JP2011054456A - Light emitting device and method of manufacturing light emitting device - Google Patents

Light emitting device and method of manufacturing light emitting device Download PDF

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JP2011054456A
JP2011054456A JP2009203300A JP2009203300A JP2011054456A JP 2011054456 A JP2011054456 A JP 2011054456A JP 2009203300 A JP2009203300 A JP 2009203300A JP 2009203300 A JP2009203300 A JP 2009203300A JP 2011054456 A JP2011054456 A JP 2011054456A
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light
hole
emitting device
led
guide plate
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Naruhito Yanai
成仁 柳井
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To easily abut a light emission surface of an LED on a light guide plate irrespective of dimension tolerance of the LED. <P>SOLUTION: The light emitting device 1 includes a case 5, a light source 32 housed in the case 5, the light guide plate 2 housed in the case 5 and having a hole 22 with a first surface 23a formed on one side part, and a reactive force receiving part 4 formed on a second surface 41 side opposite to a first surface 23a of the hole 22. When the light source 32 is housed in the hole 22, the reactive force receiving part 4 is crashed and the light emission surface 32a of the light source 32 is made in contact with the first surface 23a and is clamped. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、液晶表示装置のバックライトに用いられる発光装置と、その発光装置を製造する方法に関する。   The present invention relates to a light emitting device used for a backlight of a liquid crystal display device and a method for manufacturing the light emitting device.

光源の発光面と導光板とが離れてしまうと、輝度が低下してしまうという問題がある。これを防ぐため、従来の発光装置においては、ＬＥＤ固定板（３）に穿孔された固定部（６）及び、ＬＥＤ実装基板（４）に形成された穿孔部（１３）にＬＥＤ（２）を嵌め込み、固定板の平滑面（７）とＬＥＤの発光面（８）を面一にした状態で、平滑面の上に導光板（レンズ体（１））を取り付けていた（特許文献１参照）。   If the light emitting surface of the light source and the light guide plate are separated from each other, there is a problem that the luminance is lowered. In order to prevent this, in the conventional light emitting device, the LED (2) is placed in the fixing part (6) perforated in the LED fixing plate (3) and the perforated part (13) formed in the LED mounting board (4). The light guide plate (lens body (1)) was mounted on the smooth surface in a state where the smooth surface (7) of the fixing plate and the light emitting surface (8) of the LED were flush with each other (see Patent Document 1). .

特開２００８−０１６１９７号公報JP 2008-016197 A

ところで、ＬＥＤを製造する際には、その寸法に公差が生じる。ＬＥＤの寸法が穿孔部や固定部の寸法よりも大きくなった場合、ＬＥＤを穿孔部や固定部に嵌め込むことが困難となる。逆に、ＬＥＤの寸法が穿孔部や固定部の寸法よりも小さくなった場合、ＬＥＤが固定部から動いてしまい、ＬＥＤ実装基板の固定や導光板の取り付けが困難となる。
そこで、本発明が解決しようとする課題は、ＬＥＤの寸法公差に関係なく、ＬＥＤの発光面を容易に導光板に接触させることである。 By the way, when manufacturing LEDs, there is a tolerance in their dimensions. When the dimension of the LED becomes larger than the dimension of the perforated part or the fixed part, it becomes difficult to fit the LED into the perforated part or the fixed part. On the contrary, when the dimension of the LED becomes smaller than the dimension of the perforated part or the fixed part, the LED moves from the fixed part, and it becomes difficult to fix the LED mounting board or attach the light guide plate.
Therefore, the problem to be solved by the present invention is to easily bring the light emitting surface of the LED into contact with the light guide plate regardless of the dimensional tolerance of the LED.

以上の課題を解決するため、本発明の一の態様によれば、
ケースと、
前記ケース内に収容される光源と、
前記ケース内に収容され、一側部に第一の面を有した孔が設けられた導光板と、
前記孔の前記第一の面に対向する第二の面側に設けられた反力受け部と、を備え、
前記光源を前記孔に収容すると、前記反力受け部が押し潰されることによって前記光源の発光面が前記第一の面に接触して挟持されることを特徴とする発光装置が提供される。 In order to solve the above problems, according to one aspect of the present invention,
Case and
A light source housed in the case;
A light guide plate housed in the case and provided with a hole having a first surface on one side;
A reaction force receiving portion provided on the second surface side facing the first surface of the hole,
When the light source is accommodated in the hole, a light emitting device is provided in which the light receiving surface of the light source is held in contact with the first surface by being crushed by the reaction force receiving portion.

好ましくは、前記孔における前記第一の面と前記第二の面以外の側面にも更に反力受け部を備えている。
好ましくは、前記孔は複数設けられ、１つの前記孔につき１つ以上の前記光源が収容されている。
好ましくは、前記孔は、矩形状である。
好ましくは、前記反力受け部は、前記孔に取り付けられた弾性体である。
好ましくは、前記弾性体は、前記導光板と一体成型されている。
好ましくは、前記反力受け部は、前記孔の内面に設けられ、前記光源に向かって尖った先端部を有する。 Preferably, a reaction force receiving portion is further provided on a side surface of the hole other than the first surface and the second surface.
Preferably, a plurality of the holes are provided, and one or more light sources are accommodated per one hole.
Preferably, the hole has a rectangular shape.
Preferably, the reaction force receiving portion is an elastic body attached to the hole.
Preferably, the elastic body is integrally formed with the light guide plate.
Preferably, the reaction force receiving portion is provided on an inner surface of the hole and has a tip portion sharpened toward the light source.

本発明の他の態様によれば、
導光板に孔を形成するとともに前記孔の内面に光を導入する第一の面を設け、前記孔の内面であって前記第一の面と対向する第二の面側に反力受け部を設け、光源を前記第一の面と前記反力受け部との間に嵌め込むとともに、前記反力受け部が前記光源と前記孔の内面とで押しつぶされ、前記光源の発光面が前記第一の面に接触して把持された状態とすることを特徴とする発光装置の製造方法が提供される。 According to another aspect of the invention,
A hole is formed in the light guide plate and a first surface for introducing light is provided on the inner surface of the hole, and a reaction force receiving portion is provided on a second surface side of the hole facing the first surface. And the light source is fitted between the first surface and the reaction force receiving portion, the reaction force receiving portion is crushed by the light source and the inner surface of the hole, and the light emitting surface of the light source is the first light emitting surface. There is provided a method for manufacturing a light emitting device, wherein the light emitting device is held in contact with the surface of the light emitting device.

本発明によれば、光源の寸法公差が基準寸法より大きくても小さくても、その公差に合わせて樹脂部材が圧縮され、光源が導光板の入射面と樹脂部材とに挟持された状態となる。このため、光源の発光面を容易に入射面に接触させることができる。   According to the present invention, regardless of whether the dimensional tolerance of the light source is larger or smaller than the reference dimension, the resin member is compressed according to the tolerance, and the light source is sandwiched between the incident surface of the light guide plate and the resin member. . For this reason, the light emission surface of a light source can be made to contact an incident surface easily.

本発明の第１実施形態における発光装置を示した正面図である。It is the front view which showed the light-emitting device in 1st Embodiment of this invention. 同実施形態における導光板を示した正面図である。It is the front view which showed the light-guide plate in the same embodiment. 図２の一部を拡大して示した図である。It is the figure which expanded and showed a part of FIG. 図２のIV−IV断面図である。It is IV-IV sectional drawing of FIG. 図１のＶ−Ｖ断面図である。It is VV sectional drawing of FIG. 本発明の第２実施形態における発光装置の一部を拡大して示した正面図である。It is the front view which expanded and showed a part of light-emitting device in 2nd Embodiment of this invention. 本発明の第３実施形態における発光装置を示した正面図である。It is the front view which showed the light-emitting device in 3rd Embodiment of this invention. 同実施形態の変形例を示した図である。It is the figure which showed the modification of the embodiment.

以下に、本発明を実施するための好ましい形態について図面を用いて説明する。但し、以下に述べる実施形態には、本発明を実施するために技術的に好ましい種々の限定が付されているが、発明の範囲を以下の実施形態及び図示例に限定するものではない。   Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

＜第１実施形態＞
まず、発光装置１の構成について説明する。
図１は、発光装置１の正面図である。この発光装置１は、導光板２と、導光板２の一側部に取り付けられたＬＥＤユニット３と、導光板２及びＬＥＤユニット３を収納するケース５を備えている。ＬＥＤユニット３は、ＦＰＣ基板３１と、ＦＰＣ基板３１の上に複数実装されたＬＥＤ３２とで構成されている。ＦＰＣ基板３１は、帯状の実装部３１ａと、実装部３１ａの一側部から延びる延出部３１ｂと、延出部３１ｂの先端に設けられ、図示しない電子機器に接続される端子３１ｃとを有している。ＬＥＤ３２は、導光板２に光を供給する光源であり、図１の方向から見て略矩形状をした部材である。ＬＥＤ３２は、発光面３２ａ（図５に図示）を有している。ＬＥＤ３２は、実装部３１ａの長手方向に沿って一列に、且つ等間隔に並べられている。 <First Embodiment>
First, the configuration of the light emitting device 1 will be described.
FIG. 1 is a front view of the light emitting device 1. The light emitting device 1 includes a light guide plate 2, an LED unit 3 attached to one side of the light guide plate 2, and a case 5 that houses the light guide plate 2 and the LED unit 3. The LED unit 3 includes an FPC board 31 and a plurality of LEDs 32 mounted on the FPC board 31. The FPC board 31 has a strip-shaped mounting portion 31a, an extending portion 31b extending from one side of the mounting portion 31a, and a terminal 31c provided at the tip of the extending portion 31b and connected to an electronic device (not shown). is doing. The LED 32 is a light source that supplies light to the light guide plate 2 and is a member having a substantially rectangular shape when viewed from the direction of FIG. The LED 32 has a light emitting surface 32a (shown in FIG. 5). The LEDs 32 are arranged in a line and at equal intervals along the longitudinal direction of the mounting portion 31a.

図２は導光板２の正面図である。導光板２は、ＬＥＤ３２から導入した光を面状にして射出するものである。導光板２は、透明なアクリル樹脂、ポリカーボネート樹脂等の樹脂材料によって略矩形の板状に形成されている。導光板２の中央部は略矩形の反射部２１となっている。反射部２１の背面には、入射光を乱反射させるための微細な溝または半円上の凹部が無数に形成されている。導光板２の一側部には、ＬＥＤ３２を嵌め込むための孔２２が複数形成されている。孔２２は、反射部２１の一辺に沿って一列に、且つ等間隔に並べて形成されている。隣り合う二つの孔２２の間隔は、隣り合う二つのＬＥＤ３２の間隔と等しくなっている。
以下、導光板２の孔２２よりも反射部２１の側を本体２３、それ以外の部分を側辺部２４と称する。側辺部２４は、孔２２よりも導光板２の外側の部分である周囲部２５と、本体２３と周囲部２５を繋ぐ連結部２６とからなる。側辺部２４は、周囲部２５の左右両端から連結部２６を入射面２３ａの方向にそれぞれ延ばした形状をしており、入射面２３ａの方向に開放されている。 FIG. 2 is a front view of the light guide plate 2. The light guide plate 2 emits light introduced from the LEDs 32 in a planar shape. The light guide plate 2 is formed in a substantially rectangular plate shape by a resin material such as transparent acrylic resin or polycarbonate resin. The central portion of the light guide plate 2 is a substantially rectangular reflecting portion 21. An infinite number of fine grooves or semicircular recesses for irregularly reflecting incident light are formed on the back surface of the reflecting portion 21. A plurality of holes 22 into which the LEDs 32 are fitted are formed on one side of the light guide plate 2. The holes 22 are formed in a line along the one side of the reflecting portion 21 and at equal intervals. The interval between two adjacent holes 22 is equal to the interval between two adjacent LEDs 32.
Hereinafter, the side of the reflecting portion 21 from the hole 22 of the light guide plate 2 is referred to as a main body 23, and the other portion is referred to as a side portion 24. The side portion 24 includes a peripheral portion 25 that is an outer portion of the light guide plate 2 than the hole 22 and a connecting portion 26 that connects the main body 23 and the peripheral portion 25. The side part 24 has a shape in which the connecting part 26 extends from the left and right ends of the peripheral part 25 in the direction of the incident surface 23a, and is open in the direction of the incident surface 23a.

図３は、図２の円で囲んだ部分を拡大して示した図であり、図４は、図２のIV−IV断面図である。図３に示すように、孔２２は、導光板２の厚さ方向（図３の紙面に垂直な方向）に沿って形成されている。図３の方向から見た孔２２の形状は、図１の方向から見たＬＥＤ３２よりも一回り大きな矩形となっている。孔２２の内面であって本体２３の側面は、ＬＥＤ３２の発光面３２ａから出射した光を導光板２へと導入する入射面２３ａとなっている。   3 is an enlarged view of a portion surrounded by a circle in FIG. 2, and FIG. 4 is a sectional view taken along the line IV-IV in FIG. As shown in FIG. 3, the holes 22 are formed along the thickness direction of the light guide plate 2 (direction perpendicular to the paper surface of FIG. 3). The shape of the hole 22 viewed from the direction of FIG. 3 is a rectangle that is slightly larger than the LED 32 viewed from the direction of FIG. The inner surface of the hole 22 and the side surface of the main body 23 is an incident surface 23 a for introducing light emitted from the light emitting surface 32 a of the LED 32 into the light guide plate 2.

孔２２の中には樹脂部材４が一体成型されている。樹脂部材４はゴム等の弾性体で形成され、弾性を有している。樹脂部材４は、周囲部２５の側面２５ａに沿って形成された背後面４１、及び連結部２６の側面２６ａ，２６ｂに沿って形成された側部４２，４３からなり、図３に示す方向から見て入射面２３ａの方向に開放されたＵ字状となっている。背後面４１は、図４に示すように、側面２５ａと平行且つその奥行きが導光板２の厚さと等しくなるよう形成されている。図示しないが、側部４２，４３も同様に形成されている。入射面２３ａと背後面４１とは所定間隔を空けて互いに対向している。入射面２３ａと背後面４１との距離は、図１の方向から見たＬＥＤ３２の短手方向の幅よりも短く、側部４２と側部４３との距離は、図１の方向から見たＬＥＤ３２の長手方向の幅より短くなっている。なお、実験的、理論的或いは経験的に、ＬＥＤ３２の寸法にはばらつきが生じることが推測される。このため、入射面２３ａと背後面４１との距離、及び側部４２と側部４３との距離は、推測される中で最も小さく製造されるＬＥＤ３２の寸法を基準として設計することが好ましい。   The resin member 4 is integrally molded in the hole 22. The resin member 4 is formed of an elastic body such as rubber and has elasticity. The resin member 4 includes a rear surface 41 formed along the side surface 25a of the peripheral portion 25 and side portions 42 and 43 formed along the side surfaces 26a and 26b of the connecting portion 26, and from the direction shown in FIG. The U-shape is open in the direction of the incident surface 23a as viewed. As shown in FIG. 4, the rear surface 41 is formed so as to be parallel to the side surface 25 a and have a depth equal to the thickness of the light guide plate 2. Although not shown, the side portions 42 and 43 are formed in the same manner. The incident surface 23a and the rear surface 41 are opposed to each other with a predetermined interval. The distance between the incident surface 23a and the rear surface 41 is shorter than the width in the short direction of the LED 32 viewed from the direction of FIG. 1, and the distance between the side portion 42 and the side portion 43 is the LED 32 viewed from the direction of FIG. It is shorter than the width in the longitudinal direction. In addition, it is estimated experimentally, theoretically, or empirically that the size of the LED 32 varies. For this reason, it is preferable to design the distance between the incident surface 23a and the rear surface 41 and the distance between the side portion 42 and the side portion 43 on the basis of the size of the LED 32 that is manufactured to be the smallest.

図５は、図１のＶ−Ｖ断面図である。ＬＥＤユニット３が導光板２に取り付けられると、ＦＰＣ３１の実装部３１ａと導光板２の背面とが両面テープで接着される。そして、ＬＥＤ３２が孔２２に嵌め込まれる。すると、周囲部２５及び連結部２６によって、ＬＥＤ３２及び樹脂部材４が覆われる。すると、樹脂部材４の背後面４１が反力受け部として機能し、図５に示すようにしてＬＥＤ３２と周囲部２５の側面２５ａとで圧縮される。そして、ＬＥＤ３２の発光面３２ａが背後面４１の弾性力によって入射面２３ａの方向へと押し付けられる。また、樹脂部材４の側部４２，４３が反力受け部として機能し、ＬＥＤ３２と連結部２６の側面２６ａ，２６ｂとで圧縮される。そして、ＬＥＤ３２が側部４２，４３の弾性力によって側面２６ａ，２６ｂの方向へ押される。このようにして発光装置１が構成されている。   5 is a cross-sectional view taken along the line VV in FIG. When the LED unit 3 is attached to the light guide plate 2, the mounting portion 31 a of the FPC 31 and the back surface of the light guide plate 2 are bonded with a double-sided tape. Then, the LED 32 is fitted into the hole 22. Then, the LED 32 and the resin member 4 are covered by the peripheral portion 25 and the connecting portion 26. Then, the rear surface 41 of the resin member 4 functions as a reaction force receiving portion and is compressed by the LED 32 and the side surface 25a of the peripheral portion 25 as shown in FIG. Then, the light emitting surface 32a of the LED 32 is pressed toward the incident surface 23a by the elastic force of the back surface 41. Further, the side portions 42 and 43 of the resin member 4 function as reaction force receiving portions, and are compressed by the LED 32 and the side surfaces 26 a and 26 b of the connecting portion 26. Then, the LED 32 is pushed in the direction of the side surfaces 26a and 26b by the elastic force of the side portions 42 and 43. In this way, the light emitting device 1 is configured.

次に、発光装置１の製造方法について説明する。
始めに、導光板２を製造する。略矩形状に窪み、その窪みの一端部に四角柱形の突起が複数形成された金型を作り、そこにアクリル樹脂やポリカーボネート樹脂等の樹脂材料を流し込む。樹脂材料が固化すると一側部に孔２２が形成された樹脂板ができる。次に、略矩形状に窪み、初めの金型と同じ位置に初めの金型より細い四角柱形の突起が複数形成された金型を作り、そこに製作した樹脂板をはめ込む。金型の突部と樹脂板の孔２２の間にできるＵ字状の隙間にゴムを流し込む。ゴムが固まると孔２２に樹脂部材４が一体成型される。樹脂板の背面にレーザ加工等により反射部２１を形成する。こうして導光板２が出来上がる。 Next, a method for manufacturing the light emitting device 1 will be described.
First, the light guide plate 2 is manufactured. A mold having a substantially rectangular shape and a plurality of quadrangular columnar protrusions formed at one end of the recess is made, and a resin material such as an acrylic resin or a polycarbonate resin is poured into the mold. When the resin material is solidified, a resin plate having holes 22 formed on one side portion is obtained. Next, a mold is formed that is recessed in a substantially rectangular shape and has a plurality of quadrangular columnar projections that are thinner than the first mold at the same position as the first mold, and the resin plate that is produced is fitted therein. Rubber is poured into a U-shaped gap formed between the protrusion of the mold and the hole 22 of the resin plate. When the rubber is hardened, the resin member 4 is integrally formed in the hole 22. The reflection portion 21 is formed on the back surface of the resin plate by laser processing or the like. Thus, the light guide plate 2 is completed.

次に、導光板２にＬＥＤユニット３を取り付ける。導光板２背面の孔２２の周囲に両面テープを貼り付ける。そして、ＬＥＤユニット３のＬＥＤ３２を対応する孔２２にそれぞれ押し込む。すると、樹脂部材４が反力受け部として機能し、樹脂部材４がＬＥＤ３２に押し潰され、孔２２の中にＬＥＤ３２が入り込む。ＬＥＤ３２が孔２２に最後まで嵌め込まれると、実装部３１ａと導光板２の背面が接着される。こうして発光装置１が出来上がる。   Next, the LED unit 3 is attached to the light guide plate 2. A double-sided tape is affixed around the hole 22 on the back surface of the light guide plate 2. Then, the LEDs 32 of the LED unit 3 are respectively pushed into the corresponding holes 22. Then, the resin member 4 functions as a reaction force receiving portion, the resin member 4 is crushed by the LED 32, and the LED 32 enters the hole 22. When the LED 32 is fitted into the hole 22 to the end, the mounting portion 31a and the back surface of the light guide plate 2 are bonded. Thus, the light emitting device 1 is completed.

本発明によれば、ＬＥＤ３２の寸法公差が基準寸法より大きくても小さくても、その公差に合わせて樹脂部材４の背後面４１が圧縮され、ＬＥＤ３２が導光板２の入射面２３ａと背後面４１とに挟持された状態となる。このため、ＬＥＤ３２の発光面３２ａを容易に入射面２３ａに接触させることができるという効果を奏する。
更に、連結部２６とＬＥＤ３２との間に樹脂部材４の側部４２，４３を介在させることにより、ＬＥＤ３２の連結部２６の側面２６ａ，２６ｂの方向への動きを規制できるという効果も奏する。
更に、樹脂部材４をゴム等の弾性体によって形成することにより、弾性体の弾性力によってＬＥＤ３２が導光板２の方向に押し付けられ、ＬＥＤ３２がより確実に入射面２３ａに接触するという効果も奏する。 According to the present invention, regardless of whether the dimensional tolerance of the LED 32 is larger or smaller than the reference dimension, the rear surface 41 of the resin member 4 is compressed according to the tolerance, and the LED 32 is incident on the incident surface 23 a and the rear surface 41 of the light guide plate 2. It will be in the state pinched by. For this reason, there exists an effect that the light emission surface 32a of LED32 can be made to contact the entrance plane 23a easily.
Furthermore, by interposing the side portions 42 and 43 of the resin member 4 between the connecting portion 26 and the LED 32, there is an effect that the movement of the LED 32 in the direction of the side surfaces 26a and 26b of the connecting portion 26 can be restricted.
Furthermore, by forming the resin member 4 from an elastic body such as rubber, the LED 32 is pressed in the direction of the light guide plate 2 by the elastic force of the elastic body, so that the LED 32 is more reliably brought into contact with the incident surface 23a.

＜第２実施形態＞
図６は、本発明の第２実施形態における導光板１０２の一部（図２の円で囲んだ部分）を拡大して示したものである。本実施形態は、導光板１０２の孔１２２の形状が第１実施形態と異なっているが、ＬＥＤユニット３やケース５等の他の構成は第１実施形態と同様である。なお、図６ではＬＥＤユニット３及びケース５の図示は省略する。 Second Embodiment
FIG. 6 is an enlarged view of a part of the light guide plate 102 (portion surrounded by a circle in FIG. 2) according to the second embodiment of the present invention. In the present embodiment, the shape of the hole 122 of the light guide plate 102 is different from that of the first embodiment, but other configurations such as the LED unit 3 and the case 5 are the same as those of the first embodiment. In FIG. 6, the LED unit 3 and the case 5 are not shown.

導光板１０２に形成された孔１２２の内面には、複数の尖った突起が設けられている。突起は、アクリル樹脂、ポリカーボネート樹脂等の樹脂材料で導光板１０２の側辺部１２４とそれぞれ一体に形成されており、弾性を有していない。突起は、周囲部１２５の側部に形成された背後面１４１と、連結部１２６の側部に形成された側部１４２，１４３とからなる。背後面１４１の先端部１４１ａは入射面１２３ａの方向に向き、側部１４２の先端部１４２ａと側部１４３の先端部１４３ａは互いに向き合っている。入射面１２３ａと先端部１４１ａの距離は、ＬＥＤ３２の短手方向幅より短く、先端部１４２ａと先端部１４３ａとの距離は、ＬＥＤ３２の長手方向の幅より短くなっている。このようにして発光装置１０１が構成されている。   A plurality of pointed protrusions are provided on the inner surface of the hole 122 formed in the light guide plate 102. The protrusions are integrally formed with the side portions 124 of the light guide plate 102 of a resin material such as acrylic resin or polycarbonate resin, and have no elasticity. The protrusion includes a rear surface 141 formed on the side portion of the peripheral portion 125 and side portions 142 and 143 formed on the side portion of the connecting portion 126. The front end portion 141a of the rear surface 141 faces in the direction of the incident surface 123a, and the front end portion 142a of the side portion 142 and the front end portion 143a of the side portion 143 face each other. The distance between the incident surface 123a and the tip portion 141a is shorter than the width in the short direction of the LED 32, and the distance between the tip portion 142a and the tip portion 143a is shorter than the width in the longitudinal direction of the LED 32. In this way, the light emitting device 101 is configured.

先端部１４１ａ、１４２ａ，１４３ａは、尖っているために導光板１０２の本体１２３や側辺部１２４に比べて脆くなっている。このため、先端部１４１ａ、１４２ａ，１４３ａが反力受け部として機能し、孔１２２にＬＥＤ３２を押し込むと、ＬＥＤ３２によって先端部１４１ａ，１４２ａ，１４３ａが押し潰され、ＬＥＤ３２が、入射面１２３ａと先端部１４１ａとで挟持されるとともに、先端部１４２ａと先端部１４３ａとでも挟持される。   The tip portions 141 a, 142 a, and 143 a are sharp, and therefore are more fragile than the main body 123 and the side portion 124 of the light guide plate 102. Therefore, the tip portions 141a, 142a, and 143a function as reaction force receiving portions. When the LED 32 is pushed into the hole 122, the tip portions 141a, 142a, and 143a are crushed by the LED 32, and the LED 32 is connected to the incident surface 123a and the tip portion. 141a and the tip part 142a and the tip part 143a.

本実施形態によれば、突起が弾性を有していないので、ＬＥＤ３２の発光面３２ａが入射面１２３ａに接触した状態でＬＥＤ３２を導光板１０２に固定することができるという効果を奏する。また、樹脂部材１０４を導光板１０２と一体に形成することで、導光板１０２の製作工程を減らすことができるという効果も奏する。   According to this embodiment, since the protrusion does not have elasticity, there is an effect that the LED 32 can be fixed to the light guide plate 102 in a state where the light emitting surface 32a of the LED 32 is in contact with the incident surface 123a. Further, by forming the resin member 104 integrally with the light guide plate 102, there is an effect that the manufacturing process of the light guide plate 102 can be reduced.

＜第３実施形態＞
図７は、本発明の第３実施形態における発光装置２０１の正面図である。本実施形態は、導光板２０２の形状が第１実施形態と異なっているが、ＬＥＤユニット３やケース５等の構成は第１実施形態と同様である。なお、図７でもＬＥＤユニット３及びケース５の図示を省略する。 <Third Embodiment>
FIG. 7 is a front view of the light emitting device 201 according to the third embodiment of the present invention. In the present embodiment, the shape of the light guide plate 202 is different from that of the first embodiment, but the configurations of the LED unit 3 and the case 5 are the same as those of the first embodiment. In FIG. 7, the LED unit 3 and the case 5 are not shown.

導光板２０２の一側部には、面方向に突出する凸部２２６が等間隔に複数形成されている。隣り合う二つの凸部２２６の間隔は、寸法のばらつきが推測される中で最も大きく製造されるＬＥＤ３２の長手方向の幅よりも長くなっている。本体２２３の側面であって隣り合う二つの凸部２２６の間は、入射面２２３ａとなっている。ケース２０５は、周囲に側壁２５１が形成された略矩形トレー状の部材である。樹脂部材２０４は、ゴム等の弾性体で棒状に形成されている。   On one side of the light guide plate 202, a plurality of convex portions 226 projecting in the surface direction are formed at equal intervals. The interval between the two adjacent convex portions 226 is longer than the width in the longitudinal direction of the LED 32 that is manufactured to be the largest among the estimated size variations. An incident surface 223 a is formed between two adjacent convex portions 226 on the side surface of the main body 223. The case 205 is a substantially rectangular tray-shaped member having a side wall 251 formed around it. The resin member 204 is formed in a rod shape with an elastic body such as rubber.

導光板２０２は、ケース２０５に収納されると共にケース２０５に固定される。そして、入射面２２３ａは側壁（背後面）２５１と所定の間隔を空けて対向する。樹脂部材２０４は、凸部２２６の先端と側壁２５１の内面２５１ａとの間に挟みこまれる。そして、入射面２２３ａ、凸部２２６及び樹脂部材２０４で囲まれる空間（孔）２２２が等間隔に複数形成される。空間２２２内において、入射面２２３ａと樹脂部材２０４との距離は、ＬＥＤ３２の短手方向の幅より短い。   The light guide plate 202 is housed in the case 205 and fixed to the case 205. The incident surface 223a faces the side wall (back surface) 251 with a predetermined distance. The resin member 204 is sandwiched between the tip of the convex portion 226 and the inner surface 251 a of the side wall 251. A plurality of spaces (holes) 222 surrounded by the incident surface 223a, the convex portion 226, and the resin member 204 are formed at equal intervals. In the space 222, the distance between the incident surface 223a and the resin member 204 is shorter than the width of the LED 32 in the short direction.

ＬＥＤユニット３は、導光板２０２の表側から取り付けられる。ＬＥＤユニット３が導光板２０２に取り付けられると、ＦＰＣ３１の実装部３１ａと導光板２０２の正面とが両面テープで接着される。そして、ＬＥＤ３２が空間２２２に嵌め込まれる。すると、樹脂部材２０４が反力受け部として機能する。即ち、樹脂部材２０４がＬＥＤ３２と側壁２５１の内面２５１ａとで押し潰されて圧縮される。そして、ＬＥＤ３２の発光面３２ａが樹脂部材２０４の弾性力によって入射面２２３ａの方向へと押し付けられる。このようにして発光装置２０１が構成されている。   The LED unit 3 is attached from the front side of the light guide plate 202. When the LED unit 3 is attached to the light guide plate 202, the mounting portion 31a of the FPC 31 and the front surface of the light guide plate 202 are bonded with a double-sided tape. Then, the LED 32 is fitted into the space 222. Then, the resin member 204 functions as a reaction force receiving portion. That is, the resin member 204 is crushed and compressed by the LED 32 and the inner surface 251 a of the side wall 251. Then, the light emitting surface 32 a of the LED 32 is pressed toward the incident surface 223 a by the elastic force of the resin member 204. In this way, the light emitting device 201 is configured.

（第３実施形態の変形例）
図８は、第３実施形態の変形例を示した図である。本変形例では、樹脂部材２０４の形状が異なっている。樹脂部材２０４は、棒状の背後面２４１及び背後面２４１に複数形成された凸部２４２からなる。隣り合う二つの凸部２４２の間隔は、狭い箇所と広い箇所が交互になっている。狭い箇所の間隔は、凸部２２６の太さとほぼ等しく、広い箇所の間隔は、ＬＥＤ３２の長手方向の幅より短くなっている。導光板２０２と共にケース２０５に収納された樹脂部材２０４は、背後面２４１が凸部２２６と側壁２５１との間に挟み込まれ、凸部２４２が凸部２２６を挟み込んでいる。そして、入射面２２３ａ、凸部２４２及び背後面２４１で囲まれる空間（孔）２２２が等間隔に複数形成される。 (Modification of the third embodiment)
FIG. 8 is a diagram showing a modification of the third embodiment. In this modification, the shape of the resin member 204 is different. The resin member 204 includes a rod-shaped rear surface 241 and a plurality of convex portions 242 formed on the rear surface 241. A narrow portion and a wide portion are alternately arranged between two adjacent convex portions 242. The interval between the narrow portions is substantially equal to the thickness of the convex portion 226, and the interval between the wide portions is shorter than the width in the longitudinal direction of the LED 32. The resin member 204 housed in the case 205 together with the light guide plate 202 has a rear surface 241 sandwiched between the convex portion 226 and the side wall 251, and the convex portion 242 sandwiches the convex portion 226. A plurality of spaces (holes) 222 surrounded by the incident surface 223a, the convex portion 242 and the rear surface 241 are formed at equal intervals.

この空間２２２にＬＥＤ３２が嵌め込まれると、背後面２４１及び凸部２４２が反力受け部として機能する。即ち、背後面２４１がＬＥＤ３２と側壁２５１の内面２５１ａとで押し潰されて圧縮される。そして、ＬＥＤ３２の発光面３２ａが背後面２４１の弾性力によって入射面２２３ａの方向へと押し付けられる。また、凸部２４２がＬＥＤ３２と凸部２２６とで圧縮される。そして、ＬＥＤ３２が凸部２４２の弾性力によって左右から押される。   When the LED 32 is fitted in the space 222, the rear surface 241 and the convex portion 242 function as a reaction force receiving portion. That is, the rear surface 241 is crushed and compressed by the LED 32 and the inner surface 251 a of the side wall 251. Then, the light emitting surface 32a of the LED 32 is pressed toward the incident surface 223a by the elastic force of the back surface 241. Further, the convex portion 242 is compressed by the LED 32 and the convex portion 226. Then, the LED 32 is pushed from the left and right by the elastic force of the convex portion 242.

本実施形態によれば、樹脂部材２０４以外は従来の部品を用いることが可能で、更に容易にＬＥＤを接触させることができるという効果を奏する。   According to the present embodiment, it is possible to use conventional parts other than the resin member 204, and there is an effect that the LED can be brought into contact more easily.

なお、樹脂部材はＬＥＤと周囲部とに挟まれる部分と、ＬＥＤと連結部とに挟まれる部分とで分かれていてもよい。
また、樹脂部材を一体成型せずに、導光板とは別に製造し、後から導光板に取り付けてもよい。
また、樹脂部材以外にも、圧縮可能な部材であれば何でも用いることができる。
また、第３実施形態において、ＬＥＤユニット３を先に導光板２０２に取り付けておき、後から樹脂部材２０４を詰めてもよい。 In addition, the resin member may be divided into a part sandwiched between the LED and the peripheral part and a part sandwiched between the LED and the connecting part.
Further, the resin member may be manufactured separately from the light guide plate without being integrally molded, and attached to the light guide plate later.
In addition to the resin member, any compressible member can be used.
In the third embodiment, the LED unit 3 may be attached to the light guide plate 202 first, and the resin member 204 may be filled later.

１，１０１，２０１ 発光装置
２，１０２，２０２ 導光板
２３ａ，１２３ａ，２２３ａ 入射面（第１の面）
２５，１２５ 周囲部
２６，１２６ 連結部
３ ＬＥＤユニット
３２ ＬＥＤ（光源）
３２ａ 発光面
４，１０４，２０４ 樹脂部材（反力受け部）
１４１ａ、１４２ａ、１４３ａ先端部（反力受け部）
２２６ 凸部（反力受け部）
５，２０５ ケース
２５１ 側壁 1, 101, 201 Light-emitting device 2, 102, 202 Light guide plate 23a, 123a, 223a Incident surface (first surface)
25, 125 Peripheral part 26, 126 Connection part 3 LED unit 32 LED (light source)
32a Light emitting surface 4, 104, 204 Resin member (reaction force receiving part)
141a, 142a, 143a tip portion (reaction force receiving portion)
226 Convex part (reaction force receiving part)
5,205 Case 251 Side wall

Claims (8)

ケースと、
前記ケース内に収容される光源と、
前記ケース内に収容され、一側部に第一の面を有した孔が設けられた導光板と、
前記孔の前記第一の面に対向する第二の面側に設けられた反力受け部と、を備え、
前記光源を前記孔に収容すると、前記反力受け部が押し潰されることによって前記光源の発光面が前記第一の面に接触して挟持されることを特徴とする発光装置。 Case and
A light source housed in the case;
A light guide plate housed in the case and provided with a hole having a first surface on one side;
A reaction force receiving portion provided on the second surface side facing the first surface of the hole,
When the light source is accommodated in the hole, the light receiving surface of the light source is clamped in contact with the first surface by crushing the reaction force receiving portion. 前記孔における前記第一の面と前記第二の面以外の側面にも更に反力受け部を備えていることを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, further comprising a reaction force receiving portion on a side surface of the hole other than the first surface and the second surface. 前記孔は複数設けられ、１つの前記孔につき１つ以上の前記光源が収容されていることを特徴とする請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, wherein a plurality of the holes are provided, and one or more of the light sources are accommodated in each of the holes. 前記孔は、矩形状であることを特徴とする請求項１から３のいずれか一項に記載の発光装置。   The light emitting device according to claim 1, wherein the hole has a rectangular shape. 前記反力受け部は、前記孔に取り付けられた弾性体であることを特徴とする請求項１から４の何れか一項に記載の発光装置。   The light emitting device according to claim 1, wherein the reaction force receiving portion is an elastic body attached to the hole. 前記弾性体は、前記導光板と一体成型されていることを特徴とする請求項５に記載の発光装置。   The light emitting device according to claim 5, wherein the elastic body is integrally formed with the light guide plate. 前記反力受け部は、前記孔の内面に設けられ、前記光源に向かって尖った先端部を有することを特徴とする請求項１から４の何れか一項に記載の発光装置。   5. The light-emitting device according to claim 1, wherein the reaction force receiving portion is provided on an inner surface of the hole and has a tip end pointed toward the light source. 導光板に孔を形成するとともに前記孔の内面に光を導入する第一の面を設け、前記孔の内面であって前記第一の面と対向する第二の面側に反力受け部を設け、光源を前記第一の面と前記反力受け部との間に嵌め込むとともに、前記反力受け部が前記光源と前記孔の内面とで押しつぶされ、前記光源の発光面が前記第一の面に接触して把持された状態とすることを特徴とする発光装置の製造方法。   A hole is formed in the light guide plate and a first surface for introducing light is provided on the inner surface of the hole, and a reaction force receiving portion is provided on a second surface side of the hole facing the first surface. And the light source is fitted between the first surface and the reaction force receiving portion, the reaction force receiving portion is crushed by the light source and the inner surface of the hole, and the light emitting surface of the light source is the first light emitting surface. A method for manufacturing a light-emitting device, wherein the light-emitting device is held in contact with the surface of the light-emitting device.
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