JP2011029484A - Wafer holder - Google Patents

Wafer holder Download PDF

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JP2011029484A
JP2011029484A JP2009175206A JP2009175206A JP2011029484A JP 2011029484 A JP2011029484 A JP 2011029484A JP 2009175206 A JP2009175206 A JP 2009175206A JP 2009175206 A JP2009175206 A JP 2009175206A JP 2011029484 A JP2011029484 A JP 2011029484A
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frame body
fitting portion
outer peripheral
adhesive filling
inner peripheral
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JP5225228B2 (en
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Sadao Okawa
貞雄 大川
Kenichiro Sakamoto
憲一朗 坂本
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OKAWA KANAGATA SEKKEI JIMUSHO KK
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OKAWA KANAGATA SEKKEI JIMUSHO KK
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Abstract

<P>PROBLEM TO BE SOLVED: To use a wafer holder even for a large-diameter wafer by making the wafer holder lightweight and low-cost and improving operability while holding large mechanical rigidity. <P>SOLUTION: The wafer holder includes: a first frame body 6 having a first engagement part 12 comprising a first outer circumferential engagement part 10 and a first inner peripheral engagement part 11; and a second frame body 7 having a second outer circumferential engagement part 14 where an outer circumferential adhesive filled part 19 is formed and a second inner peripheral engagement part 15 where an inner peripheral adhesive filled part 20 is formed, wherein an adhesive 17 filling the outer circumferential adhesive-filled part 19 and inner peripheral adhesive-filled part 20 with the second engagement part 16 engaged in the first engagement part 12 is cured to unite the first frame body 6 and the second frame body 7 together, thereby constituting a ring-shaped frame body 3 having an inner gap part 8. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、半導体製造工程に用いられて半導体ウェーハやガラス基板ウェーハ等（以下、ウェーハと総称する。）を保持するウェーハ用ホルダ（以下、ホルダと略称する。）に関する。   The present invention relates to a wafer holder (hereinafter abbreviated as a holder) that is used in a semiconductor manufacturing process and holds a semiconductor wafer, a glass substrate wafer, or the like (hereinafter collectively referred to as a wafer).

半導体製造工程等においては、ウェーハ製造元から供給されたウェーハを１枚ずつ保持して各工程間の搬送或いは保管等を行う際に保持治具としてホルダ（テープフレーム）が用いられる（例えば、特許文献１を参照）。ホルダは、主面上に多数の集積回路形成を行い、導通試験やバックグラインド処理を施したウェーハを保持し、検査工程やチップ形成のためのダイシング工程における保持治具としても用いられる。
ホルダは、金属材料によりリング状に形成されたフレーム体と、このフレーム体の開口部を閉塞して着脱自在に貼り付けられる樹脂フィルムとから構成され、樹脂フィルム上にウェーハを載置して周囲をフレーム体により保護する。ホルダについては、半導体技術に関するスタンダード・仕様・ガイドラインについて日欧米を中心として規格化が図られたＳＥＭＩ規格にも「テープフレーム」として規格化が図られており、このＳＥＭＩ規格に適合する仕様により製造される。ホルダは、例えばフレーム幅１／３位置において３０Ｎの負荷を作用させてもフレーム体に変形等が生じない機械的剛性を有すること等の仕様が規定される。
なお、ホルダについては、軽量化を図るために補強用添加剤を含有させた合成樹脂材により成形したものも提案されている（例えば、特許文献２を参照）。合成樹脂製ホルダについても、上述したＳＥＭＩ規格に適合する仕様を以って製造される。 In semiconductor manufacturing processes and the like, a holder (tape frame) is used as a holding jig when holding wafers supplied from a wafer manufacturer one by one and carrying or storing them between the processes (for example, Patent Documents). 1). The holder forms a large number of integrated circuits on the main surface, holds a wafer subjected to a continuity test and a back grinding process, and is also used as a holding jig in a dicing process for an inspection process or chip formation.
The holder is composed of a frame body formed in a ring shape with a metal material and a resin film that closes the opening of the frame body and is detachably attached. Is protected by the frame body. For holders, standardization, specifications, and guidelines related to semiconductor technology have been standardized as "tape frames" in the SEMI standard, which has been standardized mainly in Japan, Europe, and the United States, and manufactured according to specifications that conform to this SEMI standard. Is done. For example, the holder is specified to have a mechanical rigidity such that the frame body is not deformed even when a load of 30 N is applied at the position of the frame width 1/3.
As for the holder, there has been proposed a holder formed by a synthetic resin material containing a reinforcing additive in order to reduce the weight (see, for example, Patent Document 2). Synthetic resin holders are also manufactured with specifications that conform to the SEMI standards described above.

特開２００９−６５１２９公報JP 2009-65129 A 特開２００１−７０５６公報JP 2001-7056 A

ホルダは、上述した所定の規格仕様を満たすために、フレーム体が一般にある程度の厚み寸法、例えば１．５ｍｍ厚のステンレス板や鋼板等の金属板を素材として形成される。ホルダは、ウェーハの大口径化に伴ってフレーム体も大型となり、所定の規格仕様を満たす機械的剛性を得るために板厚の大きな金属素材を用いてフレーム体製作が行われる。ホルダは、このために材料費コストがアップするとともに、重量も大きくなるといった問題があった。
ところで、ホルダは、特許文献１にも記載されるようにそれぞれにウェーハを収納した状態で整列収納構造を有する収納容器内に多数個が収納され、運搬やセット等の作業が行われる。収納容器は、全体として大きな重量となるために、その取り扱いに際して作業者に大きな負担を負わせるとともに、各ホルダを取り出してダイシングマシーンにセットする等の作業性を低下させるといった問題があった。 In order to satisfy the above-mentioned predetermined standard specifications, the holder is generally formed of a metal plate such as a stainless steel plate or a steel plate having a certain thickness, for example, a thickness of 1.5 mm. As the diameter of the holder increases, the size of the frame increases, and the frame is manufactured using a metal material having a large plate thickness in order to obtain mechanical rigidity that satisfies a predetermined standard specification. For this reason, the holder has a problem that the material cost increases and the weight also increases.
By the way, as described in Patent Document 1, a large number of holders are stored in a storage container having an aligned storage structure in a state where wafers are stored in each holder, and operations such as transportation and setting are performed. Since the storage container has a large weight as a whole, there has been a problem that a heavy burden is imposed on an operator when handling the storage container and workability such as taking out each holder and setting it on a dicing machine is lowered.

特許文献１には、上下一対のリング状金属薄板と、これら金属薄板により挟持されて接着剤により固定された中空金属球、発泡金属、メッシュメタル、或いはエキスパンドメタルのいずれかからなるコア材とから構成されるウェーハ用フレーム体が記載されている。ウェーハ用フレーム体は、金属薄板と軽量コア体の積層体により構成することで、軽量化とともにねじれや曲げ等に対する強度向上が図られる。かかるウェーハ用フレーム体は、大径のウェーハ用として大型に形成されても軽量化を図って所定の規格仕様を満たすことが可能である。
上述した特許文献１に記載のウェーハ用フレーム体においては、上下一対のリング状金属薄板間に全周に亘ってコア体を均一な状態で配置するとともにこれらを均一に接合する作業が極めて面倒で効率が悪いために、材料コストを低減しても全体のコスト低減を図ることが困難である。ウェーハ用フレーム体は、例えば使用後に洗浄処理を施した場合にコア体間に洗浄水が浸入して乾きが悪く、また残留した洗浄水により金属薄板に錆が発生しやすく、さらに内部に埃等を溜めて保持したウェーハに付着させる等の問題がある。 Patent Document 1 includes a pair of upper and lower ring-shaped metal thin plates and a core material made of hollow metal spheres, foam metal, mesh metal, or expanded metal sandwiched between these metal thin plates and fixed by an adhesive. A wafer frame body to be constructed is described. By configuring the wafer frame body with a laminated body of a thin metal plate and a lightweight core body, the weight can be reduced and the strength against twisting and bending can be improved. Such a frame for a wafer can satisfy a predetermined standard specification by reducing the weight even if it is formed in a large size for a large-diameter wafer.
In the above-described wafer frame body described in Patent Document 1, the core body is arranged in a uniform state over the entire circumference between a pair of upper and lower ring-shaped metal thin plates, and the operation of uniformly bonding them is extremely troublesome. Since the efficiency is poor, it is difficult to reduce the overall cost even if the material cost is reduced. For example, when the wafer frame body is washed after use, the washing water enters between the core bodies and the dryness is poor, and the remaining washing water easily causes rust on the metal thin plate. There is a problem such as adhering to the wafer which is accumulated and held.

上述した特許文献２に記載の合成樹脂製ウェーハ用フレーム体は、金属製ウェーハ用フレーム体と比較してある程度の軽量化が図られるが、大径のウェーハ用として大型に形成される場合には所定の機械的強度を付与するために全体の厚みが大きくなる。合成樹脂製ウェーハ用フレーム体は、厚みが大きくなるにしたがって部分的な成形歪みが生じ易くなり、ウェーハを安定した状態で保持することが困難となる。
したがって、本発明は、ウェーハを確実に保護する充分な機械的剛性を保持しながら軽量化や低コスト化或いは作業性の向上を図り、大口径ウェーハ用としても好適に用いることが可能なウェーハ用ホルダを提供することを目的に提案されたものである。 The synthetic resin wafer frame described in Patent Document 2 described above can be reduced in weight to some extent as compared to a metal wafer frame, but when formed in a large size for a large-diameter wafer. In order to provide a predetermined mechanical strength, the overall thickness is increased. As the thickness of the synthetic resin wafer frame increases, partial molding distortion tends to occur, and it becomes difficult to hold the wafer in a stable state.
Therefore, the present invention aims to reduce the weight, reduce the cost, or improve the workability while maintaining sufficient mechanical rigidity to reliably protect the wafer, and can be suitably used for a large-diameter wafer. It has been proposed for the purpose of providing a holder.

上述した目的を達成する本発明にかかるウェーハ用ホルダは、第１フレーム体と、第２フレーム体と、ウェーハ保持体とから構成される。ウェーハ用ホルダは、第１フレーム体が、例えばステンレス薄板やメッキ処理を施した薄鋼板等の金属薄板を素材とし、第１主面部の外周縁に沿って全周に亘り立ち上がる一体の環状立壁として形成された第１外周嵌合部と、内周縁に沿って全周に亘り第１外周嵌合部と相対向して立ち上がる一体の環状立壁として形成された第１内周嵌合部とからなる第１嵌合部を有し、全体が中央開口部を有するリング状のチャンネル体として形成される。ウェーハ用ホルダは、第２フレーム体が、例えばステンレス薄板やメッキ処理を施した薄鋼板等の金属薄板或いは導電材を含有した合成樹脂材を素材とし、第２主面部の外周縁に沿って全周に亘り立ち上がり第１外周嵌合部の内径よりもやや小径とされた一体の環状立壁として形成された第２外周嵌合部と、内周縁に沿って全周に亘り第２外周嵌合部と相対向して立ち上がり第１内周嵌合部の内径よりもやや大径とされた一体の環状立壁として形成された第２内周嵌合部とからなる第２嵌合部を有し、第２外周嵌合部の第１外周嵌合部との対向部位及び第２内周嵌合部の第１内周嵌合部との対向部位にそれぞれ周方向に並んで多数個の外周接着剤充填部及び内周接着剤充填部が形成され、全体が中央開口部を有するリング状のチャンネル体として形成される。ウェーハ用ホルダは、ウェーハ保持体が、例えば表面に粘着剤を塗布した導電性樹脂フィルムを素材とし、第１フレーム体の第１主面部とほぼ同径にダイシング用ホルダとして用いられる場合に、樹脂フィルムが用いられて第１フレーム体の第１主面部とほぼ同径に形成される。   A wafer holder according to the present invention that achieves the above-described object includes a first frame body, a second frame body, and a wafer holder. The holder for a wafer is an integral annular standing wall in which the first frame body is made of, for example, a metal thin plate such as a stainless steel thin plate or a plated steel plate, and rises over the entire circumference along the outer peripheral edge of the first main surface portion. The first outer peripheral fitting portion formed and the first inner peripheral fitting portion formed as an integral annular standing wall that rises opposite the first outer peripheral fitting portion along the entire inner periphery. It has a 1st fitting part, and the whole is formed as a ring-shaped channel body which has a center opening part. In the wafer holder, the second frame body is made of, for example, a stainless steel thin plate, a metal thin plate such as a thin steel plate subjected to plating, or a synthetic resin material containing a conductive material, and is entirely along the outer peripheral edge of the second main surface portion. A second outer periphery fitting portion formed as an integral annular standing wall having a diameter slightly smaller than the inner diameter of the first outer periphery fitting portion, and the second outer periphery fitting portion along the entire inner periphery. A second fitting portion comprising a second inner circumferential fitting portion formed as an integral annular standing wall which is opposed to and rises slightly larger than the inner diameter of the first inner circumferential fitting portion, A plurality of outer peripheral adhesives arranged in the circumferential direction respectively at a portion facing the first outer periphery fitting portion of the second outer periphery fitting portion and a portion facing the first inner periphery fitting portion of the second inner periphery fitting portion. A ring-shaped channel body in which a filling portion and an inner peripheral adhesive filling portion are formed and the whole has a central opening; It is formed Te. The wafer holder is a resin that is used when the wafer holder is made of, for example, a conductive resin film whose surface is coated with an adhesive, and is used as a dicing holder having substantially the same diameter as the first main surface portion of the first frame body. A film is used and is formed to have substantially the same diameter as the first main surface portion of the first frame body.

ウェーハ用ホルダは、第１フレーム体に対して第２フレーム体が、第１外周嵌合部の内側面に沿って第２外周嵌合部の外側面を嵌合するとともに第１内周嵌合部の内側面に沿って第２内周嵌合部の外側面を嵌合して、第１嵌合部内に第２嵌合部を嵌合する組み合わせが行われる。ウェーハ用ホルダは、例えば第１フレーム体の第２フレーム体側の第２内周嵌合部と相対する部位に予め接着剤が塗布される。ウェーハ用ホルダは、第１嵌合部内に第２嵌合部を嵌合することにより、接着剤が相対する嵌合面間に拡がるとともに外周接着剤充填部及び内周接着剤充填部内に充填される。ウェーハ用ホルダは、接着剤が硬化することにより第１フレーム体と第２フレーム体が強固に一体化され、内部に全周に亘って空間部を有する全体がリング状のフレーム体を構成する。ウェーハ用ホルダは、第１フレーム体の底面に中央開口部を閉塞するようにしてウェーハ保持体の外周部位を貼り付けて、リング状のフレーム体により外周を取り囲んだウェーハ収納空間部を構成する。ウェーハ用ホルダは、ウェーハ収納空間部内にウェーハを収納してウェーハ保持体により保持し、運搬・搬送等の取り扱いが行われるようにし、またウェーハ収納空間部内に収納した状態でウェーハを所定の大きさに裁断するダイシング工程が施されるようにする。   In the wafer holder, the second frame body is fitted to the first frame body and the outer surface of the second outer periphery fitting portion is fitted along the inner surface of the first outer periphery fitting portion. The combination which fits the outer surface of a 2nd inner periphery fitting part along the inner surface of a part, and fits a 2nd fitting part in a 1st fitting part is performed. For example, the wafer holder is preliminarily coated with an adhesive on a portion of the first frame body facing the second inner periphery fitting portion on the second frame body side. By fitting the second fitting portion into the first fitting portion, the wafer holder spreads between the fitting surfaces facing each other and is filled into the outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion. The In the wafer holder, the first frame body and the second frame body are firmly integrated by curing the adhesive, and the whole having a space portion around the entire circumference forms a ring-shaped frame body. The wafer holder forms a wafer storage space portion in which the outer peripheral portion of the wafer holder is attached to the bottom surface of the first frame body so as to close the central opening, and the outer periphery is surrounded by the ring-shaped frame body. The wafer holder stores the wafer in the wafer storage space and holds it by a wafer holder so that it can be handled such as transporting and transporting. The wafer is stored in the wafer storage space with a predetermined size. A dicing process for cutting is performed.

以上のように構成された本発明にかかるウェーハ用ホルダは、中央開口部を有するリング状のチャンネル体からなる第１フレーム体と第２フレーム体が第１嵌合部内に第２嵌合部を嵌合して一体化することにより内部空間部を有して軽量化とともにコスト低減を図ったリング状のフレーム体を構成する。ウェーハ用ホルダは、相対する部位に予め塗布した接着剤がそれぞれの相対する嵌合面間に拡がるとともに外周接着剤充填部及び内周接着剤充填部内にも充填されて硬化することにより、第１フレーム体と第２フレーム体が全周に亘って強固に一体化されウェーハを確実に保持する大きな機械的剛性を有する。ウェーハ用ホルダによれば、大口径ウェーハ用にも好適に用いられ、作業性の向上を図って半導体の生産効率を向上させる。   The wafer holder according to the present invention configured as described above includes a first frame body made of a ring-shaped channel body having a central opening and a second frame body having a second fitting portion in the first fitting portion. By fitting and integrating, a ring-shaped frame body having an internal space portion and reducing the weight and cost is configured. In the wafer holder, the adhesive applied in advance on the opposite parts spreads between the respective fitting surfaces facing each other and is also filled in the outer peripheral adhesive filling part and the inner peripheral adhesive filling part to be cured. The frame body and the second frame body are firmly integrated over the entire circumference and have a large mechanical rigidity for securely holding the wafer. The wafer holder is also suitably used for large-diameter wafers, improving workability and improving semiconductor production efficiency.

本発明の実施の形態として示すウェーハ用ホルダの平面図である。It is a top view of the holder for wafers shown as an embodiment of the invention. 同ウェーハ用ホルダの要部断面図である。It is principal part sectional drawing of the holder for the wafers. 同ウェーハ用ホルダの組立操作を説明する要部分解斜視図である。It is a principal part disassembled perspective view explaining assembly operation of the holder for wafers. 第２の実施の形態として示すフレーム体の組立操作を説明する要部分解斜視図である。It is a principal part disassembled perspective view explaining the assembly operation of the frame shown as 2nd Embodiment. 第３の実施の形態として示すフレーム体の組立操作を説明する要部分解斜視図である。It is a principal part disassembled perspective view explaining the assembly operation of the frame body shown as 3rd Embodiment. 同フレーム体の要部分解断面図である。It is a principal part exploded sectional view of the frame body.

以下、本発明の実施の形態として示すウェーハ用ホルダ（以下、ホルダと略称する。）１について図面を参照して詳細に説明する。ホルダ１は、主面上に多数の集積回路形成を行ったウェーハ２を保持し、検査工程やチップ形成のためのダイシング工程等を施すために用いるＳＥＭＩ規格に適合する仕様を有するダイシング用ホルダである。なお、ホルダ１は、半導体製造工程において、１枚のウェーハ２を保持し、単独或いは収納容器内に収納されて各工程間の搬送或いは保管等を行う際の保持治具としても用いられる。
ホルダ１は、図１に示すようにウェーハ２の外径よりも大径の中央開口部４を有するリング状のフレーム体３と、このフレーム体３に対して中央開口部４を閉塞して着脱されるウェーハ保持体、すなわちダイシングフィルム５とから構成される。ホルダ１は、ダイシングフィルム５により底面側を閉塞された中央開口部４が、フレーム体３により周囲を囲まれたウェーハ収納空間部を構成する。ホルダ１は、ウェーハ２を、中央開口部４内においてダイシングフィルム５上に保持するとともにフレーム体３により外周部を取り囲んで保護する。なお、ホルダ１は、ダイシング用ホルダであることから、ウェーハ保持体として詳細を後述するダイシングフィルム５が着脱されるが、他の用途に用いるホルダである場合には所定のウェーハ保持体が着脱される。 Hereinafter, a wafer holder (hereinafter abbreviated as a holder) 1 shown as an embodiment of the present invention will be described in detail with reference to the drawings. The holder 1 is a dicing holder which holds a wafer 2 on which a large number of integrated circuits are formed on the main surface and has specifications conforming to the SEMI standard used for performing an inspection process, a dicing process for chip formation, and the like. is there. Note that the holder 1 is used as a holding jig for holding a single wafer 2 in a semiconductor manufacturing process and storing the wafer 2 alone or in a storage container for carrying or storing between the processes.
As shown in FIG. 1, the holder 1 has a ring-shaped frame body 3 having a central opening 4 having a diameter larger than the outer diameter of the wafer 2, and the central opening 4 is closed with respect to the frame body 3. And a dicing film 5. The holder 1 constitutes a wafer storage space in which a central opening 4 whose bottom side is closed by a dicing film 5 is surrounded by a frame body 3. The holder 1 holds the wafer 2 on the dicing film 5 in the central opening 4 and surrounds the outer periphery with the frame body 3 to protect it. In addition, since the holder 1 is a dicing holder, a dicing film 5 (to be described in detail later) is attached and detached as a wafer holder. However, when the holder 1 is a holder used for other purposes, a predetermined wafer holder is attached and detached. The

ホルダ１は、例えば直径３００ｍｍのウェーハ２の保持用として用いられ、ウェーハ２を中央開口部４内に収納してダイシングフィルム５上に保持する。ホルダ１は、中央開口部４の内径、すなわちフレーム体３の口径が３５０ｍｍであり、フレーム体３の外径が４００ｍｍに形成される。したがって、ホルダ１は、フレーム体３が、全周に亘って５０ｍｍ／２、すなわち２５ｍｍ幅のリング体として形成される。ホルダ１は、ダイシングフィルム５が、例えば厚みが約０．３ｍｍ程度のポリプロピレン或いはＰＥＴのフィルム材を基材としてその表面に例えばアクリル系粘着接着剤が塗布される。
ダイシング用ホルダであるホルダ１には、ＳＥＭＩ規格に適合する仕様として、図１に示すように収納容器内に位置決め収納するためにフレーム体３の外周部に互いに９０°の間隔を以って３箇所に直線部位からなる係合部１Ａ、１Ｂ、１Ｃが形成される。ホルダ１には、中央の係合部１Ｂと対向する外周部側に位置して中心軸を挟む対称位置に、ダイシングマシーン側の位置決めピンが相対係合する一対の位置決め用凹部（ノッチ）１Ｄ、１Ｅが形成されている。
ホルダ１は、フレーム体３が、共同して中央開口部４を構成する第１中央開口部６Ａ、第２中央開口部７Ａを有する詳細を後述するリング状の第１フレーム体（下フレーム体）６と第２フレーム体（上フレーム体）７を一体に組み合わせて構成される。フレーム体３は、第１フレーム体６と第２フレーム体７が、それぞれ後述するようにチャンネル形状のリング状部材からなる。フレーム体３は、第１フレーム体６が第２フレーム体７よりもやや大径に形成され、相対する開口部を突き合わせるように組み合わされることにより密閉された環状空間部からなる内部空間部８を構成して一体化される。フレーム体３は、底面部にダイシングフィルム５を貼り付けるとともに内部空間部８内に補強用かつ高さ調整用のリング状コア体１８を結合してホルダ１を構成する。 The holder 1 is used for holding a wafer 2 having a diameter of 300 mm, for example, and the wafer 2 is accommodated in the central opening 4 and held on the dicing film 5. In the holder 1, the inner diameter of the central opening 4, that is, the diameter of the frame body 3 is 350 mm, and the outer diameter of the frame body 3 is 400 mm. Accordingly, in the holder 1, the frame body 3 is formed as a ring body having a width of 50 mm / 2, that is, 25 mm, over the entire circumference. The holder 1 has a dicing film 5 coated with, for example, an acrylic adhesive adhesive on the surface of a polypropylene or PET film material having a thickness of, for example, about 0.3 mm.
The holder 1 that is a dicing holder has a specification that conforms to the SEMI standard, as shown in FIG. Engagement portions 1A, 1B, and 1C made of straight portions are formed at the locations. The holder 1 has a pair of positioning recesses (notches) 1D in which the positioning pins on the dicing machine side are relatively engaged with each other at a symmetrical position on the outer peripheral side facing the central engaging portion 1B and sandwiching the central axis. 1E is formed.
The holder 1 has a ring-shaped first frame body (lower frame body), which will be described in detail later, in which the frame body 3 has a first central opening 6A and a second central opening 7A that together form the central opening 4. 6 and a second frame body (upper frame body) 7 are integrally combined. In the frame body 3, the first frame body 6 and the second frame body 7 are each formed of a channel-shaped ring-shaped member as will be described later. The frame body 3 has an inner space portion 8 formed of an annular space portion that is hermetically sealed by combining the first frame body 6 with a slightly larger diameter than the second frame body 7 and abutting opposite openings. To be integrated. The frame body 3 forms the holder 1 by adhering the dicing film 5 to the bottom surface portion and connecting the reinforcing and height adjusting ring-shaped core body 18 in the internal space portion 8.

フレーム体３は、後述するように第１フレーム体６と第２フレーム体７が、例えばステンレス薄板や無電解ニッケルメッキ処理等を施した薄鋼板等の約０．２ｍｍ厚の金属薄板を素材として形成される。フレーム体３は、かかる金属薄板を素材として内部空間部８を有する中空部材として構成されることにより、重さが約１２０ｇである。したがって、フレーム体３は、厚みが１．５ｍｍの金属板を素材として形成した重さが約３００ｇの従来品と比較して大幅な軽量化が図られる。フレーム体３は、素材コストが低減されるとともにプレス金型或いは工程も簡易化されて製作されることにより、コスト低減が図られる。フレーム体３は、後述する構造から従来品と同等の機械的剛性を有する。
フレーム体３は、第１フレーム体６と第２フレーム体７が、それぞれ同一素材の金属薄板に対して、リング状の中間体を形成する外形抜きプレス加工と、中間体に対してその外内周縁に沿って立壁部を一体に立ち上がり形成する絞り加工を施して形成される。なお、フレーム体３は、第１フレーム体６と第２フレーム体７の製作工程が、かかる工程に限定されないことは勿論である。 As will be described later, the frame body 3 is made of a metal thin plate having a thickness of about 0.2 mm, such as a stainless steel thin plate or a thin steel plate subjected to electroless nickel plating, as a material. It is formed. The frame body 3 has a weight of about 120 g by being configured as a hollow member having the internal space portion 8 using such a metal thin plate as a raw material. Accordingly, the frame body 3 can be significantly reduced in weight as compared with a conventional product having a weight of about 300 g formed from a metal plate having a thickness of 1.5 mm. The frame body 3 is manufactured by reducing the material cost and simplifying the press mold or process, thereby reducing the cost. The frame body 3 has mechanical rigidity equivalent to that of the conventional product due to the structure described later.
The frame body 3 includes an outer punching process in which the first frame body 6 and the second frame body 7 form a ring-shaped intermediate body with respect to a thin metal plate of the same material, respectively, It is formed by performing a drawing process in which the standing wall portion is integrally raised along the periphery. In addition, as for the frame body 3, the manufacturing process of the 1st frame body 6 and the 2nd frame body 7 is of course not limited to this process.

すなわち、第１フレーム体６は、素材に対してフレーム体３の幅寸法よりもやや大きな幅寸法を有するリング状の中間体を形成する外形抜き加工や、この中間体の外周縁及び内周縁に沿って全周に亘り立壁部位を一体に立ち上がり形成する絞り加工を施してチャンネル形状のリング状部材として形成される。第１フレーム体６は、図２及び図３に示すようにリング状の第１主面部９の外周縁に沿って第１外周嵌合部１０を一体に立設するとともに、内周縁に沿って第１内周嵌合部１１を一体に立設する。第１フレーム体６は、これら同心円状の第１外周嵌合部１０と第１内周嵌合部１１が第１嵌合部１２を構成する。
第１フレーム体６は、第１外周嵌合部１０が、第１主面部９の外周縁に沿って全周に亘って立ち上がる一体の環状立壁からなり、例えば立ち上がり寸法が約１．５ｍｍに形成される。なお、第１フレーム体６は、第１外周嵌合部１０が、上述した係合部１Ａ、１Ｂ、１Ｃの対応部位を直線状の立壁として形成されるとともに位置決め用凹部１Ｄ、１Ｅの対応部位を内周側に凹む立壁として形成される。
第１フレーム体６は、第１内周嵌合部１１が、第１主面部９の内周縁に沿って全周に亘って立ち上がり第１外周嵌合部１０と全周に亘って対向することにより同心円をなす一体の環状立壁からなる。第１フレーム体６は、第１内周嵌合部１１も、第１外周嵌合部１０と同等の立ち上がり寸法を有し、例えば約１．５ｍｍに形成される。第１フレーム体６は、このように第１主面部９の外内周縁に沿って相対する第１外周嵌合部１０と第１内周嵌合部１１を一体に立ち上がり形成することにより、上述したように断面が上向きコ字状を呈するチャンネル形状のリング状部材として形成される。 That is, the first frame body 6 has an outer shape forming process for forming a ring-shaped intermediate body having a width dimension slightly larger than the width dimension of the frame body 3 with respect to the material, and an outer peripheral edge and an inner peripheral edge of the intermediate body. A channel-shaped ring-shaped member is formed by drawing the standing wall portion so as to rise integrally along the entire circumference. As shown in FIGS. 2 and 3, the first frame body 6 integrally has a first outer periphery fitting portion 10 erected along the outer peripheral edge of the ring-shaped first main surface portion 9 and along the inner peripheral edge. The first inner periphery fitting portion 11 is erected integrally. In the first frame body 6, the concentric first outer periphery fitting portion 10 and the first inner periphery fitting portion 11 constitute a first fitting portion 12.
The first frame body 6 is formed of an integral annular standing wall in which the first outer periphery fitting portion 10 rises over the entire circumference along the outer peripheral edge of the first main surface portion 9. For example, the rising dimension is formed to be about 1.5 mm. Is done. In the first frame body 6, the first outer periphery fitting portion 10 is formed with the corresponding portions of the engaging portions 1A, 1B, and 1C as straight standing walls, and the corresponding portions of the positioning recesses 1D and 1E. Is formed as a standing wall recessed inwardly.
In the first frame body 6, the first inner periphery fitting portion 11 rises along the inner peripheral edge of the first main surface portion 9 and faces the first outer periphery fitting portion 10 over the entire periphery. It consists of the integral annular standing wall which makes a concentric circle. In the first frame body 6, the first inner circumference fitting portion 11 also has a rising dimension equivalent to that of the first outer circumference fitting portion 10, and is formed to be about 1.5 mm, for example. The first frame body 6 is formed by integrally forming the first outer peripheral fitting portion 10 and the first inner peripheral fitting portion 11 that are opposed along the outer inner peripheral edge of the first main surface portion 9 as described above. Thus, it is formed as a channel-shaped ring-shaped member having a U-shaped cross section.

第２フレーム体７も、素材に対して第１フレーム体６の中間体よりも板厚分小さな外形寸法を有するリング状の中間体を形成する外形抜き加工を施し、この中間体の外周縁及び内周縁に沿って立壁部を一体に立ち上がり形成する絞り加工を施してチャンネル形状のリング状部材として形成される。第２フレーム体７も、図２及び図３に示すように第２主面部１３の外周縁に沿った第２外周嵌合部１４と内周縁に沿った第２内周嵌合部１５を一体に形成してなる。第２フレーム体７は、これら同心円状の第２外周嵌合部１４と第２内周嵌合部１５により第２嵌合部１６を構成する。
第２フレーム体７も、第２外周嵌合部１４が、第２主面部１３の外周縁に沿って全周に亘って立ち上がる一体の環状立壁からなる。第２フレーム体７は、第２外周嵌合部１４が、外周面の外径を第１フレーム体６側の第１外周嵌合部１０の内周面の外径とほぼ等しくなるように全体がやや小径に形成される。第２フレーム体７は、後述するように第１フレーム体６に対して第２外周嵌合部１４を第１主面部９の内面に突き合わせて組み付けられるとともに接着剤１７により接合されて密閉された内部空間部８を構成することから、この第２外周嵌合部１４が立ち上がり寸法を例えば約１．３ｍｍに形成される。なお、第２フレーム体７も、第１フレーム体６側と同様に係合部１Ａ、１Ｂ、１Ｃの対応部位を直線状の立壁として形成するとともに位置決め用凹部１Ｄ、１Ｅの対応部位を内周側に凹む立壁として形成する。 The second frame body 7 is also subjected to an outer shape punching process for forming a ring-shaped intermediate body having an outer dimension smaller than the intermediate body of the first frame body 6 with respect to the raw material. A channel-shaped ring-shaped member is formed by drawing the standing wall portion along the inner peripheral edge. As shown in FIGS. 2 and 3, the second frame body 7 also includes a second outer peripheral fitting portion 14 along the outer peripheral edge of the second main surface portion 13 and a second inner peripheral fitting portion 15 along the inner peripheral edge. Formed. The second frame body 7 constitutes a second fitting portion 16 by the concentric second outer circumference fitting portion 14 and the second inner circumference fitting portion 15.
The 2nd frame body 7 also consists of an integral annular standing wall in which the 2nd outer periphery fitting part 14 rises over the perimeter along the outer periphery of the 2nd main surface part 13. As shown in FIG. The second frame body 7 is entirely such that the second outer peripheral fitting portion 14 has an outer diameter of the outer peripheral surface substantially equal to an outer diameter of the inner peripheral surface of the first outer peripheral fitting portion 10 on the first frame body 6 side. Is formed with a slightly smaller diameter. As will be described later, the second frame body 7 is assembled to the first frame body 6 by abutting the second outer peripheral fitting portion 14 against the inner surface of the first main surface portion 9 and is bonded and sealed by the adhesive 17. Since the internal space portion 8 is configured, the second outer peripheral fitting portion 14 is formed with a rising dimension of, for example, about 1.3 mm. Similarly to the first frame body 6 side, the second frame body 7 is also formed with the corresponding portions of the engaging portions 1A, 1B, 1C as straight standing walls and the corresponding portions of the positioning recesses 1D, 1E on the inner periphery. It is formed as a standing wall recessed to the side.

第２フレーム体７も、第２内周嵌合部１５が、第２主面部１３の内周縁に沿って全周に亘って立ち上がり、第２外周嵌合部１４と全周に亘って対向することにより同心円をなす一体の環状立壁として形成される。第２フレーム体７は、第２内周嵌合部１５が、外周面の外径を第１フレーム体６側の第１内周嵌合部１１の内周面の外径とほぼ等しくなるようにして形成される。第２フレーム体７も、第２内周嵌合部１５が立ち上がり寸法を例えば約１．３ｍｍに形成される。第２フレーム体７も、このように第２主面部１３の外内周縁に沿って相対する第２外周嵌合部１４と第２内周嵌合部１５を一体に立ち上がり形成することにより、上述したように断面が下向きコ字状を呈するチャンネル形状のリング状部材として形成される。
第２フレーム体７には、図２及び図３に示すように、第２嵌合部１６を構成する第２外周嵌合部１４に接着剤１７が流れ込む多数個の外周接着剤充填部１９が形成されるとともに、第２内周嵌合部１５にも多数個の内周接着剤充填部２０が形成される。第２フレーム体７は、上述したように第２嵌合部１６が第１フレーム体６の第１嵌合部１２内に嵌合され、第２外周嵌合部１４と第２内周嵌合部１５の先端部が第１主面部９の内面９Ａにそれぞれ突き当てられる。 Also in the second frame body 7, the second inner peripheral fitting portion 15 rises along the inner peripheral edge of the second main surface portion 13 and faces the second outer peripheral fitting portion 14 over the entire periphery. Thus, it is formed as an integral annular standing wall that forms a concentric circle. The second frame body 7 has the second inner periphery fitting portion 15 such that the outer diameter of the outer peripheral surface is substantially equal to the outer diameter of the inner peripheral surface of the first inner periphery fitting portion 11 on the first frame body 6 side. Formed. The second frame body 7 is also formed so that the second inner periphery fitting portion 15 has a rising dimension of about 1.3 mm, for example. As described above, the second frame body 7 is also formed by integrally rising the second outer peripheral fitting portion 14 and the second inner peripheral fitting portion 15 which are opposed along the outer inner peripheral edge of the second main surface portion 13 as described above. Thus, it is formed as a channel-shaped ring-shaped member having a U-shaped cross section.
As shown in FIGS. 2 and 3, the second frame body 7 has a plurality of outer peripheral adhesive filling portions 19 into which the adhesive 17 flows into the second outer peripheral fitting portion 14 constituting the second fitting portion 16. At the same time, a large number of inner peripheral adhesive filling portions 20 are also formed in the second inner peripheral fitting portion 15. As described above, in the second frame body 7, the second fitting portion 16 is fitted into the first fitting portion 12 of the first frame body 6, and the second outer circumference fitting portion 14 and the second inner circumference fitting. The tip of the portion 15 is abutted against the inner surface 9A of the first main surface portion 9.

外周接着剤充填部１９は、第２外周嵌合部１４の先端縁に、周方向に所定の間隔を以って並んで形成された多数個の切欠き部により構成される。外周接着剤充填部１９は、それぞれが周方向に所定の切り欠き幅を有するとともに、所定の高さを以って第２外周嵌合部１４に切り欠き形成される。外周接着剤充填部１９は、切り欠き寸法や個数が、接着剤１７の種類や粘度等の条件に応じて適宜設定されて第２外周嵌合部１４に形成される。
内周接着剤充填部２０も、第２内周嵌合部１５の先端縁に、周方向に所定の間隔を以って並んで形成された多数個の切欠き部により構成される。内周接着剤充填部２０も、それぞれが周方向に所定の切り欠き幅を有するとともに、所定の高さを以って第２内周嵌合部１５に切り欠き形成される。内周接着剤充填部２０も、切り欠き寸法や個数が、接着剤１７の種類や粘度等の条件に応じて適宜設定されて第２内周嵌合部１５に形成される。 The outer peripheral adhesive filling portion 19 is configured by a large number of notches formed at the front end edge of the second outer peripheral fitting portion 14 so as to be arranged at predetermined intervals in the circumferential direction. Each of the outer peripheral adhesive filling portions 19 has a predetermined notch width in the circumferential direction, and is formed in the second outer periphery fitting portion 14 with a predetermined height. The outer peripheral adhesive filling portion 19 is formed in the second outer peripheral fitting portion 14 such that the notch size and the number of the outer peripheral adhesive filling portion 19 are appropriately set according to conditions such as the type and viscosity of the adhesive 17.
The inner peripheral adhesive filling portion 20 is also configured by a large number of notches that are formed at the distal end edge of the second inner peripheral fitting portion 15 and arranged at predetermined intervals in the circumferential direction. Each of the inner peripheral adhesive filling portions 20 also has a predetermined notch width in the circumferential direction, and is notched in the second inner peripheral fitting portion 15 with a predetermined height. The inner peripheral adhesive filling portion 20 is also formed in the second inner peripheral fitting portion 15 with the notch size and number appropriately set according to conditions such as the type and viscosity of the adhesive 17.

第２フレーム体７は、上述したように金属薄板素材からリング状の中間体を形成する外形抜き加工とこの中間体に第２外周嵌合部１４と第２内周嵌合部１５を形成する絞り加工を施して製作される。第２フレーム体７は、外形抜き加工を施す際に外周縁と内周縁を櫛歯状に打ち抜き、外周縁と内周縁に沿って絞り加工を施すことにより第２外周嵌合部１４と第２内周嵌合部１５の先端部にそれぞれ外周接着剤充填部１９と内周接着剤充填部２０を形成する。
外周接着剤充填部１９及び内周接着剤充填部２０は、第２フレーム体７を金属薄板素材に対して外形抜き加工と絞り加工を施して製作することから、高さ方向の内壁部位を直角のコーナ部として形成した場合に応力が集中してクラック等が発生する虞がある。したがって、外周接着剤充填部１９及び内周接着剤充填部２０は、コーナ部における応力集中を緩和するために、図３に示すようにそれぞれが高さ方向の内壁を円弧状に形成される。 As described above, the second frame body 7 forms a ring-shaped intermediate body from a thin metal plate material, and forms a second outer periphery fitting portion 14 and a second inner periphery fitting portion 15 in the intermediate body. Manufactured by drawing. The second frame body 7 is formed by punching the outer peripheral edge and the inner peripheral edge in a comb shape when performing the outer shape punching process, and performing the drawing process along the outer peripheral edge and the inner peripheral edge. An outer peripheral adhesive filling portion 19 and an inner peripheral adhesive filling portion 20 are formed at the distal end portion of the inner peripheral fitting portion 15, respectively.
Since the outer peripheral adhesive filling portion 19 and the inner peripheral adhesive filling portion 20 are manufactured by subjecting the metal thin plate material to the outer shape drawing and drawing processing, the inner wall portion in the height direction is perpendicular. When formed as a corner portion, there is a risk of stress concentration and cracks. Therefore, each of the outer peripheral adhesive filling portion 19 and the inner peripheral adhesive filling portion 20 has an inner wall in the height direction formed in an arc shape as shown in FIG. 3 in order to relieve stress concentration in the corner portion.

フレーム体３は、上述した第１フレーム体６に対して第２フレーム体７が、図３矢印で示すように第１嵌合部１２に第２嵌合部１６を全周に亘って嵌合することにより組み合わされる。フレーム体３は、第１フレーム体６に対して第２フレーム体７が、図２に示すように第１フレーム体６側の第１外周嵌合部１０の内側面１０Ａに沿って第２フレーム体７側の第２外周嵌合部１４の外側面１４Ａが嵌合される。フレーム体３は、第１フレーム体６側の第１内周嵌合部１１の内側面１１Ａに沿って第２フレーム体７側の第２内周嵌合部１５の外側面１５Ａが嵌合される。フレーム体３は、これにより第１フレーム体６の第１中央開口部６Ａと第２フレーム体７の第２中央開口部７Ａが共同して中央開口部４を構成し、全体がリング状となる。
フレーム体３は、第１フレーム体６と第２フレーム体７が第１嵌合部１２と第２嵌合部１６を組み合わせた状態で、図２に示すように第２フレーム体７側の第２外周嵌合部１４と第２内周嵌合部１５がそれぞれの先端部を第１フレーム体６側の第１主面部９の内面９Ａに突き合わされる。フレーム体３は、第１フレーム体６と第２フレーム体７が、第１フレーム体６の第１外周嵌合部１０及び第１内周嵌合部１１の先端部と、第２フレーム体７側の第２主面部１３がほぼ同一面を構成して組み合わされる。 In the frame body 3, the second frame body 7 is fitted to the first fitting section 12 and the second fitting section 16 over the entire circumference as shown by arrows in FIG. To be combined. As shown in FIG. 2, the frame body 3 is a second frame along the inner surface 10 </ b> A of the first outer periphery fitting portion 10 on the first frame body 6 side. 14 A of outer surfaces of the 2nd outer periphery fitting part 14 by the side of the body 7 are fitted. The frame body 3 is fitted with the outer surface 15A of the second inner periphery fitting portion 15 on the second frame body 7 side along the inner surface 11A of the first inner periphery fitting portion 11 on the first frame body 6 side. The As a result, the frame body 3 is configured by the first central opening 6A of the first frame body 6 and the second central opening 7A of the second frame body 7 together to form the central opening 4, and the whole becomes a ring shape. .
The frame body 3 is a first frame body 6 and a second frame body 7 in a state where the first fitting portion 12 and the second fitting portion 16 are combined, as shown in FIG. 2 outer peripheral fitting part 14 and 2nd inner peripheral fitting part 15 are faced | matched by the inner surface 9A of the 1st main surface part 9 by the side of the 1st frame body 6 at each front-end | tip part. The frame body 3 includes a first frame body 6 and a second frame body 7, a first outer peripheral fitting portion 10 of the first frame body 6 and a distal end portion of the first inner peripheral fitting portion 11, and a second frame body 7. The second main surface portion 13 on the side constitutes substantially the same surface and is combined.

フレーム体３は、第１フレーム体６と第２フレーム体７が、図２に示すように外周部において嵌合された第１外周嵌合部１０の内側面１０Ａと第２外周嵌合部１４の外側面１４Ａとの間に充填した接着剤１７により結合される。フレーム体３は、第１フレーム体６と第２フレーム体７が、内周部において嵌合された第１内周嵌合部１１の内側面１１Ａと第２内周嵌合部１５の外側面１５Ａとの間に充填した接着剤１７により一体に結合される。フレーム体３は、第１フレーム体６と第２フレーム体７が、突き合わされた第１主面部９の内面９Ａと第２外周嵌合部１４及び第２内周嵌合部１５の先端部との間に充填した接着剤１７により一体に結合される。
フレーム体３は、図３に示すように第１フレーム体６に予め接着剤１７が塗布された状態で第２フレーム体７の組み合わせが行われる。接着剤１７には、例えばアクリル系接着剤やエポキシ系接着剤等の、比較的粘度の大きい室温硬化型或いは加熱硬化型接着剤の金属用接着剤が用いられる。接着剤１７は、同図に示すように第１フレーム体６の第１主面部９の内面９Ａと第１外周嵌合部１０の内側面１０Ａ及び第１内周嵌合部１１の内側面１１Ａにそれぞれ跨るようにして塗布される。
フレーム体３は、上述したように第１フレーム体６と第２フレーム体７が、第１嵌合部１２内に第２嵌合部１６を嵌合することにより内部空間部８を構成して一体化される。フレーム体３は、第１フレーム体６に対して第２フレーム体７が、第１外周嵌合部１０の内側面１０Ａに沿って第２外周嵌合部１４の外側面１４Ａが嵌合され、第１主面部９の内面９Ａに第２外周嵌合部１４の先端部が突き当てられる。フレーム体３は、第１内周嵌合部１１の内側面１１Ａに沿って第２内周嵌合部１５の外側面１５Ａが嵌合され、第１主面部９の内面９Ａに第２内周嵌合部１５の先端部が突き当てられる。 As shown in FIG. 2, the frame body 3 includes an inner side surface 10A of the first outer circumference fitting portion 10 and a second outer circumference fitting portion 14 in which the first frame body 6 and the second frame body 7 are fitted at the outer circumference as shown in FIG. Are bonded by an adhesive 17 filled between the outer surface 14A and the outer surface 14A. The frame body 3 includes an inner side surface 11A of the first inner circumferential fitting portion 11 and an outer side surface of the second inner circumferential fitting portion 15 in which the first frame body 6 and the second frame body 7 are fitted in the inner circumferential portion. They are integrally bonded with an adhesive 17 filled between 15A. The frame body 3 includes an inner surface 9A of the first main surface portion 9 where the first frame body 6 and the second frame body 7 are abutted with each other, and a distal end portion of the second outer peripheral fitting portion 14 and the second inner peripheral fitting portion 15. Are bonded together by an adhesive 17 filled therebetween.
As shown in FIG. 3, the frame body 3 is combined with the second frame body 7 in a state where the adhesive 17 is applied to the first frame body 6 in advance. As the adhesive 17, for example, a metal adhesive such as a room temperature curable adhesive or a heat curable adhesive having a relatively high viscosity, such as an acrylic adhesive or an epoxy adhesive, is used. The adhesive 17 includes an inner surface 9A of the first main surface portion 9 of the first frame body 6, an inner surface 10A of the first outer periphery fitting portion 10, and an inner surface 11A of the first inner periphery fitting portion 11 as shown in FIG. It is applied so as to straddle each.
As described above, the frame body 3 includes the first frame body 6 and the second frame body 7 to form the internal space portion 8 by fitting the second fitting portion 16 into the first fitting portion 12. Integrated. In the frame body 3, the second frame body 7 is fitted to the first frame body 6, and the outer side surface 14A of the second outer circumference fitting portion 14 is fitted along the inner side surface 10A of the first outer circumference fitting portion 10. The tip end portion of the second outer peripheral fitting portion 14 is abutted against the inner surface 9A of the first main surface portion 9. In the frame body 3, the outer surface 15 </ b> A of the second inner periphery fitting portion 15 is fitted along the inner surface 11 </ b> A of the first inner periphery fitting portion 11, and the second inner periphery is fitted to the inner surface 9 </ b> A of the first main surface portion 9. The tip of the fitting part 15 is abutted.

第１フレーム体６に予め塗布された接着剤１７は、図２に示すように相対嵌合される第１外周嵌合部１０の内側面１０Ａと第２外周嵌合部１４の外側面１４Ａとの間及び第１内周嵌合部１１の内側面１１Ａと第２内周嵌合部１５の外側面１５Ａとの間にそれぞれ拡がる。接着剤１７は、外周接着剤充填部１９と内周接着剤充填部２０内に充填されて、第２外周嵌合部１４及び第２内周嵌合部１５の内面側にも回り込む。
接着剤１７は、接合対象物に対して接触面積や充填量が多くなるにしたがい、接合対象物間に大きな接合強度を生じさせる。フレーム体３は、第１フレーム体６と第２フレーム体７が、上述した外周接着剤充填部１９と内周接着剤充填部２０の構成により内外周において多くの接触面積と充填量を以って接着剤１７により接合されることにより強固に一体化される。フレーム体３は、第２外周嵌合部１４及び第２内周嵌合部１５の内面側に回り込んだ接着剤１７が硬化することにより、一種の楔作用を奏して第１フレーム体６と第２フレーム体７をより強固に一体化する。フレーム体３は、第１フレーム体６と第２フレーム体７が、略密閉空間部を構成する内部空間部８内において接合されることから、接着剤１７が流れ出してウェーハ２を汚損させる等の不都合が生じることは無い。 The adhesive 17 previously applied to the first frame body 6 includes an inner surface 10A of the first outer periphery fitting portion 10 and an outer surface 14A of the second outer periphery fitting portion 14 which are relatively fitted as shown in FIG. And between the inner surface 11A of the first inner periphery fitting portion 11 and the outer surface 15A of the second inner periphery fitting portion 15. The adhesive 17 is filled in the outer peripheral adhesive filling portion 19 and the inner peripheral adhesive filling portion 20, and goes around the inner surfaces of the second outer peripheral fitting portion 14 and the second inner peripheral fitting portion 15.
The adhesive 17 generates a large bonding strength between the bonding objects as the contact area and the filling amount increase with respect to the bonding objects. In the frame body 3, the first frame body 6 and the second frame body 7 have a large contact area and filling amount on the inner and outer periphery due to the configuration of the outer peripheral adhesive filling portion 19 and the inner peripheral adhesive filling portion 20 described above. Then, they are firmly integrated by being bonded by the adhesive 17. The frame body 3 exhibits a kind of wedge action by hardening the adhesive 17 that has turned around to the inner surface side of the second outer periphery fitting portion 14 and the second inner periphery fitting portion 15, and the first frame body 6. The second frame body 7 is integrated more firmly. In the frame body 3, since the first frame body 6 and the second frame body 7 are joined in the internal space portion 8 that constitutes a substantially sealed space portion, the adhesive 17 flows out, and the wafer 2 is soiled. There is no inconvenience.

フレーム体３は、上述したように第１フレーム体６と第２フレーム体７が、内部空間部８を構成して一体化される。フレーム体３は、第１フレーム体６と第２フレーム体７の上述した組み合わせ構造により、第１フレーム体６側の第１外周嵌合部１０及び第１内周嵌合部１１の高さ寸法１．５ｍｍが全体の厚み寸法となる。フレーム体３は、図２に示すように結合された第１フレーム体６側の第１外周嵌合部１０と第２フレーム体７側の第２外周嵌合部１４が共同して、厚みが０．４ｍｍの外周壁部を構成する。フレーム体３は、結合された第１フレーム体６側の第１内周嵌合部１１と第２フレーム体７側の第２内周嵌合部１５が共同して、厚みが０．４ｍｍの内周壁部を構成する。
フレーム体３は、第１フレーム体６側の第１主面部９を底面部とし、第２フレーム体７側の第２主面部１３を天井部として、内部に内部空間部８を構成してなる。フレーム体３は、全体の幅が２５ｍｍ、高さが１．５ｍｍであり、平坦性を有して変形や歪み等の発生を防止した機械的剛性の大きなフレーム体を構成する。フレーム体３は、中空構造であり厚み寸法の小さな金属板を素材として形成することにより、軽量化が図られる。
フレーム体３には、図１乃至図３に示すように、内部空間部８内に第１フレーム体６の第１主面部９と第２フレーム体７の第２主面部１３の対向間隔を保持するリング状のコア体１８が設けられる。フレーム体３は、上述した第１フレーム体６と第２フレーム体７の組み合わせ構造により充分な機械的剛性を有しているが、コア体１８を設けることにより補強されてさらに機械的剛性の向上が図られる。フレーム体３は、例えば３０Ｎの偏倚荷重を１分間に亘って負荷しても変形や歪み発生が生じることはなく、ＳＥＭＩ規格に適合する仕様を有してウェーハ２を確実に保持する軽量のホルダ１を構成する。 As described above, in the frame body 3, the first frame body 6 and the second frame body 7 constitute an internal space portion 8 and are integrated. The frame body 3 has the above-described combined structure of the first frame body 6 and the second frame body 7, and the height dimensions of the first outer periphery fitting portion 10 and the first inner periphery fitting portion 11 on the first frame body 6 side. 1.5 mm is the overall thickness dimension. As shown in FIG. 2, the frame body 3 has a thickness obtained by jointing the first outer periphery fitting portion 10 on the first frame body 6 side and the second outer periphery fitting portion 14 on the second frame body 7 side. A 0.4 mm outer peripheral wall portion is formed. The frame body 3 has a thickness of 0.4 mm by jointly connecting the first inner periphery fitting portion 11 on the first frame body 6 side and the second inner periphery fitting portion 15 on the second frame body 7 side. The inner peripheral wall portion is configured.
The frame body 3 has an internal space portion 8 formed therein, with the first main surface portion 9 on the first frame body 6 side as a bottom surface portion and the second main surface portion 13 on the second frame body 7 side as a ceiling portion. . The frame body 3 has a total width of 25 mm and a height of 1.5 mm, and has a high mechanical rigidity that has flatness and prevents deformation and distortion. The frame body 3 has a hollow structure and can be reduced in weight by forming a metal plate having a small thickness as a material.
As shown in FIG. 1 to FIG. 3, the frame body 3 maintains a facing distance between the first main surface portion 9 of the first frame body 6 and the second main surface portion 13 of the second frame body 7 in the internal space 8. A ring-shaped core body 18 is provided. The frame body 3 has sufficient mechanical rigidity due to the combination structure of the first frame body 6 and the second frame body 7 described above. However, the frame body 3 is reinforced by providing the core body 18 to further improve the mechanical rigidity. Is planned. The frame body 3 has a specification that conforms to the SEMI standard and holds the wafer 2 securely without any deformation or distortion even when a bias load of 30 N, for example, is applied for 1 minute. 1 is constructed.

コア体１８は、素材として例えば亜鉛メッキを施した薄厚鋼板が用いられ、この素材に外形抜きプレス加工を施して、横長矩形の断面形状を有して第２フレーム体７の第２外周嵌合部１４よりも小径でありかつ第２内周嵌合部１５よりも大径のリング体として形成される。コア体１８は、後述するように内部空間部８内において第１フレーム体６と第２フレーム体７とに結合されるが、内部空間部８のほぼ中央部に配置される外径であることが好ましい。
コア体１８は、厚み寸法が内部空間部８の高さ寸法（１．１ｍｍ）よりもやや薄厚の１ｍｍであり、幅寸法が約３ｍｍに形成される。コア体１８は、かかる寸法値に限定されないことは勿論であるが、大きな幅寸法とした場合にフレーム体３の重量を大きくし、また小さな幅寸法とした場合にフレーム体３の補強作用が低下する。コア体１８は、上述した厚み寸法により内部空間部８を構成する第１フレーム体６の第１主面部９と第２フレーム体７の第２主面部１３との間において約０．１ｍｍの間隙が生じるが、図２に示すようにこの間隙に接着剤１７が充填されるようにする。 The core body 18 is made of, for example, a thin steel plate that is galvanized as a material. The core body 18 is subjected to outer shape press processing to have a horizontally long cross-sectional shape, and the second frame body 7 has a second outer periphery fitting. The ring body is smaller in diameter than the portion 14 and larger in diameter than the second inner periphery fitting portion 15. The core body 18 is coupled to the first frame body 6 and the second frame body 7 in the internal space portion 8 as will be described later, but has an outer diameter that is disposed at a substantially central portion of the internal space portion 8. Is preferred.
The core body 18 has a thickness dimension of 1 mm, which is slightly thinner than the height dimension (1.1 mm) of the internal space 8, and a width dimension of about 3 mm. Of course, the core body 18 is not limited to such a dimension value, but the weight of the frame body 3 is increased when the width is large, and the reinforcing action of the frame body 3 is decreased when the width is small. To do. The core body 18 has a gap of about 0.1 mm between the first main surface portion 9 of the first frame body 6 and the second main surface portion 13 of the second frame body 7 constituting the internal space portion 8 with the above-described thickness dimension. However, as shown in FIG. 2, the gap 17 is filled with the adhesive 17.

コア体１８は、図２及び図３に示すように例えば第１フレーム体６に対して第１主面部９の内面９Ａ上に接合される。コア体１８は、第１外周嵌合部１０と第１内周嵌合部１１と同心円を構成して第１フレーム体６の第１主面部９の内面９Ａに底面を結合される。コア体１８は、第１フレーム体６に対して第２フレーム体７が組み合わされることにより、第２外周嵌合部１４と第２内周嵌合部１５と同心円を構成して第２フレーム体７の第２主面部１３の内面１３Ａに上面を結合される。コア体１８は、これにより第１フレーム体６の第１主面部９と第２フレーム体７の第２主面部１３の対向間隔を保持する。
なお、コア体１８は、底面を第１フレーム体６の第１主面部９に結合するとともに上面を第２フレーム体７の第２主面部１３に結合するようにしたが、第１フレーム体６と第２フレーム体７がしっかりと固定されることから、例えば底面のみを第１フレーム体６側と固定し第２フレーム体７の第２主面部１３を支えるようにしてもよい。コア体１８は、上述した第１フレーム体６と第２フレーム体７の組み合わせ工程に先行して、第１フレーム体６の第１主面部９に接合固定される。 As shown in FIGS. 2 and 3, the core body 18 is joined to the first frame body 6 on the inner surface 9 </ b> A of the first main surface portion 9, for example. The core body 18 is concentric with the first outer periphery fitting portion 10 and the first inner periphery fitting portion 11, and the bottom surface is coupled to the inner surface 9 </ b> A of the first main surface portion 9 of the first frame body 6. When the second frame body 7 is combined with the first frame body 6, the core body 18 forms a concentric circle with the second outer periphery fitting portion 14 and the second inner periphery fitting portion 15, and the second frame body. The upper surface is coupled to the inner surface 13 </ b> A of the second main surface portion 13. Thus, the core body 18 maintains the facing distance between the first main surface portion 9 of the first frame body 6 and the second main surface portion 13 of the second frame body 7.
The core body 18 has a bottom surface coupled to the first main surface portion 9 of the first frame body 6 and an upper surface coupled to the second main surface portion 13 of the second frame body 7. Since the second frame body 7 is firmly fixed, for example, only the bottom surface may be fixed to the first frame body 6 side and the second main surface portion 13 of the second frame body 7 may be supported. The core body 18 is bonded and fixed to the first main surface portion 9 of the first frame body 6 prior to the combination process of the first frame body 6 and the second frame body 7 described above.

以上のように構成されたフレーム体３には、図２に示すように第１フレーム体６の第１主面部９の底面９Ｂにダイシングフィルム５が貼り付けられホルダ１を構成する。ダイシングフィルム５は、フレーム体３の外径よりもやや小径であり、接着剤として粘着性接着剤を用いることにより外周部位を第１主面部９の底面９Ｂに対して着脱される。ダイシングフィルム５は、第１フレーム体６に貼り付けることにより、図１に示すように中央開口部４の底面部を閉塞してフレーム体３により周囲を囲まれたウェーハ収納空間部を構成する。ダイシングフィルム５は、詳細を省略するがウェーハ収納空間部の構成領域において上面にウェーハ２を保持する粘着剤が塗布される。   As shown in FIG. 2, the dicing film 5 is attached to the bottom surface 9 </ b> B of the first main surface portion 9 of the first frame body 6 to constitute the holder 1 in the frame body 3 configured as described above. The dicing film 5 has a slightly smaller diameter than the outer diameter of the frame body 3, and an outer peripheral portion is attached to and detached from the bottom surface 9 </ b> B of the first main surface portion 9 by using a sticky adhesive as an adhesive. The dicing film 5 is affixed to the first frame body 6 to close the bottom surface of the central opening 4 and form a wafer storage space surrounded by the frame body 3 as shown in FIG. The dicing film 5 is coated with an adhesive that holds the wafer 2 on the upper surface in the constituent area of the wafer storage space, although details are omitted.

ホルダ１においては、フレーム体３が、上述したようにそれぞれ従来品よりも薄厚であり低コスト化と加工性の向上が図られる金属薄板を素材として簡易なプレス加工を施して第１フレーム体６と第２フレーム体７を形成する。ホルダ１は、フレーム体３が、第１フレーム体６と第２フレーム体７を組み合わせて内部を中空とする内部空間部８を有して構成することから軽量化が図られる。ホルダ１は、第２フレーム体７に外周接着剤充填部１９と内周接着剤充填部２０を形成した構造により、第１フレーム体６と第２フレーム体７を接着剤１７により強固に一体化する。ホルダ１は、フレーム体３の内部空間部８内に補強部材のコア体１８を設けたことによってさらに大きな機械的剛性を有する。
ホルダ１は、フレーム体３の中央開口部４により構成されるウェーハ収納空間部内にウェーハ２を収納してダイシングフィルム５上に保持する。ホルダ１は、ウェーハ２を収納保持した状態で運搬・搬送等の取り扱いを行い、ウェーハ２を所定の大きさに裁断するダイシング工程が施されるようにする。ホルダ１は、大きな機械的剛性を有するフレーム体３によりウェーハ２の周囲を取り囲んで確実に保護する。ホルダ１は、上述したように材料や工程のコスト低減が図られて廉価であり、大幅な軽量化が図られるも対曲げ特性や対捻れ特性が大きい充分な機械的剛性を有するフレーム体３を備えることにより、大口径のウェーハであっても大量かつ確実に処理することを可能とする。 In the holder 1, the frame body 3 is thinner than the conventional product as described above, and the first frame body 6 is subjected to a simple pressing process using a metal thin plate as a raw material, which can reduce costs and improve workability. And the second frame body 7 is formed. The holder 1 can be reduced in weight because the frame body 3 includes the internal space portion 8 in which the first frame body 6 and the second frame body 7 are combined to make the interior hollow. The holder 1 has a structure in which an outer peripheral adhesive filling portion 19 and an inner peripheral adhesive filling portion 20 are formed on the second frame body 7, and the first frame body 6 and the second frame body 7 are firmly integrated with the adhesive 17. To do. The holder 1 has greater mechanical rigidity by providing the core body 18 of the reinforcing member in the internal space 8 of the frame body 3.
The holder 1 stores the wafer 2 in a wafer storage space portion constituted by the central opening 4 of the frame body 3 and holds it on the dicing film 5. The holder 1 performs handling such as transportation and conveyance in a state where the wafer 2 is stored and held, and a dicing process is performed in which the wafer 2 is cut into a predetermined size. The holder 1 surrounds the periphery of the wafer 2 by the frame body 3 having a large mechanical rigidity and reliably protects it. As described above, the holder 1 is made of a frame body 3 having sufficient mechanical rigidity with high bending resistance and torsional characteristics, although the material and process costs are reduced as described above, and the weight is significantly reduced. By providing, even a large-diameter wafer can be reliably processed in large quantities.

上述したホルダ１においては、第２外周嵌合部１４の先端部に外周接着剤充填部１９を形成するとともに第２内周嵌合部１５の先端部に内周接着剤充填部２０を形成し、第１フレーム体６と第２フレーム体７が接着剤１７によって強固に一体化されるようにする。本発明は、かかる構成に限定されないことは勿論である。図４に第２の実施の形態として示したフレーム体３０も、第２フレーム体７の第２外周嵌合部１４に外周接着剤充填部を構成する多数個の外周接着剤充填部３１を形成するとともに、第２内周嵌合部１５に内周接着剤充填部を構成する多数個の内周接着剤充填部３２を形成した基本的な構成を上述したホルダ１と同様とするが、これら外周接着剤充填部３１と内周接着剤充填部３２の具体的な構造に特徴がある。フレーム体３０は、その他の構成を上述したホルダ１と同様とすることから対応する部位には同一符号を付して説明を省略する。   In the holder 1 described above, the outer peripheral adhesive filling portion 19 is formed at the distal end portion of the second outer peripheral fitting portion 14, and the inner peripheral adhesive filling portion 20 is formed at the distal end portion of the second inner peripheral fitting portion 15. The first frame body 6 and the second frame body 7 are firmly integrated by the adhesive 17. Of course, the present invention is not limited to such a configuration. Also in the frame body 30 shown as the second embodiment in FIG. 4, a plurality of outer peripheral adhesive filling portions 31 constituting the outer peripheral adhesive filling portion are formed in the second outer peripheral fitting portion 14 of the second frame body 7. In addition, the basic configuration in which a plurality of inner peripheral adhesive filling portions 32 constituting the inner peripheral adhesive filling portion 15 is formed in the second inner peripheral fitting portion 15 is the same as that of the holder 1 described above. The specific structure of the outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 is characterized. Since the frame body 30 has the same configuration as that of the holder 1 described above, the corresponding parts are denoted by the same reference numerals and description thereof is omitted.

第２フレーム体７には、第２外周嵌合部１４に周方向に所定の間隔を以って周方向の長さ寸法が高さ方向の寸法よりも大きい楕円形状の貫通孔からなる外周接着剤充填部３１が形成される。第２フレーム体７には、第２内周嵌合部１５にも周方向に所定の間隔を以って周方向の長さ寸法が高さ方向の寸法よりも大きい楕円形状の貫通孔からなる内周接着剤充填部３２が形成される。
第２フレーム体７は、上述したよう素材に外形抜きプレス加工を施してリング状の中間体を形成するが、その際に後工程の絞り工程において第２外周嵌合部１４と第２内周嵌合部１５を立ち上がり形成する外周縁部と内周縁部に沿った領域にそれぞれ外周接着剤充填部３１と内周接着剤充填部３２を構成する多数個の長孔を周方向に並んで打ち抜き形成する。第２フレーム体７は、中間体に絞り加工を施して第２主面部１３の外周縁部と内周縁部に沿って立ち上がる第２外周嵌合部１４と第２内周嵌合部１５を一体に形成するが、これら第２外周嵌合部１４と第２内周嵌合部１５に外周接着剤充填部３１と内周接着剤充填部３２が開口する。 The second frame body 7 is bonded to the second outer periphery fitting portion 14 with an outer periphery formed by an elliptical through-hole having a circumferential length greater than a height dimension at a predetermined interval in the circumferential direction. An agent filling portion 31 is formed. The second frame body 7 is also composed of an elliptical through-hole whose circumferential length is larger than the height in the circumferential direction with a predetermined interval in the second inner circumferential fitting portion 15. An inner peripheral adhesive filling portion 32 is formed.
As described above, the second frame body 7 forms a ring-shaped intermediate body by subjecting the material to a punching process, and at that time, the second outer periphery fitting portion 14 and the second inner periphery are formed in the subsequent drawing step. A plurality of long holes constituting the outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 are punched side by side in the circumferential direction in regions along the outer peripheral edge portion and the inner peripheral edge portion that rise and form the fitting portion 15. Form. The second frame body 7 includes a second outer peripheral fitting portion 14 and a second inner peripheral fitting portion 15 that are drawn along the outer peripheral edge portion and the inner peripheral edge portion of the second main surface portion 13 by drawing the intermediate body. The outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 are opened in the second outer peripheral fitting portion 14 and the second inner peripheral fitting portion 15.

外周接着剤充填部３１と内周接着剤充填部３２は、それぞれ楕円形状の長孔に形成されることから、第２外周嵌合部１４と第２内周嵌合部１５を形成する絞り工程時において各孔のコーナ部における応力集中を緩和する。外周接着剤充填部３１と内周接着剤充填部３２は、第１フレーム体６側の相対する第１外周嵌合部１０及び第１内周嵌合部１１に対して大きな開口寸法を以って対向する。なお、第２フレーム体７は、第２外周嵌合部１４及び第２内周嵌合部１５に対して、外周接着剤充填部３１と内周接着剤充填部３２が高さ位置を異にして形成するようにしてもよい。   Since the outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 are each formed in an elliptical long hole, a drawing step for forming the second outer peripheral fitting portion 14 and the second inner peripheral fitting portion 15. Sometimes the stress concentration at the corners of each hole is relaxed. The outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 have a large opening size with respect to the first outer peripheral fitting portion 10 and the first inner peripheral fitting portion 11 facing each other on the first frame body 6 side. Facing each other. The second frame body 7 is different from the second outer periphery fitting portion 14 and the second inner periphery fitting portion 15 in that the outer peripheral adhesive filling portion 31 and the inner peripheral adhesive filling portion 32 have different height positions. You may make it form.

フレーム体３０も、第１フレーム体６に予め接着剤１７が塗布された状態で第２フレーム体７の組み合わせが行われる。第１フレーム体６には、図４に示すように第１主面部９に対して、第１外周嵌合部１０と第１内周嵌合部１１の立ち上がり部位に跨ってそれぞれ所定量の接着剤１７が予め塗布される。フレーム体３も、第１フレーム体６に対して第２フレーム体７が、第１外周嵌合部１０の内側面１０Ａに沿って第２外周嵌合部１４の外側面１４Ａを嵌合して、第１主面部９の内面９Ａに第２外周嵌合部１４の先端部を突き当てる。フレーム体３は、第１フレーム体６に対して第２フレーム体７が、第１内周嵌合部１１の内側面１１Ａに沿って第２内周嵌合部１５の外側面１５Ａを嵌合して、第１主面部９の内面９Ａに第２内周嵌合部１５の先端部を突き当てる。
フレーム体３においても、第１フレーム体６に予め塗布された接着剤１７が、相対嵌合される第１外周嵌合部１０の内側面１０Ａと第２外周嵌合部１４の外側面１４Ａとの間及び第１内周嵌合部１１の内側面１１Ａと第２内周嵌合部１５の外側面１５Ａとの間にそれぞれ拡がる。フレーム体３においても、接着剤１７が、第２外周嵌合部１４に形成した外周接着剤充填部３１と第２内周嵌合部１５に形成した内周接着剤充填部３２内に充填されてそれぞれの内面側へと回り込む。フレーム体３においても、第１フレーム体６と第２フレーム体７が、上述した外周接着剤充填部３１と内周接着剤充填部３２を楕円形状の長孔に形成したことより、内外周において多くの接触面積と充填量を以って接着剤１７により接合される。フレーム体３においては、第１フレーム体６と第２フレーム体７がより強固に一体化される。 The frame body 30 is also combined with the second frame body 7 in a state where the adhesive 17 is previously applied to the first frame body 6. As shown in FIG. 4, the first frame body 6 has a predetermined amount of adhesion to the first main surface portion 9 across the rising portions of the first outer periphery fitting portion 10 and the first inner periphery fitting portion 11. Agent 17 is applied in advance. Also in the frame body 3, the second frame body 7 is fitted to the first frame body 6 along the outer side surface 14 </ b> A of the second outer circumference fitting portion 14 along the inner side surface 10 </ b> A of the first outer circumference fitting portion 10. The tip of the second outer periphery fitting portion 14 is abutted against the inner surface 9A of the first main surface portion 9. In the frame body 3, the second frame body 7 is fitted to the first frame body 6 along the outer surface 15 </ b> A of the second inner circumference fitting portion 15 along the inner surface 11 </ b> A of the first inner circumference fitting portion 11. Then, the tip end portion of the second inner peripheral fitting portion 15 is abutted against the inner surface 9A of the first main surface portion 9.
Also in the frame body 3, the adhesive 17 previously applied to the first frame body 6 has an inner surface 10 </ b> A of the first outer periphery fitting portion 10 and an outer surface 14 </ b> A of the second outer periphery fitting portion 14 that are relatively fitted to each other. And between the inner surface 11A of the first inner periphery fitting portion 11 and the outer surface 15A of the second inner periphery fitting portion 15. Also in the frame body 3, the adhesive 17 is filled in the outer peripheral adhesive filling portion 31 formed in the second outer peripheral fitting portion 14 and the inner peripheral adhesive filling portion 32 formed in the second inner peripheral fitting portion 15. Wrap around each inside. Also in the frame body 3, the first frame body 6 and the second frame body 7 have the above-described outer circumferential adhesive filling portion 31 and inner circumferential adhesive filling portion 32 formed in elliptical elongated holes, so that Bonded by the adhesive 17 with a large contact area and filling amount. In the frame body 3, the first frame body 6 and the second frame body 7 are more firmly integrated.

第３の実施の形態として示したホルダ１は、上述した金属薄板を素材にして形成した第１フレーム体６に対して合成樹脂素材により成形した第２フレーム体４１を組み合わせて内部空間部８を有するリング状のフレーム体４０を構成する。ホルダ１も、フレーム体４０に中央開口部４を閉塞するようにしてダイシングフィルム５を貼り付けてウェーハ収納空間部を構成してなる。第２フレーム体４１は、導電性を付与するために導電材を含有した合成樹脂材料、例えば特許文献２に記載されたＰＰＳ、ＰＡ、ＰＥＳ、ＰＥＥＫ、ＰＣ或いはＰＢＴ等の熱可塑性合成樹脂材が用いられて成形される。   The holder 1 shown as the third embodiment combines the second frame body 41 formed of a synthetic resin material with the first frame body 6 formed of the above-described metal thin plate as a material, and the internal space 8 is formed. The ring-shaped frame body 40 is configured. The holder 1 is also formed by adhering a dicing film 5 to the frame body 40 so as to close the central opening 4 to form a wafer storage space. The second frame body 41 is made of a synthetic resin material containing a conductive material to impart conductivity, for example, a thermoplastic synthetic resin material such as PPS, PA, PES, PEEK, PC or PBT described in Patent Document 2. Used and molded.

第２フレーム体４１も、基本的な構成を上述した第２フレーム体７と同様とし、第２主面部４２の外周縁と内周縁に沿って相対向する環状立壁からなる第２外周嵌合部４３と第２内周嵌合部４４が同心円状に一体に立ち上がり形成されてなる。第２フレーム体４１には、第２主面部４２に、第２外周嵌合部４３と第２内周嵌合部４４との間に位置して全周に亘って立ち上がる同心円状の環状立壁からなる補強凸部４５が一体に形成される。第２フレーム体４１は、第２外周嵌合部４３と第２内周嵌合部４４と補強凸部４５により断面がほぼ下向き山形のリング体として形成される。
第２フレーム体４１は、合成樹脂材料により成形することから上述した金属製の第２フレーム体７と比較して材料の機械的強度特性がやや小さいことがある。したがって、第２フレーム体４１は、第２主面部４２、第２外周嵌合部４３、第２内周嵌合部４４及び補強凸部４５がそれぞれの厚み寸法を金属製の第２フレーム体７の対応する各部と比較してやや大きな所定の厚みを有して形成される。しかしながら、第２フレーム体４１は、かかる構造によっても材料特性により大きな重量となることはなく、内部空間部８を有する構造により軽量化が図られる。 The second frame body 41 also has a basic configuration similar to that of the second frame body 7 described above, and is a second outer periphery fitting portion formed of annular standing walls facing each other along the outer peripheral edge and the inner peripheral edge of the second main surface portion 42. 43 and the 2nd inner peripheral fitting part 44 stand | start up integrally in concentric form. The second frame body 41 includes a concentric annular standing wall that is positioned between the second outer peripheral fitting portion 43 and the second inner peripheral fitting portion 44 on the second main surface portion 42 and rises over the entire circumference. Reinforcing protrusions 45 are integrally formed. The second frame body 41 is formed by a second outer peripheral fitting portion 43, a second inner peripheral fitting portion 44, and a reinforcing convex portion 45 as a ring body having a substantially downward cross section.
Since the second frame body 41 is formed of a synthetic resin material, the mechanical strength characteristics of the material may be slightly smaller than the metal second frame body 7 described above. Therefore, the second frame body 41 has the second main surface portion 42, the second outer peripheral fitting portion 43, the second inner peripheral fitting portion 44, and the reinforcing convex portion 45 with the thickness dimensions of the second frame body 7 made of metal. It is formed with a predetermined thickness that is slightly larger than the corresponding parts. However, the second frame body 41 does not become heavy due to the material characteristics even by such a structure, and the weight can be reduced by the structure having the internal space portion 8.

第２フレーム体４１は、第２主面部４２が、第１フレーム体６の第１主面部９に対して第１外周嵌合部１０と第１内周嵌合部１１の厚み分小径とされた外径を有して所定の厚みを以って形成される。第２フレーム体４１は、第２外周嵌合部４３及び第２内周嵌合部４４が、それぞれ第１フレーム体６の第２外周嵌合部１０と第２内周嵌合部１１に対して第１主面部９の厚み分小さい高さ寸法を以って第２主面部４２の外周縁と内周縁に沿って立ち上がり形成される。第２フレーム体４１は、第２外周嵌合部４３と第２内周嵌合部４４が、第２嵌合部４６を構成する。
第２フレーム体４１は、補強凸部４５も、第２外周嵌合部４３及び第２内周嵌合部４４とほぼ同等の高さ寸法を以って第２主面部４２の内面に立ち上がり形成される。なお、第２フレーム体４１にも、図示を省略するが第１フレーム体６側の係合部１Ａ、１Ｂ、１Ｃの対応部位を直線状の立壁として形成するとともに位置決め用凹部１Ｄ、１Ｅの対応部位を内周側に凹む立壁として形成する。
第２フレーム体４１には、第２外周嵌合部４３の先端部に、周方向に並んで外周接着剤充填部を構成する多数個の外周接着剤充填凹部４７が形成される。第２フレーム体４１には、第２内周嵌合部４４の先端部に、周方向に並んで内周接着剤充填部を構成する多数個の内周接着剤充填凹部４８が形成される。第２フレーム体４１には、補強凸部４５の先端部に、周方向に並んで中央接着剤充填部を構成する多数個の中央接着剤充填凹部４９が形成される。 In the second frame body 41, the second main surface portion 42 has a small diameter corresponding to the thickness of the first outer peripheral fitting portion 10 and the first inner peripheral fitting portion 11 with respect to the first main surface portion 9 of the first frame body 6. And having a predetermined thickness. In the second frame body 41, the second outer periphery fitting portion 43 and the second inner periphery fitting portion 44 are respectively connected to the second outer periphery fitting portion 10 and the second inner periphery fitting portion 11 of the first frame body 6. Thus, the first main surface portion 9 is formed so as to rise along the outer peripheral edge and the inner peripheral edge of the second main surface portion 42 with a height dimension smaller by the thickness. In the second frame body 41, the second outer periphery fitting portion 43 and the second inner periphery fitting portion 44 constitute a second fitting portion 46.
In the second frame body 41, the reinforcing convex portion 45 is also formed to rise on the inner surface of the second main surface portion 42 with substantially the same height as the second outer peripheral fitting portion 43 and the second inner peripheral fitting portion 44. Is done. Although not shown, the second frame body 41 is formed with corresponding portions of the engaging portions 1A, 1B, and 1C on the first frame body 6 side as straight standing walls and corresponding to the positioning recesses 1D and 1E. The part is formed as a standing wall that is recessed toward the inner periphery.
In the second frame body 41, a large number of outer peripheral adhesive filling recesses 47 that form the outer peripheral adhesive filling portion are formed side by side in the circumferential direction at the distal end portion of the second outer peripheral fitting portion 43. The second frame body 41 is formed with a plurality of inner peripheral adhesive filling concave portions 48 that form an inner peripheral adhesive filling portion arranged in the circumferential direction at the distal end portion of the second inner peripheral fitting portion 44. In the second frame body 41, a plurality of central adhesive filling concave portions 49 that form a central adhesive filling portion are formed side by side in the circumferential direction at the distal end portion of the reinforcing convex portion 45.

外周接着剤充填凹部４７は、図６に示すように第２外周嵌合部４３に、先端部と外側面４３Ａとに開口して内側面側に底壁４７Ａが残された高さ方向の凹部として形成される。外周接着剤充填凹部４７は、開口寸法や個数が、第２外周嵌合部４３の厚み寸法、接着剤１７の種類や粘度等の条件に応じて適宜設定されて第２外周嵌合部４３に形成される。第２フレーム体４１は、合成樹脂材料を素材として成形することから、金属材を素材とする上述した第２フレーム体７と比較して、かかる底付き凹部からなる外周接着剤充填凹部４７であっても簡易な工程により第２外周嵌合部４３に形成することが可能である。
内周接着剤充填凹部４８も、図６に示すように第２内周嵌合部４４に、先端部と外側面４４Ａとに開口して内側面側に底壁４８Ａが残された高さ方向の凹部として形成される。内周接着剤充填凹部４８も、開口寸法や個数が、第２内周嵌合部４４の厚み寸法、接着剤１７の種類や粘度等の条件に応じて適宜設定されて第２外周嵌合部４３に形成される。 As shown in FIG. 6, the outer peripheral adhesive filling concave portion 47 is a concave portion in the height direction in which the second outer peripheral fitting portion 43 opens at the tip portion and the outer side surface 43 </ b> A and the bottom wall 47 </ b> A remains on the inner side surface. Formed as. The outer peripheral adhesive filling recess 47 has an opening size and a number that are appropriately set according to conditions such as a thickness dimension of the second outer peripheral fitting portion 43, a type of the adhesive 17, a viscosity, and the like. It is formed. Since the second frame body 41 is formed by using a synthetic resin material as a raw material, the second frame body 41 is a peripheral adhesive filling concave portion 47 including a concave portion with a bottom as compared with the above-described second frame body 7 made of a metal material. However, it is possible to form the second outer peripheral fitting portion 43 by a simple process.
As shown in FIG. 6, the inner peripheral adhesive filling concave portion 48 is also opened in the second inner peripheral fitting portion 44 at the front end portion and the outer side surface 44 </ b> A, and the bottom wall 48 </ b> A is left on the inner side surface. Formed as a recess. In the inner peripheral adhesive filling recess 48, the opening size and the number of the inner peripheral adhesive filling recesses 48 are appropriately set according to conditions such as the thickness dimension of the second inner peripheral fitting portion 44, the type and viscosity of the adhesive 17, and the second outer peripheral fitting portion. 43.

中央接着剤充填凹部４９も、図６に示すように補強凸部４５の先端部に開口する厚み方向に貫通する高さ方向の開口部として形成される。中央接着剤充填凹部４９も、開口寸法や個数が、補強凸部４５の厚み寸法、接着剤１７の種類や粘度等の条件に応じて適宜設定されて補強凸部４５に形成される。
なお、外周接着剤充填凹部４７と内周接着剤充填凹部４８は、上述したように外周接着剤充填凹部４７と内周接着剤充填凹部４８を底壁付きの凹部として第２外周嵌合部４３と第２内周嵌合部４４に形成したが、かかる形状に限定されず例えば厚み方向に貫通する凹溝であってもよい。外周接着剤充填凹部４７と内周接着剤充填凹部４８及び中央接着剤充填凹部４９は、第２外周嵌合部４３と第２内周嵌合部４４及び補強凸部４５に対して互いに対向するようにして形成する必要も無い。 The central adhesive filling concave portion 49 is also formed as an opening in the height direction penetrating in the thickness direction opening at the tip of the reinforcing convex portion 45 as shown in FIG. The central adhesive filling concave portion 49 is also formed in the reinforcing convex portion 45 by appropriately setting the opening size and the number according to the conditions such as the thickness size of the reinforcing convex portion 45, the type of adhesive 17 and the viscosity.
As described above, the outer peripheral adhesive filling concave portion 47 and the inner peripheral adhesive filling concave portion 48 are formed by using the outer peripheral adhesive filling concave portion 47 and the inner peripheral adhesive filling concave portion 48 as concave portions with a bottom wall. However, the present invention is not limited to this shape, and may be a groove that penetrates in the thickness direction. The outer peripheral adhesive filling concave portion 47, the inner peripheral adhesive filling concave portion 48, and the central adhesive filling concave portion 49 are opposed to the second outer peripheral fitting portion 43, the second inner peripheral fitting portion 44, and the reinforcing convex portion 45. There is no need to form in this way.

フレーム体４０も、第１フレーム体６に予め接着剤１７が塗布された状態で第２フレーム体４１の組み合わせが行われる。第１フレーム体６には、図５及び図６に示すように第１主面部９に対して、第２フレーム体４１側の第２外周嵌合部４３と第２内周嵌合部４４の先端部がそれぞれ対向する第１外周嵌合部１０と第１内周嵌合部１１の立ち上がり部位に跨がるようにしてそれぞれ所定量の接着剤１７が予め塗布される。第１フレーム体６には、第１主面部９の内面９Ａに対して、補強凸部４５の先端部が対向する部位に所定量の接着剤１７が予め塗布される。
フレーム体４０も、第１フレーム体６に対して第２フレーム体４１が、第１外周嵌合部１０の内側面１０Ａに沿って第２外周嵌合部４３の外側面４３Ａを嵌合して、第１主面部９の内面９Ａに第２外周嵌合部４３の先端部を突き当てる。フレーム体４０も、第１フレーム体６に対して第２フレーム体４１が、第１内周嵌合部１１の内側面１１Ａに沿って第２内周嵌合部４４の外側面４４Ａを嵌合して、第１主面部９の内面９Ａに第２内周嵌合部４４の先端部を突き当てる。フレーム体４０は、第１フレーム体６に対して第２フレーム体４１が、第１主面部９の内面９Ａに補強凸部４５の先端部を突き当てる。 The frame body 40 is also combined with the second frame body 41 in a state where the adhesive 17 is previously applied to the first frame body 6. As shown in FIGS. 5 and 6, the first frame body 6 has a second outer peripheral fitting portion 43 and a second inner peripheral fitting portion 44 on the second frame body 41 side with respect to the first main surface portion 9. A predetermined amount of adhesive 17 is applied in advance so as to straddle the rising portions of the first outer periphery fitting portion 10 and the first inner periphery fitting portion 11 whose front ends are opposed to each other. On the first frame body 6, a predetermined amount of adhesive 17 is applied in advance to a portion of the inner surface 9 </ b> A of the first main surface portion 9 where the tip of the reinforcing convex portion 45 faces.
Also in the frame body 40, the second frame body 41 is fitted to the first frame body 6 along the outer surface 43 </ b> A of the second outer periphery fitting portion 43 along the inner surface 10 </ b> A of the first outer periphery fitting portion 10. The tip of the second outer periphery fitting portion 43 is abutted against the inner surface 9A of the first main surface portion 9. Also in the frame body 40, the second frame body 41 is fitted to the first frame body 6 along the outer surface 44A of the second inner circumferential fitting portion 44 along the inner side surface 11A of the first inner circumferential fitting portion 11. Then, the tip end portion of the second inner peripheral fitting portion 44 is abutted against the inner surface 9A of the first main surface portion 9. In the frame body 40, the second frame body 41 abuts the tip end portion of the reinforcing convex portion 45 against the inner surface 9 </ b> A of the first main surface portion 9 against the first frame body 6.

フレーム体４０においても、上述したように第１フレーム体６に予め塗布された接着剤１７が、第２フレーム体４１の先端部を突き当てた第２外周嵌合部４３と第２内周嵌合部４４及び補強凸部４５により押し拡げられる。フレーム体４０においても、第１フレーム体６と第２フレーム体４１とに対して、相対嵌合される第１外周嵌合部１０の内側面１０Ａと第２外周嵌合部４３の外側面４３Ａとの間及び第１内周嵌合部１１の内側面１１Ａと第２内周嵌合部４４の外側面４４Ａとの間に拡がるとともに、補強凸部４５の先端部に沿って拡がる。
フレーム体４０においては、接着剤１７が、第２フレーム体４１に対して、第２外周嵌合部４３に形成した外周接着剤充填凹部４７と第２内周嵌合部４４に形成した内周接着剤充填凹部４８内にそれぞれ充填される。フレーム体４０においては、接着剤１７が、外周接着剤充填凹部４７と内周接着剤充填凹部４８を底壁付き凹部として形成したことによりそれぞれ内側に溢れ出ることなく、第１外周嵌合部１０の内側面１０Ａと第２外周嵌合部４３の外側面４３Ａとの間及び第１内周嵌合部１１の内側面１１Ａと第２内周嵌合部４４の外側面４４Ａとの間に沿って拡がる。フレーム体４０においては、第１フレーム体６と第２フレーム体４１が、内外周において多くの接触面積と充填量を以って接着剤１７により接合される。フレーム体３においては、第１フレーム体６と第２フレーム体７がより強固に一体化される。 Also in the frame body 40, as described above, the adhesive 17 applied in advance to the first frame body 6 is fitted with the second outer periphery fitting portion 43 and the second inner periphery fitting that abut the tip portion of the second frame body 41. The joint 44 and the reinforcing projection 45 are pushed and expanded. Also in the frame body 40, the inner surface 10 </ b> A of the first outer periphery fitting portion 10 and the outer surface 43 </ b> A of the second outer periphery fitting portion 43 that are relatively fitted to the first frame body 6 and the second frame body 41. And between the inner side surface 11A of the first inner peripheral fitting portion 11 and the outer side surface 44A of the second inner peripheral fitting portion 44 and also along the tip of the reinforcing convex portion 45.
In the frame body 40, the adhesive 17 has an inner circumference formed in the outer circumferential adhesive filling recess 47 formed in the second outer circumference fitting portion 43 and the second inner circumference fitting portion 44 with respect to the second frame body 41. Each of the adhesive filling recesses 48 is filled. In the frame body 40, the adhesive 17 is formed so that the outer peripheral adhesive filling concave portion 47 and the inner peripheral adhesive filling concave portion 48 are formed as concave portions with a bottom wall, so that the first outer peripheral fitting portion 10 does not overflow inside. Between the inner side surface 10A of the second outer peripheral fitting portion 43 and the outer side surface 43A of the second inner peripheral fitting portion 44 and between the inner side surface 11A of the first inner peripheral fitting portion 11 and the outer surface 44A of the second inner peripheral fitting portion 44. And spread. In the frame body 40, the 1st frame body 6 and the 2nd frame body 41 are joined by the adhesive agent 17 with many contact areas and filling amount in inner and outer periphery. In the frame body 3, the first frame body 6 and the second frame body 7 are more firmly integrated.

フレーム体４０においては、第２フレーム体４１に補強凸部４５を一体に形成し、第１フレーム体６に第２フレーム体４１を組み合わせる際に先端部を第１フレーム体６の第１主面部９の内面９Ａに対して接着剤１７により接合されるようにする。フレーム体４０においては、補強凸部４５が、一体に化した第１外周嵌合部１０と第２外周嵌合部４３及び第１内周嵌合部１１と第２内周嵌合部４４との間において同心円を構成して第１フレーム体６の第１主面部９の内面９Ａに結合される。フレーム体４０においては、これにより第１フレーム体６と第２フレーム体４１が、機械的強度を保持されて一体化されるとともに第１主面部９と第２主面部４２の対向間隔が保持される。
なお、フレーム体４０は、上述したように第２フレーム体４１に１つの環状補強凸部４５を一体に形成したが、複数の環状補強凸部を一体に形成することも可能である。
なお、本発明は、図面を参照して説明した上述した各実施の形態に限定されるものではなく、添付の特許請求の範囲及びその要旨を逸脱することなく、様々な変更、置換或いは同等に構成されることは当業者にとって明らかである。 In the frame body 40, the reinforcing convex portion 45 is formed integrally with the second frame body 41, and when the second frame body 41 is combined with the first frame body 6, the tip portion is the first main surface portion of the first frame body 6. 9 is bonded to the inner surface 9A by an adhesive 17. In the frame body 40, the reinforcing protrusion 45 is integrated with the first outer periphery fitting portion 10, the second outer periphery fitting portion 43, the first inner periphery fitting portion 11, and the second inner periphery fitting portion 44. A concentric circle is formed between the first frame body 6 and the inner surface 9A of the first main surface portion 9 of the first frame body 6. In the frame body 40, the first frame body 6 and the second frame body 41 are thereby integrated while maintaining mechanical strength, and the facing distance between the first main surface portion 9 and the second main surface portion 42 is maintained. The
In the frame body 40, as described above, one annular reinforcing convex portion 45 is integrally formed on the second frame body 41. However, a plurality of annular reinforcing convex portions can be integrally formed.
The present invention is not limited to the above-described embodiments described with reference to the drawings, and various modifications, substitutions, or equivalents can be made without departing from the scope and spirit of the appended claims. It will be apparent to those skilled in the art that it is configured.

１ ホルダ、２ ウェーハ、３ フレーム体、４ 中央開口部（ウェーハ収納空間部）、５ ダイシングフィルム（ウェーハ保持体）、６ 第１フレーム体、７ 第２フレーム体、８ 内部空間部、９ 第１主面部、１０ 第１外周嵌合部、１１ 第１内周嵌合部、１２ 第１嵌合部、１３ 第２主面部、１４ 第２外周嵌合部、１５ 第２内周嵌合部、１６ 第２嵌合部、１７ 接着剤、１８ コア体、１９ 外周接着剤充填部、２０ 内周接着剤充填部、３０ フレーム体、３１ 外周接着剤充填部、３２ 内周接着剤充填部、４０ フレーム体、４１ 第２フレーム体、４２ 第１主面部、４３ 第２外周嵌合部、４４ 第２内周嵌合部、４５ 補強凸部、４６ 第２嵌合部、４７ 外周接着剤充填凹部、４８ 内周接着剤充填凹部、４９ 中央接着剤充填凹部   DESCRIPTION OF SYMBOLS 1 Holder, 2 Wafer, 3 Frame body, 4 Center opening part (wafer accommodation space part), 5 Dicing film (wafer holding body), 6 1st frame body, 7 2nd frame body, 8 Internal space part, 9 1st Main surface part, 10 1st outer periphery fitting part, 11 1st inner periphery fitting part, 12 1st fitting part, 13 2nd main surface part, 14 2nd outer periphery fitting part, 15 2nd inner periphery fitting part, 16 2nd fitting part, 17 adhesive agent, 18 core body, 19 outer periphery adhesive filling part, 20 inner periphery adhesive filling part, 30 frame body, 31 outer periphery adhesive filling part, 32 inner periphery adhesive filling part, 40 Frame body, 41 2nd frame body, 42 1st main surface part, 43 2nd outer periphery fitting part, 44 2nd inner periphery fitting part, 45 Reinforcement convex part, 46 2nd fitting part, 47 Outer periphery adhesive filling recessed part , 48 Inner peripheral adhesive filling recess, 49 Central adhesive filling recess

Claims (7)

第１主面部の外周縁に沿って全周に亘り立ち上がる一体の環状立壁として形成された第１外周嵌合部と、内周縁に沿って全周に亘り前記第１外周嵌合部と相対向して立ち上がる一体の環状立壁として形成された第１内周嵌合部とからなる第１嵌合部を有し、全体が中央開口部を有するリング状のチャンネル体として形成された第１フレーム体と、
第２主面部の外周縁に沿って全周に亘り立ち上がり前記第１外周嵌合部の内径よりもやや小径とされた一体の環状立壁として形成された第２外周嵌合部と、内周縁に沿って全周に亘り前記第２外周嵌合部と相対向して立ち上がり前記第１内周嵌合部の内径よりもやや大径とされた一体の環状立壁として形成された第２内周嵌合部とからなる第２嵌合部を有し、前記第２外周嵌合部の前記第１外周嵌合部との対向部位及び前記第２内周嵌合部の前記第１内周嵌合部との対向部位にそれぞれ周方向に並んで多数個の外周接着剤充填部及び内周接着剤充填部が形成され、全体が中央開口部を有するリング状のチャンネル体として形成された第２フレーム体と、
前記第１フレーム体の前記第１主面部とほぼ同径に形成され、前記開口部を閉塞して前記第１フレーム体の前記第１主面部に貼り付けられてウェーハ収納空間部を構成するウェーハ保持体
とから構成され、
前記第１フレーム体と前記第２フレーム体が、前記第１外周嵌合部の内側面に前記第２外周嵌合部の外側面を嵌合するとともに前記第１内周嵌合部の内側面に前記第２内周嵌合部の外側面を嵌合する前記第１嵌合部内への前記第２嵌合部の嵌合を行うと、前記第１嵌合部或いは前記第２嵌合部の嵌合部位に塗布した接着剤が前記外周接着剤充填部及び前記内周接着剤充填部内に充填して硬化することにより一体化されて、内部空間部を有するリング状のフレーム体を構成することを特徴とするウェーハ用ホルダ。 A first outer peripheral fitting portion formed as an integral annular standing wall that rises along the outer peripheral edge of the first main surface portion, and opposite to the first outer peripheral fitting portion along the entire inner periphery. The first frame body is formed as a ring-shaped channel body having a first fitting portion comprising a first inner circumferential fitting portion formed as an integral standing wall standing up as a whole, and having a central opening. When,
A second outer peripheral fitting portion formed as an integral annular standing wall that rises along the outer peripheral edge of the second main surface portion and is slightly smaller in diameter than the inner diameter of the first outer peripheral fitting portion; A second inner circumference fitting formed as an integral standing wall that rises in opposition to the second outer circumference fitting portion along the entire circumference and is slightly larger than the inner diameter of the first inner circumference fitting portion. A second fitting portion comprising a joint portion, and a portion of the second outer circumference fitting portion facing the first outer circumference fitting portion and the first inner circumference fitting of the second inner circumference fitting portion. A second frame formed as a ring-shaped channel body having a plurality of outer peripheral adhesive filling portions and inner peripheral adhesive filling portions formed in a circumferential direction at respective positions facing the portion, and having a central opening. Body,
A wafer that is formed to have substantially the same diameter as the first main surface portion of the first frame body, closes the opening, and is attached to the first main surface portion of the first frame body to form a wafer storage space portion. Holding body,
The first frame body and the second frame body fit the outer surface of the second outer periphery fitting portion to the inner surface of the first outer periphery fitting portion and the inner surface of the first inner periphery fitting portion. When the second fitting portion is fitted into the first fitting portion that fits the outer surface of the second inner circumferential fitting portion, the first fitting portion or the second fitting portion A ring-shaped frame body having an internal space portion is formed by integrating the adhesive applied to the fitting portion by filling the outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion and curing. A wafer holder characterized by that. 前記外周接着剤充填部及び前記内周接着剤充填部が、前記第１フレーム体の前記第１主面部の内面にそれぞれ突き当てられる前記第２外周嵌合部と前記第２内周嵌合部の先端縁に、周方向に並んで形成された切欠き部として、前記第２フレーム体に形成されることを特徴とする請求項１に記載のウェーハ用ホルダ。   The second outer periphery fitting portion and the second inner periphery fitting portion in which the outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion are respectively abutted against the inner surface of the first main surface portion of the first frame body. 2. The wafer holder according to claim 1, wherein the second frame body is formed as a notch portion formed side by side in a circumferential direction at a leading edge of the wafer. 前記外周接着剤充填部及び前記内周接着剤充填部が、前記第１フレーム体の前記第１外周嵌合部の内側面及び前記第１内周嵌合部の内側面にそれぞれ嵌合される前記第２外周嵌合部及び前記第２内周嵌合部にそれぞれ周方向に並んで形成された周方向を長軸とした長孔として、前記第２フレーム体に形成されることを特徴とする請求項１に記載のウェーハ用ホルダ。   The outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion are respectively fitted to an inner side surface of the first outer peripheral fitting portion and an inner side surface of the first inner peripheral fitting portion of the first frame body. It is formed in the second frame body as a long hole having a long axis in the circumferential direction formed in the second outer circumferential fitting portion and the second inner circumferential fitting portion in a circumferential direction. The wafer holder according to claim 1. 前記第１フレーム体が、リング状の金属薄板を素材とし、外周縁と内周縁に沿って相対向する前記第１外周嵌合部と前記第１内周嵌合部を一体に立ち上がり形成した金属製のフレーム体であり、
前記第２フレーム体が、導電材を含有した合成樹脂材を素材とし、それぞれ多数個の前記外周接着剤充填部及び前記内周接着剤充填部を有して外周縁と内周縁に沿って相対向する前記第２外周嵌合部と前記第２内周嵌合部を一体に立ち上がり形成した合成樹脂製のフレーム体である
ことを特徴とする請求項１乃至請求項３のいずれか１項に記載のウェーハ用ホルダ。 The first frame body is made of a ring-shaped metal thin plate, and the first outer periphery fitting portion and the first inner periphery engagement portion that are opposed to each other along the outer peripheral edge and the inner peripheral edge are integrally formed to rise. A frame body made of
The second frame body is made of a synthetic resin material containing a conductive material, and has a plurality of the outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion, respectively, and is relatively aligned along the outer peripheral edge and the inner peripheral edge. 4. The synthetic resin frame body according to claim 1, wherein the second outer peripheral fitting portion and the second inner peripheral fitting portion facing each other are formed integrally. The wafer holder as described. 前記外周接着剤充填部及び前記内周接着剤充填部が、前記第２外周嵌合部と前記第２内周嵌合部に、それぞれ少なくとも外側面側に開口して内側面側に底壁が残された凹部として、前記第２フレーム体に形成されることを特徴とする請求項４に記載のウェーハ用ホルダ。   The outer peripheral adhesive filling portion and the inner peripheral adhesive filling portion are opened to the second outer peripheral fitting portion and the second inner peripheral fitting portion, respectively, at least on the outer surface side and have a bottom wall on the inner surface side. 5. The wafer holder according to claim 4, wherein the remaining recess is formed in the second frame body. 6. 前記第２フレーム体には、前記第２主面部の内面に、前記第２外周嵌合部と前記第２内周嵌合部との間において全周に亘って立ち上がる同心円状の環状立壁からなる補強凸部が一体に形成され、
前記第１嵌合部内に前記第２嵌合部を嵌合した状態で、前記補強凸部が前記第１主面部の内面に突き当てられて前記第１主面部と前記第２主面部の対向間隔とを保持する請求項４又は請求項５のいずれか１項に記載のウェーハ用ホルダ。 The second frame body includes a concentric annular standing wall that rises over the entire circumference between the second outer peripheral fitting portion and the second inner peripheral fitting portion on the inner surface of the second main surface portion. Reinforcement convex part is formed integrally,
In a state where the second fitting portion is fitted in the first fitting portion, the reinforcing convex portion is abutted against the inner surface of the first main surface portion, and the first main surface portion and the second main surface portion are opposed to each other. The wafer holder according to any one of claims 4 and 5, which holds the interval. 前記補強凸部には、先端縁に、周方向に並んだ切欠き部からなる中央接着剤充填部が形成されることを特徴とする請求項６に記載のウェーハ用ホルダ。   The wafer holder according to claim 6, wherein a central adhesive filling portion including a notch portion arranged in a circumferential direction is formed on the front end edge of the reinforcing convex portion.
JP2009175206A 2009-07-28 2009-07-28 Wafer holder Expired - Fee Related JP5225228B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298715A (en) * 1988-03-31 1989-12-01 Air Prod And Chem Inc Wafer holding attachment of low thermal effect unit and its manufacture
JP2009065129A (en) * 2007-08-09 2009-03-26 Jfe Techno Research Corp Frame for wafer
JP2010245493A (en) * 2008-06-26 2010-10-28 Jfe Techno Research Corp Wafer frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298715A (en) * 1988-03-31 1989-12-01 Air Prod And Chem Inc Wafer holding attachment of low thermal effect unit and its manufacture
JP2009065129A (en) * 2007-08-09 2009-03-26 Jfe Techno Research Corp Frame for wafer
JP2010245493A (en) * 2008-06-26 2010-10-28 Jfe Techno Research Corp Wafer frame

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