装装置によって実装されたLED素子の前記基板における位置を示す実装位置情報と当該LED素子についての前記素子特性情報とを関連付けたマップデータを、前記基板毎に作成するマップデータ作成手段と、
前記マップデータと前記樹脂塗布情報に基づき、規定の発光特性を具備するための適正塗布量の前記樹脂を前記基板に実装された各LED素子に塗布する樹脂塗布装置とを備えたことを特徴とするLEDパッケージ製造システム。 - 前記部品実装装置および樹脂塗布装置はいずれもLANシステムに接続されており、前記素子特性情報提供手段および樹脂情報提供手段は、外部記憶手段より読み出された前記素子特性情報および樹脂塗布情報を、前記LANシステムを介して前記部品実装装置および樹脂塗布装置にそれぞれ送信することを特徴とする請求項1記載のLEDパッケージ製造システム。
- 前記マップデータ作成手段は前記部品実装装置に設けられており、前記マップデータは部品実装装置から前記樹脂塗布装置に送信されることを特徴とする請求項1または2に記載のLEDパッケージ製造システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201653A JP2012059915A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システム |
DE112011103012T DE112011103012T5 (de) | 2010-09-09 | 2011-05-09 | LED-Bauelemente-Fertigungssystem |
CN2011800044752A CN102640312A (zh) | 2010-09-09 | 2011-05-09 | Led封装件制造*** |
KR1020127011969A KR20130098848A (ko) | 2010-09-09 | 2011-05-09 | Led 패키지 제조 시스템 |
US13/503,695 US20120204793A1 (en) | 2010-09-09 | 2011-05-09 | Led package manufacturing system |
PCT/JP2011/002577 WO2012032691A1 (ja) | 2010-09-09 | 2011-05-09 | Ledパッケージ製造システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201653A JP2012059915A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システム |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012059915A true JP2012059915A (ja) | 2012-03-22 |
Family
ID=45810304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010201653A Pending JP2012059915A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120204793A1 (ja) |
JP (1) | JP2012059915A (ja) |
KR (1) | KR20130098848A (ja) |
CN (1) | CN102640312A (ja) |
DE (1) | DE112011103012T5 (ja) |
WO (1) | WO2012032691A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014057048A (ja) * | 2012-08-13 | 2014-03-27 | Showa Shinku Co Ltd | 原子層堆積装置、発光装置の製造方法及び発光装置の色度調整方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069589A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 発光装置 |
JP2015092519A (ja) * | 2012-02-27 | 2015-05-14 | シャープ株式会社 | 発光装置 |
US20190049512A1 (en) * | 2017-08-09 | 2019-02-14 | Dominant Opto Technologies Sdn Bhd | SYSTEMS AND METHODS FOR SIMPLIFYING INTEGRATION OF LEDs INTO MULTIPLE APPLICATIONS |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253745A (ja) * | 2003-02-24 | 2004-09-09 | Citizen Electronics Co Ltd | パステルledの作成方法 |
JP2005056885A (ja) * | 2003-08-04 | 2005-03-03 | Fine Rubber Kenkyusho:Kk | 半導体発光装置の製造方法 |
JP2007066969A (ja) * | 2005-08-29 | 2007-03-15 | Toshiba Lighting & Technology Corp | 白色発光ダイオード装置とその製造方法 |
JP2009272638A (ja) * | 2008-05-05 | 2009-11-19 | Cree Inc | 測定された発光特性に基づいた光変換材料の選択的堆積によって発光素子を製造する方法 |
JP2010103349A (ja) * | 2008-10-24 | 2010-05-06 | Toshiba Corp | 発光装置の製造方法 |
JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
JP2011096936A (ja) * | 2009-10-30 | 2011-05-12 | Alpha- Design Kk | 半導体発光ディバイス製造装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7220966B2 (en) * | 2003-07-29 | 2007-05-22 | Toyota Motor Manufacturing North America, Inc. | Systems and methods for inspecting coatings, surfaces and interfaces |
JP5079722B2 (ja) * | 2008-03-07 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
US8268644B2 (en) * | 2008-03-25 | 2012-09-18 | Kabushiki Kaisha Toshiba | Light emitting device, and method and apparatus for manufacturing same |
JP4985678B2 (ja) | 2009-02-27 | 2012-07-25 | ブラザー工業株式会社 | 画像記録装置 |
US7998526B2 (en) * | 2009-12-01 | 2011-08-16 | Bridgelux, Inc. | Method and system for dynamic in-situ phosphor mixing and jetting |
JP2011171557A (ja) * | 2010-02-19 | 2011-09-01 | Toshiba Corp | 発光装置、その製造方法および発光装置製造装置 |
EP2566314B1 (en) * | 2010-04-29 | 2021-04-21 | FUJI Corporation | Manufacturing-work machine |
JP5750235B2 (ja) * | 2010-04-29 | 2015-07-15 | 富士機械製造株式会社 | 製造作業機 |
-
2010
- 2010-09-09 JP JP2010201653A patent/JP2012059915A/ja active Pending
-
2011
- 2011-05-09 US US13/503,695 patent/US20120204793A1/en not_active Abandoned
- 2011-05-09 CN CN2011800044752A patent/CN102640312A/zh active Pending
- 2011-05-09 DE DE112011103012T patent/DE112011103012T5/de not_active Withdrawn
- 2011-05-09 WO PCT/JP2011/002577 patent/WO2012032691A1/ja active Application Filing
- 2011-05-09 KR KR1020127011969A patent/KR20130098848A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253745A (ja) * | 2003-02-24 | 2004-09-09 | Citizen Electronics Co Ltd | パステルledの作成方法 |
JP2005056885A (ja) * | 2003-08-04 | 2005-03-03 | Fine Rubber Kenkyusho:Kk | 半導体発光装置の製造方法 |
JP2007066969A (ja) * | 2005-08-29 | 2007-03-15 | Toshiba Lighting & Technology Corp | 白色発光ダイオード装置とその製造方法 |
JP2009272638A (ja) * | 2008-05-05 | 2009-11-19 | Cree Inc | 測定された発光特性に基づいた光変換材料の選択的堆積によって発光素子を製造する方法 |
JP2010103349A (ja) * | 2008-10-24 | 2010-05-06 | Toshiba Corp | 発光装置の製造方法 |
JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
JP2011096936A (ja) * | 2009-10-30 | 2011-05-12 | Alpha- Design Kk | 半導体発光ディバイス製造装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014057048A (ja) * | 2012-08-13 | 2014-03-27 | Showa Shinku Co Ltd | 原子層堆積装置、発光装置の製造方法及び発光装置の色度調整方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102640312A (zh) | 2012-08-15 |
KR20130098848A (ko) | 2013-09-05 |
US20120204793A1 (en) | 2012-08-16 |
DE112011103012T5 (de) | 2013-07-04 |
WO2012032691A1 (ja) | 2012-03-15 |
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