JP2011181854A - Conductive connecting method to upper and lower layers of conductive circuit board - Google Patents

Conductive connecting method to upper and lower layers of conductive circuit board Download PDF

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JP2011181854A
JP2011181854A JP2010047203A JP2010047203A JP2011181854A JP 2011181854 A JP2011181854 A JP 2011181854A JP 2010047203 A JP2010047203 A JP 2010047203A JP 2010047203 A JP2010047203 A JP 2010047203A JP 2011181854 A JP2011181854 A JP 2011181854A
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conductive
opening
conductive circuit
circuit
lower layers
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JP5410338B2 (en
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Katsuya Hiroshige
勝也 広繁
Koichi Hiroshige
孝一 広繁
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SAGAMI SHOKAI KK
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<P>PROBLEM TO BE SOLVED: To solve such a problem that the cracks and deposition failures of plating, which are caused by such a current method used in forming a double-sided circuit and a multilayer circuit, for a printed board that through-holes are drilled into a printed board and plated and then connected to a conductive circuit on each layer with plating for interlayer conductive connections. <P>SOLUTION: An electrical connecting method to upper and lower layers of a conductive circuit board includes steps of forming a conductive circuit 3 with aperture in a fibrous base material 1 with aperture, and bending the conductive circuit 3 up- and down-ward in order to carry out electrical connection to another conductive circuit 5 or to electronic parts 11 of the upper and lower layers. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明はＬＳＩ等の接点部品と導電基板とを一体に結合導通するように、開口部を有する繊維状基材、開口部を持つシート状基材に導電回路を形成し、その導電回路と他の導電回路を金属メッキ等で導電接続をした導電回路基板の上・下層への導電接続法に関するものである。   In the present invention, a conductive circuit is formed on a fibrous base material having an opening and a sheet-like base material having an opening so that the contact parts such as LSI and the conductive substrate are integrally connected. The conductive circuit is connected to the upper and lower layers of a conductive circuit board in which the conductive circuit is conductively connected by metal plating or the like.

従来技術としては、プリント基板等の導電基板とＬＳＩ等の多接点部品との接合方法において、化学繊維、金属繊維、天然繊維等を編んだメッシュシート又は多数の微細孔からなる多孔シートに、ＬＳＩ等の多接点部品の接合部と、プリント基板等の導電基板の導電パターンとを表裏両面で導通するための貫通した導電部を設けて導電シートを形成し、該導電シートを導電基板とＬＳＩ等の多接点部品の間に配設し、導電基板の導電パターンとＬＳＩ等の接合部とを一体に結合導通するプリント基板等の導電基板とＬＳＩ等の多接点部品との接合方法（例えば、特許文献１参照）が存在している。   As a conventional technique, in a method of joining a conductive substrate such as a printed circuit board and a multi-contact part such as LSI, LSI is applied to a mesh sheet knitted with chemical fibers, metal fibers, natural fibers, or a porous sheet made up of a large number of fine holes. A conductive sheet is formed by providing a conductive part that penetrates the joint part of a multi-contact part such as a conductive pattern of a conductive substrate such as a printed circuit board on both front and back surfaces, and the conductive sheet is formed on the conductive substrate and the LSI. A method of joining a conductive substrate such as a printed circuit board and a multi-contact component such as an LSI (for example, a patent) Reference 1) exists.

特許第２８４１０４５号公報（特許請求の範囲の欄、発明の詳細な説明の欄の｛発明の実施の形態｝の段落｛０００５｝〜｛０００８｝、及び図１〜図３を参照）Japanese Patent No. 2841045 (refer to the paragraphs {0005} to {0008} of {DETAILED DESCRIPTION OF THE INVENTION} in the column of “Claims” and “Detailed Description of the Invention” and FIGS. 1 to 3)

しかしながら、近年電子機器は小型化が進み、プリント基板も携帯電話、デジタルカメラ、パソコンに代表されるように、薄く、屈曲するフレキシブルな導電回路基板が求められている。
また、前記従来技術は、現状では導電接続材（コネクター）は平面状であり、平面で接触させるため、平面全面に金メッキを施さなければならず、金の使用量が多くなり、近年の貴金属の高騰にみられる如く、少しでも金の使用量を減らす必要があるという問題があった。
また、プリント基板での両面回路、多層回路を形成する層間導電接続は現状では、プリント基板に孔を穿設し、その孔にメッキ加工、各層の導電回路にメッキで接続をしている。これでは、メッキのクラックや析出不良が生じ、導電回路基板の上・下層への導電接続法としては問題であった。
本発明は、これらの問題を解決した導電回路基板の上・下層への導電接続法を提供するものである。 However, in recent years, electronic devices have been reduced in size, and printed circuit boards are required to be thin and flexible conductive circuit boards, as represented by mobile phones, digital cameras, and personal computers.
In addition, in the conventional technology, the conductive connecting material (connector) is in a flat shape at present, and since it is brought into contact with a flat surface, the entire flat surface must be plated with gold, and the amount of gold used is increased. There was a problem that it was necessary to reduce the amount of gold used as much as possible.
Further, interlayer conductive connection for forming a double-sided circuit and a multilayer circuit on a printed circuit board is currently made by forming holes in the printed circuit board, plating the holes, and connecting the conductive circuits of each layer by plating. This causes plating cracks and deposition defects, which is a problem as a conductive connection method to the upper and lower layers of the conductive circuit board.
The present invention provides a conductive connection method to the upper and lower layers of a conductive circuit board that solves these problems.

上記の目的を達成することができる本発明の第１発明は、請求項１に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つ繊維状基材に、開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する構成である。 A first invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in claim 1, and is as follows.
A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other upper and lower conductive circuits and electronic components. .

上記の目的を達成することができる本発明の第２発明は、請求項２に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つシート状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する構成である。 The second invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of the conductive circuit board as described in claim 2, and is as follows.
A conductive circuit having an opening is formed on a sheet-like substrate having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in the upper and lower layers.

上記の目的を達成することができる本発明の第３発明は、請求項３に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つ繊維状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げて、上・下層の他の導電回路や電子部品と導電接続し、さらにその開口部を有する繊維状基材の開口部を筐体や、他の基板に固定して導電接続する構成である。 A third invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in claim 3, and is as follows.
A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in upper and lower layers, and further In this configuration, the opening of the fibrous base material having the opening is fixed to a housing or another substrate for conductive connection.

上記の目的を達成することができる本発明の第４発明は、請求項４に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
請求項３に記載の発明に加えて、導電接続において、絶縁性固定剤を導電回路基板の開口部を利用して絡ませて他の基板や筐体に固定する構成である。 A fourth invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in claim 4, and is as follows.
In addition to the invention described in claim 3, in the conductive connection, the insulating fixing agent is entangled using the opening of the conductive circuit board and fixed to another board or casing.

本発明に係る導電回路基板の上・下層への導電接続法は、上記説明のような構成を有するので、以下に記載する効果を奏する。
（１）プリント基板での両面回路、多層回路を形成する層間導電接続を行う上で、開口部をもつ繊維状基材や、開口部を持つシート状基材に開口部を有する導電回路を形成し、その導電回路を延長し形成しておくことにより、上・下に折り曲げることで確実にそして簡単に各層と導電接続をすることができる。
（２）開口部を持つ繊維状基材や、開口部を持つシート状基材に開口部を有する導電回路を形成するので、回路として空気との接触面積が大きくなるので、放熱機能を高めるものである。
（３）開口部を有する導電回路になるので、引き伸ばして開口部を菱型にすることで、回路延長することができるものである。 Since the conductive connection method to the upper and lower layers of the conductive circuit board according to the present invention has the configuration as described above, the following effects can be obtained.
(1) Forming a fibrous base material having an opening or a conductive circuit having an opening on a sheet-like base material having an opening when performing double-sided circuit or multilayer circuit connection on a printed circuit board By extending and forming the conductive circuit, it is possible to reliably and easily make conductive connection with each layer by bending up and down.
(2) Since a conductive substrate having an opening is formed on a fibrous base material having an opening or a sheet-like substrate having an opening, the area of contact with air as a circuit is increased, so that the heat dissipation function is enhanced. It is.
(3) Since the conductive circuit has an opening, the circuit can be extended by stretching and making the opening a diamond shape.

本発明の第一実施例である開口部を持つ導電回路を下層の他の導電回路に導電接続する状態を示すもので、（ａ）は導電接続する前の状態を示す概略正断面図、（ｂ）は下層の他の導電回路に導電接続した状態を示す概略正断面図である。The conductive circuit with the opening part which is the 1st Example of this invention shows the state which carries out conductive connection to the other conductive circuit of a lower layer, (a) is a schematic sectional front view which shows the state before conducting conductive connection, b) is a schematic front sectional view showing a state where the conductive connection is made to another conductive circuit in the lower layer. 図１に示した状態にさらに加えて、筐体との固定状態を示す（ａ）は概略平面図、（ｂ）は概略正断面図である。In addition to the state shown in FIG. 1, (a) is a schematic plan view and (b) is a schematic front sectional view showing a fixed state with respect to the housing. 本発明の開口部を持つ導電回路の導電回路に沿って適宜の切断部を形成して、その切断部を利用して下方に折り曲げ、下層の導電回路と導電接続し、さらに電子部品を導電接続した状態を示す（ａ）は概略正断面図、（ｂ）は同概略平面図である。An appropriate cut portion is formed along the conductive circuit of the conductive circuit having the opening of the present invention, bent downward using the cut portion, and conductively connected to the lower conductive circuit, and further electrically connected to the electronic component (A) which shows the state which carried out is a schematic front sectional view, (b) is the schematic plan view. 本発明の下方にある他の導電回路に円柱の、例えば銅メッキされた導電部に本発明の導電回路基板を導電接続した状態を示す（ａ）は概略一部正断面図、（ｂ）は同概略斜視図である。The state where the conductive circuit board of the present invention is conductively connected to the conductive part of the cylinder, for example, the copper plating, on the other conductive circuit below the present invention is shown in FIG. It is the same schematic perspective view. 開口部を有する繊維状基材に換えて、フィルム状基材に開口部を形成したものの実施例を示すもので、（ａ）は概略正断面図、（ｂ）は同概略平面図である。An example of a film-like base material having an opening formed in place of a fibrous base material having an opening is shown, wherein (a) is a schematic front sectional view, and (b) is a schematic plan view thereof. 開口部を持つ繊維状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を多層にした状態を示す多層導電回路基板の上・下層への導電接続を示す概略正断面図である。Schematic cross section showing conductive connection to the upper and lower layers of a multilayer conductive circuit board showing a state in which a conductive circuit having an opening is formed on a fibrous base material having an opening and the conductive circuit having the opening is made into a multilayer FIG. 開口部を持つ繊維状基材に開口部を有する導電回路を形成し、その導電回路を絶縁性固定剤で固定し、開口部のある回路を引き伸ばして開口部を菱型にすることで、回路延長した状態を示す概略平面図である。A circuit is formed by forming a conductive circuit having an opening on a fibrous base material having an opening, fixing the conductive circuit with an insulating fixing agent, stretching the circuit with the opening, and making the opening a rhombus It is a schematic plan view which shows the extended state. 金属ハトメにより導電接続固定した状態を示す概略正断面図である。It is a general | schematic front sectional view which shows the state fixed by conductive connection by metal eyelets.

開口部を持つ繊維状基材や、開口部を持つシート状基材に、開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する導電回路基板の上・下層への導電接続法である。   A conductive circuit having an opening is formed on a fibrous base material having an opening or a sheet-like substrate having an opening, and the conductive circuit having the opening is bent up and down to form another conductive circuit on the upper and lower layers. And a conductive connection method to the upper and lower layers of a conductive circuit board that is conductively connected to an electronic component.

一般的に開口部を持つ繊維状基材としては、織布、不織布、微細な開口部を持つシート、フィルムが考えられ、材料としては、ガラス繊維、ポリエステル等の化学繊維、カーボン繊維、イミドフィルム、ポリエステルフィルム等が採用される。
そして、導電回路の形成は、開口部を有する繊維状基材や、開口部を持つシート状基材上にメッキで形成したり、金属板上でメッキにより形成したメッキ回路を剥離して得られた導電回路、銅箔をエッチングして形成した導電回路等が採用できる。
また、導電性接続としては、ハンダ接続、金属の超音波接続、圧接、メッキでの接続、導電ペーストでの接続、導電接着剤での接続、金属製ハトメでの固定接続、ネジ止め接続、接点を銀、錫メッキで圧接し拡散接合することにより導電性接続が可能である。 In general, as the fibrous base material having an opening, woven fabric, non-woven fabric, sheet or film having a fine opening can be considered, and the materials include chemical fibers such as glass fiber and polyester, carbon fiber, and imide film. A polyester film or the like is employed.
The conductive circuit is formed by plating a fibrous base material having openings or a sheet-like base material having openings, or by peeling a plating circuit formed by plating on a metal plate. A conductive circuit formed by etching a copper foil or the like can be employed.
Also, the conductive connection includes solder connection, ultrasonic metal connection, pressure contact, plating connection, connection with conductive paste, connection with conductive adhesive, fixed connection with metal eyelet, screw connection, contact Can be conductively connected by pressure welding with silver and tin plating and diffusion bonding.

次に、図面に基づいてさらに具体的な実施例を詳細に説明する。
図１は、開口部を有する繊維状基材１にメッキにて形成した導電回路２と開口部のある導電回路３を形成し、この開口部のある導電回路３を下層の他の導電回路５に導電接続した状態を示したもので、メッキにて形成した導電回路２の部分と他の導電回路５の間には絶縁層４を介在させ、開口部のある導電回路３と他の導電回路５との間は絶縁層４を取り除き、開口部のある導電回路３を下方に加圧して折り曲げ、他の導電回路５と導電接続する実施例を示したものである。 Next, specific examples will be described in detail with reference to the drawings.
In FIG. 1, a conductive circuit 2 formed by plating and a conductive circuit 3 having an opening are formed on a fibrous base material 1 having an opening, and the conductive circuit 3 having the opening is formed as another conductive circuit 5 below. The conductive circuit 2 is electrically connected, and an insulating layer 4 is interposed between the portion of the conductive circuit 2 formed by plating and the other conductive circuit 5, and the conductive circuit 3 having an opening and the other conductive circuit 5 shows an embodiment in which the insulating layer 4 is removed, the conductive circuit 3 having an opening is pressed downward, bent, and conductively connected to another conductive circuit 5.

図２に示すものは、筐体１９に多層回路を固定した実施例である。
開口部のある繊維状基材１にメッキにて形成した導電回路２、９と、開口部のある導電回路３を形成し、下方の他の導電回路５と導電接続する上で、基材１に絡めてハンダにより導電接続したものである。４は図１と同様に絶縁層である。
さらに、導電回路２、３の形成されていない開口部のある繊維状基材６を介して、絶縁性固定剤で開口部を絡めて筐体１９に固定した実施例である。 FIG. 2 shows an embodiment in which a multilayer circuit is fixed to the housing 19.
Conductive circuits 2 and 9 formed by plating on a fibrous base material 1 having openings and a conductive circuit 3 having openings are formed and conductively connected to other conductive circuits 5 below. Are entangled with each other and conductively connected by solder. 4 is an insulating layer as in FIG.
Furthermore, in this embodiment, the openings are entangled with an insulating fixing agent via the fibrous base material 6 having openings where the conductive circuits 2 and 3 are not formed.

図３に示すものは、図１、図２において説明したものと同様に、多層導電回路を導電接続するもので、一部電子部品１１を接続したり、切断部１２を利用して、下方の導電回路５と導電接続した実施例である。
図４に示したものは、本発明の下方にある他の導電回路５に円柱１５の、例えば銅メッキされた導電部に本発明の導電回路基板を導電接続した実施例である。
図５に示したものは、開口部を有する繊維状基材１に換えて、開口部を有するフィルム状基材の実施例である。
図６に示したものは、開口部を持つ繊維状基材１に開口部を有する導電回路３を形成し、その開口部を有する導電回路３を多層にした実施例である。
図７に示したものは、開口部を持つ繊維状基材１に開口部を有する導電回路３を形成し、その導電回路３を絶縁性固定剤で固定し、開口部のある回路を引き伸ばして開口部を菱型にすることで、回路延長１６した実施例である。
図８に示したものは、金属ハトメ２０により導電接続固定した実施例である。 As shown in FIGS. 1 and 2, the one shown in FIG. 3 is a conductive connection of a multilayer conductive circuit. A part of the electronic component 11 is connected or a cutting portion 12 is used to This is an embodiment in which the conductive circuit 5 is conductively connected.
FIG. 4 shows an embodiment in which the conductive circuit board of the present invention is conductively connected to a conductive portion of a cylinder 15, for example, copper plated, to another conductive circuit 5 below the present invention.
What was shown in FIG. 5 is the Example of the film-form base material which has an opening part instead of the fibrous base material 1 which has an opening part.
FIG. 6 shows an embodiment in which a conductive circuit 3 having an opening is formed on a fibrous base material 1 having an opening, and the conductive circuit 3 having the opening is multilayered.
In the structure shown in FIG. 7, a conductive circuit 3 having an opening is formed on a fibrous base material 1 having an opening, the conductive circuit 3 is fixed with an insulating fixing agent, and the circuit having the opening is stretched. This is an embodiment in which the circuit is extended 16 by making the opening a diamond shape.
FIG. 8 shows an embodiment in which the conductive connection is fixed by the metal eyelet 20.

プリント基板等の導電回路基板とＬＳＩ等の接点部品との導電接合する基板であれば各種応用することができる。   Various substrates can be applied as long as they are conductively bonded to a conductive circuit board such as a printed circuit board and contact parts such as an LSI.

１・・・・開口部を有する繊維状基材
２・・・・メッキ等により形成した導電回路
３・・・・開口部のある導電回路
４・・・・絶縁層
５・・・・他の導電回路
６・・・・開口部のある繊維
７・・・・導電回路上の開口部
８・・・・開口部を有するフィルム状基材
９・・・・導電回路
１０・・・・ハンダにより基材に絡めて形成した導電接続
１１・・・・電子部品
１２・・・・繊維状基材に形成した切断部
１３・・・・導電回路の開口部に絡めて固定剤で固定した部分
１４・・・・回路上の開口部にメッキを充填して導電円柱に接続した部分
１５・・・・導電円柱
１６・・・・引き伸ばした延長回路
１７・・・・導電接着剤
１８・・・・補助導電回路
１９・・・・筐体
２０・・・・金属ハトメ DESCRIPTION OF SYMBOLS 1 ...... Fibrous base material which has an opening part 2 .... Conductive circuit formed by plating etc. 3 .... Conductive circuit with an opening part 4 .... Insulating layer 5 ... Others Conductive circuit 6 ... Fiber with opening 7 ... Opening on conductive circuit 8 ... Film-like substrate with opening 9 ... Conductive circuit 10 ... With solder Conductive connection 11 entangled with base material ... Electronic component 12 ... Cut section 13 formed on fibrous base material ... Part 14 entangled with opening of conductive circuit and fixed with fixing agent 14 ······ A portion 15 in which the opening on the circuit is filled with plating and connected to the conductive cylinder 15 ··· The conductive cylinder 16 ··· The extended extension circuit 17 ··· The conductive adhesive 18 ··· Auxiliary conductive circuit 19 ... Case 20 ... Metal eyelet

Claims (4)

開口部を持つ繊維状基材に、開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続することを特徴とする導電回路基板の上・下層への導電接続法。 A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other upper and lower conductive circuits and electronic components. Conductive connection method to upper and lower layers of conductive circuit board. 開口部を持つシート状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続することを特徴とする導電回路基板の上・下層への導電接続法。 A conductive circuit having an opening is formed on a sheet-like substrate having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in the upper and lower layers. Conductive connection method to upper and lower layers of conductive circuit board. 開口部を持つ繊維状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げて、上・下層の他の導電回路や電子部品と導電接続し、さらにその開口部を有する繊維状基材の開口部を筐体や、他の基板に固定することに用いることを特徴とする導電回路基板の上・下層への導電接続法。 A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in upper and lower layers, and further A conductive connection method to the upper and lower layers of a conductive circuit board, wherein the opening part of a fibrous base material having an opening part is used to fix the opening part to a housing or another substrate. 導電接続において、絶縁性固定剤を導電回路基板の開口部を利用して絡ませて他の基板や筐体に固定することを特徴とする請求項３に記載の導電回路基板の上・下層への導電接続法。 4. The conductive circuit board according to claim 3, wherein in the conductive connection, the insulating fixing agent is entangled using the opening of the conductive circuit board and fixed to another board or casing. Conductive connection method.
JP2010047203A 2010-03-03 2010-03-03 Conductive connection method to upper and lower layers of conductive circuit board Expired - Fee Related JP5410338B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157566A (en) * 2012-01-31 2013-08-15 Sumitomo Electric Printed Circuit Inc Printed wiring board and method of manufacturing the printed wiring board

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Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board
JPH09275267A (en) * 1996-04-03 1997-10-21 Katsuya Hiroshige Method for forming printed wiring sheet
JP2001308540A (en) * 2000-04-21 2001-11-02 Shinko Electric Ind Co Ltd Multilayer wiring board and method for manufacturing the same
JP2004039455A (en) * 2002-07-03 2004-02-05 Seiji Kagawa Metal deposition conductive thin film with conductive hole, and its manufacturing method and application

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board
JPH09275267A (en) * 1996-04-03 1997-10-21 Katsuya Hiroshige Method for forming printed wiring sheet
JP2001308540A (en) * 2000-04-21 2001-11-02 Shinko Electric Ind Co Ltd Multilayer wiring board and method for manufacturing the same
JP2004039455A (en) * 2002-07-03 2004-02-05 Seiji Kagawa Metal deposition conductive thin film with conductive hole, and its manufacturing method and application

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157566A (en) * 2012-01-31 2013-08-15 Sumitomo Electric Printed Circuit Inc Printed wiring board and method of manufacturing the printed wiring board

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