JP2011054852A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2011054852A JP2011054852A JP2009204082A JP2009204082A JP2011054852A JP 2011054852 A JP2011054852 A JP 2011054852A JP 2009204082 A JP2009204082 A JP 2009204082A JP 2009204082 A JP2009204082 A JP 2009204082A JP 2011054852 A JP2011054852 A JP 2011054852A
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- Prior art keywords
- layer
- interposer
- insulating layer
- semiconductor device
- release layer
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
【解決手段】支持基板1上に熱可塑性樹脂からなる剥離層2を形成し、剥離層2の上に、剥離層2の形成に用いた熱可塑性樹脂を溶解する溶剤を含む熱硬化性樹脂からなる絶縁層3を形成する。
【選択図】図1
Description
2 剥離層
3 絶縁層
4 混合層
10 インターポーザ
11A〜11F 配線層
12 絶縁層
21A〜21C 半導体チップ
31 封止樹脂層
Claims (5)
- 支持基板上に熱可塑性樹脂からなる剥離層を形成する工程と、
前記剥離層の上に、前記熱可塑性樹脂を溶解する溶剤を含む熱硬化性樹脂からなる絶縁層を形成する工程と
を備えることを特徴とする半導体装置の製造方法。 - 前記溶剤が前記熱可塑性樹脂を溶解し、前記剥離層と前記絶縁層との間に、前記剥離層と前記絶縁層の成分により構成される混合層が形成される
ことを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記絶縁層を最下層とするインターポーザを形成する
ことを特徴とする請求項2に記載の半導体装置の製造方法。 - 前記剥離層を加熱しながら前記混合層を含む前記絶縁層を前記支持基板に対して相対的に移動させて、前記剥離層を剪断し、前記混合層を含む前記絶縁層を前記支持基板から分離する工程
を備えることを特徴とする請求項3に記載の半導体装置の製造方法。 - 前記混合層を除去する工程
を備えることを特徴とする請求項4に記載の半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009204082A JP2011054852A (ja) | 2009-09-03 | 2009-09-03 | 半導体装置の製造方法 |
US12/850,797 US20110053320A1 (en) | 2009-09-03 | 2010-08-05 | Method of fabricating a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009204082A JP2011054852A (ja) | 2009-09-03 | 2009-09-03 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011054852A true JP2011054852A (ja) | 2011-03-17 |
Family
ID=43625514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009204082A Pending JP2011054852A (ja) | 2009-09-03 | 2009-09-03 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110053320A1 (ja) |
JP (1) | JP2011054852A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204765A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004167874A (ja) * | 2002-11-20 | 2004-06-17 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体 |
JP2005144816A (ja) * | 2003-11-13 | 2005-06-09 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002061827A1 (fr) * | 2001-01-31 | 2002-08-08 | Sony Corporation | DISPOSITIF à SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION |
JP2010010644A (ja) * | 2008-05-27 | 2010-01-14 | Toshiba Corp | 半導体装置の製造方法 |
-
2009
- 2009-09-03 JP JP2009204082A patent/JP2011054852A/ja active Pending
-
2010
- 2010-08-05 US US12/850,797 patent/US20110053320A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004167874A (ja) * | 2002-11-20 | 2004-06-17 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体 |
JP2005144816A (ja) * | 2003-11-13 | 2005-06-09 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体 |
Also Published As
Publication number | Publication date |
---|---|
US20110053320A1 (en) | 2011-03-03 |
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