JP2011063408A - Glass substrate picking-out method - Google Patents

Glass substrate picking-out method Download PDF

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JP2011063408A
JP2011063408A JP2009217005A JP2009217005A JP2011063408A JP 2011063408 A JP2011063408 A JP 2011063408A JP 2009217005 A JP2009217005 A JP 2009217005A JP 2009217005 A JP2009217005 A JP 2009217005A JP 2011063408 A JP2011063408 A JP 2011063408A
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glass substrate
glass
taken out
substrates
robot
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Toshihide Okatsu
敏秀 大勝
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Ulvac Inc
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Ulvac Inc
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Priority to JP2009217005A priority Critical patent/JP2011063408A/en
Priority to TW099131074A priority patent/TW201119928A/en
Priority to KR1020100090610A priority patent/KR20110031114A/en
Priority to CN2010102872336A priority patent/CN102020116A/en
Publication of JP2011063408A publication Critical patent/JP2011063408A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Treatment Of Glass (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass substrate picking-out method for individually sucking and picking out glass substrates located on the top of a glass substrate aggregate, in sequence, in the state of propping the glass substrate aggregate consisting of the plurality of stacked glass substrates, while picking out the glass substrates one by one even when they are attached to each other. <P>SOLUTION: A robot is used for operating a glass substrate holding device 1 with a plurality of suction tools 4 to pull the glass substrate away from the lower side of the glass substrate 11 and then pick out the glass substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

複数のガラス基板が重ねられてなるガラス基板集合体を立て掛けられた状態とし、ガラス基板集合体の最表部に位置するガラス基板からを順に個別に吸着して取り出すガラス基板の取り出し方法に関する。   The present invention relates to a method for taking out a glass substrate, in which a glass substrate assembly formed by stacking a plurality of glass substrates is placed on the surface, and the glass substrates positioned at the outermost portion of the glass substrate assembly are individually adsorbed and taken out in order.

太陽光を直接電気に変換することを可能とする太陽電池は、クリーンで地球温暖化を防止するエネルギー源として注目されている。その中でも、ガラス基板上にシリコンを薄く堆積させた構造である薄膜太陽電池は、従来の太陽電池と比較して、シリコン使用量の少なさや、構造のシンプルさなどの点で有利であり、特に注目されている。また、薄膜太陽電池は大型化することによってコストダウンが図れるため、薄膜太陽電池に使用されるガラス基板は大型化の一途を辿っている。   Solar cells that can directly convert sunlight into electricity have attracted attention as energy sources that are clean and prevent global warming. Among them, the thin film solar cell having a structure in which silicon is thinly deposited on a glass substrate is advantageous in terms of the small amount of silicon used and the simplicity of the structure, compared with the conventional solar cell. Attention has been paid. Moreover, since the cost reduction can be achieved by increasing the size of the thin film solar cell, the glass substrate used for the thin film solar cell is steadily increasing in size.

薄膜太陽電池の製造工程において、搬送状態のガラス基板は、図８に示すように、パレット３０上に複数枚が重ねられることによって、ガラス基板集合体１０のような形態をとることが多い。通常、ガラス基板は、このガラス基板集合体１０から１枚ずつ取り出される。また、ガラス基板の保管、輸送時に、ガラス基板同士が衝撃を受け接触することによる擦れ傷や、ガラス基板表面が汚染されることを防止するために、ガラス基板同士の間に紙やフィルム等の合紙（緩衝材）を挿入することも一般的である（例えば特許文献１）。   In the manufacturing process of the thin film solar cell, the glass substrate in the transported state often takes the form of the glass substrate aggregate 10 by stacking a plurality of sheets on the pallet 30 as shown in FIG. Usually, glass substrates are taken out from the glass substrate assembly 10 one by one. Also, during storage and transportation of glass substrates, in order to prevent scratches caused by contact between glass substrates and contact with each other, and contamination of the glass substrate surface, paper, films, etc. It is also common to insert a slip sheet (buffer material) (for example, Patent Document 1).

従来のガラス基板取り出し方法としては、図８に示したように、立て掛けられたガラス基板集合体１０の上端からガラス基板を引き剥がした後、取り出す方法があった。また、大型のガラス基板の取り扱いには危険が伴うため、産業用ロボットのアームの先端に備えられた複数の吸着具を用いて引き剥がすことが一般的である。
このように、ガラス基板の縁部から引き剥がし、ガラス基板の全体、または一部を分離した後、ガラス基板の取り出しを行うことによって、輸送中および／または保管中の湿気などが原因となり、ガラス基板同士が付着していた場合においても、安定した取り出しが可能である。 As a conventional glass substrate taking-out method, as shown in FIG. 8, there is a method of taking out the glass substrate after peeling off the glass substrate from the upper end of the standing glass substrate assembly 10. Further, since handling a large glass substrate involves danger, it is common to peel it off using a plurality of suction tools provided at the tip of an arm of an industrial robot.
Thus, after peeling off from the edge of the glass substrate and separating the whole or part of the glass substrate, the glass substrate is taken out, which may cause moisture during transportation and / or storage. Even when the substrates are adhered to each other, stable removal is possible.

しかし、ガラス基板の大型化・薄型化に伴い、ガラス基板同士またはガラス基板と合紙とが付着し易くなり、ガラス基板を引き剥がす際、最表部に位置するガラス基板に付着する形で２枚以上のガラス基板が剥がれてしまい、このガラス基板を取り出す際に、付着したガラス基板が落下するという問題が生じていた。
また、このような付着を防ぎ、確実に１枚ずつ取り出すためには、縁部からの引き剥がし作業に多くの時間を要するため、タクトタイムが長くなるという問題があった。 However, as the glass substrates increase in size and thickness, the glass substrates or the glass substrate and the slip sheet are likely to adhere to each other. When the glass substrates are peeled off, the glass substrates adhere to the glass substrate located at the outermost portion. One or more glass substrates were peeled off, and when this glass substrate was taken out, there was a problem that the adhered glass substrate dropped.
Further, in order to prevent such adhesion and reliably take out one sheet at a time, it takes a lot of time for the peeling operation from the edge portion, and there is a problem that the tact time becomes long.

特開２００５−１５０３１５号公報JP 2005-150315 A

この発明は、このような事情を考慮してなされたもので、その目的は、ガラス基板集合体よりガラス基板を引き剥がす際、ガラス基板同士が付着している場合においても、より速く、より確実に、１枚のガラス基板を引き剥がすことを可能にするガラス基板の取り出し方法を提供することにある。   The present invention has been made in consideration of such circumstances, and its purpose is faster and more reliable even when the glass substrates are adhered to each other when the glass substrates are peeled off from the glass substrate assembly. Another object of the present invention is to provide a method for taking out a glass substrate that makes it possible to peel off one glass substrate.

本発明の請求項１に係るガラス基板の取り出し方法は、複数のガラス基板が重ねられてなるガラス基板集合体を立て掛けられた状態とし、前記ガラス基板集合体の最表部に位置するガラス基板からを順に個別に吸着して取り出すガラス基板取り出し方法において、前記ガラス基板の下方より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とする。
本発明の請求項２に係るガラス基板の取り出し方法は、請求項１に記載のガラス基板の取り出し方法において、前記ガラス基板の下辺に沿って該ガラス基板を吸着し、この一辺より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とする。
本発明の請求項３に係るガラス基板の取り出し方法は、請求項１に記載のガラス基板の取り出し方法において、前記ガラス基板の下辺を構成する角部において該ガラス基板を吸着し、この一点より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とする。
本発明の請求項４に係るガラス基板の取り出し方法は、請求項１〜３のいずれか１項に記載のガラス基板の取り出し方法において、前記ガラス基板集合体が、前記ガラス基板と緩衝体とを交互に積み重ねた構成であることを特徴とする。 The glass substrate take-out method according to claim 1 of the present invention is a state in which a glass substrate aggregate formed by stacking a plurality of glass substrates is leaned, and from a glass substrate located at the outermost portion of the glass substrate aggregate. In the method for taking out a glass substrate by individually adsorbing each in order, the glass substrate is taken out from below the glass substrate, and then the glass substrate is taken out.
The glass substrate take-out method according to claim 2 of the present invention is the glass substrate take-out method according to claim 1, wherein the glass substrate is adsorbed along a lower side of the glass substrate, and the glass substrate is taken from one side. After peeling off, the glass substrate is taken out.
The glass substrate take-out method according to claim 3 of the present invention is the glass substrate take-out method according to claim 1, wherein the glass substrate is adsorbed at a corner portion constituting the lower side of the glass substrate. After the glass substrate is peeled off, the glass substrate is taken out.
The glass substrate takeout method according to claim 4 of the present invention is the glass substrate takeout method according to any one of claims 1 to 3, wherein the glass substrate aggregate includes the glass substrate and the buffer. It is the structure which piled up alternately.

本発明によれば、ガラス基板の下方よりガラス基板を引き剥がした後、ガラス基板を取り出すことによって、ガラス基板同士が付着している場合においても、より速く、より確実に、１枚のガラス基板を引き剥がすことが可能となる。   According to the present invention, after the glass substrate is peeled off from the lower side of the glass substrate, the glass substrate is taken out, and even when the glass substrates are adhered to each other, the glass substrate is faster and more reliably. Can be peeled off.

本発明に用いるガラス基板の取り出しシステムの概略側面図である。It is a schematic side view of the taking-out system of the glass substrate used for this invention. 図１に示したガラス基板の取り出しシステムの上面図である。It is a top view of the taking-out system of the glass substrate shown in FIG. 本発明に用いるガラス基板保持装置の斜視図である。It is a perspective view of the glass substrate holding | maintenance apparatus used for this invention. ガラス基板集合体の拡大図である。It is an enlarged view of a glass substrate aggregate. 本発明のガラス基板の取り出し方法を示す概略図である。It is the schematic which shows the taking-out method of the glass substrate of this invention. 本発明の別のガラス基板の取り出し方法を示す概略図である。It is the schematic which shows the taking-out method of another glass substrate of this invention. 本発明の別のガラス基板の引き剥がし箇所を示す図である。It is a figure which shows the peeling location of another glass substrate of this invention. 従来のガラス基板の引き剥がし箇所を示す図である。It is a figure which shows the peeling location of the conventional glass substrate.

以下、本発明の実施の形態を図面を参照して詳細に説明する。
図１は、本発明に用いるガラス基板の取り出しシステムを示す概略側面図である。図２は図１の上面図である。図３は、ガラス基板の取り出しシステムに用いるロボット２０のアーム先端部に取り付けられる、ガラス基板保持装置１の斜視図である。図４は、ガラス基板集合体１０の拡大図である。
本発明に用いるガラス基板の取り出しシステムは、ガラス基板集合体１０が立て掛けられ、該ガラス基板集合体を斜めに載置するパレット３０、ガラス基板１１を保持するためのガラス基板保持装置１、及びガラス基板保持装置１を自在に動かすためのロボット２０とから構成される。
本システムは、パレット３０に立て掛けられたガラス基板集合体１０から、一枚ずつガラス基板１１を取り出し、薄膜太陽電池の組み立て工程などへ搬送するためのシステムである。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic side view showing a glass substrate take-out system used in the present invention. FIG. 2 is a top view of FIG. FIG. 3 is a perspective view of the glass substrate holding device 1 attached to the arm tip of the robot 20 used in the glass substrate take-out system. FIG. 4 is an enlarged view of the glass substrate assembly 10.
The glass substrate take-out system used in the present invention includes a pallet 30 on which a glass substrate aggregate 10 is stood and placed obliquely, a glass substrate holding device 1 for holding the glass substrate 11, and a glass The robot 20 is configured to move the substrate holding device 1 freely.
This system is a system for taking out the glass substrates 11 one by one from the glass substrate assembly 10 leaning on the pallet 30 and transporting them to the thin film solar cell assembly process or the like.

本実施の形態では、ガラス基板１１として、１ｍ×１．５ｍの矩形形状をなし、厚さ５ｍｍのものを用いた。ガラス基板１１の片面にはスズドープ酸化インジウム（ＩＴＯ）や、フッ素ドープ酸化スズ（ＦＴＯ）からなる透明導電膜が形成されている。透明導電膜は、図１及び図４における右側の面、つまり後述する吸着具４が吸着する面とは反対の面に形成されている。
ガラス基板１１は、図４に示すように、ガラス基板１１と該ガラス基板１１用の緩衝材としての合紙１２とが交互に重ねられ、ガラス基板集合体１０を構成している。
ガラス基板集合体１０は、背板３２を介してパレット３０に傾斜させて立て掛けられるようにして載置されている。パレット３０は、木材などで形成することができるが、床面３１はウレタンなど、ガラス基板１１に傷を付けないような材質であることが好ましい。背板３２は、ガラス基板１１の撓みを抑えるためにガラス基板集合体１０とパレット３０との間に配置されている。背板３２は、ガラス板集合体１０の撓みを抑える剛性を有する金属や樹脂より形成される。 In the present embodiment, a glass substrate 11 having a rectangular shape of 1 m × 1.5 m and a thickness of 5 mm is used. A transparent conductive film made of tin-doped indium oxide (ITO) or fluorine-doped tin oxide (FTO) is formed on one surface of the glass substrate 11. The transparent conductive film is formed on the right side surface in FIGS. 1 and 4, that is, the surface opposite to the surface on which an adsorbing tool 4 described later adsorbs.
As shown in FIG. 4, the glass substrate 11 and the slip sheet 12 as a buffer material for the glass substrate 11 are alternately stacked to constitute the glass substrate aggregate 10.
The glass substrate assembly 10 is placed so as to lean against the pallet 30 via the back plate 32. The pallet 30 can be formed of wood or the like, but the floor surface 31 is preferably made of a material such as urethane that does not damage the glass substrate 11. The back plate 32 is disposed between the glass substrate assembly 10 and the pallet 30 in order to suppress the bending of the glass substrate 11. The back plate 32 is formed of a metal or resin having rigidity that suppresses the bending of the glass plate assembly 10.

ロボット２０は、一般的に産業ロボットとして使用される、６軸構成の多関節ロボットである。ロボット２０は、図示しない制御装置を備えており、この制御装置により自在に制御することが可能である。ロボット２０は、パレット３０に載置されたガラス基板集合体１０に、アクセス可能な所定の位置に配置される。アーム先端部２２には、ガラス基板保持装置１が取り付けられている。   The robot 20 is a 6-axis multi-joint robot generally used as an industrial robot. The robot 20 includes a control device (not shown) and can be freely controlled by this control device. The robot 20 is disposed at a predetermined position accessible to the glass substrate assembly 10 placed on the pallet 30. The glass substrate holding device 1 is attached to the arm tip 22.

ガラス基板保持装置１は、支持体２と、ガラス基板吸着手段３ａ、３ｂ、３ｃ、３ｄ、３ｅとから構成されている。
支持体２は、ガラス基板１１よりやや小さな面積を有する矩形形状のフレームである。ロボット２０のアーム先端部２２は、該支持体２の略中央部に接続されている。 The glass substrate holding device 1 is composed of a support 2 and glass substrate suction means 3a, 3b, 3c, 3d, and 3e.
The support 2 is a rectangular frame having an area slightly smaller than that of the glass substrate 11. The arm tip portion 22 of the robot 20 is connected to the substantially central portion of the support 2.

ガラス基板吸着手段３ａ〜３ｅには、それぞれ、ガラス基板１１を吸着可能な吸着具４と、該吸着具４とガラス基板１１との接触を感知するための接触センサ（図示せず）が設けられている。   Each of the glass substrate suction means 3a to 3e is provided with a suction tool 4 capable of sucking the glass substrate 11, and a contact sensor (not shown) for detecting contact between the suction tool 4 and the glass substrate 11. ing.

ガラス基板吸着手段３ａ〜３ｅは、本実施の形態においては、図３に示すように、３個のガラス基板吸着手段が５列に亘って設けられている。縦横方向の設置間隔は等間隔であることが好ましい。
なお、ガラス基板吸着手段３ａ〜３ｅの数及び配置は、少なくともガラス基板１１の四隅を吸着することが可能であれば、この配置に限ることはない。 In the present embodiment, the glass substrate suction means 3a to 3e are provided with three glass substrate suction means in five rows as shown in FIG. It is preferable that the installation intervals in the vertical and horizontal directions are equal.
The number and arrangement of the glass substrate adsorption means 3a to 3e are not limited to this arrangement as long as at least four corners of the glass substrate 11 can be adsorbed.

次に、上記ガラス基板の取り出しシステムを利用した本発明に係るガラス基板取り出し方法について説明する。なお、ロボット２０の操作は、図示しない制御装置によって自動的に行われるが、人の操作によって手動で行うことも可とする。   Next, the glass substrate taking-out method according to the present invention using the glass substrate taking-out system will be described. The operation of the robot 20 is automatically performed by a control device (not shown), but can be manually performed by a human operation.

まず、所定の位置に、ガラス基板集合体１０を載置したパレット３０を配置する。図４に示すように、ガラス基板集合体１０は、隣り合うガラス基板１１の間に合紙１２を挟みこんだ状態で、パレット３０上に斜め積みされている。
制御装置によりロボット２０を操作し、ガラス基板保持装置１をガラス基板集合体１０と対面させる。
さらに、ロボット２０を操作し、ガラス基板保持装置１をガラス基板集合体１０の方向へ移動させる。この移動は、ガラス基板吸着手段３ａ〜３ｅの接触センサが吸着具４とガラス基板１１との接触を感知するまで継続する。その結果、ガラス基板吸着手段３ａ〜３ｅの吸着具４がガラス基板１０に当接する。当接した後、ガラス基板吸着手段３ａ〜３ｅのそれぞれの吸着具４が、ガラス基板集合体１０の最表部に位置するガラス基板１１を吸着する。 First, the pallet 30 on which the glass substrate assembly 10 is placed is placed at a predetermined position. As shown in FIG. 4, the glass substrate aggregates 10 are diagonally stacked on the pallet 30 with the interleaf paper 12 sandwiched between adjacent glass substrates 11.
The robot 20 is operated by the control device so that the glass substrate holding device 1 faces the glass substrate assembly 10.
Further, the robot 20 is operated to move the glass substrate holding device 1 toward the glass substrate assembly 10. This movement continues until the contact sensor of the glass substrate suction means 3a to 3e senses the contact between the suction tool 4 and the glass substrate 11. As a result, the suction tool 4 of the glass substrate suction means 3 a to 3 e comes into contact with the glass substrate 10. After the contact, each suction tool 4 of the glass substrate suction means 3 a to 3 e sucks the glass substrate 11 located at the outermost part of the glass substrate assembly 10.

なお、この吸着の際、ガラス基板集合体１０の最表部に位置するガラス基板１１に対して、該ガラス基板１１が引き剥がされるような力は発生しないように吸着させる。   In this adsorption, the glass substrate 11 located at the outermost surface of the glass substrate assembly 10 is adsorbed so as not to generate a force that causes the glass substrate 11 to be peeled off.

次に、図５を参照して、ガラス基板１１の引き剥がし方法について説明する。
まず、ロボット２０を操作し、ガラス基板保持装置１を図１における左上斜方向（図５の矢印Ｂ参照）に移動させると同時に、ロボット２０の手首部２１を回転させ、ガラス基板保持装置１を図５において右回転させる（図５の矢印Ｃ参照）。
移動の方向成分は、図１における上方向１０〜５０ｍｍおよび左方向１０〜５０ｍｍである。この上方向及び左方向の移動量は、ガラス基板１１の大きさ及び厚さにより、好適な量が選択される。また、上記移動速度は、１〜１５ｍｍ／秒、回転速度は１°〜１０°／分である。
このように、ガラス基板保持装置１を移動させる動きと回転させる動きを組み合わせることによって、図５に示すように、１枚のガラス基板１１の下部よりガラス基板吸着手段３ｅによって引き剥がされる。 Next, with reference to FIG. 5, the peeling method of the glass substrate 11 is demonstrated.
First, the robot 20 is operated to move the glass substrate holding device 1 in the upper left oblique direction (see arrow B in FIG. 5), and at the same time, the wrist portion 21 of the robot 20 is rotated, so that the glass substrate holding device 1 is moved. In FIG. 5, it is rotated right (see arrow C in FIG. 5).
The direction component of movement is 10 to 50 mm in the upward direction and 10 to 50 mm in the left direction in FIG. As the amount of movement in the upward direction and the left direction, a suitable amount is selected depending on the size and thickness of the glass substrate 11. The moving speed is 1 to 15 mm / second, and the rotational speed is 1 ° to 10 ° / min.
In this way, by combining the movement of moving the glass substrate holding device 1 and the movement of rotating the glass substrate holding apparatus 1, the glass substrate suction means 3e peels it off from the lower part of one glass substrate 11, as shown in FIG.

ガラス基板吸着手段３ａ〜３ｅによって吸着されているガラス基板１１が引き剥がされる際、ガラス基板１１以外のガラス基板集合体１０は、自身の重量によって生じるガラス基板集合体１０の下端部とパレット３０の床面３１との摩擦力によって、その場に留められる。つまり、湿度などによって生じる付着力によって、ガラス基板１１及び合紙１２同士が付着している場合でも、ガラス基板集合体１０が上記付着力によってガラス基板１１に付着して追随することはない。   When the glass substrate 11 adsorbed by the glass substrate adsorbing means 3 a to 3 e is peeled off, the glass substrate aggregate 10 other than the glass substrate 11 is formed on the pallet 30 and the lower end of the glass substrate aggregate 10 generated by its own weight. It is held in place by the frictional force with the floor surface 31. That is, even when the glass substrate 11 and the interleaf paper 12 are adhered to each other due to the adhesive force generated by humidity or the like, the glass substrate assembly 10 does not adhere to the glass substrate 11 due to the adhesive force and follow.

上記したガラス基板保持装置１の動作により、ガラス基板１１がガラス基板集合体１０から引き剥がされた後、ロボット２０を操作し、ガラス基板１１を所定の位置に移動させる。ガラス基板１１の移動動作は、ガラス基板１１が完全に引き剥がされた後に開始することが好ましいが、これに限ることはなく、ガラス基板１１が、完全に引き剥がされてない状態で、移動動作を開始してもよい。移動動作の開始のタイミングは、ガラス基板の寸法、重量、またはガラス基板と合紙との付着状態などによって適宜決定される。移動動作の開始を早めることによって、タクトタイムの短縮が可能となる。   After the glass substrate 11 is peeled off from the glass substrate assembly 10 by the operation of the glass substrate holding device 1 described above, the robot 20 is operated to move the glass substrate 11 to a predetermined position. The movement operation of the glass substrate 11 is preferably started after the glass substrate 11 is completely peeled off, but is not limited thereto, and the movement operation is performed in a state where the glass substrate 11 is not completely peeled off. May start. The start timing of the moving operation is appropriately determined depending on the size and weight of the glass substrate or the adhesion state between the glass substrate and the slip sheet. By shortening the start of the movement operation, the tact time can be shortened.

ガラス基板１１を所定の位置に載置した後、ロボット２０のアームを操作し、再びガラス基板保持装置１をガラス基板集合体１０と対面させ、ガラス基板１１の取り出しを繰り返させる。   After placing the glass substrate 11 at a predetermined position, the arm of the robot 20 is operated, the glass substrate holding device 1 is again faced to the glass substrate assembly 10, and the glass substrate 11 is repeatedly taken out.

なお、上記実施の形態は、ガラス基板保持装置１の移動と回転を組み合わせることによって、ガラス基板１１の下部よりガラス基板１１を引き剥がしたが、これに限ることはない。例えば、図６に示すように、ガラス基板吸着手段３ａ〜３ｅのうち、ガラス基板吸着手段３ｅの一列を吸着具４がガラス基板１１を引き剥がす方向に移動させることによって、ガラス基板１１の下部よりガラス基板１１を引き剥がす方法としてもよい。
この方法を用いる場合、ガラス基板吸着手段３ａ〜３ｅには、吸着具４を移動可能に支持する吸着具移動機構５を設けることが必要である。
吸着具移動機構５は、図示しない駆動源によってガラス基板１１方向に吸着具４を移動させることが可能に構成される。駆動源としては、エアーシリンダーが好ましい。 In addition, although the said embodiment peeled off the glass substrate 11 from the lower part of the glass substrate 11 by combining the movement and rotation of the glass substrate holding device 1, it is not restricted to this. For example, as shown in FIG. 6, by moving one row of the glass substrate suction means 3 e in the glass substrate suction means 3 e in the direction in which the suction tool 4 peels the glass substrate 11 out of the glass substrate suction means 3 a to 3 e. Alternatively, the glass substrate 11 may be peeled off.
When this method is used, the glass substrate suction means 3a to 3e must be provided with a suction tool moving mechanism 5 that supports the suction tool 4 so as to be movable.
The suction tool moving mechanism 5 is configured to be able to move the suction tool 4 in the direction of the glass substrate 11 by a driving source (not shown). As the driving source, an air cylinder is preferable.

また、図７に示すように、ガラス基板１１の下辺を構成する角部よりガラス基板１１を引き剥がすことによって、ガラス基板１１を取り出す方法としてもよい。
例えば、ガラス基板吸着手段３ａ〜３ｅのうち、ガラス基板吸着手段３ｅ１（図３参照）のみを吸着具４がガラス基板１１を引き剥がす方向に移動させることによって、ガラス基板１１の角部よりガラス基板１１を引き剥がす方法としてもよい。 Moreover, as shown in FIG. 7, it is good also as a method of taking out the glass substrate 11 by peeling off the glass substrate 11 from the corner | angular part which comprises the lower side of the glass substrate 11. FIG.
For example, by moving only the glass substrate suction means 3e1 (see FIG. 3) among the glass substrate suction means 3a to 3e in the direction in which the suction tool 4 peels off the glass substrate 11, the glass substrate 11 is removed from the corner of the glass substrate 11. 11 may be peeled off.

なお、本実施の形態においては、吸着具を１５個備えたガラス基板保持装置を用いてガラス基板の搬送を行ったが、斜め積みされたガラス基板の上部よりも先に下辺部を引き剥がすことができれば、吸着具１５の数量及び配置はこれにかぎることはない。
また、本実施の形態においては、６軸構成のロボットを使用したが、これに限ることはなく、斜め積みされたガラス基板の上部よりも先に下辺部を引き剥がすことを可能にする機構を有するものであれば、さらに自由度の低いロボットなども採用可能である。
また、本実施の形態においては、ガラス基板集合体をガラス基板同士の間に合紙を挿入する形態としたが、合紙を挿入せずに、ガラス基板同士を直接接触させる形態のガラス基板集合体としてもよい。 In the present embodiment, the glass substrate is transported using the glass substrate holding device having 15 suction tools, but the lower side is peeled off before the upper part of the glass substrates stacked obliquely. If it is possible, the quantity and arrangement of the suction tool 15 are not limited to this.
In this embodiment, a 6-axis robot is used. However, the present invention is not limited to this, and a mechanism that makes it possible to peel off the lower side before the upper part of the glass substrates stacked obliquely. If it has, a robot with a lower degree of freedom can also be adopted.
In the present embodiment, the glass substrate aggregate is configured to insert the slip sheet between the glass substrates, but the glass substrate assembly is configured to directly contact the glass substrates without inserting the slip sheet. It may be a body.

１…ガラス基板保持装置、３ａ〜３ｅ…ガラス基板吸着手段、４…吸着具、１０…ガラス基板集合体、１１…ガラス基板、１２…合紙、２０…ロボット、２１…手首部、２２…アーム先端部。 DESCRIPTION OF SYMBOLS 1 ... Glass substrate holding device, 3a-3e ... Glass substrate adsorption | suction means, 4 ... Adsorption tool, 10 ... Glass substrate aggregate, 11 ... Glass substrate, 12 ... Insert paper, 20 ... Robot, 21 ... Wrist part, 22 ... Arm Tip.

Claims (4)

複数のガラス基板が重ねられてなるガラス基板集合体を立て掛けられた状態とし、前記ガラス基板集合体の最表部に位置するガラス基板からを順に個別に吸着して取り出すガラス基板取り出し方法において、
前記ガラス基板の下方より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とするガラス基板の取り出し方法。 In a glass substrate taking-out method in which a glass substrate aggregate formed by stacking a plurality of glass substrates is leaned against, and the glass substrate located at the outermost part of the glass substrate aggregate is individually adsorbed and taken out in order.
A method for removing a glass substrate, comprising: removing the glass substrate after peeling the glass substrate from below the glass substrate. 前記ガラス基板の下辺に沿って該ガラス基板を吸着し、この一辺より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とする請求項１に記載のガラス基板の取り出し方法。   The method for removing a glass substrate according to claim 1, wherein the glass substrate is adsorbed along a lower side of the glass substrate, and the glass substrate is taken out from the one side, and then the glass substrate is taken out. 前記ガラス基板の下辺を構成する角部において該ガラス基板を吸着し、この一点より該ガラス基板を引き剥がした後、該ガラス基板を取り出すことを特徴とする請求項１に記載のガラス基板の取り出し方法。   The glass substrate is taken out according to claim 1, wherein the glass substrate is adsorbed at a corner portion constituting the lower side of the glass substrate, and the glass substrate is taken out from the one point, and then the glass substrate is taken out. Method. 前記ガラス基板集合体は、前記ガラス基板と緩衝体とを交互に積み重ねた構成であることを特徴とする請求項１〜３のいずれか１項に記載のガラス基板の取り出し方法。   The said glass substrate aggregate | assembly is the structure which laminated | stacked the said glass substrate and the buffer body alternately, The taking-out method of the glass substrate of any one of Claims 1-3 characterized by the above-mentioned.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016160073A (en) * 2015-03-04 2016-09-05 富士通株式会社 Manufacturing device of buffer material and manufacturing method of buffer material
JP2017080862A (en) * 2015-10-30 2017-05-18 日本電気硝子株式会社 Method and apparatus for producing sheet glass
CN107093651A (en) * 2017-05-18 2017-08-25 江西比太科技有限公司 The two-in-one automatic loading/unloading equipment of solar silicon wafers
WO2018117229A1 (en) * 2016-12-22 2018-06-28 川崎重工業株式会社 Conveyance system and operation method therefor
CN110240397A (en) * 2019-06-18 2019-09-17 深圳市信濠光电科技股份有限公司 A kind of high efficiency glass cover-plate fetching device

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* Cited by examiner, † Cited by third party
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CN102642719B (en) * 2012-04-11 2014-10-22 佛山市河之舟机电有限公司 Efficient relay-type tile picking method and tile picking machine
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CN112193872B (en) * 2020-09-16 2022-08-19 钜讯通电子（深圳）有限公司 Automatic film supply device
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CN113753568A (en) * 2021-09-29 2021-12-07 无锡根深地固科技有限公司 Automatic unstacking device for flat cultivation containers
CN115922184B (en) * 2023-03-15 2023-05-05 长春华翔汽车金属部件有限公司 Thermoforming patch board welding workstation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221775U (en) * 1975-08-01 1977-02-16
JPS56100440U (en) * 1979-12-28 1981-08-07
JP2009055009A (en) * 2007-07-31 2009-03-12 Sharp Corp Substrate transfer method, and substrate transfer equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221775U (en) * 1975-08-01 1977-02-16
JPS56100440U (en) * 1979-12-28 1981-08-07
JP2009055009A (en) * 2007-07-31 2009-03-12 Sharp Corp Substrate transfer method, and substrate transfer equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016160073A (en) * 2015-03-04 2016-09-05 富士通株式会社 Manufacturing device of buffer material and manufacturing method of buffer material
JP2017080862A (en) * 2015-10-30 2017-05-18 日本電気硝子株式会社 Method and apparatus for producing sheet glass
WO2018117229A1 (en) * 2016-12-22 2018-06-28 川崎重工業株式会社 Conveyance system and operation method therefor
JP2018103279A (en) * 2016-12-22 2018-07-05 川崎重工業株式会社 Transportation system and method for operating the same
CN109890577A (en) * 2016-12-22 2019-06-14 川崎重工业株式会社 Transportation system and its method of operation
CN107093651A (en) * 2017-05-18 2017-08-25 江西比太科技有限公司 The two-in-one automatic loading/unloading equipment of solar silicon wafers
CN110240397A (en) * 2019-06-18 2019-09-17 深圳市信濠光电科技股份有限公司 A kind of high efficiency glass cover-plate fetching device
CN110240397B (en) * 2019-06-18 2022-04-01 深圳市信濠光电科技股份有限公司 Glass cover plate taking and placing device

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