JP2011103358A5 - - Google Patents
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- Publication number
- JP2011103358A5 JP2011103358A5 JP2009257469A JP2009257469A JP2011103358A5 JP 2011103358 A5 JP2011103358 A5 JP 2011103358A5 JP 2009257469 A JP2009257469 A JP 2009257469A JP 2009257469 A JP2009257469 A JP 2009257469A JP 2011103358 A5 JP2011103358 A5 JP 2011103358A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- mounting structure
- structure according
- semiconductor mounting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (6)
前記基板上に実装された、側面に凹凸部が設けられたシリコン基板と、
前記シリコン基板の上に実装された半導体チップと、
前記半導体チップを覆うと共に、前記シリコン基板の上面を封止する絶縁層とを備える、半導体実装構造体。 A substrate,
A silicon substrate mounted on the substrate and provided with uneven portions on the side surfaces;
A semiconductor chip mounted on the silicon substrate;
A semiconductor mounting structure comprising: an insulating layer that covers the semiconductor chip and seals the upper surface of the silicon substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009257469A JP5357706B2 (en) | 2009-11-10 | 2009-11-10 | Semiconductor mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009257469A JP5357706B2 (en) | 2009-11-10 | 2009-11-10 | Semiconductor mounting structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011103358A JP2011103358A (en) | 2011-05-26 |
| JP2011103358A5 true JP2011103358A5 (en) | 2012-10-25 |
| JP5357706B2 JP5357706B2 (en) | 2013-12-04 |
Family
ID=44193584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009257469A Expired - Fee Related JP5357706B2 (en) | 2009-11-10 | 2009-11-10 | Semiconductor mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5357706B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5709719B2 (en) * | 2011-01-18 | 2015-04-30 | 有限会社 ナプラ | Electronic component support apparatus and electronic device |
| JP2013003714A (en) * | 2011-06-14 | 2013-01-07 | Denso Corp | Power supply device and electronic control device for vehicle |
| JP6279921B2 (en) * | 2014-02-12 | 2018-02-14 | 新光電気工業株式会社 | Wiring board and semiconductor package |
| WO2017188253A1 (en) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | Substrate for mounting electronic component, electronic device and electronic module |
| WO2018142499A1 (en) * | 2017-02-01 | 2018-08-09 | 三菱電機株式会社 | Wavelength-variable light source |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169029A (en) * | 1992-05-11 | 1994-06-14 | Nec Corp | Radiating pad for pwb |
| JP2004221248A (en) * | 2003-01-14 | 2004-08-05 | Citizen Electronics Co Ltd | Semiconductor device |
| JP4179186B2 (en) * | 2004-02-25 | 2008-11-12 | ソニー株式会社 | WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE |
| KR100703090B1 (en) * | 2005-08-30 | 2007-04-06 | 삼성전기주식회사 | A Back Side Ground Type Flip Chip Semiconductor Package |
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2009
- 2009-11-10 JP JP2009257469A patent/JP5357706B2/en not_active Expired - Fee Related