JP2011044269A - Lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system for suppressing the temperature rise of a light emitting element substrate while eliminating the need for a heat sink between the light emitting element substrate and a support. <P>SOLUTION: The lighting system includes the light emitting element substrate 2 on which a light emitting element 1 is mounted, a power supply circuit board 8 on which a power supply circuit is mounted for supplying driving power to the light emitting element substrate 2, and the support 4 for supporting the light emitting element substrate 2 and the power supply circuit board 8, the light emitting element substrate 2 and the power supply circuit board 8 being isolated from each other, the support 4 between the light emitting element substrate 2 and the power supply circuit board 8 isolated from each other having a mounting hole 43 via which it is mounted on another. Between the light emitting element substrate 2 and the power supply circuit board 8, a shielding body 5 is provided for shielding heat. A component 9 to be connected to the power supply circuit board 8 or the light emitting element substrate 2 is located between the light emitting element substrate 2 and the power supply circuit board 8 and mounted on the support 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、発光素子が実装された発光素子基板と、該発光素子基板に駆動電力を供給する電源回路が実装された電源回路基板と、前記発光素子基板及び前記電源回路基板を支持する支持体とを備えた照明装置に関する。   The present invention provides a light emitting element substrate on which a light emitting element is mounted, a power supply circuit board on which a power supply circuit that supplies driving power to the light emitting element substrate is mounted, and a support that supports the light emitting element substrate and the power supply circuit board. It is related with the illuminating device provided with.

従来の照明装置では、発光素子基板及び電源回路基板を支持体に支持させる場合に、金属製のフレーム（支持体）にアルミニウム等の金属製の放熱板を取り付けた後、放熱板の上に発光素子基板を発光素子の非実装面が接触するように取り付け、また、発光素子基板に隣接させて電源回路基板をフレームに直接取り付けていた（特許文献１及び２参照）。これにより、発光素子にて発生した熱及び電源回路基板から発光素子基板に流入した熱を放熱板から支持体に伝導させて放熱するようにしていた。   In a conventional lighting device, when a light emitting element substrate and a power circuit board are supported by a support, a metal heat radiating plate such as aluminum is attached to a metal frame (support), and then light is emitted on the heat radiating plate. The element substrate was attached so that the non-mounting surface of the light emitting element was in contact, and the power circuit board was directly attached to the frame adjacent to the light emitting element substrate (see Patent Documents 1 and 2). Thus, heat generated in the light emitting element and heat flowing from the power supply circuit board to the light emitting element substrate are conducted from the heat radiating plate to the support to radiate heat.

特開２００９−４１３１号公報JP 2009-4131 A 特開２００９−９８０４号公報JP 2009-9804 A

従来の照明装置では、例えば、天井に設置する場合、天井に取り付けるフレームに発光素子基板を支持させるとき、フレームとの間に放熱板を介装していたので、作業性が悪かった。また、フレームに天井等への取り付けのために設ける取付部を小さなスペースに収めたいという要望もあった。   In the conventional lighting device, for example, when installed on the ceiling, when the light emitting element substrate is supported by the frame attached to the ceiling, the heat radiation plate is interposed between the frame and the workability is poor. There has also been a desire to fit an attachment portion provided for attachment to a frame or the like in a frame in a small space.

本発明は、上述したような事情に鑑みてなされたものであり、発光素子基板と支持体との間に設けていた放熱板を省略して作業性を改善しつつ、発光素子基板の温度上昇を抑制し、併せて、天井等への取り付けのために支持体に設ける取付部を小さなスペースに収めることができる照明装置を提供することを目的とする。   The present invention has been made in view of the above-described circumstances. The temperature rise of the light-emitting element substrate is improved while improving the workability by omitting the heat dissipation plate provided between the light-emitting element substrate and the support. In addition, an object of the present invention is to provide an illuminating device that can hold an attachment portion provided on a support for attachment to a ceiling or the like in a small space.

本発明に係る照明装置は、発光素子が実装された発光素子基板と、該発光素子基板に駆動電力を供給する電源回路が実装された電源回路基板と、前記発光素子基板及び前記電源回路基板を支持する支持体とを備えた照明装置において、前記発光素子基板と前記電源回路基板とが離隔し、該離隔した前記発光素子基板と前記電源回路基板との間の前記支持体に、他物に取り付けるための取付部を設けていることを特徴とする。   A lighting device according to the present invention includes a light emitting element substrate on which a light emitting element is mounted, a power supply circuit board on which a power supply circuit that supplies driving power to the light emitting element substrate is mounted, the light emitting element substrate, and the power supply circuit board. In a lighting device including a supporting body to be supported, the light emitting element substrate and the power circuit board are separated from each other, and the supporting body between the separated light emitting element substrate and the power circuit board is provided with another object. An attachment portion for attachment is provided.

本発明によれば、離隔した発光素子基板と電源回路基板との間の支持体に取付部が収めてある。また、電源回路基板に実装された電源回路から発光素子基板に駆動電力が供給され、発光素子基板に実装された発光素子が発光した場合、電源回路の発熱により電源回路基板の温度が上昇するが、発光素子基板は電源回路基板と離隔して支持体に支持されているので、電源回路基板の熱は発光素子基板に伝わり難い。   According to the present invention, the attachment portion is housed in the support body between the light emitting element substrate and the power supply circuit substrate which are separated from each other. In addition, when driving power is supplied to the light emitting element substrate from the power circuit mounted on the power circuit board and the light emitting element mounted on the light emitting element substrate emits light, the temperature of the power circuit board rises due to heat generation of the power circuit. Since the light emitting element substrate is supported by the support member apart from the power circuit board, the heat of the power circuit board is difficult to be transmitted to the light emitting element substrate.

本発明に係る照明装置は、発光素子が実装された発光素子基板と、該発光素子基板に駆動電力を供給する電源回路が実装された電源回路基板と、前記発光素子基板及び前記電源回路基板を支持する支持体とを備えた照明装置において、前記発光素子基板と前記電源回路基板との間に、熱を遮蔽する遮蔽体が設けてあることを特徴とする。   A lighting device according to the present invention includes a light emitting element substrate on which a light emitting element is mounted, a power supply circuit board on which a power supply circuit that supplies driving power to the light emitting element substrate is mounted, the light emitting element substrate, and the power supply circuit board. In a lighting device including a supporting body to be supported, a shielding body that shields heat is provided between the light emitting element substrate and the power circuit board.

本発明によれば、電源回路基板に実装された電源回路から発光素子基板に駆動電力が供給され、発光素子基板に実装された発光素子が発光する。この場合、電源回路の発熱により電源回路基板の温度が上昇するが、電源回路基板の熱は発光素子基板と電源回路基板との間に設けた遮蔽体によって遮蔽されるので、電源回路基板の熱は発光素子基板に伝わり難い。また、支持体の内、遮蔽体を設けた付近にねじ等の固定部材を取り付けて、照明装置を天井などに取り付けることができる。   According to the present invention, driving power is supplied to the light emitting element substrate from the power supply circuit mounted on the power supply circuit board, and the light emitting element mounted on the light emitting element substrate emits light. In this case, the temperature of the power supply circuit board rises due to the heat generation of the power supply circuit, but the heat of the power supply circuit board is shielded by the shield provided between the light emitting element substrate and the power supply circuit board. Is difficult to be transmitted to the light emitting element substrate. In addition, a fixing member such as a screw can be attached in the vicinity of the support where the shield is provided, and the lighting device can be attached to the ceiling or the like.

本発明に係る照明装置は、前記電源回路基板又は前記発光素子基板に接続される部品を前記発光素子基板と前記電源回路基板との間に位置させて前記支持体に取り付けてあることを特徴とする。
本発明によれば、発光素子基板と電源回路基板との間に位置して支持体に取り付けられた部品が電源回路基板又は前記発光素子基板に接続される。 The illuminating device according to the present invention is characterized in that the power supply circuit board or a component connected to the light emitting element board is positioned between the light emitting element board and the power supply circuit board and attached to the support. To do.
According to the present invention, the component mounted between the light emitting element substrate and the power supply circuit board and attached to the support is connected to the power supply circuit board or the light emitting element substrate.

本発明に係る照明装置は、前記部品は、前記電源回路に外部から供給される電力及び電源用の制御信号を中継する端子であることを特徴とする。
本発明によれば、外部から供給される電力及び電源用の制御信号は発光素子基板と電源回路基板との間に配置された端子によって中継されてから、電源回路に供給される。 In the lighting device according to the present invention, the component is a terminal that relays power supplied from the outside to the power supply circuit and a control signal for the power supply.
According to the present invention, the power and power control signals supplied from the outside are relayed by the terminals arranged between the light emitting element substrate and the power circuit board, and then supplied to the power circuit.

本発明に係る照明装置は、前記電源回路基板が取り付けてある前記支持体の取付箇所に、放熱片が連設してあることを特徴とする。
本発明によれば、電源回路基板が取り付けてある支持体の取付箇所に連設された放熱片によって電源回路基板の熱が放熱される。 The illuminating device according to the present invention is characterized in that a heat radiating piece is continuously provided at an attachment position of the support body to which the power circuit board is attached.
According to the present invention, the heat of the power circuit board is radiated by the heat dissipating piece continuously provided at the mounting location of the support body to which the power circuit board is mounted.

本発明に係る照明装置は、前記放熱片に、付加機能を有する部品を取り付けていることを特徴とする。
本発明によれば、付加機能を有する部品が電源回路基板の取付箇所の支持体に連設された放熱片に取り付けられる。 The lighting device according to the present invention is characterized in that a component having an additional function is attached to the heat dissipating piece.
According to the present invention, the component having the additional function is attached to the heat dissipating piece that is connected to the support at the attachment location of the power circuit board.

本発明に係る照明装置は、前記部品は、センサ類、スピーカ又は火災報知機であることを特徴とする。
本発明によれば、センサ類、スピーカ又は火災報知機が、電源回路基板の取付箇所の支持体に連設された放熱片に取り付けられる。 In the illumination device according to the present invention, the component is a sensor, a speaker, or a fire alarm.
According to this invention, sensors, a speaker, or a fire alarm is attached to the heat radiating piece connected to the support body of the attachment location of the power circuit board.

本発明に係る照明装置によれば、発光素子基板と電源回路基板とが離隔して支持体に支持され、電源回路基板の熱は発光素子基板に伝わり難く、また、離隔した発光素子基板と電源回路基板との間の支持体に設けた取付部によって支持体が他物に取り付けられるので、発光素子基板と支持体との間に設けていた放熱板を省略して作業性を改善しつつ、発光素子基板の温度上昇を抑制し、さらに天井等への取り付けのために支持体に設ける取付部を小さなスペースに収めることができる照明装置が提供される。   According to the lighting device of the present invention, the light emitting element substrate and the power circuit board are separated and supported by the support, and the heat of the power circuit board is not easily transmitted to the light emitting element substrate. Since the support body is attached to another object by the mounting portion provided on the support body between the circuit board, while improving workability by omitting the heat sink provided between the light emitting element substrate and the support body, Provided is a lighting device that can suppress an increase in temperature of a light-emitting element substrate, and can fit an attachment portion provided on a support for attachment to a ceiling or the like in a small space.

本発明に係る照明装置によれば、電源回路基板の熱は発光素子基板と電源回路基板との間に設けた遮蔽体によって遮蔽され、電源回路基板の熱は発光素子基板に伝わり難いので、発光素子基板と支持体との間に設けていた放熱板を省略して作業性を改善しつつ、発光素子基板の温度上昇を抑制することができ、また、天井等への取り付けのために支持体に取り付けるねじ等の固定部材を小さなスペースに収めることができる照明装置が提供される。   According to the lighting device of the present invention, the heat of the power supply circuit board is shielded by the shield provided between the light emitting element substrate and the power supply circuit board, and the heat of the power supply circuit board is not easily transmitted to the light emitting element substrate. The heat sink provided between the element substrate and the support body is omitted to improve workability, and the temperature rise of the light emitting element substrate can be suppressed, and the support body is attached to the ceiling or the like. Provided is a lighting device that can hold a fixing member such as a screw attached to a small space.

本発明の第１の実施の形態に係る照明装置の分解斜視図である。It is a disassembled perspective view of the illuminating device which concerns on the 1st Embodiment of this invention. 図１に示す照明装置の平面図である。It is a top view of the illuminating device shown in FIG. 図２のＩＩＩ−ＩＩＩ線における断面図である。It is sectional drawing in the III-III line of FIG. 図２のＩＶ−ＩＶ線における断面図である。It is sectional drawing in the IV-IV line of FIG. 図１に示す照明装置の下面側から見た平面図である。It is the top view seen from the lower surface side of the illuminating device shown in FIG. 本発明の第２の実施の形態に係る照明装置の主要部の断面図である。It is sectional drawing of the principal part of the illuminating device which concerns on the 2nd Embodiment of this invention. 本発明の第３の実施の形態に係る照明装置の下面側から見た平面図である。It is the top view seen from the lower surface side of the illuminating device which concerns on the 3rd Embodiment of this invention. 図７に示す照明装置の側面図である。It is a side view of the illuminating device shown in FIG. 図７に示す照明装置の設置構造を示す断面図である。It is sectional drawing which shows the installation structure of the illuminating device shown in FIG. 本発明の第４の実施の形態に係る照明装置の分解斜視図である。It is a disassembled perspective view of the illuminating device which concerns on the 4th Embodiment of this invention. 図１０に示す照明装置の下面側から見た平面図である。It is the top view seen from the lower surface side of the illuminating device shown in FIG. 図１０に示す照明装置の側面図である。It is a side view of the illuminating device shown in FIG. 図１０に示す照明装置の側面図である。It is a side view of the illuminating device shown in FIG. 図１０に示す照明装置の設置構造を示す断面図である。It is sectional drawing which shows the installation structure of the illuminating device shown in FIG.

以下、本発明に係る照明装置の実施の形態について、ストレート型とスクウエア型、及び、天井直付け型と天井埋め込み型を例にして図面に基づいて説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a lighting device according to the present invention will be described based on the drawings, taking a straight type and a square type, and a direct ceiling type and a ceiling embedded type as examples.

第１の実施の形態
第１の実施の形態に係る照明装置はストレート型で天井直付け型である。図１は本発明の第１の実施の形態に係る照明装置の分解斜視図、図２は図１に示す照明装置の平面図、図３は図２のＩＩＩ−ＩＩＩ線における断面図、図４は図２のＩＶ−ＩＶ線における断面図、図５は図１に示す照明装置の下面側から見た平面図である。 1st Embodiment The illuminating device which concerns on 1st Embodiment is a straight type and a ceiling direct attachment type. 1 is an exploded perspective view of the lighting device according to the first embodiment of the present invention, FIG. 2 is a plan view of the lighting device shown in FIG. 1, FIG. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 5 is a cross-sectional view taken along line IV-IV in FIG. 2, and FIG.

複数個の発光ダイオード（以下、ＬＥＤと略す）１が長方形の発光ダイオード基板（以下、ＬＥＤ基板と略す）２の一面２ａに２次元のマトリックス状に等間隔で実装されている。ＬＥＤ１は例えば、ＬＥＤ素子と、該ＬＥＤ素子を封止し、蛍光体が分散された樹脂と、入力端子及び出力端子とを備えた表面実装型ＬＥＤである。ＬＥＤ１は配光特性がランバート分布の指向性を有し、ＬＥＤ１から出射される光はＬＥＤ１の光軸となす角度が９０度以下の範囲に含まれ、指向角は約１２０度である。   A plurality of light emitting diodes (hereinafter abbreviated as LEDs) 1 are mounted on a surface 2a of a rectangular light emitting diode substrate (hereinafter abbreviated as an LED substrate) 2 in a two-dimensional matrix at equal intervals. The LED 1 is, for example, a surface-mount type LED including an LED element, a resin in which the LED element is sealed, and a phosphor is dispersed, and an input terminal and an output terminal. The LED 1 has a directivity with a Lambert distribution of light distribution characteristics, and the light emitted from the LED 1 is included in a range of 90 degrees or less with respect to the optical axis of the LED 1, and the directivity angle is about 120 degrees.

ＬＥＤ基板２には、各ＬＥＤ１に通電するための配線パターン（不図示）、各ＬＥＤ１に一定の電流を流すための制限抵抗（不図示）、及び、後述の電源回路基板８からの配線が接続されるコネクタ３が設けてある。ＬＥＤ基板２には、中央位置及び４隅の５箇所に夫々取付用の貫通孔２ｃが開設してある。   Connected to the LED board 2 are a wiring pattern (not shown) for energizing each LED 1, a limiting resistor (not shown) for supplying a constant current to each LED 1, and wiring from the power supply circuit board 8 described later. A connector 3 is provided. The LED substrate 2 is provided with through holes 2c for attachment at the central position and at five locations at the four corners.

ＬＥＤ基板２は他面２ｂの側に位置してＬＥＤ基板２を保持するフレーム４が設けてある。フレーム４は、例えば鉄、アルミニウム製などの放熱性が良好な金属製である。フレーム４は、断面形状がコの字型の長尺部材であり、長方形状の底部板部４ａ、及び、該底部板部４ａの各長辺側の縁部から底部板部４ａに対して垂直方向に延設された２つの長方形状の側部板部４ｂを有する。各側部板部４ｂの底部板部４ａとは反対側の縁部の内側に、底部板部４ａと平行な方向の溝部４ｂ１を設けてある。さらに、該底部板部４ａ及び側部板部４ｂの両端部にネジ止めされるサイドカバー４ｃが設けてある。底部板部４ａには、ＬＥＤ基板２の各貫通孔２ｃに対応したネジ孔４１と、天井側から電力線及び調光用の電線を引き込むための引込孔４２と、天井への取り付け用の２個の長孔状の取付孔４３とが設けてある。   The LED substrate 2 is provided on the other surface 2b side, and a frame 4 for holding the LED substrate 2 is provided. The frame 4 is made of a metal having good heat dissipation, such as iron or aluminum. The frame 4 is a long member having a U-shaped cross-section, and is rectangular with respect to the bottom plate portion 4a from the rectangular bottom plate portion 4a and the long side edges of the bottom plate portion 4a. It has two rectangular side plate portions 4b extending in the direction. A groove 4b1 in a direction parallel to the bottom plate 4a is provided on the inner side of the edge of each side plate 4b opposite to the bottom plate 4a. Further, side covers 4c are provided that are screwed to both ends of the bottom plate portion 4a and the side plate portions 4b. In the bottom plate part 4a, screw holes 41 corresponding to the respective through holes 2c of the LED substrate 2, a lead-in hole 42 for drawing a power line and a light adjusting wire from the ceiling side, and two pieces for attachment to the ceiling A long hole-like mounting hole 43 is provided.

長手方向に一列状に配置された３枚のＬＥＤ基板２が底部板部４ａの中央側部分に配置され、各ＬＥＤ基板２の一面２ａの側に、長辺側が開口した台形の断面形状を有する反射シート６が配置される。反射シート６は、ＬＥＤ基板２の一面２ａの側とは反対側に高反射率の層を設けたポリカーボネート樹脂製であり、長方形状の底部板部６ａと、該底部板部６ａの各長辺側の縁部から斜め方向に延設された２つの長方形状の側部板部６ｂとを有する。底部板部６ａには、各ＬＥＤ１に対応した開口６１と、ＬＥＤ基板２の貫通孔２ｃに対応した貫通孔６２とが設けてある。   Three LED boards 2 arranged in a line in the longitudinal direction are arranged at the center side portion of the bottom plate portion 4a, and have a trapezoidal cross-sectional shape with an opening on the long side on the one surface 2a side of each LED board 2. A reflection sheet 6 is disposed. The reflection sheet 6 is made of polycarbonate resin having a high reflectance layer on the side opposite to the one surface 2a side of the LED substrate 2, and has a rectangular bottom plate portion 6a and each long side of the bottom plate portion 6a. And two rectangular side plate portions 6b extending obliquely from the side edge. An opening 61 corresponding to each LED 1 and a through hole 62 corresponding to the through hole 2 c of the LED substrate 2 are provided in the bottom plate portion 6 a.

各ＬＥＤ基板２に反射シート６の高反射率の層の反対側が接するように重ね、反射シート６の貫通孔６２とＬＥＤ基板２の貫通孔２ｃとにネジを挿通させ、フレーム４のネジ孔４１にネジ止めすることにより、ＬＥＤ基板２と反射シート６とが底部板部４ａに取り付けられる。   Each LED substrate 2 is overlapped so that the opposite side of the high-reflectance layer of the reflection sheet 6 is in contact with each other, screws are inserted into the through holes 62 of the reflection sheet 6 and the through holes 2c of the LED substrate 2, and screw holes 41 of the frame 4 are inserted. The LED board 2 and the reflection sheet 6 are attached to the bottom plate part 4a by screwing to the bottom plate part 4a.

各ＬＥＤ１から発光し、反射シート６で反射された光を拡散透過させる長方形のカバー７が、反射シート６の開口側に配置されている。カバー７は、フレーム４の側部板部４ｂの溝部４ｂ１の一端から挿入されて保持されている。   A rectangular cover 7 that diffuses and transmits light emitted from each LED 1 and reflected by the reflection sheet 6 is disposed on the opening side of the reflection sheet 6. The cover 7 is inserted and held from one end of the groove 4b1 of the side plate 4b of the frame 4.

一列状に配置された３枚のＬＥＤ基板２の長手方向の両端部側の底部板部４ａに、該底部板部４ａから垂直方向に立設された２つの板部材５がネジ止めにより固定されている。前記カバー７は２つの板部材５によって溝部４ｂ１から外れないように規制される。また、電源回路基板８の側に設けた板部材５によって、電源回路基板８の熱がＬＥＤ基板２に伝わることが遮蔽される。   Two plate members 5 erected in the vertical direction from the bottom plate portion 4a are fixed to the bottom plate portions 4a on both ends in the longitudinal direction of the three LED substrates 2 arranged in a row by screws. ing. The cover 7 is regulated by the two plate members 5 so as not to be detached from the groove 4b1. Further, the plate member 5 provided on the power circuit board 8 side shields the heat of the power circuit board 8 from being transmitted to the LED board 2.

フレーム４の底部板部４ａの一端部側に、板部材５から離隔させて、コンデンサやトランス等の電子部品が実装された電源回路基板８が設けてある。電源回路基板８は、部品の実装面を底部板部４ａに向けた状態で一面が開口した箱状の電源カバー８ｂの内底部に絶縁シート８ａを挟んでネジ止めされ、前記電源カバー８ｂが底部板部４ａにネジ止めされている。電源カバー８ｂと板部材５との間の離隔したスペースに中継用の端子９を備えた端子台が設けられ、底部板部４ａにネジ止めされている。電力線及び調光用の電線が端子９から電源回路基板８に接続されている。これにより、離隔したＬＥＤ基板２と電源回路基板８との間に電源回路基板８に接続される部品（端子９）を配置することにより、該部品（端子９）と電源回路基板８との配線を極力短くするとともに、スペースを有効に活用し、小型化が可能となる。尚、上記ＬＥＤ基板２と電源回路基板８との間に配置する部品はＬＥＤ基板２に接続される部品でもよく、この場合には該部品とＬＥＤ基板２との配線を極力短くするとともに、スペースの有効活用、小型化が可能となる。   A power circuit board 8 on which electronic components such as a capacitor and a transformer are mounted is provided on one end side of the bottom plate portion 4 a of the frame 4 so as to be separated from the plate member 5. The power supply circuit board 8 is screwed with an insulating sheet 8a sandwiched between the inner bottom of a box-shaped power supply cover 8b opened on one side with the component mounting surface facing the bottom plate 4a. Screwed to the plate portion 4a. A terminal block provided with relay terminals 9 is provided in a space between the power supply cover 8b and the plate member 5, and is screwed to the bottom plate portion 4a. A power line and a light control wire are connected from the terminal 9 to the power circuit board 8. Thus, by arranging the component (terminal 9) connected to the power circuit board 8 between the LED substrate 2 and the power circuit board 8 which are separated from each other, wiring between the component (terminal 9) and the power circuit board 8 is performed. Can be made as small as possible, and space can be used effectively to reduce the size. The component disposed between the LED board 2 and the power supply circuit board 8 may be a component connected to the LED board 2. In this case, the wiring between the component and the LED board 2 is shortened as much as possible, and the space is also reduced. Can be effectively utilized and downsized.

フレーム４のサイドカバー４ｃと板部材５との間のフレーム４の開口部分を覆う２枚の長方形のカバー１０が設けてある。該カバー１０は、サイドカバー４ｃを外した状態でフレーム４の側部板部４ｂの溝部４ｂ１に沿って挿入され、板部材５の縁部に当接した後、サイドカバー４ｃを取り付けることで保持される。尚、図５には、中央のカバー７と電源回路基板８側のカバー１０とを一部切り欠いた状態を示す。   Two rectangular covers 10 are provided to cover the opening portion of the frame 4 between the side cover 4 c of the frame 4 and the plate member 5. The cover 10 is inserted along the groove 4b1 of the side plate 4b of the frame 4 with the side cover 4c removed, and is held by attaching the side cover 4c after contacting the edge of the plate member 5. Is done. FIG. 5 shows a state in which the central cover 7 and the cover 10 on the power circuit board 8 side are partially cut away.

次に、第１の実施の形態に係る照明装置の天井への取り付け方法について説明する。先ず、両側のカバー１０及びサイドカバー４ｃを取り外し、フレーム４の底部板部４ａの引込孔４２を通して天井に配設された電力線及び調光用の電線を引き込んだ状態で、フレーム４の底部板部４ａを天井側に設置したチャネル材等に当接させ、２つの取付孔４３からネジを挿通し、チャネル材等のネジ孔（不図示）にネジ止めすることにより、フレーム４が天井側に固定される。次に、引込孔４２を通して引き込んでおいた電力線及び調光用の電線を端子９に接続する。その後、カバー１０とサイドカバー４ｃとを取り付けて設置が終了する。   Next, a method for attaching the lighting device according to the first embodiment to the ceiling will be described. First, the cover 10 and the side cover 4c on both sides are removed, and the bottom plate portion of the frame 4 in a state in which the power lines and the light control wires arranged on the ceiling are drawn through the drawing holes 42 of the bottom plate portion 4a of the frame 4. The frame 4 is fixed to the ceiling side by abutting the channel material 4a installed on the ceiling side with screws 4a through the two mounting holes 43 and screwing into screw holes (not shown) of the channel material etc. Is done. Next, the power line and the light control wire drawn through the lead-in hole 42 are connected to the terminal 9. Thereafter, the cover 10 and the side cover 4c are attached, and the installation is completed.

第２の実施の形態
第２の実施の形態に係る照明装置は第１の実施の形態の照明装置の一部を変形したものである。図６は本発明の第２の実施の形態に係る照明装置の主要部の断面図である。 Second Embodiment An illumination device according to a second embodiment is obtained by modifying a part of the illumination device according to the first embodiment. FIG. 6 is a cross-sectional view of the main part of the illumination device according to the second embodiment of the present invention.

第２の実施の形態では、電源回路基板８が配置されていない側のカバー１０は取り付けず、フレーム４の底部板部４ａに受光センサ１１を設置してある。該受光センサ１１が検出した室内の明るさの信号は図示しない調光制御部に入力され、調光制御部から前記調光用の電線を介して前記電源回路基板８へ入力される。   In the second embodiment, the light receiving sensor 11 is installed on the bottom plate portion 4 a of the frame 4 without attaching the cover 10 on the side where the power circuit board 8 is not disposed. The indoor brightness signal detected by the light receiving sensor 11 is input to a dimming control unit (not shown), and is input from the dimming control unit to the power supply circuit board 8 via the dimming wire.

また、電源回路基板８が配置されている側のフレーム４の底部板部４ａに、電源回路基板８の熱を放熱するためのアルミニウム製などの放熱片１２が連設されている。これにより、電源回路基板８が取り付けてあるフレーム４の取付箇所に連設された放熱片１２によって電源回路基板８の熱が放出されるので、ＬＥＤ基板２が電源回路基板８から受ける熱が少なくなり、ＬＥＤ基板２の温度上昇をさらに抑制することができる。   Further, a heat radiating piece 12 made of aluminum or the like for radiating heat of the power circuit board 8 is connected to the bottom plate portion 4a of the frame 4 on the side where the power circuit board 8 is disposed. As a result, the heat of the power circuit board 8 is released by the heat dissipating piece 12 connected to the mounting position of the frame 4 to which the power circuit board 8 is mounted, so that the LED board 2 receives less heat from the power circuit board 8. Thus, the temperature rise of the LED substrate 2 can be further suppressed.

さらに、該放熱片１２に付加機能を有する部品として火災報知機１３が取り付けてある。なお、火災報知機１３以外に、例えばスピーカを放熱片１２に取り付けてもよい。これにより、部品スペースの有効活用及び小型化を実現しつつ、付加機能を持たせることが可能となる。放熱片１２に取り付ける部品が火災報知機１３の場合は、該火災報知機によって火災の発生を報知することができ、利便性を向上させることができる。また放熱片に取り付ける部品がスピーカの場合は、該スピーカによって緊急の連絡等を行うことができ、また放熱片に取り付ける部品がセンサ類の場合は、該センサ類の検出信号に基づいて例えば照明装置の作動及び停止を制御することができる。   Further, a fire alarm 13 is attached to the heat dissipating piece 12 as a part having an additional function. In addition to the fire alarm 13, for example, a speaker may be attached to the heat dissipation piece 12. Thereby, it is possible to provide an additional function while realizing effective use and miniaturization of the component space. When the part attached to the heat radiating piece 12 is the fire alarm 13, the fire alarm can notify the occurrence of a fire, and the convenience can be improved. In addition, when the component attached to the heat radiating piece is a speaker, emergency communication or the like can be performed by the speaker. When the component attached to the heat radiating piece is a sensor, for example, an illumination device is used based on the detection signal of the sensor. Can be controlled.

第３の実施の形態
第３の実施の形態に係る照明装置は第１の実施の形態の照明装置を天井埋め込み型に構成した点を除いて、第１の実施の形態と同様である。図７は本発明の第３の実施の形態に係る照明装置の下面側から見た平面図、図８は図７に示す照明装置の側面図、図９は図７に示す照明装置の設置構造を示す断面図である。尚、図７には、中央のカバー７と電源回路基板８側のカバー１０とを取り外した状態を示す。 Third Embodiment A lighting apparatus according to a third embodiment is the same as the first embodiment except that the lighting apparatus according to the first embodiment is configured as a ceiling-embedded type. 7 is a plan view seen from the lower surface side of the lighting device according to the third embodiment of the present invention, FIG. 8 is a side view of the lighting device shown in FIG. 7, and FIG. 9 is an installation structure of the lighting device shown in FIG. FIG. FIG. 7 shows a state where the center cover 7 and the cover 10 on the power circuit board 8 side are removed.

第３の実施の形態では、内周寸法がフレーム４の底部板部４ａの外形寸法より少し大きい矩形環状の枠板１６を備え、フレーム４の底部板部４ａとは反対側の側部板部４ｂの縁部に外向きの延出部４ｂ２が設けてある。第３の実施の形態の照明装置を設置する場合は、フレーム４の底部板部４ａを上側にした状態で枠板１６を側部板部４ｂの延出部４ｂ２で受け止め、天井側の埋め込み部に垂下してあるアンカーボルト１４に底部板部４ａの２つの取付孔４３を挿通し、アンカーボルト１４側の受けナット１５ａに当接した底部板部４ａを締め付けナット１５ｂで締め付けて天井側に固定する。枠板１６は天井に接し、天井側の埋め込み部と照明装置との隙間を塞ぐとともに、照明装置の位置を安定に保持する。   In the third embodiment, a rectangular annular frame plate 16 having an inner circumference dimension slightly larger than the outer dimension of the bottom plate portion 4a of the frame 4 is provided, and the side plate portion on the opposite side of the bottom plate portion 4a of the frame 4 is provided. An outwardly extending portion 4b2 is provided at the edge of 4b. When installing the lighting device of the third embodiment, the frame plate 16 is received by the extended portion 4b2 of the side plate portion 4b with the bottom plate portion 4a of the frame 4 facing upward, and the embedded portion on the ceiling side The two anchoring holes 43 of the bottom plate portion 4a are inserted into the anchor bolts 14 suspended from the bottom, and the bottom plate portion 4a that is in contact with the receiving nut 15a on the anchor bolt 14 side is tightened with the tightening nut 15b and fixed to the ceiling side. To do. The frame plate 16 is in contact with the ceiling, closes the gap between the embedded portion on the ceiling side and the lighting device, and stably holds the position of the lighting device.

第４の実施の形態
第４の実施の形態に係る照明装置は天井埋め込み型でスクウエア型にするための構成を除いて第１の実施の形態に係る照明装置と同様である。図１０は本発明の第４の実施の形態に係る照明装置の分解斜視図、図１１は図１０に示す照明装置の下面側から見た平面図、図１２は図１０に示す照明装置の側面図、図１３は図１０に示す照明装置の側面図、図１４は図１０に示す照明装置の設置構造を示す断面図である。 Fourth Embodiment A lighting device according to a fourth embodiment is the same as the lighting device according to the first embodiment, except for a configuration for embedding the ceiling and making it a square type. 10 is an exploded perspective view of the lighting device according to the fourth embodiment of the present invention, FIG. 11 is a plan view seen from the lower surface side of the lighting device shown in FIG. 10, and FIG. 12 is a side view of the lighting device shown in FIG. 13 is a side view of the lighting device shown in FIG. 10, and FIG. 14 is a cross-sectional view showing the installation structure of the lighting device shown in FIG.

第４の実施の形態では、縦及び横方向に各２個並置された４個の矩形状のＬＥＤ基板２Ａと、各ＬＥＤ基板２Ａに対応した４枚の反射シート２１がフレーム２０の底部板部２０ａの中央部分に配置され、底部板部２０ａにネジ止めされる。フレーム２０は底部板部２０ａの縁部に連設された側部板部２０ｂと、底部板部２０ａ及び側部板部２０ｂの端部に取り付けられるサイドカバー２０ｃとを備える。拡散透過用のカバー２２が反射シート２１の開口側に配置されている。内周寸法がフレーム２０の底部板部２０ａの外形寸法より少し大きい矩形環状の枠板２４がフレーム２０を挟んでカバー２２と反対側に配置されている。フレーム２０の側部板部２０ｂの縁部に、カバー２２を保持する溝部２０ｂ１と、枠板２４を受け止める延出部２０ｂ２とが設けてある。電源回路基板３０がフレーム２０の底部板部２０ａのＬＥＤ基板２Ａとは反対側に取り付けてある。   In the fourth embodiment, four rectangular LED boards 2A that are juxtaposed in the vertical and horizontal directions, and four reflection sheets 21 corresponding to the LED boards 2A are the bottom plate portion of the frame 20. It arrange | positions at the center part of 20a and is screwed by the bottom part board part 20a. The frame 20 includes a side plate portion 20b that is connected to the edge of the bottom plate portion 20a, and a side cover 20c that is attached to the end portions of the bottom plate portion 20a and the side plate portion 20b. A cover 22 for diffuse transmission is disposed on the opening side of the reflection sheet 21. A rectangular annular frame plate 24 having an inner circumference dimension slightly larger than the outer dimension of the bottom plate portion 20a of the frame 20 is disposed on the opposite side of the cover 22 with the frame 20 interposed therebetween. A groove 20b1 for holding the cover 22 and an extending portion 20b2 for receiving the frame plate 24 are provided at the edge of the side plate 20b of the frame 20. A power circuit board 30 is attached to the opposite side of the bottom board 20a of the frame 20 from the LED board 2A.

第４の実施の形態の照明装置を設置する場合は、フレーム２０の底部板部２０ａを上側にした状態で枠板２４を側部板部２０ｂの延出部２０ｂ２で受け止め、天井側の埋め込み部に垂下してある連結部材２５の先端を底部板部２０ａの取付部（不図示）に連結することによって天井側に固定される。枠板２４は天井に接し、天井側の埋め込み部と照明装置との隙間を塞ぐとともに、照明装置の位置を安定に保持する。   When installing the lighting device of the fourth embodiment, the frame plate 24 is received by the extended portion 20b2 of the side plate portion 20b with the bottom plate portion 20a of the frame 20 facing upward, and the embedded portion on the ceiling side. By connecting the tip of the connecting member 25 hanging down to the mounting portion (not shown) of the bottom plate portion 20a, it is fixed to the ceiling side. The frame plate 24 is in contact with the ceiling, closes the gap between the embedded portion on the ceiling side and the lighting device, and stably holds the position of the lighting device.

以上の実施の形態では、発光素子として、表面実装型の発光ダイオード（ＬＥＤ）を用いているが、他のタイプの発光ダイオード、あるいは、ＥＬ（Ｅｌｅｃｔｒｏ Ｌｕｍｉｎｅｓｃｅｎｃｅ）等を用いてもよい。   In the above embodiment, a surface-mounted light-emitting diode (LED) is used as the light-emitting element, but another type of light-emitting diode, EL (Electro Luminescence), or the like may be used.

また、以上の実施の形態では、照明装置を天井に設置した例を説明したが、天井以外の壁等の取付対象に設置するようにしてもよい。   Moreover, although the example which installed the illuminating device in the ceiling was demonstrated in the above embodiment, you may make it install in attachment objects, such as walls other than a ceiling.

１ 発光ダイオード（発光素子）
２ 発光ダイオード基板（発光素子基板）
２Ａ 発光ダイオード基板（発光素子基板）
４ フレーム（支持体）
５ 板部材（遮蔽体）
８ 電源回路基板
９ 端子（部品）
１２ 放熱板（放熱片）
１３ 火災報知機（部品）
２０ フレーム（支持体）
３０ 電源回路基板
４３ 取付孔（取付部）
1 Light-emitting diode (light-emitting element)
2 Light emitting diode substrate (light emitting element substrate)
2A light emitting diode substrate (light emitting element substrate)
4 frame (support)
5 Plate member (shield)
8 Power supply circuit board 9 Terminal (component)
12 Heat dissipation plate (heat dissipation piece)
13 Fire alarm (parts)
20 frame (support)
30 Power circuit board 43 Mounting hole (Mounting part)

Claims (7)

発光素子が実装された発光素子基板と、該発光素子基板に駆動電力を供給する電源回路が実装された電源回路基板と、前記発光素子基板及び前記電源回路基板を支持する支持体とを備えた照明装置において、
前記発光素子基板と前記電源回路基板とが離隔し、該離隔した前記発光素子基板と前記電源回路基板との間の前記支持体に、他物に取り付けるための取付部を設けていることを特徴とする照明装置。 A light emitting element substrate on which a light emitting element is mounted, a power supply circuit board on which a power supply circuit that supplies driving power to the light emitting element substrate is mounted, and a support that supports the light emitting element substrate and the power supply circuit board. In the lighting device,
The light emitting element substrate and the power supply circuit board are separated from each other, and an attachment portion for attaching to another object is provided on the support body between the separated light emitting element substrate and the power supply circuit board. A lighting device. 発光素子が実装された発光素子基板と、該発光素子基板に駆動電力を供給する電源回路が実装された電源回路基板と、前記発光素子基板及び前記電源回路基板を支持する支持体とを備えた照明装置において、
前記発光素子基板と前記電源回路基板との間に、熱を遮蔽する遮蔽体が設けてあることを特徴とする照明装置。 A light emitting element substrate on which a light emitting element is mounted, a power supply circuit board on which a power supply circuit that supplies driving power to the light emitting element substrate is mounted, and a support that supports the light emitting element substrate and the power supply circuit board. In the lighting device,
An illuminating device, wherein a shield that shields heat is provided between the light emitting element substrate and the power supply circuit substrate. 前記電源回路基板又は前記発光素子基板に接続される部品を前記発光素子基板と前記電源回路基板との間に位置させて前記支持体に取り付けてあることを特徴とする請求項１又は２に記載の照明装置。   3. The power supply circuit board or a component connected to the light emitting element board is positioned between the light emitting element board and the power supply circuit board and attached to the support. Lighting equipment. 前記部品は、前記電源回路に外部から供給される電力及び電源用の制御信号を中継する端子であることを特徴とする請求項３に記載の照明装置。   The lighting device according to claim 3, wherein the component is a terminal that relays power supplied from the outside to the power supply circuit and a control signal for the power supply. 前記電源回路基板が取り付けてある前記支持体の取付箇所に、放熱片が連設してあることを特徴とする請求項１から４のいずれか１項に記載の照明装置。   The lighting device according to any one of claims 1 to 4, wherein a heat radiating piece is continuously provided at an attachment position of the support body to which the power supply circuit board is attached. 前記放熱片に、付加機能を有する部品を取り付けていることを特徴とする請求項５に記載の照明装置。   The lighting device according to claim 5, wherein a component having an additional function is attached to the heat radiating piece. 前記部品は、センサ類、スピーカ又は火災報知機であることを特徴とする請求項６に記載の照明装置。
The lighting device according to claim 6, wherein the component is a sensor, a speaker, or a fire alarm.

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