JP2012015466A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2012015466A
JP2012015466A JP2010153429A JP2010153429A JP2012015466A JP 2012015466 A JP2012015466 A JP 2012015466A JP 2010153429 A JP2010153429 A JP 2010153429A JP 2010153429 A JP2010153429 A JP 2010153429A JP 2012015466 A JP2012015466 A JP 2012015466A
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Prior art keywords
light emitting
emitting device
light
optical member
solid
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JP2010153429A
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Ryoji Yokoya
良二 横谷
Keiji Kiba
啓嗣 騎馬
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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Priority to JP2010153429A priority Critical patent/JP2012015466A/en
Priority to CN2011101968586A priority patent/CN102315371A/en
Priority to EP11172732.7A priority patent/EP2405182B1/en
Priority to US13/176,282 priority patent/US8894251B2/en
Publication of JP2012015466A publication Critical patent/JP2012015466A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which reduces unevenness in luminance and color at a light emitting part and forms an even and continuous light emitting surface.SOLUTION: A light emitting device 10 includes multiple solid light emitting elements 12 mounted on a long wiring board 11, an optical member 13 which is provided with the solid light emitting elements 12 so as to cover light emitting surfaces of the multiple solid light emitting elements 12 and which forms a semi-circle or semi-oval in a cross sectional direction and a gutter shape in the longitudinal direction, and a wavelength converting member 14 covered over a light deriving surface of the optical member 13 and excited by light derived from the solid light emitting elements 12 to emit light having a converted wavelength.

Description

本発明は、複数の固体発光素子を光源として照明装置等に適用される発光装置に関する。   The present invention relates to a light emitting device applied to an illumination device or the like using a plurality of solid state light emitting elements as light sources.

従来より、配線基板上に複数の固体発光素子を実装した発光装置が知られている（例えば、特許文献１参照）。
前述した特許文献１に記載された発光装置は、各々の青色固体発光素子に黄色蛍光体を被覆することにより白色光を生成できる。 Conventionally, a light-emitting device in which a plurality of solid-state light-emitting elements are mounted on a wiring board is known (see, for example, Patent Document 1).
The light emitting device described in Patent Document 1 described above can generate white light by coating each blue solid light emitting element with a yellow phosphor.

特開２０１０−１２３９１８号公報（図１、請求項１）Japanese Patent Laying-Open No. 2010-123918 (FIG. 1, claim 1)

通常、発光装置は固体発光素子が点在して設けられている。ところが、固体発光素子の蛍光体は必ずしも均一ではないので全体として色むらを生じる。また、固体発光素子の発光部が小さいために、発光部の輝度が高くなってグレアを生ずる。
前述した特許文献１に記載された発光装置は、これらの課題を解決するために提案されたものであり、固体発光素子列から離間して共通して設けられた蛍光体層および拡散層を通して光を導出する。 Usually, the light emitting device is provided with interspersed solid light emitting elements. However, since the phosphor of the solid state light emitting device is not necessarily uniform, color unevenness occurs as a whole. In addition, since the light emitting portion of the solid state light emitting device is small, the luminance of the light emitting portion is increased to cause glare.
The light-emitting device described in Patent Document 1 described above has been proposed to solve these problems, and light is transmitted through a phosphor layer and a diffusion layer that are provided in common apart from the solid-state light-emitting element array. Is derived.

ところが、前述した特許文献１に記載された発光装置は、以下に記載する二つの課題を有する。
課題の一つ目は、蛍光体層が固体発光素子から離間して配置されてはいるものの、封止部材が接着層を介して蛍光体層に密着されているために、固体発光素子からの出射光が蛍光体層に直接入射して、蛍光体層への入射密度が固体発光素子の配光や固体発光素子間の距離に依存して不均一となって輝度むらが生ずることである。また、蛍光体層への各部位への入射角度分布も不均一となって色むらが生ずることである。
課題の二つ目は、蛍光体層が平板状であるために、固体発光素子から蛍光体層への入射角度が大きい成分が反射されやすく、光取出し効率が低下することである。 However, the light-emitting device described in Patent Document 1 described above has the following two problems.
The first problem is that although the phosphor layer is spaced apart from the solid light emitting element, the sealing member is in close contact with the phosphor layer through the adhesive layer, so The emitted light is directly incident on the phosphor layer, and the incident density on the phosphor layer becomes non-uniform depending on the light distribution of the solid light emitting elements and the distance between the solid light emitting elements, resulting in uneven brightness. In addition, the incident angle distribution on each part of the phosphor layer is also non-uniform and color unevenness occurs.
The second problem is that since the phosphor layer is flat, a component having a large incident angle from the solid light emitting element to the phosphor layer is easily reflected, and the light extraction efficiency is lowered.

本発明は、従来の課題を解決するためになされたもので、発光部での輝度むらと色むらとを軽減でき、均一で連続した発光面を形成できる発光装置を提供することを目的とする。   The present invention has been made to solve the conventional problems, and an object of the present invention is to provide a light emitting device capable of reducing luminance unevenness and color unevenness in a light emitting portion and forming a uniform and continuous light emitting surface. .

本発明に係る発光装置は、長尺の配線基板上に実装された複数の固体発光素子と、複数の固体発光素子の光出射面を覆うように共通して設けられ、断面形状が半円あるいは半楕円形状でかつ長手方向に樋状の光学部材と、光学部材の光導出面に被覆され、固体発光素子から導出された光で励起され、波長変換された光を出射する波長変換部材とを備える。   The light-emitting device according to the present invention is provided in common so as to cover a plurality of solid-state light-emitting elements mounted on a long wiring substrate and the light emission surface of the plurality of solid-state light-emitting elements, and the cross-sectional shape is a semicircle or A semi-elliptical optical member having a bowl shape in the longitudinal direction, and a wavelength conversion member that is covered with a light guide surface of the optical member, is excited by light derived from the solid light emitting element, and emits wavelength-converted light. .

本発明に係る発光装置は、配線基板の表面の少なくとも光学部材の下面を含む領域が高い反射率を有する。   In the light-emitting device according to the present invention, a region including at least the lower surface of the optical member on the surface of the wiring board has a high reflectance.

本発明に係る発光装置は、光学部材と波長変換部材との間に空気層を有する。   The light emitting device according to the present invention has an air layer between the optical member and the wavelength conversion member.

本発明に係る発光装置は、光学部材が、固体発光素子を載置した配線基板との間で、複数の固体発光素子を収納してなる凹部を有し、凹部に固体発光素子を収納した状態で凹部に一部が埋設する。   In the light emitting device according to the present invention, the optical member has a recess formed by housing a plurality of solid light emitting elements between the optical substrate and the wiring board on which the solid light emitting element is mounted, and the solid light emitting element is stored in the recess. The part is buried in the recess.

本発明に係る発光装置は、配線基板と波長変換部材との同一の側の端辺の少なくとも一方が略一致する。   In the light emitting device according to the present invention, at least one of the end sides on the same side of the wiring board and the wavelength conversion member substantially coincides.

本発明に係る発光装置は、光学部材は、複数の光学パーツから構成され、一体として略長尺状に形成される。   In the light emitting device according to the present invention, the optical member is composed of a plurality of optical parts, and is formed in a substantially long shape as a unit.

本発明に係る発光装置は、波長変換部材は、複数の波長変換パーツから構成され、一体として略長尺状に形成される。   In the light emitting device according to the present invention, the wavelength conversion member is composed of a plurality of wavelength conversion parts, and is formed in a substantially long shape as a unit.

本発明に係る発光装置によれば、発光部での輝度むらと色むらとを軽減でき、均一で連続した発光面を形成できるという効果を奏する。   According to the light emitting device of the present invention, luminance unevenness and color unevenness in the light emitting portion can be reduced, and an effect that a uniform and continuous light emitting surface can be formed.

本発明に係る第１実施形態の発光装置の分解斜視図1 is an exploded perspective view of a light emitting device according to a first embodiment of the present invention. 図１の発光装置の長尺方向の垂直断面図1 is a vertical sectional view in the longitudinal direction of the light emitting device of FIG. 図１の発光装置の短尺方向の垂直断面図1 is a vertical sectional view in the short direction of the light emitting device of FIG. 図１の発光装置における光学部材の外観斜視図1 is an external perspective view of an optical member in the light emitting device of FIG. 図１の発光装置の波長変換部材の外観斜視図1 is an external perspective view of a wavelength conversion member of the light emitting device of FIG. 図１の発光装置の光学的な特性を説明する短尺方向の垂直断面図1 is a vertical cross-sectional view in the short direction illustrating the optical characteristics of the light-emitting device of FIG. 本発明に係る第２実施形態の発光装置の長尺方向の垂直断面図Longitudinal vertical sectional view of a light emitting device according to a second embodiment of the present invention. 図７の発光装置の短尺方向の垂直断面図FIG. 7 is a vertical sectional view of the light emitting device in the short direction. 図７の発光装置の平面図The top view of the light-emitting device of FIG. 図７の発光装置の内部構造を示す平面図The top view which shows the internal structure of the light-emitting device of FIG. 図７の発光装置の光学的な特性を説明する長尺方向の垂直断面図FIG. 7 is a vertical sectional view in the longitudinal direction for explaining the optical characteristics of the light-emitting device of FIG. 図７の発光装置の変形例の平面図The top view of the modification of the light-emitting device of FIG. 本発明に係る第３実施形態の発光装置の平面図The top view of the light-emitting device of 3rd Embodiment concerning this invention. 図１３の発光装置の短尺方向の垂直断面図FIG. 13 is a vertical sectional view of the light emitting device in the short direction. 図１３の発光装置を適用した照明装置の垂直断面図Vertical sectional view of a lighting device to which the light emitting device of FIG. 13 is applied 図１３の発光装置の変形例の短尺方向の垂直断面図FIG. 13 is a vertical sectional view in the short direction of a modification of the light emitting device of FIG. 本発明に係る第４実施形態の発光装置の外観斜視図External appearance perspective view of light-emitting device of 4th Embodiment concerning this invention. 図１７の発光装置の長尺方向の垂直断面図FIG. 17 is a vertical sectional view of the light emitting device in the longitudinal direction. 図１７の発光装置の短尺方向の垂直断面図FIG. 17 is a vertical sectional view of the light emitting device in the short direction. 本発明に係る第５実施形態の発光装置の外観斜視図External appearance perspective view of light-emitting device of 5th Embodiment concerning this invention. 図２０の発光装置の長尺方向の垂直断面図20 is a vertical sectional view in the longitudinal direction of the light emitting device of FIG. 図２０の発光装置の短尺方向の垂直断面図20 is a vertical sectional view in the short direction of the light emitting device of FIG. 本発明に係る第６実施形態の発光装置の外観斜視図External appearance perspective view of light-emitting device of 6th Embodiment concerning this invention. 図２３の発光装置の平面図Plan view of the light emitting device of FIG. 図２３の発光装置の変形例の外観斜視図FIG. 23 is an external perspective view of a modification of the light emitting device of FIG. 本発明に係る第７実施形態の発光装置の長尺方向の垂直断面図Longitudinal vertical sectional view of a light emitting device according to a seventh embodiment of the invention 図２６の発光装置の短尺方向の垂直断面図26 is a vertical sectional view in the short direction of the light emitting device of FIG.

以下、本発明に係る複数の実施形態の発光装置について、図面を用いて説明する。
(第１実施形態)
図１に示すように、本発明に係る第１実施形態の発光装置１０は、長尺の配線基板１１と、配線基板１１上に実装された複数の固体発光素子１２と、複数の固体発光素子１２の光出射面を覆うように共通して設けられた光学部材１３と、光学部材１３の光導出面に被覆され、固体発光素子１２から導出された光で励起され、波長変換された光を出射する波長変換部材１４とを備える。 Hereinafter, light emitting devices according to a plurality of embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
As shown in FIG. 1, a light emitting device 10 according to a first embodiment of the present invention includes a long wiring board 11, a plurality of solid light emitting elements 12 mounted on the wiring board 11, and a plurality of solid light emitting elements. The optical member 13 provided in common so as to cover the 12 light emitting surfaces, and the light derived surface of the optical member 13 is covered, excited by the light derived from the solid-state light emitting element 12, and the wavelength-converted light is emitted. The wavelength conversion member 14 to be provided is provided.

図２および図３に示すように、配線基板１１は、アルミニウム等の金属やガラスエポキシあるいはセラミックスを母材として成形されている。配線基板１１は、その上面に固体発光素子１２に給電するための配線パターン１５が設けられている。配線パターン１５の上面には白色レジスト１６が設けられている。配線基板１１は、例えば長さ寸法２００ｍｍ×幅寸法２０ｍｍの長尺形状である。   As shown in FIGS. 2 and 3, the wiring board 11 is formed using a metal such as aluminum, glass epoxy, or ceramics as a base material. The wiring substrate 11 is provided with a wiring pattern 15 for supplying power to the solid state light emitting device 12 on the upper surface thereof. A white resist 16 is provided on the upper surface of the wiring pattern 15. The wiring board 11 has a long shape of, for example, a length dimension of 200 mm × a width dimension of 20 mm.

固体発光素子１２は、窒化物半導体（LED）であり、発光ピーク波長が４６０ｎｍの青色光を発光する。固体発光素子１２は、その大きさが０．３ｍｍサイズである。固体発光素子１２は、配線基板１１上に複数が長手方向に等間隔で一列に実装されている。固体発光素子１２は、その実装方法がダイボンド実装とワイヤーボンド実装との組み合わせである。実装方法としては、フリップチップ実装でもよい。固体発光素子１２の種類や大きさはこの限りではない。
なお、固体発光素子１２群は、一列に限らず、複数列でもよい。その際、光学部材１３の横断面のサイズが断面内の固体発光素子１２群の外接円の光学部材１３の屈折率倍以上となればよい。 The solid state light emitting device 12 is a nitride semiconductor (LED) and emits blue light having an emission peak wavelength of 460 nm. The size of the solid state light emitting device 12 is 0.3 mm. A plurality of solid state light emitting devices 12 are mounted on the wiring substrate 11 in a line at equal intervals in the longitudinal direction. The mounting method of the solid light emitting element 12 is a combination of die bond mounting and wire bond mounting. As a mounting method, flip chip mounting may be used. The type and size of the solid state light emitting device 12 are not limited to this.
Note that the group of solid-state light emitting elements 12 is not limited to one row, and may be a plurality of rows. In that case, the size of the cross section of the optical member 13 should just be more than the refractive index times of the optical member 13 of the circumcircle of the solid light emitting element 12 group in a cross section.

図４に示すように、光学部材１３は、透明のシリコーン樹脂製であって、外形の断面が半円で長手方向に樋状で固体発光素子１２群を覆うようなサイズである。光学部材１３は、その断面の外形の直径が固体発光素子１２の外接円直径の光学部材１３の屈折率倍（シリコーン樹脂の場合は１．４１倍である。）以上となっている。光学部材１３は、断面の中心を含む内側に凹部１７が形成されており、固体発光素子１２群を内包するサイズになっている。光学部材１３は、両端部に凹部１７を有さない蓋部１８が形成されている。光学部材１３は、内側の凹部１７に光学部材１３と同じ屈折率を有するシリコーン樹脂が充填され、固体発光素子１２群を覆うように配線基板１１上に搭載されることにより封止および実装されて固定される。光学部材１３は、硬化後に封止樹脂と一体構造となるために界面が生じない。光学部材１３は、その中心軸が固体発光素子１２群の実装軸に一致している。
なお、光学部材１３は、シリコーン樹脂に限らず、例えば、エポキシ樹脂やガラス等の無機材でもよい。また、光学部材１３は、外形の断面が半円に限らずに半楕円形状であってもよい。 As shown in FIG. 4, the optical member 13 is made of a transparent silicone resin, and has a size such that the cross section of the outer shape is a semicircle and has a bowl shape in the longitudinal direction and covers the group of solid light emitting elements 12. The optical member 13 has a cross-sectional outer diameter that is equal to or greater than the refractive index of the optical member 13 that is the circumscribed circle diameter of the solid light-emitting element 12 (1.41 times in the case of silicone resin). The optical member 13 has a recess 17 formed on the inner side including the center of the cross section, and is sized to contain the group of solid light emitting elements 12. The optical member 13 is formed with a lid portion 18 that does not have the concave portion 17 at both ends. The optical member 13 is sealed and mounted by filling the inner concave portion 17 with a silicone resin having the same refractive index as the optical member 13 and mounting it on the wiring substrate 11 so as to cover the group of solid light emitting elements 12. Fixed. Since the optical member 13 has an integral structure with the sealing resin after curing, no interface is generated. The central axis of the optical member 13 coincides with the mounting axis of the solid light emitting element 12 group.
The optical member 13 is not limited to a silicone resin, and may be an inorganic material such as an epoxy resin or glass. Further, the optical member 13 is not limited to a semicircular cross section, and may be a semi-elliptical shape.

図５に示すように、波長変換部材１４は、屈折率が、１．２〜１．５の透明耐熱性樹脂（例えばシリコーン樹脂）に固体発光素子１２から放射された青色光によって励起されて黄色光を放射する粒子状の黄色蛍光体を分散させた混合材料である。波長変換部材１４は、透光性材料に分散させる蛍光体として、黄色に限らず、色調整や演色性を高める等の目的で複数色の蛍光体を混色させて用いてもよく、例えば、赤色蛍光体と緑色蛍光体を用いることにより、演色性の高い白色光が得られる。波長変換部材１４は、光学部材１３に密着する形状に成形された、厚み０．５〜１ｍｍのシート状に形成されており、両端部に曲面部分の厚みに比べて薄い厚みの蓋部１９が形成されている。波長変換部材１４は、光学部材１３に相似する形状であるために、シリコーン樹脂を介して光学部材１３を覆うように密着して搭載されている。
なお、波長変換部材１４は、光学部材１３の表面に塗布されることにより形成されてもよい。 As shown in FIG. 5, the wavelength conversion member 14 is excited by the blue light emitted from the solid light emitting element 12 to a transparent heat-resistant resin (for example, silicone resin) having a refractive index of 1.2 to 1.5, and thus the wavelength conversion member 14 is yellow. It is a mixed material in which particulate yellow phosphors that emit light are dispersed. The wavelength conversion member 14 is not limited to yellow as a phosphor to be dispersed in the translucent material, and may be used by mixing phosphors of a plurality of colors for the purpose of improving color adjustment or color rendering. By using the phosphor and the green phosphor, white light with high color rendering can be obtained. The wavelength conversion member 14 is formed in a sheet shape having a thickness of 0.5 to 1 mm and formed in a shape that is in close contact with the optical member 13, and the lid portions 19 that are thinner than the curved surface portions are formed at both ends. Is formed. Since the wavelength conversion member 14 has a shape similar to the optical member 13, the wavelength conversion member 14 is mounted in close contact with the optical member 13 through a silicone resin.
The wavelength conversion member 14 may be formed by being applied to the surface of the optical member 13.

次に、発光装置１０の光学的な特性について説明する。
図６に示すように、固体発光素子１２群から発した青色光は光学部材１３を介して波長変換部材１４に入射され、その一部が波長変換部材１４の内部の蛍光体によって波長変換された光を発し、波長変換されずに出射した青色光と混ざって白色光として波長変換部材１４の表面から出射される。単一の固体発光素子１２から発された光は波長変換部材１４が固体発光素子１２を中心とした半円状であり、かつ固体発光素子１２の発光面に対して十分に大きいサイズであるために、波長変換部材１４の断面の任意の入射点Ａ，入射点Ｂ，入射点Ｃに入射される光成分の角度分布が小さくなって揃う。そのため、波長変換部材１４の出射面の界面での表面反射成分が軽減される。これにより、発光装置１０は、効率よく光を取り出せる。さらに、波長変換部材１４の内部での光路長の分布も波長変換部材１４の任意の点で均一化されるために、色むらおよび輝度むらを軽減できる。 Next, optical characteristics of the light emitting device 10 will be described.
As shown in FIG. 6, the blue light emitted from the solid light emitting element 12 group is incident on the wavelength conversion member 14 through the optical member 13, and a part of the blue light is wavelength-converted by the phosphor inside the wavelength conversion member 14. Light is emitted and mixed with blue light emitted without wavelength conversion, and is emitted from the surface of the wavelength conversion member 14 as white light. The light emitted from the single solid-state light emitting element 12 has a semicircular shape with the wavelength conversion member 14 centered on the solid-state light emitting element 12 and is sufficiently large in size relative to the light emitting surface of the solid-state light emitting element 12. Further, the angular distribution of the light components incident on the arbitrary incident point A, incident point B, and incident point C in the cross section of the wavelength conversion member 14 is reduced and aligned. Therefore, the surface reflection component at the interface of the emission surface of the wavelength conversion member 14 is reduced. Thereby, the light-emitting device 10 can extract light efficiently. Furthermore, since the distribution of the optical path length inside the wavelength conversion member 14 is also made uniform at an arbitrary point of the wavelength conversion member 14, color unevenness and luminance unevenness can be reduced.

以上、説明した本発明に係る第１実施形態の発光装置１０によれば、任意の固体発光素子１２を含む光学部材１３および波長変換部材１４の断面形状が固体発光素子１２を中心とする半円であるために、固体発光素子１２から光学部材１３の断面方向に出射した光が波長変換部材１４に全て小さい角度分布で入射する。
従って、本発明に係る第１実施形態の発光装置１０によれば、色むらや輝度むらを軽減できる。また、本発明に係る第１実施形態の発光装置１０によれば、固体発光素子１２を並べた構造と比べて波長変換部材１４の表面積が大きくなるので、発光部の輝度が低下してグレアを緩和できる。 As described above, according to the light emitting device 10 according to the first embodiment of the present invention described above, the cross-sectional shapes of the optical member 13 and the wavelength conversion member 14 including the arbitrary solid light emitting element 12 are semicircular with the solid light emitting element 12 as the center. Therefore, all the light emitted from the solid light emitting element 12 in the cross-sectional direction of the optical member 13 enters the wavelength conversion member 14 with a small angular distribution.
Therefore, according to the light emitting device 10 of the first embodiment according to the present invention, color unevenness and brightness unevenness can be reduced. In addition, according to the light emitting device 10 of the first embodiment of the present invention, the surface area of the wavelength conversion member 14 is increased compared to the structure in which the solid light emitting elements 12 are arranged, so that the luminance of the light emitting unit is reduced and glare is reduced. Can be relaxed.

（第２実施形態）
次に、本発明に係る第２実施形態の発光装置について説明する。なお、以下の各実施形態において、上述した第１実施形態と重複する構成要素や機能的に同様な構成要素については、図中に同一符号あるいは相当符号を付することによって説明を簡略化あるいは省略する。 (Second Embodiment)
Next, a light emitting device according to a second embodiment of the invention will be described. In the following embodiments, components that are the same as those in the first embodiment described above or functionally similar components are simplified or omitted by giving the same reference numerals or equivalent symbols in the drawings. To do.

図７および図８に示すように、本発明に係る第２実施形態の発光装置２０は、配線基板１１の表面において光学部材１３の下面を含む領域が高い反射率を有し、光学部材１３と波長変換部材１４との間に空気層２１を有する。波長変換部材１４は、例えば厚みが０．５〜１ｍｍを有しており、波長変換部材１４の下面と配線基板１１とがシリコーン樹脂を介して接合されている。
また、発光装置２０は、図９に示すように、配線基板１１の表面において、固体発光素子１２の実装部およびワイヤボンディング部以外の領域に高反射の白色レジスト膜２２を有することにより高い反射率が実現される。光学部材１３の下面は拡散反射率の高い性状になっている。 As shown in FIGS. 7 and 8, the light emitting device 20 according to the second embodiment of the present invention has a high reflectance in the region including the lower surface of the optical member 13 on the surface of the wiring board 11. An air layer 21 is provided between the wavelength conversion member 14. The wavelength conversion member 14 has, for example, a thickness of 0.5 to 1 mm, and the lower surface of the wavelength conversion member 14 and the wiring substrate 11 are joined via a silicone resin.
Further, as shown in FIG. 9, the light emitting device 20 has a high reflectance by having a highly reflective white resist film 22 in a region other than the mounting portion of the solid light emitting element 12 and the wire bonding portion on the surface of the wiring substrate 11. Is realized. The lower surface of the optical member 13 has a high diffuse reflectance property.

図１０に示すように、発光装置２０は、光学部材１３が搭載される光学部材搭載部２３において固体発光素子１２のダイボンド用のパターン２４と通電用のパターン２５とが分離されており、ダイボンド用のパターン２４が光学部材１３の下面と略一致されており、通電用のパターン２５が、ダイボンド用のパターン２４の外側から固体発光素子１２の近傍まで細線で伸びるパターン構成になっている。ダイボンド用のパターン２４は、白色レジスト膜２２に被覆されておらず、パターンとして外部に露出している。
ダイボンド用のパターン２４は、銀メッキあるいはアルミ蒸着の高反射処理が施されていてもよい。 As shown in FIG. 10, in the light emitting device 20, the die bonding pattern 24 and the energization pattern 25 of the solid light emitting element 12 are separated in the optical member mounting portion 23 on which the optical member 13 is mounted. The pattern 24 is substantially coincident with the lower surface of the optical member 13, and the energizing pattern 25 has a pattern configuration extending from the outside of the die-bonding pattern 24 to the vicinity of the solid light emitting element 12 with a thin line. The die bonding pattern 24 is not covered with the white resist film 22 and is exposed to the outside as a pattern.
The die bond pattern 24 may be subjected to high reflection treatment of silver plating or aluminum deposition.

図１１に示すように、発光装置２０の変形例は、高反射のセラミック製の配線基板１１が適用されており、この配線基板１１上に形成された通電用のパターン２５の必要最小限だけが光学部材１３の下面内に形成されている。   As shown in FIG. 11, a highly reflective ceramic wiring board 11 is applied to the modification of the light emitting device 20, and only the minimum necessary pattern of the energization pattern 25 formed on the wiring board 11 is used. It is formed in the lower surface of the optical member 13.

次に、発光装置２０の光学的な特性について説明する。
図１２に示すように、光学部材１３と波長変換部材１４との間に空気層２１があるために、光学部材１３の長手方向に向かう光成分は光学部材１３の光出射面の界面で全反射成分が増え、長手方向への導光作用が生じる。この際、光学部材１３の下面の配線基板１１の反射面において拡散反射されて角度変化した光が任意の点で一様に光学部材１３から出射される。これにより、波長変換部材１４の任意の点に入射する光成分（入射量、入射角度分布）が、より均一となり、発光部である波長変換部材１４での色むらや輝度むらが、より均一となる。また、光学部材１３の成形あるいは配線基板１１への実装過程で内部にボイドが生じた場合、固体発光素子１２からの光がボイドによって角度変化が生じるために、光学部材１３の外面からの出射光にむらが生じる。このとき、発光装置１０のように、波長変換部材１４が光学部材１３に密着していると、出射光むらが転写された形で発光部である波長変換部材１４の表面において輝度むらを生ずる。しかし、発光装置２０では、波長変換部材１４が光学部材１３から離間しているために、その影響が軽減される。 Next, optical characteristics of the light emitting device 20 will be described.
As shown in FIG. 12, since there is an air layer 21 between the optical member 13 and the wavelength conversion member 14, the light component traveling in the longitudinal direction of the optical member 13 is totally reflected at the interface of the light emitting surface of the optical member 13. A component increases and the light guide effect to a longitudinal direction arises. At this time, light that has been diffusely reflected on the reflection surface of the wiring substrate 11 on the lower surface of the optical member 13 and changed in angle is emitted uniformly from the optical member 13 at an arbitrary point. As a result, the light component (incident amount, incident angle distribution) incident on an arbitrary point of the wavelength conversion member 14 becomes more uniform, and color unevenness and luminance unevenness in the wavelength conversion member 14 that is a light emitting portion become more uniform. Become. In addition, when a void is generated inside the optical member 13 during molding or mounting on the wiring board 11, the light from the solid-state light emitting element 12 changes in angle due to the void. Unevenness occurs. At this time, when the wavelength conversion member 14 is in close contact with the optical member 13 as in the light emitting device 10, uneven brightness occurs on the surface of the wavelength conversion member 14 that is a light emitting portion in a form in which the unevenness of the emitted light is transferred. However, in the light emitting device 20, since the wavelength conversion member 14 is separated from the optical member 13, the influence is reduced.

本発明に係る第２実施形態の発光装置２０によれば、波長変換部材１４で反射された青色光および固体発光素子１２側に出射した黄色光が配線基板１１の表面で反射されて波長変換部材１４に再入射し、発光装置２０の外側に出射される。そのため、本発明に係る第２実施形態の発光装置２０によれば、光取出しの効率を向上できる。また、本発明に係る第２実施形態の発光装置２０によれば、配線基板１１の表面における反射面が拡散反射面であれば、再入射成分が波長変換部材１４に均一に入射されるために、長手方向の輝度むらおよび色むらを軽減できる。   According to the light emitting device 20 of the second embodiment according to the present invention, the blue light reflected by the wavelength conversion member 14 and the yellow light emitted to the solid light emitting element 12 side are reflected by the surface of the wiring substrate 11 to be the wavelength conversion member. 14 reenters and exits the light emitting device 20. Therefore, according to the light emitting device 20 of the second embodiment of the present invention, the light extraction efficiency can be improved. Further, according to the light emitting device 20 of the second embodiment of the present invention, if the reflection surface on the surface of the wiring board 11 is a diffuse reflection surface, the re-incident component is uniformly incident on the wavelength conversion member 14. , Longitudinal luminance unevenness and color unevenness can be reduced.

また、本発明に係る第２実施形態の発光装置２０によれば、光学部材１３と波長変換部材１４と間に空気層２１を有するために、光学部材１３の光導出面の界面で全反射成分が増え、長手方向への導光作用が生じる。その際、光学部材１３の下面の配線基板１１の反射面で拡散反射された光が光学部材１３から出射されるために、波長変換部材１４の任意の点に入射する光成分が、より均一となり、発光部の色むらおよび輝度むらが均一になる。また、本発明に係る第２実施形態の発光装置２０によれば、波長変換部材１４が光学部材１３から離間しているために、光学部材１３の内側に生じたボイドによる青色光出射分布むらが波長変換部材１４に転写されることがないので、発光部の輝度むらを軽減できる。さらに、本発明に係る第２実施形態の発光装置２０によれば、波長変換部材１４への入射光および内部で発生した変換光で固体発光素子１２側に出る光成分のうち、波長変換部材１４の内面で全反射される成分が増えるため、光取出しの効率を向上できる。   Moreover, according to the light emitting device 20 of the second embodiment of the present invention, since the air layer 21 is provided between the optical member 13 and the wavelength conversion member 14, the total reflection component is present at the interface of the light guide surface of the optical member 13. The light guide action in the longitudinal direction is increased. At that time, since the light diffusely reflected by the reflecting surface of the wiring board 11 on the lower surface of the optical member 13 is emitted from the optical member 13, the light component incident on any point of the wavelength conversion member 14 becomes more uniform. The uneven color and uneven brightness of the light emitting part are uniform. Further, according to the light emitting device 20 of the second embodiment of the present invention, since the wavelength conversion member 14 is separated from the optical member 13, there is uneven blue light emission distribution due to voids generated inside the optical member 13. Since the light is not transferred to the wavelength conversion member 14, the luminance unevenness of the light emitting portion can be reduced. Furthermore, according to the light emitting device 20 of the second embodiment of the present invention, the wavelength conversion member 14 out of the light components that are incident on the wavelength conversion member 14 and the light components that are generated inside and are emitted to the solid light emitting element 12 side. Since the component totally reflected on the inner surface of the light increases, the light extraction efficiency can be improved.

（第３実施形態）
次に、本発明に係る第３実施形態の発光装置について説明する。
図１３および図１４に示すように、本発明に係る第３実施形態の発光装置３０は、光学部材３１が、固体発光素子１２を載置した配線基板１１との間で、複数の固体発光素子１２を収納してなる凹部３２を有する枠体３３を備え、枠体３３の凹部３２に固体発光素子１２を収納した状態で凹部３２に一部が埋設されている。 (Third embodiment)
Next, a light emitting device according to a third embodiment of the invention will be described.
As shown in FIGS. 13 and 14, the light emitting device 30 according to the third embodiment of the present invention includes a plurality of solid state light emitting elements between the optical member 31 and the wiring substrate 11 on which the solid state light emitting elements 12 are mounted. A frame 33 having a recess 32 that stores 12 is provided, and a part of the solid light emitting element 12 is embedded in the recess 32 in a state where the solid light emitting element 12 is stored in the recess 32 of the frame 33.

枠体３３は、配線基板１１上の固体発光素子１２群の周囲にボンディングワイヤ部を含む固体発光素子１２を収納する高さを有し、かつ、その内面形状が、例えば４５度で配線基板１１に向かって狭くなるテーパ形状をなし、かつ、上部開口部３４が光学部材３１の外径に同一である。枠体３３は、接着剤（シリコーン製）を介して配線基板１１上に搭載されており、少なくとも内面が反射率の高いものになっている。枠体３３は、高反射ポリブチレンテレフタレート製である。
なお、枠体３３は、そのテーパ形状が４５度に限定されない。また、枠体３３は、アルミ等の金属製あるいは耐熱性に優れた樹脂や金属で内面にアルミや銀の蒸着が施されたものでもよく、高反射のセラミック製であってもよい。また、凹部３２を一体に形成したセラミック基板でもよい。 The frame 33 has a height for housing the solid light emitting elements 12 including the bonding wire portion around the group of solid light emitting elements 12 on the wiring board 11 and has an inner surface shape of, for example, 45 degrees. The upper opening 34 is the same as the outer diameter of the optical member 31. The frame 33 is mounted on the wiring board 11 via an adhesive (made of silicone), and at least the inner surface has high reflectivity. The frame 33 is made of highly reflective polybutylene terephthalate.
In addition, the taper shape of the frame 33 is not limited to 45 degrees. The frame 33 may be made of a metal such as aluminum, or may be made of a resin or metal having excellent heat resistance, with aluminum or silver deposited on the inner surface, or may be made of a highly reflective ceramic. Moreover, the ceramic substrate which formed the recessed part 32 integrally may be sufficient.

光学部材３１は、その一部を枠体３３内に内挿して搭載されている。波長変換部材１４は、その端部が枠体３３上にシリコーン樹脂を介して接着固定されている。
なお、波長変換部材１４は、枠体３３を覆うように配線基板１１に接合により固定されてもよい。 The optical member 31 is mounted with a part thereof inserted into the frame 33. The end of the wavelength conversion member 14 is bonded and fixed on the frame 33 via a silicone resin.
The wavelength conversion member 14 may be fixed to the wiring substrate 11 by bonding so as to cover the frame 33.

次に、発光装置３０における光学部材３１の形成手順について説明する。
光学部材３１を形成するにあたり、まず、枠体３３の凹部３２に透明シリコーン樹脂材料３５が充填される。次に、透明シリコーン樹脂材料３５と同様な透明樹脂で形成された断面形状が半円形状で、かつ長手方向に樋状の透明部材材料３６が透明シリコーン樹脂材料３５を介して接合される。これにより、光学部材３１を容易にかつ内部にボイドを生じることなく製造できる。 Next, a procedure for forming the optical member 31 in the light emitting device 30 will be described.
In forming the optical member 31, first, the concave portion 32 of the frame 33 is filled with the transparent silicone resin material 35. Next, a cross-sectional shape formed of a transparent resin similar to the transparent silicone resin material 35 is semicircular, and a bowl-shaped transparent member material 36 in the longitudinal direction is bonded via the transparent silicone resin material 35. Thereby, the optical member 31 can be manufactured easily and without generating a void inside.

図１５に示すように、発光装置３０を適用した照明装置４０は、天井面に埋設されるベースライトであって、下方が開口された器具本体４１の天板４２の下面に発光装置３０が取り付けられている。発光装置３０の前面には配光制御用反射板４３が取り付けられており、器具本体４１の開口側端部に樋状の金属製の枠部材４４が固定用ねじ４５により取り付けられている。配線基板１１からは固体発光素子１２へ通電するための電源線４６が引き出されており、電源線４６は器具本体４１の外部で不図示の電源装置に電気的に接続される。配線基板１１は、ねじ４７により器具本体４１の天板４２の下面に取り付けられている。
なお、配光制御用反射板４３は、レンズであってもよい。 As shown in FIG. 15, a lighting device 40 to which the light emitting device 30 is applied is a base light embedded in a ceiling surface, and the light emitting device 30 is attached to the lower surface of the top plate 42 of the instrument body 41 opened at the bottom. It has been. A light distribution control reflecting plate 43 is attached to the front surface of the light emitting device 30, and a bowl-shaped metal frame member 44 is attached to the opening side end of the instrument main body 41 by a fixing screw 45. A power supply line 46 for energizing the solid state light emitting device 12 is drawn out from the wiring board 11, and the power supply line 46 is electrically connected to a power supply device (not shown) outside the instrument body 41. The wiring board 11 is attached to the lower surface of the top plate 42 of the instrument body 41 with screws 47.
The light distribution control reflecting plate 43 may be a lens.

発光装置３０を適用した照明装置４０は、発光装置３０において、固体発光素子１２の側面から水平および下方に発した光が枠体３３の内面で上方に撥ね上げられ、かつ配光制御用反射板４３の下面開口部が枠体３３の上端よりも下方へ配置されるために、配光制御用反射板４３に光を効率よく入射できる。そして、照明装置４０は、配光制御用反射板４３から漏れ光が生じない。   The illuminating device 40 to which the light emitting device 30 is applied is the light emitting device 30 in which light emitted horizontally and downward from the side surface of the solid light emitting element 12 is repelled upward on the inner surface of the frame 33 and the light distribution control reflecting plate Since the lower surface opening of 43 is disposed below the upper end of the frame 33, light can be efficiently incident on the light distribution control reflecting plate 43. And the illuminating device 40 does not produce leakage light from the light distribution control reflecting plate 43.

図１６に示すように、発光装置３０の変形例は、枠体３７を覆って波長変換部材１４の端部が配線基板１１に接合されている。
本変形例では、枠体３７の外形を小型化できる。 As shown in FIG. 16, in the modification of the light emitting device 30, the end of the wavelength conversion member 14 is bonded to the wiring substrate 11 so as to cover the frame body 37.
In this modification, the outer shape of the frame 37 can be reduced in size.

本発明に係る第３実施形態の発光装置３０によれば、光学部材３１の形成が、枠体３３，３７の凹部３２に透明シリコーン樹脂材料３５が充填され、次に、透明シリコーン樹脂材料３５と同様な透明樹脂で形成された断面形状が半円形状で、かつ長手方向に樋状の透明部材材料３６が透明シリコーン樹脂材料３５を介して接合される。これにより、本発明に係る第３実施形態の発光装置３０によれば、光学部材３１を容易にかつ内部にボイドを生じることなく製造できる。   According to the light emitting device 30 of the third embodiment of the present invention, the optical member 31 is formed by filling the concave portions 32 of the frames 33 and 37 with the transparent silicone resin material 35, and then with the transparent silicone resin material 35. A transparent member material 36 having a semicircular cross-sectional shape made of a similar transparent resin and having a bowl shape in the longitudinal direction is bonded via a transparent silicone resin material 35. Thereby, according to the light-emitting device 30 of 3rd Embodiment which concerns on this invention, the optical member 31 can be manufactured easily and without producing a void inside.

また、本発明に係る第３実施形態の発光装置３０によれば、歩留まりを向上できるとともに製造時の工程の簡素化を図れるために、製造コストを大幅に低減できる。また、照明装置４０の器具効率を大幅に向上できる。   Moreover, according to the light emitting device 30 of the third embodiment of the present invention, the yield can be improved and the manufacturing process can be simplified, so that the manufacturing cost can be greatly reduced. Moreover, the instrument efficiency of the illuminating device 40 can be improved significantly.

（第４実施形態）
次に、本発明に係る第４実施形態の発光装置について説明する。
図１７に示すように、本発明に係る第４実施形態の発光装置５０は、配線基板１１と波長変換部材１４との長さ方向に直交する幅方向側（短尺側）の端辺が一致している。
図１８および図１９に示すように、発光装置５０は、配線基板１１と波長変換部材１４との幅方向側の端辺が一致しているために、複数個の隣り合う幅方向側の１辺を各々近接させることにより均一な面発光光源を容易に形成できる。 (Fourth embodiment)
Next, a light emitting device according to a fourth embodiment of the invention will be described.
As shown in FIG. 17, in the light emitting device 50 according to the fourth embodiment of the present invention, the end sides on the width direction side (short side) perpendicular to the length direction of the wiring substrate 11 and the wavelength conversion member 14 match. ing.
As shown in FIGS. 18 and 19, the light emitting device 50 has a plurality of adjacent one sides on the width direction side because the width side edges of the wiring substrate 11 and the wavelength conversion member 14 are the same. By making them close to each other, a uniform surface-emitting light source can be easily formed.

本発明に係る第４実施形態の発光装置５０によれば、複数個を隣接して配置した際に、連続した発光面のサイズと形状の変更が容易に形成できる。   According to the light emitting device 50 of the fourth embodiment of the present invention, it is possible to easily change the size and shape of the continuous light emitting surface when a plurality of light emitting devices are arranged adjacent to each other.

（第５実施形態）
次に、本発明に係る第５実施形態の発光装置について説明する。
図２０に示すように、本発明に係る第５実施形態の発光装置６０は、配線基板１１と波長変換部材１４との長さ方向側(長尺側)の端辺が一致している。
図２１および図２２に示すように、発光装置６０は、配線基板１１と波長変換部材１４との長さ方向側の端辺が一致しているために、複数個の隣り合う長さ方向側の１辺を隙間なく各々近接させることにより均一なライン発光光源を容易に形成できる。 (Fifth embodiment)
Next, a light emitting device according to a fifth embodiment of the invention will be described.
As shown in FIG. 20, in the light emitting device 60 according to the fifth embodiment of the present invention, the length direction side (long side) ends of the wiring substrate 11 and the wavelength conversion member 14 coincide with each other.
As shown in FIG. 21 and FIG. 22, the light emitting device 60 has a plurality of adjacent lengthwise side edges because the lengthwise ends of the wiring substrate 11 and the wavelength conversion member 14 are the same. A uniform line light source can be easily formed by bringing one side close to each other without a gap.

（第６実施形態）
次に、本発明に係る第６実施形態の発光装置について説明する。
図２３および図２４に示すように、本発明に係る第６実施形態の発光装置７０は、分割された複数の短尺光学部材パーツ７２から構成された光学部材７１を備える。短尺光学部材パーツ７２の端部には、固体発光素子１２の実装間隔よりも薄い厚みを有する壁７３が形成されている。短尺光学部材パーツ７２のサイズは、壁７３が特定の隣接する固体発光素子１２の中間に位置するようになっている。 (Sixth embodiment)
Next, a light emitting device according to a sixth embodiment of the invention will be described.
As shown in FIGS. 23 and 24, the light emitting device 70 according to the sixth embodiment of the present invention includes an optical member 71 including a plurality of divided short optical member parts 72. At the end of the short optical member part 72, a wall 73 having a thickness smaller than the mounting interval of the solid light emitting elements 12 is formed. The size of the short optical member part 72 is such that the wall 73 is located in the middle of a specific adjacent solid light emitting element 12.

次に、発光装置７０における光学部材７１の形成手順について説明する。
光学部材７１を形成するにあたり、短尺光学部材パーツ７２の凹部７４に透明シリコーン樹脂材料が充填されて固体発光素子１２の端から実装されていく。次に、隣接する短尺光学部材パーツ７２間が透明シリコーン樹脂材料を介して接合される。このとき、充填される透明シリコーン樹脂材料と短尺光学部材パーツ７２および透明シリコーン樹脂材料が同一材料であることにより、硬化後に界面のない一体構造となる。 Next, a procedure for forming the optical member 71 in the light emitting device 70 will be described.
In forming the optical member 71, the concave portion 74 of the short optical member part 72 is filled with a transparent silicone resin material and mounted from the end of the solid light emitting element 12. Next, the adjacent short optical member parts 72 are joined via a transparent silicone resin material. At this time, since the transparent silicone resin material to be filled, the short optical member part 72, and the transparent silicone resin material are the same material, an integrated structure having no interface after curing is obtained.

図２５に示すように、発光装置７０の変形例は、分割された複数の短尺波長変換部材パーツ７５から構成された波長変換部材７６を備える。この場合、短尺波長変換部材パーツ７５間の接合は波長変換部材７６と同じ蛍光体を含有したシリコーン樹脂材料を介して行うのが好ましい。   As shown in FIG. 25, the modified example of the light emitting device 70 includes a wavelength conversion member 76 configured from a plurality of divided short wavelength conversion member parts 75. In this case, the joining between the short wavelength conversion member parts 75 is preferably performed via a silicone resin material containing the same phosphor as the wavelength conversion member 76.

本発明に係る第６実施形態の発光装置７０によれば、柔軟な光学部材７１または波長変換部材７６を分割することにより成形が容易になる。また、ボイドが生じ難くなるために歩留まりが向上し、実装が容易になる。これにより、製造コストを低減できる。   According to the light emitting device 70 of the sixth embodiment of the present invention, the flexible optical member 71 or the wavelength conversion member 76 is divided to facilitate the molding. In addition, since voids are less likely to occur, the yield is improved and mounting is facilitated. Thereby, manufacturing cost can be reduced.

（第７実施形態）
次に、本発明に係る第７実施形態の発光装置について説明する。
図２６および図２７に示すように、本発明に係る第７実施形態の発光装置８０は、波長変換部材１４と相似形状であって、波長変換部材１４を覆うように空気層２１を介して透光なアクリル製のカバー８１が設けられている。カバー８１は、ポリカーボネイド等の透明樹脂やガラスが選ばれる。 (Seventh embodiment)
Next, a light emitting device according to a seventh embodiment of the invention will be described.
As shown in FIGS. 26 and 27, the light emitting device 80 according to the seventh embodiment of the present invention has a similar shape to the wavelength conversion member 14 and is transparent through the air layer 21 so as to cover the wavelength conversion member 14. A light acrylic cover 81 is provided. The cover 81 is made of transparent resin such as polycarbonate or glass.

なお、カバー８１は、波長変換部材１４に密着されていると、部材間の熱膨張収縮により、界面で剥がれが生じたり、固定により波長変換部材１４および光学部材１３に静的負荷がかかり易く信頼性が低下したりする。しかし、カバー８１は、波長変換部材１４から離間して設けられているために、界面における剥がれや信頼性の低下を生じない。   Note that when the cover 81 is in close contact with the wavelength conversion member 14, the cover 81 is peeled off at the interface due to thermal expansion and contraction between the members, or the static load is easily applied to the wavelength conversion member 14 and the optical member 13 due to fixation. The sex will be reduced. However, since the cover 81 is provided away from the wavelength conversion member 14, it does not peel off at the interface or deteriorate the reliability.

本発明に係る第７実施形態の発光装置８０によれば、カバー８１により発光部が覆われることにより、外部からの負荷による損傷（例えば、ワイヤ断線や剥がれや傷である。）を防止できる。これにより、本発明に係る第７実施形態の発光装置８０によれば、外部から固体発光素子１２を保護できる。   According to the light emitting device 80 of the seventh embodiment of the present invention, the light emitting portion is covered with the cover 81, so that damage due to an external load (for example, wire breakage, peeling or scratching) can be prevented. Thereby, according to the light-emitting device 80 of 7th Embodiment which concerns on this invention, the solid light emitting element 12 can be protected from the outside.

なお、本発明の発光装置は、前述した実施形態に限定されるものでなく、適宜な変形や改良等が可能である。
前述した実施形態では、固体発光素子の数が１０個の場合のみを示しているが、これに限らず、固体発光素子の数は、１０個以下および１０個以上の複数個であってもよい。 In addition, the light-emitting device of this invention is not limited to embodiment mentioned above, A suitable deformation | transformation, improvement, etc. are possible.
In the above-described embodiment, only the case where the number of solid light emitting elements is 10 is shown, but the present invention is not limited thereto, and the number of solid light emitting elements may be 10 or less and a plurality of 10 or more. .

１０，２０，３０，５０，６０，７０，８０ 発光装置
１１ 配線基板
１２ 固体発光素子
１３，３１，７１ 光学部材
１４，７６ 波長変換部材(発光部)
２１ 空気層
３２ 凹部
７２ 短尺光学部材パーツ（光学パーツ）
７５ 短尺波長変換部材パーツ（波長変換パーツ） 10, 20, 30, 50, 60, 70, 80 Light emitting device 11 Wiring board 12 Solid light emitting element 13, 31, 71 Optical member 14, 76 Wavelength converting member (light emitting portion)
21 Air layer 32 Concave portion 72 Short optical member parts (optical parts)
75 Short wavelength conversion member parts (wavelength conversion parts)

Claims (7)

長尺の配線基板上に実装された複数の固体発光素子と、
前記複数の固体発光素子の光出射面を覆うように共通して設けられ、断面形状が半円あるいは半楕円形状でかつ長手方向に樋状の光学部材と、
前記光学部材の光導出面に被覆され、前記固体発光素子から導出された光で励起され、波長変換された光を出射する波長変換部材とを備える発光装置。 A plurality of solid state light emitting devices mounted on a long wiring board;
An optical member that is provided in common so as to cover the light emitting surfaces of the plurality of solid-state light emitting elements, has a semicircular or semi-elliptical cross-sectional shape, and a bowl-shaped optical member in the longitudinal direction;
A light emitting device comprising: a wavelength conversion member that is coated on a light extraction surface of the optical member, is excited by light derived from the solid light emitting element, and emits wavelength-converted light. 請求項１に記載の発光装置において、
前記配線基板の表面の少なくとも前記光学部材の下面を含む領域が高い反射率を有する発光装置。 The light-emitting device according to claim 1.
A light emitting device having a high reflectance in a region including at least a lower surface of the optical member on a surface of the wiring board. 請求項１または請求項２に記載の発光装置において、
前記光学部材と前記波長変換部材との間に空気層を有する発光装置。 The light-emitting device according to claim 1 or 2,
A light emitting device having an air layer between the optical member and the wavelength conversion member. 請求項１ないし請求項３のいずれか１項に記載の発光装置において、
前記光学部材が、前記固体発光素子を載置した前記配線基板との間で、前記複数の固体発光素子を収納してなる凹部を有し、前記凹部に前記固体発光素子を収納した状態で前記凹部に一部が埋設する発光装置。 The light emitting device according to any one of claims 1 to 3,
The optical member has a recess formed by housing the plurality of solid light emitting elements between the wiring board on which the solid light emitting element is placed, and the solid light emitting element is stored in the recess in the state where the solid light emitting element is stored. A light emitting device partially embedded in the recess. 請求項１ないし請求項４のいずれか１項に記載の発光装置において、
前記配線基板と前記波長変換部材との同一の側の端辺の少なくとも一方が略一致する発光装置。 The light emitting device according to any one of claims 1 to 4,
A light emitting device in which at least one of the end sides on the same side of the wiring board and the wavelength conversion member substantially coincides. 請求項１ないし請求項５のいずれか１項に記載の発光装置において、
前記光学部材は、複数の光学パーツから構成され、一体として略長尺状に形成される発光装置。 The light emitting device according to any one of claims 1 to 5,
The said optical member is comprised from several optical parts, and is a light-emitting device integrally formed in substantially elongate shape. 請求項１ないし請求項６のいずれか１項に記載の発光装置において、
前記波長変換部材は、複数の波長変換パーツから構成され、一体として略長尺状に形成される発光装置。 The light emitting device according to any one of claims 1 to 6,
The wavelength conversion member includes a plurality of wavelength conversion parts and is integrally formed in a substantially long shape.
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