JP2011061345A - Piezoelectric device - Google Patents

Piezoelectric device Download PDF

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JP2011061345A
JP2011061345A JP2009206794A JP2009206794A JP2011061345A JP 2011061345 A JP2011061345 A JP 2011061345A JP 2009206794 A JP2009206794 A JP 2009206794A JP 2009206794 A JP2009206794 A JP 2009206794A JP 2011061345 A JP2011061345 A JP 2011061345A
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base material
insulating base
piezoelectric
lead portion
vibrator
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Kunio Sakuma
國雄 佐久間
Kazumi Hara
一巳 原
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To realize low height of a piezoelectric device with a piezoelectric vibrator and a circuit element laminated thereon. <P>SOLUTION: A piezoelectric oscillator 10 as the piezoelectric device is provided with the piezoelectric vibrator 20, a semiconductor element 31 as the circuit element, and a flexible circuit substrate 30. The flexible circuit substrate 30 comprises an insulated base material 33, a through hole 38 made in the insulated base material 33, and a conducting lead section 37. The conducting lead section 37 comprises an inside lead section 34 projecting to the through hole 38, a wiring section 35 on the base material contacting with the insulated base material 33, and an outside lead section 36 projecting from an outer circle side section of the insulated base material 33. The inside lead section 34 is connected to a semiconductor element electrode 32 as a circuit element electrode. The wiring section 35 on the base material is connected to a vibrator electrode 25. The outside lead section 36 is bent in a thickness direction of the insulated base material 33, and a tip end of the bent outside lead section 36 is in a range of thickness of the insulated base material 33. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、圧電振動素子と、圧電振動素子を発振させる機能を含む回路素子とを有する圧電デバイスに関する。   The present invention relates to a piezoelectric device having a piezoelectric vibration element and a circuit element having a function of oscillating the piezoelectric vibration element.

近年、水晶等の圧電振動素子を用いた圧電振動子は、基準クロック等を発生する重要な部品として、様々な電子機器に搭載されている。そして、圧電振動子は、携帯機器の進展に伴う小型化が進むとともに、回路素子との複合化等の高機能化が進んでいる。   In recent years, a piezoelectric vibrator using a piezoelectric vibration element such as a crystal is mounted on various electronic devices as an important part for generating a reference clock or the like. The piezoelectric vibrator has been miniaturized along with the progress of portable devices, and has advanced functions such as compounding with circuit elements.

従来、圧電振動子と圧電振動子を発振させるための回路素子とを組み合わせた圧電デバイスの一例としての圧電発振器に関しては、様々な構造が提案されている。
特に、小型化を実現するために、フレキシブル回路基板を利用し、圧電振動子と回路素子とを積み重ねた構成とした圧電発振器の構造が提案されている。 Conventionally, various structures have been proposed for a piezoelectric oscillator as an example of a piezoelectric device in which a piezoelectric vibrator and a circuit element for oscillating the piezoelectric vibrator are combined.
In particular, in order to realize miniaturization, a structure of a piezoelectric oscillator is proposed in which a flexible circuit board is used and a piezoelectric vibrator and a circuit element are stacked.

例えば特許文献１には、図４に示すような圧電発振器１１０が提示されている。圧電発振器１１０は、圧電振動素子１２１を収納した概略矩形状の圧電振動子１２０と、圧電振動子１２０を発振させるための回路を有した回路素子１３１と、フレキシブル回路基板１３０とを有して形成されている。
圧電振動子１２０は、フレキシブル回路基板１３０の第１の面に搭載され、圧電振動子１２０の外面に形成された振動子電極１２５と、フレキシブル回路基板１３０の第１の面に形成された第１の導体パターン１３４とが電気的に接続されている。
回路素子１３１は、フレキシブル回路基板１３０の第１の面と表裏反対側にある第２の面に搭載され、回路素子１３１の第１の主面に形成された回路素子電極１３２と、フレキシブル回路基板１３０の第２の面に形成された第２の導体パターン１３５とが電気的に接続されている。
圧電振動子１２０と回路素子１３１とは、フレキシブル回路基板１３０を挟んで、対向した位置に搭載されている。このフレキシブル回路基板１３０が圧電振動子１２０の辺端部外へ延伸した部分は、圧電振動子１２０の辺端部付近で回路素子１３１側へ折り曲げられ、更に回路素子１３１の第２の主面側へ折り曲げられ、回路素子１３１の第２の主面に接触した構成となっている。
フレキシブル回路基板１３０の、回路素子１３１の第２の主面と接触した面と反対側の面に、外部接続端子１３７が設けられている。 For example, Patent Document 1 presents a piezoelectric oscillator 110 as shown in FIG. The piezoelectric oscillator 110 is formed by including a substantially rectangular piezoelectric vibrator 120 containing a piezoelectric vibration element 121, a circuit element 131 having a circuit for causing the piezoelectric vibrator 120 to oscillate, and a flexible circuit board 130. Has been.
The piezoelectric vibrator 120 is mounted on the first surface of the flexible circuit board 130, the vibrator electrode 125 formed on the outer surface of the piezoelectric vibrator 120, and the first formed on the first face of the flexible circuit board 130. The conductor pattern 134 is electrically connected.
The circuit element 131 is mounted on a second surface on the opposite side of the first surface of the flexible circuit board 130, the circuit element electrode 132 formed on the first main surface of the circuit element 131, and the flexible circuit board The second conductor pattern 135 formed on the second surface 130 is electrically connected.
The piezoelectric vibrator 120 and the circuit element 131 are mounted at positions facing each other with the flexible circuit board 130 interposed therebetween. A portion where the flexible circuit board 130 extends to the outside of the side end portion of the piezoelectric vibrator 120 is bent toward the circuit element 131 side near the side end portion of the piezoelectric vibrator 120, and further on the second main surface side of the circuit element 131. And is in contact with the second main surface of the circuit element 131.
An external connection terminal 137 is provided on the surface of the flexible circuit board 130 opposite to the surface in contact with the second main surface of the circuit element 131.

また、特許文献２には、圧電振動子と、回路素子と、フレキシブル回路基板とを有して構成され、圧電振動子と回路素子は、フレキシブル回路基板を挟んで電気的に接合され、フレキシブル回路基板が圧電振動子辺端部の両側に延伸され、延伸されたフレキシブル回路基板にて回路素子の外面が被覆され、フレキシブル回路基板の、回路素子と接していない面に、外部接続端子が形成された圧電発振器の構成が提案されている。   Patent Document 2 includes a piezoelectric vibrator, a circuit element, and a flexible circuit board, and the piezoelectric vibrator and the circuit element are electrically joined with the flexible circuit board interposed therebetween. The substrate is stretched on both sides of the piezoelectric vibrator side edge, the outer surface of the circuit element is covered with the stretched flexible circuit board, and external connection terminals are formed on the surface of the flexible circuit board that is not in contact with the circuit element. A configuration of a piezoelectric oscillator has been proposed.

特開２００８−１４１４１７号公報JP 2008-141417 A 特開２００７−２０１６１６号公報JP 2007-201616 A

前述の特許文献１の構造においては、フレキシブル回路基板１３０は、第１の面に圧電振動子１２０が接続されるための第１の導体パターン１３４を有し、第２の面に回路素子１３１が接続されるための第２の導体パターン１３５を有した両面配線仕様のものが使用される。第１の導体パターン１３４上には、外部接続端子１３７が設けられ、外部接続端子１３７を、圧電発信器１１０の底面に配置するために、フレキシブル回路基板１３０を、回路素子１３１の厚み方向に、折り返して使用している。
このように、回路素子１３１の表面側及び裏面側の両側にフレキシブル回路基板１３０が配置されているため、圧電発振器１１０全体の厚みが増し、低背化が困難という課題があった。 In the structure of Patent Document 1 described above, the flexible circuit board 130 has the first conductor pattern 134 for connecting the piezoelectric vibrator 120 to the first surface, and the circuit element 131 on the second surface. The thing of the double-sided wiring specification which has the 2nd conductor pattern 135 for connecting is used. An external connection terminal 137 is provided on the first conductor pattern 134, and the flexible circuit board 130 is arranged in the thickness direction of the circuit element 131 in order to dispose the external connection terminal 137 on the bottom surface of the piezoelectric oscillator 110. Wrapped and used.
As described above, since the flexible circuit boards 130 are arranged on both the front surface side and the back surface side of the circuit element 131, there is a problem that the thickness of the entire piezoelectric oscillator 110 is increased and it is difficult to reduce the height.

また、前述の特許文献２の場合も同様に、回路素子の両面がフレキシブル回路基板により被覆されているため、圧電発振器の厚みが増し、低背化が困難であった。   Similarly, in the case of the above-mentioned Patent Document 2, since both sides of the circuit element are covered with the flexible circuit board, the thickness of the piezoelectric oscillator is increased and it is difficult to reduce the height.

本発明は、上記課題を解決するように、以下の適用例として実現される。   The present invention is realized as the following application examples so as to solve the above problems.

［適用例１］本適用例の圧電デバイスは、圧電振動素子と、前記圧電振動素子が収納される収納容器と、前記圧電振動素子と電気的に接続されて前記収納容器の外面に形成された振動子電極とを有する圧電振動子と、前記圧電振動素子を発振させる機能を含む発振回路と、前記発振回路と接続された回路素子電極とを有する回路素子と、前記圧電振動子と前記回路素子とを電気的に接続させたフレキシブル回路基板と、を備え、前記フレキシブル回路基板は、絶縁基材と、前記絶縁基材に形成された貫通穴と、前記絶縁基材の一面に形成された導電リード部と、を有し、前記導電リード部は、前記貫通穴に突き出した内側リード部と、前記絶縁基材に接した基材上配線部と、前記絶縁基材の外周部から突き出した外側リード部と、を有し、前記内側リード部は、前記回路素子電極と接続され、前記基材上配線部は、前記振動子電極と接続され、前記外側リード部は、前記絶縁基材の厚さ方向に折り曲げられ、折り曲げられた前記外側リード部の先端が、前記絶縁基材の厚さの範囲内にあることを特徴とする。   [Application Example 1] The piezoelectric device of this application example is formed on the outer surface of the storage container by being electrically connected to the piezoelectric vibration element, the storage container in which the piezoelectric vibration element is stored, and the piezoelectric vibration element. A piezoelectric vibrator having a vibrator electrode; an oscillation circuit having a function of oscillating the piezoelectric vibration element; a circuit element having a circuit element electrode connected to the oscillation circuit; the piezoelectric vibrator and the circuit element A flexible circuit board electrically connected to each other, the flexible circuit board comprising an insulating base material, a through hole formed in the insulating base material, and a conductive material formed on one surface of the insulating base material. A lead portion, and the conductive lead portion includes an inner lead portion protruding into the through hole, a wiring portion on the substrate in contact with the insulating base material, and an outer side protruding from the outer peripheral portion of the insulating base material. Lead part, and having a front The inner lead portion is connected to the circuit element electrode, the base wiring portion is connected to the vibrator electrode, and the outer lead portion is bent and bent in the thickness direction of the insulating base member. The front end of the outer lead portion is in the thickness range of the insulating base material.

この構成によれば、フレキシブル回路基板の絶縁基材の外周部に突き出した外側リード部が、絶縁基材の厚さ方向に折り曲げられて、折り曲げられた外側リード部の先端が絶縁基材の厚さの範囲内にあることにより、外側リード部を、圧電デバイスが他の回路基板に接続されて使用される際の外部接続端子とすることができる。
外部接続端子は、圧電デバイスの側面に配置されることから、従来のような底面に外部接続端子を配置するためのフレキシブル回路基板の折り返し配置が不要となり、圧電デバイス全体の厚さをフレキシブル回路基板の厚さ分薄くすることができ、圧電デバイスを低背化できるという効果を有する。 According to this configuration, the outer lead portion protruding from the outer peripheral portion of the insulating base material of the flexible circuit board is bent in the thickness direction of the insulating base material, and the tip of the bent outer lead portion is the thickness of the insulating base material. By being within this range, the outer lead portion can be used as an external connection terminal when the piezoelectric device is connected to another circuit board.
Since the external connection terminal is arranged on the side surface of the piezoelectric device, the flexible circuit board is not required to be folded back to arrange the external connection terminal on the bottom surface as in the prior art. Therefore, the piezoelectric device can be reduced in height.

［適用例２］上記適用例に記載の圧電デバイスにおいて、前記絶縁基材の厚さ方向に折り曲げられた前記外側リード部は、更に、前記絶縁基材の平面外周方向に折り曲げられ、折り曲げられた前記外側リード部の先端が、前記絶縁基材の厚さの範囲内にあることを特徴とする。   Application Example 2 In the piezoelectric device according to the application example described above, the outer lead portion bent in the thickness direction of the insulating base material is further bent and bent in a planar outer peripheral direction of the insulating base material. The tip of the outer lead portion is in the thickness range of the insulating base material.

この構成によれば、外側リード部が、絶縁基材の厚さ方向に折り曲げられ、更に外周方向に折り曲げられ、先端部が絶縁基材の厚さの範囲内にあることにより、外側リード部を、圧電発振器の側面に形成された概Ｌ字型の外部接続端子とすることができる。
外部接続端子が他の回路基板に接続されて使用される際において、使用環境の変化により圧電発振器と他の回路基板との熱膨張係数差による熱応力が接続部に発生するが、概Ｌ字型に形成された外部接続端子が大きな弾性を有することから、熱応力が吸収され、実装信頼性を向上させることができるという効果を有する。 According to this configuration, the outer lead portion is bent in the thickness direction of the insulating base material, further bent in the outer peripheral direction, and the tip end portion is within the thickness range of the insulating base material. The external connection terminal can be an approximately L-shaped external connection terminal formed on the side surface of the piezoelectric oscillator.
When the external connection terminal is connected to another circuit board and used, thermal stress due to a difference in thermal expansion coefficient between the piezoelectric oscillator and the other circuit board is generated in the connection part due to a change in use environment. Since the external connection terminal formed in the mold has great elasticity, the thermal stress is absorbed, and the mounting reliability can be improved.

［適用例３］本適用例の圧電デバイスは、圧電振動素子と、前記圧電振動素子が収納される収納容器と、前記圧電振動素子と電気的に接続されて前記収納容器の外面に形成された振動子電極とを有する圧電振動子と、前記圧電振動素子を発振させる機能を含む発振回路と、前記発振回路と接続された回路素子電極とを有する回路素子と、前記圧電振動子と前記回路素子とを電気的に接続させたフレキシブル回路基板と、を備え、前記フレキシブル回路基板は、絶縁基材と、前記絶縁基材内に形成された貫通穴と、前記絶縁基材の一面に形成された導電リード部と、を有し、前記導電リード部は、前記貫通穴に突き出した内側リード部と、前記絶縁基材に接した基材上配線部と、を有し、前記内側リード部は、前記回路素子電極と接続され、前記基材上配線部は、前記振動子電極と接続され、前記絶縁基材は、該絶縁基材の表裏を貫通して形成された接続穴の内に充填された導電材を有し、前記導電材は、一端面が前記基材上配線部と接続され、前記端面と表裏関係が反対側の端面が、前記絶縁基材面から露出されていることを特徴とする。   Application Example 3 A piezoelectric device according to this application example is formed on the outer surface of the storage container by being electrically connected to the piezoelectric vibration element, a storage container in which the piezoelectric vibration element is stored, and the piezoelectric vibration element. A piezoelectric vibrator having a vibrator electrode; an oscillation circuit having a function of oscillating the piezoelectric vibration element; a circuit element having a circuit element electrode connected to the oscillation circuit; the piezoelectric vibrator and the circuit element A flexible circuit board that is electrically connected to each other, and the flexible circuit board is formed on one surface of the insulating base material, a through hole formed in the insulating base material, and the insulating base material. A conductive lead portion, and the conductive lead portion has an inner lead portion protruding into the through hole, and a wiring portion on a base material in contact with the insulating base material, and the inner lead portion is Connected to the circuit element electrode The wiring portion on the base material is connected to the vibrator electrode, and the insulating base material has a conductive material filled in a connection hole formed through the front and back of the insulating base material, and the conductive material One end surface of the material is connected to the wiring portion on the base material, and an end surface on the opposite side to the end surface is exposed from the insulating base material surface.

この構成によれば、絶縁基材の基材上配線部と接している部分に穴が形成され、穴内に導電材が充填され、基材上配線部がある面と反対側の絶縁基材面から、導電材が露出していることにより、露出部を、圧電デバイスの外部接続端子とすることができる。
圧電デバイスの機能向上に伴い外部接続端子数が増加する場合においても、外部接続端子を絶縁基材平面部の任意の位置に配置でき、外部接続端子の配置のピッチを広く保つことができることから、圧電デバイスを他の回路基板へ接続して使用する際に、接続が容易となり、接続安定性を向上できるという効果を有する。また、前述の適用例と同様の効果も併せて有している。 According to this configuration, a hole is formed in a portion of the insulating base material that is in contact with the wiring portion on the base material, the hole is filled with a conductive material, and the insulating base material surface opposite to the surface on which the wiring portion on the base material is located Thus, the exposed portion can be used as an external connection terminal of the piezoelectric device by exposing the conductive material.
Even when the number of external connection terminals increases with the improvement of the function of the piezoelectric device, the external connection terminals can be arranged at any position on the insulating base plane part, and the pitch of the external connection terminals can be kept wide. When the piezoelectric device is used by being connected to another circuit board, the connection becomes easy and the connection stability can be improved. Moreover, it has the same effect as the above-mentioned application example.

本発明の第１実施形態にかかる圧電発振器の概略図であり、（ａ）は、正断面図、（ｂ）は、（ａ）のフレキシブル回路基板側から見た底面図。It is the schematic of the piezoelectric oscillator concerning 1st Embodiment of this invention, (a) is a front sectional view, (b) is the bottom view seen from the flexible circuit board side of (a). 本発明の第２実施形態にかかる圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかる圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator concerning 3rd Embodiment of this invention. 従来の圧電発振器の構造を示す断面図。Sectional drawing which shows the structure of the conventional piezoelectric oscillator.

本発明にかかる圧電デバイスの実施形態を、図面を用いて説明する。   An embodiment of a piezoelectric device according to the present invention will be described with reference to the drawings.

（第１実施形態）
図１（a）は、圧電デバイスの一例としての圧電発振器の第１実施形態を示す正断面図である。また、図１（ｂ）は、第１実施形態の圧電発振器をフレキシブル回路基板側から見た底面図である。
図１に示すように、圧電デバイスとしての圧電発振器１０は、圧電振動素子２１が内包された圧電振動子２０と、圧電振動素子２１（圧電振動子２０）を発振させる機能を含む回路素子としての半導体素子３１と、圧電振動子２０と半導体素子３１とを電気的に接続させるフレキシブル回路基板３０と、を備えている。 (First embodiment)
FIG. 1A is a front sectional view showing a first embodiment of a piezoelectric oscillator as an example of a piezoelectric device. FIG. 1B is a bottom view of the piezoelectric oscillator according to the first embodiment viewed from the flexible circuit board side.
As shown in FIG. 1, a piezoelectric oscillator 10 as a piezoelectric device is a circuit element including a piezoelectric vibrator 20 including a piezoelectric vibration element 21 and a function of causing the piezoelectric vibration element 21 (piezoelectric vibrator 20) to oscillate. The semiconductor element 31 and the flexible circuit board 30 which electrically connects the piezoelectric vibrator 20 and the semiconductor element 31 are provided.

圧電振動子２０は、例えば水晶などの圧電材料を用いて形成された圧電振動素子２１が、セラミックなどの凹状の収納容器２２の底部に固定され、開口部を蓋体２３によって気密的に封止されている。収納容器２２の底部には、収納容器２２の外面（本例では、半導体素子３１と対面する一面）に形成された振動子電極２５と電気的に導通な引出電極２４が設けられている。引出電極２４は、圧電振動素子２１の図示しない励振電極と接続されており、これにより圧電振動素子２１と振動子電極２５とが電気的に接続される。なお、本例では、振動子電極２５が半導体素子３１と対面する一面に形成された例で説明したが、フレキシブル回路基板３０との接続が可能な、例えば、側面に設けられても良い。   In the piezoelectric vibrator 20, for example, a piezoelectric vibration element 21 formed using a piezoelectric material such as quartz is fixed to the bottom of a concave storage container 22 such as ceramic, and the opening is hermetically sealed by a lid 23. Has been. At the bottom of the storage container 22, an extraction electrode 24 that is electrically connected to the transducer electrode 25 formed on the outer surface of the storage container 22 (in this example, one surface facing the semiconductor element 31) is provided. The extraction electrode 24 is connected to an excitation electrode (not shown) of the piezoelectric vibration element 21, whereby the piezoelectric vibration element 21 and the vibrator electrode 25 are electrically connected. In this example, the vibrator electrode 25 is described as being formed on one surface facing the semiconductor element 31. However, the vibrator electrode 25 may be provided on the side surface that can be connected to the flexible circuit board 30.

半導体素子３１は、圧電振動子２０を構成する圧電振動素子２１を発振させる機能を有する発振回路（図示せず）と、発振回路と電気的に接続され、金などで形成された突起状の半導体素子電極３２とを有する。
フレキシブル回路基板３０は、ポリイミドなどの絶縁基材３３と、絶縁基材３３内に設けられた貫通穴３８と、絶縁基材３３の一面に形成された導電リード部３７と、を有している。貫通穴３８は、半導体素子３１を内包する形状となっている。
導電リード部３７は、貫通穴３８に突き出した内側リード部３４と、絶縁基材３３上に接着されている基材上配線部３５と、絶縁基材３３の平面外周部から突き出した外側リード部３６と、を有している。また、導電リード部３７は、例えば、銅などからなり、厚みは１８μｍで、表面には、錫、金等の被覆が施されている。
貫通穴３８内に半導体素子３１が配置され、内側リード部３４が半導体素子電極３２と重ね合わされ、重ね合わされた領域に冶具等で熱と圧力が加えられることにより、半導体素子３１とフレキシブル回路基板３０とが電気的に接続される。 The semiconductor element 31 includes an oscillation circuit (not shown) having a function of oscillating the piezoelectric vibration element 21 that constitutes the piezoelectric vibrator 20, and a protruding semiconductor that is electrically connected to the oscillation circuit and formed of gold or the like. Device electrode 32.
The flexible circuit board 30 includes an insulating base material 33 such as polyimide, a through hole 38 provided in the insulating base material 33, and a conductive lead portion 37 formed on one surface of the insulating base material 33. . The through hole 38 has a shape that encloses the semiconductor element 31.
The conductive lead portion 37 includes an inner lead portion 34 projecting from the through hole 38, an on-substrate wiring portion 35 bonded onto the insulating base material 33, and an outer lead portion projecting from the planar outer peripheral portion of the insulating base material 33. 36. The conductive lead portion 37 is made of, for example, copper, has a thickness of 18 μm, and the surface is coated with tin, gold, or the like.
The semiconductor element 31 is disposed in the through hole 38, the inner lead portion 34 is overlapped with the semiconductor element electrode 32, and heat and pressure are applied to the overlapped region with a jig or the like, whereby the semiconductor element 31 and the flexible circuit board 30 are overlapped. Are electrically connected.

また、前述では、半導体素子３１とフレキシブル回路基板３０との接続において、突起状の半導体素子電極３２と内側リード部３４とを接続しているが、例えば、半導体素子電極３２として突起状ではなく平坦な形状の電極とし、代わりに内側リード部３４の先端部に、表面が金などからなる突起状の電極を設けることにより、同様の接続がなされても良い。   In the above description, in the connection between the semiconductor element 31 and the flexible circuit board 30, the protruding semiconductor element electrode 32 and the inner lead portion 34 are connected. For example, the semiconductor element electrode 32 is flat rather than protruding. A similar connection may be made by providing a projection electrode having a surface of gold or the like at the tip of the inner lead portion 34 instead.

半導体素子３１及び内側リード部３４周辺は、機械的及び湿度的な保護のため、エポキシ樹脂などからなる保護樹脂３９にて被覆される。基材上配線部３５と、振動子電極２５とが重ね合わされ、半田などにより接合される。外側リード部３６は、金型などにより、絶縁基材３３の厚さ方向に折り曲げられる。折り曲げられた外側リード部３６の先端は、絶縁基材３３の厚さの範囲内にあるように配置され、圧電発振器１０全体の厚みが増さないよう設定される。外側リード部３６は、絶縁基材３３と概接触した状態となっている。なお、外側リード部３６と絶縁基材３３は、エポキシ樹脂などからなる接着剤により、固定されても良い。   The periphery of the semiconductor element 31 and the inner lead portion 34 is covered with a protective resin 39 made of an epoxy resin or the like for mechanical and humidity protection. The wiring member 35 on the substrate and the vibrator electrode 25 are overlapped and joined by solder or the like. The outer lead portion 36 is bent in the thickness direction of the insulating base material 33 by a mold or the like. The tip of the bent outer lead portion 36 is disposed so as to be within the thickness range of the insulating base material 33, and is set so that the thickness of the entire piezoelectric oscillator 10 does not increase. The outer lead portion 36 is substantially in contact with the insulating base material 33. The outer lead portion 36 and the insulating base material 33 may be fixed by an adhesive made of an epoxy resin or the like.

本実施形態によれば、フレキシブル回路基板３０の絶縁基材３３の平面外周部に突き出した外側リード部３６が、絶縁基材３３の厚さ方向に折り曲げられて、折り曲げられた外側リード部３６の先端が絶縁基材３３の厚さの範囲内にあることにより、外側リード部３６を、圧電発振器１０が他の回路基板に接続されて使用される際の外部接続端子とすることができる。   According to the present embodiment, the outer lead portion 36 protruding from the planar outer peripheral portion of the insulating base material 33 of the flexible circuit board 30 is bent in the thickness direction of the insulating base material 33, and the outer lead portion 36 is bent. Since the tip is within the thickness range of the insulating base material 33, the outer lead portion 36 can be used as an external connection terminal when the piezoelectric oscillator 10 is connected to another circuit board.

前記外部接続端子は、圧電発振器１０の側面に配置されることから、従来の圧電発振器構造（図４参照）のような底面に外部接続端子１３７を配置するためのフレキシブル回路基板１３０の折り返し配置が不要となり、圧電発振器１１０全体の厚さをフレキシブル回路基板１３０の厚さ分薄くすることができ、圧電発振器１１０を低背化できるという効果を有する。   Since the external connection terminal is disposed on the side surface of the piezoelectric oscillator 10, the flexible circuit board 130 is folded back for disposing the external connection terminal 137 on the bottom as in the conventional piezoelectric oscillator structure (see FIG. 4). This eliminates the need to reduce the thickness of the entire piezoelectric oscillator 110 by the thickness of the flexible circuit board 130, thereby reducing the height of the piezoelectric oscillator 110.

また、フレキシブル回路基板３０の一面に存在する内側リード部３４に半導体素子３１を接合するとともに、フレキシブル回路基板３０の前記同一面に存在する基材上配線部３５に圧電振動子２０も接合できる構造であることから、従来のような工程が複雑で高価な両面配線基板を用いることなく、安価な片面配線基板を使用することができるという効果を有する。   Further, the semiconductor element 31 is bonded to the inner lead portion 34 existing on one surface of the flexible circuit board 30, and the piezoelectric vibrator 20 can be bonded to the on-substrate wiring portion 35 existing on the same surface of the flexible circuit board 30. Therefore, there is an effect that an inexpensive single-sided wiring board can be used without using an expensive double-sided wiring board with complicated processes as in the prior art.

また、半導体素子３１の外形寸法が変わっても同一構造にて対応可能であることから、半導体素子３１の選択の自由度が高く、半導体素子３１のシュリンクによる更なる低コスト化への対応も容易であるという効果を有する。   In addition, since the same structure can be used even if the external dimensions of the semiconductor element 31 change, the degree of freedom in selecting the semiconductor element 31 is high, and it is easy to cope with further cost reduction by shrinking the semiconductor element 31. It has the effect of being.

（第２実施形態）
図２は、本発明にかかる圧電デバイスの一例としての圧電発振器の第２実施形態を示す断面図である。以下、第２実施形態において、フレキシブル回路基板５０の導電リード部５２以外は、前述の第１実施形態と同じであるので、同符号を付けて説明を省略する。
図２に示すように、導電リード部５２は、外側リード部５１が絶縁基材３３の厚さ方向に折り曲げられ、更に外側リード部５１の先端部が、絶縁基材３３の平面外周方向に折り曲げられ、外側リード部５１の先端部が絶縁基材３３の厚さの範囲内に配置される。すなわち概Ｌ字形をしていることに特徴がある。なお、外側リード部５１の折り曲げは、金型などによって成形される。 (Second Embodiment)
FIG. 2 is a cross-sectional view showing a second embodiment of a piezoelectric oscillator as an example of a piezoelectric device according to the present invention. Hereinafter, in the second embodiment, except for the conductive lead portion 52 of the flexible circuit board 50, it is the same as that of the first embodiment described above, so the same reference numerals are given and the description is omitted.
As shown in FIG. 2, in the conductive lead portion 52, the outer lead portion 51 is bent in the thickness direction of the insulating base material 33, and the distal end portion of the outer lead portion 51 is further bent in the planar outer peripheral direction of the insulating base material 33. The tip of the outer lead 51 is disposed within the thickness range of the insulating base material 33. In other words, it is characterized by an approximate L shape. The outer lead portion 51 is bent by a mold or the like.

本第２実施形態によれば、外側リード部５１が、絶縁基材３３の厚さ方向に折り曲げられ、更に外周方向に折り曲げられ、先端部が絶縁基材３３の厚さの範囲内に配置されていることにより、外側リード部５１を、圧電発振器４０の側面に形成された概Ｌ字型の外部接続端子とすることができる。   According to the second embodiment, the outer lead portion 51 is bent in the thickness direction of the insulating base material 33, further bent in the outer peripheral direction, and the tip portion is disposed within the thickness range of the insulating base material 33. Accordingly, the outer lead portion 51 can be a substantially L-shaped external connection terminal formed on the side surface of the piezoelectric oscillator 40.

前記外部接続端子が他の回路基板に接続された場合において、使用環境の変化により圧電発振器４０と他の回路基板との熱膨張係数差による熱応力が接続部に発生するが、概Ｌ字型に形成された外部接続端子が大きな弾性を有することから、熱応力が吸収され、実装信頼性を向上させることができるという効果を有する。また、前述の第１実施形態の効果も同様に有する。   When the external connection terminal is connected to another circuit board, thermal stress due to a difference in thermal expansion coefficient between the piezoelectric oscillator 40 and the other circuit board is generated in the connection portion due to a change in use environment. Since the external connection terminals formed on the substrate have great elasticity, the thermal stress is absorbed, and the mounting reliability can be improved. Moreover, it has the effect of the above-mentioned 1st Embodiment similarly.

（第３実施形態）
図３は本発明にかかる圧電デバイスの一例としての圧電発振器の第３実施形態を示す断面図である。以下、前述の第１実施形態と同じものは、同符号を付けて説明を省略する。
本第３実施形態と前述の第１実施形態との違いは、前述の第１実施形態における外部接続端子としての外側リード部３６が、本第３実施形態には存在しないことと、本第３実施形態には、前述第１実施形態には存在しない、外部接続端子としての基板ビアホール７２が存在することである。 (Third embodiment)
FIG. 3 is a sectional view showing a third embodiment of a piezoelectric oscillator as an example of a piezoelectric device according to the present invention. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
The difference between the third embodiment and the first embodiment described above is that the outer lead portion 36 as the external connection terminal in the first embodiment described above does not exist in the third embodiment, and the third embodiment. In the embodiment, there is a substrate via hole 72 as an external connection terminal that does not exist in the first embodiment.

図３に示すように、基板ビアホール７２は、金型やドリルなどにより表裏を貫通して形成された接続穴７３内に、めっき法等により、銅などからなる導電材７４が充填されて形成される。なお、接続穴７３内には導電材７４として、印刷法やインクジェット法等により、導電ペーストが充填されても良い。
また、導電材７４は、一端面が基材上配線部３５と接し、電気的に導通している。また基材上配線部３５と接する端面と表裏関係が反対側の端面は、絶縁基材３３から露出している。なお、絶縁基材３３から露出している導電材７４の端部は、表面がめっき法等により金などで被覆されていても良い。 As shown in FIG. 3, the substrate via hole 72 is formed by filling a conductive material 74 made of copper or the like into a connection hole 73 formed by penetrating the front and back surfaces with a mold, a drill, or the like by a plating method or the like. The The connection hole 73 may be filled with a conductive paste as the conductive material 74 by a printing method, an inkjet method, or the like.
In addition, the conductive material 74 has one end surface in contact with the substrate wiring portion 35 and is electrically connected. Further, the end surface opposite to the end surface in contact with the wiring portion 35 on the base material is exposed from the insulating base material 33. Note that the end of the conductive material 74 exposed from the insulating base material 33 may be coated with gold or the like by a plating method or the like.

本実施形態によれば、絶縁基材３３の基材上配線部３５と接している部分に接続穴７３が形成され、その接続穴７３内に導電材７４が充填されている。そして、基材上配線部３５がある面と反対側の絶縁基材３３の面から露出している導電材７４の露出部を、圧電発振器６０の外部接続端子とすることができる。
このようにすることで、圧電発振器６０の機能向上に伴い外部接続端子数が増加する場合においても、外部接続端子を絶縁基材３３平面部の任意の位置に配置でき、外部接続端子の配置のピッチを広く保つことが可能となる。従って、圧電発振器６０を他の回路基板へ接続して使用する際に、接続が容易となり、接続安定性を向上できるという効果を有する。
また、配線の引き回しが不要となり配線長を最短にできることから、発振回路システムとしての安定性を向上できるという効果も有する。また、前述の第１実施形態の効果も同様に有する。 According to the present embodiment, the connection hole 73 is formed in a portion of the insulating base material 33 that is in contact with the substrate wiring portion 35, and the conductive material 74 is filled in the connection hole 73. Then, the exposed portion of the conductive material 74 exposed from the surface of the insulating base material 33 on the side opposite to the surface on which the upper wiring portion 35 is provided can be used as the external connection terminal of the piezoelectric oscillator 60.
By doing in this way, even when the number of external connection terminals increases with the improvement of the function of the piezoelectric oscillator 60, the external connection terminals can be arranged at an arbitrary position on the planar portion of the insulating base 33, and the arrangement of the external connection terminals can be reduced. It becomes possible to keep the pitch wide. Therefore, when the piezoelectric oscillator 60 is connected to another circuit board and used, the connection becomes easy and the connection stability can be improved.
Further, since the wiring is not required and the wiring length can be minimized, there is an effect that the stability as the oscillation circuit system can be improved. Moreover, it has the effect of the above-mentioned 1st Embodiment similarly.

なお、上述の実施形態では、電子デバイスの一例として圧電発振器を用いて説明したが、電子デバイスとしてはこれに限らない。他の電子デバイスとしては、例えば、圧電振動素子を用いたセンサー素子とその発振回路を含む駆動回路を有するセンシングデバイス（例えば、ジャイロセンサー、圧力センサー）などであってもよい。   In the above-described embodiment, the piezoelectric oscillator is described as an example of the electronic device, but the electronic device is not limited to this. As another electronic device, for example, a sensing device (for example, a gyro sensor or a pressure sensor) having a sensor element using a piezoelectric vibration element and a drive circuit including an oscillation circuit thereof may be used.

１０，４０，６０…圧電デバイスとしての圧電発振器、２０…圧電振動子、２１…圧電振動素子、２２…収納容器、２３…蓋体、２４…引出電極、２５…振動子電極、３０，５０…フレキシブル回路基板、３１…半導体素子、３２…半導体素子電極、３３…絶縁基材、３４…内側リード部、３５…基材上配線、 ３６，５１…外側リード部、３７，５２…導電リード部、３８…貫通穴、３９…保護樹脂、７２…基板ビアホール、７３…接続穴、７４…導電材。   DESCRIPTION OF SYMBOLS 10, 40, 60 ... Piezoelectric oscillator as a piezoelectric device, 20 ... Piezoelectric vibrator, 21 ... Piezoelectric vibration element, 22 ... Storage container, 23 ... Cover body, 24 ... Extraction electrode, 25 ... Vibrator electrode, 30, 50 ... Flexible circuit board, 31 ... semiconductor element, 32 ... semiconductor element electrode, 33 ... insulating base material, 34 ... inner lead part, 35 ... wiring on base material, 36,51 ... outer lead part, 37,52 ... conductive lead part, 38 ... through hole, 39 ... protective resin, 72 ... substrate via hole, 73 ... connection hole, 74 ... conductive material.

Claims (3)

圧電振動素子と、前記圧電振動素子が収納される収納容器と、前記圧電振動素子と電気的に接続されて前記収納容器の外面に形成された振動子電極とを有する圧電振動子と、
前記圧電振動素子を発振させる機能を含む発振回路と、前記発振回路と接続された回路素子電極とを有する回路素子と、
前記圧電振動子と前記回路素子とを電気的に接続させたフレキシブル回路基板と、を備え、
前記フレキシブル回路基板は、絶縁基材と、前記絶縁基材に形成された貫通穴と、前記絶縁基材の一面に形成された導電リード部と、を有し、
前記導電リード部は、前記貫通穴に突き出した内側リード部と、前記絶縁基材に接した基材上配線部と、前記絶縁基材の外周部から突き出した外側リード部と、を有し、
前記内側リード部は、前記回路素子電極と接続され、前記基材上配線部は、前記振動子電極と接続され、前記外側リード部は、前記絶縁基材の厚さ方向に折り曲げられ、折り曲げられた前記外側リード部の先端が、前記絶縁基材の厚さの範囲内にあることを特徴とする圧電デバイス。 A piezoelectric vibrator having a piezoelectric vibration element, a storage container storing the piezoelectric vibration element, and a vibrator electrode electrically connected to the piezoelectric vibration element and formed on an outer surface of the storage container;
A circuit element having an oscillation circuit including a function of causing the piezoelectric vibration element to oscillate, and a circuit element electrode connected to the oscillation circuit;
A flexible circuit board in which the piezoelectric vibrator and the circuit element are electrically connected, and
The flexible circuit board has an insulating base, a through hole formed in the insulating base, and a conductive lead portion formed on one surface of the insulating base,
The conductive lead portion has an inner lead portion protruding into the through hole, a wiring portion on the substrate in contact with the insulating base material, and an outer lead portion protruding from the outer peripheral portion of the insulating base material,
The inner lead portion is connected to the circuit element electrode, the substrate upper wiring portion is connected to the vibrator electrode, and the outer lead portion is bent and bent in the thickness direction of the insulating substrate. In addition, the tip of the outer lead portion is within the thickness range of the insulating base material. 前記絶縁基材の厚さ方向に折り曲げられた前記外側リード部は、更に、前記絶縁基材の平面外周方向に折り曲げられ、折り曲げられた前記外側リード部の先端が、前記絶縁基材の厚さの範囲内にあることを特徴とする請求項１に記載の圧電デバイス。   The outer lead portion bent in the thickness direction of the insulating base material is further bent in the plane outer peripheral direction of the insulating base material, and the tip of the bent outer lead portion is the thickness of the insulating base material. The piezoelectric device according to claim 1, wherein the piezoelectric device falls within the range. 圧電振動素子と、前記圧電振動素子が収納される収納容器と、前記圧電振動素子と電気的に接続されて前記収納容器の外面に形成された振動子電極とを有する圧電振動子と、
前記圧電振動素子を発振させる機能を含む発振回路と、前記発振回路と接続された回路素子電極とを有する回路素子と、
前記圧電振動子と前記回路素子とを電気的に接続させたフレキシブル回路基板と、を備え、
前記フレキシブル回路基板は、絶縁基材と、前記絶縁基材に形成された貫通穴と、前記絶縁基材の一面に形成された導電リード部と、を有し、
前記導電リード部は、前記貫通穴に突き出した内側リード部と、前記絶縁基材に接した基材上配線部と、を有し、
前記内側リード部は、前記回路素子電極と接続され、
前記基材上配線部は、前記振動子電極と接続され、
前記絶縁基材は、該絶縁基材の表裏を貫通して形成された接続穴の内に充填された導電材を有し、
前記導電材は、一端面が前記基材上配線部と接続され、前記端面と表裏関係が反対側の端面が、前記絶縁基材面から露出されていることを特徴とする圧電デバイス。 A piezoelectric vibrator having a piezoelectric vibration element, a storage container storing the piezoelectric vibration element, and a vibrator electrode electrically connected to the piezoelectric vibration element and formed on an outer surface of the storage container;
A circuit element having an oscillation circuit including a function of causing the piezoelectric vibration element to oscillate, and a circuit element electrode connected to the oscillation circuit;
A flexible circuit board in which the piezoelectric vibrator and the circuit element are electrically connected, and
The flexible circuit board has an insulating base, a through hole formed in the insulating base, and a conductive lead portion formed on one surface of the insulating base,
The conductive lead part has an inner lead part protruding into the through hole, and a wiring part on a base material in contact with the insulating base material,
The inner lead portion is connected to the circuit element electrode,
The wiring portion on the substrate is connected to the vibrator electrode,
The insulating base material has a conductive material filled in a connection hole formed through the front and back of the insulating base material,
One end face of the conductive material is connected to the wiring portion on the base material, and an end face on the opposite side to the end face is exposed from the insulating base material surface.
JP2009206794A 2009-09-08 2009-09-08 Piezoelectric device Withdrawn JP2011061345A (en)

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