JP2011088406A - Method of manufacturing bus bar module, and the bus bar module - Google Patents

Method of manufacturing bus bar module, and the bus bar module Download PDF

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Publication number
JP2011088406A
JP2011088406A JP2009245644A JP2009245644A JP2011088406A JP 2011088406 A JP2011088406 A JP 2011088406A JP 2009245644 A JP2009245644 A JP 2009245644A JP 2009245644 A JP2009245644 A JP 2009245644A JP 2011088406 A JP2011088406 A JP 2011088406A
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Prior art keywords
bus bar
bus
mold
bus bars
bar module
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JP2009245644A
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JP5446722B2 (en
Inventor
masafumi Kaga
雅文 加賀
Satoru Yamamoto
哲 山本
Akihiro Tanba
昭浩 丹波
Takanori Yamazaki
孝則 山崎
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C2045/1454—Joining articles or parts of a single article injecting between inserts not being in contact with each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a bus bar module, with which productivity is improved by collectively molding a bus bar, and lowering of electric insulation property can be prevented by keeping a space between the bus bars during molding. <P>SOLUTION: In the method of manufacturing the bus bar module 1 by collectively molding the plurality of the bus bars 2a, 2b in the state of separating the bus bars 2a, 2b at a given space by an insulating resin 3, and molding a resin mold 4 so that connection terminals 5 of the respective bus bars 2a, 2b are exposed from the resin mold 4, the respective bus bars 2a, 2b, except for the connection terminals 5, are separated at the given space and hollow-held, and an access preventive means 18 keeping the space between the bus bars 2a, 2b during molding is provided to the mold 10 hollow-holding the bus bars 2a, 2b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、複数のバスバーの電気的絶縁などを目的として、各バスバーを狭ギャップで積層し、その各バスバー間と周囲を絶縁性樹脂により一括モールド成形されてなるバスバーモジュールの製造方法及びバスバーモジュールに関するものである。   The present invention relates to a bus bar module manufacturing method and a bus bar module in which each bus bar is laminated with a narrow gap for the purpose of electrical insulation of a plurality of bus bars, and between and around the bus bars are collectively molded with an insulating resin. It is about.

図１６に示すように、複数枚積層されたバスバー１０１において高電界（例えば、４ｋＶ／ｍｍ程度）に耐える電気絶縁性と信頼性を確保するために絶縁性樹脂１０２でバスバー間と周囲をモールド成形する手法が用いられる。具体的な製造手法は射出成形、押出成形が一般的である。   As shown in FIG. 16, in order to ensure electrical insulation and reliability that can withstand a high electric field (for example, about 4 kV / mm) in a bus bar 101 in which a plurality of bus bars 101 are laminated, an insulating resin 102 is used to mold between and around the bus bars. Is used. Specific manufacturing methods are generally injection molding and extrusion molding.

このように、各バスバー１０１を積層し、その各バスバー１０１間と周囲を絶縁性樹脂１０２によりモールド成形したものをバスバーモジュール１００と言う。   A bus bar module 100 is formed by stacking the bus bars 101 and molding the bus bars 101 between and around the bus bars 101 with an insulating resin 102.

インバータ回路の入力側にバスバーモジュール１００を用いる場合、バスバーモジュール１００には直流電圧が印加されており、インバータ回路でスイッチングして概略方形波電流を出力するようにして使用される。概略方形波電流において電流が時間的に変化している部分（ＬｏｗとＨｉｇｈとの間）では損失が発生するため、損失低減のため電流の時間変化は速いほうが好ましい。   When the bus bar module 100 is used on the input side of the inverter circuit, a DC voltage is applied to the bus bar module 100, and the bus bar module 100 is used so as to be switched by the inverter circuit to output a substantially square wave current. Since a loss occurs in a portion of the roughly square wave current where the current changes with time (between Low and High), it is preferable that the time change of the current is faster in order to reduce the loss.

しかし、電流の時間変化を大きくすると大きいサージ電圧が発生する（サージ電圧は、電流の時間変化とインダクタンスに比例）。   However, when the time change of the current is increased, a large surge voltage is generated (the surge voltage is proportional to the time change of the current and the inductance).

このため、インバータ入力回路のインダクタンスは小さいことが好ましい。電極であるバスバー１０１同士の間隔が広いとインダクタンスが大きくなるため、この観点ではバスバー１０１同士の間隔を狭くすることが望まれている。   For this reason, it is preferable that the inductance of the inverter input circuit is small. Since the inductance increases when the interval between the bus bars 101 as electrodes is wide, it is desired to reduce the interval between the bus bars 101 from this viewpoint.

特開２００７−３８４９０号公報JP 2007-38490 A 特開２００４−３０４８７４号公報JP 2004-304874 A

インバータ入力回路のインダクタンスを小さくすべく、各バスバー１０１同士の間隔を狭くした場合、積層されたバスバー１０１がモールド成形時に金型内で樹脂に押され、バスバー１０１が変形（ソリ）、若しくは動くようなことがあれば、積層間隔が狭くなり十分な電気絶縁性が得られない問題が生じる。   When the interval between the bus bars 101 is reduced in order to reduce the inductance of the inverter input circuit, the stacked bus bars 101 are pushed by the resin in the mold at the time of molding so that the bus bars 101 are deformed (warped) or moved. If this is not the case, there arises a problem that the interval between the layers becomes narrow and sufficient electrical insulation cannot be obtained.

この問題を回避すべく、予めバスバー１０１間にスペーサとしての樹脂成形物を挟んでおく方法が考えられるが、この樹脂成形物がモールド樹脂である絶縁性樹脂１０２と完全に融解しないで界面を作る場合があり、また、樹脂成形物とバスバー１０１との間に気泡が入る場合があり、電気絶縁性が低下してしまう問題がある。さらに、バスバー１０１間に樹脂成形物を挟み込む工程が必要となり製造コストの上昇を招いてしまう問題もある。   In order to avoid this problem, a method of previously sandwiching a resin molded product as a spacer between the bus bars 101 is conceivable, but this resin molded product forms an interface without completely melting with the insulating resin 102 which is a mold resin. In some cases, air bubbles may enter between the resin molded product and the bus bar 101, resulting in a problem in that the electrical insulation is deteriorated. Furthermore, there is a problem in that a process of sandwiching a resin molded product between the bus bars 101 is required, resulting in an increase in manufacturing cost.

そこで、本発明の目的は、バスバーを一括モールド成形することで生産性を向上でき、その成形時にバスバー同士の間隔を維持して電気絶縁性の低下を防止することができるバスバーモジュールの製造方法及びバスバーモジュールを提供することにある。   Accordingly, an object of the present invention is to improve the productivity by batch molding the bus bars, and to maintain a distance between the bus bars at the time of molding and to prevent a decrease in electrical insulation and To provide a bus bar module.

本発明は上記目的を達成するために創案されたものであり、複数のバスバーを所定間隔で離間させた状態で絶縁性樹脂により一括モールド成形して、樹脂モールド体を成形すると共に該樹脂モールド体から各バスバーの接続端子が露出するように形成するバスバーモジュールの製造方法において、前記樹脂モールド体を成形するための金型内に、前記各バスバーを前記接続端子を除いて所定間隔で離間させて中空保持すると共に、前記各バスバーを中空保持した前記金型に、成形中にバスバー同士の間隔を維持する接近防止手段を設けるバスバーモジュールの製造方法である。   The present invention was devised to achieve the above-mentioned object, and a plurality of bus bars are molded together with an insulating resin in a state of being separated at a predetermined interval to form a resin mold body and the resin mold body In the manufacturing method of the bus bar module formed so that the connection terminal of each bus bar is exposed, the bus bars are spaced apart from each other at a predetermined interval in the mold for molding the resin mold body. It is a manufacturing method of the bus bar module which is provided with an access prevention means for maintaining the space between the bus bars during molding in the mold that holds the bus bars in a hollow state while holding the bus bars in a hollow state.

前記接近防止手段は、前記各バスバーの両面にそれぞれ対向する前記金型の各面からそれぞれ前記金型内に挿入され、中空保持された前記各バスバーの両面にそれぞれ当接して前記各バスバーを挟持する複数の接近防止ピンからなるとよい。   The approach preventing means is inserted into the mold from the surfaces of the mold facing the both surfaces of the bus bars, respectively, and is in contact with both surfaces of the bus bars held hollow to sandwich the bus bars. It is good to consist of a plurality of approach prevention pins.

また、前記接近防止手段は、前記各バスバーの他のバスバーに対向する対向面に対向する前記金型の面から前記金型内に挿入され、中空保持された前記各バスバーの前記対向面に当接する複数の接近防止ピンからなってもよい。   Further, the approach preventing means is inserted into the mold from the surface of the mold facing the other surface facing the other bus bar of each bus bar and contacts the facing surface of each bus bar held hollow. It may consist of a plurality of approach prevention pins that come into contact.

前記各バスバーに、他のバスバーに当接する前記接近防止ピンを挿通してかわすためのピン穴を形成するとよい。   Each bus bar may be formed with a pin hole through which the access prevention pin that contacts the other bus bar is inserted.

前記ピン穴の内径を、前記接近防止ピンの外径よりも大きく形成するとよい。   The inner diameter of the pin hole may be larger than the outer diameter of the access preventing pin.

前記接近防止ピンを、前記接近防止ピンが前記バスバーと当接する位置と隣接する前記接近防止ピンが前記バスバーと当接する位置との間における前記絶縁性樹脂の表面を沿う距離が沿面絶縁距離以上となるように、間隔を空けて配置するとよい。   The distance along the surface of the insulating resin between the position where the access prevention pin contacts the bus bar and the position where the adjacent access prevention pin contacts the bus bar is equal to or greater than the creeping insulation distance. It is good to arrange at intervals so that it may become.

前記樹脂モールド体を成形した後あるいは成形中に、前記樹脂モールド体から前記接近防止ピンを除去するとよい。   The access prevention pin may be removed from the resin mold body after or during the molding of the resin mold body.

前記接近防止ピンは、前記金型内に固定されるか、或いは前記金型内に移動可能に挿入されるとよい。   The access prevention pin may be fixed in the mold or may be movably inserted into the mold.

本発明は上記目的を達成するために創案されたものであり、複数のバスバーを所定間隔で離間させた状態で絶縁性樹脂により一括モールド成形して、樹脂モールド体を成形すると共に該樹脂モールド体から各バスバーの接続端子が露出するように形成するバスバーモジュールにおいて、前記バスバーの所定箇所には、成形中にバスバー同士が接近することを防止するべく間隔を維持するための接近防止ピンを挿入するためのピン穴が形成されていることを特徴とするバスバーモジュールである。   The present invention was devised to achieve the above-mentioned object, and a plurality of bus bars are molded together with an insulating resin in a state of being separated at a predetermined interval to form a resin mold body and the resin mold body In the bus bar module formed so that the connection terminals of the bus bars are exposed from each other, an access prevention pin is inserted into a predetermined portion of the bus bar so as to prevent the bus bars from approaching each other during molding. This is a bus bar module in which a pin hole is formed.

本発明によれば、バスバーを一括モールド成形することで生産性を向上でき、その成形時にバスバー同士の間隔を維持して電気絶縁性の低下を防止することができる。   According to the present invention, the productivity can be improved by batch molding the bus bars, and the interval between the bus bars can be maintained during the molding to prevent the electrical insulation from being lowered.

本発明により得られたバスバーモジュールを示す図である。It is a figure which shows the bus-bar module obtained by this invention. 図１のバスバーモジュールの構造を示す図である。It is a figure which shows the structure of the bus-bar module of FIG. 図１のバスバーモジュールの製造に用いる金型を示す図である。It is a figure which shows the metal mold | die used for manufacture of the bus-bar module of FIG. 図３の金型を組み立ててバスバーを保持させたときの構造を示す図である。It is a figure which shows a structure when the metal mold | die of FIG. 3 is assembled and a bus bar is hold | maintained. 図４の状態で金型内に絶縁性樹脂を注入したときの構造を示す図である。It is a figure which shows a structure when insulating resin is inject | poured in the metal mold | die in the state of FIG. 図５のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 金型を省略した樹脂モールド体を示す図である。It is a figure which shows the resin mold body which abbreviate | omitted the metal mold | die. 金型を省略した樹脂モールド体の構造を示す図である。It is a figure which shows the structure of the resin mold body which abbreviate | omitted the metal mold | die. 金型の変形例を示す図である。It is a figure which shows the modification of a metal mold | die. 図９の金型を用いたバスバーモジュールの製造方法を説明する図である。It is a figure explaining the manufacturing method of the bus-bar module using the metal mold | die of FIG. 図１０のＢ−Ｂ線断面図である。It is the BB sectional view taken on the line of FIG. 金型の変形例を示す図である。It is a figure which shows the modification of a metal mold | die. 本発明の適用例としてのバスバーを示す図であり、（ａ）は斜視図、（ｂ）は側面図である。It is a figure which shows the bus bar as an example of application of this invention, (a) is a perspective view, (b) is a side view. 本発明の適用例としてのバスバーを示す図であり、（ａ）は斜視図、（ｂ）は側面図である。It is a figure which shows the bus bar as an example of application of this invention, (a) is a perspective view, (b) is a side view. 図１３，１４のバスバーを用いたバスバーモジュールの製造方法を説明する図であり、（ａ）はバスバーの配置例を示す図、（ｂ）は得られたバスバーモジュールを示す図である。It is a figure explaining the manufacturing method of the bus-bar module using the bus-bar of FIG. 13, 14, (a) is a figure which shows the example of arrangement | positioning of a bus bar, (b) is a figure which shows the obtained bus-bar module. 一般的なバスバーモジュールの構造を示す図である。It is a figure which shows the structure of a general bus-bar module.

以下、本発明の好適な実施の形態を添付図面にしたがって説明する。   Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

図１は、本発明により得られたバスバーモジュールを示す斜視図であり、図２は、その構造を示す断面斜視図である。   FIG. 1 is a perspective view showing a bus bar module obtained by the present invention, and FIG. 2 is a cross-sectional perspective view showing the structure thereof.

図１，２に示すように、本発明により得られるバスバーモジュール１は、例えば、厚さ１．５ｍｍの複数のバスバー２を所定間隔で離間させた状態で絶縁性樹脂（例えば、ＰＰＳ（ポリフェニレンサルファイド）樹脂）３により一括モールド成形して、樹脂モールド体４を成形すると共に樹脂モールド体４から各バスバー２の接続端子５が露出するように形成されたものである。樹脂モールド体４の上下面には、それぞれ複数の穴６が形成されている。この穴６の詳細については後述する。   As shown in FIGS. 1 and 2, the bus bar module 1 obtained by the present invention includes, for example, an insulating resin (for example, PPS (polyphenylene sulfide) in a state where a plurality of bus bars 2 having a thickness of 1.5 mm are spaced apart at a predetermined interval. ) Resin) 3 is formed by batch molding to form the resin mold body 4 and the connection terminals 5 of the bus bars 2 are exposed from the resin mold body 4. A plurality of holes 6 are respectively formed on the upper and lower surfaces of the resin mold body 4. Details of the hole 6 will be described later.

ここで、所定間隔とは、おおよそ１ｍｍ以下（インダクタンスを小さくするため）であってバスバー２間の電気絶縁性を良好に保てる間隔（例えば、０．５ｍｍ）を言う。   Here, the predetermined interval refers to an interval (for example, 0.5 mm) that is approximately 1 mm or less (in order to reduce inductance) and that can maintain good electrical insulation between the bus bars 2.

このバスバーモジュール１の製造方法を、その製造に用いる金型と共に説明する。   The manufacturing method of this bus bar module 1 is demonstrated with the metal mold | die used for the manufacture.

先ず、図３に示すように、上型１１と下型１２とからなる中空の金型１０を用意する。   First, as shown in FIG. 3, a hollow mold 10 including an upper mold 11 and a lower mold 12 is prepared.

金型１０は、樹脂モールド体４を成形するためのものであり、その金型１０の上型１１の側部には絶縁性樹脂３を注入するためのゲート（樹脂注入孔）１３が複数形成されている（図６参照）。ゲート１３は、その開口部の形状は、例えば、金型１０の長手方向に沿って細長い形状を成している。なお、ゲート１３の数は、単数でも良い。また、ゲート１３の開口部の形状は、金型１０の長手方向に沿って細長い形状を成していなくても良く、例えば、円形形状でも良い。   The mold 10 is for molding the resin mold body 4, and a plurality of gates (resin injection holes) 13 for injecting the insulating resin 3 are formed on the side of the upper mold 11 of the mold 10. (See FIG. 6). The gate 13 has an elongated shape, for example, along the longitudinal direction of the mold 10. The number of gates 13 may be singular. Further, the shape of the opening of the gate 13 does not have to be an elongated shape along the longitudinal direction of the mold 10, and may be, for example, a circular shape.

上型１１は、図示上側から上型本体１１ａ、枠体形状に形成された第１保持溝付金型１１ｂ、枠体形状に形成された第２保持溝付金型１１ｃの３つの金型部品からなる。   The upper die 11 has three die parts, an upper die main body 11a, a first holding grooved die 11b formed in a frame shape, and a second holding grooved die 11c formed in a frame shape from the upper side in the figure. Consists of.

第１保持溝付金型１１ｂの内周面には、第１バスバー２ａを保持するための第１保持溝１４ａが形成され、第２保持溝付金型１１ｃの内周面には、第２バスバー２ｂを保持するための第２保持溝１４ｂが形成される（図４参照）。   A first holding groove 14a for holding the first bus bar 2a is formed on the inner peripheral surface of the first holding groove mold 11b, and a second holding groove 14a is formed on the inner peripheral surface of the second holding groove mold 11c. A second holding groove 14b for holding the bus bar 2b is formed (see FIG. 4).

これら保持溝１４ａ，１４ｂにそれぞれバスバー２ａ，２ｂを収容した後、上型１１を組み立てると第１保持溝１４ａの上部が上型本体１１ａの下面１５ａで閉じられ、その下面１５ａと第１保持溝１４ａの底面を構成する座１６ａとの間に第１バスバー２ａが挟み込まれて保持される。同様に、第２バスバー２ｂが第１保持溝付金型１１ｂの下面１５ｂと第２保持溝１４ｂの座１６ｂとの間に挟み込まれて保持される。   After the bus bars 2a and 2b are accommodated in the holding grooves 14a and 14b, respectively, when the upper die 11 is assembled, the upper portion of the first holding groove 14a is closed by the lower surface 15a of the upper die body 11a, and the lower surface 15a and the first holding groove The first bus bar 2a is sandwiched and held between the seat 16a constituting the bottom surface of 14a. Similarly, the second bus bar 2b is sandwiched and held between the lower surface 15b of the first holding groove mold 11b and the seat 16b of the second holding groove 14b.

このとき、座１６ａ，１６ｂと下面１５ａ，１５ｂとで挟み込まれた部分が、後に接続端子５となる。つまり接続端子５となる部分に絶縁性樹脂３が流れ込まないように、座１６ａ，１６ｂと下面１５ａ，１５ｂとの間隙はバスバー２ａ，２ｂの厚さと同じにされる。   At this time, the portion sandwiched between the seats 16 a and 16 b and the lower surfaces 15 a and 15 b becomes the connection terminal 5 later. That is, the gap between the seats 16a and 16b and the lower surfaces 15a and 15b is made the same as the thickness of the bus bars 2a and 2b so that the insulating resin 3 does not flow into the portion that becomes the connection terminal 5.

その後、上型１１と下型１２を組み立てると各バスバー２ａ，２ｂが所定間隔で離間された状態で金型１０内のキャビティ１７に中空保持される。   Thereafter, when the upper mold 11 and the lower mold 12 are assembled, the bus bars 2a and 2b are held hollow in the cavity 17 in the mold 10 in a state of being separated at a predetermined interval.

従来は、この状態でゲート１３から絶縁性樹脂３を注入し、各バスバー２ａ，２ｂ間と周囲をモールド成形していた。   Conventionally, the insulating resin 3 is injected from the gate 13 in this state, and the space between the bus bars 2a and 2b and the periphery are molded.

しかし、絶縁性樹脂３を注入する際の樹脂圧でバスバー２ａ，２ｂが変形したり動いたりしてバスバー２ａ，２ｂ同士が接近してその間隔が縮まり、結果として十分な電気絶縁性を確保できなくなる場合がある。   However, the bus bars 2a and 2b are deformed or moved by the resin pressure when the insulating resin 3 is injected, and the bus bars 2a and 2b come close to each other and the distance between them is reduced. As a result, sufficient electrical insulation can be secured. It may disappear.

そこで、本発明では各バスバー２ａ，２ｂを中空保持した金型１０に、成形中にバスバー２ａ，２ｂ同士の間隔を維持する接近防止手段１８を設けるようにした。   Therefore, in the present invention, the access prevention means 18 for maintaining the space between the bus bars 2a and 2b during molding is provided in the mold 10 holding the bus bars 2a and 2b in a hollow state.

接近防止手段１８は、各バスバー２ａ，２ｂの両面にそれぞれ対向する金型１０の各面からそれぞれ金型１０内に挿入され、中空保持された各バスバー２ａ，２ｂの両面にそれぞれ当接して各バスバー２ａ，２ｂを挟持する複数の接近防止ピン１９からなる。   The approach prevention means 18 is inserted into the mold 10 from the respective surfaces of the mold 10 facing the both surfaces of the bus bars 2a and 2b, respectively, and abuts on both surfaces of the bus bars 2a and 2b held hollow. It consists of a plurality of access prevention pins 19 that sandwich the bus bars 2a, 2b.

接近防止ピン１９としては、各バスバー２ａ，２ｂの間隔を維持してしっかりと支持する目的から、φ１ｍｍ程度（例えば、φ１．５ｍｍ）のものを用いるとよい。また、各バスバー２ａ，２ｂに関して、接近防止ピン１９の先端面が当接する部分は、絶縁性樹脂３がモールドされないので、成形後に露出することになる。この露出する部分の間隔、即ち、バスバー２ａに係る露出部分とバスバー２ｂに係る露出部分との各間隔は、絶縁性を確保する観点から、当該間隔における絶縁性樹脂の表面を沿う距離が材料や使用環境で決まる沿面絶縁距離以上となるように、設計するとよい。   As the approach prevention pin 19, a pin having a diameter of about φ1 mm (for example, φ1.5 mm) may be used for the purpose of firmly supporting the space between the bus bars 2a and 2b. Further, in each bus bar 2a, 2b, the portion where the tip surface of the approach prevention pin 19 abuts is exposed after molding because the insulating resin 3 is not molded. The distance between the exposed portions, that is, the distance between the exposed portion related to the bus bar 2a and the exposed portion related to the bus bar 2b is such that the distance along the surface of the insulating resin in the interval is the material or It should be designed so that the creepage insulation distance is determined by the usage environment.

なお、接近防止ピン１９は、金型１０内に固定されるか、或いは金型１０内に移動可能に挿入される。接近防止ピン１９をその軸方向に移動可能にすることで様々な厚さのバスバーを所定間隔で離間させて保持することができるため、金型１０の汎用性が向上する。そのため、本実施の形態においては接近防止ピン１９を金型１０に対して移動可能に設けた。   The approach prevention pin 19 is fixed in the mold 10 or is movably inserted into the mold 10. By making the approach prevention pin 19 movable in the axial direction, bus bars having various thicknesses can be held at predetermined intervals, so that the versatility of the mold 10 is improved. Therefore, in the present embodiment, the approach prevention pin 19 is provided so as to be movable with respect to the mold 10.

次いで、この金型１０を組み立てて各バスバー２ａ，２ｂを保持させる。図４に示すように、バスバー２ａ（又は２ｂ）には、他のバスバー２ｂ（又は２ａ）に当接する接近防止ピン１９を挿通してかわすためのピン穴２０が形成される。ピン穴２０の内径は、接近防止ピン１９の外径よりも大きく形成しているが、例えば、接近防止ピン１９の外経とピン穴２０の内径の差をバスバー２ａとバスバー２ｂの間の距離ｔの２倍以上とすると、ピン穴２０の内面をバスバー２ａとバスバー２ｂの間の距離ｔ以上の厚さの絶縁性樹脂３で覆うことができる。この様に構成することにより、電気絶縁特性をバスバー２ａとバスバー２ｂの間の電気絶縁特性より良くすることができる。また、ピン穴２０の内側の絶縁性樹脂３の厚さをバスバー２ａとバスバー２ｂの間の距離ｔと同じにすることで、過不足のない電気絶縁特性とすることができると共に、絶縁性樹脂３の使用量を最適化することができ、接近防止ピン１９の外経に対して必要最小限の穴径とすることができる。   Next, the mold 10 is assembled to hold the bus bars 2a and 2b. As shown in FIG. 4, a pin hole 20 is formed in the bus bar 2 a (or 2 b) to insert and dodge an access prevention pin 19 that contacts the other bus bar 2 b (or 2 a). The inner diameter of the pin hole 20 is formed larger than the outer diameter of the access prevention pin 19. For example, the difference between the outer diameter of the access prevention pin 19 and the inner diameter of the pin hole 20 is the distance between the bus bar 2a and the bus bar 2b. If it is more than twice t, the inner surface of the pin hole 20 can be covered with the insulating resin 3 having a thickness not less than the distance t between the bus bar 2a and the bus bar 2b. By configuring in this way, the electrical insulation characteristics can be made better than the electrical insulation characteristics between the bus bar 2a and the bus bar 2b. Further, by making the thickness of the insulating resin 3 inside the pin hole 20 the same as the distance t between the bus bar 2a and the bus bar 2b, it is possible to obtain an electrical insulation characteristic with no excess and deficiency, and an insulating resin. 3 can be optimized, and the required minimum hole diameter for the outer diameter of the access prevention pin 19 can be obtained.

金型１０の組み立て後、図５，６に示すように、ゲート１３から金型１０内のキャビティ１７に絶縁性樹脂３を注入する。このとき、接近防止ピン１９によって、各バスバー２ａ，２ｂの変形や移動を規制してバスバー２ａ，２ｂの間隔が所定間隔に維持される。また、接近防止ピン１９の外径とピン穴２０の内径の差が１ｍｍ以上あるため、その隙間に絶縁性樹脂３が回り込み、各バスバー２ａ，２ｂのピン穴２０間においても十分な電気絶縁性を確保することができる。金型１０を省略した樹脂モールド体４の斜視図及び構造図を図７，８に示す。   After the assembly of the mold 10, as shown in FIGS. 5 and 6, the insulating resin 3 is injected from the gate 13 into the cavity 17 in the mold 10. At this time, the access prevention pin 19 restricts the deformation and movement of the bus bars 2a and 2b so that the interval between the bus bars 2a and 2b is maintained at a predetermined interval. In addition, since the difference between the outer diameter of the access prevention pin 19 and the inner diameter of the pin hole 20 is 1 mm or more, the insulating resin 3 wraps around the gap, and sufficient electrical insulation is provided between the pin holes 20 of the bus bars 2a and 2b. Can be secured. A perspective view and a structural diagram of the resin mold body 4 from which the mold 10 is omitted are shown in FIGS.

この状態で絶縁性樹脂３を硬化させて、図７，８に示すように、樹脂モールド体４を成形すると共に樹脂モールド体４から各バスバー２ａ，２ｂの各接続端子５が露出するように形成する。   In this state, the insulating resin 3 is cured to form the resin mold body 4 and to form the connection terminals 5 of the bus bars 2a and 2b from the resin mold body 4 as shown in FIGS. To do.

その後、樹脂モールド体４を金型１０から離型すると共に樹脂モールド体４から接近防止ピン１９を除去する。以上の工程により、バスバーモジュール１を得る。   Thereafter, the resin mold body 4 is released from the mold 10 and the approach prevention pins 19 are removed from the resin mold body 4. The bus bar module 1 is obtained through the above steps.

つまり、樹脂モールド体４に形成された穴６は、樹脂モールド体４を成形する際に各バスバー２ａ，２ｂの間隔を維持するための接近防止ピン１９により形成されたものである。樹脂モールド体４の成形時に絶縁性樹脂３の硬化と共に接近防止ピン１９を徐々に引き抜いて（コアバックして）いくことで完成品に穴６を残さないようにすることも可能である。この様に構成することで、つまり、穴６からバスバーが露出させないようにすることで、電気絶縁特性を更に向上させることができる。   That is, the hole 6 formed in the resin mold body 4 is formed by the access prevention pin 19 for maintaining the interval between the bus bars 2a and 2b when the resin mold body 4 is molded. It is also possible to keep the hole 6 in the finished product by gradually pulling out (core back) the access prevention pin 19 as the insulating resin 3 is cured when the resin mold body 4 is molded. By configuring in this way, that is, by preventing the bus bar from being exposed from the hole 6, the electrical insulation characteristics can be further improved.

この様に、穴６からバスバー２ａ，２ｂが露出させないようにした場合でも、接近防止ピン１９が挿入されていた部分に充填される樹脂とその周囲の樹脂は、温度、圧力等の成形条件が異なってしまうおそれがある。この場合、接近防止ピン１９が挿入されていた部分の樹脂とその周囲の樹脂の界面の電気絶縁強度が樹脂の電気絶縁強度より低くなるおそれがある。しかし、前記したように、接近防止ピン１９がバスバーに当接する部分同士の間隔を樹脂の沿面絶縁距離以上となるように設計しておけば、前記樹脂の界面の電気絶縁強度が低いことによる影響を受けないようにすることができる。   In this way, even when the bus bars 2a and 2b are not exposed from the hole 6, the molding condition such as the temperature and pressure of the resin filled in the portion where the access prevention pin 19 has been inserted and the resin around it are limited. May be different. In this case, there is a possibility that the electrical insulation strength of the interface between the resin in the portion where the access prevention pin 19 has been inserted and the surrounding resin is lower than the electrical insulation strength of the resin. However, as described above, if the distance between the portions where the access prevention pins 19 are in contact with the bus bar is designed to be equal to or greater than the creeping insulation distance of the resin, the effect of low electrical insulation strength at the resin interface is low. You can avoid it.

以上要するに本実施の形態に係るバスバーモジュールの製造方法によれば、各バスバー２ａ，２ｂを中空保持した金型１０に、成形中にバスバー２ａ，２ｂ同士の間隔を維持する接近防止手段１８を設けるため、バスバー２ａ，２ｂが変形したり移動したりすることなくバスバー２ａ，２ｂ間の間隔を一定に保つことができ、十分な電気絶縁性を確保することができる。   In short, according to the method for manufacturing the bus bar module according to the present embodiment, the mold 10 that holds the bus bars 2a and 2b hollow is provided with the access preventing means 18 that maintains the distance between the bus bars 2a and 2b during molding. Therefore, the interval between the bus bars 2a and 2b can be kept constant without the bus bars 2a and 2b being deformed or moved, and sufficient electrical insulation can be ensured.

また、本実施の形態においては、接近防止手段１８は、各バスバー２ａ，２ｂの両面にそれぞれ対向する金型１０の各面からそれぞれ金型１０内に挿入され、中空保持された各バスバー２ａ，２ｂの両面にそれぞれ当接して各バスバー２ａ，２ｂを挟持する複数の接近防止ピン１９からなるため、簡易な構成で上述の効果を実現することができる。   Further, in the present embodiment, the approach preventing means 18 is inserted into the mold 10 from each surface of the mold 10 facing the both surfaces of each bus bar 2a, 2b, and is held hollow. Since the plurality of access prevention pins 19 are in contact with both sides of 2b and sandwich the bus bars 2a and 2b, the above-described effects can be realized with a simple configuration.

本実施の形態においては、金型１０として上型１１が３つの金型部品からなるものを用いたが、これに限定されず、例えば、図９に示すように、上型１１が１つの金型部品からなる金型９０を用いてもよい。なお、図９では、各バスバー２ａ，２ｂを保持するための保持溝などの構成は省略して描いてある。   In the present embodiment, the upper mold 11 is composed of three mold parts as the mold 10. However, the present invention is not limited to this. For example, as shown in FIG. 9, the upper mold 11 has one mold. A mold 90 made of mold parts may be used. In FIG. 9, the configuration of holding grooves and the like for holding the bus bars 2a and 2b is omitted.

この金型９０を用いる場合も、図１０，１１に示すように、金型９０を組み立てて各バスバー２ａ，２ｂを保持し、金型９０のゲート９１から絶縁性樹脂３を注入し、同様にバスバーモジュール１を製造することができる。   Also when using this metal mold | die 90, as shown to FIG. 10, 11, the metal mold | die 90 is assembled, each bus-bar 2a, 2b is hold | maintained, the insulating resin 3 is inject | poured from the gate 91 of the metal mold | die 90, and The bus bar module 1 can be manufactured.

また、図１２に示すように、接近防止手段１８が、バスバー２ａ（又は２ｂ）の他のバスバー２ｂ（又は２ａ）に対向する対向面に対向する金型１２０の面から金型１２０内に挿入され、中空保持された各バスバー２ａ，２ｂの対向面に当接する複数の接近防止ピン１２１からなってもよい。このように構成した場合であっても、絶縁性樹脂３の注入時の樹脂圧によって各バスバー２ａ，２ｂが接近する方向に力が働くため、バスバー２ａ，２ｂの間隔が広がることはない。   Further, as shown in FIG. 12, the approach preventing means 18 is inserted into the mold 120 from the surface of the mold 120 facing the facing surface facing the other bus bar 2b (or 2a) of the bus bar 2a (or 2b). The plurality of access prevention pins 121 may be in contact with the opposing surfaces of the bus bars 2a and 2b held hollow. Even in such a configuration, the force acts in the direction in which each bus bar 2a, 2b approaches due to the resin pressure when the insulating resin 3 is injected, so that the interval between the bus bars 2a, 2b does not increase.

本発明は、板状のバスバー２だけではなく、図１３，１４に示すようなＬ字型のバスバー１３０，１４０を用いたバスバーモジュールにも適用することができる。各バスバー１３０，１４０は、接続端子１３１，１４１となる端部をそれぞれ有し、その端部には金型に固定するための固定穴１３２，１４２がそれぞれ形成されている。また、各バスバー１３０，１４０には、ピン穴１３３，１４３がそれぞれ形成される。   The present invention can be applied not only to the plate-like bus bar 2 but also to a bus bar module using L-shaped bus bars 130 and 140 as shown in FIGS. Each bus bar 130 and 140 has an end portion to be a connection terminal 131 and 141, and fixing holes 132 and 142 for fixing to the mold are formed at the end portions, respectively. In addition, pin holes 133 and 143 are formed in the bus bars 130 and 140, respectively.

このような形状のバスバー１３０，１４０に合わせた金型を用意し、図１５（ａ）に示すように、この金型により各バスバー１３０，１４０を所定間隔で離間させた状態で保持した後、金型内に絶縁性樹脂３を注入し、これを硬化させて樹脂モールド体１５０を成形すると共にその樹脂モールド体１５０から各接続端子１３１，１４１を露出させることにより、図１５（ｂ）に示すようなバスバーモジュール１５１が得られる。このバスバーモジュール１５１の樹脂モールド体１５０には、成形時に接近防止ピン１９により形成された穴１５２が残っている。   After preparing the mold matched to the bus bars 130 and 140 having such a shape, as shown in FIG. 15A, the bus bars 130 and 140 are held by the mold in a state of being spaced apart at a predetermined interval. Insulating resin 3 is injected into the mold and cured to mold resin mold body 150 and to expose each connection terminal 131, 141 from resin mold body 150, as shown in FIG. A bus bar module 151 like this is obtained. In the resin molded body 150 of the bus bar module 151, a hole 152 formed by the approach prevention pin 19 remains during molding.

なお、図１５（ｂ）に示すようなバスバーモジュール１５１は、接続端子１３１，１４１が反対方向に出ているため、接続端子間の沿面絶縁距離を長くとることが容易になるという特徴がある。   Note that the bus bar module 151 as shown in FIG. 15B has a feature that it is easy to increase the creeping insulation distance between the connection terminals because the connection terminals 131 and 141 protrude in the opposite direction.

１ バスバーモジュール
２ａ，２ｂ バスバー
３ 絶縁性樹脂
４ 樹脂モールド体
５ 接続端子
１０ 金型
１８ 接近防止手段 DESCRIPTION OF SYMBOLS 1 Bus bar module 2a, 2b Bus bar 3 Insulating resin 4 Resin mold body 5 Connection terminal 10 Mold 18 Access prevention means

Claims (9)

複数のバスバーを所定間隔で離間させた状態で絶縁性樹脂により一括モールド成形して、樹脂モールド体を成形すると共に該樹脂モールド体から各バスバーの接続端子が露出するように形成するバスバーモジュールの製造方法において、
前記樹脂モールド体を成形するための金型内に、前記各バスバーを前記接続端子を除いて所定間隔で離間させて中空保持すると共に、前記各バスバーを中空保持した前記金型に、成形中にバスバー同士の間隔を維持する接近防止手段を設けることを特徴とするバスバーモジュールの製造方法。 Manufacturing a bus bar module in which a plurality of bus bars are collectively molded with an insulating resin in a state of being spaced apart at a predetermined interval, thereby forming a resin mold body and exposing the connection terminals of each bus bar from the resin mold body In the method
In the mold for molding the resin mold body, each bus bar is held hollow at a predetermined interval except for the connection terminals, and the mold holding the bus bars in a hollow state is being molded. A method of manufacturing a bus bar module, characterized by providing an approach preventing means for maintaining an interval between bus bars. 前記接近防止手段は、
前記各バスバーの両面にそれぞれ対向する前記金型の各面からそれぞれ前記金型内に挿入され、中空保持された前記各バスバーの両面にそれぞれ当接して前記各バスバーを挟持する複数の接近防止ピンからなる請求項１に記載のバスバーモジュールの製造方法。 The access preventing means includes
A plurality of access prevention pins which are inserted into the mold from the respective surfaces of the mold facing the both surfaces of the bus bars, respectively, and are in contact with both surfaces of the bus bars held hollow to sandwich the bus bars. The manufacturing method of the bus-bar module of Claim 1 which consists of these. 前記接近防止手段は、
前記各バスバーの他のバスバーに対向する対向面に対向する前記金型の面から前記金型内に挿入され、中空保持された前記各バスバーの前記対向面に当接する複数の接近防止ピンからなる請求項１に記載のバスバーモジュールの製造方法。 The access preventing means includes
The bus bar includes a plurality of access prevention pins that are inserted into the mold from the surface of the mold facing the opposite surface of the bus bar facing the other bus bar and abut against the facing surface of the bus bar held hollow. The manufacturing method of the bus-bar module of Claim 1. 前記各バスバーに、他のバスバーに当接する前記接近防止ピンを挿通してかわすためのピン穴を形成した請求項２又は３に記載のバスバーモジュールの製造方法。   The method of manufacturing a bus bar module according to claim 2 or 3, wherein a pin hole is formed in each bus bar to insert and dodge the access prevention pin that abuts against another bus bar. 前記ピン穴の内径を、前記接近防止ピンの外径よりも大きく形成する請求項４に記載のバスバーモジュールの製造方法。   The manufacturing method of the bus bar module according to claim 4, wherein an inner diameter of the pin hole is formed larger than an outer diameter of the access prevention pin. 前記接近防止ピンを、前記接近防止ピンが前記バスバーと当接する位置と隣接する前記接近防止ピンが前記バスバーと当接する位置との間における前記絶縁性樹脂の表面を沿う距離が沿面絶縁距離以上となるように、間隔を空けて配置する請求項２〜５のいずれかに記載のバスバーモジュールの製造方法。   The distance along the surface of the insulating resin between the position where the access prevention pin contacts the bus bar and the position where the adjacent access prevention pin contacts the bus bar is equal to or greater than the creeping insulation distance. The bus bar module manufacturing method according to any one of claims 2 to 5, wherein the bus bar module is arranged at intervals. 前記樹脂モールド体を成形した後あるいは成形中に、前記樹脂モールド体から前記接近防止ピンを除去する請求項２〜６のいずれかに記載のバスバーモジュールの製造方法。   The method of manufacturing a bus bar module according to any one of claims 2 to 6, wherein the access prevention pin is removed from the resin mold body after or during the molding of the resin mold body. 前記接近防止ピンは、前記金型内に固定されるか、或いは前記金型内に移動可能に挿入される請求項２〜７のいずれかに記載のバスバーモジュールの製造方法。   The method of manufacturing a bus bar module according to any one of claims 2 to 7, wherein the access prevention pin is fixed in the mold or is movably inserted into the mold. 複数のバスバーを所定間隔で離間させた状態で絶縁性樹脂により一括モールド成形して、樹脂モールド体を成形すると共に該樹脂モールド体から各バスバーの接続端子が露出するように形成するバスバーモジュールにおいて、
前記バスバーの所定箇所には、成形中にバスバー同士が接近することを防止するべく間隔を維持するための接近防止ピンを挿入するためのピン穴が形成されていることを特徴とするバスバーモジュール。 In a bus bar module formed by batch molding with an insulating resin with a plurality of bus bars spaced apart at a predetermined interval, forming a resin mold body and exposing the connection terminals of each bus bar from the resin mold body,
A bus bar module, wherein a pin hole for inserting an access prevention pin for maintaining an interval to prevent the bus bars from approaching each other during molding is formed at a predetermined portion of the bus bar.
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