JP2011522405A - オプトエレクトロニックモジュールおよびオプトエレクトロニック装置 - Google Patents
オプトエレクトロニックモジュールおよびオプトエレクトロニック装置 Download PDFInfo
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- JP2011522405A JP2011522405A JP2011510814A JP2011510814A JP2011522405A JP 2011522405 A JP2011522405 A JP 2011522405A JP 2011510814 A JP2011510814 A JP 2011510814A JP 2011510814 A JP2011510814 A JP 2011510814A JP 2011522405 A JP2011522405 A JP 2011522405A
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 49
- 230000003287 optical effect Effects 0.000 claims abstract description 77
- 230000005540 biological transmission Effects 0.000 claims description 12
- 230000000295 complement effect Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000007373 indentation Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
- F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/25—Projection lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/06—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the lampholder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (15)
- オプトエレクトロニックモジュールにおいて、
該オプトエレクトロニックモジュールは、
− 支持体(3)に配置された少なくとも1つの発光ダイオードチップ(2)と、
− 前記の支持体(3)に固定されておりかつ発光ダイオードチップ(2)を少なくとも部分的に覆う取付突出部(4)とを有しており、
− 当該の取付突出部(4)は、その上側に構造化部(6)を有しており、当該の構造化部(6)によって光学素子(5)の位置決めが可能になることを特徴とする
オプトエレクトロニックモジュール。 - − 前記の取付突出部(4)の下側に発光ダイオードチップ(2)を収容するための凹部(41)が形成されている、
請求項1に記載のオプトエレクトロニックモジュール。 - − 前記の取付突出部(4)により、発光ダイオードチップ(2)が完全に覆われる、
請求項1または2に記載のオプトエレクトロニックモジュール。 - − 前記の取付突出部(4)により、発光ダイオードチップ(2)が完全に覆われておりかつ側方が完全に包囲されている、
請求項1から3までのいずれか1項に記載のオプトエレクトロニックモジュール。 - − 前記の取付突出部(4)の上側に少なくとも1つの***部(61)、例えばピン状***部が形成されている、
請求項1から4までのいずれか1項に記載のオプトエレクトロニックモジュール。 - − 前記の取付突出部(4)の上側にくぼみ(62)、例えばスロット状のくぼみが形成されている、
請求項1から5までのいずれか1項に記載のオプトエレクトロニックモジュール。 - − 前記の取付突出部(4)の上側に開口部が形成されている、
請求項1から6までのいずれか1項に記載のオプトエレクトロニックモジュール。 - − 前記の構造化部(61)には平坦部(63)が含まれている、
請求項1から7までのいずれか1項に記載のオプトエレクトロニックモジュール。 - − 前記の平坦部(63)は取付突出部(4)のビーム透過領域に配置されている、
請求項8に記載のオプトエレクトロニックモジュール。 - − 取付突出部(4)と、少なくとも1つの発光ダイオードチップ(2)との間の空間が気体によって、例えば空気によって充たされている、
請求項1から9までのいずれか1項に記載のオプトエレクトロニックモジュール。 - オプトエレクトロニック装置において、
該オプトエレクトロニック装置は、
− 請求項1から10までのいずれか1項に記載のオプトエレクトロニックモジュールと、
− 前記の取付突出部(4)に載置された光学素子(5)とを有しており、
− 当該の光学素子(5)は、前記の取付突出部(4)の構造化部(6)に少なくとも部分的にはめ込まれる構造化部を有することを特徴とする
オプトエレクトロニック装置。 - − 前記の取付突出部(4)と光学素子(5)との間の取付突出部(4)のビーム透過領域に平坦な接触接続部が設けられている、
請求項11に記載のオプトエレクトロニック装置。 - − 前記の取付突出部(4)と光学素子(5)との間のビーム透過領域に中間空間が設けられている、
請求項11に記載のオプトエレクトロニック装置。 - − 前記の光学素子(5)は取付突出部(4)に固定されている、
請求項11から13までのいずれか1項に記載のオプトエレクトロニック装置。 - − 前記の光学素子(5)は、支持体(3)に固定されている、
請求項11から13までのいずれか1項に記載のオプトエレクトロニック装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008025921.7 | 2008-05-30 | ||
DE102008025921 | 2008-05-30 | ||
DE102008039147.6 | 2008-08-21 | ||
DE102008039147A DE102008039147A1 (de) | 2008-05-30 | 2008-08-21 | Optoelektronisches Modul und optoelektronische Anordnung |
PCT/DE2009/000541 WO2009143794A1 (de) | 2008-05-30 | 2009-04-17 | Optoelektronisches modul und optoelektronische anordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011522405A true JP2011522405A (ja) | 2011-07-28 |
JP2011522405A5 JP2011522405A5 (ja) | 2012-06-07 |
Family
ID=41254073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011510814A Pending JP2011522405A (ja) | 2008-05-30 | 2009-04-17 | オプトエレクトロニックモジュールおよびオプトエレクトロニック装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8646990B2 (ja) |
EP (1) | EP2279527B1 (ja) |
JP (1) | JP2011522405A (ja) |
KR (1) | KR101681330B1 (ja) |
CN (1) | CN101965641A (ja) |
DE (1) | DE102008039147A1 (ja) |
WO (1) | WO2009143794A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202013101190U1 (de) | 2013-03-20 | 2014-06-24 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit einer LED, einer Platine und einem optischen Element |
KR102137746B1 (ko) * | 2013-12-24 | 2020-07-24 | 엘지이노텍 주식회사 | 광학 렌즈 및 램프 모듈 |
DE102014101784B4 (de) * | 2014-02-13 | 2024-03-14 | HELLA GmbH & Co. KGaA | Verfahren zum Aufbau eines LED- Lichtmoduls |
US10914962B2 (en) * | 2015-08-21 | 2021-02-09 | Everready Precision Ind. Corp | Structured light module with fastening element |
DE102016202571A1 (de) * | 2016-02-19 | 2017-08-24 | Osram Gmbh | Beleuchtungseinrichtung |
Citations (5)
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JPH0284351U (ja) * | 1988-12-16 | 1990-06-29 | ||
JPH0563068U (ja) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JP2004524679A (ja) * | 2001-01-10 | 2004-08-12 | シルバーブルック リサーチ ピーティワイ リミテッド | 発光半導体パッケージ |
JP2005062842A (ja) * | 2003-07-31 | 2005-03-10 | Toshiba Discrete Technology Kk | 光伝送デバイス |
JP2006301544A (ja) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | 光学部品及び光学部品を用いた照明器具 |
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CN100392460C (zh) * | 2003-03-13 | 2008-06-04 | 富士通株式会社 | 光传送模块及其制造方法 |
EP2520953A1 (en) * | 2003-07-29 | 2012-11-07 | Light Engine Limited | Circumferentially emitting luminaires and lens elements formed by transverse-axis profile-sweeps |
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DE102004036157B4 (de) | 2004-07-26 | 2023-03-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul |
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JP2006162654A (ja) | 2004-12-02 | 2006-06-22 | Olympus Corp | 光学デバイス及び照明装置 |
DE102005020908A1 (de) | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
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-
2008
- 2008-08-21 DE DE102008039147A patent/DE102008039147A1/de not_active Withdrawn
-
2009
- 2009-04-17 KR KR1020107020382A patent/KR101681330B1/ko active IP Right Grant
- 2009-04-17 JP JP2011510814A patent/JP2011522405A/ja active Pending
- 2009-04-17 CN CN2009801082311A patent/CN101965641A/zh active Pending
- 2009-04-17 US US12/922,492 patent/US8646990B2/en active Active
- 2009-04-17 EP EP09753510.8A patent/EP2279527B1/de active Active
- 2009-04-17 WO PCT/DE2009/000541 patent/WO2009143794A1/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0284351U (ja) * | 1988-12-16 | 1990-06-29 | ||
JPH0563068U (ja) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JP2004524679A (ja) * | 2001-01-10 | 2004-08-12 | シルバーブルック リサーチ ピーティワイ リミテッド | 発光半導体パッケージ |
JP2005062842A (ja) * | 2003-07-31 | 2005-03-10 | Toshiba Discrete Technology Kk | 光伝送デバイス |
JP2006301544A (ja) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | 光学部品及び光学部品を用いた照明器具 |
Also Published As
Publication number | Publication date |
---|---|
KR20110014133A (ko) | 2011-02-10 |
WO2009143794A1 (de) | 2009-12-03 |
US8646990B2 (en) | 2014-02-11 |
DE102008039147A1 (de) | 2009-12-03 |
CN101965641A (zh) | 2011-02-02 |
US20110116752A1 (en) | 2011-05-19 |
EP2279527B1 (de) | 2017-12-13 |
KR101681330B1 (ko) | 2016-11-30 |
EP2279527A1 (de) | 2011-02-02 |
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