JP2012009220A - Backlight device, liquid crystal display - Google Patents

Backlight device, liquid crystal display Download PDF

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JP2012009220A
JP2012009220A JP2010142851A JP2010142851A JP2012009220A JP 2012009220 A JP2012009220 A JP 2012009220A JP 2010142851 A JP2010142851 A JP 2010142851A JP 2010142851 A JP2010142851 A JP 2010142851A JP 2012009220 A JP2012009220 A JP 2012009220A
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led
connector member
liquid crystal
substrate
connector
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Koichiro Matsuhisa
浩一郎 松久
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Sharp Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a backlight device while capable of minimizing the connecting wire materials as few as possible which are arranged to a plurality of LED substrates corresponding to at least one edge of a liquid crystal panel, and also capable of preventing unevenness in brightness in a nearby region of the connecting portion of the LED substrate, and to provide a liquid crystal display having the same.SOLUTION: Two neighboring LED substrates 13, 14 are separated in a direction perpendicular to substrate surfaces of the LED substrates 13, 14, and connector connection terminals 23a, 23b are arranged to be overlapped in a direction perpendicular to the substrate surfaces of the LED substrates 13, 14. In such a state, by mounting a connector 23 on through-holes 24a, 24b of the connector connection terminals 23a, 23b in a direction parallel to transverse direction of the substrate surfaces of the LED substrates 13, 14, all the LEDs 13a to 13e, and 14a to 14e are arranged with evenly spaced intervals d1 over the two LED substrates 13, 14.

Description

本発明は，液晶パネルのエッジに配列されるＬＥＤ（発光ダイオード）により，該液晶パネルの背面に設けられた導光板を通じて液晶パネルを照明する所謂エッジ型ＬＥＤバックライト装置に関し，特に，そのバックライト装置で均一に液晶パネルを照明するための技術に関するものである。   The present invention relates to a so-called edge-type LED backlight device that illuminates a liquid crystal panel through a light guide plate provided on the back surface of the liquid crystal panel by LEDs (light emitting diodes) arranged on the edge of the liquid crystal panel, and more particularly to the backlight. The present invention relates to a technique for uniformly illuminating a liquid crystal panel with an apparatus.

従来から，液晶テレビジョン受像機や液晶ディスプレイなどの液晶表示装置の薄型化を実現するために，液晶パネルのエッジにＬＥＤ（発光ダイオード）を配置する所謂エッジ型ＬＥＤバックライト装置が知られている（例えば特許文献１参照）。
ここに，図５は，従来のエッジ型ＬＥＤバックライト装置の概略構成を示す模式図である。また，図５（ａ）は正面図，図５（ｂ）は側面図である。なお，図５〜図７では図示の簡略上，ＬＥＤ１０３の数を省略して記載しているが，実際には約１３ｍｍ程度の間隔で多数のＬＥＤ１０３が配置される。
図５に示すように，液晶パネル１０１の上下のエッジ部には，直列接続された複数のＬＥＤ１０３が等間隔で並設されたＬＥＤ基板１０４が設けられている。また，液晶パネル１０１の背後にはＬＥＤ１０３各々からの光を均一化して液晶パネル１０１に照射する導光板１０２が配置されている。ここで，ＬＥＤ基板１０４各々は，ＬＥＤ１０３の駆動を制御するＬＥＤ駆動回路１０６に合計２本のハーネス１０５で接続されており，当該バックライト装置では合計４本のハーネス１０５が必要である。 2. Description of the Related Art Conventionally, so-called edge type LED backlight devices in which LEDs (light emitting diodes) are arranged on the edge of a liquid crystal panel in order to realize thinning of a liquid crystal display device such as a liquid crystal television receiver or a liquid crystal display are known. (For example, refer to Patent Document 1).
FIG. 5 is a schematic diagram showing a schematic configuration of a conventional edge type LED backlight device. 5A is a front view and FIG. 5B is a side view. 5 to 7, the number of LEDs 103 is omitted for simplicity of illustration, but in practice, a large number of LEDs 103 are arranged at intervals of about 13 mm.
As shown in FIG. 5, LED substrates 104 in which a plurality of LEDs 103 connected in series are arranged in parallel at equal intervals are provided on the upper and lower edge portions of the liquid crystal panel 101. Further, behind the liquid crystal panel 101, a light guide plate 102 is disposed that irradiates the liquid crystal panel 101 with the light from each of the LEDs 103 uniform. Here, each LED board 104 is connected to the LED drive circuit 106 that controls the drive of the LED 103 by a total of two harnesses 105, and the backlight apparatus requires a total of four harnesses 105.

ところで，液晶パネル１０１のサイズが４０型などのように大きい場合には，その液晶パネル１０１のエッジに配置されるＬＥＤ基板１０４も長尺化することになり，その製造が困難になる。そこで，例えば図６に示すように，液晶パネル１０１のエッジごとに二つのＬＥＤ基板１０４を配置し，その４つのＬＥＤ基板１０４を合計６本のハーネス１０５を用いて駆動回路１０６に接続することが考えられる。
但し，近年では，液晶表示装置の薄型化により内部スペースが狭小化しつつあるため，バックライト装置内でハーネスを配線することのできるスペースも小さくなっている。そのため，液晶表示装置の組み立て時にハーネスの線噛みが生じるおそれがあり，また，線噛みを避けるために組み立ての作業性が低下することも問題である。 By the way, when the size of the liquid crystal panel 101 is large, such as a 40-inch type, the LED substrate 104 disposed on the edge of the liquid crystal panel 101 is also lengthened, and its manufacture becomes difficult. Therefore, for example, as shown in FIG. 6, two LED boards 104 are arranged for each edge of the liquid crystal panel 101, and the four LED boards 104 can be connected to the drive circuit 106 using a total of six harnesses 105. Conceivable.
However, in recent years, since the internal space is becoming narrower due to the thinning of the liquid crystal display device, the space in which the harness can be wired in the backlight device is also reduced. For this reason, there is a possibility that the wire biting of the harness may occur at the time of assembling the liquid crystal display device, and it is also a problem that the workability of the assembly is lowered in order to avoid the wire biting.

そこで，例えば図７に示すように，ＬＥＤ基板１０４各々の端部に接続端子２０１を搭載しておき，該ＬＥＤ基板１０４をＬＥＤ１０３の配列方向に並べた状態で，隣接する二つの接続端子２０１をコネクタ２０２によって線材を介することなく接続するボードｔｏボードの接続構造を採ることが考えられる。
これにより，図７に示すように，４つのＬＥＤ基板１０４を合計４本のハーネス１０５で駆動回路１０６に接続することができ，図６に示す構成に比べてハーネス１０５を２本省略することができるため，液晶表示装置内におけるハーネス１０５の線噛みのおそれを低減することや組み立て作業性の向上を図ることができる。 Therefore, for example, as shown in FIG. 7, the connection terminals 201 are mounted on the end portions of the LED boards 104, and the two adjacent connection terminals 201 are arranged in a state where the LED boards 104 are arranged in the arrangement direction of the LEDs 103. It is conceivable to adopt a board-to-board connection structure in which the connector 202 is connected without a wire rod.
As a result, as shown in FIG. 7, the four LED boards 104 can be connected to the drive circuit 106 by a total of four harnesses 105, and two harnesses 105 can be omitted as compared with the configuration shown in FIG. Therefore, it is possible to reduce the risk of the wire biting of the harness 105 in the liquid crystal display device and to improve the assembly workability.

特開２００４−７９４８８号公報JP 2004-79488 A

ところで，前述したようなエッジ型ＬＥＤバックライト装置では，液晶パネル１０１上の明るさのムラを防止するべくＬＥＤ１０３各々を等間隔で配列することが重要である。
一方，エッジ型ＬＥＤバックライト装置では，液晶パネルの背面にＬＥＤを配置する所謂直下型ＬＥＤバックライト装置に比べてＬＥＤの配列間隔を狭くする必要がある（例えば１３ｍｍ程度）。
そのため，図７に示したように，接続端子２０１各々をＬＥＤ１０３の配列方向に並べてコネクタ２０２を装着する構成では，隣接する二つのＬＥＤ基板１０４の端部に設けられたＬＥＤ１０３間のピッチｄ１２を，他のＬＥＤ１０３のピッチｄ１１と同じにすることができず，該ＬＥＤ基板１０４の接続部分近傍の領域Ｒで明るさにムラが生じるという問題が生じる。
従って，本発明は上記事情に鑑みてなされたものであり，その目的とするところは，液晶パネルの少なくとも一つのエッジに対応して配置される複数のＬＥＤ基板の接続線材をできるだけ少なくすると共に，該ＬＥＤ基板の接続部分近傍の領域における明るさのムラを防止することのできるバックライト装置及びこれを備えた液晶表示装置を提供することにある。 By the way, in the edge type LED backlight device as described above, it is important to arrange the LEDs 103 at equal intervals in order to prevent uneven brightness on the liquid crystal panel 101.
On the other hand, in the edge type LED backlight device, it is necessary to make the LED arrangement interval narrower (for example, about 13 mm) than the so-called direct type LED backlight device in which the LEDs are arranged on the back surface of the liquid crystal panel.
Therefore, as shown in FIG. 7, in the configuration in which the connection terminals 201 are arranged in the arrangement direction of the LEDs 103 and the connector 202 is mounted, the pitch d12 between the LEDs 103 provided at the ends of the two adjacent LED substrates 104 is The pitch d11 of the other LEDs 103 cannot be made the same, and there arises a problem that unevenness occurs in the brightness in the region R in the vicinity of the connection portion of the LED substrate 104.
Accordingly, the present invention has been made in view of the above circumstances, and its object is to reduce the number of connecting wires of a plurality of LED substrates arranged corresponding to at least one edge of a liquid crystal panel as much as possible, An object of the present invention is to provide a backlight device capable of preventing unevenness of brightness in a region near the connection portion of the LED substrate and a liquid crystal display device including the backlight device.

上記目的を達成するために本発明は，液晶パネルの少なくとも一つのエッジに対応して配置され，前記液晶パネルの背面に設けられた導光板を通じて該液晶パネルを照明する複数のＬＥＤを備えてなるバックライト装置に適用されるものであって，前記エッジごとに対応して設けられ，直列接続されると共に等間隔で並設された複数のＬＥＤが基板表面に搭載された複数のＬＥＤ基板と，前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板のうち一方のＬＥＤ基板の基板表面に搭載され，該ＬＥＤ基板に搭載された前記ＬＥＤのアノード側に接続された第１のコネクタ部材と，前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板のうち他方のＬＥＤ基板の基板表面に搭載され，該ＬＥＤ基板に搭載された前記ＬＥＤのカソード側に接続された第２のコネクタ部材と，前記第１のコネクタ部材及び前記第２のコネクタ部材を線材を介することなく接続するための第３のコネクタ部材とを備えている。また，前記第１のコネクタ部材及び前記第２のコネクタ部材各々に，前記ＬＥＤ基板の基板表面の短手方向と平行な方向から前記第３のコネクタ部材を装着するための装着部が設けられている。さらに，前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板が，該ＬＥＤ基板の基板表面と垂直な方向に離間し，且つ前記第１のコネクタ部材及び前記第２のコネクタ部材が前記ＬＥＤ基板の基板表面に垂直な方向に重なるように配置された状態で，前記ＬＥＤ基板の基板表面の短手方向と平行な方向から前記第３のコネクタ部材が前記第１のコネクタ部材及び前記第２のコネクタ部材の装着部に装着されることにより，該二つの前記ＬＥＤ基板に亘って前記ＬＥＤが等間隔で配置される。
本発明によれば，前記液晶パネルの少なくとも一つのエッジに対応して配置される複数の前記ＬＥＤ基板を前記第３のコネクタ部材で接続することにより，該ＬＥＤ基板の接続線材をできるだけ少なくすることができ，線噛みのおそれを低減することや組み立て作業性の向上を図ることができる。また，隣接する前記ＬＥＤ基板の端部に配置された前記ＬＥＤの間隔を，他の前記ＬＥＤと同様の間隔で配置することが可能となるため，該ＬＥＤ基板の接続部分近傍の領域における明るさのムラを防止することができる。
ここに，前記第１のコネクタ部材及び前記第２のコネクタ部材各々の前記装着部が，前記ＬＥＤ基板の基板表面の短手方向に貫通し，内周面に前記ＬＥＤに接続された導通部材が設けられた貫通孔であり，前記第３のコネクタ部材が，前記第１のコネクタ部材及び前記第２のコネクタ部材各々の前記貫通孔に嵌挿されることにより前記第１のコネクタ部材及び前記第２のコネクタ部材の前記導通部材を接続する二つの突出端子を備えてなるものであることが考えられる。これにより，前記第３のコネクタ部材を前記第１のコネクタ部材及び前記第２のコネクタ部材に対して，前記貫通孔のいずれの方向からでも装着することができる。また，前記ＬＥＤ基板の基板表面のパターン（回路）を変更すれば，該ＬＥＤ基板に用いる基板は共通のものとすることができる。
なお，大型の前記液晶パネルに用いられる場合には，前記液晶パネルの少なくとも対向する二つのエッジに複数の前記ＬＥＤ基板が設けることで，該液晶パネルを十分な明るさで照明することができる。
前記第１のコネクタ部材及び前記第２のコネクタ部材各々は前記ＬＥＤ基板各々の端部に設けられることが考えられる。この場合，隣接する二つの前記ＬＥＤ基板の重なる領域を最も小さくすることができ，該ＬＥＤ基板のサイズを最も小さくすることができる。
また，この場合，前記第３のコネクタ部材の一部又は全部が高反射材で形成されたものであることが望ましい。これにより，前記第３のコネクタ部材による光量の低下を防止し，前記液晶パネルにおける明るさのムラを防止することができる。
ところで，本発明は，前記バックライト装置と前記液晶パネルと前記導光板とを備えてなる液晶表示装置の発明としても捉えることができる。
ここで，前記導光板は，前記ＬＥＤ基板各々が該ＬＥＤ基板の基板表面と垂直な方向に離間して配置されることにより生じる段差に沿って，該導光板の入射面と前記ＬＥＤ各々との間隔が一定となるように形成された段差形状を有するものであることが望ましい。 In order to achieve the above object, the present invention comprises a plurality of LEDs arranged corresponding to at least one edge of a liquid crystal panel and illuminating the liquid crystal panel through a light guide plate provided on the back surface of the liquid crystal panel. A plurality of LED boards, each of which is applied to a backlight device, and is provided corresponding to each edge, connected in series and arranged in parallel at equal intervals; A first connector member mounted on the surface of one of the two LED substrates adjacent to each other and connected to the anode side of the LED mounted on the LED substrate, and each edge The two LED substrates adjacent to each other are mounted on the surface of the other LED substrate and contact the cathode side of the LED mounted on the LED substrate. And a third connector member for connecting without through the second connector member is a wire the first connector member and said second connector member. Each of the first connector member and the second connector member is provided with a mounting portion for mounting the third connector member from a direction parallel to the lateral direction of the substrate surface of the LED substrate. Yes. Further, the two LED boards adjacent at each edge are separated in a direction perpendicular to the substrate surface of the LED substrate, and the first connector member and the second connector member are the substrate surface of the LED substrate. The third connector member is disposed between the first connector member and the second connector member from a direction parallel to a short side direction of the substrate surface of the LED substrate in a state of being arranged so as to overlap in a direction perpendicular to the first substrate member. By being mounted on the mounting portion, the LEDs are arranged at equal intervals across the two LED substrates.
According to the present invention, by connecting the plurality of LED boards arranged corresponding to at least one edge of the liquid crystal panel with the third connector member, the number of connecting wires of the LED boards can be reduced as much as possible. It is possible to reduce the risk of wire biting and to improve the assembly workability. In addition, since it becomes possible to arrange the intervals of the LEDs arranged at the end portions of the adjacent LED substrates at the same intervals as the other LEDs, the brightness in the region near the connection portion of the LED substrate Can be prevented.
Here, the mounting portion of each of the first connector member and the second connector member penetrates in the lateral direction of the substrate surface of the LED substrate, and a conductive member connected to the LED on the inner peripheral surface The first connector member and the second connector member are inserted into the through holes of the first connector member and the second connector member, respectively. It is conceivable that the connector member is provided with two protruding terminals that connect the conducting member. Accordingly, the third connector member can be attached to the first connector member and the second connector member from any direction of the through hole. Further, if the pattern (circuit) on the surface of the LED substrate is changed, the substrate used for the LED substrate can be made common.
When used in a large liquid crystal panel, the liquid crystal panel can be illuminated with sufficient brightness by providing a plurality of LED substrates on at least two opposing edges of the liquid crystal panel.
It is conceivable that the first connector member and the second connector member are provided at end portions of the LED boards. In this case, the area where the two adjacent LED substrates overlap can be minimized, and the size of the LED substrate can be minimized.
In this case, it is desirable that a part or all of the third connector member is formed of a highly reflective material. Accordingly, it is possible to prevent a decrease in the amount of light due to the third connector member and to prevent unevenness in brightness in the liquid crystal panel.
By the way, the present invention can also be understood as an invention of a liquid crystal display device including the backlight device, the liquid crystal panel, and the light guide plate.
Here, the light guide plate is formed between a light incident surface of the light guide plate and each of the LEDs along a step formed by the LED substrates being spaced apart in a direction perpendicular to the substrate surface of the LED substrate. It is desirable to have a step shape formed so that the interval is constant.

本発明によれば，前記液晶パネルの少なくとも一つのエッジに対応して配置される複数の前記ＬＥＤ基板を前記第３のコネクタ部材で接続することにより，該ＬＥＤ基板の接続線材をできるだけ少なくすることができ，線噛みのおそれを低減することや組み立て作業性の向上を図ることができる。また，隣接する前記ＬＥＤ基板の端部に配置された前記ＬＥＤの間隔を，他の前記ＬＥＤと同様の間隔で配置することが可能となるため，該ＬＥＤ基板の接続部分近傍の領域における明るさのムラを防止することができる。   According to the present invention, by connecting the plurality of LED boards arranged corresponding to at least one edge of the liquid crystal panel with the third connector member, the number of connecting wires of the LED boards can be reduced as much as possible. It is possible to reduce the risk of wire biting and to improve the assembly workability. In addition, since it becomes possible to arrange the intervals of the LEDs arranged at the end portions of the adjacent LED substrates at the same intervals as the other LEDs, the brightness in the region near the connection portion of the LED substrate Can be prevented.

本発明の実施の形態に係る液晶表示装置の概略構成を示す要部模式図。FIG. 2 is a schematic diagram illustrating a main part of a schematic configuration of a liquid crystal display device according to an embodiment of the present invention. 本発明の実施の形態に係る液晶表示装置におけるＬＥＤ基板の接続構造の一例を説明するための要部模式図。The principal part schematic diagram for demonstrating an example of the connection structure of the LED board in the liquid crystal display device which concerns on embodiment of this invention. 本発明の実施の形態に係る液晶表示装置におけるＬＥＤ基板の接続構造の他の例を説明するための要部模式図。The principal part schematic diagram for demonstrating the other example of the connection structure of the LED board in the liquid crystal display device which concerns on embodiment of this invention. 本発明の実施の形態に係る液晶表示装置におけるＬＥＤ基板の接続構造の他の例を説明するための要部模式図。The principal part schematic diagram for demonstrating the other example of the connection structure of the LED board in the liquid crystal display device which concerns on embodiment of this invention. 従来の液晶表示装置におけるＬＥＤ基板の接続構造を説明するための要部模式図。The principal part schematic diagram for demonstrating the connection structure of the LED board in the conventional liquid crystal display device. 従来の液晶表示装置におけるＬＥＤ基板の接続構造を説明するための要部模式図。The principal part schematic diagram for demonstrating the connection structure of the LED board in the conventional liquid crystal display device. 従来の液晶表示装置におけるＬＥＤ基板の接続構造を説明するための要部模式図。The principal part schematic diagram for demonstrating the connection structure of the LED board in the conventional liquid crystal display device.

以下添付図面を参照しながら，本発明の実施の形態について説明し，本発明の理解に供する。尚，以下の実施の形態は，本発明を具体化した一例であって，本発明の技術的範囲を限定する性格のものではない。
ここに，図１は，本発明の実施の形態に係る液晶表示装置Ｘの概略構成を示す要部模式図であって，（ａ）は正面図，（ｂ）は側面図，（ｃ）は回路図を示している。
図１（ａ），（ｂ）に示すように，本発明の実施の形態に係る液晶表示装置Ｘは，映像が表示される液晶パネル１と，前記液晶パネル１を背後から照明するためのバックライト装置２と，前記液晶パネル１の背面に配置された導光板３とを備えてなる液晶テレビジョン受像機や液晶ディスプレイである。前記液晶パネル１は，例えば４０型以上の大型のパネルである。
前記バックライト装置２は，前記液晶パネル１の少なくとも一つのエッジに対応して配置され，前記液晶パネル１の背面に設けられた前記導光板３を通じて該液晶パネル１を照明する複数のＬＥＤ（発光ダイオード）を備える所謂エッジ型ＬＥＤバックライト装置である。本実施の形態では，前記液晶パネル１における対向する上下二つののエッジにＬＥＤが配置される構成を例に挙げて説明する。
なお，前記液晶表示装置Ｘは，一般的な液晶テレビジョン受像機や液晶ディスプレイなどの液晶表示装置が有する他の構成要素も有しているが，その点については従来と同様であるため，ここではその説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings so that the present invention can be understood. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
Here, FIG. 1 is a schematic diagram of a main part showing a schematic configuration of a liquid crystal display device X according to an embodiment of the present invention, where (a) is a front view, (b) is a side view, and (c) is a side view. A circuit diagram is shown.
As shown in FIGS. 1A and 1B, a liquid crystal display device X according to an embodiment of the present invention includes a liquid crystal panel 1 on which an image is displayed, and a back for illuminating the liquid crystal panel 1 from behind. A liquid crystal television receiver or a liquid crystal display including a light device 2 and a light guide plate 3 disposed on the back surface of the liquid crystal panel 1. The liquid crystal panel 1 is a large panel of, for example, 40 type or more.
The backlight device 2 is arranged corresponding to at least one edge of the liquid crystal panel 1, and a plurality of LEDs (light emitting devices) that illuminate the liquid crystal panel 1 through the light guide plate 3 provided on the back surface of the liquid crystal panel 1. This is a so-called edge-type LED backlight device including a diode. In the present embodiment, a configuration in which LEDs are arranged on two opposite upper and lower edges of the liquid crystal panel 1 will be described as an example.
The liquid crystal display device X also has other constituent elements of a liquid crystal display device such as a general liquid crystal television receiver or a liquid crystal display. Then, the explanation is omitted.

前記バックライト装置２は，前記液晶パネル１の上辺のエッジに対応して配置された二つのＬＥＤ基板１１，１２と，該上辺に対向する下辺のエッジに対応して配置された二つのＬＥＤ基板１３，１４と，前記ＬＥＤ基板１１〜１４各々に搭載されたＬＥＤの駆動を制御する駆動回路４と，前記ＬＥＤ基板１１〜１４及び前記駆動回路４を接続するハーネス５１〜５４とを備えている。
なお，本実施の形態では，前記液晶パネル１の対向する上下の二つのエッジ各々に複数の前記ＬＥＤ基板１１，１２と複数の前記ＬＥＤ基板１３，１４とが設けられている場合を例に挙げて説明するがこれに限らない。例えば，エッジごとに対応して三つ以上のＬＥＤ基板が配置されることが考えられ，この場合には該エッジにおいて隣接する二つのＬＥＤ基板各々が後述の前記ＬＥＤ基板１３，１４のような関係となるように構成されていればよい。また，前記液晶パネル１の一つのエッジのみにＬＥＤ基板が設けられることや，前記液晶パネル１の上下左右のエッジ全てに複数のＬＥＤ基板が設けられることも考えられる。 The backlight device 2 includes two LED boards 11 and 12 arranged corresponding to the upper edge of the liquid crystal panel 1 and two LED boards arranged corresponding to the lower edge facing the upper edge. 13, 14, a drive circuit 4 that controls driving of the LEDs mounted on each of the LED boards 11 to 14, and harnesses 51 to 54 that connect the LED boards 11 to 14 and the drive circuit 4. .
In the present embodiment, a case where a plurality of the LED substrates 11 and 12 and a plurality of the LED substrates 13 and 14 are provided on each of two opposing upper and lower edges of the liquid crystal panel 1 is taken as an example. However, this is not a limitation. For example, it is conceivable that three or more LED substrates are arranged corresponding to each edge. In this case, two LED substrates adjacent to each other in the edge are related to each other as in the LED substrates 13 and 14 described later. What is necessary is just to be comprised so that it may become. It is also conceivable that an LED substrate is provided only on one edge of the liquid crystal panel 1, or that a plurality of LED substrates are provided on all the upper, lower, left and right edges of the liquid crystal panel 1.

ここに，前記ＬＥＤ基板１１〜１４各々は，放熱性能を確保するべく熱伝導率の高い金属製の基板であり，基板表面から裏面に貫通するスルーホールを形成することができないため，電気回路を形成するためのパターンは基板表面のみに形成されている。
そのため，前記ＬＥＤ基板１１〜１４では，直列接続されたＬＥＤ１１ａ〜１１ｅ，ＬＥＤ１２ａ〜１２ｅ，ＬＥＤ１３ａ〜１３ｅ，ＬＥＤ１４ａ〜１４ｅが基板表面に搭載されている。前記ＬＥＤ基板１１〜１４各々において，ＬＥＤ１１ａ〜１１ｅ，ＬＥＤ１２ａ〜１２ｅ，ＬＥＤ１３ａ〜１３ｅ，ＬＥＤ１４ａ〜１４ｅは，間隔ｄ１で等間隔に並設されている。なお，図示の簡略上，前記ＬＥＤ基板１１〜１４に搭載されるＬＥＤの数を省略して記載しているが，実際には，例えば約１３ｍｍ程度の間隔でＬＥＤが配置される。 Here, each of the LED substrates 11 to 14 is a metal substrate having a high thermal conductivity so as to ensure heat dissipation performance, and a through-hole penetrating from the substrate surface to the back surface cannot be formed. The pattern to be formed is formed only on the substrate surface.
Therefore, in the LED boards 11 to 14, the LEDs 11a to 11e, LEDs 12a to 12e, LEDs 13a to 13e, and LEDs 14a to 14e connected in series are mounted on the board surface. In each of the LED substrates 11 to 14, the LEDs 11a to 11e, the LEDs 12a to 12e, the LEDs 13a to 13e, and the LEDs 14a to 14e are arranged in parallel at an interval d1. For simplicity of illustration, the number of LEDs mounted on the LED boards 11 to 14 is omitted, but actually, the LEDs are arranged at intervals of about 13 mm, for example.

そして，図１（ａ），（ｂ）に示すように，前記バックライト装置２において，隣接する二つの前記ＬＥＤ基板１１と前記ＬＥＤ基板１２，隣接する二つの前記ＬＥＤ基板１３と前記ＬＥＤ基板１４は，それぞれＢｔｏＢ（board to board）タイプのコネクタ２２，２３（第３のコネクタ部材の一例）で接続されている。
具体的に，図１（ｃ）に示すように，前記ＬＥＤ基板１２のＬＥＤ１２ｅのカソード端子と前記ＬＥＤ基板１１のＬＥＤ１１ｅのアノード端子とが前記コネクタ２２で接続され，前記ＬＥＤ１１ａ〜１１ｅ及び前記ＬＥＤ１２ａ〜１２ｅの全てのＬＥＤが直列接続されることとなる。また，前記ＬＥＤ基板１４のＬＥＤ１４ｅのカソード端子と前記ＬＥＤ基板１３のＬＥＤ１３ｅのアノード端子とが前記コネクタ２３で接続され，前記ＬＥＤ１３ａ〜１３ｅ及び前記ＬＥＤ１４ａ〜１４ｅの全てのＬＥＤが直列接続されることとなる。
一方，前記ＬＥＤ１２ａのアノード端子は前記ハーネス５２により前記駆動回路４に接続され，前記ＬＥＤ１１ａのカソード端子は前記ハーネス５１により前記駆動回路４に接続される。また，前記ＬＥＤ１４ａのアノード端子は前記ハーネス５３により前記駆動回路４に接続され，前記ＬＥＤ１３ａのカソード端子は前記ハーネス５４により前記駆動回路４に接続される。
このように，前記バックライト装置２では，前記ＬＥＤ基板１１と前記ＬＥＤ基板１２，前記ＬＥＤ基板１３と前記ＬＥＤ基板１４を，それぞれ前記コネクタ２２，２３を用いて接続しているため，前記ＬＥＤ基板１１〜１４及び前記駆動回路４を接続するための線材は，合計４本の前記ハーネス５１〜５４となる。したがって，前述した従来構成（図６参照）に比べて線材を省略することができ，線噛みのおそれを低減することや組み立て作業性の向上を図ることができる。 As shown in FIGS. 1A and 1B, in the backlight device 2, the two adjacent LED boards 11 and 12 and the two adjacent LED boards 13 and 14 are connected. Are connected by BtoB (board to board) type connectors 22 and 23 (an example of a third connector member), respectively.
Specifically, as shown in FIG. 1C, the cathode terminal of the LED 12e of the LED board 12 and the anode terminal of the LED 11e of the LED board 11 are connected by the connector 22, and the LEDs 11a to 11e and the LEDs 12a to 12a are connected. All the LEDs of 12e are connected in series. Further, the cathode terminal of the LED 14e of the LED board 14 and the anode terminal of the LED 13e of the LED board 13 are connected by the connector 23, and all the LEDs 13a to 13e and the LEDs 14a to 14e are connected in series. Become.
On the other hand, the anode terminal of the LED 12 a is connected to the drive circuit 4 by the harness 52, and the cathode terminal of the LED 11 a is connected to the drive circuit 4 by the harness 51. The anode terminal of the LED 14 a is connected to the drive circuit 4 by the harness 53, and the cathode terminal of the LED 13 a is connected to the drive circuit 4 by the harness 54.
Thus, in the backlight device 2, the LED board 11 and the LED board 12, and the LED board 13 and the LED board 14 are connected using the connectors 22 and 23, respectively. Wires for connecting 11 to 14 and the drive circuit 4 are the four harnesses 51 to 54 in total. Therefore, the wire can be omitted as compared with the above-described conventional configuration (see FIG. 6), and the risk of wire biting can be reduced and assembly workability can be improved.

続いて，図２を参照しつつ，前記バックライト装置２において前記ＬＥＤ基板１３と前記ＬＥＤ基板１４とを前記コネクタ２３を用いて接続するための接続構造について説明する。なお，前記ＬＥＤ基板１１と前記ＬＥＤ基板１２とを前記コネクタ２２を用いて接続する接続構造も同様であるため，その説明は省略する。
ここに，図２（ａ）は，前記ＬＥＤ基板１３と前記ＬＥＤ基板１４との接続構造を説明するための要部模式図であって，図２（ｂ），（ｃ）は，図２（ａ）におけるＡ−Ａ矢視図を示す要部模式図である。
図２（ａ）に示すように，前記ＬＥＤ基板１３の基板表面には，前記ＬＥＤ１３ｅよりも外側の端部に，該ＬＥＤ１３ｅのアノード側に接続されたコネクタ接続端子２３ａ（第１のコネクタ部材の一例）が搭載されている。一方，前記ＬＥＤ基板１４の基板表面には，前記ＬＥＤ１４ｅよりも外側の端部に，該ＬＥＤ１４ｅのカソード側に接続されたコネクタ接続端子２３ｂ（第２のコネクタ部材の一例）が搭載されている。ここで，前記コネクタ接続端子２３ａ，２３ｂ各々は，前記ＬＥＤ１３ｅ，１４ｅ各々から前記間隔ｄ１の範囲内に配置されている。 Next, a connection structure for connecting the LED board 13 and the LED board 14 using the connector 23 in the backlight device 2 will be described with reference to FIG. In addition, since the connection structure which connects the said LED board 11 and the said LED board 12 using the said connector 22 is also the same, the description is abbreviate | omitted.
Here, FIG. 2A is a schematic diagram of a main part for explaining a connection structure between the LED substrate 13 and the LED substrate 14, and FIGS. 2B and 2C are FIGS. It is a principal part schematic diagram which shows the AA arrow line view in a).
As shown in FIG. 2 (a), on the substrate surface of the LED substrate 13, a connector connection terminal 23a (the first connector member of the first connector member) connected to the anode side of the LED 13e at the end portion outside the LED 13e. An example) is installed. On the other hand, a connector connection terminal 23b (an example of a second connector member) connected to the cathode side of the LED 14e is mounted on the outer surface of the LED 14e on the substrate surface of the LED board 14. Here, each of the connector connecting terminals 23a and 23b is disposed within the distance d1 from each of the LEDs 13e and 14e.

また，図２（ｂ）に示すように，前記コネクタ接続端子２３ａ，２３ｂ各々には，前記ＬＥＤ基板１３，１４の基板表面の短手方向と平行な方向から前記コネクタ２３を接続するため，前記ＬＥＤ基板１３，１４の短手方向に貫通する貫通孔２４ａ，２４ｂ（装着部の一例）が形成されている。前記貫通孔２４ａ，２４ｂには，その内周面に，前記ＬＥＤ１３ｅ，１４ｅに接続された銅メッキ等（導通部材の一例）が設けられている。
一方，図２（ｂ）に示すように，前記コネクタ２３には，前記コネクタ接続端子２３ａ及び前記コネクタ接続端子２３ｂ各々の前記貫通孔２４ａ，２４ｂに嵌挿されることにより前記コネクタ接続端子２３ａ，２３ｂ各々の前記貫通孔２４ａ，２４ｂ内の銅メッキ等の導通部材を接続する二つの突出端子２５ａ，２５ｂが設けられている。前記突出端子２５ａ，２５ｂは，前記コネクタ２３の内部で導通している。したがって，前記コネクタ２３は，前記コネクタ接続端子２３ａ，２３ｂを線材を介することなく接続する。 Further, as shown in FIG. 2B, the connector 23 is connected to the connector connection terminals 23a and 23b from the direction parallel to the short direction of the substrate surfaces of the LED boards 13 and 14, respectively. Through holes 24a and 24b (an example of a mounting portion) penetrating in the short direction of the LED substrates 13 and 14 are formed. The through holes 24a and 24b are provided with copper plating or the like (an example of a conductive member) connected to the LEDs 13e and 14e on the inner peripheral surfaces thereof.
On the other hand, as shown in FIG. 2 (b), the connector 23 is inserted into the through holes 24a and 24b of the connector connection terminal 23a and the connector connection terminal 23b, thereby connecting the connector connection terminals 23a and 23b. Two protruding terminals 25a and 25b for connecting conductive members such as copper plating in the through holes 24a and 24b are provided. The protruding terminals 25 a and 25 b are electrically connected inside the connector 23. Therefore, the connector 23 connects the connector connection terminals 23a and 23b without a wire rod.

このように構成された前記バックライト装置２では，図２（ａ），（ｂ）に示すように，前記ＬＥＤ基板１３，１４が，該ＬＥＤ基板１３，１４の基板表面と垂直な方向（図２（ａ）における上下方向）に離間し，且つ前記コネクタ接続端子２３ａ及び前記コネクタ接続端子２３ｂが前記ＬＥＤ基板１３，１４の基板表面に垂直な方向に重なるように配置される。そして，この状態で，前記ＬＥＤ基板１３，１４の基板表面の短手方向と平行な方向から前記コネクタ２３の前記突出端子２５ａ，２５ｂが前記コネクタ接続端子２３ａ，２３ｂの前記貫通孔２４ａ，２４ｂに嵌挿されて装着されることにより，隣接する二つの前記ＬＥＤ基板１３，１４に亘る全てのＬＥＤ１３ａ〜１３ｅ，１４ａ〜１４ｅが，間隔ｄ１で等間隔に配置される。したがって，前記バックライト装置２では，前記ＬＥＤ基板１３，１４の接続部分近傍の領域における明るさのムラを防止することができる。
なお，前記バックライト装置２では，前記コネクタ接続端子２３ａ，２３ｂ各々が，前記ＬＥＤ基板１３，１４各々の端部に設けられており，該ＬＥＤ基板１３，１４が重なる領域が小さいため，該ＬＥＤ基板１３，１４のサイズを小さくすることができる。 In the backlight device 2 configured as described above, as shown in FIGS. 2A and 2B, the LED substrates 13 and 14 are oriented in a direction perpendicular to the substrate surface of the LED substrates 13 and 14 (see FIG. 2 (a) in the vertical direction), and the connector connection terminals 23a and 23b are arranged so as to overlap in a direction perpendicular to the substrate surfaces of the LED substrates 13 and 14. In this state, the projecting terminals 25a and 25b of the connector 23 enter the through holes 24a and 24b of the connector connection terminals 23a and 23b from a direction parallel to the short direction of the substrate surfaces of the LED boards 13 and 14, respectively. By being inserted and mounted, all the LEDs 13a to 13e and 14a to 14e across the two adjacent LED boards 13 and 14 are arranged at equal intervals with the interval d1. Therefore, in the backlight device 2, it is possible to prevent uneven brightness in a region near the connection portion of the LED substrates 13 and 14.
In the backlight device 2, the connector connection terminals 23 a and 23 b are provided at the end portions of the LED boards 13 and 14, respectively, and the area where the LED boards 13 and 14 overlap is small. The size of the substrates 13 and 14 can be reduced.

ところで，前記バックライト装置２では，前記ＬＥＤ基板１１と前記ＬＥＤ基板１２，前記ＬＥＤ基板１３と前記ＬＥＤ基板１４のそれぞれが基板表面と垂直な方向に離間して配置されるため，それぞれの間に段差が生じる。
そのため，前記導光板３は，前記ＬＥＤ基板１１と前記ＬＥＤ基板１２，前記ＬＥＤ基板１３と前記ＬＥＤ基板１４のそれぞれの間に生じる段差に沿って，該導光板３の入射面と前記ＬＥＤ基板１１〜１４各々に搭載されたＬＥＤ各々との間隔が一定となるように形成された段差形状を有している。
これにより，前記導光板３では，前記ＬＥＤ基板１１〜１４各々のＬＥＤから照射された光が均一化されて前記液晶パネル１に照射される。 By the way, in the backlight device 2, the LED substrate 11 and the LED substrate 12, and the LED substrate 13 and the LED substrate 14 are arranged apart from each other in the direction perpendicular to the substrate surface. A step occurs.
Therefore, the light guide plate 3 includes the light incident surface of the light guide plate 3 and the LED substrate 11 along the steps formed between the LED substrate 11 and the LED substrate 12, and the LED substrate 13 and the LED substrate 14, respectively. -14 each have a step shape formed so that the distance between each of the LEDs mounted on each of them is constant.
Thereby, in the said light-guide plate 3, the light irradiated from each LED of the said LED board 11-14 is equalized, and the said liquid crystal panel 1 is irradiated.

また，前記コネクタ接続端子２３ａ，２３ｂの前記貫通孔２４ａ，２４ｂは，前記ＬＥＤ基板１３，１４の短手方向に貫通しているため，図２（ｂ），（ｃ）に示すように，前記貫通孔２４ａ，２４ｂの左右いずれの方向からでも前記コネクタ２３を装着することができる。但し，前記液晶パネル１と前記導光板３との間には各種の光学フィルムなどを配置するための間隙が必要となるため，その間隙を利用して，図１（ｂ）に示すように前記液晶パネル１側から前記コネクタ２２，２３を装着し，前記バックライト装置２の前記液晶パネル１とは反対側への突出を避けて薄型化を図ることが望ましい。
さらに，前記貫通孔２４ａ，２４ｂの左右いずれの方向からでも前記コネクタ２３を装着することができる構成では，前記ＬＥＤ基板１１〜１４各々の基板表面のパターン（回路）を変更してＬＥＤの接続方向を変えれば，該ＬＥＤ基板１１〜１４各々に共通の基板を用いることも可能である。 Further, since the through holes 24a and 24b of the connector connecting terminals 23a and 23b penetrate in the short direction of the LED boards 13 and 14, as shown in FIGS. The connector 23 can be mounted from either the left or right direction of the through holes 24a, 24b. However, since a gap is required between the liquid crystal panel 1 and the light guide plate 3 for arranging various optical films and the like, the gap is used as shown in FIG. It is desirable to mount the connectors 22 and 23 from the side of the liquid crystal panel 1 and reduce the thickness by avoiding the projection of the backlight device 2 to the opposite side of the liquid crystal panel 1.
Further, in the configuration in which the connector 23 can be mounted from either the left or right direction of the through holes 24a and 24b, the pattern (circuit) on the substrate surface of each of the LED substrates 11 to 14 is changed to change the LED connection direction. In other words, a common substrate can be used for each of the LED substrates 11 to 14.

本実施例１では，図３を参照しつつ，前記コネクタ２３の変形例について説明する。
ここに，図３（ａ），（ｂ）は前記コネクタ２３の変形例であるコネクタ２３１を示す図，図３（ｃ），（ｄ）は前記コネクタ２３の変形例であるコネクタ２３２を示す図であって，図３（ａ），（ｃ）は，図２（ｂ）と同方向から見た図である。また，図３（ｂ）は図３（ａ）を上方から見た図であり，図３（ｄ）は図３（ｃ）のＢ−Ｂ矢視図である。
まず，図３（ａ），（ｂ）に示すように，前記コネクタ２３１は，前記コネクタ接続端子２３ａ，２３ｂに装着されたときに，該コネクタ接続端子２３ａ，２３ｂの前記ＬＥＤ１４ｅ側の面（図１における右方向）を覆う反射面２６を有するＬ字状に形成されたものである。前記反射面２６は，高反射材（アルミや銀など）で形成された面，或いは高反射材のメッキが施された面などである。そのため，前記コネクタ２３１が前記コネクタ接続端子２３ａ，２３ｂに装着されると，前記ＬＥＤ基板１４の端部に配置されたＬＥＤ１４ｅから照射された光が前記反射面２６に反射して，前記導光板３に入射される。なお，前記反射面２６のみでなく前記コネクタ２３１全体が高反射率を有するものであってもよい。
したがって，前記コネクタ２３１を用いれば，前記ＬＥＤ１４ｅから，前記コネクタ接続端子２３ａ，２３ｂや前記ＬＥＤ基板１３，前記ＬＥＤ基板１３及び前記ＬＥＤ基板１４の隙間などに向けて本来照射される光を無駄にすることなく，前記反射面２６で反射させて前記導光板３に入射させることができるため，該コネクタ２３１による光量の低下を防止し，前記液晶パネル１における明るさのムラを防止することができる。 In the first embodiment, a modified example of the connector 23 will be described with reference to FIG.
3A and 3B are views showing a connector 231 which is a modified example of the connector 23, and FIGS. 3C and 3D are views showing a connector 232 which is a modified example of the connector 23. FIG. 3 (a) and 3 (c) are views seen from the same direction as FIG. 2 (b). 3 (b) is a view of FIG. 3 (a) as viewed from above, and FIG. 3 (d) is a view taken along arrow BB in FIG. 3 (c).
First, as shown in FIGS. 3A and 3B, when the connector 231 is attached to the connector connection terminals 23a and 23b, the surface of the connector connection terminals 23a and 23b on the LED 14e side (see FIG. 3). 1 is formed in an L shape having a reflection surface 26 that covers the right direction in FIG. The reflective surface 26 is a surface formed of a highly reflective material (such as aluminum or silver), or a surface plated with a highly reflective material. Therefore, when the connector 231 is attached to the connector connection terminals 23a and 23b, the light emitted from the LED 14e disposed at the end of the LED substrate 14 is reflected on the reflecting surface 26, and the light guide plate 3 Is incident on. Note that not only the reflection surface 26 but also the entire connector 231 may have a high reflectance.
Therefore, if the connector 231 is used, the light originally emitted from the LED 14e toward the connector connection terminals 23a and 23b, the LED board 13, the LED board 13, and the gap between the LED board 14 and the like is wasted. Without being reflected, the light can be reflected by the reflecting surface 26 and can be incident on the light guide plate 3, so that a decrease in the amount of light by the connector 231 can be prevented, and uneven brightness in the liquid crystal panel 1 can be prevented.

また，図３（ｃ），（ｄ）に示すように，前記コネクタ２３２には，前記コネクタ接続端子２３ａ，２３ｂに接続されたときに，前記ＬＥＤ基板１３と前記ＬＥＤ基板１４との隙間を埋めるべく一部に突出面２７が形成されている。前記突出面２７の表面は，高反射材（アルミや銀など）で形成された面，或いは高反射材のメッキが施された面などである。そのため，前記コネクタ２３２が前記コネクタ接続端子２３ａ，２３ｂに装着されると，前記ＬＥＤ基板１４の端部に配置されたＬＥＤ１４ｅから照射された光が前記突出面２７で反射して，前記導光板３に入射される。
したがって，前記コネクタ２３２を用いれば，前記ＬＥＤ１４ｅから，前記ＬＥＤ基板１３及び前記ＬＥＤ基板１４の隙間に向けて本来照射される光を無駄にすることなく，前記突出面２７で反射させて前記導光板３に入射させることができるため，該コネクタ２３２による光量の低下を防止し，前記液晶パネル１における明るさのムラを防止することができる。 As shown in FIGS. 3C and 3D, the connector 232 is filled with a gap between the LED board 13 and the LED board 14 when connected to the connector connection terminals 23a and 23b. As a result, a protruding surface 27 is formed in part. The surface of the protruding surface 27 is a surface formed of a highly reflective material (aluminum, silver, etc.) or a surface plated with a highly reflective material. Therefore, when the connector 232 is attached to the connector connection terminals 23a and 23b, the light emitted from the LED 14e disposed at the end of the LED substrate 14 is reflected by the protruding surface 27, and the light guide plate 3 Is incident on.
Therefore, if the connector 232 is used, light that is originally emitted from the LED 14e toward the gap between the LED substrate 13 and the LED substrate 14 is reflected on the projecting surface 27 without being wasted, and the light guide plate 3, it is possible to prevent a decrease in the amount of light by the connector 232 and to prevent unevenness in brightness in the liquid crystal panel 1.

本実施例２では，図４を参照しつつ，前記ＬＥＤ基板１３，１４の接続構造の他の例を説明する。
図４に示すように，本実施例２に係る構成では，前記ＬＥＤ基板１４が前記ＬＥＤ基板１３側に延長されており，その端部に前記接続端子２３ｂが設けられている。このとき，前記接続端子２３ｂは，前記ＬＥＤ１４ｅからの離間距離が間隔ｄ１以上且つ間隔ｄ１×２以下となる範囲で配置されている。
一方，前記ＬＥＤ基板１３では，前記ＬＥＤ基板１４側の端部のＬＥＤ１３ｅとその一つ手前のＬＥＤ１３ｄとの間に前記接続端子２３ａが設けられている。なお，この場合でも，前記ＬＥＤ１３ａ〜１３ｅは，図１（ｃ）に示したように前記ＬＥＤ基板１３の基板表面に形成されたパターンによって直列接続され，前記ＬＥＤ１３ｅのアノード側に前記接続端子２３ａが接続されている。従って，前記接続端子２３ａ，２３ｂが前記コネクタ２３によって接続されると，前記ＬＥＤ１３ｅのアノード端子に前記ＬＥＤ１４ｅのカソード端子が接続されることとなる。 In the second embodiment, another example of the connection structure of the LED boards 13 and 14 will be described with reference to FIG.
As shown in FIG. 4, in the configuration according to the second embodiment, the LED board 14 is extended to the LED board 13 side, and the connection terminal 23b is provided at the end thereof. At this time, the connection terminal 23b is arranged in such a range that the distance from the LED 14e is not less than the interval d1 and not more than the interval d1 × 2.
On the other hand, in the LED board 13, the connection terminal 23 a is provided between the LED 13 e at the end on the LED board 14 side and the LED 13 d immediately before. Even in this case, the LEDs 13a to 13e are connected in series by a pattern formed on the surface of the LED board 13 as shown in FIG. 1C, and the connection terminal 23a is connected to the anode side of the LED 13e. It is connected. Accordingly, when the connection terminals 23a and 23b are connected by the connector 23, the cathode terminal of the LED 14e is connected to the anode terminal of the LED 13e.

そして，前記バックライト装置２では，図４に示すように，前記ＬＥＤ基板１３，１４を該ＬＥＤ基板１３，１４の基板表面と垂直な方向に離間させ，且つ前記コネクタ接続端子２３ａ及び前記コネクタ接続端子２３ｂが前記ＬＥＤ基板１３，１４の基板表面に垂直な方向に重なるように配置した状態で，前記コネクタ２３の前記突出端子２５ａ，２５ｂが前記コネクタ接続端子２３ａ，２３ｂの前記貫通孔２４ａ，２４ｂに嵌挿されて装着される。これにより，隣接する二つの前記ＬＥＤ基板１３，１４に亘る全てのＬＥＤ１３ａ〜１３ｅ，１４ａ〜１４ｅが間隔ｄ１で等間隔で配置されるため，前記ＬＥＤ基板１３，１４の接続部分近傍の領域における明るさのムラを防止することができる。
特に，係る構成によれば，前記実施の形態で説明したように前記ＬＥＤ基板１３，１４の端部に接続端子２３ａ，２３ｂが設けられている場合（図２参照）に比べて，前記ＬＥＤ基板１３における前記ＬＥＤ１３ｅから端部までの距離を短縮することが可能となり，また，前記ＬＥＤ１３ｅから照射される光が前記コネクタ２３によって遮蔽されないため，前記ＬＥＤ１３ｅ及びＬＥＤ１４ｅ近傍において十分な明るさを確保することができる。 In the backlight device 2, as shown in FIG. 4, the LED boards 13, 14 are separated in a direction perpendicular to the board surfaces of the LED boards 13, 14, and the connector connection terminals 23 a and the connector connection are made. In a state where the terminals 23b are arranged so as to overlap in the direction perpendicular to the substrate surfaces of the LED boards 13, 14, the protruding terminals 25a, 25b of the connector 23 are the through holes 24a, 24b of the connector connecting terminals 23a, 23b. It is inserted into and attached. As a result, all the LEDs 13a to 13e and 14a to 14e extending over the two adjacent LED boards 13 and 14 are arranged at equal intervals at the interval d1, so that the brightness in the region near the connection portion of the LED boards 13 and 14 is increased. Unevenness of the thickness can be prevented.
In particular, according to such a configuration, the LED board as compared with the case where the connection terminals 23a and 23b are provided at the ends of the LED boards 13 and 14 as described in the embodiment (see FIG. 2). 13, the distance from the LED 13e to the end of the LED 13e can be shortened, and light irradiated from the LED 13e is not shielded by the connector 23, so that sufficient brightness is secured in the vicinity of the LED 13e and the LED 14e. Can do.

Ｘ …液晶表示装置
１ …液晶パネル
２ …バックライト装置
３ …導光板
４ …駆動回路
１１〜１４…ＬＥＤ基板
１１ａ〜１１ｅ，１２ａ〜１２ｅ…ＬＥＤ
１３ａ〜１３ｅ，１４ａ〜１４ｅ…ＬＥＤ
２２，２３…コネクタ
２３ａ，２３ｂ…接続端子
２４ａ，２４ｂ…貫通孔
２５…端子
２６…反射面
２７…突出面
５１〜５４…ハーネス X ... Liquid crystal display device 1 ... Liquid crystal panel 2 ... Backlight device 3 ... Light guide plate 4 ... Drive circuits 11-14 ... LED substrates 11a-11e, 12a-12e ... LED
13a-13e, 14a-14e ... LED
22, 23 ... Connectors 23a, 23b ... Connection terminals 24a, 24b ... Through holes 25 ... Terminal 26 ... Reflecting surface 27 ... Projecting surfaces 51-54 ... Harness

Claims (7)

液晶パネルの少なくとも一つのエッジに対応して配置され，前記液晶パネルの背面に設けられた導光板を通じて該液晶パネルを照明する複数のＬＥＤを備えてなるバックライト装置であって，
前記エッジごとに対応して設けられ，直列接続されると共に等間隔で並設された複数のＬＥＤが基板表面に搭載された複数のＬＥＤ基板と，
前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板のうち一方のＬＥＤ基板の基板表面に搭載され，該ＬＥＤ基板に搭載された前記ＬＥＤのアノード側に接続された第１のコネクタ部材と，
前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板のうち他方のＬＥＤ基板の基板表面に搭載され，該ＬＥＤ基板に搭載された前記ＬＥＤのカソード側に接続された第２のコネクタ部材と，
前記第１のコネクタ部材及び前記第２のコネクタ部材を線材を介することなく接続するための第３のコネクタ部材と，
を備えてなり，
前記第１のコネクタ部材及び前記第２のコネクタ部材各々に，前記ＬＥＤ基板の基板表面の短手方向と平行な方向から前記第３のコネクタ部材を装着するための装着部が設けられてなり，
前記エッジごとにおいて隣接する二つの前記ＬＥＤ基板が，該ＬＥＤ基板の基板表面と垂直な方向に離間し，且つ前記第１のコネクタ部材及び前記第２のコネクタ部材が前記ＬＥＤ基板の基板表面に垂直な方向に重なるように配置された状態で，前記ＬＥＤ基板の基板表面の短手方向と平行な方向から前記第３のコネクタ部材が前記第１のコネクタ部材及び前記第２のコネクタ部材の装着部に装着されることにより，該二つの前記ＬＥＤ基板に亘って前記ＬＥＤが等間隔で配置されてなることを特徴とするバックライト装置。 A backlight device comprising a plurality of LEDs arranged corresponding to at least one edge of the liquid crystal panel and illuminating the liquid crystal panel through a light guide plate provided on the back surface of the liquid crystal panel,
A plurality of LED substrates provided corresponding to the respective edges, connected in series and arranged in parallel at equal intervals, and a plurality of LED substrates mounted on the substrate surface;
A first connector member mounted on the surface of one of the two LED substrates adjacent to each other on the edge and connected to the anode side of the LED mounted on the LED substrate;
A second connector member mounted on the surface of the other LED substrate of the two adjacent LED substrates for each edge and connected to the cathode side of the LED mounted on the LED substrate;
A third connector member for connecting the first connector member and the second connector member without a wire rod;
With
Each of the first connector member and the second connector member is provided with a mounting portion for mounting the third connector member from a direction parallel to the short direction of the substrate surface of the LED substrate,
Two adjacent LED boards at each edge are separated in a direction perpendicular to the substrate surface of the LED substrate, and the first connector member and the second connector member are perpendicular to the substrate surface of the LED substrate. The third connector member is attached to the first connector member and the second connector member from a direction parallel to the short side direction of the substrate surface of the LED substrate in a state of being arranged so as to overlap in any direction. The backlight device is characterized in that the LEDs are arranged at equal intervals across the two LED substrates. 前記第１のコネクタ部材及び前記第２のコネクタ部材各々の前記装着部が，前記ＬＥＤ基板の基板表面の短手方向に貫通し，内周面に前記ＬＥＤに接続された導通部材が設けられた貫通孔であり，
前記第３のコネクタ部材が，前記第１のコネクタ部材及び前記第２のコネクタ部材各々の前記貫通孔に嵌挿されることにより前記第１のコネクタ部材及び前記第２のコネクタ部材の前記導通部材を接続する二つの突出端子を備えてなる請求項１に記載のバックライト装置。 The mounting portion of each of the first connector member and the second connector member penetrates in the short direction of the substrate surface of the LED substrate, and a conductive member connected to the LED is provided on the inner peripheral surface. A through hole,
The conductive member of the first connector member and the second connector member is inserted into the through hole of each of the first connector member and the second connector member. The backlight device according to claim 1, comprising two protruding terminals to be connected. 前記液晶パネルの少なくとも対向する二つのエッジに複数の前記ＬＥＤ基板が設けられなる請求項２に記載のバックライト装置。   The backlight device according to claim 2, wherein a plurality of the LED substrates are provided on at least two opposing edges of the liquid crystal panel. 前記第１のコネクタ部材及び前記第２のコネクタ部材各々が前記ＬＥＤ基板各々の端部に設けられてなる請求項３に記載のバックライト装置。   The backlight device according to claim 3, wherein each of the first connector member and the second connector member is provided at an end portion of each of the LED substrates. 前記第３のコネクタ部材の一部又は全部が高反射材で形成されたものである請求項４に記載のバックライト装置。   The backlight device according to claim 4, wherein a part or all of the third connector member is formed of a highly reflective material. 請求項１〜５のいずれかに記載のバックライト装置と前記液晶パネルと前記導光板とを備えてなる液晶表示装置。   A liquid crystal display device comprising the backlight device according to claim 1, the liquid crystal panel, and the light guide plate. 前記導光板が，前記ＬＥＤ基板各々が該ＬＥＤ基板の基板表面と垂直な方向に離間して配置されることにより生じる段差に沿って，該導光板の入射面と前記ＬＥＤ各々との間隔が一定となるように形成された段差形状を有するものである請求項６に記載の液晶表示装置。   The light guide plate has a constant distance between the incident surface of the light guide plate and each of the LEDs along a step formed by the LED substrates being spaced apart in a direction perpendicular to the substrate surface of the LED substrate. The liquid crystal display device according to claim 6, wherein the liquid crystal display device has a step shape formed to be.
JP2010142851A 2010-06-23 2010-06-23 Backlight device, liquid crystal display Pending JP2012009220A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050655A1 (en) * 2012-09-28 2014-04-03 日亜化学工業株式会社 Linking body for multiple light-emitting devices
CN103939755A (en) * 2013-01-18 2014-07-23 神锯有限公司 Light emitting device
US9638954B2 (en) 2013-04-12 2017-05-02 Funai Electric Co., Ltd. Display apparatus and backlight

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050655A1 (en) * 2012-09-28 2014-04-03 日亜化学工業株式会社 Linking body for multiple light-emitting devices
CN104487760A (en) * 2012-09-28 2015-04-01 日亚化学工业株式会社 Linking body for multiple light-emitting devices
JPWO2014050655A1 (en) * 2012-09-28 2016-08-22 日亜化学工業株式会社 Connected multiple light emitting devices
US9784438B2 (en) 2012-09-28 2017-10-10 Nichia Corporation Connected body of a plurality of light emitting devices
CN103939755A (en) * 2013-01-18 2014-07-23 神锯有限公司 Light emitting device
US9638954B2 (en) 2013-04-12 2017-05-02 Funai Electric Co., Ltd. Display apparatus and backlight
US9857629B2 (en) 2013-04-12 2018-01-02 Funai Electric Co., Ltd. Display apparatus and backlight

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