JP2011171670A - Printed board, and method of manufacturing the same - Google Patents

Printed board, and method of manufacturing the same Download PDF

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JP2011171670A
JP2011171670A JP2010036496A JP2010036496A JP2011171670A JP 2011171670 A JP2011171670 A JP 2011171670A JP 2010036496 A JP2010036496 A JP 2010036496A JP 2010036496 A JP2010036496 A JP 2010036496A JP 2011171670 A JP2011171670 A JP 2011171670A
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solder paste
paste material
electronic component
insulating substrate
circuit board
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Yoshiharu Fukuchi
義敏 福地
Jun Karasawa
純 唐沢
Mio Omura
美央 大村
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed board having a paste material of varied desired film thickness, and a method of manufacturing the same. <P>SOLUTION: This printed board includes: an insulation board 2 having a mounting region for a small electronic component and a mounting region for a large electronic component; a depression part 3 formed in the mounting region for the large electronic component of the insulation board 2; a solder paste material 4 small in film thickness and arranged in the mounting region for the small component of the insulation board 2; and a solder paste material 5 filled in the depression part 3 and larger in film thickness than that of the thin solder paste material 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、スクリーン印刷に対応したプリント基板およびその製造方法に関する。   The present invention relates to a printed circuit board compatible with screen printing and a method for manufacturing the same.

電子機器、例えば携帯電話では、チップ部品や微細ピッチQFP、微細ピッチBGAなどの小型電子部品とシールド板金部品やコネクタ部品などの大型電子部品とがプリント基板上に混在してクリーム半田などの半田ペースト材により実装されている。このような混在プリント基板では、小型電子部品の実装領域には電子部品の端子間の間隔が狭いために半田ペースト材の膜厚を薄く、大型電子部品の実装領域にはプリント基板上に安定して固定させるために膜厚を厚く印刷している。   In electronic devices such as mobile phones, solder paste such as cream solder is used by mixing small electronic components such as chip components, fine pitch QFP, and fine pitch BGA with large electronic components such as shield sheet metal components and connector components. It is mounted by material. In such a mixed printed circuit board, the distance between the terminals of the electronic component is narrow in the mounting area of the small electronic component, so the thickness of the solder paste material is thin, and the mounting area of the large electronic component is stable on the printed circuit board. In order to fix it, the film thickness is printed thick.

従来、上記のような異なる厚みの半田ペースト材の印刷方法としては、半田ペースト材を充填する孔部の膜厚が異なる段差付マスク１０１を用いてスクリ−ン印刷する方法が開示されている（例えば、特許文献１参照。）。   Conventionally, as a method of printing solder paste materials having different thicknesses as described above, a method of performing screen printing using a stepped mask 101 having different film thicknesses of holes filled with solder paste materials has been disclosed ( For example, see Patent Document 1.)

即ち、この特許文献１では、図３（ａ）に示すように、段差付マスク１０１は、薄い膜厚の孔部１０３が形成されたマスク１０２の一部に光硬化性樹脂１０４が積層され、その積層部分に厚い膜厚の孔部１０５が形成されている。   That is, in Patent Document 1, as shown in FIG. 3A, a stepped mask 101 is formed by laminating a photocurable resin 104 on a part of a mask 102 in which a thin hole 103 is formed, A thick hole 105 is formed in the laminated portion.

そして、図３（ｂ）に示すように、半田ペースト材１０７を充填する際には、段差付マスク１０１を屈曲させてマスク１０２部分の裏面と光硬化性樹脂１０４の裏面とをプリント基板１０６上に接触させた状態で、マスク１０２上に半田ペースト材１０７をのせ、スキージ１０８により掻き取ることで、薄い膜厚の孔部１０３の部分に膜厚の薄い半田ペースト材１０９の印刷を行い、厚い膜厚の孔部１０５の部分に膜厚の厚い半田ペースト材１１０の印刷を行う。   As shown in FIG. 3B, when filling the solder paste material 107, the stepped mask 101 is bent so that the back surface of the mask 102 portion and the back surface of the photocurable resin 104 are on the printed circuit board 106. In this state, the solder paste material 107 is placed on the mask 102 and scraped off by the squeegee 108, so that the thin solder paste material 109 is printed in the portion of the hole 103 having the thin film thickness. A thick solder paste material 110 is printed on the hole 105 having a thickness.

特開２００９−１５１０６９号JP 2009-151069 A

しかし、特許文献１に開示の段差付マスク１０１では、薄い膜厚の孔部１０３と厚い膜厚の孔部１０５との間隔が広い場合であれば、マスク１０２が段差分だけ屈曲し、薄い膜厚の孔部１０３のマスク１０２の部分をプリント基板１０６に密着させることができるが、薄い膜厚の孔部１０３と厚い膜厚の孔部１０５との間隔が狭くなると、屈曲するための十分な距離が無いため、薄い膜厚の孔部１０３のマスク１０２部分が浮き上がる。そのため、薄い膜厚の孔部１０３に適切な量の半田ペースト材１０７を充填することができないという課題があった。   However, in the stepped mask 101 disclosed in Patent Document 1, if the gap between the thin film-thickness hole 103 and the thick film-thickness hole 105 is wide, the mask 102 is bent by the level difference and the thin film The mask 102 portion of the thick hole portion 103 can be brought into close contact with the printed circuit board 106. However, if the interval between the thin film thickness hole portion 103 and the thick film thickness hole portion 105 becomes narrow, sufficient to bend Since there is no distance, the mask 102 portion of the hole 103 having a thin film thickness is lifted. Therefore, there is a problem that an appropriate amount of the solder paste material 107 cannot be filled in the hole 103 having a thin film thickness.

本発明では、異なる所望の膜厚みの半田ペースト材を有するプリント基板およびその製造方法を提供する。   The present invention provides a printed circuit board having solder paste materials having different desired film thicknesses and a method for manufacturing the same.

上記目的を達成するために、本発明のプリント基板は、小型電子部品の実装領域および大型電子部品の実装領域を有する絶縁基板と、前記絶縁基板の前記大型電子部品の実装領域に設けられた窪み部と、前記絶縁基板の前記小型電子部品の実装領域に設けられた膜厚の薄い半田ペースト材と、前記窪み部内に充填され、前記薄い半田ペースト材より膜厚の厚い半田ペースト材とを備えることを特徴としている。   In order to achieve the above object, a printed circuit board according to the present invention includes an insulating substrate having a mounting region for small electronic components and a mounting region for large electronic components, and a depression provided in the mounting region for the large electronic components on the insulating substrate. And a solder paste material having a thin film thickness provided in a mounting region of the small electronic component on the insulating substrate, and a solder paste material having a film thickness thicker than the thin solder paste material and filled in the recess. It is characterized by that.

また、本発明の段差付基板の製造方法は、小型電子部品の実装領域および大型電子部品の実装領域を有する絶縁基板の当該大型電子部品の実装領域に窪み部を形成する工程と、前記窪み部および前記絶縁基板の前記小型電子部品の実装領域を露出させる孔部を有する一様な膜厚のマスクを前記絶縁基板上に載置する工程と、前記マスクの前記孔部からペースト材を充填し、前記絶縁基板の前記小型電子部品の実装領域に膜厚の薄い半田ペースト材を印刷し、且つ前記窪み部内に前記薄い半田ペースト材より膜厚の厚い半田ペースト材を印刷する工程とを含むことを特徴としている。   Further, the method for manufacturing a stepped substrate according to the present invention includes a step of forming a recess in the mounting area of the large electronic component of the insulating substrate having a mounting area of the small electronic component and a mounting area of the large electronic component, and the recess And a step of placing a mask having a uniform thickness on the insulating substrate having a hole exposing the mounting area of the small electronic component on the insulating substrate, and filling a paste material from the hole of the mask. And a step of printing a solder paste material having a thin film thickness on a mounting region of the small electronic component on the insulating substrate, and printing a solder paste material having a film thickness thicker than that of the thin solder paste material in the recess. It is characterized by.

本発明では、異なる所望の膜厚の半田ペースト材を有するプリント基板とその製造方法を提供することができる。   In the present invention, it is possible to provide a printed circuit board having solder paste materials having different desired film thicknesses and a method for manufacturing the same.

本発明の実施形態に係るプリント基板の断面図。Sectional drawing of the printed circuit board which concerns on embodiment of this invention. 本発明の実施形態に係るプリント基板の製造工程を示す断面図。Sectional drawing which shows the manufacturing process of the printed circuit board which concerns on embodiment of this invention. 従来の段差付マスクを使用したスクリーン印刷工程の概略図。Schematic of the screen printing process using the conventional stepped mask.

以下、本発明の実施形態に係るプリント基板およびその製造方法について、図面を参照して詳細に説明する。   Hereinafter, a printed circuit board and a manufacturing method thereof according to embodiments of the present invention will be described in detail with reference to the drawings.

まず、本発明の実施形態に係るプリント基板について、図１を参照して説明する。図1に示すように、本実施形態におけるプリント基板１は、絶縁基板２と、絶縁基板２の一部に設けられた窪み部３と、絶縁基板２上に設けられた膜厚の薄い半田ペースト材４と、窪み部３に設けられた膜厚の厚い半田ペースト材５とを有している。   First, a printed circuit board according to an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, a printed circuit board 1 in this embodiment includes an insulating substrate 2, a recess 3 provided in a part of the insulating substrate 2, and a thin solder paste provided on the insulating substrate 2. A material 4 and a thick solder paste material 5 provided in the depression 3 are provided.

絶縁基板２は、絶縁層２ａと絶縁層２ａ上に積層された配線層２ｂとで構成されている。絶縁基板２としては、例えば配線層２ｂが片面に設けられた片面基板や配線層２ｂが両面に設けられた両面基板、上面に配線層２ｂを有する絶縁層２ａを複数、積層した多層基板などを使用することができ、本実施形態では絶縁層２ａ−１、２ａ−２の上面に配線層２ｂ−１、２ｂ−２をそれぞれ有する絶縁基板２−１、２−２を積層した構造の多層基板であるビルドアップ基板を用いている。   The insulating substrate 2 includes an insulating layer 2a and a wiring layer 2b laminated on the insulating layer 2a. As the insulating substrate 2, for example, a single-sided substrate in which the wiring layer 2b is provided on one side, a double-sided substrate in which the wiring layer 2b is provided on both sides, a multilayer substrate in which a plurality of insulating layers 2a having the wiring layer 2b on the upper surface are stacked, and the like. In this embodiment, a multilayer substrate having a structure in which insulating substrates 2-1 and 2-2 each having wiring layers 2b-1 and 2b-2 are stacked on the upper surfaces of the insulating layers 2a-1 and 2a-2, respectively. The build-up board which is is used.

また、絶縁基板２の上面は、チップ部品や微細ピッチQFP、微細ピッチBGAなどの小型電子部品を実装する領域とシールド板金部品やコネクタ部品などの大型電子部品を実装する領域とを有する。配線層２ｂ−１，２ｂ−２は、電子部品間を接続するための回路パターンに形成され、上層の配線層２ｂ−２と下層の配線層２ｂ−１とは、層間接続ビアにて互いに接続されている。小型電子部品を実装する領域には、電子部品の端子を接続するためのパッドＰ１が設けられ、パッドＰ１は配線層２ｂ−２と接続されている。また絶縁基板２の上面には、電子部品を半田付けする配線層２ｂ−２の一部分を露出し、半田付けが不要な配線層２ｂ−２部分を含めてソルダーレジスト７が形成されている。   The upper surface of the insulating substrate 2 has a region for mounting small electronic components such as chip components, fine pitch QFP, and fine pitch BGA, and a region for mounting large electronic components such as shield sheet metal components and connector components. The wiring layers 2b-1 and 2b-2 are formed in a circuit pattern for connecting the electronic components, and the upper wiring layer 2b-2 and the lower wiring layer 2b-1 are connected to each other through an interlayer connection via. Has been. In the area where the small electronic component is mounted, a pad P1 for connecting a terminal of the electronic component is provided, and the pad P1 is connected to the wiring layer 2b-2. On the upper surface of the insulating substrate 2, a part of the wiring layer 2b-2 for soldering the electronic component is exposed, and a solder resist 7 is formed including the wiring layer 2b-2 portion that does not require soldering.

窪み部３は、絶縁基板２の大型電子部品を実装するパッドＰ２の一部分に設けられ、深さは必要に応じて様々な深さに設定することができる。図１では、上層の絶縁層２ａ−２と上層の配線層２ｂ−２を貫通する程度の深さであるが、例えば下層の絶縁層２ａ−１の一部にまで達する程度の深さなど、必要に応じて深さを設定することが出来る。また、窪み部３の幅の広さも同様に特に制限が無く、必要に応じて設定することができる。   The recess 3 is provided in a part of the pad P2 on which the large electronic component of the insulating substrate 2 is mounted, and the depth can be set to various depths as necessary. In FIG. 1, the depth is sufficient to penetrate the upper insulating layer 2 a-2 and the upper wiring layer 2 b-2. For example, the depth reaches a part of the lower insulating layer 2 a-1. The depth can be set as needed. Similarly, the width of the recess 3 is not particularly limited, and can be set as necessary.

窪み部３のパターンについても特に制限はなく、例えば円形、楕円形、正方形、長方形、ひし形、台形等の四角形、五角形、六角形、七角形、八角形等の多角形、その他、ひょうたん形、ダンベル形等の不定形等があげられる。   There is no particular limitation on the pattern of the recess 3, for example, a square such as a circle, an ellipse, a square, a rectangle, a rhombus, a trapezoid, a polygon such as a pentagon, a hexagon, a heptagon, an octagon, etc., a gourd, a dumbbell Examples include irregular shapes such as shapes.

また、窪み部３にはめっき膜６が設けられており、配線層２ｂ−１、２ｂ−２と電気的に接続されている。めっき膜６は、導電性の材質であり、例えば銅（Ｃｕ）等を使用することができるがこれに限定されることはない。   In addition, a plating film 6 is provided in the recess 3 and is electrically connected to the wiring layers 2b-1 and 2b-2. The plating film 6 is a conductive material, and for example, copper (Cu) or the like can be used, but is not limited thereto.

膜厚の薄い半田ペースト材４は、小型電子部品の実装領域であるパッドＰ１上に形成され、また膜厚の厚い半田ペースト材５は、大型電子部品の実装領域であるパッドＰ２の一部分に形成された窪み部３上に形成されている。そして、膜厚の薄い半田ペースト材４と膜厚の厚い半田ペースト材５は、配線層２ｂ−２上面からの高さがほぼ同一平面となるように設けられている。   The thin solder paste material 4 is formed on the pad P1 which is the mounting area of the small electronic component, and the thick solder paste material 5 is formed on a part of the pad P2 which is the mounting area of the large electronic component. It is formed on the recessed part 3 made. The thin solder paste material 4 and the thick solder paste material 5 are provided so that the height from the upper surface of the wiring layer 2b-2 is substantially the same plane.

次に、上記プリント基板１の製造方法について、図2を参照して説明する。   Next, a method for manufacturing the printed circuit board 1 will be described with reference to FIG.

まず、図２（ａ）に示すように、絶縁層２ａ−１、２ａ―２の上面にそれぞれ配線層２ｂ−１、２ｂ−２を有する絶縁基板２−１、２−２を複数、積層した絶縁基板２を形成する。そして、大型電子部品の実装領域に、例えばレーザ加工法やフォトリソグラフィ法などで最上層の絶縁基板２−２に窪み部３を形成する。   First, as shown in FIG. 2A, a plurality of insulating substrates 2-1 and 2-2 each having wiring layers 2b-1 and 2b-2 are stacked on the upper surfaces of the insulating layers 2a-1 and 2a-2. An insulating substrate 2 is formed. Then, the depression 3 is formed in the uppermost insulating substrate 2-2 in the mounting area of the large electronic component by, for example, laser processing or photolithography.

レーザにより窪み部３を形成する場合には、例えば配線層２ｂ−２と絶縁層２ａ−２を貫く事が可能な波長のレーザを使用し、窪み部３の形成箇所の設定が可能な場合は形成箇所の設定後、直接レーザを照射して形成する。また、窪み部３の形成箇所の設定が出来ない場合は絶縁基板２−２上に窪み部３の形成箇所に位置合わせされたマスクを設けてレーザを照射し、形成する。   In the case where the depression 3 is formed by a laser, for example, a laser having a wavelength that can penetrate the wiring layer 2b-2 and the insulating layer 2a-2 is used, and the formation location of the depression 3 can be set. After setting the formation location, it is formed by direct laser irradiation. If the formation location of the depression 3 cannot be set, a mask aligned with the formation location of the depression 3 is provided on the insulating substrate 2-2 and irradiated with a laser to form the depression.

フォトリソグラフィにより窪み部３を形成する場合には、例えば窪み部３の形成箇所を除いた領域にレジストを設け、エッチングを行うことにより窪み部３を形成させる。なお、エッチング後はレジストを剥離する。   In the case of forming the recess 3 by photolithography, for example, a resist is provided in a region excluding the formation portion of the recess 3 and etching is performed to form the recess 3. Note that the resist is removed after etching.

次に、図２（ｂ）に示すように、窪み部３の内表面に、例えば電解めっき法などにより、めっき膜６を形成する。   Next, as shown in FIG. 2B, a plating film 6 is formed on the inner surface of the recess 3 by, for example, electrolytic plating.

そして、図２（ｃ）に示すように、ソルダーレジスト７を、例えば印刷法や写真法などにより絶縁基板２−２の配線層２ｂ−２上に形成する。なお、ソルダーレジスト７を形成する領域としては、めっき膜６や小型電子部品及び大型電子部品の実装されるパッドＰ１，Ｐ２部分を除いたその他の配線層２ｂ−２部分に対して形成する。   Then, as shown in FIG. 2C, the solder resist 7 is formed on the wiring layer 2b-2 of the insulating substrate 2-2 by, for example, a printing method or a photographic method. In addition, as an area | region which forms the soldering resist 7, it forms with respect to the wiring layer 2b-2 part except the plating film 6, a small electronic component, and the pad P1, P2 part in which a large electronic component is mounted.

次に、図２（ｄ）に示すように、絶縁基板２上に、孔部８ａを有する一様な厚みのマスク８を載置する。マスク８の孔部８ａは、小型電子部品及び大型電子部品が実装される窪み部３が形成されているパッドＰ１，Ｐ２部分に対し、位置合わせされて設けられている。そして、マスク８は、孔部８ａと窪み部３、パッドＰ１，Ｐ２とが露出するように位置合わせされて載置される。   Next, as shown in FIG. 2 (d), a mask 8 having a uniform thickness having a hole 8 a is placed on the insulating substrate 2. The hole 8a of the mask 8 is provided in alignment with the pads P1 and P2 where the recess 3 on which the small electronic component and the large electronic component are mounted is formed. Then, the mask 8 is positioned and placed so that the hole 8a, the recessed portion 3, and the pads P1 and P2 are exposed.

ここで使用するマスク８は、上面にペースト材９をのせてスキージ１０で掻き取り、プリント基板１に転写できるものであれば、例えばエマルジョン形マスク、ソリッドマスク、サスペンドマスク、メタルマスク（エッチング法、レーザ法、アディティブ法、機械加工法）等、いずれの方式で作成したマスク８であっても使用することができる。   The mask 8 used here may be, for example, an emulsion type mask, a solid mask, a suspend mask, a metal mask (etching method, etc.) as long as the paste material 9 is placed on the upper surface, scraped with a squeegee 10 and transferred to the printed circuit board 1. The mask 8 produced by any method such as a laser method, an additive method, or a machining method can be used.

なお、マスク８の孔部８ａの深さや広さが制限されることはないが、均一の深さに形成されたものを使用する。また、マスク８の孔部８ａのパターンについても特に制限はなく、例えば円形、楕円形、正方形、長方形、ひし形、台形等の四角形、五角形、六角形、七角形、八角形等の多角形、その他、ひょうたん形、ダンベル形等の不定形等があげられる。   The depth and width of the hole 8a of the mask 8 are not limited, but those having a uniform depth are used. Further, the pattern of the hole 8a of the mask 8 is not particularly limited. For example, a square such as a circle, an ellipse, a square, a rectangle, a rhombus, a trapezoid, a polygon such as a pentagon, a hexagon, a heptagon, an octagon, and the like. Indeterminate shapes such as gourd shape and dumbbell shape.

次に、図２（ｅ）に示すように、マスク８上に半田ペースト材９を設けてスキージ１０により掻き取り、プリント基板１のめっき膜６に覆われた窪み部３内とマスク８の孔部８ａ内に、半田ペースト材９を充填させる。   Next, as shown in FIG. 2 (e), a solder paste material 9 is provided on the mask 8 and scraped off by a squeegee 10, and the inside of the recessed portion 3 covered with the plating film 6 of the printed circuit board 1 and the hole of the mask 8. The solder paste material 9 is filled in the portion 8a.

そして最後に、マスク８をプリント基板１から取り外し、スクリーン印刷を終える。この際、図１に示すように、窪み部３では、ソルダーレジスト７とマスク８の厚みに加え、窪み部３の深さの分だけ半田ペースト材５が厚くなり、パッドＰ１，Ｐ２上では、ソルダーレジスト７とマスク８と同じ厚みとなる。即ち、膜厚の薄い半田ペースト材４と膜厚の厚い半田ペースト材５の配線層２ｂ−２上面からの高さは、ほぼ同一となる。ここで「ほぼ同一の高さ」とは、製造上のバラツキによる誤差を含む。   Finally, the mask 8 is removed from the printed circuit board 1 to finish screen printing. At this time, as shown in FIG. 1, in addition to the thickness of the solder resist 7 and the mask 8, the solder paste material 5 becomes thicker by the depth of the recess 3 in the recess 3, and on the pads P1 and P2, It becomes the same thickness as the solder resist 7 and the mask 8. That is, the heights of the thin solder paste material 4 and the thick solder paste material 5 from the upper surface of the wiring layer 2b-2 are substantially the same. Here, “substantially the same height” includes errors due to manufacturing variations.

以上、本実施形態のプリント基板によれば、大型電子部品を実装する領域部分に窪み部３を形成し、この窪み部３内に膜厚の厚い半田ペースト５を形成している。そのため、窪み部３の半田ペースト材５は、窪み部３の深さ分、小型電子部品を実装する領域部分の半田ペースト材４と比較して膜厚を厚くできる。従って、電子部品の実装においては、小型電子部品の端子間をショートさせることなく、大型電子部品を安定して固定できる。   As described above, according to the printed circuit board of the present embodiment, the recess 3 is formed in the region where the large electronic component is mounted, and the thick solder paste 5 is formed in the recess 3. Therefore, the thickness of the solder paste material 5 in the recess 3 can be increased by the depth of the recess 3 compared to the solder paste material 4 in the region where the small electronic component is mounted. Therefore, in mounting electronic components, large electronic components can be stably fixed without shorting between terminals of the small electronic components.

しかも、大型電子部品を固定する際に、大型電子部品の接続部を窪み部３に挿入することにより、従来のようにプリント基板上に実装する場合に比べて、
堅固に固定できる。 Moreover, when fixing a large electronic component, by inserting the connecting portion of the large electronic component into the recess 3, compared to mounting on a printed circuit board as in the past,
Can be firmly fixed.

また、大型電子部品の接続部を窪み部３内に挿入することにより、プリント基板上からの高さを低くでき、電子機器の薄型化が図れる。   Moreover, by inserting the connection part of a large-sized electronic component in the hollow part 3, the height from a printed circuit board can be made low, and thickness reduction of an electronic device can be achieved.

更に本実施形態のプリント基板の製造方法によれば、絶縁基板の大型電子部品に実装領域に窪み部３を設けているので、段差のない一様な膜厚のマスク８を用いてスクリーン印刷を行うことができ、異なる所望の厚みの半田ペースト材を容易に設けることが可能となる。   Furthermore, according to the printed circuit board manufacturing method of the present embodiment, since the depression 3 is provided in the mounting area in the large electronic component of the insulating substrate, screen printing is performed using the mask 8 having a uniform film thickness without a step. This makes it possible to easily provide solder paste materials having different desired thicknesses.

１，１０６…プリント基板
２，２−１，２−２…絶縁基板
２ａ−１，２ａ−２…絶縁層
２ｂ−１，２ｂ−２…配線層
３…窪み部
４，１０９…膜厚の薄い半田ペースト材
５，１１０…膜厚の厚い半田ペースト材
６…めっき膜
７…ソルダーレジスト
８，１０２…マスク
８ａ…孔部
９，１０７…半田ペースト材
１０，１０８…スキージ
Ｐ１，Ｐ２…パッド
１０１…段差付マスク
１０３…薄い膜厚の孔部
１０４…光硬化性樹脂
１０５…厚い膜厚の孔部 DESCRIPTION OF SYMBOLS 1,106 ... Printed circuit board 2, 2-1, 2-2 ... Insulating board 2a-1, 2a-2 ... Insulating layer 2b-1, 2b-2 ... Wiring layer 3 ... Indentation part 4,109 ... Thin film thickness Solder paste material 5, 110 ... Thick solder paste material 6 ... Plating film 7 ... Solder resist 8, 102 ... Mask 8a ... Hole 9, 107 ... Solder paste material 10, 108 ... Squeegee P1, P2 ... Pad 101 ... Stepped mask 103 ... Thin film thickness hole 104 ... Photocurable resin 105 ... Thick film thickness hole

Claims (7)

小型電子部品の実装領域および大型電子部品の実装領域を有する絶縁基板と、
前記絶縁基板の前記大型電子部品の実装領域に設けられた窪み部と、
前記絶縁基板の前記小型電子部品の実装領域に設けられた膜厚の薄い半田ペースト材と、
前記窪み部内に充填され、前記薄い半田ペースト材より膜厚の厚い半田ペースト材と
を備えることを特徴とするプリント基板。 An insulating substrate having a mounting area for small electronic components and a mounting area for large electronic components;
A depression provided in a mounting region of the large electronic component of the insulating substrate;
A thin solder paste material provided in a mounting region of the small electronic component on the insulating substrate;
A printed circuit board comprising: a solder paste material that is filled in the recess and has a thickness greater than that of the thin solder paste material. 前記絶縁基板は、絶縁層と、前記絶縁層の表面に形成された配線層と、前記小型電子部品の実装領域に前記配線層と接続されたパッドとを有し、前記膜厚の薄い半田ペースト材は、前記パッド上に設けられていることを特徴とする請求項１記載のプリント基板。   The insulating substrate includes an insulating layer, a wiring layer formed on a surface of the insulating layer, and a pad connected to the wiring layer in a mounting region of the small electronic component, and the thin solder paste The printed board according to claim 1, wherein a material is provided on the pad. 更に前記窪み部の内面に前記配線層と接続されためっき層を有し、前記膜厚の厚い半田ペースト材は前記めっき層を介して前記窪み部内に設けられていることを特徴とする請求項２記載のプリント基板。   Furthermore, it has a plating layer connected with the said wiring layer in the inner surface of the said hollow part, The said thick solder paste material is provided in the said hollow part via the said plating layer. 2. The printed circuit board according to 2. 前記膜厚の厚い半田ペースト材は、前記膜厚の薄い半田ペースト材と同一平面を有することを特徴とする請求項１乃至３のいずれか１項に記載のプリント基板。   The printed circuit board according to claim 1, wherein the thick solder paste material has the same plane as the thin solder paste material. 表面に小型電子部品の実装領域および大型電子部品の実装領域を有する絶縁基板の当該前記大型電子部品の実装領域に窪み部を形成する工程と、
前記窪み部および前記絶縁基板の前記小型電子部品の実装領域を露出させる孔部を有する一様な膜厚のマスクを前記絶縁基板上に載置する工程と、
前記マスクの前記孔部から半田ペースト材を充填し、前記絶縁基板の前記小型電子部品の実装領域に膜厚の薄い半田ペースト材を印刷し、且つ前記窪み部内に前記薄い半田ペースト材より膜厚の厚い半田ペースト材を印刷する工程と、
を含むことを特徴とするプリント基板の製造方法。 Forming a depression in the mounting area of the large electronic component of the insulating substrate having a mounting area of the small electronic component and a mounting area of the large electronic component on the surface;
Placing a mask with a uniform film thickness on the insulating substrate having a hole that exposes the recess and a mounting region of the small electronic component on the insulating substrate;
A solder paste material is filled from the hole of the mask, a thin solder paste material is printed in a mounting region of the small electronic component on the insulating substrate, and a film thickness is thinner than the thin solder paste material in the recess. Printing a thick solder paste material,
A printed circuit board manufacturing method comprising: 前記窪み部は、レーザ加工法、またはフォトリソグラフィ法により形成されることを特徴とする請求項５記載のプリント基板の製造方法。   6. The method of manufacturing a printed circuit board according to claim 5, wherein the recess is formed by a laser processing method or a photolithography method. 前記膜厚の厚い半田ペースト材は、前記膜厚の薄い半田ペースト材と同一平面に形成されることを特徴とする請求項５または６記載のプリント基板の製造方法。   7. The method for manufacturing a printed circuit board according to claim 5, wherein the thick solder paste material is formed on the same plane as the thin solder paste material.
JP2010036496A 2010-02-22 2010-02-22 Printed board, and method of manufacturing the same Pending JP2011171670A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110225652A (en) * 2019-07-08 2019-09-10 上海朗骥电子科技有限公司 A kind of built-in component type circuit board printed metal sheet and its application

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110225652A (en) * 2019-07-08 2019-09-10 上海朗骥电子科技有限公司 A kind of built-in component type circuit board printed metal sheet and its application

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