JP2011091112A - Method for manufacturing electronic component mounting substrate and electronic component mounting substrate - Google Patents

Method for manufacturing electronic component mounting substrate and electronic component mounting substrate Download PDF

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JP2011091112A
JP2011091112A JP2009241823A JP2009241823A JP2011091112A JP 2011091112 A JP2011091112 A JP 2011091112A JP 2009241823 A JP2009241823 A JP 2009241823A JP 2009241823 A JP2009241823 A JP 2009241823A JP 2011091112 A JP2011091112 A JP 2011091112A
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hole
substrate
conductor layer
filling
copper plate
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JP5380243B2 (en
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Beji Sasaki
ベジ 佐々木
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Freesia Makurosu Kk
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Freesia Makurosu Kk
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Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability by enhancing bondability between a conductive member also serving as a heat dissipation member and a through-hole. <P>SOLUTION: Copper plates 3, 5 are disposed on both upper and lower sides of an insulated substrate 1 having a substrate through-hole 1a, and a filling copper plate 7 is disposed on the upper copper plate 3. A small-diameter through-hole 3a concentric with the substrate through-hole 1a is formed at the upper copper plate 3. In this state, an ultra-hard drill 9 whose blade edge on the tip is heated is made to be close to the filling copper plate 7 while rotating, and the copper plate 3 around the through-hole 3a and the filling copper plate 7 are molten, thereby filling the substrate through-hole 1a with a molten material. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、絶縁基板の両面に設けた導体層相互を導電部材によって接続する電子部品搭載用基板の製造方法及び電子部品搭載用基板に関する。   The present invention relates to an electronic component mounting substrate manufacturing method and an electronic component mounting substrate in which conductor layers provided on both surfaces of an insulating substrate are connected to each other by a conductive member.

絶縁基板の両面に銅箔による導体層を設け、この絶縁基板に設けた貫通孔に放熱部材を圧入することによって両面の導体層相互を接続し、もって放熱特性を改善させるようにした電子部品搭載用基板が知られている（下記特許文献１）。   Electronic component mounting in which a conductor layer made of copper foil is provided on both sides of an insulating substrate, and a heat-dissipating member is press-fitted into a through-hole provided in the insulating substrate, thereby connecting the conductor layers on both sides to improve heat dissipation characteristics. A substrate is known (Patent Document 1 below).

特許第３１７４３９３号公報Japanese Patent No. 3174393

しかしながら、上記した従来の電子部品搭載用基板では、１本のピン状の放熱部材を、両面に導体層を設けた絶縁基板の貫通孔に圧入しているだけなので、放熱部材と貫通孔との間に隙間が発生しやすく相互間の密着性が充分とは言えず、改善が望まれている。   However, in the above-described conventional electronic component mounting board, a single pin-shaped heat radiating member is only press-fitted into the through hole of the insulating substrate provided with the conductor layer on both sides. A gap is easily generated between them, and the adhesion between them is not sufficient, and improvement is desired.

そこで、本発明は、放熱部材を兼ねる導電部材と貫通孔との間の密着性を高めて信頼性を向上させることを目的としている。   Then, this invention aims at improving the reliability by improving the adhesiveness between the electroconductive member which serves as a heat radiating member, and a through-hole.

本発明は、基板貫通孔を備える絶縁基板の両面に導体層をそれぞれ配置するとともに、前記基板貫通孔に対応して該基板貫通孔よりも小さい貫通孔を備える一方の前記導体層の表面に充填用導体層を配置し、前記一方の導体層の貫通孔に対応する位置の前記充填用導体層の表面に、前記貫通孔の内径よりも大きくかつ前記基板貫通孔の内径よりも小さい直径の加熱部材を押し当てることで、前記貫通孔周辺の一方の導体層及び充填用導体層を溶融させ、前記充填用導体層の溶融物の一部を前記一方の導体層の貫通孔から流下させるとともに、該一方の導体層の溶融物の一部を流下させて、これら流下物を前記基板貫通孔に充填し、前記一方の導体層の貫通孔に対応する部位及びその周囲を、前記充填用導体層の溶融物の他の一部及び前記一方の導体層の溶融物の他の一部で充填し、これら充填した溶融物を固化させた後、前記充填用導体層を前記一方の導体層から離脱させることを特徴とする。 According to the present invention, conductor layers are respectively disposed on both surfaces of an insulating substrate having a substrate through hole, and the surface of one conductor layer having a through hole smaller than the substrate through hole corresponding to the substrate through hole is filled. The conductive layer is disposed, and heating is performed on the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer with a diameter larger than the inner diameter of the through hole and smaller than the inner diameter of the substrate through hole. By pressing the member, the one conductor layer and the filling conductor layer around the through hole are melted, and a part of the melt of the filling conductor layer flows down from the through hole of the one conductor layer, A part of the melted material of the one conductor layer is caused to flow down, the falling material is filled into the substrate through-hole, and the portion corresponding to the through-hole of the one conductor layer and the periphery thereof are filled with the filling conductor layer. The other part of the melt and said one Filled with another portion of the melt of the conductive layer, after solidifying the melt was these filled, characterized in that disengaging said filling conductive layer from the conductive layer of the one.

本発明によれば、一方の導体層及びその上部に配置した充填用導体層を、加熱部材を用いて溶融させることで絶縁基板の基板貫通孔に溶融物を充填し、この充填して固化させた導電部により導体層相互を接続するようにしたので、導電部による基板貫通孔に対する密着性が高まるとともに、溶融物である導電部が各導体層に一体化して各導体層相互間での導電性及び放熱性が向上し、電子部品搭載用基板として信頼性を高めることができる。   According to the present invention, one of the conductor layers and the filling conductor layer disposed thereon are melted by using a heating member to fill the substrate through-hole of the insulating substrate with the melt, and this is filled and solidified. Since the conductive layers are connected to each other by the conductive portions, the adhesion of the conductive portions to the substrate through-holes is enhanced, and the conductive portions that are melts are integrated into the conductive layers to conduct the electric conduction between the conductive layers. And heat dissipation are improved, and the reliability of the electronic component mounting board can be improved.

本発明の一実施形態を示す電子部品搭載用基板の製造工程図で、（ａ）は４つの部材相互の配置状態、（ｂ）は（ａ）の４つの部材を位置決めしつつ重ね合わせた状態、（ｃ）は（ｂ）の重ね合わせた状態で加熱した超硬ドリルを最上部の充填用銅板に接近させている状態である。BRIEF DESCRIPTION OF THE DRAWINGS It is a manufacturing-process figure of the electronic component mounting board | substrate which shows one Embodiment of this invention, (a) is the arrangement | positioning state of four members mutually, (b) is the state which overlapped while positioning the four members of (a) (C) is the state which has made the super hard drill heated in the piled-up state of (b) approach the uppermost copper plate for filling. 図１に続く電子部品搭載用基板の製造工程図で、（ａ）は加熱した超硬ドリルを充填用銅板に接触させて該充填用銅板及び一方の銅板を溶融させている状態、（ｂ）は（ａ）の溶融物が固化して充填用銅板を離脱させ、基板貫通孔内の導電部により銅板相互を接続した状態、（ｃ）は、（ｂ）の工程の後に、スルーホールとなる孔明け加工を実施して銅板表面に金属メッキ層を形成し、所定の後工程を経て完成したプリント配線板に電子部品を実装した状態である。FIG. 2 is a manufacturing process diagram of an electronic component mounting board subsequent to FIG. 1, wherein (a) is a state in which a heated carbide drill is brought into contact with a filling copper plate to melt the filling copper plate and one copper plate; Is a state where the melt of (a) is solidified and the copper plate for filling is detached and the copper plates are connected to each other by the conductive portion in the substrate through hole, and (c) becomes a through hole after the step (b). This is a state in which a punching process is performed to form a metal plating layer on the copper plate surface, and electronic components are mounted on a printed wiring board completed through a predetermined post-process. 図１の充填用銅板に代えて充填用銅片を使用する場合の図１（ｃ）に対応する断面図である。It is sectional drawing corresponding to FIG.1 (c) in the case of using a copper piece for filling instead of the copper plate for filling of FIG.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

まず、図１（ａ）に示すように、絶縁層となる絶縁基板１と、その上下両側に位置する導体層となる銅板３，５と、上部の銅板３のさらに上部に位置する充填用導体層となる充填用銅板７とを用意する。絶縁基板１は、例えばガラス繊維からなる基材に接着剤に相当する熱硬化性樹脂である例えばエポキシ樹脂を上下方面に含浸させた半硬化状態のプリプレグである。すなわち、本絶縁基板１は、接着剤をあらかじめ設けていることになる。   First, as shown in FIG. 1A, an insulating substrate 1 serving as an insulating layer, copper plates 3 and 5 serving as conductor layers located on both upper and lower sides thereof, and a filling conductor located further above the upper copper plate 3 A filling copper plate 7 to be a layer is prepared. The insulating substrate 1 is a semi-cured prepreg in which, for example, an epoxy resin, which is a thermosetting resin corresponding to an adhesive, is impregnated on the upper and lower surfaces of a base material made of glass fiber. That is, the insulating substrate 1 is provided with an adhesive in advance.

上記した絶縁基板１には基板貫通孔１ａを形成し、上部の銅板３には、基板貫通孔１ａと同心状でかつ基板貫通孔１ａよりも小径の貫通孔としての銅板貫通孔３ａを形成してある。   A substrate through hole 1a is formed in the insulating substrate 1 described above, and a copper plate through hole 3a is formed in the upper copper plate 3 as a through hole that is concentric with the substrate through hole 1a and has a smaller diameter than the substrate through hole 1a. It is.

次に、図１（ｂ）に示すように、上記した４つの部材を、図１（ａ）の配置状態、すなわち、最下部から順に、銅板５，絶縁基板１，銅板３，充填用銅板７となるようこれらを水平状態で重ね合わせる。このとき、基板貫通孔１ａと銅板貫通孔３ａとは中心がほぼ一致しており、この状態で図示しない加工設備に位置決めピンなどを用いて位置決め固定する。   Next, as shown in FIG. 1 (b), the above four members are arranged in the arrangement state of FIG. 1 (a), that is, in order from the bottom, copper plate 5, insulating substrate 1, copper plate 3, filling copper plate 7 These are superposed in a horizontal state so that At this time, the center of the substrate through hole 1a and the copper plate through hole 3a are substantially coincident, and in this state, the substrate through hole 1a is positioned and fixed to a processing facility (not shown) using a positioning pin or the like.

そして、この状態で、図１（ｃ）に示すように、先端を平坦とした加熱部材としての超硬ドリル９を、その中心軸線を基板貫通孔１ａ及び銅板貫通孔３ａの中心に合わせた状態で、回転させながら最上部の充填用銅板７に押し付ける。なお、このとき超硬ドリル９の先端（刃先）を１５００℃程度に加熱し、回転速度は、溶融した銅が飛散らない程度の、例えば２０〜８０ｒｐｍ程度とする。   And in this state, as shown in FIG.1 (c), the state which matched the center axis line with the center of the board | substrate through-hole 1a and the copper plate through-hole 3a of the carbide drill 9 as a heating member which made the front-end | tip flat. Then, it is pressed against the uppermost filling copper plate 7 while rotating. At this time, the tip (blade edge) of the cemented carbide drill 9 is heated to about 1500 ° C., and the rotation speed is set to about 20 to 80 rpm, for example, so that molten copper is not scattered.

これにより、図２（ａ）に示すように、まず銅板貫通孔３ａ周辺の充填用銅板７が孔明け加工されつつ溶融し、その溶融物の一部が銅板３の銅板貫通孔３ａから流下して絶縁基板１の基板貫通孔１ａに充填され充填物７ｂとなる。この際、銅板３の一部も溶融して自身の銅板貫通孔３ａから流下して基板貫通孔１ａに充填される。このとき、絶縁基板１も加熱されることから、基板貫通孔１ａが当初の形状（円形）に対し内側に突出するなどして変形する。   2A, first, the filling copper plate 7 around the copper plate through hole 3a is melted while being drilled, and a part of the melt flows down from the copper plate through hole 3a of the copper plate 3. Thus, the substrate through-hole 1a of the insulating substrate 1 is filled to become a filler 7b. At this time, a part of the copper plate 3 is also melted and flows down from its own copper plate through hole 3a and filled into the substrate through hole 1a. At this time, since the insulating substrate 1 is also heated, the substrate through-hole 1a is deformed by protruding inward with respect to the original shape (circular shape).

その後、超硬ドリル９を、その先端面が銅板３の下面にほぼ達する位置もしくはその直前付近まで下降させることで、絶縁基板１の基板貫通孔１ａに対応する部分周辺の銅板３及び充填用銅板７が溶融し、超硬ドリル９の周囲の銅板３及び充填用銅板７が溶融状態となる。   Thereafter, the carbide drill 9 is lowered to a position where the tip end surface thereof almost reaches the lower surface of the copper plate 3 or to a position immediately before it, so that the copper plate 3 and the filling copper plate around the portion corresponding to the substrate through hole 1a of the insulating substrate 1 7 melts, and the copper plate 3 and the filling copper plate 7 around the cemented carbide drill 9 enter a molten state.

そしてこの状態で、超硬ドリル９を後退（上昇）させると、図２（ｂ）に示すように、基板貫通孔１ａには、充填用銅板７及び銅板３の溶融物が充填された状態になるとともに、銅板３の銅板貫通孔３ａ周囲の基板貫通孔１ａに対応する部位には、銅板３の溶融物とその上部の充填用銅板７の溶融物が充填された状態になる。その後時間経過によって、これらの溶融物が固化して導電部１１及び銅板固化部１３となり、導電部１１はその下部の銅板５に一体化するとともに、その上部の銅板固化部１３と一体化し、さらにこの銅板固化部１３はその周囲の銅板３とも一体化する。   In this state, when the carbide drill 9 is retracted (raised), as shown in FIG. 2B, the substrate through-hole 1a is filled with the melt of the filling copper plate 7 and the copper plate 3. At the same time, the portion of the copper plate 3 corresponding to the substrate through hole 1a around the copper plate through hole 3a is filled with the melt of the copper plate 3 and the melt of the filling copper plate 7 on the upper portion thereof. Thereafter, with the lapse of time, these melts solidify into conductive portions 11 and copper plate solidified portions 13, and the conductive portions 11 are integrated with the lower copper plate 5, and are integrated with the upper copper plate solidified portion 13, This copper plate solidification part 13 is also integrated with the surrounding copper plate 3.

なお、加熱して使用する超硬ドリル９は、剥離剤をコーティングしたものを使用し、これにより銅板３及び充填用銅板７の溶融物の固着を防いでいる。また、図２（ｂ）における銅板固化部１３の表面は、研磨仕上げして平滑化している。   In addition, the carbide drill 9 used by heating uses what coated the release agent, and this prevents adhesion of the melt of the copper plate 3 and the filling copper plate 7. Further, the surface of the copper plate solidified portion 13 in FIG. 2B is polished and smoothed.

その後、絶縁基板１とその両側の各銅板３，５との３つの部材を、図示しない加圧プレスによって加熱しつつ加圧することで、プリプレグである絶縁基板１中のあらかじめ設けてある接着剤を溶融させて絶縁基板１と各銅板３，５とを圧着して接合し積層体を形成する。   Thereafter, the three members of the insulating substrate 1 and the copper plates 3 and 5 on both sides of the insulating substrate 1 are pressurized while being heated by a pressure press (not shown), so that the adhesive provided in advance in the insulating substrate 1 which is a prepreg is applied. The insulating substrate 1 and the copper plates 3 and 5 are joined by being melted and bonded to form a laminate.

続いて、この積層体に対し、図示しないスルーホールとなる所定の孔明け加工を実施してから、図２（ｃ）に示すように、図２（ａ）の絶縁基板１の両側における各銅板３，５の表面に銅などによる金属メッキ層１５，１７をそれぞれ形成するとともに、スルーホールの内面にも同様にして金属メッキ層を形成する。そして、上記金属メッキ層１５，１７に対してエッチング処理によって所要の回路パターンを形成した上で、所要の電子部品１９を実装する。   Subsequently, the laminated body is subjected to a predetermined drilling process to be a through hole (not shown), and then, as shown in FIG. 2 (c), the copper plates on both sides of the insulating substrate 1 in FIG. 2 (a). Metal plating layers 15 and 17 made of copper or the like are formed on the surfaces 3 and 5, respectively, and metal plating layers are similarly formed on the inner surfaces of the through holes. And after forming a required circuit pattern by the etching process with respect to the said metal plating layers 15 and 17, the required electronic component 19 is mounted.

上記のように溶融物が固化して形成された導電部１１は、前記した所要の回路パターンによって、電子部品１９が実装される金属メッキ層１５及び銅板３から銅板５及び金属メッキ層１７に向けて電流を流す導電部材として機能すると同時に、電子部品１９から発生する熱を金属メッキ層１５及び銅板３から銅板５及び金属メッキ層１７に伝達して放熱する放熱部材としても機能する。   The conductive part 11 formed by solidifying the melt as described above is directed from the metal plating layer 15 and the copper plate 3 on which the electronic component 19 is mounted to the copper plate 5 and the metal plating layer 17 according to the required circuit pattern. It also functions as a heat radiating member that transmits heat from the metal plating layer 15 and the copper plate 3 to the copper plate 5 and the metal plating layer 17 and dissipates heat.

このように、本実施形態によれば、絶縁基板１の基板貫通孔１ａに対応する部位の銅板３及び充填用銅板７を溶融させて、該溶融物を基板貫通孔１ａ内に充填させて導電部１１を形成するようにしたので、導電部１１によって基板貫通孔１ａに対する密着性が高まり、耐振動性が向上して経時劣化にも有効となる。これと同時に、上下の銅板３，５が、銅板３及び充填用銅板７の溶融物を固化させた導電部１１と銅板固化部１３とによって一体化しているので、銅板３，５相互間での導電性及び放熱性が向上する。   As described above, according to the present embodiment, the copper plate 3 and the filling copper plate 7 corresponding to the substrate through hole 1a of the insulating substrate 1 are melted, and the melt is filled in the substrate through hole 1a to conduct electricity. Since the portion 11 is formed, the adhesion to the substrate through-hole 1a is enhanced by the conductive portion 11, the vibration resistance is improved, and the deterioration with time is effective. At the same time, since the upper and lower copper plates 3 and 5 are integrated by the conductive portion 11 and the copper plate solidified portion 13 that solidify the melt of the copper plate 3 and the filling copper plate 7, Conductivity and heat dissipation are improved.

以上によって、本実施形態の電子部品搭載用基板の信頼性を高めることができる。   As described above, the reliability of the electronic component mounting board according to the present embodiment can be improved.

なお、本実施形態では、加熱部材として超硬ドリル９を用いているが、単に円柱形状のピン状の部材を用いてもよい。超硬ドリル９を用いることで孔明け作用も発生するので、銅板３及び充填用銅板７をより容易に短時間に溶融させることができ、作業性が向上する。一方、加熱部材としてピン状の部材を用いることで、安価な工具で済み、製造コストを抑えることができる。ピン状の部材の場合には、回転させてもよく、回転させずに単に押付けるだけでもよい。   In the present embodiment, the carbide drill 9 is used as the heating member, but a cylindrical pin-shaped member may be used. Since the drilling action is also generated by using the carbide drill 9, the copper plate 3 and the filling copper plate 7 can be melted more easily in a short time, and workability is improved. On the other hand, by using a pin-shaped member as the heating member, an inexpensive tool can be used, and the manufacturing cost can be reduced. In the case of a pin-shaped member, it may be rotated or simply pressed without rotating.

また、上記した基板貫通孔１３ａ及び銅板貫通孔３ａは円形としているが、円形に限らず、四角形や多角形でもよい。   Moreover, although the board | substrate through-hole 13a and the copper plate through-hole 3a which were mentioned above are circular, not only circular but a square and a polygon may be sufficient.

また、図３に示すように、銅板３の銅板貫通孔３ａに対応する位置の表面上に、図１に示した充填用銅板７に代わる充填用銅片７Ａを配置してもよい。   Further, as shown in FIG. 3, a filling copper piece 7 </ b> A in place of the filling copper plate 7 shown in FIG. 1 may be disposed on the surface of the copper plate 3 corresponding to the copper plate through hole 3 a.

１ 絶縁基板
１ａ 基板貫通孔
３，５ 銅板（導体層）
３ａ 銅板貫通孔
７ 充填用銅板（充填用導体層）
９ 超硬ドリル（加熱部材） 1 Insulating substrate 1a Substrate through hole 3,5 Copper plate (conductor layer)
3a Copper plate through hole 7 Filling copper plate (filling conductor layer)
9 Carbide drill (heating member)

Claims (3)

基板貫通孔を備える絶縁基板の両面に導体層をそれぞれ配置するとともに、前記基板貫通孔に対応して該基板貫通孔よりも小さい貫通孔を備える一方の前記導体層の表面に充填用導体層を配置し、前記一方の導体層の貫通孔に対応する位置の前記充填用導体層の表面に、前記貫通孔の内径よりも大きくかつ前記基板貫通孔の内径よりも小さい直径の加熱部材を押し当てることで、前記貫通孔周辺の一方の導体層及び充填用導体層を溶融させ、前記充填用導体層の溶融物の一部を前記一方の導体層の貫通孔から流下させるとともに、該一方の導体層の溶融物の一部を流下させて、これら流下物を前記基板貫通孔に充填し、前記一方の導体層の貫通孔に対応する部位及びその周囲を、前記充填用導体層の溶融物の他の一部及び前記一方の導体層の溶融物の他の一部で充填し、これら充填した溶融物を固化させた後、前記充填用導体層を前記一方の導体層から離脱させることを特徴とする電子部品搭載用基板の製造方法。   Conductor layers are disposed on both surfaces of an insulating substrate having a substrate through hole, and a filling conductor layer is provided on the surface of one of the conductor layers having a through hole smaller than the substrate through hole corresponding to the substrate through hole. A heating member having a diameter larger than the inner diameter of the through hole and smaller than the inner diameter of the substrate through hole is pressed against the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer. Thus, the one conductor layer and the filling conductor layer around the through hole are melted, and a part of the melt of the filling conductor layer is caused to flow down from the through hole of the one conductor layer. A part of the melt of the layer is caused to flow down, and the flow-through is filled in the through hole of the substrate, and the portion corresponding to the through hole of the one conductor layer and the periphery thereof are filled with the melt of the melt of the filling conductor layer. The other part and the one conductor layer Filled with another part of the Torubutsu, after solidifying the melt was these filling method of manufacturing an electronic component mounting board, characterized in that disengaging said filling conductive layer from the conductive layer of the one. 前記加熱部材を先端が平坦となるドリルとし、このドリルを回転させつつ前記一方の導体層の貫通孔に対応する位置の前記充填用導体層の表面に押し当てることを特徴とする請求項１に記載の電子部品搭載用基板の製造方法。   The heating member is a drill having a flat tip, and is pressed against the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer while rotating the drill. The manufacturing method of the electronic component mounting board | substrate of description. 絶縁基板の両面に導体層をそれぞれ設け、この各導体層相互を前記絶縁基板の基板貫通孔に設けた導電部によって電気的に接続する電子部品搭載用基板であって、前記導電部は、一方の前記導体層の上部に配置した充填用導体層に対する加熱部材の加熱により溶融させた溶融物の一部及び、前記絶縁基板の上部に位置する前記一方の導体層に対する加熱部材の加熱により溶融させた溶融物の一部が充填され、この充填された部位に対応する前記一方の導体層は、該一方の導体層の溶融物の他の一部及び、前記充填用導体層の溶融物の他の一部が充填され、これら充填された溶融物が固化していることを特徴とする電子部品搭載用基板。   A substrate for mounting electronic parts in which conductor layers are provided on both surfaces of an insulating substrate, and the conductor layers are electrically connected to each other by a conductive portion provided in a substrate through-hole of the insulating substrate. A part of the melt melted by heating of the heating member with respect to the filling conductor layer disposed on the upper side of the conductor layer and the heating member with respect to the one conductor layer located on the upper side of the insulating substrate The one conductor layer corresponding to the filled portion is filled with the other part of the melt of the one conductor layer and the melt of the conductor layer for filling. A substrate for mounting electronic components, wherein a part of the substrate is filled and the filled melt is solidified.
JP2009241823A 2009-10-20 2009-10-20 Manufacturing method of electronic component mounting substrate and electronic component mounting substrate Expired - Fee Related JP5380243B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419172A (en) * 1977-07-14 1979-02-13 Shindo Denshi Kougiyou Kk Method of making flexible throughhhole print wire substrate
JPS5759398A (en) * 1980-09-26 1982-04-09 Hitachi Chemical Co Ltd Method of welding and conducting flexible printed circuit board
JPH0669646A (en) * 1992-08-21 1994-03-11 Kokusai Electric Co Ltd Pattern conductive method of printed wiring board and through hole
JPH08307058A (en) * 1995-04-28 1996-11-22 Toagosei Co Ltd Multilayer printed wiring board and its manufacture
JP2000133944A (en) * 1998-10-22 2000-05-12 Hitachi Cable Ltd Manufacture of laminated wiring board and wiring board with bump

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419172A (en) * 1977-07-14 1979-02-13 Shindo Denshi Kougiyou Kk Method of making flexible throughhhole print wire substrate
JPS5759398A (en) * 1980-09-26 1982-04-09 Hitachi Chemical Co Ltd Method of welding and conducting flexible printed circuit board
JPH0669646A (en) * 1992-08-21 1994-03-11 Kokusai Electric Co Ltd Pattern conductive method of printed wiring board and through hole
JPH08307058A (en) * 1995-04-28 1996-11-22 Toagosei Co Ltd Multilayer printed wiring board and its manufacture
JP2000133944A (en) * 1998-10-22 2000-05-12 Hitachi Cable Ltd Manufacture of laminated wiring board and wiring board with bump

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