JP2011113746A - Led light emitting structure - Google Patents

Led light emitting structure Download PDF

Info

Publication number
JP2011113746A
JP2011113746A JP2009267953A JP2009267953A JP2011113746A JP 2011113746 A JP2011113746 A JP 2011113746A JP 2009267953 A JP2009267953 A JP 2009267953A JP 2009267953 A JP2009267953 A JP 2009267953A JP 2011113746 A JP2011113746 A JP 2011113746A
Authority
JP
Japan
Prior art keywords
heat
substrate
led light
tube
metal material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009267953A
Other languages
Japanese (ja)
Inventor
Yu-Lin Chu
朱裕麟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2009267953A priority Critical patent/JP2011113746A/en
Publication of JP2011113746A publication Critical patent/JP2011113746A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED light emitting structure having a wider irradiation range and a superior heat dissipation structure. <P>SOLUTION: In an LED light source device at least mainly comprising a substrate, a light emitter and a transmission layer, the substrate has a circular arc cross section and is a plate material integrally formed of a metal, appearance of the substrate is similar to a sphere, a plurality of light emitting bodies are provided outside the circular arc of the substrate, each light emitter is an LED having a grain shape, the transmission layer covers over the outermost side of the substrate and the light emitting bodies, and a plurality of heat conduction fins are provided in the inner wall of the substrate. An LED light emitting structure includes the LED light source device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、ＬＥＤ（発光ダイオード。以下、本明細書において同じ。）発光構造体に関するものであり、さらに詳しくはＬＥＤ光源装置の構造に関し、特に、照明灯として使用可能なＬＥＤ灯具及び灯具光源に関するものである。   The present invention relates to an LED (light-emitting diode; hereinafter the same in this specification) light-emitting structure, and more particularly to a structure of an LED light source device, and more particularly to an LED lamp and a lamp light source that can be used as an illumination lamp. Is.

従来のＬＥＤ灯具は、灯具枠体と発光セットからなるものである。灯具枠体の内部は、複数の組立て空間に区画されたものであり、発光セットは、組立てフレームと回路板及び光ガイド板とを組立てたものからなるものである。回路板には、複数の発光体が設置され、一側に、電源線が接続され、光ガイド板の端面に、回路板の発光体に合わせて、複数の光ガイド弧面が設けられてある。該光ガイド弧面には、第一光ガイド面と第二光ガイド面があり、光ガイド弧面の底端において、中央に、貫通孔が貫設されてある。また、発光セットに応じて、変圧器が設置される。   A conventional LED lamp is composed of a lamp frame and a light emitting set. The interior of the lamp frame is divided into a plurality of assembly spaces, and the light emitting set is formed by assembling an assembly frame, a circuit board, and a light guide plate. A plurality of light emitters are installed on the circuit board, a power line is connected to one side, and a plurality of light guide arc surfaces are provided on the end face of the light guide plate in accordance with the light emitters of the circuit board. . The light guide arc surface includes a first light guide surface and a second light guide surface, and a through hole is formed in the center at the bottom end of the light guide arc surface. Moreover, a transformer is installed according to a light emission set.

以上のように、従来のＬＥＤ灯具は、複数の発光セットを灯具の枠体に組立て、発光セットの光ガイド板は、二つの反射角の光ガイド弧面を有し、光ガイド弧面の第一光ガイド面と第二光ガイド面の設置により、発光体が出射した光束が、より広い照射範囲になって、発光体の発光効率の向上が図られている。   As described above, the conventional LED lamp assembles a plurality of light-emitting sets into a frame of the lamp, and the light guide plate of the light-emitting set has light guide arc surfaces with two reflection angles. By setting the one light guide surface and the second light guide surface, the luminous flux emitted from the light emitter is in a wider irradiation range, and the light emission efficiency of the light emitter is improved.

しかし、前記のようなＬＥＤ灯具は、該発光体が、第一光ガイド面と第二光ガイド面により、比較的に広い照射範囲を実現することができるが、かかる第一光ガイド面と第二光ガイド面を作製するためのコストが高くなり、該第一光ガイド面と第二光ガイド面による照射範囲も、比較的限られたものである。また、かかる構造のＬＥＤ灯具によれば、放熱構造については十分とはいえない。   However, in the LED lamp as described above, the light emitter can realize a relatively wide irradiation range by the first light guide surface and the second light guide surface. The cost for producing the two-light guide surface is increased, and the irradiation range by the first light guide surface and the second light guide surface is relatively limited. Moreover, according to the LED lamp having such a structure, it cannot be said that the heat dissipation structure is sufficient.

さらに、一般市販の白熱電球は、発光のパワーが高ければ、電球球体も、大きくなるため、広い空間を要し、無駄なスペースを要することになる。   Further, in general incandescent light bulbs, if the light emission power is high, the bulb sphere also becomes large, so a large space is required and a wasteful space is required.

かかる状況下において、発光ダイオードを光源とするＬＥＤ灯具及び照明装置については多数提案されており、例えば、特開２００９−１８７８８８号公報によれば、ＬＥＤ光源、受光素子、電流制御部とからなるＬＥＤ照明灯が提案されている。また、米国公開特許和文抄録（公開番号：２００２／０１２６５０３）によれば、発光ダイオードを用いるリニアＬＥＤ照明灯が提案されている。   Under such circumstances, many LED lamps and lighting devices using light emitting diodes as light sources have been proposed. For example, according to Japanese Unexamined Patent Application Publication No. 2009-187888, an LED comprising an LED light source, a light receiving element, and a current control unit. Lighting lights have been proposed. In addition, according to US published patent abstract (publication number: 2002/0126503), a linear LED illumination lamp using a light emitting diode is proposed.

さらに、特開２００２−４３７７１号公報によれば、ＬＥＤ発光体をマウントしてなる基盤を基体に装着してなるＬＥＤ発光灯が提案されている。   Furthermore, according to Japanese Patent Laid-Open No. 2002-43771, an LED light lamp is proposed in which a base on which an LED light emitter is mounted is mounted on a base.

しかしながら、かかる提案によっても照明範囲は限られた構造のものであり、さらに放熱構造を組み込みコンパクトに構成されたＬＥＤ発光構造体については開示されていない。
特開２００９−１８７８８８号公報 米国公開特許和文抄録 特開２００２−４３７７１号公報 However, even with this proposal, the illumination range has a limited structure, and further, there is no disclosure of an LED light emitting structure that is compactly configured by incorporating a heat dissipation structure.
JP 2009-187888 A US published patent abstract JP 2002-43771 A

従って、本発明の課題は、ＬＥＤ光源装置を用いるＬＥＤ発光構造体であって、コンパクトな構造で照射範囲が広範囲であり、効率的な放熱可能な放熱構造を有するＬＥＤ発光構造体を提供することにある。   Accordingly, an object of the present invention is to provide an LED light emitting structure using an LED light source device, which has a compact structure, a wide irradiation range, and an efficient heat dissipation structure. It is in.

そこで、本発明者は、前記の本発明の課題を解決するために、鋭意検討を重ねたところ、ＬＥＤの晶粒発光体を断面が円弧状の基板に嵌設したＬＥＤ光源装置を用いることにより、放射状に照射させることができ、また、特定の金属材質の組み合せにより効率的な放熱構造を提供できることに着目し、かかる知見に基いて本発明の完成に想到した。   Accordingly, the present inventor has made extensive studies in order to solve the above-described problems of the present invention. As a result, the present inventors have used an LED light source device in which a crystal grain light emitter of an LED is fitted on a substrate having an arc-shaped cross section. Focusing on the fact that an effective heat dissipation structure can be provided by a combination of specific metal materials, the present invention has been completed based on such knowledge.

すなわち、本発明の主な目的は、主として、ＬＥＤの晶粒発光体を、断面が円弧状である基板に嵌設し、また、該円弧の中心角が、約２７０°であるＬＥＤ光源装置を提供し、これにより、該発光体による照射範囲が、放射状の照明領域及び照射する範囲がより広くなり、従来技術によるＬＥＤ灯具と一般市販の白熱電球より、本発明のＬＥＤ光源装置の作製コストが、比較的に低いが、より広い照射範囲が得られ、また、光源球体を交換しなくても、より大きい発光パワーを得ることにある。   That is, the main object of the present invention is to provide an LED light source device in which a crystal grain light emitter of LED is mainly fitted on a substrate having a circular cross section, and the central angle of the circular arc is about 270 °. Thus, the irradiation range by the light emitter becomes wider in the radial illumination area and the irradiation range, and the production cost of the LED light source device of the present invention is lower than that of the conventional LED lamp and the general commercially available incandescent bulb. Although it is relatively low, a wider irradiation range can be obtained, and a larger light emission power can be obtained without replacing the light source sphere.

かくして、本発明によれば、
請求項１において、
少なくとも、主として、基板、発光体及び透過層からなるＬＥＤ光源装置であって、基板が円弧状の断面を有し、金属からなる材料により一体成形された板材であり、該基板の外観が、球体に類似したものであり、円弧状の外側に、複数の発光体が設置され、該発光体が、晶粒状のＬＥＤであり、前記基板と前記発光体の最外側に、前記透過層が被覆され、前記基板の内縁壁に、複数の熱伝導フィンが設置されてなるＬＥＤ光源装置から構成されたことを特徴とするＬＥＤ発光構造体が提供される。 Thus, according to the present invention,
In claim 1,
At least an LED light source device mainly composed of a substrate, a light emitter, and a transmission layer, the substrate having a circular arc-shaped cross section, and a plate material integrally formed of a material made of metal. A plurality of light emitters are installed on the outer side of the arc shape, and the light emitter is a crystal-like LED, and the outermost layer of the substrate and the light emitter is covered with the transmission layer. In addition, an LED light emitting structure comprising an LED light source device in which a plurality of heat conducting fins are installed on the inner edge wall of the substrate is provided.

請求項２によれば、
前記ＬＥＤ光源装置の基板の内壁の裏側に、さらに、放熱装置が接続され、該放熱装置が、主として、熱伝導管、熱伝導板、放熱部材及び放熱片からなり、前記熱伝導管、熱伝導板、放熱部材及び放熱片が、ともに、金属からなり、前記熱伝導管が、複数の管体を集合してなり、前記熱伝導管の先端が、基板の円弧状内に挿入して、基板の内縁壁に設けてある熱伝導フィンと該熱伝導管とが直接に接触し、前記熱伝導管の末端に前記熱伝導板が固定され、前記放熱部材の一端において、中心に、貫通孔が形成され、該貫通孔の口径の大きさが、前記熱伝導板を収納して、前記貫通孔の内壁と直接に接触できるように調整され、前記放熱部材の外側にも、囲むように、複数の前記放熱片が設置されることを特徴とする請求項１に記載のＬＥＤ発光構造体が提供される。 According to claim 2,
A heat radiating device is further connected to the back side of the inner wall of the substrate of the LED light source device, and the heat radiating device mainly comprises a heat conduction tube, a heat conduction plate, a heat radiating member and a heat radiating piece, and the heat conduction tube, heat conduction The plate, the heat radiating member, and the heat radiating piece are all made of metal, the heat conducting tube is a collection of a plurality of tubes, and the tip of the heat conducting tube is inserted into the arc shape of the substrate, The heat conduction fin provided on the inner edge wall of the heat conduction tube is in direct contact with the heat conduction tube, the heat conduction plate is fixed to the end of the heat conduction tube, and a through hole is formed at the center at one end of the heat dissipation member. The through hole is formed and adjusted so that the diameter of the through hole accommodates the heat conducting plate and can be in direct contact with the inner wall of the through hole. The LED radiator according to claim 1, wherein the heat radiation piece is installed. Structure is provided.

請求項３によれば、
前記放熱装置の熱伝導管は、複数の多角形管材を集合してからなる蜂巣状の管体であることを特徴とする請求項２に記載のＬＥＤ発光構造体が提供される。 According to claim 3,
The LED light emitting structure according to claim 2, wherein the heat conduction tube of the heat dissipation device is a honeycomb tube formed by collecting a plurality of polygonal tubes.

請求項４によれば、
前記ＬＥＤ光源装置の基板と放熱装置の熱伝導管、熱伝導板、放熱部材及び放熱片は、金属材質からなり、前記基板に使用された金属材質の比熱値が、前記熱伝導管に使用された金属材質の比熱値より大きいか又は等しく、該熱伝導管に使用された金属材質の比熱値が、前記熱伝導板に使用された金属材質の比熱値より大きいか又は等しく、該熱伝導板に使用された金属材質の比熱値が、前記放熱部材に使用された金属材質の比熱値より大きいか又は等しく、該放熱部材に使用された金属材質の比熱値が前記放熱片に使用された金属材質の比熱値より大きいか又は等しいことを特徴とする請求項２に記載のＬＥＤ発光構造体が提供される。 According to claim 4,
The substrate of the LED light source device and the heat conduction tube, heat conduction plate, heat radiation member and heat radiation piece of the heat radiation device are made of a metal material, and the specific heat value of the metal material used for the substrate is used for the heat conduction tube. The specific heat value of the metal material used for the heat conduction tube is greater than or equal to the specific heat value of the metal material used, and the specific heat value of the metal material used for the heat conduction plate is greater than or equal to the specific heat value of the metal material. The specific heat value of the metal material used for the heat radiating member is greater than or equal to the specific heat value of the metal material used for the heat radiating member, and the specific heat value of the metal material used for the heat radiating member is the metal used for the heat radiating piece. The LED light emitting structure according to claim 2, wherein the LED light emitting structure is greater than or equal to a specific heat value of the material.

請求項５によれば、
前記放熱装置の前記放熱部材は、末端に継手が設置され、該継手が、一般の灯座に螺入されることができることを特徴とする請求項２に記載のＬＥＤ発光構造体が提供される。 According to claim 5,
3. The LED light emitting structure according to claim 2, wherein a joint is installed at an end of the heat radiating member of the heat radiating device, and the joint can be screwed into a general light seat. .

本発明は、少なくとも、主として、基板や発光体及び透過層からなり、該基板が、円弧状の断面を有し、金属から一体成形された板材であり、該基板の外観が、球体に類似し、基板の円弧状の外側に、複数の発光体が設置され、その発光体が、晶粒状のＬＥＤで、基板と発光体の最外側に、透過層が覆われ、また、基板の内縁壁に、複数の熱伝導フィンが設置されるＬＥＤ光源装置から構成される、ＬＥＤ発光構造体に関するものである。   The present invention is at least mainly composed of a substrate, a light-emitting body, and a transmission layer, and the substrate is a plate material that has an arc-shaped cross section and is integrally formed from metal, and the appearance of the substrate is similar to a sphere. A plurality of light emitters are installed on the arcuate outer side of the substrate, and the light emitter is a crystal-like LED, and the transmission layer is covered on the outermost side of the substrate and the light emitter, and the inner edge wall of the substrate In addition, the present invention relates to an LED light emitting structure composed of an LED light source device in which a plurality of heat conducting fins are installed.

本発明は、前記の構成からなり、コンパクトなＬＥＤ光源装置であるにも拘らず、照射範囲が広く、また、放熱装置を組み合わせた場合には放熱効率が優れ、著しく顕著な効果を奏する。   Although the present invention has the above-described configuration and is a compact LED light source device, the irradiation range is wide, and when combined with a heat radiating device, the heat radiating efficiency is excellent and has a remarkable effect.

以下、図面を参照しながら、本発明の特徴及び技術内容について、詳しく説明する。もっとも、それらの図面等は、参考や説明のためであり、本発明は、それらによって限定されるものではない。   Hereinafter, the features and technical contents of the present invention will be described in detail with reference to the drawings. However, those drawings and the like are for reference and explanation, and the present invention is not limited thereto.

本発明は図１に示すように、ＬＥＤ発光構造体に関するものであり、少なくとも、ＬＥＤ光源装置１と放熱装置２とから構成されるものである。   As shown in FIG. 1, the present invention relates to an LED light emitting structure, and includes at least an LED light source device 1 and a heat dissipation device 2.

ＬＥＤ光源装置１は、図１のＡ−Ａ断面図である図２で示すように、主として、基板１１と発光体１２、透過層１３及び熱伝導フィン１４から構成されたものである。   The LED light source device 1 is mainly composed of a substrate 11, a light emitter 12, a transmissive layer 13, and heat conductive fins 14 as shown in FIG.

基板１１は、金属材質であり、その断面が円弧状で一体成形された板材である。基板１１の断面円弧の中心角が、約２７０°に設定されてある。これにより、該基板１１の外観が、球体に類似したものとなる。球体内には、放熱空間１１１が設けてある。   The board | substrate 11 is a metal material, The cross section is a board | plate material integrally formed by circular arc shape. The central angle of the cross-sectional arc of the substrate 11 is set to about 270 °. Thereby, the appearance of the substrate 11 is similar to a sphere. A heat dissipation space 111 is provided in the sphere.

また、基板１１の円弧状の外側に、複数の発光体１２が嵌設されてある。その発光体１２が、晶粒状のＬＥＤであり、基板１１と発光体１２の最外側は、透過層１３で被覆されてある。該透過層１３は、耐熱性樹脂の透過性ゲルからなる。また、基板１１の内縁壁に、複数の熱伝導フィン１４が固定され、該熱伝導フィン１４が、更に、放熱装置２の熱伝導管２１に接触するように、貼り付けてある。   A plurality of light emitters 12 are fitted on the arcuate outer side of the substrate 11. The light emitter 12 is a crystallized LED, and the outermost sides of the substrate 11 and the light emitter 12 are covered with a transmission layer 13. The transmission layer 13 is made of a heat-resistant resin permeable gel. A plurality of heat conduction fins 14 are fixed to the inner edge wall of the substrate 11, and the heat conduction fins 14 are further pasted so as to contact the heat conduction tube 21 of the heat dissipation device 2.

ＬＥＤ発光体としては、半導体発光素子、例えば、現在、ＧａＡｓ（赤）、ＧａＡｓＰ（赤）、ＧａＰ（赤、黄、緑）、ＧａＮ（青）、２‐４族のＺｎＳｅｘＴｅ１-ｘ、ＺｎｘＣｄ１−ｘＴｅ、３‐５族のＧａＳｂ、ＩｎＡｓ等が知られているので、適宜使用することができるが、これらに限定されるものではない。 As the LED light emitter, a semiconductor light emitting element, for example, GaAs (red), GaAsP (red), GaP (red, yellow, green), GaN (blue), Group 2-4 ZnSe x Te 1-x Since Zn x Cd 1-x Te, Group 3-5 GaSb, InAs, and the like are known, they can be used as appropriate, but are not limited thereto.

放熱装置２は、図１に示すように、ＬＥＤ光源装置１の基板１１の内壁裏側に設置され、主として、熱伝導管２１と熱伝導板２２、放熱部材２３、放熱片２４及び継手２５からなる。熱伝導管２１、熱伝導板２２、放熱部材２３及び放熱片２４が、ともに、金属からなる。熱伝導管２１は、図３で示すように、複数の多角形管材を集合した蜂巣状の管体である。   As shown in FIG. 1, the heat radiating device 2 is installed on the back side of the inner wall of the substrate 11 of the LED light source device 1, and mainly includes a heat conducting tube 21, a heat conducting plate 22, a heat radiating member 23, a heat radiating piece 24, and a joint 25. . The heat conducting tube 21, the heat conducting plate 22, the heat radiating member 23, and the heat radiating piece 24 are all made of metal. As shown in FIG. 3, the heat conduction tube 21 is a honeycomb tube body in which a plurality of polygonal tube materials are assembled.

また、該熱伝導管２１の先端が、基板１１の放熱空間１１１内に挿入し、基板１１の内縁壁にある熱伝導フィン１４と熱伝導管２１により、図４のように、その放熱空間１１１が完全に充填される。   Further, the tip of the heat conducting tube 21 is inserted into the heat radiating space 111 of the substrate 11 and the heat radiating space 111 is formed by the heat conducting fins 14 and the heat conducting tube 21 on the inner edge wall of the substrate 11 as shown in FIG. Is completely filled.

また、熱伝導管２１の先端だけが、放熱空間１１１に挿入して熱伝導フィン１４の一端に接触し、これにより、基板１１内に、より多い放熱空間１１１が保留される。熱伝導管２１の末端に、熱伝導板２２が接続し、放熱部材２３が設置され、該放熱部材２３の一端において、中心に、貫通孔２３１が形成される。貫通孔２３１の口径の大きさは、熱伝導板２２を収納して、該熱伝導板２２が、放熱部材２３の貫通孔２３１の内壁に直接に接触するように調整される。   Further, only the tip of the heat conducting tube 21 is inserted into the heat radiating space 111 and comes into contact with one end of the heat conducting fin 14, so that more heat radiating space 111 is reserved in the substrate 11. A heat conduction plate 22 is connected to the end of the heat conduction tube 21, and a heat radiating member 23 is installed. A through hole 231 is formed at the center of one end of the heat radiating member 23. The diameter of the through hole 231 is adjusted so that the heat conducting plate 22 is accommodated and the heat conducting plate 22 is in direct contact with the inner wall of the through hole 231 of the heat radiating member 23.

また、放熱部材２３の外側にも、囲むように、多数の放熱片２４が設置され、該放熱片２４により、快速的に熱エネルギーを伝導できる薄いシートで、放熱部材２３の末端に、更に、継手２５が設置され、該継手２５を、一般の電球ソケットに螺入することができる。   In addition, a large number of heat dissipating pieces 24 are also provided outside the heat dissipating member 23 so as to surround the heat dissipating member 24. A joint 25 is installed, and the joint 25 can be screwed into a general light bulb socket.

図５を参照する。ＬＥＤ光源装置１の発光体１２によって発光する場合、熱エネルギーが発生する時、ＬＥＤ光源装置１の基板１１の内縁壁に設置された熱伝導フィン１４により、直接に、基板１１上の熱エネルギーが、放熱装置２の熱伝導管２１へ伝導される。   Please refer to FIG. When light is emitted by the light emitter 12 of the LED light source device 1, when thermal energy is generated, the thermal energy on the substrate 11 is directly generated by the heat conduction fins 14 installed on the inner edge wall of the substrate 11 of the LED light source device 1. The heat is conducted to the heat conducting tube 21 of the heat radiating device 2.

また、熱伝導管２１により、熱エネルギーが、放熱装置２の熱伝導板２２と放熱部材２３へ順に伝導され、最後に、放熱部材２３の外側を囲む放熱片２４から放熱される。   Further, the heat conduction tube 21 sequentially conducts heat energy to the heat conducting plate 22 and the heat radiating member 23 of the heat radiating device 2, and finally radiates heat from the heat radiating piece 24 surrounding the outside of the heat radiating member 23.

前記の基板１１、熱伝導管２１、熱伝導板２２、放熱部材２３及び放熱片２４等が、ともに金属材料からなるため、その放熱が、よりスムーズに且つ迅速に行われる。   Since the substrate 11, the heat conduction tube 21, the heat conduction plate 22, the heat radiating member 23, the heat radiating piece 24, and the like are all made of a metal material, the heat is radiated more smoothly and quickly.

本発明によれば、前記各構成に、それぞれ、異なる比熱値を有する金属を使用し、また、熱伝導率の順に、先に熱エネルギーに接触する構成金属の比熱値が、後から熱エネルギーに接触する構成金属の比熱値より大きくするか又は等しくなるように、調整される。例えば、基板１１に、比熱値：９００のアルミニウムが使用されると、熱伝導管２１に、比熱値：３８５の銅が使用されると、熱エネルギーが、比熱値の比較的に低い金属での伝導速度が、比熱値の比較的に高い金属より速いという特性により、該金属材質設定により、本発明のＬＥＤ光源装置１は、図４のように、より効率的に放熱することができる。   According to the present invention, a metal having a different specific heat value is used for each of the above components, and the specific heat value of the component metal that comes into contact with the heat energy in the order of thermal conductivity is changed to the heat energy later. It adjusts so that it may become larger than or equal to the specific heat value of the constituent metal which contacts. For example, when aluminum having a specific heat value of 900 is used for the substrate 11, when copper having a specific heat value of 385 is used for the heat conduction tube 21, the heat energy is a metal having a relatively low specific heat value. Due to the property that the conduction speed is faster than that of a metal having a relatively high specific heat value, the LED light source device 1 of the present invention can radiate heat more efficiently as shown in FIG. 4 by setting the metal material.

そして、熱伝導管２１の先端だけを、放熱空間１１１内に挿入して熱伝導フィン１４の一端に接触させることにより、基板１１内に、より多い放熱空間１１１が保留されるので、該発光体１２の基板１１上に発生した熱エネルギーの一部が、熱伝導フィン１４の一端を介して、熱伝導管２１へ伝達される。   Since only the tip of the heat conduction tube 21 is inserted into the heat radiation space 111 and brought into contact with one end of the heat conduction fin 14, more heat radiation space 111 is reserved in the substrate 11. A part of the thermal energy generated on the 12 substrates 11 is transmitted to the heat conduction tube 21 through one end of the heat conduction fin 14.

また、一部のエネルギーが、放熱空間１１１内の気体により、熱伝導管２１へ伝導され、これは、気体の比熱値が、金属材質より高いため、上記の放熱効果が得られる。   Further, a part of the energy is conducted to the heat conducting tube 21 by the gas in the heat radiation space 111, and since the specific heat value of the gas is higher than that of the metal material, the above heat radiation effect is obtained.

本発明に係るＬＥＤ発光装置によれば、図５のように、該ＬＥＤ光源装置１の基板１１上に設けてある発光体１２によって発光する場合、基板１１の断面の円弧の中心角が約２７０°に設定されてあるため、光線を該ＬＥＤ光源装置１の照射範囲として設定された照射空間の各隅に、平均的に照射することができる。   According to the LED light emitting device of the present invention, as shown in FIG. 5, when light is emitted by the light emitter 12 provided on the substrate 11 of the LED light source device 1, the central angle of the arc of the cross section of the substrate 11 is about 270. Since the angle is set to 0 °, it is possible to irradiate light beams on average to each corner of the irradiation space set as the irradiation range of the LED light source device 1.

また、該基板１１の断面の円弧角度が、約２７０°に設定されているので、同時に、該発光体１２により発生した熱エネルギーが、直接に、基板１１へ伝導される。基板１１上の熱エネルギーが、続いて、基板１１の内縁壁に設置されたＬＥＤ光源装置１の放熱フィン１４へ伝導され、放熱フィン１４により、更に、熱エネルギーが、放熱装置２の熱伝導管２１へ伝導される。その熱エネルギーが、熱伝導管２１に沿って放熱装置２の熱伝導板２２へ伝導される。   Further, since the arc angle of the cross section of the substrate 11 is set to about 270 °, the thermal energy generated by the light emitter 12 is directly conducted to the substrate 11 at the same time. The heat energy on the substrate 11 is then conducted to the heat radiation fins 14 of the LED light source device 1 installed on the inner edge wall of the substrate 11, and the heat energy is further transferred by the heat radiation fins 14 to the heat conduction tube of the heat radiation device 2. Conducted to 21. The thermal energy is conducted along the heat conducting tube 21 to the heat conducting plate 22 of the heat radiating device 2.

そして、熱伝導板２２により伝導された熱エネルギーが、更に、放熱装置２の放熱部材２３へ伝導され、放熱部材２３を囲む放熱片２４により、放熱部材２３によって受けた熱エネルギーを分散して放熱する放熱効果を奏することができる。   The heat energy conducted by the heat conducting plate 22 is further conducted to the heat radiating member 23 of the heat radiating device 2, and the heat energy received by the heat radiating member 23 is dispersed by the heat radiating pieces 24 surrounding the heat radiating member 23 to dissipate heat. It is possible to achieve a heat dissipation effect.

また、図６に示すように、ＬＥＤ光源装置１の基板１１の断面の円弧の中心角が約１２０°に設定した場合、図７のように、円弧の中心角が２７０°である基板１１に比較すると、その照射範囲が、比較的に狭くなり集光した状態となる。   Further, as shown in FIG. 6, when the center angle of the arc of the cross section of the substrate 11 of the LED light source device 1 is set to about 120 °, the substrate 11 having the center angle of the arc of 270 ° as shown in FIG. In comparison, the irradiation range becomes relatively narrow and the light is condensed.

本発明に係るＬＥＤ発光構造体は、図４のように、ＬＥＤ光源装置１の発光体１２を、中心角が２７０°である断面円弧状の基板１１の外側に沿って嵌設してあるので、該発光体１２による照射範囲が、放射状の照射領域に照射し、照射する範囲をより拡大することができる。   In the LED light emitting structure according to the present invention, as shown in FIG. 4, the light emitter 12 of the LED light source device 1 is fitted along the outside of the substrate 11 having a circular arc cross section with a central angle of 270 °. The irradiation range by the light emitter 12 can irradiate the radial irradiation region, and the irradiation range can be further expanded.

また、ＬＥＤ光源装置１の裏端に、放熱装置２が設置されるため、発光体１２が発光することにより基板１１に発生した熱エネルギーを有効に放熱することができる。   Moreover, since the heat radiating device 2 is installed at the back end of the LED light source device 1, it is possible to effectively radiate the thermal energy generated in the substrate 11 by the light emitting body 12 emitting light.

また、放熱装置２の末端に、継手２５が設置され、該継手２５が、一般電球のソケットに螺合できるため、従来の白熱電球の代わりに、本発明に係るＬＥＤ発光構造体を使用することができる。また、本発明によれば、図２のように、基板１１と発光体１２の最外側に、透過層１３が被覆されたものである。該透過層１３が、耐熱可能な透過ゲルからなるため、透過片が不要になり、コストを節約することができる。また、有効に照射範囲を増大できるＬＥＤ発光構造体を提供することができる。   Moreover, since the joint 25 is installed in the terminal of the thermal radiation apparatus 2, and this joint 25 can be screwed together with the socket of a general light bulb, it uses the LED light emission structure which concerns on this invention instead of the conventional incandescent light bulb. Can do. Further, according to the present invention, as shown in FIG. 2, the outermost side of the substrate 11 and the light emitter 12 is coated with the transmission layer 13. Since the permeable layer 13 is made of a heat-resistant permeable gel, no transmissive piece is required, and costs can be saved. Moreover, the LED light-emitting structure which can increase an irradiation range effectively can be provided.

以上は、本発明のより好ましい実施例であり、本発明は、それらによって限定されるものではなく、また、本発明に係わる特許請求の範囲及び明細書の内容に基づいて行った等価の変更や修正は、全てが、本発明の特許請求の範囲内に含まれることは明らかである。   The above is a more preferred embodiment of the present invention, and the present invention is not limited thereto, and equivalent changes made based on the content of the claims and the specification related to the present invention Obviously, all modifications are within the scope of the claims of the present invention.

本発明の一実施形態によるＬＥＤ発光灯の分解斜視図である。It is a disassembled perspective view of the LED light-emitting lamp by one Embodiment of this invention. 図１で示すＬＥＤ発光灯のＬＥＤ灯源のＡ-Ａ断面概念図である。It is an AA cross-sectional conceptual diagram of the LED lamp source of the LED light-emitting lamp shown in FIG. 本発明の一実施形態によるＬＥＤ発光灯の一部断面斜視図である。It is a partial cross section perspective view of the LED light-emitting lamp by one Embodiment of this invention. 本発明の一実施形態によるＬＥＤ発光灯のＬＥＤ灯源が中空である場合を示す断面概念図である。It is a section conceptual diagram showing the case where the LED lamp source of the LED luminous lamp by one embodiment of the present invention is hollow. 本発明に係る一実施形態によるＬＥＤ発光灯のＬＥＤ灯源が発光する場合を示す断面概念図である。It is a section conceptual diagram showing the case where the LED lamp source of the LED light-emitting lamp according to one embodiment of the present invention emits light. 本発明の他の実施形態によるＬＥＤ発光灯の分解斜視図である。It is a disassembled perspective view of the LED light-emitting lamp by other embodiment of this invention. 本発明の他の実施形態によるＬＥＤ発光灯のＬＥＤ灯源が発光する場合を示す断面図である。It is sectional drawing which shows the case where the LED lamp source of the LED light-emitting lamp by other embodiment of this invention light-emits.

１ ＬＥＤ光源装置
１１ 基板
１１１ 放熱空間
１２ 発光体
１３ 透過層
１４ 放熱フィン
２ 放熱装置
２１ 熱伝導管
２２ 熱伝導板
２３ 放熱部材
２３１ 貫通孔
２４ 放熱片
２５ 継手 DESCRIPTION OF SYMBOLS 1 LED light source device 11 Substrate 111 Radiation space 12 Light emitter 13 Transmission layer 14 Radiation fin 2 Heat radiation device 21 Heat conduction tube 22 Heat conduction plate 23 Heat radiation member 231 Through hole 24 Heat radiation piece 25 Joint

Claims (5)

少なくとも、主として、基板、発光体及び透過層からなるＬＥＤ光源装置であって、基板が円弧状の断面を有し、金属からなる材料により一体成形された板材であり、該基板の外観が、球体に類似したものであり、円弧状の外側に、複数の発光体が設置され、該発光体が、晶粒状のＬＥＤであり、前記基板と前記発光体の最外側に、前記透過層が被覆され、前記基板の内縁壁に、複数の熱伝導フィンが設置されてなるＬＥＤ光源装置から構成されたことを特徴とするＬＥＤ発光構造体。   At least an LED light source device mainly composed of a substrate, a light emitter, and a transmission layer, the substrate having a circular arc-shaped cross section, and a plate material integrally formed of a material made of metal. A plurality of light emitters are installed on the outer side of the arc shape, and the light emitter is a crystal-like LED, and the outermost layer of the substrate and the light emitter is covered with the transmission layer. An LED light emitting structure comprising an LED light source device in which a plurality of heat conductive fins are installed on an inner edge wall of the substrate. 前記ＬＥＤ光源装置の基板の内壁の裏側に、さらに、放熱装置が接続され、該放熱装置が、主として、熱伝導管、熱伝導板、放熱部材及び放熱片からなり、前記熱伝導管、熱伝導板、放熱部材及び放熱片が、ともに、金属からなり、前記熱伝導管が、複数の管体を集合してなり、前記熱伝導管の先端が、基板の円弧状内に挿入して、基板の内縁壁に設けてある熱伝導フィンと該熱伝導管とが直接に接触し、前記熱伝導管の末端に前記熱伝導板が固定され、前記放熱部材の一端において、中心に、貫通孔が形成され、該貫通孔の口径の大きさが、前記熱伝導板を収納して、前記貫通孔の内壁と直接に接触できるように調整され、前記放熱部材の外側にも、囲むように、複数の前記放熱片が設置されることを特徴とする請求項１に記載のＬＥＤ発光構造体。   A heat radiating device is further connected to the back side of the inner wall of the substrate of the LED light source device, and the heat radiating device mainly comprises a heat conduction tube, a heat conduction plate, a heat radiating member and a heat radiating piece, and the heat conduction tube, heat conduction The plate, the heat radiating member, and the heat radiating piece are all made of metal, the heat conducting tube is a collection of a plurality of tubes, and the tip of the heat conducting tube is inserted into the arc shape of the substrate, The heat conduction fin provided on the inner edge wall of the heat conduction tube is in direct contact with the heat conduction tube, the heat conduction plate is fixed to the end of the heat conduction tube, and a through hole is formed at the center at one end of the heat dissipation member. The through hole is formed and adjusted so that the diameter of the through hole accommodates the heat conducting plate and can be in direct contact with the inner wall of the through hole. The LED radiator according to claim 1, wherein the heat radiation piece is installed. Structure. 前記放熱装置の熱伝導管は、複数の多角形管材を集合してからなる蜂巣状の管体であることを特徴とする請求項２に記載のＬＥＤ発光構造体。   The LED light emitting structure according to claim 2, wherein the heat conduction tube of the heat dissipation device is a honeycomb tube formed by collecting a plurality of polygonal tube materials. 前記ＬＥＤ光源装置の基板と放熱装置の熱伝導管、熱伝導板、放熱部材、及び放熱片は、それぞれ金属材質からなり、前記基板に使用された金属材質の比熱値が、前記熱伝導管に使用された金属材質の比熱値より大きいか又は等しく、該熱伝導管に使用された金属材質の比熱値が、前記熱伝導板に使用された金属材質の比熱値より大きいか又は等しく、該熱伝導板に使用された金属材質の比熱値が、前記放熱部材に使用された金属材質の比熱値より大きいか又は等しく、該放熱部材に使用された金属材質の比熱値が前記放熱片に使用された金属材質の比熱値より大きいか又は等しいことを特徴とする請求項２に記載のＬＥＤ発光構造体。   The substrate of the LED light source device and the heat conducting tube, the heat conducting plate, the heat radiating member, and the heat radiating piece of the heat radiating device are each made of a metal material, and the specific heat value of the metal material used for the substrate is the heat conduction tube. The specific heat value of the metal material used for the heat conducting tube is greater than or equal to the specific heat value of the metal material used, and the specific heat value of the metal material used for the heat conduction plate is greater than or equal to the specific heat value of the metal material used. The specific heat value of the metal material used for the conductive plate is greater than or equal to the specific heat value of the metal material used for the heat radiating member, and the specific heat value of the metal material used for the heat radiating member is used for the heat radiating piece. The LED light emitting structure according to claim 2, wherein the LED light emitting structure is greater than or equal to a specific heat value of the metal material. 前記放熱装置の前記放熱部材は、末端に継手が設置され、該継手が、一般の灯座に螺入されることができることを特徴とする請求項２に記載のＬＥＤ発光構造体。
The LED light emitting structure according to claim 2, wherein a joint is installed at an end of the heat dissipation member of the heat dissipation device, and the joint can be screwed into a general light seat.
JP2009267953A 2009-11-25 2009-11-25 Led light emitting structure Pending JP2011113746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009267953A JP2011113746A (en) 2009-11-25 2009-11-25 Led light emitting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009267953A JP2011113746A (en) 2009-11-25 2009-11-25 Led light emitting structure

Publications (1)

Publication Number Publication Date
JP2011113746A true JP2011113746A (en) 2011-06-09

Family

ID=44235941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009267953A Pending JP2011113746A (en) 2009-11-25 2009-11-25 Led light emitting structure

Country Status (1)

Country Link
JP (1) JP2011113746A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102635801A (en) * 2012-04-09 2012-08-15 中山市鸿宝电业有限公司 Novel LED (light-emitting diode) down lamp

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110731U (en) * 1990-02-27 1991-11-13
JPH03121905U (en) * 1990-03-28 1991-12-12
JP2002208301A (en) * 2001-01-12 2002-07-26 Toshiba Lighting & Technology Corp Solid light source
JP2006244725A (en) * 2005-02-28 2006-09-14 Atex Co Ltd Led lighting system
JP2008522349A (en) * 2004-11-29 2008-06-26 ティーアイアール システムズ リミテッド Integrated module lighting unit
JP3144283U (en) * 2008-06-12 2008-08-21 麗鴻科技股▲ふん▼有限公司 Light emitting diode lamp
JP2008204671A (en) * 2007-02-17 2008-09-04 Nichia Chem Ind Ltd Illumination device
JP2010524210A (en) * 2007-04-03 2010-07-15 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング Semiconductor optical module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110731U (en) * 1990-02-27 1991-11-13
JPH03121905U (en) * 1990-03-28 1991-12-12
JP2002208301A (en) * 2001-01-12 2002-07-26 Toshiba Lighting & Technology Corp Solid light source
JP2008522349A (en) * 2004-11-29 2008-06-26 ティーアイアール システムズ リミテッド Integrated module lighting unit
JP2006244725A (en) * 2005-02-28 2006-09-14 Atex Co Ltd Led lighting system
JP2008204671A (en) * 2007-02-17 2008-09-04 Nichia Chem Ind Ltd Illumination device
JP2010524210A (en) * 2007-04-03 2010-07-15 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング Semiconductor optical module
JP3144283U (en) * 2008-06-12 2008-08-21 麗鴻科技股▲ふん▼有限公司 Light emitting diode lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102635801A (en) * 2012-04-09 2012-08-15 中山市鸿宝电业有限公司 Novel LED (light-emitting diode) down lamp

Similar Documents

Publication Publication Date Title
US9435492B2 (en) LED luminaire with improved thermal management and novel LED interconnecting architecture
JP4805347B2 (en) Light emitting diode cluster lamp
JP5539588B2 (en) Lighting device with reverse tapered heat sink
US10030819B2 (en) LED lamp and heat sink
JP2010055993A (en) Lighting system and luminaire
KR20120039620A (en) Solid state light source light bulb
JP2007324137A (en) Lighting system
JP2013533583A (en) LED spotlight
JP2010016223A (en) Lamp
JP2008300570A (en) Light emitting device
US20130094177A1 (en) Wavelength conversion component with improved thermal conductive characteristics for remote wavelength conversion
JP2009032466A (en) Illuminating device
US11466847B2 (en) Led filament arrangement with heat sink structure
JP3164034U (en) LED lighting device
JP2022549024A (en) light emitting device
US9651240B2 (en) LED lamp
JP5382335B2 (en) Light bulb shaped lamp and lighting equipment
JP3112794U (en) Radiator for light-emitting diode lamp
JP2011113746A (en) Led light emitting structure
JP3177084U (en) Combination heat dissipation structure for LED bulbs
JP2013030598A (en) Heat generation device
JP2003288806A (en) Lighting device
JP5551562B2 (en) lamp
JP2012074251A (en) Lamp
JP6076605B2 (en) LED light emitting device

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111206

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120508