JP2011215547A - Transmission and reception module - Google Patents

Transmission and reception module Download PDF

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JP2011215547A
JP2011215547A JP2010086160A JP2010086160A JP2011215547A JP 2011215547 A JP2011215547 A JP 2011215547A JP 2010086160 A JP2010086160 A JP 2010086160A JP 2010086160 A JP2010086160 A JP 2010086160A JP 2011215547 A JP2011215547 A JP 2011215547A
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transmission
reception
light
optical waveguide
circuit board
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JP5223879B2 (en
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Mitsuki Hirano
光樹 平野
Takemasa Ushiwatari
剛真 牛渡
Shugen Ryu
主鉉 柳
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a transmission and reception module which is easy to mount optical elements and ICs and also small.SOLUTION: The transmission and reception module has a transmission side substrate 2 having a light emitting element 22 and a driver IC 23, which are mounted on the front surface of a transmission circuit substrate 21, a transmission side optical wave-guide 25 formed at the back of the transmission circuit substrate 21 and optically connected to a transmission optical fiber 24, and a transmission side mirror 26 which is formed on the transmission side optical wave-guide 25 and makes light emitted from the light emitting element 22 incident on the core of the transmission side optical wave-guide 25 by changing its path by 90°C; and a light receiving side substrate 3 having a light receiving element 32 and an amplifier IC 33 mounted on the front surface of a receiving circuit substrate 31, a receiving side optical wave-guide 35 formed at the back side of the receiving circuit substrate 31 and optically connected to a receiving side optical fiber 34, and a receiving side mirror 36 which is formed on the receiving side optical wave-guide 35 and makes light running on the core of the receiving side optical wave-guide 35 incident on the light receiving element 32 by changing its optical path by 90°. Thus, this transmission and reception module is built by firmly adhering together the back sides of the substrates 2, and 3.

Description

本発明は、送受信モジュールに関するものである。   The present invention relates to a transmission / reception module.

特許文献１では、光ファイバの先端部に直方体状の実装部材を設け、その実装部材に、面発光素子あるいは面受光素子からなる光素子と、光素子を駆動する（あるいは光素子からの電気信号を増幅する）ＩＣとを実装した光モジュールが提案されている。   In Patent Document 1, a rectangular parallelepiped mounting member is provided at the tip of an optical fiber, and an optical element composed of a surface light emitting element or a surface light receiving element and an optical element are driven on the mounting member (or an electrical signal from the optical element). An optical module mounted with an IC has been proposed.

この光モジュールでは、実装部材の背面から正面に貫通するように光ファイバを挿入する貫通孔が形成されており、実装部材の背面側から貫通孔に挿入された光ファイバの先端と対向する位置、すなわち実装部材の正面における貫通孔が形成された位置に、光素子が実装される。より正確には、光素子は、実装部材の正面に固定される基板に実装される。実装部材の正面と背面以外の面である側面には、ＩＣが搭載され、ＩＣと光素子とが配線パターンを介して電気的に接続される。   In this optical module, a through hole for inserting an optical fiber is formed so as to penetrate from the back surface of the mounting member to the front surface, a position facing the tip of the optical fiber inserted into the through hole from the back surface side of the mounting member, That is, the optical element is mounted at the position where the through hole is formed on the front surface of the mounting member. More precisely, the optical element is mounted on a substrate fixed to the front surface of the mounting member. An IC is mounted on a side surface other than the front surface and the back surface of the mounting member, and the IC and the optical element are electrically connected via a wiring pattern.

特開２００１−２８１５０４号公報JP 2001-281504 A

しかしながら、特許文献１の光モジュールでは、実装部材の正面に光素子が実装され、実装部材の側面にＩＣが実装されており、光素子を実装する面とＩＣを実装する面が１つの平面を為していない。そのため、光素子やＩＣの実装がしにくく、実装に手間がかかるという問題がある。   However, in the optical module of Patent Document 1, the optical element is mounted on the front surface of the mounting member, and the IC is mounted on the side surface of the mounting member. The surface on which the optical element is mounted and the surface on which the IC is mounted have one plane. I have not done it. Therefore, there is a problem that it is difficult to mount an optical element or an IC, and it takes time and effort.

また、特許文献１の光モジュールでは、実装部材の正面に光素子が実装され、実装部材の側面にＩＣが実装されるため、正面から側面に回り込むように配線パターンを形成しなければならなかった。この様な構成だと、配線パターンの距離が長くなるため、電気信号の劣化の原因になるという問題がある。さらに配線パターンの形成が困難であるという問題もある。   Further, in the optical module of Patent Document 1, since the optical element is mounted on the front surface of the mounting member and the IC is mounted on the side surface of the mounting member, a wiring pattern has to be formed so as to wrap around from the front surface to the side surface. . In such a configuration, the distance between the wiring patterns becomes long, which causes a problem of causing deterioration of the electric signal. Further, there is a problem that it is difficult to form a wiring pattern.

これらの問題を解決するため、実装部材の正面に光素子とＩＣの両方を実装することも考えられるが、この場合、光素子とＩＣの実装面積を確保するために実装部材が大型化してしまい、光モジュール全体が大型化してしまうといった問題が生じる。   In order to solve these problems, it is conceivable to mount both the optical element and the IC in front of the mounting member. In this case, however, the mounting member becomes large in order to secure the mounting area of the optical element and the IC. There arises a problem that the entire optical module is enlarged.

また、特許文献１の光モジュールでは、実装部材に厚みがあるので、カードエッジコネクタを使用することはできない。   Moreover, in the optical module of patent document 1, since a mounting member has thickness, a card edge connector cannot be used.

そこで、本発明の目的は、上記課題を解決し、光素子やＩＣの実装が容易であり、かつ小型な送受信モジュールを提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems and provide a small transmission / reception module in which an optical element and an IC can be easily mounted.

本発明は上記目的を達成するために創案されたものであり、送信側回路基板と、該送信側回路基板の表面側に実装された発光素子およびドライバＩＣと、前記送信側回路基板の裏面側に形成され、送信側光ファイバと光学的に接続される送信側光導波路と、該送信側光導波路に形成され、前記発光素子から出射された光の光路を９０度変換して前記送信側光導波路のコアに入射する送信側ミラーと、を有する送信側基板と、受信側回路基板と、該受信側回路基板の表面側に実装された受光素子およびアンプＩＣと、前記受信側回路基板の裏面側に形成され、受信側光ファイバと光学的に接続される受信側光導波路と、該受信側光導波路に形成され、前記受信側光導波路のコアを伝搬する光の光路を９０度変換して前記受光素子に入射する受信側ミラーと、を有する受信側基板と、を備え、前記両基板の裏面同士を向かい合わせた状態で固定してなる送受信モジュールである。   The present invention has been devised to achieve the above object, and includes a transmission side circuit board, a light emitting element and a driver IC mounted on the front side of the transmission side circuit board, and a back side of the transmission side circuit board. A transmission-side optical waveguide that is optically connected to the transmission-side optical fiber, and the transmission-side optical waveguide that is formed in the transmission-side optical waveguide and converts the optical path of the light emitted from the light-emitting element by 90 degrees. A transmission-side substrate having a transmission-side mirror incident on the core of the waveguide; a reception-side circuit substrate; a light-receiving element and an amplifier IC mounted on the front surface side of the reception-side circuit substrate; and a back surface of the reception-side circuit substrate A receiving-side optical waveguide that is optically connected to the receiving-side optical fiber, and an optical path of light that is formed in the receiving-side optical waveguide and propagates through the core of the receiving-side optical waveguide. Reception incident on the light receiving element Comprising: a reception-side substrate having a mirror, and the said a transceiver module comprising fixed in a state of facing the rear surface of both the substrate.

前記両基板の間には、グランド層が形成されてもよい。   A ground layer may be formed between the two substrates.

前記グランド層は、前記送信側基板の裏面及び／又は前記受信側基板の裏面にスパッタリング又は真空蒸着により形成された金属膜からなってもよい。   The ground layer may be made of a metal film formed by sputtering or vacuum deposition on the back surface of the transmitting substrate and / or the back surface of the receiving substrate.

前記グランド層は、前記両基板を導電性の接着剤で接着固定して形成される接着層からなってもよい。   The ground layer may include an adhesive layer formed by bonding and fixing the two substrates with a conductive adhesive.

前記発光素子および前記送信側光導波路を、前記送信側回路基板の一の側辺側に偏らせて配置すると共に、前記受光素子および前記受信側光導波路を、前記受信側回路基板の一の側辺側に偏らせて配置し、前記両基板の裏面同士を向かい合わせた際に、前記送信側光導波路と前記受信側光導波路とが重ならないようにされてもよい。   The light emitting element and the transmission side optical waveguide are arranged so as to be biased toward one side of the transmission side circuit board, and the light receiving element and the reception side optical waveguide are arranged on one side of the reception side circuit board. The transmission side optical waveguide and the reception side optical waveguide may be arranged so as not to overlap each other when they are arranged so as to be biased to the side and the back surfaces of the two substrates face each other.

前記発光素子および前記送信側ミラーは、前記受光素子および前記受信側ミラーよりも、前記両光ファイバから離れた位置に設けられてもよい。   The light emitting element and the transmission side mirror may be provided at a position farther from the both optical fibers than the light receiving element and the reception side mirror.

前記両回路基板の端部に接続端子を形成してなるカードエッジコネクタを備えてもよい。   You may provide the card edge connector which forms a connection terminal in the edge part of both said circuit boards.

本発明によれば、光素子やＩＣの実装が容易であり、かつ小型な送受信モジュールを提供できる。   According to the present invention, it is easy to mount an optical element or an IC, and a small transmission / reception module can be provided.

本発明の一実施の形態に係る送受信モジュールを示す図であり、（ａ）は平面図、（ｂ）はその１Ｂ−１Ｂ線断面図、（ｃ）はその１Ｃ−１Ｃ線断面図、（ｄ）はその１Ｄ−１Ｄ線断面図である。It is a figure which shows the transmission-and-reception module which concerns on one embodiment of this invention, (a) is a top view, (b) is the 1B-1B sectional view taken on the line, (c) is the 1C-1C sectional view, ) Is a cross-sectional view taken along the line 1D-1D. （ａ）〜（ｇ）は、図１の送受信モジュールの製造方法を説明する図である。(A)-(g) is a figure explaining the manufacturing method of the transmission / reception module of FIG. 本発明の一実施の形態に係る送受信モジュールを示す図であり、（ａ）は平面図、（ｂ）はその３Ｂ−３Ｂ線断面図、（ｃ）はその３Ｃ−３Ｃ線断面図である。It is a figure which shows the transmission / reception module which concerns on one embodiment of this invention, (a) is a top view, (b) is the 3B-3B sectional view taken on the line, (c) is the 3C-3C sectional view.

以下、本発明の好適な実施の形態を添付図面にしたがって説明する。   Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

図１は、本実施の形態に係る送受信モジュールを示す図であり、（ａ）は平面図、（ｂ）はその１Ｂ−１Ｂ線断面図、（ｃ）はその１Ｃ−１Ｃ線断面図、（ｄ）はその１Ｄ−１Ｄ線断面図である。   1A and 1B are diagrams showing a transceiver module according to the present embodiment, where FIG. 1A is a plan view, FIG. 1B is a sectional view taken along line 1B-1B, FIG. 1C is a sectional view taken along line 1C-1C, d) is a sectional view taken along line 1D-1D.

図１（ａ）〜（ｄ）に示すように、送受信モジュール１は、送信側基板２と受信側基板３とを備え、両基板２，３の裏面Ｒ同士を向かい合わせた状態で、両基板２，３を接着固定したものである。   As shown in FIGS. 1A to 1D, the transmission / reception module 1 includes a transmission-side substrate 2 and a reception-side substrate 3, with both substrates 2 and 3 facing each other with their back surfaces R facing each other. 2 and 3 are bonded and fixed.

まず、送信側基板２について説明する。   First, the transmission side substrate 2 will be described.

送信側基板２は、送信側回路基板２１と、送信側回路基板２１の表面Ｆ側に実装された発光素子２２およびこの発光素子２２を駆動するためのドライバＩＣ２３と、送信側回路基板２１の裏面Ｒ側に形成され、送信側光ファイバ２４と光学的に接続される送信側光導波路２５と、送信側光導波路２５に形成された送信側ミラー２６と、を有する。   The transmission side board 2 includes a transmission side circuit board 21, a light emitting element 22 mounted on the front surface F side of the transmission side circuit board 21, a driver IC 23 for driving the light emitting element 22, and a back surface of the transmission side circuit board 21. A transmission side optical waveguide 25 formed on the R side and optically connected to the transmission side optical fiber 24, and a transmission side mirror 26 formed on the transmission side optical waveguide 25.

送信側回路基板２１は、発光素子２２が発光する光に対して透明な材料からなり、例えば、ポリエチレン、アクリル、エポキシ、シリコーンなどの樹脂からなる。本実施の形態では、送信側回路基板２１として、フレキシブルプリント基板（ＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ））を用いる。   The transmission side circuit board 21 is made of a material that is transparent to the light emitted from the light emitting element 22, and is made of, for example, a resin such as polyethylene, acrylic, epoxy, or silicone. In the present embodiment, a flexible printed circuit (FPC (Flexible Printed Circuit)) is used as the transmission-side circuit board 21.

発光素子２２は、例えば、ＶＣＳＥＬ（Ｖｅｒｔｉｃａｌ Ｃａｖｉｔｙ Ｓｕｒｆａｃｅ Ｅｍｉｔｔｉｎｇ Ｌａｓｅｒ）などの面発光素子からなる。発光素子２２とドライバＩＣ２３とは、送信側回路基板２１に形成された図示しない配線パターンにより電気的に接続されている。発光素子２２、ドライバＩＣ２３、および送信側光導波路２５は、送信側回路基板２１の一の側辺側（図１（ａ）では上側）に偏らせて配置される。   The light emitting element 22 is composed of a surface light emitting element such as a VCSEL (Vertical Cavity Surface Emitting Laser), for example. The light emitting element 22 and the driver IC 23 are electrically connected by a wiring pattern (not shown) formed on the transmission side circuit board 21. The light emitting element 22, the driver IC 23, and the transmission side optical waveguide 25 are arranged so as to be biased toward one side of the transmission side circuit board 21 (upper side in FIG. 1A).

送信側光導波路２５は、図示していないが、コアとクラッドとからなる。送信側光導波路２５の一端部（図１（ａ）〜（ｃ）では右側）には、送信側光ファイバ２４を挿入するための溝２５ａが形成されており、その溝２５ａに送信側光ファイバ２４を挿入することで、送信側光ファイバ２４と送信側光導波路２５のコアとが位置合せされ、光学的に接続される。   Although not shown, the transmission side optical waveguide 25 is composed of a core and a clad. A groove 25a for inserting the transmission side optical fiber 24 is formed at one end of the transmission side optical waveguide 25 (right side in FIGS. 1A to 1C), and the transmission side optical fiber is inserted into the groove 25a. By inserting 24, the transmission side optical fiber 24 and the core of the transmission side optical waveguide 25 are aligned and optically connected.

また、送信側光導波路２５には、送信側光導波路２５の光軸に対して４５度傾いた傾斜面を有する送信側ミラー２６が形成される。送信側ミラー２６は、発光素子２２から出射された光の光路を９０度変換して、送信側光導波路２５のコアに入射する。送信側ミラー２６は、ダイシングにより送信側光導波路２５にＶ溝を形成することにより形成される。   The transmission side optical waveguide 25 is formed with a transmission side mirror 26 having an inclined surface inclined by 45 degrees with respect to the optical axis of the transmission side optical waveguide 25. The transmission side mirror 26 converts the optical path of the light emitted from the light emitting element 22 by 90 degrees and enters the core of the transmission side optical waveguide 25. The transmission side mirror 26 is formed by forming a V groove in the transmission side optical waveguide 25 by dicing.

送信側回路基板２１の裏面Ｒには、スパッタリング又は真空蒸着により形成された金属膜からなる送信側グランド層２７が形成される。また、図示していないが、送信側回路基板２１の他端部（送信側光ファイバ２４が接続される側と反対側、図１（ａ）〜（ｃ）では左側）の表面Ｆには、接続端子が整列して形成され、カードエッジコネクタ４が形成され、ドライバＩＣ２３と電気的に接続されている。   A transmission side ground layer 27 made of a metal film formed by sputtering or vacuum deposition is formed on the back surface R of the transmission side circuit board 21. Moreover, although not shown in figure, on the surface F of the other end part of the transmission side circuit board 21 (the side opposite to the side to which the transmission side optical fiber 24 is connected, the left side in FIGS. 1A to 1C), The connection terminals are formed in alignment, the card edge connector 4 is formed, and is electrically connected to the driver IC 23.

次に、受信側基板３について説明する。   Next, the receiving side substrate 3 will be described.

受信側基板３は、受信側回路基板３１と、受信側回路基板３１の表面Ｆ側に実装された受光素子３２およびこの受光素子３２からの電気信号を増幅するためのアンプＩＣ３３と、受信側回路基板３１の裏面Ｒ側に形成され、受信側光ファイバ３４と光学的に接続される受信側光導波路３５と、受信側光導波路３５に形成された受信側ミラー３６と、を有する。   The reception side substrate 3 includes a reception side circuit substrate 31, a light receiving element 32 mounted on the surface F side of the reception side circuit substrate 31, an amplifier IC 33 for amplifying an electric signal from the light reception element 32, and a reception side circuit. A reception-side optical waveguide 35 that is formed on the rear surface R side of the substrate 31 and is optically connected to the reception-side optical fiber 34, and a reception-side mirror 36 that is formed in the reception-side optical waveguide 35.

受信側回路基板３１は、受光素子３２が受光する光に対して透明な材料からなり、例えば、ポリエチレン、アクリル、エポキシ、シリコーンなどの樹脂からなる。本実施の形態では、受信側回路基板３１として、フレキシブルプリント基板（ＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ））を用いる。   The receiving circuit board 31 is made of a material that is transparent to light received by the light receiving element 32, and is made of, for example, a resin such as polyethylene, acrylic, epoxy, or silicone. In the present embodiment, a flexible printed circuit (FPC (Flexible Printed Circuit)) is used as the receiving circuit board 31.

受光素子３２は、例えば、ＰＤ（Ｐｈｏｔｏ Ｄｉｏｄｅ）などの面受光素子からなる。受光素子３２とアンプＩＣ３３とは、受信側回路基板３１に形成された図示しない配線パターンにより電気的に接続されている。受光素子３２、アンプＩＣ３３、および受信側光導波路３５は、受信側回路基板３１の一の側辺側（図１（ａ）では下側）に偏らせて配置される。   The light receiving element 32 is composed of a surface light receiving element such as PD (Photo Diode), for example. The light receiving element 32 and the amplifier IC 33 are electrically connected by a wiring pattern (not shown) formed on the receiving side circuit board 31. The light receiving element 32, the amplifier IC 33, and the reception side optical waveguide 35 are arranged so as to be biased toward one side of the reception side circuit board 31 (lower side in FIG. 1A).

受信側光導波路３５は、図示していないが、コアとクラッドとからなる。受信側光導波路３５の一端部（図１（ａ）〜（ｃ）では右側）には、受信側光ファイバ３４を挿入するための溝３５ａが形成されており、その溝３５ａに受信側光ファイバ３４を挿入することで、受信側光ファイバ３４と受信側光導波路３５のコアとが位置合せされ、光学的に接続される。   Although not shown, the reception-side optical waveguide 35 includes a core and a clad. A groove 35a for inserting the reception side optical fiber 34 is formed at one end of the reception side optical waveguide 35 (on the right side in FIGS. 1A to 1C), and the reception side optical fiber is formed in the groove 35a. By inserting 34, the reception-side optical fiber 34 and the core of the reception-side optical waveguide 35 are aligned and optically connected.

また、受信側光導波路３５には、受信側光導波路３５の光軸に対して４５度傾いた傾斜面を有する受信側ミラー３６が形成される。受信側ミラー３６は、受信側光導波路３５のコアを伝搬する光の光路を９０度変換し、受光素子３２に入射する。受信側ミラー３６は、ダイシングにより受信側光導波路３５にＶ溝を形成することにより形成される。   The reception side optical waveguide 35 is formed with a reception side mirror 36 having an inclined surface inclined by 45 degrees with respect to the optical axis of the reception side optical waveguide 35. The reception side mirror 36 converts the optical path of light propagating through the core of the reception side optical waveguide 35 by 90 degrees and enters the light receiving element 32. The receiving side mirror 36 is formed by forming a V groove in the receiving side optical waveguide 35 by dicing.

受光素子３２および受信側ミラー３６は、発光素子２２および送信側ミラー２６を形成した位置よりも、光ファイバ２４，３４側に設けられる。換言すれば、発光素子２２および送信側ミラー２６は、受光素子３２および受信側ミラー３６よりも、両光ファイバ２４，３４から離れた位置にオフセットして設けられる。   The light receiving element 32 and the receiving side mirror 36 are provided closer to the optical fibers 24 and 34 than the position where the light emitting element 22 and the transmitting side mirror 26 are formed. In other words, the light-emitting element 22 and the transmission-side mirror 26 are provided offset from the light-receiving element 32 and the reception-side mirror 36 at positions away from both the optical fibers 24 and 34.

受信側回路基板３１の裏面Ｒには、スパッタリング又は真空蒸着により形成された金属膜からなる受信側グランド層３７が形成される。また、図示していないが、受信側回路基板３１の他端部（受信側光ファイバ３４が接続される側と反対側、図１（ａ）〜（ｃ）では左側）の表面Ｆ側には、接続端子が整列して形成され、カードエッジコネクタ４が形成され、アンプＩＣ３３と電気的に接続されている。   A reception-side ground layer 37 made of a metal film formed by sputtering or vacuum deposition is formed on the back surface R of the reception-side circuit board 31. Although not shown, on the surface F side of the other end of the reception side circuit board 31 (on the opposite side to the side where the reception side optical fiber 34 is connected, the left side in FIGS. 1A to 1C). The connection terminals are formed in alignment, the card edge connector 4 is formed, and is electrically connected to the amplifier IC 33.

送受信モジュール１は、送信側基板２と受信側基板３の裏面Ｒ同士を向かい合わせた状態で、両基板２，３を接着剤５により接着固定して形成される。   The transmission / reception module 1 is formed by bonding and fixing the substrates 2 and 3 with an adhesive 5 in a state where the back surfaces R of the transmission side substrate 2 and the reception side substrate 3 face each other.

このとき、送信側光導波路２５が送信側回路基板２１の一の側辺側に偏らせて配置されており、かつ、受信側光導波路３５が受信側回路基板３１の一の側辺側に偏らせて配置されているため、両光導波路２５，３５が重なって干渉してしまうことはない。さらに、送受信モジュール１の長手方向（光ファイバ２４，３４の挿入方向）で両ミラー２６，３６の位置をずらして両ミラー２６，３６間の距離をより大きくすることによって、両光導波路２５，３５間の光のクロストークの影響を小さくすることができる。また、送受信モジュール１の長手方向で両ＩＣ２３，３３の位置をずらして両ＩＣ２３，３３間の距離をより大きくすることによって、両ＩＣ２３，３３間の電気のクロストークの影響を小さくすることができる。   At this time, the transmission side optical waveguide 25 is arranged so as to be biased toward one side of the transmission side circuit board 21, and the reception side optical waveguide 35 is biased toward one side of the reception side circuit board 31. Therefore, the optical waveguides 25 and 35 do not overlap and interfere with each other. Further, by shifting the positions of the mirrors 26 and 36 in the longitudinal direction of the transmission / reception module 1 (the insertion direction of the optical fibers 24 and 34), the distance between the mirrors 26 and 36 is further increased, whereby both the optical waveguides 25 and 35 are obtained. It is possible to reduce the influence of light crosstalk between them. Further, by shifting the positions of the ICs 23 and 33 in the longitudinal direction of the transmission / reception module 1 and increasing the distance between the ICs 23 and 33, the influence of electrical crosstalk between the ICs 23 and 33 can be reduced. .

また、両基板２，３の裏面同士を向かい合わせて接着固定すると、両基板２，３の間には、両グランド層２７，３７が介在することになる。これら両グランド層２７，３７により、両基板２，３間のクロストーク（送受信間のクロストーク）を抑制することが可能になる。なお、両グランド層２７，３７は、例えば、スルーホールを介して両回路基板２１，３１の表面Ｆ側の配線パターン（グランドパターン）に電気的に接続され、カードエッジコネクタ４を介して、接続対象の機器のグランドに電気的に接続される。   Further, when the back surfaces of both substrates 2 and 3 are faced to each other and bonded and fixed, both ground layers 27 and 37 are interposed between both substrates 2 and 3. These ground layers 27 and 37 can suppress crosstalk between the substrates 2 and 3 (crosstalk between transmission and reception). Both the ground layers 27 and 37 are electrically connected to the wiring pattern (ground pattern) on the surface F side of both circuit boards 21 and 31 through, for example, through holes, and connected through the card edge connector 4. It is electrically connected to the ground of the target device.

両基板２，３を接着固定する際に用いる接着剤５としては、特に限定されるものではないが、例えば、ＵＶ硬化性樹脂、熱硬化性樹脂などを用いるとよい。   The adhesive 5 used when the substrates 2 and 3 are bonded and fixed is not particularly limited. For example, a UV curable resin or a thermosetting resin may be used.

次に、送受信モジュール１の製造方法について図２を用いて説明する。   Next, the manufacturing method of the transmission / reception module 1 is demonstrated using FIG.

送受信モジュール１を製造する際には、まず、図２（ａ）に示すように、送信側回路基板２１の裏面Ｒに送信側光導波路２５を形成し、図２（ｂ）に示すように、ダイシングによりＶ溝を形成して送信側ミラー２６を形成する。   When manufacturing the transmission / reception module 1, first, as shown in FIG. 2A, the transmission side optical waveguide 25 is formed on the back surface R of the transmission side circuit board 21, and as shown in FIG. The transmission side mirror 26 is formed by forming a V groove by dicing.

その後、図２（ｃ）に示すように、送信側回路基板２１の裏面Ｒ側に、スパッタリング又は真空蒸着により金属膜を形成して送信側グランド層２７を形成する。なお、この送信側グランド層２７は、ダイシングにより形成されたＶ溝内にも形成され、送信側ミラー２６における反射膜の役割も兼ねることになる。   Thereafter, as shown in FIG. 2C, a transmission-side ground layer 27 is formed by forming a metal film on the back surface R side of the transmission-side circuit board 21 by sputtering or vacuum deposition. The transmission-side ground layer 27 is also formed in a V-groove formed by dicing, and also serves as a reflection film in the transmission-side mirror 26.

送信側グランド層２７を形成した後、図２（ｄ）に示すように、送信側回路基板２１の表面Ｆに発光素子２２とドライバＩＣ２３を実装する。その後、図２（ｅ）に示すように、送信側光導波路２５の一端部に溝２５ａを形成して、その溝２５ａに送信側光ファイバ２４を挿入することで、送信側光ファイバ２４を送信側回路基板２１に実装する。以上により、送信側基板２が得られる。   After the transmission-side ground layer 27 is formed, the light emitting element 22 and the driver IC 23 are mounted on the surface F of the transmission-side circuit board 21 as shown in FIG. Thereafter, as shown in FIG. 2E, a groove 25a is formed at one end of the transmission-side optical waveguide 25, and the transmission-side optical fiber 24 is inserted into the groove 25a, thereby transmitting the transmission-side optical fiber 24. Mounted on the side circuit board 21. Thus, the transmission side substrate 2 is obtained.

送信側基板２を形成した後、図２（ａ）〜（ｅ）で説明した同様の手順で受信側基板３を形成し、図２（ｆ）に示すように、両基板２，３の裏面Ｒ同士を向かい合わせる。その後、図２（ｇ）に示すように、両基板２，３を接着剤５で接着固定すると、送受信モジュール１が得られる。なお、図２（ａ）〜（ｆ）では断面図を示しているが、図２（ｇ）では側面図を示している。   After the transmission side substrate 2 is formed, the reception side substrate 3 is formed by the same procedure described in FIGS. 2A to 2E, and the back surfaces of both the substrates 2 and 3 are formed as shown in FIG. Rs face each other. Thereafter, as shown in FIG. 2 (g), when the substrates 2 and 3 are bonded and fixed with the adhesive 5, the transceiver module 1 is obtained. 2A to 2F show cross-sectional views, but FIG. 2G shows a side view.

以上説明したように、本実施の形態に係る送受信モジュール１では、送信側回路基板２１の表面Ｆ側に、発光素子２２およびドライバＩＣ２３を実装すると共に、その裏面Ｒ側に送信側ミラー２６を有する送信側光導波路２５を形成した送信側基板２と、受信側回路基板３１の表面Ｆ側に、受光素子３２およびアンプＩＣ３３を実装すると共に、その裏面Ｒ側に受信側ミラー３６を有する受信側光導波路３５を形成した受信側基板３とを備え、これら両基板２，３の裏面Ｒ同士を向かい合わせた状態で、両基板２，３を接着固定している。   As described above, in the transmission / reception module 1 according to the present embodiment, the light emitting element 22 and the driver IC 23 are mounted on the front surface F side of the transmission side circuit board 21 and the transmission side mirror 26 is provided on the rear surface R side thereof. The light receiving element 32 and the amplifier IC 33 are mounted on the front surface F side of the transmission side substrate 2 on which the transmission side optical waveguide 25 is formed and the reception side circuit substrate 31, and the reception side optical fiber having the reception side mirror 36 on the back surface R side. The receiving substrate 3 having the waveguide 35 is provided, and the substrates 2 and 3 are bonded and fixed in a state where the back surfaces R of the substrates 2 and 3 face each other.

送受信モジュール１では、発光素子２２とドライバＩＣ２３を同じ平面（送信側回路基板２１の表面Ｆ）に、受光素子３２とアンプＩＣ３３を同じ平面（受信側回路基板３１の表面Ｆ）に実装するため、光素子２２，３２とＩＣ２３，３３の実装が容易であり、さらには、特許文献１の光モジュールのように正面から側面に回り込むような配線パターンを形成する必要がないため、製造が容易である。   In the transmission / reception module 1, the light emitting element 22 and the driver IC 23 are mounted on the same plane (surface F of the transmission side circuit board 21), and the light receiving element 32 and the amplifier IC 33 are mounted on the same plane (surface F of the reception side circuit board 31). The optical elements 22 and 32 and the ICs 23 and 33 can be easily mounted. Further, unlike the optical module disclosed in Patent Document 1, it is not necessary to form a wiring pattern that wraps around from the front to the side. .

また、送受信モジュール１では、特許文献１の光モジュールのような直方体状の実装部材を用いておらず、２つの基板２，３を積層した構造であるため、送受信モジュール１全体を薄くすることが可能である。よって、送受信モジュール１を小型化することができる。従来の特許文献１の光モジュールでは、光素子とＩＣの実装を容易とすれば小型化が困難になるという問題があったが、本発明によれば、光素子２２，３２とＩＣ２３，３３を容易に実装でき、その上、送受信モジュール１を小型化できることになる。   In addition, the transmission / reception module 1 does not use a rectangular parallelepiped mounting member like the optical module of Patent Document 1, and has a structure in which two substrates 2 and 3 are laminated. Is possible. Therefore, the transmission / reception module 1 can be reduced in size. In the conventional optical module of Patent Document 1, there is a problem that it is difficult to reduce the size if the optical element and the IC are easily mounted. However, according to the present invention, the optical elements 22 and 32 and the ICs 23 and 33 are provided. In addition, the transceiver module 1 can be downsized.

さらに、特許文献１の光モジュールでは、実装部材に厚みがあるので、カードエッジコネクタを使用することはできなかったが、これに対して、送受信モジュール１では、送受信モジュール１全体を薄くできるので、カードエッジコネクタを使用することが可能となる。   Furthermore, in the optical module of Patent Document 1, since the mounting member has a thickness, the card edge connector cannot be used. On the other hand, in the transmission / reception module 1, the entire transmission / reception module 1 can be thinned. A card edge connector can be used.

さらにまた、送受信モジュール１では、送信側基板２と受信側基板３を別個に形成して、その後両基板２，３を接着固定するため、ダイシング等によりミラー２６，３６を容易に形成することが可能である。通常、積層基板などにおいて中間層にミラーを形成することは非常に困難であるが、本実施の形態では送信側基板２と受信側基板３を別々に形成することにより、ミラー２６，３６を簡便に形成可能としている。   Furthermore, in the transmission / reception module 1, the transmission side substrate 2 and the reception side substrate 3 are formed separately, and then the both substrates 2 and 3 are bonded and fixed. Therefore, the mirrors 26 and 36 can be easily formed by dicing or the like. Is possible. Normally, it is very difficult to form a mirror on an intermediate layer in a laminated substrate or the like, but in this embodiment, the mirrors 26 and 36 can be simplified by forming the transmitting side substrate 2 and the receiving side substrate 3 separately. Can be formed.

また、送受信モジュール１では、両基板２，３の間にグランド層２７，３７を形成しているため、両基板２，３間のクロストークを抑制することが可能である。送受信モジュール１では、送信と受信が両基板２，３に完全に分かれているので、両基板２，３間にグランド層２７，３７を形成することで、送受信間のクロストークを防止できる。なお、本実施の形態では、両基板２，３にグランド層２７，３７を形成する場合を説明したが、いずれか一方のみを形成するようにしてもよい。   In the transmission / reception module 1, since the ground layers 27 and 37 are formed between the two substrates 2 and 3, it is possible to suppress crosstalk between the both substrates 2 and 3. In the transmission / reception module 1, transmission and reception are completely separated on both the boards 2 and 3, so that crosstalk between transmission and reception can be prevented by forming the ground layers 27 and 37 between the both boards 2 and 3. In the present embodiment, the case where the ground layers 27 and 37 are formed on both the substrates 2 and 3 has been described, but only one of them may be formed.

さらに、送受信モジュール１では、発光素子２２および送信側光導波路２５を、送信側回路基板２１の一の側辺側に偏らせて配置すると共に、受光素子３２および受信側光導波路３５を、受信側回路基板３１の一の側辺側に偏らせて配置して、送信側光導波路２５と受信側光導波路３５とが重ならないようにしているため、送受信モジュール１をさらに薄くし、小型化を図ることが可能となる。   Further, in the transmission / reception module 1, the light emitting element 22 and the transmission side optical waveguide 25 are arranged so as to be biased toward one side of the transmission side circuit board 21, and the light receiving element 32 and the reception side optical waveguide 35 are disposed on the reception side. Since the transmission side optical waveguide 25 and the reception side optical waveguide 35 are arranged so as to be biased toward one side of the circuit board 31, the transmission / reception module 1 is further thinned and reduced in size. It becomes possible.

さらにまた、送受信モジュール１では、発光素子２２および送信側ミラー２６を、受光素子３２および受信側ミラー３６よりも、両光ファイバ２４，３４から離れた位置に設けているため、発光素子２２からの光が漏れて受光素子３２に直接受光されたり、あるいは発光素子２２からの光が漏れて受信側光導波路３５のコアに光結合してしまうことを防止できる。なお、本実施の形態では、発光素子２２と受光素子３２とを幅方向（図１（ａ）では上下方向）にオフセットしているが、この場合でも、オフセット量が少なければ発光素子２２からの光が漏れて受光素子３２に受光されてしまう場合がある。よって、発光素子２２と受光素子３２とをさらに長さ方向（図１（ａ）では左右方向）にもオフセットして、発光素子２２からの光が漏れたとしても受光素子３２に受光されることがないよう構成することが望ましい。   Furthermore, in the transmission / reception module 1, the light emitting element 22 and the transmission side mirror 26 are provided at positions farther from the optical fibers 24 and 34 than the light receiving element 32 and the reception side mirror 36. It is possible to prevent light from leaking and being directly received by the light receiving element 32, or light from the light emitting element 22 from leaking and being optically coupled to the core of the receiving side optical waveguide 35. In the present embodiment, the light-emitting element 22 and the light-receiving element 32 are offset in the width direction (vertical direction in FIG. 1A). Light may leak and be received by the light receiving element 32. Therefore, even if the light emitting element 22 and the light receiving element 32 are further offset in the length direction (left and right direction in FIG. 1A) and light from the light emitting element 22 leaks, the light receiving element 32 receives the light. It is desirable to configure so that there is no.

次に、本発明の他の実施の形態を説明する。   Next, another embodiment of the present invention will be described.

図３（ａ）〜（ｃ）に示す送受信モジュール３０は、図１の送受信モジュール１において、両基板２，３を接着固定した後に、光ファイバ２４，３４を接続するようにしたものである。   The transmission / reception module 30 shown in FIGS. 3A to 3C is obtained by connecting the optical fibers 24 and 34 after the substrates 2 and 3 are bonded and fixed in the transmission / reception module 1 of FIG.

具体的には、送受信モジュール３０では、送信側回路基板２１の一端部に、受信側光ファイバ３４を通すための切欠き２８が形成され、かつ、受信側回路基板３１の一端部に、送信側光ファイバ２４を通すための切欠き３８が形成される。   Specifically, in the transmission / reception module 30, a notch 28 for passing the reception side optical fiber 34 is formed at one end of the transmission side circuit board 21, and the transmission side A notch 38 for passing the optical fiber 24 is formed.

送信側光ファイバ２４は、切欠き３８を通して溝２５ａ内に挿入され、送信側光導波路２５と光学的に接続される。送信側光ファイバ２４の上方（受信側回路基板３１側、図３（ｂ）では下側）には、送信側光ファイバ２４を固定して抜けを防ぐための固定ジグ３９が設けられる。   The transmission side optical fiber 24 is inserted into the groove 25 a through the notch 38 and optically connected to the transmission side optical waveguide 25. Above the transmission side optical fiber 24 (on the reception side circuit board 31 side, the lower side in FIG. 3B), a fixing jig 39 is provided to fix the transmission side optical fiber 24 and prevent it from coming off.

同様に、受信側光ファイバ３４は、切欠き２８を通して溝３５ａ内に挿入され、受信側光導波路３５と光学的に接続される。受信側光ファイバ３４の上方（送信側回路基板２１側、図３（ｃ）では上側）には、受信側光ファイバ３４を固定して抜けを防ぐための固定ジグ２９が設けられる。   Similarly, the reception side optical fiber 34 is inserted into the groove 35 a through the notch 28 and optically connected to the reception side optical waveguide 35. Above the reception side optical fiber 34 (on the transmission side circuit board 21 side, the upper side in FIG. 3C), a fixing jig 29 is provided to fix the reception side optical fiber 34 and prevent it from coming off.

送受信モジュール３０によれば、両基板２，３を接着固定した後に光ファイバ２４，３４を接続することができるので、両基板２，３を接着固定する際に光ファイバ２４，３４が邪魔になることがなく、送受信モジュール３０をより容易に製造することが可能となる。   According to the transmission / reception module 30, since the optical fibers 24 and 34 can be connected after the substrates 2 and 3 are bonded and fixed, the optical fibers 24 and 34 become an obstacle when the substrates 2 and 3 are bonded and fixed. Therefore, the transmission / reception module 30 can be manufactured more easily.

上記実施の形態では、グランド層２７，３７として、スパッタリング又は真空蒸着により形成された金属膜を用いたが、これに限らず、接着剤５に導電性の接着剤を用い、接着剤５が固化して形成される接着層をグランド層としてもよい。導電性の接着剤としては、例えば、銀微粒子を含むエポキシ樹脂などが挙げられる。この場合、接着剤を固化する際に加熱により銀微粒子を焼結させて、導電性を得るようにすればよい。   In the above embodiment, a metal film formed by sputtering or vacuum deposition is used as the ground layers 27 and 37. However, the present invention is not limited to this, and a conductive adhesive is used as the adhesive 5 so that the adhesive 5 is solidified. The adhesive layer formed in this manner may be a ground layer. Examples of the conductive adhesive include an epoxy resin containing silver fine particles. In this case, when solidifying the adhesive, the silver fine particles may be sintered by heating to obtain conductivity.

また、上記実施の形態では、両回路基板２１，３１として、発光素子２２が発光する光、あるいは受光素子３２が受光する光に対して透明な材料を用いたが、これに限らず、両回路基板２１，３１として、発光素子２２が発光する光、あるいは受光素子３２が受光する光に対して不透明な材料を用い、光が通る部分にスルーホールを形成するようにしてもよい。   Moreover, in the said embodiment, although the transparent material was used with respect to the light which the light emitting element 22 light-emits, or the light which the light receiving element 32 light-receives as both the circuit boards 21 and 31, not only this but both circuits As the substrates 21 and 31, a material opaque to the light emitted from the light emitting element 22 or the light received by the light receiving element 32 may be used, and a through hole may be formed in a portion through which the light passes.

このように、本発明は、上述した実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で種々の変更が可能である。   Thus, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

１ 送受信モジュール
２ 送信側基板
３ 受信側基板
２１ 送信側回路基板
２２ 発光素子
２３ ドライバＩＣ
２４ 送信側光ファイバ
２５ 送信側光導波路
２６ 送信側ミラー
２７ 送信側グランド層
３１ 受信側回路基板
３２ 受光素子
３３ アンプＩＣ
３４ 受信側光ファイバ
３５ 受信側光導波路
３６ 受信側ミラー
３７ 受信側グランド層 DESCRIPTION OF SYMBOLS 1 Transmission / reception module 2 Transmission side board | substrate 3 Reception side board | substrate 21 Transmission side circuit board 22 Light emitting element 23 Driver IC
24 transmitting-side optical fiber 25 transmitting-side optical waveguide 26 transmitting-side mirror 27 transmitting-side ground layer 31 receiving-side circuit board 32 light-receiving element 33 amplifier IC
34 Reception-side optical fiber 35 Reception-side optical waveguide 36 Reception-side mirror 37 Reception-side ground layer

Claims (7)

送信側回路基板と、該送信側回路基板の表面側に実装された発光素子およびドライバＩＣと、前記送信側回路基板の裏面側に形成され、送信側光ファイバと光学的に接続される送信側光導波路と、該送信側光導波路に形成され、前記発光素子から出射された光の光路を９０度変換して前記送信側光導波路のコアに入射する送信側ミラーと、を有する送信側基板と、
受信側回路基板と、該受信側回路基板の表面側に実装された受光素子およびアンプＩＣと、前記受信側回路基板の裏面側に形成され、受信側光ファイバと光学的に接続される受信側光導波路と、該受信側光導波路に形成され、前記受信側光導波路のコアを伝搬する光の光路を９０度変換して前記受光素子に入射する受信側ミラーと、を有する受信側基板と、を備え、
前記両基板の裏面同士を向かい合わせた状態で固定してなることを特徴とする送受信モジュール。 A transmission side circuit board, a light emitting element and a driver IC mounted on the front side of the transmission side circuit board, and a transmission side formed on the back side of the transmission side circuit board and optically connected to the transmission side optical fiber A transmission-side substrate comprising: an optical waveguide; and a transmission-side mirror that is formed in the transmission-side optical waveguide, converts the optical path of light emitted from the light-emitting element by 90 degrees, and enters the core of the transmission-side optical waveguide; ,
A receiving side circuit board, a light receiving element and an amplifier IC mounted on the front side of the receiving side circuit board, and a receiving side formed on the back side of the receiving side circuit board and optically connected to the receiving side optical fiber A reception-side substrate having an optical waveguide, and a reception-side mirror that is formed in the reception-side optical waveguide, converts a light path of light propagating through the core of the reception-side optical waveguide by 90 degrees, and enters the light-receiving element; With
A transceiver module characterized by being fixed with the back surfaces of the two substrates facing each other. 前記両基板の間には、グランド層が形成される請求項１記載の送受信モジュール。   The transmission / reception module according to claim 1, wherein a ground layer is formed between the two substrates. 前記グランド層は、前記送信側基板の裏面及び／又は前記受信側基板の裏面にスパッタリング又は真空蒸着により形成された金属膜からなる請求項２記載の送受信モジュール。   The transmission / reception module according to claim 2, wherein the ground layer is made of a metal film formed by sputtering or vacuum deposition on a back surface of the transmission side substrate and / or a back surface of the reception side substrate. 前記グランド層は、前記両基板を導電性の接着剤で接着固定して形成される接着層からなる請求項２記載の送受信モジュール。   The transmission / reception module according to claim 2, wherein the ground layer is formed of an adhesive layer formed by bonding and fixing the two substrates with a conductive adhesive. 前記発光素子および前記送信側光導波路を、前記送信側回路基板の一の側辺側に偏らせて配置すると共に、
前記受光素子および前記受信側光導波路を、前記受信側回路基板の一の側辺側に偏らせて配置し、
前記両基板の裏面同士を向かい合わせた際に、前記送信側光導波路と前記受信側光導波路とが重ならないようにされる請求項１〜４いずれかに記載の送受信モジュール。 The light emitting element and the transmission side optical waveguide are arranged so as to be biased toward one side of the transmission side circuit board, and
The light receiving element and the receiving side optical waveguide are arranged so as to be biased toward one side of the receiving side circuit board,
The transmission / reception module according to any one of claims 1 to 4, wherein the transmission-side optical waveguide and the reception-side optical waveguide are prevented from overlapping when the back surfaces of the two substrates face each other. 前記発光素子および前記送信側ミラーは、前記受光素子および前記受信側ミラーよりも、前記両光ファイバから離れた位置に設けられる請求項１〜５いずれかに記載の送受信モジュール。   The transmission / reception module according to any one of claims 1 to 5, wherein the light-emitting element and the transmission-side mirror are provided at positions farther from the both optical fibers than the light-receiving element and the reception-side mirror. 前記両回路基板の端部に接続端子を形成してなるカードエッジコネクタを備えた請求項１〜６いずれに記載の送受信モジュール。   The transmission / reception module according to any one of claims 1 to 6, further comprising a card edge connector in which connection terminals are formed at ends of the circuit boards.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013105470A1 (en) * 2012-01-10 2013-07-18 日立化成株式会社 Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
US9500819B2 (en) 2015-04-27 2016-11-22 Fujitsu Limited Optical module
JP2018036550A (en) * 2016-09-01 2018-03-08 ヒロセ電機株式会社 Method for manufacturing photoelectric conversion connector, photoelectric conversion connector and photoelectric conversion connector device using the same
JP2020201509A (en) * 2020-08-31 2020-12-17 ヒロセ電機株式会社 Method for manufacturing photoelectric conversion connector, photoelectric conversion connector and photoelectric conversion connector device using the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088818A (en) * 1994-06-17 1996-01-12 Hitachi Cable Ltd Electronic circuit with integrated optical transmission reception module
JP2003133631A (en) * 2001-10-30 2003-05-09 Sumitomo Electric Ind Ltd Optical transceiver
JP2003185887A (en) * 2001-12-13 2003-07-03 Kyocera Corp Optical semiconductor device
JP2003197956A (en) * 2001-12-27 2003-07-11 Seiko Epson Corp Light emitting/receiving device and optical communication system
JP2003329894A (en) * 2002-05-13 2003-11-19 Sumitomo Electric Ind Ltd Card edge type optical communication module and optical communication equipment
JP2009162882A (en) * 2007-12-28 2009-07-23 Hitachi Cable Ltd Optical transmission assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088818A (en) * 1994-06-17 1996-01-12 Hitachi Cable Ltd Electronic circuit with integrated optical transmission reception module
JP2003133631A (en) * 2001-10-30 2003-05-09 Sumitomo Electric Ind Ltd Optical transceiver
JP2003185887A (en) * 2001-12-13 2003-07-03 Kyocera Corp Optical semiconductor device
JP2003197956A (en) * 2001-12-27 2003-07-11 Seiko Epson Corp Light emitting/receiving device and optical communication system
JP2003329894A (en) * 2002-05-13 2003-11-19 Sumitomo Electric Ind Ltd Card edge type optical communication module and optical communication equipment
JP2009162882A (en) * 2007-12-28 2009-07-23 Hitachi Cable Ltd Optical transmission assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013105470A1 (en) * 2012-01-10 2013-07-18 日立化成株式会社 Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
US20140321807A1 (en) * 2012-01-10 2014-10-30 Hitachi Chemical Company, Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
JPWO2013105470A1 (en) * 2012-01-10 2015-05-11 日立化成株式会社 Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
US9442251B2 (en) 2012-01-10 2016-09-13 Hitachi Chemical Company, Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
US9500819B2 (en) 2015-04-27 2016-11-22 Fujitsu Limited Optical module
JP2018036550A (en) * 2016-09-01 2018-03-08 ヒロセ電機株式会社 Method for manufacturing photoelectric conversion connector, photoelectric conversion connector and photoelectric conversion connector device using the same
JP2020201509A (en) * 2020-08-31 2020-12-17 ヒロセ電機株式会社 Method for manufacturing photoelectric conversion connector, photoelectric conversion connector and photoelectric conversion connector device using the same
JP6992137B2 (en) 2020-08-31 2022-01-13 ヒロセ電機株式会社 Manufacturing method of opto-electric conversion connector, opto-electric conversion connector and opto-electric conversion connector device using it

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