JP2011519160A - 電力生成が可能な熱伝達装置 - Google Patents
電力生成が可能な熱伝達装置 Download PDFInfo
- Publication number
- JP2011519160A JP2011519160A JP2011506176A JP2011506176A JP2011519160A JP 2011519160 A JP2011519160 A JP 2011519160A JP 2011506176 A JP2011506176 A JP 2011506176A JP 2011506176 A JP2011506176 A JP 2011506176A JP 2011519160 A JP2011519160 A JP 2011519160A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- transfer device
- working fluid
- capillary groove
- vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005611 electricity Effects 0.000 title 1
- 239000012530 fluid Substances 0.000 claims abstract description 35
- 238000001704 evaporation Methods 0.000 claims abstract description 26
- 230000008020 evaporation Effects 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
101 毛細溝
101a 圧電薄膜
103 作動流体
105 ブリッジ
VF 気化した作動流体の蒸気
HL 作動流体の気化による潜熱
CF 凝縮された作動流体
Claims (7)
- 外部の発熱体から伝達された熱によって作動流体を気化させて蒸気を発生させる多チャネル毛細溝を含む蒸発部と、
前記蒸発部を通じて気化した作動流体の蒸気を凝縮させ、前記凝縮した液体を前記蒸発部にリターンさせる液体流動通路を含む凝縮部と、を備え、
前記多チャネル毛細溝の表面には圧電薄膜が蒸着され、前記気化した作動流体の蒸気によって前記圧電薄膜が蒸着された多チャネル毛細溝が振動し、前記多チャネル毛細溝で電力が生成されることを特徴とする熱伝達装置。 - 前記気化した作動流体の蒸気が前記多チャネル毛細溝の間を滑りながら流動することによって、前記圧電薄膜が蒸着された多チャネル毛細溝が左右または前後に振動することを特徴とする請求項1に記載の熱伝達装置。
- 前記多チャネル毛細溝は、
下部が前記蒸発部の壁面と連結され、上部が移動自在のカンチレバー形状を有することを特徴とする請求項1に記載の熱伝達装置。 - 前記多チャネル毛細溝の毛細管作用によって前記作動流体が前記多チャネル毛細溝の間に飽和状態で均一に分布することを特徴とする請求項1に記載の熱伝達装置。
- 前記作動流体の気化−凝縮による相変化によって前記発熱体から伝達された熱が前記凝縮部を通じて外部に放出されることを特徴とする請求項1に記載の熱伝達装置。
- 前記蒸発部と前記凝縮部との間に圧着防止のための柱状ブリッジが形成されることを特徴とする請求項1に記載の熱伝達装置。
- 前記ブリッジは、前記凝縮した液体を前記蒸発部にリターンさせる液体流動通路として利用されることを特徴とする請求項6に記載の熱伝達装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0054761 | 2008-06-11 | ||
KR1020080054761A KR100952422B1 (ko) | 2008-06-11 | 2008-06-11 | 전력 생성이 가능한 열 전달 장치 |
PCT/KR2008/007329 WO2009151194A1 (en) | 2008-06-11 | 2008-12-11 | The heat transfer device with functions of power generation |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011519160A true JP2011519160A (ja) | 2011-06-30 |
JP5145458B2 JP5145458B2 (ja) | 2013-02-20 |
Family
ID=41416879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011506176A Expired - Fee Related JP5145458B2 (ja) | 2008-06-11 | 2008-12-11 | 電力生成が可能な熱伝達装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110079372A1 (ja) |
JP (1) | JP5145458B2 (ja) |
KR (1) | KR100952422B1 (ja) |
WO (1) | WO2009151194A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399513B (zh) * | 2010-03-25 | 2013-06-21 | Wistron Corp | 可將動能轉換為電能的熱管及其相關散熱模組 |
CN102209451B (zh) * | 2010-03-31 | 2013-12-11 | 纬创资通股份有限公司 | 可将动能转换为电能的热管及其相关散热模块 |
US10267568B2 (en) * | 2016-05-11 | 2019-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Programmable ultrasonic thermal diodes |
CN113301777B (zh) * | 2021-04-26 | 2022-12-02 | 江西新菲新材料有限公司 | 均热板及均热板的制备方法、电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330488A (ja) * | 1995-05-30 | 1996-12-13 | Sumitomo Metal Ind Ltd | 圧電ファン付きヒートシンク |
JPH09112919A (ja) * | 1995-09-29 | 1997-05-02 | Daewoo Electronics Co Ltd | 電子レンジの蒸気センサを利用した自動調理制御方法 |
JPH10270978A (ja) * | 1997-02-18 | 1998-10-09 | Kobe Steel Ltd | 表面弾性波素子及びその製造方法 |
JPH11183067A (ja) * | 1997-12-18 | 1999-07-06 | Fujikura Ltd | 平板状ヒートパイプ |
JPH11303726A (ja) * | 1998-04-23 | 1999-11-02 | Murata Mfg Co Ltd | 圧電型風力発電機 |
JP2000161879A (ja) * | 1998-11-20 | 2000-06-16 | Fujikura Ltd | 平板状ヒートパイプ |
JP2005318774A (ja) * | 2004-04-30 | 2005-11-10 | Katsumi Ikeda | 圧電デバイスを利用した発電機能付携帯電話 |
JP2009024583A (ja) * | 2007-07-19 | 2009-02-05 | Shimizu Corp | 風力発電モジュール及び風力発電ユニット |
JP2012182186A (ja) * | 2011-02-28 | 2012-09-20 | Murata Mfg Co Ltd | 冷却装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US4442372A (en) | 1982-11-22 | 1984-04-10 | Walton Energy Systems Co. | Piezo electric apparatus for generating electricity |
US4923000A (en) * | 1989-03-03 | 1990-05-08 | Microelectronics And Computer Technology Corporation | Heat exchanger having piezoelectric fan means |
US5039901A (en) | 1990-06-22 | 1991-08-13 | Newbould John M | Electric power source through steam transition |
US6808015B2 (en) * | 2000-03-24 | 2004-10-26 | Denso Corporation | Boiling cooler for cooling heating element by heat transfer with boiling |
EP1350276A2 (en) * | 2000-10-25 | 2003-10-08 | Washington State University Research Foundation | Piezoelectric micro-transducers, methods of use and manufacturing methods for same |
JP2002364992A (ja) | 2001-06-06 | 2002-12-18 | Hitachi Zosen Corp | 多管式熱交換装置 |
US7411337B2 (en) * | 2001-11-16 | 2008-08-12 | Intel Corporation | Electrical energy-generating system and devices and methods related thereto |
US7131487B2 (en) * | 2001-12-14 | 2006-11-07 | Intel Corporation | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
US6880626B2 (en) * | 2002-08-28 | 2005-04-19 | Thermal Corp. | Vapor chamber with sintered grooved wick |
US6945317B2 (en) * | 2003-04-24 | 2005-09-20 | Thermal Corp. | Sintered grooved wick with particle web |
US20050082949A1 (en) * | 2003-10-21 | 2005-04-21 | Michio Tsujiura | Piezoelectric generator |
US7397169B2 (en) * | 2004-03-19 | 2008-07-08 | Lawrence Livermore National Security, Llc | Energy harvesting using a thermoelectric material |
US7900692B2 (en) * | 2005-10-28 | 2011-03-08 | Nakamura Seisakusho Kabushikigaisha | Component package having heat exchanger |
US8183745B2 (en) * | 2006-05-08 | 2012-05-22 | The Penn State Research Foundation | High frequency ultrasound transducers |
US7475718B2 (en) * | 2006-11-15 | 2009-01-13 | Delphi Technologies, Inc. | Orientation insensitive multi chamber thermosiphon |
US7692922B2 (en) * | 2007-06-30 | 2010-04-06 | Intel Corporation | Heatsink, method of manufacturing same, and microelectronic package containing same |
-
2008
- 2008-06-11 KR KR1020080054761A patent/KR100952422B1/ko active IP Right Grant
- 2008-12-11 JP JP2011506176A patent/JP5145458B2/ja not_active Expired - Fee Related
- 2008-12-11 WO PCT/KR2008/007329 patent/WO2009151194A1/en active Application Filing
- 2008-12-11 US US12/990,146 patent/US20110079372A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330488A (ja) * | 1995-05-30 | 1996-12-13 | Sumitomo Metal Ind Ltd | 圧電ファン付きヒートシンク |
JPH09112919A (ja) * | 1995-09-29 | 1997-05-02 | Daewoo Electronics Co Ltd | 電子レンジの蒸気センサを利用した自動調理制御方法 |
JPH10270978A (ja) * | 1997-02-18 | 1998-10-09 | Kobe Steel Ltd | 表面弾性波素子及びその製造方法 |
JPH11183067A (ja) * | 1997-12-18 | 1999-07-06 | Fujikura Ltd | 平板状ヒートパイプ |
JPH11303726A (ja) * | 1998-04-23 | 1999-11-02 | Murata Mfg Co Ltd | 圧電型風力発電機 |
JP2000161879A (ja) * | 1998-11-20 | 2000-06-16 | Fujikura Ltd | 平板状ヒートパイプ |
JP2005318774A (ja) * | 2004-04-30 | 2005-11-10 | Katsumi Ikeda | 圧電デバイスを利用した発電機能付携帯電話 |
JP2009024583A (ja) * | 2007-07-19 | 2009-02-05 | Shimizu Corp | 風力発電モジュール及び風力発電ユニット |
JP2012182186A (ja) * | 2011-02-28 | 2012-09-20 | Murata Mfg Co Ltd | 冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5145458B2 (ja) | 2013-02-20 |
KR100952422B1 (ko) | 2010-04-14 |
WO2009151194A1 (en) | 2009-12-17 |
KR20090128810A (ko) | 2009-12-16 |
US20110079372A1 (en) | 2011-04-07 |
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